Electronic module, electronic device, and method for producing electronic module

Abstract

The present invention maintains insulating properties between electroconductive plates.　According to the present invention, a semiconductor device is equipped with: a first electroconductive plate (22a), which comprises copper or a copper alloy as a main component; a second electroconductive plate (23a), which has a second back surface (23a7) facing the first electroconductive plate (22a) and a side surface connected to the second back surface (23a7) and comprises copper or a copper alloy as a main component; and a second oxide film (23b), which is provided on the second back surface (23a7) and side surface of the second electroconductive plate (23a), has electrical insulating properties, and includes an oxide of a metal element differing from the metal(s) of the second electroconductive plate (23a). A first oxide film (22b) and the second oxide film (23b) are used as insulating members between a first wiring part (22a2) of the first electroconductive plate (22a) and a second wiring part (23a2) of the second electroconductive plate (23a).

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