Sensor module and system

Abstract

This sensor module includes a sensor and a housing. The housing houses the sensor. The housing includes an attachment surface and an opposing surface. The attachment surface is attached to an object. The opposing surface is located opposite the attachment surface. The sensor is provided on the opposing surface.

Description

Sensor Modules and Systems

[0001] The present disclosure relates to sensor modules and systems.

[0002] International Publication No. 2020 / 171156 (Patent Document 1) discloses a cutting tool including a holder having a sensor mounted therein and a cutting insert.

[0003] International Publication No. 2020 / 171156

[0004] A sensor module according to the present disclosure includes a sensor and a housing. The housing accommodates the sensor. The housing has a mounting surface and an opposing surface. The mounting surface is attached to an object. The opposing surface is located opposite the mounting surface. The sensor is provided on the opposing surface.

[0005] FIG. 1 is a perspective view of a sensor module according to a first embodiment. FIG. 2 is an exploded perspective view showing the internal structure of the sensor module according to the first embodiment. FIG. 3 is a plan view of the sensor module according to the first embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5 is an exploded perspective view of a housing according to the first embodiment. FIG. 6 is a plan view of a substrate according to the first embodiment. FIG. 7 is a plan view of a sensor according to the first embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a perspective view of a sensor module according to a second embodiment. FIG. 10 is an exploded perspective view showing the internal structure of a sensor module according to the second embodiment. FIG. 11 is a plan view of a sensor module according to the second embodiment. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 13. FIG. 13 is an exploded perspective view of a housing according to the second embodiment. FIG. 14 is an exploded perspective view showing the internal structure of a sensor module according to a third embodiment. FIG. 15 is an exploded perspective view of a housing according to the third embodiment. FIG. 16 is an exploded perspective view showing the internal structure of a sensor module according to a fourth embodiment. FIG. 17 is a plan view of a sensor module according to the fourth embodiment. FIG. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. 17 . FIG. 19 is an exploded perspective view of a housing according to the fifth embodiment. FIG. 20 is a partially enlarged plan view showing the internal structure of a sensor module according to the fifth embodiment. FIG. 21 is an exploded perspective view of a housing according to a first modified example of the fifth embodiment. FIG. 22 is a partially enlarged plan view showing the internal structure of a sensor module according to the first modified example of the fifth embodiment. FIG. 23 is an exploded perspective view of a housing according to a second modified example of the fifth embodiment. FIG. 24 is a partially enlarged plan view showing the internal structure of a sensor module according to the second modified example of the fifth embodiment. FIG. 25 is an exploded perspective view of a housing according to a third modified example of the fifth embodiment. FIG. 26 is a partially enlarged plan view showing the internal structure of a sensor module according to the third modified example of the fifth embodiment. FIG. 27 is a perspective view of a system according to the sixth embodiment. FIG. 28 is a side view of the system according to the sixth embodiment. FIG. 29 is a perspective view of a system according to the seventh embodiment. FIG. 30 is an exploded perspective view of a system according to the eighth embodiment. FIG. 31 is an exploded perspective view of a system according to the ninth embodiment.FIG. 32 is a perspective view of a system according to the ninth embodiment.

[0006] [Problem to be Solved by the Present Disclosure] There is room for improvement in attaching a sensor to an object such as a cutting tool in order to measure the physical quantity of the object.

[0007] An object of the present disclosure is to provide a sensor module that allows a sensor to be easily attached to an object.

[0008] Effect of the Present Disclosure According to the present disclosure, it is possible to provide a sensor module that allows a sensor to be easily attached to an object.

[0009] [Outline of the embodiment] First, an outline of the embodiment of the present disclosure will be described.

[0010] (1) A sensor module according to the present disclosure includes a sensor and a housing. The housing accommodates the sensor. The housing has a mounting surface and an opposing surface. The mounting surface is attached to an object. The opposing surface is located opposite the mounting surface. The sensor is provided on the opposing surface.

[0011] According to the sensor module of the present disclosure, the sensor module can be easily attached to an object, and the sensor can be attached to the object without reducing the rigidity of the object, such as a cutting tool.

[0012] (2) According to the sensor module of (1), the sensor may include a strain sensor, which can measure the strain of the object.

[0013] (3) The sensor module according to (1) or (2) above may include a substrate electrically connected to the sensor. This allows the sensor to receive power via the substrate. Furthermore, information detected by the sensor can be transmitted to the wireless communication unit via the substrate.

[0014] (4) The sensor module according to (3) above may include a terminal provided on the substrate for supplying power to the sensor. This allows power to be supplied to the sensor from a power source such as a power supply module via the terminal.

[0015] (5) The sensor module according to (4) above may include a power supply module electrically connected to the terminals, thereby enabling power to be supplied from the power supply module to the sensor via the terminals.

[0016] (6) According to the sensor module of (5) above, the power supply module may be housed in a housing. This eliminates the need for a cable extending outside the housing. Furthermore, even when the space available for mounting the sensor module is severely limited, the sensor module can be easily mounted to an object. Furthermore, if the object to which the sensor module is mounted is a cutting tool such as a cutting tool, interference between the cable and the insert or between the cable and the workpiece is eliminated.

[0017] (7) The sensor module according to (5) or (6) above may include a cable connecting the terminal and the power supply module. The cable may be disposed on the substrate or at a location farther from the substrate than the sensor. This allows the sensor to be disposed near the insert if the object to be attached to the sensor module is, for example, a cutting tool such as a turning tool. Furthermore, because the cable is disposed at a location farther from the insert, interference between the cable and the insert and the workpiece can be avoided.

[0018] (8) In the sensor module according to any one of (3) to (7), a sensor may be disposed between the opposing surface and the substrate. This allows the sensor module to be miniaturized.

[0019] (9) The sensor module according to any one of (1) to (7) above may include a protective member that covers the sensor. This protects the sensor. The protective member also allows the housing portion and the lid portion of the housing to be bonded and fixed together.

[0020] (10) According to the sensor module of (9), the protective member may be made of resin. This allows information detected by the sensor to be wirelessly transmitted to the outside of the housing.

[0021] (11) In the sensor module according to any one of (1) to (10), the sensor may be disposed on the opposing surface at a position where the distance from the mounting surface is shortest. If the sensor is a strain sensor, this allows the sensor to accurately detect strain on the object because the distance from the sensor to the object is shortest. If the sensor is a temperature sensor, this allows the sensor to accurately detect temperature changes on the object because the distance from the sensor to the object is shortest.

[0022] (12) According to the sensor module of any one of (1) to (11) above, a recess may be provided on the facing surface. A sensor may be disposed in the recess. If the sensor is a strain sensor, this shortens the distance from the sensor to the object, allowing the sensor to accurately detect distortion of the object. If the sensor is a temperature sensor, this shortens the distance from the sensor to the object, allowing the sensor to accurately detect temperature changes of the object. Furthermore, the recess serves as a marker for where to attach the sensor.

[0023] (13) According to the sensor module of any one of (1) to (12) above, a groove may be provided on the opposing surface. The sensor may be disposed on the groove. This causes stress concentration in the groove, increasing the strain detected by the sensor. As a result, the sensor can detect the strain of the object with high accuracy.

[0024] (14) A system according to the present disclosure includes the sensor module according to any one of (1) to (13) above and an object. The object is an element involved in machining or plastic processing. This makes it possible to measure the physical quantity of the element involved in machining or plastic processing. As a result, it is possible to understand the state of the element involved in machining or plastic processing, which is the object, from the measured physical quantity.

[0025] [Details of the embodiment] Hereinafter, details of the embodiment of the present disclosure (hereinafter also referred to as the present embodiment) will be described with reference to the drawings. Note that the same or corresponding parts in the following drawings are designated by the same reference numerals, and description thereof will not be repeated.

[0026] First Embodiment <Configuration of Sensor Module> First, a sensor module 1 according to a first embodiment will be described.

[0027] FIG. 1 is a perspective view of a sensor module 1 according to the first embodiment. FIG. 2 is an exploded perspective view showing the internal structure of the sensor module 1 according to the first embodiment. FIG. 3 is a plan view of the sensor module 1 according to the first embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. The sensor module 1 according to the first embodiment has a housing 3, a substrate 4, a sensor 5, a wireless communication unit 6, terminals 7, a cable 8, and a protective member 9. Note that the protective member 9 is not shown in FIGS. 1 to 3.

[0028] The sensor module 1 shown in Figures 1 to 4 is a module having a sensor for measuring a physical quantity of an object. The sensor 5 may be one as shown in Figure 2. However, the sensor 5 may be multiple, and the multiple sensors 5 may measure different physical quantities.

[0029] The object may be, for example, an element involved in machining, which may be, for example, a component of a machine tool such as a cutting tool, a turret, a spindle, a tool post, a table, or a chuck, or may be a workpiece or anything else that affects the machining.

[0030] The object may be, for example, an element involved in plastic processing, such as a mold, a punch, a die, a base and a frame of a forging machine, or any other element that affects the plastic processing.

[0031] 2, the circuit board 4, the sensor 5, the wireless communication unit 6, the terminal 7, a portion of the cable 8, and the protective member 9 (see FIG. 4) are housed in the internal space of the housing 3. The housing 3 has a lid 31 and a storage portion 32. The lid 31 is attached to the storage portion 32 so as to partially cover the opening of the storage portion 32.

[0032] The shape of the housing 3 may be changed to match the shape of the object to which it is attached. In a plan view in the z direction, the shape of the housing 3 may be elliptical or rectangular (see FIG. 9 ). As shown in FIG. 3 , both ends of the housing 3 may be semicircular in a plan view in the z direction. In a plan view in the z direction, the housing 3 may have a curved shape, for example, an L-shape. Depending on the shape of the object to which it is attached, the mounting surface 33 a of the housing 3 may be a flat surface or a smoothly curved surface. The housing 3 may have a shape that allows it to be embedded in the object, for example, a male screw shape.

[0033] The housing 3 may be made of a metal material having high rigidity, a resin material, or a hard material other than a metal material or a resin material.

[0034] Figure 5 is an exploded perspective view of the housing 3 according to the first embodiment. As shown in Figures 4 and 5, the storage portion 32 is concave and has a mounting surface 33a, an outer wall surface 33b, an opposing surface 34, and an inner wall surface 35. The lid portion 31 is flat and has an upper surface 33c and a lower surface 36. The opposing surface 34 is located opposite the mounting surface 33a. The opposing surface 34 is the bottom surface of the storage portion 32. When the lid portion 31 is attached to the storage portion 32, the inner wall surface 35 is continuous with the lower surface 36. In this way, the opposing surface 34, the inner wall surface 35, and the lower surface 36 form the internal space of the housing 3.

[0035] The mounting surface 33a is a surface that is attached to an object such as a cutting tool. The outer wall surface 33b is located opposite the inner wall surface 35. The upper surface 33c is located opposite the lower surface 36. The outer wall surface 33b is continuous with the mounting surface 33a.

[0036] 1 to 4 , the direction in which the housing 3 extends is the x-direction. The direction perpendicular to the x-direction is the y-direction. The direction perpendicular to the x-direction and the y-direction is the z-direction. The opposing surface 34 and the mounting surface 33a are surfaces that extend in the x-direction and the y-direction and are surfaces that are perpendicular to the z-direction. The opposing surface 34 and the lower surface 36 are spaced apart from each other in the z-direction so as to sandwich the internal space of the housing 3 therebetween.

[0037] A first cutout n1 and a through-hole h may be provided in the cover portion 31. The first cutout n1 and the through-hole h are each formed to reach the lower surface 36 from the upper surface 33c.

[0038] 1 to 4, the first notch n1 may be located at one end of the cover 31 in the x direction, for example. The first notch n1 may be located at the center of the cover 31 in the y direction, for example. As will be described later, the cable 8 is inserted through the first notch n1. The through-hole h may be located at a position overlapping the wireless communication unit 6, as shown in FIG.

[0039] As shown in Fig. 4, the protective member 9 fills the internal space of the housing 3. The protective member 9 covers the circuit board 4, the sensor 5, the wireless communication unit 6, and a portion of the cable 8. In this way, the protective member 9 protects the circuit board 4, the sensor 5, and the wireless communication unit 6. The protective member 9 may also bond the storage section 32 and the lid section 31 together. As a result, the lid section 31 can be attached to the storage section 32. The protective member 9 may be made of, for example, an insulating resin.

[0040] When protecting the sensor 5 and the substrate 4 inside the housing 3 from machining oil and chips scattered from outside the housing 3 without using the protective member 9, it is necessary to completely isolate the sensor 5 and the substrate 4 from the outside of the housing 3 without providing a through-hole h or the like in the housing 3. However, if the housing 3 is made of a metal material, radio waves are blocked. As a result, information such as strain detected by the sensor 5 cannot be transmitted wirelessly to the outside of the housing 3. On the other hand, in the sensor module 1 according to this embodiment, the protective member 9 is made of resin, so information such as strain detected by the sensor 5 can be transmitted wirelessly to the outside of the housing 3 without blocking radio waves.

[0041] The facing surface 34 has a first facing surface portion 34a and a second facing surface portion 34b. Specifically, a recess H1 is provided in the facing surface 34. As shown in Fig. 4, the recess H1 is located on the opposite side of the substrate 4 from the cable 8 in the x direction.

[0042] The recess H1 is formed by a second opposing surface portion 34b and a side surface portion 34c. The side surface portion 34c is continuous with the first opposing surface portion 34a and the second opposing surface portion 34b. The side surface portion 34c may extend in a direction along the z direction. In a plan view of the opposing surface 34, the side surface portion 34c may be formed to surround the sensor 5. The side surface portion 34c may be inclined with respect to the z direction.

[0043] The second opposing surface portion 34b is the surface in the recess H1 that is located furthest from the first opposing surface portion 34a in the z direction. In other words, the second opposing surface portion 34b is the surface of the opposing surface 34 that is closest to the mounting surface 33a in the z direction. From a different perspective, as shown in FIG. 4 , the distance t2 between the second opposing surface portion 34b and the mounting surface 33a in the z direction is smaller than the distance t1 between the first opposing surface portion 34a and the mounting surface 33a.

[0044] The number of recesses H1 formed in the facing surface 34 may be one. Alternatively, a plurality of recesses H1 may be formed in the facing surface 34 in accordance with the number of sensors 5.

[0045] The substrate 4 is disposed on the first opposing surface portion 34a. The sensor 5 is disposed on the second opposing surface portion 34b. In this manner, the sensor 5 is disposed at a position on the opposing surface 34 where the distance to the mounting surface 33a is shortest. This results in the shortest distance from the sensor 5 to the object. In other words, if the sensor 5 is a strain sensor, the sensor 5 can accurately detect strain on the object. Also, if the sensor 5 is a temperature sensor, the sensor 5 can accurately detect temperature changes on the object. Also, the recess H1 serves as a marker for where to attach the sensor 5. The sensor 5 may be disposed on the first opposing surface portion 34a.

[0046] 2, the substrate 4 extends in the x direction in the internal space of the housing 3. The substrate 4 includes an insulating layer made of resin or the like, and a circuit pattern (not shown) made of copper or the like formed on the surface of the insulating layer.

[0047] FIG. 6 is a plan view of the substrate 4 according to the first embodiment. A connector 41, a wireless communication unit 6, and a terminal 7 are provided on the surface of the substrate 4. The substrate 4 is electrically connected to the sensor 5. Specifically, as shown in FIG. 4, the sensor 5 is electrically connected to the connector 41 provided on the substrate 4 via wiring 42. The terminal 7 is connected to the cable 8. As described above, the cable 8 is inserted into the first notch n1. In this manner, the cable 8 extends from the internal space of the housing 3 to the outside. A portion of the cable 8 extending outside the housing 3 may be electrically connected to a power source (not shown) located outside the housing 3. In other words, the terminal 7 supplies power to the sensor 5 and the wireless communication unit 6 via the cable 8 connected to the power source.

[0048] 2, the terminal 7 may be disposed at the farthest position in the x direction on the surface of the substrate 4 as viewed from the sensor 5. From a different perspective, the cable 8 may be disposed on the substrate 4 or at a position farther away than the substrate 4. This allows the sensor 5 to be disposed near the insert portion if the object to be attached to the sensor module 1 is a cutting tool such as a cutting tool. Furthermore, because the cable 8 is disposed at a position away from the insert portion, the cable 8 can avoid interference with the insert portion and the workpiece.

[0049] As viewed from the sensor 5, the wireless communication unit 6 may be disposed on the surface of the substrate 4 in a position closer in the x direction than the terminals 7. As described above, the wireless communication unit 6 may be disposed in a position overlapping the through-hole h in a plan view in the z direction (see FIG. 3). In this way, even if the housing 3 is made of a metal material, the provision of the through-hole h in the lid portion 31 allows information such as strain detected by the sensor 5 to be wirelessly transmitted to the outside.

[0050] An AD converter (not shown) may be disposed on the surface of the substrate 4. Information such as strain detected by the sensor 5 is an analog signal. Therefore, by disposing an AD converter on the surface of the substrate 4, the analog signal can be converted into a digital signal and transmitted to the wireless communication unit 6.

[0051] The sensor 5 according to the first embodiment may include, for example, a strain sensor. The sensor 5 may include, for example, a sensor capable of measuring a desired physical quantity. The sensor 5 may include, for example, any of a strain sensor, a temperature sensor, and an acceleration sensor.

[0052] The strain sensor may be a strain gauge having a metal circuit, a semiconductor sensor having a semiconductor element, or a sensor equipped with any other strain measurement method.

[0053] The configuration of the sensor 5 according to the first embodiment will be described when the sensor has a strain gauge. Fig. 7 is a plan view of the sensor 5 according to the first embodiment. Fig. 8 is a cross-sectional view taken along line VIII-VIII in Fig. 7. Note that in Fig. 7, the metal thin film pattern 52 is indicated by a dotted line. The sensor 5 has, for example, a base plate 51, a metal thin film pattern (metal thin film resistor) 52, leads 54, and a protective layer 53.

[0054] A metal thin film pattern 52 and a protective layer 53 are formed on the surface of the base plate 51. The back surface of the base plate 51 can be attached to the opposing surface 34 using an adhesive. The base plate 51 may be made of, for example, an insulating ceramic material. The base plate 51 may also be made of a stainless steel material.

[0055] The metal thin film pattern 52 may include an electrode portion 52a. A lead 54 may be electrically connected to the electrode portion 52a. The surface of the electrode portion 52a may be coated with a metal material such as copper, silver, or gold, and the lead 54 may be soldered to the surface of the electrode portion 52a. The lead 54 is electrically connected to the wiring 42. The metal thin film pattern 52 may be made of, for example, a nickel-chromium (NiCr) or chromium (Cr)-based material.

[0056] The protective layer 53 is disposed on the base plate 51 so as to cover the metal thin film pattern 52 and the leads 54. In this way, the protective layer 53 protects the metal thin film pattern 52. The protective layer 53 is made of alumina (Al ２ O ３ ) or silicon dioxide (SiO ２ The insulating material may be a thin film of .

[0057] When strain occurs in the object, the metal thin film pattern 52 expands or contracts via the opposing surface 34 of the housing 3 and the base plate 51. When the metal thin film pattern 52 expands or contracts, the resistance value of the metal thin film pattern 52 changes, and the amount of strain in the object corresponding to the change in resistance value can be calculated. The resistance value may be converted into a voltage using a bridge circuit. In this way, even if the change in resistance value is small, the amount of strain can be measured from the voltage value.

[0058] Second Embodiment <Configuration of Sensor Module> Next, a sensor module 1 according to a second embodiment will be described. The sensor module 1 according to the second embodiment differs from the sensor module 1 according to the first embodiment mainly in that the substrate 4 overlaps the sensor 5 in a plan view seen from the z direction, but is otherwise similar to the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0059] Fig. 9 is a perspective view of the sensor module 1 according to the second embodiment. Fig. 10 is an exploded perspective view showing the internal structure of the sensor module 1 according to the second embodiment. Fig. 11 is a plan view of the sensor module 1 according to the second embodiment. Fig. 12 is a cross-sectional view taken along line XII-XII in Fig. 11. Fig. 13 is an exploded perspective view of the housing 3 according to the second embodiment. In Fig. 12, the step portion 37 is indicated by a dotted line.

[0060] 9 to 13, a second notch n2 and a third notch n3 may be provided in the cover 31. Each of the second notch n2 and the third notch n3 is formed to extend from the upper surface 33c to the lower surface 36.

[0061] In a plan view seen from the z direction, the position of the second cutout n2 may be changed to match the position of the cable 8. As shown in Fig. 10 , the terminal 7 is disposed at one end of the substrate 4 in the y direction. Therefore, in a plan view seen from the z direction, the cable 8 extends from one end of the internal space of the housing 3 in the y direction to the outside. Therefore, as shown in Fig. 11 , the second cutout n2 may be disposed, for example, at one end of the lid portion 31 in the y direction.

[0062] The third cutout n3 is located, for example, opposite the second cutout n2 in the y direction. The third cutout n3 may be disposed at a position overlapping the wireless communication unit 6, as shown in Fig. 11. In this way, the position of the third cutout n3 may be changed to match the position of the wireless communication unit 6 in a plan view seen from the z direction.

[0063] As shown in Figure 13, a step portion 37 is provided at the boundary between the inner wall surface 35 of the housing 3 and the first opposing surface portion 34a. The step portion 37 protrudes from the first opposing surface portion 34a toward the lid portion 31. The step portion 37 has a mounting surface 37a and a side wall surface 37b. The mounting surface 37a is the surface on which the substrate 4 is placed. The mounting surface 37a extends along both the x direction and the y direction. The mounting surface 37a is continuous with the inner wall surface 35. The side wall surface 37b is continuous with both the mounting surface 37a and the first opposing surface portion 34a. The side wall surface 37b extends along the x direction and the z direction.

[0064] In the z direction, the mounting surface 37a is disposed above the sensor 5. In this way, by disposing the substrate 4 on the mounting surface 37a of the step portion 37, the sensor 5 can be disposed between the opposing surface 34 (second opposing surface portion 34b) on which the sensor 5 is disposed and the substrate 4. In other words, in a plan view seen from the z direction, the sensor 5 can be disposed so as to overlap the substrate 4 in the x direction, and the housing 3 can be made smaller in size in the x direction.

[0065] (Third embodiment) <Configuration of sensor module> Next, a sensor module 1 according to a third embodiment will be described. The sensor module 1 according to the third embodiment differs from the sensor module 1 according to the first embodiment mainly in that the accommodation portion 32 is flat and the lid portion 31 is concave, but is otherwise similar to the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0066] Fig. 14 is an exploded perspective view showing the internal structure of the sensor module 1 according to the third embodiment. Fig. 15 is an exploded perspective view of the housing 3 according to the third embodiment. As shown in Figs. 14 and 15, the accommodation portion 32 is flat and has a mounting surface 33a and an opposing surface 34. The opposing surface 34 is located opposite the mounting surface 33a. As shown in Fig. 14, the sensor 5 and the substrate 4 are mounted in the flat accommodation portion 32.

[0067] The lid portion 31 is concave and has an upper surface 33c, an outer wall surface 33b, an inner wall surface 35, and a lower surface 36. The inner wall surface 35 is continuous with the lower surface 36. The outer wall surface 33b is located opposite the inner wall surface 35. The upper surface 33c is located opposite the lower surface 36. The outer wall surface 33b is continuous with the upper surface 33c. When the lid portion 31 is attached to the storage portion 32, the inner wall surface 35 is continuous with the opposing surface 34. In this way, the opposing surface 34, the inner wall surface 35, and the lower surface 36 form the internal space of the housing 3.

[0068] The housing portion 32 is flat and does not have an inner wall surface 35 or an outer wall surface 33b, which reduces the rigidity of the housing portion 32. As a result, if the sensor 5 is a strain sensor, the sensor 5 mounted in the housing portion 32 can detect small strains.

[0069] Thus, in the sensor module 1 of the third embodiment, the housing 3 has a concave lid portion 31 and a flat storage portion 32, but the shapes of the storage portion 32 and the lid portion 31 may be changed as appropriate; for example, the lid portion 31 and the storage portion 32 may be mutually concave.

[0070] (Fourth embodiment) <Configuration of sensor module> Next, a sensor module 1 according to a fourth embodiment will be described. The sensor module 1 according to the fourth embodiment differs from the sensor module 1 according to the first embodiment mainly in that a power supply is accommodated in the internal space of the housing 3, but is otherwise similar to the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0071] FIG. 16 is an exploded perspective view showing the internal structure of a sensor module 1 according to the fourth embodiment. FIG. 17 is a plan view of the sensor module 1 according to the fourth embodiment. FIG. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. 17 . As shown in FIGS. 16 and 18 , the sensor module 1 has a power supply module 11 as a power source. The power supply module 11 includes a battery. The power supply module 11 is accommodated in the internal space of the housing 3. The power supply module 11 is electrically connected to the terminals 7 via wiring. The cover 31 does not necessarily have to be provided with the first notch n1 through which the cable 8 is inserted. In this way, the sensor module 1 has a structure in which no cable 8 extends from the internal space of the housing 3 to the outside.

[0072] If the power source is located outside the housing 3, the location where the sensor module 1 can be installed is limited by the location of the power source or the length of the cable 8 connecting the power source to the sensor module 1. In the sensor module 1 according to the fourth embodiment, by mounting the power supply module 11 that supplies power to the sensor 5 in the internal space of the housing 3, the sensor module 1 can be installed on an object without being subject to the above-mentioned limitations. Therefore, even if the space for installing the sensor module 1 is severely limited, the sensor module 1 can be easily installed on an object.

[0073] Furthermore, if the object to which the sensor module 1 is attached is a cutting tool such as a turning tool, there is no interference between the cable 8 and the insert portion, or between the cable 8 and the workpiece. For example, even during turning, there is no interference between the workpiece rotating at high speed and the cable 8. Furthermore, the sensor module 1 can be attached to the object even if the object is moving or rotating.

[0074] The battery included in the power supply module 11 may be, for example, a disposable battery or a replaceable battery. A partition may be provided near the power supply module 11 to prevent the protective member 9 from entering the power supply module 11 and covering it, thereby hindering battery replacement. The lid 31 may also be structured to be divided into a portion that covers the power supply module 11 and the other portion. In this way, when replacing the battery, the battery can be replaced by opening and closing only the portion of the lid 31 that covers the power supply module 11.

[0075] The battery included in the power supply module 11 may be compatible with wired or wireless power supply. If the battery is compatible with wired power supply, the housing 3 may be provided with a first notch n1 through which the cable 8 is inserted. If the battery is compatible with wireless power supply, the housing 3 does not need to be provided with the first notch n1 through which the cable 8 is inserted. This makes it easy to charge the battery.

[0076] There are no particular limitations on where the power supply module 11 is placed as long as it is in the internal space of the housing 3, and it may be placed near the terminals 7 as shown in Fig. 18. As shown in Fig. 18, the power supply module 11 may be placed farther from the sensor 5 than the board 4. The power supply module 11 may also be placed closer to the sensor 5 than the board 4.

[0077] Fifth Embodiment <Configuration of Sensor Module> Next, a sensor module 1 according to a fifth embodiment will be described. The sensor module 1 according to the fifth embodiment differs from the sensor module 1 according to the first embodiment mainly in that a groove 38 is provided in the opposing surface 34, but is otherwise similar to the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0078] Fig. 19 is an exploded perspective view of the housing 3 according to the fifth embodiment. Fig. 20 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the fifth embodiment. As shown in Figs. 19 and 20, a groove 38 is provided in the opposing surface 34.

[0079] 20 , in a plan view of the facing surface 34, the groove 38 is disposed at a position overlapping the sensor 5. In other words, the sensor 5 is disposed above the groove 38. In a plan view of the facing surface 34, the groove 38 may be disposed at a position overlapping the recess H1. In this way, when distortion occurs in the object, stress concentration occurs in the groove 38, and the distortion detected by the sensor 5 increases. As a result, the sensor 5 can detect the distortion of the object with high accuracy.

[0080] The groove 38 is formed by a third opposing surface portion 38a and a side surface portion 38b. The side surface portion 38b may be continuous with the first opposing surface portion 34a, the second opposing surface portion 34b, and the third opposing surface portion 38a. The side surface portion 38b may extend in the z direction. The side surface portion 38b may be inclined with respect to the z direction.

[0081] 19 , the third opposing surface portion 38a may be the surface of the groove portion 38 that is located at a position furthest from the first opposing surface portion 34a in the z direction. In other words, the third opposing surface portion 38a may be the surface of the opposing surface 34 that is closest to the mounting surface 33a in the z direction.

[0082] As described above, in a plan view of the opposing surface 34, the sensor 5 is disposed on the second opposing surface portion 34b. In a plan view of the opposing surface 34, the side surface portion 34c of the recess H1 is formed so as to surround the sensor 5. In other words, the width w1 of the recess H1 in the x direction is larger than the width w3 of the sensor 5 in the x direction, and the width k1 of the recess H1 in the y direction is larger than the width k3 of the sensor 5 in the y direction.

[0083] On the other hand, the groove 38 extends narrowly in a certain direction. For example, the width w2 of the groove 38 in the x direction is shorter than the width k2 of the groove 38 in the y direction. As shown in FIG. 20 , in a plan view of the facing surface 34, the groove 38 may be disposed at the center of the width w1 of the recess H1 in the x direction. In a plan view of the facing surface 34, the groove 38 may be disposed at the center of the width w3 of the sensor 5 in the x direction. The width w2 of the groove 38 in the x direction may be smaller than the width w1 of the recess H1 in the x direction and may be smaller than the width w3 of the sensor 5 in the x direction. The width w2 of the groove 38 in the x direction may be ⅓ or less of the width w3 of the sensor 5 in the x direction. A plurality of grooves 38 may be provided in the facing surface 34, and the plurality of grooves 38 may be disposed at equal intervals in the x direction.

[0084] The width k2 of the groove 38 in the y direction may be larger than the width k3 of the sensor 5 in the y direction, and may be larger than the width k2 of the recess H1 in the y direction.

[0085] (First Modification of Fifth Embodiment) Fig. 21 is an exploded perspective view of the housing 3 according to a first modification of the fifth embodiment. Fig. 22 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the first modification of the fifth embodiment. As shown in Figs. 21 and 22, the third opposing surface portion 38a may be disposed on the same plane as the second opposing surface portion 34b.

[0086] From a different perspective, the distance in the z direction between the third opposing surface portion 38a and the mounting surface 33a may be the same as the distance t2 between the second opposing surface portion 34b and the mounting surface 33a. That is, as shown in Fig. 22, a pair of fourth cutout portions n4 may be provided in the side surface portion 34c of the recess H1. The pair of fourth cutout portions n4 may be arranged to sandwich the sensor 5 in the y direction.

[0087] (Second Modification of Fifth Embodiment) Fig. 23 is an exploded perspective view of a housing 3 according to a second modification of the fifth embodiment. Fig. 24 is a partially enlarged plan view showing the internal structure of a sensor module 1 according to a second modification of the fifth embodiment. As shown in Figs. 23 and 24, the width k2 of the groove 38 in the y direction may be the same as the width k1 of the recess H1 in the y direction.

[0088] In a plan view of the opposing surface 34, the groove 38 may be surrounded by the side surface 34c of the recess H1. Therefore, the width k2 of the groove 38 in the y direction may be smaller than the width k1 of the recess H1 in the y direction.

[0089] (Third Modification of Fifth Embodiment) Fig. 25 is an exploded perspective view of a housing 3 according to a third modification of the fifth embodiment. Fig. 26 is a partially enlarged plan view showing the internal structure of a sensor module 1 according to a third modification of the fifth embodiment. As shown in Figs. 25 and 26, the recess H1 may not be formed in the opposing surface 34, but a groove 38 may be formed instead. The sensor 5 may be provided on the groove 38.

[0090] Sixth Embodiment <System Configuration> Next, a system 100 according to a sixth embodiment will be described.

[0091] Fig. 27 is a perspective view of the system 100 according to the sixth embodiment. Fig. 28 is a side view of the system 100 according to the sixth embodiment. The system 100 includes the sensor module 1 according to the first embodiment and a cutting tool 2. The cutting tool 2 may be, for example, a cutting tool.

[0092] The cutting tool 2 has a shank portion 21, an insert portion (cutting tip) 22, a fixing portion 23, and a base plate 24. The shank portion 21 may be cylindrical or may be rectangular as shown in FIGS. 27 and 28. Specifically, the shank portion 21 has a first side surface 21a, a second side surface 21b, a third side surface 21c, a fourth side surface 21d, a first end surface 21e, and a second end surface 21f. As shown in FIGS. 27 and 28, the direction perpendicular to the first end surface 21e is defined as the X direction. The X direction may be substantially the same as the x direction. The direction perpendicular to the first side surface 21a is defined as the Y direction. The Y direction may be substantially the same as the y direction. The direction perpendicular to the second side surface 21b is defined as the Z direction. The Z direction may be substantially the same as the z direction. In other words, the shank portion 21 extends in the X direction. The second end surface 21f is located opposite the first end surface 21e in the X direction.

[0093] The shank portion 21 is attached to a turret of a machine tool. Specifically, the first side surface 21 a and the third side surface 21 c are gripped by the turret from the Y direction, thereby fixing the cutting tool 2.

[0094] 28, the second side surface 21b has a first region 21b1 and a second region 21b2. As seen from the fourth side surface 21d in the Z direction, the second region 21b2 is disposed farther than the first region 21b1. The second region 21b2 is continuous with the second end surface 21f.

[0095] A holding portion 25, which is a recess for holding the insert portion 22, is formed at the boundary between the second end face 21f and the second region 21b2 of the second side face 21b. The insert portion 22 and the base plate 24 are arranged in the holding portion 25. The insert portion 22 is arranged on the base plate 24 in a stacked manner.

[0096] A fixing portion 23 is disposed on the first side surface 21a near the second end surface 21f. The fixing portion 23 fixes the insert portion 22. The insert portion 22 is held by being sandwiched between a base plate 24 and the fixing portion 23.

[0097] The insert portion 22 has a first flank 22a, a second flank 22b, a corner flank 22c, and a rake face 22d. The first flank 22a extends in the direction in which the second side surface 21b extends. The second flank 22b extends in the direction in which the second end surface 21f extends. The rake face 22d extends in the direction in which the first side surface 21a extends. The corner flank 22c is located between the first flank 22a and the second flank 22b. The first flank 22a is a main flank. The second flank 22b is a secondary flank.

[0098] The sensor module 1 according to the first embodiment may be attached to the shank portion 21, and the mounting surface 33a of the housing 3 may be attached to any one of the first side surface 21a, the second side surface 21b, the third side surface 21c, and the fourth side surface 21d, for example. The mounting surface 33a and the shank portion 21 may be mechanically fixed using screws or the like. The mounting surface 33a and the shank portion 21 may be simply fixed using an adhesive. The shank portion 21 and the housing 3 may be fixed using a magnet, by fitting, by using a clamp and a vise, by welding the mounting surface 33a and the shank portion 21 together, by joining and fixing the mounting surface 33a and the shank portion 21 together by friction stir welding or the like, or by other fastening means.

[0099] The mounting surface 33a may be a polished surface. Specifically, the surface roughness of the mounting surface 33a may be smaller than the surface roughness of the outer wall surface 33b and the surface roughness of the upper surface 33c of the housing 3. The surface roughness (arithmetic mean roughness Ra) of the mounting surface 33a is, for example, 25 μm or less. In this way, the mounting surface 33a and the shank portion 21 can be easily fixed together using an adhesive.

[0100] The surface roughness is measured using a "SURFCOM 2800E" manufactured by Tokyo Seimitsu Co., Ltd. When measuring the surface roughness, the measurement length and cutoff value comply with the JIS (Japanese Industrial Standards) B0601:2001 standard. However, if the measurement target is small and the standard measurement length cannot be ensured, the measurement length is set to a settable value, and the cutoff value is set to 1 / 5 of the set measurement length, and the surface roughness is measured.

[0101] The sensor 5 is disposed at one end of the internal space of the housing 3 extending in the x-direction. Therefore, when the insert portion 22 is disposed at one end of the cutting tool 2 extending in the X-direction, the sensor 5 can be disposed near the insert portion 22. Specifically, the sensor module 1 may be attached to the shank portion 21 so that the cable 8 is disposed near the first end face 21e and the sensor 5 is disposed near the insert portion 22 in the X-direction. From a different perspective, the sensor 5 may be disposed closer to the insert portion 22 than the cable 8 in the X-direction. This allows for accurate measurement of physical quantities of the cutting tool 2 as the target object. The measured physical quantity may be, for example, strain, temperature, or acceleration occurring in the shank portion 21. Furthermore, because the cable 8 is disposed away from the insert portion 22, interference between the cable 8 and the insert portion 22 and the workpiece can be avoided.

[0102] <System Operation> Next, the operation of the system 100 will be described. The cutting tool 2 machines a rotating workpiece (material to be cut) by, for example, bringing the insert portion 22 into contact with the workpiece. At this time, the sensor 5 detects distortion occurring in the shank portion 21 via the housing 3. A signal containing information such as the distortion detected by the sensor 5 is transmitted to the wireless communication unit 6, and then transmitted from the wireless communication unit 6 to the outside of the housing 3. The signal is received and analyzed outside the housing 3, thereby determining the state of the cutting tool 2, which is the target object.

[0103] When the sensor 5 has a strain sensor, the rigidity of the accommodating portion 32 of the housing 3 may be smaller than the rigidity of the object, or may be the same as the rigidity of the object. In this way, the sensor 5 can accurately detect the strain occurring in the shank portion 21. In other words, the material of the housing 3 may be changed depending on the material of the object. The material of the housing 3 may be the same as the material of the object.

[0104] Seventh Embodiment <System Configuration> Next, a system 100 according to a seventh embodiment will be described. Fig. 29 is a perspective view of the system 100 according to the seventh embodiment. The system 100 according to the seventh embodiment differs from the system 100 according to the sixth embodiment in that the sensor module 1 according to the second embodiment is attached to the cutting tool 2, which is the target object, but is otherwise substantially the same as the system 100 according to the sixth embodiment. This allows, for example, a sensor module 1 that is miniaturized in the x direction to be attached to the shank portion 21 even if the width of the cutting tool 2 in the X direction is small.

[0105] Eighth Embodiment <System Configuration> Next, a system 100 according to an eighth embodiment will be described. Fig. 30 is a perspective view of the system 100 according to the eighth embodiment. The system 100 according to the eighth embodiment differs from the system 100 according to the sixth embodiment in that a recess H2 in which the sensor module 1 is embedded is formed in the second side surface 21b, but is substantially the same as the system 100 according to the sixth embodiment in other respects.

[0106] The recess H2 is formed to open to the first region 21b1 of the second side surface 21b. The recess H2 is recessed (along the Z direction) from the second side surface 21b toward the fourth side surface 21d. In a plan view of the second side surface 21b, the recess H2 extends along the X direction.

[0107] Embedding the sensor module 1 in the recess H2 reduces the volume of the sensor module 1 that protrudes from the side surface of the shank portion 21. This prevents the sensor module 1 from interfering with the workpiece, the processing machine, and chips that fly during processing.

[0108] The shape of the recess H2 may be the same as the shape of the sensor module 1, or may be larger than the shape of the sensor module 1. The depth of the recess H2 in the Z direction may be smaller than, the same as, or larger than the thickness of the sensor module 1 in the Z direction.

[0109] The shape and position of the recess H2 may be changed depending on the shape of the sensor module 1, the shape of the object, the physical quantity to be measured, etc. The recess H2 may be formed on any of the first side surface 21 a, the third side surface 21 c, the fourth side surface 21 d, and the first end surface 21 e of the shank portion 21, in addition to the second side surface 21 b.

[0110] Power may be supplied to the sensor module 1 from an external power source, a battery may be built into the recess H2, or a power supply module 11 may be housed in the internal space of the sensor module 1.

[0111] After the sensor module 1 is embedded in the recess H2, the recess H2 may be closed with a lid member, thereby protecting the sensor module 1 from strong impacts from chips and coolant that may be generated during heavy cutting or the like and that may scatter.

[0112] After the sensor module 1 is embedded in the recess H2, the recess H2 does not need to be closed with a lid member. In this way, there is no need to perform additional processing on the shank portion 21 to install the lid member, and the sensor module 1 can be easily attached to the shank portion 21.

[0113] Ninth Embodiment <System Configuration> Next, a system 100 according to a ninth embodiment will be described. Fig. 31 is an exploded perspective view of the system 100 according to the ninth embodiment. Fig. 32 is a perspective view of the system 100 according to the ninth embodiment. The system 100 according to the ninth embodiment differs from the system 100 according to the eighth embodiment in that a fifth notch n5 into which the sensor module 1 is embedded is formed in the second side surface 21b and the third side surface 21c, but is substantially the same as the system 100 according to the eighth embodiment in other respects.

[0114] The fifth notch n5 is formed to open to the first region 21b1 of the second side surface 21b and the third side surface 21c. The fifth notch n5 is recessed from the third side surface 21c toward the first side surface 21a (along the Y direction). In a plan view of the third side surface 21c, the fifth notch n5 extends along the X direction.

[0115] The fifth notch n5 basically has the same effect as the recess H2 in the system 100 according to the eighth embodiment, and embedding the sensor module 1 in the fifth notch n5 reduces the volume of the sensor module 1 that protrudes from the side surface of the shank portion 21. In this way, the sensor module 1 can avoid interference with the workpiece, the processing machine, and chips that fly during processing.

[0116] Furthermore, during processing, the distortion caused by bending due to the principal force acting on the cutting tool 2 (in the system 100 according to the ninth embodiment, this is a force acting in a direction from the first side surface 21a to the third side surface 21c) can be measured with high accuracy.

[0117] The shape of the fifth cutout n5 may be the same as the shape of the sensor module 1, may be larger than the sensor module 1, or may be smaller than the sensor module 1 so that a part of the sensor module 1 protrudes from the fifth cutout n5. The depth of the fifth cutout n5 in the Y direction may be smaller than, the same as, or larger than the thickness of the sensor module 1 in the z direction.

[0118] The shape and position of the fifth notch n5 may be changed depending on the shape of the sensor module 1, the shape of the target object, the physical quantity to be measured, etc. The fifth notch n5 may be formed across multiple surfaces including the first side surface 21 a, the fourth side surface 21 d, and the first end surface 21 e of the shank portion 21 in addition to the second side surface 21 b and the third side surface 21 c.

[0119] As shown in FIG. 32 , the fifth notch n5 opens to the second side surface 21b. Therefore, when the sensor module 1 is embedded in the fifth notch n5, a portion of the outer wall surface 33b is exposed through the fifth notch n5. A sixth notch n6 may be provided in the area of ​​the outer wall surface 33b exposed through the fifth notch n5. The sixth notch n6 is formed so as to extend from the outer wall surface 33b to the inner wall surface 35. The cable 8 may be inserted through the sixth notch n6. In this manner, even if the first side surface 21a and the third side surface 21c are gripped by a turret from the Y direction, the cable 8 can be connected to a power source located outside the housing 3 without interfering with the turret. Note that a power source, such as a power supply module 11 including a battery, may be housed in the internal space of the housing 3.

[0120] Furthermore, since a sixth notch n6 is provided in the area of ​​the outer wall surface 33b exposed from the fifth notch n5, even if the first side surface 21a and the third side surface 21c are grasped by the turret from the Y direction, information such as distortion detected by the sensor 5 can be transmitted wirelessly to the outside from the sixth notch n6 of the housing 3.

[0121] After the sensor module 1 is embedded in the sixth notch n6, the sixth notch n6 may be closed with a cover member. In this way, even if chips and coolant generated during heavy cutting or the like are scattered, the sensor module 1 can be protected from strong impacts caused by the chips and coolant.

[0122] After the sensor module 1 is embedded in the sixth notch n6, the sixth notch n6 does not need to be closed with a lid member. In this way, there is no need to perform additional processing on the shank portion 21 to install a lid member, and the sensor module 1 can be easily attached to the shank portion 21.

[0123] Next, the effects of the sensor module 1 according to the present disclosure will be described. In order to grasp the state of an object such as a cutting tool, it is necessary to install a sensor 5 in the object. For example, if a cavity is provided inside the shank portion 21 and the sensor 5 is embedded therein, the rigidity of the cutting tool 2 may be reduced. In particular, if a cavity is provided near the insert portion 22, the rigidity of the cutting tool 2 may be significantly reduced. Therefore, it has been difficult to attach the sensor 5 to an object such as the cutting tool 2 in order to measure the physical quantity of the cutting tool 2 using the sensor 5 near the insert portion 22.

[0124] The sensor module 1 according to the present disclosure includes a sensor 5 and a housing 3. The housing 3 accommodates the sensor 5. The housing 3 has a mounting surface 33a and an opposing surface 34. The mounting surface 33a is attached to an object. The opposing surface 34 is located opposite the mounting surface 33a. The sensor 5 is provided on the opposing surface 34. This allows the sensor module to be easily attached to the object. Furthermore, the sensor 5 can be attached to the object without reducing the rigidity of the object, such as a cutting tool 2.

[0125] According to the sensor module 1 of the present disclosure, the sensor 5 may include a strain sensor, which can measure the strain of an object.

[0126] The sensor module 1 according to the present disclosure may include a substrate 4 electrically connected to the sensor 5. This allows power to be supplied to the sensor 5 via the substrate 4. Furthermore, information detected by the sensor 5 can be transmitted to the wireless communication unit 6 via the substrate 4.

[0127] The sensor module 1 according to the present disclosure may include a terminal 7 provided on the substrate 4 for supplying power to the sensor 5. This allows power to be supplied to the sensor 5 from a power source such as a power supply module 11 disposed outside the housing 3 via the terminal 7.

[0128] The sensor module 1 according to the present disclosure may include a power supply module 11 electrically connected to the terminal 7. This allows power to be supplied from the power supply module 11 to the sensor 5 via the terminal 7.

[0129] According to the sensor module 1 according to the present disclosure, the power supply module 11 may be housed in the housing 3. This eliminates the need for a cable 8 that extends outside the housing 3. Furthermore, even when the space for attaching the sensor module 1 is severely limited, the sensor module 1 can be easily attached to an object. Furthermore, if the object to which the sensor module 1 is attached is a cutting tool such as a cutting tool, there is no interference between the cable 8 and the insert portion 22 or between the cable 8 and the workpiece.

[0130] The sensor module 1 according to the present disclosure may include a cable 8 connecting the terminal 7 and the power supply module 11. The cable 8 may be arranged on the substrate 4 or at a position farther from the substrate 4 as viewed from the sensor 5. This allows the sensor 5 to be arranged near the insert 22 if the object to be attached to the sensor module 1 is a cutting tool 2 such as a cutting tool. Furthermore, because the cable 8 is arranged at a position farther from the insert 22, it is possible to avoid interference between the cable 8 and the insert 22 or the workpiece.

[0131] According to the sensor module 1 of the present disclosure, the sensor 5 may be disposed between the facing surface 34 and the substrate 4. This allows the sensor module 1 to be made smaller.

[0132] The sensor module 1 according to the present disclosure may include a protective member 9 that covers the sensor 5. This protects the sensor 5. The protective member 9 also allows the accommodating portion 32 and the lid portion 31 of the housing 3 to be bonded and fixed together.

[0133] According to the sensor module 1 of the present disclosure, the protective member 9 may be made of resin, which allows information detected by the sensor 5 to be transmitted wirelessly to the outside of the housing 3.

[0134] According to the sensor module 1 of the present disclosure, the sensor 5 may be disposed at a position on the opposing surface 34 where the distance from the mounting surface 33a is shortest. This allows the sensor 5 to accurately detect distortion of the object if the sensor 5 is a strain sensor, since the distance from the sensor 5 to the object is shortest. Also, if the sensor 5 is a temperature sensor, the distance from the sensor 5 to the object is shortest, so the sensor 5 can accurately detect temperature changes of the object.

[0135] According to the sensor module 1 of the present disclosure, a recess H1 may be provided on the facing surface 34. A sensor 5 may be disposed in the recess H1. If the sensor 5 is a strain sensor, this shortens the distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect distortion of the object. If the sensor 5 is a temperature sensor, this shortens the distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect temperature changes of the object. The recess H1 serves as a marker for where to attach the sensor 5. The sensor module 1 of the present disclosure may be a sensor unit having the sensor 5, or may be a sensor device.

[0136] According to the sensor module 1 of the present disclosure, a groove H2 may be provided in the facing surface 34. The sensor 5 may be disposed on the groove H2. This causes stress concentration in the groove H2, increasing the strain detected by the sensor 5. As a result, the sensor 5 can detect the strain of the object with high accuracy.

[0137] The system 100 according to the present disclosure includes the sensor module 1 according to the above embodiment and an object. The object is an element involved in machining or plastic processing. This allows the physical quantities of the element involved in machining or plastic processing to be measured. As a result, the state of the element involved in machining or plastic processing, which is the object, can be understood from the measured physical quantities. Note that the object is not limited to the cutting tool 2. The object may be, for example, an element involved in machining. The element involved in machining may be, for example, a component of a machine tool such as a cutting tool, turret, spindle, tool rest, table, or chuck, or may be a workpiece or other element that affects machining. The object may also be, for example, an element involved in plastic processing. The element involved in plastic processing may be, for example, a mold, punch, die, base, or frame of a forging machine, or other element that affects plastic processing. The system 100 according to the present disclosure may include the sensor module 1 according to the above embodiment and, for example, a turret.

[0138] The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The basic scope of the present disclosure is defined by the claims, not the above-described embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0139] REFERENCE SIGNS LIST 1 Sensor module, 2 Cutting tool, 3 Housing, 4 Board, 5 Sensor, 6 Wireless communication unit, 7 Terminal, 8 Cable, 9 Protective member, 11 Power supply module, 21 Shank portion, 21a First side surface, 21b Second side surface, 21b1 First region, 21b2 Second region, 21c Third side surface, 21d Fourth side surface, 21e First end surface, 21f Second end surface, 22 Insert portion, 22a First relief surface, 22b Second relief surface, 22c Corner relief surface, 22d Rake surface, 23 Fixing portion, 24 Base plate, 25 Holding portion, 31 Lid portion, 32 Storage portion, 33a Mounting surface, 33b Outer wall surface, 33c Top surface, 34 Opposing surface, 34a First opposing surface portion, 34b Second opposing surface portion, 34c, 38b Side portion, 35 Inner wall surface, 36 lower surface, 37 step portion, 37a mounting surface, 37b side wall surface, 38 groove portion, 38a third opposing surface portion, 41 connector, 42 wiring, 51 base plate, 52 metal thin film pattern (metal thin film resistor), 52a electrode portion, 53 protective layer, 54 lead, 100 system, h through hole, n1 first notch portion, n2 second notch portion, n3 third notch portion, n4 fourth notch portion, n5 fifth notch portion, n6 sixth notch portion, H1, H2 recess portion, k1, k2, k3, w1, w2, w3, k1 width, t1, t2 distance.

Claims

1. A sensor, a housing that accommodates the sensor; The housing has a mounting surface that is attached to an object and an opposing surface that is located opposite the mounting surface, The sensor module, wherein the sensor is provided on the opposing surface.

2. The sensor module of claim 1 , wherein the sensor comprises a strain sensor.

3. The sensor module according to claim 1 , further comprising a substrate electrically connected to the sensor.

4. The sensor module according to claim 3 , further comprising a terminal provided on the substrate for supplying power to the sensor.

5. The sensor module of claim 4 , further comprising a power supply module electrically connected to the terminals.

6. The sensor module according to claim 5 , wherein the power supply module is accommodated in the housing.

7. a cable connecting the terminal and the power supply module; The sensor module according to claim 5 , wherein the cable is arranged on the substrate or at a position farther from the sensor than the substrate.

8. The sensor module according to claim 3 , wherein the sensor is disposed between the opposing surface and the substrate.

9. The sensor module according to claim 1 , further comprising a protective member covering the sensor.

10. The sensor module according to claim 9 , wherein the protective member is made of resin.

11. The sensor module according to claim 1 , wherein the sensor is disposed on the opposing surface at a position where the distance from the mounting surface is shortest.

12. A recess is provided on the opposing surface, The sensor module according to claim 1 , wherein the sensor is disposed in the recess.

13. A groove is provided on the opposing surface, The sensor module according to claim 1 , wherein the sensor is disposed above the groove.

14. The sensor module according to any one of claims 1 to 13; the object; The system, wherein the object is an element involved in machining or plastic processing.