Method for manufacturing an element array, method for removing an element, method for repairing an element array, device for removing an element, and device for repairing an element array

Abstract

[Problem] To provide a method for manufacturing a device array capable of manufacturing a device array with excellent durability, a method for removing a device used in the manufacturing method, a method for repairing a device array, a device removal device, and a device repair device for a device array. [Solution] A method for manufacturing an element array comprises a process of irradiating a first energy line to a specific element (37a) to be removed under a first condition, and a process of irradiating a second energy line to a location where the specific element has been removed under a second condition. The first condition is a condition in which an insulating member (39) in contact with a substrate terminal (38a) remains while removing the specific element (37a) from the surface of the substrate (34), and the second condition is a condition in which, unlike the first condition, the insulating member (39) is also removed.

Description

Technology Field

[0001] The present disclosure relates to a method for manufacturing an element array, a method for removing an element, a method for repairing an element array, an apparatus for removing an element, and an apparatus for repairing an element array. Background Technology

[0002] Recently, the development of displays using micro LEDs with a chip size of 100㎛ or less has been actively pursued. For example, Patent Document 1 shown below discloses a micro LED mounting technology using a laser-degradable adhesive. Since displays using micro LEDs mount a very large number of micro LED elements, there are cases where light emission failures occur due to defects in the micro LED elements themselves or defects during mounting on a single display substrate.

[0003] Meanwhile, regarding surface mount technology, a technology has been developed to detach devices such as micro LED devices from a substrate using a laser (e.g., Patent Document 2), and a method is conceived to remove specific devices such as micro LED devices mounted at a chip mounting site on a display substrate and to remount a new device at the device mounting site after removal.

[0004] When mounting a device onto a substrate, an insulating material such as flux is sometimes interposed around the substrate-side terminals to connect the device-side terminals with the substrate-side terminals. In this case, if a laser is irradiated onto a specific device to be removed, the device and the insulating material can be removed simultaneously if the laser output is high, but there is a risk of damaging the substrate itself or its constituent components.

[0005] In addition, when the laser output is low, parts of the device remain, making it difficult to re-mount new devices. Furthermore, even if only specific devices are removed, insulating materials such as flux used during device mounting may deteriorate due to heat from laser irradiation, and the deteriorated insulating materials may remain on or near the terminals of the substrate.

[0006] If degraded insulating material is left to remain on or near the terminals of the substrate, there is a risk that a good bond may not be obtained when a new device is reinstalled. Furthermore, even when a new device is not reinstalled, leaving degraded insulating material to remain on or near the terminals of the substrate may also lead to a reduction in the durability of the device array (e.g., a display). Prior art literature

[0007] Patent Document 1: International Publication WO2019 / 207920 Patent Document 2: Japanese Published Patent Application No. JP 2017-17230 The problem to be solved

[0008] The present disclosure is made in light of these actual circumstances, and its purpose is to provide a method for manufacturing a device array capable of manufacturing a device array with excellent durability, a method for removing a device used in the manufacturing method, a method for repairing a device array, a device removal device, and a device repair device. means of solving the problem

[0009] To achieve the above objective, a method for manufacturing a device array according to one aspect of the present disclosure is,

[0010] A method for manufacturing a device array having a plurality of devices electrically connected through device terminals with respect to a substrate terminal installed on a substrate,

[0011] A process of irradiating a first energy line onto a specific element as a target for removal under a first condition, and

[0012] With respect to the location where the above-mentioned specific element has been removed, a process of irradiating a second energy line under a second condition, and

[0013] The first condition above is a condition in which an insulating member in contact with the substrate terminal remains while removing the specific element from the surface of the substrate, and

[0014] The second condition above, unlike the first condition above, is also a condition in which the insulating member is removed.

[0015] In the method for manufacturing this device array, first, a first energy line is irradiated under a first condition on a specific device to be removed, thereby removing the specific device from the surface of the substrate. The first condition is an energy irradiation condition in which only the specific device is removed, and an insulating member that is in contact with at least a portion of the substrate terminal, from which the connection with the device terminal has been released, may be left together with the substrate terminal. Therefore, there is less risk of damaging the substrate itself or the constituent members of the substrate by the first energy line.

[0016] In addition, as a method for removing a specific element, the specific element may be removed from a predetermined location on the substrate by sublimating it through irradiating the specific element with a first energy line. Alternatively, the element may be removed from a predetermined location on the substrate by blowing away the connection between the element terminal and the substrate terminal by irradiating the specific element with a first energy line.

[0017] In addition, under a second condition different from the first condition, the insulating member located on the surface of a substrate at a predetermined location where a specific element has been removed can be removed by irradiating a second energy line onto the insulating member at that predetermined location. Therefore, the insulating member that has been degraded by heat, etc., during the irradiation of the first energy line can be removed by irradiating the second energy line.

[0018] If a deteriorated insulating member is left on or near the terminals of the substrate, there is a risk that a good connection between the terminals of the new device and the substrate terminals may not be obtained when a new device is mounted; however, by removing the deteriorated insulating member, a new insulating member can be formed at the removed location. Therefore, even if a new device is not mounted, the durability as a device array (e.g., a display) can be improved. Furthermore, by connecting the terminals of the new device and the substrate terminals after installing the new insulating member, the connection state is maintained well, and in this case as well, the durability as a device array (e.g., a display) can be improved.

[0019] Preferably, the output of the first energy line is higher than the output of the second energy line. For example, the output of the first energy line may be at least 2 times, at least 5 times, or at least 10 times the output of the second energy line.

[0020] Preferably, the number of shots of the second energy line is greater than the number of shots of the first energy line. For example, the number of shots of the first energy line depends on the output of the first energy line, but it is preferable to have fewer shots, for example, 3 shots or fewer, 2 shots or fewer, 1 shot, etc. It is desirable to be able to remove only specific elements with a small number of shots.

[0021] In addition, the number of shots of the second energy line is preferably, for example, 2 shots or more, 3 shots or more, 4 shots or more, and is preferably such that it is sufficient to sufficiently remove the insulating member located around the substrate terminal on the surface of the substrate corresponding to the location where the specific element was removed.

[0022] Preferably, the first energy line is irradiated onto the specific element with a first irradiation range smaller than the planar area of ​​the specific element. By irradiating the first energy line with such an irradiation range, there is less risk of deterioration of the substrate or auxiliary parts of the substrate (e.g., cavity molds, etc.) located around the specific element.

[0023] The second energy line is a second irradiation range capable of removing the insulating member located around the substrate terminal on the surface of the substrate corresponding to the location where the specific element is removed, and it is preferable that the insulating member be irradiated, and the irradiation range is not particularly limited. However, if the specific element and the insulating member are disposed within the cavity of the cavity mold, it is preferable that the second irradiation range be a range that is not irradiated to the cavity mold. This is to prevent the cavity mold from deteriorating.

[0024] The method of connecting the above-described substrate terminal and the above-described element terminal is not particularly limited, but the method described above is particularly effective when the substrate terminal and the element terminal are metal-bonded.

[0025] Each of the above-mentioned elements may be disposed within a cavity of a cavity frame installed on the surface of the substrate, and it is preferable that an insulating member be interposed around the element terminals and the substrate terminals within the cavity. By configuring it in this way, regular arrangement of elements is facilitated, and at the same time, removal of specific elements is also facilitated. Furthermore, as a means of installing the cavity frame on the surface of the substrate, the cavity frame may be prepared separately from the substrate and mounted on the substrate, or the cavity frame may be integrally formed on the surface of the substrate itself.

[0026] The above-described method for manufacturing a device array is,

[0027] A process of supplying a new insulating member to the surface portion of the substrate from which the insulating member has been removed, and

[0028] The process may additionally include connecting a device terminal of a new device to a substrate terminal located on the surface portion of the substrate supplied with the new insulating member.

[0029] A method for removing an element according to one aspect of the present disclosure is,

[0030] A process of irradiating a first energy line onto a specific element as a target for removal under a first condition, and

[0031] With respect to the location where the above-mentioned specific element has been removed, a process of irradiating a second energy line under a second condition, and

[0032] The first condition above is a condition in which an insulating member in contact with the substrate terminal remains while removing the specific element from the surface of the substrate, and

[0033] The second condition above, unlike the first condition above, is also a condition in which the insulating member is removed.

[0034] By using this element removal method, the manufacturing method of the element array described above can be easily realized.

[0035] A method for repairing an array of elements according to one aspect of the present disclosure is,

[0036] After removing the specific element and the insulating member by the method for removing the element described above, a process of supplying a new insulating member to the surface portion of the substrate from which the insulating member has been removed, and

[0037] The method comprises a process of transporting a new element to a surface portion of the substrate supplied with the new insulating member, and a process of connecting an element terminal of the new element to a substrate terminal located on the surface portion of the substrate supplied with the new insulating member.

[0038] By using this device array repair method, the manufacturing method of the device array described above can be easily realized.

[0039] A device for removing an element according to one aspect of the present disclosure is,

[0040] A substrate support that holds the substrate, and

[0041] An energy irradiation device that irradiates energy lines, and

[0042] A first control unit that controls the energy irradiation device such that, among a plurality of elements having element terminals connected to a substrate terminal provided on the surface of the substrate, the energy line is irradiated to a specific element as a target for removal under a first condition, and

[0043] With respect to an insulating member present on the surface of the substrate from which the specific element has been removed, a second control unit for controlling the energy line irradiated from the energy irradiation device under a second condition,

[0044] The first condition above is a condition in which an insulating member in contact with the substrate terminal remains while removing the specific element from the surface of the substrate, and

[0045] The second condition above is a condition in which the insulating member is removed, unlike the first condition above.

[0046] By using a device for removing this element, the method for manufacturing the element array described above can be carried out efficiently.

[0047] A repair device for an element array according to one aspect of the present disclosure is,

[0048] The device for removing the element described above, and

[0049] An insulating material supply device that supplies a new insulating material to the surface portion of the substrate from which the insulating material has been removed, and

[0050] A conveying device for conveying a new element to the surface portion of the substrate supplied with the new insulating member, and

[0051] The device connection device has a device terminal of the new device connected to the substrate terminal located on the surface portion of the substrate supplied with the new insulating member.

[0052] By using a repair device for this element array, the manufacturing method of the element array described above can be carried out efficiently. Brief explanation of the drawing

[0053] FIG. 1a is a schematic diagram showing the schematic configuration of an energy irradiation device used in a method for manufacturing a device array according to one embodiment of the present disclosure. FIG. 1b is a schematic diagram showing a transport device used in a method for manufacturing an element array according to one embodiment of the present disclosure. FIG. 1c is a schematic diagram showing a flux printing apparatus used in a method for manufacturing an element array according to one embodiment of the present disclosure. FIG. 2 is a cross-sectional view of a key part of an element array parallel to a plane including the X-axis and Z-axis shown in FIG. 1a. FIG. 3 is an enlarged cross-sectional view of a key part showing a method for removing some specific elements among the elements shown in FIG. 2. FIG. 4 is an enlarged cross-sectional view of a key part showing a process following the process shown in FIG. 3. FIG. 5 is an enlarged cross-sectional view of a key part showing a process following the process shown in FIG. 4. FIG. 6 is an enlarged cross-sectional view of a key part showing a process following the process shown in FIG. 5. FIG. 7 is an enlarged cross-sectional view of a key part showing a process following the process shown in FIG. 6. Specific details for implementing the invention

[0054] The following describes embodiments.

[0055] First, the element array (33) shown in FIGS. 1a and FIGS. 2 will be described. The element array (33) of this embodiment is used, for example, as a display device, and a plurality of elements (37) are mounted in a matrix along the X-axis and Y-axis on the surface of a substrate (34). In addition, in the drawings, the X-axis, Y-axis, and Z-axis are perpendicular to each other, and in this embodiment, the plane of the substrate (34) is parallel to the X-axis and Y-axis.

[0056] The element (37) is not particularly limited, but is, for example, a display element. In addition, the display element is not limited to an element for displaying a screen, but may be an element for illumination, and examples include a light-emitting element (micro LED element), a fluorescent element, etc.

[0057] In this embodiment, the element (37) is, for example, a micro light-emitting element (micro LED element), and its planar shape has a size of, for example, 5 μm × 5 μm to 200 μm × 300 μm. In addition, the gap δ (see FIG. 2) between the element (37) and the element (37) (or 37a / the same unless specifically mentioned below) is, for example, about 5 to 500 μm.

[0058] Each element (37) is housed inside each cavity (36a) (see FIG. 2) formed in a matrix on a cavity frame (36) fixed to the surface of a substrate (34), and the element terminal (38b) of the element (37) is electrically connected to a substrate terminal (38a) formed on the surface of the substrate (34).

[0059] As for the substrate (34), it is not particularly limited and may be a wiring substrate having wiring formed thereon connected to the substrate terminal (38a), may be transparent or translucent, and may also be flexible. As for the cavity mold (36), it is preferable to be made of, for example, plastic, but it may also be made of other insulating materials. The size of each cavity (36a) formed in the cavity mold (36) is set to a size in which the element (37) can be inserted. The cavity mold (36) having the cavity (36a) may be formed, for example, by photolithography and may be made of UV resin, etc.

[0060] As for the substrate terminal (38a), it is not particularly limited, but may have a connection layer comprising Sn or a Sn alloy (e.g., an alloy containing Sn, Ag and / or Cu, etc., or a Sn-In alloy) on the surface in contact with the element terminal (38b). Additionally, the substrate terminal (38a) may have an underlayer composed of a metal (including an alloy) different from the connection layer, for example, on the side closer to the substrate (34). Examples of the underlayer include Ni or a Ni alloy layer, but it may also be composed of other metals. Furthermore, the connection layer may also be composed of other metals other than Sn or a Sn alloy.

[0061] The element terminal (38b) is not particularly limited, but is composed of, for example, Au or an Au alloy.

[0062] Inside each cavity (36a), a flux (39) serving as an insulating material is filled between the element (37) and the substrate (34). The flux (39) has the function of preventing the surface of the substrate terminal (38a) from oxidizing before connecting to the element terminal (38b), and also has the function of protecting these terminals (38a, 38b) after connecting the element terminal (38b) and the substrate terminal (38a). In addition, the flux (39) also has the function of temporarily fixing the element (37) to the substrate (34) inside the cavity (36a) before connecting the element terminal (38b) and the substrate terminal (38a). The flux (39) is not particularly limited, but examples include resin-based fluxes, organic-based fluxes, inorganic-based fluxes, etc., which have a resin such as rosin or modified rosin as a main component.

[0063] Next, a repair device (1) of the element array (33) shown in FIG. 1a will be described. The repair device (1) of the present embodiment has an element removal device (2) shown in FIG. 1a, a control device (2b), a conveying device (4) shown in FIG. 1b, a flux supply device as an insulating material supply device (e.g., a flux printing device (5) shown in FIG. 1c), and an element connection device that is not shown.

[0064] The flux supply device may be equipped with a flux application device instead of a stamp tool (44) mounted on the return head (42) of the return device (4). It is preferable that the return head (42) equipped with the flux application device be a separate return head from the return head that holds the stamp tool (44). The flux application device is not particularly limited, but for example, a flux transfer device (pin transfer, etc.) may be used, or the flux printing device (5) shown in FIG. 1c may be used.

[0065] As shown in FIG. 1c, the flux printing device (5) has a metal mask (52) having holes (54) of a predetermined pattern, a holding member (not shown) for holding the metal mask (52), and a squeegee (56). Holes (54) of a predetermined pattern are formed in the metal mask (52), and the X-axis and Y-axis positions of the metal mask (52) are controlled so that the holes (54) shown in FIG. 1c are aligned with a position corresponding to a specific cavity (36a) shown in FIG. 7. In this state, the squeegee (56) is moved parallel to the metal mask (52) from one end of the upper side of the metal mask (52) toward the other end while making contact with the flux (39). As a result, the flux (39) is supplied through the holes (54) into the specific cavity corresponding to the holes (54).

[0066] As shown in FIG. 1a, the device removal device (2) has a substrate support (3) that holds a substrate (34). The substrate support (3) has a base (32). A substrate (34) of the device array (33) is detachably fixed to an upper surface along the Z-axis of the base (32). A cavity frame (36) is installed and fixed (may be integrally molded with the substrate (34)) on the upper surface of the substrate (34) of the device array (33) of this embodiment, and each device (37) is disposed within a cavity (36a) of the cavity frame (36). A method for manufacturing the device array (33) will be described later.

[0067] A laser irradiation device (2a) is positioned as an element removal device (2) at an upward position along the Z-axis of the element array (33). The laser irradiation device (2a) is positioned to be movable relative to the base portion (32) along the X-axis and Y-axis. If necessary, the laser irradiation device (2a) may also be positioned to be movable relative to the base portion (32) along the Z-axis. Specifically, for the laser irradiation device (2a), examples include a YAG laser, a carbon dioxide laser, an excimer laser, and a UV laser. Considering the wavelength of the laser and the energy required for removal, a YAG laser is preferred.

[0068] The control device (2b) has a first control unit (2b1) and a second control unit (2b2) ​​for controlling the laser output and the number of shots from the laser emission unit (22) of the laser irradiation device (2a). The control device (2b) can control a movement mechanism that moves the laser irradiation device (2a) relative to the base unit (32), and at the same time, can control a movement mechanism that moves the return head (42) of the return device (4) shown in FIG. 1b relative to the base unit (32). The control device (2b) may be provided in the laser irradiation device (2a), but may be placed at a different location from the laser irradiation device (2a), and may be configured to communicate with the laser irradiation device (2a) via wired or wireless means. Additionally, the laser irradiation device (2a) itself may have a laser irradiation condition setting function equivalent to that of the control device (2b), in which case the control device (2b) may be omitted.

[0069] The first control unit (2b1) controls the laser irradiation device (2a) to irradiate a specific element (37a) as a target for removal under a first condition, among a plurality of elements (37, 37a) each having an element terminal (38b) connected to a plurality of substrate terminals (38a) installed on the surface of the substrate (34) shown in FIG. 2. The laser light (Lt) emitted from the laser emission unit (22) of the laser irradiation device (2a) is irradiated only on the specific element (37a), as shown in FIG. 3.

[0070] Preferably, the laser light (Lt) is controlled by the first control unit (2b1) so that it is irradiated onto the specific element (37a) with a first irradiation range (including a spot diameter or a laser scan range) that is smaller than the total area of ​​the planar shape of the specific element (37a). By irradiating the first energy line with such an irradiation range, there is less risk of deterioration of the substrate (34) or auxiliary parts of the substrate (e.g., a cavity frame (36), etc.) located around the specific element (37a). Additionally, the laser irradiation device (2a) may have an irradiation mask for directly irradiating the laser light (Lt) only onto the surface of the specific element (37a) with an irradiation range of a rectangular spot shape that matches the planar shape of the specific element (37a).

[0071] Additionally, the laser irradiation device (2a) may have an imaging device. Additionally, the device (2) may be equipped with an imaging device as a separate device. The imaging device is capable of imaging the elements (37 or 37a) of the element array (33). The imaging device may perform an external inspection of each element (37, 37a), and may control the relative movement of the laser irradiation device (2a) or the base (32) so that laser light (Lt) is irradiated only on a specific element (37a) that is judged to be defective during the external inspection. The imaging device may be installed in the same driving system as the laser irradiation device (2a) to miniaturize the device configuration. Additionally, the imaging device may be used for determining the presence or absence of the placement of elements (37) or determining their position, in addition to determining defects in the elements, and may be supported and driven by a separate support mechanism or driving mechanism from the laser irradiation device (2a), including cases where it is used for such purposes. The processing of the image captured by the imaging device may be performed by the control device (2b) shown in FIG. 1a or another control device.

[0072] Additionally, the second control unit (2b2) ​​controls the laser irradiation device (2a) to irradiate a laser light (Lt) as a second energy line onto a flux (39) that serves as an insulating member on the surface of a substrate (34) corresponding to a location where a specific element (37a) has been removed, as shown in FIG. 4, under a second condition different from the first condition. Here, the conditions to be controlled include the output of the laser light, the irradiation range (including the spot diameter or laser scan range), etc.

[0073] The first control unit (2b1) and the second control unit (2b2) ​​shown in FIG. 1a may be configured as dedicated circuits in the control device (2b) or as programs executed on a computer, etc. Other control units in the control device (2b) may also be configured as dedicated circuits or as programs executed on a computer, etc.

[0074] The conveying device (4) shown in FIG. 1b has a conveying head (42), and a stamp tool (44) is detachably mounted on the lower end of the conveying head (42). In the stamp tool (44) of this embodiment, a stamp convex portion (46) is installed, and a new element (37b) is detachably mounted on the stamp convex portion (46). The new element (37b) is the same element as the element (37), is a new element mounted in the part where a specific element (37a) has been removed, and is conveyed to a predetermined position by the conveying device (4). Multiple stamp convex portions may be installed.

[0075] The material of the stamp convex portion (46) is not particularly limited, but examples include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicone compounds, and polyether rubber. The stamp convex portion (46) is formed on the surface (bottom) of the stamp layer, and the stamp layer may also be composed of the same material as the convex portion (46), but it is preferable that the surface of the stamp layer other than the convex portion (46) does not have adhesive properties. It is preferable that the element is not picked up by adhesive force in areas other than the convex portion (46).

[0076] Next, a method for manufacturing an array of elements (33), in particular, a method for manufacturing an array of light-emitting elements (micro LED elements) will be described.

[0077] First, an arrangement of elements (e.g., an arrangement of elements (37) of a single light-emitting color) is formed on the surface of a substrate for forming elements, wherein elements (37) of a specific light-emitting color, such as LED elements, are arranged in a matrix. As for the substrate for forming elements, for example, depending on the type of element (37) (blue light-emitting element, red light-emitting element, green light-emitting element, etc.), examples include a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, etc. are used.

[0078] After forming an array of elements (37) on the surface of a substrate for forming elements, the elements (37) are separated from the substrate on which the elements (37) are formed by a method such as a laser lift method, for example, and transferred into the cavity (36a) of the cavity mold (36) of the substrate (34) (for mounting) shown in FIG. 1a. This process is repeated with elements (37) of different light-emitting colors (RGB) to produce an element array (33) having RGB elements (37).

[0079] In addition, each cavity (36a) of the cavity frame (36) installed on the substrate (34) is filled with flux (39) in advance by means of a coating nozzle, as shown in FIG. 2, and the area around the substrate terminal (38a) of the substrate (34) is filled with flux (39). The connection between the element terminal (38b) of the element (37 (37a)) and the substrate terminal (38a) is not particularly limited, but in this embodiment, it is a metal bond and is bonded by a bonding device not shown.

[0080] In this way, the element array (33) is formed, but in the method for manufacturing the element array of the present embodiment, next, for example, an appearance inspection or a light emission inspection is performed on each element (37 (37a)) arranged in the array shown in FIG. 1a, and a specific element (37a) that needs to be removed for any reason, such as an appearance defect or a light emission defect, is identified. Furthermore, in the method for manufacturing the element array of the present embodiment, next, after performing the removal method of the specific element (37a) shown below, a repair method of the element array (33) is performed.

[0081] Specifically, first, as shown in FIG. 1a, the laser light (Lt) from the laser irradiation device (2a) is controlled to move relative to one or both of the base (32) or the laser irradiation device (2a) along the X-axis and Y-axis so that the laser light (Lt) is irradiated from the laser irradiation device (2a) to only a specific element (37a) within a predetermined irradiation range. Additionally, if necessary, the relative distance along the Z-axis between the base (32) and the laser irradiation device (2a) is controlled. This control is performed by the control device (2b) controlling the movement mechanism of either or both of the base (32) or the laser irradiation device (2a).

[0082] Next, a first control unit (2b1) of a control device (2b) controls the laser irradiation device (2a) so that laser light (Lt) is irradiated onto a specific element (37a) from the laser emission unit (22) of the laser irradiation device (2a), thereby removing only the specific element (37a). That is, the laser light (Lt) is controlled to a first condition by the first control unit (2b1) of the control device (2b). The first condition is a condition in which the specific element (37a) is removed from the surface of the substrate (34) along with the element terminal (38b) by irradiating the laser light (Lt) as a first energy line into the first irradiation range of the specific element (37a), as shown in FIGS. 3 and 4. In addition, the first condition is also a condition in which the flux (39), which is in contact with at least a portion of the substrate terminal (38a), is left along with the substrate terminal (38a).

[0083] Specifically, under the first condition, the wavelength of the laser light (Lt) emitted from the laser emitter (22) is not particularly limited, but is preferably 532 nm or less, and more preferably 266 nm or less. In addition, under the first condition, the output of the laser light (Lt) is preferably such that the element (37a) can be removed by sublimation (including ablation) or blown away within 3 shots, preferably within 1 shot, and although it depends on the size and material of the element (37a), for example, 10 to 100 mJ / cm² 2 It is desirable that the fewer the shots, the less damage is done to the substrate terminal (38a), and the less risk there is of damage to the substrate (34) or cavity frame (36).

[0084] Additionally, the irradiation range of the laser light (Lt) (including the spot diameter or laser scan range) is preferably smaller than the size along the X and Y axes of the element (37a), and it is preferable that the laser light (Lt) is not irradiated onto the cavity frame (36). By irradiating the laser light (Lt) in this manner, as shown in FIG. 4, only the specific element (37a) can be removed from the substrate (34), and the flux (39), which is in contact with at least a portion of the substrate terminal (38a), can be left together with the substrate terminal (38a).

[0085] As shown in FIG. 4, after removing only a specific element (37a) from the substrate (34), the second control unit (2b2) ​​of the control device (2b) shown in FIG. 1a controls the laser light (Lt) from the laser emission unit (22) of the laser irradiation device (2a) under a second condition different from the first condition. The second condition is a condition in which, as shown in FIG. 4 and FIG. 5, the laser light (Lt) as a second energy line is irradiated onto the flux present on the surface of the substrate (34) corresponding to the location where the specific element (37a) was removed, thereby removing the flux (39) within the specific cavity (36a). Furthermore, the specific cavity (36a) is the cavity (36a) from which the specific element (37a) was removed.

[0086] Specifically, in the second condition, the wavelength of the laser light (Lt) emitted from the laser emitter (22) is not particularly limited, but is preferably 532 nm or less, more preferably 266 nm or less. The wavelength of the laser light (Lt) in the second condition may be the same as or different from the wavelength of the laser light (Lt) in the first condition. In addition, in the second condition, it is preferable that the output of the laser light (Lt) is smaller than the output of the laser light (Lt) in the first condition. Preferably, the output of the laser light (Lt) in the second condition may be 1 / 2 or less of the output of the laser light (Lt) in the first condition, more preferably 1 / 3 or less, 1 / 4 or less, 1 / 5 or less, or 1 / 10 or less.

[0087] The number of shots of laser light (Lt) in the second condition is preferably greater than the number of shots of laser light (Lt) in the first condition, and preferably 4 shots or more, 5 shots or more, or 10 shots or more. The number of shots of laser light (Lt) in the second condition is preferably such that the flux (39) within the specific cavity (36a) is almost completely removed, as shown in FIG. 5. In addition, the flux (39) within the specific cavity (36a) does not need to be completely removed, but it is preferable that at least the flux in contact with the substrate terminal (38a) is removed.

[0088] By irradiating the laser light (Lt) under the second condition, the flux (39) present in the specific cavity (36a) is sublimated and removed. Additionally, due to the heat generated during the irradiation of the laser light (Lt) under the second condition, as shown in FIG. 5, the surface of the substrate terminal (38a) (e.g., the surface of the Sn layer) has its irregularities (see FIG. 4) caused by the connection marks with the device terminal (38b) shown in FIG. 3 removed, and is flattened or takes on a rounded, convex shape.

[0089] Additionally, the irradiation range of the laser light (Lt) under the second condition is preferably such that the laser light (Lt) is irradiated onto the flux (39) shown in FIG. 4 inside a specific cavity (36a) and is not irradiated onto the cavity frame (36). Additionally, the laser light (Lt) may also be irradiated onto the surface of the substrate terminal (38a).

[0090] After that, using a flux printing device (5) shown in FIG. 1c, for example, a new flux (39) is injected into a specific cavity (36a) as shown in FIG. 6. The new flux (39) is preferably made of the same material as the removed flux (39) before it was degraded by heat such as laser light irradiation, but it is not necessarily the same flux. By the new flux (39), an oxide film formed on the surface of the substrate terminal (38a) is removed, making it easier to bond with the device terminal (38b).

[0091] Next, using the stamp tool (44) of the conveying device (4) shown in FIG. 1b, a new element (37b) is conveyed to a position corresponding to a specific cavity (36a) as shown in FIG. 7, and the element (37b) is mounted inside the cavity (36a) so that the element terminal (38b) of the new element (37b) contacts the substrate terminal (38a).

[0092] The connection between the element terminal (38b) of the element (37b) and the substrate terminal (38a) may be performed by an element connection device (not shown) or by a conveying device (4). In either case, the element (37b) is pushed toward the substrate (34) with a predetermined pressure to create at least a partial metal bond between the element terminal (38b) and the substrate terminal (38a). At this time, heat (e.g. 40°C or higher) may be applied to the substrate terminal (38a) while causing the element terminal (38b) to penetrate the surface of the substrate terminal (38a). In this way, an element array (33) is manufactured.

[0093] As described above, in the method for manufacturing the element array (33) of the present embodiment (the method for removing the element and the method for repairing the element array are also the same), first, as shown in FIG. 3, a laser light (Lt) is irradiated on a specific element (37a) to be removed under a first condition, and as shown in FIG. 4, the specific element (37a) is removed from the surface of the substrate (34). The first condition is an energy irradiation condition in which only the specific element (37a) is removed, and the flux (39) that is in contact with at least a part of the substrate terminal (38a) after the connection with the element terminal (38b) is released can be left together with the substrate terminal (38a). Therefore, there is less risk of damaging the substrate (34) itself or the cavity frame (36) installed on the substrate (34).

[0094] In addition, in the method of the present embodiment, the flux (39) located on the surface of a substrate (34) that has a specific element (37a) removed can be removed by irradiating the flux (39) located at a specific position, under a second condition different from the first condition. Therefore, the flux degraded by heat, etc., during the irradiation of the laser light (Lt) under the first condition can be removed by irradiating the laser light under the second condition.

[0095] If the degraded flux (39) is left in a state where it remains on or near the substrate terminal (38a), there is a concern that a good connection between the device terminal (38b) of the new device (37b) and the substrate terminal (38a) will not be obtained when the new device (37b) is re-mounted, but by removing the degraded flux (39), the new flux (39) can be re-mounted. Therefore, even if the new device (37b) is not mounted, the durability as a device array (e.g., a display) can be improved. In addition, after re-mounting the new flux (39), the device terminal (38b) of the new device (37b) and the substrate terminal (38a) of the substrate (34) are connected, so the connection state is maintained well, and in this case as well, the durability as a device array (e.g., a display) (33) can be improved.

[0096] In addition, in this embodiment, each of the elements (37) (including 37a and 37b) is placed within each cavity (36a) of a cavity frame (36) installed on the surface of a substrate (34), and a flux (39) is interposed around the element terminal (38b) and the substrate terminal (38a) within the cavity (36a). By configuring it in this way, regular arrangement of elements (37) (including 37a and 37b) is easy, and at the same time, removal of a specific element (37a) is also easy.

[0097] In addition, in this embodiment, a new good element (37b) is not placed at the location where a specific element (37a) was removed, and for example, a display device (including a lighting device) having an element array may be used. For example, if the size of the element (37) is small, even if a specific element (37a) within two or more arrays of elements (37) is missing, there may be no problem with the entire display device (including a lighting device) having an element array.

[0098] In addition, in the device (2) of the present embodiment, even if the elements (37) arranged in a predetermined array are small, such as 5㎛×5㎛ or less, it is easy to easily remove only specific elements (37a), and thus an element array with specific elements (37a) removed can be easily manufactured.

[0099] Furthermore, the present invention is not limited to the embodiments described above and can be modified in various ways within the scope of the present invention.

[0100] For example, in the above-described embodiment, a cavity frame (36) is installed on the surface of the substrate (34), but the element array (33) does not necessarily have to have a cavity frame (36).

[0101] Additionally, as for the specific component (37a) to be removed, it may be a component that is defective, has a misaligned connection position, or is unnecessary in the layout.

[0102] In addition, in the above-described embodiment, the method of connecting the substrate terminal (38a) and the device terminal (38b) is not particularly limited, but the method of the above-described embodiment is particularly effective when the substrate terminal (38a) and the device terminal (38b) are directly connected, such as by a metal bond. Other connection methods include, for example, connection by ACF (conductive adhesive), bonding by solder, BGA, bonding by conductive paste, bonding by curable insulating resin, etc.

[0103] In addition, in the above-described embodiment, a laser irradiation device (2a) is used as an energy beam irradiation device, but the energy beam irradiation device is not limited to a laser irradiation device (2a).

[0104] In addition, in addition to the flux (39), insulating materials used in the element array (33) include, for example, underfill, potting agent, filler, etc.

[0105] In addition, the element (37) is not limited to a display element, but may be various electronic component elements such as a ceramic capacitor, chip inductor, piezoelectric element, magnetostrictive element, chip resistor, tantalum electrolytic capacitor, IC, or semiconductor element.

[0106] In addition, as a conveying device, in addition to a conveying device using a stamp tool (44), a conveying device having an adsorption conveying part may also be used. Explanation of the symbols

[0107] 1… Repair device for a component array 2… Device for removing elements 2a… laser irradiation device (energy irradiation device) 2b… ​​control unit 2b1… First control unit 2b2… 2nd control unit 22… Laser Photo Shooting Unit 3… PCB support 32… base part 33… device array 34… board 36… cavity mold 36a… cavity 37… small 37a… specific element 37b… new device 38a… board terminal 38b… component terminal 39… Flux (insulating material) 4… return device 42… Return head 44… Stamp tool 46… Stamp raised part 5… Flux printing device 52… Metal mask 54… hole 56… Squeegee

Claims

Claim 1 A method for manufacturing a device array having a plurality of devices electrically connected through device terminals to a substrate terminal installed on a substrate, the method comprising: a process of irradiating a first energy line to a specific device to be removed under a first condition; and a process of irradiating a second energy line to a location where the specific device has been removed under a second condition, wherein the first condition is a condition in which an insulating member in contact with the substrate terminal remains while removing the specific device from the surface of the substrate, and the second condition is a condition in which, unlike the first condition, the insulating member is removed. Claim 2 A method for manufacturing a device array in which, in claim 1, the output of the first energy line is higher than the output of the second energy line. Claim 3 A method for manufacturing an array of elements according to claim 1, wherein the number of shots of the second energy line is greater than the number of shots of the first energy line. Claim 4 A method for manufacturing an array of elements according to claim 1, wherein the first energy line is a first irradiation range smaller than the planar area of ​​the specific element, and the specific element is irradiated with the first energy line. Claim 5 A method for manufacturing an element array irradiated on an insulating member, wherein the second energy line is a second irradiation range capable of removing the insulating member located around the substrate terminal present on the surface of the substrate corresponding to the position where the specific element is removed. Claim 6 A method for manufacturing an element array according to any one of claims 1 to 5, wherein each of the elements is disposed within each cavity of a cavity mold installed on the surface of the substrate, and the insulating member is interposed around the element terminals and the substrate terminals within the cavity. Claim 7 A method for manufacturing a device array according to any one of claims 1 to 5, further comprising a process of supplying a new insulating member to a surface portion of the substrate from which the insulating member has been removed, and a process of connecting a device terminal of a new device to a substrate terminal located on the surface portion of the substrate where the new insulating member has been supplied. Claim 8 A method for removing a device, comprising a process of irradiating a first energy line onto a specific device to be removed under a first condition, and a process of irradiating a second energy line onto a location where the specific device has been removed under a second condition, wherein the first condition is a condition in which an insulating member in contact with the substrate terminal remains while removing the specific device from the surface of the substrate, and the second condition is a condition in which, unlike the first condition, the insulating member is also removed. Claim 9 A method for repairing an element array, comprising the steps of: removing the specific element and the insulating member by the method for removing the element described in claim 8; supplying a new insulating member to a surface portion of the substrate from which the insulating member has been removed; returning a new element to a surface portion of the substrate from which the new insulating member has been supplied; and connecting the element terminal of the new element to a substrate terminal located on the surface portion of the substrate from which the new insulating member has been supplied. Claim 10 A device for removing an element, comprising: a substrate support member for maintaining a substrate; an energy irradiation device for irradiating an energy line; a plurality of elements having element terminals connected to a substrate terminal provided on the surface of the substrate; a first control unit for controlling the energy irradiation device such that the energy line is irradiated to the specific element as a target for removal under a first condition; and a second control unit for controlling the energy line irradiated from the energy irradiation device under a second condition regarding an insulating member existing on the surface of the substrate from which the specific element has been removed, wherein the first condition is a condition in which the insulating member in contact with the substrate terminal remains while removing the specific element from the surface of the substrate, and the second condition is a condition in which the insulating member is removed, unlike the first condition. Claim 11 A repair device for an element array having a removal device for an element described in claim 10, an insulating member supply device for supplying a new insulating member to a surface portion of a substrate from which the insulating member has been removed, a conveying device for conveying a new element to a surface portion of the substrate to which the new insulating member has been supplied, and an element connecting device for connecting an element terminal of the new element to a substrate terminal located on the surface portion of the substrate to which the new insulating member has been supplied.

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