Vacuum coupled plating jig

Abstract

The present invention relates to a vacuum-coupled plating jig, and more particularly to a vacuum-coupled plating jig that combines two plates arranged with a substrate in between by vacuum pressure without a separate coupling member. The present invention allows for the secure fixation of a substrate placed between a first plate and a second plate by using a vacuum to bring them into close contact, without the need for a separate coupling member (such as a clamp) conventionally used to fix a substrate to a jig. In addition, it is possible to prevent the plating solution from flowing into the conductive part that applies power to the substrate, and it can be applied to substrates of various thicknesses by means of a first internal sealing member, a second internal sealing member, and an external sealing member that are elastically deformed by external force.

Description

Technology Field

[0001] The present invention relates to a vacuum-coupled plating jig, and more particularly to a vacuum-coupled plating jig that combines two plates arranged with a substrate in between by vacuum pressure without a separate coupling member. Background Technology

[0002] A plating device for plating substrates such as printed circuit boards is equipped with a jig for holding the substrate.

[0003] A clamp is attached to the above jig, and the jig holds a substrate by means of the clamp.

[0004] When plating the above substrate, the current supplied through the jig is transmitted to the substrate through the jig and the clamp so that an electroplated layer is formed on the substrate.

[0005] Conventional plating devices of this type had the following problems.

[0006] Basically, the jig holding the substrate is immersed in the plating solution along with the substrate.

[0007] Therefore, plating was inevitably carried out on the contact points that become submerged in the plating solution along with the substrate during plating, namely the electrical contact points between the clamp and the substrate.

[0008] When this phenomenon accumulates, a problem arises where the clamp and the substrate become stuck together and do not detach easily.

[0009] To prevent this problem, the jig and clamp had to be periodically stripped to prevent plating from accumulating at the contact points.

[0010] In addition, due to resistance generated at the clamp contact points and uneven current distribution within the product, plating became concentrated in areas adjacent to the contact points, resulting in thick plating; this affected the overall plating variation of the product and became a factor in degrading product quality.

[0011] Although various technologies have been developed to solve these problems, the aforementioned issues still exist. Prior art literature

[0012] Published Patent 10-2019-0056460 The problem to be solved

[0013] The present invention aims to solve the aforementioned problems by providing a vacuum-bonded plating jig that prevents plating solution from flowing into the area where the substrate and the conductive part come into contact, can be applied to substrates of various thicknesses, and can firmly bond two plates placed with the substrate in between using a vacuum. means of solving the problem

[0014] To achieve the above objective, the vacuum-coupled plating jig of the present invention comprises: a first plate having a hollow shape with a first perforation hole formed on the inside; a second plate having a hollow shape with a second perforation hole formed on the inside, one side of which contacts the other side of the first plate with a substrate in between; a first internal sealing member mounted in a closed-loop shape along the circumference of the first perforation hole on the other side of the first plate and contacting along the circumference of one side of the substrate; a second internal sealing member mounted in a closed-loop shape along the circumference of the second perforation hole on one side of the second plate and contacting along the circumference of the other side of the substrate; and an external sealing member having a closed-loop shape disposed between the other side of the first plate and the one side of the second plate at the outer edge of the substrate, which seals the gap between the first plate and the second plate when the first plate and the second plate are coupled. The apparatus comprises a conductive member that is mounted on the other side of the first plate between the first internal sealing member and the external sealing member, or mounted on one side of the second plate between the second internal sealing member and the external sealing member, and is electrically connected to an external power source; wherein, when the first plate and the second plate are in contact with each other, an adsorption space is formed between the first and second internal sealing members and the external sealing member, and when the substrate is placed between the first plate and the second plate, the edge portion of the substrate placed inside the external sealing member contacts the conductive member, and as the air in the adsorption space is discharged to the outside by an external force and the adsorption space becomes a vacuum, the first plate and the second plate are mutually coupled with the substrate in between.

[0015] An air connector portion communicating with the adsorption space is formed on the first plate or the second plate, and air from the adsorption space is discharged to the outside through the air connector portion.

[0016] The above-mentioned conductive member comprises a first conductive member mounted on the other side of the first plate and a second conductive member mounted on one side of the second plate; wherein the first conductive member comprises a rod-shaped first electrode bar and a first elastic connecting member, one end of which is coupled to the first electrode bar and bent, and the other end of which contacts the edge of one side of the substrate; and the second conductive member comprises a rod-shaped second electrode bar and a second elastic connecting member, one end of which is coupled to the second electrode bar and bent, and the other end of which contacts the edge of the other side of the substrate; wherein the other end of the first elastic connecting member and the other end of the second elastic connecting member are bent in a direction that brings them closer to each other, and before the first plate and the second plate are coupled, the other end of the first elastic connecting member protrudes further in the opposite direction of the first electrode bar than the other side of the first plate, and the second elastic connecting member The other end protrudes further in the opposite direction of the second electrode bar than one side of the second plate.

[0017] The apparatus further comprises a plurality of first guide members mounted around the perimeter of the first plate, wherein the first guide members protrude toward the outer surface of the second plate, and when the first plate and the second plate come into contact, the first guide members are positioned adjacent to the outer surface of the second plate to guide the movement of the second plate.

[0018] The apparatus further comprises a plurality of second guide members mounted on the outer side of the first internal sealing member on one surface of the first plate, wherein the second guide members protrude in the direction of the second plate, and when the substrate is inserted in the direction of the first plate, the second guide members are positioned adjacent to the outer surface of the substrate to guide the movement of the substrate. Effects of the invention

[0019] According to the vacuum-coupled plating jig of the present invention as described above, the following effects are achieved.

[0020] The present invention allows for the secure fixation of a substrate placed between a first plate and a second plate by using a vacuum to bring them into close contact, without the need for a separate coupling member (such as a clamp) conventionally used to fix a substrate to a jig.

[0021] In addition, it is possible to prevent the plating solution from flowing into the conductive part that applies power to the substrate, and it can be applied to substrates of various thicknesses by means of a first internal sealing member, a second internal sealing member, and an external sealing member that are elastically deformed by external force. Brief explanation of the drawing

[0022] FIG. 1 is a perspective view of a plating jig according to an embodiment of the present invention, FIG. 2 is a unidirectional exploded perspective view of a plating jig according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of a plating jig according to an embodiment of the present invention, FIG. 4 is an enlarged view of the first conductive part according to an embodiment of the present invention, FIG. 5 is a drawing of the substrate arranged in FIG. 4. FIG. 6 is an enlarged view of a second conductive part according to an embodiment of the present invention, FIG. 7 is a cross-sectional view taken along line AA of FIG. 1. Specific details for implementing the invention

[0023] As shown in FIGS. 1 to 7, the vacuum-coupled plating jig of the present invention comprises a first plate (10), a second plate (20), a first internal sealing member (30), a second internal sealing member (40), an external sealing member (50), and a conductive member.

[0024] The first plate (10) above is formed in a hollow shape with a first through hole formed on the inside.

[0025] The second plate (20) is formed in a hollow shape with a second through hole formed on the inside.

[0026] The other side of the first plate (10) and the one side of the second plate (20) are in mutual contact with a substrate (S) between them, thereby fixing the substrate (S) placed between them.

[0027] The first internal sealing member (30) is mounted in a closed-loop shape along the perimeter of the first through hole on the other side of the first plate (10) and contacts along the perimeter of one side of the substrate (S).

[0028] The second internal sealing member (40) is mounted in a closed-loop shape along the perimeter of the second through hole on one side of the second plate (20) and contacts along the perimeter of the other side of the substrate (S).

[0029] The above external sealing member (50) is formed in a closed-loop shape and is positioned between the other side of the first plate (10) and one side of the second plate (20) at the outer edge of the substrate (S).

[0030] The above external sealing member (50) seals the gap between the first plate (10) and the second plate (20) at the outer edge of the substrate (S) when the first plate (10) and the second plate (20) are combined.

[0031] The first internal sealing member (30), the second internal sealing member (40), and the external sealing member (50) are made of elastic gaskets, etc.

[0032] When the first plate (10) and the second plate (20) are in contact with each other, an adsorption space (17) is formed between the first internal sealing member (30) and the external sealing member (50) and between the second internal sealing member (40) and the external sealing member (50), and the adsorption space (17) is sealed from the outside so that plating solution, etc., does not flow into it.

[0033] As the air in the adsorption space (17) is expelled to the outside by an external force and the adsorption space (17) becomes a vacuum, the first plate (10) and the second plate (20) are joined together in close contact with each other with the substrate (S) in between.

[0034] An air connector part (15) communicating with the adsorption space (17) is formed in the first plate (10) or the second plate (20).

[0035] The air connector part (15) is connected to an external vacuum pump (not shown), and when the vacuum pump is operated, as indicated by the arrow in FIG. 7, the air in the adsorption space (17) is discharged to the outside through the air connector part (15), and the adsorption space (17) becomes vacuumed, so that the first plate (10) and the second plate (20) are strongly attached to each other and the substrate (S) placed between them can be strongly fixed.

[0036] Therefore, in the present invention, a separate coupling member, such as a clamp, for combining the first plate (10) and the second plate (20) or for gripping the substrate (S) is unnecessary.

[0037] In addition, the first internal sealing member (30), the second internal sealing member (40), and the external sealing member (50), which can be elastically deformed by an external force, can be applied to substrates (S) of various thicknesses.

[0038] The above-mentioned conductive members (61, 65) are mounted on the other side of the first plate (10) between the first internal sealing member (30) and the external sealing member (50) and / or are mounted on one side of the second plate (20) between the second internal sealing member (40) and the external sealing member (50), and are electrically connected to an external power source.

[0039] With the substrate (S) positioned between the first plate (10) and the second plate (20), the edge portion of the substrate (S) positioned inside the external sealing member (50) comes into contact with the conductive portion.

[0040] The above-mentioned current-carrying unit contacts the substrate (S) and supplies power to the substrate (S).

[0041] The above-mentioned conductive part is composed of a first conductive part (61) mounted on the other side of the first plate (10) and a second conductive part (65) mounted on one side of the second plate (20).

[0042] The first conductive part (61) is composed of a rod-shaped first electrode bar (62) and a first elastic connecting member (63), one end of which is connected to the first electrode bar (62) and bent, and the other end of which contacts the edge of one side of the substrate (S).

[0043] The second conductive part (65) above is composed of a rod-shaped second electrode bar (66) and a second elastic connecting member (67), one end of which is connected to the second electrode bar (66) and bent, and the other end of which contacts the edge of the other side of the substrate (S).

[0044] The other end of the first elastic connecting member (63) and the other end of the second elastic connecting member (67) are bent in a direction that brings them closer to each other.

[0045] Before the first plate (10) and the second plate (20) are combined, the other end of the first elastic connecting member (63) protrudes further in the opposite direction of the first electrode bar (62) than the other side of the first plate (10), and the other end of the second elastic connecting member (67) protrudes further in the opposite direction of the second electrode bar (66) than one side of the second plate (20).

[0046] Accordingly, when the first plate (10) and the second plate (20) are combined, the first elastic connecting member (63) and the second elastic connecting member (67) are elastically deformed while in contact with the substrate (S), and at this time, they come into more firm contact with the substrate (S).

[0047] Figure 4 shows a state without a substrate (S), and Figure 5 shows a state where the substrate (S) is placed on the first elastic connecting member (63).

[0048] The present invention may further include a first guide member (71) and a second guide member (72).

[0049] The first guide member (71) is composed of multiple members and is mounted around the circumference of the first plate (10).

[0050] The first guide member (71) is protruded in the direction of the outer surface of the second plate (20).

[0051] When the first plate (10) and the second plate (20) come into contact, the first guide member (71) is positioned adjacent to the outer surface of the second plate (20) and guides the second plate (20) to move accurately toward the first plate (10).

[0052] The second guide member (72) is composed of multiple members, and one end is mounted on the outside of the first internal sealing member (30) on one side of the first plate (10).

[0053] The second guide member (72) is protruded in the direction of the second plate (20).

[0054] The above second guide member (72) is formed by bending a steel plate, etc.

[0055] When the substrate (S) is inserted toward the second through hole in the direction of the first plate (10), the second guide member (72) is positioned adjacent to the outer surface of the substrate (S) and guides the substrate (S) to move to the correct position of the first plate (10).

[0056] The second guide member (72) may be formed with an elastic structure and may be made to contact the outer surface of the substrate (S). Additionally, the second plate (20) has a gap formed between the second elastic connecting members (67) in which the other end of the second guide member (72) is inserted and disposed.

[0057] As described above, the present invention can firmly fix and bond the substrate (S) placed between the first plate (10) and the second plate (20) by using vacuum pressure without a separate coupling member or other mechanism used in the past, and at the same time, prevent the plating solution, etc. from flowing into the current-carrying parts (61, 65) by means of the first internal sealing member (30), the second internal sealing member (40), and the external sealing member (50).

[0059] The vacuum-coupled plating jig of the present invention is not limited to the aforementioned embodiments and can be implemented with various modifications within the scope permitted by the technical concept of the present invention. Explanation of the symbols

[0060] 10: First plate, 15: Air connector part, 17: Adsorption space, 20: Second plate, 30: First internal sealing member, 40: Second internal sealing member, 50: External sealing member, 61: First current-carrying part, 62: First electrode bar, 63: First elastic connecting member, 65: Second current-carrying part, 66: Second electrode bar, 67: Second elastic connecting member, 71 : First guide member, 72 : Second guide member, S : Substrate.

Claims

Claim 1 A first plate with a hollow shape having a first perforation hole formed on the inside; a second plate with a hollow shape having a second perforation hole formed on the inside, one side of which contacts the other side of the first plate with a substrate in between; a first internal sealing member mounted in a closed-loop shape along the circumference of the first perforation hole on the other side of the first plate and contacting along the circumference of one side of the substrate; a second internal sealing member mounted in a closed-loop shape along the circumference of the second perforation hole on one side of the second plate and contacting along the circumference of the other side of the substrate; an external sealing member with a closed-loop shape disposed between the other side of the first plate and the one side of the second plate at the outer edge of the substrate, which seals the gap between the first plate and the second plate when the first plate and the second plate are combined; and a member mounted on the other side of the first plate between the first internal sealing member and the external sealing member, or the The apparatus comprises: a conductive part mounted on one surface of the second plate between the second inner sealing member and the outer sealing member and electrically connected to an external power source; and a plurality of second guide members, one end of which is mounted on the outer side of the first inner sealing member on one surface of the first plate; wherein, when the first plate and the second plate are in contact with each other, an adsorption space is formed between the first and second inner sealing members and the outer sealing member that is sealed and does not communicate with the outside, and when the substrate is placed between the first plate and the second plate, the edge portion of the substrate placed inside the outer sealing member contacts the conductive part, and as the air in the adsorption space is discharged to the outside by an external force and the adsorption space becomes a vacuum, the first plate and the second plate are mutually coupled with the entire perimeter of the first perforation hole and the second perforation hole with the substrate in between, and the conductive part comprises a first conductive part mounted on the other surface of the first plate and a conductive part mounted on one surface of the second plate It comprises a second current-carrying member; wherein the first current-carrying member comprises a rod-shaped first electrode bar and a first elastic connecting member, one end of which is coupled to the first electrode bar and bent, and the other end of which contacts the edge of one surface of a substrate;The second conductive member comprises a rod-shaped second electrode bar and a second elastic connecting member, one end of which is coupled to the second electrode bar and bent, and the other end of which contacts the edge of the other side of the substrate; wherein the other end of the first elastic connecting member and the other end of the second elastic connecting member are bent in a direction that brings them closer to each other, and before the first plate and the second plate are coupled, the other end of the first elastic connecting member protrudes further in the opposite direction of the first electrode bar than the other side of the first plate, and the other end of the second elastic connecting member protrudes further in the opposite direction of the second electrode bar than one side of the second plate, and the second guide member protrudes in the direction of the second plate, and when the substrate is inserted in the direction of the first plate, the second guide member is positioned adjacent to the outer surface of the substrate to guide the movement of the substrate, and the second elastic connecting member is on the second plate A vacuum-coupled plating jig characterized by having a gap formed therein in which the other end of the second guide member is inserted and disposed. Claim 2 A vacuum-coupled plating jig according to claim 1, wherein the first plate or the second plate has an air connector portion formed therein that communicates with the adsorption space, and the air of the adsorption space is discharged to the outside through the air connector portion. Claim 3 delete Claim 4 A vacuum-coupled plating jig according to claim 1, further comprising a plurality of first guide members mounted around the perimeter of the first plate, wherein the first guide members protrude in the direction of the outer surface of the second plate, and when the first plate and the second plate come into contact, the first guide members are positioned adjacent to the outer surface of the second plate to guide the movement of the second plate. Claim 5 delete

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