Electronic device including flexible printed circuit board

Abstract

According to various embodiments of the present disclosure, the present invention relates to an eyeglass-type electronic device comprising: a lens frame portion disposed within a housing; a camera module and a display module disposed within the lens frame portion; a first wearing portion extending from one end of the lens frame portion and having a first PCB disposed therein; a second wearing portion extending from the other end of the lens frame portion and having a second PCB disposed therein; and a flexible PCB (FPCB) electrically connected from the first PCB through the lens frame portion to the second PCB, wherein the FPCB is electrically connected to the camera module and the display module, and the FPCB is electrically connected to a module for a first signal and a second signal, respectively, wherein the first wiring of the FPCB connected to the module for the first signal is located in at least a part of the uppermost layer or the lowermost layer of the FPCB, and the second wiring of the FPCB for the second signal is located in at least a part of the inner layer of the FPCB, and the first signal is a signal of higher speed than the second signal. Various other embodiments may also be possible.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to an eyeglass-type electronic device comprising a flexible circuit board. Background Technology

[0003] As electronic and communication technologies advance, electronic devices can be miniaturized and lightened to the point where they can be used without significant discomfort even when worn on the user's body. For example, wearable electronic devices such as head-mounted devices (HMDs), smartwatches (or bands), contact lens-type devices, ring-type devices, glove-type devices, shoe-type devices, or clothing-type devices are being commercialized. Since wearable electronic devices are worn directly on the body, portability and user accessibility can be improved.

[0004] A head-mounted device is a device used while worn on a user's head or face, capable of providing augmented reality (AR) to the user. For example, a head-mounted device providing augmented reality may be implemented in the form of glasses, capable of providing information about objects to the user in the form of images or text within at least a portion of the user's field of vision. A head-mounted device may also provide virtual reality (VR) to the user. For example, by outputting independent images to each of the user's eyes, it may provide a superior sense of immersion by outputting content provided from external inputs to the user in the form of video or audio. The problem to be solved

[0006] Electronic devices for virtual reality or augmented reality (hereinafter AR) have a main circuit board (hereinafter, main PCB) located in the center of the AR device (above the forehead), so the AR device is mainly of the goggle type rather than the glasses type, and in the case of the glasses type, it has a simple configuration without a monocular or camera. In addition, since the main PCB is located in the center of the AR device, the AR device can become large. In glasses-type AR devices, when worn by a user, various modules such as a camera and a display included in the glass part containing the glasses may be included. To develop a slim and lightweight glasses-type AR device, the main PCB may be located in the temple of the glasses and connected to modules such as a camera and a display via a flexible printed circuit board (hereinafter, FPCB), but there are limitations due to the spatial constraints of the temple of the glasses.

[0007] As the number of data lines to be drawn out from the main PCB and each module increases, the number of FPCBs connecting each module and the main PCB, the width of the FPCBs, and / or the layers of the FPCBs increase, which may lead to a decrease in flexibility. In the case of glasses-type AR devices, this can make it difficult to fold the temples of the glasses.

[0008] Because connectors for connecting FPCBs must be placed on the PCB for each module, the PCB becomes larger, which causes an increase in the size of the AR device. Additionally, because multiple different FPCBs must be combined during the assembly process of combining FPCBs with the main PCB, the structure is complex, which takes a long time to assemble and may reduce mass production efficiency.

[0009] In addition, FPCB includes at least one layer and uses the same material for all layers. In AR device structures where high-speed signals such as MIPI, PCIe, and RF signals are connected to the left or right eye respectively, there may be signal loss due to multiple FPCBs.

[0010] According to various embodiments of the present disclosure, the glasses-type AR device is miniaturized and lightweight to increase the user's portability and convenience, and may include components integrated into a small space for high performance.

[0011] According to various embodiments of the present disclosure, by using a single FPCB to connect the main system and other modules, it is possible to provide a glasses-type AR device that is miniaturized and capable of transmitting low-loss, high-speed signals.

[0012] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure. means of solving the problem

[0014] According to various embodiments of the present disclosure, an eyeglass-type electronic device may include a housing, a lens frame portion disposed within the housing, a camera module and a display module disposed in the lens frame portion, a first wearing portion extending from one end of the lens frame portion and having a first PCB disposed therein, a second wearing portion extending from the other end of the lens frame portion and having a second PCB disposed therein, and a flexible PCB (FPCB) connected from the first PCB through the lens frame portion to the second PCB.

[0015] According to various embodiments of the present disclosure, an electronic device in the form of glasses may be proposed, comprising: a lens frame portion; a first wearing portion extending from one end of the lens frame portion and having a first PCB disposed thereon; a second wearing portion extending from the other end of the lens frame portion and having a second PCB disposed thereon; and a flexible PCB (FPCB) connected from the first PCB through the lens frame portion to the second PCB, wherein the FPCB is electrically connected to a module for a first signal and a second signal, respectively, and the first wiring of the FPCB connected to the module for the first signal is located in at least a part of the uppermost layer or the lowermost layer of the FPCB, and the second wiring of the FPCB for the second signal is located in at least a part of the inner layer of the FPCB, and the first signal is a signal of higher speed than the second signal.

[0016] According to various embodiments of the present disclosure, an electronic device in the form of glasses may be proposed, comprising a flexible PCB (FPCB), a main PCB electrically connected to one end of the FPCB, a sub PCB electrically connected to the other end of the FPCB, and a connector that can be connected to at least one component of the electronic device in at least a portion of the FPCB, wherein the FPCB comprises a plurality of layers providing power or signal wiring, wherein the plurality of layers comprises a first wiring disposed in at least one of the top or bottom layer among the layers providing signal wiring as a first wiring for a first signal, and a second wiring disposed in an inner layer disposed between the top and bottom layers as a second wiring for a second signal, wherein the first signal is a signal of higher speed than the second signal. Effects of the invention

[0018] AR electronic devices according to various embodiments of the present disclosure can be miniaturized and high-speed signal transmission can be improved by using a single FPCB. Brief explanation of the drawing

[0020] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure. FIG. 2 is a perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a perspective view for explaining the internal configuration of an electronic device according to one embodiment of the present disclosure. FIG. 4 is a perspective view for explaining the internal configuration of an electronic device according to another embodiment of the present disclosure. FIG. 5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 6 illustrates the structure of an FPCB according to one embodiment of the present disclosure. Figure 7a illustrates the method of connecting an FPCB and a module in a conventional glasses-type electronic device. FIG. 7b illustrates a method of connecting an FPCB and a module according to one embodiment of the present disclosure. FIG. 8 illustrates layer-by-layer wiring of an FPCB according to one embodiment of the present disclosure. FIG. 9 illustrates a layout for each layer of an FPCB according to one embodiment of the present disclosure. FIGS. 10a and FIGS. 10b illustrate a dedicated FPCB for power reinforcement according to one embodiment of the present disclosure. Specific details for implementing the invention

[0021] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0022] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with an electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0023] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0024] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0025] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input data or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0029] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0030] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0035] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0037] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0040] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0041] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0042] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0045] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0046] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0047] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0049] Referring to FIG. 2, the electronic device (200) is a wearable electronic device in the form of glasses, and the user can visually perceive surrounding objects or the environment while wearing the electronic device (200). For example, the electronic device (200) may be a head mounting device (HMD) or smart glasses capable of providing images directly in front of the user's eyes. The configuration of the electronic device (200) of FIG. 2 may be all or part identical to the configuration of the electronic device (101) of FIG. 1.

[0050] According to various embodiments, the electronic device (200) may include a housing (210) that forms the exterior of the electronic device (200). The housing (210) may provide a space in which components of the electronic device (200) can be placed. For example, the housing (210) may include a lens frame (202) and at least one wearable member (203) comprising a first wearable member (e.g., the first wearable member (203a) of FIG. 3) and a second wearable member (e.g., the second wearable member (203b) of FIG. 3).

[0051] According to various embodiments, the electronic device (200) may include at least one display member (201) capable of providing visual information to a user. For example, the display member (201) may include a glass, a lens, a display, a waveguide, and / or a module equipped with a touch circuit. According to one embodiment, the display member (201) may be formed to be transparent or translucent. According to one embodiment, the display member (201) may include glass made of a translucent material or a window member in which the transmittance of light can be controlled as the color intensity is adjusted. According to one embodiment, the display member (201) may be provided as a pair and positioned to correspond to the user's left eye and right eye, respectively, when the electronic device (200) is worn on the user's body.

[0052] According to various embodiments, the lens frame (202) may accommodate at least a portion of the display member (201). For example, the lens frame (202) may surround at least a portion of the edge of the display member (201). According to one embodiment, the lens frame (202) may position at least one of the display members (201) corresponding to the user's eye. According to one embodiment, the lens frame (202) may be a rim of a general eyeglass structure. According to one embodiment, the lens frame (202) may include at least one closed curve surrounding the display member (201).

[0053] According to various embodiments, the wearable member (203) may extend from the lens frame (202). For example, the wearable member (203) may extend from the end of the lens frame (202) and, together with the lens frame (202), be supported or positioned on the user's body (e.g., ear). According to one embodiment, the wearable member (203) may be rotatably coupled to the lens frame (202) via a hinge structure (229). According to one embodiment, the wearable member (203) may include an inner side (231c) configured to face the user's body and an outer side (231d) opposite to the inner side.

[0054] According to various embodiments, the electronic device (200) may include a hinge structure (229) configured to allow the wearable member (203) to be folded with respect to the lens frame (202). The hinge structure (229) may be positioned between the lens frame (202) and the wearable member (203). When the electronic device (200) is not worn, the user may fold the wearable member (203) so that a portion overlaps with respect to the lens frame (202) to carry or store it.

[0055] FIG. 3 is a perspective view illustrating the internal configuration of an electronic device according to one embodiment of the present disclosure. FIG. 4 is a perspective view illustrating the internal configuration of an electronic device according to another embodiment of the present disclosure. FIG. 5 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0056] Referring to FIGS. 3 through 5, the electronic device (200) may include components (e.g., at least one circuit board (241) (e.g., PCB (printed circuit board), PBA (printed board assembly), FPCB (flexible PCB) or RFPCB (rigid-flexible PCB)), at least one battery (243), at least one speaker module (245), at least one power delivery structure (246), and a camera module (250)) housed in a housing (210). The configuration of the housing (210) in FIGS. 3 and 4 may be all or partly the same as the configuration of the display member (201), lens frame (202), wearable member (203a, 203b), and hinge structure (229) in FIG. 2.

[0057] According to various embodiments, the electronic device (200) may acquire and / or perceive a visual image of an object or environment in the direction the user is looking at or the electronic device (200) is facing (e.g., -Y direction) using a camera module (250) (e.g., camera module (180) of FIG. 1), and may receive information regarding the object or environment from an external electronic device (e.g., electronic device (102, 104) or server (108) of FIG. 1) through a network (e.g., first network (198) or second network (199) of FIG. 1). In another embodiment, the electronic device (200) may provide the received information regarding the object or environment to the user in an audible or visual form. The electronic device (200) may provide the received information regarding the object or environment to the user in a visual form through a display member (201) using a display module (e.g., display module (160) of FIG. 1). For example, the electronic device (200) can implement augmented reality by implementing information about objects or environments in a visual form and combining it with actual images of the user's surrounding environment.

[0058] According to various embodiments, the display member (201) may include a first surface (F1) facing the direction in which external light is incident (e.g., -Y direction) and a second surface (F2) facing the opposite direction of the first surface (F1) (e.g., +Y direction). When a user is wearing the electronic device (200), at least a portion of the light or image incident through the first surface (F1) may pass through the second surface (F2) of the display member (201) positioned to face the user's left eye and / or right eye and be incident on the user's left eye and / or right eye.

[0059] According to various embodiments, the lens frame (202) may include at least two frames. For example, the lens frame (202) may include a first frame (202a) and a second frame (202b). According to one embodiment, when a user wears the electronic device (200), the first frame (202a) is a frame that faces the user's face, and the second frame (202b) may be a part of the lens frame (202) that is spaced apart from the first frame (202a) in the direction of the user's gaze (e.g., -Y direction).

[0060] According to various embodiments, the light output module (211) may provide an image and / or video to a user. For example, the light output module (211) may include a display panel (not shown) capable of outputting a video, and a lens (not shown) corresponding to the user's eye and guiding the video to a display member (201). For example, the user may obtain a video output from the display panel of the light output module (211) through the lens of the light output module (211). According to various embodiments, the light output module (211) may include a device configured to display various information. For example, the light output module (211) may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon (LCoS), an organic light emitting diode (OLED), or a micro light emitting diode (micro LED). According to one embodiment, if the light output module (211) and / or display member (201) includes one of a liquid crystal display device, a digital mirror display device, or a silicon liquid crystal display device, the electronic device (200) may include a light source that irradiates light onto a display area of ​​the light output module (211) and / or display member (201). According to another embodiment, if the light output module (211) and / or display member (201) includes one of an organic light-emitting diode or a micro LED, the electronic device (200) may provide a virtual image to a user without including a separate light source.

[0061] According to various embodiments, at least a portion of the light output module (211) may be placed within the housing (210). For example, the light output module (211) may be placed in the first wearable member (203a) and the second wearable member (203b) or the lens frame (202) so as to correspond to the user's left eye and right eye, respectively. According to one embodiment, the light output module (211) is connected to the display member (201) and may provide an image to the user through the display member (201).

[0062] According to various embodiments, the circuit board (241) may include components for driving the electronic device (200). For example, the circuit board (241) may include at least one integrated circuit chip, and at least one of the processor (120), memory (130), power management module (188), or communication module (190) of FIG. 1 may be provided on the integrated circuit chip. According to one embodiment, the circuit board (241) may be placed within the wearable member (203) of the housing (210). According to one embodiment, the circuit board (241) may be electrically connected to a battery (243) through a power delivery structure (246). According to one embodiment, the circuit board (241) is connected to a flexible printed circuit board (205) and can transmit electrical signals to electronic components of an electronic device (e.g., a light output module (211), a camera module (250), and a light-emitting unit (not shown) through the flexible printed circuit board (205). According to one embodiment, the circuit board (241) may be an interposer board.

[0063] According to various embodiments, the flexible printed circuit board (205) may extend from the circuit board (241) across the hinge structure (229) into the interior of the lens frame (202) and may be positioned in at least a portion of the perimeter of the display member (201) inside the lens frame (202).

[0064] According to various embodiments, the battery (243) (e.g., the battery (189) of FIG. 1) may be electrically connected to components of the electronic device (200) (e.g., a light output module (211), a circuit board (241), a speaker module (245), a microphone module (247), and / or a camera module (250)) and may supply power to the components of the electronic device (200).

[0065] According to various embodiments, at least a portion of the battery (243) may be disposed in the wearable member (203). According to one embodiment, the battery (243) may be disposed adjacent to the end of the wearable member (203). For example, the battery (243) may include a first battery (243a) disposed in the first wearable member (203a) of the wearable member (203) and a second battery (243b) disposed in the second wearable member (203b).

[0066] According to various embodiments, a speaker module (245) (e.g., the audio module (170) or sound output module (155) of FIG. 1) can convert an electrical signal into sound. At least a portion of the speaker module (245) may be placed within a wearable member (203) of a housing (210). According to one embodiment, the speaker module (245) may be positioned within the wearable member (203) to correspond to the user's ear. According to one embodiment (e.g., FIG. 3), the speaker module (245) may be placed on a circuit board (241). For example, the speaker module (245) may be placed between the circuit board (241) and an inner case (e.g., the inner case (231) of FIG. 5). According to one embodiment (e.g., FIG. 4), the speaker module (245) may be placed next to the circuit board (241). For example, the speaker module (245) can be placed between the circuit board (241) and the battery (243).

[0067] According to various embodiments, the electronic device (200) may include a connecting member (248) connected to a speaker module (245) and a circuit board (241). The connecting member (248) may transmit at least a portion of the sound and / or vibration generated by the speaker module (245) to the circuit board (241). According to one embodiment, the connecting member (248) may be formed integrally with the speaker module (245). For example, a portion extending from the speaker frame of the speaker module (245) (e.g., the speaker frame (314) in FIG. 6) may be interpreted as the connecting member (248). The configuration of the connecting member (248) is further described in FIG. 10. According to one embodiment (e.g., FIG. 3), the connecting member (248) may be omitted. For example, when the speaker module (245) is placed on the circuit board (241), the connecting member (248) may be omitted.

[0068] According to various embodiments, the power transfer structure (246) can transfer power from the battery (243) to an electronic component of the electronic device (200) (e.g., an optical output module (211)). For example, the power transfer structure (246) is electrically connected to the battery (243) and / or a circuit board (241), and the circuit board (241) can transfer power received through the power transfer structure (246) to the optical output module (211).

[0069] According to various embodiments, the power delivery structure (246) may be a configuration capable of delivering power. For example, the power delivery structure (246) may include a flexible printed circuit board or a wire. For example, the wire may include a plurality of cables (not shown). In various embodiments, the shape of the power delivery structure (246) may be varied in various ways, taking into account the number and / or type of cables, etc.

[0070] According to various embodiments, a microphone module (247) (e.g., the input module (150) and / or audio module (170) of FIG. 1) can convert sound into an electrical signal. According to one embodiment, the microphone module (247) may be placed on at least a portion of the lens frame (202). For example, at least one microphone module (247) may be placed on the bottom (e.g., facing the -X axis) and / or the top (e.g., facing the X axis) of the electronic device (200). According to various embodiments, the electronic device (200) can more clearly recognize the user's voice using voice information (e.g., sound) obtained from at least one microphone module (247). For example, the electronic device (200) can distinguish voice information and ambient noise based on the obtained voice information and / or additional information (e.g., low-frequency vibrations of the user's skin and bones). For example, the electronic device (200) can clearly recognize the user's voice and perform a function that reduces ambient noise (e.g., noise canceling).

[0071] According to various embodiments, the camera module (250) can capture still images and / or video. The camera module (250) may include at least one of a lens, at least one image sensor, an image signal processor, or a flash. According to one embodiment, the camera module (250) may be placed within a lens frame (202) and around a display member (201).

[0072] According to various embodiments, the camera module (250) may include at least one first camera module (251). According to one embodiment, the first camera module (251) may capture the trajectory of a user's eye (e.g., pupil) or gaze. For example, the first camera module (251) may capture the reflection pattern of light emitted by a light-emitting unit (not shown) to the user's eye. For example, the light-emitting unit (not shown) may emit light in the infrared band for tracking the trajectory of the gaze using the first camera module (251). For example, the light-emitting unit (not shown) may include an IR LED. According to one embodiment, a processor (e.g., the processor (120) of FIG. 1) may adjust the position of the virtual image so that the virtual image projected onto the display member (201) corresponds to the direction in which the user's pupil gazes. According to one embodiment, the first camera module (251) may include a camera of the global shutter (GS) type, and a plurality of first camera modules (251) of the same specifications and performance may be used to track the trajectory of the user's eyes or gaze.

[0073] According to various embodiments, the first camera module (251) may periodically or non-periodically transmit information related to the trajectory of the user's eyes or gaze (e.g., trajectory information) to a processor (e.g., processor (120) of FIG. 1). According to another embodiment, the first camera module (251) may transmit the trajectory information to the processor when it detects that the user's gaze has changed based on the trajectory information (e.g., the eyes move beyond a reference value while the head is not moving).

[0074] According to various embodiments, the camera module (250) may include a second camera module (253). According to one embodiment, the second camera module (253) may capture an external image. According to one embodiment, the second camera module (253) may be a camera with a global shutter or a rolling shutter (RS) method. According to one embodiment, the second camera module (253) may capture an external image through a second optical hole (223) formed in the second frame (202b). For example, the second camera module (253) may include a high-resolution color camera and may be a high resolution (HR) or photo video (PV) camera. Additionally, the second camera module (253) may provide an autofocus (AF) function and an optical image stabilizer (OIS) function.

[0075] According to various embodiments (not shown), the electronic device (200) may include a flash (not shown) positioned adjacent to the second camera module (253). For example, the flash (not shown) may provide light to increase the brightness (e.g., illumination) around the electronic device (200) when acquiring an external image of the second camera module (253), and may reduce the difficulty of acquiring an image due to a dark environment, the mixing of various light sources, and / or light reflection.

[0076] According to various embodiments, the camera module (250) may include at least one third camera module (255). According to one embodiment, the third camera module (255) may capture a user's movements through a first optical hole (221) formed in the lens frame (202). For example, the third camera module (255) may capture a user's gesture (e.g., hand movement). The third camera module (255) and / or the first optical hole (221) may be positioned at each end of the lens frame (202) (e.g., the second frame (202b)), for example, at each end of the lens frame (202) (e.g., the second frame (202b)) in the X direction. According to one embodiment, the third camera module (255) may be a camera with a global shutter (GS) type. For example, the third camera module (255) can provide 360-degree spatial (e.g., omnidirectional), position recognition, and / or motion recognition using a camera that supports 3DoF (degrees of freedom) or 6DoF. According to one embodiment, the third camera module (255) can perform simultaneous localization and mapping (SLAM) and user motion recognition functions using multiple global shutter type cameras of the same specifications and performance as stereo cameras. According to one embodiment, the third camera module (255) may include an infrared (IR) camera (e.g., a time of flight (TOF) camera, or a structured light camera). For example, the IR camera may operate as at least part of a sensor module (e.g., the sensor module (176) of FIG. 1) for detecting the distance to a subject.

[0077] According to one embodiment, at least one of the first camera module (251) or the third camera module (255) may be replaced with a sensor module (e.g., the sensor module (176) of FIG. 1). For example, the sensor module may include at least one of a vertical cavity surface emitting laser (VCSEL), an infrared sensor, and / or a photodiode. For example, the photodiode may include a positive intrinsic negative (PIN) photodiode or an avalanche photodiode (APD). The photodiode may be referred to as a photo detector or a photo sensor.

[0078] According to one embodiment, at least one of the first camera module (251), the second camera module (253), or the third camera module (255) may include a plurality of camera modules (not shown). For example, the second camera module (253) may be composed of a plurality of lenses (e.g., wide-angle and telephoto lenses) and image sensors and may be placed on one side of the electronic device (200) (e.g., the side facing the -Y axis). For example, the electronic device (200) may include a plurality of camera modules, each having different attributes (e.g., angle of view) or functions, and may control the angle of view of the camera modules to change based on user selection and / or trajectory information. For example, at least one of the plurality of camera modules may be a wide-angle camera and at least another may be a telephoto camera.

[0079] According to various embodiments, a processor (e.g., processor (120) of FIG. 1) may determine the movement of the electronic device (200) and / or the movement of the user by using information of the electronic device (200) obtained using at least one of a gesture sensor, a gyroscope sensor, or an accelerometer sensor of a sensor module (e.g., sensor module (176) of FIG. 1) and a user's movement (e.g., approach of the user's body to the electronic device (200)) obtained using a third camera module (255). According to one embodiment, the electronic device (200) may include, in addition to the described sensors, a magnetic (geomagnetic) sensor capable of measuring orientation using a magnetic field and magnetic force, and / or a Hall sensor capable of obtaining movement information (e.g., direction of movement or distance of movement) using the strength of the magnetic field. For example, the processor may determine the movement of the electronic device (200) and / or the movement of the user based on information obtained from the magnetic (geomagnetic) sensor and / or the Hall sensor.

[0080] According to various embodiments (not shown), the electronic device (200) may perform an input function capable of interacting with a user (e.g., touch, and / or pressure sensing function). For example, a component configured to perform a touch and / or pressure sensing function (e.g., a touch sensor, and / or pressure sensor) may be placed in at least a part of the wearable member (203). The electronic device (200) may control a virtual image output through a display member (201) based on information obtained through said component. For example, the sensor associated with the touch and / or pressure sensing function may be configured in various ways, such as a resistive type, a capacitive type, an electromagnetic induction type (EM), or an optical type. According to one embodiment, the component configured to perform said touch and / or pressure sensing function may be all or partly identical to the configuration of the input module (150) of FIG. 1.

[0081] According to various embodiments, the electronic device (200) may include a reinforcing member (260) that is disposed in the internal space of the lens frame (202) and is formed to have a higher rigidity than the rigidity of the lens frame (202).

[0082] According to various embodiments, the electronic device (200) may include a lens structure (270). The lens structure (270) may refract at least a portion of light. For example, the lens structure (270) may be a prescription lens having a specified refractive power. According to one embodiment, the lens structure (270) may be positioned behind the window member of the display member (201) (e.g., in the +Y direction). For example, the lens structure (270) may be positioned between the display member (201) and the user's eye. For example, the lens structure (270) may face one side of the display member (201) (e.g., the second outer surface (231b) of FIG. 5).

[0083] According to various embodiments, the housing (210) may include a hinge cover (227) capable of concealing a portion of the hinge structure (229). Another portion of the hinge structure (229) may be received or concealed between the inner case (231) and the outer case (233), which will be described later.

[0084] According to various embodiments, the wearable member (203) may include an inner case (231) and an outer case (233). The inner case (231) is a case configured to face or directly contact the user's body, for example, and may be made of a material with low thermal conductivity, for example, a synthetic resin. According to one embodiment, the inner case (231) may include an inner side facing the user's body (e.g., inner side (231c) of FIG. 2). The outer case (233) may include a material capable of at least partially transferring heat (e.g., a metallic material) and may be coupled to face the inner case (231). According to one embodiment, the outer case (233) may include an outer side opposite to the inner side (231c) (e.g., outer side (231d) of FIG. 2). In one embodiment, at least one of the circuit board (241) or the speaker module (245) may be accommodated in a space separated from the battery (243) within the wearable member (203). In the illustrated embodiment, the inner case (231) may include a first case (231a) containing the circuit board (241) and / or the speaker module (245) and a second case (231b) accommodating the battery (243), and the outer case (233) may include a third case (233a) coupled to face the first case (231a) and a fourth case (233b) coupled to face the second case (231b). For example, the first case (231a) and the third case (233a) can be combined (hereinafter referred to as the 'first case part (231a, 233a)') to accommodate a circuit board (241) and / or a speaker module (245), and the second case (231b) and the fourth case (233b) can be combined (hereinafter referred to as the 'second case part (231b, 233b)') to accommodate a battery (243).

[0085] According to various embodiments, the first case portion (231a, 233a) is rotatably coupled to the lens frame (202) through a hinge structure (229), and the second case portion (231b, 233b) may be connected or mounted to the end of the first case portion (231a, 233a) through a connecting structure (235). In some embodiments, the portion of the connecting structure (235) that contacts the user's body may be made of an elastic material with low thermal conductivity, such as silicone, polyurethane, or rubber, and the portion that does not contact the user's body may be made of a material with high thermal conductivity (e.g., a metal material). For example, when heat is generated in the circuit board (241) or battery (243), the connecting structure (235) may block the transfer of heat to the portion that contacts the user's body and disperse or release the heat through the portion that does not contact the user's body. According to one embodiment, the portion of the connection structure (235) configured to come into contact with the user's body may be interpreted as part of the inner case (231), and the portion of the connection structure (235) that does not come into contact with the user's body may be interpreted as part of the outer case (233). According to one embodiment (not shown), the first case (231a) and the second case (231b) may be formed integrally without the connection structure (235), and the third case (233a) and the fourth case (233b) may be formed integrally without the connection structure (235). According to various embodiments, in addition to the illustrated components, other components (e.g., the antenna module (197) of FIG. 1) may be included, and information regarding objects or environments may be received from an external electronic device (e.g., the electronic device (102, 104) or server (108) of FIG. 1) through a network (e.g., the first network (198) or the second network (199) of FIG. 1) using the communication module (190).

[0086] According to one embodiment, in the electronic device (200), the FPCB (e.g., the FPCB (720) of FIG. 7b) may be further connected to a module for eye tracking.

[0087] Referring to FIGS. 6 through 10, the electronic device (200) may include components (e.g., at least one circuit board (241), FPCB (flexible PCB), wireless communication module (192), at least one battery (243), at least one speaker module (245), and camera module (250)) housed in a housing (210) and a connecting member (248) connected to the circuit board (241).

[0088] The configuration of the housing (210) of FIGS. 6 to 10 may be all or partly the same as the configuration of the display member (201), lens frame (202), wearing member (203), hinge structure (229), and power transmission structure (246) described in FIGS. 1 to 5.

[0089] FIG. 6 illustrates the structure of an FPCB according to one embodiment of the present disclosure.

[0090] According to various embodiments, the electronic device (200) may include a main PCB (e.g., the first PCB (601) of FIG. 6) among at least one circuit board (241). The first PCB (e.g., the first PCB (601) of FIG. 6 or the first PCB (711) of FIG. 7b) may be a board comprising at least one layer. The first PCB may be connected to components housed in the housing (210) through a hotbar (e.g., the hotbar (701) of FIG. 7b) or a connector (not shown). The first PCB (e.g., the first PCB (601) of FIG. 6 or the first PCB (711) of FIG. 7b) may be located on one of the eyeglass temples (e.g., the right temple of FIG. 7b). The first PCB (e.g., the first PCB (601) of FIG. 6 or the first PCB (711) of FIG. 7b) may be equipped with at least one electronic component (e.g., the electronic component (711) of FIG. 7b (e.g., AP memory, CAM PMIC, or AMP)). The first PCB (e.g., the first PCB (601) of FIG. 6 or the first PCB (711) of FIG. 7b)) may be connected to a battery (e.g., the battery (243) of FIG. 5) located at the end of the eyeglass temple and to an SPK.

[0091] According to various embodiments, the electronic device (200) may include a sub PCB (e.g., the second PCB (602) of FIG. 6) among at least one circuit board (241). The second PCB (e.g., the second PCB (602) of FIG. 6 or the second PCB (712) of FIG. 7b) may be a board comprising at least one layer. The second PCB (e.g., the second PCB (602) of FIG. 6 or the second PCB (712) of FIG. 7b) may be connected to components housed in the housing (210) through a hotbar (not shown) or a connector (e.g., the connector (703) of FIG. 7b). The second PCB may be located on the other eyeglass temple (e.g., the left temple of FIG. 7b). The second PCB (e.g., the second PCB (602) of FIG. 6 or the second PCB (712) of FIG. 7b) may be equipped with at least one electronic component (e.g., the electronic component (712) of FIG. 7b (e.g., touch IC, IR driver, WIFI, power, AMP, or MIC)). The second PCB (e.g., the second PCB (602) of FIG. 6 or the second PCB (712) of FIG. 7b)) may be connected to a battery (e.g., the battery (243) of FIG. 5) and an SPK located at the end of the eyeglass temple. A single FPCB (e.g., the FPCB (720) of FIG. 7b) may electrically connect the first PCB (e.g., the first PCB (711) of FIG. 7b) and the second PCB (e.g., the second PCB (712) of FIG. 7b), and, depending on the embodiment, may be electrically connected to the battery(s) located at the end of the eyeglass temple.

[0092] According to various embodiments, the electronic device (200) may include a first PCB (e.g., the first PCB (711) of FIG. 7b), a second PCB (e.g., the second PCB (712) of FIG. 7b), and an FPCB (e.g., the FPCB (720) of FIG. 7b) connected to components housed in a housing (210). The FPCB (e.g., the FPCB (720) of FIG. 7b) may be located in at least part of the display member (201), lens frame (202), wearing member (203), hinge structure (229), and power delivery structure (246) described in FIG. 1 through 5.

[0093] According to various embodiments, with reference to FIG. 6, a first PCB (601) containing a main system located at the right end of the glasses (e.g., in the +x-axis direction of FIG. 6) and a second PCB (e.g., the second PCB (712) in FIG. 7b) containing a sub system located at the left end of the glasses (e.g., in the -x-axis direction of FIG. 6) and containing a charging circuit, a battery (e.g., the first battery (243a) and the second battery (243b) in FIG. 2) and / or a speaker (e.g., the SPK (704) in FIG. 7) may be connected through a single FPCB (e.g., the FPCB (720) in FIG. 7b). The FPCB (e.g., FPCB (720) of FIG. 7b) can be electrically connected to a first PCB (e.g., first PCB (711) of FIG. 7b) or a second PCB (e.g., second PCB (712) of FIG. 7b) through a hotbar (e.g., hotbar (701) of FIG. 7b) or a connector.

[0094] Figure 7a illustrates the connection method between the FPCB and the module in a glasses-type electronic device.

[0095] Referring to FIG. 7a, a main PCB (e.g., main PCB (711a) of FIG. 7a), a plurality of multilayer FPCBs (e.g., FPCB (720a) of FIG. 7a), and a connection structure between each FPCB and each module (e.g., electronic component(s) (705) of FIG. 7a) in a conventional glasses-type device are illustrated. It illustrates connecting a plurality of modules (e.g., electronic component(s) (705) of FIG. 7a) to each FPCB (e.g., FPCB (720a) of FIG. 7a) in a one-to-one manner using each FPCB from the main PCB (e.g., main PCB (711a) of FIG. 7a).

[0096] Referring to FIG. 7a, the main PCB (e.g., the main PCB (711a) of FIG. 7a) and the sub PCB (e.g., the sub PCB (712a) of FIG. 7a) may include one or more components.

[0097] Referring to FIG. 7a, each module (e.g., electronic component(s) (705) of FIG. 7a) may include, for example, a camera (CAM), a microphone (MIC), a display, or a sensor. Each module (e.g., electronic component(s) (705) of FIG. 7a) may be connected to a main PCB (e.g., main PCB (711a) of FIG. 7a) by a connector (e.g., CON (703a) of FIG. 7a).

[0098] Referring to FIG. 7a, when a connector (e.g., CON (703a) of FIG. 7a) is used for each module (e.g., electronic component(s) (705) of FIG. 7a), multiple connectors (e.g., CON (703a) of FIG. 7a) are used, which increases the size of the main PCB (e.g., main PCB (711a) of FIG. 7a)) and increases the total thickness because each FPCB (e.g., FPCB (720a) of FIG. 7a) is used, making it difficult to pass through the hinge (e.g., hinge structure (229) of FIG. 5)) and making it difficult to bend the temples of the glasses.

[0099] FIG. 7b illustrates a method of connecting an FPCB and a module according to one embodiment of the present disclosure.

[0100] Referring to FIG. 7b, the first PCB (e.g., the first PCB (711) in FIG. 7b) can be connected to a single FPCB (e.g., the FPCB (720) in FIG. 7b) through a single hotbar (e.g., the hotbar (701) in FIG. 7) (or connector). Compared to the embodiment of FIG. 7a in which multiple FPCBs (e.g., FPCB (720a) of FIG. 7a) are used, the size of the first PCB (e.g., FPCB (711) of FIG. 7b) can be minimized because a single FPCB (e.g., FPCB (720) of FIG. 7b) is connected to the first PCB (e.g., FPCB (711) of FIG. 7b), and a multilayer structure included in a single FPCB (e.g., FPCB (720) of FIG. 7b) can be used to connect to multiple modules (e.g., electronic component(s) (705) of FIG. 7a). For example, using a single FPCB (e.g., FPCB (720) of FIG. 7b) reduces the thickness of the wiring passing from the temple to the hinge compared to arranging multiple FPCBs (e.g., FPCB (720) of FIG. 7b) as in FIG. 7a, making it easier to wire to the display member and facilitating the folding or unfolding operation of the temple.

[0101] According to various embodiments, a single FPCB (e.g., FPCB (720) of FIG. 7b) may include a rigid region (610) having less flexibility than other regions and a flexible region (620) that is bendable and has higher flexibility than the rigid region, and may include a rigid / flexible region (630) in which regions with different flexibility are combined without separate connectors. The difference in partial flexibility in a single FPCB (e.g., FPCB (720) of FIG. 7b) may be achieved by a difference in material or by a partially placed auxiliary substrate. According to one embodiment, a connector (e.g., con (703) in FIG. 7b) connected to a display and camera module (e.g., electronic component(s) (705) in FIG. 7b) is located in the middle of the FPCB (e.g., FPCB (720) in FIG. 7b), and some circuits, such as a sensor, may be onboard in the rigid area (610). The flexible area (620) may have a degree of flexibility that allows for folding or unfolding of the glasses temples.

[0102] FIG. 8 illustrates layer-by-layer wiring of an FPCB according to one embodiment of the present disclosure.

[0103] Referring to FIG. 8, a single FPCB (e.g., FPCB (720) of FIG. 8) may include a plurality of layers for wiring (e.g., layers 2 to 7 of FIG. 8 or layers 2 (902) to 7 (907) of FIG. 9), and each wiring layer may have wiring arranged for the transmission of power or various signals.

[0104] According to various embodiments, in a single FPCB composed of multiple layers (e.g., FPCB (720) of FIG. 8), each wiring layer (e.g., layer 2 to layer 7 of FIG. 8 or layer 2 (902) to layer 7 (907) of FIG. 9) may be connected to at least one component, such as a power source or a sensor, and arranged with consideration for signal transmission efficiency or power efficiency. For example, in the case of a multi-layered FPCB (e.g., FPCB (720) of FIG. 8), various combinations are possible, such as where electrical components (e.g., electronic component(s) (705) of FIG. 7b) such as a display or camera are connected in the wiring of the FPCB, where the final destination is reached, such as whether the FPCB for signal transmission (e.g., FPCB (720) of FIG. 8) is connected to the front of the AR glasses or to the hinge, or where the wiring for high-speed signal transmission (e.g., layer 2, layer 7 of FIG. 8) and the power wiring are separated and located in which layer of the FPCB (e.g., FPCB (720) of FIG. 8).

[0105] For example, a layer of wiring for transmitting high-speed signals, such as MIPI signals for a display or camera module, PCIe interfaces for graphics cards, SSDs, etc., or RF signals for wireless communication signals such as WiFi antenna signals, may be located at the top or bottom layer in a flexible area of ​​a single FPCB (e.g., FPCB (720) in FIG. 7b). For example, the layer of wiring for transmitting high-speed signals may be layer 2 or layer 7 with reference to FIG. 8, and may be layer 2 (902) or layer 7 (907) with reference to FIG. 9. An insulating layer (not shown) for shielding may be disposed between each layer, and the layer exposed to the upper and lower surfaces of the FPCB (e.g., FPCB (720) in FIG. 7b) (e.g., layer 1 or layer 8 in FIG. 8, or layer 1 (901) or layer 8 (908) in FIG. 9) may function at least partially as an electromagnetic shielding structure, e.g., an EMI sheet. Layers disposed between wiring layers for high-speed signal transmission (e.g., layer 2, layer 7 of FIG. 8 or layer 2 (902), layer 7 (907) of FIG. 9) (e.g., layers 3 to 6 of FIG. 8 or layers 3 (903) to 6 (906) of FIG. 9) may provide, for example, power wiring (e.g., wiring of layer 5 of FIG. 8), interface signal wiring (e.g., wiring of layer 4 of FIG. 8), and / or ground for impedance matching (e.g., wiring of layer 3, layer 6 of FIG. 8 or ground). Additional signals including the corresponding signals may be located in each layer.

[0106] According to various embodiments, a first PCB (e.g., the first PCB (711) of FIG. 7b) and a second PCB (e.g., the second PCB (712) of FIG. 7b) are electrically connected through a single FPCB (e.g., the FPCB (720) of FIG. 7b), and between the first PCB (e.g., the first PCB (711) of FIG. 7b) and the second PCB (e.g., the second PCB (712) of FIG. 7b), at least one wearing member (203a, 203b) and at least one hinge structure (229) and parts (810a to 810i) disposed on the lens frame (202) can be electrically connected to the first PCB (e.g., the first PCB (711) of FIG. 7b) and the second PCB (e.g., the second PCB (712) of FIG. 7b) through a single FPCB (e.g., the FPCB (720) of FIG. 7b). For example, a plurality of modules (e.g., electronic component(s) (705) of FIG. 7b) may be electrically connected to a first PCB (e.g., the first PCB (711) of FIG. 7b) or a second PCB (e.g., the second PCB (712) of FIG. 7b) through an FPCB (e.g., the FPCB (720) of FIG. 7b) by having at least one of a Display / MIC (810a), HET CAM (810b), ET CAM (810d, 810g), IR LED (810c, 810f), and sensor (810e) disposed therein. The FPCB (e.g., the FPCB (720) of FIG. 7b) connected to the first PCB (e.g., the first PCB (711) of FIG. 7b) may be formed of a plurality of layers (e.g., layers 1 to 8 of FIG. 8). For example, each wiring included in an FPCB (e.g., FPCB (720) of FIG. 7b) may include a layer for high-speed signals (e.g., layer 2, layer 7 of FIG. 8), a ground for impedance matching layer (e.g., layer 3, layer 6 of FIG. 8), a layer for interface signals (e.g., layer 4 of FIG. 8), and a layer for main power (e.g., layer 5 of FIG. 8).Each part and its name described in FIG. 7b is provided as an example for convenience of explanation and is not limited to those described in the drawing.

[0107] According to various embodiments, the materials of multiple layers (e.g., layers 1 to 8 in FIG. 8) constituting an FPCB (e.g., FPCB (720) in FIG. 7b) may differ from each other. Generally, the same material may be used for wiring in different layers of an FPCB (e.g., FPCB (720) in FIG. 7b), but considering electrical characteristics or losses depending on the material, some layers (e.g., layers providing wiring for high-speed signal transmission) may include a material different from other layers (e.g., layers providing wiring for power or interface). For example, if a material having a lower dielectric constant than other wiring layers is used for the wiring layers for high-speed signal transmission (e.g., layers 2 and 7 in FIG. 8) used for high-speed signal wiring (e.g., layers 2 and 7 in FIG. 8), high-speed signals can be transmitted with a low loss rate.

[0108] Referring to [Table 1], the loss rate can be compared when Low Df and Normal Df materials are used for the wiring forming the FPCB (e.g., FPCB (720) in FIG. 7b). For example, in the case of a Wi-Fi signal, when a Low Df material is used at a frequency of 2.4 GHz, the loss rate in the rigid region is 0.0155, whereas when a Normal Df material is used, the loss rate is 0.029, which is higher than when a Low Df material is used. For example, when a communication module used for transmitting high-speed signals such as WiFi, PCIe, or RF is connected to the FPCB (e.g., FPCB (720) in FIG. 7b), the connection can be made using wiring located in the outer layer of the FPCB (e.g., the wiring for high-speed signals in FIG. 8 (layer 2, layer 7)). The layer for wiring high-speed signals of the FPCB (e.g., FPCB (720) of FIG. 7b) is formed of a material having a lower dielectric constant than the inner layer (e.g., layer 3 to layer 6 of FIG. 8), and the material of each wiring layer (e.g., layer 2 to layer 7 of FIG. 8) can be appropriately selected considering the signal transmitted through it. The Low Df material can be a low dielectric loss material that can be applied to a coverlay or prepreg (PPG), but is not limited thereto.

[0109]

[0110] FIG. 9 illustrates a layout for each layer of an FPCB according to one embodiment of the present disclosure.

[0111] Referring to FIG. 9, the layout of each layer of the FPCB (e.g., layer 1 (901) to layer 8 (908) of FIG. 9) is illustrated. For example, if wiring located on the outer layer of the FPCB (e.g., FPCB (720) of Fig. 7b) in Fig. 9 (e.g., layer 2 (902) or layer 6 (906) of Fig. 9) is provided for high-speed signals (e.g., MIPI, PCIe, and / or RF signals) between the first PCB (e.g., the first PCB (601) of Fig. 6) and the first rigid area (e.g., 610 of Fig. 6), the section (e.g., 640 of Fig. 6) from the first rigid area (e.g., rigid area (610) of Fig. 6) to the second PCB (e.g., the second PCB (602) of Fig. 6) may have a smaller width than the section (e.g., 620 of Fig. 6) between the first PCB (e.g., the first PCB (601) of Fig. 6) and the first rigid area (e.g., 610 of Fig. 6). For example, since at least some of the signal wiring corresponding to MIPI can be omitted, the width of the FPCB can be reduced and flexibility increased in the section (e.g., 640 in Fig. 6) between the first rigid area (e.g., 610 in Fig. 6) and the second PCB (e.g., 602 in Fig. 6). For example, as the FPCB (e.g., FPCB (720) in Fig. 7b) is connected to each module (e.g., 810a to 810i in Fig. 8) and extends toward the second PCB (e.g., the second PCB (602) in Fig. 6), the signal is drawn out to each module, so the width of the FPCB (e.g., FPCB (720) in Fig. 7b) can be reduced gradually or in steps as it approaches the second PCB (e.g., the second PCB (602) in Fig. 6). In some embodiments, the width of the FPCB (e.g., FPCB (720) of FIG. 7b) may be substantially uniform between the first PCB (e.g., the first PCB (601) of FIG. 6) and the second PCB (e.g., the second PCB (602) of FIG. 6), in which case the internal wiring may be simplified closer to the second PCB (e.g., the second PCB (602) of FIG. 6).For example, the wiring of a portion (e.g., 650 in FIG. 6) of an FPCB (e.g., FPCB (720) in FIG. 7b) adjacent to a second PCB (e.g., the second PCB (602) in FIG. 6) may be simplified compared to the wiring of another portion (e.g., 620 in FIG. 6) of an FPCB (e.g., FPCB (720) in FIG. 7b) adjacent to a first PCB. For example, there may be empty portions, such as the ends of layer 2 (902) and layer 7 (907) in FIG. 9a, and at least a portion of the corresponding layer without wiring may be removed to improve the flexibility or bendability of the FPCB (e.g., FPCB (720) in FIG. 7b). In another embodiment, if the width of the FPCB (e.g., FPCB (720) in FIG. 7b) is reduced in the section where wiring is simplified (e.g., 650 in FIG. 6), free space can be secured in the area passing through the hinge, and the secured free space can allow a coaxial cable connected to a Wi-Fi antenna to pass through, thereby reducing transmission loss in wireless communication.

[0112] FIGS. 10a and FIGS. 10b illustrate a dedicated FPCB for power reinforcement according to one embodiment of the present disclosure.

[0113] According to various embodiments, wiring for main power (e.g., layer 5 of FIG. 8) may be located in an inner layer of a single FPCB (e.g., FPCB (720) of FIG. 7b), and to improve the IR drop of the power supply in the FPCB (e.g., FPCB (720) of FIG. 7b), a conductive member (e.g., 1001 of FIG. 10a, 10b) may be additionally located in an empty space above the RIM (e.g., lens frame (202) of FIG. 2 to 4) as in FIG. 10a or FIG. 10b, thereby improving the IR drop of the FPCB (e.g., FPCB (720) of FIG. 7b) and separating the power supply to increase the freedom of signal wiring. For example, the conductive member (e.g., 1001 of FIG. 10a, 10b) may include an FPCB or a coaxial cable. At this time, power wiring can be drawn out through vias from a single FPCB (e.g., FPCB (720) in FIG. 7b) to an outer layer and joined to a conductive member (e.g., 1001 in FIG. 10a and 10b) through a board-to-board connector, a contact connector, or soldering.

[0114] The electronic device (200) of the present disclosure, for example, as an AR device in the form of glasses, may have a first PCB (e.g., the first PCB (601) of FIG. 6) including a main system placed on at least one wearable member (203), and may provide wiring from the first PCB (e.g., the first PCB (601) of FIG. 6) to various components (e.g., camera, display, audio module and sensor) and / or a second PCB (e.g., the second PCB (602) of FIG. 6) through a single FPCB (e.g., the FPCB (720) of FIG. 7b) having a multilayer structure, and even if the FPCB (e.g., the FPCB (720) of FIG. 7b) is wired through a hinge structure (229), it may have the effect of minimizing the PCB size, reducing the size of the glasses, and simplifying the assembly process while facilitating the folding or unfolding operation of the glasses temples. In addition, high-speed signals can be transmitted with low loss by making the material of the top or bottom layer among the layers providing signal wiring in the FPCB (e.g., FPCB (720) of FIG. 7b) different from the material of the inner layer.

[0115] According to various embodiments of the present disclosure, an eyeglass-type electronic device (e.g., the electronic device (200) of FIG. 2) may comprise a housing (e.g., the housing (210) of FIG. 2), a lens frame portion provided as part of the housing (e.g., the lens frame portion (202) of FIG. 2), at least one camera module (e.g., the camera module (250) of FIG. 2) or at least one display module (e.g., the display module (160) of FIG. 2), a first wearing portion (e.g., the first wearing member (203a) of FIG. 3) extending from one end of the lens frame portion and having a first PCB disposed thereon, a second wearing portion (e.g., the second wearing member (203b) of FIG. 3) extending from the other end of the lens frame portion and having a second PCB disposed thereon, and a flexible PCB (FPCB) (e.g., the FPCB (720) of FIG. 7b) electrically connected from the first PCB through the lens frame portion to the second PCB, and inside the lens frame portion, the FPCB is the camera It can be electrically connected to at least one of the module or the display module.

[0116] According to various embodiments of the present disclosure, the FPCB and the first PCB may be electrically connected by a single connector.

[0117] According to various embodiments of the present disclosure, a battery electrically connected to the second PCB may be located at the end of the second wearable part.

[0118] According to various embodiments of the present disclosure, the FPCB may be electrically connected from a battery located at the end of a first wearable part and electrically connected to a first PCB to a battery electrically connected to a second PCB.

[0119] According to various embodiments of the present disclosure, the FPCB comprises a plurality of layers providing power or signal wiring, said first wiring for a first signal disposed in at least one of the uppermost or lowermost layer among the plurality of layers, and said second wiring for a second signal disposed in an inner layer disposed between the uppermost and lowermost layer among the plurality of layers, and said first signal may be a signal of higher speed than said second signal.

[0120] According to various embodiments of the present disclosure, the first wiring may be formed of a material different from the second wiring.

[0121] According to various embodiments of the present disclosure, a display module includes a first display module and a second display module, and a camera module includes a first camera module and a second camera module, and an FPCB and the first display module, the second display module, the first camera module, and the second camera module may be electrically connected to either a first PCB or a second PCB through the FPCB.

[0122] According to various embodiments of the present disclosure, the FPCB may be additionally electrically connected to a module for eye tracking.

[0123] According to various embodiments of the present disclosure, an eyeglass-type electronic device (e.g., electronic device (200) of FIG. 2) comprises: a housing (e.g., housing (210) of FIG. 2); a lens frame portion (e.g., lens frame portion (202) of FIG. 2) provided as part of the housing; a first wearing portion (e.g., first wearing member (203a) of FIG. 3) extending from one end of the lens frame portion; a first PCB received in the first wearing portion; a second wearing portion (e.g., second wearing member (203b) of FIG. 3) extending from the other end of the lens frame portion; a second PCB received in the second wearing portion; and a flexible PCB (e.g., FPCB (720) of FIG. 7b) electrically connected from the first PCB through the lens frame portion to the second PCB, wherein, within the lens frame portion, the FPCB comprises a plurality of layers providing power or signal wiring, wherein the plurality of layers providing signal wiring, among the plurality of layers providing signal wiring, is a first wiring for a first signal An electronic device may be proposed comprising a first wiring and a second wiring for a second signal disposed in at least one of the top layer or the bottom layer, wherein the second wiring is disposed in an inner layer disposed between the top layer and the bottom layer among the plurality of layers, and the first signal is a signal of higher speed than the second signal.

[0124] According to various embodiments of the present disclosure, the first wiring may be formed of a material having a lower dielectric constant than the second wiring.

[0125] According to various embodiments of the present disclosure, the first wiring may be formed of a material having a lower signal loss than the second wiring.

[0126] According to various embodiments of the present disclosure, a camera module or display disposed in the lens frame portion is further included, and the camera module or the display may be electrically connected to a connector disposed in the FPCB.

[0127] According to various embodiments of the present disclosure, at least a portion of the top layer or bottom layer of the FPCB may be covered with an EMI sheet (or tape) for shielding.

[0128] According to various embodiments of the present disclosure, the FPCB in the section between the connector and the second PCB may be formed with a width smaller than the section between the connector and the first PCB.

[0129] According to various embodiments of the present disclosure, the FPCB is a single FPCB composed of a plurality of wires, and wiring for main power may be located in an inner layer of the FPCB.

[0130] According to various embodiments of the present disclosure, a conductive member is further included that is electrically connected to the single FPCB and disposed in the lens frame portion, and the conductive member may be located in the upper portion of the lens frame portion to prevent voltage drop (IR drop).

[0131] According to various embodiments of the present disclosure, the FPCB comprises a plurality of layers providing power or signal wiring, and the FPCB may be electrically connected to at least one of a camera module, a display module, an audio module, and a sensor.

[0132] According to various embodiments of the present disclosure, a hotbar structure disposed on a first PCB is included, and the FPCB can be electrically connected to the first PCB through the hotbar structure.

[0133] According to various embodiments of the present disclosure, the battery is further included in the end portion of the second wearable part, and the battery may be electrically connected to the second PCB.

[0134] According to various embodiments of the present disclosure, a display module includes a first display module and a second display module, and a camera module includes a first camera module and a second camera module, and the FPCB and the first display module, the second display module, the first camera module, and the second camera module may be electrically connected.

[0135] According to various embodiments of the present disclosure, the FPCB may be further electrically connected to a module for eye tracking.

[0136] According to various embodiments of the present disclosure, an eyeglass-type electronic device comprises a flexible PCB (FPCB), a main PCB electrically connected to one end of the FPCB, a sub PCB electrically connected to the other end of the FPCB, and a connector that can be connected to at least one component of the eyeglass-type electronic device in at least a portion of the FPCB, wherein the FPCB comprises a plurality of layers providing power or signal wiring, wherein the plurality of layers comprises a first wiring disposed in at least one of the top or bottom layer among the layers providing signal wiring as a first wiring for a first signal, and a second wiring disposed in an inner layer disposed between the top and bottom layers as a second wiring for a second signal, wherein the first signal may be a signal of higher speed than the second signal.

[0137] According to various embodiments of the present disclosure, when a first component connected through the connector receives the first signal, the first signal may be transmitted to the main PCB through the first wiring of the layer for the first component.

[0138] According to various embodiments of the present disclosure, a sheet or tape for shielding may be attached to the layer providing the first wiring.

[0139] According to various embodiments of the present disclosure, in a plurality of layers comprising the FPCB, the layer comprising the first wiring may use a material different from the wiring of other layers in order to reduce signal loss.

[0140] According to various embodiments of the present disclosure, the FPCB further includes a rotatable hinge portion of the glasses-type electronic device at one end and the other end, and the FPCB can be connected to the main PCB and sub PCB, respectively, through the hinge portion.

[0141] According to various embodiments of the present disclosure, wiring for power transmission may be located in an inner layer positioned between the top layer and the bottom layer.

[0142] The eyeglass-type electronic device of the present disclosure described above is not limited by the aforementioned embodiments and drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

Claims

Claim 1 An eyeglass-type electronic device comprising: a housing; a lens frame portion provided as part of the housing; at least one camera module or at least one display module disposed in the lens frame portion; a first wearing portion extending from one end of the lens frame portion; a first PCB received in the first wearing portion; a second wearing portion extending from the other end of the lens frame portion; a second PCB received in the second wearing portion; a single FPCB (flexible PCB) having a plurality of layers electrically connected from the first PCB through the lens frame portion to the second PCB; and a conductive member disposed within the lens frame portion and electrically connected to the single FPCB, wherein, within the lens frame portion, the FPCB is electrically connected to at least one of the camera module or the display module, and the conductive member is disposed at the top of the lens frame portion to prevent voltage drop. Claim 2 In claim 1, the FPCB and the first PCB are electrically connected by a single connector in an eyeglass-type electronic device. Claim 3 In claim 1, an eyeglass-type electronic device having a battery electrically connected to the second PCB located at the end of the second wearable part. Claim 4 In paragraph 3, the FPCB is an eyeglass-type electronic device located at the end of the first wearable part and electrically connected from a battery electrically connected to the first PCB to a battery electrically connected to the second PCB. Claim 5 An eyeglass-type electronic device according to claim 1, wherein the FPCB comprises: a plurality of layers providing power or signal wiring; a first wiring for a first signal disposed in at least one of the uppermost or lowermost layer among the plurality of layers; and a second wiring for a second signal disposed in an inner layer between the uppermost and lowermost layer among the plurality of layers, wherein the first signal is a signal of higher speed than the second signal. Claim 6 In paragraph 5, the first wiring is formed of a different material from the second wiring in the eyeglass-type electronic device. Claim 7 An eyeglass-type electronic device according to claim 1, wherein the display module includes a first display module and a second display module, and the camera module includes a first camera module and a second camera module, and the first display module, the second display module, the first camera module, and the second camera module are electrically connected to either a first PCB or a second PCB through the FPCB. Claim 8 In claim 7, the FPCB is an eyeglass-type electronic device additionally electrically connected to a module for eye tracking. Claim 9 In an eyeglass-type electronic device, the device comprises: a housing; a lens frame portion provided as part of the housing; a first wearing portion extending from one end of the lens frame portion; a first PCB received in the first wearing portion; a second wearing portion extending from the other end of the lens frame portion; a second PCB received in the second wearing portion; and a single FPCB (flexible PCB) having a plurality of layers, electrically connected from the first PCB through the lens frame portion to the second PCB. An eyeglass-type electronic device comprising a conductive member disposed within the lens frame portion and electrically connected to the single FPCB, wherein, within the lens frame portion, the FPCB comprises a plurality of layers providing power or signal wiring, wherein the plurality of layers comprises a first wiring disposed in at least one of the uppermost or lowermost layer among the layers providing signal wiring as a first wiring for a first signal, and a second wiring disposed in an inner layer disposed between the uppermost and lowermost layers as a second wiring for a second signal, wherein the first signal is a signal of higher speed than the second signal, and the conductive member is disposed at the top of the lens frame portion to prevent voltage drop. Claim 10 In claim 9, the FPCB further comprises an EMI sheet that provides an electromagnetic shielding structure to the first wiring or the second wiring, forming a glasses-type electronic device. Claim 11 An eyeglass-type electronic device according to claim 9, further comprising a camera module or display disposed on the lens frame portion, wherein the camera module or the display is electrically connected to a connector disposed on the FPCB. Claim 12 In claim 11, the FPCB in the section between the connector and the second PCB is formed with a width smaller than the section between the connector and the first PCB, forming an eyeglass-type electronic device. Claim 13 In claim 9, the second wiring is set as wiring for power supply in a glasses-type electronic device. Claim 14 delete Claim 15 In claim 9, the glasses-type electronic device further comprises a battery accommodated at the end of the second wearable part, wherein the battery is electrically connected to the second PCB. Claim 16 In claim 9, the FPCB is an eyeglass-type electronic device electrically connected to a module for eye tracking. Claim 17 An eyeglass-type electronic device comprising: a flexible PCB (FPCB) including a plurality of layers; a conductive member electrically connected to the FPCB and configured to prevent voltage drop of the FPCB; a main PCB electrically connected to one end of the FPCB; a sub PCB electrically connected to the other end of the FPCB; a connector that can be connected to at least one component of the eyeglass-type electronic device in at least a portion of the FPCB; wherein the FPCB includes a plurality of layers providing power or signal wiring, wherein the plurality of layers include a first wiring disposed in at least one of the top or bottom layer among the layers providing signal wiring as a first wiring for a first signal, and a second wiring disposed in an inner layer disposed between the top and bottom layers as a second wiring for a second signal, wherein the first signal is a signal of higher speed than the second signal. Claim 18 An eyeglass-type electronic device according to claim 17, wherein when a first component connected through the connector receives the first signal, the first signal is transmitted to the main PCB through the first wiring of the layer for the first component. Claim 19 In claim 17, a glasses-type electronic device having a shielding sheet or tape attached to the layer providing the first wiring. Claim 20 In claim 17, an eyeglass-type electronic device having wiring for power transmission located in an inner layer positioned between the uppermost and lowermost layers. Claim 21 delete Claim 22 delete Claim 23 delete Claim 24 delete Claim 25 delete Claim 26 delete

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