Enclosed liquid cooling system

TW202630718APending Publication Date: 2026-07-16LIQUACOOL IP LLC

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Patent Information

Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner: LIQUACOOL IP LLC
Filing Date: 2025-02-17
Publication Date: 2026-07-16

Application Information

Patent Timeline

17 Feb 2025

Application

16 Jul 2026

Publication

TW202630718A

IPC: H05K7/20; F28D5/00; F28F3/06

Inventors: 柯立世

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Technology Topics

Liquid cooling system Printed circuit board

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Abstract

A liquid cooling system comprising a printed circuit board, a gasket seated on a top side of the printed circuit board gasket encircling one or more components on the printed circuit board, an enclosure on the gasket and fastened against the printed circuit board to form a sealed chamber, and a transfer liquid within the sealed chamber contacting one or more components mounted on the printed circuit board to provide cooling for the one or more components.

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