Gold alloy wire, and bonding wire, conductive wire, joining wire, semiconductor wire, structural wire, medical wire, jewelry wire, and semiconductor device using the gold alloy wire

TW202643622APending Publication Date: 2026-11-01TANAKA DENSHI KOGYO KK
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Patent Information

Application Number
TW115105417
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-28
Filing Date
2026-02-11
Publication Date
2026-11-01

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Abstract

A gold alloy wire with excellent strength that can withstand secondary processing and less strength degradation due to heat in the operating environment. The ratio of the specific grain boundary lengths of the crystal grains in the cross section perpendicular to the length direction of the gold alloy wire, as defined by the following formula (1), is 60% or less, and the ratio of the orientation of the crystal orientation <hkl> within the length direction of the gold alloy wire measured in this cross section, with an angular difference of less than 15 degrees relative to the length direction of the gold alloy wire, <111>, is 20% to 70%. The ratio of specific grain boundary lengths = Σ3~Σ29 grain boundary lengths / total grain boundary length (1)
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