Anti-electrostatic discharge grip ring for wavers

Abstract

This invention discloses an anti-static discharge expansion ring for wafers, comprising an outer ring and an inner ring that can be tightly fitted together. After the wafer dicing process, a blue film used for dicing the wafer is applied to cover the inner ring and clamps it in place by engaging the outer ring with the inner ring. An annular protrusion is formed on the inner side of the outer ring, and an annular recess is formed on the outer side of the inner ring. The annular protrusion engages with the annular recess to secure the two rings together. The surface of the outer ring has visible filamentous textures. The outer ring is molded from a first base plastic, fiber-reinforced material, and carbon nanotubes, with a surface resistivity between 10³ Ω and 10¹⁰ Ω. The inner ring is molded from a second base plastic and polyether block amide, with a surface resistivity between 10⁸ Ω and 10¹¹ Ω.

Claims

1. An anti-static discharge expansion ring for wafers, comprising an outer ring and an inner ring that can be tightly fitted together, wherein after the wafer dicing process, the inner ring is covered with a blue film used for dicing the wafer and clamped to engage the outer ring with the inner ring, characterized in that: an annular protrusion is formed on the inner side of the outer ring, and an annular recess is formed on the outer side of the inner ring, the annular protrusion being inserted into the annular recess to fix the two together and prevent them from loosening; the surface of the outer ring has visible filamentous textures; the outer ring is formed by mixing a first base plastic, a fiber-reinforced material and carbon nanotubes, with a surface resistivity between 10³ Ω and 10¹⁰ Ω; and the inner ring is formed by mixing a second base plastic and polyether block amide (PEBA), with a surface resistivity between 10⁸ Ω and 10¹¹ Ω.

2. An anti-static discharge expansion ring for wafers, comprising an outer ring and an inner ring that can be tightly fitted together, wherein after the wafer dicing process, the inner ring is covered with a blue film used for dicing the wafer and clamped to engage the outer ring with the inner ring, characterized in that: an annular protrusion is formed on the inner side of the outer ring, and an annular recess is formed on the outer side of the inner ring, the annular protrusion being inserted into the annular recess to fix the two together and prevent them from loosening; the surface of the outer ring has visible filamentous texture; the outer ring is formed by mixing a first base plastic, fiber-reinforced material and carbon nanotubes, with a surface resistivity between 10³ Ω and 10¹⁰ Ω; and the inner ring is formed by mixing a second base plastic and carbon fiber, with a surface resistivity between 10³ Ω and 10¹⁰ Ω.

3. An anti-static discharge expansion ring for wafers, comprising an outer ring and an inner ring that can be tightly fitted together, wherein after the wafer dicing process, the inner ring is covered with a blue film used for dicing the wafer and clamped to engage the outer ring with the inner ring, characterized in that: an annular protrusion is formed on the inner side of the outer ring, and an annular recess is formed on the outer side of the inner ring, the annular protrusion being inserted into the annular recess to secure the two together; the surface of the outer ring has visible filamentous texture; the outer ring is formed by mixing a first base plastic, carbon fiber, plastic dye and white dye, with a surface resistivity between 10³ Ω and 10¹⁰ Ω; the inner ring is formed by mixing a second base plastic and polyether block amide, with a surface resistivity between 10⁸ Ω and 10¹¹ Ω; The outer ring comprises 55 to 83 parts by weight of a first base plastic component, 5 to 25 parts by weight of a carbon fiber component, 5 to 15 parts by weight of a plastic dye component, and 2 to 10 parts by weight of a white dye component; and the inner ring comprises 70 to 95 parts by weight of a second base plastic component and 5 to 30 parts by weight of a polyether block amide component.

4. An antistatic discharge expansion ring for a wafer as claimed in any one of claims 1 to 3, wherein the first substrate plastic is polycarbonate (PC), acrylonitrile butadiene styrene copolymer (ABS), polyoxymethylene (POM), or a mixture of the foregoing materials.

5. An antistatic discharge expansion ring for a wafer as claimed in any one of claims 1 to 3, wherein the second substrate plastic is polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyoxymethylene, or a mixture of the foregoing materials.

6. An anti-static discharge expansion ring for a wafer as described in claim 1 or 2, wherein the fiber reinforcement material is glass fiber or carbon fiber.

7. The anti-static discharge expansion ring for a wafer as described in claim 1 or 3, wherein the polyether block amide is a polyamide 6 and polyethylene glycol block copolymer.

8. The anti-static discharge expansion ring for a wafer as claimed in claim 1, wherein the inner ring further comprises a white dye, wherein the composition of the inner ring comprises 65 to 80 parts by weight of a second base plastic component, 15 to 30 parts by weight of a polyether block amide component, and 2 to 5 parts by weight of a white dye component.

9. An anti-static discharge expansion ring for a wafer as described in claim 3 or 8, wherein the white dye is titanium dioxide or zinc sulfide.

10. The anti-static discharge expansion ring for a wafer as claimed in claim 2, wherein the composition of the inner ring comprises 70 to 95 parts by weight of a second base plastic component and 5 to 30 parts by weight of a carbon fiber component.

11. The anti-static discharge expansion ring for a wafer as claimed in claim 6, wherein the fiber reinforcement material is glass fiber, and the composition of the outer ring comprises 60 to 85 parts by weight of a first base plastic component, 10 to 30 parts by weight of a glass fiber component, and 2 to 20 parts by weight of a carbon nanotube component.

12. The anti-static discharge expansion ring for a wafer as claimed in claim 6, wherein the fiber reinforcement material is carbon fiber, and the composition of the outer ring comprises 60 to 85 parts by weight of a first base plastic component, 5 to 25 parts by weight of a carbon fiber component, and 2 to 15 parts by weight of a carbon nanotube component.

13. The anti-static discharge expansion ring for a wafer as claimed in claim 2, wherein the surface of the inner ring has visible filamentary patterns.

14. The anti-static discharge expansion ring for a wafer as described in claim 3, wherein the plastic dye is phthalocyanine blue, ultramarine blue, cobalt blue, Prussian blue, indigo, phthalocyanine green, azo red, or benzidine yellow.

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