Grounding ring of a process kit for semiconductor substrate processing
USD1064005SActive Publication Date: 2025-02-25APPLIED MATERIALS INC
Patent Information
- Application Number
- US29/848745
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Filing Date
- 2022-08-04
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2040-02-25
Smart Images
Figure USD1064005-D00000_ABST
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Description
[0001] FIG. 1 is a top isometric view of a grounding ring of a process kit for semiconductor substrate processing, according to the novel design.
[0002] FIG. 2 is a bottom isometric view thereof.
[0003] FIG. 3 is a top plan view thereof.
[0004] FIG. 4 is a bottom plan view thereof.
[0005] FIG. 5 is a left elevation view thereof.
[0006] FIG. 6 is a right elevation view thereof.
[0007] FIG. 7 is a back elevation view thereof, enlarged to more clearly show details; and,
[0008] FIG. 8 is a front elevation view thereof, enlarged to more clearly show details.
Claims
The ornamental design for a grounding ring of a process kit for semiconductor substrate processing, as shown and described.
Citation Information
Patent Citations
DEPOSITION RING OF A PROCESS KIT FOR SEMICONDUCTOR SUBSTRATE PROCESSING - Patent application
JP1747664S
DEPOSITION RING OF A PROCESS KIT FOR SEMICONDUCTOR SUBSTRATE PROCESSING - Patent application
JP1747763S
Wafer lifting apparatus and method for dechucking wafer using the same
KR1020090064113A
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