Display device and electronic apparatus

Abstract

A display device and an electronic apparatus. The display device comprises: a display module (2); a flexible circuit board (3), the flexible circuit board (3) comprising a bending part (31) and a component mounting part (32), which are connected into a whole, wherein the bending part (31) is electrically connected to the display module (2), and the component mounting part (32) is located on a non-display side of the display module (2) and overlaps the display module (2) in a thickness direction of the display module (2); and a processor (6), which is integrated on the component mounting part (32) and used for providing a display signal for the display module (2).

Description

Display device and electronic device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device and an electronic device. Background Art

[0002] Small appliances such as refrigerators, washing machines, robot vacuums, floor scrubbers, cooking machines, and air purifiers utilize display screens as user interfaces to achieve human-machine interaction. The display module in some small appliances typically utilizes a display module + system board design, which is complex to install and expensive.

[0003] Summary of the Invention

[0004] The present disclosure provides a display device and an electronic device.

[0005] In a first aspect, the present disclosure provides a display device, comprising:

[0006] Display module;

[0007] A flexible circuit board, comprising: a bending portion and a device mounting portion connected as one body, the bending portion being electrically connected to the display module, the device mounting portion being located on a non-display side of the display module and overlapping with the display module in a thickness direction of the display module;

[0008] A processor is integrated on the device mounting portion and is used to provide a display signal for the display module.

[0009] In some embodiments, an overlapping area between the device mounting portion and the display module is greater than 1 / 3 of an area of ​​the display module.

[0010] In some embodiments, the device mounting portion is bonded to the display module via a bonding portion.

[0011] In some embodiments, the device mounting portion is provided with a signal interface for electrically connecting to the system main control board.

[0012] The processor is electrically connected to the signal interface, and is specifically configured to provide a display signal to the display module according to a control instruction provided by the system main control board.

[0013] In some embodiments, the display device further comprises:

[0014] A conductive portion and a touch chip, the touch chip being electrically connected to the conductive portion and the signal interface, configured to send a drive signal to the conductive portion, determine whether a touch occurs based on a change in the electrical signal on the conductive portion, and send a touch feedback signal to the system main control board;

[0015] The conductive portion and the display module do not overlap in a thickness direction of the display module.

[0016] In some embodiments, the device mounting portion includes: a main body portion connected to the bent portion, and at least one strip-shaped branch structure provided on an edge of the main body portion, wherein the edge of the main body portion includes: a first edge and a second edge, wherein the first edge and the second edge extend in directions intersecting, the length of the second edge is smaller than the length of the first edge, and the width of the strip-shaped branch structure is smaller than the length of the second edge;

[0017] Wherein, the processor is arranged on the main body, and the conductive part is arranged on the strip-shaped branch structure.

[0018] In some embodiments, the width of the strip-shaped branch structure is less than 1 / 4 of the length of the second edge.

[0019] In some embodiments, the touch chip is disposed on the strip-shaped branch structure.

[0020] In some embodiments, the conductive portion has an area between 150 and 530 square millimeters.

[0021] In some embodiments, the display device further comprises:

[0022] A photosensor is provided on the strip-shaped branch structure; wherein the photosensor and the conductive portion are provided on different strip-shaped branch structures, and the photosensor and the display module do not overlap in a thickness direction of the display module;

[0023] The light sensor is electrically connected to the signal interface, and is configured to generate an electrical signal according to the received light, and send the electrical signal to the system main control board through the signal interface.

[0024] In some embodiments, the flexible circuit board includes:

[0025] a first insulating layer;

[0026] A plurality of signal traces are arranged on the first insulating layer;

[0027] a second insulating layer, located on a side of the plurality of signal traces away from the first insulating layer;

[0028] The processor is arranged on a side of the second insulating layer away from the first insulating layer, and is electrically connected to the signal trace through a via hole on the second insulating layer;

[0029] The conductive portion is provided on the same layer as the signal line and is electrically connected to the touch chip through the signal line; the first insulating layer covers at least a portion of the signal line and has no overlap with the conductive portion in a thickness direction of the display module.

[0030] In some embodiments, the device mounting portion includes a main body portion, the main body portion includes a first edge and a third edge arranged opposite to each other, the first edge is connected to the bending portion, the processor is arranged on the main body portion, and the distance from the processor to the first edge is smaller than the distance from the processor to the third edge; the distance from the signal interface to the third edge is smaller than the distance from the microprocessor to the third edge.

[0031] In some embodiments, the display device further includes a heat sink, which is disposed on a side of the device mounting portion away from the processor, and an orthographic projection of the heat sink on the device mounting portion overlaps with an orthographic projection of the processor on the device mounting portion.

[0032] In some embodiments, the thickness of the flexible circuit board is between 0.1 mm and 0.3 mm.

[0033] In some embodiments, in the display device, the total thickness of other structures except the display module is less than or equal to 2.8 mm.

[0034] The present disclosure also provides an electronic device, comprising:

[0035] The above-mentioned display device;

[0036] The housing comprises a main shell and a transparent cover connected to the main shell, wherein the main shell and the transparent cover define a receiving cavity;

[0037] Wherein, the display device is fixedly arranged in the accommodating cavity, and the display module is arranged opposite to the transparent cover.

[0038] In some embodiments, the display module is bonded to the transparent cover portion.

[0039] In some embodiments, the display device further includes: a photosensor, wherein the photosensor and the display module do not overlap in the thickness direction of the display module; a light-transmitting window is further provided on the main shell, and the photosensor is arranged opposite to the light-transmitting window. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0041] FIG. 1 is a front view of an assembled display module and a system board in a small household appliance in an example.

[0042] FIG. 2 is a schematic diagram of the back side of a small household appliance after the display module and the system board are assembled in one example.

[0043] FIG3 is a front schematic diagram of a display device provided in some embodiments of the present disclosure.

[0044] FIG4 is a schematic diagram of the back side of a display device provided in some embodiments of the present disclosure.

[0045] FIG5 is a side view of a display device provided in some embodiments of the present disclosure.

[0046] FIG6 is a schematic diagram showing the connection between the unfolded flexible circuit board and the display module.

[0047] FIG. 7A is a cross-sectional view taken along line AA′ in FIG. 6 .

[0048] FIG. 7B is a cross-sectional view taken along line BB′ in FIG. 6 .

[0049] FIG8 is a schematic diagram of a partial structure of an electronic device provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0050] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0051] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0052] In the field of small household appliances such as refrigerators, washing machines, sweeping robots, floor scrubbers, cooking machines, air purifiers and other products, human-computer interaction is achieved by adding display screens as display operation interfaces.

[0053] In some small household appliances, the display module and the system board are electrically connected through a flexible circuit board. Figure 1 is a front view schematic diagram of the display module and the system board of a small household appliance in an example after assembly, and Figure 2 is a back view schematic diagram of the display module and the system board of a small household appliance in an example after assembly. As shown in Figures 1 and 2, the system board includes a driver circuit board 1 and a driver chip component arranged on the driver circuit board 1. The driver chip component, for example, includes a touch chip (not shown), a processor 6, and a cache 9 (such as a flash chip). A plurality of pressure-sensitive springs 4 are also provided on the driver circuit board 1. The driver circuit board 1 is arranged opposite to the display module 2, and the pressure-sensitive springs 4 are arranged on the surface of the driver circuit board 1 facing the display module 2, and the touch chip, processor 6 and cache 9 are arranged on the surface of the driver circuit board 1 facing away from the display module 2. A first connector 7 and a second connector 8 are also provided on the surface of the driver circuit board 1 facing away from the display module 2. The first connector 7 is electrically connected to one end of the flexible circuit board 3, and the other end of the flexible circuit board 3 is electrically connected to the display module 2 through the through hole 5 on the driver circuit board 1. The processor 6 is connected to the first connector 7, the buffer 9, and the second connector 8 on the driver circuit board 1. At the same time, the pressure-sensitive spring 4 is also electrically connected to the touch chip, and the touch chip is connected to the second connector 8. The second connector 8 is used to connect to the system main control board of the small household appliance product.

[0054] The touch chip detects different signals when the pressure-sensitive spring 4 is pressed and when it is not pressed. The touch chip determines whether the pressure-sensitive spring is pressed based on the difference in the signals and sends a touch feedback signal to the system main control board. The system main control board then sends a control instruction to the processor 6 based on the touch feedback signal. The processor 6 controls the display panel to turn on or switch images based on the control instruction.

[0055] Among them, the buffer 9 stores the original image information of multiple images that need to be displayed by small household appliances; when the processor 6 controls the display panel to display an image, it can obtain the original image information of the corresponding image from the buffer 9 according to the control instructions of the system main control board, and after processing the original image information, generate the image information to be displayed and send it to the display module 2 for the display module 2 to display the image.

[0056] In the structures shown in Figures 1 and 2, the display module 2 needs to be assembled with the driver circuit board 1 via the flexible circuit board 3, which increases the overall assembly process of the small household appliance. In addition, the cost of the driver circuit board 1 is relatively high, resulting in a higher overall cost of the small household appliance.

[0057] The embodiments of the present disclosure provide a display device, which is applied to electronic devices, and the electronic devices may be small household appliances, such as refrigerators, washing machines, robot vacuums, floor scrubbers, cooking machines, air purifiers, and the like. In these small household appliances, the display area of ​​the display device is relatively small, and the content of the displayed image is relatively simple. FIG3 is a front schematic diagram of the display device provided in some embodiments of the present disclosure, FIG4 is a back schematic diagram of the display device provided in some embodiments of the present disclosure, and FIG5 is a side view of the display device provided in some embodiments of the present disclosure. As shown in FIG3 to FIG5, the display device includes: a display module 2, a flexible circuit board 3, and a processor 6 integrated on the flexible circuit board 3.

[0058] The display module 2 may be a liquid crystal display module, an OLED display module, a QLED display module, or the like, and is not specifically limited in this disclosure. Furthermore, in small household appliances, the display module 2 is relatively small, for example, less than 6 inches, less than 5 inches, or less than 3 inches. In one example, the display module 2 is 2.4 inches.

[0059] The flexible circuit board 3 includes a bending portion 31 and a device mounting portion 32 connected as one body. The bending portion 31 is electrically connected to the display module 2. The device mounting portion 32 is located on the non-display side of the display module 2 and overlaps with the display module 2 in the thickness direction of the display module 2.

[0060] The display module 2 may include a display substrate and a binding electrode provided on the display substrate, and the above-mentioned bent portion 31 is electrically connected to the display module 2, specifically, the bent portion 31 is electrically connected to the binding electrode. In addition, it should be noted that the display module 2 has a display side and a non-display side, the display side is the side that displays the image, and the non-display side is the side opposite to the display side. In the embodiment of the present disclosure, the overlap of two structures in the thickness direction of the display module 2 means that, with a plane parallel to the display module 2 as a reference plane, the orthographic projections of the above-mentioned two structures on the reference plane overlap.

[0061] The processor 6 is electrically connected to the display module 2 via the flexible circuit board 3 and is used to provide display signals to the display module 2. In some embodiments, the driver chip can be a microcontroller unit (MCU), and the display signal can include an image signal. In addition to the display substrate, the display module 2 can also include a display driver chip disposed on the display substrate. The display driver chip can provide voltage signals to the pixels in the display substrate based on the image signal, thereby causing the display panel to display the corresponding image.

[0062] In the disclosed embodiment, the microprocessor 6 in the display device is integrated on the flexible circuit board 3. In this case, when assembling the display device, only the display module 2 and the flexible circuit board 3 need to be assembled, eliminating the need for assembly with the driver circuit board, thereby improving product assembly efficiency. Furthermore, compared to the driver circuit board, the flexible circuit board 3 is lower in cost, thickness, and weight, thereby reducing the cost, thickness, and weight of the display device.

[0063] In some embodiments, the overlapping area between the device mounting portion 32 and the display module 2 is greater than or equal to 1 / 3 of the area of ​​the display mask 2, thereby providing sufficient mounting area. For example, the overlapping area between the device mounting portion 32 and the display module 2 is 1 / 3, 1 / 2, or 2 / 3 of the area of ​​the display mask 2.

[0064] The overlapping area between the device mounting portion 32 and the display module 2 refers to the overlapping area between the device mounting portion 32 and the display module 2 in the thickness direction of the display module 2. The area of ​​the display module 2 may specifically refer to the area of ​​the surface of the display module 2 away from the device mounting portion 32.

[0065] In some embodiments, the orthographic projection of the device mounting portion 32 on the plane where the display module 2 is located can be completely located within the area where the display module 2 is located, so as to facilitate fixation between the device mounting portion 32 and the display module 2 .

[0066] In some embodiments, the device mounting portion 32 is bonded to the display module 2 via the bonding portion 16. Thus, when assembling the display device with the housing of the small household appliance, only the display module 2 needs to be bonded to the housing, eliminating the need to secure the flexible circuit board 3 to the housing using fasteners such as screws, thereby facilitating assembly of the entire device. The bonding portion 16 can be a continuous adhesive film layer or a discontinuous plurality of adhesive structures. For example, the bonding portion 16 can be a continuous double-sided adhesive layer or include multiple double-sided adhesive strips.

[0067] It should be noted that the fact that the device mounting portion 32 is bonded to the display module 2 via the adhesive portion 16 does not necessarily mean that the adhesive portion 16 is the only portion between the device mounting portion 32 and the display module 2. In some embodiments, as shown in FIG5 , the surface of the device mounting portion 32 facing the display module 2 may also be provided with a heat sink 15, with the adhesive layer 16 disposed between the heat sink 15 and the display module 2. The provision of the heat sink 15 dissipates heat from the flexible circuit board 3, preventing overheating caused by the processor 6 integrated on the flexible circuit board 3.

[0068] The heat sink 15 can be made of a material with high heat dissipation effect and high hardness, so as to achieve good heat dissipation effect while providing a certain support force for the flexible circuit board 3. For example, the heat sink 15 is made of steel sheet.

[0069] In some embodiments, the thickness of the heat sink 15 is less than or equal to 1 mm, thereby reducing the overall thickness of the display device.

[0070] Figure 6 is a connection diagram of the unfolded flexible circuit board and the display module. As shown in Figure 6, in some embodiments, the device mounting portion 32 has a first edge E1 connected to the bending portion 31, and the first edge E1 extends along the first direction. The dimension of the bending portion 31 in the first direction is smaller than the length of the first edge E1, so that the bending portion 31 is bent.

[0071] As shown in Figure 6, the device mounting portion 32 is provided with a signal interface 13 for electrically connecting to the system main control board. When the display device is used in the aforementioned small household appliance, the image content displayed by the display device is relatively simple, and the amount of data transmitted by the signal interface is relatively small. Therefore, an interface with fewer pins can be used, for example, an 8-pin interface. The display device may also include a buffer 9, wherein the buffer 9 is used to store the original image information of multiple images.

[0072] The processor 6 is electrically connected to the signal interface 13 and the buffer 9, and is specifically configured to receive control instructions sent by the system main control board through the signal interface 13 and provide a display signal to the display module in accordance with the control instructions. In some examples, the display device may further include the buffer 9 (e.g., a flash chip). The processor 6 may also be connected to the buffer 9 and, in accordance with the control instructions provided by the system main control board, retrieve the original image information of the corresponding image from the buffer 9, process the original image information, generate the image information to be displayed, and transmit it to the display module 2.

[0073] In some embodiments, the processor 6 can transmit the image information to be displayed to the display driver chip in the display module 2, so that the display driver chip provides a driving voltage to the display substrate according to the image to be displayed, thereby displaying the image. Of course, in other embodiments, the processor 6 and the display driver chip can be integrated into a single chip, thereby further improving chip integration and simplifying the structure of the display device.

[0074] In some embodiments, processor 6 is located on a side of device mounting portion 32 away from display module 2. Because processor 6 processes data when the display device is operating and generates considerable heat, a heat sink 15 can be positioned corresponding to processor 6. Specifically, the orthographic projection of heat sink 15 on device mounting portion 32 overlaps with the orthographic projection of microprocessor 6 on device mounting portion 32, thereby dissipating heat from processor 6. The area of ​​heat sink 15 can be relatively small, as long as it covers the area where processor 6 is located. Heat sinks may not be provided in other locations to prevent the placement of heat sink 15 from affecting the overall thickness and weight of the display device.

[0075] The display device further includes a conductive portion 10 and a touch chip 11. The touch chip 11 is electrically connected to the conductive portion 10 and the signal interface 13. The touch chip 11 is configured to send an electrical signal to the conductive portion 10, determine whether a touch has occurred based on changes in the electrical signal on the conductive portion 10, and send a touch feedback signal to the system main control board. The conductive portion 10 and the display module 2 do not overlap in the thickness direction of the display module 2. That is, with a plane parallel to the display module 2 as a reference plane, the orthographic projection of the conductive portion 10 on this reference plane does not overlap with the orthographic projection of the display module 2 on the reference plane.

[0076] Among them, the conductive part 10 can be a sheet metal structure and is electrically connected to the touch chip 11 through a signal line. For example, it can be connected to the connection port of the touch chip 11 through a signal line. When the display device is working, the touch chip 11 sends a drive signal to the conductive part 10. The drive signal can be a current signal. Since parasitic capacitance is formed between the conductive part 10 and other signal lines (such as ground lines) on the flexible circuit board, when the current signal is output to the conductive part 10, it is equivalent to charging the parasitic capacitance. By detecting the change rate of the voltage signal on the conductive part 10, the charging rate of the capacitor where the conductive part 10 is located can be determined. When the conductive portion is not touched, the capacitance of the conductive portion 10 is the parasitic capacitance, and the charging speed is fixed; when a touch object (such as a finger) approaches the conductive portion 10, a capacitance (referred to as a first capacitance) is formed between the touch object and the conductive portion 10. The first capacitance is superimposed on the parasitic capacitance, that is, the capacitance of the conductive portion 10 changes, thereby causing the voltage change speed on the conductive portion 10 to change, and the charging speed will also change. The change in the charging speed of the touch chip 11 determines that the conductive portion 10 is touched, and sends a touch feedback signal to the system main control board, so that the system main control board sends a control instruction to the processor 6 according to the touch feedback signal. The processor 6 controls the display panel to turn on or switch images according to the control instruction. Of course, in other embodiments, the touch chip 11 can also be directly connected to the processor 6, thereby directly sending a touch feedback instruction to the processor 6. After receiving the touch feedback instruction, the processor 6 controls the display panel to turn on or switch images according to the touch feedback instruction.

[0077] It is understandable that when the area of ​​the conductive portion 10 is too small, it is difficult for the finger to touch the conductive portion 10 during use; when the area of ​​the conductive portion 10 is too large, the parasitic capacitance between the conductive portion 10 and the ground line is too large. Then, when a touch occurs, the first capacitance formed between the finger and the conductive portion 10 has little effect on the charging speed, and the touch chip is not easy to detect the occurrence of a touch. Therefore, in the embodiment of the present disclosure, the area of ​​the conductive portion 10 is set between 150 and 530 square millimeters to improve the accuracy of touch detection. For example, the area of ​​the conductive portion 10 is 150, 300, 400, 500, or 530 square millimeters.

[0078] It should be noted that the area of ​​the conductive portion 10 refers to the area of ​​the orthographic projection of the conductive portion 10 on the plane where the display module 2 is located.

[0079] The conductive portion 10 may be circular, square or other irregular shapes. In one example, the conductive portion 10 is circular with a diameter between 7 and 13 mm, such as 7 mm, 10 mm or 13 mm.

[0080] In one example, the display device may include multiple conductive parts 10 and multiple touch chips 11. For example, the multiple conductive parts 10 include a first conductive part and a second conductive part, and the multiple touch chips 11 include a first touch chip and a second touch chip. The first conductive part is electrically connected to the first touch chip, and the second conductive part is electrically connected to the second touch chip 11. When the first conductive part is touched, the first touch chip sends a first feedback signal to the system main control board. The system main control board sends a first control instruction to the processor 6 based on the first feedback signal. The microcontroller chip controls the display module 2 to turn on according to the first control instruction. When the second conductive part is touched, the second touch chip sends a second feedback signal to the system main control board. The system main control board sends a second control instruction to the processor 6 based on the second feedback signal. The processor 6 controls the display module 2 to switch images according to the second control instruction.

[0081] In some embodiments, as shown in FIG6 , the device mounting portion 32 includes a main portion 321 connected to the bent portion 31, and at least one strip-shaped branch structure 322 disposed at the edge of the main portion 321. The main portion 321 and the strip-shaped branch structure 322 are connected to form an integral structure. The buffer 9 and the processor 6 are disposed on the main portion 321, and the conductive portion 10 is disposed on the strip-shaped branch structure 322. In one example, each conductive portion 10 is disposed on a strip-shaped branch structure 322, and different conductive portions 10 are disposed on different strip-shaped branch structures 322.

[0082] The main body 321 can be a polygonal structure, such as a rectangular or rounded rectangular structure. The edges of the main body 321 include a first edge E1 and a second edge E2. The first edge E1 and the second edge E2 extend in intersecting directions, the length of the second edge E2 is less than the length of the first edge E1, and the width of the strip-shaped branch structure 322 is less than the length of the second edge E2. In other words, the width of the strip-shaped branch structure 322 is less than the length of the short side of the main body 321, thereby minimizing the area of ​​the flexible circuit board 3. During the production of the flexible circuit board, it can be divided on the motherboard to form multiple flexible circuit boards of the desired shape. When the area of ​​the flexible circuit board required for the display device is reduced, the motherboard can be divided into more flexible circuit boards, thereby reducing production costs.

[0083] Among them, the strip-shaped branch structure 322 may include: a branch head 322a and a connecting portion 322b connected between the branch head 322a and the main body 321. The branch head 322a may be circular, square or other shapes, and the connecting portion 322b may be a strip-shaped structure extending along a certain direction. Assuming that the width of the connecting portion is d1, and the size of the branch head 322a in the width direction of the connecting portion 322b is d2, then the strip-shaped branch structure 322 may refer to the larger one of d1 and d2.

[0084] It should be noted that a structure being "strip-shaped" means that the structure as a whole extends in a certain direction, but does not mean that the edges of the structure must be straight lines.

[0085] It should also be noted that the shapes of different strip-shaped branch structures 322 do not have to be exactly the same.

[0086] In some embodiments, the width of the strip-shaped branch structure 322 is less than 1 / 4 of the length of the second edge E2, thereby minimizing the overall area of ​​the flexible circuit board 3 and reducing costs. In actual product design, the width of the connecting portion 322b can be minimized as long as it does not affect the normal routing of the strip-shaped branch structure 322.

[0087] In some embodiments, as shown in FIG6 , the touch chip 11 is also disposed on the strip-shaped branch structure 322. For example, the touch chip 11 is disposed on the connecting portion 322b of the strip-shaped branch structure 322. Placing the touch chip 11 on the strip-shaped branch structure 322 can bring the touch chip 11 closer to the conductive portion 10, thereby reducing the length of the trace between the two, thereby reducing the parasitic capacitance between the trace and the ground line, and preventing the sensitivity of touch detection from being affected by large parasitic capacitance. Furthermore, placing the touch chip 11 on the strip-shaped branch structure 322 no longer occupies space on the main body 321, thereby leaving more space on the main body 321 for arranging other components.

[0088] It should be understood that when there are multiple conductive parts 10 and touch chips 11 , the conductive parts 10 and touch chips 11 may correspond one to one, and the touch chip 11 and its corresponding conductive part 10 are arranged on the same strip-shaped branch structure 322 .

[0089] Figure 7A is a cross-sectional view taken along line AA' in Figure 6 , and Figure 7B is a cross-sectional view taken along line BB' in Figure 6 . As shown in Figures 7A and 7B , in some embodiments, the flexible circuit board 3 includes: a first insulating layer 3a, a second insulating layer 3b, and a routing layer 3c. The routing layer 3c includes a plurality of signal routing lines disposed on the first insulating layer 3a; the second insulating layer 3b is located on a side of the plurality of signal routing lines away from the first insulating layer 3a. The routing layer 3c may be made of copper. In one example, the first insulating layer 3a may include: a first insulating sublayer 3a1 and a first adhesive layer 3a2 located between the first insulating sublayer 3a1 and the routing layer 3c. The material of the first insulating sublayer 3a1 may include, for example, polyimide. The second insulating layer 3b may include: a second insulating sublayer 3b1, a second bonding layer 3b2 and a third insulating sublayer 3b3, the second bonding layer 3b2 is located between the second insulating sublayer 3b1 and the third insulating sublayer 3b3, the third insulating sublayer 3b3 is located on the side of the second insulating sublayer 3b1 away from the routing layer 3c, and the materials of the second insulating sublayer 3b1 and the third insulating sublayer 3b3 may both include polyimide.

[0090] FIG7A only illustrates a conductive portion and a portion of the strip-shaped branch structure in which it is located. Similar structures can also be used for other portions of the flexible circuit board 3, such as the island-shaped branch structure in which other conductive portions are located. The main body 321 also includes the above-mentioned first insulating layer 3a, second insulating layer 3b, and a plurality of signal traces. The cache 9 and processor 6 are both arranged on the side of the second insulating layer 3b away from the first insulating layer 3a, and are electrically connected to the signal traces in the trace layer 3c through vias in the second insulating layer 3b. It can be understood that the cache 9 and processor 6 are electrically connected to the signal traces in the trace layer 3c through vias in the second insulating layer 3b, which means that the pins 131 of the cache 9 and the pins of the processor 6 are electrically connected to the signal traces in the trace layer 3c through vias in the second insulating layer 3b.

[0091] The conductive portion 10 is provided on the same layer as the signal trace 101 and is electrically connected to the touch control chip via the signal trace 101 in the trace layer 3c. That is, the conductive portion 10 and the signal trace 101 connected thereto form an integral structure. Furthermore, it is understood that although the signal trace 101 connected to the conductive portion 10 and the signal traces connected to the buffer 9 and the processor 6 are all located in the trace layer 3c, the conductive portion 10 and the buffer 9 are connected to different signal traces, and the conductive portion 10 and the processor 6 are also connected to different signal traces.

[0092] As shown in FIG7A , first insulating layer 3a covers at least a portion of each signal trace, and there is no overlap between first insulating layer 3a and conductive portion 10 in the thickness direction of display module 2. In other words, a portion of the conductor in trace layer 3c is exposed by first insulating layer 3a, thereby forming conductive portion 10. Because conductive portion 10 is part of trace layer 3c of flexible circuit board 3, it does not need to be assembled with flexible circuit board 3, unlike pressure-sensitive springs, thereby improving production efficiency.

[0093] Furthermore, the surface of the conductive portion 10 facing away from the second insulating layer 3b, as well as the surface of the first insulating layer 3a facing away from the second insulating layer 3b, can both be coated with an ink layer. When the display device is installed in the housing of an electronic device, if the housing does not cover the area of ​​the conductive portion 10, then when a finger touches the ink layer on the conductive portion 10, the ink layer acts as a dielectric layer, thereby forming the aforementioned first capacitance between the conductive portion 10 and the finger. If the insulating portion of the housing covers the area of ​​the conductive portion 10, then when a finger touches the ink layer on the conductive portion 10, the ink layer and the insulating portion of the housing together act as a dielectric layer, thereby forming the aforementioned first capacitance between the conductive portion 10 and the finger.

[0094] In addition, as mentioned above, the display device in the embodiment of the present disclosure is particularly suitable for small household appliances. In these products, the screen content of the display device is relatively simple, and the types of signals transmitted between chips are relatively small. Therefore, it is sufficient to set a wiring layer in the flexible circuit board 3. In this way, while meeting the display requirements, the cost and thickness of the flexible circuit board 3 are reduced, thereby reducing the overall cost and thickness of the display device.

[0095] It should be noted that Figures 7A and 7B are obtained by cutting along the cutting line in Figure 6. The flexible circuit board in Figure 6 is in an unfolded state, with the conductive portion 10 facing the inside of the paper, and the processor 6 and signal interface 13 facing the outside of the paper. Therefore, the conductive portion 10 in Figure 7A faces downward in Figure 7A, and the signal interface 13 in Figure 7B faces upward in Figure 7B. In actual applications, the flexible circuit board 3 is in a bent state, with the conductive portion 10 facing the light emitting direction of the display module 2, and the signal interface 13 is located on the side of the main body 321 of the flexible circuit board 3 facing away from the display module 2. For example, if the display device is located in the housing of an electronic device and the display module 2 faces the top of the housing, the conductive portion 10 also faces the top of the housing.

[0096] In some embodiments, the thickness of the flexible circuit board 3 is between 0.1 mm and 0.3 mm, thereby facilitating a reduction in the overall thickness of the display device. For example, the thickness of the flexible circuit board 3 is 0.1 mm, 0.2 mm, or 0.3 mm.

[0097] The thickness of the device structures on the flexible circuit board 3 (e.g., cache chip 9, processor 6, etc.) is less than or equal to 1 mm, the thickness of the heat dissipation layer 15 is less than or equal to 1 mm, and the thickness of the bonding portion 16 is less than or equal to 0.5 mm. In other words, the total thickness of the display device, excluding the display module 2, is less than or equal to 2.8 mm. This reduces the overall thickness of the display device, helps reduce the space occupied by the display device within the device housing, and facilitates the securement of the display device.

[0098] In one example, the thickness of the heat dissipation layer 15 is 1 mm or 0.8 mm or 0.6 mm or 0.4 mm, the thickness of the bonding portion 16 is 0.5 mm or 0.4 mm or 0.3 mm or 0.2 mm or 0.1 mm; the thickness of the device structure on the flexible circuit board 3 is 1 mm or 0.8 mm or 0.6 mm or 0.4 mm.

[0099] As shown in Figure 6, the main body 321 includes: a first edge E1 and a third edge E3, which are oppositely disposed, as well as a second edge E2 and a fourth edge E4. The first edge E1 of the main body 321 is the first edge E1 of the device mounting portion 32 and is connected to the bent portion 31. The second edge E2 and the fourth edge E4 extend in directions that intersect with the direction of the first edge E1. For example, the second edge E2 and the fourth edge E4 extend in directions that are substantially perpendicular to the direction of the first edge E1. The third edge E3 is substantially parallel to the first edge E1. The distance from the processor 6 to the first edge E1 is shorter than the distance from the processor 6 to the third edge E3, thereby reducing the wiring distance between the processor 6 and the display module 2. Since a large amount of image information needs to be transmitted quickly between the processor 6 and the display module 2, reducing the wiring distance between the processor 6 and the display module 2 helps improve the signal transmission quality between the processor 6 and the display module 2. In addition, the distance from the signal interface 13 to the third edge E3 is smaller than the distance from the microprocessor to the third edge E3, and the distance from the signal interface 13 to the second edge E2 is smaller than the distance from the processor 6 to the second edge E2, that is, the signal interface 13 is arranged at a position close to the edge of the main body 321, which is conducive to the electrical connection between the signal interface 13 and the system main control board.

[0100] In some embodiments, resistors, capacitors and other devices (not shown) are also provided on the flexible circuit board 3, and some of these devices are located on the side of the processor 6 close to the second edge E2. In this case, as shown in Figure 6, the buffer 9 can be set on the side of the processor 6 close to the fourth edge E4 to improve the compactness of the device arrangement and reduce the wiring distance between the buffer 9 and the processor 6, thereby improving the transmission reliability.

[0101] In some embodiments, as shown in FIG6 , the display device further includes a photosensor 12 , wherein the photosensor 12 is disposed on the strip-shaped branch structure 322 , and the photosensor 12 and the conductive portion 10 are disposed on different strip-shaped branch structures 322 , and the photosensor 12 and the display module 2 do not overlap in the thickness direction of the display module 2 . The photosensor 12 is located on a side of the first insulating layer 3 a away from the second insulating layer 3 b .

[0102] Among them, the photosensor 12 is electrically connected to the signal interface 13. The photosensor 12 is used to generate a corresponding electrical signal based on the sensed light, and transmit the electrical signal to the system main control board through the signal interface 13, so that the system main control board controls the display mode of the display module 2 according to the electrical signal generated by the photosensor 12.

[0103] For example, when the ambient light is dark, the voltage of the electrical signal generated by the photosensor 12 is low, and the system main control board sends a third control instruction to the processor 6 according to the lower electrical signal, and the processor 6 adjusts the image information to be displayed according to the third control instruction to reduce the display brightness of the display module 2; when the ambient light is bright, the voltage of the electrical signal generated by the photosensor 12 is high, and the system main control board sends a fourth control instruction to the processor 6 according to the higher electrical signal, and the processor 6 adjusts the image to be displayed according to the fourth control instruction to increase the display brightness of the display module 2.

[0104] It should be noted that, in other embodiments, the signal generated by the photosensor 12 may also be directly sent to the processor 6 , and the processor 6 may adjust the image of the display module 2 directly according to the signal from the photosensor 6 .

[0105] The present disclosure also provides an electronic device, such as a small household appliance such as a refrigerator, a washing machine, a robot vacuum, a floor scrubber, a cooking machine, or an air purifier. The electronic device includes the aforementioned display device and a housing, wherein the housing includes a main housing and a transparent cover connected to the main housing. The main housing and the transparent cover define a receiving cavity, and the display device is disposed in the receiving cavity.

[0106] Figure 8 is a partial structural schematic diagram of an electronic device provided in some embodiments of the present disclosure, wherein the main housing portion may include multiple walls, for example, a bottom wall, a top wall, and multiple side walls. A first light-transmitting window is provided on one of the walls (for example, the top wall), and the transparent cover portion is located at the first light-transmitting window. Figure 8 only shows one wall 17 of the main housing, a transparent cover 171 provided on the wall 17, and a display device. As shown in Figure 8, the display module 2 of the display device is arranged relative to the transparent cover 171. The so-called "display module 2 and transparent cover 171" are arranged relative to each other, which means that at least a part of the display area of ​​the display module 2 is opposite to the transparent cover 171, so that the user can see the image displayed by the display module 2 through the transparent cover 171. The transparent cover 171 can be a glass cover or a cover made of an organic material such as polyimide.

[0107] The display module 2 of the display device is bonded to the transparent cover plate 171, thereby securing the display device within the main housing. Compared to fasteners such as screws, this bonding method facilitates assembly of the display device and the housing. The entire surface of the display module 2 facing the transparent cover plate 171 can be bonded to the transparent cover plate 171, thereby improving connection stability. It is understood that the display module 2 and the transparent cover plate 171 are bonded using a transparent bonding structure.

[0108] The main housing may also be provided with a second light-transmitting window 173, and the light sensor 12 is arranged opposite to the second light-transmitting window 173 to facilitate sensing of external ambient light. A transparent protective layer may or may not be provided at the position of the second light-transmitting window 173.

[0109] In some embodiments, the branch head 322a of each strip-like branch structure 322 can also be connected to the housing. For example, adhesive tape can be used to bond the surface of the branch head 322a away from the transparent cover 171 to the housing, so that the strip-like branch structure 322 swings up and down due to gravity, thereby ensuring the stability of the conductive part 10 relative to the housing and the stability of the photosensor relative to the housing.

[0110] As shown in FIG8 , the main housing has a preset touch area 172, wherein each touch area 172 corresponds to a conductive portion 10, and each touch area 172 is arranged relative to a corresponding conductive portion 10. In actual application, a specific marking pattern or a special pattern such as a depression can be formed on the touch area, so that the user can clearly identify the touch location. When a human hand touches the touch area 172 from the outside, the finger forms a first capacitance with the conductive portion 10, thereby allowing the touch chip to determine that a touch has occurred. The specific detection principle has been described above and will not be repeated here.

[0111] In some embodiments, as shown in FIG8 , a portion 18 of the main housing can have a transparent layer + light-shielding layer structure. The light-shielding layer can be ink coated on the transparent layer, and the transparent layer can be integrated with the transparent cover. One of the touch areas 172 can be located on the "transparent layer + light-shielding layer" structure. In this case, when a finger touches the touch area 172, the finger and the conductive portion 10 form a first capacitor, and the transparent layer and light-shielding layer can serve as the dielectric layer of the first capacitor.

[0112] In some embodiments, the electronic device further includes a system main control board (not shown), which is electrically connected to the signal interface 13 on the flexible circuit board 3. The system main control board can be fixed to the wall of the housing by bonding or by fasteners such as screws, which is not specifically limited in this disclosure.

[0113] It should be noted that the description of the numerical range of m1 to m2 in the above embodiments includes the endpoint values ​​m1 and m2.

[0114] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display device, comprising: Display module; A flexible circuit board, the flexible circuit board comprising: a bending portion and a device mounting portion connected as one body, the bending portion being electrically connected to the display module, the device mounting portion being located on a non-display side of the display module and overlapping with the display module in a thickness direction of the display module; A processor is integrated on the device mounting portion and is used to provide a display signal for the display module.

2. The display device according to claim 1, wherein: An overlapping area between the device mounting portion and the display module is greater than 1 / 3 of an area of ​​the display module.

3. The display device according to claim 1, wherein: The device mounting portion is bonded to the display module via a bonding portion.

4. The display device according to claim 1, wherein: The device mounting portion is provided with a signal interface for electrically connecting to the system main control board. The processor is electrically connected to the signal interface, and is specifically used to provide a display signal to the display module according to a control instruction provided by the system main control board.

5. The display device according to claim 4, wherein: The display device further includes: A conductive part and a touch chip, wherein the touch chip is electrically connected to the conductive part and the signal interface, and is used to send a driving signal to the conductive part, and to determine whether a touch occurs according to a change in the electrical signal on the conductive part, and to send a touch feedback signal to the system main control board; Wherein, the conductive part and the display module do not overlap in the thickness direction of the display module.

6. The display device according to claim 5, wherein: The device mounting portion comprises: a main body portion connected to the bending portion, and at least one strip-shaped branch structure arranged at an edge of the main body portion, wherein the edge of the main body portion comprises: a first edge and a second edge, wherein the extension directions of the first edge and the second edge intersect, the length of the second edge is smaller than the length of the first edge, and the width of the strip-shaped branch structure is smaller than the length of the second edge; Wherein, the processor is arranged on the main body, and the conductive part is arranged on the strip-shaped branch structure.

7. The display device according to claim 6, wherein: The width of the strip-shaped branch structure is less than 1 / 4 of the length of the second edge.

8. The display device according to claim 6, wherein: The touch chip is arranged on the strip-shaped branch structure.

9. The display device according to claim 5, wherein: The area of ​​the conductive part is between 150 and 530 square millimeters.

10. The display device according to claim 6, wherein: The display device further includes: A photosensitive sensor is arranged on the strip-shaped branch structure; wherein the photosensitive sensor and the conductive part are arranged on different strip-shaped branch structures, and the photosensitive sensor and the display module do not overlap in the thickness direction of the display module; The photosensitive sensor is electrically connected to the signal interface, and is used to generate an electrical signal according to the received light, and send the electrical signal to the system main control board through the signal interface.

11. The display device according to claim 4, wherein: The flexible circuit board comprises: a first insulating layer; A plurality of signal traces are arranged on the first insulating layer; A second insulating layer, located on a side of the plurality of signal traces away from the first insulating layer; Wherein, the processor is arranged on a side of the second insulating layer away from the first insulating layer, and is electrically connected to the signal trace through a via hole on the second insulating layer; The conductive part is arranged in the same layer as the signal wiring and is electrically connected to the touch chip through the signal wiring; the first insulating layer covers at least a portion of the signal wiring and has no overlap with the conductive part in the thickness direction of the display module.

12. The display device according to any one of claims 3 to 11, wherein: The device mounting portion includes a main body portion, the main body portion includes a first edge and a third edge that are relatively arranged, the first edge is connected to the bending portion, the processor is arranged on the main body portion, and the distance from the processor to the first edge is smaller than the distance from the processor to the third edge; the distance from the signal interface to the third edge is smaller than the distance from the microprocessor to the third edge.

13. The display device according to any one of claims 1 to 12, wherein: The display device further includes a heat sink, which is disposed on a side of the device mounting portion away from the processor, and an orthographic projection of the heat sink on the device mounting portion overlaps with an orthographic projection of the processor on the device mounting portion.

14. The display device according to any one of claims 1 to 13, wherein: The thickness of the flexible circuit board is between 0.1 mm and 0.3 mm.

15. The display device according to any one of claims 1 to 14, wherein: In the display device, the total thickness of other structures except the display module is less than or equal to 2.8 mm.

16. An electronic device, wherein: include: The display device according to any one of claims 1 to 15; The housing comprises a main housing and a transparent cover connected to the main housing, wherein the main housing and the transparent cover define a receiving cavity; Wherein, the display device is fixedly arranged in the accommodating cavity, and the display module is arranged opposite to the transparent cover plate.

17. The electronic device according to claim 16, wherein: The display module is bonded to the transparent cover plate portion.

18. The electronic device according to claim 17, wherein: The display device further includes: a photosensor, wherein the photosensor and the display module have no overlap in the thickness direction of the display module; a light-transmitting window is also provided on the main housing, and the photosensor is arranged opposite to the light-transmitting window.

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