Connection structure and electronic device

Abstract

A connection structure and an electronic device. The electronic device (200) at least comprises a middle frame (220), a metal structural member (110), and a fixing member (120); a first through hole (111) is formed in the metal structural member, a second through hole (2201) is formed in the middle frame, and the fixing member passes through the first through hole and the second through hole; at least one through groove (112) is formed on the metal structural member, the surface of the through groove facing away from the middle frame is recessed, and the through groove extends to at least one outer edge of the metal structural member; and the surface of the through groove facing the middle frame protrudes. In this way, the formation of a gap between the metal structural member and the middle frame can be avoided in a scenario such as falling, such that the problem of poor overall performance of an electronic device caused by poor contact between the metal structural member and the middle frame can be avoided.

Description

Connection structure and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 29, 2022, with application number 202211511521.4 and application name “Connection Structure and Electronic Device”, and claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 24, 2023, with application number 202310204554.2 and application name “Connection Structure and Electronic Device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of terminal technology, and in particular to a connection structure and an electronic device. Background Art

[0003] At present, mobile phones, computers and other electronic devices have become inseparable from our lives. They can be seen everywhere in our lives and have greatly improved people's living standards.

[0004] To achieve the functions required by users, electrical connections are generally required within electronic devices through structural design matching. For example, the Near Field Communication (NFC) coil module uses a spring-loaded connection to the circuit board, the antenna functional spring on the circuit board uses metal riveting to achieve electrical connection to the middle frame, and the display uses metal sheet welding and conductive foam to achieve electrical connection to the middle frame. Among many electrical connection solutions, using screws to achieve electrical connection between multiple structural components is a common method.

[0005] However, when users use electronic devices, gaps can easily form between structural components and circuit boards due to drops and other scenarios, leading to poor contact between the structural components and the circuit boards or between the circuit boards and the middle frame, thus causing poor performance of the electronic devices.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a connection structure and an electronic device that can avoid gaps between metal structural parts and circuit boards in scenarios such as falling, thereby avoiding poor contact between metal structural parts and circuit boards or between circuit boards and middle frames, which can cause poor overall performance.

[0008] In a first aspect, an embodiment of the present application provides an electronic device, which includes at least a middle frame, a metal structural member and a fixing member; the metal structural member has a first through hole, the middle frame has a second through hole, and the fixing member passes through the first through hole and the second through hole; the metal structural member is provided with at least one through groove, the through groove is recessed on a side away from the middle frame, and the through groove extends to at least one outer edge of the metal structural member; and the through groove protrudes toward a side of the middle frame.

[0009] The electronic device provided in the embodiment of the present application can fix the metal structural part and the middle frame with the fixing part by passing the fixing part through the first through hole on the metal structural part and the second through hole on the middle frame. In addition, at least one through groove is provided on the metal structural part, the through groove is recessed on a side facing away from the middle frame, extends to at least one outer edge of the metal structural part, and protrudes toward a side of the middle frame. In this way, the through groove can squeeze the middle frame to absorb the gap between the metal structural part and the middle frame, thereby avoiding the presence of a gap between the metal structural part and the middle frame in scenarios such as falling, and further avoiding the problem of poor contact between the metal structural part and the middle frame, which causes poor overall performance of the electronic device.

[0010] In one possible implementation, the through-grooves are formed using a stamping process. Stamping processes have the advantages of high production efficiency and low material consumption. Therefore, forming through-grooves on metal structural components using stamping not only improves the efficiency of through-grooving but also fully utilizes the metal structural components, avoiding cost waste. Furthermore, stamping processes offer high dimensional accuracy and excellent processing stability.

[0011] In one possible implementation, the through-groove is disposed adjacent to the first through-hole. By disposing the through-groove adjacent to the first through-hole, since the through-groove protrudes toward one side of the middle frame, the closer the through-groove is to the first through-hole, the better the squeezing effect of the bottom of the through-groove on the middle frame. This can better absorb the gap between the metal structural member and the middle frame, thereby more effectively preventing the problem of gaps between the metal structural member and the middle frame in scenarios such as drops.

[0012] In a possible implementation, the contact surface between the through slot and the middle frame is in the shape of a rectangle or a square ring.

[0013] In one possible implementation, the metal structural member is further provided with at least one convex bump. This convex bump structure can effectively improve the impedance of the contact interface between the metal structural member and the middle frame. Specifically, the addition of the convex bump can transform the surface contact between the metal structural member and the middle frame into point contact, thereby increasing the pressure at the contact point, destroying the interface with the non-performing conductor, increasing the nominal contact area, and reducing the impedance. Therefore, by adding the convex bump to the through-groove provided on the metal structural member, a more stable electrical connection can be formed between the metal structural member and the middle frame.

[0014] In a possible implementation, the convex hull protrudes toward a surface of the middle frame, and a surface of the convex hull facing away from the middle frame is a plane.

[0015] In one possible implementation, the convex bulge is disposed adjacent to the first through-hole. By disposing the convex bulge adjacent to the first through-hole, since the convex bulge protrudes toward one side of the middle frame, the convex bulge can effectively improve the impedance of the contact interface between the metal structural member and the middle frame. The closer the convex bulge is to the first through-hole, the better the squeezing effect of the convex bulge on the middle frame. This can better absorb the gap between the metal structural member and the middle frame, thereby largely avoiding the problem of gaps between the metal structural member and the middle frame in scenarios such as falling, thereby forming a more stable electrical connection between the metal structural member and the middle frame.

[0016] In a possible implementation, the contact surface between the convex hull and the middle frame is circular or annular.

[0017] In one possible implementation, one end of the metal structural member has a bent edge; the through-groove extends in a direction parallel to the length of the bent edge. By designing the through-groove to extend in a direction parallel to the length of the bent edge, the bent edge of the metal structural member is not damaged during the fabrication of the through-groove. Furthermore, since the through-groove extends in a direction parallel to the length of the bent edge, the bent edge of the metal structural member does not interfere with the fabrication process of the through-groove, thereby preventing the presence of the bent edge from affecting the stability and reliability of the fabrication process.

[0018] In one possible implementation, the metal structural member has a notch, and the notch communicates with the first through-hole, thereby forming at least one elastic arm on the metal structural member. Providing the notch in the metal structural member allows the metal structural member to achieve a disconnected design. Since the metal structural member has the first through-hole and the notch communicates with the first through-hole, at least one end of the metal structural member is suspended in the air. This suspended end has a certain degree of elasticity, thereby ensuring the formation of at least one elastic arm on the metal structural member.

[0019] In one possible implementation, the metal structural member is formed with an elastic arm; the through-groove is located on the elastic arm; or, the through-groove is located in an area of ​​the metal structural member outside the elastic arm. When the through-groove is provided on the metal structural member, regardless of whether the through-groove is provided on the elastic arm or in an area of ​​the metal structural member outside the elastic arm, as long as the through-groove faces the middle frame and is convex, the bottom of the through-groove can squeeze the middle frame, thereby effectively absorbing the gap between the metal structural member and the middle frame, thereby largely avoiding the problem of a gap between the metal structural member and the middle frame in scenarios such as falling.

[0020] In one possible implementation, the metal structure includes a first portion having a first end and a second end opposite to each other, the second end serving as the elastic arm. In this case, the metal structure having one elastic arm forms a two-claw metal structure.

[0021] In one possible implementation, the metal structure further includes a second portion; one end of the second portion is connected to the first end of the first portion. In this case, one end of the second portion is connected to the first end of the first portion, and the metal structure having one elastic arm forms a three-claw metal structure.

[0022] In one possible implementation, the metal structure further includes a third portion; the other end of the second portion is connected to the third portion. In this case, one end of the second portion is connected to the first end of the first portion, and the other end of the second portion is connected to one end of the third portion. The metal structure with one elastic arm forms a four-claw metal structure.

[0023] In one possible implementation, the electronic device further includes: a circuit board; the circuit board is located between the metal structural member and the middle frame; the at least one through-groove is located on a side of the metal structural member facing away from the circuit board, and the through-groove protrudes toward a side of the circuit board.

[0024] When there is a circuit board between the metal structural part and the middle frame, at least one through groove is provided on the metal structural part, and the through groove is also located on the side of the metal structural part facing away from the circuit board. At this time, the through groove protrudes toward the side of the circuit board, and the bottom of the through groove can squeeze the circuit board to absorb the gap between the metal structural part and the circuit board, thereby avoiding the existence of a gap between the metal structural part and the circuit board in scenarios such as falling, and further avoiding poor contact between the metal structural part and the circuit board or between the circuit board and the middle frame, which causes the problem of poor overall performance of the electronic device.

[0025] In a second aspect, an embodiment of the present application provides a connection structure for use in an electronic device, the electronic device comprising a middle frame and a metal structural member, the metal structural member having a first connection portion, and the middle frame having a second connection portion; the connection structure comprising at least: the first connection portion, the second connection portion, and a fixing member; the first connection portion having a first through hole, the second connection portion having a second through hole, the fixing member passing through the first through hole and the second through hole;

[0026] At least one through groove is provided on the first connecting portion, wherein the through groove is recessed on a side away from the second connecting portion and extends to at least one outer edge of the first connecting portion; and the through groove protrudes toward a side of the second connecting portion.

[0027] The connection structure provided in the embodiment of the present application includes a first connection part of a metal structural member, a second connection part of a middle frame and a fixing member. By passing the fixing member through the first through hole on the first connection part and the second through hole on the second connection part, the fixing member can fix the first connection part and the second connection part to fix the metal structural member and the middle frame. In addition, at least one through groove is provided on the first connection part of the metal structural member, the through groove is recessed on a side away from the second connection part of the middle frame, and protrudes on a side toward the second connection part of the middle frame. The bottom of the through groove can squeeze the middle frame to absorb the gap between the metal structural member and the middle frame, thereby avoiding the presence of a gap between the metal structural member and the middle frame in scenarios such as falling, and further avoiding poor contact between the metal structural member and the middle frame, which causes the problem of poor overall performance of the electronic device.

[0028] In one possible implementation, the through-grooves are formed using a stamping process. Stamping processes have the advantages of high production efficiency and low material consumption. Therefore, forming through-grooves on metal structural components using stamping not only improves the efficiency of through-grooving but also fully utilizes the metal structural components, avoiding cost waste. Furthermore, stamping processes offer high dimensional accuracy and excellent processing stability.

[0029] In one possible implementation, the through-groove is disposed adjacent to the first through-hole. By disposing the through-groove adjacent to the first through-hole, since the through-groove protrudes toward one side of the middle frame, the closer the through-groove is to the first through-hole, the better the squeezing effect of the bottom of the through-groove on the middle frame. This can better absorb the gap between the metal structural member and the middle frame, thereby more effectively preventing the problem of gaps between the metal structural member and the middle frame in scenarios such as drops.

[0030] In one possible implementation, the first connection portion is further provided with at least one convex bump. This convex bump structure can effectively improve the impedance of the contact interface between the metal structural member and the middle frame. Specifically, the addition of the convex bump can transform the surface contact between the metal structural member and the middle frame into point contact, thereby increasing the pressure at the contact point, destroying the interface of the non-performing conductor, increasing the nominal contact area, and reducing the impedance. Therefore, by adding the convex bump to the through-groove provided on the metal structural member, a more stable electrical connection can be formed between the metal structural member and the middle frame.

[0031] In a possible implementation, a side of the convex hull facing the second connecting portion is convex, and a side of the convex hull facing away from the second connecting portion is a plane.

[0032] In one possible implementation, the convex bulge is disposed adjacent to the first through-hole. Because the convex bulge protrudes toward one side of the middle frame, it can effectively improve the impedance of the contact interface between the metal structural member and the middle frame. The closer the convex bulge is to the first through-hole, the better the squeezing effect of the convex bulge on the middle frame. This can better absorb the gap between the metal structural member and the middle frame, thereby largely preventing the problem of gaps between the metal structural member and the middle frame in scenarios such as drops, thereby forming a more stable electrical connection between the metal structural member and the middle frame.

[0033] In one possible implementation, one end of the first connecting portion has a bent edge; the through-groove extends in a direction parallel to the length of the bent edge. By designing the through-groove to extend in a direction parallel to the length of the bent edge, the bent edge of the metal structural component is not damaged during fabrication of the through-groove. Furthermore, since the through-groove extends in a direction parallel to the length of the bent edge, the bent edge of the metal structural component does not interfere with the fabrication process of the through-groove, thereby preventing the presence of the bent edge from affecting the stability and reliability of the fabrication process.

[0034] In one possible implementation, the first connecting portion has a notch, and the notch is connected to the first through-hole, so that at least one elastic arm is formed on the first connecting portion; the through-groove is located on the elastic arm; or the through-groove is located in an area outside the elastic arm on the first connecting portion. By providing the notch on the first connecting portion of the metal structural member, a disconnected design is achieved for the first connecting portion. Since the first connecting portion has the first through-hole and the notch is connected to the first through-hole, at least one end of the first connecting portion is suspended, and the suspended end has a certain degree of elasticity, thereby ensuring that at least one elastic arm is formed on the first connecting portion.

[0035] In addition, when a through groove is provided on the first connecting portion, no matter whether the through groove is provided on the elastic arm or in an area on the metal structure other than the elastic arm, as long as the side of the through groove facing the middle frame is convex, the bottom of the through groove can squeeze the middle frame, thereby being able to well absorb the gap between the metal structure and the middle frame, thereby being able to largely avoid the problem of a gap between the metal structure and the middle frame in scenarios such as falling. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG1 is a schematic diagram of the three-dimensional structure of an electronic device provided in one embodiment of the present application;

[0037] FIG2 is a schematic diagram of a planar structure of an electronic device provided in one embodiment of the present application;

[0038] FIG3 is a cross-sectional schematic diagram of a connection structure in an electronic device in the prior art;

[0039] FIG4 is another cross-sectional schematic diagram of a connection structure in an electronic device in the prior art;

[0040] FIG5 is another cross-sectional schematic diagram of a connection structure in an electronic device in the prior art;

[0041] FIG6 is another cross-sectional schematic diagram of a connection structure in an electronic device in the prior art;

[0042] FIG7 is a cross-sectional schematic diagram of a connection structure in an electronic device provided in an embodiment of the present application;

[0043] FIG8 is a cross-sectional schematic diagram of a connection structure in an electronic device provided in an embodiment of the present application;

[0044] FIG9 is a schematic diagram of a three-dimensional structure of a connection structure in an electronic device provided in an embodiment of the present application;

[0045] FIG10 is an exploded view of FIG9 ;

[0046] FIG11 is a schematic diagram of a three-dimensional structure of a connection structure in an electronic device provided in one embodiment of the present application;

[0047] FIG12 is a schematic diagram of the front three-dimensional structure of a connecting portion in the connecting structure shown in FIG11;

[0048] FIG13 is a schematic diagram of the back three-dimensional structure of a connecting portion in the connecting structure shown in FIG11 ;

[0049] FIG14 is a schematic diagram showing the principle of the connection structure provided by one embodiment of the present application in contact with the middle frame or the circuit board;

[0050] FIG15 is a schematic diagram of the structure of the connection structure provided by one embodiment of the present application when the convex bump contacts the middle frame or the circuit board;

[0051] FIG16 is a schematic structural diagram of a connection structure provided in an embodiment of the present application wherein a through slot contacts a middle frame or a circuit board;

[0052] FIG17 is a schematic structural diagram of the connection structure provided by one embodiment of the present application when the convex bump contacts the middle frame or the circuit board;

[0053] FIG18 is a schematic structural diagram of the connection structure provided by one embodiment of the present application when the convex bump contacts the middle frame or the circuit board;

[0054] FIG19 is a schematic structural diagram of the connection structure provided by one embodiment of the present application when the through slot contacts the middle frame or the circuit board;

[0055] FIG20 is a schematic structural diagram of the connection structure provided by one embodiment of the present application when the through slot contacts the middle frame or the circuit board;

[0056] FIG21 is a front perspective structural diagram of another connecting portion in the connecting structure shown in FIG11 ;

[0057] FIG22 is a schematic diagram of the back three-dimensional structure of another connecting portion in the connecting structure shown in FIG11;

[0058] FIG23 is a schematic diagram of a three-dimensional structure of a connection structure in an electronic device provided in an embodiment of the present application;

[0059] FIG24 is a front perspective structural diagram of a connecting portion of the connecting structure shown in FIG23 ;

[0060] FIG25 is a schematic diagram of the back three-dimensional structure of a connecting portion in the connecting structure shown in FIG23;

[0061] FIG26 is a schematic diagram of a three-dimensional structure of a connection structure in an electronic device provided in an embodiment of the present application;

[0062] FIG27 is a front perspective structural diagram of a connecting portion of the connecting structure shown in FIG26 ;

[0063] FIG28 is a schematic diagram of the back three-dimensional structure of a connecting portion in the connecting structure shown in FIG26 ;

[0064] FIG29 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a two-claw structure and the through groove is located on the elastic arm;

[0065] FIG30 is a schematic side perspective view of a connection structure provided by an embodiment of the present application in which the connecting portion has a two-claw structure and the through groove is located on the elastic arm;

[0066] FIG31 is a schematic diagram of the back three-dimensional structure of a connection structure provided by an embodiment of the present application in which the connection portion has a two-claw structure and the through groove is located on the elastic arm;

[0067] FIG32 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a two-claw structure and the through groove is located outside the elastic arm;

[0068] FIG33 is a schematic diagram of the back three-dimensional structure of a connection structure provided by an embodiment of the present application in which the connection portion has a two-claw structure and the through groove is located outside the elastic arm;

[0069] FIG34 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a three-claw structure and the through groove is located on the elastic arm;

[0070] FIG35 is a schematic diagram of the back three-dimensional structure of a connection structure provided by an embodiment of the present application in which the connection portion has a three-claw structure and the through groove is located on the elastic arm;

[0071] FIG36 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a three-claw structure and the through groove is located outside the elastic arm;

[0072] FIG37 is a schematic diagram of the back three-dimensional structure of the connection structure provided by one embodiment of the present application, in which the connection portion has a three-claw structure and the through groove is located outside the elastic arm;

[0073] FIG38 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a four-claw structure and the through groove is located on the elastic arm;

[0074] FIG39 is a schematic diagram of the back three-dimensional structure of a connection structure provided by an embodiment of the present application in which the connection portion has a four-claw structure and the through groove is located on the elastic arm;

[0075] FIG40 is a front perspective structural diagram of a connection structure provided by an embodiment of the present application in which the connection portion has a four-claw structure and the through groove is located outside the elastic arm;

[0076] Figure 41 is a schematic diagram of the back three-dimensional structure of the connection structure provided by an embodiment of the present application when the connecting portion is a four-claw structure and the through groove is located outside the elastic arm.

[0077] DESCRIPTION OF NUMERALS AND SIGNS: 100 - connection structure; 110 - metal structural member; 110a - first connection portion; 110b - main body; 111 - first through hole; 112 - through groove; 1121 - groove surface of through groove; 1122 - groove bottom of through groove; 112a - first through groove; 1121a - groove surface of first through groove; 1122a - groove bottom of first through groove; 112b - second through groove; 1121b - groove surface of second through groove; 1122b - groove bottom of second through groove; 112c - third through groove; 1121c - groove surface of third through groove; 1122c - groove bottom of third through groove; 112d - fourth through groove; 1121d - groove surface of fourth through groove; 1122d - bottom of the fourth through-groove; 113 - bent edge; 114 - notch; 115 - elastic arm; 1101 - first portion; 1101a - first end of the first portion; 1101b - second end of the first portion; 1102 - second portion; 1102a - first end of the second portion; 1102b - second end of the second portion; 1103 - third portion; 1103a - first end of the third portion; 1103b - second end of the third portion; 116 - convex hull; 1161 - first surface of the convex hull; 1162 - second surface of the convex hull; 120 - fixing member; 130 - plastic structural member; 200 - electronic device; 210 - display screen; 220 - middle frame; 221 - middle plate; 222 - frame; 2201 - second through hole; 2201a - second connecting portion; 230 - circuit board; 2301 - third through hole; 240 - battery; 250 - USB port; 260 - card tray; 270 - motor; L1 - extension direction of the through slot; L2 - length direction of the bent edge; S1 - first plane; S2 - second plane. DETAILED DESCRIPTION

[0078] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0079] Mobile phones, computers and other electronic devices have become inseparable from our lives. They can be seen everywhere in our lives and have greatly improved people's living standards.

[0080] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker / headphone, or a mobile or fixed terminal with a connection structure or requiring an electrical connection, such as a vehicle-mounted front-end device, a driving recorder, and a security device.

[0081] Take a mobile phone as an example of the above-mentioned electronic device for illustration. The mobile phone provided in the embodiment of the present application can be a curved screen mobile phone or a flat screen mobile phone. In the embodiment of the present application, a flat screen mobile phone is taken as an example for illustration. Figures 1 and 2 respectively show the overall three-dimensional structure and planar structure of the electronic device. As shown in Figures 1 and 2, the electronic device 200 provided in the embodiment of the present application may include at least: a display screen 210, a middle frame 220, a circuit board 230, a battery 240 and a back cover (not shown in the figure), wherein the middle frame 220, the circuit board 230 and the battery 240 are located between the display screen 210 and the back cover, wherein the battery 240 generally may have a battery 240 interface (not shown in the figure), and the battery 240 interface is electrically connected to the circuit board 230.

[0082] The circuit board 230 may be disposed on the middle frame 220. For example, the circuit board 230 may be disposed on the side of the middle frame 220 facing the back cover, or the circuit board 230 may also be disposed on the side of the middle frame 220 facing the display screen 210. Similarly, the battery 240 may be disposed on the side of the middle frame 220 facing the back cover, or the battery 240 may also be disposed on the side of the middle frame 220 facing the display screen 210. For example, the side of the middle frame 220 facing the back cover may have a battery 240 compartment (not shown in the figure), and the battery 240 may be installed in the battery 240 compartment.

[0083] The battery 240 can be connected to the charging management module and the circuit board 230 through a power management module. The power management module receives input from the battery 240 and / or the charging management module and provides power to the processor, internal memory, external memory, display screen 210, camera module, and communication module. The power management module can also be used to monitor parameters such as the capacity of the battery 240, the number of cycles of the battery 240, and the health status of the battery 240 (leakage, impedance). In some other embodiments, the power management module can also be set in the processor of the circuit board 230. In other embodiments, the power management module and the charging management module can also be set in the same device.

[0084] When the electronic device 200 is a flat screen electronic device 200, the display screen 210 can be an organic light-emitting diode (OLED) display screen 210 or a liquid crystal display (LCD) display screen 210. When the electronic device 200 is a curved screen electronic device 200, the display screen 210 can be an OLED display screen 210.

[0085] Continuing with Figure 2 , the middle frame 220 may include a middle plate 221 and a frame 222. The frame 222 may be disposed around the perimeter of the middle plate 221. Generally, the frame 222 may include a top edge, a bottom edge, a left edge, and a right edge, which together form a square ring-shaped frame 222. The materials of the middle plate 221 may include, but are not limited to, aluminum plate, aluminum alloy, stainless steel, steel-aluminum composite die-cast plate, titanium alloy, or magnesium alloy. For example, in some embodiments, the middle plate 221 may also be made of plastic. Specifically, the middle frame 220 is a relatively complex structure in actual product design. It can generally be spatially divided into a perimeter frame 222 and a central area (main plate 221) that accommodates the motherboard, sub-boards, or battery 240. Therefore, the material distribution of the middle frame 220 may not be complete. For example, the battery compartment is typically made of metal, but it can also be made of plastic, depending on other factors.

[0086] The frame 222 can be a metal frame 222, a plastic frame 222, a ceramic frame 222, or a glass frame 222. When the frame 222 is a metal frame 222, the material of the metal frame 222 can include, but is not limited to, aluminum alloy, stainless steel, steel-aluminum composite die-cast plate, or titanium alloy. The middle plate 221 and the frame 222 can be snap-fitted, welded, bonded, or integrally formed, or they can be fixedly connected by injection molding.

[0087] The back cover can be a metal back cover, a glass back cover, a plastic back cover, or a ceramic back cover. In the embodiment of the present application, the material of the back cover is not limited and is not limited to the above examples.

[0088] It should be noted that, in some examples, the back cover of the electronic device 200 can be connected to the frame 222 to form an integrally molded (Unibody) back cover. For example, the electronic device 200 may include: a display screen 210, a middle plate 221 and a battery cover. The battery cover can be a back cover formed by integrally molding (Unibody) the frame 222 and the back cover, so that the circuit board 230 and the battery 240 are located in the space surrounded by the middle plate 221 and the battery cover.

[0089] In an embodiment of the present application, as shown in Figure 2, the electronic device 200 may also include: a USB interface 250, a card tray 260 and a motor 270. Moreover, the USB interface 250, the card tray 260 and the motor 270 are generally arranged at the bottom of the electronic device 200, that is, relatively close to the bottom edge of the frame 222.

[0090] It is understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device 200. In other embodiments of the present application, the electronic device 200 may include more or fewer components than shown, or may combine or separate certain components, or may have different component arrangements. For example, the electronic device 200 may also include devices such as cameras (e.g., front-facing cameras and rear-facing cameras) and flashlights.

[0091] Furthermore, to achieve the functions required by the user, electronic device 200 inevitably requires structural design matching within electronic device 200 to achieve electrical connections. For example, the Near Field Communication (NFC) coil module is connected to circuit board 230 using a spring clip, the antenna spring on circuit board 230 is connected to the middle frame 220 by riveting metal parts to the middle frame 220, and the display 210 is connected to the middle frame 220 using conductive foam and welded metal sheets.

[0092] In many electrical connection schemes, it is common to use screws to achieve electrical connection between multiple structural parts. For example, in Figure 3, the metal structural part 110 and the middle frame 220 are connected by a fixing part 120. Specifically, the metal structural part 110 has a first through hole 111, and the middle frame 220 has a second through hole 2201. The fixing part 120 passes through the first through hole 111 and the second through hole 2201 to fix the metal structural part 110 and the middle frame 220. In Figure 4, the metal structure 110, the middle frame 220, and the circuit board 230 are connected by a fixing member 120. Specifically, the metal structure 110 has a first through hole 111, the middle frame 220 has a second through hole 2201, and the circuit board 230 has a third through hole 2301. The fixing member 120 passes through the first through hole 111, the second through hole 2201, and the third through hole 2301 to fix the metal structure 110, the middle frame 220, and the circuit board 230. However, when a user uses the electronic device 200, a gap may easily form between the metal structure 110 and the circuit board 230 due to a drop or other scenario, resulting in poor contact between the metal structure 110 and the circuit board 230 or between the circuit board 230 and the middle frame 220, causing poor performance of the electronic device 200.

[0093] In the embodiment of the present application, the electrical connection location can generally be the circuit board 230 area, and specifically, the structural member, the circuit board 230 and the middle frame 220 can be locked together to achieve electrical connection. In this scenario, the structural member can be a metal structural member to enhance the contact between the structural member and the circuit board 230, or a gasket can be welded under the circuit board 230. In this case, the gasket acts as a metal structural member to enhance the contact between the gasket and the middle frame 220. Alternatively, in a non-board area (i.e., an area outside the circuit board 230), such as a speaker assembly area, there will be a situation where the speaker assembly and the middle frame 220 are locked. In most cases, the speaker assembly is a metal and plastic composite structure. Then the metal part acts as a metal structural member in the embodiment of the present application, which is equivalent to enhancing the connection reliability between the speaker assembly and the middle frame 220.

[0094] In the related art, to improve the reliability of electrical connections after reliability tests such as drops, a bump 116 (see Figures 5 and 6) is generally added between two contact surfaces (for example, between a metal structural member and the middle frame 220, or between a metal structural member and the circuit board 230) in actual design to absorb the floating height or gap between the contact interfaces when fixing parts (such as screws) are installed. Moreover, the structure of the bump 116 effectively improves the impedance of the contact interface, mainly by changing the surface contact to point contact, increasing the pressure at the contact point to destroy the non-good conductor interface, increase the nominal contact area, and reduce the impedance, thereby forming a more stable electrical connection.

[0095] However, for point-to-surface contact, considering the tolerances in the machining of the entire machine, it is necessary to ensure that the convex 116 has a complete contact surface. Generally, the height of the convex 116 is required to be 0.08±0.02mm, and the distance from the center of the convex 116 to the edge of the contact surface is more than 0.6mm on one side. Since it is in a combination scenario of a screw combined with the convex 116, it is difficult to form a complete convex 116 in some structures, such as when the structural parts are in a limited XY space (i.e., not in the thickness direction of the electronic device 200), and it is impossible to ensure that the convex 116 has a sufficient effective contact area. If sufficient contact area cannot be guaranteed, when the contact point enters the high-resistance area, it will cause uncontrollable electrical connection problems in the point-to-surface contact, and even present fatal RSE regulatory issues in the high-current area.

[0096] Based on this, the embodiments of the present application provide a new connection structure and an electronic device having the connection structure. The connection structure is applied to an electronic device, and the electronic device includes at least a middle frame, a metal structure, and a fixing member. The metal structure has a first through hole, the middle frame has a second through hole, and the fixing member passes through the first through hole and the second through hole to fix the metal structure and the middle frame. The metal structure is provided with at least one through groove, which is recessed on a side facing away from the middle frame and extends to at least one outer edge of the metal structure. The bottom of the through groove protrudes toward a side of the middle frame. In this way, a gap between the metal structure and the middle frame can be avoided in scenarios such as falling, thereby avoiding poor contact between the metal structure and the middle frame, which can cause poor overall performance of the electronic device.

[0097] The following describes the connection structure and the specific structure of the electronic device by taking a specific embodiment as an example and combining with the accompanying drawings.

[0098] 7 to 9 , an embodiment of the present application provides an electronic device 200, which may include at least a middle frame 220, a metal structural member 110, and a fixing member 120. As shown in FIG10 , the metal structural member 110 has a first through hole 111, and the middle frame 220 has a second through hole 2201. The fixing member 120 passes through the first through hole 111 and the second through hole 2201, thereby fixing the metal structural member 110 and the middle frame 220.

[0099] At least one through-groove 112 is provided on the metal structure 110 , wherein a side of the through-groove 112 facing away from the middle frame 220 is recessed, and a side of the through-groove 112 facing the middle frame 220 is protruding.

[0100] As shown in FIG. 7 or FIG. 8 , the through-groove 112 has a groove surface (i.e., the groove surface 1121 of the through-groove) and a groove bottom (i.e., the groove bottom 1122 of the through-groove). The groove surface 1121 of the through-groove is concave, while the groove bottom 1122 of the through-groove is convex. Specifically, taking the area of ​​the side of the metal structural member 110 facing away from the middle frame 220 excluding the through-groove 112 as a first plane S1, and the area of ​​the side of the metal structural member 110 facing the middle frame 220 excluding the through-groove 112 as a second plane S2, as an example, the groove surface 1121 of the through-groove is concave relative to the first plane S1, while the groove bottom 1122 of the through-groove is convex relative to the second plane S2.

[0101] It can be understood that in the embodiment of the present application, the through groove 112 can be extended to at least one outer edge of the metal structural part 110. For example, the through groove 112 can be extended to one outer edge of the metal structural part 110, or the through groove 112 can be extended to two outer edges of the metal structural part 110, or the through groove 112 can be extended to three outer edges of the metal structural part 110. The embodiment of the present application does not limit the specific opening position of the through groove 112.

[0102] In addition, the number of the through slots 112 may be one, two, three or more, which is not limited in the embodiment of the present application.

[0103] By passing the fixing part 120 through the first through hole 111 on the metal structural part 110 and the second through hole 2201 on the middle frame 220, the fixing part 120 can fix the metal structural part 110 and the middle frame 220. In addition, by providing at least one through groove 112 on the metal structural part 110, the groove bottom 1122 of the through groove protrudes toward one side of the middle frame 220, and the groove bottom 1122 of the through groove can squeeze the middle frame 220 to absorb the gap between the metal structural part 110 and the middle frame 220, thereby avoiding the presence of a gap between the metal structural part 110 and the middle frame 220 in scenarios such as falling, and further avoiding poor contact between the metal structural part 110 and the middle frame 220, which causes the problem of poor overall performance of the electronic device 200.

[0104] In some embodiments, the metal structure 110 may not have the first through hole 111, but may be replaced with a blind hole (not shown). In this case, the fixing member 120 passes through the second through hole 2201 on the middle frame, and one end of the fixing member 120 abuts against the inner wall of the blind hole to secure the metal structure 110 to the middle frame 220. It should also be noted that in order to achieve waste discharge and some spatial constraints of the electronic device 200, the middle frame 220 is generally provided with through holes (such as the second through hole 2201) instead of blind holes.

[0105] In the embodiment of the present application, the metal structure 110 may include a main body 110b and at least one first connection portion 110a. As shown in FIG11 , the metal structure 110 includes the main body 110b and three first connection portions 110a, each of which has a first through hole 111. The middle frame 220 may have a second connection portion 2201a, each of which has a second through hole 2201.

[0106] An embodiment of the present application also provides a connection structure 100, which is applied to an electronic device 200. The connection structure 100 includes at least: a first connection portion 110a of a metal structural member 110, a second connection portion 2201a of a middle frame 220, and a fixing member 120. The fixing member 120 passes through the first through hole 111 and the second through hole 2201 to fix the first connection portion 110a and the second connection portion 2201a, thereby achieving a fixed connection between the metal structural member 110 and the middle frame 220.

[0107] Specifically, in the connection structure 100, at least one through groove 112 is provided on the surface of the first connection part 110a facing away from the second connection part 2201a. The through groove 112 is recessed on the side facing away from the second connection part 2201a. The through groove 112 extends to at least one outer edge of the first connection part 110a. Moreover, the through groove 112 protrudes toward a side of the second connection part 2201a.

[0108] It should be noted that in the embodiment of the present application, when the electronic device 200 includes a circuit board 230, the circuit board 230 is generally located between the metal structural part 110 and the middle frame 220, wherein at least one through groove 112 is located on the side of the metal structural part 110 facing away from the circuit board 230, and the bottom 1122 of the through groove protrudes toward one side of the circuit board 230.

[0109] When there is a circuit board 230 between the metal structural part 110 and the middle frame 220, at least one through groove 112 is provided on the metal structural part 110, and the through groove 112 is also located on the side of the metal structural part 110 facing away from the circuit board 230. At this time, the groove bottom 1122 of the through groove protrudes toward the side of the circuit board 230. The groove bottom 1122 of the through groove can squeeze the circuit board 230 to absorb the gap between the metal structural part 110 and the circuit board 230, thereby avoiding the existence of a gap between the metal structural part 110 and the circuit board 230 in scenarios such as falling, and further avoiding poor contact between the metal structural part 110 and the circuit board 230 or between the circuit board 230 and the middle frame 220, which causes the problem of poor overall performance of the electronic device 200.

[0110] Specifically, as shown in FIG10 , the metal structure 110 has a first through hole 111, the middle frame 220 has a second through hole 2201, and the circuit board 230 has a third through hole 2301. The fixing member 120 passes through the first through hole 111, the second through hole 2201, and the third through hole 2301 to fix the metal structure 110, the middle frame 220, and the circuit board 230.

[0111] It is understood that in the embodiment of the present application, the through-groove 112 can be formed by a stamping process. The stamping process has the advantages of high production efficiency and low material consumption. Therefore, forming the through-groove 112 on the metal structural member 110 by stamping not only improves the efficiency of manufacturing the through-groove 112, but also fully utilizes the metal structural member 110, avoiding cost waste. In addition, the stamping process also has high dimensional accuracy and good processing stability.

[0112] At the spatial limit of the metal structural part 110, for example, when the periphery of the metal structural part 110 is designed to match other modules or structural parts, the design features will become complicated, and there may be bends at specific positions to cause height differences. In the embodiment of the present application, the through-groove 112 can better adapt to the structural features and has smaller spatial size requirements for the metal structural part 110. Therefore, the use of the through-groove 112 to replace the traditional convex hull 116 structure can reduce the size requirements of the XY space. In addition, when the through-groove 112 design is adopted, if the metal structural part 110 does not have a bent edge or the bent edge only involves one side of the metal structural part 110, effective contact between the metal structural part 110 and the middle frame 220 or between the metal structural part 110 and the circuit board 230 can be achieved by designing a symmetrical through-groove 112, and the processing difficulty of the through-groove 112 can also be reduced.

[0113] In the embodiment of the present application, as shown in Figures 12 and 13 , the through groove 112 may be a U-shaped groove. The processing difficulty of the U-shaped groove is relatively low, and the process of forming the U-shaped groove by stamping is relatively mature.

[0114] As shown in Figures 12 and 13, in the embodiment of the present application, the through-groove 112 can be provided adjacent to the first through-hole 111. The fixing member 120 needs to pass through the first through-hole 111 to achieve the connection between the metal structural member 110 and the middle frame 220. By providing the through-groove 112 at a position adjacent to the first through-hole 111, since the bottom 1122 of the through-groove protrudes toward one side of the middle frame 220, the closer the through-groove 112 is to the first through-hole 111, the better the squeezing effect of the bottom 1122 of the through-groove on the middle frame 220. This can better absorb the gap between the metal structural member 110 and the middle frame 220, thereby avoiding the problem of a gap between the structural member and the circuit board 230 in scenarios such as falling to a greater extent.

[0115] It should be noted that, in the embodiment of the present application, at least one convex bump 116 may be further provided on the metal structural member 110 (see FIG. 8 or FIG. 30 ).

[0116] In one possible implementation, the convex hull 116 is convex on one side facing the middle frame 220, and the side facing away from the middle frame 220 is flat. The convex hull 116 has a first surface (i.e., the first surface 1161 of the convex hull) and a second surface (i.e., the second surface 1162 of the convex hull). The first surface 1161 of the convex hull is convex, and the second surface 1162 of the convex hull is flat.

[0117] Specifically, as shown in Figure 8, taking the area on the side of the metal structural part 110 facing away from the middle frame 220 except the through groove 112 and the convex 116 as the first plane S1, and the area on the side of the metal structural part 110 facing the middle frame 220 except the through groove 112 and the convex 116 as the second plane S2 as an example, the first surface 1161 of the convex hull protrudes relative to the second plane S2, and the second surface 1162 of the convex hull is a plane, that is, the second surface 1162 of the convex hull is located on the same plane as the first plane S1.

[0118] By providing at least one convex hump 116 on the metal structural member 110, the convex hump 116 and the through-groove 112 can be arranged symmetrically, thus making the overall structural design of the metal structural member 110 as symmetrical as possible. Furthermore, the convex hump 116 structure can effectively improve the impedance of the contact interface between the metal structural member 110 and the middle frame 220. Specifically, the addition of the convex hump 116 can transform the surface contact between the metal structural member 110 and the middle frame 220 into point contact, thereby increasing the pressure at the contact point, destroying the non-good conductor interface, increasing the nominal contact area, and reducing the impedance. Therefore, by adding the convex hump 116 to the through-groove 112 on the side of the metal structural member 110 facing the middle frame 220, a more stable electrical connection can be formed between the metal structural member 110 and the middle frame 220.

[0119] Of course, it is understandable that in some embodiments, the metal structural member 110 may not be provided with the convex bump 116 (see FIG. 7 ). The embodiment of the present application is not limited to this, nor is it limited to the above example.

[0120] In the embodiment of the present application, the convex bump 116 can be provided adjacent to the first through hole 111. By providing the convex bump 116 adjacent to the first through hole 111, since the convex bump 116 protrudes toward one side of the middle frame 220, the convex bump 116 can effectively improve the impedance of the contact interface between the metal structural member 110 and the middle frame 220. The closer the convex bump 116 is to the first through hole 111, the better the squeezing effect of the convex bump 116 on the middle frame 220. This can better absorb the gap between the metal structural member 110 and the middle frame 220, thereby avoiding the problem of a gap between the structural member and the circuit board 230 in scenarios such as falling to a greater extent, thereby forming a more stable electrical connection between the metal structural member 110 and the middle frame 220.

[0121] Specifically, in practical application scenarios, the convex hull 116 and the through-groove 112 can be used in combination. The combination of the through-groove 112 and the convex hull 116 allows for more flexible application of spatial dimensions, ensuring contact balance as much as possible, increasing the number and area of ​​contact points, and reducing the risk of contact failure in reliability scenarios.

[0122] As shown in Figure 14, the design employs a combination of through-slots 112 and bumps 116. Each contact point is equivalent to adding a resistor in parallel, reducing the resistance exponentially, thereby further reducing system impedance. For example, in a Universal Serial Bus (USB) charging scenario, the impedance of a single bump 116 is approximately 200mΩ. To achieve optimal return impedance and improve charging efficiency, a typical battery pack of 240 requires an impedance of less than 40mΩ. Therefore, multiple points of parallel connection are required to further reduce system impedance.

[0123] Taking the electronic device 200 including the circuit board 230 as an example, to ensure that the metal structure 110 is in a balanced state relative to the circuit board 230 during assembly or use of the electronic device 200, the convex bumps 116 and through-grooves 112 need to be evenly arranged. Therefore, in locations with sufficient XY space, the convex bumps 116 or through-grooves 112 can be used to increase contact between the metal structure 110 and the circuit board 230. In locations with insufficient XY space, the through-grooves 112 can be used to increase contact between the metal structure 110 and the circuit board 230.

[0124] For example, in the embodiment of the present application, when the convex bump 116 and the through groove 112 protrude toward one side of the circuit board 230, they may protrude 0.05 mm relative to the second plane S2 of the metal structure 110, and the contact area of ​​the protrusion may be approximately 0.2 mm. 2 It should be noted that the embodiments of the present application do not limit the specific area, nor are they limited to the above examples.

[0125] In addition, the structures of the bulge 116 and the through groove 112 are compared here. The bulge 116 is generally a bulge of the ball head, and the nominal contact surface of the point contact of the bulge of the ball head is annular, and the length of the annular contact surface is consistent in all directions. If the diameter of the bulge of the ball head is made very large, the problem of contact failure can be solved to a certain extent, but because of the increase in the dimensions in all directions, more space will be lost. Even if an elliptical cross-sectional structure is used, it will not be able to effectively achieve the purpose of reducing the area because of the need to reserve a skirt (i.e., the edge position around the bulge of the ball head) and the original size limitation of the metal structural part 110. If the circumference of the bulge of the ball head is further reduced while the height remains unchanged, it will affect the structural strength of the metal structural part 110, causing the bulge 116 structure to fall off.

[0126] The nominal contact surface of the through-slot 112 is rectangular, which allows it to be longer in one direction without affecting the design dimensions of the other side. Furthermore, the through-slot 112 does not require a skirt (i.e., the through-slot 112 has no edges around it), further reducing the size of the metal structure 110.

[0127] As shown in Figures 15 and 16, a is the radius of the contact surface between the convex hull 116 and the middle frame 220, R is the radius of the convex hull 116, 2a' and L are the characteristic side lengths of the through-slot 112, respectively. When a high-frequency current passes through the wire, it can be considered that the current only flows in a very thin layer on the surface of the wire. The higher the frequency, the smaller the skin depth (δ). At the communication frequency of the electronic device 200, the skin depth is relatively small, satisfying a>δ, a'>δ. In the current application scenario, it can be roughly considered that δ = 0.002mm.

[0128] As shown in FIG17 , when a ≤ δ, the contact surface between the convex hull 116 and the middle frame 220 is circular. As shown in FIG18 , when a > δ, the contact surface between the convex hull 116 and the middle frame 220 is annular. As shown in FIG19 , when a' ≤ δ, the contact surface between the through-groove 112 and the middle frame 220 is rectangular. As shown in FIG20 , when a' > δ, the contact surface between the convex hull 116 and the middle frame 220 is square.

[0129] Taking the convex hull of a spherical head as an example, when the convex hull 116 and the through groove 112 occupy the same space, according to the formula principle, it can be roughly considered that: nominal contact area ≈ perimeter * skin depth δ, nominal contact area of ​​the convex hull 116 ≈ 2*Π*a*δ, nominal contact area of ​​the through groove 112 ≈ 2*(2a'+L)*δ, convex hull 116 / through groove 112 = (Πa) / (2a'+L), where Π≈3.14. Therefore, according to the current design, the convex hull 116 interferes by 0.08 mm, and the through groove 112 interferes by 0.05 mm, that is, a = 0.26 mm, 2a' = 0.54 mm, and L = 0.52 mm, then the ratio between the two is 78.5%. Therefore, the through groove 112 design has a larger nominal contact area and a better effect.

[0130] In addition, if there are other bending features around the metal structural part 110, the through groove 112 can be designed at a non-bending edge position, which can reduce the difficulty of forming the through groove 112, ensure the size of the metal structural part 110, and reduce processing costs.

[0131] If the bent edge exists only on one side, as shown in Figures 21 and 22, where one end of the first connecting portion 110a of the metal structural member 110 has a bent edge 113, the through-groove's extension direction L1 can be perpendicular to the length direction L2 of the bent edge. For example, in Figures 21 and 22, the through-groove 112 can be formed and provided at a position perpendicular to the bent edge 113. In this case, a distance is generally required between the through-groove 112 and the bent edge 113 to prevent the bent edge 113 from interfering with the through-groove 112.

[0132] Specifically, as shown in Figures 21 and 22, a first through groove 112a and a second through groove 112b are formed at a position perpendicular to the bending edge 113, and the groove surface 1121a of the first through groove and the groove surface 1121b of the second through groove are recessed away from the side of the middle frame 220, and the groove bottom 1122a of the first through groove and the groove bottom 1122b of the second through groove are protruding toward a side of the middle frame 220.

[0133] Alternatively, in some other embodiments, the extending direction L1 of the through slot may be parallel to the length direction L2 of the bent edge.

[0134] By designing the extension direction L1 of the through groove to be parallel to the length direction L2 of the bending edge, when the through groove 112 is manufactured, for example, when the through groove 112 is stamped, the bending edge 113 of the metal structural part 110 will not be damaged. At the same time, the extension direction L1 of the through groove is parallel to the length direction L2 of the bending edge, and the bending edge 113 of the metal structural part 110 will not interfere with the process of manufacturing the through groove 112, thereby avoiding the existence of the bending edge 113 affecting the process stability and reliability of manufacturing the through groove 112.

[0135] Specifically, in Figures 23 to 25 , two symmetrical through-grooves 112 can be formed and arranged parallel to the bend edge 113. Both through-grooves 112 can be formed and arranged in place at one time. As shown in Figures 24 and 25 , a third through-groove 112c and a fourth through-groove 112d are formed and arranged parallel to the bend edge 113. The groove surfaces 1121c and 1121d of the third through-groove are recessed away from the side of the middle frame 220, while the groove bottoms 1122c and 1122d of the third through-groove are protruding toward the side of the middle frame 220.

[0136] Alternatively, in FIG. 26 to FIG. 28 , a through groove 112 may be formed at a position parallel to the bent edge 113 , and the through groove 112 may also be formed in place in one step.

[0137] It is understood that in some embodiments, the metal structure 110 may have a notch 114, and the notch 114 may be connected to the first through hole 111, so that at least one elastic arm 115 is formed on the metal structure 110 (see Figures 29 and 31). By providing the notch 114 on the metal structure 110, the metal structure 110 realizes a disconnected design. Since the metal structure 110 has the first through hole 111, the notch 114 is connected to the first through hole 111, so that at least one end of the metal structure 110 is suspended. The suspended end has a certain elasticity, thereby ensuring that at least one elastic arm 115 is formed on the metal structure 110.

[0138] In addition, in some other embodiments, the metal structural member 110 may have a notch 114, which is connected to the first through hole 111, but the metal structural member 110 may not have the elastic arm 115. In this case, compared with the metal structural member 110 with the elastic arm 115, the metal structural member 110 without the elastic arm 115 will have a relatively poor effect on absorbing the gap between the metal structural member 110 and the circuit board 230.

[0139] Specifically, the convex hump 116 without the elastic arm 115 can only absorb approximately 0.08mm of screw lift. However, the actual lift is much higher than this. To ensure mechanical reliability, the screw lift is approximately 0.15mm. Considering the design height, the metal structural member 110 needs to have a spring force greater than 0.7N even at a height of 0.35mm. Therefore, the elastic arm 115 is added to the existing closed metal structural member 110. This design ensures that the device can be used in locations with high RF current, ESD-sensitive locations, or in scenarios with strict requirements on front-to-back impedance for environmental reliability, ensuring proper function.

[0140] It should be noted that, in the embodiment of the present application, the application scenario of the metal structural member 110 is not limited to the screw locking scenario.

[0141] For metal structural members 110 having elastic arms 115, through-grooves 112 (e.g., U-shaped grooves) can also be used to improve contact reliability. Specifically, the through-grooves 112 can be located on the elastic arms 115 or in locations other than the elastic arms 115 (i.e., areas on the metal structural member 110 outside the elastic arms 115). The present embodiment of the application does not impose any particular restrictions on the extension direction L1 of the through-grooves; the through-grooves 112 can generally be located along the radius of the inner circle of the metal structural member 110.

[0142] For example, in the embodiment of the present application, an elastic arm 115 is formed on the metal structure 110, and the through-groove 112 can be located on the elastic arm 115. In this way, on the basis that the elastic arm 115 absorbs a certain amount of the connection gap between the metal structure 110 and the middle frame 220, the through-groove 112 can further squeeze and absorb the gap between the metal structure 110 and the middle frame 220.

[0143] Alternatively, in some embodiments, the through slot 112 may be located outside the elastic arm 115 on the metal structure 110. In this case, the through slot 112 can also further squeeze and absorb the gap between the metal structure 110 and the middle frame 220 on the basis of the elastic arm 115.

[0144] That is to say, when the through groove 112 is set on the metal structural part 110, no matter whether the through groove 112 is set on the elastic arm 115 or the through groove 112 is set on the area of ​​the metal structural part 110 other than the elastic arm 115, as long as the bottom 1122 of the through groove is protruding toward the side of the middle frame 220, the bottom 1122 of the through groove can squeeze the middle frame 220, thereby being able to well absorb the gap between the metal structural part 110 and the middle frame 220, thereby being able to largely avoid the problem of a gap between the structural part and the circuit board 230 in scenarios such as falling.

[0145] It should be noted that, in the embodiment of the present application, the structure of the metal structural member 110 includes but is not limited to the following possible implementations:

[0146] In one possible implementation, as shown in Figures 29 to 33 , the metal structure 110 may include a first portion 1101 having a first end and a second end (i.e., a first end 1101a of the first portion and a second end 1101b of the first portion) opposite to each other, wherein the second end 1101b of the first portion serves as an elastic arm 115. In this case, the metal structure 110 having one elastic arm 115 forms a two-claw metal structure 110.

[0147] In Figures 29, 30, and 31, the metal structure 110 is a two-claw metal structure 110, with the through-slot 112 located on the elastic arm 115. In Figures 32 and 33, the metal structure 110 is a two-claw metal structure 110, with the through-slot 112 located outside the elastic arm 115 of the two-claw metal structure 110. Furthermore, the metal structure 110 has a through-slot 112 and a convex bump 116.

[0148] Another possible implementation is as shown in Figures 34 to 37 , in which a metal structural member 110 includes a first portion 1101 and a second portion 1102. The second portion 1102 has opposing first and second ends (i.e., first end 1102a of the second portion and second end 1102b of the second portion). The second end 1101b of the first portion serves as an elastic arm 115, and the first end 1102a of the second portion is connected to the first end 1101a of the first portion. In this case, the first end 1102a of the second portion is connected to the first end 1101a of the first portion, and the metal structural member 110 having one elastic arm 115 forms a three-claw metal structural member 110.

[0149] In Figures 34 and 35 , the metal structural member 110 is a three-prong metal structural member 110, with the through-slot 112 located on the elastic arm 115. In Figures 36 and 37 , the metal structural member 110 is a three-prong metal structural member 110, with the through-slot 112 located outside the elastic arm 115 of the three-prong metal structural member 110. Furthermore, the metal structural member 110 has one through-slot 112 and two protrusions 116.

[0150] Another possible implementation is as shown in Figures 38 to 41 , in which a metal structural member 110 includes a first portion 1101, a second portion 1102, and a third portion 1103. The third portion 1103 has a first end and a second end opposite to each other (i.e., a first end 1103a of the third portion and a second end 1103b of the third portion). The second end 1101b of the first portion serves as an elastic arm 115. In this case, the first end 1102a of the second portion is connected to the first end 1101a of the first portion, and the second end 1102b of the second portion is connected to the first end 1103a of the third portion. The metal structural member 110 having one elastic arm 115 forms a four-claw metal structural member 110.

[0151] Specifically, in Figures 38 and 39 , the metal structural member 110 is a four-claw metal structural member 110, with the through-slot 112 located on the elastic arm 115. In Figures 40 and 41 , the metal structural member 110 is a four-claw metal structural member 110, with the through-slot 112 located outside the elastic arm 115 of the four-claw metal structural member 110. Furthermore, the metal structural member 110 has one through-slot 112 and three protrusions 116.

[0152] It is understood that in the embodiments of the present application, the metal structure 110 is not limited to the layout shown in Figures 9 and 10; it can be any layer in a multi-layer contact, and the contact surface is not restricted. The metal structure 110 can be a metal structure 110. It is also not limited to metal structures; as long as it can achieve effective contact between the two, any material can be used. It does not necessarily require a conductive relationship; reliable contact from the structure itself can also benefit.

[0153] For example, in some embodiments, the connection structure 100 may further include a plastic structural member 130. As shown in FIG10 and FIG11 , the plastic structural member 130 is connected to the first connection portion 110a of the metal structural member 110 via a fixing member 120. It is understood that the fixing member 120 may be a screw, a stud, or a bolt, and the present application is not limited to this and is not limited to the above examples.

[0154] It should be noted that the location where the plastic structural member 130 and the metal structural member 110 are joined can be where the fixing member 120 is located, or can be a location other than the fixing member 120. In some embodiments, the plastic structural member 130 and the fixing member 120 can be integrally formed first, and then the fixing member 120 can be fastened to the metal structural member 110. Therefore, the layout of the fixing member 120 is not a critical factor affecting the location where the plastic structural member 130 and the metal structural member 110 are joined.

[0155] It is easy to understand that in the embodiment of the present application, the plastic structural member 130 and the metal structural member 110 can be injection molded to further ensure the connection reliability between the metal structural member 110 and the middle frame 220, or between the metal structural member 110 and the circuit board 230. In addition, injection molding the plastic structural member 130 and the metal structural member 110 can also improve the overall reliability of the plastic structural member 130 and the metal structural member 110 to a certain extent. Moreover, in some embodiments, the plastic structural member 130 can provide insulation or isolation at certain locations.

[0156] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0157] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0158] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described here. In addition, the terms "may include" and "have" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0159] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising at least: Middle frame, metal structural parts and fixings; The metal structure has a first through hole, the middle frame has a second through hole, and the fixing member passes through the first through hole and the second through hole; At least one through groove is provided on the metal structural member, the through groove is recessed on a side away from the middle frame, and the through groove extends to at least one outer edge of the metal structural member; And the through groove protrudes toward one side of the middle frame.

2. The electronic device according to claim 1, characterized in that: The through groove is formed by a stamping process.

3. The electronic device according to claim 1 or 2, characterized in that: The through groove is arranged adjacent to the first through hole.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The contact surface between the through slot and the middle frame is in a rectangular or square ring shape.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The metal structure is also provided with at least one convex bump.

6. The electronic device according to claim 5, characterized in that: The convex hull protrudes toward one side of the middle frame, and the side of the convex hull facing away from the middle frame is a plane.

7. The electronic device according to claim 5 or 6, characterized in that: The convex hull is disposed adjacent to the first through hole.

8. The electronic device according to any one of claims 5 to 7, characterized in that: The contact surface between the convex hull and the middle frame is in a circular or annular shape.

9. The electronic device according to any one of claims 1 to 8, characterized in that: One end of the metal structure has a bent edge; the extending direction of the through slot is parallel to the length direction of the bent edge.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The metal structure has a notch, and the notch is communicated with the first through hole, so that at least one elastic arm is formed on the metal structure.

11. The electronic device according to claim 10, characterized in that: The metal structure is formed with an elastic arm; The through slot is located on the elastic arm; or, the through slot is located in a region outside the elastic arm on the metal structure.

12. The electronic device according to claim 10 or 11, characterized in that: The metal structure comprises: a first part; The first portion has a first end and a second end opposite to each other, the second end serving as the elastic arm.

13. The electronic device according to claim 12, characterized in that: The metal structure also includes: a second part; one end of the second part is connected to the first end of the first part.

14. The electronic device according to claim 13, characterized in that: The metal structure also includes: a third part; the other end of the second part is connected to the third part.

15. The electronic device according to claim 14, characterized in that: The electronic device further comprises: a circuit board; the circuit board is located between the metal structure and the middle frame; The at least one through slot is located on a side of the metal structure away from the circuit board, and the through slot faces One side of the circuit board is protruding.

16. A connection structure, applied to the electronic device according to any one of claims 1 to 15, characterized in that: The electronic device comprises a middle frame and a metal structure, the metal structure has a first connection portion, and the middle frame has a second connection portion; The connection structure at least includes: the first connection part, the second connection part and a fixing member; The first connecting portion has a first through hole, the second connecting portion has a second through hole, and the fixing member passes through the first through hole and the second through hole; At least one through groove is provided on the first connecting portion, the through groove is recessed on a side away from the second connecting portion, and the through groove extends to at least one outer edge of the first connecting portion; And the through groove protrudes toward one side of the second connecting portion.

17. The connection structure according to claim 16, characterized in that: The through groove is formed by a stamping process.

18. The connection structure according to claim 16 or 17, characterized in that: The through groove is arranged adjacent to the first through hole.

19. The connection structure according to any one of claims 16 to 18, characterized in that: At least one convex hump is also arranged on the first connecting portion.

20. The connection structure according to claim 19, characterized in that: The convex bulge protrudes toward one side of the second connecting portion, and the convex bulge is flat on one side away from the second connecting portion.

21. The connection structure according to claim 19 or 20, characterized in that: The convex hull is disposed adjacent to the first through hole.

22. The connection structure according to any one of claims 16 to 21, characterized in that: One end of the first connecting portion has a bent edge; an extending direction of the through slot is parallel to a length direction of the bent edge.

23. The connection structure according to any one of claims 16 to 22, characterized in that: The first connecting portion has a notch, and the notch is connected to the first through hole, so that at least one elastic arm is formed on the first connecting portion; The through slot is located on the elastic arm; or, the through slot is located in a region outside the elastic arm on the first connecting portion.

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