Contactless-type metal card and manufacturing method therefor

Abstract

The present invention relates to a metal card for implementing RF capability by applying a COM chip module, the metal card comprising: an antenna for transmitting / receiving information to / from the outside; a metal body for providing a space, an opening part, and a slit part, the space being for receiving the antenna, the opening part being insert molding-processed using a synthetic resin so as to receive a portion of a COM chip module, and the slit part being formed starting from the opening part and up to the end of the metal card; a rear sheet manufactured into a shape corresponding to the metal body so as to be lamination-coupled to the rear surface of the metal body; and a front sheet corresponding to the rear sheet and lamination-coupled to the front surface of the metal body, wherein the metal body, the rear sheet, and the front sheet are each coupled by being laminated, and after chamfering, a pocket-milled part is formed in the front sheet so as to correspond to the shape of the COM chip module, and the COM chip module is coupled to the pocket-milled part.

Description

Contactless metal card and its manufacturing method

[0001] The present invention relates to a metal card for performing payment and a method for manufacturing the same, and more specifically, to a contactless metal card for performing payment in a contactless manner and having improved durability, and a method for manufacturing the same.

[0002] In general, cards are classified into magnetic cards using a magnetic strip, smart cards using an IC chip, and combination cards that combine the two, depending on the recording method. Smart cards are classified into contact and contactless cards depending on the reading method. Contactless cards are further classified into proximity communication (NFC) cards that can be read only at a distance of several to several tens of centimeters, and RF cards that can be read from a longer distance. Usually, these methods are often equipped in duplicate.

[0003] Meanwhile, the proliferation of contactless payment terminal infrastructure is leading to a shift from offline payment methods using smart cards to contactless cards. Previously, hybrid cards, which combined a contact-based COB and a contactless chip, were the norm. However, contactless chips have limited memory capacity, limiting their use to transportation card functions.

[0004] Combi chips can be equipped with international contactless credit card standards, allowing for both contactless and contactless payments with a single chip. Contactless payment standards include Visa's "Visa Tap to Pay," Mastercard's "Just Tap & Go," American Express's "American Express Contactless," UnionPay's "QuickPass," and JCB's "JCB Contactless."

[0005] There are various technologies for contact connection between the combi COB and the coil antenna, but there have been issues with durability and resistance to external stress.

[0006] Accordingly, COM (Coil On Module) package technology, which configures an antenna coil on COB, has emerged, and it has become possible to perform contactless payment function without physical contact connection between the chip and the coil antenna, thereby overcoming the durability limitations of the physical contact method.

[0007] However, when applying a contactless COM, coil antenna design technology is required to maintain the RF stability of the existing contact method.

[0008] Conventional antennas and COB-based physical contact structures are prone to defects, such as chip damage or antenna contacts falling off due to impact during final assembly and card-size punching during sheet-level processing. In such cases, the metal body, chip, and antenna are difficult to reuse, increasing manufacturing costs.

[0009]

[0010] {Prior art literature}

[0011] {Patent Document}

[0012] (Patent Document 0001) Republic of Korea Patent No. 10-1754985

[0013]

[0014] Accordingly, the present invention has been devised to solve the above-mentioned problems, and the problem to be solved by the present invention is to provide a contactless metal card and a manufacturing method thereof that fundamentally blocks the possibility of chip damage during the manufacturing process, since the COM chip assembly process is performed in the last process.

[0015] Another object of the present invention is to provide a contactless metal card and a method for manufacturing the same, which can reduce the possibility of chip detachment due to external stress by having the same card layer structure.

[0016]

[0017] However, the technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0018] The present invention has been created to improve the problems of the prior art as described above, and is a metal card that implements RF performance by applying a COM chip module, comprising: an antenna for transmitting and receiving information with the outside; a metal body that provides a space for accommodating the antenna, an opening that is insert-molded with synthetic resin to accommodate a portion of the COM chip module, and a slit that starts from the opening and extends to the end of the metal card; a rear sheet that is manufactured in a shape corresponding to the metal body and is laminated and combined on the rear surface of the metal body; and a front sheet that corresponds to the rear sheet and is laminated and combined on the front surface of the metal body; wherein the metal body, the rear sheet, and the front sheet are respectively laminated and combined, and after chamfering, a pocket milling portion is formed in the front sheet corresponding to the shape of the COM chip module, and the COM chip module can be combined in the pocket milling portion.

[0019]

[0020] In addition, in one embodiment, the metal body includes: a body main body forming an outer shape; a milling part formed in a portion of the body main body for accommodating the antenna; and an opening part that is insert-molded with synthetic resin or filled with a prosthesis of synthetic resin material so that a portion of the COM chip module is combined in a portion of the milling part; wherein the slit part can be formed through the opening and the milling part to the end of the body main body.

[0021]

[0022] Additionally, in one embodiment, the pocket milling portion may be formed to correspond to the shape of a portion of the COM chip module included in the opening so as to enable coupling of the COM chip module.

[0023]

[0024] Additionally, in one embodiment, the COM chip module may include a chip molding portion in which the COM chip is molded and combined; and a lead frame portion that supports the chip molding portion from below and is combined with the front sheet and the pocket milling portion of the opening.

[0025]

[0026] Additionally, in one embodiment, the pocket milling portion may be included in the front sheet and formed to correspond to the lead frame portion and chip molding portion of the COM chip module so as to enable coupling of the COM chip module.

[0027]

[0028] In addition, in one embodiment, the antenna may include a primary coil portion that primarily receives current through a magnetic induction method from the COM chip module; a secondary coil portion that extends from the primary coil to form a closed-loop coil pattern; and a capacitance pattern portion that is configured with an upper pattern and a lower pattern that are configured in parallel at both ends of the primary coil portion and the secondary coil portion.

[0029]

[0030] Additionally, in one embodiment, the back sheet may be laminated with a back printing sheet, an overlay film, and an MS tape film layer.

[0031]

[0032] Additionally, in one embodiment, the front sheet may be laminated with a front printing sheet and an overlay film layer.

[0033]

[0034] In addition, in one embodiment, the metal body comprises a metal sheet formed of a plurality of metal sheets; a rear sheet manufactured in a shape corresponding to the metal sheet and laminated and bonded to the rear surface of the metal sheet; and a front sheet corresponding to the rear sheet and laminated and bonded to the front surface of the metal sheet; wherein the metal sheet is punched to separate into individual metal bodies, and a pocket milling portion is formed in the metal body, and the COM chip module can be coupled to the pocket milling portion.

[0035]

[0036] In order to implement RF performance by applying the above-described COM chip module, a metal body is provided, which includes an antenna for transmitting and receiving information with the outside, a space for accommodating the antenna, an opening processed by insert molding with synthetic resin to accommodate a portion of the COM chip module, and a slit portion formed from the opening to the end of the metal card, a back sheet manufactured in a shape corresponding to the metal body and laminated and combined on the back of the metal body, and a front sheet corresponding to the back sheet and laminated and combined on the front of the metal body, wherein the metal body, the back sheet, and the front sheet are respectively laminated and combined, and after chamfering, a pocket milling portion is formed on the front surface corresponding to the shape of the COM chip module, and the COM chip module is coupled to the pocket milling portion, wherein the metal body comprises: a body main body forming an outer shape; a milling portion formed on a portion of the body main body to accommodate the antenna; And an opening that is insert-molded with synthetic resin or filled with a prosthesis of synthetic resin material so that a part of the COM chip module is combined with a part of the milling part; wherein the slit part is formed through the opening part and the milling part to the end of the body main body, and the pocket milling part is included in the opening part and formed to correspond to the shape of a part of the COM chip module so that the COM chip module can be combined. A method for manufacturing a contactless metal card, comprising: a metal body manufacturing step of manufacturing the metal body; a back sheet laminating step of laminating the back sheet on the back of the metal body after the metal body manufacturing step; a front sheet laminating step of laminating the front sheet on the front of the metal body after the back sheet laminating step; a laminating step of laminating the metal body in which the back sheet and the front sheet are laminated after the front sheet laminating step; a chamfering step of chamfering the metal card after the laminating step; A pocket milling part forming step for forming the pocket milling part on the metal card after the above chamfering processing step;And it can be made by including a COM chip module combining step of combining the COM chip module corresponding to the pocket milling part after going through the pocket milling part forming step.;

[0037]

[0038] In addition, in one embodiment, the metal body comprises a metal sheet manufacturing step of manufacturing a metal sheet formed of a plurality of metal bodies; a back sheet laminating step of manufacturing a back sheet corresponding to the metal sheet after the metal sheet manufacturing step and laminating the back sheet on the back of the metal sheet; a front sheet laminating step of manufacturing a front sheet corresponding to the back sheet after the back sheet laminating step and laminating the front sheet on the metal sheet; a laminating step of laminating the metal sheet on which the back sheet and the front sheet are laminated after the front sheet laminating step; a metal sheet punching step of separating the metal sheet by punching it into individual sheets after the laminating step; a chamfering step of chamfering the metal card after the metal sheet punching step; a pocket milling part forming step of forming the pocket milling part on the metal card after the chamfering step; And it can be made by including a COM chip module combining step of combining the COM chip module corresponding to the pocket milling part after going through the pocket milling part forming step.

[0039] According to one embodiment of the present invention, since the COM chip is assembled in the final process after laminating the metal body, the back sheet, and the front sheet, the possibility of chip breakage during the process can be completely eliminated.

[0040] Additionally, since it is a contactless method with no physical contact between the antenna and the COM chip, the possibility of progressive RF failure can be fundamentally blocked.

[0041] In addition, since the entire COM chip area is bonded to the insert molding portion, the possibility of the COM chip detaching due to external stress can be dramatically improved.

[0042] Additionally, since pocket milling is performed using existing plastic contact card equipment, there is no need to invest in separate additional equipment, which can save time and cost.

[0043]

[0044] However, the effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0045] The following drawings attached to this specification illustrate preferred embodiments of the present invention, and together with the detailed description of the invention described below, serve to further understand the technical idea of ​​the present invention, and therefore, the present invention should not be interpreted as being limited to matters described in such drawings.

[0046] Figure 1 is an exploded perspective view of the components of a contactless metal card according to one embodiment of the present invention.

[0047] Figure 2 is a cross-sectional view of a component of a contactless metal card.

[0048] Figure 3 is a drawing showing the process of laminating (a), pocket milling (b), and implanting a COM chip (c) on a contactless metal card.

[0049] Figure 4 is a conceptual diagram illustrating the structure of an antenna.

[0050] Figure 5 is a drawing showing a metal sheet in which a plurality of metal bodies are formed.

[0051] Figure 6 is a drawing showing a back sheet and a front sheet being laminated and bonded to a metal sheet.

[0052] Figure 7 is a flowchart showing a method for manufacturing a contactless metal card according to one embodiment of the present invention.

[0053] Figure 8 is a flowchart showing a method for mass-producing a contactless metal card according to one embodiment of the present invention.

[0054] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily practice the present invention. However, the description of the present invention is merely an embodiment for structural and functional explanation, and therefore the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, since the embodiments can be modified in various ways and can have various forms, the scope of the present invention should be understood to include equivalents that can realize the technical idea. In addition, the purposes or effects presented in the present invention do not mean that a specific embodiment must include all of them or only such effects, and therefore the scope of the present invention should not be construed as being limited thereby.

[0055] The meanings of terms described in the present invention should be understood as follows.

[0056] Terms such as "first" and "second" are intended to distinguish one component from another, and the scope of the rights should not be limited by these terms. For example, a first component could be referred to as a second component, and similarly, a second component could also be referred to as a first component. When a component is referred to as being "connected" to another component, it should be understood that it may be directly connected to that other component, but there may also be other components in between. Conversely, when a component is referred to as being "directly connected" to another component, it should be understood that there are no other components in between. Meanwhile, other expressions describing the relationship between components, such as "between" and "immediately between" or "adjacent to" and "directly adjacent to", should be interpreted similarly.

[0057] Singular expressions should be understood to include plural expressions unless the context clearly indicates otherwise, and terms such as "comprises" or "has" should be understood to specify the presence of stated features, numbers, steps, operations, components, parts, or combinations thereof, but not to exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0058] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted to be consistent with their meaning within the context of the relevant technology, and should not be interpreted as having ideal or overly formal meanings unless explicitly defined herein.

[0059]

[0060] FIG. 1 is an exploded perspective view of a component of a contactless metal card according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a component of a contactless metal card, FIG. 3 is a drawing showing a process of laminating (a), pocket milling (b), and implanting a COM chip (c) of a contactless metal card, respectively, FIG. 4 is a conceptual diagram showing the structure of an antenna, FIG. 5 is a drawing showing a metal sheet on which a plurality of metal bodies are formed, and FIG. 6 is a drawing showing a state in which a back sheet and a front sheet are laminated and bonded to a metal sheet.

[0061] As shown in FIGS. 1 to 6, the present invention is a metal card that implements RF performance by applying a COM chip, and may include an antenna (100), a metal body (200), a rear sheet (300), a front sheet (400), and a COM chip module (500).

[0062] Here, COM chips are hardware platforms for embedded system development, designed to allow system developers to easily connect various hardware and software components and streamline the complex system development process. RF stands for Radio Frequency, a technology that transmits information using electromagnetic waves. It operates in the high-frequency range (3 kHz to 300 GHz), enabling wireless transmission and reception of transmitted data, and providing various functions such as high-speed data transmission, long-distance communication, and multiple access.

[0063] The antenna (100) can transmit and receive information with the outside. The antenna (100) is composed of an FPCB and forms a loop structure of an upper pattern (140) and a lower pattern (150), and may include a COM chip module (500), a primary coil part (110) that primarily receives current through a magnetic induction method, a secondary coil part (120) that extends from the primary coil part (110) to form a closed-loop coil pattern, and a capacitance pattern part (130) composed of an upper pattern (140) and a lower pattern (150) of the FPCB for resonance frequency tuning that is configured in parallel at both ends of the primary coil part (110) and the secondary coil part (120).

[0064] Specifically, unlike conventional wire antennas, the FPCB antenna is made by etching the antenna circuit on a flexible circuit board. By doing so, the size of the antenna (100) can be reduced, the installation and assembly process can be simplified, and power consumption can be reduced, etc., and the FPCB antenna can guarantee stable performance even in a high-frequency bandwidth.

[0065] The capacitance pattern unit (110) can tune the resonant frequency. Specifically, capacitance is a physical quantity that represents the proportional relationship between the amount of electrically accumulated charge and the voltage difference, and represents the electrical capacity existing between two electrolytes.

[0066]

[0067] The metal body (200) may provide a space for accommodating the antenna (100), an opening (230) insert-molded with synthetic resin to accommodate a portion of the COM chip module (500), and a slit (240) formed from the opening (230) to the end of the metal card. That is, the metal body (200) may include a body body (210), a milling portion (220), and an opening (230). The body body (210) may have an outer shape. The milling portion (220) may be formed on a portion of the body body (210) to accommodate the antenna (100).

[0068] Specifically, milling is the process of cutting the surface of a workpiece using a rotating cutting tool. It is a method of creating a shape by cutting the surface of a workpiece using a high-speed rotating body (tool). Milling can produce workpieces of various shapes by utilizing various types of cutting tools, rotational speeds, and automatic control technologies. Milling is automated using CNC (Computer Numerical Control) technology and is primarily used in metalworking, woodworking, and plastics processing.

[0069] The opening (230) is formed in an open state so that a part of the COM chip module (500) can be combined with a part of the milling processing section (220), and can be insert-molded using a synthetic resin material or filled with a prosthesis of a synthetic resin material. The opening (230) can be filled with a synthetic resin so that a part of the COM chip module (500) can be combined with a part of the milling processing section (220).

[0070] The slit portion (240) can be formed through the opening portion (230) and the milling processing portion (220) to the end of the body body (210).

[0071]

[0072] The rear sheet (300) is manufactured in a shape corresponding to the metal body (200) and can be laminated and bonded to the rear of the metal body (200). The rear sheet (300) can be laminated with a rear printing sheet, an overlay film, and an MS tape film layer.

[0073] The front sheet (400) corresponds to the rear sheet (300) and can be laminated and bonded to the front of the metal body (200). The front sheet (400) can be laminated with a front printing sheet and an overlay film layer.

[0074] Specifically, the materials for the rear sheet (300) and front sheet (400) can be manufactured using synthetic resins with excellent durability and elasticity. Types of synthetic resins include phenol resin, polyurethane resin, polyamide resin, acrylic resin, urea / melamine resin, and silicone resin.

[0075] Additionally, a rear sheet (300) including an M / S tape can be assembled on the rear of the metal body (200), and a front sheet (400) can be assembled on the front.

[0076]

[0077] The metal body (200), the rear sheet (300), and the front sheet (400) are laminated and combined, respectively, and after chamfering, a pocket milling portion (410) can be formed in the front sheet (400) corresponding to the shape of the COM chip module (500). The COM chip module (500) can be combined with the pocket milling portion (410).

[0078] The pocket milling section (410) is included in the opening (230) and can be formed to correspond to the shape of a portion of the COM chip module (500) so that the COM chip module (500) can be coupled.

[0079] Laminating is performed under high temperature and high pressure conditions using a laminating machine such as a hot press, which laminates two or more layers by stacking and compressing them, increases durability, makes the surface waterproof and dustproof, and can also maintain the gloss of the surface.

[0080]

[0081] A COM chip module (500) may include a chip molding portion (510) and a lead frame portion (520). The chip molding portion (510) may be molded and joined to a COM chip. The lead frame portion (520) may support the chip molding portion (510) from below and may be joined to the front sheet (400) and the pocket milling portion (410) of the opening (230). The pocket milling portion (410) may be included in the front sheet (400) and formed to correspond to the lead frame portion (520) and the chip molding portion (510) of the COM chip module (500) so that the COM chip module (500) may be joined.

[0082]

[0083] A contactless metal card according to an embodiment of the present invention may include a metal sheet (202), a back sheet (302), and a front sheet (402). The metal sheet (202) may be formed by a plurality of metal bodies (200). The back sheet (302) may be manufactured in a shape corresponding to the metal sheet (202) and may be laminated and bonded to the back of the metal sheet (202). The front sheet (402) may correspond to the back sheet (302) and may be laminated and bonded to the front of the metal sheet (202). The metal sheet (202) may be punched and separated into individual metal bodies (200). A pocket milling portion (410) may be formed in the metal body (200), and a COM chip module (500) may be bonded to the pocket milling portion (410).

[0084]

[0085] Figure 7 is a flowchart showing a method for manufacturing a contactless metal card according to one embodiment of the present invention.

[0086] As shown in FIG. 7, in order to implement RF performance by applying the above-described COM chip module (500), an antenna (100) for transmitting and receiving information with the outside, a space for accommodating the antenna (100), an opening (230) insert-molded with synthetic resin to accommodate a part of the COM chip module (500), and a metal body (200) that provides a slit (240) formed from the opening (230) to the end of the metal card, a back sheet (300) manufactured in a shape corresponding to the metal body (200) and laminated and combined on the back of the metal body (200), a front sheet (400) corresponding to the back sheet (300) and laminated and combined on the front of the metal body (200), and the metal body (200), the back sheet (300), and the front sheet (400) are laminated and combined respectively, and after chamfering, are formed corresponding to the shape of the COM chip module (500). A pocket milling part (410) is formed, and a COM chip module (500) is coupled to the pocket milling part (410), and the metal body (200) includes a body body (210) forming an outer shape and a milling part (220) formed in a part of the body body (210) to accommodate an antenna (100), and an opening (230) that is insert-molded with synthetic resin or filled with a prosthesis of synthetic resin material so that a part of the COM chip module (500) is coupled to a part of the milling part (220), and a slit part (240) is formed through the opening (230) and the milling part (220) to the end of the body body (210), and the pocket milling part (410) is formed so that the COM chip module (500) can be coupled to the opening (230) corresponding to the shape of a part of the COM chip module (500). As a method for manufacturing a contactless metal card, the present invention can be performed by including a metal body manufacturing step (S100), a back sheet laminating step (S110), a front sheet laminating step (S120), a laminating step (S130), a chamfering step (S140), a pocket milling part forming step (S150), and a COM chip module combining step (S160).

[0087] The metal body manufacturing step (S100) is a step for manufacturing a metal body (200) of a set shape.

[0088] The rear sheet lamination step (S110) is a step of laminating the rear sheet (300) on the rear of the metal body (200) after the metal body manufacturing step (S100).

[0089] The front sheet lamination step (S120) is a step in which the front sheet (400) is laminated on the front of the metal body (200) after the rear sheet lamination step (S110).

[0090] The laminating step (S130) is a step of laminating the metal body (200) on which the back sheet (300) and the front sheet (400) are laminated after the front sheet laminating step (S120).

[0091] More specifically, the laminating step (S130) includes forming an adhesive layer between the front sheet (400) and the metal body (200), and between the back sheet (300) and the metal body (200). The adhesive layer is formed by using a fabric that has been previously bonded to the front sheet (400) and the back sheet (300), or by using an acrylic adhesive or hot melt tape on the front and back surfaces of the metal body (200), and then laminating the front sheet (400) and the back sheet (300) using a hot press device.

[0092]

[0093] The chamfering step (S140) is a step for chamfering the metal card (10) after the laminating step (S130). Specifically, the chamfering step (S140) can chamfer the side surface of the laminated metal card after the laminating step (S130). Chamfering is mainly performed on the surface of various materials such as metal, plastic, and wood to produce an accurate size, shape, and surface finish, and can be mainly performed using a CNC machine. The CNC machine is controlled by a computer program and can produce parts with a desired shape.

[0094] The pocket milling part forming step (S150) is a step of forming a pocket milling part (410) on a metal card (600) that has undergone the chamfering process (S140) and has undergone the chamfering process.

[0095] The COM chip module joining step (S160) is a step of joining the COM chip module (500) to correspond to the shape of the pocket milling part (410) after the pocket milling part forming step (S150). That is, the process may be performed by forming the pocket milling part (410) by pocket milling the part where the COM chip module (500) is to be seated, and finally assembling the COM chip module (500).

[0096] The COM chip module bonding step (S160) includes a step of forming an adhesive layer in advance on the lead frame portion (520) of the COM chip module (500), and the adhesive layer can mainly use a hot melt tape.

[0097]

[0098] Figure 8 is a flowchart showing a method for mass-producing a contactless metal card according to one embodiment of the present invention.

[0099] As illustrated in FIG. 8, the present invention can be achieved by including a metal sheet manufacturing step (S200), a rear sheet laminating step (S210), a front sheet laminating step (S220), a laminating step (S230), a metal sheet punching step (S240), a chamfering step (S250), a pocket milling part forming step (S260), and a COM chip module bonding step (S270).

[0100] The metal sheet manufacturing step (S200) is a step for manufacturing a metal sheet (202) in which a plurality of metal bodies (200) are formed.

[0101] The rear sheet lamination step (S210) is a step in which, after the metal sheet manufacturing step (S200), a rear sheet (302) corresponding to the metal sheet (202) is manufactured and the rear sheet (302) is laminated on the rear side of the metal sheet (202).

[0102] The front sheet lamination step (S220) is a step in which, after the rear sheet lamination step (S210), a front sheet (402) corresponding to the rear sheet (302) is manufactured and laminated on the front of the metal sheet (202).

[0103] The laminating step (S230) is a step of laminating the metal sheet (202) on which the back sheet (302) and the front sheet (402) are laminated after the front sheet laminating step (S220).

[0104] More specifically, the laminating step (S230) includes forming an adhesive layer between the front sheet (302) and the metal sheet (202), and between the back sheet (402) and the metal sheet (202), wherein the adhesive layer is formed by using fabric that has been previously bonded to the front sheet and the back sheet, or by using an acrylic adhesive or hot melt tape on the front and back surfaces of the metal sheet (202), and then stacking the front sheet (302) and the back sheet (402) and laminating them using hot press equipment.

[0105] The metal sheet punching step (S240) is a step in which the metal sheet (202) is separated by punching it into individual sheets after the laminating step (S230).

[0106] The chamfering processing step (S250) is a step in which the metal card (10) is chamfered after the metal sheet punching step (S240).

[0107] The pocket milling part forming step (S260) is a step of forming a pocket milling part (410) on a metal card (600) that has undergone the chamfering process (S250) and has undergone the chamfering process.

[0108] The COM chip module bonding step (S270) is a step of bonding the COM chip module (500) corresponding to the shape of the pocket milling part (410) after the pocket milling part forming step (S260).

[0109] The COM chip module bonding step (S270) includes a step of forming an adhesive layer in advance on the lead frame portion (520) of the COM chip module (500), and the adhesive layer can mainly use a hot melt tape.

[0110]

[0111] Below, the specific description of the components is as described above in the invention of the contactless metal card.

[0112]

[0113] According to one embodiment of the present invention, since the COM chip (30) is assembled in the final process after laminating the metal body (200), the back sheet (300), and the front sheet (400), the possibility of chip damage during the process can be completely eliminated.

[0114] In addition, since it is a contactless method with no physical contact between the antenna (100) and the COM chip (30), the possibility of a defective progressive RF can be fundamentally blocked.

[0115] In addition, since the entire area of ​​the COM chip (30) is bonded to the insert molding part, the possibility of the COM chip (30) being detached due to external stress can be dramatically improved.

[0116] Additionally, since pocket milling is performed using existing plastic contact card equipment, there is no need to invest in separate additional equipment, which can save time and cost.

[0117]

[0118] The detailed description of the preferred embodiments of the present invention disclosed above has been provided to enable those skilled in the art to implement and practice the present invention. While the above description has been made with reference to preferred embodiments of the present invention, those skilled in the art will appreciate that various modifications and variations can be made to the present invention without departing from the scope of the present invention. For example, those skilled in the art can utilize the individual components described in the above-described embodiments in combination with each other. Accordingly, the present invention is not intended to be limited to the embodiments described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0119] The present invention may be embodied in other specific forms without departing from the spirit and essential characteristics thereof. Therefore, the above detailed description should not be construed in any way as limiting but rather as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all changes coming within the equivalent scope of the claims are intended to be embraced therein. The present invention is not intended to be limited to the embodiments set forth herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. Furthermore, claims that are not explicitly cited in the claims may be combined to form embodiments or incorporated into new claims by post-application amendment.

[0120] {Explanation of symbols}

[0121] 100: Antenna

[0122] 110: Capacitance pattern section

[0123] 120: Primary coil section

[0124] 130: Secondary coil section

[0125] 140: Upper pattern

[0126] 150: Lower pattern

[0127] 200: Metal body

[0128] 202: Metal sheet

[0129] 210: Body

[0130] 220: Milling processing section

[0131] 230: Opening

[0132] 240: Slit section

[0133] 300: Rear seat

[0134] 302: Rear seat

[0135] 400: Front seat

[0136] 402: Front seat

[0137] 410: Pocket milling section

[0138] 500: COM chip module

[0139] 510: Chip molding section

[0140] 520: Lead frame section

[0141] 600: Metal card with bevel processing completed

[0142]

[0143] A method for manufacturing a contactless metal card according to an embodiment of the present invention involves laminating a metal body, a back sheet, and a front sheet, and then assembling a COM chip in the final process, thereby completely eliminating the possibility of chip breakage during the process, and thus has industrial applicability.

Claims

1. As a metal card that implements RF performance by applying a COM chip module, An antenna that transmits and receives information to and from the outside world; A metal body providing a space for accommodating the antenna, an opening insert-molded with synthetic resin to accommodate a portion of the COM chip module, and a slit formed from the opening to the end of the metal card; A rear sheet manufactured in a shape corresponding to the above metal body and laminated and bonded to the rear of the above metal body; and A front sheet corresponding to the rear sheet and laminated and bonded to the front of the metal body; The above metal body, the rear sheet, and the front sheet are each laminated and combined, and after chamfering, a pocket milling portion is formed in the front sheet corresponding to the shape of the COM chip module. A contactless metal card characterized in that the COM chip module is coupled to the pocket milling section.

2. In claim 1, The above metal body, The main body that forms the exterior; A milling part formed on a part of the body to accommodate the antenna; and An opening that is insert-molded with synthetic resin or filled with a synthetic resin material prosthesis so that a part of the COM chip module is combined in a part of the milling processing section; The above slit portion, A contactless metal card characterized by being formed through the above opening and milling processing to the end of the body.

3. In claim 2, A contactless metal card characterized in that the pocket milling section is formed to correspond to the shape of a portion of the COM chip module and to enable coupling of the COM chip module, which is included in the opening.

4. In claim 3, The above COM chip module, A chip molding part in which the above COM chip is molded and combined; and A contactless metal card characterized by including a lead frame portion that supports the chip molding portion from below and is coupled to the front sheet and the pocket milling portion of the opening.

5. In claim 4, The above pocket milling part, A contactless metal card characterized in that it is included in the front sheet and formed to enable the combination of the COM chip module in correspondence with the lead frame portion and chip molding portion of the COM chip module.

6. In claim 1, The above antenna, The above COM chip module and the primary coil part that primarily receives current through magnetic induction; A secondary coil portion extending from the primary coil to form a closed loop coil pattern; and A contactless metal card characterized by including a capacitance pattern section composed of an upper pattern and a lower pattern configured in parallel at both ends of the primary coil section and the secondary coil section.

7. In claim 1, A contactless metal card characterized in that the above back sheet is laminated with a back printing sheet, an overlay film, and an MS tape film layer.

8. In claim 1, A contactless metal card characterized in that the front sheet is laminated with a front printing sheet and an overlay film layer.

9. In any one of claims 1 to 8, A metal sheet formed by forming a plurality of the above metal bodies; A back sheet manufactured in a shape corresponding to the metal sheet and laminated and bonded to the back of the metal sheet; and A front sheet corresponding to the above rear sheet and laminated and bonded to the front of the metal sheet; including, The above metal sheet is punched and separated into individual metal bodies, A contactless metal card characterized in that a pocket milling portion is formed in the metal body and the COM chip module is coupled to the pocket milling portion.

10. In order to implement RF performance by applying a COM chip module according to any one of claims 1 to 9, a metal body is provided which provides an antenna for transmitting and receiving information with the outside, a space for accommodating the antenna, an opening that is insert-molded with synthetic resin to accommodate a portion of the COM chip module, and a slit portion formed from the opening to the end of the metal card, a back sheet that is manufactured in a shape corresponding to the metal body and is laminated and combined on the back of the metal body, and a front sheet that corresponds to the back sheet and is laminated and combined on the front of the metal body, wherein the metal body, the back sheet, and the front sheet are respectively laminated and combined, and after chamfering, a pocket milling portion is formed on the front surface corresponding to the shape of the COM chip module, and the COM chip module is coupled to the pocket milling portion, wherein the metal body comprises: a body main body forming an outer shape; a milling portion formed on a portion of the body main body to accommodate the antenna; And an opening that is insert-molded with synthetic resin or filled with a prosthesis of synthetic resin material so that a part of the COM chip module is combined with a part of the milling processing part; wherein the slit part is formed through the opening and the milling processing part to the end of the body main body, and the pocket milling part is included in the opening and formed to correspond to the shape of a part of the COM chip module so that the COM chip module can be combined, as a method for manufacturing a contactless metal card, Metal body manufacturing step for manufacturing the above metal body; A rear sheet lamination step of laminating the rear sheet on the rear of the metal body after the metal body manufacturing step; A front sheet lamination step of laminating the front sheet on the front of the metal body after the rear sheet lamination step; A laminating step of laminating the metal body on which the rear sheet and the front sheet are laminated after the front sheet laminating step; A chamfering processing step for chamfering the metal card after the laminating step; A pocket milling part forming step for forming the pocket milling part on the metal card after the above chamfering processing step; and A method for manufacturing a contactless metal card, characterized in that it comprises a COM chip module combining step of combining the COM chip module corresponding to the pocket milling section after the pocket milling section forming step.

11. In claim 9, A metal sheet manufacturing step for manufacturing a metal sheet in which the above metal body is formed in multiple pieces; A back sheet lamination step of producing a back sheet corresponding to the metal sheet after the above metal sheet manufacturing step and laminating the back sheet on the back of the metal sheet; A front sheet laminating step of producing a front sheet corresponding to the rear sheet after the rear sheet laminating step and laminating it on the front of the metal sheet; A laminating step of laminating the metal sheet on which the back sheet and the front sheet are laminated after the front sheet laminating step; A metal sheet punching step for separating the metal sheet by punching it into individual sheets after the above laminating step; A chamfering processing step for chamfering the metal card after the metal sheet punching step; A pocket milling part forming step for forming the pocket milling part on the metal card after the above chamfering processing step; and A method for manufacturing a contactless metal card, characterized in that it comprises a COM chip module combining step of combining the COM chip module corresponding to the pocket milling section after the pocket milling section forming step.

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