Semiconductor heat treatment device and carrying device transmission method thereof

Abstract

The present disclosure provides a semiconductor heat treatment device and a carrying device transmission method thereof. The semiconductor heat treatment device comprises: a plurality of process chambers, divided into at least one chamber group; carrying devices, having one-to-one correspondence to the chamber groups; at least one transmission execution mechanism, the transmission execution mechanisms being connected to the carrying devices in a one-to-one correspondence manner and configured to drive the corresponding carrying devices to perform an incoming action or an outgoing action; a controller, communicationally connected with the transmission execution mechanisms and configured to receive an incoming instruction or an outgoing instruction corresponding to a specified process chamber, and control, according to the incoming instruction or the outgoing instruction, a transmission execution mechanism corresponding to a chamber group to which the specified process chamber belongs to perform the incoming action or the outgoing action; and a superordinate computer, communicationally connected with the controller and configured to send the incoming instruction or the outgoing instruction to the controller by using a preset scheduling method. The present solution solves the problems in the prior art of low automation degree and scheduling efficiency, redundant structure, high energy consumption of the entire machine, and high device manufacturing and maintenance costs.

Description

Semiconductor heat treatment equipment and carrier transmission method thereof Technical Field

[0001] The present disclosure relates to the technical field of semiconductor heat treatment equipment, and in particular, to a semiconductor heat treatment equipment and a method for transmitting a carrier device thereof. Background Art

[0002] As photovoltaic equipment (such as semiconductor heat treatment equipment such as horizontal diffusion furnaces) develops towards the direction of "large production capacity and low cost", the number of cantilever paddles (used to carry processed workpieces such as wafers) contained in a single photovoltaic equipment has also developed from 2 to the current mainstream 5-6. The cantilever paddle is one of the core components of semiconductor heat treatment equipment. Rapid and efficient automatic control and scheduling of the cantilever paddle is an indispensable key core technology for reducing costs and increasing efficiency of semiconductor heat treatment equipment.

[0003] Figure 1 is a block diagram of the principles of a conventional cantilever paddle control device. As shown in Figure 1, semiconductor heat treatment equipment includes multiple process chambers (e.g., furnace tubes), each of which is equipped with a cantilever paddle, a transfer actuator, and a slave computer. The master computer sends a series of commands to each slave computer, such as paddle forward, paddle lower, paddle reverse, and furnace door closing, so that each slave computer drives the transfer actuator to independently control the cantilever paddle's transmission. The transfer actuator is used to drive the cantilever paddle up and down and translate, enabling the cantilever paddle to be transferred into and out of the corresponding process chamber.

[0004] However, the above control device inevitably has the following problems in practical application, namely:

[0005] First, each lower computer independently controls the transmission of the cantilever propeller by receiving a series of commands from the upper computer, such as propeller forward, propeller downward, propeller backward, and furnace door closing. This step-by-step control method has a low degree of automation and scheduling efficiency, and cannot meet the needs of highly automated control.

[0006] Secondly, due to the limitation of the energy consumption of the whole machine, it generally does not work at full capacity, that is, all cantilever paddles are used to work at the same time. Therefore, equipping each process chamber with a set of cantilever paddles and transmission actuators not only causes structural redundancy, but also increases the equipment manufacturing and maintenance costs. In addition, the cantilever paddles in standby state will also increase the energy consumption of the whole machine.

[0007] Summary of the Invention

[0008] The present disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor heat treatment equipment and a control method for its carrier device, which can solve the problems in the prior art of low automation and scheduling efficiency, structural redundancy, high energy consumption of the whole machine, and high equipment manufacturing and maintenance costs.

[0009] To achieve the purpose of the present disclosure, a semiconductor thermal processing device is provided, comprising:

[0010] A plurality of process chambers, wherein the plurality of process chambers are divided into at least one chamber group;

[0011] At least one carrying device for carrying a workpiece to be processed; the carrying device corresponds to the chamber group one by one;

[0012] At least one transfer actuator connected to each of the carriers in a one-to-one correspondence, the transfer actuator being used to drive the corresponding carrier to perform an incoming action or an outgoing action, wherein the incoming action or the outgoing action is used to transfer the carrier into or out of any process chamber in the corresponding chamber group;

[0013] a controller, communicatively connected to the transfer execution mechanism, configured to receive an incoming instruction or an outgoing instruction corresponding to the designated process chamber, and control the transfer execution mechanism corresponding to the chamber group to which the designated process chamber belongs to perform the incoming action or the outgoing action according to the incoming instruction or the outgoing instruction;

[0014] A host computer is communicatively connected to the controller and is used to send the incoming instruction or the outgoing instruction to the controller using a preset scheduling method.

[0015] Optionally, the semiconductor heat treatment equipment further includes:

[0016] At least one braking mechanism is provided in one-to-one correspondence with the carrying device, and is used to brake the corresponding carrying device when receiving a braking signal; and release the brake of the corresponding carrying device when receiving a braking release signal;

[0017] The controller is further configured to send the braking signal or the braking release signal to the braking mechanism.

[0018] Optionally, the braking mechanism includes:

[0019] Locking cylinder;

[0020] a clamp connected to the piston rod of the locking cylinder, for braking the corresponding carrying device when the piston rod extends from the locking cylinder; and releasing the brake of the corresponding carrying device when the piston rod retracts;

[0021] A control air circuit is connected to the locking cylinder and is used to supply air to the locking cylinder when receiving the braking signal so that the piston rod extends from the locking cylinder; and to discharge the air in the locking cylinder when receiving the brake release signal so that the piston rod retracts.

[0022] Optionally, the interior of the locking cylinder is divided into a first air cavity and a second air cavity by the piston rod, and one end of the piston rod passes through the second air cavity and extends out of the locking cylinder;

[0023] The control air circuit includes a reversing valve, a relief valve and an air source, wherein the air source is connected to the reversing valve through a first air circuit, the relief valve is connected to the reversing valve through a second air circuit, and the reversing valve is connected to the first air cavity and the second air cavity through a third air circuit and a fourth air circuit respectively;

[0024] The reversing valve switches to the first state when receiving the braking signal; switches to the second state when receiving the braking release signal; in the first state, the reversing valve connects the first air path with the third air path, and disconnects the second air path with the fourth air path; in the second state, the reversing valve connects the second air path with the third air path, and disconnects the first air path with the fourth air path.

[0025] Optionally, the plurality of process chambers are arranged in sequence along the vertical direction;

[0026] The transfer actuator is used to drive the corresponding carrier device to move up and down, so that the carrier device moves to the height position where any process chamber in the corresponding chamber group is located, and is also used to drive the carrier device at the height position to move horizontally, so as to transfer the carrier device into or out of the process chamber;

[0027] The braking mechanism is used to brake the corresponding carrying device in the vertical direction when receiving the braking signal.

[0028] Optionally, the transmission execution mechanism includes:

[0029] A lifting drive assembly, connected to the corresponding carrying device, for driving the corresponding carrying device to lift;

[0030] A horizontal drive assembly connected to the lifting drive assembly, used to drive the lifting drive assembly and the carrying device to translate synchronously;

[0031] A loading and unloading robot arm and a driving assembly for driving the loading and unloading robot arm to lift and translate. The loading and unloading robot arm is used to load or unload the workpiece to be processed from the carrying device under the drive of the driving assembly.

[0032] Optionally, the controller includes:

[0033] A first input module, configured to receive a first sensor feedback signal related to controlling the transmission actuator;

[0034] A control module is used to control the transmission actuator to perform the incoming action or the outgoing action according to the feedback signal of the first sensor.

[0035] Optionally, the controller further includes:

[0036] A second input module is used to receive a second sensor feedback signal related to controlling the opening and closing state of the chamber door of each process chamber;

[0037] The control module is further configured to control the cavity door to perform opening and closing actions according to a feedback signal from the second sensor.

[0038] As another technical solution, the present disclosure further provides a method for transporting a carrier device of a semiconductor heat treatment equipment, the method comprising:

[0039] receiving an incoming command or an outgoing command corresponding to a designated process chamber;

[0040] According to the incoming instruction or the outgoing instruction, controlling a transmission execution mechanism corresponding to the chamber group to which the designated process chamber belongs to execute the incoming action or the outgoing action;

[0041] The said incoming action or the said outgoing action is used to input or output the carrying device for carrying the workpiece to be processed into or out of any process chamber in the corresponding chamber group.

[0042] Optionally, the plurality of process chambers are arranged in sequence along the vertical direction;

[0043] Controlling the transmission execution mechanism to execute the incoming action includes:

[0044] Controlling the transmission actuator to drive the corresponding carrying device to move up and down, so that the carrying device moves to the height position where the designated process chamber is located;

[0045] Controlling the door of the designated process chamber to open;

[0046] Controlling the transfer actuator to drive the carrier located at the height position to translate, so as to transfer the carrier into the designated process chamber;

[0047] Controlling the transmission execution mechanism to execute the outgoing action includes:

[0048] controlling the transfer actuator to drive the carrier in the designated process chamber to translate, so as to transfer the carrier out of the process chamber;

[0049] The door of the designated process chamber is controlled to be closed.

[0050] Optionally, the semiconductor heat treatment equipment includes at least one braking mechanism, which is provided in one-to-one correspondence with the carrying device; and the method further includes:

[0051] When the carrying device is stationary or has completed a lifting action or is in an abnormal state, sending a braking signal to the braking mechanism, so that the braking mechanism brakes the corresponding carrying device in the vertical direction when receiving the braking signal;

[0052] When the incoming instruction or the outgoing instruction is received, a brake release signal is sent to the brake mechanism, so that the brake mechanism releases the brake of the corresponding carrying device when receiving the brake release signal.

[0053] The present disclosure has the following beneficial effects:

[0054] In the technical solution of the semiconductor heat treatment equipment and the method for controlling the carrier device thereof provided by the present disclosure, a carrier device corresponds one-to-one to a chamber group, and a transfer actuator corresponds one-to-one to a carrier device. The incoming action or outgoing action performed by the transfer actuator is used to transfer the carrier device into or out of any process chamber in the corresponding chamber group. For a chamber group including multiple process chambers, a transfer actuator and a carrier device can be shared, and there is no need to equip all process chambers with a transfer actuator and a carrier device, thereby reducing structural redundancy, reducing the energy consumption of the entire machine, and reducing equipment manufacturing and maintenance costs. On this basis, by combining the use of a controller to communicate with each transmission actuator and to communicate with the host computer, one controller can be used to control the transmission of multiple carriers, that is, to achieve "one-to-many" control. Specifically, the host computer can use a preset scheduling method to send an input instruction or an output instruction corresponding to the specified process chamber to the controller. According to the input instruction or the output instruction, the controller controls the transmission actuator corresponding to the chamber group to which the specified process chamber belongs to perform an input action or an output action, that is, to transmit the carrier to or from the specified process chamber in the corresponding chamber group. Compared with the prior art in which each lower computer is used to independently and step-by-step control the transmission actuator corresponding to each process chamber, on the basis of multiple process chambers sharing one transmission actuator and carrier, combined with the preset scheduling method adopted by the host computer, the input action or the output action can be automatically completed according to the instruction issued by the host computer, without the need for the host computer to issue a series of commands one by one for step-by-step control, thereby effectively improving the degree of automation and scheduling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] FIG1 is a block diagram of the principle of a conventional cantilever propeller control device;

[0056] FIG2 is a schematic block diagram of a semiconductor thermal processing apparatus according to an embodiment of the present disclosure;

[0057] FIG3 is a schematic diagram of the structure of a transmission actuator used in an embodiment of the present disclosure;

[0058] FIG4 is a schematic diagram of a control gas circuit used in an embodiment of the present disclosure;

[0059] FIG5 is a diagram showing the positional relationship between the locking cylinder and the bow of the boat in a braking state in an embodiment of the present disclosure;

[0060] FIG6 is a flowchart of a method for transporting a carrier device of a semiconductor thermal processing equipment according to an embodiment of the present disclosure;

[0061] FIG7 is a flowchart of a method for controlling a transmission execution mechanism to execute an incoming action according to an embodiment of the present disclosure;

[0062] FIG8 is a flowchart of a method for controlling a transmission execution mechanism to execute an outgoing action adopted in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0063] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the semiconductor heat treatment equipment and the control method of the carrier device provided by the present disclosure are described in detail below with reference to the accompanying drawings.

[0064] Please refer to Figure 2. The semiconductor heat treatment equipment provided by the embodiment of the present disclosure is, for example, a heat treatment equipment such as a diffusion furnace. The semiconductor heat treatment equipment includes: multiple process chambers (not shown in the figure), at least one carrier device 2, at least one transmission actuator 3, a controller 4 and a host computer 5, wherein the multiple process chambers are divided into at least one chamber group 1. The chamber group 1 may include one or more process chambers. The number of process chambers in different chamber groups 1 may be the same or different. For example, for a diffusion furnace, the number of process chambers (also known as furnace tubes) is generally 5 or 6. In this case, it can be divided into 2 chamber groups 1. A chamber group 1 may include 2 or 3 process chambers. The process chamber usually has an openable and closable chamber door (also known as a furnace door). When the chamber door is open, the carrier device 2 can be passed in or out; when the chamber door is closed, it can provide a closed space for the process chamber.

[0065] At least one carrier 2 is used to support the workpiece being processed. For a diffusion furnace, this carrier 2 is typically a cantilever paddle. The workpiece being processed, for example, is a wafer, which is typically loaded onto a wafer boat, which is supported by the cantilever paddle. Each carrier 2 corresponds one-to-one with each chamber group 1. That is, each process chamber in the same chamber group 1 shares one carrier 2, and this carrier 2 can be transferred to or from any process chamber in the corresponding chamber group 1. For example, if there are two chamber groups 1, two carriers 2 are provided, and each process chamber in each chamber group shares one carrier 2.

[0066] The number of transfer actuators 3 is the same as the number of carriers 2, and they are connected one-to-one. The transfer actuators 3 are used to drive the corresponding carriers 2 to perform an incoming action or an outgoing action, which is used to transfer the carriers 2 into or out of any process chamber in the corresponding chamber group 1. Specifically, the process chambers in the same chamber group 1 share one transfer actuator 3, which can transfer the corresponding carrier 2 into or out of any process chamber in the corresponding chamber group 1. For example, as shown in Figure 2, if the chambers are divided into two groups, two transfer actuators 3 are correspondingly provided, and the process chambers in each chamber group share one transfer actuator 3.

[0067] A controller 4 is communicatively coupled to the transmission actuator 3 and is configured to receive incoming or outgoing instructions corresponding to a designated process chamber and, based on the incoming or outgoing instructions, control the transmission actuator 3 corresponding to the chamber group 1 to which the designated process chamber belongs to execute an incoming or outgoing action. A host computer 5 is communicatively coupled to the controller 4 and is configured to send incoming or outgoing instructions to the controller 4 using a preset scheduling method. The controller 4 can control all transmission actuators 3. The controller 4, for example, can be a programmable logic controller (PLC) that interacts with the host computer 5 in real time, for example, via an EtherCAT bus (Ethernet Control Automation Technology). For example, a switch 6 is connected between the controller 4 and the host computer 5. The controller 4 can also communicate with each transmission actuator 3 via the EtherCAT bus.

[0068] In some embodiments, the controller 4 includes a first input module 42 and a control module 41, wherein the first input module 42 is used to receive a first sensor feedback signal related to controlling the transmission actuator 3; and the control module 41 is used to control the transmission actuator 3 to perform an incoming action or an outgoing action based on the first sensor feedback signal. Sensors for detecting position, limit, etc. are generally provided on the transmission actuator 3 and the carrier 2. These sensors can send the detected position information and in-position information about the transmission actuator 3 and the carrier 2 to the control module 41 via the first input module 42. This position information and in-position information are collectively referred to as the first sensor feedback signal. The control module 41 can control the transmission actuator 3 to perform an incoming action or an outgoing action based on the first sensor feedback signal.

[0069] In some embodiments, the controller 4 further includes a second input module 43, which is used to receive a second sensor feedback signal related to controlling the opening and closing status of the chamber door of each process chamber; the control module 41 is also used to control the chamber door to perform opening and closing actions based on the second sensor feedback signal. In this way, the controller 4 can realize automatic control of the chamber door. A limit sensor is provided at the chamber door of the process chamber, and the limit sensor can send the detected chamber door opening and closing status information to the control module 41 through the second input module 43. The opening and closing status information is the above-mentioned second sensor feedback signal. In addition, in one example, the controller 4 can also include a third input module 44, which is used to receive the acquisition signal of the entire system. The acquisition signal includes, for example, the CDA (cylinder stop) signal of the chamber door, the EMO (normally closed) signal, the alarm stop signal, etc. The control module 41 is also used to execute logic outputs including buzzer control, alarm tower light control, etc. when receiving the above-mentioned acquisition signal.

[0070] The host computer 5 can be used as a human-computer interface and monitors the movement information of the carrier device 2 and the furnace door information through real-time interaction with the controller 4. This information specifically includes the position, speed, limit status, and furnace door status of the carrier device 2. During debugging, the host computer 5 can also be used to optimize the program and change configuration parameters. During the transmission control process of the carrier device 2, the host computer 5 is used to send input instructions or output instructions to the controller 4 using a preset scheduling method. This preset scheduling method is used to implement the deployment of each carrier device 2 to ensure efficient scheduling of the movement of the carrier device 2 based on the ability to transfer the carrier device 2 to or from any process chamber in the corresponding chamber group.

[0071] In some embodiments, the semiconductor heat treatment equipment may further include a plurality of slave computers, each of which corresponds to each process chamber, and each of which is used to receive sensor feedback signals related to the process chamber executing the process, and receive the first sensor feedback signal and the second sensor feedback signal sent by the controller 4. Each slave computer may also be used to control the process chamber to execute the process according to commands related to the process chamber executing the process issued by the upper computer 5. That is to say, the controller 4 and the slave computer in the embodiment of the present disclosure have their own control objects and execute different instructions. The controller 4 is used to execute incoming instructions or outgoing instructions, while the slave computer is used to execute commands related to the process; moreover, the controller 4 and the slave computer collect different sensor feedback signals. The controller 4 is used to collect the above-mentioned first and second sensor feedback signals, while the slave computer collects sensor feedback signals related to the process chamber executing the process.

[0072] In the semiconductor heat treatment equipment provided by the embodiment of the present disclosure, a carrier device 2 corresponds one-to-one to a group of chamber groups 1, and a transfer actuator 3 corresponds one-to-one to a carrier device 2. The incoming action or outgoing action performed by the transfer actuator 3 is used to transfer the carrier device 2 into or out of any process chamber in the corresponding chamber group. For a chamber group 1 including multiple process chambers, a transfer actuator 3 and a carrier device 2 can be shared, and there is no need to equip all process chambers with a transfer actuator 3 and a carrier device 2, thereby reducing structural redundancy, reducing the energy consumption of the entire machine, and reducing the equipment manufacturing and maintenance costs. On this basis, by using a controller 4 to communicate with each transmission actuator 3 and to communicate with the host computer 5, it is possible to realize that one controller 4 controls the transmission of multiple carrier devices 2, that is, to realize "one-to-many" control. Specifically, the host computer 5 can use a preset scheduling method to send an input instruction or an output instruction corresponding to the specified process chamber to the controller 4. According to the input instruction or the output instruction, the controller 4 controls the transmission actuator 3 corresponding to the chamber group 1 to which the specified process chamber belongs to perform the input action or the output action, that is, to transmit the carrier device 2 to or from the specified process chamber in the corresponding chamber group 1. Compared with the prior art in which each lower computer is used to independently and step-by-step control the transmission actuator corresponding to each process chamber, on the basis of multiple process chambers sharing one transmission actuator 3 and carrier device 2, combined with the preset scheduling method adopted by the host computer 5, the input action or the output action can be automatically completed according to the instruction issued by the host computer 5, without the need for the host computer 5 to issue a series of commands one by one for step-by-step control, thereby effectively improving the degree of automation and scheduling efficiency.

[0073] In some embodiments, multiple process chambers are arranged vertically in sequence. In this case, the transport actuator 3 is used to drive the corresponding carrier 2 up and down, so that the carrier 2 moves to the height position of any process chamber in the corresponding chamber group 1. The transport actuator 3 is also used to drive the carrier 2 at this height position to move the carrier 2 in translation, so as to transfer the carrier 2 into or out of the process chamber. Taking a horizontal diffusion furnace as an example, multiple process chambers are arranged vertically in sequence, and the chamber door of each process chamber is located on one side of the chamber in the horizontal direction. In this case, the transport actuator 3 drives the corresponding carrier 2 up and down, so that the carrier 2 can be selectively raised and lowered to the height position of any process chamber in the corresponding chamber group 1, that is, the carrier 2 is at the same height as one of the process chambers, so that it can be opposite the chamber door of the process chamber. Based on this, with the chamber door open, the transport actuator 3 can drive the carrier 2 at this height position to move translationally, so that the carrier 2 can be transferred into or out of the process chamber.

[0074] There may be various types of transmission actuators 3 for realizing the above functions. For example, as shown in FIG3 , the transmission actuator 3 includes: a lifting drive assembly 35, a horizontal drive assembly 34, a loading and unloading robot arm, and a drive assembly for driving the loading and unloading robot arm to lift and translate. The lifting drive assembly 35 is connected to the corresponding carrier 2 for driving the corresponding carrier 2 to lift and lower. The horizontal drive assembly 34 is connected to the lifting drive assembly 35 for driving the lifting drive assembly 35 and the carrier 2 to translate synchronously. The loading and unloading robot arm is used to load or unload the workpiece to be processed from the carrier 2 under the drive of the drive assembly, for example, loading or unloading the wafer boat 10 carrying the wafers from the cantilever paddle 2. In a specific embodiment, the lifting drive assembly 35 includes a lifting drive and a lifting motor, wherein the lifting motor is connected to the carrier 2 through a transmission assembly. The rotational power provided by the lifting motor is converted into linear power in the vertical direction by the transmission assembly and transmitted to the carrier 2. The transmission assembly, for example, includes a screw and a nut in a threaded engagement. The screw is disposed vertically, and a lifting motor is used to drive the screw to rotate, thereby driving the nut to move along the screw. The nut is connected to the supporting device 2, for example, to the bow 21 of the cantilever paddle 2. The lifting driver is used to exchange information and convert signals with the controller 4, for example, converting control signals from the controller 4 to control the lifting motor to perform actions. The lifting driver and the lifting motor are, for example, a servo driver and a servo motor.

[0075] The horizontal drive assembly 34 is, for example, fixed to the frame 33. The horizontal drive assembly 34 may be one or more. For example, two horizontal drive assemblies 34 are shown in FIG3 . The two are arranged opposite to each other in the vertical direction and are connected to the lifting drive assembly 35 near its two ends, and are used to jointly drive the lifting drive assembly 35 to move in translation. Specifically, the horizontal drive assembly 34 includes a horizontal drive and a horizontal motor, wherein the horizontal motor is connected to the supporting device 2 through a transmission assembly, and the rotational power provided by the horizontal motor is converted into linear power in the horizontal direction by the transmission assembly and transmitted to the lifting drive assembly 35. The transmission assembly includes, for example, a transmission belt. The horizontal drive is used to exchange information and convert signals with the controller 4, for example, converting the control signal from the controller 4 so as to control the horizontal motor to perform an action. The horizontal drive and the horizontal motor are, for example, a servo drive and a servo motor.

[0076] The drive assembly for driving the loading and unloading robot arm to lift and translate, for example, includes a lifting cylinder 31 and two horizontal motors 32. The lifting cylinder 31 is connected to the two horizontal motors 32 to drive the two horizontal motors 32 to lift and translate synchronously. The two horizontal motors 32 are connected to the loading and unloading robot arm near its ends to jointly drive the loading and unloading robot arm to translate, thereby loading or unloading workpieces from the support device 2. For example, when the loading and unloading robot arm translates to a retracted position (close to the lifting cylinder 31), the loading and unloading robot arm can load or unload workpieces (e.g., a wafer boat). When the loading and unloading robot arm translates to an extended position (away from the lifting cylinder 31), the loading and unloading robot arm can load or unload workpieces (e.g., a wafer boat) onto the support device 2 (e.g., a cantilever paddle). The two horizontal motors 32 are connected to the loading and unloading robot arm via a transmission assembly. The transmission assembly converts the rotational power provided by the horizontal motors 32 into horizontal linear power, which is then transmitted to the loading and unloading robot arm. In addition, the two horizontal motors 32 can realize the reciprocating translation of the loading and unloading robotic arms by switching between forward and reverse rotation.

[0077] In some embodiments, the semiconductor heat treatment apparatus further includes at least one braking mechanism 11, each corresponding to a carrier 2, configured to brake the corresponding carrier 2 upon receiving a braking signal and release the brakes upon receiving a release signal. The controller 4 is further configured to send the braking or release signal to the braking mechanism 11. By utilizing the braking mechanism 11 in conjunction with the controller 4, safety interlock control of the carrier 2 can be achieved.

[0078] In the case where multiple process chambers are arranged in sequence along the vertical direction, the carrier device 2 shared by multiple process chambers has a long vertical movement stroke, and there may be a safety risk of the carrier device 2 falling due to reasons such as failure of a switch (such as a brake). Therefore, the braking mechanism 11 is used to brake the corresponding carrier device 2 in the vertical direction when receiving a braking signal, thereby preventing the carrier device 2 from falling.

[0079] There are many types of braking mechanisms 11 for realizing the above functions. For example, as shown in Figures 4 and 5, the braking mechanism 11 includes a locking cylinder 111, a clamp (not shown in the figures) and a control air circuit, wherein the clamp is connected to the piston rod 11c of the locking cylinder 111, and is used to brake the corresponding carrying device 2 when the piston rod 11c extends from the locking cylinder 111. For example, as shown in Figure 5, taking the carrying device 2 as a cantilever paddle as an example, when the piston rod 11c extends from the locking cylinder 111, the piston rod 11c extends into the bow 21 of the cantilever paddle to prevent the cantilever paddle from rising and falling. At the same time, the clamp, for example, extends into the travel path of the lifting drive assembly to block the movement of the lifting drive assembly. In actual applications, the locking cylinder 111 and the clamp can adopt any braking structure, and the embodiments of the present disclosure have no special restrictions on this. When the piston rod 11c retracts, the corresponding carrying device 2 is released from the brake; the control air circuit is connected to the locking cylinder 111, and is used to supply air to the locking cylinder 111 when a brake signal is received, so that the piston rod 11c extends from the locking cylinder 111; when a brake release signal is received, the air in the locking cylinder 111 is discharged to retract the piston rod 11c. In one example, the movement of the piston rod 11c of the locking cylinder 111 and the braking action of the clamp can both be controlled by the controller 4, that is, the braking signal includes a clamp clamping signal and a locking cylinder 111 locking signal. When the locking cylinder 111 receives the locking cylinder 111 locking signal output by the controller 4, and the clamp receives the clamp clamping signal output by the controller 4, the piston rod 11c extends from the locking cylinder 111, and the clamp brakes the corresponding carrying device 2 in the vertical direction. The brake release signal includes a brake on signal and a locking cylinder 111 on signal. When the locking cylinder 111 receives the brake on signal from the controller 4, and the brake receives the brake on signal from the controller 4, the brake releases the brakes on the corresponding load-bearing device 2 and retracts the piston rod 11c. By controlling the movement of the piston rod 11c of the locking cylinder 111 and the braking action of the brake, the controller 4 can achieve dual protection against falling of the load-bearing device 2.

[0080] In some embodiments, the controller 4 can determine the motion state of the load-bearing device 2 based on the feedback signal received from the first sensor. When the load-bearing device 2 is stationary, after completing the lifting motion, or in an abnormal state, the controller 4 can output a braking signal to prevent the load-bearing device 2 from falling. Furthermore, the locking cylinder 111 can also feedback position information to the controller 4. For example, after the controller 4 outputs the braking signal, the controller 4 can also feedback information about the load-bearing device 2 being in a locked state in the vertical direction to the host computer 5 when receiving the in-position feedback signal fed back by the locking cylinder 111, so that the host computer 5 can display this information on the human-computer interaction interface and can also provide the host computer 5 with software logic interlocking. When the controller 4 receives an incoming command or an outgoing command sent by the host computer 5, the controller 4 outputs a brake release signal and feedbacks information about the load-bearing device 2 being in an unlocked state in the vertical direction to the host computer 5 so that the host computer 5 can display this information on the human-computer interaction interface. In one example, after outputting the brake release signal, the controller 4 is further configured to determine whether the current state of the carrier 2 satisfies a preset interlocking condition. If so, the controller 4 controls the corresponding transmission actuator 3 to perform an incoming action or an outgoing action.

[0081] In a specific embodiment, as shown in FIG4 , the interior of the locking cylinder 111 is divided into a first air chamber 11a and a second air chamber 11b by a piston rod 11c, and one end of the piston rod 11c passes through the second air chamber 11b and extends out of the locking cylinder 111; the control air circuit includes a reversing valve 13, a relief valve 14 and an air source 12, wherein the air source 12 is connected to the reversing valve 13 through a first air circuit 15a, the relief valve 14 is connected to the reversing valve 13 through a second air circuit 15b, and the reversing valve 13 is connected to the third air circuit 15c and The fourth air path 15d is connected to the first air chamber 11a and the second air chamber 11b, respectively. The reversing valve 13 switches to the first state upon receiving a braking signal and to the second state upon receiving a brake release signal. In the first state, the reversing valve 13 connects the first air path 15a with the third air path 15c and disconnects the second air path 15b from the fourth air path 15d. In the second state, the reversing valve 13 connects the second air path 15b with the third air path 15c and disconnects the first air path 15a from the fourth air path 15d. Figure 4 shows the reversing valve 13 in the second state.

[0082] In some embodiments, the controller 4 can also switch between automatic mode, manual mode and program function mode, wherein, in automatic mode, the controller 4 can automatically control the corresponding transmission actuator 3 to perform an incoming action or an outgoing action upon receiving an incoming instruction or an outgoing instruction sent by the host computer 5. In manual mode, the controller 4 can control the corresponding transmission actuator 3 to perform an action corresponding to the instruction according to the instruction sent by the user through the host computer 5, such as servo control of the lifting drive component 35 and the horizontal drive component 34 in the transmission actuator 3, including functions such as enabling, resetting, returning to origin, speed control, and position control. In program function mode, the controller 4 can perform automatic or semi-automatic logic control of some actions, such as automatic feeding, automatic picking, semi-automatic feeding, semi-automatic picking, and opening and closing the cavity door, etc.

[0083] As another technical solution, the embodiment of the present disclosure further provides a method for transporting a carrier device of a semiconductor heat treatment device, wherein the semiconductor heat treatment device is the semiconductor heat treatment device provided in the embodiment of the present disclosure, as shown in FIG6 . The method includes:

[0084] S1. receiving an incoming instruction or an outgoing instruction corresponding to a designated process chamber;

[0085] S2, controlling the transmission actuator 3 corresponding to the chamber group 1 to which the designated process chamber belongs to perform an incoming action or an outgoing action;

[0086] The incoming action or the outgoing action is used to move the carrying device 2 for carrying the workpiece to be processed into or out of a designated process chamber in the corresponding chamber group 1 .

[0087] The selection of the above-mentioned designated process chamber may be achieved by the host computer 5 using a preset scheduling method.

[0088] The carrier device transmission method provided by the embodiment of the present disclosure can control the transmission execution mechanism 3 corresponding to the chamber group 1 to which the specified process chamber belongs to perform an incoming action or an outgoing action according to the incoming instruction or the outgoing instruction corresponding to the specified process chamber, that is, to transmit the carrier device 2 into or out of the specified process chamber in the corresponding chamber group 1. Compared with the prior art in which each lower computer is used to independently and step-by-step control the transmission execution mechanism corresponding to each process chamber, on the basis of multiple process chambers sharing one transmission execution mechanism and carrier device, combined with the preset scheduling method adopted by the upper computer, the incoming action or the outgoing action can be automatically completed according to the instruction issued by the upper computer, without the need for the upper computer to issue a series of commands one by one for step-by-step control, thereby effectively improving the degree of automation and scheduling efficiency.

[0089] In some embodiments, multiple process chambers are arranged in sequence along the vertical direction. In this case, as shown in FIG7 , the method for controlling the transfer actuator 3 to perform the transfer action includes:

[0090] S101, controlling the transmission actuator 3 to drive the corresponding carrier 2 to move up and down, so that the carrier 2 moves to the height position where the designated process chamber is located;

[0091] The above step S101 is executed when an incoming instruction corresponding to a designated process chamber is received, and the transmission execution mechanism 3 corresponds to the chamber group to which the designated process chamber belongs.

[0092] S102, controlling the door of the designated process chamber to open;

[0093] S103 , controlling the transfer actuator 3 to drive the carrier 2 located at the height position to move horizontally, so as to transfer the carrier 2 to the designated process chamber.

[0094] In some embodiments, after the above step S103, the method further includes:

[0095] S104 , controlling the transmission actuator 3 to drive the carrier device 2 in the process chamber to move up and down, so that the carrier device 2 is located at a material taking or feeding position.

[0096] Complete the above incoming actions.

[0097] In some embodiments, as shown in FIG8 , the method for controlling the transmission actuator 3 to perform the outgoing action includes:

[0098] S105 , controlling the transfer actuator 3 to drive the carrier 2 in the designated process chamber to translate, so as to transfer the carrier 2 out of the process chamber;

[0099] The above step S105 is executed when a transmission instruction corresponding to a designated process chamber is received, and the transmission execution mechanism 3 corresponds to the chamber group to which the designated process chamber belongs.

[0100] S106 , controlling the chamber door of the designated process chamber to close.

[0101] Complete the outgoing action described above.

[0102] In a specific embodiment, when an incoming instruction corresponding to a designated process chamber is received, the origin position information of the transmission actuator 3 is first obtained, and the origin position information is, for example, the origin position of the servo motor of the above-mentioned lifting drive assembly 35 and the horizontal drive assembly 34 in the transmission actuator 3. Then, after determining that the transmission actuator 3 has completed the last action, the current position information of the transmission actuator 3 is obtained. According to the current position information, there are two situations for the transmission actuator 3. The first situation is that the transmission actuator 3 is at a height position where one of the process chambers is located (it can be located inside the process chamber or outside the process chamber). The second situation is that the transmission actuator 3 is in a safe position, which is the extreme position of the transmission actuator 3 away from the process chamber in the translation direction.

[0103] In the first scenario described above, the horizontal drive assembly 34 can be controlled to drive the carrier 2 to translate, thereby transferring the carrier 2 into or out of the process chamber. During this process, upon receiving a torque alarm signal or an extreme position alarm signal, the horizontal drive assembly 34 is immediately controlled to stop. The horizontal drive assembly 34 is equipped with a torque sensor to detect whether it is generating torque and an in-position sensor to detect whether its translation motor has reached its forward or reverse extreme position. Both sensors provide feedback of the torque alarm signal or extreme position alarm signal. Upon receiving the in-position signal from the horizontal drive assembly 34, a signal indicating the completion of the operation is sent to the host computer 5. The translation motor of the horizontal drive assembly 34 is equipped with an encoder to determine whether the carrier 2 has reached the target position. This encoder provides feedback of the in-position signal. Furthermore, in the first scenario described above, if a new in-position or out-position command corresponding to another process chamber is received, the transfer actuator 3 is determined to be in a safe position. If so, the new in-position or out-position command is executed. If not, the horizontal drive assembly 34 is controlled to translate the carrier 2 to a safe position.

[0104] In the second case described above, the lifting drive assembly 35 can be controlled to drive the carrier 2 up and down. During this process, once a torque alarm signal or an extreme position alarm signal is received, the lifting drive assembly 35 is immediately controlled to stop. The lifting drive assembly 35 is provided with a torque sensor for detecting whether it generates torque, and an in-position sensor for detecting whether its lifting motor has reached the forward or reverse extreme position. The two sensors provide feedback of the torque alarm signal or the extreme position alarm signal. Upon receiving the in-position signal fed back by the lifting drive assembly 35, a signal indicating the completion of the action is sent to the upper computer 5. The lifting motor of the lifting drive assembly 35 is provided with an encoder to determine whether the carrier 2 has reached the target position. The encoder provides feedback of the in-position signal. In addition, when the lifting drive assembly 35 is controlled to drive the carrier 2 up and down, if the transmission actuator 3 does not reach the height position of the designated process chamber within the preset time, a position deviation alarm signal is sent to the upper computer 5, so that the upper computer 5 can perform operations such as pop-up prompts. In addition, in the second case above, if a new incoming instruction or outgoing instruction corresponding to other process chambers is received, the new incoming instruction or outgoing instruction is executed after the current incoming instruction or outgoing instruction is completed and the transmission execution mechanism 3 is located in a safe position.

[0105] In some embodiments, before controlling the transmission actuator 3 to drive the corresponding carrying device 2 to move up and down, the method further includes:

[0106] Determine whether the transport actuator 3 reaches a safe position within a preset time, where the safe position is the extreme position of the transport actuator 3 away from the process chamber in the translation direction;

[0107] If yes, the transmission actuator 3 is controlled to drive the corresponding carrying device 2 to move up and down;

[0108] If not, a position deviation alarm signal is issued.

[0109] In this way, it can be ensured that the carrying device 2 can be driven to move up and down only when the carrying device 2 is located outside the process chamber.

[0110] In some embodiments, in the case where multiple process chambers are arranged in sequence in the vertical direction, the carrier device 2 shared by the multiple process chambers has a long vertical movement stroke, and there may be a safety risk of the carrier device 2 falling due to reasons such as switch (e.g., brake) failure. To this end, the semiconductor heat treatment equipment may further include at least one braking mechanism, which is set in a one-to-one correspondence with the carrier device 2 and is used to brake the corresponding carrier device 2 in the vertical direction when a braking signal is received; and release the brake of the corresponding carrier device 2 when a braking release signal is received. The carrier device 2 transmission method provided in the embodiment of the present disclosure also includes:

[0111] When the carrying device 2 is stationary or has completed the lifting action or is in an abnormal state, a braking signal is sent to the braking mechanism, so that the braking mechanism brakes the corresponding carrying device 2 in the vertical direction when receiving the braking signal;

[0112] When an incoming command or an outgoing command is received, the brake release signal is sent to the brake mechanism, so that the brake mechanism releases the brake of the corresponding carrying device 2 when the brake release signal is received.

[0113] In one example, the motion state of the carrying device 2 can be judged based on the received first sensor feedback signal. When the carrying device 2 is stationary or after completing the lifting movement or an abnormal state occurs, the controller 4 can output a braking signal to prevent the carrying device 2 from falling.

[0114] The above-mentioned braking mechanism includes, for example, a locking cylinder 111, a clamp and a control air circuit. The structures and functions of these components have been described in detail in the above-mentioned embodiments and will not be repeated here. Optionally, the above-mentioned braking signal includes a clamp clamping signal and a locking cylinder 111 locking signal. When the locking cylinder 111 receives the locking cylinder 111 locking signal output by the controller 4, and the clamp receives the clamp clamping signal output by the controller 4, the piston rod 11c extends from the locking cylinder 111, and the clamp brakes the corresponding supporting device 2 in the vertical direction. The above-mentioned brake release signal includes a clamp opening signal and a locking cylinder 111 opening signal. When the locking cylinder 111 receives the locking cylinder 111 opening signal output by the controller 4, and the clamp receives the clamp opening signal output by the controller 4, the clamp releases the brake on the corresponding supporting device 2, and the piston rod 11c retracts. By controlling the movement of the piston rod 11 c of the locking cylinder 111 and the braking action of the clamp, dual protection of the carrying device 2 from falling can be achieved.

[0115] To sum up, in the technical solution of the semiconductor heat treatment equipment and the control method of its carrier device 2 provided by the embodiment of the present disclosure, one carrier device 2 corresponds one-to-one to a group of chamber groups 1, and one transmission actuator 3 corresponds one-to-one to one carrier device 2. The incoming action or outgoing action performed by the transmission actuator 3 is used to transfer the carrier device 2 into or out of any process chamber in the corresponding chamber group. For a chamber group 1 including multiple process chambers, a transmission actuator 3 and a carrier device 2 can be shared, and there is no need to equip all process chambers with a transmission actuator 3 and a carrier device 2, thereby reducing structural redundancy, reducing the energy consumption of the entire machine, and reducing the equipment manufacturing and maintenance costs. On this basis, by using a controller 4 to communicate with each transmission actuator 3 and to communicate with the host computer 5, it is possible to realize that one controller 4 controls the transmission of multiple carrier devices 2, that is, to realize "one-to-many" control. Specifically, the host computer 5 can use a preset scheduling method to send an input instruction or an output instruction corresponding to the specified process chamber to the controller 4. According to the input instruction or the output instruction, the controller 4 controls the transmission actuator 3 corresponding to the chamber group 1 to which the specified process chamber belongs to perform the input action or the output action, that is, to transmit the carrier device 2 to or from the specified process chamber in the corresponding chamber group 1. Compared with the prior art in which each lower computer is used to independently and step-by-step control the transmission actuator corresponding to each process chamber, on the basis of multiple process chambers sharing one transmission actuator 3 and carrier device 2, combined with the preset scheduling method adopted by the host computer 5, the input action or the output action can be automatically completed according to the instruction issued by the host computer 5, without the need for the host computer 5 to issue a series of commands one by one for step-by-step control, thereby effectively improving the degree of automation and scheduling efficiency.

[0116] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A semiconductor heat treatment device, wherein: include: A plurality of process chambers, wherein the plurality of process chambers are divided into at least one chamber group; At least one carrying device, used for carrying the workpiece to be processed; The carrying devices correspond one to one with the chamber groups; At least one transmission actuator connected to the carrier device in a one-to-one correspondence, the transmission actuator is used to drive the corresponding carrier device to perform an incoming action or an outgoing action, and the incoming action or the outgoing action is used to transfer the carrier device into or out of any process chamber in the corresponding chamber group; a controller, connected in communication with the transmission execution mechanism, configured to receive an incoming instruction or an outgoing instruction corresponding to the designated process chamber, and control the transmission execution mechanism corresponding to the chamber group to which the designated process chamber belongs to perform the incoming action or the outgoing action according to the incoming instruction or the outgoing instruction; A host computer is communicatively connected with the controller, and is used for sending the incoming instruction or the outgoing instruction to the controller by adopting a preset scheduling method.

2. The semiconductor heat treatment equipment according to claim 1, wherein: The semiconductor thermal processing equipment further comprises: At least one braking mechanism is provided in one-to-one correspondence with the carrying device, and is used to brake the corresponding carrying device when receiving a braking signal; and release the brake of the corresponding carrying device when receiving a brake release signal; The controller is further configured to send the braking signal or the braking release signal to the braking mechanism.

3. The semiconductor heat treatment equipment according to claim 2, wherein: The braking mechanism comprises: Locking cylinder; A clamp connected to the piston rod of the locking cylinder, used to brake the corresponding carrying device when the piston rod extends from the locking cylinder; and release the brake of the corresponding carrying device when the piston rod retracts; A control air circuit is connected to the locking cylinder and is used to supply air to the locking cylinder when receiving the brake signal so that the piston rod extends from the locking cylinder; and to discharge the gas in the locking cylinder when receiving the brake release signal so that the piston rod retracts.

4. The semiconductor heat treatment equipment according to claim 3, wherein: The interior of the locking cylinder is divided into a first air cavity and a second air cavity by the piston rod, and one end of the piston rod passes through the second air cavity and extends out of the locking cylinder; The control gas circuit includes a reversing valve, a relief valve and an air source, wherein the air source is connected to the reversing valve through a first gas circuit, the relief valve is connected to the reversing valve through a second gas circuit, and the reversing valve is connected to the first air cavity and the second air cavity through a third gas circuit and a fourth gas circuit respectively; The reversing valve switches to the first state when receiving the braking signal, and switches to the second state when receiving the braking release signal. In the first state, the reversing valve connects the first air circuit with the third air circuit, and disconnects the second air circuit with the fourth air circuit. In the second state, the reversing valve connects the second air circuit with the third air circuit, and disconnects the first air circuit with the fourth air circuit.

5. The semiconductor heat treatment equipment according to any one of claims 2 to 4, wherein: The plurality of process chambers are arranged in sequence along the vertical direction; The transmission actuator is used to drive the corresponding carrier device to rise and fall, so that the carrier device moves to the height position where any process chamber in the corresponding chamber group is located, and is also used to drive the carrier device at the height position to move horizontally, so as to transfer the carrier device into or out of the process chamber; The braking mechanism is used to brake the corresponding carrying device in the vertical direction when receiving the braking signal.

6. The semiconductor heat treatment equipment according to claim 5, wherein: The transmission execution mechanism comprises: A lifting drive assembly, connected to the corresponding carrying device, and used to drive the corresponding carrying device to lift; A horizontal driving assembly connected to the lifting driving assembly and used to drive the lifting driving assembly and the carrying device to translate synchronously; A loading and unloading robot arm and a driving assembly for driving the loading and unloading robot arm to rise, fall and translate. The loading and unloading robot arm is used to load or unload the workpiece to be processed from the carrying device under the drive of the driving assembly.

7. The semiconductor heat treatment equipment according to claim 1, wherein: The controller comprises: A first input module, used to receive a first sensor feedback signal related to controlling the transmission actuator; A control module is used to control the transmission actuator to perform the incoming action or the outgoing action according to the feedback signal of the first sensor.

8. The semiconductor heat treatment equipment according to claim 7, wherein: The controller further comprises: A second input module, used for receiving a second sensor feedback signal related to controlling the opening and closing state of the chamber door of each process chamber; The control module is further used to control the cavity door to perform opening and closing actions according to the feedback signal of the second sensor.

9. A method for transporting a carrier device of a semiconductor heat treatment device, wherein: The semiconductor heat treatment equipment is the semiconductor heat treatment equipment according to any one of claims 1 to 8, and the method comprises: receiving an incoming command or an outgoing command corresponding to a designated process chamber; According to the incoming instruction or the outgoing instruction, a transmission execution mechanism corresponding to the chamber group to which the designated process chamber belongs is controlled to execute the incoming action or the outgoing action.

10. The method according to claim 9, wherein: The plurality of process chambers are arranged in sequence along the vertical direction; Controlling the transmission execution mechanism to execute the incoming action includes: Controlling the transmission actuator to drive the corresponding carrying device to rise and fall, so that the carrying device moves to the height position where the designated process chamber is located; Controlling the door of the designated process chamber to open; Controlling the transmission actuator to drive the carrier located at the height position to translate, so as to transfer the carrier into the designated process chamber; Controlling the transmission actuator to execute the outgoing action includes: Controlling the transfer actuator to drive the carrier in the designated process chamber to translate, so as to transfer the carrier out of the process chamber; The door of the designated process chamber is controlled to be closed.

11. The method according to claim 10, wherein: The semiconductor heat treatment equipment includes at least one braking mechanism, which is arranged in one-to-one correspondence with the carrying device; the method also includes: When the carrying device is stationary or has completed the lifting action or is in an abnormal state, sending a braking signal to the braking mechanism, so that the braking mechanism brakes the corresponding carrying device in the vertical direction when receiving the braking signal; When the incoming instruction or the outgoing instruction is received, a brake release signal is sent to the brake mechanism, so that the brake mechanism releases the brake of the corresponding carrying device when receiving the brake release signal.

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