Semiconductor process device
By using clamps that fit the positioning columns and positioning holes in the connection device of semiconductor process equipment, the problem of joint contact during the docking process of gas pipelines is solved, and higher connection reliability and sealing are achieved, ensuring that Stability of process results and improvement of product quality.
Patent Information
- Application Number
- PCT/CN2024/095942
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-05-30
- Filing Date
- 2024-05-29
- Publication Date
- 2025-02-20
AI Technical Summary
The gas pipeline of semiconductor process equipment is prone to contact during the docking process, causing debris to enter the process chamber, affecting process results and product quality.
Using a connecting device including the first clamp and the second clamp, through the coordination of the positioning column and the positioning hole, the central axis of the first joint and the second joint overlap, and a gap is provided between the joints to avoid contact. .
It effectively avoids contact of joints during docking of gas pipelines, improves the reliability and sealing of connections, and ensures the stability of process results and the improvement of product quality.
Smart Images
Figure CN2024095942_20022025_PF_FP_ABST
Abstract
Description
semiconductor process equipment Technical Field
[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a semiconductor process equipment. Background Art
[0002] In the semiconductor industry, many gas pipelines require quartz material due to factors such as process gas temperature, corrosiveness, and sealing. The reliability of the connection device connecting the gas pipeline to the semiconductor process chamber directly affects the final process results, making this connection device crucial.
[0003] Typically, gas pipelines are butted together using a first and second joint with mating concave and convex surfaces to ensure coaxial alignment. These joints are then secured together using a flange clamp. However, during the butt-jointing process, the concave and convex surfaces of the first and second joints can easily contact each other. This contact creates debris that can enter the process chamber with the airflow, affecting process results and reducing product quality.
[0004] Summary of the Invention
[0005] The purpose of the embodiments of the present application is to provide a semiconductor process equipment that can solve the problem that the gas pipelines of the current semiconductor process equipment are prone to touching during the docking process.
[0006] In order to solve the above technical problems, this application is implemented as follows:
[0007] The embodiment of the present application provides a semiconductor process equipment, comprising a process chamber, a first connector, a second connector, and a connecting device, wherein the first connector is connected to the process chamber,
[0008] The connecting device includes a first clamping member and a second clamping member, wherein the first clamping member and the second clamping member are used to clamp the first joint and the second joint so that the first joint and the second joint are sealed and matched to form a gas transmission pipeline;
[0009] The first clamping member is sleeved on the first joint, and the second clamping member is sleeved on the second joint. One of the first clamping member and the second clamping member has a positioning column, and the other has a positioning hole. The positioning column and the positioning hole are positioned and matched so that the central axis of the first joint coincides with the central axis of the second joint, and there is a gap between the first joint and the second joint.
[0010] In the embodiment of the present application, one of the first clamping member and the second clamping member has a positioning post, and the other has a positioning hole. The positioning post and the positioning hole are positioned so that the central axis of the first joint coincides with the central axis of the second joint. A gap is provided between the concave and convex surfaces of the first joint and the second joint, thereby preventing the concave and convex surfaces of the first joint and the second joint from contacting during the docking of the gas pipeline. Therefore, the embodiment of the present application can solve the problem that the gas pipelines of current semiconductor process equipment are prone to contact during the docking process. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG1 is a schematic structural diagram of a connection device disclosed in an embodiment of the present application;
[0012] FIG2 is a cross-sectional view of a connection device disclosed in an embodiment of the present application;
[0013] FIG3 is an exploded view of the connection device disclosed in an embodiment of the present application;
[0014] FIG4 is a cross-sectional view of a connection device disclosed in an embodiment of the present application;
[0015] FIG5 is a schematic structural diagram of a first clamping member, a second clamping member, and a connecting assembly disclosed in an embodiment of the present application;
[0016] FIG6 is an exploded view of the first clamping member, the second clamping member, and the connecting assembly disclosed in an embodiment of the present application;
[0017] FIG7 is a side view of the first clamping member and the second clamping member disclosed in an embodiment of the present application;
[0018] FIG8 is a schematic structural diagram of a first clamping member disclosed in an embodiment of the present application;
[0019] FIG9 is a partial enlarged view of the positioning post disclosed in an embodiment of the present application;
[0020] FIG10 is a schematic structural diagram of a second clamping member disclosed in an embodiment of the present application;
[0021] FIG11 is an exploded view of the first joint, the second joint, and the sealing ring disclosed in an embodiment of the present application;
[0022] 12 and 13 are cross-sectional views of the first joint, the second joint, and the sealing ring in different states according to the embodiment of the present application;
[0023] FIG14 is a top view of the first joint disclosed in an embodiment of the present application;
[0024] FIG15 is a cross-sectional view of a connection assembly disclosed in an embodiment of the present application;
[0025] FIG16 is a schematic diagram of a portion of the structure of the semiconductor process equipment disclosed in an embodiment of the present application.
[0026] Description of reference numerals:
[0027] 100-process chamber;
[0028] 210 - first joint, 211 - mating protrusion, 212 - first flange portion, 2121 - first positioning plane, 220 - second joint, 221 - mating groove, 222 - second flange portion, 2221 - second positioning plane, 230 - sealing ring;
[0029] 300-connecting device, 330-first clamping member, 331-positioning column, 3311-first positioning column, 3312-second positioning column, 3313-third positioning column, 3314-third positioning plane, 3315-positioning groove, 3316-positioning section, 3317-connecting section, 3318-smooth section, 3319-threaded connection section, 332-first avoidance opening, 340-second clamping member, 341-positioning hole, 342-second avoidance opening, 350-connecting assembly, 351-connecting sleeve, 3511-installing groove, 352-locking member, 3521-elastic drive part, 3522-positioning part, 360-protective sleeve, 370-first buffer pad, 380-second buffer pad. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0031] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.
[0032] The semiconductor process equipment provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and their application scenarios.
[0033] As shown in Figures 1 to 16, an embodiment of the present application discloses a semiconductor process equipment, including a process chamber 100, a first joint 210, a second joint 220 and a connecting device 300. The first joint 210 is connected to the process chamber 100. In some embodiments, the first joint 210 and the process chamber 100 can be an integral structure or a split structure. The embodiment of the present application does not impose specific restrictions, but regardless of whether the two adopt an integral structure or a split structure, the sealing between the two needs to meet the gas transmission requirements. Further, in some embodiments, when the first joint 210 and the process chamber 100 are a split structure, the two can be connected by welding, threaded connectors, etc., and a sealing structure such as an O-ring is used to seal the first joint 210 and the process chamber 100 to ensure sealing. In some embodiments, the connection between the first joint 210 and the process chamber 100 can be located at the lower part of the process chamber 100 (for example, at a position near the lower end of the chamber side wall) to reduce the impact on other structures. In some embodiments, the first connector 210 and the second connector 220 can be made of quartz material, and of course can also be made of other materials, which are not specifically limited here. In one embodiment, the second connector 220 and the other parts of the pipeline in which it is located are an integrated structure.
[0034] The connecting device 300 includes a first clamping member 330 and a second clamping member 340. The first clamping member 330 and the second clamping member 340 are used to clamp the first connector 210 and the second connector 220, so that the first connector 210 and the second connector 220 are sealed together to form a gas pipeline. The gas pipeline is connected to the process chamber 100. In some embodiments, the gas pipeline can be an air intake pipeline or an exhaust pipeline, or other gas pipelines, such as a circulation pipeline, etc., without limitation.
[0035] In some embodiments, the first clamping member 330 and the second clamping member 340 can be flange clamps, which can be, for example, U-shaped plates, but can also be other plate-like structures, and are not specifically limited here. Specifically, the first clamping member 330 is sleeved on the first joint 210, and the second clamping member 340 is sleeved on the second joint 220. One of the first clamping member 330 and the second clamping member 340 has a positioning column 331, and the other has a positioning hole 341. The positioning column 331 and the positioning hole 341 are positioned and matched so that the central axis of the first joint 210 coincides with the central axis of the second joint 220, and there is a gap between the first joint 210 and the second joint 220, thereby ensuring that the first joint 210 and the second joint 220 are coaxially arranged, and at the same time, the first joint 210 and the second joint 220 can avoid contact.
[0036] In some embodiments, the semiconductor processing equipment further includes a sealing ring 230 disposed between the first connector 210 and the second connector 220. The sealing ring 230 provides a seal between the first connector 210 and the second connector 220, thereby improving the sealing performance of the gas pipeline. Furthermore, in some embodiments, a groove is defined on a surface of the second connector 220 facing the first connector 210. A portion of the sealing ring 230 is disposed within the groove, and the groove is used to secure the sealing ring 230.
[0037] In the embodiment of the present application, one of the first clamping member 330 and the second clamping member 340 has a positioning column 331, and the other has a positioning hole 341, so that the central axis of the first joint 210 coincides with the central axis of the second joint 220, and a gap is provided between the concave and convex surfaces of the first joint 210 and the second joint 220, thereby preventing the concave and convex surfaces of the first joint 210 and the second joint 220 from touching each other during the docking of the gas pipeline. Therefore, the embodiment of the present application can solve the problem that the gas pipelines of the current semiconductor process equipment are prone to touching each other during the docking process. In addition, the present application can avoid the connection device in the prior art using the compression force of the spring to achieve compression of the sealing ring 230, so the reliability of the above-mentioned connection device 300 is better.
[0038] 12 and 13 , in some embodiments, one of the surface of the first connector 210 facing the second connector 220 and the surface of the second connector 220 facing the first connector 210 has a mating protrusion 211, and the other of the surface of the first connector 210 facing the second connector 220 and the surface of the second connector 220 facing the first connector 210 has a mating groove 221. At least a portion of the mating protrusion 211 is located within the mating groove 221. This not only improves the sealing between the first connector 210 and the second connector 220, but also prevents incorrect mating between the first connector 210 and the second connector 220, thereby providing a foolproofing effect. For example, in FIG12 and FIG13 , the surface of the first connector 210 facing the second connector 220 has a mating protrusion 211, and the surface of the second connector 220 facing the first connector 210 has a mating groove 221.
[0039] In addition, the provision of the mating protrusion 211 and the mating groove 221 can extend the flow path of gas escaping from the connection between the first connector 210 and the second connector 220, thereby extending the time it takes for this gas to reach the sealing ring 230, allowing it to fully dissipate heat and thereby protecting the sealing ring 230. Furthermore, a gap exists between the surface of the mating protrusion 211 and the inner wall of the mating groove 221. In this case, during the docking process of the first connector 210 and the second connector 220, this gap provides space for the mating protrusion 211 and the mating groove 221 to move, preventing them from contacting each other. Of course, the opposing surfaces of the first connector 210 and the second connector 220 can also be planes, and the sealing ring 230 can be positioned adjacent to the edge of the plane.
[0040] 5 to 8 , in some embodiments, the number of the positioning posts 331 and the number of the positioning holes 341 can both be one. In this case, to ensure the positioning effect, the positioning hole 341 can be larger, that is, a larger cross-sectional area can be used, and the positioning hole 341 can be set as an arc-shaped hole, and the positioning posts 331 are adapted to the positioning holes 341. Alternatively, the number of the positioning posts 331 and the number of the positioning holes 341 can both be at least two, and at least two positioning posts 331 are arranged at intervals along the circumference of the first joint 210, and each positioning post 331 corresponds to the positioning hole 341 one-to-one. In this case, the cross-sectional area of each positioning post 331 and each positioning hole 341 can be set smaller, and the positioning holes 341 opened in the second clamping member 340 can be set more dispersed, so that the force acting on the second clamping member 340 is also more dispersed, which is beneficial to protecting the second clamping member 340 and can more reliably limit the relative position of the first joint 210 and the second joint 220, so that the central axis of the first joint 210 and the central axis of the second joint 220 more accurately coincide.
[0041] Furthermore, in some embodiments, the at least two positioning posts 331 include a first positioning post 3311, a second positioning post 3312, and a third positioning post 3313, each of which is arranged opposite to each other. Specifically, the first positioning post 3311 is arranged opposite to the third positioning post 3313, the first positioning post 3311 is arranged opposite to the second positioning post 3312, and the second positioning post 3312 is arranged opposite to the third positioning post 3313. The first distance between the second positioning post 3312 and the first positioning post 3311 is equal to the second distance between the second positioning post 3312 and the third positioning post 3313. In this case, the first positioning post 3311, the second positioning post 3312, and the third positioning post 3313 are arranged in an isosceles triangle or an equilateral triangle structure, which helps to improve the positioning stability of the first clamping member 330. Of course, the first distance and the second distance can also be different. In some examples, the first clamping member 330 and the second clamping member 340 are both U-shaped structures (e.g., U-shaped plates). In this case, as shown in FIG8 , the first positioning post 3311 and the third positioning post 3313 are respectively located at the two ends of the U-shaped structure, and the second positioning post 3312 is located at the bend of the U-shaped structure. In this way, combined with the shape of the U-shaped structure, the first positioning post 3311, the second positioning post 3312, and the third positioning post 3313 can be evenly distributed on the U-shaped structure, so that the force acting on the U-shaped structure can be more uniform, which is beneficial to protecting the U-shaped structure. At the same time, the relative position of the first joint 210 and the second joint 220 can be more reliably limited, so that the central axis of the first joint 210 and the central axis of the second joint 220 more accurately coincide with each other.
[0042] In some embodiments, there is contact between the positioning post 331 and the first joint 210 and the second joint 220 to achieve positioning fit. Specifically, the positioning post 331 can be a positioning cylinder, in which case the positioning post 331 and the first joint 210 and the second joint 220 are in linear contact; or, in other embodiments, the positioning post 331 has a third positioning plane 3314, which is respectively positioned and fitted with the first positioning plane 2121 of the first flange portion 212 of the first joint 210 and the second positioning plane 2221 of the second flange portion 222 of the second joint 220 in the circumferential direction of the first joint 210. The positioning fit here can be direct positioning fit or indirect positioning fit through other components (such as the protective sleeve described below). In this case, the positioning post 331 and the first joint 210 and the second joint 220 are in surface contact, which is conducive to improving the positioning stability of the positioning post 331. Of course, the first positioning plane 2121 of the first flange portion 212 and the second positioning plane 2221 of the second flange portion 222 can also be concave surfaces. In this case, the positioning column 331 has a positioning convex surface, but in this case, the production of the positioning column 331, the first flange portion 212 and the second flange portion 222 is relatively inconvenient, and is not as simple as the above-mentioned setting as the positioning plane.
[0043] In addition, as shown in Figure 14, when the first positioning column 3311, the second positioning column 3312 and the third positioning column 3313 are distributed in an isosceles triangle or an equilateral triangle structure, the number of first positioning planes 2121 is three, and the three first positioning planes 2121 correspond one-to-one to the first positioning column 3311, the second positioning column 3312 and the third positioning column 3313 in the circumferential direction of the first joint 210.
[0044] There can be multiple ways to connect the first clamping member 330 and the second clamping member 340 to clamp the first joint 210 and the second joint 220. In some embodiments, the connecting device also includes a connecting assembly 350, and one end of the positioning column 331 passes through the positioning hole 341 and is connected to the connecting assembly 350, so that the first clamping member 330 and the second clamping member 340 clamp the first joint 210 and the second joint 220.
[0045] In some embodiments, the connecting assembly 350 can be directly sleeved onto the positioning post 331, and the two are connected by friction or threaded connection. In other embodiments, the connecting assembly 350 is sleeved onto the positioning post 331 and can be rotated relative to the positioning post 331 to a position where it is positioned and matched with the positioning post 331 in the circumferential direction of the first joint 210, so as to achieve a sealed fit between the first joint 210 and the second joint 220. In this case, the specific position of the connecting assembly 350 and the positioning post 331 in the circumferential direction of the first joint 210 can be predetermined based on the compression amount of the sealing ring 230 provided between the first joint 210 and the second joint 220, thereby avoiding frequent measurement of the distance between the first joint 210 and the second joint 220 during the rotation of the connecting assembly 350 relative to the positioning post 331, thereby improving the assembly efficiency of the first joint 210 and the second joint 220.
[0046] In some embodiments, in an embodiment in which the number of positioning posts 331 and positioning holes 341 is at least two and at least two positioning posts 331 are arranged at intervals along the circumference of the first joint 210, the connecting components 350 are arranged in a one-to-one correspondence with the positioning posts 331, that is, a plurality of connecting components 350 are sleeved on the positioning posts 331 in a one-to-one correspondence, and each connecting component 350 can be rotated relative to the corresponding positioning posts 331 to a position in which it is positioned and matched with each positioning post 331 in the circumferential direction of the first joint 210, so that the first joint 210 and the second joint 220 are sealed and matched. In this case, the positioning and matching positions of each connecting component 350 and each positioning post 331 are at the same height, which can avoid the second clamping member 340 and the second joint 220 from tilting, and there is no need to manually adjust the position of each connecting component 350, which is beneficial to improving the assembly efficiency of the connecting device 300.
[0047] Referring to Figure 15, in some further embodiments, the connecting assembly 350 includes a connecting sleeve 351 and a locking piece 352, and the connecting sleeve 351 is sleeved on the positioning column 331; in some embodiments, the locking piece 352 can be a deformable piece directly provided on the inner wall of the connecting sleeve 351, and the circumferential surface of the positioning column 331 is provided with a positioning groove 3315, and the deformable piece and the positioning groove 3315 are positioned and matched in the circumferential direction of the first joint 210. When the connecting assembly 350 is subjected to a large force, the deformable piece is easily separated from the positioning groove 3315, and the positioning stability between the two is poor; and, in the process of the connecting sleeve 351 being sleeved on the positioning column 331, the deformable piece is easily damaged. Based on this, in some embodiments, an installation groove 3511 is provided on one of the inner wall of the connecting sleeve 351 and the circumferential surface of the positioning column 331, and the locking piece 352 is movably arranged in the installation groove 3511, and a positioning groove 3315 is provided on the other of the inner wall of the connecting sleeve 351 and the circumferential surface of the positioning column 331; in the process of the connecting sleeve 351 being sleeved on the positioning column 331 along the positioning column 331, the locking piece 352 retracts into the installation groove 3511, and when the connecting sleeve 351 reaches the position corresponding to the locking piece 352 and the positioning groove 3315, part of the locking piece 352 extends out of the notch of the installation groove 3511, and is positioned and matched with the positioning groove 3315 in the circumferential direction of the first joint 210. For example, the inner wall of the connecting sleeve 351 is provided with a mounting groove 3511, and the locking piece 352 can be movably arranged in the mounting groove 3511. The locking piece 352 is positioned and matched with the positioning groove 3315 in the circumferential direction of the first joint 210. In this case, at least a part of the locking piece 352 can be a rigid structure, and the locking piece 352 has better stability after being positioned and matched with the positioning groove 3315; and, in the process of the connecting sleeve 351 being sleeved on the positioning column 331, the locking piece 352 can be located in the mounting groove 3511, thereby preventing the locking piece 352 from being damaged.
[0048] In some embodiments, the connecting sleeve 351 may be a hexagonal nut, and may also be other structures, which are not specifically limited here.
[0049] Furthermore, in some embodiments, the locking member 352 includes a connected elastic driving portion 3521 and a positioning portion 3522. The elastic driving portion 3521 can drive a portion of the positioning portion 3522 to extend out of the notch of the mounting slot 3511, so that the positioning portion 3522 is positioned and matched with the positioning slot 3315. At this time, the elastic driving portion 3521 uses its own elastic force to continuously act on the positioning portion 3522, that is, the elastic driving portion 3521 is always in a compressed state, thereby improving the positioning stability of the positioning portion 3522. In addition, the elastic driving portion 3521 can be a spring, which has a simple structure, takes up little space, and is relatively low in cost. Of course, the elastic driving portion 3521 can be replaced with a driving member such as a micro cylinder or a hydraulic cylinder.
[0050] In some embodiments, the positioning portion 3522 can be a positioning block. When the positioning block is disengaged from the positioning groove 3315, the force exerted by the connecting sleeve 351 on the positioning block can easily cause the positioning block to be damaged; therefore, in some embodiments, the end of the positioning portion 3522 away from the elastic driving portion 3521 can be a semicircular structure or a conical structure, which has a guiding function to facilitate the disengagement of the positioning block from the positioning groove 3315; further, in some embodiments, the positioning portion 3522 is a positioning ball, and the curvature of the positioning ball is equal at all places. The positioning ball can rotate relative to the elastic driving portion 3521. In the process of disengaging the positioning ball from the positioning groove 3315, the positioning ball can rotate while moving, thereby further improving the smoothness of disengaging the positioning block from the positioning groove 3315.
[0051] In some embodiments, the mounting groove 3511 includes a first accommodating cavity and a second accommodating cavity that are connected to each other. The elastic driving portion 3521 is arranged in the first accommodating cavity, and the positioning portion 3522 is arranged in the second accommodating cavity. The second accommodating cavity has a limiting side wall at one end away from the first accommodating cavity, and the slot is opened on the limiting side wall. The elastic driving portion 3521 can drive the positioning portion 3522 to press on the limiting side wall. The limiting side wall is used to limit a part of the positioning portion 3522 in the mounting groove 3511, and the remaining part is located outside the mounting groove 3511. That is to say, the limiting side wall can limit the positioning portion 3522 so that only a part of it can extend out of the mounting groove 3511, thereby preventing the positioning portion 3522 from detaching from the mounting groove 3511, thereby improving the stability of the positioning portion 3522 and the positioning groove 3315 in positioning cooperation.
[0052] Part of the positioning portion 3522 fits with the limiting side wall, that is, the positioning portion 3522 is adapted to the limiting side wall. Furthermore, in some embodiments, the positioning portion 3522 is a positioning ball, and the limiting side wall can be an arc-shaped structure that can fit with part of the positioning ball, and the cross-sectional area of the limiting side wall gradually decreases in the direction extending from the first accommodating cavity to the second accommodating cavity. The limiting side wall with such a structure can increase the contact area between the positioning portion 3522 and the connecting sleeve 351, thereby improving the stability of the positioning portion 3522; in addition, the diameter of the notch on the limiting side wall with such a structure is smaller than the diameter of the positioning portion 3522, which can prevent the positioning portion 3522 from being separated from the mounting groove 3511.
[0053] In some further embodiments, the positioning column 331 includes a connected positioning section 3316 and a connecting section 3317, and the second clamping member 340 is sleeved on the positioning section 3316 through the positioning hole 341. The positioning section 3316 and the positioning hole 341 are positioned and matched in the circumferential direction of the first joint 210. In some embodiments, the cross-sectional shape of the positioning section 3316 can be circular. At this time, the curvature of the circumference of the positioning section 3316 is equal, and the first clamping member 330 and the second clamping member 340 are prone to offset; in view of this, in other embodiments, the cross-sectional shape of the positioning section 3316 is polygonal, and the positioning hole 341 is a polygonal hole whose shape is adapted to the positioning section 3316, that is, the shapes of the positioning section 3316 and the positioning hole 341 can be the same. Once the positioning segment 3316 is positioned and engaged with the positioning hole 341, the contour line of the orthographic projection of the first clamping member 330 coincides with the contour line of the orthographic projection of the second clamping member 340 in the axial direction of the first joint 210, thereby improving the positioning accuracy of the first clamping member 330 and the second clamping member 340. When the cross-sectional shape of the positioning segment 3316 is polygonal, the outer circumference of the positioning segment 3316 includes multiple sequentially connected flat surfaces. Adjacent flat surfaces can be smoothly connected by arcuate surfaces to prevent scratches on other components. Of course, the adjacent flat surfaces described here can also be directly connected.
[0054] In some embodiments, the cross-sectional shape of the positioning segment 3316 can be a triangle, a rectangle, etc., which is not specifically limited here.
[0055] Referring to FIG9 , in other embodiments, the positioning post 331 includes a connected smooth section 3318 and a threaded section 3319. The diameter of the smooth section 3318 is larger than that of the threaded section 3319, forming a positioning end surface between the smooth section 3318 and the threaded section 3319. Specifically, a step is formed at the connection between the smooth section 3318 and the threaded section 3319. This step constitutes the positioning end surface. The connecting assembly 350 is threadedly engaged with the threaded section 3319 and positioned with the smooth section 3318, thereby enhancing the connection security of the connecting assembly 350. In the axial direction of the positioning post 331, the connecting assembly 350 can be positioned and engaged with the positioning end surface, thereby preventing further movement of the connecting assembly 350 relative to the positioning post 331. Of course, in the above embodiment, the smooth section 3318 can also be omitted, and the connecting assembly can simply be threadedly engaged with the threaded section 3319.
[0056] In some embodiments, in embodiments where the positioning post 331 includes a connected positioning segment 3316 and a connecting segment 3317, the smooth segment 3318 and the threaded connecting segment 3319 may constitute the connecting segment 3317. Of course, in the above embodiment, the positioning segment 3316 may be omitted, and only the connecting segment 3317 may be provided, and the connecting segment 3317 may be composed of the smooth segment 3318 and the threaded connecting segment 3319. In some embodiments, the positioning segment 3316, the smooth segment 3318, and the threaded connecting segment 3319 may be sequentially connected by welding, machining, or the like.
[0057] Referring to Figure 3, in some other embodiments, the connecting device 300 further includes a protective sleeve 360, which is sleeved over the positioning post 331. The protective sleeve 360 is located between the first clamping member 330 and the second clamping member 340, and the protective sleeve 360 is provided in a one-to-one correspondence with the positioning post 331. In this solution, the provision of the protective sleeve 360 can prevent the positioning post 331 from directly contacting the first joint 210 and the second joint 220, thereby protecting the first joint 210 and the second joint 220. In some embodiments, the protective sleeve 360 can be a resin sleeve, which has the characteristics of good flexibility, corrosion resistance, high and low temperature resistance, aging resistance, and long service life. Of course, it can also have other structures, which are not specifically limited here.
[0058] In some embodiments, where there are at least two positioning posts 331, protective sleeves 360 are provided in a one-to-one correspondence with the positioning posts 331, thereby protecting the first connector 210 and the second connector 220. Furthermore, the protective sleeves 360 may have a prismatic structure, such that the third positioning planes 3314 of the positioning posts 331 are positioned and matched with the first positioning plane 2121 of the first flange portion 212 of the first connector 210 and the second positioning plane 2221 of the second flange portion 222 of the second connector 220, respectively, in the circumferential direction of the first connector 210, through the protective sleeves 360.
[0059] In yet other embodiments, the connection device 300 further includes a first buffer pad 370 and a second buffer pad 380. The first buffer pad 370 is disposed between the first clamping member 330 and the first flange portion 212 of the first joint 210, while the second buffer pad 380 is disposed between the second clamping member 340 and the second flange portion 222 of the second joint 220. In this embodiment, the first buffer pad 370 and the second buffer pad 380 not only provide a buffering effect but also prevent direct contact between the first clamping member 330 and the first joint 210, and between the second clamping member 340 and the second joint 220, thereby protecting the first joint 210 and the second joint 220. In some embodiments, the first buffer pad 370 and the second buffer pad 380 can both be made of a resin material, which has the characteristics of good flexibility, corrosion resistance, high and low temperature resistance, aging resistance, and long service life. Of course, they can also be made of other materials, and this is not specifically limited here.
[0060] In some embodiments, both the first clamping member 330 and the second clamping member 340 can be split structures, with the parts of the split structures assembled to form an annular structure (e.g., an annular plate); alternatively, the first clamping member 330 and the second clamping member 340 can be U-shaped structures (e.g., U-shaped plates), with the first clamping member 330 having a first clearance opening 332 for clearing the first connector 210, thereby facilitating the first clamping member 330 to be mounted on the first connector 210 through the first clearance opening 332; and the second clamping member 340 having a second clearance opening 342 for clearing the second connector 220, thereby facilitating the second clamping member 340 to be mounted on the second connector 220 through the second clearance opening 342. Furthermore, in some embodiments, the circumferences of the first clamping member 330 and the second clamping member 340 are all arcuate surfaces, or include smoothly connected arcuate surfaces and flat surfaces, thereby preventing scratches on other structures during installation.
[0061] The docking process of the gas transmission pipeline of the semiconductor process equipment disclosed in the present application is as follows: first, the first buffer pad 370 is installed on the first clamping member 330, and the first buffer pad 370 is fitted with the first clamping member 330; then the protective sleeve 360 is put on the positioning column 331 of the first clamping member 330; then the first clamping member 330 is installed on the first joint 210, and the first positioning plane 2121 of the first flange portion 212 of the first joint 210 is matched with the protective sleeve 360; then the matching groove 221 of the second joint 220 equipped with the sealing ring 230 is installed on the matching protrusion 211 of the first joint 210, so that The second joint 220 is docked with the first joint 210. During this installation process, due to the positioning of the positioning column 331 and the protective buffering of the protective sleeve 360, no collision will occur between the first joint 210 and the second joint 220; then the second buffer pad 380 and the second clamping member 340 are installed in sequence; finally, the connecting component 350 is installed to the connecting section 3317 of the positioning column 331, so that the positioning part 3522 in the connecting component 350 is inserted into the positioning groove 3315 of the positioning column 331 for positioning and matching. The position of this positioning and matching satisfies the compression amount of the sealing ring 230, thereby completing the assembly of the connecting device 300.
[0062] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.
Claims
1. A semiconductor process equipment, wherein: The invention comprises a process chamber, a first joint, a second joint and a connecting device, wherein the first joint is connected to the process chamber, The connecting device comprises a first clamping member and a second clamping member, wherein the first clamping member and the second clamping member are used to clamp the first joint and the second joint so that the first joint and the second joint are sealed and matched to form a gas transmission pipeline; The first clamping member is sleeved on the first joint, and the second clamping member is sleeved on the second joint. One of the first clamping member and the second clamping member has a positioning column, and the other has a positioning hole. The positioning column and the positioning hole are positioned and matched so that the central axis of the first joint coincides with the central axis of the second joint, and there is a gap between the first joint and the second joint.
2. The semiconductor process equipment according to claim 1, wherein: One of the side of the first joint facing the second joint and the side of the second joint facing the first joint has a mating protrusion, and the other of the side of the first joint facing the second joint and the side of the second joint facing the first joint has a mating groove, at least part of the mating protrusion is located in the mating groove, and there is a gap between the surface of the mating protrusion and the inner wall of the mating groove.
3. The semiconductor process equipment according to claim 1, wherein: The number of the positioning posts and the number of the positioning holes are both at least two, the at least two positioning posts are arranged at intervals along the circumference of the first joint, and each of the positioning posts is matched with the positioning holes in a one-to-one correspondence.
4. The semiconductor process equipment according to claim 3, wherein: The at least two positioning posts include a first positioning post, a second positioning post and a third positioning post, wherein the first positioning post, the second positioning post and the third positioning post are arranged opposite to each other; a first distance between the second positioning post and the first positioning post is equal to a second distance between the second positioning post and the third positioning post; The first clamping member and the second clamping member are both U-shaped structures, the first positioning column and the third positioning column are respectively located at two ends of the U-shaped structure, and the second positioning column is located at the bending part of the U-shaped structure.
5. The semiconductor process equipment according to claim 1, wherein: The positioning column has a third positioning plane, and the third positioning plane is respectively positioned and matched with the first positioning plane of the first flange portion of the first joint and the second positioning plane of the second flange portion of the second joint in the circumferential direction of the first joint.
6. The semiconductor process equipment according to any one of claims 1 to 5, wherein: The connecting device further comprises a connecting assembly, and one end of the positioning column passes through the positioning hole and is connected to the connecting assembly, so as to enable the first clamping member and the second clamping member to clamp the first joint and the second joint.
7. The semiconductor process equipment according to claim 6, wherein: The connecting assembly is sleeved on the positioning post and can be rotated relative to the positioning post to a position where it is positioned and matched with the positioning post in the circumferential direction of the first joint, so that the first joint and the second joint are sealed and matched.
8. The semiconductor process equipment according to claim 6, wherein: The number of the positioning posts and the number of the positioning holes are both at least two, the at least two positioning posts are arranged at intervals along the circumference of the first joint, and each of the positioning posts is matched with the positioning holes in a one-to-one correspondence; There are multiple connecting components, and the multiple connecting components are sleeved on the positioning column one by one, and each connecting component can be rotated relative to the corresponding positioning column to a position where it is positioned and matched with the positioning column in the circumferential direction of the first joint, and the positioning and matching position of each connecting component and the corresponding positioning column is at the same height.
9. The semiconductor process equipment according to claim 6, wherein: The connecting assembly comprises a connecting sleeve and a locking piece, and the connecting sleeve is sleeved on the positioning column; One of the inner wall of the connecting sleeve and the circumferential surface of the positioning column is provided with a mounting groove, and the locking piece can be movably arranged in the mounting groove, and the other of the inner wall of the connecting sleeve and the circumferential surface of the positioning column is provided with a positioning groove; in the process of the connecting sleeve being sleeved on the positioning column along the positioning column, the locking piece retracts into the mounting groove, and when the connecting sleeve reaches the position where the locking piece corresponds to the mounting groove, part of the locking piece extends out of the notch of the mounting groove and is positioned and matched with the positioning groove in the circumferential direction of the first joint.
10. The semiconductor process equipment according to claim 9, wherein: The locking member comprises an elastic driving portion and a positioning portion which are connected to each other. The elastic driving portion can drive a portion of the positioning portion to extend out of a notch of the installation slot, so that the positioning portion is positioned and matched with the positioning slot.
11. The semiconductor process equipment according to claim 10, wherein: The mounting groove includes a first accommodating cavity and a second accommodating cavity that are connected to each other. The elastic driving portion is arranged in the first accommodating cavity, and the positioning portion is arranged in the second accommodating cavity. The second accommodating cavity has a limiting side wall at one end away from the first accommodating cavity, and the notch is opened in the limiting side wall. The elastic driving portion can drive the positioning portion to press against the limiting side wall, and part of the positioning portion is in contact with the limiting side wall; the limiting side wall is used to limit a part of the positioning portion in the mounting groove.
12. The semiconductor process equipment according to claim 11, wherein: The positioning portion is a positioning ball; the limiting side wall is an arc-shaped structure that can partially fit with the positioning ball, and the cross-sectional area of the limiting side wall gradually decreases in the extension direction from the first accommodating cavity to the second accommodating cavity.
13. The semiconductor process equipment according to claim 6, wherein: The positioning column includes a connected positioning section and a connecting section. The second clamp is sleeved on the positioning section through the positioning hole. The positioning section and the positioning hole are positioned and matched in the circumferential direction of the first joint. The cross-sectional shape of the positioning section is a polygon. The positioning hole is a polygonal hole whose shape is adapted to the positioning section. The connecting component is connected to the connecting section.
14. The semiconductor process equipment according to claim 6, wherein: The positioning column includes a connected smooth section and a threaded connection section, the diameter of the smooth section is larger than the diameter of the threaded connection section, so as to form a positioning end face between the smooth section and the threaded connection section, the connecting component is threadedly matched with the threaded connection section and is positioned with the smooth section, and in the axial direction of the positioning column, the connecting component can be positioned with the positioning end face.
15. The semiconductor process equipment according to any one of claims 1 to 5, wherein: The connecting device further comprises a protective sleeve, which is sleeved on the positioning column. The protective sleeve is located between the first clamping member and the second clamping member, and the protective sleeve is arranged in a one-to-one correspondence with the positioning column.
16. The semiconductor process equipment according to any one of claims 1 to 5, wherein: The connecting device further includes a first buffer pad and a second buffer pad, wherein the first buffer pad is disposed between the first clamp and the first flange portion of the first joint, and the second buffer pad is disposed between the second clamp and the second flange portion of the second joint.