Temperature measurement apparatus

Through the non-contact temperature measurement device, the irradiation period controlled by infrared laser beam and switch components is used to solve the damage problem of the traditional contact measurement device to the ultra-thin temperature uniform plate, and safe and high-precision temperature measurement is achieved.

WO2024254842A1PCT designated stage expired Publication Date: 2024-12-19T GLOBAL TECH CO LTD
View PDF 6 Cites 0 Cited by

Patent Information

Application Number
PCT/CN2023/100618
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-16
Publication Date
2024-12-19

AI Technical Summary

Technical Problem

Traditional contact temperature measurement devices are prone to damage due to excessive pressure when measuring the temperature of the evaporation surface or condensation surface of the ultra-thin temperature uniform plate, and require a non-contact temperature measurement method.

Method used

A non-contact temperature measurement device is designed, using a continuous wave laser assembly to provide the heating point of the infrared laser beam irradiation temperature equalization plate, combined with the switch assembly to control the illumination period and the data processing unit to process the thermal radiation data of the non-irradiation period, and convert it into The temperature of the heating site.

Benefits of technology

The temperature of the evaporation surface and condensation surface is accurately measured without contact, avoiding damage to the temperature homogenization plate, and improving the measurement accuracy and safety.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN2023100618_19122024_PF_FP_ABST
    Figure CN2023100618_19122024_PF_FP_ABST
Patent Text Reader

Abstract

A non-contact temperature measurement apparatus, comprising: a vapor chamber (1), which comprises a condensation surface (12) and an evaporation surface (11); a continuous wave laser assembly (3), which faces a heating dot of the evaporation surface (11) to provide a near-infrared laser beam, wherein the near-infrared laser beam comprises a first near-infrared wavelength range; a switch assembly, which controls the near-infrared laser beam to periodically and intermittently irradiate the heating dot, an irradiation time period and a non-irradiation time period jointly forming an irradiation cycle; a first infrared detection assembly (4), which detects a second near-infrared wavelength range to obtain first thermal radiation information of the heating dot; and a data processing unit (8), which only processes first heat radiation data corresponding to the non-irradiation time period and converts same into a first temperature of the heating dot, wherein the irradiation time period is greater than the non-irradiation time period.
Need to check novelty before this filing date? Find Prior Art

Description

Temperature measuring device Technical Field

[0001] The present invention relates to a temperature measuring device, and in particular to a non-contact temperature measuring device. Background Art

[0002] Ultra-thin vapor chambers, when using traditional contact temperature measurement devices to measure the temperature of the evaporation or condensation surfaces, can easily be damaged by excessive pressure. Therefore, it is necessary to propose a new temperature measurement device to avoid this problem.

[0003] Summary of the Invention

[0004] The main purpose of the present invention is to provide a non-contact temperature measurement device, comprising:

[0005] a bracket for placing a temperature averaging plate, wherein the temperature averaging plate includes a condensing surface and an evaporating surface, wherein the evaporating surface includes a heating point;

[0006] a continuous wave laser assembly disposed toward the support and capable of providing an infrared laser beam for irradiating the heating point, wherein the infrared laser beam includes a first infrared wavelength range;

[0007] a switch component for controlling an irradiation cycle of the infrared laser beam, wherein the irradiation cycle includes an irradiation period and a non-irradiation period;

[0008] a first infrared detection component disposed toward the bracket and detecting a second infrared wavelength range for collecting first thermal radiation data of the heating point;

[0009] A data processing unit processes only the first thermal radiation data corresponding to the non-irradiation period and converts the data into a first temperature of the heating point, wherein the irradiation period is greater than the non-irradiation period. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG1 is a schematic diagram of a non-contact temperature measurement device according to an embodiment of the present invention;

[0011] FIG. 2 is a diagram showing the relationship between the irradiation power and time of a continuous wave laser at a heating point according to an embodiment of the present invention.

[0012] Legend:

[0013] <Invention> 1 Ultra-thin temperature plate 2 Absorption layer 3 Continuous wave laser component 4 First infrared detection component 5 Second infrared detection component 6 Third infrared detection component 7 Power measurement component 8 Data processing unit 9 Spectrometer 11 Evaporation surface 12 Condensation surface DETAILED DESCRIPTION

[0014] Referring to Figure 1, one embodiment of the present invention is a non-contact temperature measurement device. An ultra-thin vapor chamber 1 is mounted on a support and includes an evaporation surface 11 and a condensation surface 12. A light-absorbing layer 2 is disposed on the heating point of the evaporation surface 11. The light-absorbing layer 2 may be a layer of black paint with an absorbance of over 99%, absorbing infrared radiation incident thereon to heat the heating point. A continuous-wave laser assembly 3, operating within the infrared wavelength range, is positioned facing the support. In one embodiment, a peak wavelength of 808 nm is selected to emit a continuous-wave laser beam directed toward the light-absorbing layer 2 at the heating point. A beam splitter 9 is disposed between the continuous-wave laser assembly 3 and the light-absorbing layer 2. In one embodiment, 95% of the continuous-wave laser beam is transmitted through the light-absorbing layer 2 to heat the heating point of the evaporation surface 11. The remaining 5% of the continuous-wave laser beam is reflected by a power measurement assembly 7. By measuring the power of the reflected continuous-wave laser beam, a data processing unit 8 is used to estimate the heating power of the transmitted continuous-wave laser beam on the heating point. The data processing unit 8 may be a personal computer or a workstation.

[0015] In one embodiment, an optical filter is placed in front of the first infrared detection component 4. For example, a band-rejection filter can block near-infrared rays with a wavelength of 808 nm. Within the rejection band, its optical density can be greater than 6 and its full-width half-maximum (FWHM) can be approximately 30 nm. Alternatively, a long-wavelength-pass optical filter with a wider rejection bandwidth can be used. Its rejection band can include the near-infrared band of 700-1400 nm, and its optical density can be greater than 5, allowing long-wavelength infrared rays to pass. The first infrared detection component 4, for example, detects infrared rays with a peak wavelength of 2.3 μm, obtains thermal radiation data from the heating point, and then converts the thermal radiation data into temperature through the data processing unit 8. The second infrared detection component 5 detects thermal radiation from a first reference point on the condensation surface 12 that faces the heating point, and the third infrared detection component 6 detects thermal radiation from a second reference point on the condensation surface 12. The data processing unit 8 converts the corresponding thermal radiation data into the temperature of the first reference point and the temperature of the second reference point, respectively. The distance between the first reference point and the second reference point may be 3 cm.

[0016] In one embodiment, no optical filter is provided in front of the first infrared detection component 4. The first infrared detection component 4 detects infrared rays with a wavelength range of 8 to 14 μm.

[0017] In one embodiment, referring to FIG2 , a switching component controls the continuous wave laser beam of the continuous wave laser assembly 3 to periodically and intermittently irradiate the light absorbing layer 2 at the heating point. A diagram showing the relationship between irradiation power and time is shown. An irradiation cycle includes an irradiation period t1, during which the heating point is irradiated, and a non-irradiation period t2, during which the heating point is not irradiated. The irradiation period t1 is greater than the non-irradiation period t2. For example, 80% of a cycle is irradiation period t1, and 20% is non-irradiation period t2.

[0018] In one embodiment, the data processing unit 8 processes only the first thermal radiation data corresponding to a delay time after the start of the non-irradiation period and converts it into the first temperature of the heating point. In one embodiment, the delay time after the start of the non-irradiation period is 20 ms (milliseconds), 40 ms, or 60 ms after the start of the non-irradiation period.

[0019] The switch component may be a shutter, positioned before the CW laser component 3, and the opening and closing of the shutter controls the irradiation period of the CW laser beam on the heating point. The switch component may be a switching circuit, which controls the irradiation period of the CW laser beam on the heating point by controlling the power supply of the CW laser component 3.

[0020] In one embodiment, the data processing unit 8 converts only the first thermal radiation data detected by the first infrared detection component 4 during the non-irradiation period t2 into the first temperature. In one embodiment, the data processing unit 8 does not process the first thermal radiation data detected by the first infrared detection component 4 during the irradiation period t1.

[0021] In one embodiment, the data processing unit 8 receives and processes data from the power measurement component 7, the first infrared detection component 4, the second infrared detection component 5, and the third infrared detection component 6 to obtain the heating power and temperature of the heating point, the temperature of the first reference point, and the temperature of the second reference point, respectively.

Claims

1. A temperature measuring device, comprising: A bracket for placing a temperature averaging plate, wherein the temperature averaging plate includes a condensation surface and an evaporation surface, wherein the evaporation surface includes a heating point; a continuous wave laser assembly disposed toward the support and capable of providing an infrared laser beam for irradiating the heating point, wherein the infrared laser beam includes a first infrared wavelength range; a switch component for controlling an irradiation cycle of the infrared laser beam, wherein the irradiation cycle includes an irradiation period and a non-irradiation period; a first infrared detection component, disposed toward the bracket, detecting a second infrared wavelength range, and used for collecting a first thermal radiation data of the heating point; A data processing unit processes only the first thermal radiation data corresponding to the non-irradiation period and converts it into a first temperature of the heating point, wherein the irradiation period is greater than the non-irradiation period.

2. The temperature measuring device as claimed in claim 1, wherein the data processing unit only processes the first thermal radiation data corresponding to a delay time after the start of the non-irradiation period, and converts it into the first temperature of the heating point.

3. The temperature measuring device as claimed in claim 1, wherein the switch assembly comprises an optical shutter and a driving circuit of the optical shutter.

4. The temperature measurement device as claimed in claim 1, wherein the switch component comprises a switch circuit that can directly switch the continuous wave laser component.

5. The temperature measuring device as claimed in claim 1, further comprising a second infrared detection component and a third infrared detection component, respectively used to detect a second thermal radiation data of a first reference point and a third thermal radiation data of a second reference point on the condensation surface. 6 . The temperature measuring device as claimed in claim 4 , wherein the data processing unit converts the second thermal radiation data and the third thermal radiation data into a second temperature and a third temperature respectively.

Citation Information

Patent Citations

  • Device and method for detecting heat-dissipating plate

    CN101832959A

  • Vapor chamber heat transfer performance test device and test method

    CN112014425A

  • Non-contact thin vapor chamber thermal performance measuring device

    CN114755259A

  • Non-contact type uniform heating plate temperature measurement detection device

    CN212903546U

  • Temperature measurement device

    JP2017150936A