Display panel, preparation method therefor, and display apparatus

Abstract

The present application provides a display panel, a preparation method therefor, and a display apparatus. The preparation method for the display panel (100) comprises: providing a driving substrate (10), the driving substrate (10) comprising a plurality of pad groups (11); manufacturing grid retaining walls (20) on the drive substrate (10) by means of a first mask plate (80), the grid retaining walls (20) and the driving substrate (10) forming a plurality of pixel openings (23) arranged in an array, each pixel opening (23) being provided with a pad group (11); manufacturing a reflective layer (50) on the side, away from the driving substrate (10), of the grid retaining walls (20), the reflective layer (50) at least covering side walls (203) of each grid retaining wall (20); transferring light-emitting elements (30) onto the driving substrate (10), and performing alignment bonding with the pad groups (11); and manufacturing a lens array (60) by means of the first mask plate, the lens array (60) comprising a plurality of lens units (61) arranged in one-to-one correspondence with the pixel openings (23) and used for gathering light in the pixel openings (23). The preparation method for the display panel (100) can improve the light utilization rate and the light-emitting area of pixel units, and can reduce the number of mask plates.

Description

Display panel, manufacturing method thereof, and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority based on Chinese patent application 2023106897876 filed on June 12, 2023, and all of its contents are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display technology, and in particular to a display panel, a manufacturing method thereof, and a display device. Background Art

[0004] With the continuous advancement and development of scientific and technological modernization, display technology has become a key link in information interaction and intelligent development, and people's requirements for display technology are becoming increasingly higher. Among them, micro-light-emitting diodes (Micro-LEDs) have attracted extensive research across the industry due to their outstanding features such as high contrast, fast response, wide viewing angle, and long life.

[0005] In existing technologies, Micro-LEDs are self-luminous units driven by current. Each Micro-LED within a pixel emits light uniformly in all directions within the pixel space. However, only light that can penetrate the display module is truly useful light. Consequently, within each pixel, the light utilization rate of the light-emitting unit is low, and the light-emitting area within the pixel is small. To improve the light utilization rate of the light-emitting unit, components that enhance light utilization are typically installed within the pixel unit to increase light utilization. However, installing these components increases the production cost of the display panel.

[0006] Summary of the Invention

[0007] The present application provides a display panel, a method for manufacturing the same, and a display device, aiming to solve the problems of low light utilization efficiency and increased production costs of pixel units in display panels in the prior art.

[0008] In order to solve the above technical problems, the first technical solution provided by this application is to provide a method for preparing a display panel. The preparation method includes:

[0009] Providing a driving substrate; the driving substrate includes a plurality of pad groups;

[0010] A grid retaining wall is formed on the driving substrate by using a first mask plate; the grid retaining wall and the driving substrate form a plurality of pixel openings arranged in an array, and each pixel opening is provided with a pad group;

[0011] A reflective layer is formed on a side of the grid retaining wall away from the driving substrate, and the reflective layer at least covers the side wall of the grid retaining wall;

[0012] Transferring the light emitting element to the driving substrate and bonding it to the pad group;

[0013] A lens array is manufactured using the first mask; the lens array includes a plurality of lens units, which are arranged in a one-to-one correspondence with the pixel openings and are used to gather light in the pixel openings.

[0014] The step of making a grid retaining wall on the driving substrate by using a first mask plate includes:

[0015] coating photoresist on the driving substrate to form a photoresist layer;

[0016] Adjusting the exposure dose and exposure parameters to adjust the angle between the side wall and the bottom wall of the grid retaining wall, and the height between the top wall and the bottom wall of the grid retaining wall;

[0017] performing an exposure process on the photoresist layer through the first mask;

[0018] The photoresist layer after exposure is developed to form the grid retaining wall; wherein, the angle between the side wall and the bottom wall of the grid retaining wall is a first preset value, the first preset value is less than 90°, the height between the bottom wall and the top wall of the grid retaining wall is a second preset value, and the light emitting area of ​​the pixel opening is a third preset value.

[0019] The step of manufacturing the lens array using the first mask plate includes:

[0020] Coating a transparent photoresist on a side of the light emitting element away from the driving substrate, wherein the transparent photoresist at least fills the pixel opening;

[0021] Adjusting exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit;

[0022] performing an exposure process on the transparent photoresist through the first mask plate;

[0023] The transparent photoresist after exposure is developed to form the lens array; the lens unit is convex to the side away from the light-emitting element to form a curved surface to gather the light in the pixel opening; wherein the surface of the lens unit on the side away from the light-emitting element is higher than the top wall of the grid retaining wall, and the edge of the lens unit is flush with the top wall of the grid retaining wall.

[0024] The step of manufacturing the lens array using the first mask plate includes:

[0025] providing a transparent substrate;

[0026] coating a transparent photoresist on one side of the transparent substrate;

[0027] Adjusting exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit;

[0028] performing an exposure process on the coated transparent photoresist through the first mask plate;

[0029] The transparent photoresist after exposure is developed to form the lens array; the lens unit is convex toward the side away from the transparent substrate to form a curved surface; the lens array and the transparent substrate form a lens substrate; wherein the photoresist used to make the grid retaining wall is a positive photoresist, and the transparent photoresist used to make the lens array is a negative photoresist; the light-emitting element is a micro light-emitting diode or a sub-millimeter light-emitting diode;

[0030] The preparation method further comprises:

[0031] The lens substrate is aligned and covered on the side of the grid retaining wall away from the driving substrate, and the lens array is located on the side of the transparent substrate close to the driving substrate, and the lens unit is located in the pixel opening and is arranged in a one-to-one correspondence with the pixel opening to gather the light in the pixel opening.

[0032] Wherein, when the lens substrate is aligned and covered on a side of the grid retaining wall away from the driving substrate, the lens substrate is fixed on the grid retaining wall by transparent optical adhesive.

[0033] The first mask plate includes a first area and a second area; the first area corresponds to the grid retaining wall and has the same shape as the grid retaining wall; the second area corresponds to the lens array and has the same shape as the lens array.

[0034] Before the step of forming a reflective layer on the side of the grid retaining wall away from the driving substrate, the method further includes forming an encapsulation layer on the side of the grid retaining wall away from the driving substrate, and exposing the pad group; specifically, the method includes:

[0035] Coating photoresist on a side of the grid retaining wall away from the driving substrate;

[0036] performing an exposure process on the coated photoresist through a second mask;

[0037] Performing a development process on the exposed photoresist to form the encapsulation layer;

[0038] The encapsulation layer extends along the surface of the grid retaining wall and covers the grid retaining wall and a portion of the driving substrate corresponding to the pixel opening. The encapsulation layer has a through hole to expose the pad group.

[0039] The step of forming a reflective layer on a side of the grid retaining wall away from the driving substrate and making the reflective layer at least cover the side wall of the grid retaining wall comprises:

[0040] coating a reflective photoresist containing metal oxide nanoparticles on a side of the encapsulation layer away from the drive substrate;

[0041] performing an exposure process on the coated reflective photoresist through the second mask plate;

[0042] The reflective photoresist after the exposure process is developed to form the reflective layer; the reflective layer covers the grid retaining wall and the packaging layer, and is used to reflect the emitted light of the light-emitting element to the light-emitting surface of the pixel opening.

[0043] In order to solve the above technical problems, the second technical solution provided by this application is to provide a display panel. The display panel includes:

[0044] A driving substrate comprising a plurality of pad groups;

[0045] A grid retaining wall is provided on one side of the driving substrate and forms a plurality of pixel openings arranged in an array with the driving substrate, wherein each pixel opening is provided with one of the pad groups;

[0046] a reflective layer, the reflective layer being disposed on a side of the grid retaining wall away from the driving substrate and at least covering a side wall of the grid retaining wall;

[0047] a light-emitting element disposed in the pixel opening and aligned and bonded to the pad group so that the driving substrate drives the light-emitting element to emit light;

[0048] a lens array comprising a plurality of lens units, each of which is arranged in a one-to-one correspondence with the pixel openings and is used to focus light in the pixel openings;

[0049] The material of the grid retaining wall includes a positive photoresist material, and the material of the lens array includes a negative photoresist material, so that the grid retaining wall and the lens array are both manufactured through a first mask.

[0050] The lens array is arranged on the driving substrate, and the lens units are filled in the corresponding pixel openings and bulge toward a side away from the light-emitting element to form an arc surface, so as to gather the light in the pixel openings.

[0051] In which, the display panel also includes a transparent substrate, which is covered on the side of the grid retaining wall away from the driving substrate, and the lens array is arranged on the side of the transparent substrate close to the driving substrate. The lens unit bulges toward the side away from the transparent substrate to form an arc surface to gather the light in the pixel opening.

[0052] The angle between the side wall and the bottom wall of the grid retaining wall is a first preset value, which is less than 90°; the height between the bottom wall and the top wall of the grid retaining wall is a second preset value.

[0053] The display panel further includes an encapsulation layer disposed between the light-emitting element and the driving substrate, the encapsulation layer extending along the surface of the grid retaining wall and covering the grid retaining wall and a portion of the driving substrate corresponding to the pixel opening, and the encapsulation layer having a through hole to expose the pad group;

[0054] The reflective layer covers the surface of the packaging layer at a side away from the grid retaining wall.

[0055] The material of the reflective layer includes metal oxide nanoparticles and organic resin; and both the encapsulation layer and the reflective layer are made through a second mask.

[0056] Wherein, the light-emitting element is a current-driven light-emitting device.

[0057] Wherein, the light emitting element is a micro light emitting diode.

[0058] In order to solve the above technical problems, the third technical solution provided by the present application is to provide a display device. The display device includes a display panel, the display panel is the display panel involved in the above technical solution, and the display panel is manufactured by the manufacturing method involved in the above technical solution.

[0059] The display device further includes a control module, which is used to provide a control signal to the display panel to support the operation of the display panel.

[0060] Beneficial effects of the present application: Different from the prior art, the present application provides a display panel, a method for preparing the same, and a display device. The method for preparing the display panel makes a reflective layer on the side of the grid retaining wall away from the driving substrate, and makes the reflective layer cover at least the side wall of the grid retaining wall, so that the light in the pixel opening can be reflected to the light-emitting surface through the reflective layer, thereby improving the light utilization rate and the light-emitting area of ​​the pixel opening; by making a lens array, and setting the lens units of the lens array in a one-to-one correspondence with the pixel opening, so as to focus the light in the pixel opening, thereby further improving the luminous efficiency and luminous brightness of the light-emitting element. Furthermore, the present application uses a first mask plate to make the grid retaining wall and the lens array, that is, uses the same mask plate to make the grid retaining wall and the lens array, without the need to design and make a mask plate separately for making the lens array, saving the extra cost of the mask plate, thereby saving production costs and improving product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0062] FIG1 is a schematic diagram of a planar structure of a display panel provided in a first embodiment of the present application;

[0063] FIG2 is a schematic cross-sectional view of the structure taken along line AA in FIG1 ;

[0064] FIG3 is a schematic structural diagram of a first mask provided in one embodiment of the present application;

[0065] FIG4 is a schematic structural diagram of a display panel provided by a second embodiment;

[0066] FIG5 is a schematic structural diagram of a display panel provided in a third embodiment of the present application;

[0067] FIG6 is a schematic structural diagram of a display panel provided in a fourth embodiment of the present application;

[0068] FIG7 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0069] FIG8 is a schematic diagram of a process flow provided by an embodiment of step S2 in FIG7 ;

[0070] FIG9 is a schematic diagram of a process flow provided by a first embodiment of step S5 in FIG7 ;

[0071] FIG10 is a schematic diagram of a flow chart of a second embodiment of step S5 in FIG7 ;

[0072] FIG11 is a schematic diagram of a process for manufacturing an encapsulation layer according to an embodiment of the present application;

[0073] FIG12 is a schematic diagram of a process flow provided by an embodiment of step S3 in FIG7 ;

[0074] FIG13 is a schematic structural diagram of a display device provided in an embodiment of the present application.

[0075] Figure markings: 100-display panel; 10-driving substrate; 11-pad group; 111-first pad; 112-second pad; 20-grid retaining wall; 201-bottom wall; 202-top wall; 203-side wall; 21-first retaining wall; 22-second retaining wall; 23-pixel opening; 30-light-emitting element; 31-electrode; 311-first electrode; 312-second electrode; 32-semiconductor light-emitting layer; 40-encapsulation layer; 50-reflective layer; 60-lens array; 61-lens unit; 70-transparent substrate; 80-first mask plate; 81-first area; 82-second area; 200-control module; X-first direction; Y-second direction. DETAILED DESCRIPTION

[0076] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0077] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0078] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0079] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0080] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the planar structure of the display panel provided in the first embodiment of the present application, and Figure 2 is a schematic diagram of the cross-sectional structure along the AA direction in Figure 1. In this embodiment, a display panel 100 is provided, and the display panel 100 includes a driving substrate 10, a grid retaining wall 20, a light-emitting element 30, and a lens array 60. Among them, the driving substrate 10 is used to drive the light-emitting element 30 to emit light. The driving substrate 10 specifically includes a plurality of pad groups 11, and each pad group 11 includes a first pad 111 and a second pad 112, which are respectively used to align and bond with the two electrodes 31 of the light-emitting element 30, thereby providing a driving signal to the light-emitting element 30 to drive the light-emitting element 30 to emit light.

[0081] The grid retaining wall 20 is disposed on the drive substrate 10 and forms a plurality of pixel openings 23 arranged in an array with the drive substrate 10. Each pixel opening 23 is provided with a pad group 11 and a light-emitting element 30. Specifically, the grid retaining wall 20 has multiple grid structures. The multiple grid structures can be arranged according to the pixel arrangement pattern of the display panel 100, for example, arranged in an array of M rows and N columns, to block lateral light leakage and prevent cross-color between adjacent light-emitting elements 30, similar to a black matrix (BM). Specifically, the grid retaining wall 20 includes multiple first retaining walls 21 extending along a first direction X and multiple second retaining walls 22 extending along a second direction Y. The first direction X and the second direction Y intersect. In the embodiment of the present application, the first direction X and the second direction Y are perpendicular to each other. The multiple first retaining walls 21 and the multiple second retaining walls 22 are arranged to form multiple grid structures. Each of the first and second retaining walls 21 and 22 includes a top wall 202 and a bottom wall 201 that face each other, as well as a sidewall 203 connecting the top and bottom walls 202 and 201. The surfaces of the first and second retaining walls 21 and 22 that are closer to the driver substrate 10 serve as the bottom wall 201, while the surfaces of the first and second retaining walls 21 and 22 that are farther from the driver substrate 10 serve as the top wall 202. The top and bottom walls 202 are parallel to each other. Specifically, the cross-sections of the first and second retaining walls 21 and 22 can be trapezoidal, i.e., the angle between the sidewall 203 and the bottom wall 201 is acute. This allows light incident on the sidewall 203 to be reflected, allowing the light to pass through the pixel opening 23 and reach the user's eyes, thereby improving light utilization. Specifically, the grid retaining walls 20 can be made of an opaque photoresist, such as black photoresist, which is formed by etching the black photoresist using a mask for exposure and development.

[0082] Among them, the lens array 60 is arranged on the driving substrate 10, and the lens array 60 includes a plurality of lens units 61. The plurality of lens units 61 are arranged in a one-to-one correspondence with the pixel openings 23, and are used to focus the light in the pixel openings 23, thereby improving the luminous efficiency and display brightness of the light-emitting element 30 in the pixel openings 23. In this embodiment, the plurality of lens units 61 are filled in the corresponding pixel openings 23, and the lens units 61 are convex to the side away from the light-emitting element 30 to form an arc surface, which is used to focus the light in the pixel openings 23. Specifically, the curvature of the arc surface on the side of the lens unit 61 away from the light-emitting unit can be set according to actual needs. For example, it can be adjusted according to parameters such as the size of the light-emitting element 30, the light output angle, and the distance between the light-emitting element 30 and the arc surface, so that the focusing effect of the lens unit 61 meets the needs. Specifically, the central axis of the lens unit 61 can be coaxial with the light-emitting central axis of the light-emitting element 30 to improve the focusing effect of the lens unit 61. Of course, the central axis of the lens unit 61 may also be non-collinear with the light-emitting center axis of the light-emitting unit or be set at a certain angle to offset the light-emitting center of the light-emitting unit so that the light in the pixel opening 23 can meet the usage requirements.

[0083] Specifically, in this embodiment, the surface of the lens unit 61 on the side away from the light-emitting element 30 is higher than the top wall 202 of the grid retaining wall 20, and the edge of the lens unit 61 is flush with the top wall 202 of the grid retaining wall 20. This not only does not increase the overall thickness of the display panel 100, but also allows more light within the corresponding pixel opening 23 to pass through the lens unit 61, thereby improving the light-collecting effect of the lens unit 61. The thickness of the lens unit 61 can be set according to actual needs and is not specifically limited.

[0084] Specifically, the material of the lens unit 61 can be a transparent resin material. The lens array 60 can be formed by exposing and developing the lens array 60 using a mask. Because the lens array 60 is arranged corresponding to the pixel openings 23, the lens array 60 and the grid retaining wall 20 can be manufactured using the same mask. This eliminates the need to design and manufacture a separate mask for the lens array 60, saving additional mask costs and thus reducing production costs, thereby improving product competitiveness.

[0085] Please refer to Figure 3, which is a schematic structural diagram of a first mask plate 80 provided in an embodiment of the present application. In this embodiment, the first mask plate 80 is used to manufacture the grid retaining wall 20 and the lens array 60. Specifically, the first mask plate 80 includes a first region 81 and a second region 82. The first region 81 corresponds to the grid retaining wall 20, and the shape of the first region 81 is the same as the shape of the grid retaining wall 20. The second region 82 corresponds to the lens array 60, and the shape of the second region 82 is the same as the shape of the lens array 60. The first region 81 has a plurality of holes distributed in an array, and the plurality of holes distributed in an array constitute the second region 82. When manufacturing the grid retaining wall 20 and the lens array 60, the photoresist used to manufacture the grid retaining wall 20 is a positive photoresist, and the photoresist used to manufacture the lens array 60 is a negative photoresist. Therefore, the first mask plate 80 can be used to manufacture both the grid retaining wall 20 and the lens array 60, thereby saving the production cost of the display panel 100.

[0086] In this embodiment, the display panel 100 further includes a reflective layer 50, which is disposed on a side of the grid retaining wall 20 away from the drive substrate 10 and covers at least the sidewall 203 of the grid retaining wall 20 to reflect light. Specifically, the reflective layer 50 may cover the top wall 202 and sidewalls 203 of the grid retaining wall 20, as well as a portion of the drive substrate 10 within the pixel opening 23, thereby increasing the reflectivity of light within the pixel opening 23 and thereby improving the light utilization efficiency of the light-emitting element 30. Specifically, the reflective layer 50 may be made of a metal or an organic material, such as aluminum, copper, silver, or some metal alloys. The organic material may be, for example, an organic resin doped with metal oxide nanoparticles having a low light absorption coefficient, which exhibits mirror-like reflective properties after high-temperature curing.

[0087] Specifically, the specific angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20 can be adjusted to control the reflection angle of the reflective layer 50 on the light and the refraction angle of the lens unit 61 on the light, so that the propagation direction of the light in the pixel opening 23 can be concentrated according to the use requirements to improve the light utilization rate. At the same time, by reducing the angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20, the width of the top wall 202 of the grid retaining wall 20 can be reduced, and the width of the top of the pixel opening 23 can be increased to increase the light output area of ​​the pixel opening 23 to meet the large size requirements of the pixel unit. Specifically, when making the grid retaining wall 20, the exposure dose and exposure parameters can be adjusted to control the angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20 to meet actual needs.

[0088] In this embodiment, the display panel 100 further includes an encapsulation layer 40, which is disposed between the light-emitting element 30 and the drive substrate 10. The encapsulation layer 40 is used to protect the pad group 11 and the electrode 31 of the light-emitting element 30, thereby preventing the pad group 11 and the electrode 31 of the light-emitting element 30 from being corroded by water, oxygen, etc., and also improves the bonding stability of the light-emitting element 30, thereby preventing the light-emitting element 30 from loosening or falling off. Specifically, the material of the encapsulation layer 40 may include a transparent organic resin material, which is formed by exposure and development using a mask.

[0089] In this embodiment, the encapsulation layer 40 is specifically arranged between the light-emitting element 30 and the driving substrate 10, extends to the grid retaining wall 20, and covers the grid retaining wall 20. The reflective layer 50 covers the side of the encapsulation layer 40 away from the grid retaining wall 20. Therefore, the encapsulation layer 40 and the reflective layer 50 can be formed using the same mask plate, thereby further saving the number of mask plates and saving the production cost of the display panel 100.

[0090] Please refer to FIG4 , which is a schematic diagram of the structure of a display panel 100 provided in a second embodiment of the present application. In this embodiment, the display panel 100 further includes a transparent substrate 70, which is disposed on a side of the grid retaining wall 20 away from the driving substrate 10. A lens array 60 is provided on a side of the transparent substrate 70 closer to the driving substrate 10. The lens array 60 includes a plurality of lens units 61. The lens units 61 are disposed at the pixel openings 23 and are arranged one-to-one with the pixel openings 23 to focus light in the pixel openings 23. Specifically, the lens units 61 are convex toward the side away from the transparent substrate 70 to form a curved surface to focus light in the pixel openings 23. The curvature of the curved surface of the lens unit 61 on the side away from the transparent substrate 70 can be set according to actual needs. For example, it can be adjusted based on parameters such as the size of the light-emitting element 30, the light emission angle, and the distance between the light-emitting element 30 and the curved surface to ensure that the focusing effect of the lens unit 61 meets the requirements. Specifically, the central axis of the lens unit 61 can be coaxially arranged with the central axis of light emission of the light emitting element 30 to improve the light focusing effect of the lens unit 61. Of course, the central axis of the lens unit 61 can also be non-collinear with the central axis of light emission of the light emitting unit or arranged at a certain angle to offset the light emission center of the light emitting unit so that the light in the pixel opening 23 can meet the usage requirements.

[0091] Specifically, in this embodiment, the thickness of the lens unit 61 can be set according to actual needs and is not specifically limited. During production, the lens array 60 is first fabricated on the transparent substrate 70 to form a lens substrate. The lens substrate is then aligned and mounted on the grid retaining wall 20. The lens units 61 are positioned at the pixel openings 23, corresponding to each pixel opening 23. This allows the light within each pixel opening 23 to be focused, thereby improving the effective utilization of the light from the light-emitting element 30.

[0092] In this embodiment, the lens unit 61 can be made of a transparent resin material. The lens array 60 is also formed by exposure and development using the first mask plate 80. This eliminates the need for a dedicated mask plate to manufacture the lens array 60, saving mask plate costs and, consequently, the production cost of the display panel 100. Furthermore, because both the lens array 60 and the grid retaining wall 20 are manufactured using the first mask plate 80, the lens array 60 and the pixel openings 23 are more closely matched, achieving higher alignment accuracy and a more precise focusing effect.

[0093] Specifically, the lens array 60 can be formed by exposing and developing the lens array using a mask. Since the lens array 60 is arranged corresponding to the pixel openings 23, the lens array 60 and the grid retaining wall 20 can be manufactured using the same mask. This eliminates the need to design and manufacture a separate mask for the lens array 60, saving additional mask costs and thus production costs, thereby improving product competitiveness.

[0094] In the embodiment of the present application, the light-emitting element 30 can be a current-driven light-emitting device, such as a light-emitting diode (LED), a sub-millimeter light-emitting diode (Mini-LED), or a micro-light-emitting diode (Micro-LED). The light-emitting element 30 can be configured according to actual needs and is not specifically limited to this. In the embodiment of the present application, a micro-light-emitting diode (Micro-LED) is used as an example for description. The light-emitting element 30 includes a semiconductor light-emitting layer 32, a first electrode 311, and a second electrode 312. The first electrode 311 and the second electrode 312 are respectively aligned and bonded to the first pad 111 and the second pad 112 of the pad group 11, so that the drive substrate 10 is electrically connected to the light-emitting element 30, thereby driving the light-emitting element 30 to emit light. Specifically, the plurality of light-emitting elements 30 may include a first light-emitting element 30, a second light-emitting element 30 and a third light-emitting element 30, and the first light-emitting element 30, the second light-emitting element 30 and the third light-emitting element 30 may be used to emit red light, green light and blue light, respectively, and the first light-emitting element 30, the second light-emitting element 30 and the third light-emitting element 30 are arranged according to a preset rule to display the image in full color.

[0095] It should be noted that because Micro-LED chips are fabricated on sapphire epitaxial wafers, smaller Micro-LEDs are more affordable, but their light source area is also smaller. Therefore, when the pixel unit size is large, that is, when the area of ​​the pixel opening 23 is large, conventional display panels 100 often suffer from the problem that the light emitting area and light intensity of the small light emitting element 30 cannot meet the requirements of the large pixel unit. In the embodiment of the present application, a reflective layer 50 is provided on the grid retaining wall 20 to reflect the light emitted to the reflective layer 50 to the light-emitting surface of the pixel opening 23, thereby improving the utilization rate of the light and increasing the light-emitting area of ​​the pixel opening 23; further, a lens array 60 is provided at a position corresponding to the pixel opening 23 to focus the light in the pixel opening 23, thereby further improving the luminous efficiency and luminous brightness of the light-emitting element 30, so that the small-sized light-emitting element 30 can be adapted to the larger-sized pixel opening 23, that is, the display panel 100 provided in the embodiment of the present application can, under the premise of ensuring a larger luminous area and luminous intensity, realize that the small-sized light-emitting element 30 is adapted to the larger-sized pixel unit, which can further reduce the production cost.

[0096] Please refer to Figures 5 and 6. Figure 5 is a schematic structural diagram of the display panel 100 provided in the third embodiment of the present application, and Figure 6 is a schematic structural diagram of the display panel 100 provided in the fourth embodiment of the present application. The difference is that in the third embodiment, the lens unit 61 fills the pixel opening 23 and covers the light-emitting element 30, and the surface of the lens unit 61 on the side away from the light-emitting element 30 is a curved surface; in the fourth embodiment, the lens unit 61 is arranged on the side of the transparent substrate 70 close to the driving substrate 10, and is arranged in alignment with the pixel opening 23. The same is that in these two embodiments, the height of the gate retaining wall is increased to the first preset value, the angle between the side wall 203 of the gate retaining wall and the bottom wall 201 is reduced to the second preset value, and the light-emitting area of ​​the pixel opening 23 is increased to the third preset value. Specifically, in the first and second embodiments, the original height of the grid retaining wall 20 is h1, and the angle between the side wall 203 and the bottom wall 201 is α, so that the width of the pixel opening 23 is a1 and the light exit area of ​​the pixel opening 23 is S1. In the third and fourth embodiments, the height of the grid retaining wall 20 is increased to h2, and the angle between the side wall 203 and the bottom wall 201 is β, so that the width of the pixel opening 23 is increased to a2 and the light exit area is increased to S2, wherein h2>h1, α>β, a2>a1, and S2>S1. It should be noted that in the embodiments of the present application, the height of the grid retaining wall 20 refers to the height between the bottom wall 201 and the top wall 202. In these two embodiments, by increasing the height of the gate retaining wall and / or reducing the angle between the gate retaining wall side wall 203 and the bottom wall 201, the opening area of ​​the pixel opening 23 is increased, thereby increasing the light exit area of ​​the pixel opening 23.

[0097] Specifically, when making the grid retaining wall 20, the first mask plate 80 can also be used. Before exposing the photoresist, by adjusting the exposure dose and exposure parameters, and adjusting the dose, contrast, and viscosity of the photoresist of the ultraviolet light passing through the first mask plate, the height of the grid retaining wall 20 and the angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20 are adjusted to meet the opening area requirements of the pixel opening 23; in this way, the original first mask plate 80 can still be used, and there is no need to redesign and manufacture the first mask plate 80, thereby meeting the large size requirements of the pixel opening 23 and further saving production costs.

[0098] Specifically, in a traditional display panel, the height of the grid retaining wall is h1, the angle between the side wall and the bottom wall of the grid retaining wall is α, and the light-emitting area of ​​the pixel unit is S0; the embodiment of the present application can effectively improve the light utilization rate of the pixel unit by setting a lens array 60, thereby effectively improving the luminous area and luminous brightness; further, the embodiment of the present application can increase the height of the grid retaining wall 20 to h2 and reduce the angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20 to β, thereby increasing the area of ​​the pixel opening 23 to form a large-size pixel unit, and by setting a lens array 60, to improve the light utilization rate in the pixel opening 23, thereby increasing the actual light-emitting area of ​​the pixel opening 23 to S2, and effectively improving the luminous brightness of the pixel unit to meet the light-emitting area and brightness requirements of the large-size pixel unit; compared with the traditional display panel, the display panel provided by the embodiment of the present application can increase the luminous area of ​​the pixel unit by about 1.3 to 1.8 times, and basically by more than 1.5 times. Furthermore, in the third and fourth embodiments, the driving voltage of the light-emitting element can be increased to further improve the luminous brightness of the light-emitting element, thereby further improving the brightness of the pixel unit to meet the luminous brightness requirements of large-size pixel units, thereby improving the display brightness and display effect of the display panel.

[0099] Through the above-mentioned arrangement, in the embodiment of the present application, the use requirements of large-size pixel units can be met by using small-size light-emitting elements, which can effectively reduce the cost of the light-emitting elements and thus reduce the production cost of the display panel.

[0100] Specifically, the manufacturing method of the display panel 100 is as described below, which will not be introduced in detail here. Please refer to the following for details.

[0101] Please refer to Figure 7, which is a schematic flow chart of a method for manufacturing a display panel according to one embodiment of the present application. In this embodiment, a method for manufacturing a display panel 100 is provided. The method can be used to manufacture the display panel 100 involved in the above embodiments. The method for manufacturing the display panel 100 specifically includes the following steps:

[0102] S1: providing a driving substrate 10; the driving substrate 10 includes a plurality of pad groups 11;

[0103] S2: Using a first mask plate 80, a grid retaining wall 20 is formed on the driving substrate 10; the grid retaining wall 20 and the driving substrate 10 form a plurality of pixel openings 23 arranged in an array, each pixel opening 23 having a pad group 11;

[0104] S3: forming a reflective layer 50 on a side of the grid retaining wall 20 away from the driving substrate 10 , and making the reflective layer 50 cover at least the side wall 203 of the grid retaining wall 20 ;

[0105] S4: transferring the light emitting element 30 to the driving substrate 10 and aligning and bonding it with the pad group 11;

[0106] S5 : manufacturing a lens array 60 through the first mask; the lens array 60 includes a plurality of lens units 61 , which are arranged in a one-to-one correspondence with the pixel openings 23 and are used to focus the light in the pixel openings 23 .

[0107] Among them, the provided driving substrate 10 includes multiple pad groups 11, which are arranged in an array. Each pad group 11 includes a first pad 111 and a second pad 112, which are respectively used to align and bond with the first electrode 311 and the second electrode 312 of the light-emitting element 30 to drive the light-emitting element 30 to emit light.

[0108] In this embodiment, by forming a reflective layer 50 on the side of the grid retaining wall 20 away from the drive substrate 10, and by making the reflective layer 50 cover at least the side wall 203 of the grid retaining wall 20, the light within the pixel opening 23 can be reflected to the light-emitting surface by the reflective layer 50, thereby improving the light utilization rate and the light-emitting area of ​​the pixel opening 23. By forming a lens array 60, and setting the lens units 61 of the lens array 60 in a one-to-one correspondence with the pixel opening 23, the light in the pixel opening 23 is focused, thereby further improving the luminous efficiency and luminous brightness of the light-emitting element 30. Furthermore, the present application uses a first mask plate 80 to form the grid retaining wall 20 and the lens array 60, that is, uses the same mask plate to form the grid retaining wall 20 and the lens array 60, eliminating the need to design and manufacture a separate mask plate for forming the lens array 60, saving the additional cost of the mask plate, thereby saving production costs and improving product competitiveness. In this embodiment, the grid retaining wall 20 is first made, and then the light-emitting element 30 is transferred to the driving substrate, and the light-emitting element 30 is aligned and bonded to the pad group 11. Due to the multiple groove-structured pixel openings 23 formed between the grid retaining wall 20 and the driving substrate 10, the alignment accuracy of the light-emitting element is higher, and the position of the light-emitting element is relatively more fixed and not easy to shift.

[0109] Specifically, please refer to Figure 8, which is a flow chart of an embodiment of step S2 in Figure 7. In this embodiment, the above step S2 specifically includes the following steps:

[0110] S21: coating photoresist on the driving substrate 10 to form a photoresist layer;

[0111] S22: adjusting the exposure dose and exposure parameters to adjust the angle between the side wall 203 and the bottom wall 201 of the grid retaining wall 20, and the height between the top wall 202 and the bottom wall 201 of the grid retaining wall 20;

[0112] S23: exposing the photoresist layer through a first mask;

[0113] S24 : developing the photoresist layer after the exposure process to form the grid retaining wall 20 .

[0114] Before applying the photoresist, the drive substrate 10 needs to be pre-treated, and the front end of the drive substrate 10 needs to be cleaned and dried. After the pre-treatment, the drive substrate 10 is coated with photoresist by a coating device located above the drive substrate 10, completing the photoresist coating process. Specifically, the photoresist can be a black photoresist used to make a black matrix, and the photoresist is a positive photoresist.

[0115] In step S22, before exposing the photoresist, the parameters of the exposure device need to be adjusted. By adjusting the exposure dose and exposure parameters of the ultraviolet light, the inclination of the sidewalls 203 of the grid retaining wall 20 and the height of the grid retaining wall 20 are adjusted so that the inclination of the sidewalls 203 and the height of the grid retaining wall 20 formed subsequently can reach preset values. Thus, after the exposure, development, and curing processes, the grid retaining wall 20 is formed, and the angle between the sidewalls 203 and the bottom wall 201 of the grid retaining wall 20 is a first preset value, which is less than 90°, that is, the angle between the sidewalls 203 and the bottom wall 201 is an acute angle. The height between the bottom wall 201 and the top wall 202 of the grid retaining wall 20 is a second preset value, and the light output area of ​​the pixel opening 23 is a third preset value. Specifically, the specific structure and function of the lattice retaining wall 20 produced by this embodiment are the same or similar to the specific structure and function of the lattice retaining wall 20 involved in the above embodiment, and can achieve the same technical effect. Please refer to the specific introduction above and will not repeat it here.

[0116] Specifically, in the above embodiment, the height of the grid retaining wall 20 and the inclination of the side wall 203 can be adjusted by adjusting the exposure dose and exposure parameters of the ultraviolet light so that the opening area of ​​the pixel opening 23 reaches a preset value, thereby making the light output area of ​​the pixel opening 23 reach a third preset value. Through the first mask plate 80, both small-size pixel units and large-size pixel units can be produced.

[0117] Please refer to Figure 9, which is a flow chart of a first embodiment of step S5 in Figure 7. In this embodiment, the above step S5 specifically includes the following steps:

[0118] S511: Coating a transparent photoresist on a side of the light emitting element 30 away from the driving substrate 10 , wherein the transparent photoresist at least fills the pixel opening 23 ;

[0119] S512: adjusting the exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit 61;

[0120] S513: exposing the transparent photoresist through the first mask plate 80;

[0121] S514 : developing the transparent photoresist after the exposure process to form a lens array 60 ; the lens unit 61 is convex toward the side away from the light emitting element 30 to form an arc surface to gather the light in the pixel opening 23 .

[0122] In this embodiment, the transparent photoresist can be a negative photoresist. By adjusting the ultraviolet exposure dose and exposure parameters, the thickness and focusing degree of the lens unit 61 can be adjusted so that the focusing effect of the lens unit 61 meets the use requirements. Specifically, the specific structure and function of the lens array 60 produced by this embodiment are the same or similar to the specific structure and function of the lens array 60 involved in the first embodiment above, and can achieve the same technical effects. For details, please refer to the detailed introduction above and will not be repeated here. By providing the lens array 60, the light in the pixel opening 23 is focused, thereby improving the light utilization rate and the luminous brightness, so that the requirements of large-sized pixel units can be met while ensuring the brightness.

[0123] Specifically, the surface of the lens unit 61 on the side away from the light-emitting element 30 is higher than the top wall 202 of the grid retaining wall 20, and the edge of the lens unit 61 is flush with the top wall 202 of the grid retaining wall 20. This not only does not increase the overall thickness of the display panel 100, but also allows more light within the corresponding pixel opening 23 to pass through the lens unit 61, thereby improving the light-collecting effect of the lens unit 61. The thickness of the lens unit 61 can be set according to actual needs and is not specifically limited.

[0124] Please refer to Figure 10, which is a flow chart of a second embodiment of step S5 in Figure 7. In this embodiment, the above step S5 specifically includes the following steps:

[0125] S521: providing a transparent substrate 70;

[0126] S522: coating a transparent photoresist on one side of the transparent substrate 70;

[0127] S523: adjusting the exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit 61;

[0128] S524: exposing the coated transparent photoresist through the first mask plate 80;

[0129] S525 : developing the transparent photoresist after the exposure process to form the lens array 60 ; the lens unit 61 is convex toward the side away from the transparent substrate 70 to form an arc surface.

[0130] In this embodiment, the lens array 60 is not directly manufactured on the drive substrate 10, but is manufactured on another transparent substrate 70, and the lens array 60 is manufactured using a first mask plate 80, so that the lens units 61 in the formed lens array 60 can correspond one-to-one with the pixel openings 23, without having to worry about the positional accuracy of the lens units 61. By using the first mask plate to manufacture the lens array 60, there is no need to additionally design and manufacture a mask plate for manufacturing the lens array 60, which can effectively save production costs and improve product competitiveness. The lens array 60 manufactured by this embodiment has the same or similar specific structure and function as the lens array 60 involved in the second embodiment above, and can achieve the same technical effects. For details, please refer to the detailed description above and will not be repeated here.

[0131] In this embodiment, after the lens array 60 is fabricated on the transparent substrate 70 to obtain the lens substrate, the process further includes step S6, after step S5, of aligning the lens substrate and placing it on the side of the grid retaining wall 20 away from the drive substrate 10. The lens array 60 is positioned on the side of the transparent substrate 70 closer to the drive substrate 10, and the lens units 61 are positioned in the pixel openings 23, corresponding to each pixel opening 23 one by one, to focus the light in the pixel openings 23.

[0132] Specifically, when the lens substrate is aligned and covered on the grid retaining wall 20, the lens substrate can be fixed to the grid retaining wall 20 through a transparent optical adhesive layer to prevent external dust, water, oxygen, etc. from entering the panel, causing the brightness of the display panel 100 to decrease or the bonding between the light-emitting element 30 and the pad group 11 to fail, resulting in dark spots.

[0133] Please refer to Figure 11, which is a schematic diagram of the process for manufacturing an encapsulation layer according to one embodiment of the present application. In this embodiment, the method for manufacturing the display panel 100 further includes step S7: forming an encapsulation layer 40 on the side of the grid retaining wall 20 away from the driving substrate 10, and exposing the pad group 11. Specifically, step S7 is between steps S2 and S3, and specifically includes the following steps:

[0134] S71: coating photoresist on a side of the grid retaining wall 20 away from the driving substrate 10;

[0135] S72: exposing the coated photoresist through a second mask;

[0136] S73 : developing the exposed photoresist to form an encapsulation layer 40 .

[0137] In this embodiment, the encapsulation layer 40 is formed between the light-emitting element 30 and the drive substrate 10, and extends to and covers the grid retaining wall 20. This protects the pad group 11 and the electrode 31 of the light-emitting element 30 from corrosion by water, oxygen, and the like. It also improves the bonding stability of the light-emitting element 30 and prevents the light-emitting element 30 from loosening or falling off. The encapsulation layer 40 has through holes to expose the pad group 11, facilitating subsequent thermal compression bonding with the light-emitting element 30.

[0138] Please refer to Figure 12, which is a flow chart of an embodiment of step S3 in Figure 7. In this embodiment, step 3 specifically includes the following steps:

[0139] S31: coating a reflective photoresist containing metal oxide nanoparticles on a side of the encapsulation layer 40 away from the driving substrate 10;

[0140] S32: exposing the coated reflective photoresist through a second mask;

[0141] S33 : developing the reflective photoresist after the exposure process to form a reflective layer 50 ; the reflective layer 50 covers the grid retaining wall 20 and the packaging layer 40 and is used to reflect the emitted light of the light emitting element 30 to the light emitting surface of the pixel opening 23 .

[0142] In this embodiment, the reflective photoresist comprises an organic resin and metal oxide nanoparticles. The metal oxide nanoparticles have a low light absorption coefficient, such as aluminum oxide nanoparticles, zinc oxide nanoparticles, or a mixture thereof, so that the reflective layer 50 formed after high-temperature curing has mirror-like reflective properties. Specifically, the doping concentration of the metal oxide nanoparticles can be set according to actual needs and is not specifically limited. Specifically, the specific structure and function of the reflective layer 50 formed by this embodiment are the same or similar to those of the reflective layer 50 described in the above embodiments, and can achieve the same technical effects. For details, please refer to the detailed description above and will not be repeated here.

[0143] The reflective layer 50 formed by the above embodiment covers the side of the encapsulation layer 40 away from the grid retaining wall 20, and its surface shape and size are the same as those of the filling layer. Therefore, both the encapsulation layer 40 and the reflective layer 50 can be formed using a second mask plate, thereby further saving the number of mask plates and saving the production cost of the display panel 100.

[0144] The display panel manufactured using the above-described embodiment can utilize the existing matching mask plate, eliminating the need for additional mask plates for the lens array and encapsulation layer. This not only increases the light-emitting area and brightness of the pixel units, improving the display effect, but also reduces production costs. Furthermore, the manufacturing method of the above-described embodiment allows the use of small-sized light-emitting elements to meet the requirements of large-sized pixel units, effectively reducing the cost of the light-emitting elements and thus further reducing the production cost of the display panel.

[0145] Please refer to Figure 13, which is a schematic diagram of the structure of a display device provided in one embodiment of the present application. In this embodiment, the display device includes a display panel 100 and a control module 200. The control module 200 is electrically connected to the display panel 100 to provide a control signal to the display panel 100 to drive the display panel 100 to display a corresponding image.

[0146] Specifically, the control module 200 can be used to provide the display panel 100 with various control signals required by the display panel 100, such as scan signals, data signals, clock signals, and power signals, to support the operation of the display panel 100. The specific structure and function of the display panel 100 are the same or similar to those of the display panel 100 involved in the above embodiment, and can achieve the same technical effects. For details, please refer to the detailed description above and will not be repeated here. Specifically, the display panel 100 can be manufactured by the manufacturing method of the display panel 100 provided in the above embodiment. The specific manufacturing method can be referred to the detailed description above and will not be repeated here.

[0147] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a display panel, in, include: Providing a drive substrate; The driving substrate includes a plurality of pad groups; A grid retaining wall is made on the driving substrate by using a first mask plate; the grid retaining wall and the driving substrate form a plurality of pixel openings arranged in an array, and each of the pixel openings is provided with a pad group; A reflective layer is formed on a side of the grid retaining wall away from the driving substrate, and the reflective layer at least covers the side wall of the grid retaining wall; Transferring the light emitting element to the driving substrate and bonding it to the pad group; A lens array is manufactured by using the first mask plate; the lens array includes a plurality of lens units, and the lens units are arranged in a one-to-one correspondence with the pixel openings to gather the light in the pixel openings.

2. The preparation method according to claim 1, in, The step of manufacturing the grid retaining wall on the driving substrate by using the first mask plate comprises: Coating photoresist on the driving substrate to form a photoresist layer; Adjusting the exposure dose and exposure parameters to adjust the angle between the side wall and the bottom wall of the grid retaining wall, and the height between the top wall and the bottom wall of the grid retaining wall; performing exposure processing on the photoresist layer through the first mask; The photoresist layer after exposure is developed to form the grid retaining wall; wherein the angle between the side wall and the bottom wall of the grid retaining wall is a first preset value, the first preset value is less than 90°, the height between the bottom wall and the top wall of the grid retaining wall is a second preset value, and the light emitting area of ​​the pixel opening is a third preset value.

3. The preparation method according to claim 1, in, The step of manufacturing the lens array by using the first mask plate comprises: Coating a transparent photoresist on a side of the light emitting element away from the driving substrate, wherein the transparent photoresist at least fills the pixel opening; Adjusting exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit; performing exposure processing on the transparent photoresist through the first mask plate; The transparent photoresist after exposure is developed to form the lens array; the lens unit is convex to the side away from the light-emitting element to form an arc surface to gather the light in the pixel opening; wherein the surface of the lens unit on the side away from the light-emitting element is higher than the top wall of the grid retaining wall, and the edge of the lens unit is flush with the top wall of the grid retaining wall.

4. The preparation method according to claim 1, in, The step of manufacturing the lens array by using the first mask plate comprises: providing a transparent substrate; coating a transparent photoresist on one side of the transparent substrate; Adjusting exposure dose and exposure parameters to adjust the thickness and focusing degree of the lens unit; performing an exposure process on the coated transparent photoresist through the first mask plate; The transparent photoresist after exposure is developed to form the lens array; the lens unit is convex to the side away from the transparent substrate to form a curved surface; the lens array and the transparent substrate form a lens substrate; wherein the photoresist used to make the grid retaining wall is a positive photoresist, and the transparent photoresist used to make the lens array is a negative photoresist; the light-emitting element is a micro light-emitting diode or a sub-millimeter light-emitting diode; The preparation method further comprises: The lens substrate is aligned and covered on the side of the grid retaining wall away from the driving substrate, and the lens array is located on the side of the transparent substrate close to the driving substrate, and the lens unit is located in the pixel opening and is arranged one-to-one with the pixel opening to gather the light in the pixel opening.

5. The preparation method according to claim 4, in, When the lens substrate is aligned and covered on a side of the grid retaining wall away from the driving substrate, the lens substrate is fixed on the grid retaining wall by transparent optical adhesive.

6. The preparation method according to claim 1, in, The first mask plate includes a first area and a second area; the first area corresponds to the grid retaining wall and has the same shape as the grid retaining wall; the second area corresponds to the lens array and has the same shape as the lens array.

7. The preparation method according to claim 1, in, Before the step of forming a reflective layer on the side of the grid retaining wall away from the driving substrate, the step further includes: forming a packaging layer on the side of the grid retaining wall away from the driving substrate, and exposing the pad group; specifically including: Applying photoresist on a side of the grid retaining wall away from the driving substrate; performing an exposure process on the coated photoresist through a second mask plate; Performing a developing process on the photoresist after the exposure process to form the encapsulation layer; The encapsulation layer extends along the surface of the grid retaining wall and covers the grid retaining wall and a portion of the driving substrate corresponding to the pixel opening, and the encapsulation layer has a through hole to expose the pad group.

8. The preparation method according to claim 7, in, The step of manufacturing a reflective layer on a side of the grid retaining wall away from the driving substrate and making the reflective layer at least cover the side wall of the grid retaining wall comprises: Coating a reflective photoresist containing metal oxide nanoparticles on a side of the encapsulation layer away from the drive substrate; performing an exposure process on the coated reflective photoresist through the second mask plate; The reflective photoresist after the exposure process is developed to form the reflective layer; the reflective layer covers the grid retaining wall and the packaging layer, and is used to reflect the emitted light of the light-emitting element to the light-emitting surface of the pixel opening.

9. A display panel, in, include: A driving substrate, comprising a plurality of pad groups; A grid retaining wall is arranged on one side of the driving substrate and forms a plurality of pixel openings arranged in an array with the driving substrate, wherein each pixel opening is provided with one of the pad groups; A reflective layer, the reflective layer is arranged on a side of the grid retaining wall away from the driving substrate and at least covers Cover the side walls of the grid retaining wall; A light emitting element is disposed in the pixel opening and aligned and bonded with the pad group, so that the driving substrate drives the light emitting element to emit light; A lens array, comprising a plurality of lens units, wherein the lens units are arranged in one-to-one correspondence with the pixel openings and are used to gather light in the pixel openings; The material of the grid retaining wall includes a positive photoresist material, and the material of the lens array includes a negative photoresist material, so that the grid retaining wall and the lens array are both manufactured through a first mask.

10. The display panel according to claim 9, in, The lens array is arranged on the driving substrate, and the lens unit is filled in the corresponding pixel opening and bulges toward a side away from the light emitting element to form an arc surface, so as to gather the light in the pixel opening.

11. The display panel according to claim 9, in, The display panel also includes a transparent substrate, which is covered on a side of the grid retaining wall away from the driving substrate. The lens array is arranged on a side of the transparent substrate close to the driving substrate. The lens unit protrudes toward a side away from the transparent substrate to form an arc surface to gather light in the pixel opening.

12. The display panel according to claim 9, in, The angle between the side wall and the bottom wall of the grid retaining wall is a first preset value, which is less than 90°; the height between the bottom wall and the top wall of the grid retaining wall is a second preset value.

13. The display panel according to claim 9, in, The display panel further includes an encapsulation layer disposed between the light emitting element and the driving substrate, the encapsulation layer extending along the surface of the grid retaining wall and covering the grid retaining wall and a portion of the driving substrate corresponding to the pixel opening, the encapsulation layer having a through hole to expose the pad group; The reflective layer covers the surface of the packaging layer at a side away from the grid retaining wall.

14. The display panel according to claim 13, in, The material of the reflective layer includes metal oxide nanoparticles and organic resin; the encapsulation layer and the reflective layer are both made by using a second mask plate.

15. The display panel according to claim 9, in, The light emitting element is a current driven light emitting device.

16. The display panel according to claim 15, in, The light emitting element is a micro light emitting diode.

17. A display device, in, A display panel is included, wherein the display panel is the display panel as claimed in claim 7, and the display panel is manufactured by the manufacturing method as claimed in claim 1.

18. The display device according to claim 17, in, The display device further includes a control module, which is used to provide a control signal to the display panel to support the operation of the display panel.

Images