Drying medium recovery system and semiconductor drying apparatus

Abstract

The present application relates to a supercritical drying medium recovery system and a semiconductor wafer drying apparatus. The supercritical drying medium recovery system comprises a separation device; the separation device comprises a condensation pipeline and a first cavity; a liquid discharge port is formed in the lower side wall of the condensation pipeline and is communicated with the first cavity; the inlet of the condensation pipeline is used for receiving an organic solvent-containing drying medium, and the outlet of the condensation pipeline is used for discharging the separated drying medium for recovery, wherein the condensation pipeline is used for condensing the organic solvent in the organic solvent-containing drying medium, so that the organic solvent is condensed into a liquid to flow into the first cavity from the liquid discharge port. The present application solves the problem in the related art of how to recover carbon dioxide in the wafer drying process, realizing carbon dioxide recovery in the wafer drying process.

Description

Drying media recovery systems and semiconductor drying equipment Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a drying medium recovery system and semiconductor drying equipment. Background Art

[0002] During the manufacturing process of integrated circuits, the characteristic dimensions of semiconductor devices continue to shrink, and the aspect ratio of graphic structures becomes larger and larger, thus placing higher and higher requirements on wafer cleaning technology.

[0003] Traditional wafer cleaning processes typically require rinsing the wafer with large amounts of high-purity water and then drying it with isopropyl alcohol (IPA). However, as the aspect ratios of wafer structures increase, traditional wafer cleaning processes are struggling to meet production demands. This is primarily because the surface tension at the gas-liquid interface when drying wafers with IPA can easily cause adhesion and collapse of high-aspect-ratio structures. To address this issue, supercritical carbon dioxide (SCCO) drying technology has been gradually applied to wafer cleaning processes. This drying technology uses SCCO, which has zero surface tension, to dry the cleaned wafer surface. Utilizing the high solubility, high diffusivity, and low viscosity of SCCO, the SCCO and SC are fully dissolved in the SCCO and SCCO in a supercritical state. Finally, the SCCO is released, removing the SCCO from the wafer surface, completing the drying process without damaging the wafer structures. However, research has found that the amount of SCCO used in SCCO drying is very high. If the used SCCO is not treated and is directly discharged into the atmosphere, it not only pollutes the environment but also wastes SCCO.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide a supercritical drying medium recovery system and semiconductor drying equipment to at least solve the problem of how to recover the drying medium (such as carbon dioxide) in the process of drying wafers in the related art.

[0006] In a first aspect, an embodiment of the present application provides a drying medium recovery system, which is applied to semiconductor drying equipment, wherein the semiconductor drying equipment includes a drying device, which is used to dissolve the organic solvent on the wafer through a supercritical drying medium; the drying medium recovery system is used to recover the drying medium in the drying medium containing the organic solvent discharged from the drying device, and the drying medium recovery system includes a separation device, which includes a condensation pipeline and a first cavity, and the lower side wall of the condensation pipeline is provided with a drain port, and the drain port is connected to the first cavity, the inlet of the condensation pipeline is used to receive the drying medium containing the organic solvent, and the outlet of the condensation pipeline is used to discharge the separated drying medium for recovery; wherein,

[0007] The condensation pipeline is used to condense the organic solvent in the drying medium containing the organic solvent, so that the organic solvent is condensed into a liquid and flows into the first cavity from the drain port.

[0008] In some embodiments, the condensation line is spiral.

[0009] In some embodiments, the inlet of the condensation line and the outlet of the condensation line are located at different heights in the vertical direction.

[0010] In some embodiments, the condensation pipeline is arranged in the first cavity, or is arranged outside the first cavity.

[0011] In some embodiments, a first liquid outlet is provided at the bottom of the first cavity, and the first liquid outlet is used to discharge the organic solvent in the first cavity.

[0012] In some embodiments, a first air outlet is provided on a side wall of the first cavity for discharging the drying medium in the first cavity for recovery.

[0013] In some embodiments, the drying medium recovery system further includes a first cooling device connected to the condensing pipeline for maintaining the temperature of the condensing pipeline within a preset temperature range.

[0014] In some embodiments, the first cooling device is spirally wound on the condensation pipeline.

[0015] In some embodiments, the drying medium recovery system further includes a purification device, which includes a second cavity provided with a second air outlet, an air inlet pipe and a drying medium filter membrane, wherein the drying medium filter membrane is arranged in the second cavity and divides the second cavity into an upper space and a lower space; the lower space of the second cavity is used to accommodate a purification solvent; the air inlet end of the air inlet pipe is connected to the outlet of the condensation pipe, and the air outlet end of the air inlet pipe is inserted into the second cavity; the second air outlet is arranged in the upper space and is used to discharge the purified drying medium for recovery.

[0016] In some embodiments, the drying medium recovery system further includes a first pipeline, a second pipeline, a detection device, a switch device, and a controller, wherein the pipeline for the drying device to discharge the drying medium containing the organic solvent is connected to the first pipeline and the second pipeline respectively through the switch device; the first pipeline is connected to the separation device; the second pipeline is connected to the purification device; wherein,

[0017] The detection device is used to detect the concentration of the organic solvent in the drying medium containing the organic solvent discharged by the drying device; the controller is used to control the switching device to switch the first pipeline and the second pipeline according to the organic solvent concentration detected by the detection device;

[0018] When the organic solvent concentration detected by the detection device is greater than a preset concentration, the controller controls the switch device to connect the first pipeline; when the organic solvent concentration detected by the detection device is less than the preset concentration, the controller controls the switch device to connect the second pipeline.

[0019] In some embodiments, the drying medium recovery system further includes a dehumidification device, and the dehumidification device is connected to the outlet of the condensation pipeline or the second air outlet.

[0020] In some embodiments, the drying medium recovery system further includes a filtering device connected to the dehumidification device.

[0021] In a second aspect, an embodiment of the present application further provides a semiconductor drying device comprising: a drying medium recovery system, a storage device, a supercritical drying medium preparation device, and a drying device as described in the first aspect, wherein the drying medium recovery system, the storage device, the supercritical drying medium preparation device, and the drying device are sequentially connected to form a circulation loop, wherein:

[0022] The storage device is used to store the drying medium recovered in the drying medium recovery system;

[0023] The supercritical drying medium preparation device is used to prepare the drying medium discharged from the storage device into a supercritical drying medium;

[0024] The drying device is configured to dissolve the organic solvent on the surface of the wafer through the supercritical drying medium to dry the wafer, and discharge the drying medium containing the organic solvent to the drying medium recovery system to recover the drying medium.

[0025] In some embodiments, the supercritical drying medium preparation device includes:

[0026] a second cooling device for cooling the drying medium discharged from the storage device into a liquid state;

[0027] A pressurizing device, used to pressurize the liquid drying medium to a pressure exceeding the critical pressure of the drying medium;

[0028] The heating device is used to heat the drying medium exceeding the critical pressure to a temperature exceeding the critical temperature of the drying medium to obtain a supercritical drying medium.

[0029] Compared with the related art, the drying medium recovery system and semiconductor drying equipment provided in the embodiments of the present application, the semiconductor drying equipment includes a drying device, the drying device is used to dissolve the organic solvent on the wafer through a supercritical drying medium; the drying medium recovery system is used to recover the drying medium in the drying medium containing the organic solvent discharged from the drying device. By providing a separation device in the drying medium recovery system, the separation device includes a condensation pipeline and a first cavity, the lower side wall of the condensation pipeline is provided with a drain port, the drain port is connected to the first cavity, the inlet of the condensation pipeline is used to receive the drying medium containing the organic solvent, and the outlet of the condensation pipeline is used to discharge the drying medium after separation for recovery; wherein, the condensation pipeline is used to condense the organic solvent in the drying medium containing the organic solvent, so that the organic solvent is condensed into a liquid and flows from the drain port into the first cavity, which solves the problem of how to recover carbon dioxide in the process of drying wafers in the related art, and realizes the recovery of carbon dioxide in the process of drying wafers.

[0030] The details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent.

[0031] Summary of the Figures

[0032] The features and properties of the present invention are further described by the following examples and accompanying drawings.

[0033] FIG1 is a schematic structural diagram of a first embodiment of a drying medium recovery system provided by the present application;

[0034] FIG2 is a schematic structural diagram of a second embodiment of a drying medium recovery system provided by the present application;

[0035] FIG3 is a schematic structural diagram of a third embodiment of a drying medium recovery system provided by the present application;

[0036] FIG4 is a schematic structural diagram of a fourth embodiment of a drying medium recovery system provided by the present application;

[0037] FIG5 is a schematic structural diagram of a fifth embodiment of a drying medium recovery system provided by the present application;

[0038] FIG6 is a schematic structural diagram of a sixth embodiment of a drying medium recovery system provided by the present application;

[0039] FIG7 is a schematic structural diagram of a seventh embodiment of a drying medium recovery system provided by the present application;

[0040] FIG8 is a schematic structural diagram of an eighth embodiment of a drying medium recovery system provided by the present application;

[0041] FIG9 is a schematic structural diagram of a semiconductor drying device according to an embodiment of the present application;

[0042] FIG10 is a structural block diagram of a semiconductor drying device according to an embodiment of the present application.

[0043] Reference numerals: 10, separation device; 11, first cavity; 111, first liquid outlet; 112, first air outlet; 12, condensation pipeline; 121, drain outlet; 122, inlet of condensation pipeline; 123, outlet of condensation pipeline; 124, first cooling device; 30, purification device; 31, second cavity; 311, second air outlet; 312, second liquid outlet; 313, third air outlet; 314, upper space; 315, lower space; 32, air inlet pipeline; 33, drying Medium filter membrane; 20, controller; 40, first pipeline; 50, second pipeline; 60, switch device; 70, detection device; 80, dehumidification device; 90, filtering device; 100, drying medium recovery system; 200, supercritical drying medium preparation device; 201, second cooling device; 202, boosting device; 203, heating device; 300, drying device; 400, third pipeline; 500, fourth pipeline; 600, fifth pipeline; 700, storage device; 800, sixth pipeline.

[0044] Preferred embodiments of the present invention

[0045] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for ordinary technicians in the field related to the contents disclosed in the present application, some changes such as design, manufacturing or production based on the technical contents disclosed in the present application are only conventional technical means and should not be understood as the contents disclosed in the present application being insufficient.

[0046] Unless otherwise defined, the technical or scientific terms used in this application should have the ordinary meaning understood by a person of ordinary skill in the technical field to which this application belongs. The words "one", "a", "the" and the like used in this application do not indicate a limit on quantity and may indicate the singular or plural. The terms "include", "comprise", "have" and any variations thereof used in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units that are inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The word "multiple" used in this application means greater than or equal to two. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The terms "first", "second", "third" and the like involved in this application are merely used to distinguish similar objects and do not represent a specific ordering of the objects.

[0047] First embodiment:

[0048] Referring to FIG. 1 , this embodiment provides a drying medium recovery system 100 for use in semiconductor drying equipment.

[0049] For ease of understanding, a semiconductor drying apparatus including a drying medium recovery system 100 is briefly described with reference to FIG9 . As shown in FIG9 , the semiconductor drying apparatus includes a drying medium recovery system 100, a storage device 700, a supercritical drying medium preparation device 200, and a drying device 300, which are sequentially connected and form a circulation loop. The drying medium recovery system 100 stores the recovered drying medium in the storage device 700 via a sixth pipeline 800 ; the storage device 700 passes the stored drying medium into the supercritical drying medium preparation device 200 via a fourth pipeline 500 to prepare supercritical drying medium; the supercritical drying medium preparation device 200 passes the supercritical drying medium into the drying device 300 via a fifth pipeline 600 to dissolve the organic solvent remaining on the wafers for drying the wafers; and the drying device 200 discharges the drying medium containing the organic solvent into the drying medium recovery system 100 via a third pipeline 400, thereby achieving the recycling of the drying medium.

[0050] In this embodiment, the drying medium containing the organic solvent discharged from the drying device 300 is basically in a gaseous state, because a pressure reducing valve is generally provided on the third pipeline 400, and the pressure is reduced by the pressure reducing valve so that most of the drying medium becomes a gaseous state.

[0051] Next, the drying medium recovery system 100 provided in this embodiment will be described in detail with reference to FIG. 1 and FIG. 10 .

[0052] Figure 1 is a schematic diagram of a drying medium recovery system 100 according to an embodiment of the present application. As shown in Figure 1 , the drying medium recovery system 100 includes a separation device 10. Separation device 10 includes a condensation line 12 and a first chamber 11. Condensation line 12 is used to receive drying medium containing an organic solvent and cool and liquefy the organic solvent. A drain port 121 is provided on the lower sidewall of condensation line 12, communicating with first chamber 11 to discharge the liquefied organic solvent into first chamber 11.

[0053] Specifically, the inlet 122 of the condensing line is used to receive a drying medium containing an organic solvent. Referring to Figures 1 and 9 , the inlet 122 of the condensing line can be connected to the drying device 300 via a third line 400, thereby receiving the drying medium containing an organic solvent discharged from the drying device 300. The outlet 123 of the condensing line is used to discharge the separated drying medium for recycling. Referring to Figures 1 and 9 , the outlet 123 of the condensing line can be connected to the storage device 700 via a sixth line 800, thereby recycling and storing the separated drying medium, thereby achieving reuse of the drying medium.

[0054] The third pipeline 400 discharges a mixture of an organic solvent and a drying medium, such as a mixture of isopropyl alcohol and carbon dioxide, into the drying medium recovery system 100. Therefore, in this embodiment, by cooling the drying medium containing the organic solvent through the condensation pipeline 12 in the separation device 10, the organic solvent can be liquefied and separated from the drying medium, and flowed into the first cavity 11 from the drain port 121, and the drying medium can be discharged through the outlet 123 of the condensation pipeline for recovery and / or storage, thereby achieving the separation of the organic solvent and the drying medium. This solves the problem of how to recover the drying medium (e.g., carbon dioxide) during the wafer drying process in the related art, achieves the recovery of carbon dioxide during the wafer drying process, and reduces carbon dioxide pollution to the environment and the waste of carbon dioxide resources.

[0055] 1 , in this embodiment, the condensation pipeline 12 is disposed inside the first cavity 11 , which can reduce the volume of the separation device 10 .

[0056] 1 , in this example, the inlet 122 of the condensation line is arranged at the bottom, and the outlet 123 of the condensation line is arranged at the top.

[0057] In other examples, the inlet 122 of the condensation line is arranged at the top, and the outlet 123 of the condensation line is arranged at the bottom.

[0058] In the above embodiment, by arranging the inlet 122 and the outlet 123 of the condensation line at different heights, the flowability of the carbon dioxide containing isopropyl alcohol in the condensation line 12 can be improved, thereby improving the condensation efficiency of the isopropyl alcohol.

[0059] Continuing with FIG1 , a first liquid outlet 111 is provided at the bottom of the first cavity 11 for discharging the organic solvent from the first cavity 11. In this embodiment, the provision of the first liquid outlet 111 on the first cavity 11 prevents excessive accumulation of isopropyl alcohol within the first cavity 11 from clogging the liquid outlet 121 and adversely affecting the separation of the isopropyl alcohol and carbon dioxide.

[0060] 1 , the condensation line 12 may be spiral. In this embodiment, by configuring the condensation line 12 in a spiral shape, the condensation line 12 can increase the contact area with the isopropyl alcohol while maintaining a small volume, thereby improving the condensation efficiency of the isopropyl alcohol.

[0061] In some embodiments, the drying medium recovery system 100 further includes a liquid recovery device (not shown), which is connected to the first liquid outlet 111 to collect the isopropyl alcohol discharged from the condensation line 12 into the first cavity 11 .

[0062] It should be noted that the organic solvent in this embodiment can be isopropanol, acetone, xylene, etc., and the drying medium can also be but not limited to carbon dioxide, ethylene, ethane, propane, chloroform, which is not specifically limited in the embodiments of this application.

[0063] For ease of explanation, in the following embodiments of the present application, the organic solvent is isopropyl alcohol and the drying medium is carbon dioxide for exemplary explanation. That is, in the specific examples below, the drying medium containing the organic solvent received by the drying medium recovery system 100 is carbon dioxide containing isopropyl alcohol.

[0064] Second embodiment:

[0065] As shown in FIG2 , compared with the first embodiment, the difference in this embodiment is that the condensation pipeline 12 is arranged outside the first cavity 11 . This arrangement can reduce the volume of the first cavity 11 .

[0066] For the convenience of explanation, in the following embodiments of the present application, the condensation pipeline 12 in the second embodiment is arranged on the inner side of the first cavity 11 as an example for exemplary explanation.

[0067] Third embodiment:

[0068] As shown in FIG3 , based on the first embodiment, in this embodiment, the drying medium recovery system 100 may further include a first cooling device 124 . The first cooling device 124 is sleeved on the outside of the condensing pipe 12 to cool the temperature of the condensing pipe 12 to a preset temperature range.

[0069] In this embodiment, the first cooling device 124 is mounted on the outside of the condensing line 12. By heat transfer, the temperature of the condensing line 12 is cooled to a preset temperature range, thereby enhancing the condensing capacity of the condensing line 12 and improving the liquefaction efficiency of isopropyl alcohol, thereby improving the separation effect of carbon dioxide and isopropyl alcohol.

[0070] In a specific example, the first cooling device 124 may be spirally wound around the condensation line 12 .

[0071] Fourth embodiment:

[0072] As shown in FIG4 , based on the first embodiment, in this embodiment, a first air outlet 112 is further provided on the sidewall of the first cavity 11 for discharging the drying medium within the first cavity 11 for recovery. As shown in FIG4 , the drying medium discharged from the first air outlet 112 and the outlet 123 of the condensation line can be collected through a pipeline into the sixth pipeline 800 for discharge and recovery of the drying medium.

[0073] In this embodiment, by providing the first gas outlet 112 on the side wall of the first cavity 11, it is possible to avoid the problem that when isopropyl alcohol and carbon dioxide are separated in the condensation line 12, part of the carbon dioxide is discharged from the drain port 121 into the first cavity 11, resulting in excessive storage of carbon dioxide in the first cavity 11 and an increase in the internal air pressure, causing the isopropyl alcohol liquefied through the condensation line 12 to be unable to flow from the drain port 121 to the first cavity 12, thereby improving the separation effect of isopropyl alcohol and carbon dioxide.

[0074] Fifth embodiment:

[0075] In order to avoid the problem of isopropanol being carried over during the carbon dioxide separation process, the above problem can also be solved in the following manner in the embodiments of the present application.

[0076] As shown in FIG5 , based on the fourth embodiment, in this embodiment, the drying medium recovery system 100 may further include a purification device 30. Specifically, the purification device 30 includes a second cavity 31 provided with a second air outlet 311, an air inlet pipe 32, and a drying medium filter membrane 33. The drying medium filter membrane 33 is disposed in the second cavity 31 and divides the second cavity 31 into an upper space 314 and a lower space 315. The lower space 315 of the second cavity 31 is used to accommodate the purification solvent; the air inlet end of the air inlet pipe 32 is connected to the outlet 123 of the condensation pipe, and the air outlet end of the air inlet pipe 32 is inserted into the second cavity 31 and, when in use, is inserted into the purification solvent; the second air outlet 311 is disposed in the upper space 314 and is used to discharge the purified drying medium for recovery.

[0077] As is well known, the organic solvent to be separated is soluble in the purification solvent, and the drying medium to be recovered is insoluble in the purification solvent. In the present embodiment, the purification solvent is water, and the isopropyl alcohol as the organic solvent is soluble in water, and the carbon dioxide as the drying medium is insoluble in water. Therefore, in the present embodiment, by utilizing the purification solvent in the purification device 30 to further dissolve the isopropyl alcohol carried in the carbon dioxide, and filtering out the mode of other gases except carbon dioxide by the drying medium filter membrane 33, it is possible to further purify carbon dioxide, avoid the problem of carrying other gases or isopropyl alcohol in the carbon dioxide, and effectively improve the purity of carbon dioxide.

[0078] It should be noted that the drying medium filter membrane 33 in this embodiment is mainly used to filter out gases other than carbon dioxide; the purification solvent in this embodiment can be water, or other solvents that can dissolve isopropyl alcohol, such as ethanol, ether, benzene, etc.

[0079] 5 , in some embodiments, the second cavity 31 further includes a third gas outlet 313 and a second liquid outlet 312 . The third gas outlet 313 is used to discharge the gas between the drying medium filter membrane 33 and the purification solvent, that is, the gas in the lower space 315 , and the second liquid outlet 312 is used to discharge the liquid in the second cavity 31 .

[0080] Sixth embodiment:

[0081] As shown in FIG6 , based on the fifth embodiment, the drying medium recovery system 100 in this embodiment further includes a first pipeline 40 , a second pipeline 50 , a switch device 60 , a detection device 70 and a controller 20 . The pipeline for the drying medium containing organic solvent discharged from the drying device 300 (i.e., the third pipeline 400) is connected to the first pipeline 40 and the second pipeline 50 through the switch device 60; the first pipeline 40 is connected to the separation device 10; the second pipeline 50 is connected to the purification device 30; the detection device 70 is used to detect the organic solvent concentration in the drying medium discharged from the drying device 300. For example, the detection device 70 can be set in the third pipeline 400 or on the drying device 300; the controller 20 is used to control the switch device 60 to switch the first pipeline 40 and the second pipeline 50 according to the organic solvent concentration detected by the detection device 70. When the organic solvent concentration detected by the detection device 70 is greater than the preset concentration, the controller 20 controls the switch device 60 to connect the first pipeline 40 so that the drying medium containing organic solvent is recovered in sequence through the separation device 10 and the purification device 30; when the organic solvent concentration detected by the detection device 70 is less than the preset concentration, the controller 20 controls the switch device 60 to connect the first pipeline 50 so that the drying medium containing organic solvent is directly recovered through the purification device 30.

[0082] In this embodiment, by providing a first pipeline 40 to receive a drying medium containing an organic solvent greater than a preset concentration and sequentially transporting it to the separation device 10 and the purification device 30 for carbon dioxide recovery, and providing a second pipeline 40 to receive a drying medium containing an organic solvent less than a preset concentration and transporting it to the purification device 30 for carbon dioxide recovery, the treatment of carbon dioxide containing isopropyl alcohol of different concentrations is achieved, saving carbon dioxide recovery time and improving carbon dioxide recovery efficiency.

[0083] It should be noted that FIG6 is merely an example and is not intended to limit the configuration of the switch device 60 between the third pipeline 400, which carries the drying medium containing the organic solvent discharged from the drying device 300, and the first pipeline 40 and the second pipeline 50. For example, in some embodiments, two switch devices 60 are provided, with the third pipeline 400 connected to the first pipeline 40 via one switch device 60 and the third pipeline 400 connected to the second pipeline 50 via the other switch device 60, to achieve precise control over the opening and closing of each pipeline.

[0084] For example, the switch device 60 may be a valve, and the detection device 70 may be a sensor for detecting the concentration of a solution.

[0085] Seventh embodiment:

[0086] As shown in FIG. 7 , based on the sixth embodiment, in this embodiment, the supercritical drying medium recovery system 100 further includes a dehumidification device 80 , which is connected between the storage device 700 and the third gas outlet 313 .

[0087] In this embodiment, the carbon dioxide purified by the purification device 30 is dried by the dehumidification device 80, thereby avoiding the influence of moisture on the purity of the carbon dioxide and improving the purity of the purified carbon dioxide.

[0088] Eighth embodiment:

[0089] In related technologies, particles may be generated during the separation or purification process in the semiconductor manufacturing process. For example, particles generated due to equipment aging and other reasons may contaminate the drying medium to be recycled, ultimately affecting the purity of the recovered drying medium, such as carbon dioxide.

[0090] To solve the above problem, as shown in FIG8 , based on the seventh embodiment, in this embodiment, the supercritical drying medium recovery system 100 further includes a filtering device 90 , which is connected between the storage device 700 and the dehumidification device 80 .

[0091] In this embodiment, a filtering device 90 is provided to filter particulate contaminants mixed in the drying medium to be recovered, thereby reducing the impact of the particles on the purity of the recovered drying medium, such as carbon dioxide.

[0092] It should be noted that the filter device 90 can be a filter device 90 for filtering particles larger than 3 nm, or a filter device 90 for filtering smaller particles according to a specific process.

[0093] Furthermore, in any embodiment of the drying medium recovery system 100 , the air outlet, liquid outlet, air inlet, and liquid discharge port may be provided with a switch valve.

[0094] It should be noted that, in the drying medium recovery system 100 described in Embodiments 1 to 4, the dehumidification device 80 and the filtering device 90 may also be disposed at the outlet 123 of the condensation pipeline.

[0095] It should be noted that, for the above-mentioned first to eighth embodiments, those skilled in the art should understand that the various technical features of the above-mentioned embodiments can be combined in any manner. To make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should all be considered to be within the scope of this specification. For example, the purification device 40 in the above-mentioned fifth embodiment can also be combined with embodiments two to four. For another example, in addition to being configured with a cooling device 124 in the fourth embodiment, other embodiments can also be configured with the cooling device 124 in the fourth embodiment.

[0096] Ninth embodiment:

[0097] The present application also provides a semiconductor drying device. FIG9 is a schematic structural diagram of a semiconductor drying device according to an embodiment of the present application. As shown in FIG9 , the semiconductor drying device includes a drying medium recovery system 100, a storage device 700, a supercritical drying medium preparation device 200, and a drying device 300, which are sequentially connected to form a circulation loop. The drying medium recovery system 100 can be the drying medium recovery system 100 of any of the above-mentioned embodiments 1 to 8.

[0098] Continuing to refer to Figure 9, the drying medium recovery system 100 stores the recovered drying medium in the storage device 700 through the sixth pipeline 800; the storage device 700 passes the stored drying medium into the supercritical drying medium preparation device 200 through the fourth pipeline 500 to be prepared into supercritical drying medium; the supercritical drying medium preparation device 200 passes the supercritical drying medium into the drying device 300 through the fifth pipeline 600; the drying device 200 dries the wafer with the supercritical drying medium to dissolve the organic solvent remaining on the wafer to dry the wafer, and discharges the drying medium containing the organic solvent into the drying medium recovery system 100 through the third pipeline 400; the drying medium recovery 100 separates and recovers the drying medium containing the organic solvent, thereby realizing the recycling of the drying medium.

[0099] In this embodiment, the supercritical drying medium prepared by the supercritical drying medium preparation device 200 is used to prepare the drying medium from the storage device 700 into a supercritical drying medium, which is then transported to the drying device 300 so that the supercritical drying medium and the organic solvent on the wafer surface are fully miscible, thereby drying the wafer. The zero surface tension of the supercritical drying medium can effectively improve the adhesion and collapse problems of high aspect ratio structures. In this embodiment, the drying medium containing the organic solvent is discharged from the drying device 300 and sent to the drying medium recovery system 100 to achieve the recovery of the drying medium, thereby reducing the pollution of the drying medium to the environment and improving the resource recovery and utilization of the drying medium.

[0100] Tenth embodiment:

[0101] Figure 10 is a structural block diagram of semiconductor drying according to an embodiment of the present application. As shown in Figure 10, on the basis of the ninth embodiment, in this embodiment, the supercritical drying medium preparation device 200 includes: a second cooling device 201, used to cool the drying medium discharged from the storage device 700 into a liquid state; a boosting device 202, used to boost the pressure of the liquid drying medium to a pressure exceeding the critical pressure of the drying medium; a heating device 203, used to heat the drying medium exceeding the critical pressure to a temperature exceeding the critical temperature of the drying medium to obtain a supercritical drying medium, and pass the supercritical drying medium into the drying device 300 through the fifth pipeline 600.

[0102] In this embodiment, the above-mentioned device is used to prepare a supercritical drying medium, thereby ensuring the recycling of the supercritical drying medium.

[0103] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A drying medium recovery system, applied to semiconductor drying equipment, the semiconductor drying equipment comprising a drying device, the drying device being used to dissolve an organic solvent on a wafer by means of a supercritical drying medium; the drying medium recovery system being used to recover the drying medium in the drying medium containing the organic solvent discharged from the drying device, characterized in that: The drying medium recovery system comprises a separation device, the separation device comprises a condensation pipeline and a first cavity, the lower side wall of the condensation pipeline is provided with a drain port, the drain port is communicated with the first cavity, the inlet of the condensation pipeline is used to receive the drying medium containing the organic solvent, and the outlet of the condensation pipeline is used to discharge the separated drying medium for recovery; wherein, The condensation pipeline is used to condense the organic solvent in the drying medium containing the organic solvent, so that the organic solvent is condensed into a liquid and flows into the first cavity from the drain port.

2. The drying medium recovery system according to claim 1, characterized in that: The condensation pipeline is spiral.

3. The drying medium recovery system according to claim 1, characterized in that: The inlet of the condensation pipeline and the outlet of the condensation pipeline are located at different heights in the vertical direction.

4. The drying medium recovery system according to claim 1, characterized in that: The condensation pipeline is arranged in the first cavity, or arranged outside the first cavity.

5. The drying medium recovery system according to claim 1, characterized in that: A first liquid outlet is disposed at the bottom of the first cavity, and the first liquid outlet is used to discharge the organic solvent in the first cavity.

6. The drying medium recovery system according to claim 1, characterized in that: The side wall of the first cavity is provided with a first air outlet for discharging the drying medium in the first cavity for recovery.

7. The drying medium recovery system according to claim 1, characterized in that: The separation device further comprises a first cooling device, which is connected to the condensation pipeline and is used to maintain the temperature of the condensation pipeline within a preset temperature range.

8. The drying medium recovery system according to claim 7, characterized in that: The first cooling device is spirally wound on the condensation pipeline.

9. The drying medium recovery system according to claim 1, characterized in that: The drying medium recovery system also includes a purification device, which includes a second cavity provided with a second air outlet, an air inlet pipeline and a drying medium filter membrane, wherein the drying medium filter membrane is arranged in the second cavity and divides the second cavity into an upper space and a lower space; the lower space of the second cavity is used to accommodate a purification solvent; the air inlet end of the air inlet pipeline is connected to the outlet of the condensation pipeline, and the air outlet end of the air inlet pipeline is inserted into the second cavity; the second air outlet is arranged in the upper space and is used to discharge the purified drying medium for recovery.

10. The drying medium recovery system according to claim 9, characterized in that: The drying medium recovery system further includes a first pipeline, a second pipeline, a detection device, a switch device and a controller, wherein the pipeline through which the drying device discharges the drying medium containing the organic solvent is connected to the first pipeline and the second pipeline respectively through the switch device; the first pipeline is connected to the separation device; the second pipeline is connected to the purification device; wherein, The detection device is used to detect the concentration of the organic solvent in the drying medium containing the organic solvent discharged by the drying device; the controller is used to control the switch device to switch the first pipeline and the second pipeline according to the concentration of the organic solvent detected by the detection device; When the organic solvent concentration detected by the detection device is greater than the preset concentration, the controller controls the switch device to connect the first pipeline; when the organic solvent concentration detected by the detection device is less than the preset concentration, the controller controls the switch device to connect the second pipeline.

11. The drying medium recovery system according to claim 1 or 9, characterized in that: The drying medium recovery system further comprises a dehumidification device, and the dehumidification device is connected to the outlet of the condensation pipeline or the second air outlet.

12. The drying medium recovery system according to claim 11, characterized in that: The drying medium recovery system further comprises a filtering device, and the filtering device is connected to the dehumidification device.

13. A semiconductor drying device, characterized in that: The semiconductor drying equipment comprises: a drying medium recovery system, a storage device, a supercritical drying medium preparation device and a drying device as claimed in any one of claims 1 to 12, wherein the drying medium recovery system, the storage device, the supercritical drying medium preparation device and the drying device are sequentially connected to form a circulation loop, wherein: The storage device is used to store the dry medium recovered in the dry medium recovery system; The supercritical drying medium preparation device is used to prepare the drying medium discharged from the storage device into a supercritical drying medium; The drying device is configured to dissolve the organic solvent on the surface of the wafer through the supercritical drying medium to dry the wafer, and discharge the drying medium containing the organic solvent to the drying medium recovery system. The drying medium is recovered.

14. The semiconductor drying equipment according to claim 13, characterized in that: The supercritical drying medium preparation device comprises: a second cooling device, used to cool the dry medium discharged from the storage device into a liquid state; A pressurizing device, used to pressurize the liquid drying medium to a pressure exceeding the critical pressure of the drying medium; The heating device is used to heat the drying medium exceeding the critical pressure to a temperature exceeding the critical temperature of the drying medium to obtain a supercritical drying medium.

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