Solution supply device and semiconductor apparatus
By using the main discharge pipeline of the solution supply device in the semiconductor equipment to discharge unstable flow solutions and installing a voltage regulator in the pipeline, the problems of solution concentration fluctuations and concentration drifts in the prior art are solved, and the accuracy of the mixed solution is improved and Stability of product film etching amount.
Patent Information
- Application Number
- PCT/CN2024/091726
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-06-13
- Filing Date
- 2024-05-08
- Publication Date
- 2024-12-19
AI Technical Summary
In semiconductor wet cleaning and etching equipment, the existing solution mixing device fluctuates greatly during the mixing process due to the limitations of pipeline design and valve component response regulation. As the number of online real-time liquid replenishment increases, the concentration drift accumulates. , resulting in unstable etching of the product film and even leading to product scrapping.
A solution supply device is designed. By using the main discharge pipeline to discharge unstable flow after the mixing process is completed, the liquid dispensing flow is stabilized before being transported to the processing device, and a voltage regulator is set in the pipeline to stabilize the hydraulic pressure, ensuring that Volume proportional accuracy of each component of the mixed solution.
It effectively improves the accuracy of the volume ratio of each component in the mixed solution, ensures the stability of the product film etching amount, and avoids product scrapping caused by concentration drift.
Smart Images

Figure CN2024091726_19122024_PF_FP_ABST
Abstract
Description
Solution supply device and semiconductor equipment Technical Field
[0001] The present invention relates to the field of semiconductor equipment, and further relates to a solution supply device and semiconductor equipment. Background Art
[0002] In semiconductor wet cleaning and etching equipment, different solutions must be mixed in appropriate proportions. To ensure that the amount of thin film etched remains within a certain range, high concentration stability is required for the mixed solutions. Common mixed solutions include, for example, DHF solution (a mixture of water and 49% hydrofluoric acid), SC1 solution (a mixture of ammonia, hydrogen peroxide, and water in a 1:2:50 volume ratio), and HF / HNO3 solution (a mixture of hydrofluoric acid and nitric acid). Existing equipment controls the volume ratio of each component chemical solution by adjusting the injection flow rate of the chemical solution in different input pipelines to achieve the target concentration solution.
[0003] However, due to limitations such as pipeline design and the time required for valve response control, the concentration of the solution fluctuates greatly during the mixing process. Moreover, as the number of online real-time refills increases, the concentration drift will have a cumulative effect, which will cause the solution to etch the product film in an unstable manner and even lead to product scrapping.
[0004] For example, in the invention patent with application number 200510075183.4, a chemical mixing and supplying device and method are disclosed. As shown in Figure 1, the chemical mixing and supplying device includes: a first chemical source part 112, a second chemical source part 122, a first delivery pipeline 114, a second delivery pipeline 124, a main delivery pipeline 140, a mixer 142 located in the main delivery pipeline 140, first and fourth flow meters 116 and 126, a discharge pipeline 150, and a control component 130 for comparing the chemical mixing ratio calculated based on the flow rate data provided by the first and fourth flow meters 116 and 126 with the preset chemical mixing ratio to control the flow rate of the chemical. The discharge line 150 is connected to the first and second delivery lines 114 and 124, respectively, and can be connected to the chemical source parts 112 and 122, respectively. Because the flow rate of the initially delivered chemicals is very unstable, the initially delivered chemicals are discharged from the discharge line 150 for 3-5 seconds, and then a stable flow rate is maintained, that is, the chemicals are discharged during the flow rate adjustment process.
[0005] Although the aforementioned discharge line 150 can be used to discharge unstable chemicals from the first and second delivery lines 114 and 124 and prevent the unstable flow of chemicals from flowing into the main delivery line 140 and the mixer 142, when the chemical supply to the discharge line 150 is stopped and the chemical supply to the main delivery line 140 is started, the chemicals supplied from the first delivery line 114 and the second delivery line 124 will mix in the main delivery line 140. Due to changes in pipe resistance and pressure within the pipelines before and after the on-off valves, the chemical flow rates in the first and second delivery lines 114 and 124 fluctuate dramatically, resulting in an unstable flow rate of the chemical mixed from the first and second delivery lines 114 and 124 and inputted into the main delivery line 140. This, in turn, causes a deviation in the chemical mixing ratio inputted from the main delivery line 140 into the mixer 142 and a deviation in the concentration of the chemical solution supplied from the mixer 142 to the treatment device 10.
[0006] Therefore, this patent aims to improve the volume ratio accuracy of each chemical component in the mixed liquid.
[0007] Summary of the Invention
[0008] In response to the above technical problems, the present invention aims to improve the volume ratio accuracy of each chemical component in the mixed liquid. In order to achieve the above purpose, the present invention provides a solution supply device and a semiconductor device.
[0009] In some embodiments, the present invention provides a solution supply device for providing a mixed solution to a processing device, comprising:
[0010] A first solution input end is used to receive the injected first solution; a second solution input end is used to receive the injected second solution; a first delivery pipeline is connected to the first solution input end; a second delivery pipeline is connected to the second solution input end; a mixing tank is connected to the end of the first delivery pipeline away from the first solution input end, and the end of the second delivery pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution; a main delivery pipeline is connected between the mixing tank and the treatment device, for providing the mixed solution to the treatment device; a main discharge line is connected to the main delivery pipeline; a control component is communicated with the main discharge line and the main delivery pipeline, for discharging the mixed solution with an unstable flow through the main discharge line before the main delivery pipeline provides the mixed solution to the treatment device.
[0011] In some embodiments, the present invention provides a semiconductor device including a semiconductor processing apparatus and the solution supply apparatus described above.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] The present invention adds a main discharge line after the liquid mixture is mixed. This discharges the solution with abnormal concentrations caused by unstable flow rates in the early stages of mixing through the main discharge line. The solution is then delivered to the processing device after the flow rate stabilizes, thereby improving the volume ratio accuracy of the components in the mixed solution. The present invention also incorporates a pressure stabilizer in the pipeline to stabilize the delivered hydraulic pressure, thereby delivering the liquid at a stable flow rate to the processing device, improving the volume ratio accuracy of the components in the mixed solution.
[0014] Summary of the Figures
[0015] The features and properties of the present invention are further described by the following examples and accompanying drawings.
[0016] FIG1 is a structural diagram of a chemical mixing and supplying device according to the background technology of the present invention;
[0017] FIG2 is a schematic diagram of an embodiment of a solution supply device of the present invention;
[0018] FIG3 is a schematic diagram of another embodiment of the solution supply device of the present invention;
[0019] FIG4 is a schematic diagram of another embodiment of the solution supply device of the present invention;
[0020] FIG5 is a schematic diagram of another embodiment of the solution supply device of the present invention.
[0021] Preferred embodiments of the present invention
[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings and other embodiments can be obtained based on these drawings without inventive work.
[0023] To simplify the drawings, only portions relevant to the invention are schematically depicted in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one component with the same structure or function is schematically depicted or labeled. In this document, "one" not only means "only one" but also "more than one."
[0024] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.
[0025] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0026] [Example 1]
[0027] As shown in Figure 2, this embodiment discloses a solution supply device 200, which includes a first solution input end 211, a second solution input end 221, a first delivery pipeline 210, a second delivery pipeline 220, a main delivery pipeline 230, a main discharge pipeline 240, a mixing tank 250 and a control component 270.
[0028] The first solution input end 211 is used to receive an injected first solution, and the second solution input end 221 is used to receive an injected second solution, wherein the first solution is different from the second solution. A first delivery line 210 is connected to the first solution input end 211, and a second delivery line 220 is connected to the second solution input end 221. A mixing tank 250 is connected to the end of the first delivery line 210 away from the first solution input end 211 and the end of the second delivery line 220 away from the second solution input end 221. Specifically, the mixing tank 250 is located at the confluence of the first delivery line 210 and the second delivery line 220, or the first delivery line 210 and the second delivery line 220 are respectively connected to the mixing tank 250, and is used to mix the solutions respectively delivered by the first delivery line 210 and the second delivery line 220. A main delivery line 230 is connected between the mixing tank 250 and the treatment device 300 to provide the mixed solution to the treatment device 300.
[0029] Furthermore, main discharge line 240 is connected to main delivery line 230, acting as a branch of main delivery line 230. Control unit 270 maintains communication with both main delivery line 230 and main discharge line 240, respectively, and is configured to discharge the solution with an unstable flow rate through main discharge line 240 in the DR direction shown in FIG. 2 , before main delivery line 230 supplies the mixed solution to treatment device 300. This embodiment ensures stable delivery of the mixed solution within mixing tank 250 to treatment device 300, thereby improving the accuracy of the volume ratio of the components in the mixed solution and ensuring that the mixed solution supplied to treatment device 300 has a precise concentration each time.
[0030] This application does not limit how the solution is discharged. In some embodiments, a second regulating valve 241 is provided on the main discharge line 240, and a first regulating valve 231 is provided on the main delivery line 230 between the main discharge line 240 and the treatment device 300. The first regulating valve 231 is located between the main discharge line 240 and the treatment device 300, and the first regulating valve 231 and the second regulating valve 241 are each in communication with a control component 270. Before the main delivery line 230 supplies the mixed solution to the treatment device 300, the control component 270 closes the first regulating valve 231 and opens the second regulating valve 241 to discharge the solution with an unstable flow rate through the main discharge line 240. When the main delivery line 230 supplies the mixed solution to the treatment device 300, the control component 270 first opens the first regulating valve 231. At this time, the solution in the main delivery line 230 is divided into two parts: one part continues to be discharged through the main discharge line 240, and the other part is supplied to the treatment device 300. After the first regulating valve 231 and the second regulating valve 241 are in the open state at the same time for a preset time, the flow rate of the solution in the main delivery pipeline 230 will tend to stabilize. At this time, the second regulating valve 241 is closed. At this time, all the solution in the main delivery pipeline 230 is supplied to the processing device 300.
[0031] Preferably, a second flowmeter 242 is provided on the main discharge line 240, and a first flowmeter 232 is provided on the main delivery line 230 between the main discharge line 240 and the treatment device 300. Both the first and second flowmeters 232 are communicatively connected to the control unit 270. Before the main delivery line 230 supplies the mixed solution to the treatment device 300, the flow rate value of the solution in the main discharge line 240, as measured by the second flowmeter 242, when the flow rate is stable, is defined as a first detection value. When the main delivery line 230 supplies the mixed solution to the treatment device 300, the flow rate of the solution in the main delivery line 230 changes due to the opening of the first regulating valve 231. At this time, the real-time value of the solution flow rate (i.e., the solution flow rate in the branch 233 of the main delivery line 230) delivered from the main delivery line 230 to the treatment device 300, as measured by the first flowmeter 232, is defined as a second detection value, and the real-time value of the solution flow rate in the main discharge line 240, as measured by the second flowmeter 242, is defined as a third detection value. Control component 270 adjusts the opening rate of first regulating valve 231 and the closing rate of second regulating valve 241 to keep the sum of the second and third detection values equal to the first detection value, thereby maintaining a stable flow rate within main delivery pipeline 230. Ultimately, first regulating valve 231 is fully opened and second regulating valve 241 is fully closed. At this point, the second detection value equals the first detection value, and the third detection value equals zero.
[0032] Preferably, as shown in FIG3 , a feed tank 234 (daily tank) may be further provided on the main delivery line 230. The feed tank 234 is located between the main discharge line 240 and the treatment device 300 and is used to buffer the mixed solution from the mixing tank 250 and supply it to the treatment device 300. In the accompanying drawings of this embodiment, the feed tank 234 is provided after the first regulating valve 231 and the second flow meter 242 and before the treatment device 300 to improve the volume ratio accuracy of the components in the mixed solution entering the feed tank 234, thereby ensuring that the mixed solution supplied from the feed tank 234 to the treatment device 300 has a precise concentration each time.
[0033] In some embodiments, a third regulating valve 212 and a third flowmeter 213 are provided on the first delivery pipeline 210, and the third regulating valve 212 is located between the first solution input end 211 and the third flowmeter 213. A fourth regulating valve 222 and a fourth flowmeter 223 are provided on the second delivery pipeline 220, and the fourth regulating valve 222 is located between the second solution input end 221 and the fourth flowmeter 223. That is, along the flow direction of the solution in the first delivery pipeline 210 or the second delivery pipeline 220, the third flowmeter 213 is downstream of the third regulating valve 212, and the fourth flowmeter 223 is downstream of the fourth regulating valve 222, so as to detect the actual flow in the first delivery pipeline 210 or the second delivery pipeline 220 that may fluctuate due to the action of the third regulating valve 212 or the fourth regulating valve 222. The third and fourth regulating valves 212 and 222, as well as the third and fourth flowmeters 213 and 223, are each communicatively connected to a control unit 270. The control unit 270 receives flow information signals from the third and fourth flowmeters 213 and 223 and controls the openings of the third and fourth regulating valves 212 and 222 to regulate the flow in each pipeline. It should be noted that the first, second, third, and fourth regulating valves 231, 241, 212, and 222 are preferably flow control valves (FCVs), but may also be conventional gate valves.
[0034] When the third regulating valve 212 and the fourth regulating valve 222 are selected as flow control valves, the control component 270 can control the concentration ratio by controlling the flow ratio of the solutions in the first delivery pipeline 210 and the second delivery pipeline 220 respectively through the flow control valves, that is, the control component 270 detects the flow data in the first delivery pipeline 210 and the second delivery pipeline 220 respectively through the third flowmeter 213 and the fourth flowmeter 223, calculates the flow ratio of different chemical solutions injected into the first solution input end 211 and the second solution input end 221, compares the calculated flow ratio with the preset solution volume mixing ratio, and outputs a control signal for controlling the opening rate of the third regulating valve 212 and the fourth regulating valve 222, thereby controlling the concentration of the mixed solution so that the first solution and the second solution are mixed to form a mixed solution with the above-mentioned preset solution volume mixing ratio, thereby achieving the preset concentration ratio.
[0035] In practical applications, take the case where the first solution input end 211 is injected with HF (hydrogen fluoride) solution and the second solution input end 221 is injected with DIW (deionized water) as an example:
[0036] First, only the second, third, and fourth regulating valves 241, 212, and 222 are opened, and the first regulating valve 231 is closed. The control component 270 controls the flow ratio of the HF or DIW solution in the first delivery pipeline 210 and the second delivery pipeline 220 through the third regulating valve 212 and the fourth regulating valve 222, respectively, to adjust the concentration of the mixed solution in the mixing tank 250. The HF / DIW mixed solution, which has large flow fluctuations due to changes in pressure or pipe resistance, is discharged from the main discharge pipeline 240. Secondly, after the second flowmeter 242 detects that the solution flow in the main discharge pipeline 240 is stable, the control component 270 opens the first regulating valve 231 to inject the HF / DIW mixed solution at a stable flow rate into the feed tank 234. During the above process, the control component 270 adjusts the opening rate of the first regulating valve 231 and the closing rate of the second regulating valve 241 according to the control method described above to maintain a stable flow in the main delivery pipeline 230.
[0037] [Example 2]
[0038] As shown in FIG4 , this embodiment discloses a solution supply device 200, which is similar to the first embodiment and includes a first solution input port 211, a second solution input port 221, a first delivery line 210, a second delivery line 220, a main delivery line 230, a main discharge line 240, a mixing tank 250, a feed tank 234, and a control component 270. The connection method of these components and pipelines is the same as that of the first embodiment and will not be repeated here. The difference between this embodiment and the first embodiment is that a buffer tank 214 and a circulation line 215 are added to the first delivery line 210, and a secondary discharge line 224 is added to the second delivery line 220.
[0039] The buffer tank 214 is located between the first solution input port 211 and the third regulating valve 212. A circulation line 215 is connected to the first delivery line 210 between the buffer tank 214 and the first solution input port 211 at one end and to the first delivery line 210 between the buffer tank 214 and the third regulating valve 212 at the other end. The circulation line 215 is equipped with a fifth regulating valve 216 and a fifth flowmeter 217. A secondary discharge line 224 is connected to the first delivery line 210 between the second solution input port 221 and the fourth regulating valve 222 at one end and is equipped with a sixth regulating valve 225 and a sixth flowmeter 226. The fifth regulating valve 216, the sixth regulating valve 225, the fifth flowmeter 217, and the sixth flowmeter 226 are also respectively connected to the control unit 270.
[0040] In practical applications, take the case where the first solution input end 211 is injected with HF (hydrogen fluoride) solution and the second solution input end 221 is injected with DIW (deionized water) as an example:
[0041] First, only the fifth and sixth regulating valves 216 and 225 are opened, while the first, second, third, and fourth regulating valves 231, 241, 212, and 222 are closed. The HF solution will circulate within the buffer tank 214 and circulation line 215 at the set flow rate, and the DIW will begin to flow steadily through the secondary discharge line 224. Secondly, after the flow rates of the HF solution and DIW have reached the set values and stabilized for a period of time, the fifth and sixth regulating valves 216 and 225 are closed, and the second, third, and fourth regulating valves 241, 212, and 222 are simultaneously opened, with the first regulating valve 231 remaining closed. The HF solution stops entering the circulation line 215, and the DIW stops being discharged from the secondary discharge line 224. The HF solution and DIW converge in the mixing tank 250. After passing through the mixing tank 250, the HF / DIW mixed solution flows to the main discharge line 240, from which the HF / DIW mixed solution, which has large flow fluctuations due to changes in pressure or pipe resistance, is discharged. Finally, after the second flow meter 242 detects that the flow rate is stable, the first regulating valve 231 is opened to inject the HF / DIW mixed solution into the feed tank 234 at a stable flow rate.
[0042] [Example 3]
[0043] As shown in FIG5 , this embodiment discloses a solution supply device 200, which, similar to the first embodiment, includes a first solution input port 211, a second solution input port 221, a first delivery pipeline 210, a second delivery pipeline 220, a main delivery pipeline 230, a mixing tank 250, a feed tank 234, and a control component 270. The connection method of these components and pipelines is the same as that of the first embodiment and will not be repeated here. The difference between this embodiment and the first embodiment is that a pressure stabilizer 260 is added to each of the first delivery pipeline 210 and the second delivery pipeline 220.
[0044] Furthermore, because the first and second delivery pipelines 210 and 220 maintain constant pressures within the pipelines through respective pressure regulators 260, the pressure of the solution entering the main delivery pipeline 230 remains unchanged, thereby ensuring a dynamic flow rate stability. Specifically, the pressure regulator 260 can achieve the same technical effect as the main discharge pipeline 240 in the first embodiment. Therefore, in this embodiment, the main delivery pipeline 230 does not need to be connected to the main discharge pipeline 240. The pressure regulator 260 can be a hydraulic balancing valve or can be composed of a controller, a pressure sensor, and a flow control valve. The pressure sensor is connected to the interior of the pipeline and transmits a pressure signal to the controller. The controller controls the opening of the flow control valve based on the received pressure signal to maintain a constant pressure within the pipeline. The controller can be independent of the control component 270 or be part of the control component 270.
[0045] In practical applications, take the case where the first solution input end 211 is injected with HF (hydrogen fluoride) solution and the second solution input end 221 is injected with DIW (deionized water) as an example:
[0046] If the main delivery line 230 is connected to the main discharge line 240, the second, third, and fourth regulating valves 241, 212, and 222 are first opened, and the first regulating valve 231 is closed. The HF solution and DIW are then combined in the mixing tank 250 through the respective pressure regulators 260 of the respective pipelines. The HF / DIW mixed solution is then discharged through the main discharge line 240 for a specified time. When the feed tank 234 needs to be replenished, the second regulating valve 241 is closed, and the first regulating valve 231 is opened to inject the HF / DIW mixed solution into the feed tank 234 at a stable flow rate.
[0047] If the main delivery line 230 is not connected to the main discharge line 240, the first, third, and fourth regulating valves 231, 212, and 222 are directly opened to allow the HF solution and DIW to merge in the mixing tank 250 through the pressure regulators 260 of their respective pipelines. The HF / DIW mixed solution is then injected into the feed tank 234. The pressure regulators 260 on the first and second delivery lines 210 and 220 maintain the dynamic balance of the hydraulic pressure in the main delivery line 230, providing a stable flow rate to the feed tank 234 to ensure the accuracy of the concentration of the HF / DIW mixed solution.
[0048] [Example 4]
[0049] This embodiment discloses a semiconductor device comprising a processing device 300 and the solution supply device 200 of any of the aforementioned embodiments. The processing device 300 includes, but is not limited to, a wafer cleaning tank or a wafer etching tank. The solution supply device 200 can provide a mixed solution to one or more of these wafer cleaning tanks and wafer etching tanks via a main delivery line 230, thereby performing etching and cleaning processes on wafers. By installing the solution supply device 200 in the semiconductor device, this embodiment can improve the stability of the amount of thin film etched during the etching process and enhance the cleanliness of the substrate surface during the cleaning process.
[0050] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of the present invention. For those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the scope of protection of the present invention.
Claims
1. A solution supply device for providing a mixed solution to a processing device, characterized in that: include: A first solution input end, used for receiving an injected first solution; A second solution input end, used for receiving the injected second solution; A first delivery pipeline connected to the first solution input end; a second delivery pipeline connected to the second solution input end; a mixing tank connected to an end of the first delivery pipeline away from the first solution input end and an end of the second delivery pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution; a main delivery pipeline, connected between the mixing tank and the processing device, for providing a mixed solution to the processing device; a main discharge pipeline connected to the main delivery pipeline; A control component is communicatively connected with the main discharge pipeline and the main delivery pipeline, and is used to discharge the mixed solution with an unstable flow through the main discharge pipeline before the main delivery pipeline provides the mixed solution to the treatment device.
2. The solution supply device according to claim 1, characterized in that: A first regulating valve is provided on the main delivery pipeline, and the first regulating valve is located between the main discharge pipeline and the processing device; A second regulating valve is provided on the main discharge pipeline; The control component is in communication with the first regulating valve and the second regulating valve, respectively, and is configured to: before the main delivery pipeline provides the mixed solution to the treatment device, the control component closes the first regulating valve and opens the second regulating valve to discharge the mixed solution with an unstable flow rate through the main discharge pipeline; and When the main delivery pipeline provides the mixed solution to the processing device, the control component controls the first regulating valve to open, and controls the first regulating valve and the second regulating valve to be in the open state for a preset time, and then closes the second regulating valve.
3. The solution supply device according to claim 1, characterized in that: A first regulating valve and a first flow meter are sequentially arranged on the main delivery pipeline, and the first regulating valve and the first flow meter are located between the main discharge pipeline and the treatment device; The main discharge pipeline is provided with a second regulating valve and a second flow meter in sequence; The control component is respectively connected to the first regulating valve, the first flow meter, the second regulating valve and the second flow meter in communication, and is configured as follows: Before the main delivery pipeline provides the mixed solution to the treatment device, the control component closes the first regulating valve and opens the second regulating valve, and the flow value of the solution flow in the main discharge pipeline detected by the second flow meter when it is stable is a first detection value; When the main delivery pipeline provides a mixed solution to the treatment device, the real-time value of the solution flow rate delivered from the main delivery pipeline to the treatment device detected by the first flowmeter is a second detection value, and the real-time value of the solution flow rate in the main discharge pipeline detected by the second flowmeter is a third detection value, and the control component adjusts the opening rate of the first regulating valve and the closing rate of the second regulating valve so that the sum of the second detection value and the third detection value is equal to the first detection value.
4. The solution supply device according to claim 1, characterized in that: The main conveying pipeline is provided with a feed tank, which is located between the main discharge pipeline and the treatment device and is used for buffering the mixed solution from the mixing tank and supplying it to the treatment device.
5. The solution supply device according to claim 1, characterized in that: A third regulating valve and a third flow meter are provided on the first delivery pipeline; A fourth regulating valve and a fourth flow meter are provided on the second delivery pipeline; The control component is also configured to: receive flow data detected by the third flow meter and the fourth flow meter, calculate the flow ratio of the first solution and the second solution, compare the flow ratio with a preset mixing ratio, and output a control signal for controlling the opening rate of the third regulating valve and the fourth regulating valve, so that the first solution and the second solution are mixed to form a mixed solution with the preset mixing ratio.
6. The solution supply device according to claim 1, characterized in that: The first delivery pipeline and the second delivery pipeline are respectively provided with pressure stabilizers for stabilizing the hydraulic pressure in the first delivery pipeline and the second delivery pipeline.
7. The solution supply device according to claim 1, characterized in that: include: A buffer tank, provided in the first delivery pipeline; A circulation pipeline is connected before and after the buffer tank of the first delivery pipeline, and is used to recover the first solution with unstable flow through the circulation pipeline before the first delivery pipeline provides the first solution to the mixing tank.
8. The solution supply device according to claim 1 or 7, characterized in that: include: The secondary discharge pipeline is connected to the second delivery pipeline and is used to discharge the second solution with an unstable flow rate through the secondary discharge pipeline before the second delivery pipeline provides the second solution to the mixing tank.
9. A solution supply device for providing a mixed solution to a treatment device, characterized in that: include: A first solution input end, used for receiving an injected first solution; A second solution input end, used for receiving the injected second solution; A first delivery pipeline connected to the first solution input end; a second delivery pipeline connected to the second solution input end; a mixing tank connected to an end of the first delivery pipeline away from the first solution input end and an end of the second delivery pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution; The main delivery pipeline is connected between the mixing tank and the processing device and is used to provide the mixed solution to the processing device; wherein, The first delivery pipeline and the second delivery pipeline are respectively provided with pressure stabilizers for stabilizing the hydraulic pressure in the first delivery pipeline and the second delivery pipeline.
10. A semiconductor device, characterized in that: The invention comprises a processing device for processing a semiconductor and a solution supply device as claimed in any one of claims 1 to 9.
Citation Information
Patent Citations
Ozonated water mixture supply apparatus and method, and substrate treating facility with the apparatus
CN101452823A
Method for controlling concentration of mixed acid in wet cleaning solution for semiconductor
CN112827376A
Apparatus and method for mixing and supplying chemicals
CN1743061A
Multi-liquid online mixing equipment
CN211216203U
Apparatus for mixing and supplying chemical
KR1020100048416A
Cited By
Liquid conveying method and system for semiconductor
CN122216521A
Liquid delivery method and system for semiconductor
CN122216521B
