Electric component module

Abstract

This electronic component module includes an electronic component and a multilayer wiring board. The multilayer wiring board includes a plurality of wiring layers and a plurality of insulating layers. An arrangement surface is provided with a hole. The plurality of wiring layers includes a surface wiring layer constituting the arrangement surface, and a bottom surface wiring layer constituting a bottom surface of the hole. The electronic component includes an electric circuit, an outer shape part forming an outer shape of the electronic component, and an electrode connecting the electric circuit and the wiring layer. The outer shape part includes an outer shape part body disposed in the surface wiring layer, a first facing surface facing the surface wiring layer, a protruding part disposed in the hole, and a second facing surface that is an end surface of the protruding part in a first direction and faces the bottom surface wiring layer. The outer shape part is integrally formed of a resin material. The electrode includes a first electrode provided on the first facing surface and connected to the surface wiring layer, and a second electrode provided on the second facing surface and connected to the bottom surface wiring layer.

Description

Electronic Component Module

[0001] The present disclosure relates to electronic component modules.

[0002] An electronic component module includes a substrate with wiring on its surface and a plurality of electronic components mounted on the surface of the substrate. The electronic component module of the following patent document has holes formed on the surface of the substrate. Electronic components (bare semiconductor chips) are housed in the holes. In other words, the electronic components do not protrude from the surface of the substrate. This allows the electronic component module to be made thinner (smaller).

[0003] Japanese Patent Application Publication No. 11-135566

[0004] However, the technology disclosed in the above patent document limits the size of the electronic component to one that can be accommodated in the hole. Under these circumstances, there is a need for the development of an electronic component module that can be miniaturized even if the electronic component is larger than the hole.

[0005] The present disclosure has been made in view of the above, and has an object to provide an electronic component module that can be made smaller.

[0006] The electronic component module of the present disclosure includes an electronic component and a multilayer wiring board arranged in a first direction relative to the electronic component, with a surface facing a second direction opposite the first direction serving as a placement surface on which the electronic component is placed. The multilayer wiring board has a plurality of wiring layers and a plurality of insulating layers arranged alternately in the first direction. Holes are formed in the placement surface. The plurality of wiring layers include a surface wiring layer that forms the placement surface and a bottom wiring layer that forms the bottom of the hole. The electronic component has an electric circuit, an outer portion that contains the electric circuit and forms the outer shape of the electronic component, and electrodes that are provided on the outer surface of the outer portion and connect the electric circuit to the wiring layer. The outer portion has an outer portion main body disposed on the surface wiring layer, a first opposing surface which is the surface of the outer portion main body in the first direction and faces the surface wiring layer, a protrusion which protrudes from the outer portion main body in the first direction and is disposed in the hole, and a second opposing surface which is the end face of the protrusion in the first direction and faces the bottom wiring layer. The electrodes have a first electrode provided on the first opposing surface and connected to the surface wiring layer, and a second electrode provided on the second opposing surface and connected to the bottom wiring layer.

[0007] The electronic component module of the present disclosure is miniaturized.

[0008] FIG. 1 is a plan view of an electronic component module according to a first embodiment. FIG. 2 is a schematic diagram illustrating a cross section taken along line II-II in FIG. 1. FIG. 3 is a schematic diagram illustrating a cross section taken along line III-III in FIG. 1. FIG. 4 is a plan view of a multilayer wiring substrate according to the first embodiment as viewed from a second direction. FIG. 5 is a plan view of a filter device (electronic component) according to the first embodiment as viewed from a first direction. FIG. 6 is a cross-sectional view of an electronic component module according to a second embodiment cut along an imaginary plane extending in the stacking direction and the arrangement direction. FIG. 7 is a view of an electronic component according to a modified example as viewed from a direction facing the second opposing surface.

[0009] Hereinafter, embodiments of the power amplifier device of the present disclosure will be described in detail with reference to the drawings. However, the present disclosure is not limited to these embodiments. Each embodiment is an example, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. From the first embodiment onwards, a description of matters common to the second embodiment will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0010] 1 is a plan view of an electronic component module according to a first embodiment. The electronic component module 100 according to the first embodiment includes a multilayer wiring substrate 1 and two electronic components 40. The two electronic components 40 are an integrated circuit 41 and a filter device 42. The integrated circuit 41 and the filter device 42 are disposed on the same plane (surface 2) of the multilayer wiring substrate 1.

[0011] Hereinafter, a direction parallel to the surface 2 will be referred to as the "planar direction." Of the planar directions, the direction in which the integrated circuits 41 and the filter devices 42 are lined up will be referred to as the "arrangement direction." Of the arrangement directions, the direction in which the filter devices 42 are arranged as viewed from the integrated circuits 41 will be referred to as the "first arrangement direction Y1," and the opposite direction will be referred to as the "second arrangement direction Y2." Furthermore, of the planar directions, the direction intersecting the arrangement direction will be referred to as the "width direction Z."

[0012] Fig. 2 is a schematic diagram of a cross section taken along line II-II in Fig. 1. Fig. 3 is a schematic diagram of a cross section taken along line III-III in Fig. 1. As shown in Figs. 2 and 3, the multilayer wiring board 1 has a plurality of wiring layers 10 and a plurality of insulating layers 20 alternately stacked on top of each other. Note that in Figs. 2 and 3, the cross sections of the wiring layers 10 and the insulating layers 20 are actually discontinuous in the planar direction, but are shown as continuous in the planar direction to make the structure of the multilayer wiring board 1 easier to understand.

[0013] Hereinafter, the direction in which the wiring layer 10 and the insulating layer 20 are stacked is referred to as the stacking direction. In the stacking direction, the direction in which the multilayer wiring substrate 1 is arranged as viewed from the filter device 42 is referred to as the first direction X1, and the direction opposite to the first direction is referred to as the second direction X2.

[0014] The multilayer wiring substrate 1 has a front surface 2 facing the second direction X2 and a back surface 3 facing the first direction X1. An electronic component 40 is arranged on the front surface 2. No electronic component is arranged on the back surface 3.

[0015] There are four wiring layers 10 and four insulating layers 20. That is, the multiple wiring layers 10 include a first wiring layer 11, a second wiring layer 12, a third wiring layer 13, and a fourth wiring layer 14. The multiple insulating layers 20 include a first insulating layer 21, a second insulating layer 22, a third insulating layer 23, and a fourth insulating layer 24.

[0016] The first wiring layer 11, the first insulating layer 21, the second wiring layer 12, the second insulating layer 22, the third wiring layer 13, the third insulating layer 23, the fourth wiring layer 14, and the fourth insulating layer 24 are stacked in this order in the first direction Z1. Thus, the first wiring layer 11 is an arrangement layer on which electronic components 40 are arranged, and constitutes the front surface 2. The fourth insulating layer 24 constitutes the back surface 3.

[0017] A hole 30 is provided in the surface 2 of the multilayer wiring substrate 1. As shown in Fig. 3, the depth L1 of the hole 30 is smaller than the thickness L2 of the multilayer wiring substrate 1 in the stacking direction. In other words, the hole 30 does not penetrate the multilayer wiring substrate 1. The first wiring layer (surface wiring layer) 11, the first insulating layer 21, the second wiring layer 12, and the second insulating layer 22 are each partially penetrated by the hole 30. In addition, the third wiring layer (bottom wiring layer) 13 forms the bottom surface 31 of the hole 30.

[0018] 4 is a plan view of the multilayer wiring board of the first embodiment as viewed from the second direction X2. As shown in FIG. 4, when viewed from the second direction X2, the holes 30 are formed in a rectangular shape and are longer in the width direction Z than in the arrangement direction.

[0019] The first wiring layer 11 has an end 11a of a first wiring, an end 11b of a second wiring, and ends 11c and 11d of two ground wirings, which are arranged around the edge of the hole 30. The third wiring layer 13 has an end 13a of a third wiring, an end 13b of a fourth wiring, and ends 13c and 13d of two ground wirings, which are arranged on the bottom surface 31.

[0020] The filter device 42 is a device that applies band limiting to an input electrical signal. As shown in Fig. 2, the filter device 42 has an electrical circuit 43, an outer portion 50 that houses the electrical circuit 43, and an electrode 60 provided on the outer surface of the outer portion 50. As shown in Fig. 3, the height L3 (size in the stacking direction) of the filter device 42 is greater than the depth L1 of the hole 30 (see Fig. 3) (L3 > L1). In other words, the filter device 42 is larger than the hole 30. Note that the electrical circuit 43 is omitted from Fig. 3.

[0021] As shown in FIG. 2 , the electric circuit 43 includes a first LC filter (first electric circuit) 44 and a second LC filter (second electric circuit) 45. Therefore, the filter device 42 of this embodiment has two functions. In other words, it is a device that combines two filter devices into one (integrated). Note that the first LC filter 44 and the second LC filter 45 of this embodiment have different pass bands. However, the present disclosure also allows the first LC filter 44 and the second LC filter 45 to have the same pass band.

[0022] The exterior portion 50 includes an exterior portion main body 51 and a protruding portion 52 protruding from the exterior portion main body 51 in the first direction X1. The exterior portion 50 is formed of a resin material. Therefore, the exterior portion main body 51 and the protruding portion 52 are integrated and inseparable. Furthermore, the exterior portion main body 51 and the protruding portion 52 are each formed in a cubic shape. Note that the present disclosure may also be applied to the exterior portion 50 of a ceramic package.

[0023] The outer portion main body 51 is disposed on the surface 2 (first wiring layer 11). The outer portion main body 51 has a first opposing surface 53 facing the first direction X1. The first opposing surface 53 faces the surface 2 (first wiring layer 11). The protrusion 52 is housed in the hole 30. The end face of the protrusion 52 in the first direction X1 forms a second opposing surface 54 facing the bottom surface 31 (third wiring layer 13) of the hole 30.

[0024] 2 , the first LC filter 44 is disposed inside the exterior portion main body 51 and the second LC filter 45 is disposed inside the protruding portion 52, but the present disclosure is not limited to this. For example, the first LC filter 44 may be disposed across the exterior portion main body 51 and the protruding portion 52, and the position of the electrical circuit disposed inside the exterior portion 50 is not particularly important.

[0025] Fig. 5 is a plan view of the filter device (electronic component) of the first embodiment as viewed from a first direction. As shown in Fig. 5, the protrusion 52 is disposed in the center of the first opposing surface 53. Therefore, the first opposing surface 53 has a rectangular frame shape (annular shape). The second opposing surface 54 has a rectangular shape. The electrode 60 includes a first electrode 61 provided on the first opposing surface 53 and a second electrode 62 provided on the second opposing surface 54.

[0026] The first electrode 61 is an electrode for connecting the first LC filter 44 and the first wiring layer (surface wiring layer) 11. The first electrode 61 is joined to the first wiring layer 11 via solder 70 (see FIGS. 2 and 3). The first electrode 61 has an input electrode 61a (see FIG. 3) joined to the end 11a, an output electrode 61b (see FIG. 3) joined to the end 11b, and two ground electrodes 61c and 61d (see FIG. 2) joined to the end 11c and 11d.

[0027] The second electrode 62 is an electrode for connecting the second LC filter 45 and the third wiring layer (bottom wiring layer) 13. The second electrode 62 is joined to the third wiring layer 13 via solder 70 (see FIGS. 2 and 3). The second electrode 62 has an input electrode 62a (see FIG. 3) joined to the end 31a, an output electrode 62b (see FIG. 3) joined to the end 31b, and two ground electrodes 62c and 62d (see FIG. 2) joined to the end 31c and 31d.

[0028] As described above, according to the first embodiment, a portion of the electronic component 40 (filter device 42) is housed in the hole 30. This reduces the protrusion amount L4 (see FIG. 3 ) of the electronic component 40 (filter device 42) protruding in the second direction X2 from the surface 2. In other words, even if the electronic component 40 (filter device 42) is larger than the hole 30, the electronic component module 100 can be made smaller.

[0029] Furthermore, the filter device 42 has two functions (a first LC filter 44 and a second LC filter 45). If two components (an electronic component including the first LC filter 44 and an electronic component including the second LC filter 45) were provided, the number of components would increase. Furthermore, two components would be placed on the surface 2, and the area of ​​the surface 2 that the components occupy would increase. For these reasons, in this embodiment, an increase in the number of components is avoided. Furthermore, the area that the filter device 42 occupies on the surface 2 is reduced. This allows the electronic component module 100 to be miniaturized in the planar direction.

[0030] The first embodiment has been described above. Next, a second embodiment in which the electronic component 40 is provided on the rear surface 3 will be described.

[0031] Second Embodiment Fig. 6 is a cross-sectional view of an electronic component module according to a second embodiment cut along a virtual plane extending in the stacking direction and the arrangement direction. The electronic component module 100A of the second embodiment is similar to the first embodiment in that a hole 30A is formed in the first wiring layer (surface wiring layer) 11 of the multilayer wiring substrate 1A, and the third wiring layer 13 forms the bottom surface 31A. The filter device 42 is similar to the first embodiment in that an outer body 51 is disposed on the first wiring layer 11, and a protrusion 52 is disposed in the hole 30A. The first electrode 61 is connected to the first wiring layer (surface wiring layer) 11, and the second electrode 62 is connected to the third wiring layer (bottom wiring layer) 13.

[0032] However, the multilayer wiring board 1A of the second embodiment differs from the multilayer wiring board 1 of the first embodiment in that it does not include the fourth insulating layer 24. Therefore, the fourth wiring layer 14 is disposed furthest in the first direction X1 among the multiple wiring layers 10, and serves as a back surface wiring layer that constitutes the back surface 3 of the multilayer wiring board 1A. Also, the integrated circuit 41 of the second embodiment differs from the first embodiment in that it is disposed in the fourth wiring layer 14 (back surface wiring layer).

[0033] As described above, even in the electronic component module 100A of the second embodiment, the amount of protrusion of the filter device 42 from the front surface 2 in the second direction X2 is reduced. That is, similar to the first embodiment, the electronic component module 100A can be made smaller.

[0034] Although the embodiment has been described above, the present disclosure is not limited to the examples shown in the embodiment. For example, although the present embodiment includes two electronic components 40, the present disclosure may include one or more electronic components 40.

[0035] In the present embodiment, all of the first electrodes 61 connected to the first LC filter (first electric circuit) 44 are provided on the first opposing surface 53. However, in the present disclosure, the first electrodes 61 may be distributed between the first opposing surface 53 and the second opposing surface 54. Similarly, the second electrodes 62 may be distributed between the first opposing surface 53 and the second opposing surface 54.

[0036] Furthermore, although the electronic component 40 of this embodiment is exemplified as a filter device 42 having two functions (two electric circuits), the present disclosure may be directed to an electronic component having one function, or an electronic component having three or more functions. Note that when the electronic component 40 has one function (electrical circuit), the multiple electrodes connected to the one electric circuit are distributed and arranged on the first opposing surface 53 and the second opposing surface 54.

[0037] 7 is a view of an electronic component according to a modified example viewed from a direction facing the second opposing surface. Furthermore, although the outer portion main body 51 of the embodiment is larger than the protrusion 52 in terms of size in the arrangement direction (first arrangement direction Y1 and second arrangement direction Y2) and width direction Z, the present disclosure is not limited thereto. For example, as shown in FIG. 7 , the outer portion 50B may have a protrusion 52B larger than the outer portion main body 51B in terms of size in the arrangement direction (first arrangement direction Y1 and second arrangement direction Y2). In other words, the present disclosure does not particularly care about the sizes of the outer portion main body and the protrusion.

[0038] Furthermore, although the outer portion main body 51 and the protrusion 52 in the embodiment have a rectangular shape when viewed from the stacking direction, the outer portion main body and the protrusion of the present disclosure may be formed into a polygonal shape such as a triangle, or a circle when viewed from the stacking direction.

[0039] The present disclosure may also be applied to combinations of the following configurations: (1) An electronic component; and a multilayer wiring board arranged in a first direction relative to the electronic component, the surface of which facing a second direction opposite to the first direction serving as a placement surface for placing the electronic component, wherein the multilayer wiring board has a plurality of wiring layers and a plurality of insulating layers arranged alternately in the first direction, the placement surface having a hole, the plurality of wiring layers including: a surface wiring layer that forms the placement surface; and a bottom wiring layer that forms the bottom surface of the hole, wherein the electronic component has: an electric circuit; an outer portion that contains the electric circuit and forms the outer shape of the electronic component; and electrodes that are provided on the outer surface of the outer portion and connect the electric circuit and the wiring layer, wherein the outer portion includes: an outer portion main body arranged on the surface wiring layer; a first opposing surface that is the surface of the outer portion main body in the first direction and faces the surface wiring layer; and a protrusion that protrudes from the outer portion main body in the first direction and is arranged in the hole. an end surface of the protrusion in the first direction, the end surface facing the bottom wiring layer, and a second opposing surface, the end surface facing the bottom wiring layer, wherein the electrodes include a first electrode provided on the first opposing surface and connected to the surface wiring layer, and a second electrode provided on the second opposing surface and connected to the bottom wiring layer. (2) The electronic component module according to (1), wherein the electric circuit includes a first electric circuit and a second electric circuit not connected to the first electric circuit, the first electrode connecting the first electric circuit to the surface wiring layer, and the second electrode connecting the second electric circuit to the bottom wiring layer. (3) The electronic component module according to (2), wherein the first electric circuit is a first LC filter, and the second electric circuit is a second LC filter, and the first LC filter and the second LC filter have different pass bands. (4) The electronic component module according to (2), wherein the first electric circuit is a first LC filter, the second electric circuit is a second LC filter, and the first LC filter and the second LC filter have the same pass band.(5) The electronic component module according to any one of (1) to (4), wherein the outer portion is formed of a resin material, and the outer main body portion and the protrusion are integrated. (6) The electronic component module according to any one of (1) to (5), comprising an integrated circuit disposed on the front surface wiring layer. (7) The electronic component module according to any one of (1) to (5), wherein the plurality of wiring layers have a back surface wiring layer that is disposed furthest in the first direction among the plurality of wiring layers and that forms a back surface of the multilayer wiring board, and comprising an integrated circuit disposed on the back surface wiring layer.

[0040] REFERENCE SIGNS LIST 1, 1A Multilayer wiring board 2 Front surface 3 Back surface 10 Wiring layer 20 Insulating layer 30, 30A Hole 31, 31A Bottom surface 40 Electronic component 42 Filter device 43 Electric circuit 50, 50B Outer portion 51, 51B Outer portion main body 52, 52B Protrusion 53 First opposing surface 54 Second opposing surface 60 Electrode 61 First electrode 62 Second electrode 100, 100A Electronic component module

Claims

1. An electronic component, and a multilayer wiring board arranged in a first direction relative to the electronic component, the surface facing a second direction opposite to the first direction serving as a placement surface for placing the electronic component, wherein the multilayer wiring board has a plurality of wiring layers and a plurality of insulating layers arranged alternately in the first direction, the placement surface having a hole, the plurality of wiring layers comprising: a surface wiring layer constituting the placement surface; and a bottom wiring layer constituting the bottom surface of the hole, wherein the electronic component comprises: an electric circuit; an exterior portion containing the electric circuit and forming the exterior of the electronic component; and electrodes provided on the outer surface of the exterior portion and connecting the electric circuit and the wiring layer, wherein the exterior portion comprises: an exterior portion main body arranged on the surface wiring layer; a first opposing surface which is the surface of the exterior portion main body in the first direction and faces the surface wiring layer; and a protrusion protruding from the exterior portion main body in the first direction and disposed in the hole. an end face of the protrusion in the first direction, the end face facing the bottom wiring layer; and a second opposing surface, the electrodes including: a first electrode provided on the first opposing surface and connected to the surface wiring layer; and a second electrode provided on the second opposing surface and connected to the bottom wiring layer.

2. The electronic component module described in claim 1, wherein the electrical circuit has: a first electrical circuit; and a second electrical circuit not connected to the first electrical circuit, the first electrode connects the first electrical circuit to the surface wiring layer, and the second electrode connects the second electrical circuit to the bottom wiring layer.

3. The electronic component module according to claim 2, wherein the first electric circuit is a first LC filter, the second electric circuit is a second LC filter, and the passbands of the first LC filter and the second LC filter are different from each other.

4. The electronic component module according to claim 2, wherein the first electric circuit is a first LC filter, the second electric circuit is a second LC filter, and the pass bands of the first LC filter and the second LC filter are the same.

5. An electronic component module according to any one of claims 1 to 4, wherein the outer portion is formed from a resin material, and the outer main body portion and the protrusion are integrated.

6. An electronic component module according to any one of claims 1 to 5, comprising an integrated circuit disposed on the surface wiring layer.

7. An electronic component module as claimed in any one of claims 1 to 5, wherein the plurality of wiring layers have a back surface wiring layer which is arranged furthest in the first direction among the plurality of wiring layers and which constitutes the back surface of the multilayer wiring board, and further comprises an integrated circuit arranged on the back surface wiring layer.

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