Wire bonding device and recovery method

Abstract

A wire bonding device for performing wire bonding on a plurality of bond points in a bonding object comprises a control unit, and a detection unit for detecting a state of a wire tail. The control unit executes: a determination process for determining whether or not a state of the wire tail that is detected by the detection unit allows for execution of the next bonding process; and a tail redrawing step of, when it is determined that the bonding process is not executable, pressing the wire tail by a bonding tool to a second bond point that differs from the plurality of bond points, and lifting the bonding tool to draw the wire tail from the second bond point in a state in which a tension that is applied by a tension-applying unit is released and a state in which clamping by a clamping unit is released.

Description

Wire bonding apparatus and recovery method

[0001] The present invention relates to a wire bonding apparatus and a recovery method for performing a recovery operation when an error is detected.

[0002] A conventional wire bonding apparatus electrically connects a first bonding point (e.g., a pad on a semiconductor die) to a second bonding point (e.g., a lead on a package) with a wire, and automatically protrudes the wire from the tip of a capillary.

[0003] Patent No. 6067951

[0004] The wire bonding apparatus disclosed in Patent Document 1 vibrates the capillary up and down at a frequency including the natural frequency of the bonding arm by a vibrating means that vibrates the capillary up and down while the wire is held by a holding means, thereby realizing the process of protruding the wire from the tip of the capillary.

[0005] However, in the recovery operation when an error related to the wire tail occurs (e.g., the wire tail does not protrude, the wire tail protrudes but is short, the wire tail is bent, etc.), the wire bonding apparatus must perform the complex operations described above to make the wire tail protrude again. Furthermore, the wire bonding apparatus uniformly performs the operation of forming the wire tail regardless of the state of the wire tail at the tip of the capillary. Therefore, there is a risk that the wire bonding apparatus may not be able to generate an appropriate wire tail during the recovery operation.

[0006] Therefore, the present invention has been made in consideration of these circumstances, and aims to provide a wire bonding device that can newly protrude an appropriate wire tail with a simple operation when an error related to the wire tail occurs.

[0007] A wire bonding apparatus according to one aspect of the present invention is a wire bonding apparatus for performing wire bonding processing on a plurality of bond points on a bonding target, comprising: a bonding tool for inserting a wire; a tension applying unit provided on the wire supply side of the bonding tool for applying tension to the wire; a clamping unit provided on the wire supply side of the bonding tool for holding the wire; a bonding processing for unwinding the wire inserted into the bonding tool and bonding it to a first bond point which is a bond point on the bonding target; and a wire tail for forming the wire extending from the tip of the bonding tool by cutting the wire while the wire is held by the clamping unit. and a detection unit that detects the state of the wire tail. The control unit is configured to execute a determination process to determine whether the state of the wire tail detected by the detection unit allows the next bonding process to be performed or not, and if it is determined that the bonding process is not possible, to execute a tail re-payout process to press the wire tail with the bonding tool against a second bond point that is a bond point different from the plurality of bond points, and to raise the bonding tool to pay out the wire tail from the second bond point in a state where the tension applied by the tension application unit is released and the clamping by the clamping unit is released.

[0008] A recovery method according to one aspect of the present invention is a recovery method performed using a wire bonding apparatus that performs wire bonding processing on a plurality of bond points on a bonding target, the wire bonding apparatus including: a bonding tool that inserts a wire; a tension applying unit that is provided on the wire supply side of the bonding tool and applies tension to the wire; and a clamping unit that is provided on the wire supply side of the bonding tool and holds the wire. The recovery method includes a control unit that performs a bonding process in which a wire inserted into a bonding tool is unwound and joined to a first bond point, which is the bond point to be bonded, and a forming process in which the wire is cut while held by the clamp unit to form a wire tail in which the wire extends from the tip of the bonding tool, and a detection unit that detects the state of the wire tail.The recovery method includes a determination process that determines whether the state of the wire tail detected by the detection unit allows a next bonding process to be performed, and if it is determined that the bonding process cannot be performed, a tail re-payout process that presses the wire tail with the bonding tool against a second bond point, which is a bond point different from the plurality of bond points, and, with the tension applied by the tension application unit released and the clamp by the clamp unit released, raises the bonding tool to unwound the wire tail from the second bond point.

[0009] According to the present invention, it is possible to provide a wire bonding apparatus that can newly protrude an appropriate wire tail with a simple operation when an error related to the wire tail occurs.

[0010] FIG. 1 is a diagram showing an example of a wire bonding apparatus according to the present embodiment; FIG. 2 is a diagram showing an example of the top surface of a bonding arm and a temporary bond region; FIG. 3 is a diagram showing an example of the configuration of a tail image detection unit; FIG. 4 is a diagram showing a detected image showing the tip of a bonding tool; FIG. 5 is a flowchart including various processes for generating a wire tail using a temporary bond point when an error occurs regarding the protruding state of the wire tail; FIG. 6 is a diagram showing an example of the operation of the temporary bonding process when the wire tail does not protrude; FIG. 7 is a diagram showing an example of a first tail bending process; FIG. 8 is a diagram showing an example of a second tail bending process; and FIG. 9 is a diagram showing an example of the operation of the temporary bonding process when the wire tail is short.

[0011] The following describes embodiments of the present invention. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic. The technical scope of the present invention should not be interpreted as being limited to the embodiments.

[0012] ===Configuration of Wire Bonding Apparatus 1=== The wire bonding apparatus 1 will be described with reference to Figures 1 to 4. Figure 1 is a diagram showing an example of the wire bonding apparatus 1 according to this embodiment. Figure 2 is a diagram showing an example of the top surface of the bonding arm 20 and a sacrificial bond region 130.

[0013] The wire bonding apparatus 1 is an apparatus that can perform recovery according to the state of the wire tail in the sacrificial bond area 130 when an error related to the wire tail, such as a wire cut error or a spark error, occurs. Furthermore, the wire bonding apparatus 1 can perform recovery by gripping the wire with only one clamper (clamper 44 in FIG. 1 ) by adjusting the timing of applying tension to the wire during the recovery operation. In other words, the wire bonding apparatus 1 is an apparatus that can appropriately perform recovery of an error related to the wire tail with simpler operation and apparatus configuration.

[0014] As shown in FIG. 1, the wire bonding apparatus 1 includes, for example, an XY drive mechanism 10, a Z drive mechanism 12, a bonding arm 20, an ultrasonic horn 30, a bonding tool 40, a load sensor 50, an ultrasonic vibrator 60, a non-attachment detection unit 70, a tail image detection unit 80, and a control unit 90.

[0015] The XY drive mechanism 10 is configured to be movable in, for example, X and Y axis directions (directions parallel to the bonding surface). The XY drive mechanism 10 is provided with, for example, a Z drive mechanism 12 that can move the bonding arm 20 in the Z axis direction (direction perpendicular to the bonding surface).

[0016] The bonding arm 20 is supported by a support shaft 14 and is configured to be freely swingable relative to the XY drive mechanism 10. The bonding arm 20 is formed in a substantially rectangular parallelepiped shape so as to extend from the XY drive mechanism 10 toward a bonding stage 16 on which a semiconductor device 100, which is the bonding target, is placed. The bonding arm 20 includes an arm base end 22 attached to the XY drive mechanism 10, an arm tip end 24 located on the tip side (-Y direction side) of the arm base end 22 and to which an ultrasonic horn 30 is attached, and a flexible connecting portion 23 connecting the arm base end 22 and the arm tip end 24. The connecting portion 23 is configured, for example, by slits 25a and 25b of predetermined widths extending from the top surface 21a of the bonding arm 20 toward the bottom surface 21b, and a slit 25c of predetermined width extending from the bottom surface 21b of the bonding arm 20 toward the top surface 21a. In this way, the connecting portion 23 is configured as a locally thin portion by the slits 25 a , 25 b , and 25 c , so that the arm tip end portion 24 can bend relative to the arm base end portion 22 .

[0017] As shown in FIG. 1 , a recess 26 for accommodating an ultrasonic horn 30 is formed on the bottom surface 21b of the bonding arm 20. The ultrasonic horn 30 is housed in the recess 26 of the bonding arm 20 and attached to the arm tip 24 with a horn fixing screw 32. The ultrasonic horn 30 holds a bonding tool 40 at its tip protruding from the recess 26, and an ultrasonic vibrator 60 for generating ultrasonic vibrations is provided in the recess 26. Ultrasonic vibrations are generated by the ultrasonic vibrator 60 and transmitted to the bonding tool 40 by the ultrasonic horn 30. As a result, the ultrasonic vibrator 60 can apply ultrasonic vibrations to the bonding target via the bonding tool 40. The ultrasonic vibrator 60 is, for example, a piezoelectric vibrator.

[0018] 2, slits 25a and 25b are formed in this order on the top surface 21a of the bonding arm 20 from the top surface 21a to the bottom surface 21b. The upper slit 25a is wider than the lower slit 25b. A load sensor 50 is provided in the wider upper slit 25a. The load sensor 50 is fixed to the arm tip 24 by a preload screw 52. The load sensor 50 is disposed so as to be sandwiched between the arm base end 22 and the arm tip 24. That is, the load sensor 50 is offset from the longitudinal central axis of the ultrasonic horn 30 in the direction toward or away from the bonding target, and is attached between the center of rotation of the bonding arm 20 and the attachment surface of the ultrasonic horn 30 at the arm tip 24 (i.e., the tip surface of the arm tip 24 on the bonding tool 40 side). As described above, the ultrasonic horn 30 that holds the bonding tool 40 is attached to the arm tip 24, so when a load is applied to the tip of the bonding tool 40 due to a reaction force from the bonding target, the arm tip 24 bends relative to the arm base end 22, making it possible for the load sensor 50 to detect the load. The load sensor 50 is, for example, a piezoelectric load sensor.

[0019] The bonding tool 40 is for inserting a wire 42 and is, for example, a capillary with an insertion hole 41. The wire 42 used for bonding is inserted into the insertion hole 41 of the bonding tool 40. The bonding tool 40 is configured so that a portion of the wire 42 can be paid out from its tip. For convenience, the wire 42 paid out from the tip of the bonding tool 40 will be referred to as a wire tail 42a below. The tip of the bonding tool 40 is also provided with a portion for pressing the wire 42 (hereinafter, also referred to as the "tip portion 40a"). The tip portion 40a has a shape that is rotationally symmetrical about the axial direction of the insertion hole 41 of the bonding tool 40, and has a pressing surface on the underside around the insertion hole 41. The bonding tool 40 is replaceably attached to the ultrasonic horn 30 by spring force or the like.

[0020] The clamper 44 (clamping unit) is provided, for example, above the bonding tool 40 (in the +Z-axis direction) and operates together with the bonding tool 40. The clamper 44 is configured to grip (restrain) or release the wire 42 at a predetermined timing based on a control signal output from a clamper control unit 91, for example.

[0021] The tension applying unit 45 is provided further above (in the +Z-axis direction) the clamper 44. The tension applying unit 45 is configured, for example, to pass the wire 42 through and create a gas flow in the +Z-axis direction to apply an appropriate tension to the wire 42. Note that a tension applying unit (not shown) may be provided further above (in the +Z-axis direction) the tension applying unit 45. The tension applying unit (not shown) applies tension to the wire 42 to prevent sagging, for example.

[0022] The wire 42 is made of a material selected in consideration of ease of processing, low electrical resistance, etc., such as gold (Au), aluminum (Al), copper (Cu), or silver (Ag). The wire 42 forms a ball portion 43 extending from the tip of the bonding tool 40. The ball portion 43 is bonded to a predetermined bond point (for example, the electrode pad 112 of the semiconductor die 110, hereinafter referred to as the "first bond point").

[0023] The mis-bonding detection unit 70 electrically detects, for example, whether or not a ball portion 43 formed at the tip of the wire 42 inserted into the bonding tool 40 is grounded to the semiconductor device 100 that is the target of bonding. The mis-bonding detection unit 70 includes, for example, a power supply unit 71, an output measurement unit 72, and a determination unit 73. The power supply unit 71 applies, for example, a predetermined electrical signal between the semiconductor device 100 and the wire 42. The output measurement unit 72 measures, for example, the output of the electrical signal supplied by the power supply unit 71. The determination unit 73 determines, for example, based on the measurement result of the output measurement unit 72, whether or not the wire 42 has made electrical contact with the semiconductor device 100.

[0024] Further, the misattachment detection unit 70 detects whether the wire tail 42a has been cut off from a predetermined bond point of the semiconductor device 100, for example, based on the output of an electrical signal supplied to the wire 42. Here, the predetermined bond point is, for example, the electrode pad 122 of the lead frame 120 or the sacrificial bond point 131 (second bond point) of the sacrificial bond region 130.

[0025] The sacrificial bond region 130 is a bonding region for feeding out a normal wire tail when an error occurs regarding the protrusion state of the wire tail. The sacrificial bond region 130 is, for example, a region at the same height in the Z-axis direction as the top surface of the semiconductor device 100, and is provided near the semiconductor device 100. The sacrificial bond region 130 may be provided with a hole for bending the wire tail (hole 132 in FIG. 7 , which will be described later). The sacrificial bond region 130 may also be a predetermined region on the semiconductor device 100 (bonding target). The coordinates of the positions of the sacrificial bond region 130, sacrificial bond point 131, and hole 132 are stored in a memory unit (not shown) of the wire bonding apparatus 1.

[0026] The tail image detection unit 80 detects, for example, an image showing the state of the wire tail 42a. The tail image detection unit 80 outputs the detected image (hereinafter referred to as a "detected image") to the control unit 90. The configuration of the tail image detection unit 80 will be described with reference to FIG. 3. FIG. 3 is a diagram showing an example of the configuration of the tail image detection unit 80. As shown in FIG. 3, the tail image detection unit 80 includes, for example, a light emitter 81, a lens 82, a prism 83, and an imaging unit 84. The light emitter 81 is formed of a light-emitting diode or the like and illuminates the tip of the bonding tool 40 from the side above the reference member 85. The imaging unit 84 is, for example, a charge-coupled device (CCD) camera. Imaging light irradiated onto the tip by the light emitter 81 is incident on the imaging unit 84 through the lens 82 and the prism 83. The imaging unit 84 generates a detected image from the incident imaging light.

[0027] The control unit 90 includes, for example, a clamper control unit 91, an XYZ-axis control unit 92, and an error determination unit 93. The clamper control unit 91 controls the opening and closing operation of the clamper 44. The XYZ-axis control unit 92 controls the operation of the bonding tool 40 in the X-axis, Y-axis, and Z-axis directions.

[0028] The error determination unit 93 detects errors related to the state of the wire tail. The state of the wire tail includes, for example, whether or not the wire tail protrudes from the bonding tool 40, whether or not the wire tail is bent, and the state of the ball formed by sparks on the wire tail. In other words, the error determination unit 93 executes a determination process to determine whether or not the state of the tip of the wire detected by the non-attachment detection unit 70 and the tail image detection unit 80 (the state of the ball portion 43 and the state of the wire tail) allows the next bonding process to be performed.

[0029] Specifically, the error determination unit 93 determines that an error has occurred in the wire tail when, for example, it is determined that the wire tail does not protrude from the bonding tool 40 in the detection image acquired from the tail image detection unit 80. Furthermore, the error determination unit 93 may determine that an error has occurred in the wire tail when, for example, it is determined that the length of the wire tail protruding from the bonding tool 40 in the detection image is shorter than a threshold. Furthermore, the error determination unit 93 may determine that an error has occurred in the wire tail when, for example, it is determined that a ball has not been properly formed on the wire tail due to sparks on the wire tail in the non-attachment detection unit 70 or the detection image. Specifically, the error determination unit 93 compares the diameter of the ball shown in the detection image with a preset threshold, and determines that an error has occurred in the wire tail when the diameter of the ball is less than the threshold. Note that the error determination unit 93 has been described as a function included in the control unit 90, but is not limited to this and may be, for example, a functional unit separate from the control unit 90.

[0030] The control unit 90 is connected to each of the components, such as the XY drive mechanism 10, the Z drive mechanism 12, the ultrasonic horn 30 (ultrasonic vibrator 60), the clamper 44, the load sensor 50, the non-attachment detection unit 70, and the tail image detection unit 80, so as to be able to send and receive signals to and from these components. By controlling the operation of these components, the control unit 90 can execute a recovery operation to generate a normal wire tail 42a using only one clamper 44 when the wire tail 42a cannot be generated normally (when the error determination unit 93 identifies an error related to the state of the ball portion 43 or the wire tail).

[0031] The control unit 90 also detects the protruding state of the wire tail at the tip of the bonding tool 40 (capillary) based on the detection image. The protruding state of the wire tail refers to, for example, whether or not the wire tail protrudes from the tip 40a of the bonding tool 40, and how far the wire tail protrudes from the tip 40a. Below, an overview of the operation of the control unit 90 to determine whether or not the wire tail protrudes from the tip 40a of the bonding tool 40 and an overview of the operation to detect the length of the wire tail will be described with reference to FIG. 4. FIG. 4 is a diagram showing a detection image in which the tip 40a of the bonding tool 40 is shown.

[0032] The control unit 90 detects whether or not a wire tail protrudes from the tip portion 40a included in the detection image shown in FIG. 4 (tail detection process). Specifically, as shown in FIG. 4A, when a pixel indicating a portion extending from the tip of the tip portion 40a toward the reference member 85 is not identified, the control unit 90 detects that the wire tail does not protrude from the tip portion 40a. For example, a state in which the wire tail does not protrude from the tip portion 40a includes a state in which the tip portion 40a of the wire tail 42a is attached to the edge of the tip of the bonding tool 40 (e.g., the region from the pressing surface to the insertion hole). Furthermore, as shown in FIG. 4B, when a pixel indicating a portion extending from the tip of the tip portion 40a toward the reference member 85 is identified, the control unit 90 detects that the wire tail protrudes from the tip portion 40a.

[0033] The control unit 90 also detects the length of the wire tail 42a extending from the tip portion 40a included in the detection image shown in FIG. 4 (first protrusion length determination process, second protrusion length determination process). Specifically, the control unit 90 may, for example, identify the number of pixels representing the portion extending from the tip of the tip portion 40a toward the reference member 85, and then refer to a storage unit (not shown) to identify the length of the wire tail 42a as a length corresponding to the number of pixels. The control unit 90 may also identify the length of the wire tail 42a based on the result of a relative comparison between the number of pixels representing the portion extending from the tip of the bonding tool 40 toward the reference member 85 and the number of pixels of the reference member 85. For example, the control unit 90 identifies the length of the wire tail 42a as 200 μm as shown in FIG. 4B and as 50 μm as shown in FIG. 4C.

[0034] The control unit 90 is connected to, for example, an operation unit 140 for inputting control information (hereinafter referred to as "control information") and a display unit 141 for outputting the control information. The worker checks the screen on the display unit 141 and inputs the control information (rising information, lowering information, coordinates of the waste bond point, etc.) on the operation unit 140. The control unit 90 is a computer device equipped with a CPU, memory, etc., and programs for executing processes required for wire bonding are stored in advance in the memory. The control unit 90 is configured to perform each process for controlling the operation of the bonding tool 40 described in the wire bonding method described below (for example, it is equipped with a program for causing a computer to execute each process).

[0035] ===Processing Contents=== The various steps of the wire bonding process executed by the control unit 90 of the wire bonding apparatus 1 will be described with reference to Figures 1 to 9. Figure 5 is a flowchart including various steps for generating a wire tail using a temporary bond point when an error occurs related to the protruding state of the wire tail. Figure 6 is a diagram showing an example of the operation of the temporary bonding process when the wire tail is not protruding. Figure 7 is a diagram showing an example of the first tail bending process. Figure 8 is a diagram showing an example of the second tail bending process. Figure 9 is a diagram showing an example of the operation of the temporary bonding process when the wire tail is short.

[0036] First, the outline of the steps executed before step S101 will be described below. As shown in FIG. 1 , the wire bonding apparatus 1 forms a ball portion 43 on the wire tail 42a extending from the bonding tool 40. Next, the wire bonding apparatus 1 lowers the bonding tool 40 toward the electrode pad 112 of the semiconductor die 110, bringing the ball portion 43 into contact with the electrode pad 112. Then, the wire bonding apparatus 1 controls the ultrasonic vibration to ON (first bonding step). The wire bonding apparatus 1 raises the bonding tool 40 in the +Z-axis direction while feeding out the wire 42 from the bonding tool 40.

[0037] Next, the wire bonding apparatus 1 forms a wire loop of the wire 42 while bending the wire 42 toward the electrode pad 122 (wire bonded portion) (wire loop process). Then, the wire bonding apparatus 1 presses a portion of the wire 42 against the upper surface of the electrode pad 122 (multiple bond points) and controls the ultrasonic vibration to ON (bonding process). The wire bonding apparatus 1 raises the bonding tool 40 in the +Z-axis direction and pays out the wire tail 42a from the tip 40a (tail payout process). The wire bonding apparatus 1 then clamps the wire 42 with the clamper 44. With the wire tail 42a protruding from the bonding tool 40, the wire bonding apparatus 1 raises the wire 42 in the +Z-axis direction and cuts off the wire tail 42a from the electrode pad 122 (wire bonded portion) (cutting process). At this time, the clamper 44 clamps the wire 42.

[0038] In this state, the wire bonding apparatus 1 executes the process of step S101. While the above description has been given of wire bonding between two points, this is not limiting. For example, step S101 and subsequent steps may be executed for bump bonding. In this case, in the above bonding process, the wire bonding apparatus 1 forms the wire 42 at the tip of the bonding tool 40 into a ball shape and bonds the ball-shaped wire 42 to the bond point.

[0039] In step S101, the wire bonding apparatus 1 detects an error related to the state of the wire tail, such as a wire cut error or a spark error. That is, the wire bonding apparatus 1 detects a state in which the wire tail 42a may not have been generated normally.

[0040] In step S102, the wire bonding apparatus 1 executes a tail detection process. The tail detection process is a process for detecting the protruding state of the wire tail 42a. As shown in FIG. 3 , in the tail detection process, imaging light emitted from a light emitter 81 is irradiated onto the tip 40a of the bonding tool 40 (capillary), and the imaging light is reflected by a prism 83 via a lens 82 and captured by an imaging unit 84, which generates a detection image (e.g., a three-dimensional image or the image shown in FIG. 4 ). As described above, the wire bonding apparatus 1 detects whether the wire tail is protruding from the bonding tool 40 based on the detection image.

[0041] In step S103, if it is determined in the tail detection step that the wire tail 42a is not protruding from the bonding tool 40 (step S102: no tail), the wire bonding apparatus 1 executes a temporary bonding step (bonding step). This allows the wire bonding apparatus 1 to execute a temporary bonding step that is optimal for a situation in which the wire tail 42a is not protruding, thereby allowing the wire tail 42a to newly protrude appropriately and quickly. The temporary bonding step is a step in which the wire 42 is pressed against the temporary bond point 131 of the temporary bond region 130 to be bonded.

[0042] When performing the waste bonding step, the wire bonding apparatus 1 performs a tension releasing step. The tension releasing step is a step of releasing the tension on the wire by the tension applying unit 45. By performing the tension releasing step, the wire bonding apparatus 1 can achieve the following steps with only one clamper 44. Furthermore, in the tension releasing step, if a tension applying unit (not shown) is provided above the tension applying unit 45, it is not necessary to release the tension on the wire 42 (tension to prevent slack in the wire 42) by the tension applying unit (not shown).

[0043] In step S104, the wire bonding apparatus 1 executes a tail re-paying process, which is a process of newly paying out the wire tail 42a at the temporary bonding point 131 (second bonding point) with the clamper 44 released.

[0044] An example of the tamper bonding process and the tail re-paying process will be described with reference to Figure 6. The processes shown in Figures 6(a) to 6(c) are the tamper bonding process, and the processes shown in Figures 6(d) to 6(g) are the tail re-paying process.

[0045] As shown in Fig. 6(a), the wire bonding apparatus 1 moves the bonding tool 40 so that the bonding tool 40 coincides with the temporary bond point 131 in the XY plane while clamping the wire 42 with the clamper 44. Next, as shown in Fig. 6(b), the wire bonding apparatus 1 detects the contact state between the tip 40a and the temporary bond point 131 electrically or by load detection. Next, as shown in Fig. 6(c), the wire bonding apparatus 1 applies a load to the tip 40a and also applies ultrasonic vibrations.

[0046] Next, as shown in FIG. 6( d ), the wire bonding apparatus 1 releases the clamped state of the wire 42 by the clamper 44, transitioning to a state in which the wire tail can be paid out. At this point, even if the clamping of the clamper 44 is released, the tension on the wire 42 is released, so the wire 42 will not come off the bonding tool 40. Although FIG. 6( a ) illustrates the tension release process being executed in FIG. 6( a ), this is not a limitation. For example, the tension release process may be executed by the time the clamp in FIG. 6( d ) is released. Next, as shown in FIG. 6( e ), the wire bonding apparatus 1 moves the bonding tool 40 in the +Z-axis direction to pay out the wire tail 42 a. Next, as shown in FIG. 6( f ), the wire bonding apparatus 1 clamps the wire 42 by the clamper 44. Next, as shown in FIG. 6( g ), the wire bonding apparatus 1 cuts off the wire tail 42 a from the throw-away bond point 131. At the time of FIG. 6( f ) or FIG. 6( g ), the wire bonding apparatus 1 may turn on the tension applied by the tension applying unit 45 .

[0047] In step S105, the wire bonding apparatus 1 executes a tail re-detection step which is the same as the tail detection step in step S102.

[0048] In step S106, if it is detected that the wire tail 42a is not protruding despite the execution of the tail re-payout step (step S105: no tail), the wire bonding apparatus 1 executes a recovery determination step. The recovery determination step determines whether or not a preset number of recoveries has been exceeded. The number of recoveries is, for example, the number of times the processes of steps S103 to S105 have been repeatedly performed in succession.

[0049] If it is determined in the recovery determination step that the number of recoveries has exceeded the limit (step S106: YES), the wire bonding apparatus 1 stops the apparatus and notifies, for example, an administrator that the apparatus has been stopped (step S107). That is, if the wire bonding apparatus 1 determines that the number of recoveries has exceeded a predetermined number (for example, three times), it determines that the state in which the wire tail 42a cannot be generated normally continues, and stops the apparatus to allow the administrator to recover. This allows the wire bonding apparatus 1 to quickly recover from the state in which it is not possible to protrude the wire tail 42a.

[0050] If it is determined in the recovery determination step that the number of recoveries has not exceeded the limit (step S106: NO), the wire bonding apparatus 1 repeats the process from step S103.

[0051] In this way, in the wire bonding apparatus 1, even if an error occurs regarding the protruding state of the wire tail 42a, such as the wire tail 42a not protruding from the bonding tool 40, a normal wire tail 42a can be generated.

[0052] In step S108, if it is determined in the tail detection process that the wire tail 42a protrudes from the bonding tool 40 (steps S102 and S105: tail present), the wire bonding apparatus 1 executes a first protrusion length determination process.

[0053] The first protrusion length determination process is a process of determining whether the length of the wire tail 42a protruding from the bonding tool 40 (hereinafter referred to as the "protrusion length") is longer or shorter than a predetermined length (hereinafter referred to as the "first length"). Specifically, the wire bonding apparatus 1 analyzes the detected image acquired by the tail image detection unit 80 to identify the length between the tip of the bonding tool 40 and the tip of the wire tail 42a as the protrusion length. The wire bonding apparatus 1 compares the identified protrusion length with the first length. This allows the wire bonding apparatus 1 to perform an optimal waste bonding process for the length of the protruding wire tail 42a, thereby allowing the wire tail 42a to protrude again appropriately and quickly.

[0054] The first length is, for example, a length that is equal to or greater than the length that allows the use of the hole 132 (see FIG. 7 ) in the sacrificial bond region 130. In other words, the first length is a length that allows the execution of a tail bending process (step S109) that uses the hole 132, which will be described later.

[0055] In step S109, if the wire bonding apparatus 1 detects that the length of the wire tail 42a is longer than the first length (step S108: Long), it performs a tail bending process (hereinafter referred to as the "first tail bending process") using the hole 132 in the sacrificial bond area 130.

[0056] The first tail bending step is a step of bending the wire tail 42a at a predetermined angle using the hole 132. In this way, when the wire tail 42a is long, the wire bonding apparatus 1 can smoothly perform bonding at the temporary bond point 131 by bending the wire tail 42a in advance, and can generate an appropriate wire tail 42a.

[0057] An example of the first tail bending process will be described with reference to FIG. 7 . First, as shown in FIG. 7( a), the wire bonding apparatus 1 clamps the wire 42 with the clamper 44 and moves the bonding tool 40 so that the center of the hole 132 and the insertion hole 41 of the bonding tool 40 coincide in the XY plane based on the coordinates of the hole 132 stored in a memory unit (not shown). Next, as shown in FIG. 7( b), the wire bonding apparatus 1 inserts the wire tail 42 a into the hole 132. At this time, the wire bonding apparatus 1 inserts the wire tail 42 a to a predetermined depth from the bond level in the Z-axis direction and stops the bonding tool 40. Next, as shown in FIG. 7( c), the wire bonding apparatus 1 moves the bonding tool 40 along the XY plane and bends the wire tail 42 a while contacting it with the hole 132 so that the wire tail 42 a forms a predetermined angle (e.g., 60 degrees) with the Z axis. Next, as shown in FIGS. 7D and 7E, the wire bonding apparatus 1 moves the bonding tool 40 to the waste bond point 131 (the process proceeds to step S112).

[0058] In step S110, if it is determined that the protrusion length of the wire tail 42a is shorter than the first length (step S108: Short), the wire bonding apparatus 1 executes a second protrusion length determination process.

[0059] The second protrusion length determination process is a process for determining whether the protrusion length of the wire tail 42a protruding from the bonding tool 40 is longer or shorter than a predetermined length (hereinafter referred to as the "second length"). Specifically, the wire bonding apparatus 1 analyzes the detected image acquired by the tail image detection unit 80 to determine the length between the tip of the bonding tool 40 and the tip of the wire tail 42a as the protrusion length. The wire bonding apparatus 1 compares the determined protrusion length with the second length. This allows the wire bonding apparatus 1 to perform an optimal operation for bending the wire tail 42a and a waste bonding process for the length of the protruding wire tail 42a, thereby allowing the wire tail 42a to protrude anew appropriately and quickly.

[0060] The second length is, for example, shorter than the first length and longer than a predetermined length. In other words, the second length is a length that prevents the hole 132 from being used (for example, a length that is shorter than the distance from the tip of the bonding tool 40 to the bond level plus a predetermined length), but is long enough to perform the third tail bending step described below.

[0061] In step S111, if the wire bonding apparatus 1 detects that the length of the wire tail 42a is longer than the second length (step S110: Long), it performs a tail bending process without using the hole 132 (hereinafter referred to as the "second tail bending process").

[0062] The second tail bending process is a process of bending the wire tail 42a at a predetermined angle without using the hole 132. In this way, the wire bonding apparatus 1 can smoothly perform bonding to the temporary bond point 131 by bending the wire tail 42a in advance, and can generate an appropriate wire tail 42a.

[0063] An example of the second tail bending process will be described with reference to FIG. 8 . First, as shown in FIG. 8( a), the wire bonding apparatus 1 clamps the wire 42 with the clamper 44 and moves the bonding tool 40 so that a predetermined point 133 in the bond region 130 and the insertion hole 41 of the bonding tool 40 coincide with each other in the XY plane. Next, as shown in FIG. 8( b), the wire bonding apparatus 1 brings the tip of the wire tail 42 a into contact with the point 133. Specifically, the wire bonding apparatus 1 stops the bonding tool 40 at a height in the Z-axis direction that is the sum of the bond level (height level in the Z-axis direction) and the length of the wire tail 42 a. Next, as shown in FIG. 8( c), the wire bonding apparatus 1 bends the wire tail 42 a while bringing the tip of the wire tail 42 a into contact with the point 133 so that the wire tail 42 a forms a predetermined angle (e.g., 60 degrees) with the Z axis. Specifically, the wire bonding apparatus 1 moves the bonding tool 40 so that the tip 40a approaches the bond level while shifting the bonding tool 40 from the point 133. Next, as shown in Figures 8(d) and 8(e), the wire bonding apparatus 1 moves the bonding tool 40 to the throw-away bond point 131.

[0064] In steps S112 and S113, the wire bonding apparatus 1 performs steps similar to those shown in FIGS. 9(a) to 9(d) to be described later on the wire tail 42a bent in the first tail bending step or the second tail bending step.

[0065] In addition, if the length of the wire tail 42a is detected to be shorter than the second length (step S110: short), the processes of steps S112 and S113 may be different from steps S103 and S104.

[0066] 9(a) to 9(d) are the "third tail bending process," the "trim bonding process," and the "tail re-paying process" when it is detected that the length of the wire tail 42a is shorter than the second length. The process shown in FIGS. 9(a) to 9(d) is the "third tail bending process," the process shown in FIGS. 9(e) and 9(f) is the "trim bonding process," and the process shown in FIGS. 9(g) to 9(i) is the "tail re-paying process."

[0067] First, as shown in FIG. 9A , the wire bonding apparatus 1 clamps the wire 42 with the clamper 44 and moves the bonding tool 40 so that a point 134 near the temporary bond point 131 coincides with the insertion hole 41 of the bonding tool 40 in the XY plane. The vicinity of the temporary bond point 131 may be, for example, a point spaced a distance equal to the length of the wire tail 42 a from the temporary bond point 131, or a point spaced a predetermined distance from the temporary bond point 131. Next, as shown in FIG. 9B , the wire bonding apparatus 1 brings the tip of the wire tail 42 a into contact with the point 134. Specifically, the wire bonding apparatus 1 stops the bonding tool 40 at a height in the Z-axis direction that is the bond level (height level in the Z-axis direction) plus the length of the wire tail 42 a. 9(c) and 9(d), the wire bonding apparatus 1 bends the wire tail 42a while maintaining contact between the point 134 and the tip of the wire tail 42a, and brings the tip 40a of the bonding tool 40 into contact with the waste bond point 131. Specifically, the wire bonding apparatus 1 moves the bonding tool 40, for example, while shifting the bonding tool 40 from the point 134, so that the tip 40a overlaps the waste bond point 131. By performing the third tail bending process, the wire bonding apparatus 1 can prevent the wire tail 42a from coming off the bonding tool 40.

[0068] Next, as shown in Fig. 9(e), the wire bonding apparatus 1 applies a load or electrically detects the contact state between the temporary bond point 131 and the wire 42. Next, as shown in Fig. 9(f), the wire bonding apparatus 1 applies a load to the tip 40a to apply ultrasonic vibration. Note that before performing the process of Fig. 9(e), the wire bonding apparatus 1 may release the tension on the wire 42 to prevent the wire 42 from slipping out of the bonding tool 40.

[0069] Next, as shown in FIG. 9( g), the wire bonding apparatus 1 releases the clamper 44 and transitions to a state in which the wire tail 42 a can be paid out. Then, the wire bonding apparatus 1 moves the bonding tool 40 in the +Z-axis direction. This causes the wire tail 42 a to be paid out from the bonding tool 40. Next, as shown in FIG. 9( h), the wire bonding apparatus 1 clamps the wire 42 with the clamper 44. Next, as shown in FIG. 9( i), the wire bonding apparatus 1 cuts off the wire tail 42 a from the waste bond point 131. Note that at the point in time shown in FIG. 9( h), the tension applying unit 45 may be turned on to apply tension to the wire 42.

[0070] In step S114, the wire bonding apparatus 1 performs a tail re-feeding process through the first tail bending process, the second tail bending process, or the third tail bending process, and then performs a tail re-detection process similar to the tail detection process of step S102.

[0071] If it is detected that the wire tail 42 a is not protruding from the bonding tool 40 (step S114 : no tail), the wire bonding apparatus 1 repeats the process from step 106 .

[0072] In step S115, if it is detected that the wire tail 42a protrudes from the bonding tool 40 (step S114: tail present), the wire bonding apparatus 1 executes a third protrusion length determination step.

[0073] The third protrusion length determination step is a step of determining whether the protrusion length of the wire tail 42a paid out in the tail re-paying step is within a predetermined normal length range. In the third protrusion length determination step, it may be determined whether the protrusion length of the wire tail 42a is longer or shorter than the predetermined normal length range. If the wire bonding apparatus 1 detects that the protrusion length is shorter than the normal length range (step S115: short), it repeats the process from step S110, and if the protrusion length is detected that the protrusion length is longer than the normal length range (step S115: long), it repeats the process from step S109.

[0074] In step S116, if it is determined that the length of the wire tail 42a is within the normal length range (step S115: normal), the wire bonding apparatus 1 executes the spark process.

[0075] The spark process is a process in which the bonding tool 40 is raised to a predetermined height in the Z-axis direction, and a discharge is generated between a discharge electrode (not shown) and the wire tail 42a, forming a ball at the tip of the wire tail 42a.

[0076] In step S117, the wire bonding apparatus 1 determines whether the spark was successful. For example, if the diameter of the ball formed by the spark is within a predetermined range, the wire bonding apparatus 1 determines that the spark was successful. Here, the wire bonding apparatus 1 detects the diameter of the ball by analyzing the detection image acquired by the imaging unit 84, for example.

[0077] If it is determined that the sparking has failed (step S117: failed), the wire bonding apparatus 1 repeats the process from step S108. If it is determined that the sparking has succeeded (step S117: successful), the wire bonding apparatus 1 proceeds to the normal bonding process.

[0078] In the above, the wire bonding apparatus 1 may execute a process of determining whether the number of recoveries has exceeded after a predetermined step. For example, the wire bonding apparatus 1 may execute a process of determining whether the number of recoveries has exceeded after determining "short" in step S108 and step S115. As a result, the wire bonding apparatus 1 determines that the state in which the wire tail 42a cannot be generated normally continues, and stops the apparatus to allow the administrator to restore the apparatus.

[0079] In the above description, the wire bonding apparatus 1 has been described as performing the sacrificial bonding process using a sacrificial bond region 130 provided near the semiconductor device 100 (bonding target). If the sacrificial bond region 130 is provided on the semiconductor device 100 (bonding target), the wire bonding apparatus 1 cannot form a hole 132 in the sacrificial bond region 130. In this case, the wire bonding apparatus 1 performs step S111 instead of step S109 in FIG. 5. This allows the wire bonding apparatus 1 to perform the sacrificial bonding process in a predetermined region on the semiconductor device 100 that is closer to the electrode pad 122, thereby enabling a faster recovery operation.

[0080] As described above, the wire bonding apparatus 1 can execute recovery operations quickly and appropriately with a simpler apparatus configuration than conventional wire bonding apparatuses.

[0081] For example, in conventional wire bonding devices, if an error such as a wire cut error or a spark miss error occurs, the bonding operation is stopped. The wire bonding device then issues an alarm to notify the operator, who then corrects the error and resumes the bonding operation. In other words, in conventional wire bonding devices, if an error occurs, the bonding operation is stopped, which causes a problem of reduced availability.

[0082] In contrast, if an error occurs regarding the state of the wire tail, the wire bonding apparatus 1 automatically generates the wire tail 42a at the temporary bond point 131, allowing bonding to be continued without stopping the apparatus. Furthermore, the wire bonding apparatus 1 performs the tension release state and the clamping state of the wire 42 with the clamper 44 at appropriate timing, making it possible to pay out the wire tail 42a using only one clamper 44. In other words, the wire bonding apparatus 1 has a simple apparatus configuration and is capable of performing a recovery operation to quickly pay out the wire tail 42a.

[0083] Furthermore, for example, in a conventional wire bonding apparatus, the wire tail is paid out by a uniform operation during the recovery operation, regardless of the state of the wire tail.

[0084] In response to this, when an error related to the state of the wire tail occurs, the wire bonding apparatus 1 executes a recovery operation of paying out the wire tail 42a according to the protruding state of the wire tail 42a. Specifically, the wire bonding apparatus 1 executes a recovery operation of the wire tail 42a according to whether or not the wire tail 42a is protruding from the bonding tool 40, and if the wire tail 42a is protruding, whether the length of the wire tail 42a is long or short. This allows the wire bonding apparatus 1 to pay out an appropriate wire tail 42a.

[0085] ===Summary=== <1> The wire bonding apparatus 1 is a wire bonding apparatus 1 that performs wire bonding processing on a plurality of bond points (e.g., electrode pads 122) on a bonding target, and includes a bonding tool 40 through which a wire 42 is inserted, a tension applying unit 45 that is provided on the wire 42 supply side of the bonding tool 40 and applies tension to the wire 42, a clamper 44 (clamp unit) that is provided on the wire 42 supply side of the bonding tool 40 and holds the wire 42, a bonding processing in which the wire 42 inserted into the bonding tool 40 is paid out and bonded to a bond point (first bond point) that is a bond point on the bonding target, and a tail payout process (forming processing) in which the wire 42 is cut while the wire 42 is held by the clamper 44 (clamp unit) to form a wire tail 42a in which the wire 42 extends from the tip of the bonding tool 40, and a misattachment detection unit 70 and a tail image detection unit 80 (detection unit) that detect the state of the wire tail 42 a, and the control unit 90 executes a determination process of determining whether the state of the wire tail 42 a detected by the misattachment detection unit 70 and the tail image detection unit 80 (detection unit) allows the next bonding process to be performed, and if it is determined that the bonding process is not allowable, executes a tail re-payout process of pressing the wire tail 42 a with the bonding tool 40 against a temporary bond point 131 (second bond point) that is a bond point different from the plurality of bond points, and then, in a state where the tension applied by the tension application unit 45 is released and the clamping by the clamper 44 (clamp unit) is released, raising the bonding tool 40 to pay out the wire tail 42 a from the temporary bond point 131 (second bond point). This enables the wire bonding apparatus 1 to newly protrude an appropriate wire tail with a simple operation when a wire tail-related error occurs. Furthermore, the wire bonding apparatus 1 can newly protrude an appropriate wire tail using a simple configuration of only one clamper on the +Z direction side of the bonding tool 40, thereby reducing the cost required to manufacture the apparatus.

[0086] <2> In the wire bonding apparatus 1, the non-attachment detection unit 70 and the tail image detection unit 80 (detection unit) detect whether the wire tail 42a protrudes from the tip 40a (tip) of the bonding tool 40, and when the non-attachment detection unit 70 or the tail image detection unit 80 (detection unit) detects that the wire tail 42a does not protrude from the tip 40a (tip) of the bonding tool 40, the control unit 90 executes the payout of the wire tail 42a at the temporary bond point 131 (second bond point) in the tail re-feeding process. This allows the wire bonding apparatus 1 to execute the optimal temporary bonding process for a situation in which the wire tail 42a does not protrude, thereby enabling smooth bonding at the temporary bond point 131 and generating an appropriate wire tail 42a.

[0087] <3> In the wire bonding apparatus 1, the non-attachment detection unit 70 and the tail image detection unit 80 (detection unit) detect whether the wire tail 42a protrudes from the tip 40a (tip) of the bonding tool 40, and when the non-attachment detection unit 70 or the tail image detection unit 80 (detection unit) detects that the wire tail 42a protrudes from the tip 40a (tip) of the bonding tool 40, the control unit 90 further executes a first protrusion length determination process in which it determines whether the length by which the wire tail 42a protrudes from the tip 40a (tip) is longer than a first length, and a waste bonding process (bonding process) in which the wire 42 is bonded at the waste bond point 131 (second bond point) in accordance with the first determination result determined in the first protrusion length determination process. The wire bonding apparatus 1 described in <1> or <2>. This allows the wire bonding apparatus 1 to perform an optimal temporary bonding process for the length of the protruding wire tail 42a, thereby enabling smooth bonding at the temporary bond point 131 and generating an appropriate wire tail 42a.

[0088] <4> The wire bonding apparatus 1 according to <3>, wherein the wire bonding apparatus 1 includes a sacrificial bond area 130 including a sacrificial bond point 131 (second bond point), the sacrificial bond area 130 having a hole 132 into which the tip portion 40a (tip) of the wire tail 42a is inserted, and when the control unit 90 detects that the length is longer than the first length in the first protrusion length determination step, the control unit 90 further performs a tail bending step of inserting a portion of the wire tail 42a into the hole 132 and bending the wire tail 42a to a predetermined angle, and in the sacrificial bonding step (bonding step), bonding is performed at the sacrificial bond point 131 (second bond point) of the bent portion of the wire tail 42a bent in the tail bending step. Thus, when the wire tail 42a is long, the wire bonding apparatus 1 can smoothly perform bonding at the sacrificial bond point 131 by bending the wire tail 42a in advance, and can generate an appropriate wire tail 42a.

[0089] <5> The wire bonding apparatus 1 according to <3>, wherein the wire bonding apparatus 1 includes a sacrificial bond region 130 including a sacrificial bond point 131 (second bond point), the sacrificial bond region 130 being a predetermined region on the semiconductor device 100 (bonding target) where a plurality of bond points are provided, and the control unit 90 further performs a tail bending process to bend the wire tail 42 a in the sacrificial bond region 130 when the first protrusion length determination process detects that the length is longer than the first length, and in the sacrificial bonding process (bonding process), bonding is performed at the sacrificial bond point 131 (second bond point) at the bent portion of the wire tail 42 a bent in the tail bending process. This allows the wire bonding apparatus 1 to perform the sacrificial bonding process in a predetermined region on the bonding target (here, the semiconductor device 100) closer to the electrode pad 122, thereby enabling a faster recovery operation.

[0090] <6> The wire bonding apparatus 1 according to any one of <3> to <5>, wherein the control unit 90 further executes a second protrusion length determination step of determining whether the length by which the wire tail 42a protrudes from the tip 40a (tip) of the bonding tool 40 is longer than a second length when the first protrusion length determination step detects that the length is shorter than the first length, and in the temporary bonding step, bonding of the wire 42 is performed at the temporary bond point 131 (second bond point) according to the second determination result determined in the second protrusion length determination step. This allows the wire bonding apparatus 1 to perform an optimal operation of bending the wire tail 42a and an optimal temporary bonding step for the length of the protruding wire tail 42a, thereby allowing the wire tail 42a to protrude anew appropriately and quickly.

[0091] <7> The wire bonding apparatus 1 according to <6>, wherein, when the second protrusion length determination step determines that the protrusion length is longer than the second length, the control unit 90 further executes a tail bending step (second tail bending step) of bending the wire tail 42 a in the throw-away bond region 130, and in the throw-away bonding step, bonding is executed at the throw-away bond point 131 (second bond point) of the bent portion of the wire tail 42 a bent in the tail bending step. In this way, the wire bonding apparatus 1 can smoothly execute bonding to the throw-away bond point 131 by bending the wire tail 42 a in advance, and can generate an appropriate wire tail 42 a.

[0092] <8> The wire bonding apparatus 1 according to <6> or <7>, wherein, in the wire bonding apparatus 1, if the second protrusion length determination step determines that the protrusion length is shorter than the second length, the control unit 90 contacts the wire tail 42a near the temporary bond point 131 (second bond point) in the temporary bond region 130 in the temporary bonding step (bonding step), and bends the wire tail 42a while bonding the bent portion of the wire tail 42a to the temporary bond point 131 (second bond point). By bending the wire tail 42a in advance, the wire bonding apparatus 1 can smoothly bond the wire tail 42a to the temporary bond point 131 and generate an appropriate wire tail 42a.

[0093] <9> The wire bonding apparatus 1 according to any one of <1> to <8>, wherein the control unit 90, after executing the tail re-paying step, further executes a re-tail detection step in which the misattachment detection unit 70 and the tail image detection unit 80 (detection unit) detect a protruding state of the wire tail 42 a on the bonding tool 40, and, if it is detected in the re-tail detection step that the wire tail 42 a is not protruding from the tip 40 a (tip) of the bonding tool 40, a recovery determination step in which the number of times the throw-away bonding step (bonding step), the tail re-paying step, and the re-tail detection step have been repeated exceeds a threshold value. This allows the wire bonding apparatus 1 to quickly recover from a state in which it is impossible to make the wire tail 42 a protrude.

[0094] <10> The wire bonding apparatus 1 according to any one of <1> to <9>, wherein the control unit 90 further executes a first bonding step of bonding the wire 42 at the tip portion 40a (tip) of the bonding tool 40 to a predetermined bond point (e.g., electrode pad 112) among a plurality of bond points, and a wire looping step of looping the wire 42 from the predetermined bond point (e.g., electrode pad 112) toward, for example, an electrode pad 122 (first bond point) after executing the first bonding step. This enables the wire bonding apparatus 1 to protrude an appropriate wire tail 42a when an error related to the wire tail occurs during wire bonding between two points.

[0095] <11> The wire bonding apparatus 1 according to any one of <1> to <9>, wherein the bonding step (bonding process) in the wire bonding apparatus 1 includes forming the wire 42 at the tip 40a (tip) of the bonding tool 40 into a ball shape and bonding the ball-shaped wire 42 to a bond point (not shown). This enables the wire bonding apparatus 1 to protrude an appropriate wire tail 42a when an error related to the wire tail occurs during bump bonding.

[0096] The embodiments described through the above embodiments of the invention can be combined, modified, or improved as appropriate depending on the application, and the present invention is not limited to the above-described embodiments. It is clear from the claims that such combinations, modifications, or improvements are also included within the technical scope of the present invention.

[0097] 1...wire bonding apparatus, 12...Z drive mechanism, 40...bonding tool, 42...wire, 42a...wire tail, 44...clamper, 60...ultrasonic vibrator, 80...tail image detection unit, 90...control unit.

Claims

1. A wire bonding apparatus for performing wire bonding processing on a plurality of bond points on a bonding target, comprising: a bonding tool for inserting a wire; a tension applying section provided on the wire supply side of the bonding tool for applying tension to the wire; a clamp section provided on the wire supply side of the bonding tool for holding the wire; a control unit for executing a bonding process in which the wire inserted into the bonding tool is paid out and joined to a first bond point which is a bond point on a bonding target, and a forming process in which the wire is cut while held by the clamp section to form a wire tail in which the wire extends from the tip of the bonding tool; and a detection section for detecting a state of the wire tail, wherein the control unit is further configured to perform a determination process in which the state of the wire tail detected by the detection section determines whether or not a next bonding process is possible; a tail re-payout process in which, when it is determined that the bonding process cannot be performed, the bonding tool is used to press the wire tail against a second bond point that is different from the plurality of bond points, and, in a state in which the tension applied by the tension application unit is released and the clamp by the clamp unit is released, the bonding tool is raised to pay out the wire tail from the second bond point.

2. The wire bonding apparatus of claim 1, wherein the detection unit detects whether or not the wire tail protrudes from the tip of the bonding tool, and the control unit performs the re-paying of the wire tail at the second bond point in the tail re-paying process when the detection unit detects that the wire tail is not protruding from the tip of the bonding tool.

3. The wire bonding apparatus of claim 1, wherein the detection unit detects whether or not the wire tail protrudes from the tip of the bonding tool, and the control unit further executes a first protrusion length determination process for determining whether or not the length by which the wire tail protrudes from the tip of the bonding tool is longer than a first length when the detection unit detects that the wire tail protrudes from the tip of the bonding tool, and a bonding process for performing bonding of the wire at the second bond point in accordance with the first determination result determined in the first protrusion length determination process.

4. A wire bonding apparatus as described in claim 3, wherein the control unit further performs a tail bending process of inserting a part of the wire tail into the hole and bending the wire tail at a predetermined angle when the first protrusion length determination process detects that the first protrusion length is longer than the first length, and in the bonding process, bonding is performed at the second bond point at the bent portion of the wire tail bent in the tail bending process.

5. A wire bonding apparatus as described in claim 3, wherein the control unit further performs a tail bending process of bending the wire tail in the sacrificial bond region when the first protrusion length determination process detects that the length is longer than the first length, and in the bonding process, bonding is performed at the second bond point at the bent portion of the wire tail bent in the tail bending process.

6. The wire bonding apparatus of claim 3, wherein the control unit further executes a second protrusion length determination process to determine whether the length by which the wire tail protrudes from the tip of the bonding tool is longer than a second length if the first protrusion length determination process detects that the length is shorter than the first length, and in the bonding process, bonds the wire at the second bond point in accordance with the second determination result determined in the second protrusion length determination process.

7. The wire bonding apparatus of claim 6, wherein the control unit further performs a tail bending process to bend the wire tail in a sacrificial bond area including the second bond point if the second protrusion length determination process determines that the protrusion length is longer than the second length, and in the bonding process, bonds the bent portion of the wire tail bent in the tail bending process at the second bond point.

8. The wire bonding apparatus of claim 6, wherein, when the second protrusion length determination process determines that the protrusion length is shorter than the second length, in the bonding process, the control unit contacts the wire tail near the second bond point in a sacrificial bond area including the second bond point, and bends the wire tail while bonding the bent portion of the wire tail to the second bond point.

9. The wire bonding apparatus of claim 1, wherein the control unit further executes the following steps: after executing the tail re-payout step, the control unit detects the protruding state of the wire tail on the bonding tool in the detection unit; and if the re-tail detection step detects that the wire tail is not protruding from the tip of the bonding tool, the control unit further executes a bonding step of bonding the wire at the second bond point, and a recovery determination step of determining whether the number of times the tail re-payout step and the re-tail detection step have been repeatedly executed exceeds a threshold value.

10. A wire bonding apparatus as described in any one of claims 1 to 9, wherein the control unit further executes a first bonding process of bonding the wire at the tip of the bonding tool to a predetermined bond point among the multiple bond points, and a wire looping process of looping the wire from the predetermined bond point toward the first bond point after executing the first bonding process.

11. A wire bonding apparatus as described in any one of claims 1 to 10, wherein the bonding process includes forming a wire at a tip of the bonding tool into a ball shape and bonding the ball-shaped wire to the first bond point.

12. A recovery method performed by a wire bonding apparatus that performs wire bonding processing on a plurality of bond points on a bonding target, the wire bonding apparatus comprising: a bonding tool for inserting a wire; a tension applying section provided on the wire supply side of the bonding tool for applying tension to the wire; a clamp section provided on the wire supply side of the bonding tool for holding the wire; a control section that executes a bonding process for paying out the wire inserted into the bonding tool and joining it to a first bond point which is a bond point on a bonding target, and a forming process for cutting the wire while holding the wire by the clamp section to form a wire tail in which the wire extends from the tip of the bonding tool; and a detection section that detects a state of the wire tail, the recovery method comprising: a determination process for determining whether the state of the wire tail detected by the detection section is such that a next bonding process can be performed; a tail re-payout process in which, when it is determined that the bonding process cannot be performed, the bonding tool is used to press the wire tail against a second bond point that is different from the plurality of bond points, and, in a state in which the tension applied by the tension application unit is released and the clamping by the clamping unit is released, the bonding tool is raised to pay out the wire tail from the second bond point.

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