Gluing parameter optimization method of 703 silica gel for lens bonding

Abstract

703 silica gel is one-component room temperature vulcanized silica gel with good adhesion, high strength and no corrosion, and is suitable for adhesion of precision optical lenses. The invention provides a cementing parameter optimization method of 703 silica gel for lens bonding, and aims to meet the cementing process requirements of optical lenses. The method comprises the following steps: measuring the cementing stress and the adhesive layer breaking stress value of 703 silica gel, and adopting a multivariate data fitting analysis method to respectively obtain quantitative rules between the cementing stress and the technological parameters and between the adhesive layer breaking stress value and the technological parameters. And optimizing the process parameters by taking the condition that the breaking stress value of the glue layer meets the strength requirement as a boundary condition and taking the minimum gluing stress as a target, so as to obtain a process parameter combination with the minimum gluing stress. Compared with the prior art, the method has the advantages that the quantitative relation between the cementing stress and the cementing process parameters and between the cementing damage stress value and the cementing process parameters is established, the application range of the method is widened, the process applicability of 703 silica gel in the aspect of optical device bonding is improved, and the cementing assembly precision and performance of optical precise instruments are improved.

Description

Technical Field

[0001] The present application relates to a method for optimizing bonding parameters of 703 silicone rubber for lens bonding, and belongs to the technical field of mechanical manufacturing. Background Art

[0002] Optical precision instruments are widely used in many fields such as missiles, aircraft, satellites, etc. They are an important precision structure in the aerospace field, realizing all-weather real-time reconnaissance, weak target detection, high-resolution target identification, fire control aiming, assisted flight, information confrontation and other needs. The accuracy and performance stability of optical precision instruments determine the stability and reliability of weapon systems. In the manufacturing process of optical lenses, bonding between precision lenses and lenses is essential. Gluing can firmly bond lenses together to ensure the stability and optical performance of the lens structure. The quality of the lens is a key factor affecting the imaging quality.

[0003] Micro-bonding is a common assembly method for most optical lenses. This method uses optical structural adhesives with relatively small elastic modulus to connect optical lenses and their corresponding supporting structures to provide sufficient mechanical strength in a vibrating environment or an environment with temperature changes, thereby ensuring the stability of the optical lens's posture. Bonding strength (stress when the adhesive layer is damaged) and bonding stress are the two most critical indicators of the quality of optical lens bonding assembly. If the bonding force in the adhesive layer causes excessive stress in the optical element, it may even cause cracks in the optical element and lead to failure of the optical system structure. Insufficient bonding strength prevents the optical lens from reaching its service life.

[0004] Existing research has explored the optimization methods of bonding stress, bonding strength and process parameters. In 1981, after Bayar proposed the radial bonding assembly of optical lenses, he established an optimization method for the thickness of the glue layer during radial bonding assembly. Bayar established a calculation formula for the thickness of the non-thermal bonding glue layer, which is the classic Bayar equation. This equation gives the constraint relationship between the thermodynamic material parameters and dimensions of optical lenses, glue layers, and frames. In 2012, the Changchun Institute of Optics, Fine Mechanics and Physics of the Chinese Academy of Sciences established the modified Fan Zhigang approximate equation that takes into account the geometric tolerances such as verticality and cylindricity of the bonded parts. The glue layer thickness can be effectively controlled and the bonding strength can be improved. The glue layer thickness designed according to the correction can effectively improve the assembly quality of optical lenses.

[0005] 703 silicone is a single-component room temperature vulcanized silicone with good adhesion, high strength and no corrosion. It has excellent electrical insulation, sealing and aging resistance, and can be used for a long time in the range of -50℃-250℃. It has outstanding high and low temperature resistance and aging resistance, excellent electrical insulation and moisture resistance and shock resistance, and also has excellent adhesion. It can widely bond various metals, non-metals, plastics and rubbers. It has excellent high temperature resistance and hot water resistance, and is an ideal material for sealing heat-resistant devices. It is suitable for bonding precision optical lenses. However, it is difficult to quantitatively characterize and establish a quantitative relationship between the mapping relationship between the bonding stress after bonding assembly and the non-uniform stress field in the optical lens. These problems have greatly limited the improvement of the bonding assembly accuracy and performance of optical precision instruments.

[0006] In view of this, facing the bonding process requirements of optical lenses, the present invention proposes a bonding parameter optimization method for 703 silicone for lens bonding. By measuring the bonding stress and adhesive layer failure stress values ​​of 703 silicone, the quantitative laws between the bonding stress and adhesive layer failure stress values ​​and the process parameters are obtained respectively by using multivariate data fitting analysis. Taking the adhesive layer failure stress value meeting the strength requirements as the boundary condition and the minimum bonding stress as the goal, the process parameters are optimized to obtain the process parameter combination with the minimum bonding stress. Compared with the prior art, this method establishes a quantitative relationship between the bonding stress and adhesive layer failure stress values ​​and the bonding process parameters, which helps to broaden its scope of application, improves the process applicability of 703 silicone in the bonding of optical devices, and improves the bonding assembly accuracy and performance of optical precision instruments. Summary of the invention

[0007] In order to solve the above problems, the technical solution adopted in this application is: to propose a method for optimizing the bonding parameters of 703 silicone for lens bonding, which is characterized by including the following process flow and steps.

[0008] Step 1: Install the optical glass lens and lens barrel on the bonding stress measuring device, apply glue with the bonding arc range and glue layer thickness as variable parameters, detect the bonding stress change law at the same time, measure and calculate the synthetic stress value of 703 silicone after curing.

[0009] Step 2: With the bonding arc range and the thickness of the adhesive layer as variables, the optical glass lens and lens barrel that have been bonded and cured using the above process parameters are mounted on the adhesive layer failure stress value measuring device to calculate the adhesive layer failure stress value after the 703 silicone is cured.

[0010] Step 3: Use multivariate data fitting analysis to obtain the quantitative law between bonding stress and process parameters.

[0011] Step 4: Use multivariate data fitting analysis to obtain the quantitative law between the adhesive layer failure stress value and the process parameters.

[0012] Step 5: Taking the failure stress value of the adhesive layer meeting the strength requirement as the boundary condition and the minimum bonding stress as the goal, optimize the process parameters to obtain the process parameter combination with the minimum bonding stress.

[0013] In the bonding process of optical glass lenses with a diameter of 120mm, the bonding arc range L and the adhesive layer thickness T are used as process parameter variables. The bonding arc range L is 5°, 10°, 15°, and 20°, and the adhesive layer thickness T is 0.25mm, 0.3mm, 0.35mm, and 0.4mm, respectively. Through the bonding stress measurement data and multivariate data fitting analysis, the relationship between the bonding stress σ and the process parameters (bonding arc range L and adhesive layer thickness T) is obtained as σ=0.3355-0.3463*T+0.125*T 2 -0.0118*L*T. Through the analysis of the adhesive layer failure stress value and multivariate data fitting, the relationship between the adhesive layer failure stress value S and the process parameters (bonding arc range L and adhesive layer thickness T) is obtained as S = -0.0855 + 0.111*T + 4.865*L + 1.5*L 2 -0.3552*L*T.

[0014] Compared with the prior art, the bonding parameter optimization method of 703 silicone for lens bonding proposed in the present invention establishes a quantitative relationship between bonding stress and adhesive layer failure stress value and process parameters, which helps to broaden its scope of application, improve the process applicability of 703 silicone in optical device bonding, and enhance the bonding assembly accuracy and performance of optical precision instruments. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A flow chart of the 703 silicone bonding process parameter optimization method provided by the present invention;

[0017] Figure 2 A schematic top view of a device for measuring 703 silicone adhesive stress provided by the present invention;

[0018] Figure 3 It is a front view schematic diagram of a device for measuring 703 silicone adhesive stress provided by the present invention;

[0019] Figure 4 This is a schematic diagram of a device for measuring the breaking stress value of the adhesive layer after curing of the 703 silicone provided by the present invention;

[0020] Figure 5 It is a schematic diagram of the bonding parameter model established by the bonding stress and the adhesive layer failure stress value of the present invention;

[0021] Figure 6 for Figure 5 Schematic diagram of the process parameter combination that minimizes bonding stress in the model;

[0022] Explanation of symbols in the figure

[0023] 1-measuring platform, 2-loading module, 3-force measuring module, 4-lens barrel, 201-loading rod, 202-spring, 203-connecting block, 301-pressing block, 302-pressure sensor, 303-signal collector, 304-industrial computer, 305-power supply, 5-measuring platform, 6-loading rod, 7-sensor module, 8-connecting plate, 701-sensor, 702-signal collector, 703-industrial computer, 704-power supply DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0025] The present invention proposes a method for optimizing the bonding parameters of 703 silicone for lens bonding, and the relevant process flow and steps are as follows, see Figure 1 .

[0026] Step S1: Install the optical glass lens and lens barrel on a bonding stress measurement platform, use the bonding arc range and the adhesive layer thickness as variables, detect the bonding stress variation law, and calculate the stress value of the 703 silicone after curing.

[0027] See also Figure 2 and Figure 3 The silicone adhesive stress measurement device consists of a measuring platform 1, a loading module 2, a force measuring module 3, and a lens barrel 4. The optical glass lens is installed inside the lens barrel 4, and the two are connected by 703 silicone. Among them, the loading module 2, the force measuring module 3 and the lens barrel 4 are fixed on the measuring platform 1. The lens barrel 4 is in direct contact with the force measuring module 3.

[0028] The force measuring module 3 is composed of a pressure block 301, a pressure sensor 302, a signal collector 303, an industrial computer 304 and a power supply 305. The pressure sensor 302 is connected to the pressure block 301, and the pressure block 301 is directly in contact with the lens barrel 4. The power supply 305 supplies power to the system, and the signal collector 303 is used to transmit the signal of the pressure sensor to the industrial computer 304 for recording and storage.

[0029] The loading module 2 is composed of a loading rod 201, a spring 202 and a connecting block 203. The loading force is controlled by adjusting the screw-in distance through the precision thread on the loading rod 201 to push the connecting block 203 to ensure that the pressure block 301 in the force measuring module 3 maintains contact with the lens barrel 4.

[0030] Step S2: With the bonding arc range and the adhesive layer thickness as variables, the optical glass lens and the lens barrel bonded using the above process parameters are respectively mounted on the adhesive layer failure stress value measuring device to calculate the adhesive layer failure stress value after the 703 silicone is cured.

[0031] See also Figure 4 , the device for measuring the destructive stress value of the adhesive layer after 703 silicone curing is composed of a measuring platform 5, a loading rod 6, a sensor module 7 and a connecting plate 8. Among them, the sensor module 7 is fixed on the measuring platform 5 and is used to detect pressure. It is loaded to the center of the optical glass through the loading rod 6, and the pressure change is detected by the sensor module 7. When the pressure suddenly changes, the pressure value at this time is recorded. The destructive stress value of the adhesive layer is calculated. The sensor module 7 is composed of a sensor 701, a signal collector 702, an industrial computer 703 and a power supply 704. Among them, the sensor 701 transmits the signal to the industrial computer 703 through the signal collector 702 for recording and storage, and the power supply 704 supplies power to the sensor module 7.

[0032] Step 3. Use multivariate data fitting analysis to obtain the quantitative law between bonding stress and process parameters, see Figure 5 (a). In the bonding process of optical glass lenses with a diameter of 120 mm, the bonding arc range L and the adhesive layer thickness T are used as process parameter variables. The bonding arc range L is 5°, 10°, 15°, and 20°, and the adhesive layer thickness T is 0.25 mm, 0.3 mm, 0.35 mm, and 0.4 mm, respectively. Through the bonding stress measurement data and multivariate data fitting analysis, the quantitative relationship between the bonding stress σ and the bonding arc range L and the adhesive layer thickness T is obtained as σ=0.3355-0.3463*T+0.125*T 2 -0.0118*L*T.

[0033] Step 4. Use multivariate data fitting analysis to obtain the quantitative law between the adhesive layer failure stress value and the process parameters. Figure 5(b). In the bonding process for optical glass lenses with a diameter of 120 mm, the bonding arc range L and the adhesive layer thickness T are used as process parameter variables. The bonding arc range L is 5°, 10°, 15°, and 20°, and the adhesive layer thickness T is 0.25mm, 0.3mm, 0.35mm, and 0.4mm, respectively. By measuring the adhesive layer failure stress value data and performing multivariate data fitting analysis, the quantitative relationship between the adhesive layer failure stress value S and the bonding arc range L and the adhesive layer thickness T is obtained as S=-0.0855+0.111*T+4.865*L+1.5*L 2 -0.3552*L*T.

[0034] Step 5. The bonding parameter model is established based on the measured values ​​of bonding stress and adhesive layer failure stress. With the adhesive layer failure stress value meeting the strength requirement as the boundary condition and the minimum bonding stress as the goal, the process parameters are optimized to obtain the process parameter combination with the minimum bonding stress.

[0035] The steps for determining the process parameter combination are:

[0036] (1) In the relationship model between the adhesive layer failure stress value and the process parameters, the given target adhesive layer failure stress value S0 is used as the benchmark to determine the parameter range and parameter combination of S>S0. Figure 6 (a).

[0037] (2) Within the above parameter range, the process parameter combination corresponding to the minimum value of the bonding stress is calculated based on the established relationship model between the bonding stress and the process parameters.

[0038] (3) The above parameter combination is determined as the optimal process parameters for 703 silicone adhesive bonding process, see Figure 6 (b).

[0039] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. The present invention proposes a method for optimizing bonding parameters of 703 silicone for lens bonding, which is characterized by The process steps include: Step 1: Install the optical glass lens and lens barrel on the bonding stress measuring device, apply glue with the bonding arc range and glue layer thickness as variable parameters, detect the bonding stress change law at the same time, measure and calculate the synthetic stress value of 703 silicone after curing; Step 2: With the bonding arc range and the adhesive layer thickness as variables, the optical glass lens and the lens barrel bonded and cured using the above process parameters are mounted on the adhesive layer failure stress value measuring device to calculate the adhesive layer failure stress value after the 703 silicone is cured; Step 3: Use multivariate data fitting analysis to obtain the quantitative law between bonding stress and process parameters; Step 4: Use multivariate data fitting analysis to obtain the quantitative law between the failure stress value of the adhesive layer and the process parameters; Step 5: Taking the failure stress value of the adhesive layer meeting the strength requirement as the boundary condition and the minimum bonding stress as the goal, optimize the process parameters to obtain the process parameter combination with the minimum bonding stress.

2. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding according to claim 1, characterized in that: The silicone adhesive stress measuring device is composed of a measuring platform, a loading module, a force measuring module and a lens barrel. The loading module, the force measuring module and the lens barrel are fixed on the measuring platform, and the lens barrel is in direct contact with the force measuring module.

3. The method for optimizing bonding parameters of 703 silica gel for lens bonding according to claim 2, characterized in that: The force measuring module is composed of a pressure block, a pressure sensor, a signal collector, an industrial computer and a power supply, wherein the pressure sensor is connected to the pressure block, the pressure block is in direct contact with the lens barrel, the power supply supplies power to the system, and the signal collector is used to transmit the signal of the force sensor to the industrial computer for recording and storage.

4. The method for optimizing bonding parameters of 703 silica gel for lens bonding according to claim 2, characterized in that: The loading module is composed of a loading rod, a spring and a connecting block. The connecting block is pushed by adjusting the screw-in distance through the precise thread on the loading rod.

5. The method for optimizing bonding parameters of 703 silica gel for lens bonding according to claim 1, characterized in that: The adhesive layer failure stress value measuring device is composed of a measuring platform, a loading rod, a sensor module and a connecting plate, wherein the sensor module is fixed on the measuring platform and loaded to the center of the optical glass through the loading rod. At the same time, the sensor module is used to detect pressure changes. The sensor module is composed of a sensor, a signal collector, an industrial computer and a power supply.

6. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding as claimed in claim 1 is characterized in that: In step 3, the multivariate data fitting analysis method is used to obtain the quantitative law between bonding stress and process parameters. In the bonding process of optical glass lenses with a diameter of 120 mm, the bonding curvature range and the thickness of the adhesive layer are used as process parameter variables.

7. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding as claimed in claim 6 is characterized in that: The bonding arc range L is 5°, 10°, 15°, and 20°, and the adhesive layer thickness T is 0.25 mm, 0.3 mm, 0.35 mm, and 0.4 mm, respectively. By measuring the bonding stress data and performing multivariate data fitting analysis, the quantitative relationship between the bonding stress σ and the bonding arc range L and the adhesive layer thickness T is obtained as σ=0.3355-0.3463*T+0.125*T 2 -0.0118*L*T.

8. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding as claimed in claim 1 is characterized in that: In step 4, the multivariate data fitting analysis method is used to obtain the quantitative law between the adhesive layer failure stress value and the process parameters. In the bonding process of an optical glass lens with a diameter of 120 mm, the bonding arc range L and the adhesive layer thickness T are used as process parameter variables.

9. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding as claimed in claim 8 is characterized in that: The bonding arc range L is 5°, 10°, 15°, and 20°, respectively, and the adhesive layer thickness T is 0.25 mm, 0.3 mm, 0.35 mm, and 0.4 mm, respectively. By measuring the adhesive layer failure stress value data and performing multivariate data fitting analysis, the quantitative relationship between the adhesive layer failure stress value S and the bonding arc range L and the adhesive layer thickness T is obtained as S=-0.0855+0.111*T+4.865*L+1.5*L 2 -0.3552*L*T.

10. The method for optimizing bonding parameters of 703 silicone rubber for lens bonding as claimed in claim 1 is characterized in that: In step 5, the process parameter combination determination steps are: S1: In the relationship model between the stress value of adhesive layer failure and process parameters, the given stress value S0 of target adhesive layer failure is used as the benchmark to determine the parameter range and parameter combination of S>S0; S2: within the above parameter range, according to the established bonding stress and process parameter relationship model, calculate the parameter combination corresponding to the minimum bonding stress; S3: Determine the above parameter combination as the optimal process parameters for the 703 silicone bonding process.

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