Housing and electronic device comprising same

Abstract

In an electronic device comprising a housing, according to one embodiment of the present disclosure, the housing includes a first region having a first reflectivity and a second region having a second reflectivity, which is different from the first reflectivity, wherein: the first region includes a substrate, a first optical coating layer disposed on the substrate, a photon absorption layer disposed on the first optical coating layer, and a second optical coating layer disposed on the photon absorption layer; the second region includes the substrate and the first optical coating layer; the first optical coating layer is formed by alternately stacking a first material having a first refractive index and a second material having a second refractive index, which is different from the first refractive index; and the second optical coating layer is formed by alternately stacking a third material having a third refractive index and a fourth material having a fourth refractive index, which is different from the third refractive index.

Description

Housing and electronic device including the same

[0001] One embodiment disclosed in this document relates to a housing and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, calendar management, or even electronic wallets are being integrated into a single electronic device. These electronic devices are becoming miniaturized for convenient portability. As the carrying and use of miniaturized or thin mobile devices, such as smartphones, becomes more common, user demands for the external design of these devices may become more sophisticated and diverse.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device including a housing according to one embodiment of the present disclosure may include a first region having a first reflectivity and a second region having a second reflectivity different from the first reflectivity. The first region may include a substrate, a first optical coating layer disposed on the substrate, a photon absorbing layer disposed on the first optical coating layer, and a second optical coating layer disposed on the photon absorbing layer. The second region may include the substrate and the first optical coating layer. The first optical coating layer may include a first material having a first refractive index and a second material having a second refractive index different from the first refractive index, which may be alternately laminated. The second optical coating layer may include a third material having a third refractive index and a fourth material having a fourth refractive index different from the third refractive index, which may be alternately laminated.

[0006] An electronic device including a housing according to one embodiment of the present disclosure may include a substrate, a plurality of optical coating layers disposed on the substrate, and a photon absorbing layer disposed between a first optical coating layer and a second optical coating layer constituting the plurality of optical coating layers. The housing may include a first region including the substrate, the first optical coating layer, the photon absorbing layer, and the second optical coating layer and having a first reflectivity, and a second region excluding at least a portion of the first region and having a second reflectivity different from the first reflectivity.

[0007] A method for processing a housing including a first region and a second region having different reflectivities according to one embodiment of the present disclosure includes a first vapor deposition process for forming a first optical coating layer on a substrate, a second vapor deposition process for forming a photon-absorbing layer on the first optical coating layer, a third vapor deposition process for forming a second optical coating layer on the photon-absorbing layer, and a selective etching process for removing the photon-absorbing layer and the second optical coating layer with respect to the second region of the housing, wherein the selective etching process can irradiate a laser of a specific wavelength to the second region.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0010] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment disclosed in this document.

[0011] FIG. 4A is a front view of an electronic device in an exploded perspective view according to one embodiment disclosed in this document.

[0012] FIG. 4b is an exploded perspective view showing a rear side of an electronic device according to one embodiment disclosed in this document.

[0013] FIG. 5 is a cross-sectional view schematically showing a portion of a first region of a housing of the electronic device of FIG. 3 taken along line A-A' according to one embodiment disclosed in the present document.

[0014] FIG. 6 is a cross-sectional view showing a first region and a second region of a housing according to one embodiment disclosed in this document.

[0015] FIG. 7 is a cross-sectional view showing a first region of a housing according to one embodiment disclosed in this document.

[0016] FIG. 8 is a cross-sectional view showing a housing including a protective coating layer according to one embodiment disclosed in this document.

[0017] FIG. 9 is a drawing showing a method for processing a housing including a first region and a second region having different reflectivities according to one embodiment disclosed in this document.

[0018] FIG. 10 is a drawing showing a state in which a laser is irradiated according to a selective etching process on a housing according to one embodiment disclosed in this document.

[0019] FIGS. 11 and 12 are photographs showing the difference between a first region and a second region of a housing according to one embodiment disclosed in this document.

[0020] FIG. 13 is an experimental example showing a state in which a second area of ​​a housing according to an embodiment disclosed in this document is irradiated with a laser according to a selective etching process, and a photograph showing an enlarged cross-section.

[0021] FIG. 14 is a cross-sectional photograph showing the difference between the first region and the second region of the housing according to one embodiment disclosed in this document.

[0022] FIG. 15 is a cross-sectional view showing at least a portion of a housing according to one embodiment disclosed in this document.

[0023] FIG. 16 is a cross-sectional view showing at least a portion of a housing according to one embodiment disclosed in this document.

[0024] FIG. 17 is a cross-sectional view showing at least a portion of a housing according to one embodiment disclosed in this document.

[0025] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0026] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0027] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0028] Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory or an external memory) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0029] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0030] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0031] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] FIG. 2 is a perspective view showing the front of an electronic device (101) according to one embodiment disclosed in this document.

[0055] FIG. 3 is a perspective view showing the rear side of an electronic device (101) according to one embodiment disclosed in this document.

[0056] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0057] In one embodiment, the first side (110A) may be formed by a front plate (122) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (122) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In one embodiment, the front plate (122) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (122) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (122)) at one edge of the first surface (110A). In one embodiment, the front plate (122) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (122) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0059] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (124), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (128), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0060] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (122)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (122) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (122). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (122) may be formed to be substantially the same.

[0061] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (115), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0062] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0063] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (124) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (124).

[0064] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0065] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0066] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0067] According to one embodiment, the connector hole (e.g., the first connector hole (128), the second connector hole (109)) may include a first connector hole (128) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (102) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0068] FIG. 4A is a front view of an electronic device (101) in an exploded perspective view according to one embodiment disclosed in this document.

[0069] FIG. 4b is an exploded perspective view showing the rear side of an electronic device (101) according to one embodiment disclosed in this document.

[0070] Referring to FIGS. 4A and 4B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 , or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (122) of FIG. 2 ), a display (230) (e.g., the display (115) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0071] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0072] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0073] In one embodiment, the first support member (211) and the side structure (210) may be combined to be referred to as a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0074] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0075] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0076] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0077] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board not shown. For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board not shown or the lower support member (260b) may be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (128), the second connector hole (109)) of FIG. 2.

[0078] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0079] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0080] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0081] FIG. 5 is a cross-sectional view schematically showing a portion of a first region of a housing of the electronic device of FIG. 3 taken along line A-A' according to one embodiment disclosed in the present document.

[0082] FIG. 6 is a cross-sectional view showing a first region (300a) and a second region (300b) of a housing (300) according to one embodiment disclosed in this document.

[0083] Referring to FIGS. 5 and 6, the housing (300) of the electronic device (101) may include a base film (310), a substrate (320), a first optical coating layer (330), a photon absorbing layer (340), and a second optical coating layer (350). The configuration of the housing (300) of FIGS. 5 and 6 may be the same as all or part of the configuration of the housing (300) of FIGS. 2 to 4. The structure of FIGS. 5 and 6 may be optionally combined with the structure of FIGS. 2 to 4.

[0084] According to one embodiment, the housing (300) may include a substrate (320) to protect internal components of the electronic device (electronic device (101) of FIG. 2) from external impact. According to one embodiment, the substrate (320) may be a transparent material that allows light to pass through. According to one embodiment, the substrate (320) may be an amorphous substrate or a crystalline substrate. For example, the amorphous substrate (320) may be formed of glass, a polymer film, or a polymer plastic, and the polymer film may include at least one of polyimide, polyethylene terephthalate (PET), or other polymer materials. For example, the crystalline substrate (320) may include at least one of sapphire, magnesium aluminate spinel (MgAl2O4), and a silicon ingot. According to one embodiment, since the substrate (320) is optically transparent, the aesthetic effects according to the color and / or texture of each of the multiple layers constituting the housing (300) may be superimposed and appear in a complex manner.

[0085] According to one embodiment, the housing (300) may include a first optical coating layer (330) disposed on a substrate (320). According to one embodiment, the first optical coating layer (330) may be formed by alternately laminating two different materials having different refractive indices. When light incident from the outside passes through the first optical coating layer (330), a constructive or destructive interference phenomenon of wavelengths occurs due to the difference in refractive indices between the different materials, and a reflectivity or color tone caused by the constructive or destructive interference phenomenon of wavelengths may be visually revealed to the outside. According to one embodiment, the first optical coating layer (330) may be a transparent material that allows light to pass through. According to one embodiment, the first optical coating layer (330) may be manufactured by a deposition method.

[0086] According to one embodiment, the housing (300) may include a second optical coating layer (350) disposed on a first optical coating layer (330). According to one embodiment, the second optical coating layer (350) may be formed by alternately laminating two different materials having different refractive indices. When light incident from the outside passes through the first optical coating layer (330), a constructive or destructive interference phenomenon of wavelengths occurs due to the difference in refractive indices between the different materials, and a reflectivity or color tone caused by the constructive or destructive interference phenomenon of wavelengths may be visually revealed to the outside. According to one embodiment, the second optical coating layer (350) may be manufactured by a deposition method.

[0087] According to one embodiment, the housing (300) according to the present invention may include a photon absorbing layer (340) between the first optical coating layer (330) and the second optical coating layer (350) to facilitate de-filming and / or removal of at least a portion of the first optical coating layer (330) and the second optical coating layer (350). The reason for including the photon absorbing layer (340) between the first optical coating layer (330) and the second optical coating layer (350) is to selectively detach the second optical coating layer (350) together with the photon absorbing layer (340) by reacting with the kinetic energy of photons irradiated for selective de-filming of the second optical coating layer (350) constituting the housing (300) after being incident on the surface of the housing (300).

[0088] According to one embodiment, the photon absorbing layer (340) may be a single layer. According to one embodiment, the photon absorbing layer (340) may be in the form of a compound containing nitrogen or oxygen to reduce the difference in refractive index between adjacent interfaces since the loss of the incident light amount during the medium transmission process must be small. According to one embodiment, the photon absorbing layer (340) may be composed of a material having a low extinction coefficient (k). For example, the extinction coefficient (k) of the photon absorbing layer (340) may be 0.01 or more and 0.5 or less. For example, the extinction coefficient (k) of the photon absorbing layer (340) may be 0.01 or more and 0.387 or less.

[0089] According to one embodiment, the photon absorbing layer (340) is composed of a single component and may be a transparent material that allows light to pass through. For example, the photon absorbing layer (340) may be a silicon (Si) or aluminum (Al)-based compound. For example, it may include at least one of optically transparent silicon or aluminum. According to one embodiment, the thickness of the photon absorbing layer (340) may be 10 nm or more and 500 nm or less. For example, when the thickness of the photon absorbing layer (340) is 10 nm, substantially effective photon absorption may occur. For example, when the thickness of the photon absorbing layer (340) is 500 nm or more, an optical distortion phenomenon may occur, which may reduce the photon absorption effect.

[0090] In one embodiment, the housing (300) may include a base film (310) exhibiting a specific color and gloss. For example, the base film (310) may include at least one of a shatterproof film or a color film configured to highlight a design appearance. Referring to FIG. 5 , the base film (310) may be positioned below the substrate (320), but the position of the base film is not limited thereto and may be variously designed and changed. This is to implement a specific color and gloss aesthetically, and may be selectively removed depending on the color and design applied to the product.

[0091] According to one embodiment, the housing (300) may substantially correspond to the second surface (or rear surface (110B of FIG. 2), or rear plate (111 of FIG. 2)) of FIGS. 2 to 3. However, the rear surface of the housing (300) according to FIGS. 2 to 3 is not limited to the rear surface, and may be designed in various ways.

[0092] According to one embodiment, the housing (300) according to the present invention may be formed to have two or more optical characteristics (e.g., reflectivity, color). According to one embodiment, the housing (300) may include a first region (300a) having a first reflectivity, and a second region (300b) having a second reflectivity different from the first reflectivity. This is to implement a housing (300) having two or more reflectivities and to construct an aesthetically pleasing housing (300) through two or more optical interference effects.

[0093] According to one embodiment, the first region (300a) may be formed by laminating the aforementioned substrate (320), the first optical coating layer (330), the photon absorbing layer (340), and the second optical coating layer (350). According to one embodiment, the second region (300b) may be formed by removing at least a portion of the housing (300) included in the first region (300a). For example, the second region (300b) may be formed by the aforementioned substrate (320) and the first optical coating layer (330), and the photon absorbing layer (340) and the second optical coating layer (350) may be removed.

[0094] According to one embodiment, the first region (300a) may implement a first reflectivity and a first color by optical characteristics expressed by the first optical coating layer (330) and the second optical coating layer (350). For example, the first reflectivity may be 10% or more. For example, the first color may have a color coordinate value of 2 or more. Here, the color coordinate value may be defined as a color coordinate in the CIELAB space. The color coordinate in CIELAB is expressed as L*, a*, and b*, and L* may be a three-dimensional coordinate representing brightness, a* the degree of red and green, and b* the degree of yellow and blue. The color coordinate value in CIELAB may be a value calculated as root (a*^2 + b*^2), which is the intensity of the color tone expressed as a distance value from the origin on the CIELAB color coordinate.

[0095] Since the second optical coating layer (350) has been removed, the second region (300b) may exhibit a second reflectivity different from the first reflectivity and a second color tone different from the first color tone due to the optical characteristics expressed by the first optical coating layer (330). For example, the second reflectivity may differ by 2% or more from the first reflectivity. The second reflectivity may be dependent on the first reflectivity. For example, when the first reflectivity is 10%, the second reflectivity may be 0 to 8% or 12% to 100%. For example, when the first reflectivity is 12%, the second reflectivity may be 0 to 10% or 14% to 100%. For example, the second color may differ by 2 or more in color coordinate values ​​from the first color. The second color may be dependent on the first color. For example, if the color coordinate value of the first color is 2, the color coordinate value of the second color may be 0 or less, or 4 or greater. For example, if the color coordinate value of the first color is 4, the color coordinate value of the second color may be 2 or less, or 6 or greater.

[0096] FIG. 7 is a cross-sectional view showing a first region (300a) of a housing (300) according to one embodiment disclosed in this document.

[0097] Referring to FIG. 7, the housing (300) of the electronic device (101) may include a substrate (320), a first optical coating layer (330), a photon absorbing layer (340), and a second optical coating layer (350). The configuration of the housing (300) of FIG. 7 may be the same as all or part of the configuration of the housing (300) of FIGS. 2 to 6. The structure of FIG. 7 may be optionally combined with the structures of FIGS. 5 to 6.

[0098] According to one embodiment, the first optical coating layer (330) may be formed by alternately stacking two different materials having different refractive indices. For example, the first optical coating layer (330) may be formed by alternately stacking a first material (331) having a first refractive index and a second material (332) having a second refractive index different from the first refractive index. For example, the first optical coating layer (330) may include a first material (331a) having a first refractive index, a second material (332a) having a second refractive index disposed on the first material (331a), and a first material (331b) disposed on the second material (332a). For example, the first refractive index and the second refractive index may be approximately 1.3 or more and 3.0 or less. For example, the first refractive index may differ from the second refractive index by approximately 0.1 or more. For example, the first refractive index can be designed to be approximately 0.4 or lower than the second refractive index. The optical properties of the first optical coating layer (330) can be displayed on the outside as reflection or color tones that are caused by the constructive or destructive interference phenomenon of wavelengths due to the difference in refractive indices between different materials when externally incident light passes through the housing (300) including the optical coating structure according to the present invention. According to Fig. 7, only the first region (300a) is illustrated, but this is for the convenience of explanation, and the same can be applied to the second region (300b).

[0099] According to one embodiment, the second optical coating layer (350) may be formed by alternately stacking two different materials having different refractive indices. For example, the second optical coating layer (350) may be formed by alternately stacking a third material (351) having a third refractive index and a fourth material (352) having a fourth refractive index different from the third refractive index. For example, the second optical coating layer (350) may include a third material (351a) having a third refractive index, a fourth material (352a) having a fourth refractive index disposed on the third material (351a), and a third material (351b) disposed on the fourth material (352a). For example, the third refractive index and the fourth refractive index may be approximately 1.3 or more and 3.0 or less. For example, the third refractive index may differ from the fourth refractive index by approximately 0.1 or more. For example, the third refractive index may be designed to be approximately 0.4 or lower than the fourth refractive index. The optical properties of the second optical coating layer (350) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (300) including the optical coating structure according to the present invention.

[0100] FIG. 8 is a cross-sectional view showing a housing (300) including a protective coating layer (360, 370) according to one embodiment disclosed in this document.

[0101] Referring to FIG. 8, the housing (300) of the electronic device (101) may include a substrate (320), a first optical coating layer (330), a photon absorbing layer (340), a second optical coating layer (350), and protective coating layers (360, 370). The configuration of the housing (300) of FIG. 8 may be the same as all or part of the configuration of the housing (300) of FIGS. 2 to 7. The structure of FIG. 8 may be optionally combined with the structures of FIGS. 5 to 7.

[0102] In one embodiment, the housing (300) may further include a protective coating layer (360, 370) on the second optical coating layer (350). For example, the housing (300) may further include a first protective coating layer (360) having high hardness on the second optical coating layer (350). For example, the housing (300) may further include a stain resistant and / or scratch resistant second protective coating layer (360) for preventing or reducing contamination on the second optical coating layer (350). For example, the housing (300) may further include a first protective coating layer (360) on the second optical coating layer (350), and a second protective coating layer (360) on the first protective coating layer (360). Even if the housing (300) includes a first protective coating layer (360) and / or a second protective coating layer (360), selective stripping of the second region (300b) may be possible because it includes a photon absorbing layer.

[0103] FIG. 9 is a drawing showing a method for processing a housing (300) including a first region (300a) and a second region (300b) having different reflectivities according to one embodiment disclosed in the present document. FIG. 10 is a drawing showing a state in which a laser (L) is irradiated to a housing (300) according to a selective etching process (S4) according to one embodiment disclosed in the present document. FIG. 11 and FIG. 12 are photographs showing the difference between the first region (300a) and the second region (300b) of the housing (300) according to one embodiment disclosed in the present document. FIG. 13 is an experimental example showing a state in which a laser (L) is irradiated to a second region (300b) of the housing (300) according to one embodiment disclosed in the present document according to a selective etching process (S4), and a photograph showing an enlarged cross-section. FIG. 14 is a cross-sectional photograph showing the difference between the first region (300a) and the second region (300b) of the housing (300) according to one embodiment disclosed in this document.

[0104] According to one embodiment, a method for processing a housing (300) including a first region (300a) and a second region (300b) having different reflectivities may include a first vapor deposition process (S1) for forming a first optical coating layer (330) on a substrate (320), a second vapor deposition process (S2) for forming a photon absorbing layer (340) on the first optical coating layer (330), a third vapor deposition process (S3) for forming a second optical coating layer (350) on the photon absorbing layer (340), and a selective etching process for removing the photon absorbing layer (340) and the second optical coating layer (350) for the second region (300b) of the housing (300).

[0105] In one embodiment, the deposition process can be defined as a process of depositing gaseous metal particles on the surface of an object as a thin solid film of several micrometers. For example, light passes through the interface of each layer constituting a transparent housing, and the film is transmitted or reflected depending on the component and / or band of the light. This can be a method of designing an optical structure to achieve a specific color or a specific reflectivity (gloss) through the effect of overlapping (or canceling, reinforcing) between components with different optical paths.

[0106] According to one embodiment, the vapor deposition method can be divided into chemical vapor deposition (CVD) and physical vapor deposition (PVD). According to one embodiment, the first vapor deposition process (S1), the second vapor deposition process (S2), and the third vapor deposition process (S3) can be at least one of chemical vapor deposition (CVD) and physical vapor deposition (PVD). Chemical vapor deposition (CVD) can be defined as a method of forming a metal thin film by applying heat or plasma to a gaseous metal source and a gas that reacts therewith to form highly reactive radicals and causing a chemical reaction on a high-temperature substrate (e.g., substrate (320)). Physical vapor deposition (PVD) can be defined as a method of forming a metal thin film by converting energy applied to a desired metal material into kinetic energy, causing the material to move and be deposited on a substrate (e.g., substrate (320)) to form a thin film.

[0107] According to one embodiment, the first vapor deposition process (S1) can be designed to generate plasma by injecting an inert gas (e.g., Ar) in a vacuum state to form a first optical coating layer (330) on a substrate (320) and then applying a first voltage suitable for a first material (e.g., 331 of FIG. 7) or a second material (e.g., 332 of FIG. 7) to thereby form a first optical coating layer (330) on a surface of the substrate (320) as a coating thin film alternately on the surface of the substrate (320).

[0108] According to one embodiment, the second vapor deposition process (S2) can be designed to generate plasma by injecting an inert gas (e.g., Ar) in a vacuum state to form an optical absorption layer (340) on the first optical coating layer (330) and then applying a second voltage suitable for the optical absorption layer (340) so that the materials constituting the vaporized optical absorption layer (340) are alternately formed as a coating thin film on the surface of the first optical coating layer (330).

[0109] According to one embodiment, the third vapor deposition process (S3) can be designed to generate plasma by injecting an inert gas (e.g., Ar) in a vacuum to form a second optical coating layer (350) on the optical absorption layer (340) and then applying a third voltage suitable for a third material (e.g., 351 of FIG. 7) or a fourth material (e.g., 352 of FIG. 7) to thereby form a coating thin film alternately on the surface of the optical absorption layer.

[0110] According to one embodiment, the selective etching process (S4) is such that when beam energy (kinetic energy of photons) generated by a laser reaches the photon-absorbing layer (340), electrons in the photon-absorbing layer (340) are excited (the energy level of electrons moves from the valence band to the conduction band) by the photon kinetic energy, thereby instantaneously heating / expanding in volume, and then transitioning to a lower energy level to release / cool heat energy. Through this thermal shock process, the photon-absorbing layer (340) is interfacially separated from the adjacent first optical coating layer (330), and can be selectively detached together with the second optical coating layer (350) forming the outer surface based on the photon-absorbing layer (340). Equipment capable of providing beam energy for selectively removing at least a portion of the housing (300) may include an exposure device and a metal mask, or equipment using a laser in the ultraviolet (UV) or green band.

[0111] According to one embodiment, the photon absorbing layer (340) may be formed of a material suitable for a vapor deposition method. According to one embodiment, the photon absorbing layer (340) may be formed of a material having a lower energy band gap than the kinetic energy of photons in the ultraviolet band (e.g., a band of less than 400 nm). For example, when the energy level of a photon in the ultraviolet band (e.g., a band of less than 400 nm) is 3.0995 eV, the energy band gap of the photon absorbing layer (340) formed by vapor deposition may be 1.12 eV or 1.68 eV, which is lower than the energy level of the photon. Accordingly, the photon absorbing layer (340) may be considered suitable for inducing an electronic excitation reaction. An electronic excitation reaction may be defined as a reaction in which electrons surrounding an atom transition to a higher energy level by absorbing a photon.

[0112] According to one embodiment, in a region where photon kinetic energy of a specific wavelength is irradiated in the second region (300b), the second optical coating layer (350) and the photon absorption layer (340) are selectively detached, thereby forming a unique reflectivity and color of only the first optical coating layer (330), thereby enabling implementation of a housing having selective reflectivity.

[0113] According to one embodiment, referring to FIG. 11, it can be confirmed that the color of the first region (300a) appears as brown or gray, and the color of the second region (300b) appears as white. According to one embodiment, referring to FIG. 12, it can be confirmed that the color of the first region (300a) appears as blue, and the color of the second region (300b) appears as yellow.

[0114] According to one embodiment, with reference to FIGS. 13 and 14, a housing sample (30) corresponding to a housing (300) may include a first region sample (30a) corresponding to a first region (300a), and a second region sample (30b) corresponding to a second region (300b) irradiated with laser (L) beam energy. The first region sample (30a) may include a substrate sample (32), a first optical coating layer sample (33), a photon absorbing layer sample (34), and a second optical coating layer sample (35). The second region sample (30b) may include a substrate sample (32), a first optical coating layer sample (33), and the photon absorbing layer sample (34) and the second optical coating layer sample (35) may be removed by the laser beam energy. The second region sample (30b), which is partially delaminated by laser beam energy irradiation, can be colored red due to the optical properties of the first optical coating layer sample (33). The first region sample (30a) can be colored aqua due to the optical properties of the first optical coating layer sample (33) and the second optical coating layer sample (35).

[0115] FIG. 15 is a cross-sectional view showing at least a portion of a housing (400) according to one embodiment disclosed in this document.

[0116] Referring to FIG. 15, the housing (400) of the electronic device (101) may include a substrate (420), a first optical coating layer (430), a first photon absorbing layer (440), a second optical coating layer (450), a second photon absorbing layer (460), and a third optical coating layer (470). The configuration of the housing (400) of FIG. 15 may be the same as all or part of the configuration of the housing (300) of FIGS. 5 to 14. The structure of FIG. 15 may be optionally combined with the structures of FIGS. 5 to 14.

[0117] According to one embodiment, the housing (400) may include a first optical coating layer (430), a second optical coating layer (450), and a third optical coating layer (470) disposed on a substrate (420). According to one embodiment, the first optical coating layer (430), the second optical coating layer (450), and the third optical coating layer (470) may be formed by alternately laminating two different materials having different refractive indices. The optical properties of the first optical coating layer (430), the second optical coating layer (450), and the third optical coating layer (470) may appear to the outside as reflection or color tones that are generated by a constructive or destructive interference phenomenon of wavelengths due to a difference in refractive indices between different materials during a process in which light incident from the outside passes through the housing (400) including the optical coating structure according to the present invention. According to one embodiment, the first optical coating layer (430), the second optical coating layer (450), and the third optical coating layer (470) may be made of a transparent material that allows light to pass through. According to one embodiment, the first optical coating layer (430), the second optical coating layer (450), and the third optical coating layer (470) may be manufactured using a deposition method.

[0118] According to one embodiment, the housing (400) according to the present invention may include a photon absorbing layer (440, 460) to facilitate functionally and / or design-wise selective de-filming and / or removal of at least a portion of the first optical coating layer (430), the second optical coating layer (450), and the third optical coating layer (470). The first photon absorbing layer (440) may be disposed between the first optical coating layer (430) and the second optical coating layer (450). The second photon absorbing layer (460) may be disposed between the second optical coating layer (450) and the third optical coating layer (470).

[0119] According to one embodiment, the housing (400) according to the present invention may be formed to have two or more optical characteristics (e.g., reflectivity, color). According to one embodiment, the housing (400) may include a first region (400a, 400c, 400e) having a first reflectivity, a 23rd region (400b) having a second reflectivity different from the first reflectivity, and a third region (400d) having a third reflectivity different from the first and second reflectivities. This is to implement a housing (400) having two or more reflectivities and to configure an aesthetically pleasing housing (400) through two or more optical interference effects.

[0120] According to one embodiment, the first region (400a, 400c, 400e) may be formed by laminating the aforementioned substrate (420), the first optical coating layer (430), the first photon absorbing layer (440), the second optical coating layer (450), the second photon absorbing layer (460), and the third optical coating layer (470). According to one embodiment, the second region (400b) may be formed by removing at least a portion of the housing (400) included in the first region (400a, 400c, 400e). For example, the second region (400b) may be formed by the aforementioned substrate (420), the first optical coating layer (430), the first photon absorbing layer (440), and the second optical coating layer (450), and the second photon absorbing layer (460) and the third optical coating layer (470) may be removed. According to one embodiment, the third region (400d) may be a region from which at least a portion of the housing (400) included in the first region (400a, 400c, 400e) is removed. For example, the third region (400d) may be composed of the aforementioned substrate (420) and the first optical coating layer (430), and the first photon absorbing layer (440), the second optical coating layer (450), the second photon absorbing layer (460), and the third optical coating layer (470) may be removed.

[0121] According to one embodiment, the first optical coating layer (430) may be formed by alternately stacking two different materials having different refractive indices. For example, the first optical coating layer (430) may be formed by alternately stacking a first material (431) having a first refractive index and a second material (432) having a second refractive index different from the first refractive index. For example, the first optical coating layer (430) may include a first material (431a) having a first refractive index, a second material (432a) having a second refractive index disposed on the first material (431a), and a first material (431b) disposed on the second material (432a). For example, the first refractive index and the second refractive index may be approximately 1.3 or more and 3.0 or less. For example, the first refractive index may differ from the second refractive index by approximately 0.1 or more. For example, the first refractive index may be designed to be approximately 0.4 or lower than the second refractive index. The optical properties of the first optical coating layer (430) may be reflected or displayed externally as a color tone due to a constructive or destructive interference phenomenon of wavelengths caused by the difference in refractive index between different materials during the process in which externally incident light passes through the housing (400) including the optical coating structure according to the present invention.

[0122] According to one embodiment, the second optical coating layer (450) may be formed by alternately stacking two different materials having different refractive indices. For example, the second optical coating layer (450) may be formed by alternately stacking a third material (451) having a third refractive index and a fourth material (452) having a fourth refractive index different from the third refractive index. For example, the second optical coating layer (450) may include a third material (451a) having a third refractive index, a fourth material (452a) having a fourth refractive index disposed on the third material (451a), and a third material (451b) disposed on the fourth material (452a). For example, the third refractive index and the fourth refractive index may be approximately 1.3 or more and 3.0 or less. For example, the third refractive index may differ from the fourth refractive index by approximately 0.1 or more. For example, the third refractive index may be designed to be approximately 0.4 or lower than the fourth refractive index. The optical properties of the second optical coating layer (450) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (400) including the optical coating structure according to the present invention.

[0123] According to one embodiment, the third optical coating layer (470) may be formed by alternately stacking two different materials having different refractive indices. For example, the third optical coating layer (470) may be formed by alternately stacking a fifth material (471) having a fifth refractive index and a sixth material (472) having a sixth refractive index different from the fifth refractive index. For example, the third optical coating layer (470) may include a fifth material (471a) having a fifth refractive index, a sixth material (472a) having a sixth refractive index disposed on the fifth material (471a), and a fifth material (471b) disposed on the sixth material (472a). For example, the fifth refractive index and the sixth refractive index may be approximately 1.3 or more and 3.0 or less. For example, the fifth refractive index may differ from the sixth refractive index by approximately 0.1 or more. For example, the fifth refractive index may be designed to be approximately 0.4 or lower than the sixth refractive index. The optical properties of the third optical coating layer (470) may be reflected or displayed externally as a color tone that is generated by a constructive or destructive interference phenomenon of wavelength due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (400) including the optical coating structure according to the present invention.

[0124] FIG. 16 is a cross-sectional view showing at least a portion of a housing (500) according to one embodiment disclosed in this document.

[0125] Referring to FIG. 16, the housing (500) of the electronic device (101) may include a substrate (520), a first optical coating layer (530), a first photon absorbing layer (540), a second optical coating layer (550), a second photon absorbing layer (560), a third optical coating layer (570), a third photon absorbing layer (580), and a fourth optical coating layer (590). The configuration of the housing (500) of FIG. 16 may be the same as all or part of the configuration of the housing (300) of FIGS. 5 to 15. The structure of FIG. 16 may be optionally combined with the structures of FIGS. 5 to 15.

[0126] According to one embodiment, the housing (500) may include a first optical coating layer (530), a second optical coating layer (550), a third optical coating layer (570), and a fourth optical coating layer (590) disposed on a substrate (520). According to one embodiment, the first optical coating layer (530), the second optical coating layer (550), the third optical coating layer (570), and the fourth optical coating layer (590) may be formed by alternately laminating two different materials having different refractive indices. The optical properties of the first optical coating layer (530), the second optical coating layer (550), the third optical coating layer (570), and the fourth optical coating layer (590) may appear on the outside as reflections or colors that are expressed as constructive or destructive interference phenomena of wavelengths due to differences in refractive indices between different materials during the process in which externally incident light passes through the housing (500) including the optical coating structure according to the present invention. According to one embodiment, the first optical coating layer (530), the second optical coating layer (550), the third optical coating layer (570), and the fourth optical coating layer (590) may be made of a transparent material that allows light to pass through. According to one embodiment, the first optical coating layer (530), the second optical coating layer (550), the third optical coating layer (570), and the fourth optical coating layer (590) may be manufactured by a deposition method.

[0127] According to one embodiment, a housing (500) according to the present invention may include a photon absorbing layer (550, 560, 580) to facilitate functionally and / or design-wise selective de-filming and / or removal of at least a portion of the first optical coating layer (530), the second optical coating layer (550), the third optical coating layer (570), and the fourth optical coating layer (590). The first photon absorbing layer (540) may be disposed between the first optical coating layer (530) and the second optical coating layer (550). The second photon absorbing layer (560) may be disposed between the second optical coating layer (550) and the third optical coating layer (570). The third photon absorbing layer (580) may be disposed between the third optical coating layer (570) and the fourth optical coating layer (590).

[0128] According to one embodiment, the housing (500) according to the present invention may be formed to have two or more optical characteristics (e.g., reflectivity, color). According to one embodiment, the housing (500) may include a first region (500a, 500c, 500e, 500g) having a first reflectivity, a second region (500b) having a second reflectivity different from the first reflectivity, a third region (500d) having a third reflectivity different from the first and second reflectivities, and a fourth region (500f) having a fourth reflectivity different from the first, second, and third reflectivities. This is to implement a housing (500) having two or more reflectivities and to configure an aesthetically pleasing housing (500) through two or more optical interference effects.

[0129] According to one embodiment, the first region (500a, 500c, 500e, 500g) may be formed by laminating the aforementioned substrate (520), the first optical coating layer (530), the first photon absorbing layer (540), the second optical coating layer (550), the second photon absorbing layer (560), and the third optical coating layer (570). According to one embodiment, the second region (500b) may be a region from which at least a portion of the housing (500) included in the first region (500a, 500c, 500e, 500g) is removed. For example, the second region (500b) may be composed of the aforementioned substrate (520), the first optical coating layer (530), the first photon absorbing layer (540), the second optical coating layer (550), the second photon absorbing layer (560), and the third optical coating layer (570), and the third photon absorbing layer (580) and the fourth optical coating layer (590) may be removed. According to one embodiment, the third region (500d) may be a region from which at least a portion of the housing (500) included in the first region (500a, 500c, 500e, 500g) is removed. For example, the third region (500d) may be composed of the aforementioned substrate (520), the first optical coating layer (530), the first photon absorbing layer (540), and the second optical coating layer (550), and the second photon absorbing layer (560), the third optical coating layer (570), the third photon absorbing layer (580), and the fourth optical coating layer (590) may be removed. According to one embodiment, the fourth region (500f) may be a region from which at least a portion of the housing (500) included in the first region (500a, 500c, 500e, 500g) is removed. For example, the fourth region (500f) is composed of the aforementioned substrate (520), the first optical coating layer (530), and the first photon absorbing layer (540), the second optical coating layer (550), the second photon absorbing layer (560), the third optical coating layer (570), the third photon absorbing layer (580), and the fourth optical coating layer (590) can be removed.

[0130] According to one embodiment, the first optical coating layer (530) may be formed by alternately stacking two different materials having different refractive indices. For example, the first optical coating layer (530) may be formed by alternately stacking a first material (531) having a first refractive index and a second material (532) having a second refractive index different from the first refractive index. For example, the first optical coating layer (530) may include a first material (531a) having a first refractive index, a second material (532a) having a second refractive index disposed on the first material (531a), and a first material (531b) disposed on the second material (532a). For example, the first refractive index and the second refractive index may be approximately 1.3 or more and 3.0 or less. For example, the first refractive index may differ from the second refractive index by approximately 0.1 or more. For example, the first refractive index may be designed to be approximately 0.5 or lower than the second refractive index. The optical properties of the first optical coating layer (530) may be reflected or displayed externally as a color tone due to a constructive or destructive interference phenomenon of wavelengths caused by the difference in refractive index between different materials during the process in which externally incident light passes through the housing (500) including the optical coating structure according to the present invention.

[0131] According to one embodiment, the second optical coating layer (550) may be formed by alternately stacking two different materials having different refractive indices. For example, the second optical coating layer (550) may be formed by alternately stacking a third material (551) having a third refractive index and a fifth material (552) having a fifth refractive index different from the third refractive index. For example, the second optical coating layer (550) may include a third material (551a) having a third refractive index, a fifth material (552a) having a fifth refractive index disposed on the third material (551a), and a third material (551b) disposed on the fifth material (552a). For example, the third refractive index and the fifth refractive index may be approximately 1.3 or more and 3.0 or less. For example, the third refractive index may differ from the fifth refractive index by approximately 0.1 or more. For example, the third refractive index may be designed to be approximately 0.5 or lower than the fifth refractive index. The optical properties of the second optical coating layer (550) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to differences in refractive indices between different materials during the process in which externally incident light passes through the housing (500) including the optical coating structure according to the present invention.

[0132] According to one embodiment, the third optical coating layer (570) may be formed by alternately stacking two different materials having different refractive indices. For example, the third optical coating layer (570) may be formed by alternately stacking a fifth material (571) having a fifth refractive index and a sixth material (572) having a sixth refractive index different from the fifth refractive index. For example, the third optical coating layer (570) may include a fifth material (571a) having a fifth refractive index, a sixth material (572a) having a sixth refractive index disposed on the fifth material (571a), and a fifth material (571b) disposed on the sixth material (572a). For example, the fifth refractive index and the sixth refractive index may be approximately 1.3 or more and 3.0 or less. For example, the fifth refractive index may differ from the sixth refractive index by approximately 0.1 or more. For example, the fifth refractive index may be designed to be approximately 0.5 or lower than the sixth refractive index. The optical properties of the third optical coating layer (570) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (500) including the optical coating structure according to the present invention.

[0133] According to one embodiment, the fourth optical coating layer (590) may be formed by alternately stacking two different materials having different refractive indices. For example, the fourth optical coating layer (590) may be formed by alternately stacking a seventh material (591) having a seventh refractive index and an eighth material (592) having an eighth refractive index different from the seventh refractive index. For example, the fourth optical coating layer (590) may include a seventh material (591a) having a seventh refractive index, an eighth material (592a) having an eighth refractive index disposed on the seventh material (591a), and a seventh material (591b) disposed on the eighth material (592a). For example, the seventh refractive index and the eighth refractive index may be approximately 1.3 or greater and 3.0 or less. For example, the seventh refractive index may differ from the eighth refractive index by approximately 0.1 or greater. For example, the seventh refractive index may be designed to be approximately 0.5 or lower than the eighth refractive index. The optical properties of the fourth optical coating layer (590) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (500) including the optical coating structure according to the present invention.

[0134] FIG. 17 is a cross-sectional view showing at least a portion of a housing (600) according to one embodiment disclosed in this document.

[0135] Referring to FIG. 17, the housing (600) of the electronic device (101) may include a substrate (620), a silicon dioxide (SiO2) layer (630), a photon absorbing layer (640), and a first optical coating layer (650). The configuration of the housing (600) of FIG. 17 may be the same as all or part of the configuration of the housing (300) of FIGS. 5 to 16. The structure of FIG. 17 may be optionally combined with the structures of FIGS. 5 to 16.

[0136] According to one embodiment, the housing (600) may include a first optical coating layer (650) disposed on a substrate (620). According to one embodiment, the first optical coating layer (650) may be formed by alternately laminating two different materials having different refractive indices. The optical properties of the first optical coating layer (650) may be reflected or colored to the outside as a reflection or color tone that is generated by a constructive or destructive interference phenomenon of wavelength due to a difference in refractive indices between different materials when light incident from the outside passes through the housing (600) including the optical coating structure according to the present invention. According to one embodiment, the first optical coating layer (650) may be a transparent material that allows light to pass through. According to one embodiment, the first optical coating layer (650) may be manufactured by a deposition method.

[0137] According to one embodiment, the housing (600) according to the present invention may include a photon absorbing layer (640) to facilitate functionally and / or design-wise selective de-filming and / or removal of at least a portion of the silicon dioxide (SiO2) layer (630) and the first optical coating layer (650). The photon absorbing layer (640) may be disposed between the silicon dioxide (SiO2) layer (630) and the first optical coating layer (650).

[0138] According to one embodiment, the housing (600) according to the present invention may be formed to have two or more optical characteristics (e.g., reflectivity, color). According to one embodiment, the housing (600) may include a first region (600a) having a first reflectivity, and a second region (600b) having a second reflectivity different from the first reflectivity. This is to implement a housing (600) having two or more reflectivities and to configure an aesthetically pleasing housing (600) through two or more optical interference effects.

[0139] According to one embodiment, the first region (600a) may be formed by stacking the aforementioned substrate (620), silicon dioxide (SiO2) layer (630), photon absorbing layer (640), and first optical coating layer (650). According to one embodiment, the second region (600b) may be formed by removing at least a portion of the housing (600) included in the first region (600a). For example, the second region (600b) may be formed by the aforementioned substrate (620), silicon dioxide (SiO2) layer (630), and the photon absorbing layer (640) and first optical coating layer (650) may be removed.

[0140] According to one embodiment, the first optical coating layer (650) may be formed by alternately stacking two different materials having different refractive indices. For example, the first optical coating layer (650) may be formed by alternately stacking a first material (651) having a first refractive index and a second material (652) having a second refractive index different from the first refractive index. For example, the first optical coating layer (650) may include a first material (651a) having a first refractive index, a second material (652a) having a second refractive index disposed on the first material (651a), and a first material (651b) disposed on the second material (652a). For example, the first refractive index and the second refractive index may be approximately 1.3 or more and 3.0 or less. For example, the first refractive index may differ from the second refractive index by approximately 0.1 or more. For example, the first refractive index may be designed to be approximately 0.6 or lower than the second refractive index. The optical properties of the first optical coating layer (650) may be reflected or colored to the outside as a phenomenon of constructive or destructive interference of wavelengths due to the difference in refractive index between different materials during the process in which externally incident light passes through the housing (600) including the optical coating structure according to the present invention.

[0141] An electronic device including a housing according to one embodiment of the present disclosure includes a first region (300a) having a first reflectivity and a second region (300b) having a second reflectivity different from the first reflectivity, wherein the first region includes a substrate (320), a first optical coating layer (330) disposed on the substrate, a photon absorbing layer (340) disposed on the first optical coating layer, and a second optical coating layer (350) disposed on the photon absorbing layer, and wherein the second region includes the substrate and the first optical coating layer, wherein the first optical coating layer is configured such that a first material having a first refractive index and a second material having a second refractive index different from the first refractive index are alternately laminated, and the second optical coating layer is configured such that a third material having a third refractive index and a fourth material having a fourth refractive index different from the third refractive index are alternately laminated.

[0142] According to one embodiment, the photon absorbing layer may include at least one of silicon and aluminum.

[0143] According to one embodiment, the extinction coefficient (k) of the material constituting the photon absorbing layer may be 0.01 or more and 0.5 or less.

[0144] According to one embodiment, the thickness of the photon absorbing layer may be 10 nm or more and 500 nm or less.

[0145] According to one embodiment, the first reflectivity may be 10% or greater, and the second reflectivity may be formed to be 2% or greater than the first reflectivity.

[0146] According to one embodiment, the first region has a first color, the second region has a second color different from the first color, the first color has a color coordinate value of 2 or more, and the second color can be formed to have a color coordinate value that is 2 or more greater than the first color.

[0147] In one embodiment, the first refractive index may be at least 0.1 lower than the second refractive index.

[0148] In one embodiment, the third refractive index may be at least 0.1 lower than the fourth refractive index.

[0149] According to one embodiment, the first refractive index, the second refractive index, the third refractive index, and the fourth refractive index may be 1.3 or more and 3.0 or less.

[0150] According to one embodiment, the housing may further include a substrate film (310) disposed below the substrate.

[0151] According to one embodiment, the housing may further include a first protective coating layer disposed on the second optical coating layer and for protecting the housing from external impact, and a second protective coating layer disposed on the first protective coating layer and including a contamination-resistant and scratch-resistant material.

[0152] An electronic device including a housing according to one embodiment of the present disclosure includes a substrate (320), a first optical coating layer (330) disposed on the substrate, and a plurality of optical coating layers (330, 350) including a second optical coating layer (350) formed on the first optical coating layer, and a photon absorbing layer (340) disposed between the first optical coating layer (330) and the second optical coating layer (350), and the housing may include the substrate, the first optical coating layer, the photon absorbing layer, and the second optical coating layer, and may include a first region (300a) having a first reflectivity and a second region (300b) having a second reflectivity that is different from the first reflectivity and is at least partially excluded from the first region.

[0153] According to one embodiment, the first optical coating layer may be formed by alternately stacking a first material having a first refractive index and a second material having a second refractive index different from the first refractive index, and the second optical coating layer may be formed by alternately stacking a third material having a third refractive index and a fourth material having a fourth refractive index different from the third refractive index.

[0154] In one embodiment, the second region may be composed only of the substrate and the first optical coating layer.

[0155] According to one embodiment, the thickness of the photon absorbing layer may be 10 nm or more and 500 nm or less.

[0156] According to one embodiment, the first reflectivity may be 10% or greater, and the second reflectivity may be formed to be 2% or greater than the first reflectivity.

[0157] According to one embodiment, the first region has a first color, the second region has a second color different from the first color, the first color has a color coordinate value of 2 or more, and the second color can be formed to have a color coordinate value that is 2 or more greater than the first color.

[0158] In one embodiment, the first refractive index may be at least 0.1 lower than the second refractive index.

[0159] In one embodiment, the third refractive index may be at least 0.1 lower than the fourth refractive index.

[0160] A method for processing a housing (300) including a first region (300a) and a second region (300b) having different reflectivities according to one embodiment of the present disclosure includes a first vapor deposition process (S1) for forming a first optical coating layer (330) on a substrate (320), a second vapor deposition process (S2) for forming a photon absorbing layer (340) on the first optical coating layer, a third vapor deposition process (S3) for forming a second optical coating layer (350) on the photon absorbing layer, and a selective etching process (S4) for removing the photon absorbing layer and the second optical coating layer with respect to the second region of the housing, wherein the selective etching process may irradiate a laser of a specific wavelength to the second region (300b).

[0161] Typically, to achieve a selectively reflective coating layer on the housing of an electronic device, chemical etching and laser etching can be applied to the optical coating layer. Chemical etching can lose its characteristic optical interference effect if the glass substrate is corroded or the optical coating layer is lost. Laser etching can have minimal etching effects if the optical transparency of the coating film allows the laser to pass through without a reaction.

[0162] An electronic device according to one embodiment of the present invention can provide an aesthetically pleasing electronic device by implementing a housing having two or more reflectivities by selectively changing the reflectivity of a housing forming an exterior.

[0163] An electronic device according to one embodiment of the present invention includes a housing comprising two optical coating layers and a photon absorbing layer disposed between the two optical coating layers, wherein the overall reflection and color tone of the optical coating are implemented by overlapping the two optical coating layers, and when light of a specific wavelength is irradiated, the second optical coating layer and the photon absorbing layer are removed only in a second region of the housing, thereby having the unique reflection and color tone of the first optical coating layer, thereby implementing an optical coating having selective reflectivity.

Claims

1. In an electronic device (101) including a housing (300), The housing includes a first region (300a) having a first reflectivity, and a second region (300b) having a second reflectivity different from the first reflectivity. The above first area is, Substrate (320); A first optical coating layer (330) disposed on the above substrate; A photon absorption layer (340) disposed on the first optical coating layer; and A second optical coating layer (350) disposed on the photon absorbing layer; The second area above is, the above substrate; and Including the first optical coating layer, The first optical coating layer is configured such that a first material having a first refractive index and a second material having a second refractive index different from the first refractive index are alternately laminated, An electronic device in which the second optical coating layer is configured such that a third material having a third refractive index and a fourth material having a fourth refractive index different from the third refractive index are alternately laminated.

2. In paragraph 1, An electronic device wherein the photon absorbing layer comprises at least one of silicon and aluminum.

3. In either of paragraphs 1 and 2, An electronic device wherein the extinction coefficient (k) of the material forming the photon absorbing layer is 0.01 or more and 0.5 or less.

4. In any one of paragraphs 1 to 3, An electronic device wherein the thickness of the photon absorbing layer is 10 nm or more and 500 nm or less.

5. In any one of paragraphs 1 to 4, The above first reflectivity is 10% or more, An electronic device wherein the second reflectivity is formed to be 2% or greater than the first reflectivity.

6. In any one of paragraphs 1 to 5, The first region has a first color, and the second region has a second color different from the first color, The above first color has a color coordinate value of 2 or more, An electronic device in which the second color is formed with a color coordinate value that is at least 2 greater than that of the first color.

7. In any one of paragraphs 1 to 6, An electronic device wherein the first refractive index is at least 0.1 lower than the second refractive index.

8. In any one of paragraphs 1 to 7, An electronic device wherein the third refractive index is at least 0.1 lower than the fourth refractive index.

9. In any one of paragraphs 1 to 8, An electronic device wherein the first refractive index, the second refractive index, the third refractive index, and the fourth refractive index are 1.3 or more and 3.0 or less.

10. In any one of paragraphs 1 to 9, An electronic device wherein the housing further includes a substrate film (310) disposed under the substrate.

11. In any one of paragraphs 1 to 10, The above housing, A first protective coating layer disposed on the second optical coating layer and for protecting the housing from external impact; and An electronic device further comprising a second protective coating layer disposed on the first protective coating layer and including a contamination-resistant and scratch-resistant material.

12. A method for processing a housing (300) including a first region (300a) and a second region (300b) having different reflectivity, A first vapor deposition process (S1) for forming a first optical coating layer (330) on a substrate (320); A second vapor deposition process (S2) for forming a photon absorption layer (340) on the first optical coating layer; A third vapor deposition process (S3) for forming a second optical coating layer (350) on the photon absorbing layer; and A selective etching process (S4) for removing the photon absorbing layer and the second optical coating layer for the second region of the housing; The above-mentioned selective etching process is a processing method that irradiates a laser of a specific wavelength to the second region (300b).

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