Heat management systems for printed circuit boards

Abstract

A printed circuit board for dissipating heat. The printed circuit board includes a plurality of layers, a circuit component provided on a top side of the plurality of layers, a heat pipe provided on a top side of the circuit component, and a copper insert provided under the circuit component and through each layer of the plurality of layers.

Description

HEAT MANAGEMENT SYSTEMS FOR PRINTED CIRCUIT BOARDSRELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 509,859, filed June 23, 2023, U.S. Provisional Patent Application No. 63 / 510,444, filed June 27, 2023, U.S. Provisional Patent Application No. 63 / 513,215, filed July 12, 2023, and U.S. Provisional Patent Application No. 63 / 558,748, filed February 28, 2024, the entire content of each of which is hereby incorporated by reference.FIELD

[0002] Implementations described herein relate to printed circuit board (PCB) heat management.SUMMARY

[0003] PCBs include many electrical or circuit components mounted to it that aid in the control of a device (e.g., battery pack, power tool, battery pack charger, etc.). These circuit components can generate heat when they are in use. The generated heat may become excessive and, for example, trapped inside a dielectric substrate of the PCB, which can lead to the PCB overheating and, in some cases, the device overheating.

[0004] In high power applications, high currents pass through circuit components and different layers of the PCB. Because materials such as FR4 that are used in PCBs have low thermal conductivity (high thermal impedance), heat cannot be transferred efficiently from the PCB to ambient air. This can cause high temperature rises on circuit components and PCBs, and thus the PCB can ultimately fail. Accordingly, there is a need for a heat management system for a PCB.

[0005] Implementations described herein provide a heat management system for a PCB including dual-sided cooling technology. Specifically, a PCB including a plurality of layers, a circuit component provided on a first side of the plurality of layers, a heat pipe provided on the circuit component, and a copper insert provided under the circuit component and through each layer of the plurality of layers. For example, dual sided cooling technology includes an embedded copper insert (e.g., a coin) within the PCB and a heat pipe. The dual-sided cooling technology dissipates heat from both the top and the bottom of the PCB. Dual-sided coolingtechnology allows circuit components to be operated at high currents without thermal failures, thus, increasing the life cycle of the circuit components.

[0006] Implementations described herein provide a printed circuit board. The printed circuit board includes a plurality of layers, a circuit component provided on a first side of the plurality of layers, a heat pipe provided on the circuit component, and a copper insert provided under the circuit component and through each layer of the plurality of layers.

[0007] Implementations described herein provide an insulated metal substrate (IMS) printed circuit board (PCB) within power tool devices. The IMS PCB includes a copper layer, a dielectric layer, and an aluminum metal base. The dielectric layer is sandwiched between the copper layer and the aluminum metal base. The power tool device includes a plurality of electrical components connected to the copper layer and a metal heat pipe connected to at least one of the plurality of electrical components and extending in a direction parallel with a top surface of the IMS PCB.

[0008] Implementations described herein provide a system for cooling a PCB with a Peltier device and a heat pipe embedded heat sink. The system includes a PCB, an electrical component provided on a first side of the printed circuit board, a Peltier device provided on a second side of the PCB, and a heat pipe embedded heat sink provided below the Peltier device. The system allows an FR4 based PCB to reliably conduct high currents and the performance of electrical or circuit components provided on the FR4 based PCB to be greatly improved.

[0009] Before any implementations are explained in detail, it is to be understood that the implementations are not limited in application to the details of the configuration and arrangement of components set forth in the following description or illustrated in the accompanying drawings. The implementations are capable of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof are meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings.

[0010] In addition, it should be understood that implementations may include hardware, software, and electronic components or modules that, for purposes of discussion, may be illustrated and described as if the majority of the components were implemented solely in hardware. However, one of ordinary skill in the art, and based on a reading of this detailed description, would recognize that, in at least one implementation, the electronic-based aspects may be implemented in software (e.g., stored on non-transitory computer-readable medium) executable by one or more processing units, such as a microprocessor and / or application specific integrated circuits (“ASICs”). As such, it should be noted that a plurality of hardware and software based devices, as well as a plurality of different structural components, may be utilized to implement the implementations. For example, “servers,” “computing devices,” “controllers,” “processors,” etc., described in the specification can include one or more processing units, one or more computer-readable medium modules, one or more input / output interfaces, and various connections (e.g., a system bus) connecting the components.

[0011] Relative terminology, such as, for example, “about,” “approximately,” “substantially,” etc., used in connection with a quantity or condition would be understood by those of ordinary skill to be inclusive of the stated value and has the meaning dictated by the context (e.g., the term includes at least the degree of error associated with the measurement accuracy, tolerances [e.g., manufacturing, assembly, use, etc.] associated with the particular value, etc.). Such terminology should also be considered as disclosing the range defined by the absolute values of the two endpoints. For example, the expression “from about 2 to about 4” also discloses the range “from 2 to 4”. The relative terminology may refer to plus or minus a percentage (e.g., 1%, 5%, 10%, or more) of an indicated value.

[0012] It should be understood that although certain drawings illustrate hardware and software located within particular devices, these depictions are for illustrative purposes only. Functionality described herein as being performed by one component may be performed by multiple components in a distributed manner. Likewise, functionality performed by multiple components may be consolidated and performed by a single component. In some implementations, the illustrated components may be combined or divided into separate software, firmware and / or hardware. For example, instead of being located within and performed by a single electronic processor, logic and processing may be distributed among multiple electronic processors. Regardless of how they are combined or divided, hardware and softwarecomponents may be located on the same computing device or may be distributed among different computing devices connected by one or more networks or other suitable communication links. Similarly, a component described as performing particular functionality may also perform additional functionality not described herein. For example, a device or structure that is “configured” in a certain way is configured in at least that way but may also be configured in ways that are not explicitly listed.

[0013] Other aspects of the implementations will become apparent by consideration of the detailed description and accompanying drawings.BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 illustrates a battery pack in accordance with implementations described herein.

[0015] FIG. 2 illustrates a perspective view of the battery pack of FIG. 1 in accordance with implementations described herein.

[0016] FIG. 3 illustrates an expanded view of the battery pack of FIG. 1 in accordance with implementations described herein.

[0017] FIG. 4 is a block diagram of a controller of the battery pack of FIG. 1 in accordance with implementations described herein.

[0018] FIG. 5 illustrates a power tool in accordance with implementations described herein.

[0019] FIG. 6 is a block diagram of a controller of the power tool of FIG. 5 in accordance with implementations described herein.

[0020] FIG. 7 illustrates a battery pack charger for charging the battery pack of FIG. 1 in accordance with implementations described herein.

[0021] FIG. 8 is a block diagram of a controller of the battery pack charger of FIG. 7 in accordance with implementations described herein.

[0022] FIG. 9 illustrates a portable power supply device in accordance with implementations described herein.

[0023] FIG. 10 illustrates a block diagram of a controller for the portable power supply device of FIG. 9 in accordance with implementations described herein.

[0024] FIG. 11 illustrates a PCB with dual sided cooling technology including a heat pipe and a copper insert in accordance with implementations described herein.

[0025] FIG. 12 illustrates a PCB that does not include a heat pipe and a copper insert.

[0026] FIG. 13 illustrates a side view of an IMS PCB having a heat pipe in accordance with implementations described herein.

[0027] FIG. 14 illustrates the IMS PCB of FIG. 13 with example thermal impedance values and thickness values.

[0028] FIG. 15 illustrates an FR4 PCB with example thermal impedance values and thickness values.

[0029] FIG. 16 illustrates an example system for cooling a PCB with a Peltier device and a heat pipe embedded heat sink in accordance with implementations described herein.

[0030] FIG. 17 illustrates an example of a control system included in the system of FIG. 16 in accordance with implementations described herein.DETAILED DESCRIPTION

[0031] FIG. 1 illustrates a battery pack 100, according to some implementations. The battery pack 100 is a power tool battery pack that is generally used to power a power tool, such as power tool 400 (see FIG. 5). The battery pack 100 includes a housing 105 and an interface portion 110 for electrically connecting the battery pack 100 to a device (e.g., the power tool 400 or a battery pack charger). The housing 105 includes a top housing portion 106 and a bottom housing portion 108 that are connected to one another. In some implementations, the housing 105 may include more than two housing portions. The top housing portion 106 may include a guide 115 for receiving rails of at least one of the power tool 400 and a battery pack charger, such as battery pack charger 600 (see FIG. 7), for mechanical coupling of the battery pack 100. A latching mechanism 120 may be provided at an end of the guide 115 opposite the interface portion 110 for securing the battery pack 100 to one of the power tool 400 and the battery pack charger 600.

[0032] FIG. 2 illustrates a perspective view of the battery pack 100, according to some implementations. The battery pack 100 includes terminals 125, 130, 135, 140, 145 to connect to, for example, the power tool 400. The terminals 125, 130, 135, 140, 145 for the battery pack 100includes a positive terminal and a negative terminal to provide power to and from the battery pack 100. In some implementations, the battery pack 100 also includes data terminals to communicate with the power tool 400. For example, the battery pack 100 may include a microcontroller to monitor one or more characteristics of the battery pack 100, and the data terminals may communicate with one of the power tool 400 and the battery pack charger 600 regarding the monitored characteristics.

[0033] FIG. 3 illustrates an expanded view of the battery pack 100, according to some implementations. A battery module 205 and a printed circuit board (PCB) 210 are provided within the housing 105. The battery module 205 may be a plastic structure housing battery cells 208. The PCB 210 is provided on a top surface of the battery module 205. In some implementations, the PCB 210 is directly connected to the top surface of the battery module 205. Alternatively, in some implementations, the PCB 210 is spaced apart from the top surface of the battery module 205. In some implementations, the PCB 210 is centered on the top surface of the battery module 205. In some implementations, the PCB 210 has a width that is approximately a third of the width of the battery module. Alternatively, in some implementations, the PCB 210 extends a same width as the battery module 205. The PCB 210 has a length that, for example, extends greater than half the length of the battery pack 100. The terminals 125, 130, 135, 140, 145 are provided on the PCB 210 and protrude from the interface portion 110 of the battery pack 100. Additional circuit components are also provided on the PCB 210. The circuit components on the PCB 210 can generate heat.

[0034] The battery cells 208 provide power to the power tool 400 and receive power from the battery charger via the terminals 125, 130, 135, 140, 145. In some implementations, battery cells 208 are lithium ion battery cells. In other implementations, the battery cells 208 may be of a different chemistry, for example, nickel-cadmium, nickel-metal hydride, and the like. In the illustrated implementation, the battery pack 100 is an 18 volt battery pack. In other implementations, the output voltage level of the battery pack 100 may be different. For example, the battery pack 100 can be a 4 volt battery pack, 28 volt battery pack, 40 volt battery pack, or another voltage. The battery pack 100 may also have various capacities (e.g., 3, 4, 5, 6, 8, or 12 ampere-hours). The battery cells 208 can also generate heat within the battery pack 100.

[0035] FIG. 4 is a block diagram of a controller 300 of the battery pack 100, according to some implementations. In some implementations, the controller 300 is provided on the PCB 210. The controller 300 is electrically and / or communicatively connected to a variety of modules or components of the battery pack 100. For example, the illustrated controller 300 is connected to one or more sensors 305 (e.g., a current sensor, a voltage sensor, a speed sensor, a voltage sensor, a temperature sensor, an accelerometer, the proximity sensor, etc.), one or more indicators 310 (e.g., LEDs, tactile indicators, audible indicators, etc.), a power supply interface 315, and one or more battery cells 208 (e.g., lithium-based battery cells).

[0036] The controller 300 includes a plurality of electrical and electronic components that provide power, operational control, and protection to the components and modules within the controller 300 and / or the battery pack 100. For example, the controller 300 includes, among other things, a processing unit 320 (e.g., a microprocessor, a microcontroller, an electronic processor, an electronic controller, or another suitable programmable device), a memory 325 input units 330, and output units 335. The processing unit 320 includes, among other things, a control unit 345, an arithmetic logic unit (“ALU”) 350, and a plurality of registers 355 (shown as a group of registers in FIG. 4), and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc ). The processing unit 320, the memory 325, the input units 330, and the output units 335, as well as the various modules or circuits connected to the controller 300 are connected by one or more control and / or data buses (e g., common bus 340). The control and / or data buses are shown generally in FIG. 4 for illustrative purposes. The use of one or more control and / or data buses for the interconnection between and communication among the various modules, circuits, and components would be known to a person skilled in the art in view of the implementations described herein.

[0037] The memory 325 is a non-transitory computer readable medium and includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as a ROM, a RAM (e.g., DRAM, SDRAM, etc.), EEPROM, flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The processing unit 320 is connected to the memory 325 and executes software instructions that are capable of being stored in a RAM of the memory 325 (e.g., during execution), a ROM of the memory 325 (e g., on a generally permanent basis), or another non-transitory computer readable medium such as another memoryor a disc. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The controller 300 is configured to retrieve from the memory 325 and execute, among other things, instructions related to the control processes and methods described herein. In other constructions, the controller 300 includes additional, fewer, or different components.

[0038] The power supply interface 315 includes a combination of mechanical components (e.g., rails, grooves, latches, etc.) and electrical components (e.g., one or more terminals) configured to and operable for interfacing (e.g., mechanically, electrically, and communicatively connecting) the cells 208 of the battery pack 100 with a device (e.g., power tool 400, charger 600, etc.). For example, the power supply interface 315 is configured to receive power through a charging circuit via a power input circuit from the battery pack 100. The power supply interface 315 is also configured to communicatively connect to the controller 300 via a communications line. Accordingly, the controller 300 may control the charging of the battery pack 100 through the power supply interface 315 to a power tool. Additionally, the power supply interface 315 is also configured to output power through a discharge circuit. As such, the controller 300 may also control the output of the battery pack 100 through the power supply interface 315.

[0039] FIG. 5 illustrates a power tool 400, according to some implementations. The power tool 400 is configured to perform one or more specific tasks (e.g., drilling, fastening, pressing, impacting, etc.). For example, an impact wrench is associated with the task of generating a rotational output (e.g., to drive a fastener). The task(s) associated with a particular tool may also be referred to as the primary function(s) of the tool. The particular power tool devices 400 illustrated and described herein (e.g., an impact driver) are merely representative. Other implementations may include a variety of power tools. Power tools can include drills, circular saws, jig saws, band saws, reciprocating saws, screw drivers, angle grinders, straight grinders, hammers, multi-tools, impact wrenches, rotary hammers, impact drivers, angle drills, powered ratchets, powered torque wrenches, hydraulic pulse tools, hydraulic tensioning tools, lock bolt installation tools, reaction arm tools, riveting tools, nailers, staplers, TC bolt guns, and the like.

[0040] The power tool 400 illustrated in FIG. 5 is an impact driver. The power tool 400 includes a main body 405, a handle 410, a battery pack interface 415, an output drive device or mechanism 420, a trigger 425, a work light 430, and forward / reverse selector 435. The powertool 400 further includes a motor, such as motor 525 (see FIG. 7), within the main body 405 of the housing. The motor 525 includes a rotor and a stator. The rotor is coupled to a motor shaft arranged to produce an output outside of the housing via the output drive device or mechanism. The housing of the power tool 400 (e.g., the main body 405 and the handle 410) are composed of a durable and light-weight plastic material. The output drive device 420 is composed of a metal (e.g., steel) output spindle. The battery pack interface 415 is configured to receive and couple to the battery pack 100 that provides power to the power tool 400. The battery pack interface 415 includes a connecting structure to engage a mechanism (e.g., the guide 115 and the latching mechanism 120) that secures the battery pack 100 to the battery pack interface 415 and a terminal block to electrically connect the power tool 400 to the battery pack 100 (e.g., terminals 125, 130, 135, 140, 145). In some implementations, the power tool 400 includes a PCB, such as PCB 210 and / or PCB 1000 (see FIG. 11), or IMS PCB 1200 (see FIG. 13 and FIG. 14). In some implementations, the power tool 400 includes the system 1400 (see FIG. 16). For example, the PCB 210 may be provided in the main body 405 or the handle 410 of the power tool 400.

[0041] FIG. 6 is a block diagram of a controller 500 of the power tool 400, according to some implementations. In some implementations, the controller 500 is provided on the PCB 210 within the power tool 400. The controller 500 is electrically and / or communicatively connected to a variety of modules or components of the power tool 400. For example, the illustrated controller 500 is connected to indicators 505, sensors 510 (e.g., a current sensor, a voltage sensor, a torque sensor, a trigger pull sensor, a temperature sensor, etc.), a power input unit 515, a switching network 520, and a trigger switch 530.

[0042] The controller 500 includes a plurality of electrical and electronic components that provide power, operational control, and protection to the components and modules within the controller 500 and / or power tool 400. For example, the controller 500 includes, among other things, a processing unit 535 (e.g., a microprocessor, an electronic processor, an electronic controller, a microcontroller, or another suitable programmable device), a memory 540, input units 545, and output units 550. The processing unit 535 includes, among other things, a control unit 560, an arithmetic logic unit (“ALU”) 565, and a plurality of registers 570 (shown as a group of registers in FIG. 6), and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc ). The processing unit 535, the memory 540, the input units 545, and the output units 550, as well as the various modulesconnected to the controller 500 are connected by one or more control and / or data buses (e.g., common bus 555). The control and / or data buses are shown generally in FIG. 6 for illustrative purposes. The use of one or more control and / or data buses for the interconnection between and communication among the various modules and components would be known to a person skilled in the art in view of the implementations described herein.

[0043] The memory 540 is a non-transitory computer readable medium and includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as a ROM, a RAM (e g., DRAM, SDRAM, etc.), EEPROM, flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The processing unit 535 is connected to the memory 540 and executes software instruction that are capable of being stored in a RAM of the memory 540 (e.g., during execution), a ROM of the memory 540 (e.g., on a generally permanent basis), or another non-transitory computer readable medium such as another memory or a disc. Software included in the implementation of the power tool 400 can be stored in the memory 540 of the controller 500. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The controller 500 is configured to retrieve from the memory 540 and execute, among other things, instructions related to the control processes and methods described herein. In other implementations, the controller 500 includes additional, fewer, or different components.

[0044] The motor 525 is energized based on a state of the trigger 425. Generally, when the trigger 425 is activated, the motor 525 is energized, and when the trigger 425 is deactivated, the motor 525 is de-energized. In some implementations, such as the power tool 400 illustrated in FIG. 5, the trigger 425 extends partially down a length of the handle of the power tool and is moveably coupled to the handle such that the trigger 425 moves with respect to the power tool housing. In the illustrated implementation, the trigger 425 is coupled to a trigger switch 530 such that when the trigger 425 is depressed, the trigger switch 530 is activated, and when the trigger 425 is released, the trigger switch 530 is deactivated. In the illustrated implementation, the trigger 425 is biased (e.g., with a biasing member such as a spring) such that the trigger 425 moves in a second direction away from the handle of the power tool 400 when the trigger 425 is released by the user. In other words, the default state of the trigger switch 530 is to be deactivated unless a user presses the trigger 425 and activates the trigger switch 530.

[0045] The switching network 520 enables the controller 500 to control the operation of the motor 525. The switching network 520 includes a plurality of electronic switches (e.g., FETs, bipolar transistors, and the like) connected together to form a network that controls the activation of the motor 525 using a pulse-width modulated (PWM) signal. For instance, the switching network 520 may include a six-FET bridge that receives PWM signals from the controller 500 to drive the motor 525. In some implementations, the switching network 520 may be provided on the PCB 210 within the power tool 400. Generally, when the trigger 425 is depressed as indicated by an output of the trigger switch 530, electrical current is supplied from the power input unit 515 to the motor 525 via the switching network 520. When the trigger 425 is not depressed, electrical current is not supplied from the power input unit 515 to the motor 525.

[0046] The battery pack interface 415 is connected to the controller 500 and couples to the battery pack 100. The battery pack interface 415 includes a combination of mechanical (e.g., a battery pack receiving portion) and electrical components configured to and operable for interfacing (e.g., mechanically, electrically, and communicatively connecting) the power tool 400 with the battery pack 100. The battery pack interface 415 is coupled to the power input unit 515. The battery pack interface 415 transmits the power received from the battery pack to the power input unit 515. The power input unit 515 includes active and / or passive components (e.g., voltage step-down controllers, voltage converters, rectifiers, filters, etc.) to regulate or control the power received through the battery pack interface 415 to the controller 500. In some implementations, the power input unit 515 is provided on the PCB 210 within the power tool 400.

[0047] The indicators 505 are also coupled to the controller 500 and receive control signals from the controller 500 to turn on and off or otherwise convey information based on different states of the power tool 400. The indicators 505 include, for example, one or more light-emitting diodes (LEDs), or a display screen (e.g., an LCD display). The indicators 505 can be configured to display conditions of, or information associated with, the power tool 400. In some implementations, the power indicators 505 are provided on the PCB 210 within the power tool 400.

[0048] The sensors 510 are communicatively coupled to the controller 500 and communicate to the controller 500 various output signals indicative of different parameters of the power tool400 or the motor 525. The sensors 510 include, for example, position or movement sensors such as Hall Effect sensors, motor current sensors, motor voltage sensors, motor position sensors, temperature sensors, torque sensors, trigger pull sensors, lasers, ultrasonic sensors, and the like. In some implementations, the sensors 510 are provided on the PCB 210 within the power tool 400.

[0049] FIG. 7 illustrates a battery pack charger 600, according to some implementations. The battery pack charger 600 includes a housing 605, interface portions 610, 615, and a cord 620. The interface portions 610, 615 electrically connect the battery pack charger 600 to one or more battery packs (e.g., battery pack 100) through charging circuits. For example, charging circuits provide power to at least one battery pack from at least one power supply. The cord 620 allows the battery pack charger 600 to receive power from an external power source (e g., a conventional wall outlet).

[0050] In some implementations, the battery pack charger 600 may charge multiple battery packs with various power ratings at once. For example, interface portion 610 may be a six Amperes (Amps) power supply for charging batteries with a six amp power rating, and interface portion 615 may be a 12 amp power supply for charging batteries with a 12 amp power rating. As another example, the battery pack charger 600 may include circuitry such that a battery pack with an 18 amp power rating may be charged by one of the interface portions 610, 615. In some implementations, the battery pack charger 600 includes the PCB 210.

[0051] FIG. 8 is a block diagram of a controller 700 of the battery pack charger 600, according to some implementations. In some implementations, the controller 700 is provided on the PCB 210 within the battery pack charger 600. The controller 700 is electrically and / or communicatively connected to a variety of modules or components of the charger 600. For example, the illustrated controller 700 is electrically connected to a voltage sensors 705, current sensors 710, power supplies 715, charging circuits 720, battery pack interfaces 725, a user interface 730, and a fan control 735. The controller 700 includes combinations of hardware and software that are operable to, among other things, control the operation of the charger 600. The fan control 735 operates a fan 740. In some implementations, the user interface 730 includes a touchscreen. In some implementations, the user interface 730 includes various components (e g.,switches, buttons, levers, dials, etc.) that allow a user to interface with and control the charger600.

[0052] The controller 700 includes a plurality of electrical and electronic components that provide power, operational control, and protection to the components and modules within the controller 700. For example, the controller 700 includes, among other things, a processing unit 745 (e.g., a microprocessor, a microcontroller, an electronic controller, an electronic processor, or another suitable programmable device), a memory 750, input units 755, and output units 760. The processing unit 745 includes, among other things, a control unit 770, an arithmetic logic unit (“ALU”) 775, and a plurality of registers 780 (shown as a group of registers in FIG. 9), and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc.). The processing unit 745, the memory 750, the input units 755, and the output units 760, as well as the various modules or circuits connected to the controller 700 are connected by one or more control and / or data buses (e.g., common bus 765). The control and / or data buses are shown generally in FIG. 8 for illustrative purposes. The use of one or more control and / or data buses for the interconnection between and communication among the various modules, circuits, and components would be known to a person skilled in the art in view of the implementations described herein.

[0053] The memory 750 is a non-transitory computer readable medium and includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as a ROM, a RAM (e.g., DRAM, SDRAM, etc.), EEPROM, flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The processing unit 745 is connected to the memory 750 and executes software instructions that are capable of being stored in a RAM of the memory 750 (e.g., during execution), a ROM of the memory 750 (e.g., on a generally permanent basis), or another non-transitory computer readable medium such as another memory or a disc. Software included in the implementation of the battery pack charger 600 can be stored in the memory 750 of the controller 700. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The controller 700 is configured to retrieve from the memory 750 and execute, among other things, instructions related to the control processes and methods describedherein. In other constructions, the controller 700 includes additional, fewer, or different components.

[0054] The battery pack interfaces 725 include a combination of mechanical components (e.g., rails, grooves, latches, etc.) and electrical components (e.g., one or more terminals) configured to and operable for interfacing (e.g., mechanically, electrically, and communicatively connecting) the charger 600 with a battery pack (e.g., battery pack 100). For example, the battery pack interfaces 725 are configured to receive power through the charging circuits 720. The battery pack interfaces 725 are also configured to communicatively connect to the controller 700 via one or more communications lines 785.

[0055] In some implementations, the controller 700 is configured to control the transfer of power to the charging circuits 720 based on detected power conditions in the charger 600. For example, the current sensors 710 and the voltage sensors 705 communicate to the controller 700 the amount of current and voltage available in the charger 600, respectively. The individual charging circuits 720 can communicate, to the controller, the amount of power needed by the battery packs 100 as well as the power rating of the battery packs 100 that are electrically connected to the respective charging circuits 720.

[0056] FIG. 9 illustrates a portable power supply device or power supply 800. The power supply 800 includes, among other things, a housing 802. In some implementations, the housing 802 includes one or more wheels 804 and a handle assembly 806. In the illustrated implementation, the handle assembly 806 is a telescoping handle movable between an extended position and a collapsed position. The handle assembly 806 includes an inner tube 808 and an outer tube 810. The inner tube 808 fits inside the outer tube 810 and is slidable relative to the outer tube 810. The inner tube 808 is coupled to a horizontal holding member 812. In some implementations, the handle assembly 806 further includes a locking mechanism to prevent inner tube 808 from moving relative to the outer tube 810 by accident. The locking mechanism may include notches, sliding catch pins, or another suitable locking mechanism to inhibit the inner tube 808 from sliding relative to the outer tube 810 when the handle assembly 806 is in the extended position and / or in the collapsed position. In practice, a user holds the holding member 812 and pulls upward to extend the handle assembly 806. The inner tube 808 slides relative to the outer tube 810 until the handle assembly 806 locks in the extended position. The user maythen pull and direct the power supply 800 by the handle assembly 806 to a desired location. The wheels 804 of the power supply 800 facilitate such movement.

[0057] The housing 802 of the power supply 800 further includes a power input unit 814, a power output unit 816, and a display 818. In the illustrated implementation, the power input unit 814 includes multiple electrical connection interfaces configured to receive power from an external power source. In some implementations, the external power source is a DC power source. For example, the DC power source may be one or more photovoltaic cells (e.g., a solar panel), an electric vehicle (EV) charging station, or any other DC power source. In some implementations, the external power source is an AC power source. For example, the AC power source may be a conventional wall outlet, such as a 120 V outlet or a 240 V outlet, found in North America. As another example, the AC power source may be a conventional wall outlet, such as a 220V outlet or 230V outlet, found outside of North America. In some implementations, the power input unit 814 is replaced by or additionally includes a cable configured to plug into a conventional wall outlet. In some implementations, the power input unit 814 further includes one or more devices, such as antennas or induction coils, configured to wirelessly receive power from an external power source. The power received by the power input unit 814 may be used to charge a core battery, or internal power source 820, disposed within the housing 802 of the power supply 800.

[0058] The power received by the power input unit 814 may also be used to provide power to one or more devices connected to the power output unit 816. The power output unit 816 includes one or more power outlets. In the illustrated implementation, the power output unit 816 includes a plurality of AC power outlets 816A and DC power outlets 816B. It should be understood that the number of power outlets included in the power output unit 816 is not limited to the power outlets illustrated in FIG. 10. For example, in some implementations of the power supply 800, the power output unit 816 may include more or fewer power outlets than the power outlets included in the illustrated implementation of the power supply 800.

[0059] In some implementations, the power output unit 816 is configured to provide power output by the internal power source 820 to one or more peripheral devices. In some implementations, the power output unit 816 is configured to provide power provided by an external power source directly to one or more peripheral devices. The one or more peripheraldevices may be a smartphone, a tablet computer, a laptop computer, a portable music player, a power tool, a power tool battery pack, a power tool battery pack charger, or the like. The peripheral devices may be configured to receive DC and / or AC power from the power output unit 816. In some implementations, the power supply 800 may include the PCB 210 and some of the various modules or components of the power supply 800, such as the power output unit 816, may be implemented on the PCB 210.

[0060] FIG. 10 is a generalized schematic illustration of the controller 900 included in power supply 800. In some implementations, the controller 900 is included on the PCB 210 included in the power supply 800. The controller 900 is electrically and / or communicatively connected to a variety of modules or components of the power supply 800. For example, the controller 900 may be connected to the power input unit 814, the power output unit 816, the display 818, and the internal power source 820. Persons skilled in the art will recognize that electrical and / or communicative connection between the controller 900 and the internal power source 820 can include electrical and / or communicative connections between the controller 900 and components included in the internal power source 820, such as, but not limited to the plurality of subcores of the internal power source 820 and components included therein, such as battery cells and subcore monitoring circuits.

[0061] The controller 900 is additionally electrically and / or communicatively connected to an input power conversion unit 905, a DC bus 910, a DC output power conversion unit 915, and an AC output power conversion unit 920 including a plurality of connected battery powered inverters 921, a user interface 922, a network communications module 925, and a plurality of sensors 926.

[0062] The network communications module 925 is connected to a network 940 to enable the controller 900 to communicate with peripheral devices in the network, such as a smartphone or a server. The sensors 926 include, for example, one or more voltage sensors, one or more current sensors, one or more temperature sensors, and / or one or more additional sensors used for measuring electrical and / or other characteristics of the power supply 800. Each of the sensors 926 generates one or more output signals that are provided to the controller 900 for processing and evaluation. The user interface 922 is included to provide user control of the power supply 800. The user interface 922 can include any combination of digital and analog input devicesrequired to achieve a desired level of control for the power supply 800. For example, the user interface 922 may include a plurality of knobs, a plurality of dials, a plurality of switches, a plurality of buttons, or the like. In some implementations, the user interface 922 is integrated with the display 818 (e.g., as a touchscreen display).

[0063] The controller 900 includes combinations of hardware and software that are operable to, among other things, control the operation of the power supply 800, communicate over the network 940, receive an input from a user via the user interface 922, provide information to a user via the display 818, etc. For example, the controller 900 includes, among other things, a processing unit 955 (e g., a microprocessor, a microcontroller, an electronic processor, an electronic controller, or another suitable programmable device), a memory 960, input units 965, and output units 970. The processing unit 955 includes, among other things, a control unit 975, an arithmetic logic unit (“ALU”) 980, and a plurality of registers 985 (shown as a group of registers in FIG. 11), and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc.). The processing unit 955, the memory 960, the input units 965, and the output units 970, as well as the various modules or circuits connected to the controller 900 are connected by one or more control and / or data buses (e.g., common bus 990). The control and / or data buses are shown generally in FIG. 10 for illustrative purposes. Although the controller 900 is illustrated in FIG. 10 as one controller, the controller 900 could also include multiple controllers configured to work together to achieve a desired level of control for the power supply 800. As such, any control functions and processes described herein with respect to the controller 900 could also be performed by two or more controllers functioning in a distributed manner.

[0064] The memory 960 is a non-transitory computer readable medium and includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as a read only memory (“ROM”), a random access memory (“RAM”) (e.g., dynamic RAM [“DRAM”], synchronous DRAM [“SDRAM”], etc.), electrically-erasable programmable ROM (“EEPROM”), flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The processing unit 955 is connected to the memory 960 and is configured to execute software instructions that are capable of being stored in a RAM of the memory 960 (e.g., during execution), a ROM of the memory 960 (e.g., on a generally permanent basis), or anothernon-transitory computer readable medium such as another memory or a disc. Software included in the implementation of the power supply 800 and controller 900 can be stored in the memory 960 of the controller 900. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The controller 900 is configured to retrieve from the memory 960 and execute, among other things, instructions related to the control processes and methods described herein. In other implementations, the controller 900 includes additional, fewer, or different components.

[0065] During operation of the power supply 800, the controller 900 is configured to monitor voltage, current, and / or other signals received from the various components described above. For example, the controller 900 is configured to monitor voltage signals received from the internal power source 820 when the internal power source 820 is charged by an external power source connected to the power input unit 814. As another example, the controller 900 is configured to monitor voltage signals received from the internal power source 820 when the internal power source 820 provides power to one or more peripheral devices connected to the power output unit 816. More generally, the controller 900 is configured to monitor and / or control power flow to and from the above-described components of power supply 800 that are electrically and communicatively coupled to the controller 900.

[0066] FIG. 11 illustrates a PCB 1000, according to some implementations. In some implementations, the PCB 1000 is the same as the PCB 210 and is included in at least one of the battery pack 100, the power tool 400, the charger 600, and the power supply 800. The PCB 1000 includes a copper insert 1002 (e.g., a coin), a first layer 1005, a second layer 1010, a third layer 1015, a fourth layer 1020, and a fifth layer 1025. In some implementations, a metal or another heat conducting material other than copper can be used for the copper insert 1002. An electrical or circuit component 1030 may be mounted on the first layer 1005 of the PCB 1000. A heat pipe 1035 may be provided on a top side of the circuit component 1030. For example, a bottom side of the heat pipe 1035 contacts the top side of the circuit component 1030. In some implementations, the bottom side of the heat pipe 1035 contacts the top side of a plurality of circuit components. The heat pipe 1035 includes a first segment 1040 and a second segment 1045. For example, the first segment 1040 contacts the circuit component 1030. In some implementations, the first segment 1040 has a higher temperature than the second segment 1045and the second segment 1045 may work to pull the concentration of heat from the first segment 1040.

[0067] In some implementations, the copper insert 1002 is embedded in the PCB 1000. For example, the copper insert 1002 extends through each layer of the PCB 1000. In some implementations, the circuit component 1030 is attached to or otherwise in contact with the copper insert 1002. For example, the circuit component 1030 is secured to the PCB 1000 on top of the copper insert 1002. The copper insert 1002 may be made of copper and may have a thermal impedance of about 5.35 degrees Celsius-per-Watt (°C / W) based on the thickness of the copper insert 1002 extending from the first layer 1005 to the fifth layer 1025 of the PCB 1000. In some implementations, the copper insert 1002 only extends through one or more of the layers or a subset of the layers.

[0068] The thermal impedance (Re) of the copper insert 1002 may be calculated based on the thickness of the copper insert (tcu) and the thermal conductivity of the copper insert (kcu) using Equation 1. The thickness of the copper insert 1002 may be 2.14 millimeters (mm) and the thermal conductivity of copper (e.g., used in the copper insert 1002) is 0.4 Watts-per-millimeter- Kelvin (W / mmK).— = RgEquation 1 kcu

[0069] In some implementations, the heat pipe 1035 may be 2mm thick and may have a thermal conductivity of 0.6 W / mmK. Using Equation 1, the thermal impedance from the top of the circuit component 1030 to the top of the heat pipe 1035 may be 3.33°C / W. The thermal impedance is calculated on a 1mm2area on each layer from the top of the PCB 1000 to the bottom of the PCB 1000. The thermal impedance of each layer can then be summed to determine total thermal impedance.

[0070] In some implementations, the first layer 1005 is made of a metal (e.g., copper). For example, the first layer 1005 may be made of one ounce (oz) of copper with a thickness of 0.035 mm. Using Equation 1, the thermal impedance of the first layer 1005 may be about 0.0875°C / W. In some implementations, the fifth layer 1025 may be substantially the same as the first layer 1005. For example, the fifth layer 1025 may also be made of copper and may have a thermal impedance of about 0.0875°C / W.

[0071] In some implementations, the second layer 1010 is made of a dielectric material (e.g., an insulator). The second layer 1010 may be 0.035 mm thick and may have a thermal conductivity of 0.4 W / mmK. Using Equation 1, the thermal impedance of the second layer 1010 may be about 140°C / W. In some implementations, the fourth layer 1020 may be substantially the same as the second layer 1010. For example, the fourth layer 1020 may also be made of the dielectric material and may have a thermal impedance of about 140°C / W.

[0072] In some implementations, the third layer 1015 is made of FR4 (i.e., glass-reinforced epoxy laminate material). The third layer 1015 may be 2 mm thick and may have a thermal conductivity of 0.00025 W / mmK. Using Equation 1, the thermal impedance of the third layer 1015 may be about 8000°C / W.

[0073] The PCB 1000 including the copper insert 1002 and the heat pipe 1035 provides 5.35°C / W thermal impedance below the circuit component 1030 and 3.33°C / W thermal impedance above the circuit component, which allows heat to dissipate below and above the circuit component 1030. In some implementations, the PCB 1000 provides a thermal impedance both above and below the circuit component of 10.0°C / W or less. The increase in heat dissipation allows the circuit component 1030 to be operated at high currents for a prolonged period of time without thermal failures, thus, prolonging the life of the circuit component 1030.

[0074] FIG. 12 illustrates a conventional PCB 1100. The conventional PCB 1100 includes a first layer 1105, a second layer 1110, a third layer 1115, a fourth layer 1120, and a fifth layer 1125. In some implementations, the first layer 1105, the second layer 1110, the third layer 1115, the fourth layer 1120, and the fifth layer 1125 are substantially the same to the corresponding layers of the PCB 1000. A circuit component 1130 is provided on top of the first layer 1105. In some implementations, the total thermal impedance of the conventional PCB 1100 on a bottom side of the circuit component 1130 is 8,280.18°C / W. Additionally, the thermal impedance on the top side of the circuit component 1130 (e.g., 2mm thick air over a 1mm2area above the circuit component 1130) may be 76,336°C / W. The total thermal impedance of the conventional PCB 1100 is much higher than the thermal impedance of the PCB 1000 due to the absence of the copper insert 1002 and the heat pipe 1035.

[0075] FIG. 13 illustrates an example IMS PCB 1200, according to some implementations. In some implementations, the IMS PCB 1200 is the same as the PCB 210 and is included in atleast one of the battery pack 100, the power tool 400, the charger 600, and the power supply 800. The IMS PCB 1200 includes a first layer 1205 (e.g., a copper layer), a second layer 1210 (e.g., a dielectric layer), and a third layer 1215 (e.g., an aluminum base layer). The second layer 1210 is sandwiched between the first layer 1205 and the third layer 1215. In the example of FIG. 13, an electrical component 1220 is connected to the first layer 1205. In other instances, additional electrical components 1220 (for example, a plurality of electrical components) may also be connected to the first layer 1205. While only a single copper layer (e.g., the first layer 1205) is illustrated in FIG. 13, in some implementations, more than one copper layer may be provided. A heat pipe 1225 is connected to an opposite side of the electrical component 1220 from the first layer 1205 (e.g., a top side). In the example of FIG. 13, the heat pipe 1225 extends parallel to the first layer 1205 (e.g., extends parallel with a top surface or a top layer of the IMS PCB 1200). In other examples, the heat pipe 1225 may extend in another direction, such as perpendicularly or at an angle with respect to the first layer 1205. The heat pipe 1225 may be composed of copper, aluminum, or some other metal with high thermal conductivity. In some instances, the heat pipe 1225 is hollow and a working fluid (such as, for example, water) is sealed inside the heat pipe 1225. A capillary structure, such as a wick, may line an interior wall of the heat pipe 1225.

[0076] FIG. 14 illustrates example thermal impedance values of thickness values for the first layer 1205, the second layer 1210, the third layer 1215, and the heat pipe 1225. Thicknesses described herein may not be illustrated to scale. In the example of FIG. 14, one ounce of copper is implemented for the first layer 1205 of copper having a thickness (tcu) of 0.035 mm. The second layer 1210 of dielectric has a thickness (tdieiectric) of 0.05 mm, the third layer 1215 of aluminum has a thickness (tAi) of 2.0 mm, and the heat pipe 1225 has a thickness (theat-pipe) of 2.0 mm. These thicknesses are merely examples. In other instances, the first layer 1205 may have a thickness between 0.030 millimeters (mm) to 0.040 mm, the second layer 1210 may have a thickness between 0.04 mm to 0.06 mm, the third layer 1215 may have a thickness between 1.8 mm to 2.2 mm, and the heat pipe 1225 may have a thickness between 1.8 mm to 2.2 mm.

[0077] Additionally, the thermal conductivity of copper (kcu) is 0.400 W / mmK, the thermal conductivity of the dielectric (kdieiectric) is 0.003 W / mmK, the thermal conductivity of aluminum (k..1) is 0.205 W / mmK, and the thermal conductivity of the heat pipe 1225 (kheat-PiPe) is approximately 0.600 W / mmK. Accordingly, if the total thermal impedance (Re) is calculated ona 1 mm2area, the total thermal impedance from the PCB top surface to the metal base is provided by Equation 2: Equation 2

[0078] Given the example values of FIG. 14, plugging in for Equation 2 provides 0.035 / 0.4 + 0.05 / 0.003 + 2 / 0.205 = 26.51°C / W. Further, the thermal impedance from the top of the electrical component 1220 to the top of the heat pipe 1225 is provided by theat-pipe / kheat pipe = 2 / 0.6 = 3.33°C / W.

[0079] For comparison, FIG. 15 illustrates an example FR4 PCB 1300 having a first layer 1305 (e.g., a copper layer), a second layer 1310 (e.g., a dielectric layer), and a third layer 1315 (e.g., an aluminum heat sink). The second layer 1310 is sandwiched between the first layer 1305 and the third layer 1315. An electrical component 1320 is connected to the first layer 1305. As seen in FIG. 15, the FR4 PCB 1300 does not include a heat pipe.

[0080] In the example of FIG. 15, one ounce of copper is used, and the first layer 1305 has a thickness (tcu) of 0.035 mm. The second layer 1310 of FR4 dielectric has a thickness (tdieiectric) of 0.965 mm, and the third layer 1315 of aluminum has a thickness (tAi) of 2.0 mm. The thermal conductivity of the FR4 dielectric (kdielectric) is 0.00025 W / mK. Accordingly, if thermal impedance is calculated on a lmmA2 area on each layer, the total thermal impedance (Re) from the top of the FR4 PCB 1300 to the bottom of the third layer 1315 is provided by Equation 3:Equation 3

[0081] Given the example values of FIG. 15, plugging in for Equation 3 provides 0.035 / 0.4 + 0.965 / 0.00025 + 2 / 0.205 = 3869.84 °C / W. As air is present on top of the electrical component 1320, the top side thermal impedance is much higher for the FR4 PCB 1300 than the IMS PCB 1200 that has the heat pipe 1225.

[0082] From the above calculations, the thermal impedance of the IMS PCB 1200 is much lower than the FR4 PCB 1300. Particularly, the thermal impedance of the IMS PCB 1200 is approximately 3.33 °C / W on the top side of the electrical component 1220 and approximately 26.51 °C / W on the bottom side of the electrical component 1220. For comparison, the thermal impedance of the FR4 PCB 1300 is approximately 76,336 °C / W on the top side of the electricalcomponent 1320 (with 2mm thick air in a lmmA2 area) and approximately 3,870 °C / W on a bottom side of the electrical component 1320. Accordingly, the IMS PCB 1200 provides significant advantages in reducing thermal impedance, allowing power electronics to operate at higher currents without thermal failure as compared to the FR4 PCB 1300.

[0083] FIG. 16 illustrates an example system 1400 for cooling a PCB with a Peltier device and a heat pipe embedded heat sink in accordance with implementations described herein. The example system 1400 illustrated in FIG. 16 includes an electrical component 1405, a PCB 1410, a first layer of thermal interface material (TIM) 1415, a Peltier device 1420, a second layer of TIM 1425, and a heat pipe embedded heat sink 1430. In some implementations, the PCB 1410 is the same as the PCB 210 and the system 1400 is included in at least one of the battery pack 100, the power tool 400, the charger 600, and the power supply 800.

[0084] In some implementations, the electrical component 1405 is provided on a first (e.g., top) side of the PCB 1410. While in the example illustrated in FIG. 16, the system 1400 is illustrated as including a single electrical component 1405 that is connected to the top side of the PCB 1410, in some instances, additional electrical components 1405 (for example, a plurality of electrical components) may also be connected to the PCB 1410. In some implementations, the electrical component 1405 dissipates heat through its bottom surface by way of the Peltier device 1420. In some implementations, the Peltier device 1420 is located under a second (e.g., bottom) side of the PCB 1410. In some instances, the first layer of TIM 1415 may be located between the bottom side of the PCB 1410 and the top side of the Peltier device 1420. Therefore, in the example illustrated in FIG. 16, heat is dissipated from the bottom of the electrical component 1405, first through the PCB 1410, then through the first layer of TIM 1415, and next through the Peltier device 1420.

[0085] Peltier cooling technology, also known as Thermo-Electric Cooling (TEC) allows any device (for example, the PCB 1410 and the electrical component 1405) to be cooled down to below freezing temperature. On the side of the Peltier device 1420 opposite to the component being cooled (for example, the electrical component 1405), heat dissipation occurs. In the example implementation illustrated in FIG. 16, heat dissipation occurs on the bottom side of the Peltier device 1420. In some implementations, a heat sink may be included under the bottom side of the Peltier device 1420. When the power or heat dissipation of electronic devicespositioned on the top side of the PCB 1410 (for example, the electrical component 1405) is low, the natural convection of the heat sink under the bottom side of the Peltier device 1420 may be sufficient to draw heat away from the Peltier device 1420. However, when the power or heat dissipation of electronic devices positioned on the top side of the PCB 1410 (for example, the electrical component 1405) is high, a heat sink with forced convection cooling, such as a fan, may be positioned under the bottom side of the Peltier device 1420 to draw a sufficient amount of heat away from the Peltier device 1420.

[0086] In the example illustrated in FIG. 16, the heat pipe embedded heat sink 1430 is provided under a bottom side of the Peltier device 1420. In some implementations, the heat pipe embedded heat sink 1430 is a heat sink with forced convection cooling implemented by a heat pipe that is bent along the surface of a heat sink. The heat pipe bent along the surface of the heat sink may be similar to the heat pipe 1225 described above in relation to FIG. 13. Specifically, the heat pipe included in the heat pipe embedded heat sink may be composed of copper, aluminum, or some other metal with high thermal conductivity. In some instances, the heat pipe is hollow and a working fluid (such as, for example, water) is sealed inside the heat pipe. A capillary structure, such as a wick, may line an interior wall of the heat pipe. The heat pipe embedded heat sink 1430 may be light weight, have high thermal conductivity, and be a passive cooling technology (a cooling technology that an external power source is not required to operate).

[0087] In some implementations, the second layer of TIM 1425 is located between the bottom side of the Peltier device 1420 and the top side of the heat pipe embedded heat sink 1430. Therefore, in the implementation illustrated in FIG. 16, heat is dissipated from the bottom side of the Peltier device 1420, through the second layer of TIM 1425, and then through the heat pipe embedded heat sink 1430.

[0088] Depending on the application in which the system 1400 is being utilized, the system 1400 may further include an external heat pipe embedded heat sink 1440. The external heat pipe embedded heat sink 1440 may be connected to the heat pipe embedded heat sink 1430 through one or more heat pipes (for example, a heat pipe 1435). For example, in FIG. 16 the heat pipe 1435 is provided under the bottom side of the heat pipe embedded heat sink 1430 and the external heat pipe embedded heat sink is provided under the bottom side of the heat pipe 1435.Therefore, heat may dissipate from the heat pipe embedded heat sink 1430, through the heat pipe 1435, and finally through the external heat pipe embedded heat sink 1440. In some implementations, the system 1400 may include a fan 1445 to provide further forced convection cooling, if necessary. The heat pipe 1435 may be similar to the heat pipe 1225 described above in relation to FIG. 13.

[0089] FIG. 17 provides an illustrative example of a control system 1500 included in the system 1400. The control system 1500 includes a first temperature sensor 1505, a second temperature sensor 1510, and a controller 1515. In some implementations, the first temperature sensor 1505 is configured to measure a temperature of the electrical component 1405. In some implementations, the second temperature sensor 1510 is configured to measure a temperature of a side or surface of the Peltier device 1420. In some implementations, the controller 1515 is a voltage / current controlling device that is configured to control the Peltier device 1420. In some implementations, the controller 1515 is configured to control the Peltier device 1420 based on the temperature of the electrical component 1405 that the controller 1515 receives from the first temperature sensor 1505 and the temperature of the of the Peltier device 1420 that the controller 1515 receives from the second temperature sensor 1510. For example, based on the temperature of the electrical component 1405 that the controller 1515 receives from the first temperature sensor 1505, the controller 1515 may control the Peltier device 1420 to maintain a desired temperature of the electrical component 1405 and / or a hot spot on the PCB 1410. In some implementations, based on the temperature of the Peltier device 1420 that the controller 1515 receives from the second temperature sensor 1510, the controller 1515 controls the Peltier device 1420 to ensure that the Peltier device 1420 is operated within its normal operating conditions.REPRESENTATIVE FEATURES

[0090] Representative features are set out in the following clauses, which stand alone or may be combined, in any combination, with one or more features disclosed in the text and / or drawings of the specification.

[0091] Clause 1. A system comprising: a printed circuit board; an electrical component provided on a first side of the printed circuit board; a Peltier device provided under a second side of the printed circuit board; and a heat pipe embedded heat sink provided under the Peltier device.

[0092] Clause 2. The system according to clause 1, the system further comprising: a first layer of thermal interface material between the printed circuit board the Peltier device; and a second layer of thermal interface material between the heat pipe embedded heat sink and the Peltier device.

[0093] Clause 3. The system according to clause 1, the system further comprising: a heat pipe provided under the heat pipe embedded heat sink; and an external heat pipe embedded heat sink provided under the heat pipe.

[0094] Clause 4. The system according to clause 1, the system further comprising: a first temperature sensor configured to measure a temperature of the electrical component; a second temperature sensor configured to measure a temperature of the Peltier device; and a controller configured to control the Peltier device based on the temperature of the electrical component and the temperature of the Peltier device.

[0095] Clause 5. The system of clause 1, wherein the system is provided in one of a battery pack, a power tool, a battery pack charger, and a power supply.

[0096] Clause 6. A printed circuit board comprising: a plurality of layers; a circuit component provided on a first side of the plurality of layers; a heat pipe provided on the circuit component; and a copper insert provided under the circuit component and through each layer of the plurality of layers.

[0097] Clause 7. The printed circuit board of clause 6, wherein the copper insert is provided directly below the circuit component.

[0098] Clause 8. The printed circuit board of clause 6, wherein the copper insert has a thermal impedance of about 5.35 degrees Celsius-per-Watt (°C / W).

[0099] Clause 9. The printed circuit board of clause 6, wherein the heat pipe has a thermal impedance of 3.33 degrees Celsius-per-Watt (°C / W).

[0100] Clause 10. The printed circuit board of clause 6, wherein the plurality of layers includes a first layer, a second layer, a third layer, a fourth layer, and a fifth layer.

[0101] Clause 11. The printed circuit board of clause 10, wherein the first layer and the fifth layer are both made of metal and have a thermal impedance of about 0.0875 degrees Celsius-per- Watt (°C / W).

[0102] Clause 12. The printed circuit board of clause 10, wherein the second layer and the fourth layer are both made of a dielectric material have a thermal impedance of about 140 degrees Celsius-per-Watt (°C / W).

[0103] Clause 13. The printed circuit board of clause 10, wherein the third layer is made of a glass-reinforced epoxy laminate material and has a thermal impedance of about 8000 degrees Celsius-per-Watt (°C / W).

[0104] Clause 14. The printed circuit board of clause 6, wherein the printed circuit board is provided in one of a battery pack, a power tool, a battery pack charger, and a power supply.

[0105] Clause 15. A power tool device comprising: an insulated metal substrate (IMS) printed circuit board (PCB), the IMS PCB including a copper layer, a dielectric layer, and an aluminum metal base, wherein the dielectric layer is sandwiched between the copper layer and the aluminum metal base; a plurality of electrical components connected to the copper layer; and a heat pipe connected to at least one of the plurality of electrical components and extending in a direction parallel with the copper layer of the IMS PCB.

[0106] Clause 16. The power tool device of clause 15, wherein the copper layer has a thickness of approximately 0.030 to 0.040 millimeters.

[0107] Clause 17. The power tool device of clause 15, wherein the dielectric layer has a thickness of approximately 0.04 to 0.06 millimeters.

[0108] Clause 18. The power tool device of clause 15, wherein the aluminum metal base has a thickness of approximately 1.8 to 2.2 millimeters.

[0109] Clause 19. The power tool device of clause 15, wherein the heat pipe has a thickness of approximately 1.8 mm to 2.2 mm.

[0110] Clause 20. The power tool device of clause 15, wherein the plurality of electrical components includes a power tool controller.

[0111] Thus, implementations described herein provide, among other things, heat management for printed circuit boards. Various features and advantages are set forth in the following claims.

Claims

CLAIMSWhat is claimed is:

1. A system comprising: a printed circuit board; an electrical component provided on a first side of the printed circuit board; a Peltier device provided under a second side of the printed circuit board; and a heat pipe embedded heat sink provided under the Peltier device.

2. The system according to claim 1, the system further comprising: a first layer of thermal interface material between the printed circuit board the Peltier device; and a second layer of thermal interface material between the heat pipe embedded heat sink and the Peltier device.

3. The system according to claim 1, the system further comprising: a heat pipe provided under the heat pipe embedded heat sink; and an external heat pipe embedded heat sink provided under the heat pipe.

4. The system according to claim 1 , the system further comprising: a first temperature sensor configured to measure a temperature of the electrical component; a second temperature sensor configured to measure a temperature of the Peltier device; and a controller configured to control the Peltier device based on the temperature of the electrical component and the temperature of the Peltier device.

5. The system of claim 1, wherein the system is provided in one of a battery pack, a power tool, a battery pack charger, and a power supply.

6. A printed circuit board comprising: a plurality of layers; a circuit component provided on a first side of the plurality of layers; a heat pipe provided on the circuit component; and a copper insert provided under the circuit component and through each layer of the plurality of layers.

7. The printed circuit board of claim 6, wherein the copper insert is provided directly below the circuit component.

8. The printed circuit board of claim 6, wherein the copper insert has a thermal impedance of about 5.35 degrees Celsius-per-Watt (°C / W).

9. The printed circuit board of claim 6, wherein the heat pipe has a thermal impedance of 3.33 degrees Celsius-per-Watt (°C / W).

10. The printed circuit board of claim 6, wherein the plurality of layers includes a first layer, a second layer, a third layer, a fourth layer, and a fifth layer.

11. The printed circuit board of claim 10, wherein the first layer and the fifth layer are both made of metal and have a thermal impedance of about 0.0875 degrees Celsius-per-Watt (°C / W).

12. The printed circuit board of claim 10, wherein the second layer and the fourth layer are both made of a dielectric material have a thermal impedance of about 140 degrees Celsius-per- Watt (°C / W).

13. The printed circuit board of claim 10, wherein the third layer is made of a glass- reinforced epoxy laminate material and has a thermal impedance of about 8000 degrees Celsius- per-Watt (°C / W).

14. The printed circuit board of claim 6, wherein the printed circuit board is provided in one of a battery pack, a power tool, a battery pack charger, and a power supply.

15. A power tool devi ce compri sin : an insulated metal substrate (IMS) printed circuit board (PCB), the IMS PCB including a copper layer, a dielectric layer, and an aluminum metal base, wherein the dielectric layer is sandwiched between the copper layer and the aluminum metal base; a plurality of electrical components connected to the copper layer; and a heat pipe connected to at least one of the plurality of electrical components and extending in a direction parallel with the copper layer of the IMS PCB.

16. The power tool device of claim 15, wherein the copper layer has a thickness of approximately 0.030 to 0.040 millimeters.

17. The power tool device of claim 15, wherein the dielectric layer has a thickness of approximately 0.04 to 0.06 millimeters.

18. The power tool device of claim 15, wherein the aluminum metal base has a thickness of approximately 1.8 to 2.2 millimeters.

19. The power tool device of claim 15, wherein the heat pipe has a thickness of approximately 1.8 mm to 2.2 mm.

20. The power tool device of claim 15, wherein the plurality of electrical components includes a power tool controller.

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