Circuit board, transformer, microwave generation device, and household appliance

Abstract

A circuit board (100), a transformer (50), a microwave generation device (1000), and a household appliance. The circuit board (100) is used for the microwave generation device (1000). The circuit board (100) comprises a substrate (10) and a power device (20), the power device (20) comprises a rectifier bridge stack and an insulated-gate bipolar transistor which are integrated, and the power device (20) is arranged on the substrate (10).

Description

Circuit boards, transformers, microwave generating equipment and household appliances

[0001] Priority information

[0002] This application claims priority and benefits of patent application No. 202310802439.5 filed with the State Intellectual Property Office of China on June 30, 2023, and priority and benefits of patent application No. 202321710711.9 filed with the State Intellectual Property Office of China on June 30, 2023, and the entire text of which is incorporated herein by reference. Technical Field

[0003] The present application relates to the field of microwave technology, and in particular to a circuit board, a transformer, a microwave generating device and a household appliance. Background Art

[0004] In the related art, a microwave oven has an electronic control board, which includes a substrate, a rectifier bridge stack and an insulated gate bipolar transistor. The rectifier bridge stack and the insulated gate bipolar transistor are respectively arranged on the substrate, occupying a large space, resulting in an excessively large volume of the electronic control board.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a circuit board, a transformer, a microwave generating device, and a household appliance.

[0007] A circuit board according to an embodiment of the present application is used for a microwave generating device, and the circuit board includes:

[0008] substrate; and

[0009] A power device includes an integrated rectifier bridge stack and an insulated gate bipolar transistor, and the power device is arranged on the substrate.

[0010] The above-mentioned circuit board integrates the rectifier bridge stack and the insulated gate bipolar transistor into one power device, making the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor more compact, thereby reducing the space occupied by the circuit board, thereby reducing the volume of the circuit board and facilitating the miniaturization of the circuit board.

[0011] In some embodiments, the power device includes a package in a rectangular parallelepiped shape.

[0012] In some embodiments, fixing holes are formed on both sides of the package body, the circuit board further includes a heat sink disposed on the substrate, and the package body is attached to the heat sink through the fixing holes.

[0013] In some embodiments, the heat sink includes a sheet-shaped heat transfer portion disposed on the substrate, the heat transfer portion includes a bonding surface, the heat sink includes side fins extending outward from the side of the heat transfer portion opposite to the bonding surface, and a top fin extending upward from an end of the heat transfer portion away from the substrate, and the package body is bonded to the bonding surface.

[0014] In some embodiments, the circuit board includes a resonant capacitor, an accommodation space is formed between the top fin and the substrate, and the resonant capacitor is placed in the accommodation space.

[0015] In some embodiments, the circuit board includes a transformer, the transformer comprising:

[0016] a skeleton assembly mounted on the substrate, the skeleton assembly being provided with a primary winding slot and a secondary winding slot, the skeleton assembly being provided with a first baffle, a second baffle, a third baffle, and a support sheet, wherein along the height direction of the transformer, the first baffle covers the notch of the primary winding slot or the upper portion of the notch of the secondary winding slot, and the second baffle covers the notch of the primary winding slot or the lower portion of the notch of the secondary winding slot; and;

[0017] A magnetic core assembly, wherein the magnetic core assembly is mounted on the skeleton assembly, the magnetic core assembly includes a first magnetic core, the first magnetic core is arranged on the side where the secondary winding slot is located, the substrate is provided with a capacitor assembly on the side where the first magnetic core is located, the support plate abuts the top of the capacitor assembly, the support plate separates the first magnetic core and the capacitor assembly in the height direction of the transformer, pins are provided between the capacitor assemblies, and the third baffle is connected to the support plate and extends toward the side where the capacitor assembly is located to cover at least a portion of the pins.

[0018] In some embodiments, the skeleton assembly includes a first skeleton and a second skeleton, the primary winding groove and the secondary winding groove are arranged on the first skeleton, the first baffle, the second baffle, the third baffle and the support plate are arranged on the second skeleton, the first skeleton is provided with a first receiving groove, a through hole and a second receiving groove that are interconnected, the first magnetic core is located in the first receiving groove and the through hole, and the magnetic core assembly also includes a second magnetic core, and the second magnetic core is located in the second receiving groove and the through hole.

[0019] In some embodiments, the first magnetic core includes a first connecting portion and a first extension portion, and the second magnetic core includes a second connecting portion and a second extension portion, the first connecting portion is located in the first accommodating groove, the first extension portion is located in the through hole, the second connecting portion is located in the second accommodating groove, and the second extension portion is located in the through hole.

[0020] In some embodiments, the second skeleton includes a first limiting groove and a second limiting groove, the first connecting portion is located in the first limiting groove to limit the first magnetic core, the second connecting portion is located in the second limiting groove to limit the second magnetic core, and there is a gap between the first extension portion and the second extension portion.

[0021] In certain embodiments, the first skeleton and the second skeleton are detachably connected.

[0022] In some embodiments, a plurality of fixing portions are protruded from the outer side of the top wall of the first accommodating groove, and the plurality of fixing portions form a plurality of strip grooves.

[0023] In some embodiments, the heat sink is arranged on the side where the second magnetic core is located, the skeleton assembly further includes a third skeleton, the third skeleton is attached to the top fin, and the power device is arranged between the third skeleton and the heat transfer part.

[0024] In some embodiments, the circuit board includes:

[0025] busbar capacitance; and

[0026] The differential mode inductor and the bus capacitor are arranged between the differential mode inductor and the transformer, and the differential mode inductor and the bus capacitor are arranged in sequence on the substrate.

[0027] A transformer according to an embodiment of the present application includes:

[0028] circuit boards;

[0029] a skeleton assembly mounted on the circuit board, the skeleton assembly being provided with a primary winding slot and a secondary winding slot, the skeleton assembly being provided with a first baffle, a second baffle, a third baffle, and a support sheet, wherein along the height direction of the transformer, the first baffle covers the notch of the primary winding slot or the upper portion of the notch of the secondary winding slot, and the second baffle covers the notch of the primary winding slot or the lower portion of the notch of the secondary winding slot; and;

[0030] A magnetic core assembly, wherein the magnetic core assembly is mounted on the skeleton assembly, the magnetic core assembly includes a first magnetic core, the first magnetic core is arranged on the side where the secondary winding slot is located, the circuit board is provided with a capacitor assembly on the side where the first magnetic core is located, the support plate abuts the top of the capacitor assembly, the support plate separates the first magnetic core and the capacitor assembly in the height direction of the transformer, a second pin is arranged between the capacitor assemblies, and the third baffle is connected to the support plate and extends toward the side where the capacitor assembly is located to cover at least a portion of the second pin.

[0031] In the above-mentioned transformer, the first baffle of the skeleton assembly covers the notch of the primary winding slot or the upper part of the notch of the secondary winding slot, and the second baffle covers the notch of the primary winding slot or the lower part of the notch of the secondary winding slot, so as to facilitate the insulation safety distance between the primary winding slot and the secondary winding slot. The support sheet abuts the top of the capacitor assembly to fix the capacitor assembly. The third baffle covers at least a part of the pin, so as to facilitate the insulation safety distance between the first magnetic core and the pin, avoiding the insulation safety distance being met by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer and reduce the cost of the transformer.

[0032] In some embodiments, the skeleton assembly includes a first skeleton and a second skeleton, the primary winding groove and the secondary winding groove are arranged on the first skeleton, the first baffle, the second baffle, the third baffle and the support plate are arranged on the second skeleton, the first skeleton is provided with a first receiving groove, a through hole and a second receiving groove that are interconnected, the first magnetic core is located in the first receiving groove and the through hole, and the magnetic core assembly also includes a second magnetic core, and the second magnetic core is located in the second receiving groove and the through hole.

[0033] In some embodiments, the first magnetic core includes a first connecting portion and a first extension portion, and the second magnetic core includes a second connecting portion and a second extension portion, the first connecting portion is located in the first accommodating groove, the first extension portion is located in the through hole, the second connecting portion is located in the second accommodating groove, and the second extension portion is located in the through hole.

[0034] In some embodiments, the second skeleton includes a first limiting groove and a second limiting groove, the first connecting portion is located in the first limiting groove to limit the first magnetic core, the second connecting portion is located in the second limiting groove to limit the second magnetic core, and there is a gap between the first extension portion and the second extension portion.

[0035] In certain embodiments, the first skeleton and the second skeleton are detachably connected.

[0036] In some embodiments, a plurality of fixing portions are protruded from the outer side of the top wall of the first accommodating groove, and the plurality of fixing portions form a plurality of strip grooves.

[0037] In some embodiments, a heat sink is provided on the circuit board, and the heat sink is provided on a side where the second magnetic core is located. The skeleton assembly further includes a third skeleton, and the third skeleton separates the second magnetic core and the heat sink.

[0038] In some embodiments, the first skeleton is detachably connected to the third skeleton.

[0039] In some embodiments, the second pin is an output terminal of the secondary winding coil of the transformer, or the second pin is connected to the output terminal of the secondary winding coil of the transformer.

[0040] A microwave generating device according to an embodiment of the present application includes the circuit board described in any one of the above embodiments, or the transformer described in any one of the above embodiments.

[0041] When the microwave generating device includes a circuit board, the rectifier bridge stack and the insulated gate bipolar transistor are integrated into a power device, so that the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor is more compact, thereby reducing the space occupied by the circuit board, thereby reducing the volume of the circuit board, and facilitating the miniaturization of the circuit board.

[0042] When the above-mentioned microwave generating device includes a transformer, the first baffle of the skeleton assembly covers the slot of the primary winding slot or the upper part of the slot of the secondary winding slot, and the second baffle covers the slot of the primary winding slot or the lower part of the slot of the secondary winding slot, so as to facilitate meeting the insulation safety distance of the primary winding slot and the secondary winding slot. The support sheet abuts the top of the capacitor assembly to fix the capacitor assembly. The third baffle covers at least a part of the pin, so as to facilitate meeting the insulation safety distance between the first magnetic core and the pin, avoiding meeting the insulation safety distance by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer and reduce the cost of the transformer.

[0043] A household appliance according to an embodiment of the present application includes the circuit board described in any one of the above embodiments, or the transformer described in any one of the above embodiments.

[0044] When the above-mentioned household appliance includes a circuit board, by integrating the rectifier bridge stack and the insulated gate bipolar transistor into a power device, the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor is made more compact, thereby reducing the space occupied by the circuit board, thereby reducing the volume of the circuit board, and facilitating the miniaturization of the circuit board.

[0045] When the above-mentioned household appliance includes a transformer, the first baffle of the skeleton assembly covers the notch of the primary winding groove or the upper part of the notch of the secondary winding groove, and the second baffle covers the notch of the primary winding groove or the lower part of the notch of the secondary winding groove, so as to facilitate the insulation safety distance between the primary winding groove and the secondary winding groove. The support sheet abuts the top of the capacitor assembly to fix the capacitor assembly. The third baffle covers at least a part of the pin, so as to facilitate the insulation safety distance between the first magnetic core and the pin, avoiding the need to increase the skeleton wall height or the skeleton height to meet the insulation safety distance, which can greatly reduce the volume of the transformer and reduce the cost of the transformer.

[0046] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0048] FIG1 is a schematic diagram of a partial structure of a circuit board according to an embodiment of the present invention;

[0049] FIG2 is a schematic structural diagram of a power device according to an embodiment of the present invention;

[0050] FIG3 is a first structural diagram of a circuit board according to an embodiment of the present invention;

[0051] FIG4 is a second structural diagram of a circuit board according to an embodiment of the present invention;

[0052] FIG5 is a third structural diagram of a circuit board according to an embodiment of the present invention;

[0053] FIG6 is a schematic diagram of a module of a microwave generating device according to an embodiment of the present invention;

[0054] 7 is a schematic diagram of partial circuit connections of a power device according to an embodiment of the present invention;

[0055] FIG8 is a schematic structural diagram of a transformer according to an embodiment of the present invention;

[0056] FIG9 is a side view of a transformer according to an embodiment of the present invention;

[0057] FIG10 is a schematic structural diagram of a skeleton assembly and a magnetic core assembly according to an embodiment of the present invention;

[0058] FIG11 is a schematic structural diagram of a first skeleton according to an embodiment of the present invention;

[0059] FIG12 is a schematic structural diagram of a first skeleton according to an embodiment of the present invention;

[0060] FIG13 is a schematic structural diagram of a second skeleton according to an embodiment of the present invention;

[0061] 14 is a schematic structural diagram of a second skeleton and a magnetic core assembly according to an embodiment of the present invention;

[0062] FIG15 is a schematic structural diagram of a third skeleton according to an embodiment of the present invention;

[0063] FIG16 is a schematic diagram showing the positions of the first baffle and the second baffle according to an embodiment of the present invention;

[0064] FIG17 is a schematic diagram of another position of the first baffle and the second baffle according to an embodiment of the present invention;

[0065] FIG18 is another schematic diagram of the positions of the first baffle and the second baffle according to an embodiment of the present invention;

[0066] FIG19 is another schematic diagram of the positions of the first blocking piece and the second blocking piece according to an embodiment of the present invention.

[0067] Description of main component symbols:

[0068] 100, circuit board; 10, substrate; 20, power device; 21, rectifier diode; 22, package body; 24, fixing hole; 26, first pin; 27, high-voltage pin; 28, low-voltage pin; 30, screw; 40, heat sink; 42, heat transfer portion; 44, fitting surface; 46, top fin; 48, side fin; 50, transformer; 60, busbar capacitor; 70, differential-mode inductor; 80, resonant capacitor; 82, accommodation space;

[0069] 112. Skeleton assembly; 114. Second pin; 116. Primary winding slot; 118. Secondary winding slot; 120. First baffle; 122. Second baffle; 124. Third baffle; 126. Support plate; 128. Magnetic core assembly; 130. First magnetic core; 132. Capacitor assembly; 134. First skeleton; 136. Second skeleton; 138. First accommodating groove; 140. Through hole; 142. Second accommodating groove; 144. Second magnetic core; 146. First connecting portion; 148. First extending portion; 150. Second connecting portion; 152. Second extending portion; 154. First limiting groove; 156. Second limiting groove; 158. Fixing portion; 160. Strip groove; 164. Third skeleton; 166. Air gap;

[0070] 1000. Microwave generating equipment. DETAILED DESCRIPTION

[0071] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0072] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more, unless otherwise specifically specified.

[0073] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections. They can refer to mechanical connections or electrical connections. They can refer to direct connections or indirect connections through an intermediary. They can refer to internal communication between two components or interactions between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0074] The disclosure of this application provides many different embodiments or examples for realizing the different structures of this application. In order to simplify the disclosure of this application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit this application. In addition, this application may repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the application provides various specific examples of processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0075] Referring to FIG1 , a circuit board 100 according to an embodiment of the present invention is used in a microwave generating device 1000. Circuit board 100 includes a substrate 10 and a power device 20. Power device 20 includes an integrated rectifier bridge stack (not shown) and an insulated gate bipolar transistor (IGBT) (not shown). Power device 20 is disposed on substrate 10.

[0076] The above-mentioned circuit board 100 integrates the rectifier bridge stack and the insulated gate bipolar transistor into a power device 20, making the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor more compact, thereby reducing the space occupied by the circuit board 100, thereby reducing the volume of the circuit board 100, and facilitating the miniaturization of the circuit board 100.

[0077] Specifically, power semiconductor devices are required in the driving power supply circuit of the microwave generating device 1000. Rectifier bridge stacks and insulated gate bipolar transistors are power semiconductor devices. Rectifier bridge stacks can be used to convert alternating current into direct current. Insulated gate bipolar transistors can be used to control resonant circuits. In the embodiment shown in Figure 1, the rectifier bridge stack and the insulated gate bipolar transistor can be integrated into a power device 20. The substrate 10 can be rectangular. The substrate 10 can support the power device 20. The power device 20 is arranged on the substrate 10 near the edge of the circuit board 100, which can make the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor more compact, thereby reducing the space occupied by the circuit board 100, thereby reducing the volume of the circuit board 100, and facilitating the miniaturization of the circuit board 100.

[0078] 2 , in some embodiments, the power device 20 includes a package body 22 in a rectangular parallelepiped shape.

[0079] In this way, it can be more compatible with the shapes of existing rectifier bridge stacks and insulated gate bipolar transistors, facilitate integration and more effectively reduce the size of the power device 20.

[0080] Specifically, the power device 20 includes a package body 22. The package body 22 may be in the shape of a rectangular parallelepiped. In FIG1 , the length direction of the circuit board 100 may be represented by L. The package body 22 may be arranged above the substrate 10 along the L direction of the circuit board 100. By designing the package body 22 into a rectangular parallelepiped, it is possible to better be compatible with the shapes of existing rectifier bridge stacks and insulated gate bipolar transistors, facilitate integration, and more effectively reduce the volume of the power device 20. In addition, in other embodiments, the package body 22 may also be configured into an oval shape or other shapes for better compatibility, which are not specifically limited here.

[0081] 1 and 2 , in some embodiments, fixing holes 24 are formed on both sides of the package body 22. The circuit board 100 further includes a heat sink 40 disposed on the substrate 10. The package body 22 is attached to the heat sink 40 through the fixing holes 24.

[0082] In this way, the package body 22 can be better fitted to the heat sink 40 , thereby improving the heat dissipation effect.

[0083] Specifically, in the embodiment shown in Figure 2, the length direction of the package body 22 can be represented by K. The package body 22 is provided with two fixing holes 24. The two fixing holes 24 can be respectively arranged on both sides of the package body 22 near the middle along the K direction of the package body 22. The fixing holes 24 can be arc-shaped, and the side walls of the fixing holes 24 can be connected to the side surfaces of the package body 22. In Figure 1, the heat sink 40 can be arranged on the substrate 10 near the edge of the substrate 10. The circuit board 100 is provided with screws 30. Fixing holes 24 can be pierced on both sides of the package body 22 by screws 30, so that the package body 22 can be fitted and fixed on the radiator 40, near one end of the radiator 40.

[0084] It should be noted that the arc-shaped fixing holes 24 facilitate disassembly of the package body 22, improving work efficiency. In one embodiment, when disassembling the package body 22, the screws 30 on one side of the package body 22 can be completely unscrewed first, and then the screws 30 on the other side of the package body 22 can be loosened without completely unscrewing them. The package body 22 can then be removed, thereby increasing the speed of disassembly. In other embodiments, the number of fixing holes 24 can be not only two, but also three or other numbers, and the shape of the fixing holes 24 can be not only arc-shaped but also other shapes, which are not specifically limited here.

[0085] Referring to Figures 1 and 3 , in certain embodiments, the heat sink 40 includes a sheet-shaped heat transfer portion 42 disposed on the substrate 10. The heat transfer portion 42 includes a contact surface 44. The heat sink 40 includes side fins 48 extending outward from the side of the heat transfer portion 42 opposite the contact surface 44, and top fins 46 extending upward from the end of the heat transfer portion 42 away from the substrate 10. The package 22 is contacted with the contact surface 44.

[0086] In this way, the space can be used to arrange fins, increase the heat dissipation area while reserving space to accommodate the power device 20. This can effectively control the volume of the heat sink 40 and make the structure of the heat sink 40 and the power device 20 more compact, thereby controlling the volume of the circuit board 100 as a whole.

[0087] Specifically, in the embodiment shown in Figure 3, the heat sink 40 is provided with a heat transfer portion 42. The heat transfer portion 42 may be in the form of a sheet and is provided on the substrate 10. The heat transfer portion 42 is provided with a fitting surface 44, which is located on one side of the heat transfer portion 42. The package body 22 can be fitted and fixed on the heat transfer portion 42 through the fitting surface 44. The heat sink 40 is also provided with side fins 48 and top fins 46. The side fins 48 may be provided on a side of the heat transfer portion 42 opposite to the fitting surface 44 and may extend outward. The top fins 46 may be provided on an end of the heat transfer portion 42 away from the substrate 10 and may extend upward. In Figure 3, five top fins 46 are provided. Four side fins 48 are provided. By arranging the top fin 46 and the side fin 48 respectively at the end of the heat transfer portion 42 away from the substrate 10 and on the side opposite to the bonding surface 44, the heat dissipation area can be increased while reserving space to accommodate the power device 20. This can effectively control the volume of the heat sink 40 and make the structure of the heat sink 40 and the power device 20 more compact, thereby controlling the volume of the circuit board 100 as a whole.

[0088] In addition, the number of the top fins 46 and the side fins 48 may also be other numbers, which can be adjusted according to specific circumstances and are not specifically limited here.

[0089] 8 to 19 , a circuit board 100 includes a transformer 50. The transformer 50 includes a substrate 10, a skeleton assembly 112, and a magnetic core assembly 128. The skeleton assembly 112 is mounted on the substrate 10 and defines a primary winding slot 116 and a secondary winding slot 118. The skeleton assembly 112 is provided with a first stopper 120, a second stopper 122, a third stopper 124, and a support sheet 126. Along the height of the transformer 50, the first stopper 120 covers the top of the primary winding slot 116 or the top of the secondary winding slot 118, and the second stopper 122 covers the bottom of the primary winding slot 116 or the bottom of the secondary winding slot 118.

[0090] The magnetic core assembly 128 is installed on the skeleton assembly 112. The magnetic core assembly 128 includes a first magnetic core 130. The first magnetic core 130 is arranged on the side where the secondary winding groove 118 is located. The substrate 10 is provided with a capacitor assembly 132 on the side where the first magnetic core 130 is located. The support plate 126 abuts the top of the capacitor assembly 132. The support plate 126 separates the first magnetic core 130 and the capacitor assembly 132 in the height direction of the transformer 50. A second pin 114 is arranged between the capacitor assembly 132. The third blocking plate 124 is connected to the support plate 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114.

[0091] In this way, the first baffle 120 of the skeleton component 112 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 above, and the second baffle 122 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 below, so as to meet the insulation safety distance of the primary winding slot 116 and the secondary winding slot 118. The support piece 126 abuts the top of the capacitor component 132 to fix the capacitor component 132. The third baffle 124 covers at least a portion of the second pin 114, so as to meet the insulation safety distance between the first magnetic core 130 and the second pin 114, avoiding the insulation safety distance being met by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer 50 and reduce the cost of the transformer 50.

[0092] Specifically, referring to Figures 8 and 10, the skeleton assembly 112 of the transformer 50 is mounted on the substrate 10, and the magnetic core assembly 128 is fixed to the skeleton assembly 112. The surface of the skeleton assembly 112 is provided with a primary winding groove 116 and a secondary winding groove 118. The primary winding groove 116 and the secondary winding groove 118 are grooves for winding coils. They are one of the key components of the transformer 50, and their main functions are to fix the coils, protect the coils, increase magnetic flux, and reduce leakage magnetic flux. In the working state, there is a high voltage on one side of the primary winding groove 116 and the other side of the secondary winding groove 118, so the two need to meet the corresponding insulation safety distance. In the related art, the insulation safety distance is met by extending the height of the side walls of the primary winding groove 116 and the secondary winding groove 118, that is, by increasing the height of the skeleton wall or the skeleton. This often makes the transformer 50 too large.

[0093] Refer to Figures 10 and 16-19, which are simplified schematic diagrams of various positions of the first and second baffles in an embodiment of the present invention. Along the height of the transformer 50, the first baffle 120 of the skeleton assembly 112 covers the upper portion of the notch of the primary winding slot 116 or the notch of the secondary winding slot 118, while the second baffle 122 of the skeleton assembly 112 covers the lower portion of the notch of the primary winding slot 116 or the notch of the secondary winding slot 118. This ensures a safe insulation distance between the primary winding slot 116 and the secondary winding slot 118, significantly reducing the size and cost of the transformer 50. In this embodiment, refer to Figures 10 and 16, along the height of the transformer 50, the first baffle 120 of the skeleton assembly 112 covers the upper portion of the notch of the primary winding slot 116, while the second baffle 122 of the skeleton assembly 112 covers the lower portion of the notch of the primary winding slot 116. 10 and 17 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the secondary winding slot 118, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the secondary winding slot 118. Referring to FIG10 and 18 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the secondary winding slot 118, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the primary winding slot 116. Referring to FIG10 and 19 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the primary winding slot 116, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the secondary winding slot 118.

[0094] Referring to Figures 8 and 9 , a magnetic core assembly 128 is mounted on the skeleton assembly 112. A first magnetic core 130 of the magnetic core assembly 128 is positioned on the side where the secondary winding slot 118 is located. A capacitor assembly 132 is provided on the substrate 10 on the side where the first magnetic core 130 is located. The first magnetic core 130 and the capacitor assembly 132 are spaced apart in the height direction of the transformer 50. In some embodiments, the capacitor assembly 132 may include two voltage-doubling rectifier capacitors spaced apart on the substrate 10. A support plate 126 of the skeleton assembly 112 abuts the top of the capacitor assembly 132, separating the first magnetic core 130 and the capacitor assembly 132 in the height direction of the transformer 50. A second pin 114 is provided between the capacitor assembly 132. In some embodiments, the second pin 114 may be the output terminal of the secondary winding coil of the transformer 50, or the second pin 114 may be connected to the output terminal of the secondary winding coil of the transformer 50. The third stopper 124 of the skeleton assembly 112 is connected to the support sheet 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114. In this way, the support sheet 126 abuts the top of the capacitor assembly 132, securing the capacitor assembly 132 to the substrate 10. This prevents the capacitor assembly 132, i.e., the voltage-doubling rectifier capacitor, from floating and causing a cold solder joint during wave soldering of the substrate 10. Furthermore, the third stopper 124 is connected to the support sheet 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114. This increases the insulation safety distance between the second pin 114 and the first magnetic core 130.

[0095] In some embodiments, referring to Figures 8, 10-13, the skeleton assembly 112 includes a first skeleton 134 and a second skeleton 136, the primary winding groove 116 and the secondary winding groove 118 are arranged on the first skeleton 134, the first baffle 120, the second baffle 122, the third baffle 124 and the support plate 126 are arranged on the second skeleton 136, the first skeleton 134 is provided with a first receiving groove 138, a through hole 140 and a second receiving groove 142 that are interconnected, the first magnetic core 130 is located in the first receiving groove 138 and the through hole 140, the magnetic core assembly 128 also includes a second magnetic core 144, and the second magnetic core 144 is located in the second receiving groove 142 and the through hole 140.

[0096] In this way, the first frame 134 can fix the magnetic core assembly 128 , and the arrangement of the first blocking piece 120 , the second blocking piece 122 and the third blocking piece 124 on the second frame 136 can meet the insulation safety distance.

[0097] Specifically, referring to Figures 8, 11, and 13, the skeleton assembly 112 includes a first skeleton 134 and a second skeleton 136. The primary winding slot 116 and the secondary winding slot 118 are disposed on the first skeleton 134. Referring to Figures 8, 10-12, the first receiving slot 138, the through-hole 140, and the second receiving slot 142 on the first skeleton 134 are interconnected. The first magnetic core 130 of the magnetic core assembly 128 is located in the first receiving slot 138 and the through-hole 140, and the second magnetic core 144 of the magnetic core assembly 128 is located in the second receiving slot 142 and the through-hole 140. In this manner, the first skeleton 134 can secure the magnetic core assembly 128. Furthermore, as mentioned above, the first blocking piece 120 and the second blocking piece 122 of the second skeleton 136 can ensure a safe insulation distance between the primary winding slot 116 and the secondary winding slot 118. The third stopper 124 of the second bobbin 136 increases the insulation safety distance between the second pin 114 and the first magnetic core 130. In some embodiments, to meet the volume adaptability requirements of the transformer 50, one or two of the first stopper 120, the second stopper 122, and the third stopper 124 may be present in the transformer 50. That is, only one or two of the first stopper 120, the second stopper 122, and the third stopper 124 may be present in the transformer 50.

[0098] In some embodiments, referring to Figures 8, 11 and 12, the first magnetic core 130 includes a first connecting portion 146 and a first extension portion 148, and the second magnetic core 144 includes a second connecting portion 150 and a second extension portion 152. The first connecting portion 146 is located in the first accommodating groove 138, the first extension portion 148 is located in the through hole 140, the second connecting portion 150 is located in the second accommodating groove 142, and the second extension portion 152 is located in the through hole 140.

[0099] In this way, the first receiving groove 138 , the through hole 140 and the second receiving groove 142 on the first frame 134 can fix the magnetic core assembly 128 .

[0100] Specifically, referring to Figures 8, 11, and 12, the first skeleton 134 is provided with a first receiving groove 138, a through hole 140, and a second receiving groove 142 that are interconnected. The first connecting portion 146 of the first magnetic core 130 is located in the first receiving groove 138 of the first skeleton 134, and the first extending portion 148 is located in the through hole 140. The second connecting portion 150 of the second magnetic core 144 is located in the second receiving groove 142, and the second extending portion 152 is located in the through hole 140. The first skeleton 134 secures the magnetic core assembly 128. The magnetic core assembly 128 improves the efficiency and power density of the transformer 50 and reduces power loss, and is therefore a very important component of the transformer 50.

[0101] In some embodiments, referring to Figures 13 and 14, the second skeleton 136 includes a first limiting groove 154 and a second limiting groove 156, the first connecting portion 146 is located in the first limiting groove 154 to limit the first magnetic core 130, the second connecting portion 150 is located in the second limiting groove 156 to limit the second magnetic core 144, and there is a gap between the first extension portion 148 and the second extension portion 152.

[0102] As such, the gap between the first extension portion 148 and the second extension portion 152 forms an air gap 166 .

[0103] Specifically, referring to Figures 13 and 14, the second skeleton 136 includes a first limiting groove 154 and a second limiting groove 156. The first connecting portion 146 is located in the first limiting groove 154 to limit the first magnetic core 130. The second connecting portion 150 is located in the second limiting groove 156 to limit the second magnetic core 144. There is a gap between the first extension portion 148 and the second extension portion 152, which forms an air gap 166 between the first magnetic core 130 and the second magnetic core 144. The air gap 166 between the first magnetic core 130 and the second magnetic core 144 can improve the efficiency of the transformer 50 and reduce energy loss. The appropriate design of the air gap 166 can help control the flow path of the magnetic flux and the magnetic field distribution, thereby making the transformer 50 work more stably and reliably. In this embodiment, a suitable air gap 166 can be obtained by reasonably setting the second skeleton 136.

[0104] In some embodiments, referring to FIG. 8 , FIG. 11 , and FIG. 13 , the first skeleton 134 and the second skeleton 136 are detachably connected.

[0105] In this way, the first frame 134 and the second frame 136 are detachably connected so that the primary winding groove 116 and the secondary winding groove 118 of the first frame 134 can be easily wound.

[0106] Specifically, referring to Figures 8, 11, and 13, the first frame 134 and the second frame 136 are detachably connected. In some embodiments, to install the transformer 50, the primary winding slots 116 and the secondary winding slots 118 in the first frame 134 are first wound, and then the second frame 136 is installed on the first frame 134. After the first frame 134 and the second frame 136 are installed, the magnetic core assembly 128 is installed on the frame assembly 112.

[0107] In some embodiments, referring to FIG. 8 , FIG. 10 and FIG. 11 , a plurality of fixing portions 158 are protruded from the outer side of the top wall of the first receiving groove 138 , and the plurality of fixing portions 158 form a plurality of strip-shaped grooves 160 .

[0108] In this way, the multiple fixing portions 158 protruding from the outer side of the top wall of the first accommodating groove 138 increase the insulation safety distance between the secondary winding groove 118 and the first magnetic core 130, and the strip grooves 160 formed by the fixing portions 158 facilitate wiring.

[0109] Specifically, referring to Figures 8, 10, and 11, the first magnetic core 130 is disposed within the first accommodating groove 138. The secondary winding groove 118 is separated from the first magnetic core 130 by the top and side walls of the first accommodating groove 138. A plurality of fixing portions 158 protruding from the outside of the top wall of the first accommodating groove 138 can increase the insulation safety distance between the secondary winding groove 118 and the first magnetic core 130. Furthermore, the plurality of fixing portions 158 are formed with strip grooves 160, which can be used for routing wires. In some embodiments, the strip grooves 160 can be used to secure the filament of a magnetron.

[0110] In some embodiments, referring to Figures 8, 10 and 15, a heat sink 40 is provided on the substrate 10, and the heat sink 40 is provided on the side where the second magnetic core 144 is located. The skeleton assembly 112 also includes a third skeleton 164, which separates the second magnetic core 144 and the heat sink 40.

[0111] In this way, the heat sink 40 can dissipate heat for the transformer 50 , and the third skeleton 164 can increase the insulation safety distance between the second magnetic core 144 and the heat sink 40 .

[0112] Specifically, referring to FIG8 , a heat sink 40 is provided on the substrate 10, located on the side where the second magnetic core 144 is located. The heat sink 40 is used to dissipate heat from the transformer 50, controlling and stabilizing the temperature of the transformer 50 and preventing excessive heat generated by current flowing through the transformer 50 from causing internal temperature increases within the transformer 50, which could affect the performance and lifespan of the transformer 50. Furthermore, the skeleton assembly 112 also includes a third skeleton 164, which separates the second magnetic core 144 from the heat sink 40. Specifically, referring to FIG10 and FIG15 , the third skeleton 164 connects to the outer side of the top wall of the second accommodating groove 142 and extends toward the side where the substrate 10 is located, separating the second magnetic core 144 from the heat sink 40. This increases the insulation safety distance between the second magnetic core 144 and the heat sink 40, while also increasing the insulation safety distance between the primary winding groove 116 and the second magnetic core 144.

[0113] In some embodiments, referring to FIG. 10 and FIG. 15 , the first frame 134 and the third frame 164 are detachably connected.

[0114] In this way, the installation of the skeleton assembly 112 and the magnetic core assembly 128 is facilitated.

[0115] 10 and 15 , the first frame 134 is detachably connected to the third frame 164. As described above, after the first frame 134 and the second frame 136 are installed and the magnetic core assembly 128 is installed, the third frame 164 is installed on one side of the second magnetic core 144.

[0116] 3 and 4 , in some embodiments, the heat sink 40 is disposed on the side of the second magnetic core 144 . The skeleton assembly 112 further includes a third skeleton 164 . The third skeleton 164 is attached to the top fin 46 . The power device 20 is disposed between the third skeleton 164 and the heat transfer portion 42 .

[0117] In this way, the fitting arrangement is conducive to improving the heat dissipation efficiency. While ensuring the heat dissipation efficiency of the transformer 50 , the structure of the transformer 50 , the power device 20 and the heat sink 40 is more compact, and the volume of the circuit board 100 can be better controlled.

[0118] Specifically, in Figure 3, the transformer 50, as the main component on the circuit board 100, can be arranged in a central position close to the substrate 10. The transformer 50 is provided with a third skeleton 164. The third skeleton 164 can be arranged on the substrate 10. The third skeleton 164 can be fitted with the top fin 46 on one end away from the substrate 10 and close to the heat sink 40. The power device 20 can be fixedly connected to the fitting surface 44 and arranged below the top fin 46, between the third skeleton 164 and the heat transfer portion 42. In other words, by fitting the third skeleton 164 with the top fin 46, it is beneficial to improve the heat dissipation efficiency. While ensuring the heat dissipation efficiency of the transformer 50, the structure of the transformer 50, the power device 20 and the heat sink 40 is more compact, and the volume of the circuit board 100 can be better controlled.

[0119] Referring to Figures 2 and 3 , in some embodiments, the power device 20 includes a plurality of first pins 26 . The plurality of first pins 26 extend downward from the package body 22 . The power device 20 is secured to the substrate 10 via the plurality of first pins 26 . The plurality of first pins 26 include a plurality of high-current pins 27 and a plurality of low-current pins 28 . The plurality of high-current pins 27 are adjacently arranged. The plurality of low-current pins 28 are adjacently arranged.

[0120] In this way, the arrangement of multiple first pins 26 simplifies the design structure of the circuit board 100 , which helps to reduce the volume of the circuit board 100 .

[0121] Specifically, in Figure 2, the power device 20 is provided with seven first pins 26. The seven first pins 26 are arranged at the bottom of the package body 22 and extend downward. The power device 20 can be fixed on the substrate 10 through the seven first pins 26. The seven first pins 26 include two high-current pins 27 and three low-current pins 28. The two high-current pins 27 are arranged adjacent to each other and are arranged at one end close to the package body 22. The three low-current pins 28 are arranged adjacent to each other and are arranged at the other end close to the package body 22. The design of multiple first pins 26 can simplify the layout design of the circuit board 100 to a certain extent, thereby making the design structure of the circuit board 100 simple, which is conducive to reducing the volume of the circuit board 100.

[0122] In addition, in the embodiment shown in Figure 7, the power device 20 includes a rectifier bridge stack and an insulated gate bipolar transistor. Four rectifier diodes 21 may be provided in the circuit of the rectifier bridge stack. In one embodiment, by inputting AC power to the high-voltage pin 27, the rectifier diodes 21 convert the AC power into DC power, which can be output from the low-voltage pin 28. The rectifier bridge stack can be represented by S1. The insulated gate bipolar transistor can be represented by S2.

[0123] 5 , in some embodiments, the circuit board 100 includes a bus capacitor 60 and a differential mode inductor 70. The bus capacitor 60 is disposed between the differential mode inductor 70 and the transformer 50. The differential mode inductor 70 and the bus capacitor 60 are sequentially arranged on the substrate 10.

[0124] In this way, the width of the circuit board 100 can be reduced, thereby reducing the volume of the circuit board 100 .

[0125] Specifically, in the embodiment shown in FIG5 , the width direction of the circuit board 100 can be represented by D. The differential-mode inductor 70 can be disposed near one side of the circuit board 100. The busbar capacitor 60 can be disposed between the differential-mode inductor 70 and the third bobbin 164. The differential-mode inductor 70 and the busbar capacitor 60 can be arranged sequentially on the substrate 10 in a direction perpendicular to the D direction, thereby reducing the width of the circuit board 100 and thereby reducing the volume of the circuit board 100.

[0126] 1 and 3 , in some embodiments, the circuit board 100 includes a resonant capacitor 80 . An accommodation space 82 is formed between the top fin 46 and the substrate 10 . The resonant capacitor 80 is placed in the accommodation space 82 .

[0127] In this way, the resonant capacitor 80 can be placed in the accommodating space 82 , making the structure between the resonant capacitor 80 and the heat sink 40 compact, thereby reducing the volume of the circuit board 100 .

[0128] Specifically, in the embodiment shown in FIG1 , the heat sink 40 can be disposed at a position away from the center of the circuit board 100. The heat sink 40 can have a T-shaped structure. The top fin 46 can cooperate with the substrate 10 to form a receiving space 82. The resonant capacitor 80 can be inserted into the substrate 10 and located in the receiving space 82. The resonant capacitor 80 is disposed close to the heat transfer portion 42. Since the resonant capacitor 80 is disposed in the receiving space 82, heat can be dissipated from the top and side surfaces of the resonant capacitor 80, thereby improving heat dissipation efficiency and further reducing the volume of the circuit board 100.

[0129] Furthermore, in related technologies, high voltages exist between the primary and secondary ends of transformers. To maintain safe insulation spacing between the primary and secondary windings, the height of the bobbin wall between the primary and secondary windings is generally increased. Furthermore, to maintain safe insulation spacing between the secondary winding pins and the magnetic core, the bobbin height is generally increased, as is the height of the magnetic core. This often results in an overly large transformer and high manufacturing costs.

[0130] Referring to Figures 8 to 19, a transformer 50 according to an embodiment of the present invention includes a circuit board 10, a skeleton assembly 112 and a magnetic core assembly 128. The skeleton assembly 112 is mounted on the circuit board 10. The skeleton assembly 112 is provided with a primary winding groove 116 and a secondary winding groove 118. The skeleton assembly 112 is provided with a first baffle 120, a second baffle 122, a third baffle 124 and a support plate 126. Along the height direction of the transformer 50, the first baffle 120 covers the notch of the primary winding groove 116 or the upper part of the notch of the secondary winding groove 118, and the second baffle 122 covers the notch of the primary winding groove 116 or the lower part of the notch of the secondary winding groove 118.

[0131] The magnetic core assembly 128 is installed on the skeleton assembly 112. The magnetic core assembly 128 includes a first magnetic core 130. The first magnetic core 130 is arranged on the side where the secondary winding groove 118 is located. The circuit board 10 is provided with a capacitor assembly 132 on the side where the first magnetic core 130 is located. The support plate 126 abuts the top of the capacitor assembly 132. The support plate 126 separates the first magnetic core 130 and the capacitor assembly 132 in the height direction of the transformer 50. A second pin 114 is arranged between the capacitor assembly 132. The third blocking plate 124 is connected to the support plate 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114.

[0132] In this way, the first baffle 120 of the skeleton component 112 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 above, and the second baffle 122 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 below, so as to meet the insulation safety distance of the primary winding slot 116 and the secondary winding slot 118. The support piece 126 abuts the top of the capacitor component 132 to fix the capacitor component 132. The third baffle 124 covers at least a portion of the second pin 114, so as to meet the insulation safety distance between the first magnetic core 130 and the second pin 114, avoiding the insulation safety distance being met by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer 50 and reduce the cost of the transformer 50.

[0133] Specifically, referring to Figures 8 and 10, the skeleton assembly 112 of the transformer 50 is mounted on the circuit board 10, and the magnetic core assembly 128 is fixed to the skeleton assembly 112. The surface of the skeleton assembly 112 is provided with a primary winding groove 116 and a secondary winding groove 118. The primary winding groove 116 and the secondary winding groove 118 are grooves for winding coils. They are one of the key components of the transformer 50, and their main functions are to fix the coils, protect the coils, increase magnetic flux, and reduce leakage magnetic flux. In the working state, there is a high voltage on one side of the primary winding groove 116 and the other side of the secondary winding groove 118, so the two need to meet the corresponding insulation safety distance. In the related art, the insulation safety distance is met by extending the height of the side walls of the primary winding groove 116 and the secondary winding groove 118, that is, by increasing the height of the skeleton wall or the skeleton. This often makes the transformer 50 too large.

[0134] Refer to Figures 10 and 16-19, which are simplified schematic diagrams of various positions of the first and second baffles in an embodiment of the present invention. Along the height of the transformer 50, the first baffle 120 of the skeleton assembly 112 covers the upper portion of the notch of the primary winding slot 116 or the notch of the secondary winding slot 118, while the second baffle 122 of the skeleton assembly 112 covers the lower portion of the notch of the primary winding slot 116 or the notch of the secondary winding slot 118. This ensures a safe insulation distance between the primary winding slot 116 and the secondary winding slot 118, significantly reducing the size and cost of the transformer 50. In this embodiment, refer to Figures 10 and 16, along the height of the transformer 50, the first baffle 120 of the skeleton assembly 112 covers the upper portion of the notch of the primary winding slot 116, while the second baffle 122 of the skeleton assembly 112 covers the lower portion of the notch of the primary winding slot 116. 10 and 17 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the secondary winding slot 118, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the secondary winding slot 118. Referring to FIG10 and 18 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the secondary winding slot 118, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the primary winding slot 116. Referring to FIG10 and 19 , along the height of the transformer 50, the first stopper 120 of the frame assembly 112 covers the upper portion of the slot opening of the primary winding slot 116, and the second stopper 122 of the frame assembly 112 covers the lower portion of the slot opening of the secondary winding slot 118.

[0135] Referring to Figures 8 and 9 , a magnetic core assembly 128 is mounted on the bobbin assembly 112. A first magnetic core 130 of the magnetic core assembly 128 is positioned on the side where the secondary winding slot 118 is located. A capacitor assembly 132 is provided on the circuit board 10 on the side where the first magnetic core 130 is located. The first magnetic core 130 and the capacitor assembly 132 are spaced apart in the height direction of the transformer 50. In some embodiments, the capacitor assembly 132 may include two voltage-doubling rectifier capacitors spaced apart on the circuit board 10. A support plate 126 of the bobbin assembly 112 abuts the top of the capacitor assembly 132, separating the first magnetic core 130 and the capacitor assembly 132 in the height direction of the transformer 50. A second pin 114 is provided between the capacitor assembly 132. In some embodiments, the second pin 114 may be the output terminal of the secondary winding coil of the transformer 50, or the second pin 114 may be connected to the output terminal of the secondary winding coil of the transformer 50. The third stopper 124 of the skeleton assembly 112 is connected to the support sheet 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114. In this way, the support sheet 126 abuts the top of the capacitor assembly 132, securing the capacitor assembly 132 to the circuit board 10. This prevents the capacitor assembly 132, i.e., the voltage-doubling rectifier capacitor, from floating and causing a cold solder joint during wave soldering of the circuit board 10. Furthermore, the third stopper 124 is connected to the support sheet 126 and extends toward the side where the capacitor assembly 132 is located to cover at least a portion of the second pin 114. This increases the insulation safety distance between the second pin 114 and the first magnetic core 130.

[0136] In some embodiments, referring to Figures 8, 10-13, the skeleton assembly 112 includes a first skeleton 134 and a second skeleton 136, the primary winding groove 116 and the secondary winding groove 118 are arranged on the first skeleton 134, the first baffle 120, the second baffle 122, the third baffle 124 and the support plate 126 are arranged on the second skeleton 136, the first skeleton 134 is provided with a first receiving groove 138, a through hole 140 and a second receiving groove 142 that are interconnected, the first magnetic core 130 is located in the first receiving groove 138 and the through hole 140, the magnetic core assembly 128 also includes a second magnetic core 144, and the second magnetic core 144 is located in the second receiving groove 142 and the through hole 140.

[0137] In this way, the first frame 134 can fix the magnetic core assembly 128 , and the arrangement of the first blocking piece 120 , the second blocking piece 122 and the third blocking piece 124 on the second frame 136 can meet the insulation safety distance.

[0138] Specifically, referring to Figures 8, 11, and 13, the skeleton assembly 112 includes a first skeleton 134 and a second skeleton 136. The primary winding slot 116 and the secondary winding slot 118 are disposed on the first skeleton 134. Referring to Figures 8, 10-12, the first receiving slot 138, the through-hole 140, and the second receiving slot 142 on the first skeleton 134 are interconnected. The first magnetic core 130 of the magnetic core assembly 128 is located in the first receiving slot 138 and the through-hole 140, and the second magnetic core 144 of the magnetic core assembly 128 is located in the second receiving slot 142 and the through-hole 140. In this manner, the first skeleton 134 can secure the magnetic core assembly 128. Furthermore, as mentioned above, the first blocking piece 120 and the second blocking piece 122 of the second skeleton 136 can ensure a safe insulation distance between the primary winding slot 116 and the secondary winding slot 118. The third stopper 124 of the second bobbin 136 increases the insulation safety distance between the second pin 114 and the first magnetic core 130. In some embodiments, to meet the volume adaptability requirements of the transformer 50, one or two of the first stopper 120, the second stopper 122, and the third stopper 124 may be present in the transformer 50. That is, only one or two of the first stopper 120, the second stopper 122, and the third stopper 124 may be present in the transformer 50.

[0139] In some embodiments, referring to Figures 8, 11 and 12, the first magnetic core 130 includes a first connecting portion 146 and a first extension portion 148, and the second magnetic core 144 includes a second connecting portion 150 and a second extension portion 152. The first connecting portion 146 is located in the first accommodating groove 138, the first extension portion 148 is located in the through hole 140, the second connecting portion 150 is located in the second accommodating groove 142, and the second extension portion 152 is located in the through hole 140.

[0140] In this way, the first receiving groove 138 , the through hole 140 and the second receiving groove 142 on the first frame 134 can fix the magnetic core assembly 128 .

[0141] Specifically, referring to Figures 8, 11, and 12, the first skeleton 134 is provided with a first receiving groove 138, a through hole 140, and a second receiving groove 142 that are interconnected. The first connecting portion 146 of the first magnetic core 130 is located in the first receiving groove 138 of the first skeleton 134, and the first extending portion 148 is located in the through hole 140. The second connecting portion 150 of the second magnetic core 144 is located in the second receiving groove 142, and the second extending portion 152 is located in the through hole 140. The first skeleton 134 secures the magnetic core assembly 128. The magnetic core assembly 128 improves the efficiency and power density of the transformer 50 and reduces power loss, and is therefore a very important component of the transformer 50.

[0142] In some embodiments, referring to Figures 13 and 14, the second skeleton 136 includes a first limiting groove 154 and a second limiting groove 156, the first connecting portion 146 is located in the first limiting groove 154 to limit the first magnetic core 130, the second connecting portion 150 is located in the second limiting groove 156 to limit the second magnetic core 144, and there is a gap between the first extension portion 148 and the second extension portion 152.

[0143] As such, the gap between the first extension portion 148 and the second extension portion 152 forms an air gap 166 .

[0144] Specifically, referring to Figures 13 and 14, the second skeleton 136 includes a first limiting groove 154 and a second limiting groove 156. The first connecting portion 146 is located in the first limiting groove 154 to limit the first magnetic core 130. The second connecting portion 150 is located in the second limiting groove 156 to limit the second magnetic core 144. There is a gap between the first extension portion 148 and the second extension portion 152, which forms an air gap 166 between the first magnetic core 130 and the second magnetic core 144. The air gap 166 between the first magnetic core 130 and the second magnetic core 144 can improve the efficiency of the transformer 50 and reduce energy loss. The appropriate design of the air gap 166 can help control the flow path of the magnetic flux and the magnetic field distribution, thereby making the transformer 50 work more stably and reliably. In this embodiment, a suitable air gap 166 can be obtained by reasonably setting the second skeleton 136.

[0145] In some embodiments, referring to FIG. 8 , FIG. 11 , and FIG. 13 , the first skeleton 134 and the second skeleton 136 are detachably connected.

[0146] In this way, the first frame 134 and the second frame 136 are detachably connected so that the primary winding groove 116 and the secondary winding groove 118 of the first frame 134 can be easily wound.

[0147] Specifically, referring to Figures 8, 11, and 13, the first frame 134 and the second frame 136 are detachably connected. In some embodiments, to install the transformer 50, the primary winding slots 116 and the secondary winding slots 118 in the first frame 134 are first wound, and then the second frame 136 is installed on the first frame 134. After the first frame 134 and the second frame 136 are installed, the magnetic core assembly 128 is installed on the frame assembly 112.

[0148] In some embodiments, referring to FIG. 8 , FIG. 10 and FIG. 11 , a plurality of fixing portions 158 are protruded from the outer side of the top wall of the first receiving groove 138 , and the plurality of fixing portions 158 form a plurality of strip-shaped grooves 160 .

[0149] In this way, the multiple fixing portions 158 protruding from the outer side of the top wall of the first accommodating groove 138 increase the insulation safety distance between the secondary winding groove 118 and the first magnetic core 130, and the strip grooves 160 formed by the fixing portions 158 facilitate wiring.

[0150] Specifically, referring to Figures 8, 10, and 11, the first magnetic core 130 is disposed within the first accommodating groove 138. The secondary winding groove 118 is separated from the first magnetic core 130 by the top and side walls of the first accommodating groove 138. A plurality of fixing portions 158 protruding from the outside of the top wall of the first accommodating groove 138 can increase the insulation safety distance between the secondary winding groove 118 and the first magnetic core 130. Furthermore, the plurality of fixing portions 158 are formed with strip grooves 160, which can be used for routing wires. In some embodiments, the strip grooves 160 can be used to secure the filament of a magnetron.

[0151] In some embodiments, referring to Figures 8, 10 and 15, a heat sink 40 is provided on the circuit board 10, and the heat sink 40 is provided on the side where the second magnetic core 144 is located. The skeleton assembly 112 also includes a third skeleton 164, which separates the second magnetic core 144 and the heat sink 40.

[0152] In this way, the heat sink 40 can dissipate heat for the transformer 50 , and the third skeleton 164 can increase the insulation safety distance between the second magnetic core 144 and the heat sink 40 .

[0153] Specifically, referring to FIG8 , a heat sink 40 is provided on the circuit board 10, located on the side where the second magnetic core 144 is located. The heat sink 40 is used to dissipate heat from the transformer 50, controlling and stabilizing the temperature of the transformer 50 and preventing excessive heat generated by current flowing through the transformer 50 from causing internal temperature increases within the transformer 50, which could affect the performance and lifespan of the transformer 50. Furthermore, the frame assembly 112 also includes a third frame 164, which separates the second magnetic core 144 from the heat sink 40. Specifically, referring to FIG10 and FIG15 , the third frame 164 connects to the outer side of the top wall of the second accommodating groove 142 and extends toward the side where the circuit board 10 is located, separating the second magnetic core 144 from the heat sink 40. This increases the insulation safety distance between the second magnetic core 144 and the heat sink 40, while also increasing the insulation safety distance between the primary winding groove 116 and the second magnetic core 144.

[0154] In some embodiments, referring to FIG. 10 and FIG. 15 , the first frame 134 and the third frame 164 are detachably connected.

[0155] In this way, the installation of the skeleton assembly 112 and the magnetic core assembly 128 is facilitated.

[0156] 10 and 15 , the first frame 134 is detachably connected to the third frame 164. As described above, after the first frame 134 and the second frame 136 are installed and the magnetic core assembly 128 is installed, the third frame 164 is installed on one side of the second magnetic core 144.

[0157] A household appliance according to an embodiment of the present invention includes the transformer 50 according to any one of the above embodiments, or the circuit board 100 according to any one of the above embodiments.

[0158] When the above-mentioned household appliance includes a transformer 50, the first baffle 120 of the skeleton component 112 covers the slot of the primary winding groove 116 or the upper part of the slot of the secondary winding groove 118, and the second baffle 122 covers the slot of the primary winding groove 116 or the lower part of the slot of the secondary winding groove 118, so as to facilitate the insulation safety distance between the primary winding groove 116 and the secondary winding groove 118. The support piece 126 abuts the top of the capacitor assembly 132 to fix the capacitor assembly 132. The third baffle 124 covers at least a portion of the pin 114, so as to facilitate the insulation safety distance between the first magnetic core 130 and the pin 114, avoiding the insulation safety distance being met by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer 50 and reduce the cost of the transformer 50.

[0159] Specifically, in the above-mentioned household appliance, the household appliance includes a transformer 50, and the transformer 50 includes a circuit board 100, a skeleton component 112 and a magnetic core component 128. The skeleton component 112 is installed on the circuit board 100, and the skeleton component 112 is provided with a primary winding groove 116 and a secondary winding groove 118. The skeleton component 112 is provided with a first baffle 120, a second baffle 122, a third baffle 124 and a support plate 126. Along the height direction of the transformer 50, the first baffle 120 covers the notch of the primary winding groove 116 or the upper part of the notch of the secondary winding groove 118, and the second baffle 122 covers the notch of the primary winding groove 116 or the upper part of the notch of the secondary winding groove 118. Below the notch of the slot 118; the magnetic core assembly 128 is installed on the skeleton assembly 112, the magnetic core assembly 128 includes a first magnetic core 130, the first magnetic core 130 is arranged on the side where the secondary winding slot 118 is located, the circuit board 100 is provided with a capacitor assembly 132 on the side where the first magnetic core 130 is located, the support sheet 126 abuts the top of the capacitor assembly 132, the support sheet 126 separates the first magnetic core 130 and the capacitor assembly 132 in the height direction of the transformer 50, and pins 114 are arranged between the capacitor assemblies 132, and the third blocking sheet 124 is connected to the support sheet 126 and extends to the side where the capacitor assembly 132 is located to cover at least a portion of the pins 114.

[0160] The first baffle 120 of the skeleton assembly 112 covers the slot of the primary winding slot 116 or the slot above the secondary winding slot 118, and the second baffle 122 covers the slot of the primary winding slot 116 or the slot below the secondary winding slot 118, so as to meet the insulation safety distance between the primary winding slot 116 and the secondary winding slot 118. The support piece 126 abuts the top of the capacitor assembly 132 to fix the capacitor assembly 132. The third baffle 124 covers at least a portion of the pin 114, so as to meet the insulation safety distance between the first magnetic core 130 and the pin 114, avoiding the need to meet the insulation safety distance by increasing the skeleton wall height or the skeleton height, which can greatly reduce the volume of the transformer 50 and reduce the cost of the transformer 50.

[0161] When the above-mentioned household appliance includes a circuit board 100, by integrating the rectifier bridge stack and the insulated gate bipolar transistor into a power device 20, the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor is made more compact, thereby reducing the space occupied by the circuit board 100, thereby reducing the volume of the circuit board 100, which is conducive to the miniaturization of the circuit board 100.

[0162] In some embodiments, the household appliance includes an inverter microwave oven.

[0163] Specifically, a variable-frequency microwave oven can be used to heat food. It can adjust its energy output based on the food's characteristics and cooking requirements, allowing for more even heating and achieving more efficient cooking results. Furthermore, a variable-frequency microwave oven offers more precise temperature regulation and heat preservation capabilities, meeting the requirements of different food types and making cooking more convenient and controllable. The variable-frequency microwave oven may include an inverter, which includes a transformer 50.

[0164] 1 to 7 and 8 to 19 , a microwave generating device 1000 according to an embodiment of the present invention includes a circuit board 100 according to any one of the above embodiments, or a transformer 50 according to any one of the above embodiments.

[0165] When the microwave generating device 1000 includes a circuit board 100, the rectifier bridge stack and the insulated gate bipolar transistor are integrated into a power device 20, so that the combined structure of the rectifier bridge stack and the insulated gate bipolar transistor is more compact, thereby reducing the space occupied by the circuit board 100, thereby reducing the volume of the circuit board 100, and facilitating the miniaturization of the circuit board 100.

[0166] Specifically, microwave generating device 1000 comprises a variable frequency microwave oven. A heat dissipation duct (not shown) is provided within microwave generating device 1000, and circuit board 100 can be positioned within the duct. By rationally designing the layout of components on circuit board 100 based on the heat dissipation duct, the space occupied by circuit board 100 can be reduced, miniaturizing circuit board 100 and facilitating the overall design of microwave generating device 1000.

[0167] When the microwave generating device 1000 includes a transformer 50, the first baffle 120 of the skeleton assembly 112 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 above, and the second baffle 122 covers the slot of the primary winding slot 116 or the slot of the secondary winding slot 118 below, so as to facilitate the insulation safety distance between the primary winding slot 116 and the secondary winding slot 118. The support sheet 126 abuts the top of the capacitor assembly 132 to fix the capacitor assembly 132. The third baffle 124 covers at least a portion of the pin 114, so as to facilitate the insulation safety distance between the first magnetic core 130 and the pin 114, avoiding the need to increase the skeleton wall height or the skeleton height to meet the insulation safety distance, which can greatly reduce the volume of the transformer 50 and reduce the cost of the transformer 50.

[0168] In the description of this specification, reference to the terms "one embodiment," "some embodiments," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in any one or more embodiments or examples.

[0169] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board for a microwave generating device, characterized in that: The circuit board comprises: substrate; and A power device, comprising an integrated rectifier bridge stack and an insulated gate bipolar transistor, and the power device is arranged on the substrate.

2. The circuit board according to claim 1, characterized in that: The power device includes a package body in a rectangular parallelepiped shape.

3. The circuit board according to claim 2, characterized in that: Fixing holes are formed on both sides of the packaging body, and the circuit board also includes a heat sink arranged on the substrate, and the packaging body is attached to the heat sink through the fixing holes.

4. The circuit board according to claim 2 or 3, characterized in that: The power device comprises: A plurality of pins are provided, wherein the plurality of pins extend downward from the package body, and the power device is fixed on the substrate through the plurality of pins. The plurality of pins include a plurality of high-voltage pins and a plurality of low-voltage pins. The plurality of high-voltage pins are arranged adjacent to each other, and the plurality of low-voltage pins are arranged adjacent to each other.

5. The circuit board according to claim 3 or 4, characterized in that: The heat sink includes a sheet-shaped heat transfer portion arranged on the substrate, the heat transfer portion includes a bonding surface, the heat sink includes side fins extending outward from the side of the heat transfer portion opposite to the bonding surface and a top fin extending upward from an end of the heat transfer portion away from the substrate, and the packaging body is bonded to the bonding surface.

6. The circuit board according to claim 5, characterized in that: The circuit board includes a resonant capacitor, an accommodation space is formed between the top fin and the substrate, and the resonant capacitor is placed in the accommodation space.

7. The circuit board according to any one of claims 1 to 6, characterized in that: The circuit board includes a transformer, and the transformer includes: A skeleton component, the skeleton component is mounted on the substrate, the skeleton component is provided with a primary winding groove and a secondary winding groove, the skeleton component is provided with a first baffle, a second baffle, a third baffle and a support sheet, along the height direction of the transformer, the first baffle covers the notch of the primary winding groove or the upper part of the notch of the secondary winding groove, the second baffle covers the notch of the primary winding groove or the lower part of the notch of the secondary winding groove, and; A magnetic core assembly, wherein the magnetic core assembly is mounted on the skeleton assembly, the magnetic core assembly includes a first magnetic core, the first magnetic core is arranged on the side where the secondary winding slot is located, the substrate is provided with a capacitor assembly on the side where the first magnetic core is located, the support sheet abuts against the top of the capacitor assembly, the support sheet separates the first magnetic core and the capacitor assembly in the height direction of the transformer, pins are arranged between the capacitor assemblies, and the third baffle is connected to the support sheet and extends to the side where the capacitor assembly is located to cover at least a portion of the pins.

8. The circuit board according to claim 7, characterized in that: The skeleton assembly includes a first skeleton and a second skeleton, the primary winding groove and the secondary winding groove are arranged on the first skeleton, the first baffle, the second baffle, the third baffle and the support plate are arranged on the second skeleton, the first skeleton is provided with a first receiving groove, a through hole and a second receiving groove which are interconnected, the first magnetic core is located in the first receiving groove and the through hole, and the magnetic core assembly also includes a second magnetic core, and the second magnetic core is located in the second receiving groove and the through hole.

9. The circuit board according to claim 7 or 8, characterized in that: The first magnetic core includes a first connecting portion and a first extending portion, and the second magnetic core includes a second connecting portion and a second extending portion, the first connecting portion is located in the first accommodating groove, the first extending portion is located in the through hole, the second connecting portion is located in the second accommodating groove, and the second extending portion is located in the through hole.

10. The circuit board according to claim 8 or 9, characterized in that: The second skeleton includes a first limiting groove and a second limiting groove, the first connecting portion is located in the first limiting groove to limit the first magnetic core, the second connecting portion is located in the second limiting groove to limit the second magnetic core, and there is a gap between the first extending portion and the second extending portion.

11. The circuit board according to any one of claims 8 to 10, characterized in that: The first frame and the second frame are detachably connected.

12. The circuit board according to claim 8 or 9, characterized in that: A plurality of fixing parts are protruded from the outer side of the top wall of the first accommodating groove, and the plurality of fixing parts form a plurality of strip grooves.

13. The circuit board according to any one of claims 8 to 10, characterized in that: The heat sink is arranged on the side where the second magnetic core is located, the skeleton assembly further includes a third skeleton, the third skeleton is attached to the top fin, and the power device is arranged between the third skeleton and the heat transfer part.

14. The circuit board according to any one of claims 7 to 13, characterized in that: The circuit board comprises: bus capacitance; and The differential mode inductor and the bus capacitor are arranged between the differential mode inductor and the transformer, and the differential mode inductor and the bus capacitor are arranged in sequence on the substrate.

15. A transformer, characterized in that: include: Circuit boards; A skeleton component, the skeleton component is mounted on the circuit board, the skeleton component is provided with a primary winding groove and a secondary winding groove, the skeleton component is provided with a first baffle, a second baffle, a third baffle and a support sheet, along the height direction of the transformer, the first baffle covers the notch of the primary winding groove or the upper part of the notch of the secondary winding groove, the second baffle covers the notch of the primary winding groove or the lower part of the notch of the secondary winding groove, and; A magnetic core assembly, wherein the magnetic core assembly is mounted on the skeleton assembly, the magnetic core assembly includes a first magnetic core, the first magnetic core is arranged on the side where the secondary winding slot is located, the circuit board is provided with a capacitor assembly on the side where the first magnetic core is located, the support sheet abuts against the top of the capacitor assembly, the support sheet separates the first magnetic core and the capacitor assembly in the height direction of the transformer, a second pin is arranged between the capacitor assemblies, and the third baffle is connected to the support sheet and extends to the side where the capacitor assembly is located to cover at least a portion of the second pin.

16. The transformer according to claim 15, characterized in that The skeleton assembly includes a first skeleton and a second skeleton, the primary winding groove and the secondary winding groove are arranged on the first skeleton, the first baffle, the second baffle, the third baffle and the support plate are arranged on the second skeleton, the first skeleton is provided with a first receiving groove, a through hole and a second receiving groove which are interconnected, the first magnetic core is located in the first receiving groove and the through hole, and the magnetic core assembly also includes a second magnetic core, and the second magnetic core is located in the second receiving groove and the through hole.

17. The transformer according to claim 16, characterized in that The first magnetic core includes a first connecting portion and a first extending portion, and the second magnetic core includes a second connecting portion and a second extending portion, the first connecting portion is located in the first accommodating groove, the first extending portion is located in the through hole, the second connecting portion is located in the second accommodating groove, and the second extending portion is located in the through hole.

18. The transformer according to claim 16 or 17, characterized in that: The second skeleton includes a first limiting groove and a second limiting groove, the first connecting portion is located in the first limiting groove to limit the first magnetic core, the second connecting portion is located in the second limiting groove to limit the second magnetic core, and there is a gap between the first extending portion and the second extending portion.

19. The transformer according to any one of claims 16 to 18, characterized in that: The first frame and the second frame are detachably connected.

20. The transformer according to any one of claims 16 to 19, characterized in that: A plurality of fixing parts are protruded from the outer side of the top wall of the first accommodating groove, and the plurality of fixing parts form a plurality of strip grooves.

21. The transformer according to any one of claims 16 to 20, characterized in that: A heat sink is arranged on the circuit board, and the heat sink is arranged on the side where the second magnetic core is located. The skeleton assembly also includes a third skeleton, and the third skeleton separates the second magnetic core and the heat sink.

22. The transformer according to claim 21, characterized in that The first frame is detachably connected to the third frame.

23. The transformer according to any one of claims 15 to 17, characterized in that: The second pin is an output terminal of the secondary winding coil of the transformer, or the second pin is connected to an output terminal of the secondary winding coil of the transformer.

24. A microwave generating device, characterized in that: It comprises the circuit board described in any one of claims 1 to 14, or the transformer described in any one of claims 15 to 23.

25. A household appliance, characterized in that: It comprises the circuit board described in any one of claims 1 to 14, or the transformer described in any one of claims 15 to 23.

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