Heat dissipation device and manufacturing method for heat dissipation device

Abstract

The present application discloses a heat dissipation device and a manufacturing method for a heat dissipation device. The heat dissipation device comprises: a cover body and a bottom plate assembly; the bottom plate assembly comprises a heat dissipation chamber, a plurality of thermally conductive members are arranged in a first area of the heat dissipation chamber at a first interval, and a plurality of thermally conductive members are arranged in a second area of the heat dissipation chamber at a second interval, wherein the first interval is smaller than the second interval; the cover body at least covers the heat dissipation chamber, and the cover body is provided with a liquid inlet and a liquid outlet which are communicated with the heat dissipation chamber; and when a chip is in a mounting state, the surface of the bottom plate assembly distant from the cover body is in contact with the chip, a third area of the chip corresponds to the first area, and a fourth area of the chip corresponds to the second area, wherein the temperature of the third area is higher than that of the fourth area.

Description

Heat dissipation device and method for manufacturing heat dissipation device

[0001] Cross-references

[0002] The present invention claims priority to the Chinese patent application filed with the Patent Office of China on June 27, 2023, with application number 202310775898.9 and invention name “Heat dissipation device and manufacturing method of heat dissipation device”. The entire contents of the application are incorporated into the present invention by reference. Technical Field

[0003] The present application relates to the field of heat dissipation equipment, and in particular to a heat dissipation device and a method for manufacturing the heat dissipation device. Background Art

[0004] Since their advent in the late 1950s, semiconductor integrated circuits have rapidly developed toward smaller sizes, higher speeds, and greater storage capacities. However, with the advent of the post-Moore era, the growth of integrated circuit transistor density has slowed. In particular, in the fields of fifth-generation mobile communication technology (5G), the Internet of Things, high-performance computing, and other high-computing applications, engineers have begun exploring the use of multi-layer packaging technology on larger chips to achieve significant increases in computing power within limited space. This, in turn, places higher demands on chip heat dissipation design. Furthermore, with the advancement of complex packaging processes and the introduction of the large and small core concepts, non-uniform heat generation chips have begun to emerge. These chips can experience extremely high heat fluxes in certain areas, leading to localized hot spots.

[0005] However, most of the heat dissipation devices in the related art are based on conventional microchannel designs with uniform heat sources, which have poor heat dissipation effects on non-uniform heat-generating chips.

[0006] Summary of the Invention

[0007] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device, which can solve the problem of poor heat dissipation effect on non-uniform heat-generating chips in the related art.

[0008] In order to solve the above problems, this application adopts the following technical solutions:

[0009] In a first aspect, an embodiment of the present application discloses a heat dissipation device, comprising: a cover body and a base plate assembly, wherein: the base plate assembly includes a heat dissipation chamber, a first area of ​​the heat dissipation chamber arranges a plurality of heat-conducting members at a first interval, and a second area of ​​the heat dissipation chamber arranges a plurality of heat-conducting members at a second interval, wherein the first interval is smaller than the second interval; the cover body at least covers the heat dissipation chamber, and the cover body is provided with a liquid inlet and a liquid outlet connected to the heat dissipation chamber; when the chip is in an installed state, the surface of the base plate assembly away from the cover body contacts the chip, the third area of ​​the chip corresponds to the first area, and the fourth area of ​​the chip corresponds to the second area, wherein the temperature of the third area is higher than the temperature of the fourth area.

[0010] In a second aspect, an embodiment of the present application discloses a method for manufacturing a heat dissipation device, comprising: welding a cover body, a separator plate and a jet plate in sequence to form a first body of the heat dissipation device; welding a frame plate and a bottom plate in sequence to form a second body of the heat dissipation device, wherein the frame plate is provided with a heat dissipation chamber; welding the first body and the second body in sequence to form the heat dissipation device.

[0011] The embodiment of the present application provides a heat dissipation device, which arranges denser heat-conducting parts in the first area of ​​the heat dissipation chamber of the base plate assembly and sparser heat-conducting parts in the second area of ​​the heat dissipation chamber. The high-temperature area of ​​the chip corresponds to the first area, and the low-temperature area of ​​the chip corresponds to the second area. When the chip is dissipating heat, the liquid flows into the heat dissipation chamber through the liquid inlet opened on the cover body, and then the liquid in the heat dissipation chamber flows out through the liquid outlet opened on the cover body. While achieving local high heat control of the chip, it can maintain good temperature uniformity and improve the heat dissipation effect of the non-uniform heat-generating chip. In addition, by dissipating heat from the chip through the heat dissipation device provided by the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, thereby ensuring the service life and packaging life of the high-power large chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG1 is a schematic structural diagram of a heat dissipation device disclosed in an embodiment of the present application;

[0013] FIG2 is a schematic structural diagram of a base plate assembly disclosed in an embodiment of the present application;

[0014] FIG3 is a schematic structural diagram of a heat conducting member disclosed in an embodiment of the present application;

[0015] FIG4 is a schematic diagram of liquid flow of a liquid separator plate disclosed in an embodiment of the present application;

[0016] FIG5 is a schematic structural diagram of a jet plate disclosed in an embodiment of the present application;

[0017] FIG6 is a cross-sectional view of a heat dissipation device disclosed in an embodiment of the present application;

[0018] FIG7 is a schematic structural diagram of a frame plate disclosed in an embodiment of the present application;

[0019] FIG8 is a flow chart of a method for manufacturing a heat dissipation device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0021] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0022] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device. FIG1 is a schematic structural diagram of a heat dissipation device disclosed in an embodiment of the present application, and FIG2 is a schematic structural diagram of a base plate assembly disclosed in an embodiment of the present application.

[0023] As shown in Figures 1 and 2, the heat dissipation device disclosed in the present application includes: a cover body 100 and a base plate assembly 200, wherein: the base plate assembly 200 includes a heat dissipation chamber 211, a first area 222 of the heat dissipation chamber 211 arranges a plurality of heat-conducting members 221 at a first interval, and a second area 223 of the heat dissipation chamber 211 arranges a plurality of heat-conducting members 221 at a second interval, wherein the first interval is smaller than the second interval; the cover body 100 at least covers the heat dissipation chamber 211, and the cover body 100 is provided with a liquid inlet 110 and a liquid outlet 120 connected to the heat dissipation chamber 211; when the chip is in an installed state, the surface of the base plate assembly 200 away from the cover body 100 contacts the chip, the third area of ​​the chip corresponds to the first area 222, and the fourth area of ​​the chip corresponds to the second area 223, wherein the temperature of the third area is higher than the temperature of the fourth area.

[0024] It should be noted that the height of the heat conducting member 221 is smaller than the height of the heat dissipation chamber 211. For example, as shown in FIG3 , the height h of the heat conducting member 221 is pin It can be 0.7 to 0.8 times the height of the heat dissipation chamber 211. In addition, the thickness of the cover 100 can be 300-500 μm, and the diameters of the liquid inlet 110 and the liquid outlet 120 can be 5-8 mm.

[0025] With the heat dissipation device disclosed in the present application, liquid enters the heat dissipation chamber 211 through the liquid inlet 110 opened on the cover body 100, and heat conduction is carried out by contact between the heat conductive member 221 and the liquid in the heat dissipation chamber 211, thereby achieving heat dissipation of the chip arranged under the base plate assembly 200, and then the liquid in the heat dissipation chamber 211 flows out through the liquid outlet 120 opened on the cover body 100.

[0026] The solution disclosed in the present application arranges the heat-conducting members 221 relatively densely in the first area 222 of the base plate assembly 200 corresponding to the high heat flux density area of ​​the chip, that is, the surface area of ​​the heat-conducting members 221 in contact with the liquid in the first area 222 is relatively large, and arranges the heat-conducting members 221 relatively sparsely in the second area 223 of the base plate assembly 200 corresponding to the low heat flux density area of ​​the chip, that is, the surface area of ​​the heat-conducting members 221 in contact with the liquid in the second area 223 is relatively small. This can achieve local high heat control of the chip while maintaining good temperature uniformity, thereby improving the heat dissipation effect of the non-uniformly heated chip.

[0027] The embodiment of the present application provides a heat dissipation device, which arranges denser heat-conducting members 221 in the first area 222 of the heat dissipation chamber 211 of the base plate assembly 200, and sparser heat-conducting members 221 in the second area 223 of the heat dissipation chamber 211. The high-temperature area of ​​the chip corresponds to the first area 222, and the low-temperature area of ​​the chip corresponds to the second area 223. When the chip is dissipating heat, the liquid flows into the heat dissipation chamber 211 through the liquid inlet 110 opened on the cover body 100, and then the liquid in the heat dissipation chamber 211 flows out through the liquid outlet 120 opened on the cover body 100. While achieving local high heat control of the chip, it can maintain good temperature uniformity and improve the heat dissipation effect of the non-uniform heat-generating chip. In addition, by dissipating heat from the chip through the heat dissipation device provided by the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, thereby ensuring the service life and packaging life of the high-power large chip.

[0028] In the present application, the heat conducting member 221 may be a microneedle. Using microneedle as the heat conducting member 221 can effectively enhance the overall heat transfer effect, avoid the occurrence of local hot spots, and achieve better temperature control in high heat flux density areas. It should be noted that the microneedle can be a rectangular columnar structure, which is not specifically limited in this application.

[0029] In one implementation, when the heat conductive member 221 is a rectangular columnar structure, the spacing length between the heat conductive members 221 may be equal to the width of the bottom surface of the rectangular columnar structure. That is, the bottom surface width of the heat conductive member 221 disposed in the first region 222 is smaller than the bottom surface width of the heat conductive member 221 disposed in the second region 223. When the heat conductive member 221 is a square columnar structure, the spacing length between the heat conductive members 221 may be equal to the side length of the square bottom surface of the square columnar structure. That is, the square bottom surface of the heat conductive member 221 disposed in the first region 222 is smaller than the square bottom surface of the heat conductive member 221 disposed in the second region 223. For example, as shown in FIG. 3 , the side length d of the square bottom surface of the heat conductive member 221 disposed in the first region 222 is pin It can be 150-300um, the first interval w pin The side length d of the bottom square of the heat conducting member 221 disposed in the second region 223 may be 150-300 μm. pin It can be 300-500um, the second interval w pin In addition, the height of the heat conducting member 221 arranged in the first area 222 and the height of the heat conducting member 221 arranged in the second area 223 can be set according to actual heat dissipation requirements. For example, the height of the heat conducting member 221 arranged in the first area 222 can be set to be greater than the height of the heat conducting member 221 arranged in the second area 223.

[0030] In an embodiment of the present application, as shown in Figure 1, the heat dissipation device may also include a uniform flow component 300, the uniform flow component 300 includes a plurality of uniform flow channels 311 and a plurality of drainage channels 312, the uniform flow channels 311 and the drainage channels 312 are arranged alternately, the plurality of uniform flow channels 311 are connected to the liquid inlet 110, the uniform flow channel 311 is provided with a plurality of liquid outlet holes 321 at intervals, the liquid outlet holes 321 are connected to the uniform flow channel 311 and the heat dissipation chamber 211, and the plurality of drainage channels 312 are connected to the liquid outlet 120 and the heat dissipation chamber 211.

[0031] The multiple flow channels 311 and the multiple drainage channels 312 on the flow equalizer assembly 300 can be arranged alternately along a predetermined direction of the flow equalizer assembly 300. For example, the drainage channels 312 are arranged in the order of 1, 3, and 5, and the flow equalizer channels 311 are arranged in the order of 2, 4, and 6 along the predetermined direction of the flow equalizer assembly 300. The liquid outlet holes 321 can be arranged in a single row or multiple rows along the flow equalizer channels 311. For example, the diameter of the liquid outlet holes 321 can be 0.8-1.2 mm, and the spacing between the liquid outlet holes 321 can be 2.5-4 mm.

[0032] When the chip is cooled, the liquid flows into the multiple uniform flow channels 311 on the uniform flow assembly 300 through the liquid inlet 110 opened on the cover body 100. After the liquid flows uniformly in each uniform flow channel 311, it vertically impacts the heat dissipation chamber 211 with the heat conductor 221 through the liquid outlet 321, completing the distributed jet and cooling the chip. Then the liquid passes through the drainage channel 312 and flows out from the liquid outlet 120. The design of the liquid outlet 321 adopted in this application can increase the flow rate of the liquid flowing downward, thereby increasing the disturbance and enhancing the heat exchange. The heat dissipation chamber 211 can provide a mixed flow space, extend the jet path, and enhance the heat dissipation effect.

[0033] The heat dissipation device disclosed in the present application can improve the overall heat exchange effect, reduce flow resistance, and improve temperature uniformity by adding a flow uniformity component 300 between the cover body 100 and the base plate component 200.

[0034] In one implementation, the drainage channel 312 may be a strip-shaped drainage frame, thereby increasing the outflow speed of the liquid.

[0035] In an embodiment of the present application, the uniform flow component 300 may include a liquid separation plate 310 and a jet plate 320, the liquid separation plate 310 includes the multiple uniform flow channels 311 and the multiple drainage channels 312, the jet plate 320 includes the multiple liquid outlet holes 321 and the multiple drainage frames 322, the liquid outlet holes 321 correspond to the uniform flow channels 311, the drainage frames 322 correspond to the drainage channels 312, and the drainage frames 322 connect the drainage channels 312 and the heat dissipation chamber 211.

[0036] In the present application, the uniform flow assembly 300 can be composed of a liquid separator 310 and a jet plate 320. The flow direction of the liquid in the liquid separator 310 is shown in FIG4 . The liquid separator 310 includes a plurality of uniform flow channels 311 and a plurality of drainage channels 312. The plurality of uniform flow channels 311 and the plurality of drainage channels 312 can be alternately arranged along the preset direction of the liquid separator 310. For example, along the preset direction of the liquid separator 310, the plurality of drainage channels 311 are arranged in the order of 1, 3, and 5, and 2, 4, and 6 uniform flow channels 311. Exemplarily, the thickness of the liquid separator 310 can be 1-1.5 mm, the plurality of uniform flow channels 311 can be a rake-shaped structure, the plurality of drainage channels 312 can also be a rake-shaped structure, the width of the uniform flow channels 311 can be 1-1.5 mm, and the width of the drainage channels 312 can be 1-1.5 mm.

[0037] In one implementation, the liquid separation plate 310 may also include a liquid inlet collection chamber and a liquid outlet collection chamber, the liquid inlet collection chamber is connected to multiple uniform flow channels 311, and the liquid outlet collection chamber is connected to the drainage channel 312. The liquid flowing in through the liquid inlet 110 flows through the liquid inlet collection chamber and the uniform flow channel 311 in sequence, and the liquid flowing out passes through the drainage channel 312 and the liquid outlet collection chamber in sequence, and then flows out from the liquid outlet 120.

[0038] The structure of the jet plate 320 is shown in Figure 5. The jet plate 320 includes multiple liquid outlets 321 and multiple drainage frames 322. Along the preset direction of the jet plate 320, the drainage frames 322 are arranged in rows 1, 3, and 5, and the liquid outlets 321 are arranged in rows 2, 4, and 6. It should be noted that the preset direction of the jet plate 320 is the same as the preset direction of the liquid separator 310. The drainage frames 322 correspond to the drainage channels 312, and the liquid outlets 321 correspond to the uniform flow channels 311. For example, the thickness of the jet plate 320 can be 300-500μm, the drainage frames 322 can be strip-shaped square frames, the length of the drainage frames 322 can be 20-35mm, and the width of the drainage frames 322 can be 1-1.5mm.

[0039] Figure 6 is a cross-sectional view of the heat dissipation device. When the chip is dissipating heat, the liquid flows into the multiple uniform flow channels 311 on the liquid separation plate 310 through the liquid inlet 110 opened on the cover body 100. After the liquid flows uniformly in each uniform flow channel 311, it vertically impacts the heat dissipation chamber 211 with the heat conductor 221 through the liquid outlet 321, completing the distributed jet and dissipating heat to the chip. Then, the liquid passes through the drainage frame 322 and the drainage channel 312 in sequence and flows out from the liquid outlet 120.

[0040] In the embodiment of the present application, the arrangement area of ​​the uniform flow channel 311 and the drainage channel 312 can be larger than the arrangement area of ​​the heat conducting member 221 on the base plate assembly 200, thereby being able to dissipate heat from the chip more evenly.

[0041] In one implementation, the base plate assembly 200 may include a frame plate 210 and a base plate 220. As shown in FIG7 , the frame plate 210 is provided with the heat dissipation chamber 211. The first region 222 of the base plate 220 is provided with a plurality of heat conducting members 221 arranged at the first intervals, and the second region 223 of the base plate 220 is provided with a plurality of heat conducting members 221 arranged at the second intervals. It should be noted that the positions of the first region 222 and the second region 223 shown in FIG2 are merely examples, and the specific arrangements of the first region 222 and the second region 223 are not specifically limited in this application.

[0042] For example, the thickness of the frame plate 210 may be 600-1500 μm, and correspondingly, the height of the heat dissipation chamber 211 may be 600-1500 μm, and the length l of the heat dissipation chamber 211 may be 1000 μm. cell The width w of the heat dissipation chamber 211 can be 35-40 mm. cell The thickness of the bottom plate 220 may be 30-35 mm, and the thickness of the bottom plate 220 may be 400-600 μm.

[0043] In one implementation, the area of ​​the arrangement region of the heat conducting member 221 on the base plate assembly 200 is larger than the area of ​​the chip, thereby better achieving heat dissipation for the chip.

[0044] Since copper has high thermal conductivity and low cost, the entire material of the heat dissipation device can be red copper.

[0045] The heat sink and chip are packaged as one to achieve embedded cooling of the chipset, which can reduce the interface thermal resistance. Since the chip is a silicon-based chip, when the chip and the heat sink are welded by diffusion heat, there is a problem of interface reliability risk due to the inconsistent thermal expansion coefficient of copper and silicon. Based on this, in this application, the heat sink can also include a metal transition layer, which is arranged between the base plate assembly 200 and the chip. This application can solve the problem of interface reliability risk due to the inconsistent thermal expansion coefficient of copper and silicon by providing a metal transition layer to separate the base plate assembly 200 from the chip.

[0046] In one implementation, the metal transition layer can be formed by performing TI / NI-Pt-Au sputtering metallization on the surface of the base plate assembly 200 close to the chip. In addition, the temperature of the diffusion heat welding between the chip and the heat sink can be reduced, reducing the impact on the performance of the chip itself.

[0047] The present application also discloses a method for manufacturing a heat dissipation device, as shown in FIG8 . The method includes:

[0048] S820: Welding the cover 100, the liquid separation plate 310 and the jet plate 320 into a first main body of the heat dissipation device.

[0049] S840: Welding the frame plate 210 and the bottom plate 220 into a second body of the heat dissipation device, wherein the frame plate 210 is provided with a heat dissipation chamber 211 .

[0050] S860: Welding the first body and the second body into the heat dissipation device.

[0051] According to the manufacturing method disclosed in the present application, the cover 100, the separator plate 310 and the jet plate 320 are first diffusion-welded in sequence to form the first body of the heat dissipation device, the frame plate 210 and the bottom plate 220 are diffusion-welded in sequence to form the second body of the heat dissipation device, and then the first body and the second body are diffusion-welded or solder-welded in sequence to form the heat dissipation device. Since the pressure required for diffusion welding the first body and the second body is less than the pressure required for diffusion welding the five-layer integral structure of the cover 100, the separator plate 310, the jet plate 320, the frame plate 210 and the bottom plate 220, the possibility of collapse of the heat dissipation chamber 211 can be reduced. When the first body and the second body are soldered, there is no pressure, and thus the problem of uneven force on the heat dissipation chamber 211 causing collapse of the heat dissipation chamber 211 will not occur. In addition, the manufacturing method of the heat dissipation device disclosed in the present application can also avoid the phenomenon of liquid channeling between the separator plate 310 and the jet plate 320 caused by misalignment.

[0052] After welding the heat sink, the heat sink is reduced by hydrogen or nitrogen-hydrogen mixed gas to avoid oxidation of the heat sink.

[0053] In addition, the surface of the base plate 220 away from the frame plate 210 can be nano-processed to make the surface smoother, and the surface of the base plate 220 away from the frame plate 210 can be TI / NI-Pt-Au sputtering metallization treated to separate the base plate 220 from the chip, thereby solving the problem of interface reliability risk caused by inconsistent thermal expansion coefficients of copper and silicon.

[0054] In the present application, the cover body 100, the liquid separation plate 310, the jet plate 320, the frame plate 210 and the bottom plate 220 are processed separately. For example, the bottom plate 220 on which the heat conductor 221 is arranged can be processed by computer number control (CNC), cutting process or etching process, the cover body 100, the liquid separation plate 310 and the frame plate 210 can be processed by CNC, and the jet plate 320 can be processed by etching process.

[0055] The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0056] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A heat dissipation device, comprising: A cover and base assembly, wherein: The base plate assembly includes a heat dissipation chamber, a first area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a first interval, and a second area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a second interval, wherein the first interval is smaller than the second interval; The cover body at least covers the heat dissipation chamber, and the cover body is provided with a liquid inlet and a liquid outlet communicating with the heat dissipation chamber; When the chip is in an installed state, the surface of the base plate assembly away from the cover body contacts the chip, the third area of ​​the chip corresponds to the first area, and the fourth area of ​​the chip corresponds to the second area, wherein the temperature of the third area is higher than the temperature of the fourth area.

2. The heat dissipation device according to claim 1, wherein: It also includes a uniform flow component, which includes a plurality of uniform flow channels and a plurality of drainage channels, the uniform flow channels and the drainage channels are alternately arranged, the plurality of uniform flow channels are connected to the liquid inlet, the uniform flow channel is provided with a plurality of liquid outlet holes at intervals, the liquid outlet holes are connected to the uniform flow channel and the heat dissipation chamber, and the plurality of drainage channels are connected to the liquid outlet and the heat dissipation chamber.

3. The heat dissipation device according to claim 2, wherein: The liquid discharge channel is a strip-shaped liquid discharge frame.

4. The heat dissipation device according to claim 2, wherein: The uniform flow component includes a liquid separator plate and a jet plate, the liquid separator plate includes the multiple uniform flow channels and the multiple drainage channels, the jet plate includes the multiple liquid outlet holes and the multiple drainage frames, the liquid outlet holes correspond to the uniform flow channels, the drainage frames correspond to the drainage channels, and the drainage frames connect the drainage channels and the heat dissipation chamber.

5. The heat dissipation device according to claim 2, wherein: The arrangement area of ​​the flow-uniform channel and the drainage channel is larger than the arrangement area of ​​the heat-conducting member on the bottom plate assembly.

6. The heat dissipation device according to claim 1, wherein: The base plate assembly includes a frame plate and a base plate, the frame plate is provided with the heat dissipation chamber, a plurality of heat conducting members are arranged at the first interval in the first area of ​​the base plate, and a plurality of heat conducting members are arranged at the second interval in the second area of ​​the base plate.

7. The heat dissipation device according to claim 1, wherein: The area of ​​the arrangement region of the heat conducting member on the base plate assembly is larger than the area of ​​the chip.

8. The heat dissipation device according to claim 1, wherein: It also includes a metal transition layer, which is arranged between the base plate component and the chip.

9. A method for manufacturing a heat dissipation device, comprising: The cover body, the liquid separation plate and the jet plate are welded into a first main body of the heat dissipation device; Welding a frame plate and a bottom plate into a second body of the heat dissipation device, wherein the frame plate is provided with a heat dissipation chamber; The first body and the second body are welded to form the heat dissipation device.

10. The manufacturing method according to claim 9, wherein: Also includes: The surface of the bottom plate away from the frame plate is subjected to nano-processing and metallization processing.

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