High-frequency heating platform and control method

Abstract

A high-frequency heating platform and a control method, relating to the technical field of radio frequency. The high-frequency heating platform comprises: an information source module, an impedance matching module, an impedance adjusting module, and an outputting module, wherein the impedance adjusting module comprises a driving unit and a variable capacitor; the variable capacitor comprises at least one plate capacitor structure, and each plate capacitor structure comprises a first electrode plate and a second electrode plate. In a heating process, an impedance matching state is detected by means of the impedance matching module, and on the basis of the impedance matching state, the driving unit is controlled to drive the first electrode plate and / or the second electrode plate in one or more plate capacitor structures to change the overlapping area or distance between the first electrode plate and the second electrode plate, so as to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjusting module until impedance matching between the information source module and the outputting module is achieved. The present application can achieve real-time impedance matching between a circuit and a load in a high-frequency heating process.

Description

A high-frequency heating platform and control method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 26, 2023, with application number 202310764353.8 and invention name “A high-frequency heating platform and control method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of radio frequency technology, and in particular to a high-frequency heating platform and a control method. Background Art

[0003] High-frequency heating technology has been widely used across various industries due to its advantages, including fast heating speed, high heating efficiency, uniform heating, and wide applicability. However, the impedance of different loads and the different states of the load after heating vary. For high-frequency circuits, the impedance of the circuit and load must be well matched to reduce reflected power, protect the circuit, and improve heating efficiency. Existing high-frequency heating technology cannot automatically adjust the impedance matching between the load and the circuit.

[0004] Therefore, how to achieve real-time impedance matching between the circuit and the load during high-frequency heating is a technical problem that needs to be urgently solved by those skilled in the art.

[0005] Summary of the Invention

[0006] To solve the above technical problems, the present application provides a high-frequency heating platform that can achieve real-time impedance matching between the circuit and the load during high-frequency heating. The present application also provides a control method for the high-frequency heating platform, which has the same technical effect.

[0007] The first object of this application is to provide a high-frequency heating platform.

[0008] The above-mentioned application objective 1 of this application is achieved through the following technical solutions:

[0009] A high-frequency heating platform comprises: a signal source module, an impedance matching module, an impedance adjustment module, and an output module, wherein the impedance adjustment module is electrically connected to the signal source module and the output module respectively, and the impedance matching module is electrically connected to the impedance adjustment module and the output module respectively, wherein:

[0010] The signal source module is configured to obtain a target heating temperature of a load placed in the output module and output a radio frequency signal according to the target heating temperature;

[0011] The output module receives the radio frequency signal through the impedance adjustment module and heats the load according to the radio frequency signal;

[0012] The impedance adjustment module includes a driving unit and a variable capacitor;

[0013] The variable capacitor includes at least one flat plate capacitor structure, each of which includes a first plate and a second plate;

[0014] The driving unit is drivingly connected to the first electrode plate and / or the second electrode plate;

[0015] The impedance matching module is used to detect the impedance matching state and, based on the impedance matching state, control the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, changing the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself until impedance matching between the source module and the output module is achieved.

[0016] Preferably, in the high-frequency heating platform, the impedance adjustment module further includes a rotating component;

[0017] The driving unit is drivingly connected to the first pole plate and / or the second pole plate through the rotating assembly;

[0018] The driving unit drives the rotating assembly to rotate, thereby changing the overlapping area or distance between the first electrode plate and the second electrode plate.

[0019] Preferably, in the high-frequency heating platform, the impedance adjustment module further includes a limiting component;

[0020] The limiting component is used to limit the flat plate capacitor structure.

[0021] Preferably, in the high-frequency heating platform, the limiting assembly includes two first fixing members fixedly connected to the rotating assembly, and the flat plate capacitor structure is located between the two first fixing members.

[0022] Preferably, in the high-frequency heating platform, the limiting assembly includes a second fixing member, and the second fixing member is fixedly connected to one of the plates in each of the flat plate capacitor structures.

[0023] Preferably, in the high-frequency heating platform, the impedance matching module includes a detection unit and a control unit, wherein:

[0024] The detection unit is used to detect the load impedance of the output module and the impedance of the impedance adjustment module;

[0025] The control unit is configured to compare the sum of the impedance of the impedance adjustment module and the load impedance with the power supply impedance of the signal source module, determine a target impedance based on the comparison result, and control the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures according to the target impedance, and change the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor until the impedance of the impedance adjustment module is equal to the target impedance;

[0026] The sum of the target impedance and the load impedance is equal to the power supply impedance.

[0027] Preferably, in the high-frequency heating platform, the control unit controls the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat-plate capacitor structures according to the target impedance, changes the overlapping area or distance between the first electrode plate and the second electrode plate, and changes the capacitance value of the variable capacitor until the impedance of the impedance adjustment module itself is equal to the target impedance. Specifically,

[0028] When the target impedance is less than the impedance of the impedance adjustment module, controlling the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures so that the overlapping area between the first electrode plate and the second electrode plate increases or the distance between the first electrode plate and the second electrode plate decreases, thereby increasing the capacitance value of the variable capacitor until the impedance of the impedance adjustment module is equal to the target impedance;

[0029] When the target impedance is greater than the self-impedance of the impedance adjustment module, the driving unit is controlled to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, so that the overlapping area between the first electrode plate and the second electrode plate is reduced or the distance is increased, so as to reduce the capacitance value of the variable capacitor until the self-impedance of the impedance adjustment module is equal to the target impedance.

[0030] Preferably, the high-frequency heating platform further includes a power amplifier module, wherein:

[0031] The signal source module is connected to the impedance adjustment module through the power amplifier module;

[0032] The power amplifier module is used to amplify the radio frequency power of the radio frequency signal output by the signal source module;

[0033] Accordingly, the impedance matching module, when detecting the impedance matching state and, based on the impedance matching state, controlling the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, changes the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until the impedance matching of the source module and the output module is achieved, is specifically used to:

[0034] Detecting the impedance matching state, and according to the impedance matching state, controlling the driving unit to drive the first plate and / or the second plate in one or more of the flat plate capacitor structures, changing the overlapping area or distance between the first plate and the second plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until impedance matching between the power amplifier module and the output module is achieved.

[0035] Preferably, the high-frequency heating platform further comprises a power supply module, and the power supply module is used to provide a working voltage to the high-frequency heating platform.

[0036] The second object of this application is to provide a control method for a high-frequency heating platform.

[0037] The second object of the present application is achieved through the following technical solutions:

[0038] A control method for a high-frequency heating platform, the method being applied to any of the above-mentioned high-frequency heating platforms, the high-frequency heating platform comprising a signal source module, an impedance matching module, an impedance adjustment module, and an output module, the impedance adjustment module comprising a drive unit and a variable capacitor, the variable capacitor comprising at least one flat plate capacitor structure, each of the flat plate capacitor structures comprising a first plate and a second plate, the drive unit being drive-connected to the first plate and / or the second plate, the method comprising:

[0039] When the load is placed in the output module, a start control instruction is obtained, and the high-frequency heating platform is started according to the start control instruction;

[0040] Obtaining a target heating temperature of the load placed in the output module, and controlling the signal source module to output a radio frequency signal according to the target heating temperature, so that the output module receives the radio frequency signal through the impedance adjustment module and heats the load according to the radio frequency signal;

[0041] The impedance matching state is detected by the impedance matching module, and according to the impedance matching state, the driving unit is controlled to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, changing the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself until impedance matching between the source module and the output module is achieved.

[0042] The above technical solution performs high-frequency heating on the load based on a high-frequency heating platform. The high-frequency heating platform includes: a signal source module, an impedance matching module, an impedance adjustment module, and an output module, wherein the impedance adjustment module includes a driving unit and a variable capacitor; the variable capacitor includes at least one flat plate capacitor structure, and each flat plate capacitor structure includes a first electrode plate and a second electrode plate; during the heating process, the impedance matching state is detected by the impedance matching module, and according to the impedance matching state, the driving unit is controlled to drive the first electrode plate and / or the second electrode plate in one or more flat plate capacitor structures, changing the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until the impedance matching of the signal source module and the output module is achieved. In summary, the above technical solution can automatically monitor the impedance matching state during the high-frequency heating process, realize real-time impedance matching between the circuit and the load, so as to reduce reflected power, improve heating efficiency, protect the circuit, and save energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] FIG1 is a schematic structural diagram of a high-frequency heating platform in an embodiment of the present application;

[0045] FIG2 is a schematic diagram of a structure of a variable capacitor in an embodiment of the present application;

[0046] FIG3 is another schematic diagram of the structure of a variable capacitor in an embodiment of the present application;

[0047] FIG4 is another structural schematic diagram of the high-frequency heating platform in an embodiment of the present application;

[0048] FIG5 is a flow chart of a control method for a high-frequency heating platform in an embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0050] In the embodiments provided in this application, it should be understood that the disclosed methods and systems can be implemented in other ways. The system embodiments described below are merely illustrative. For example, the division of units and modules is merely a logical function division. In actual implementation, there may be other division methods, such as: multiple units or modules can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or modules, which can be electrical, mechanical or other forms.

[0051] In addition, all functional units in the embodiments of the present application may be integrated into one processor, or each unit may be a separate device, or two or more units may be integrated into one device; each functional unit in the embodiments of the present application may be implemented in the form of hardware or in the form of hardware plus software functional units.

[0052] Those skilled in the art will understand that all or part of the steps of the following method embodiments can be implemented by program instructions and related hardware. The aforementioned program instructions can be stored in a computer-readable storage medium. When the program instructions are executed, the steps of the following method embodiments are executed; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, and other media that can store program codes.

[0053] It should be understood that the use of "system," "device," "unit," and / or "module" in this application is merely a method for distinguishing different units, elements, components, parts, or assemblies at different levels. However, if other words can achieve the same purpose, they can be replaced by other expressions.

[0054] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the description of this application, "plurality" or "several" means two or more, unless otherwise specifically defined.

[0055] If a flow chart is used in this application, the flow chart is used to illustrate the operations performed by the system according to the embodiments of the application. It should be understood that the previous or subsequent operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. At the same time, other operations can be added to these processes, or one or more operations can be removed from these processes.

[0056] It should also be noted that, in this document, terms such as "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such article or device. In the absence of further limitations, elements defined by the phrase "comprises a ..." do not exclude the presence of other identical elements in the article or device comprising the above elements.

[0057] The embodiments of the present application are written in a progressive manner.

[0058] As shown in FIG1 , the embodiment of the present application provides a high-frequency heating platform, comprising: a signal source module 1, an impedance adjustment module 2, an output module 3, and an impedance matching module 4. The impedance adjustment module 2 is electrically connected to the signal source module 1 and the output module 3, respectively. The impedance matching module 4 is electrically connected to the impedance adjustment module 2 and the output module 3, respectively.

[0059] The signal source module 1 is used to obtain the target heating temperature of the load placed in the output module 3 and output a radio frequency signal according to the target heating temperature; the output module 3 receives the radio frequency signal through the impedance adjustment module 2 and heats the load according to the radio frequency signal;

[0060] In this embodiment, the signal source module 1 is the source of the RF signal, capable of outputting an RF signal of a specific frequency. The load can be an object to be heated. Different types of loads or different user requirements can correspond to different target heating temperatures. The signal source module 1 can obtain the target heating temperature of the load and output an RF signal of a preset frequency or power based on the target heating temperature, thereby adaptively heating the load to achieve a better heating effect. The output module 3 is used to place the load, receive the RF signal through the impedance adjustment module 2, and heat the load based on the RF signal. In some embodiments, the output module 3 may include a heating chamber, in which the load is placed. The heating chamber may also be provided with a receiving plate to form a capacitor with the radiating plate. In other embodiments, the heating chamber may be made of metal, with the receiving plate and radiating plate forming a capacitor. In other embodiments, a coil is installed in the heating chamber, and when heating the load, the load is placed in the cylindrical cavity formed by the coil. The output module 3 may also adopt other types of heating structures as appropriate, and this application is not limited thereto.

[0061] The impedance adjustment module 2 includes a driving unit 21 and a variable capacitor 22; the variable capacitor 22 includes at least one flat plate capacitor structure, each flat plate capacitor structure includes a first plate 221 and a second plate 222; the driving unit 21 is drivingly connected to the first plate 221 and / or the second plate 222;

[0062] In this embodiment, as shown in FIG2 , the driving unit 21 can be a driving motor that controls the movement of the first plate 221 and / or the second plate 222. According to the calculation formula of the flat plate capacitor: C = ε*ε0*S / d, where C is the capacitance, ε is the effective dielectric constant between the plates, ε0 is the vacuum dielectric constant, S is the area corresponding to the two plates, and d is the distance between the two parallel plates. It can be seen that by changing the overlapping area or distance between the first plate 221 and the second plate 222, the capacitance value of the variable capacitor 22 can be changed, thereby changing the impedance of the impedance adjustment module 2. In some embodiments, the number of flat plate capacitor structures can be determined according to actual needs. In other embodiments, the impedance adjustment module 2 can also include multiple variable capacitive elements and multiple variable inductive elements to adjust the capacitance of the capacitor and / or the inductance of the inductor in the impedance adjustment module 2 by adjusting the multiple variable capacitive elements and the multiple variable inductive elements, thereby changing the impedance of the impedance adjustment module 2. This application is not limited to this.

[0063] The impedance matching module 4 is used to detect the impedance matching state and, based on the impedance matching state, control the driving unit 21 to drive the first electrode 221 and / or the second electrode 222 in one or more flat plate capacitor structures, thereby changing the overlapping area or distance between the first electrode 221 and the second electrode 222 to change the capacitance value of the variable capacitor 22, thereby changing the impedance of the impedance adjustment module 2 itself, until impedance matching between the source module 1 and the output module 3 is achieved.

[0064] In this embodiment, the purpose of setting up the impedance matching module 4 is to detect and match the impedance of the source module 1 and the output module 3 in real time, and to output the power of the RF signal to the load as much as possible through automatic impedance matching, thereby preventing power reflection in the high-frequency heating platform and improving the heating efficiency. Specifically, the impedance matching module 4 can control the driving unit 21 to drive the first electrode 221 and / or the second electrode 222 in one or more flat plate capacitor structures according to the impedance matching state detected in real time, change the overlapping area or distance between the first electrode 221 and the second electrode 222, so as to change the capacitance value of the variable capacitor 22, thereby changing the impedance of the impedance adjustment module 2 itself, until the impedance matching of the source module 1 and the output module 3 is achieved. In some embodiments, the impedance matching module 4 can detect the incident signal and the reflected signal between the impedance adjustment module 2 and the output module 3, and determine the degree of loss of the signal transmission power between the impedance adjustment module 2 and the output module 3 according to the incident signal and the reflected signal, that is, determine the impedance matching state. Specifically, if the incident signal and the reflected signal are the same and there is no difference, it means that the power generated by the source module 1 is fully transmitted to the output module 3, and the source module 1 and the output module 3 have achieved the best impedance matching effect; if there is a difference between the incident signal and the reflected signal, it means that the power generated by the source module 1 is not fully transmitted to the output module 3, so it is necessary to change the impedance of the impedance adjustment module 2 itself to further achieve impedance matching. The impedance matching module 4 can also reasonably adopt other implementation methods, and this application does not limit this.

[0065] High-frequency heating technology has been widely used across various industries due to its advantages, including fast heating speed, high heating efficiency, uniform heating, and wide applicability. However, the impedance of different loads and the different states of the load after heating vary. For high-frequency circuits, the impedance of the circuit and load must be well matched to reduce reflected power, protect the circuit, and improve heating efficiency. Existing high-frequency heating technology cannot automatically adjust the impedance matching between the load and the circuit.

[0066] In the above embodiment, high-frequency heating is performed on the load based on a high-frequency heating platform. The high-frequency heating platform includes: a source module 1, an impedance adjustment module 2, an output module 3, and an impedance matching module 4, wherein the impedance adjustment module 2 includes a driving unit 21 and a variable capacitor 22; the variable capacitor 22 includes at least one flat plate capacitor structure, each flat plate capacitor structure including a first plate 221 and a second plate 222; during the heating process, the impedance matching module 4 detects the impedance matching state, and controls the driving unit 21 to drive the first plate 221 and / or the second plate 222 in one or more flat plate capacitor structures according to the impedance matching state, changes the overlapping area or distance between the first plate 221 and the second plate 222, so as to change the capacitance value of the variable capacitor 22, thereby changing the impedance of the impedance adjustment module 2 itself, until the impedance matching of the source module 1 and the output module 3 is achieved. In summary, the above embodiment can automatically monitor the impedance matching state during the high-frequency heating process, realize real-time impedance matching between the circuit and the load, thereby reducing reflected power, improving heating efficiency, protecting the circuit, and saving energy consumption.

[0067] As shown in Figure 2 or Figure 3, in other embodiments of the present application, the impedance adjustment module 2 also includes a rotating component 23; a driving unit 21, which is driven and connected to the first pole plate 221 and / or the second pole plate 222 through the rotating component 23; the driving unit 21, by driving the rotating component 23 to rotate, thereby changing the overlapping area or distance between the first pole plate 221 and the second pole plate 222. Specifically, the driving unit 21 can adopt a driving motor, and the rotating component 23 can adopt a screw, the rotating shaft of the driving motor is connected to the screw, and the screw is connected to one end of the first pole plate 221 and / or the second pole plate 222, and the screw is driven by the driving motor to rotate, so that the first pole plate 221 and the second pole plate 222 are moved away from or closer to each other, or the overlapping area between the first pole plate 221 and the second pole plate 222 is changed, thereby adjusting the capacitance value of the variable capacitor to further achieve impedance matching.

[0068] In other embodiments of the present application, the impedance adjustment module 2 further includes a limiting component, which is used to limit the flat plate capacitor structure. In some embodiments, as shown in Figure 2, the limiting component includes two first fixing members 24 fixedly connected to the rotating component 23, and the flat plate capacitor structure is located between the two first fixing members 24, and the first fixing member 24 can be a fixed block. In other embodiments, as shown in Figure 3, the limiting component includes a second fixing member 25, and the second fixing member 25 is fixedly connected to one of the plates in each flat plate capacitor structure, and the second fixing member 25 can be a fixed rod. In the above embodiment, by adding a limiting component to the impedance adjustment module 2, the flat plate capacitor structure is limited, which facilitates the adjustment of the overlapping area or distance between the first plate 221 and the second plate 222.

[0069] As shown in Figure 4, in other embodiments of the present application, the impedance matching module 4 includes a detection unit 41 and a control unit 42, wherein: the detection unit 41 is used to detect the load impedance of the output module 3 and the self-impedance of the impedance adjustment module 2; the control unit 42 is used to compare the sum of the self-impedance and the load impedance of the impedance adjustment module 2 with the power supply impedance of the source module 1, and determine the target impedance based on the comparison result, and control the driving unit 21 to drive the first electrode 221 and / or the second electrode 222 in one or more flat plate capacitor structures according to the target impedance, to change the overlapping area or distance between the first electrode 221 and the second electrode 222 to change the capacitance value of the variable capacitor 22 until the self-impedance of the impedance adjustment module 2 is equal to the target impedance; wherein the sum of the target impedance and the load impedance is equal to the power supply impedance.

[0070] In this embodiment, the power supply impedance can be a preset value, specifically, it can be determined according to the signal source module 1. The detection unit 41 can adopt an existing impedance detection circuit, which is not limited in this application; the control unit 42 compares the sum of the detected load impedance and the impedance adjustment module 2's own impedance with the power supply impedance, and calculates the target impedance, wherein the sum of the target impedance and the load impedance is equal to the power supply impedance; at the same time, according to the target impedance, the impedance adjustment module 2's own impedance is adjusted until the impedance adjustment module 2's own impedance is equal to the target impedance. When the impedance adjustment module 2's own impedance is equal to the target impedance, the power generated by the signal source module 1 can be fully transmitted to the output module 3, so that the RF output circuit reaches the optimal matching state, thereby improving the heating efficiency of the high-frequency heating platform. In some embodiments, the control unit 42 can also monitor the operating status of the high-frequency heating platform, obtain and issue control instructions, collect and process data, and perform communication interactions, etc., which is not limited in this application.

[0071] In other embodiments of the present application, when the control unit 42 controls and adjusts the impedance of the impedance adjustment module 2 according to the target impedance, it is specifically configured to:

[0072] When the target impedance is less than the impedance of the impedance adjustment module 2, the control driving unit 21 drives the first electrode plate 221 and / or the second electrode plate 222 in one or more flat plate capacitor structures, so that the overlapping area between the first electrode plate 221 and the second electrode plate 222 increases or the distance between the first electrode plate 221 and the second electrode plate 222 decreases, thereby increasing the capacitance value of the variable capacitor 22 until the impedance of the impedance adjustment module 2 is equal to the target impedance;

[0073] When the target impedance is greater than the impedance of the impedance adjustment module 2, the control driving unit 21 drives the first electrode plate 221 and / or the second electrode plate 222 in one or more flat plate capacitor structures, so that the overlapping area between the first electrode plate 221 and the second electrode plate 222 is reduced or the distance between them is increased, so as to reduce the capacitance value of the variable capacitor 22 until the impedance of the impedance adjustment module 2 is equal to the target impedance.

[0074] When the target impedance is equal to the impedance of the impedance adjustment module 2 itself, no control operation may be performed on the impedance adjustment module 2 .

[0075] In other embodiments of the present application, the high-frequency heating platform further includes a power amplifier module 5, wherein: the signal source module 1 is connected to the impedance adjustment module 2 through the power amplifier module 5, and the power amplifier module 5 is used to amplify the radio frequency power of the radio frequency signal output by the signal source module 1;

[0076] Accordingly, the impedance matching module 4, when detecting the impedance matching state and adjusting the self-impedance of the impedance adjustment module 2 according to the impedance matching state, is specifically used to: detect the impedance matching state, and according to the impedance matching state, control the driving unit 21 to drive the first electrode 221 and / or the second electrode 222 in one or more flat plate capacitor structures, change the overlapping area or distance between the first electrode 221 and the second electrode 222, so as to change the capacitance value of the variable capacitor 22, thereby changing the self-impedance of the impedance adjustment module 2, until the impedance matching of the power amplifier module 5 and the output module 3 is achieved.

[0077] In this embodiment, the power amplifier module 5 can be a high-frequency amplifier. The high-frequency amplifier needs to meet certain technical indicators to effectively amplify the signal and have the function of transmission. Its main technical indicators include: operating frequency, output power, maximum output efficiency, conversion efficiency and power added efficiency, gain, linearity, etc., which are not limited by this application. Accordingly, the impedance matching module 4 automatically performs impedance matching by matching the impedance of the output module 3 and the power amplifier module 5, so that the power is output to the load as much as possible, preventing power reflection in the high-frequency heating platform, and improving heating efficiency.

[0078] In other embodiments of the present application, the high-frequency heating platform further includes a power supply module 6, which is used to provide an operating voltage to the high-frequency heating platform. In this embodiment, the power supply module 6 can provide an operating voltage to the high-frequency heating platform by connecting to the signal source module 1. The power supply module 6 can be a DC power supply module. The DC power supply module with adjustable voltage can adjust the operating voltage of the power amplifier module 5, thereby changing the output power of the power amplifier module 5. The power adjustment process can meet the heating requirements of different loads, ensure high efficiency of the entire heating process, and also ensure heating efficiency under different process parameters.

[0079] As shown in FIG5 , in another embodiment of the present application, a control method for a high-frequency heating platform is further provided. The method is applied to any of the high-frequency heating platforms described above. The high-frequency heating platform includes a signal source module, an impedance matching module, an impedance adjustment module, and an output module. The impedance adjustment module includes a driving unit and a variable capacitor. The variable capacitor includes at least one flat plate capacitor structure. Each flat plate capacitor structure includes a first plate and a second plate. The driving unit is connected to the first plate and / or the second plate. The method includes:

[0080] S1. After the load is placed in the output module, a start control instruction is obtained and the high-frequency heating platform is started according to the start control instruction;

[0081] S2 obtains the target heating temperature of the load placed in the output module, and controls the source module to output the RF signal according to the target heating temperature, so that the output module receives the RF signal through the impedance adjustment module and heats the load according to the RF signal;

[0082] S3. Detect the impedance matching state through the impedance matching module, and control the driving unit to drive the first plate and / or the second plate in one or more flat plate capacitor structures according to the impedance matching state, change the overlapping area or distance between the first plate and the second plate, so as to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until the impedance matching of the source module and the output module is achieved.

[0083] In this embodiment, a corresponding start control button and a temperature input button can be provided on the high-frequency heating platform. The start control button can be used to obtain a corresponding start control instruction; the temperature input button can be used to obtain the target heating temperature of the load. This is not limited in this application. In this embodiment, high-frequency heating of the load based on the high-frequency heating platform can automatically monitor the impedance matching status during the high-frequency heating process, achieving real-time impedance matching between the circuit and the load, thereby reducing reflected power, improving heating efficiency, protecting the circuit, and saving energy.

[0084] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high frequency heating platform, characterized in that: include: A signal source module, an impedance matching module, an impedance adjustment module, and an output module, wherein the impedance adjustment module is electrically connected to the signal source module and the output module respectively, and the impedance matching module is electrically connected to the impedance adjustment module and the output module respectively, wherein: The signal source module is used to obtain a target heating temperature of a load placed in the output module, and output a radio frequency signal according to the target heating temperature; The output module receives the radio frequency signal through the impedance adjustment module, and heats the load according to the radio frequency signal; The impedance adjustment module includes a driving unit and a variable capacitor; The variable capacitor comprises at least one flat plate capacitor structure, each of which comprises a first plate and a second plate; The driving unit is drivingly connected to the first electrode plate and / or the second electrode plate; The impedance matching module is used to detect the impedance matching state, and according to the impedance matching state, control the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, change the overlapping area or distance between the first electrode plate and the second electrode plate, so as to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until the impedance matching of the source module and the output module is achieved.

2. The high frequency heating platform according to claim 1, characterized in that: The impedance adjustment module also includes a rotating component; The driving unit is drivingly connected to the first pole plate and / or the second pole plate through the rotating assembly; The driving unit drives the rotating assembly to rotate, thereby changing the overlapping area or distance between the first electrode plate and the second electrode plate.

3. The high frequency heating platform according to claim 2, characterized in that: The impedance adjustment module also includes a limit component; The limiting component is used to limit the flat plate capacitor structure.

4. The high frequency heating platform according to claim 3, characterized in that: The limiting assembly includes two first fixing members fixedly connected to the rotating assembly, and the flat capacitor structure is located between the two first fixing members.

5. The high frequency heating platform according to claim 3, characterized in that: The limiting assembly includes a second fixing member, and the second fixing member is fixedly connected to one of the plates in each of the flat plate capacitor structures.

6. The high frequency heating platform according to any one of claims 1 to 5, characterized in that: The impedance matching module includes a detection unit and a control unit, wherein: The detection unit is used to detect the load impedance of the output module and the impedance of the impedance adjustment module; The control unit is used to compare the sum of the self-impedance of the impedance adjustment module and the load impedance with the power supply impedance of the source module, and determine the target impedance according to the comparison result, and control the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures according to the target impedance, and change the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor until the self-impedance of the impedance adjustment module is equal to the target impedance; The sum of the target impedance and the load impedance is equal to the power supply impedance.

7. The high frequency heating platform according to claim 6, characterized in that: The control unit controls the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat-plate capacitor structures according to the target impedance, and changes the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor until the impedance of the impedance adjustment module itself is equal to the target impedance. Specifically, it is used to: When the target impedance is less than the self-impedance of the impedance adjustment module, controlling the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat-plate capacitor structures so that the overlapping area between the first electrode plate and the second electrode plate increases or the distance decreases, so as to increase the capacitance value of the variable capacitor until the self-impedance of the impedance adjustment module is equal to the target impedance; When the target impedance is greater than the impedance of the impedance adjustment module, the driving unit is controlled to drive the first plate and / or the second plate in one or more of the flat plate capacitor structures, so that the overlapping area between the first plate and the second plate is reduced or the distance between the first plate and the second plate is increased, so as to reduce the capacitance value of the variable capacitor until the impedance of the impedance adjustment module is equal to the impedance of the variable capacitor. at the target impedance.

8. The high frequency heating platform according to claim 1, characterized in that: Also included is a power amplifier module, wherein: The information source module is connected to the impedance adjustment module through the power amplifier module; The power amplifier module is used to amplify the radio frequency power of the radio frequency signal output by the signal source module; Correspondingly, the impedance matching module, when executing the impedance matching state detection, controls the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures according to the impedance matching state, changes the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself, until the impedance matching of the source module and the output module is achieved, specifically used to: Detect the impedance matching state, and according to the impedance matching state, control the driving unit to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures, change the overlapping area or distance between the first electrode plate and the second electrode plate, so as to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module, until the impedance matching of the power amplifier module and the output module is achieved.

9. The high frequency heating platform according to claim 1, characterized in that: It also includes a power supply module, which is used to provide working voltage to the high-frequency heating platform.

10. A control method for a high-frequency heating platform, characterized in that: The method is applied to the high-frequency heating platform described in any one of claims 1 to 9, wherein the high-frequency heating platform comprises a signal source module, an impedance matching module, an impedance adjustment module, and an output module, wherein the impedance adjustment module comprises a driving unit and a variable capacitor, wherein the variable capacitor comprises at least one flat plate capacitor structure, wherein each flat plate capacitor structure comprises a first plate and a second plate, wherein the driving unit is drivingly connected to the first plate and / or the second plate, and wherein the method comprises: When the load is placed in the output module, a start control instruction is obtained, and the high-frequency heating platform is started according to the start control instruction; The target heating temperature of the load placed in the output module is obtained, and the signal source module is controlled to output a radio frequency signal according to the target heating temperature, so that the output module receives the radio frequency signal through the impedance adjustment module, and adjusts the load according to the radio frequency signal. heating; The impedance matching state is detected through the impedance matching module, and according to the impedance matching state, the driving unit is controlled to drive the first electrode plate and / or the second electrode plate in one or more of the flat plate capacitor structures to change the overlapping area or distance between the first electrode plate and the second electrode plate to change the capacitance value of the variable capacitor, thereby changing the impedance of the impedance adjustment module itself until the impedance matching of the source module and the output module is achieved.

Images