Display module and manufacturing method therefor

Abstract

A display module is disclosed. The disclosed display module comprises: a substrate including a first circuit layer including a TFT circuit, a second circuit layer for data transmission, and a third circuit layer for power and control signal transmission; a plurality of light emitting diodes arranged on the first circuit layer; a plurality of first side wirings electrically connecting a first circuit layer provided on the front surface of the substrate and a second circuit layer provided at the upper portion of the rear surface of the substrate; and a plurality of second side wirings electrically connecting the first circuit layer and a third circuit layer, which is provided at the lower portion of the rear surface of the substrate, wherein the second circuit layer is film-shaped, and is attached to the rear surface of the substrate so as to be adjacent to the first end of the substrate, and the third circuit layer is film-shaped, and is attached to the rear surface of the substrate so as to be adjacent to the second end of the substrate.

Description

Display module and manufacturing method thereof

[0001] The present invention relates to a display module and a method for manufacturing the same.

[0002] A display substrate includes a TFT layer comprising a plurality of thin film transistors (TFTs) and a plurality of light-emitting diodes mounted on the TFT layer. These light-emitting diodes operate on a pixel or subpixel basis, producing a variety of colors. Each pixel or subpixel is controlled by a plurality of TFTs. Each light-emitting diode emits a variety of colors, such as red, green, and blue.

[0003] A display module according to one or more embodiments may include a substrate including a first circuit layer including a TFT circuit, a second circuit layer for data transmission, and a third circuit layer for power and control signal transmission; a plurality of light-emitting diodes arranged on the first circuit layer; a plurality of first side wirings electrically connecting the first circuit layer provided on a front surface of the substrate and the second circuit layer provided on an upper portion of a rear surface of the substrate; and a plurality of second side wirings electrically connecting the first circuit layer and the third circuit layer provided on a lower portion of the rear surface of the substrate. The second circuit layer may be formed in a film form and may be attached to a rear surface of the substrate adjacent to a first end of the substrate. The third circuit layer may be formed in a film form and may be attached to a rear surface of the substrate adjacent to a second end of the substrate.

[0004] The second circuit layer may include a plurality of first connection pads electrically connected to one end of the plurality of first side wirings. The third circuit layer may include a plurality of second connection pads electrically connected to one end of the plurality of second side wirings.

[0005] The material of the plurality of first side wirings and the plurality of second side wirings may be silver (Ag) or copper (Cu). The material of the plurality of first connection pads and the plurality of second connection pads may be copper (Cu) or gold (Au).

[0006] The thickness of the plurality of second side wirings of the plurality of first side wirings may be 1 μm or more. The thickness of the plurality of first connection pads and the plurality of second connection pads may be 1 μm or more.

[0007] The spacing between adjacent first connection pads among the plurality of first connection pads may be smaller than the spacing between adjacent first side wirings among the plurality of first side wirings. The spacing between adjacent second connection pads among the plurality of second connection pads may be smaller than the spacing between adjacent second side wirings among the plurality of second side wirings.

[0008] The second circuit layer may further include a plurality of first test pads. The third circuit layer may further include a plurality of second test pads.

[0009] The material of the plurality of first inspection pads and the plurality of second inspection pads may be a metal having low resistance.

[0010] The material of the plurality of first inspection pads and the plurality of second inspection pads may be copper (Cu).

[0011] Each of the second circuit layer and the third circuit layer may include a flexible film layer; a first insulating layer laminated on the film layer; a metal layer laminated on the first insulating layer; and a second insulating layer laminated on the metal layer. The second insulating layer may have a plurality of openings that expose a portion of the metal layer.

[0012] A portion of the above metal layer may be a fan-out wiring portion.

[0013] A portion of the above metal layer may be a grounding portion.

[0014] A display module according to one or more embodiments may include: a glass substrate; a first circuit layer disposed on a front surface of the glass substrate and including a TFT circuit; a second circuit layer disposed on an upper portion of a rear surface of the glass substrate and electrically connected to the first circuit layer by a plurality of first side wirings; a third circuit layer disposed on a lower portion of the rear surface of the glass substrate and electrically connected to the first circuit layer by a plurality of second side wirings; and a control substrate disposed on the rear surface of the glass substrate and electrically connected to the second circuit layer by a plurality of first flexible substrates and electrically connected to the third circuit layer by a plurality of second flexible substrates. The second circuit layer and the third circuit layer may each be formed in a film form and may be laminated by an adhesive layer applied to the glass substrate.

[0015] A method for manufacturing a display module according to one or more embodiments may include: forming a first circuit layer including a TFT circuit on a first surface of a glass substrate; attaching a second circuit layer formed in a film form to one side of a second surface of the glass substrate, and attaching a third circuit layer formed in a film form to the other side of the second surface of the glass substrate; depositing a plurality of first side wirings electrically connecting the first circuit layer and the second circuit layer, and depositing a plurality of second side wirings electrically connecting the first circuit layer and the third circuit layer; transferring a plurality of light-emitting diodes onto the first circuit layer; inspecting the plurality of light-emitting diodes through a plurality of inspection pads respectively provided on the second circuit layer and the third circuit layer; and electrically connecting the second circuit layer and the third circuit layer to a control substrate.

[0016] FIG. 1 is a drawing showing a front surface of a display module according to one or more embodiments.

[0017] FIG. 2 is a drawing showing a rear surface of a display module according to one or more embodiments.

[0018] FIG. 3 is a cross-sectional side view of a display module according to one or more embodiments.

[0019] FIG. 4 is an enlarged view showing an example of fan-out wiring of a second circuit layer provided on a substrate of a display module according to one or more embodiments.

[0020] FIG. 5 is a cross-sectional side view of a substrate of a display module according to one or more embodiments.

[0021] FIG. 6 is a bottom view showing an example of a connection between a connection terminal of a rear circuit layer provided on a substrate of a display module according to one or more embodiments and a side wiring.

[0022] FIG. 7 is a flowchart illustrating a manufacturing process of a display module according to one or more embodiments.

[0023] FIGS. 8 to 12 are drawings showing examples of manufacturing a substrate of a display module according to one or more embodiments.

[0024] FIG. 13 is a block diagram illustrating a display device according to one or more embodiments.

[0025] The embodiments described in this disclosure and the configurations illustrated in the drawings are merely one or more preferred embodiments, and there may be various modified examples that can replace the embodiments and drawings of this disclosure at the time of filing of this application.

[0026] In this disclosure, the same reference numbers or symbols presented in each drawing represent parts or components that perform substantially the same function.

[0027] The terminology used in this disclosure is for the purpose of describing embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, the terms “comprise” or “have” and the like are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0028] Terms including ordinal numbers, such as “first,” “second,” etc., used in this disclosure may be used to describe various components; however, the components are not limited by these terms, and these terms are used only to distinguish one component from another. For example, without departing from the scope of the present disclosure, the first component could be referred to as the second component, and similarly, the second component could also be referred to as the first component. The term “and / or” includes any combination of a plurality of related listed items or any one of a plurality of related listed items.

[0029] The terms “leading end,” “rear end,” “upper end,” “lower end,” “front end,” “rear end,” “top surface,” “bottom surface,” “upper end,” “lower end,” “one end,” “the other end,” “left side,” and “right side” used in this disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0030] Hereinafter, a display module according to one or more embodiments is described with reference to the attached drawings.

[0031] FIG. 1 is a plan view illustrating a display module according to one or more embodiments.

[0032] Referring to FIG. 1, the display module (3) may include a substrate (30) and a plurality of pixels provided on a first surface of the substrate (30). For example, the plurality of pixels may include a plurality of light-emitting diodes (100) for image display, each arranged in a pixel area (30a) arranged in a matrix form on the substrate (30). The pixel area (30a) may be a virtually partitioned area rather than a physically partitioned area. One pixel may include a plurality of light-emitting diodes (100). In this case, one light-emitting diode (100) may be a sub-pixel.

[0033] The light-emitting diode (100) included in the display module (3) may be an inorganic light-emitting diode having a size of 100 μm or less. For example, the inorganic light-emitting diode may be a micro LED or a mini LED, but is not limited thereto. The inorganic light-emitting diode has a fast response speed, low power, and high brightness.

[0034] Micro LEDs can be more efficient at converting electricity into photons than LCDs (liquid crystal displays) or OLEDs (organic light emitting diodes). Micro LEDs can also offer higher brightness per watt than LCD or OLED displays. Micro LEDs can produce the same brightness with about half the energy of LEDs or OLEDs larger than 100 μm. Micro LEDs offer high resolution, excellent color, contrast, and brightness, enabling them to accurately display a wide range of colors and deliver clearer images outdoors, even in brighter environments. Micro LEDs are resistant to burn-in and generate less heat, ensuring a long lifespan without deformation.

[0035] FIG. 2 is a drawing illustrating a rear surface of a display module according to one or more embodiments. FIG. 3 is a side cross-sectional view of a display module according to one or more embodiments.

[0036] Referring to FIGS. 2 and 3, the substrate (30) may include a glass substrate (31), a first circuit layer (33) provided on the front surface of the glass substrate (31), and a second circuit layer (35a) and a third circuit layer (35b) provided on the rear surface of the glass substrate (31).

[0037] A first circuit layer (33) may be arranged on the front surface of a glass substrate (31). A second circuit layer (35a) and a third circuit layer (35b) may be arranged on the rear surface of a glass substrate (31).

[0038] In the present disclosure, the substrate (30) is described as including a glass substrate (31), but is not limited thereto. Instead of the glass substrate (31), the substrate (30) may include a substrate of a flexible synthetic resin series (e.g., polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), etc.), or a ceramic substrate.

[0039] The glass substrate (31) may be formed in a quadrangle shape. For example, the substrate may be formed in a rectangle or a square shape. The display module (3) may be formed in a quadrangle shape depending on the shape of the glass substrate (31).

[0040] A plurality of display modules (3) can be connected horizontally, vertically, or in a grid configuration to implement a large format display (LFD) device. For example, the large format display device may be a personal computer monitor, a high-resolution television, signage (or digital signage), an electronic display, etc.

[0041] When the display module (3) is used alone, it can be applied to wearable devices, portable devices, handheld devices, etc.

[0042] The front surface of the glass substrate (31) can be divided into an active region and an inactive region. The active region may be an area occupied by the first circuit layer (33) among the entire area of ​​the front surface of the glass substrate (31). The inactive region may be an area excluding the active region among the entire area of ​​the first surface of the substrate.

[0043] The edge region of the glass substrate (31) may be the outermost region of the glass substrate. For example, the edge region of the glass substrate (31) may include a first edge region and a second edge region. The first edge region may include an upper edge of the glass substrate (31), an upper area of ​​the front and rear sides of the glass substrate (31) adjacent to the upper edge of the glass substrate (31). The second edge region may include a lower edge of the glass substrate (31), a lower area of ​​the front and rear sides of the glass substrate (31) adjacent to the lower edge of the glass substrate (31).

[0044] A plurality of first side wirings (60a) may be provided in a first edge region of the glass substrate (31) to electrically connect a first circuit layer (33) disposed on the front surface of the glass substrate (31) and a second circuit layer (35a) disposed on the upper portion of the rear surface of the glass substrate (31). A plurality of second side wirings (60b) may be provided in a second edge region of the glass substrate (31) to electrically connect a first circuit layer (33) disposed on the front surface of the glass substrate (31) and a third circuit layer (35b) disposed on the lower portion of the rear surface of the glass substrate (31).

[0045] The first circuit layer (33) may include a plurality of thin film transistor (TFT) circuits electrically connected to a plurality of pixels. Each pixel may be driven by a corresponding TFT circuit.

[0046] The first circuit layer (33) can be formed on the entire surface of the glass substrate (31) by photolithography (e.g., cleaning, deposition, photoresist application, exposure, development, etching, and photoresist stripping) to form a TFT circuit.

[0047] For example, TFT can be a-Si (amorphous silicon) TFT, LTPS (low temperature polycrystalline silicon) TFT, LTPO (low temperature polycrystalline oxide) TFT, HOP (hybrid oxide and polycrystalline silicon) TFT, LCP (liquid crystalline polymer) TFT, or OTFT (organic TFT). TFT can also be applied by making only P-type (or N-type) MOSFET in Si wafer CMOS process.

[0048] The first circuit layer (33) provided on the front surface of the glass substrate (31) may be omitted. In this case, a plurality of micro IC chips that function as TFT circuits may be mounted on the front surface of the glass substrate (31). In this case, the plurality of micro ICs may be electrically connected to a plurality of light-emitting diodes arranged on the front surface of the glass substrate (31) through wiring.

[0049] The second circuit layer (35a) may be arranged on the upper rear surface of the glass substrate (31). The second circuit layer (35a) may be electrically connected to a plurality of first side wirings (60a) arranged at regular intervals along the first edge region of the glass substrate (31). The first side wirings (60a) may electrically connect the first circuit layer (33) arranged on the front surface of the glass substrate (31) and the second circuit layer (35a) arranged on the rear surface of the glass substrate (31). The second circuit layer (35a) may be electrically connected to the control substrate (39) by a plurality of first flexible substrates (40a).

[0050] A plurality of first flexible substrates (40a) can transmit data signals provided from a control substrate (39) to a second circuit layer (35a). The data signals transmitted to the second circuit layer (35a) can be transmitted to the first circuit layer (33) via a plurality of first side wirings (60a).

[0051] The third circuit layer (35b) may be arranged on the lower rear surface of the glass substrate (31). The third circuit layer (35b) may be electrically connected to a plurality of second side wirings (60b) arranged at regular intervals along the second edge region of the glass substrate (31). The second side wirings (60b) may electrically connect the first circuit layer (33) arranged on the front surface of the glass substrate (31) and the third circuit layer (35b) arranged on the rear surface of the glass substrate (31). The third circuit layer (35b) may be electrically connected to the control substrate (39) by a plurality of second flexible substrates (40b).

[0052] A plurality of second flexible substrates (40b) can supply power provided from the control substrate (39) to the third circuit layer (35b). The power provided to the third circuit layer (35b) can be supplied to the first circuit layer (33) through a plurality of second side wirings (60b). A plurality of second flexible substrates (40b) can transmit a control signal provided from the control substrate (39) to the third circuit layer (35b). The control signal transmitted to the third circuit layer (35b) can be transmitted to the first circuit layer (33) through a plurality of second side wirings (60b).

[0053] The control board (39) may be provided with a power supply circuit that supplies power to the first circuit layer (33), a data drive driver, a gate drive driver, and a timing controller that controls each drive driver.

[0054] The second circuit layer (35a) and the third circuit layer (35b) may be provided in the form of a film. In this case, the second circuit layer (35a) and the third circuit layer (35b) may be laminated to the upper and lower rear surfaces of the glass substrate (31), respectively. In this way, the second circuit layer (35a) and the third circuit layer (35b) are provided on the glass substrate (31) in a form different from that of the first circuit layer (33), which requires complex and numerous processes, and thus the manufacturing time of the substrate (30) can be significantly shortened or improved.

[0055] The second circuit layer (35a) may include a first fan-out wiring portion (W1), and the third circuit layer (35b) may include a second fan-out wiring portion (W2). In FIG. 2, the plurality of first connection pads (36a), the plurality of first inspection pads (37a), and the plurality of second connection pads (38a) are schematically expressed as rectangular shapes for convenience of explanation. The specific shapes of the plurality of first connection pads (36a), the plurality of first inspection pads (37a), and the plurality of second connection pads (38a) may be formed in the shape of each of the plurality of pads, as shown in FIG. 4.

[0056] Since the first fan out wiring section (W1) and the second fan out wiring section (W2) may have substantially the same structure, only the structure of the first fan out wiring section (W1) will be described below with reference to the drawings.

[0057] FIG. 4 is an enlarged view showing an example of a fan-out wiring portion of a second circuit layer provided on a substrate of a display module according to one or more embodiments.

[0058] Referring to FIG. 4, the first fan out wiring portion (W1) provided on the second circuit layer (35a) can electrically connect a plurality of first connection pads (36a), a plurality of first inspection pads (37a), and a plurality of second connection pads (38a). The first fan out wiring portion (W1) can include a plurality of fan out wirings (35-3) that sequentially connect one first connection pad (36a), one first inspection pad (37a), and one second connection pad (38a). In this case, the number of the plurality of fan out wirings (35-3) can be the same as the number of the plurality of first connection pads (36a).

[0059] A plurality of first connection pads (36a) can be electrically connected to a plurality of first side wirings (60a). A plurality of second connection pads (38a) can be electrically connected to a plurality of connection pads (not shown) provided on a plurality of first flexible substrates (40a), respectively.

[0060] When the material of the plurality of first inspection pads (37a) is made of aluminum (Al), practical high current driving is not possible due to the current limit when inspecting the substrate (30), so aging is impossible and there is a voltage drop (IR drop). To solve this, in the present disclosure, the material of the plurality of first inspection pads (37a) may be made of a metal having low resistance (e.g., copper (Cu)).

[0061] FIG. 5 is a cross-sectional side view of a substrate of a display module according to one or more embodiments.

[0062] Referring to FIG. 5, the substrate (30) may include a glass substrate (31), a first circuit layer (33) disposed on the front surface of the glass substrate (31), and second and third circuit layers (35a, 35b) disposed on the back surface of the glass substrate, respectively.

[0063] The first circuit layer (33) may include a TFT circuit formed by photolithography. In addition to the TFT circuit, the first circuit layer (33) may further include a plurality of wires and a plurality of protective layers.

[0064] The first circuit layer (33) may be provided with a plurality of third connection pads (32a) to which a plurality of first side wirings (60a) are connected. The first circuit layer (33) may include a plurality of substrate pads (33-1, 33-2) that are electrically connected to electrode pads (111, 113, see FIG. 3) of a plurality of light-emitting diodes (100).

[0065] The second circuit layer (35a) may be formed in a single film form by laminating multiple layers. The second circuit layer (35a) may be laminated to the glass substrate (31) by a first adhesive layer (34-1) applied to the rear surface of the glass substrate (31).

[0066] The second circuit layer (35a) may include a film layer (35-1), a first insulating layer (35-2) laminated on the film layer (35-1) by a second adhesive layer (34-2) applied to one surface of the film layer (35-1), a metal layer (35-3) laminated on the first insulating layer (35-2) by a third adhesive layer (34-3) applied to one surface of the first insulating layer (35-2), and a second insulating layer (35-4) laminated on the metal layer (35-3) by a fourth adhesive layer (34-4) applied to one surface of the metal layer (35-3).

[0067] The metal layer (35-3) can be used as the first fan out wiring portion (W1). The metal layer (35-3) used as the first fan out wiring portion (35-3) can be mostly covered by the second insulating layer (35-4). In this case, the thickness of the metal layer (35-3) and the thickness of the second insulating layer (35-4) can each be approximately 10 μm to 15 μm. Accordingly, the first circuit layer (33) formed by photolithography can be formed thicker than the thickness (e.g., approximately 0.7 μm or less). Accordingly, it is possible to prevent or improve the first fan out wiring portion (35-3) from being damaged or peeled off by an external impact (e.g., scratches, etc.) applied to the substrate (30) during transportation of the substrate (30) to manufacture the display module (3).

[0068] In addition, the second circuit layer (35a) and the third circuit layer (35b) are not formed on the glass substrate (31) by photolithography like the first circuit layer (33), but are manufactured in the form of a film separately from the glass substrate (31) and then laminated to the glass substrate (31) by the first adhesive layer (34-1), so that material costs can be reduced, the manufacturing process of the substrate (30) can be shortened, and the yield can be maximized.

[0069] A portion of the metal layer (35-3) can be used as a plurality of first grounding portions (G1, see Fig. 2) to prevent ESD (Electro Static Discharge) and secure a grounding area. In Fig. 2, the unexplained symbol G2 is a grounding portion forming a portion of the metal layer of the third circuit layer (35b).

[0070] The metal layer (35-3) may be exposed without being covered by the second insulating layer (35-4) at each portion connected to the plurality of first connection pads (36a), the plurality of first inspection pads (37a), and the plurality of second connection pads (38a). That is, the second insulating layer (35-4) may be provided with a plurality of openings for the plurality of first connection pads (36a), the plurality of first inspection pads (37a), and the plurality of second connection pads (38a).

[0071] FIG. 6 is a bottom view showing an example of a connection between a connection terminal of a rear circuit layer provided on a substrate of a display module according to one or more embodiments and a side wiring.

[0072] Referring to FIG. 6, the width (A) of the first connection pad (36a), the distance (B) between adjacent first connection pads (36a), the width (C) of the first side wiring (60a), and the distance (D) between adjacent first side wirings (60a) can be set in consideration of the materials of the first connection pad (36a) and the first side wiring (60a).

[0073] For example, considering the different thermal expansion coefficients between the material of the first connection pad (36a) and the material of the first side wiring (60a), the width (A) of the first connection pad (36a) may be set to be equal to or similar to the distance (D) between adjacent first side wirings (60a). The width (C) of the first side wiring (60a) may be set to be equal to or similar to the distance (B) between adjacent first connection pads (36a). In this case, the width (A) of the first connection pad (36a) may be smaller than the width (C) of the first side wiring (60a). The distance (B) between adjacent first connection pads (36a) may be smaller than the distance (D) between adjacent first side wirings (60a). Accordingly, it is possible to minimize or improve short-circuiting of adjacent first connection pads (36a) or short-circuiting of adjacent first side wirings (60a).

[0074] The thickness of the first side wiring (60a) and the thickness of the first connection pad (36a) can be formed to be approximately 1 ㎛ or more, respectively, so as to minimize or improve separation from the corresponding first connection pad (36a) and third connection pad (32a).

[0075] The material of the first side wiring (60a) may be silver (Ag) or copper (Cu). In this case, the material of the first connection pad (36a) and the third connection pad (32a) may be copper (Cu) or gold (Au) to improve the interfacial adhesion between the first side wiring (60a).

[0076] FIG. 7 is a flowchart illustrating a manufacturing process of a display module according to one or more embodiments. FIGS. 8 to 12 are drawings illustrating examples of manufacturing a substrate of a display module according to one or more embodiments.

[0077] Referring to Fig. 8, a first circuit layer (33) including a TFT layer is formed on the front surface of a glass substrate (31), for example, by photolithography (701 in Fig. 7).

[0078] A plurality of third connection pads (32a) that are electrically connected to a plurality of first side wirings (60a) may be formed on the first circuit layer (33). In addition, a plurality of sixth connection pads (not shown) that are electrically connected to a plurality of second side wirings (60b) may be formed on the first circuit layer (33). In this case, a plurality of third connection pads (32a) may be arranged in a row along the upper front surface of the glass substrate (31). A plurality of fourth connection pads may be arranged in a row along the lower front surface of the glass substrate (31).

[0079] Referring to Fig. 9, a first adhesive layer (34-1) is applied to the upper and lower rear surfaces of the glass substrate (31), respectively. Next, a second circuit layer (35a) and a third circuit layer (35b) manufactured in the form of a flexible film are laminated to the upper and lower rear surfaces of the glass substrate (31), respectively (702 in Fig. 7). In this way, the second circuit layer (35a) and the third circuit layer (35b) can be manufactured in advance before being laminated to the glass substrate (31).

[0080] A first fan-out wiring portion (W1) and a plurality of first ground portions (G1) may be formed in the second circuit layer (35a). The first fan-out wiring portion (W1) may include a plurality of first connection pads (36a) electrically connected to a plurality of first side wiring portions (60a), a plurality of first inspection pads (37a), and a plurality of second connection pads (38a) electrically connected to a plurality of first flexible substrates (40a).

[0081] A second fan-out wiring portion (W2) and a plurality of second ground portions (G2) may be formed on the third circuit layer (35b). The second fan-out wiring portion (W2) may include a plurality of fourth connection pads (36b) electrically connected to a plurality of second side wiring portions (60b), a plurality of second inspection pads (37b), and a plurality of fifth connection pads (38b) electrically connected to a plurality of second flexible substrates (40b). The plurality of second inspection pads (37b) may be made of the same material as the plurality of first inspection pads (37a).

[0082] Referring to FIG. 10, a plurality of first side wirings (60a) are deposited in the first edge area of ​​the glass substrate (31), and a plurality of second side wirings (60b) are deposited in the second edge area of ​​the glass substrate (31) (703 in FIG. 7).

[0083] Each of the plurality of first side wirings (60a) may have one end connected to a corresponding first connection pad (36a) of the second circuit layer (35a) and the other end connected to a third connection pad (32a) of the first circuit layer (33).

[0084] Each of the plurality of second side wirings (60b) may have one end connected to the corresponding fourth connection pad (36b) of the third circuit layer (35b) and the other end connected to the sixth connection pad (not shown) of the first circuit layer (33).

[0085] A plurality of light-emitting diodes (100) are transferred to the first circuit layer (33) formed on the glass substrate (31) (704 in Fig. 7).

[0086] The plurality of light emitting diodes (100) may be micro LEDs. The plurality of light emitting diodes (100) may be transferred to the first circuit layer (33) by a laser transfer method, a pick-and-place transfer method, a stamping transfer method, a rollable transfer method, or the like.

[0087] A first circuit layer (33) may be provided with a plurality of substrate pads (33-1, 33-2) to which electrode pads (111, 113) of a plurality of light-emitting diodes (100) are electrically and physically connected.

[0088] Referring to FIG. 11, inspection of the substrate (30) is performed through a plurality of first inspection pads (37a) of the second circuit layer (35a) and a plurality of second inspection pads (37b) of the third circuit layer (35b) (705 in FIG. 7).

[0089] For example, the substrate (30) goes through an EDS (electric die sorting) step of electrically inspecting the substrate (30) by applying voltage to a plurality of first inspection pads (37a) and a plurality of second inspection pads (37b). The EDS step may perform a pre-laser test to check whether each light-emitting diode (100) on the substrate (30) is normal or abnormal. A laser repair process may be performed to repair repairable light-emitting diodes among the light-emitting diodes determined to be abnormal.

[0090] Referring to Fig. 12, a control substrate (39) is connected to a substrate (30) that has passed inspection (706 in Fig. 7). In this case, the control substrate (39) can be electrically connected to the second circuit layer (35a) through a plurality of first flexible substrates (40a).

[0091] The control substrate (39) can be electrically connected to the second circuit layer (35a) through a plurality of first flexible substrates (40a). The plurality of first flexible substrates (40a) can have chips (41) mounted thereon in a COF (chip on film) type. The control substrate (39) can be electrically connected to the third circuit layer (35b) through a plurality of second flexible substrates (40b).

[0092] FIG. 13 is a block diagram illustrating a display device according to one or more embodiments.

[0093] Referring to FIG. 13, a display device (1) may include a display module (3) and a processor (4). The display module (3) may include a substrate (30) and a display driver integrated circuit (IC) (7) for controlling the substrate (30). In this case, the processor (4) may be mounted on a control substrate (39). The display driver IC (7) may be mounted on the control substrate (39) or a plurality of first flexible substrates (40a).

[0094] The processor (4) may be implemented as a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), or a time controller (TCON) that processes a digital image signal. However, the present invention is not limited thereto, and may include one or more of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a communication processor (CP), or an ARM processor, or may be defined by the relevant terminology. In addition, the processor (4) may be implemented as a system on chip (SoC) or large scale integration (LSI) having a built-in processing algorithm, or may be implemented in the form of an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA).

[0095] The processor (4) can control hardware or software components connected to the processor (4) by running an operating system or application program, and can perform various data processing and calculations. In addition, the processor (4) can load commands or data received from at least one of the other components into volatile memory and process them, and store various data in non-volatile memory.

[0096] The display driver IC (7) may include an interface module (7a), a memory (7b) (e.g., a buffer memory), an image processing module (7c), or a mapping module (7d). The display driver IC (7) may receive, for example, image information including image data or an image control signal corresponding to a command for controlling the image data, from another component of the display device (1) through the interface module (7a). For example, according to one embodiment, the image information may be received from a processor (4) (e.g., a main processor (e.g., an application processor) or an auxiliary processor (e.g., a graphics processing unit) that operates independently of the function of the main processor).

[0097] The display driver IC (7) can communicate with the sensor module through the interface module (7a). In addition, the display driver IC (7) can store at least a part of the received image information in the memory (7b), for example, on a frame basis. The image processing module (7c) can, for example, perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a part of the image data based on at least the characteristics of the image data or the characteristics of the substrate (30). The mapping module (7d) can generate a voltage value or a current value corresponding to the image data preprocessed or postprocessed through the image processing module (7c). According to one embodiment, the generation of the voltage value or the current value can be performed based at least in part on, for example, the properties of the pixels of the substrate (30) (e.g., the arrangement of the pixels (RGB stripe or pentile structure), or the size of each subpixel). At least some pixels of the substrate (30) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the substrate (30).

[0098] The display driver IC (7) can transmit a driving signal (e.g., a driver driving signal, a gate driving signal, etc.) to the display based on image information received from the processor (4).

[0099] The display driver IC (7) can display an image based on an image signal received from the processor (4). For example, the display driver IC (7) can display an image by generating a driving signal for a plurality of sub-pixels based on the image signal received from the processor (4) and controlling the light emission of the plurality of sub-pixels based on the driving signal.

[0100] According to one or more embodiments, the display module (3) may further include a touch circuit. The touch circuit may include a touch sensor and a touch sensor IC for controlling the same. The touch sensor IC may control the touch sensor to detect, for example, a touch input or a hovering input with respect to a designated location of the substrate (30). For example, the touch sensor IC may detect the touch input or the hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) with respect to the designated location of the substrate (30). The touch sensor IC may provide information (e.g., location, area, pressure, or time) about the detected touch input or hovering input to the processor (4). According to one embodiment, at least a portion of the touch circuit (e.g., the touch sensor IC) may be included as a part of the display driver IC (7), the substrate (30), or another component (e.g., an auxiliary processor) disposed externally of the display module (3).

[0101] According to one or more embodiments, the pixel driving method of the display module (3) may be an AM (active matrix) driving method or a PM (passive matrix) driving method.

[0102] According to one or more embodiments, the display device (1) may include a display module (3). The display module (3) may display various images. Here, the images may include still images and / or moving images. The display module (3) may display various images, such as broadcast content, multimedia content, etc. In addition, the display module (3) may also display a user interface and icons.

[0103] According to one or more embodiments, the display module (3) can be installed and applied in a wearable device, a portable device, a handheld device, and various electronic products or battlefields requiring a display.

[0104] According to one or more embodiments, the display device (1) may include a plurality of display modules (3). The plurality of display modules (3) may be physically connected to implement a large display (e.g., a large format display). The large display may be a monitor for a personal computer, a high-resolution television, a signage (or digital signage), or an electronic display by connecting a plurality of display modules in a grid arrangement.

[0105] While the present disclosure has been illustrated and described above with reference to various examples, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

[0106] Although the preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical idea or prospect of the present disclosure.

Claims

1. A substrate including a first circuit layer including a TFT circuit, a second circuit layer for data transmission, and a third circuit layer for power and control signal transmission; A plurality of light-emitting diodes arranged on the first circuit layer; A plurality of first side wirings electrically connecting the first circuit layer provided on the front surface of the substrate and the second circuit layer provided on the upper rear surface of the substrate; and A plurality of second side wirings electrically connecting the first circuit layer and the third circuit layer provided on the lower rear surface of the substrate; The second circuit layer is formed in a film form and is attached to the back surface of the substrate so as to be adjacent to the first end of the substrate, A display module in which the third circuit layer is formed in a film form and is attached to the rear surface of the substrate so as to be adjacent to the second end of the substrate.

2. In paragraph 1, The second circuit layer comprises a plurality of first connection pads electrically connected to one end of the plurality of first side wirings, A display module wherein the third circuit layer includes a plurality of second connection pads electrically connected to one end of the plurality of second side wirings.

3. In paragraph 2, The material of the above plurality of first side wirings and the above plurality of second side wirings is silver (Ag) or copper (Cu), A display module wherein the material of the plurality of first connection pads and the plurality of second connection pads is copper (Cu) or gold (Au).

4. In paragraph 2, The thickness of the plurality of second side wirings of the plurality of first side wirings is 1㎛ or more, A display module wherein the thickness of the plurality of first connection pads and the plurality of second connection pads is 1㎛ or more.

5. In paragraph 2, The spacing between adjacent first connection pads among the plurality of first connection pads is smaller than the spacing between adjacent first side wirings among the plurality of first side wirings, A display module wherein the spacing between adjacent second connection pads among the plurality of second connection pads is smaller than the spacing between adjacent second side wirings among the plurality of second side wirings.

6. In paragraph 2, The second circuit layer further includes a plurality of first test pads, A display module wherein the third circuit layer further includes a plurality of second test pads.

7. In paragraph 6, A display module wherein the material of the plurality of first inspection pads and the plurality of second inspection pads is a metal having low resistance.

8. In paragraph 6, A display module wherein the material of the plurality of first inspection pads and the plurality of second inspection pads is copper (Cu).

9. In paragraph 1, Each of the second circuit layer and the third circuit layer, A flexible film layer; A first insulating layer laminated on the above film layer; A metal layer laminated on the first insulating layer; and A second insulating layer laminated on the metal layer; A display module in which the second insulating layer has a plurality of openings that expose a portion of the metal layer.

10. In paragraph 9, A display module in which a portion of the above metal layer is a fan-out wiring portion.

11. In paragraph 9, A display module in which a portion of the above metal layer is a grounding portion.

12. Glass substrate; A first circuit layer disposed on the front surface of the glass substrate and including a TFT circuit; A second circuit layer disposed on the upper rear surface of the glass substrate and electrically connected to the first circuit layer by a plurality of first side wirings; A third circuit layer disposed on the lower rear surface of the glass substrate and electrically connected to the first circuit layer by a plurality of second side wirings; and A control substrate is disposed on the rear surface of the glass substrate and is electrically connected to the second circuit layer by a plurality of first flexible substrates and electrically connected to the third circuit layer by a plurality of second flexible substrates; A display module in which the second circuit layer and the third circuit layer are each formed in a film form and laminated by an adhesive layer applied to the glass substrate.

13. In paragraph 12, The first circuit layer and the second circuit layer include a plurality of connection pads electrically connected to both ends of the plurality of first side wirings, The first circuit layer and the third circuit layer include a plurality of connection pads electrically connected to both ends of the plurality of second side wirings, The material of the above plurality of first side wirings and the above plurality of second side wirings is silver (Ag) or copper (Cu), A display module wherein the material of the above-mentioned plurality of connection pads is copper (Cu) or gold (Au).

14. In paragraph 12, The thickness of the above plurality of first side wirings and the above plurality of second side wirings is 1㎛ or more, A display module wherein the thickness of the above plurality of connection pads is 1㎛ or more.

15. A step of forming a first circuit layer including a TFT circuit on a first surface of a glass substrate; A step of attaching a second circuit layer formed in a film form to one side of the second surface of the glass substrate, and attaching a third circuit layer formed in a film form to the other side of the second surface of the glass substrate; A step of depositing a plurality of first side wirings electrically connecting the first circuit layer and the second circuit layer, and depositing a plurality of second side wirings electrically connecting the first circuit layer and the third circuit layer; A step of transferring a plurality of light-emitting diodes onto the first circuit layer; A step of inspecting the plurality of light-emitting diodes through a plurality of inspection pads respectively provided in the second circuit layer and the third circuit layer; and A method for manufacturing a display module, comprising: a step of electrically connecting the second circuit layer and the third circuit layer to a control substrate.

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