Display module and manufacturing method thereof

Abstract

Disclosed is a display module. The display module comprises: a printed circuit board having a conductive pattern formed on the upper part; a plurality of light-emitting devices disposed on the printed circuit board and electrically connected to the conductive pattern; and a filling layer including an opaque non-conductive material, wherein the printed circuit board has a protruding structure arranged between a peripheral area of the plurality of light-emitting devices and the periphery of the printed circuit board, the height of the protruding structure is higher than the height of the conductive pattern, and the filling layer covers the conductive pattern between the protruding structure and the periphery of the plurality of light-emitting devices and between the plurality of light-emitting devices.

Description

Display module and manufacturing method thereof

[0001] The present disclosure relates to a display module and a method for manufacturing the same, and more particularly, to a display module and a display method in which a printed circuit board having a protruding structure formed on the outer surface is used to form a filling material flat between an LED element and a protruding structure.

[0002] LED displays typically feature multiple LED elements spaced at a specific distance. These next-generation displays, replacing conventional liquid crystal displays, boast superior color reproducibility and brighter image quality.

[0003] An LED display is formed of unit modules (hereinafter referred to as “display modules”) with a specific resolution, and multiple display modules are connected in a matrix to produce a single display.

[0004] A display module according to the present invention includes a printed circuit board (210) having a conductive pattern (220) formed on an upper portion thereof, a plurality of light-emitting elements (130) disposed on the printed circuit board (210) and electrically connected to the conductive pattern, and a filling layer (150) including an opaque non-conductive material, wherein the printed circuit board has a protruding structure (240) disposed between an outer region of the plurality of light-emitting elements and an outer shell of the printed circuit board (210), the height of the protruding structure (240) being higher than the height of the conductive pattern, and the filling layer (150) covers the conductive pattern between the protruding structure (240) and the outer shell of the plurality of light-emitting elements and between the plurality of light-emitting elements (130).

[0005] The height of the above protruding structure may be lower than the height of the upper surface of each of the plurality of light-emitting elements.

[0006] The above protruding structure may include a copper foil layer, a solder resist layer, and a silk ink layer sequentially laminated on the printed circuit board.

[0007] The copper layer may have the same height as the conductive pattern, and the solder resist layer may have the same height as the resist pattern formed to protect the conductive pattern.

[0008] The above protruding structure may include a solder resist layer and a silk ink layer sequentially laminated on the printed circuit board.

[0009] The above protruding structure can surround the plurality of light-emitting elements.

[0010] The above protruding structure is arranged at a predetermined interval from the outermost light-emitting element among the plurality of light-emitting elements, and the predetermined interval may be the interval between the plurality of light-emitting elements or half of the interval.

[0011] The display module may further include a plurality of light-emitting elements and a molding layer disposed on the filling layer, and a film layer disposed on the molding layer.

[0012] The plurality of light-emitting elements are at least one of an R color light-emitting element, a G color light-emitting element, and a B color light-emitting element, and at least one R color light-emitting element, at least one G color light-emitting element, and at least one B color light-emitting element among the plurality of light-emitting elements can operate as one pixel.

[0013] The height of the above filling layer may be lower than the height of each upper surface of the plurality of light-emitting elements.

[0014] A method for manufacturing a display module according to the present invention includes the steps of preparing a printed circuit board having a conductive pattern and a protruding structure formed in an outer area, the step of bonding a plurality of light-emitting elements to the conductive pattern, and the step of depositing an opaque non-conductive material to cover the conductive pattern between the protruding structure and the outer areas of the plurality of light-emitting elements and between the plurality of light-emitting elements (130).

[0015] The step of depositing the above-mentioned opaque non-conductive material can be performed by ejecting and depositing the opaque non-conductive material on the printed circuit board at a height corresponding to the height of the protruding structure.

[0016] The manufacturing method may further include a step of forming a molding layer on top of the plurality of light-emitting elements and the filling layer, a step of forming a film layer on top of the molding layer, and a step of cutting an outer region of a printed circuit board on which the film layer is formed.

[0017] The above molding layer can be formed using a transparent material.

[0018] The step of connecting the plurality of light-emitting elements may be connected to the printed circuit board using a flip chip method.

[0019] Figure 1 is a drawing showing a single display device formed by arranging display modules in a matrix form;

[0020] FIG. 2 is a drawing showing one of the plurality of display modules illustrated in FIG. 1;

[0021] Figure 3 is a drawing showing an example of the arrangement of light-emitting elements;

[0022] Fig. 4 is a drawing showing another example of arrangement of light-emitting elements;

[0023] Fig. 5 is a cross-sectional view of the display module taken along the line Ⅲ-Ⅲ shown in Fig. 2;

[0024] Fig. 6 is a cross-sectional view of the display module taken along the line Ⅲ-Ⅲ shown in Fig. 2;

[0025] FIG. 7 is a drawing showing an example of a display module according to one embodiment of the present invention;

[0026] Figure 8 is a flowchart for explaining a method for manufacturing a display module according to one embodiment of the present invention.

[0027] Figure 9 is a plan view illustrating a printed circuit board according to one embodiment of the present invention.

[0028] FIGS. 10 to 12 are drawings for explaining a method for manufacturing a printed circuit board according to an embodiment of the present invention.

[0029] FIGS. 13 to 15 are drawings for explaining a method for manufacturing a printed circuit board according to an embodiment of the present invention.

[0030] Figure 16 is a drawing for explaining a state in which a light-emitting element is arranged on a printed circuit board.

[0031] Figure 17 is a drawing showing a state in which filling of a non-conductive material is completed between each light-emitting element of a display module and between the outermost element and the protruding structure.

[0032] Figure 18 is a drawing showing the state of a printed circuit board on which a molding layer has been formed.

[0033] Figure 19 is a drawing showing the state of a printed circuit board on which a film layer is formed, and

[0034] Figure 20 is a drawing for explaining the process of cutting the outer area, and

[0035] Figure 21 is a drawing showing the cutting result in Figure 20.

[0036] The present disclosure may be modified in various ways and may have numerous embodiments. Specific embodiments of the present disclosure are illustrated in the drawings and described in detail in the detailed description. However, the scope of the present invention is not limited to the specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives that fall within the scope of the patent. In the description of the drawings, similar reference numerals may be used for similar components.

[0037] In describing the present disclosure, if it is determined that a specific description of a related known function or configuration may unnecessarily obscure the gist of the present disclosure, a detailed description thereof will be omitted.

[0038] The terminology used in this disclosure is for the purpose of describing specific embodiments only and is not intended to limit the scope of the rights.

[0039] In this disclosure, expressions such as “has,” “can have,” “includes,” or “may include” indicate the presence of a corresponding feature (e.g., a component such as a number, function, operation, or part), and do not exclude the presence of additional features.

[0040] In this disclosure, expressions such as “A or B,” “at least one of A and / or B,” or “one or more of A or / and B” can include all possible combinations of the listed items. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” can all refer to (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0041] The expressions “first,” “second,” “first,” or “second,” etc., used in this disclosure can describe various components, regardless of order and / or importance, and are only used to distinguish one component from another, but do not limit the components.

[0042] When it is said that a component (e.g., a first component) is “(operatively or communicatively) coupled with / to” or “connected to” another component (e.g., a second component), it should be understood that said component may be directly coupled to said other component, or may be coupled via another component (e.g., a third component).

[0043] On the other hand, when it is said that a component (e.g., a first component) is "directly connected" or "directly connected" to another component (e.g., a second component), it can be understood that no other component (e.g., a third component) exists between said component and said other component.

[0044] The expression "configured to" as used in the present disclosure may be used interchangeably with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" may not necessarily mean only "specifically designed to" in terms of hardware.

[0045] Instead, in some contexts, the phrase "a device configured to" may mean that the device, in conjunction with other devices or components, is "capable of" performing A, B, and C. For example, the phrase "a processor configured (or set) to perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or application processor) that can perform those operations by executing one or more software programs stored in a memory device.

[0046] In the embodiments, a 'module' or 'part' performs at least one function or operation, and may be implemented as hardware or software, or as a combination of hardware and software. Furthermore, a plurality of 'modules' or 'parts' may be integrated into at least one module and implemented as at least one processor, except for a 'module' or 'part' that needs to be implemented as a specific hardware.

[0047] According to various embodiments, operations performed by a module, program or other component may be executed sequentially, in parallel, iteratively or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0048] Meanwhile, the various elements and areas in the drawings are schematically drawn. Therefore, the present disclosure is not limited by the relative sizes or spacing depicted in the attached drawings.

[0049] Meanwhile, an electronic device according to various embodiments of the present disclosure may include, for example, at least one of a smartphone, a tablet PC, a desktop PC, a laptop PC, or a wearable device. The wearable device may include at least one of an accessory type (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)), a fabric or clothing-integrated type (e.g., an electronic garment), a body-attached type (e.g., a skin pad or tattoo), or a bio-implantable circuit.

[0050] In some embodiments, the electronic device may be a variety of devices including a display, for example, a television, a digital video disk (DVD) player, an audio, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a media box (e.g., Samsung HomeSync™, Apple TV™, or Google TV™), a game console (e.g., Xbox™, PlayStation™), an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

[0051] Hereinafter, with reference to the attached drawings, embodiments according to the present disclosure will be described in detail so that a person having ordinary knowledge in the technical field to which the present disclosure pertains can easily implement the present disclosure.

[0052] Hereinafter, various embodiments of this document are described with reference to the attached drawings. However, this is not intended to limit the technology described in this document to specific embodiments, and it should be understood that various modifications, equivalents, and / or alternatives of the embodiments of this document are included and fall within the scope of the claims.

[0053] In addition, the dimensions corresponding to the size of the light-emitting element used in this document (w1 X w2 X h1), the pitch (g1) between each light-emitting element, and the height of the filling layer are exemplified to indicate that the size of the light-emitting element provided in the display module according to one embodiment of the present disclosure is small or ultra-small.

[0054] Additionally, the terms used in this document are intended solely to describe specific embodiments and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly dictates otherwise. Terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art described herein.

[0055] Terms used in this document, including those defined in general dictionaries, may be interpreted as having the same or similar meaning within the context of the relevant technology. Unless explicitly defined herein, they shall not be interpreted in an idealized or overly formal sense. In some cases, even if a term is defined herein, it cannot be interpreted to exclude embodiments of the present disclosure.

[0056] Hereinafter, the configuration of a display module according to one embodiment of the present invention will be described with reference to the attached drawings, and a method of forming the display module will be sequentially described.

[0057] FIG. 1 is a drawing showing a single display device (10) formed by arranging display modules (100) in a matrix form.

[0058] Referring to FIG. 1, a display device (10) can be formed as a single device by interconnecting multiple display modules (100). Meanwhile, in the illustrated example, multiple display modules (100) are arranged in a matrix configuration. However, when implemented, they may be arranged in a series or parallel configuration, or in various configurations other than a rectangular configuration.

[0059] The display device (10) may include a driving unit (not shown) for driving each display module (100), a control unit (not shown) for controlling the driving unit, a power unit (not shown), and a plurality of wires (not shown) for receiving various signals.

[0060] The display module (100) may have a plurality of light-emitting elements arranged thereon. Specifically, the display module (100) may include a plurality of pixels, and each pixel may include a sub-pixel. The sub-pixels may include an R sub-pixel, a G sub-pixel, and a B sub-pixel.

[0061] The R subpixel may include a red (R) light-emitting element that emits red light, the G subpixel may include a green (G) light-emitting element that emits green light, and the B subpixel may include a blue (B) light-emitting element that emits blue light.

[0062] A light-emitting device is a light-emitting device manufactured using inorganic materials, unlike an OLED (Organic Light Emitting Diode), which is manufactured using organic materials. Therefore, a light-emitting device may also be referred to as an inorganic light-emitting device. Such a light-emitting device may be referred to as a micro light-emitting diode (micro LED or μLED).

[0063] A display module (100) in which each sub-pixel is implemented with a micro LED may be referred to as a micro LED display module (or LED display panel). A micro LED display module is one type of flat panel display panel on which micro light-emitting diodes may be arranged. A micro LED display panel can provide better contrast, response time, and energy efficiency than a liquid crystal display (LCD) panel that requires a backlight.

[0064] While both organic light-emitting diodes (OLEDs) and micro LEDs are energy-efficient, micro LEDs offer superior performance in brightness, luminous efficacy, and lifespan. In particular, OLEDs utilize organic phosphors, and due to the nature of these organic compounds, OLEDs are susceptible to burn-in, making them less suitable for PWM operation than micro LEDs, which are inorganic light-emitting devices.

[0065] A light-emitting element can express different brightness grayscale values ​​depending on the magnitude of the driving current provided from a pixel circuit (not shown) and / or the pulse width of the driving current. Here, the pulse width of the driving current may also be called the duty ratio of the driving current or the driving time of the driving current.

[0066] For example, a light-emitting element can express a brighter grayscale value as the magnitude of the driving current increases. Additionally, a light-emitting element can express a brighter grayscale value as the pulse width of the driving current increases (i.e., as the duty ratio increases or the driving time increases).

[0067] The pixel circuit provides a driving current to the light-emitting element when the display module (100) is driven. The pixel circuit can provide a driving current whose size and driving time are controlled to the light-emitting element based on an image data voltage (e.g., a constant current source data voltage and / or a PWM data voltage). That is, the pixel circuit can control the brightness of the light emitted by the inorganic light-emitting element by driving the light-emitting element with PAM (pulse amplitude modulation) and / or PWM.

[0068] To this end, the pixel circuit may include a constant current source circuit and a PWM circuit. The constant current source circuit and the PWM circuit are each composed of transistors, etc., and may be formed on the TFT layer of the display module (100).

[0069]

[0070] FIG. 2 is a drawing showing one of a plurality of display modules forming a single display device.

[0071] Referring to FIG. 2, a display module (100) is formed with a printed circuit board (110), a plurality of luminous elements (130) arranged at a predetermined interval on one surface of the printed circuit board (110), and a filling layer (150) formed on one surface of the printed circuit board (110) on which the plurality of luminous elements (130) are mounted.

[0072] A printed circuit board (110) is formed with a conductive pattern. This conductive pattern may include a conductive pattern for connecting to the anode and cathode of each of the plurality of light-emitting elements. This printed circuit board (110) may be formed in a rectangular shape to facilitate connection with another adjacent display module (100). However, the shape of the printed circuit board (110) is not limited thereto, and any shape that facilitates connection with adjacent printed circuit boards (110) may be used. In addition, the thickness (t) of the printed circuit board may be formed to be thicker than the height (h1) of the light-emitting element (130).

[0073] In addition, although the printed circuit board (110) is described as being flat, it is not limited thereto and may be formed as a curved surface having a predetermined curvature. In this case, by connecting the display modules (100) in a matrix shape, a single curved display device can be formed.

[0074] A plurality of light-emitting elements (130) are arranged at predetermined intervals on a printed circuit board. For example, a plurality of light-emitting elements (130) may be arranged in a matrix form on one surface of a printed circuit board (110) at predetermined intervals.

[0075] Each light emitting element (130) may be formed in an approximately hexahedral shape and may be a small or ultra-small LED having a 'width (w1) X length (w2) X height' of '1 mm X 1 mm X 0.7 mm' or less. These figures are merely examples, and light emitting elements smaller than the above-described figures or larger than the above-described figures may also be used. Meanwhile, in the illustrated example, the width and height of the light emitting elements are illustrated and described as being the same, but the width and height of the light emitting elements may be different during implementation. Such light emitting elements may be referred to as micro LED chips, micro LEDs, etc.

[0076] The light-emitting element (130) can emit light through the upper surface (133), and an anode electrode and a cathode electrode can be provided on the lower surface, respectively. The anode electrode and the cathode electrode can each be connected to a conductive pattern formed on a printed circuit board (110). Meanwhile, when implemented, the light-emitting element (130) can also emit light through the side surface (131).

[0077] In addition, since the size of each light-emitting element (130) is made small or ultra-small, the pitch (g1) of each light-emitting element (130) can be set to a very narrow interval, for example, 0.5 mm or less. Preferably, the pitch (g1) of each light-emitting element (130) can be set within a predetermined range (for example, 0.3 to 2 mm) depending on the resolution that a single display device (10) is to implement.

[0078] The filling layer (150) may be placed between each light-emitting element (130) so that the conductive pattern on the upper portion of the printed circuit board (110) is not exposed. At this time, the filling layer (150) may be formed to a height that does not cover the upper surface of each light-emitting element (130). In addition, the filling layer (150) may be formed in a form that covers the four side surfaces (131) of each light-emitting element (130).

[0079] The filling layer (150) is positioned between each light-emitting element (130) arranged roughly in a matrix shape, and may be formed on the edge portion (111) of the printed circuit board (110) in a state of surrounding each side of the light-emitting elements (130) arranged at the outermost end (here, the side refers to the side facing the edge portion (111) of the printed circuit board (110). In order to form a filling layer of this type, a printed circuit board having a protruding structure formed thereon in the outer region having a preset height that is higher than the height of the conductive pattern and lower than the upper surfaces of the plurality of light-emitting elements may be used. Meanwhile, the above-described protruding structure may remain in the display module depending on the implementation method, or may be cut and removed from the final structure.

[0080] In this way, the filling layer (150) is formed to cover the conductive material on the upper part of the printed circuit board (110), and thus, in addition to being waterproof and dustproof, it can also prevent conductive foreign substances from coming into contact with the anode electrode and cathode electrode and safely protect them from static electricity. Accordingly, it is possible to prevent short-circuiting caused by conductive foreign substances or damage to the control circuit elements caused by static electricity.

[0081] The filling layer (150) may be made of an opaque and non-conductive material, and in this case, it is preferable to further include elasticity. For example, the filling layer (150) may be made of silicone, acrylic resin, or epoxy resin. In this case, the coating solvent provided to form the filling layer (150) may have a viscosity of about 2000 to 9000 p(poise) to prevent excessive flow or dripping after being discharged by the nozzle. In addition, the filling layer (150) may be made of a dark color, for example, black, to prevent reflection of light incident on the front of each light-emitting element (130).

[0082] The filling layer (150) may be formed to have a height lower than the height of the upper surface (133) of the light emitting element (130) so as not to cover the upper surface (133) of each light emitting element (130). For example, when the filling material is discharged so that the height (h3) of the filling layer (150) is lower than the height of the upper surface (133) of each light emitting element (130), the upper surface of the filling layer (150) may be formed as a concave curved surface with a predetermined curvature toward one surface of the printed circuit board (110) due to surface tension before the filling solvent is cured. That is, the height of the filling layer (150) described above may be determined so that the concave curved surface has a height higher than the height of the conductive pattern on the printed circuit board. Accordingly, the lowest part of the curved surface of the filling layer may be located above the highest part of the conductive pattern.

[0083] Meanwhile, in FIGS. 2 and 3, the spacing between the plurality of light-emitting elements is illustrated as being the same both horizontally and vertically, but the horizontal spacing and the vertical spacing may be different from each other during implementation. That is, when R light-emitting elements, G light-emitting elements, and B light-emitting elements are arranged in a row as in FIG. 3, the vertical spacing between the plurality of light-emitting elements may be greater than the horizontal spacing so that the pixel spacing constituting the display module is constant. Conversely, when a plurality of light-emitting elements constitute one cell in the vertical direction, the horizontal spacing between the plurality of light-emitting elements may be greater than the vertical spacing.

[0084] Meanwhile, in the above, the layer formed between the light-emitting elements is described and illustrated using the term “filling layer,” but when implemented, it may also be referred to using terms such as coating layer, opaque layer, non-conductive layer, black layer, etc.

[0085] Meanwhile, although the display module (100) is illustrated and described as being equipped with only a printed circuit board, a light-emitting element, and a filling layer, when implemented, the display module (100) may have a driving circuit for driving the light-emitting element described above arranged on the rear side of the printed circuit board. In addition, an additional molding layer, film, etc. may be arranged on the upper part of the display module (100) (i.e., the upper part of the light-emitting element and the filling layer).

[0086]

[0087] Fig. 3 is a drawing showing an example of the arrangement of light-emitting elements. Specifically, Fig. 3 shows an example of the arrangement of light-emitting elements in region IV of Fig. 2.

[0088] Referring to Fig. 3, a plurality of light-emitting elements can be arranged in a matrix form on the upper part of the printed circuit board, and light-emitting elements of the same color can be arranged in each column.

[0089] For example, the first column may be arranged with R light-emitting elements, the second column may be arranged with G light-emitting elements, and the third column may be arranged with B light-emitting elements. In addition, three light-emitting elements (i.e., R light-emitting elements, G light-emitting elements, and B light-emitting elements) per row may operate as one pixel (20). In this case, the R light-emitting elements, G light-emitting elements, and B light-emitting elements constituting one pixel may be referred to as an R sub-pixel, a G sub-pixel, and a B sub-pixel.

[0090] Meanwhile, although the illustrated example illustrates and describes a pixel composed of three light-emitting elements, it may be implemented with four light-emitting elements. Furthermore, although the illustrated and described pixel is configured with light-emitting elements of the same color arranged in rows, it is also possible to arrange light-emitting elements of the same color in columns.

[0091]

[0092] Fig. 4 is a drawing showing another example of the arrangement of light-emitting elements.

[0093] Referring to Fig. 4, a plurality of light-emitting elements may be arranged in a matrix form on a printed circuit board, and four light-emitting elements arranged in a square form may constitute one pixel (30). For example, an R light-emitting element may be arranged in the first upper left area, a G light-emitting element may be arranged in the upper right area, a B light-emitting element may be arranged in the lower left area, and a W light-emitting element may be arranged in the lower right area. In addition, this arrangement structure may be arranged in the same form throughout the printed circuit board. It is obvious that the arrangement of light-emitting elements within one pixel may be arranged in a different order than in the illustrated example.

[0094] Meanwhile, although the illustrated example illustrates and describes one pixel using four light-emitting elements, a pixel may be configured using three light-emitting elements during implementation. For example, it is also possible for the R light-emitting element, the G light-emitting element, and the B light-emitting element to be arranged in the four illustrated positions with one of the four positions being empty (e.g., in an L shape).

[0095] Meanwhile, while FIGS. 3 and 4 illustrate and describe light-emitting elements of different colors, it is also possible to use a single blue light-emitting element. For example, it may be implemented in a form where all light-emitting elements use blue light-emitting elements, but color filters for implementing R, G, and B colors are provided on each light-emitting element. In this case, the color filter may be a quantum dot (QD) color filter, but is not limited thereto.

[0096] Referring to FIGS. 3 and 4, it can be confirmed that the display module (100) does not use a light-emitting element module that operates as one pixel, but rather the light-emitting elements constituting one sub-pixel are placed directly on the printed circuit board.

[0097] Meanwhile, in order to bond multiple light-emitting elements to a printed circuit board, a conductive pattern is exposed on the printed circuit board. Unlike a package-type module, in the case of a chip-type light-emitting element, even if the light-emitting element is bonded to the printed circuit board, the conductive pattern on the upper part of the circuit board is often visible.

[0098] Conductive patterns such as these (e.g., copper foil) can reflect light and affect image quality during display operation. Therefore, it is necessary to cover the conductive pattern with an opaque, non-conductive material to prevent exposure of the conductive pattern.

[0099] Hereinafter, a filling operation for preventing exposure of the conductive pattern will be described with reference to FIGS. 5 and 6.

[0100]

[0101] Figures 5 and 6 are cross-sectional views of a display module taken along line Ⅲ-Ⅲ shown in Figure 2. Specifically, Figure 5 shows a case where a filling material is deposited using a printed circuit board without a separate protruding structure, and Figure 6 shows a case where a filling material is deposited using a printed circuit board having a protruding structure as shown in Figure 9.

[0102] Referring first to FIG. 5, when a filling material (specifically, an opaque non-conductive material) is applied on a printed circuit board (110) on which a plurality of light-emitting elements are arranged, the filling material is positioned between the plurality of light-emitting elements. However, the filling material is deposited so as to cover the space between the plurality of light-emitting elements so as to have a conductive pattern (PCB pattern) underneath, but it can be confirmed that the filling material is covered in a form in which the conductive pattern is not hidden in the outermost region between the outermost light-emitting element and the outer surface of the printed circuit board (110). Specifically, while the outer region between the light-emitting elements is supported by the side surfaces of the light-emitting elements, in the outermost region of the light-emitting elements, only one part is supported by the side surfaces of the light-emitting elements, and the opposite part is not supported. Accordingly, it can be confirmed that the filling material (150') spreads toward the edge of the circuit board that is not supported, so that some of the conductive pattern (501) is exposed.

[0103] A display module formed in this form reflects light input from the outside as the conductive pattern is exposed in the outer area, and thus light interference and color interference such as white seam may occur.

[0104] To address these issues, the present disclosure utilizes a printed circuit board having a protruding structure. An example of the printed circuit board used in the present disclosure is described in detail in FIG. 9.

[0105] By utilizing a printed circuit board as described above, during the process of filling the filling material, the inner side of the outermost region is supported by the sidewall of the light-emitting element, and the outer side is supported by a protruding structure, thereby preventing the filling material from spreading. That is, as illustrated in Fig. 6, the filling material can effectively cover the conductive pattern on the printed circuit board even in the outer region.

[0106] Meanwhile, in the illustrated drawing 6, the protruding structure is not depicted. This is for comparison with drawing 5, and when implemented, a protruding structure may be located on the outer edge between the outermost light-emitting element and the edge of the printed circuit board. In addition, although drawing 6 shows a step between the outermost filling material and the printed circuit board (110), when implemented, it may be implemented in a straight line shape.

[0107]

[0108] Fig. 7 is a drawing showing an example of a display module according to the present invention. Specifically, Fig. 7 shows an example of a display module in which the outer area where the protruding structure is located is not cut during the manufacturing process of the display module.

[0109] Specifically, comparing FIG. 2 and FIG. 7, the display module (100') has a protruding structure (140) positioned on the outer area of ​​the printed circuit board.

[0110] As previously described in FIG. 6, such a protruding structure (140) can prevent the non-conductive material from spreading to the edge of the printed circuit board during the process of filling the opaque non-conductive material between the outermost light-emitting element and the edge (111) of the printed circuit board.

[0111] Meanwhile, the printed circuit board (110), the plurality of light-emitting elements (130), and the filling layer (150) other than the protruding structure (140) have been described previously in FIG. 2, and thus, a duplicate description thereof will be omitted.

[0112] In the drawing 7, the protruding structure (140) is depicted as being positioned at a certain distance from the edge portion (111) of the printed circuit board (110), but when implemented, the outer wall of the protruding structure and the outer wall of the printed circuit board (110) may coincide.

[0113]

[0114] Hereinafter, a method for manufacturing a display module according to the present invention will be described in detail with reference to FIGS. 8 to 21.

[0115] Figure 8 is a flowchart for explaining a method for manufacturing a display module according to the present invention.

[0116] Referring to Fig. 8, a printed circuit board having a conductive pattern and a protruding structure (which may be referred to as a dam) having a preset height in the outer region is prepared (S810). For example, a printed circuit board as illustrated in Fig. 10 or Fig. 15 may be prepared. The specific configuration and operation of the printed circuit board will be described below with reference to Figs. 9 to 15.

[0117] And, a plurality of light-emitting elements are electrically connected to the conductive pattern so that the plurality of light-emitting elements are arranged at preset intervals (S820). This expression may be expressed as transferring the light-emitting elements onto a printed circuit board or bonding the light-emitting elements onto a printed circuit board. For example, each light-emitting element may be bonded onto a printed circuit board using a flip chip method. When a plurality of light-emitting elements are bonded onto a printed circuit board, it may have a shape as shown in FIG. 16.

[0118] And, an opaque non-conductive material is filled in the outer region between the outermost light-emitting element and the protruding structure so that the conductive pattern is not exposed on the top (S830). For example, the opaque non-conductive material can be filled by ejecting it on the printed circuit board at a height corresponding to the height of the protruding structure so that the conductive pattern is not exposed on the top. When the non-conductive material is filled through this operation, a shape as shown in FIG. 17 can be obtained. And, after the filling, an operation of curing the filled opaque non-conductive material can be performed. For example, a curing operation such as leaving the opaque non-conductive material for a sufficient time to cure or matching preset temperature conditions can be performed.

[0119] And a molding layer (160) is formed on top of a plurality of light-emitting elements and a filling layer (S840). When such a molding layer is formed, the printed circuit board can have a shape as shown in Fig. 18.

[0120] And a film layer (170) can be formed on top of the molding layer. When the film layers are formed sequentially in this manner, the printed circuit board can have a shape as shown in Fig. 19. Meanwhile, during implementation, the molding layer and film layer forming operation or the film layer forming process may be omitted.

[0121] And, by cutting the outer area of ​​the printed circuit board on which the film layer is formed, a display module can be ultimately formed (S850). Specifically, the outer area can be cut using a mechanical cutting method or a laser cutting method using a laser.

[0122] This cutting process can be omitted, and when implemented, the entire outer area can be cut, or only the outer area corresponding to some edges of the outer area can be cut. Meanwhile, when implemented, in addition to cutting the entire outer area, it is also possible to cut around the area where the protruding member is located, or to cut based on the outer surface of the protruding structure, so that the protruding structure (or a part of the protruding structure) remains.

[0123] Meanwhile, during implementation, additional processes may be added as post-processes in addition to the processes described above, and processes not described above may be added between the processes described above. Below, detailed operations for each of the multiple processes described above will be described with reference to FIGS. 9 through 21.

[0124]

[0125] Figure 9 is a plan view illustrating a printed circuit board according to the present invention.

[0126] Referring to Fig. 9, a printed circuit board (200) may have a conductive pattern and may have a protruding structure positioned higher than the height of the conductive pattern in an outer region. Specifically, the printed circuit board may be composed of an inner region (201) where various circuits are positioned based on the center, and an outer region (205) that is cut in a later process.

[0127] The internal region (201) may be formed with various conductive patterns where multiple light-emitting elements are positioned and a resist pattern that protects a portion of the conductive patterns.

[0128] The conductive pattern may be a pattern formed of a conductive material for connecting the anode and cathode of each of the plurality of light-emitting elements. This conductive pattern may be referred to as a wiring circuit and may be formed of a material such as copper foil.

[0129] A resist pattern is a pattern that covers a conductive pattern, and includes a coating layer that prevents solder from wetting around the land where the component is to be mounted so that unintended connections do not occur during soldering (or component connection) when mounting the component on the printed circuit board. This resist pattern may be referred to as a solder mask. Through this resist pattern, short circuits in the circuit, short circuits in the printed circuit board, corrosion contamination, etc. can be prevented. This resist pattern may be the same as the material of the core of the printed circuit board, and a thermosetting resin such as epoxy resin, polyimide resin, BT (Bismalemide Triazine) resin, or Teflon resin can be used.

[0130] The outer region (205) is arranged in the outer region of the printed circuit board (200), and the outer region may include a region (203) where a protruding structure is formed and a region (204) where no protruding structure is formed. For example, the region (203) where the protruding structure is formed may be positioned at a distance from the outermost light-emitting element by a distance proportional to a pitch corresponding to the arrangement interval between a plurality of light-emitting elements. For example, the distance may be half of the corresponding pitch or a distance corresponding to the corresponding pitch.

[0131] That is, the display module does not operate independently, but is positioned adjacent to other display modules and operates. Specifically, referring to V of FIG. 1, the outermost light-emitting element of one display module is adjacent to the outermost light-emitting element of another display module, and the distance between the two light-emitting elements is preferably positioned similarly to the distance between light-emitting elements within other internal display modules. Accordingly, the distance between the outermost light-emitting element and the protruding structure can be determined by taking into consideration the proximity to other display modules and process errors during the cutting process.

[0132] As described above, the protruding structure is arranged in the outer region (205) in a form that surrounds the inner region (201), and may be formed at a preset height. For example, the protruding structure may be positioned at a preset interval from the region where the outermost element among the plurality of light-emitting elements is arranged. Here, the preset interval may be a distance spaced apart by a second interval corresponding to the interval between the outermost light-emitting element of the plurality of light-emitting elements and the plurality of light-emitting elements (i.e., the pitch between the light-emitting elements). For example, the second interval may be half the pitch between the light-emitting elements or a pitch interval.

[0133] The protruding structure may be a structure in which a copper layer, a solder resist layer, and a silk ink layer are sequentially laminated. Alternatively, the protruding structure may be a structure in which a solder resist layer and a silk ink layer are sequentially laminated. Such a protruding structure is referred to as having a protruding shape on a printed circuit board, but may also be referred to as a dam structure or a dam member.

[0134] Hereinafter, with reference to FIGS. 10 to 12, the manufacturing operation of a printed circuit board (200) having a protruding structure composed of a copper layer, a solder resist layer, and a silk ink layer will first be described.

[0135] First, referring to FIG. 10, a conductive pattern (220) can be formed on a substrate (210). In addition to a pattern for electrical connection of a plurality of light-emitting circuits, a copper foil layer (241) can be formed together in an outer region of the substrate (210). At this time, the height of the copper foil layer located in the outer region may be the same as the height of the copper foil layer (or conductive pattern) located in an inner region of the substrate, and the copper foil layer (241) may be composed of the same material as the conductive pattern (220) formed in the inner region (201).

[0136] Meanwhile, during implementation, the conductive pattern (220) and the copper layer (241) can be implemented individually through separate processes, and in this case, the heights of the conductive pattern (220) and the copper layer (241) may be different from each other.

[0137] And referring to FIG. 11, a solder resist layer (230) can be formed on a substrate on which a conductive pattern (220) is formed. At this time, a solder resist layer (242) can be formed simultaneously on an outer region of the substrate (i.e., an region where a protruding structure is to be positioned). When the solder resist layers are formed simultaneously on the inner region and the outer region, the materials of the two solder resist layers (230, 242) can be the same, and the heights of the two solder resist layers (230, 242) can be the same.

[0138] In the illustrated example, the solder resist layers for the outer region and the inner region are simultaneously formed through a single process. However, in implementation, it is also possible to form the inner region first and then form the outer region through a separate process. In this case, when the solder resist layers are formed separately, the heights of the two solder resist layers (230, 242) can be formed in different shapes.

[0139] And referring to FIG. 12, a silk ink layer (243) (or silkscreen) can be formed on the outer area of ​​the substrate. Specifically, it can be formed to have a preset height corresponding to the height of a light-emitting element bonded to a conductive pattern on top of a solder resist layer (230) on the outer area.

[0140] As such, the silk ink layer (243) is formed on top of the solder resist layer (242), and can be formed using thermosetting ink or infrared-curable ink, etc. The uppermost height of the silk ink layer can be formed to correspond to the height of the protruding structure. For example, it can be lower than the light-emitting element located on the printed circuit board, and higher than the middle height of the light-emitting element. As described above, the height of the silk ink layer (243) is to prevent excessive spreading in the outermost region during the process of filling the non-conductive material, that is, to prevent the conductive pattern on the printed circuit board from being exposed on top after the filling of the non-conductive material. As long as it has a minimum height to achieve the above-described purpose, various heights can be used.

[0141] Although it has been described that the protruding structure (240) of the present disclosure is implemented using a copper foil layer (241), a solder resist layer (242), and a silk ink layer (243), if the copper foil layer (241) and the solder resist layer (242) are formed by the same process as the configuration within the internal region (201), the height of the protruding structure (240) can be made to have a required height by adjusting the height of the silk ink layer (243).

[0142] The silk ink layer (243) may be formed using a material such as silk ink, but is not limited thereto, and various materials such as Teflon, primer, etc. may be used.

[0143] The method for manufacturing a printed circuit board having a protruding structure composed of three layers has been described above. However, when implemented, the protruding structure may be composed of only two layers. This will be described with reference to FIGS. 13 to 15.

[0144]

[0145] First, referring to Fig. 13, a conductive pattern (220) is formed on a substrate (210). Compared to Fig. 10, it can be seen that in Fig. 13, the conductive pattern is formed only in the inner region, and no conductive pattern is placed in the outer region where the protruding structure is to be located.

[0146] Next, referring to FIG. 14, a solder resist layer (230) may be formed on a substrate having a conductive pattern (220) formed thereon. At this time, a solder resist layer (242) may be formed together on an outer region of the substrate (i.e., an area where a protruding structure is to be positioned). When the solder resist layers are formed together for the inner region and outer region of the substrate, the materials of the two solder resist layers may be the same, and their heights may also be the same.

[0147] Meanwhile, during implementation, it is also possible to form solder resist layers individually for each of the outer and inner regions of the substrate. In this method, the two solder resist layers (242, 230) may be composed of different materials or have different heights.

[0148] And referring to FIG. 15, a silk ink layer can be formed on the outer area of ​​the substrate. Specifically, it can be formed to have a preset height corresponding to the height of a light-emitting element bonded to a conductive pattern on top of a solder resist layer (230) on the outer area.

[0149] Meanwhile, in illustrating and explaining FIGS. 10 to 15, the protruding structure described above is formed using three components (copper layer, solder resist layer, silk ink layer) or two components (solder resist layer, silk ink layer), that is, a method of forming the solder resist layer (or copper layer and solder resist layer) constituting the protruding structure together during the process of forming the structure in the central region within the printed circuit board is described, but in the implementation, a process of forming the protruding structure in the outer region may be performed after the structure is formed in the inner region.

[0150] Additionally, although the illustrated example shows the three materials (or two materials) forming the protruding structure as being formed in the form of vertical walls, one side of the protruding structure may have an inclined shape, and the width of each layer may be gradually narrower.

[0151] Meanwhile, in the above, only the configuration on the upper side of the printed circuit board is illustrated and described, but a driving circuit for driving a plurality of light-emitting elements may be arranged on the lower side of the printed circuit board (i.e., an area opposite to the area where the plurality of light-emitting elements are arranged).

[0152] The method for manufacturing the display module described below is described using the printed circuit board illustrated in Fig. 12, but the printed circuit board illustrated in Fig. 15 may be used during implementation. In addition, it is also possible to manufacture the display module using a printed circuit board equipped with additional components not illustrated in Fig. 12 or Fig. 15.

[0153] When a printed circuit board (200, 200') having a protruding structure as described above is prepared, a plurality of light-emitting elements (130) can be bonded (or installed, attached, or bonded) on the printed circuit board. For example, each of the plurality of light-emitting elements (130) can be positioned on a conductive pattern where the light-emitting element should be positioned, and bonded on the printed circuit board using a flip-chip method. Here, the flip-chip method is a method of forming a bump on a chip pad to connect a chip and a printed circuit board.

[0154] Meanwhile, the method of attaching a printed circuit board and multiple light-emitting elements using a flip-chip method was described above, but other bonding methods such as wire bonding and bonding using anisotropic conductive film (ACF) may be used in addition to the method described above during implementation.

[0155] In addition, the bonding of the light-emitting elements described above can be used not only to bond the light-emitting elements as a single unit, but also to bond multiple light-emitting elements as multiple units. For example, a method can be used to simultaneously bond R light-emitting elements, then simultaneously bond G light-emitting elements, and then simultaneously bond B light-emitting elements.

[0156] By performing this process, a shape similar to that in Fig. 16 can be obtained.

[0157]

[0158] Figure 16 is a drawing for explaining a state in which a light-emitting element is arranged on a printed circuit board.

[0159] Referring to Fig. 16, it can be seen that a plurality of light-emitting elements (130) are bonded on a printed circuit board (200), and a protruding structure (240) is arranged in the outer region. At this time, it can be seen that the protruding structure (240) has a height lower than the height of the installed light-emitting elements, but higher than the resist layer.

[0160] As the protruding structure is arranged in the outer region in this way, during the process of filling the non-conductive material between the plurality of light-emitting elements, the non-conductive material can be confined by the protruding structure in the outermost region (specifically, between the outermost light-emitting element and the edge of the printed circuit board).

[0161] In the illustrated example, the protruding structure (240) is depicted as having a height lower than the upper surface of the light-emitting element, but the height of the protruding structure may have the same height as the upper surface of the light-emitting element. When implemented, the height of the protruding structure (240) may be higher than the height of the light-emitting element. However, if the height of the protruding structure is excessively high, the movement of the bonding mechanism, etc. may be restricted due to the height of the protruding structure during the bonding process of the light-emitting element. Therefore, the height of the bonding mechanism (or machine) for the high light-emitting element may be taken into consideration.

[0162] Once the printed circuit board with the light-emitting elements bonded thereto is prepared, the spaces between the plurality of light-emitting elements and the space between the outermost light-emitting element and the protruding structure can be filled with a non-conductive material. For this process, a dispensing device that dispenses the non-conductive material can be utilized. For example, the dispensing device may be a device that dispenses the material by the operation of a piezoelectric valve.

[0163] Meanwhile, in the present disclosure, since the gap between each light-emitting element is less than 2 mm, and since the above-described discharge device must discharge the filling material into a very narrow gap, the nozzle of the discharge device may have a diameter (d) smaller than the above-described gap. In addition, the diameter (d) of the nozzle is also taken into consideration the condition that the coating solvent (L) may not be applied to the upper surface of each light-emitting element (130) when the coating solvent (L) is discharged. In addition, the coating solvent (L) may have a viscosity of approximately 2000 to 9000 p(poise) so as to slow down the speed at which it flows down from one surface of the printed circuit board (210) after being discharged by the nozzle (330) (or so as to maintain a certain shape).

[0164] The discharge device can discharge a predetermined amount of discharge material while moving along the X-axis and Y-axis between each light-emitting element at a preset speed.

[0165] In this way, the discharge device can discharge the discharge material (i.e., non-conductive material) not only into the space between the plurality of light-emitting elements but also into the space different from the outermost light-emitting element and the protruding structure, thereby covering all patterns (220, 230) on the upper part of the printed circuit board.

[0166] Meanwhile, in the above, it was explained that a printed circuit board having a protruding structure is used to prevent the above-described discharged material from spreading in the outermost region. On the other hand, instead of using the above-described printed circuit board, a jig can be installed on the outer surface of the printed circuit board and the discharged material can be prevented from spreading through the jig. However, if a relatively large-sized light-emitting element is used, the use of a jig is possible, but if a micro-sized light-emitting element is used, the following problems will arise if a jig is used.

[0167] Specifically, if there is a gap between the jig and the printed circuit board, the discharged material may penetrate the gap between the jig and the printed circuit board, which may result in poor bonding between the display modules. That is, although a fine connection is required between the display modules, the connection between the display modules may become inaccurate due to the discharged material adhered between the printed circuit boards. In addition, when using a jig, there may be a problem in that the process time required to install and detach the jig from the outer surface of the printed circuit board increases, and if the discharged material adheres to the jig, there is a problem in that the discharged material may not remain on the printed circuit board when the jig is detached, but may be separated in the direction of the jig.

[0168]

[0169] Figure 17 is a drawing showing a state in which filling of a non-conductive material is completed between each light-emitting element of a display module and between the outermost element and the protruding structure.

[0170] As shown in Fig. 17, when a non-conductive material is filled to a preset height, the material can be cured for a preset period of time.

[0171] Once the non-conductive material has been cured, a filling layer (150) is formed on the upper portion of the printed circuit board. Subsequently, a molding material may be applied to secure each component on the upper portion of the display module. This molding material may cover not only the upper portion of the light-emitting element but also the filling layer. Furthermore, the molding material may be transparent to allow light from the light-emitting element to pass through.

[0172]

[0173] Figure 18 is a drawing showing the state of a printed circuit board on which a molding layer (160) is formed.

[0174] Referring to Fig. 18, the molding layer is formed in a form that covers not only a plurality of light-emitting elements but also the filling layer.

[0175] Once the molding layer is formed in this manner, a film layer (170) (or film) can be placed on top of the molding layer. In the illustrated example, the film layer is placed with an area smaller than the upper portion of the molding layer. However, when implemented, the film layer may be placed with an area equal to or larger than the upper portion of the molding layer. Furthermore, the film layer may be a film having specific optical properties. For example, an ultra-low-reflection film may be used as the film layer.

[0176]

[0177] FIG. 19 is a drawing showing the state of a printed circuit board on which a film layer is formed according to one embodiment of the present disclosure.

[0178] Referring to Fig. 19, it can be confirmed that a film layer is positioned on top of the molding layer (160). The film layer (170) is formed, and all components of the display module are formed.

[0179] However, as illustrated, the outer region of the printed circuit board has a distance wider than half of the pitch, which is the distance between light-emitting elements, so if display modules are joined (or arranged) in the current state, the distance between light-emitting elements on the outer region of the display module may have a wider distance than the distance between light-emitting elements located in the central region. In this case, a cutting operation such as that illustrated in FIG. 20 described below may be performed.

[0180]

[0181] Figure 20 is a drawing for explaining a process of cutting an outer area.

[0182] Referring to FIG. 20, a laser device (50) can be used to cut the outer area of ​​a printed circuit board. Meanwhile, while the above illustrates cutting the outer area using a laser cutting method using a laser device, it is also possible to cut the outer area using a mechanical cutting method such as a milling device during implementation.

[0183] Meanwhile, although the entire outer area of ​​the display module is described above as being cut, it is possible to implement such that only a portion of the outer area is cut. For example, if the display module (100) is placed in the outermost area constituting the display device, the edge area is not adjacent to another display module, and thus the cutting described above can be performed only on the area adjacent to another display module. For example, if the display module (100) is a module placed on the upper left side of the display device as illustrated in FIG. 1, cutting can be performed only on the right edge and the bottom edge of the display module (100).

[0184] Additionally, although the illustrated example shows that cutting is performed to remove the protruding structure, the cutting position may be on the top of the protruding structure or between the protruding structure and the outer edge of the substrate, so that cutting may be performed in a manner in which the protruding structure remains or a portion of the protruding structure remains.

[0185] Meanwhile, while the above description illustrates and describes that the outer shell of the display module is cut after the formation of the film layer, in implementation, the outer shell may be cut before the formation of the film layer, and the film layer may be formed on the cut structure. Furthermore, the above-described cutting may be performed before the formation of the film layer or before the formation of the molding layer.

[0186]

[0187] Figure 21 is a drawing showing the result of cutting the outer area in Figure 20.

[0188] Referring to Fig. 21, even when the display modules are arranged in a form where they are in contact with each other as the outer area of ​​the printed circuit board is cut in this way, the spacing between the light-emitting elements located at the outermost edges of different display modules can have a spacing that is the same (or similar) as the spacing between the light-emitting elements at the center.

[0189] In addition, as can be seen in the drawings, the protruding structure in the above-described process prevents the filling material inside from spreading excessively to the outer edge of the printed circuit board, so that the filling material in the outermost region can maintain a certain height, and accordingly, the conductive pattern, etc. in the outermost region is prevented from being exposed to the upper side. Accordingly, even when light enters the printed circuit board from the upper surface of the display module, the conductive pattern exposed on the printed circuit board is not visible, so that the outer edge of the display module can maintain the same light reflection performance as the central region.

[0190] Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and various modifications may be made by those skilled in the art to which the present disclosure pertains without departing from the scope of the present invention as set forth in the appended claims.

Claims

1. A printed circuit board (210) having a conductive pattern (220) formed on the upper portion; A plurality of light-emitting elements (130) arranged on the printed circuit board (210) and electrically connected to the conductive pattern; and A filling layer (150) comprising an opaque non-conductive material; The above printed circuit board, It has a protruding structure (240) arranged between the outer area of ​​the plurality of light-emitting elements and the outer surface of the printed circuit board (210). The height of the above protruding structure (240) is higher than the height of the above challenging pattern, The above filling layer (150) is a display module that covers the conductive pattern between the protruding structure (240) and the outer shell of the plurality of light-emitting elements and between the plurality of light-emitting elements (130).

2. In paragraph 1, A display module wherein the height of the above protruding structure is lower than the height of the upper surface of each of the plurality of light-emitting elements.

3. In paragraph 1, The above protruding structure is, A display module comprising a copper layer, a solder resist layer, and a silk ink layer sequentially laminated on the printed circuit board.

4. In paragraph 3, The above copper layer has the same height as the above conductive pattern, A display module in which the solder resist layer has the same height as a resist pattern formed to protect the conductive pattern.

5. In paragraph 1, The above protruding structure is, A display module comprising a solder resist layer and a silk ink layer sequentially laminated on the printed circuit board.

6. In paragraph 1, The above protruding structure is, A display module surrounding the above plurality of light-emitting elements.

7. In paragraph 6, The above protruding structure is, It is arranged at a preset interval from the outermost light-emitting element among the above plurality of light-emitting elements, A display module wherein the above preset interval is the interval between the plurality of light-emitting elements or half of the interval.

8. In paragraph 1, A molding layer disposed on top of the plurality of light-emitting elements and the filling layer; A display module further comprising a film layer disposed on top of the molding layer.

9. In paragraph 1, The above plurality of light-emitting elements are at least one of a R color light-emitting element, a G color light-emitting element, and a B color light-emitting element, A display module in which at least one R color light-emitting element, at least one G color light-emitting element, and at least one B color light-emitting element among the plurality of light-emitting elements operate as one pixel.

10. In paragraph 1, A display module wherein the height of the filling layer is lower than the height of the upper surface of each of the plurality of light-emitting elements.

11. A step for preparing a printed circuit board having a conductive pattern and a protruding structure formed on the outer area; a step of bonding a plurality of light-emitting elements to the conductive pattern; and A method for manufacturing a display module, comprising: a step of depositing an opaque non-conductive material to cover the conductive pattern between the protruding structure and the outer shell of the plurality of light-emitting elements and between the plurality of light-emitting elements (130).

12. In paragraph 11, The step of depositing the above opaque non-conductive material is: A method for manufacturing a display module, wherein an opaque non-conductive material is ejected and deposited on the printed circuit board at a height corresponding to the height of the protruding structure.

13. In paragraph 11, A step of forming a molding layer on top of the plurality of light-emitting elements and the filling layer; A step of forming a film layer on top of the molding layer; and A method for manufacturing a display module, further comprising: a step of cutting an outer area of ​​a printed circuit board on which the film layer is formed.

14. In paragraph 13, The above molding layer is, A method for manufacturing a display module formed using a transparent material.

15. In paragraph 11, The step of connecting the above plurality of light-emitting elements is: A method for manufacturing a display module connected to the printed circuit board using a flip chip method.

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