Battery and electronic device including battery

Abstract

This battery includes: multiple negative electrodes including a negative electrode including a first tab portion and a negative electrode current collector including a first recess; multiple positive electrodes arranged alternately with the multiple negative electrodes, and including a positive electrode including a second tab portion and a positive electrode current collector including a second recess; a separator disposed between two adjacent electrodes among the multiple negative electrodes and the multiple positive electrodes; a first lead tab disposed in the first recess of the negative electrode current collector; and a second lead tab disposed in the second recess of the negative electrode current collector. The first tab portion of the negative electrode is welded to the first lead tab to form a first welded portion located in the first recess of the negative electrode current collector, and the second tab portion of the positive electrode is welded to the second lead tab to form a second welded portion located in the second recess of the positive electrode current collector.

Description

Batteries and electronic devices containing batteries

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including batteries.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, or even functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] According to an embodiment of the present disclosure, a battery may include a plurality of negative electrodes including a negative electrode including a first tab portion and a negative electrode collector including a first recess; a plurality of positive electrodes arranged alternately with the plurality of negative electrodes and including a positive electrode including a second tab portion and a positive electrode collector including a second recess; a separator disposed between two adjacent electrodes among the plurality of negative electrodes and the plurality of positive electrodes; a first lead tab disposed in the first recess of the negative electrode collector; and a second lead tab disposed in the second recess of the positive electrode collector, wherein the first tab portion of the negative electrode is welded to the first lead tab to form a first welding portion positioned in the first recess of the negative electrode collector, and the second tab portion of the positive electrode is welded to the second lead tab to form a second welding portion positioned in the second recess of the positive electrode collector.

[0005] A method for manufacturing a battery according to one embodiment of the present disclosure may include a first process for manufacturing a plate stack including a plurality of first plates and a plurality of second plates alternately arranged with the plurality of first plates, a second process for arranging a first base plate having a first lead tab coupled to one side of the plate stack and welding first tab portions of each of the plurality of first plates to the first lead tab, and a third process for arranging a second base plate having a second lead tab coupled to one side of the plate stack and welding the second lead tab to the second tab portions of each of the plurality of second plates.

[0006] An electronic device according to one embodiment of the present disclosure includes a battery comprising a housing and a lead tab disposed inside the housing, the battery comprising an electrode assembly and at least a portion of which extends outwardly of the electrode assembly, the electrode assembly comprising a plurality of first electrode plates, a plurality of second electrode plates alternately arranged with the plurality of first electrode plates, and a plurality of separators arranged between the plurality of first electrode plates and the plurality of second electrode plates alternately arranged, and the lead tab may include a first portion extending outwardly of the electrode assembly and a second portion extending from the first portion, at least one surface of which is formed with a welded portion facing at least one of the plurality of separators.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is a part of an electronic device according to one embodiment of the present disclosure.

[0013] Figure 7 is a cross-sectional view taken along the C-C' reference line shown in Figure 6.

[0014] FIG. 8 is a perspective view of a battery cell according to one embodiment of the present disclosure.

[0015] FIG. 9 is a perspective view of a battery cell according to one embodiment of the present disclosure.

[0016] Fig. 10 is a cross-sectional view taken along the P-P' reference line shown in Fig. 9.

[0017] FIG. 11A is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0018] FIG. 11b is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0019] FIG. 11c is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0020] FIG. 11d is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0021] FIG. 12A is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0022] FIG. 12b is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0023] FIG. 12c is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0024] FIG. 13a is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0025] FIG. 13b is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0026] FIG. 13c is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0027] FIG. 14a is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0028] FIG. 14b is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0029] FIG. 15a is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0030] FIG. 15b is a drawing for explaining the operation of a method for manufacturing a battery cell according to one embodiment of the present disclosure.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0055] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0056] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0057] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0058] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0059] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0061] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0062] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 11.

[0063] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0064] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0065] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0066] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0067] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (210E).

[0068] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0069] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0071] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0072] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0073] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0074] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0075] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0076] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 15b.

[0077] Referring to FIGS. 4 and 5, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0078] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0079] The first support member (311) may be provided in at least one portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A printed circuit board (340a, 340b) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0080] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) (e.g., the second surface (210B) of FIG. 2), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0081] The memory may include, for example, volatile memory or non-volatile memory.

[0082] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0083] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 309) of FIG. 2.

[0084] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0085] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0086] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0087] In one embodiment, the first support member (311) may be referred to as a “support member.” The support member (311) may include a mounting portion (3111). The mounting portion (3111) may include a recess recessed from one surface of the support member (311). For example, the battery (350) may be placed in the mounting portion (3111). The mounting portion (3111) may be a portion of the support member (311) that provides a space in which the battery (350) is placed. The mounting portion (3111) may have a groove shape recessed from one surface of the support member (311).

[0088] Fig. 6 is an enlarged view of a state in which a battery (350) according to one embodiment of the present disclosure is mounted on a support member (311). Fig. 7 is a part of a cross-sectional view taken along the C-C' reference line illustrated in Fig. 6 of the support member (311) and the battery (350). The components described with reference to Figs. 6 and 7 may be partly or entirely the same as the components described with reference to Figs. 1 to 5. The components described with reference to Figs. 6 and 7 may be partly or entirely the same as the components described with reference to Figs. 8 to 15b.

[0089] In one embodiment, the battery (350) may be disposed on the support member (311). The electronic device (101) may include an adhesive member (3113). The support member (311) may include a plate (3112). The plate (3112) may form a portion of the mounting portion (3111). For example, the plate (3112) may form one surface of the mounting portion (3111) on which the battery (350) is disposed. The adhesive member (3113) may be disposed between the battery (350) and the plate (3112). The adhesive member (3113) may attach the battery (350) to the plate (3112).

[0090] According to one embodiment, the electronic device (101) may include a connector (3501). The connector (3501) may extend outside the battery (350). The connector (3501) may electrically connect the battery (350) and an electrical component (e.g., printed circuit boards (340a, 340b, 340c) of FIG. 4). The connector (3501) may include a flexible printed circuit board (FPCB) and a connector component for electrically connecting the battery (350) and the printed circuit board (340). The battery (350) may supply power to the electrical component (e.g., printed circuit boards (340a, 340b, 340c) of FIG. 4).

[0091] According to one embodiment, the battery (350) may be a pouch-type battery. The battery (350) may include a battery housing (351). The battery housing (351) may have a space therein and may accommodate a battery cell (352). The battery (350) may include a battery cell (352). The battery cell (352) may be positioned inside the battery housing (351). The description of the battery cell (352) may be identical to the description of the battery cell (e.g., battery cell (400)) described with reference to FIGS. 8 to 15B.

[0092] According to one embodiment, the battery (350) may include a terrace portion (353). The terrace portion (353) may protrude outside the battery cell (352). A portion of a lead tab (e.g., lead tabs (440, 450) of FIG. 8) may be disposed inside the terrace portion (353). The battery (350) may include a battery circuit (354), a lead tab extension portion (355), a closing member (356), and a sealing member (357). The lead tab extension portion (355) may electrically connect the battery circuit (354) and the lead tab (e.g., lead tabs (440, 450) of FIG. 8). The sealing member (356) may surround the sealing member (357), the battery circuit (354), and the lead tab extension portion (355). A portion of a lead tab (e.g., a lead tab (440, 450) of FIG. 8) may be surrounded by a sealing member (357) and may connect a battery cell (352) and a battery circuit (354). The battery circuit (354) may include a protection circuit module (PCM). The protection circuit module may protect the battery (350) from overcurrent and overdischarge. The battery circuit (354) may be referred to as a printed circuit board. The printed circuit board (e.g., the printed circuit board (340c) of FIG. 4) may include a battery circuit (354) including the protection circuit module.

[0093] FIG. 8 is a perspective view of a battery cell (400) according to an embodiment of the present disclosure. FIG. 9 is a perspective view of a battery cell (400) according to an embodiment of the present disclosure. The components described with reference to FIGS. 8 and 9 may be partially or entirely the same as the components described with reference to FIGS. 1 to 7. The components described with reference to FIGS. 8 and 9 may be partially or entirely the same as the components described with reference to FIGS. 10 to 15B. For example, the description of the battery cell (400) may be identical to the description of the battery cell (352) described with reference to FIGS. 1 to 7.

[0094] According to one embodiment, a battery (e.g., battery (350) of FIGS. 1 to 7) may include a battery cell (400). The battery cell (400) may be placed inside a battery housing (e.g., battery housing (351) of FIG. 7).

[0095] According to one embodiment, the battery cell (400) may include an electrode assembly (401). The electrode assembly (401) may be a structure in which a plurality of electrode plates (e.g., a first electrode plate (410), a second electrode plate (420)) and a plurality of separator layers (e.g., a separator (430)) are laminated. The electrode assembly (401) may include a first electrode plate (410). The first electrode plate (410) may be a negative electrode plate. A plurality of first electrode plates (410) may be arranged. The plurality of first electrode plates (410) may be spaced apart from each other. The electrode assembly (401) may include a second electrode plate (420). The second electrode plate (420) may be a positive electrode plate. A plurality of second electrode plates (420) may be arranged. The plurality of second electrode plates (420) may be spaced apart from each other. The electrode assembly (401) may include a separator (430). The separator (430) may include a plurality of layers. The plurality of separator layers (430) may be spaced apart from each other. The separator (430) may be configured in the form of a single sheet, as shown in FIGS. 14A, 14B, 15A, and 15B. The separator (430) may be understood as an aggregate of a plurality of separator layers (430) arranged inside a completed battery cell (400), as shown in FIGS. 14A, 14B, 15A, and 15B. For example, the separator (430) may include a plurality of separator layers. Each of the plurality of separator layers may be arranged between the first electrode plate (410) and the second electrode plate (420). A plurality of first electrode plates (410) and a plurality of second electrode plates (420) may be arranged alternately. For example, each of the plurality of second electrode plates (420) may be arranged between each of the plurality of first electrode plates (410). For example, each of the plurality of first electrode plates (410) may be arranged between each of the plurality of second electrode plates (420). A separator (430) may be arranged between the first electrode plate (410) and the second electrode plate (420).Each of the plurality of separator layers (430) may be arranged between a plurality of first electrode plates (410) and a plurality of second electrode plates (420) that are alternately arranged. The electrode assembly (401) may be referred to as a “plate assembly.” The electrode assembly (401) may be referred to as a “stack.” The first electrode plate (410) may be referred to as a “cathode body.” The second electrode plate (420) may be referred to as an “anode body.” The first electrode plate (410) may be referred to as a “negative electrode.” The second electrode plate (420) may be referred to as a “positive electrode.”

[0096] According to one embodiment, the battery cell (400) may include lead tabs (440, 450). A plurality of lead tabs (440, 450) may be arranged. For example, two lead tabs (440, 450) may be arranged. The lead tabs (440, 450) may include a first lead tab (440) and a second lead tab (450). The first lead tab (440) may be connected to the first electrode plate (410). The second lead tab (450) may be connected to the second electrode plate (420). The first lead tab (440) may be referred to as a “negative lead tab.” The second lead tab (450) may be referred to as a “positive lead tab.” The lead tabs (440, 450) may protrude outward from the electrode assembly (401). At least a portion of the lead tabs (440, 450) may be positioned inside the electrode assembly (401). The lead tabs (440, 450) may electrically connect the electrode plates (410, 420) and electrical components (e.g., the printed circuit boards (340a, 340b, 340c) of FIG. 4, the battery circuit (354) of FIG. 7).

[0097] According to one embodiment, the first lead tab (440) can be connected to a plurality of first electrode plates (410). Some of the first lead tabs (440) can be located outside the electrode assembly (401), and the rest can be located inside the electrode assembly (401).

[0098] According to one embodiment, the first lead tab (440) may include a first-first portion (441). The first-first portion (441) may be a portion of the first lead tab (440) located outside the electrode assembly (401). The first lead tab (440) may include a first-second portion (443). The first-second portion (443) may be a portion of the first lead tab (440) located inside the electrode assembly (401).

[0099] According to one embodiment, the first electrode plate (410) may include a first recess (413). The first recess (413) may be formed by being sunken into a first body (e.g., the first body (412) of FIG. 12a). The first recess (413) may be formed in a first substrate electrode plate (e.g., the first substrate electrode plate (410a) of FIG. 12a) that is one of the plurality of first electrode plates (410). The first-second portion (443) of the first lead tab (440) may be coupled to the first recess (413). In one embodiment, the first body (412) of the first electrode plate (410) may include an active material. The first recess (413) may be formed in the first body (412). The first recess (413) may not include the active material.

[0100] According to one embodiment, the first lead tab (440) may include a first welded portion (444). The first welded portion (444) may be a portion where tab portions (e.g., tab portions (411) of FIG. 11D) of each of the plurality of first electrode plates (410) are welded. The first welded portion (444) may be a part of the first-second portion (443). The first welded portion (444) may be located inside the electrode assembly (401).

[0101] According to one embodiment, the first lead tab (440) may include a first terminal (445). The first terminal (445) may be disposed in an area of ​​the first-1 portion (441). The first terminal (445) may be located on the outside of the electrode assembly (401). The first terminal (445) may be electrically connected to an electrical component (e.g., the circuit boards (340a, 340b, 340c) of FIG. 4 or the battery circuit (354) of FIG. 7).

[0102] According to one embodiment, the second lead tab (450) may be connected to a plurality of second electrode plates (420). Some of the second lead tabs (450) may be located outside the electrode assembly (401), and the remainder may be located inside the electrode assembly (401).

[0103] According to one embodiment, the second lead tab (450) may include a second-first portion (451). The second-first portion (451) may be a portion of the second lead tab (450) located outside the electrode assembly (401). The second lead tab (450) may include a second-second portion (453). The second-second portion (453) may be a portion of the second lead tab (450) located inside the electrode assembly (401).

[0104] According to one embodiment, the second electrode plate (420) may include a second recess (423). The second recess (423) may be formed by being recessed into a second body (e.g., the second body (422) of FIG. 13a). The second recess (423) may be formed in a second base electrode plate (e.g., the second base electrode plate (420a) of FIG. 13a) which is one of the plurality of second electrode plates (420). The second-2 portion (453) of the second lead tab (450) may be coupled to the second recess (423). In one embodiment, the second body (422) of the second electrode plate (420) may include an active material. The second recess (423) may be formed in the second body (422). The second recess (423) may not include the active material.

[0105] According to one embodiment, the second lead tab (450) may include a second welded portion (454). The second welded portion (454) may be a portion where tab portions of each of the plurality of second electrode plates (420) (e.g., tab portions (421) of FIG. 11D) are welded. The second welded portion (454) may be a part of the second-2 portion (453). The second welded portion (454) may be located inside the electrode assembly (401).

[0106] According to one embodiment, the second lead tab (450) may include a second terminal (455). The second terminal (455) may be disposed in an area of ​​the second-1 portion (451). The second terminal (455) may be located outside the electrode assembly (401). The second terminal (455) may be electrically connected to an electrical component (e.g., the circuit boards (340a, 340b, 340c) of FIG. 4 or the battery circuit (354) of FIG. 7).

[0107] According to one embodiment, the lead tab (440, 450) may include a first portion (441, 451). The first portion (441, 451) may be a portion of the lead tab (440, 450) located outside the electrode assembly (401). The first portion (441, 451) may include a first-first portion (441) and a second-first portion (451).

[0108] According to one embodiment, the lead tab (440, 450) may include a second portion (443, 453). The second portion (443, 453) may be a portion of the lead tab (440, 450) located inside the electrode assembly (401). The second portion (443, 453) may include a second-first portion (443) and a second-second portion (453).

[0109] According to one embodiment, the lead tabs (440, 450) may include welded portions (444, 454). The welded portions (444, 454) may be portions in which tab portions of each of the plurality of electrode plates (410, 420) (e.g., tab portions (411, 421) of FIG. 11D) are welded. The welded portions (444, 454) may be a part of the second portions (443, 453). The welded portions (444, 454) may be located inside the electrode assembly (401). The welded portions (444, 454) may include a first welded portion (444) and a second welded portion (454).

[0110] According to one embodiment, the lead tab (440, 450) may include a terminal (445, 455). The terminal (445, 455) may be disposed in the first portion (441, 451). The terminal (445, 455) may be located on the outside of the electrode assembly (401). The terminal (445, 455) may be electrically connected to an electrical component (e.g., the circuit board (340a, 340b, 340c) of FIG. 4 or the battery circuit (354) of FIG. 7). The terminal (445, 455) may include a first terminal (445) and a second terminal (455).

[0111] According to one embodiment, the lead tab (440, 450) may include an outer tab portion (446, 456). The outer tab portion (446, 456) may be connected to a second portion (443, 453). The outer tab portion (446, 456) may be connected to a second portion (443, 453) in which a welding portion (444, 454) is formed. The outer tab portion (446, 456) may be a portion of a plurality of tab portions (e.g., the first tab portion (411) and the second tab portion (421) of FIG. 11D). The outer tab portion (446, 456) may be a tab portion disposed at the outermost side of the electrode assembly (401) among the plurality of tab portions (411, 421). For example, the outer tab portions (446, 456) may be a plurality of tab portions (411, 321) formed by banding to surround at least a portion of one side of the electrode assembly (401). The outer tab portions (446, 456) may cover other tab portions (411, 421) among the plurality of tab portions (411, 421). The outer tab portions (446, 456) may include a first outer tab portion (446) connected to the first electrode plate (410) and a second outer tab portion (456) connected to the second electrode plate (420).

[0112] According to one embodiment, the lead tab (440, 450) may include a plate connection portion (4461). The plate connection portion (4461) may be connected to the plates (410, 420). The plate connection portion (4461) may be a part of any one of a plurality of tab portions (for example, the tab portions (411) of FIG. 11D). FIG. 9 may be an example illustrating any one of the plurality of plate connection portions (4461). For example, the plurality of plate connection portions (4461) may be arranged to correspond to each of the plurality of first plates (410) and may be arranged between each of the plurality of separator layers (430). For example, a plurality of polar plate connecting portions (4461) may be arranged to correspond to each of a plurality of second polar plates (420), may be arranged between a plurality of separator layers (430), and may be part of a plurality of tab portions (e.g., tab portions (421) of FIG. 11d).

[0113] According to one embodiment, the first electrode plate (410) may include a first edge (410e). The separator (430) may include a separator edge (430e). The first edge (410e) and the separator edge (430e) may be spaced apart from each other. The separator (430) may include a separator end region (436). The separator end region (436) may be a portion of the separator (430) formed between the first edge (410e) and the separator edge (430e). The separator end region (436) may be formed to protrude beyond the edge regions of the first electrode plate (410) and the second electrode plate (420) so as to prevent the two electrode plates from being short-circuited. The first tab portion (for example, the first tab portion (411a) of FIG. 10) may span the separator end region (436). The first tab portion (411a) may be bent in an extension direction from the membrane edge (430e). The membrane end region (436) and the membrane edge (430e) may be formed in each of the plurality of membrane layers (430) and may correspond to each of the plurality of first tab portions (411a). The second electrode plate (420) may include a second tab portion (for example, the second tab portion (421a) of FIG. 13c), and each of the second tab portions (421a) may span the membrane end region (436) in the same manner as the first tab portion (411a) and may be bent in an extension direction from the membrane edge (430e).

[0114] According to one embodiment, the separator (430) may include a separator banding portion (439). The separator banding portion (439) may connect the separator layers positioned between the first electrode plate (410) and the second electrode plate (420).

[0115] Fig. 10 is a cross-sectional view of a battery cell (400) taken along the P-P' reference line illustrated in Fig. 9. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 1 to 9. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 11a to 15b.

[0116] According to one embodiment, the electrode assembly (401) may be formed by stacking a plurality of first electrode plates (410), a plurality of second electrode plates (420), and a plurality of separator layers (430). The electrode assembly (401) may include a first surface (401a) and a second surface (401b). The first surface (401a) may form one surface of the electrode assembly (401), and the second surface (401b) may form the other surface of the electrode assembly (401).

[0117] According to one embodiment, the electrode assembly (401) may include a first substrate plate (410a). The first substrate plate (410a) may be any one of a plurality of first electrode plates (410). The first substrate plate (410a) may be any one of a plurality of first electrode plates (410) to which an active material is applied. The first substrate plate (410a) may be defined as a first electrode plate (410) positioned most adjacent to a first surface (401a) among the plurality of first electrode plates (410). The first substrate plate (410a) may form the first surface (401a). The electrode assembly (401) may include a second substrate plate (420a). The second substrate plate (420a) may be any one of the plurality of second electrode plates (420). The second substrate plate (420a) may be any one of a plurality of second electrode plates (420) to which an active material is applied. The second substrate plate (420a) may be defined as the second electrode plate (420) positioned closest to the first surface (401a) among the plurality of second electrode plates (420). The electrode assembly (401) may include a substrate separator layer (430a). The substrate separator layer (430a) may be any one of the plurality of separator layers (430). The substrate separator layer (430a) may be defined as the separator layer (430) positioned closest to the first surface (401a) among the plurality of separator layers (430). The first substrate plate (410a) may be referred to as a “negative electrode current collector.” The second substrate plate (420a) may be referred to as a “positive electrode current collector.”

[0118] According to one embodiment, the welding portion (444, 454) may be located inside the electrode assembly (401). The welding portion (444, 454) may be located between the plurality of separator layers (430). The welding portion (444, 454) may face at least one of the plurality of separator layers (430). The first welding portion (444) of the battery cell (400) according to one embodiment of the present disclosure may have a first surface facing one of the plurality of separators (430), and a second surface opposite to the first surface may form a surface of the electrode assembly (401). The first surface may face the separator layer (430) adjacent to the first welding portion (444), and the second surface may not face the separator layer (430). The first welding portion (444) may be formed on the first base plate (410a). The second welding portion (454) may be formed on the second base plate (420a). In the electrode assembly (401) according to one embodiment of the present disclosure, the second base plate (420a) may form the first surface (401a) of the electrode assembly (401). In the electrode assembly (401) according to one embodiment of the present disclosure, the second plate (420) may form the first surface (401a) or the second surface (401b). In the electrode assembly (401) according to one embodiment of the present disclosure, the first plate (410) may form one of the first surface (401a) and the second surface (401b), and the second plate (420) may form the other of the first surface (401a) and the second surface (401b).

[0119] According to one embodiment, the first-second portion (443) may be located inside the electrode assembly (401). The first-second portion (443) may be a part of the first substrate plate (410a). The first welding portion (444) may be formed on the first-second portion (443) and may form a welding area (W) together with the first-second portion (443). The second-second portion (453) may be located inside the electrode assembly (401). The second-second portion (453) may be a part of the second substrate plate (420a). The second welding portion (454) may be formed on the second-second portion (453) and may form a welding area (W) together with the second-second portion (453).

[0120] According to one embodiment, the first tab portion (411a) of each of the plurality of first electrode plates (410) may extend toward the first base electrode plate (410a). The plurality of first tab portions (411a) may overlap each other. The plurality of first tab portions (411a) may be extended in a bundle toward the first base electrode plate (410a) and may be integrally welded at the first-second portion (443). The second tab portion (e.g., the second tab portion (421a) of FIG. 13c) of each of the plurality of second electrode plates (420) may also be extended in a similar manner toward the second base electrode plate (420a) and may be integrally welded at the second-second portion (453).

[0121] According to one embodiment, the lead tab (440, 450) may include a bending portion (447, 457). The bending portion (447, 457) may be located on the outside of the electrode assembly (401). The bending portion (447, 457) may connect the substrate plate (410a, 420a) and the first portion (441, 451). The bending portion (447, 457) may include a first bending portion (447) connecting the first substrate plate (410a) and the 1-1 portion (441). The bending portion (447, 457) may include a second bending portion (457) connecting the second substrate plate (420a) and the 2-1 portion (e.g., the 2-1 portion (451) of FIG. 8). The first-1 part (441) and the second-1 part (e.g., the second-1 part (451) of FIG. 8) may be positioned substantially on the same plane. The angle at which the first bending part (447) is inclined with respect to the first substrate plate (410a) may be different from the angle at which the second bending part (457) is inclined with respect to the second substrate plate (420a). Since the first substrate plate (410a) and the second substrate plate (420a) are spaced apart from each other with the separator (430) therebetween, and the angles at which the first bending part (447) and the second bending part (457) are inclined are different, the first-1 part (441) and the second-1 part (e.g., the second-1 part (451) of FIG. 8) may be positioned substantially on the same plane.

[0122] FIGS. 11A to 15B may be drawings sequentially illustrating a method for manufacturing a battery cell (400) according to an embodiment of the present disclosure. For example, after assembling the structures illustrated in FIG. 11A, assembly of the structures illustrated in FIG. 11B may be performed. For example, after assembling the structures illustrated in FIG. 11D, assembly of the structures illustrated in FIG. 12A may be performed. However, the order of the method for manufacturing the battery cell (400) is not limited to the above-described order, and the order of the manufacturing methods illustrated in FIGS. 11A to 15B may be switched with each other.

[0123] FIGS. 11A to 11D are drawings illustrating a method for manufacturing a plate stack (402) according to one embodiment of the present disclosure. The plate stack (402) according to one embodiment of the present disclosure can be manufactured by assembling in the order illustrated in FIGS. 11A to 11D. FIG. 11A is a drawing of one (4101) of a plurality of first plates (410) and a sheet (460) according to one embodiment of the present disclosure. FIG. 11B is a drawing of one (4201) of a plurality of second plates (420) and a sheet (460) laminated on the structure of FIG. 11A. FIG. 11C is a drawing of one (4102) of a plurality of first plates (410) and a sheet (460) laminated on the structure of FIG. 11B. FIG. 11d is a drawing showing a structure of FIG. 11c in which the manufacturing methods of FIGS. 11a and 11b are alternately performed to laminate a plurality of first electrode plates (410) and a plurality of second electrode plates (420). The components described with reference to FIGS. 11a to 11d may be partially or entirely identical to the components described with reference to FIGS. 1 to 10. The components described with reference to FIGS. 11a to 11d may be partially or entirely identical to the components described with reference to FIGS. 12a to 15b.

[0124] According to one embodiment, a plate stack (402) may be manufactured during the manufacturing process of a battery cell (400). The process of manufacturing the plate stack (402) according to one embodiment of the present disclosure may be referred to as a "first process." The plate stack (402) may be formed by assembling structures in the order illustrated in FIGS. 11A to 11D .

[0125] According to one embodiment, the plate stack (402) may include a plurality of first plates (410). The plate stack (402) may include a plurality of second plates (420). The plate stack (402) may include a plurality of sheets (460). The plurality of first plates (410) and the plurality of second plates (420) may be alternately arranged and stacked. For example, each of the plurality of second plates (420) may be positioned between each pair of the first plates (410). For example, each of the plurality of first plates (410) may be positioned between each pair of the second plates (420). Each of the plurality of sheets (460) may be positioned between each first plate (410) and each second plate (420). Some of the plurality of sheets (460) may be detachably coupled to each of the plurality of first electrode plates (410), and the remaining may be detachably coupled to each of the plurality of second electrode plates (420). Each of the plurality of sheets (460) may correspond to any one of the plurality of first electrode plates (410) that are distinct from each other. Each of the plurality of sheets (460) may correspond to any one of the plurality of second electrode plates (420) that are distinct from each other.

[0126] According to one embodiment, the plate stack (402) may be formed by stacking a plurality of first plates (410). The plate stack (402) may be formed by stacking a plurality of second plates (420). The plurality of first plates (410) may include a first-first plate (4101) and a first-second plate (4102). The plurality of second plates (420) may include a second-first plate (4201) and a second-second plate (4202). The first-first plate (4101) and the first-second plate (4102) may be spaced apart from each other, and the second-first plate (4201) may be disposed between the first-first plate (4101) and the first-second plate (4102). The 2-1 pole plate (4201) and the 2-2 pole plate (4202) can be spaced apart from each other, and the 1-2 pole plate (4102) can be placed between the 2-1 pole plate (4201) and the 2-2 pole plate (4202).

[0127] According to one embodiment, each of the plurality of first electrode plates (410) may include a first tab portion (411). Each of the plurality of first electrode plates (410) and each of the plurality of first tab portions (4111, 4112, 411n) may correspond one-to-one to each other. For example, one first electrode plate (410) may include one first tab portion (e.g., a 1-1 tab portion (4111)). The first tab portion (411) may protrude in a direction toward the outside of the electrode plate stack (402). The 1-1 electrode plate (4101) may include the 1-1 tab portion (4111), and the 1-2 electrode plate (4102) may include the 1-2 tab portion (4112). The first electrode plate (410) arranged at the outermost side of the electrode plate stack (402) may include a first outermost tab portion (411n). The first tab portions (4111, 4112, 411n) of each of the plurality of first electrode plates (410) may be spaced apart from each other.

[0128] According to one embodiment, each of the plurality of second electrode plates (420) may include a second tab portion (421). Each of the plurality of second electrode plates (420) and each of the plurality of second tab portions (4211, 4212, 421n) may correspond one-to-one to each other. For example, one second electrode plate (420) may include one second tab portion (e.g., a 2-1 tab portion (4211)). The second tab portion (421) may protrude in a direction toward the outside of the electrode plate stack (402). The 2-1 electrode plate (4201) may include the 2-1 tab portion (4211), and the 2-2 electrode plate (4202) may include the 2-2 tab portion (4212). The second electrode plate (420) arranged at the outermost side of the electrode plate stack (402) may include a second outermost tab portion (421n). The second tab portions (4211, 4212, 421n) of each of the plurality of second electrode plates (420) may be spaced apart from each other.

[0129] According to one embodiment, the first-first pole plate (4101) and the sheet (460) may be arranged as shown in FIG. 11a. The first-first pole plate (4101) may include a first-first tab portion (4111). The process of arranging the first-first pole plate (4101) may be referred to as a "first-first process."

[0130] According to one embodiment, the 2-1 pole plate (4201) and the sheet (460) may be laminated on the 1-1 pole plate (4101) as shown in FIG. 11b. The 2-1 pole plate (4201) may include the 2-1 tab portion (4211). The process of laminating the 2-1 pole plate (4201) on the 1-1 pole plate (4101) may be referred to as a “1-2 process.” The 1-2 process may be performed after the 1-1 process. The first process (e.g., the processes of FIGS. 11a to 11d) may include the 1-1 process and the 1-2 process.

[0131] According to one embodiment, the first-second pole plate (4102) and the sheet (460) may be laminated on the second-first pole plate (4201) as shown in FIG. 11c. The first-second pole plate (4102) may include a first-second tab portion (4112). The first-second tab portion (4112) may be spaced apart from the upper side of the first-first tab portion (4111). The process of laminating the first-second pole plate (4102) on the second-first pole plate (4201) may be referred to as a “first-third process.” The first-third process may be performed after the first-second process. The first process (e.g., the processes of FIGS. 11a to 11d) may include the first-first process, the first-second process, and the first-third process.

[0132] According to one embodiment, as shown in FIG. 11d, the plate stack (402) can be formed by alternately repeating the 1-1 process, the 1-2 process, and the 1-3 process. For example, after the 1-3 process, a sheet (460) and a 2-2 plate (4202) can be laminated on the 1-2 plate (4102), and thereafter, a sheet (460) and a 1-3 plate (not shown) can be laminated.

[0133] FIGS. 12A, 12B, and 12C are drawings explaining a process of welding a plate stack (402) and a first substrate plate (410a). FIG. 12A is a drawing of the first substrate plate (410a). FIG. 12B is a drawing of arranging the first substrate plate (410a) so that at least a portion of the first substrate plate (410a) overlaps one side of the plate stack (402). FIG. 12C is a drawing of a state in which a plurality of first tab portions (411) and a first lead tab (440) are welded. The components explained with reference to FIGS. 12A, 12B, and 12C may be some or all the same as the components explained with reference to FIGS. 1 to 11D. The components described with reference to FIGS. 12a, 12b, and 12c may be partially or entirely the same as the components described with reference to FIGS. 13a to 15b.

[0134] According to one embodiment, the first substrate plate (410a) may include a first body (412) and a first recess (413). The first body (412) may be a substantially flat plate. The first body (412) may include an active material. The first recess (413) may be formed in the first body (412). The first recess (413) may not include the active material. The first recess (413) may be defined as an area of ​​the first substrate plate (410a) where the active material is not applied. The first lead tab (440) may be coupled to the first recess (413). The first-second portion (443) may be coupled to the first recess (413). The first-first portion (441) may extend from the first recess (413) in a direction away from the first base electrode plate (410a). The first base electrode plate (410a) may be referred to as a “base cathode body.”

[0135] According to one embodiment, during the manufacturing process of the battery cell (400), a plurality of first tab portions (411) of the electrode plate stack (402) and the first lead tab (440) of the first base electrode plate (410a) may be welded. According to one embodiment of the present disclosure, the process of welding the first tab portions (411) and the first lead tab (440) may be referred to as a “second process.” The welding process of the first tab portions (411) and the first lead tab (440) may be performed in the order of FIGS. 12b and 12c (e.g., FIG. 12b-> FIG. 12c).

[0136] According to one embodiment, as shown in FIG. 12b, a first substrate plate (410a) may be arranged on one side of the plate stack (402). The first substrate plate (410a) may be arranged such that a portion thereof vertically overlaps a plurality of first tab portions (411). The plurality of first tab portions (411) may be vertically aligned with the first-second portion (443) of the first lead tab (440). The process of arranging the first substrate plate (410a) on one side of the plate stack (402) may be referred to as a “2-1 process.” The second process (for example, the processes of FIGS. 12b and 12c) may include the 2-1 process.

[0137] According to one embodiment, as shown in FIG. 12c, a plurality of first tab portions (411) can be welded to a first-second portion (443). A first welding portion (444) can be formed by welding a plurality of first tab portions (411). The first base plate (410a) can provide a portion (e.g., a first-second portion (443)) to which the plurality of first tab portions (411) are welded. The first-first portion (441) of the first lead tab (440) can be located on the lower side of the plate stack (402). The first lead tab (440) can include a first connection portion (446) connected to each of the plurality of first tab portions (411a). The first connection portion (446) can connect each of the plurality of first tab portions (411a) to the first-second portion (443). The process of welding a plurality of first tab portions (411) to the first substrate plate (410a) may be referred to as a "2-2 process." The 2-2 process may be performed after the 2-1 process. The second process (e.g., the process of FIGS. 12b and 12c) may include the 2-1 process and the 2-2 process.

[0138] FIG. 13a, FIG. 13b, and FIG. 13c are drawings explaining a process of welding a plate stack (402) and a second base plate (420a). FIG. 13a is a drawing of the second base plate (420a). FIG. 13b is a drawing of arranging the second base plate (420a) so that at least a portion of the second base plate (420a) overlaps one side of the plate stack (402). FIG. 13c is a drawing of a state in which a plurality of second tab portions (421) and a second lead tab (450) are welded. The components explained with reference to FIG. 13a, FIG. 13b, and FIG. 13c may be some or all the same as the components explained with reference to FIG. 1 to FIG. 12c. The components described with reference to FIGS. 13a, 13b, and 13c may be partially or entirely the same as the components described with reference to FIGS. 14a to 15b.

[0139] According to one embodiment, the second substrate plate (420a) may include a second body (422) and a second recess (423). The second body (422) may be a substantially flat plate. The second body (422) may include an active material. The second recess (423) may be formed in the second body (422). The second recess (423) may not include the active material. The second recess (423) may be defined as an area of ​​the second substrate plate (420a) where the active material is not applied. The second lead tab (450) may be coupled to the second recess (423). The second-2 portion (453) may be coupled to the second recess (423). The second-1 portion (451) may extend from the second recess (423) in a direction away from the second base plate (420a). The second base plate (420a) may be referred to as a “base anode body.”

[0140] According to one embodiment, during the manufacturing process of the battery cell (400), a plurality of second tab portions (421) of the electrode plate stack (402) and the second lead tab (450) of the second base electrode plate (420a) may be welded. According to one embodiment of the present disclosure, the process of welding the second tab portions (421) and the second lead tab (450) may be referred to as a “third process.” The welding process of the second tab portions (421) and the second lead tab (450) may be performed in the order of FIGS. 13b and 13c (e.g., FIG. 13b-> FIG. 13c).

[0141] According to one embodiment, as shown in FIG. 13b, a second substrate plate (420a) may be arranged on one side of the plate stack (402). The second substrate plate (420a) may be arranged such that a portion thereof vertically overlaps a plurality of second tab portions (421). The plurality of second tab portions (421) may be vertically aligned with the second-2 portion (453) of the second lead tab (450). The process of arranging the second substrate plate (420a) on one side of the plate stack (402) may be referred to as a “3-1 process.” The third process (e.g., the processes of FIGS. 13b and 13c) may include the 3-1 process.

[0142] According to one embodiment, as shown in FIG. 13c, a plurality of second tab portions (421) can be welded to a second-second portion (453). A second welding portion (454) can be formed by welding a plurality of second tab portions (421). The second base plate (420a) can provide a portion (e.g., a second-second portion (453)) to which the plurality of second tab portions (421) are welded. The second-first portion (451) of the second lead tab (450) can be located on the lower side of the plate stack (402). The second lead tab (450) can include a second connection portion (456) connected to each of the plurality of second tab portions (421a). The second connection portion (456) can connect each of the plurality of second tab portions (421a) to the second-second portion (453). The process of welding a plurality of second tab portions (421) to the second substrate plate (420a) may be referred to as the "3-2 process." The 3-2 process may be performed after the 3-1 process. The third process (e.g., the processes of FIGS. 13b and 13c) may include the 3-1 process and the 3-2 process.

[0143] FIG. 14a and FIG. 14b are drawings explaining a process of laminating a separator (430) on a plate (e.g., a second base plate (420a)). FIG. 14a is a drawing before the separator (430) is laminated on the plate (e.g., a second base plate (420a)), and FIG. 14b is a drawing after the separator (430) is laminated on the plate (e.g., a second base plate (420a)). The components described with reference to FIG. 14a and FIG. 14b may be partly or entirely the same as the components described with reference to FIG. 1 to FIG. 13c. The components described with reference to FIG. 14a and FIG. 14b may be partly or entirely the same as the components described with reference to FIG. 15a and FIG. 15b.

[0144] According to one embodiment, a separator (430) may be laminated on a plate (e.g., a second base plate (420a)) during the manufacturing process of a battery cell (400). The process of laminating the separator (430) on a plate (e.g., a second base plate (420a)) according to one embodiment of the present disclosure may be referred to as a “fourth process.” The laminating process of the plate (e.g., the second base plate (420a)) and the separator (430) may be performed in the order of FIGS. 14a and 14b (e.g., FIG. 14a-> FIG. 14b). The fourth process may be performed after the third process (e.g., after the 3-2 process illustrated in FIG. 13c).

[0145] According to one embodiment, as shown in FIG. 14a, a separator (430) may be placed between a second substrate plate (420a) and a first substrate plate (e.g., the first substrate plate (410a) of FIG. 12c). The separator (430) may extend long in one direction from the space between the first substrate plate (410a) and the second substrate plate (420a). The process of placing the separator (430) between the first substrate plate (410a) and the second substrate plate (420a) may be referred to as “process 4-1.” The fourth process (e.g., the process illustrated in FIGS. 14a and 14b) may include the process 4-1.

[0146] According to one embodiment, as shown in FIG. 14b, a separator (430) may be laminated on a second substrate plate (420a). The separator (430) may be folded in a first direction (e.g., the first direction (F1) of FIG. 14a) from the state of FIG. 14a. The separator (430) may be folded in the first direction (F1) so that a portion thereof may be laminated on the upper side of the second substrate plate (420a). The separator (430) may include a first separator portion (431) located on the outer side of the second substrate plate (420a) and a second separator portion (432) laminated on the second substrate plate (420a). The process of folding the separator (430) and laminating it on the electrode plate (e.g., the second substrate plate (420a)) may be referred to as a “process 4-2”. The fourth process (e.g., the process illustrated in FIGS. 14a and 14b) may include the 4-1 process and the 4-2 process.

[0147] FIGS. 15A and 15B are drawings explaining a process of manufacturing a battery cell (e.g., a battery cell (400) of FIG. 9) by folding the plates (e.g., a first plate (410) and a second plate (420)) of a plate stack (402). FIG. 15A is a drawing after folding the first plate (410) of the plate stack (402) toward the separator (430), and FIG. 15B is a drawing after stacking the separator (430) on the first plate (410) illustrated in FIG. 15A. The components explained with reference to FIGS. 15A and 15B may be some or all the same as the components explained with reference to FIGS. 1 to 14B.

[0148] According to one embodiment, during the manufacturing process of the battery cell (400), the plates of the plate stack (402) (e.g., the first plate (410) and the second plate (420)) and the separator (430) may be alternately folded to manufacture the battery cell (400). According to one embodiment of the present disclosure, the process of alternately and repeatedly folding the plates of the plate stack (402) (e.g., the first plate (410) and the second plate (420)) and the separator (430) may be named a “fifth process.” The process of alternately and repeatedly folding the plates of the plate stack (402) (e.g., the first plate (410) and the second plate (420)) and the separator (430) may be performed in the order of FIGS. 15a and 15b (e.g., FIG. 15a-> FIG. 15b). The fifth process may be performed after the fourth process (e.g., after the 4-2 process illustrated in FIG. 14b).

[0149] According to one embodiment, as shown in FIG. 15a, the first plate (410) of the plate stack (402) may be stacked on top of the separator (430). The first plate (410) of the plate stack (402) may be folded in a second direction (e.g., the second direction (F2) of FIG. 14b) from the plate stack (402) and stacked on the separator (430). The process of folding the plate (e.g., the first plate (410)) of the plate stack (402) and stacking it on the separator (430) may be referred to as “process 5-1”. The fifth process (e.g., the process illustrated in FIGS. 15a and 15b) may include the process 5-1. After the plate (e.g., the first plate (410)) of the plate stack (402) is folded, the sheet (460) may be removed. The sheet (460) that was combined with the plate (410) laminated on the separator (430) can be removed from the plate stack (402). The sheet (460) can be removed by applying force in the third direction (F3) from the plate stack (402). After the sheet (460) is removed, a plate (e.g., a first plate (410)) laminated on the separator (430) and a different type of plate (e.g., a second plate (420)) can be exposed to the outside of the plate stack (402).

[0150] According to one embodiment, as shown in FIG. 15b, the separator (430) may be folded and a portion of the separator (430) may be laminated on the first electrode plate (410). In a state where the first electrode plate (410) is laminated on the separator (430) as shown in FIG. 15a, the separator (430) may be folded in the fourth direction (F4) and laminated on the first electrode plate (410). The separator (430) may include a first separator portion (431) located on the outside of the first electrode plate (410) and a second separator portion (432) laminated on the second electrode plate (420). The process of folding the separator (430) and laminating it on the electrode plate (e.g., the first electrode plate (410)) may be referred to as a “5-2 process.” The 5-2 process may be performed after the 5-1 process. The fifth process (e.g., the process illustrated in FIGS. 15a and 15b) may include the 5-1 process and the 5-2 process.

[0151] According to one embodiment, after the 5-2 process, the first substrate (410) of the electrode stack (402) may be folded in the fifth direction (F5) and laminated over the separator (430) in the same manner as in FIG. 15a, and the sheet (460) may be removed. After the first substrate (410) is laminated over the separator (430), the separator (430) may be folded in the sixth direction (F6) and laminated over the first substrate (410).

[0152] A battery cell according to one embodiment of the present disclosure (e.g., battery cell (400) of FIG. 9) may be formed by repeating the fifth process described with reference to FIGS. 15A and 15B. For example, a method for manufacturing a battery cell (400) may include a first step of folding a plate (e.g., a first plate (410) or a second plate (420)) from a plate stack (402) and stacking it on a second separator portion (432), and a second step of folding and stacking a first separator portion (431) on a plate (e.g., a first plate (410) or a second plate (420)) stacked on the second separator portion (432). The battery cell (400) may be manufactured by alternately repeating the first step and the second step. In the process of repeating the first and second steps, a cell unit (403), which is a part of a battery cell (400), can be formed. The cell unit (403) can include at least one first electrode plate (410), at least one second electrode plate (420), and at least one separator (430).

[0153] According to one embodiment, a battery cell (e.g., battery cell (400) of FIG. 9) can be manufactured through processes 1 to 5 described with reference to FIGS. 11A to 15B. A battery cell (e.g., battery cell (400) of FIG. 9) according to one embodiment of the present disclosure can be manufactured through processes 1 to 5 described above, thereby forming a welding portion (e.g., welding portions (444, 454) of FIG. 8) inside an electrode assembly (e.g., electrode assembly (401) of FIG. 8).

[0154] According to a comparative example, a battery cell according to a comparative example in which the welding portion is located outside the electrode assembly has a structure in which the lead tab located outside the electrode assembly is folded and welded, thereby reducing the size and capacity of the battery by the volume by which the lead tab is folded. A battery cell (400) according to an embodiment of the present disclosure can increase the size and capacity of the battery by positioning the welding portion (e.g., the welding portion (444, 454) of FIG. 8) inside the electrode assembly (401).

[0155] Electronic devices include a battery for powering electrical components. The battery includes an electrode assembly comprising a plurality of stacked negative plates, a plurality of positive plates, and a plurality of separators. To electrically connect the plates constituting the electrode assembly, the tab portions of each of the plates are joined by welding.

[0156] The problem to be solved in the present disclosure may be to position the welding portion where multiple electrode plates are joined inside the electrode assembly.

[0157] The problem to be solved in the present disclosure may be to simplify the manufacturing process of a battery cell.

[0158] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0159] An electronic device according to various embodiments of the present disclosure can reduce the size of a battery and increase its capacity by having a welding portion where a plurality of electrode plates are joined located inside an electrode assembly.

[0160] An electronic device according to various embodiments of the present disclosure can form a welded portion by manufacturing a stack of electrode plates in which a plurality of electrode plates are laminated, and then manufacture a battery cell including a separator, thereby positioning the welded portion of the battery cell inside an electrode assembly.

[0161] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0162] A battery according to one embodiment of the present disclosure (e.g., 350 of FIG. 5) may include an electrode assembly (e.g., 401 of FIGS. 8 to 15B).

[0163] A battery according to one embodiment of the present disclosure (e.g., 350 of FIG. 5) may include a lead tab (e.g., 440, 450 of FIGS. 8 to 15B) at least partially extending outwardly of the electrode assembly (e.g., 401 of FIGS. 8 to 15B).

[0164] An electrode assembly according to one embodiment of the present disclosure (e.g., 401 of FIGS. 8 to 15B) may include a plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B).

[0165] An electrode assembly according to one embodiment of the present disclosure (e.g., 401 of FIGS. 8 to 15B) may include a plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) arranged alternately with a plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B).

[0166] An electrode assembly according to one embodiment of the present disclosure (e.g., 401 of FIGS. 8 to 15B) may include a plurality of separators (e.g., 430 of FIGS. 8 to 15B) arranged between the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) and the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) that are alternately arranged.

[0167] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first portion (e.g., 441, 451 of FIGS. 8 to 15B) extending outwardly from the electrode assembly (e.g., 401 of FIGS. 8 to 15B).

[0168] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second portion (e.g., 443, 453 of FIGS. 8 to 15B) extending from the first portion (e.g., 441, 451 of FIGS. 8 to 15B) between the plurality of separators (e.g., 430 of FIGS. 8 to 15B) and having a welded portion (e.g., 444, 454 of FIGS. 8 to 15B) formed between the plurality of separators (e.g., 430 of FIGS. 8 to 15B).

[0169] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second portion (e.g., 443, 453 of FIGS. 8 to 15B) extending from the first portion (e.g., 441, 451 of FIGS. 8 to 15B) and having at least one surface on which a welded portion (e.g., 444, 454 of FIGS. 8 to 15B) is formed, facing at least one of the plurality of separators (e.g., 430 of FIGS. 8 to 15B).

[0170] A welded portion (e.g., 444, 454 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first welded portion (e.g., 444 of FIGS. 8 to 15B) welded to at least one of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B).

[0171] A welded portion (e.g., 444, 454 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second welded portion (e.g., 454 of FIGS. 8 to 15B) welded to at least one of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B).

[0172] A welded portion (e.g., 444, 454 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first welded portion (e.g., 444 of FIGS. 8 to 15B) in which first tab portions (e.g., 411 of FIGS. 8 to 15B) of each of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) are welded.

[0173] A welded portion (e.g., 444, 454 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second welded portion (e.g., 454 of FIGS. 8 to 15B) in which second tab portions (e.g., 421 of FIGS. 8 to 15B) of each of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) are welded.

[0174] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first connecting portion (e.g., 446 of FIGS. 8 to 15B) connecting the first tab portions (e.g., 411 of FIGS. 8 to 15B) and the first welding portion (e.g., 444 of FIGS. 8 to 15B).

[0175] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second connecting portion (e.g., 456 of FIGS. 8 to 15B) connecting the second tab portions (e.g., 421 of FIGS. 8 to 15B) and the second welding portion (e.g., 454 of FIGS. 8 to 15B).

[0176] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first lead tab (e.g., 440 of FIGS. 8 to 15B) including a first-first portion (e.g., 441 of FIGS. 8 to 15B) located outside of the electrode assembly (e.g., 401 of FIGS. 8 to 15B) and a first-second portion (e.g., 443 of FIGS. 8 to 15B) on which the first welding portion (e.g., 444 of FIGS. 8 to 15B) is formed.

[0177] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second lead tab (e.g., 450 of FIGS. 8 to 15B) including a second-1 portion (e.g., 451 of FIGS. 8 to 15B) located outside of the electrode assembly (e.g., 401 of FIGS. 8 to 15B) and a second-2 portion (e.g., 453 of FIGS. 8 to 15B) on which the second welding portion (e.g., 454 of FIGS. 8 to 15B) is formed.

[0178] A plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first substrate electrode plate (e.g., 410a of FIGS. 8 to 15B) on which the first welding portion (e.g., 444 of FIGS. 8 to 15B) is formed.

[0179] A plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second base electrode plate (e.g., 420a of FIGS. 8 to 15B) on which the second welding portion (e.g., 454 of FIGS. 8 to 15B) is formed.

[0180] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a banding portion (e.g., 447, 457 of FIGS. 8 to 15B) connecting the first portion (e.g., 441, 451 of FIGS. 8 to 15B) and the second portion (e.g., 443, 453 of FIGS. 8 to 15B).

[0181] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a first lead tab (e.g., 440 of FIGS. 8 to 15B) including a first-first portion (e.g., 441 of FIGS. 8 to 15B) located outside the electrode assembly (e.g., 401 of FIGS. 8 to 15B), a first-second portion (e.g., 443 of FIGS. 8 to 15B) located inside the electrode assembly (e.g., 401 of FIGS. 8 to 15B), and a first bending portion (e.g., 447 of FIGS. 8 to 15B) connecting the first-first portion (e.g., 441 of FIGS. 8 to 15B) and the first-second portion (e.g., 443 of FIGS. 8 to 15B).

[0182] A lead tab (e.g., 440, 450 of FIGS. 8 to 15B) according to one embodiment of the present disclosure may include a second lead tab (e.g., 450 of FIGS. 8 to 15B) including a 2-1 part (e.g., 451 of FIGS. 8 to 15B) located outside the electrode assembly (e.g., 401 of FIGS. 8 to 15B), a 2-2 part (e.g., 453 of FIGS. 8 to 15B) located inside the electrode assembly (e.g., 401 of FIGS. 8 to 15B), and a second bending part (e.g., 457 of FIGS. 8 to 15B) connecting the 2-1 part (e.g., 451 of FIGS. 8 to 15B) and the 2-2 part (e.g., 453 of FIGS. 8 to 15B).

[0183] According to one embodiment of the present disclosure, the angles at which the first banding portion (e.g., 447 of FIGS. 8 to 15B) and the second banding portion (e.g., 457 of FIGS. 8 to 15B) are inclined may be different.

[0184] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a first process of manufacturing a plate stack (e.g., 402 of FIGS. 8 to 15B) in which a plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) and a plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) are stacked.

[0185] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a second process of welding first tab portions (e.g., 411 of FIGS. 8 to 15b) of each of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15b) to a first substrate electrode plate (e.g., 410a of FIGS. 8 to 15b) that is one of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15b).

[0186] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a third process of welding second tab portions (e.g., 421 of FIGS. 8 to 15b) of each of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15b) to a second substrate electrode plate (e.g., 420a of FIGS. 8 to 15b) that is one of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15b).

[0187] The order between the second process and the third process according to one embodiment of the present disclosure may be switchable.

[0188] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a fourth process of arranging the separator (e.g., 430 of FIGS. 8 to 15B) between the first substrate plate (e.g., 410a of FIGS. 8 to 15B) and the second substrate plate (e.g., 420a of FIGS. 8 to 15B), and folding the separator (e.g., 430 of FIGS. 8 to 15B) and stacking it on the first substrate plate (e.g., 410a of FIGS. 8 to 15B) or the second substrate plate (e.g., 420a of FIGS. 8 to 15B).

[0189] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a fifth process of stacking one of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) included in the electrode plate stack (e.g., 402 of FIGS. 8 to 15B) or one of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) included in the electrode plate stack (e.g., 402 of FIGS. 8 to 15B) over the separator (e.g., 430 of FIGS. 8 to 15B).

[0190] A battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a battery cell (e.g., 400 of FIGS. 8 to 15B) including the electrode assembly (e.g., 401 of FIGS. 8 to 15B) and the lead tab (e.g., 440, 450 of FIGS. 8 to 15B).

[0191] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a first process of manufacturing a plate stack (e.g., 402 of FIGS. 8 to 15B) including a plurality of first plates (e.g., 410 of FIGS. 8 to 15B) and a plurality of second plates (e.g., 420 of FIGS. 8 to 15B) arranged alternately with the plurality of first plates (e.g., 410 of FIGS. 8 to 15B).

[0192] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a second process of arranging a first base plate (e.g., 410a of FIGS. 8 to 15b) to which a first lead tab (e.g., 440 of FIGS. 8 to 15b) is coupled on one side of the plate stack (e.g., 402 of FIGS. 8 to 15b), and welding the first lead tab (e.g., 440 of FIGS. 8 to 15b) and first tab portions (e.g., 411 of FIGS. 8 to 15b) of each of the plurality of first plates (e.g., 410 of FIGS. 8 to 15b).

[0193] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a third process of arranging a second base plate (e.g., 420a of FIGS. 8 to 15b) to which a second lead tab (e.g., 450 of FIGS. 8 to 15b) is coupled on one side of the plate stack (e.g., 402 of FIGS. 8 to 15b), and welding the second lead tab (e.g., 450 of FIGS. 8 to 15b) and second tab portions (e.g., 421 of FIGS. 8 to 15b) of each of the plurality of second plates (e.g., 420 of FIGS. 8 to 15b).

[0194] According to one embodiment of the present disclosure, the first lead tab (e.g., 440 of FIGS. 8 to 15B) may include a first welding portion (e.g., 444 of FIGS. 8 to 15B) to which the first tab portions (e.g., 411 of FIGS. 8 to 15B) are welded, and the second lead tab (e.g., 450 of FIGS. 8 to 15B) may include a second welding portion (e.g., 454 of FIGS. 8 to 15B) to which the second tab portions (e.g., 421 of FIGS. 8 to 15B) are welded.

[0195] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a fourth process of arranging a separator (e.g., 430 of FIGS. 8 to 15B) between the first substrate plate (e.g., 410a of FIGS. 8 to 15B) and the second substrate plate (e.g., 420a of FIGS. 8 to 15B), and folding the separator (e.g., 430 of FIGS. 8 to 15B) and stacking it on the first substrate plate (e.g., 410a of FIGS. 8 to 15B) or the second substrate plate (e.g., 420a of FIGS. 8 to 15B).

[0196] A method for manufacturing a battery (e.g., 350 of FIG. 5) according to one embodiment of the present disclosure may include a fifth process of stacking one of the plurality of first electrode plates (e.g., 410 of FIGS. 8 to 15B) included in the electrode plate stack (e.g., 402 of FIGS. 8 to 15B) or one of the plurality of second electrode plates (e.g., 420 of FIGS. 8 to 15B) included in the electrode plate stack (e.g., 402 of FIGS. 8 to 15B) over the separator (e.g., 430 of FIGS. 8 to 15B).

[0197] An electronic device (e.g., 101 of FIG. 5) according to one embodiment of the present disclosure may include a housing (e.g., 301 of FIG. 5).

[0198] An electronic device (e.g., 101 of FIG. 5) according to one embodiment of the present disclosure may include a battery (e.g., 350 of FIG. 5) disposed inside the housing (e.g., 301 of FIG. 5) and including an electrode assembly (e.g., 401 of FIGS. 8 to 15B) and a lead tab (e.g., 440, 450 of FIGS. 8 to 15B) at least a portion of which extends outward from the electrode assembly (e.g., 401 of FIGS. 8 to 15B).

[0199] A battery according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 15B) may include a plurality of negative electrodes (e.g., 410 of FIGS. 1 to 15B) including a negative electrode (e.g., 410 of FIGS. 1 to 15B) having a first tab portion (e.g., 411 of FIGS. 1 to 15B) and a negative electrode current collector (e.g., 410a of FIGS. 1 to 15B) including a first recess (e.g., 413 of FIGS. 1 to 15B) and a first lead tab (e.g., 440 of FIGS. 1 to 15B) disposed in the first recess (e.g., 413 of FIGS. 1 to 15B).

[0200] A battery according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 15B) includes a positive electrode (e.g., 420 of FIGS. 1 to 15B) having a second tab portion (e.g., 421 of FIGS. 1 to 15B) and a positive electrode current collector (e.g., 420a of FIGS. 1 to 15B) including a second recess (e.g., 423 of FIGS. 1 to 15B) and a second lead tab (e.g., 450 of FIGS. 1 to 15B) disposed in the second recess (e.g., 423 of FIGS. 1 to 15B), and may include a plurality of negative electrodes (e.g., 410 of FIGS. 1 to 15B) and a plurality of positive electrodes (e.g., 420 of FIGS. 1 to 15B) arranged alternately.

[0201] A battery according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 15B) may include a separator (e.g., 430 of FIGS. 1 to 15B) disposed between two adjacent electrodes among the plurality of negative electrodes (e.g., 410 of FIGS. 1 to 15B) and the plurality of positive electrodes (e.g., 420 of FIGS. 1 to 15B).

[0202] According to one embodiment of the present disclosure, a first tab portion (e.g., 411 of FIGS. 1 to 15B) of a negative electrode (e.g., 410 of FIGS. 1 to 15B) may be welded to a first lead tab (e.g., 440 of FIGS. 1 to 15B) to form a first welding portion (e.g., 444 of FIGS. 1 to 15B) located in the first recess (e.g., 413 of FIGS. 1 to 15B) of the negative electrode current collector (e.g., 410a of FIGS. 1 to 15B).

[0203] According to one embodiment of the present disclosure, a second tab portion (e.g., 421 of FIGS. 1 to 15B) of a positive electrode (e.g., 420 of FIGS. 1 to 15B) may be welded to a second lead tab (e.g., 450 of FIGS. 1 to 15B) to form a second welding portion (e.g., 454 of FIGS. 1 to 15B) positioned in the second recess (e.g., 423 of FIGS. 1 to 15B) of the positive electrode current collector (e.g., 420a of FIGS. 1 to 15B).

[0204] A first lead tab (e.g., 440 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may include a first-first portion (e.g., 441 of FIGS. 1 to 15B) extending outwardly from the plurality of cathodes (e.g., 410 of FIGS. 1 to 15B).

[0205] A first lead tab (e.g., 440 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may include a first-second portion (e.g., 443 of FIGS. 1 to 15B) coupled to the first recess (e.g., 413 of FIGS. 1 to 15B) and having the first welding portion (e.g., 444 of FIGS. 1 to 15B) formed thereon.

[0206] A second lead tab (e.g., 450 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may include a second-1 portion (e.g., 451 of FIGS. 1 to 15B) extending outwardly from the plurality of anodes (e.g., 420 of FIGS. 1 to 15B).

[0207] A second lead tab (e.g., 450 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may include a second-2 portion (e.g., 453 of FIGS. 1 to 15B) coupled to the second recess (e.g., 423 of FIGS. 1 to 15B) and having the second welding portion (e.g., 454 of FIGS. 1 to 15B) formed thereon.

[0208] According to one embodiment of the present disclosure, the first-1 portion (e.g., 441 of FIGS. 1 to 15B) may extend in a direction away from the first recess (e.g., 413 of FIGS. 1 to 15B) from the first-2 portion (e.g., 443 of FIGS. 1 to 15B).

[0209] According to one embodiment of the present disclosure, the 2-1 portion (e.g., 451 of FIGS. 1 to 15B) may extend in a direction away from the 2-2 portion (e.g., 453 of FIGS. 1 to 15B) and the second recess (e.g., 423 of FIGS. 1 to 15B).

[0210] A battery according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 15B) may include an electrode assembly (e.g., 401 of FIGS. 1 to 15B) formed by stacking a plurality of negative electrodes (e.g., 410 of FIGS. 1 to 15B) and a plurality of positive electrodes (e.g., 420 of FIGS. 1 to 15B).

[0211] According to one embodiment of the present disclosure, the first welding portion (e.g., 444 of FIGS. 1 to 15B) and the second welding portion (e.g., 454 of FIGS. 1 to 15B) may be located on the inside of the electrode plate assembly (e.g., 401 of FIGS. 1 to 15B).

[0212] At least a portion of a separator (e.g., 430 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may be disposed between the negative electrode current collector (e.g., 410a of FIGS. 1 to 15B) and the positive electrode current collector (e.g., 420a of FIGS. 1 to 15B).

[0213] At least a portion of a separator (e.g., 430 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may be disposed between the first welding portion (e.g., 444 of FIGS. 1 to 15B) and the second welding portion (e.g., 454 of FIGS. 1 to 15B).

[0214] A first recess (e.g., 413 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may be formed by being sunken from a first body (e.g., 412 of FIGS. 1 to 15B) of a negative electrode current collector (e.g., 410a of FIGS. 1 to 15B) including an active material.

[0215] A second recess (e.g., 423 of FIGS. 1 to 15B) according to one embodiment of the present disclosure may be formed by being recessed from a second body (e.g., 422 of FIGS. 1 to 15B) of a positive electrode collector (e.g., 420a of FIGS. 1 to 15B) including an active material.

[0216] According to one embodiment of the present disclosure, the first tab portion (e.g., 411 of FIGS. 1 to 15B) and the second tab portion (e.g., 421 of FIGS. 1 to 15B) can be bent at the end of the separator (e.g., 430 of FIGS. 1 to 15B).

[0217] A separation membrane according to one embodiment of the present disclosure (e.g., 430 of FIGS. 1 to 15B) may include a separation membrane end region (e.g., 436 of FIGS. 1 to 15B) on which at least a portion of the first tab portion (e.g., 411 of FIGS. 1 to 15B) or the second tab portion (e.g., 421 of FIGS. 1 to 15B) is placed.

[0218] A battery according to one embodiment of the present disclosure (e.g., 350 of FIGS. 1 to 15B) may include a battery cell (e.g., 400 of FIGS. 1 to 15B) including the plurality of negative electrodes (e.g., 410 of FIGS. 1 to 15B), the plurality of positive electrodes (e.g., 420 of FIGS. 1 to 15B), the separator (e.g., 430 of FIGS. 1 to 15B), the first lead tab (e.g., 440 of FIGS. 1 to 15B), and the second lead tab (e.g., 450 of FIGS. 1 to 15B).

[0219] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In the battery (350), A plurality of cathodes (410) including a cathode (410) including a first tab portion (411) and a cathode current collector (410a) including a first recess (413); A plurality of cathodes (420) including a cathode (420) arranged alternately with the above-described plurality of negative electrodes (410) and including a second tab portion (421) and a cathode current collector (420a) including a second recess (423); A separator (430) disposed between two adjacent electrodes among the plurality of cathodes (410) and the plurality of anodes (420); A first lead tab (440) arranged in the first recess (413) of the negative electrode collector (410a); and It includes a second lead tab (450) arranged in the second recess (423) of the above cathode current collector (420a), The first tab portion (411) of the above cathode (410) is It is welded to the first lead tab (440) to form a first welding portion (444) located in the first recess (413) of the negative electrode collector (410a), The second tab portion (421) of the above anode (420) is A battery (350) welded to the second lead tab (450) to form a second welding portion (454) located in the second recess (423) of the positive electrode collector (420a).

2. In paragraph 1, The above first lead tab (440) is A first-first portion (441) extending outside of the above plurality of cathodes (410); and It includes a first-second part (443) that is joined to the first recess (413) and has the first welding part (444) formed therein, The above second lead tab (450) is A second-1 portion (451) extending outwardly from the above plurality of anodes (420); and A battery including a second-2 part (453) coupled to the second recess (423) and having the second welding part (454) formed thereon.

3. In paragraph 2, The above 1-1 part (441) extends from the 1-2 part (443) in a direction away from the first recess (413), The above 2-1 part (451) is a battery that extends in a direction away from the 2-2 part (453) and the second recess (423).

4. In any one of paragraphs 1 to 3, It further includes an electrode assembly (401) formed by stacking the above plurality of cathodes (410) and the above plurality of anodes (420), The above first welding portion (444) and the above second welding portion (454) are, A battery located inside the above electrode assembly (401).

5. In either of paragraphs 1 and 4, At least a portion of the above separation membrane (430), A battery placed between the negative electrode collector (410a) and the positive electrode collector (420a).

6. In any one of paragraphs 1 to 5, At least a portion of the above separation membrane (430), A battery placed between the first welding portion (444) and the second welding portion (454).

7. In any one of paragraphs 1 to 6, The above first recess (413) is It is formed on the first body (412) of the negative electrode collector (410a), and the first body (412) includes the first active material, The above second recess (423) is A battery formed on a second body (422) of a cathode collector (420a), wherein the second body (422) includes a second active material.

8. In any one of paragraphs 1 to 7, The above first tab portion (411) and the above second tab portion (421) are A battery that is bent at the end of the above separator (430).

9. In any one of paragraphs 1 to 8, The above separation membrane (430) is A battery including a separator end region (436) on which at least a portion of the first tab portion (411) or the second tab portion (421) is mounted.

10. In any one of paragraphs 1 to 9, The above battery (350) is, A battery including a battery cell (400) further including the plurality of negative electrodes (410), the plurality of positive electrodes (420), the separator (430), the first lead tab (440), and the second lead tab (450).

11. A method for manufacturing a battery (350) including an electrode assembly (401) and at least one lead tab (440, 450) at least a portion of which extends to the outside of the electrode assembly (401), Performing a first process for manufacturing a plate stack (402) including a plurality of first plates (410) and a plurality of second plates (420) arranged alternately with the plurality of first plates (410); A second process of placing a first substrate plate (410a) with a first lead tab (440) coupled to one side of the above-mentioned plate stack (402) and welding the first lead tab (440) and the first tab portions (411) of each of the plurality of first plates (410) is performed; and A method for manufacturing a battery, comprising: arranging a second substrate plate (420a) having a second lead tab (450) coupled to one side of the above-mentioned plate stack (402), and performing a third process of welding the second lead tab (450) and second tab portions (421) of each of the plurality of second plates (420).

12. In paragraph 11, A method for manufacturing a battery, wherein the first lead tab (440) includes a first welding portion (444) to which the first tab portions (411) are welded, and the second lead tab (450) includes a second welding portion (454) to which the second tab portions (421) are welded.

13. In any one of paragraphs 11 and 12, The manufacturing method of the above battery is: A method for manufacturing a battery further comprising performing a fourth process of placing a separator (430) between the first substrate plate (410a) and the second substrate plate (420a), and folding the separator (430) and laminating it on the first substrate plate (410a) or the second substrate plate (420a).

14. In paragraph 13, A method for manufacturing a battery further comprising performing a fifth process of stacking one of the plurality of first plates (410) included in the above-described plate stack (402) or one of the plurality of second plates (420) included in the above-described plate stack (402) over the separator (430).

15. In paragraph 14, A method for manufacturing a battery further comprising performing and repeating the fourth process and the fifth process alternately.

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