Electronic device and radar apparatus

Abstract

[Problem] To provide a radar apparatus and an electronic device having a structure capable of easily adjusting impedance. [Solution] An electronic device according to the present disclosure comprises: a dielectric substrate; and a first conductor substrate disposed to face the dielectric substrate. The dielectric substrate has: a first in-dielectric body waveguide formed of first and second ground conductors and a plurality of vias; and a second in-dielectric body waveguide formed of a plurality of electromagnetic-band-gap elements and electromagnetically connected to the first in-dielectric body waveguide. A first microstrip ridge gap waveguide electromagnetically connected to the second in-dielectric body waveguide is formed between the dielectric substrate and the first conductor substrate.

Description

Electronic equipment and radar equipment

[0001] The present disclosure relates to an electronic device and a radar device.

[0002] Gap waveguides have been attracting attention as a type of waveguide used in antenna devices. Gap waveguides are easy to manufacture because they have low loss and do not need to be completely surrounded by a conductor like a waveguide. Among gap waveguides, MS-RGW (Microstrip Ridge Gap Waveguide) can easily realize a gap waveguide because it can mount an electromagnetic bandgap (EBG) element on a substrate. Here, MS-RGW is a low-loss transmission line that uses metamaterial technology. EBG refers to a bandgap structure that uses metamaterial technology.

[0003] In an antenna device using an MS-RGW, a narrow conductor pattern such as a microstrip line can be used as a transmission line for inputting and outputting signals to and from an IC chip for signal transmission and reception, thereby achieving a compact, high-performance structure. In this case, by forming the MS-RGW on one side (front surface) of the substrate and forming a microstrip line (MSL) on the other side (back surface), and feeding power from the back surface of the substrate, loss during power feeding can be reduced. In other words, because the back surface of the substrate has few or no components other than the feed line, the line length can be shortened, thereby reducing loss from the power supply circuit to the antenna feed point.

[0004] In a backside feeding configuration, when transmitting, the electric field supplied from the MSL is propagated through a waveguide within the substrate and coupled to the MS-RGW on the front side, and when receiving, the radio waves propagating through the MS-RGW on the front side are coupled to the MSL via a waveguide within the substrate, and impedance adjustment is required. Impedance adjustment posed a challenge given the influence of the dielectric constant of the substrate and the limitations of design rules.

[0005] JP 2018-207487 A JP 2023-021725 A

[0006] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide an electronic device and a radar device having a structure that allows for easy impedance adjustment.

[0007] An electronic device according to the present disclosure comprises a dielectric substrate and a first conductor substrate disposed opposite the dielectric substrate, the dielectric substrate having a first intra-dielectric waveguide formed by first and second ground conductors and a plurality of vias, and a second intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements and electromagnetically connected to the first intra-dielectric waveguide, and a first microstrip ridge gap waveguide electromagnetically connected to the second intra-dielectric waveguide is formed between the dielectric substrate and the first conductor substrate.

[0008] 1A and 1B are cross-sectional views of an antenna device according to a first embodiment of the present disclosure. FIG. 2A is a rear plan view of the antenna device of FIG. 1 as viewed from the positive direction of the Z axis, and FIG. 2B is a top plan view of the antenna device of FIG. 1 as viewed from the negative direction of the Z axis. FIG. 3A is a transparent perspective view of the antenna device of FIG. 1 as viewed obliquely from above in the positive direction of the Z axis, and FIG. 3B is a transparent plan view of the antenna device 1000 of FIG. 1 as viewed from the front in the positive direction of the Z axis. A diagram showing the flow of an electric field in the antenna device of FIG. 1 during transmission or reception. FIG. 5A is a diagram showing the flow of an electric field in an SIW, and FIG. 5B is a diagram showing the flow of an electric field in an EBG-SIW. A diagram showing a comparative example of the antenna device of FIG. 1. A diagram showing a comparative example of the antenna device of FIG. 1. A cross-sectional view of an antenna device according to a second embodiment of the present disclosure. FIG. 9A is a rear plan view of the antenna device of FIG. 8 as viewed from the positive direction of the Z axis, and FIG. 9B is a top plan view of the antenna device of FIG. 8 as viewed from the negative direction of the Z axis. A cross-sectional view of an antenna device according to a third embodiment of the present disclosure. Fig. 11(A) is a rear plan view of the antenna device of Fig. 10 as seen from the positive direction of the Z axis, and Fig. 11(B) is a top plan view of the antenna device of Fig. 10 as seen from the negative direction of the Z axis. A cross-sectional view of an antenna device according to a fourth embodiment of the present disclosure. Fig. 13(A) is a rear plan view of the antenna device of Fig. 12 as seen from the positive direction of the Z axis, and Fig. 13(B) is a top plan view of the antenna device of Fig. 12 as seen from the negative direction of the Z axis. A cross-sectional view of an antenna device according to a fifth embodiment of the present disclosure. Fig. 15(A) is a rear plan view of the antenna device of Fig. 14 as seen from the positive direction of the Z axis, and Fig. 15(B) is a top plan view of the antenna device of Fig. 14 as seen from the negative direction of the Z axis. A cross-sectional view of an antenna device according to a sixth embodiment of the present disclosure. Fig. 17(A) is a rear plan view of the antenna device of Fig. 16 as seen from the positive direction of the Z axis, and Fig. 17(B) is a top plan view of the antenna device of Fig. 16 as seen from the negative direction of the Z axis. The present disclosure relates to an antenna device for a radar system, a vehicle control system, and a vehicle control system for a vehicle.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In this specification and the drawings, components having substantially the same functional configurations are designated by the same reference numerals, and their description will be omitted as appropriate. The drawings are simplified, and components necessary for implementation other than those shown in the drawings are also assumed to be provided as appropriate.

[0010] Fig. 1 is a cross-sectional view of an antenna device 1000 as an electronic device according to an embodiment of the present disclosure. X, Y, and Z axes are shown in Fig. 1. The surface of the antenna device 1000 on the positive side of the Z axis (the surface on the upper side as viewed from the paper) is referred to as the back surface (or bottom surface), and the surface on the negative side of the Z axis is referred to as the top surface.

[0011] Fig. 2(A) is a rear plan view of the antenna device 1000 of Fig. 1 as seen from the positive direction of the Z axis, and Fig. 2(B) is a top plan view of the antenna device 1000 of Fig. 1 as seen from the negative direction of the Z axis, with the conductor substrate 220 not shown in Fig. 2(B).

[0012] Fig. 3A is a transparent perspective view of the antenna device 1000 of Fig. 1 as seen obliquely from above in the positive direction of the Z axis. Fig. 3B is a transparent plan view of the antenna device 1000 of Fig. 1 as seen from the front in the positive direction of the Z axis.

[0013] In this embodiment, in a structure in which power is fed from the back surface of a substrate to an antenna using an MS-RGW (Micro Strip - Ridge Gap Waveguide) 350, a slot 190, a SIW (Substrate Integrated Waveguide) 330, and a SIW using a bandgap (EBG-SIW 340) are combined, thereby realizing power feeding in a small area with low loss.

[0014] The antenna device 1000 includes a dielectric substrate 210 on which various elements are formed, and a conductor substrate 220, which is a first conductor substrate, disposed opposite the dielectric substrate 210 with an air layer 240 interposed therebetween. The dielectric substrate 210 has a structure in which multiple dielectric layers are stacked. Each dielectric layer is a glass epoxy substrate, a fluorine substrate, a glass polyimide substrate, or the like. The conductor substrate 220 is a substrate made of a metal such as aluminum or copper. An air layer 240 is formed between the dielectric substrate 210 and the conductor substrate 220. One or more slots (not shown) are formed on the end side of the conductor substrate 220 in the positive direction of the X axis, through which the electric field propagated through the MS-RGW 350 is radiated as radio waves. In other words, the conductor substrate 220 is an antenna substrate in which slots for radio wave radiation are formed. During reception, radio waves are received through this slot, and an electric field propagates through the MS-RGW 350 in the opposite direction to that during transmission. A microstrip line (MSL) 310, which is a transmission line, is formed on the negative Z-axis side of the dielectric substrate 210, and a power supply circuit 230 is connected to the negative X-axis side of the MSL 310. The power supply circuit 230 generates a transmission signal based on transmission processing and outputs the generated signal to the MSL 310 of the antenna device 1000. The power supply circuit 230 also receives a signal received by the antenna device 1000 from the MSL 310 and performs reception processing on the received signal. The type of transmission line is not limited to a microstrip line (MSL), and other types of lines, such as a coplanar line, may be used.

[0015] An opening OP1 is formed in the ground conductor 90 on the upper surface of the dielectric substrate 210, which serves as an input / output port for radio waves between the EBG-SIW (Electromagnetic Band Gap - Substrate Integrated Waveguide) 340 and the air layer 240. The portion of the air layer 240 from the opening OP1 toward the positive X-axis direction (to the right along the paper) forms a waveguide using a microstrip ridge gap waveguide (MS-RGW) 350. A slot (not shown) is formed in the conductor substrate 220 in this waveguide. The MS-RGW 350 is a waveguide formed by surrounding the ground conductor 90 with the conductor substrate 220 and multiple EBG elements 320 arranged in a plane on both the positive Y-axis direction and the negative Y-axis direction (see FIG. 2B ). The electromagnetic band gap structure formed by the EBG elements 320 prevents radio waves from diffusing toward the positive and negative Y-axis directions. On the other hand, the entire area from the opening OP1 to the negative X-axis direction (left side of the drawing) is covered with EBG 320 elements (see FIG. 2B), thereby blocking radio wave propagation in the negative X-axis direction. The EBG element 320 includes a structure in which conductor pieces 60, 70, and 91 and multiple vias 140 (140A, 140B, and 140C) are connected to a ground conductor 50, and has a mushroom-like shape (see FIG. 3A). The conductor pieces 60, 70, and 91 are formed by patterning the ground conductor into a circular or polygonal shape. The shapes and sizes of the conductor pieces 60, 70, and 91 may be the same or different.

[0016] The dielectric substrate 210 includes the above-described MSL 310, SIW 330, and EBG-SIW 340. The SIW 330 is a first intra-dielectric waveguide that is coupled to the MSL 310 via a slot (opening) 190. The EBG-SIW 340 is a second intra-dielectric waveguide that is electromagnetically coupled to the SIW 330 in the negative direction of the Z axis. The EBG-SIW 340 is electromagnetically connected to the above-described MS-RGW 350 via an opening OP1 in the negative direction of the Z axis.

[0017] The first dielectric waveguide, SIW330, is formed by surrounding a dielectric portion with multiple ground conductors 20, 30, 40, and 50 and multiple vias 110, 120, and 130. In other words, the SIW330 is a waveguide surrounded by a metal pattern and vias, confining the electric field. The ground conductors 20-50 and the vias 110-130 are made of metal, such as copper, aluminum, or gold. The ground conductors 20, 30, 40, and 50 are formed by patterning a conductive foil (e.g., copper foil) on the corresponding dielectric layer. The vias 110-130 are formed, for example, in a cylindrical or prismatic shape. The vias 110-130 are formed, for example, by forming via holes, which are through-holes, in the dielectric layer and plating the via holes with copper or the like. In this example, vias are formed in three layers, but the number of layers in which vias are formed may be one, two, or four or more. An end portion on the back surface side (positive side of the Z axis) of the SIW 330 is connected to the MSL 310 via a slot 190 formed in the ground conductor 20. An upper surface side (negative side of the Z axis) of the SIW 330 is connected to the EBG-SIW 330. The SIW 330 is not limited to the configuration shown in the figure, as long as it is an in-dielectric waveguide formed of at least two first and second ground conductors and a plurality of vias.

[0018] The EBG-SIW 340, which is a second in-dielectric waveguide, is formed by surrounding a dielectric portion of the dielectric substrate 210 with multiple EBG elements 320 and probes 360. The EBG-SIW 340 can be viewed as a ridged SIW having the probes 360 as ridges. The EBG-SIW 340 has a pseudo-wall using the band gap of the EBG elements 320, and the electric field spreads more widely than in the SIW 330. However, by concentrating the electric field on the ridge (probe 360), the characteristic impedance is reduced. The positive Z-axis side of the EBG-SIW 340 is coupled to the SIW 330, and the negative Z-axis side of the EBG-SIW 340 is coupled to the MS-RGW 350 via an opening OP1 in the ground conductor 90.

[0019] As described above, the MS-RGW 350 is a waveguide formed by surrounding the air layer 240 between the ground conductor 90 and the conductor substrate 220 with the EBG elements 320. These EBG elements 320 are formed in a planar shape on both the positive and negative Y-axis directions of the ground conductor 90 (see FIG. 2B , FIG. 3A , and FIG. 3B ). The ground conductor 90 is connected to the ground conductor 50, which is the GND, by multiple vias 321. The vias 321 include a structure in which conductor pieces 60 and 70 and multiple vias 140 (140A, 140B, and 140C) are connected between the ground conductors 50 and 90. Unlike the EBG element 320, the vias 321 do not include an isolated conductor piece 91. The conductor pieces 60 and 70 and the multiple vias 140 (140A, 140B, and 140C) in the vias 321 can be formed using the same manufacturing process as the EBG element 320 described above. In this way, the via 321 has the same structure as the EBG element except that it does not include the conductor piece 91, and therefore the via 321 can be manufactured in the same process as the EBG element.

[0020] The probe 360 ​​includes an end of the ground conductor 90 on the negative X-axis side and a via 321 connected to the end (see FIGS. 2B and 3B). The probe 360 ​​acts as a ridge in the EBG-SIW 340, concentrating the electric field and reducing the characteristic impedance (see FIG. 4, described later). In the figure, the probe 360 ​​is located below the slot 190 (negative Z-axis side). This positional relationship allows the electric field input from the slot 190 to gradually expand rather than suddenly, improving the impedance characteristics (see FIG. 4). The width of the ground conductors 50 and 90 in the Y-axis direction at the probe 360 ​​portion is narrower than that of the other portions (see FIGS. 2B and 3B). However, the width of the ground conductors 50 and 90 in the Y-axis direction at the probe 360 ​​portion may be wider than or the same as the width of the other portions.

[0021] The EBG element 320 has a resonant frequency based on the outer dimensions (diameter) of the conductor pieces, the height of the vias, the thickness of the ground conductor 50, the dielectric constant of the dielectric layer, and other factors. The resonant frequency is set to correspond to the operating band. As an example, when transmitting millimeter-wave signals, the conductor pieces can be configured to have an outer dimension that is approximately one-quarter of the wavelength of the signal or slightly shorter. In this case, the EBG elements 320 are aligned at intervals of, for example, approximately one-quarter the wavelength of the transmission signal or shorter. With this configuration, the planar EBG elements 320 form walls with an electromagnetic bandgap structure, preventing the leakage and spread of electric fields or radio waves. The region where radio wave leakage is prevented by the formation of such EBG elements 320 is referred to as the EBG region 370 (see FIG. 2B ).

[0022] Fig. 4 shows the flow of the electric field during transmission or reception in the antenna device 1000 of Fig. 1. The length of the solid line with an arrow corresponds to the magnitude of the electric field. Fig. 5(A) shows the electric field in the SIW 330, and Fig. 5(B) shows the electric field in the EBG-SIW 340. As shown by the dashed line in Fig. 5(B), the electric field spreads more than in the SIW 330, but the electric field is concentrated by the probe 360 ​​near the opening OP1, thereby achieving impedance matching (reducing the characteristic impedance).

[0023] In the antenna device 1000 shown in FIG. 1 , the slot 190 is positioned on the right side (the side where the probe is provided), so the surface on the Z-axis direction of the probe (ridge) functions as a reflecting surface, gradually spreading the electric field (the length of the solid line with the arrow) flowing in from the MSL 310. Because the SIW 330 is a waveguide surrounded by a metal pattern and vias, the electric field is confined in the SIW 330. This electric field propagates to the EBG-SIW 340, is concentrated by the probe 360 ​​on the ridge, and is supplied to the MS-RGW 350. This reduces the characteristic impedance, improving impedance matching. Without the probe 360, the EBG-SIW 340 would spread the electric field due to the pseudo-wall created by the bandgap, which could increase the characteristic impedance. However, by concentrating the electric field generated by the probe 360 ​​and coupling it to the MS-RGW 350, the characteristic impedance can be lowered. In other words, impedance matching is achieved, and impedance characteristics can be improved. However, a configuration in which the EBG-SIW 340 is directly coupled to the MS-RGW 350 without providing the probe 360 ​​is also possible. Although this configuration may result in high impedance characteristics, it is possible to obtain the effect of miniaturization or a small area because it is possible to feed power directly from the MSL 310 on the back surface of the substrate to the MS-RGW 350. As a related technique, it is also possible to adopt a conversion structure in which a separate MS-RGW is provided in a direction parallel to the substrate surface from the MSL 310 and an electric field is propagated from the MSL to the MS-RGW, but this would result in a large size or area.

[0024] FIG. 6 shows, as a comparative example, an antenna device in which a slot 191 is provided further toward the negative X-axis direction (approximately the center of the SIW) than in FIG. 1 . FIG. 7 shows, as yet another comparative example, an antenna device in which a slot 192 is provided further toward the negative X-axis direction (opposite the side where the probe is provided) than in FIG. 6 . In FIGS. 6 and 7 , the lines with arrows indicate the electric fields during transmission and reception. As shown, the electric field input from the slots 191 and 192 (the length of the solid lines with arrows) spreads rapidly, causing impedance mismatch (an increase in the characteristic impedance). In contrast, in the antenna device 1000 of this embodiment, the slot 190 is provided at a position overlapping with the probe 360 ​​(i.e., the electromagnetic connection between the SIW 330 and the EBG-SIW 340 does not overlap with the slot 190), so the electric field input from the slot 190 gradually spreads, and the electric field can be concentrated by the probe 360 ​​near the opening OP1. This lowers the characteristic impedance and makes impedance matching easier.

[0025] As described above, according to this embodiment, in a structure in which power is fed to an antenna using an MS-RGW from the back surface of a substrate, by combining the slot 190, the SIW 330, and the EBG-SIW 340 (SIW using a bandgap), it is possible to feed power in a small area with low loss.

[0026] Second Embodiment FIG. 8 is a cross-sectional view of an antenna device 2000 as an electronic device according to a second embodiment of the present disclosure.

[0027] Fig. 9(A) is a rear plan view of the antenna device 2000 of Fig. 8 as seen from the positive direction of the Z axis, and Fig. 9(B) is a top plan view of the antenna device 2000 of Fig. 8 as seen from the negative direction of the Z axis. However, the conductor substrate 220A is not shown in Fig. 9(A), and the conductor substrate 220 is not shown in Fig. 9(B).

[0028] 1 and 2 used in the description of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The following description will focus on the differences from the first embodiment.

[0029] In the first embodiment, the arrangement from the Z-axis direction was MSL, SIW, EBG-SIW, and MS-RGW, but in the second embodiment, the arrangement is MS-RGW, EBG-SIW, SIW, EBG-SIW, and MS-RGW. That is, in the first embodiment, one of the input / output sides of the SIW 330 was an MSL and the other was an MS-RGW, but in the second embodiment, both of the input / output sides of the SIW 330 are MS-RGWs via EBG-SIWs with ridges (probes). More specifically, the positive Z-axis side of the SIW 330 is coupled to the MS-RGW 350 via an opening OP2 of an EBG-SIW 340A with a probe (ridge) 360A, which is a third intra-dielectric waveguide. The negative side of the Z axis of the SIW 330 is coupled to the MS-RGW 350 via an opening OP1 of an EBG-SIW 340 with a probe (ridge), as in the first embodiment.

[0030] A signal generated by the power supply circuit (see FIG. 1 ) is input to the MS-RGW 350A via a transmission line (e.g., MSL) (not shown), and an electric field is transmitted in the direction of the arrow in the figure. The air layer 240A between the second conductive substrate 220A and the dielectric substrate, on the positive side of the X-axis from the opening OP2, is an EBG region, and electric field propagation in this direction is blocked. Therefore, the electric field is input to the EBG-SIW 340 via the opening OP2, and is output from the opening OP1 via the SIW 330 and the EBG-SIW 340 to the MS-RGW 350. This electric field is transmitted through the MS-RGW 350 in the direction of the arrow in the figure and is radiated as a radio wave from a slot (not shown). Note that, as in the first embodiment, the air layer 240 between the conductive substrate 220 and the dielectric substrate, on the negative side of the X-axis from the opening OP1, is an EBG region, and electric field propagation in this direction is blocked.

[0031] Even when both the back and top surfaces of the substrate are MS-RGWs in this way, providing EBG-SIWs 340A, 340 with probes on the back and top surfaces of the SIW 330 allows impedance adjustment through electric field concentration during power supply, improving impedance characteristics. Note that, as in the first embodiment, a configuration is also possible in which probes are not provided on the EBG-SIWs 340A, 340 (no ridges are provided on the EBG-SIWs 340A, 340). This also applies to the other embodiments (third to sixth embodiments) that follow.

[0032] 10 is a cross-sectional view of an antenna device 3000 as an electronic device according to a third embodiment of the present disclosure. In the figure, a solid line with an arrow indicating the direction in which an electric field travels is shown.

[0033] Fig. 11(A) is a rear plan view of the antenna device 3000 of Fig. 10 as seen from the positive direction of the Z axis, and Fig. 11(B) is a top plan view of the antenna device 3000 of Fig. 1 as seen from the negative direction of the Z axis, with the conductor substrate 220 not shown in Fig. 11(B).

[0034] 1 and 2 used in the description of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The following description will focus on the differences from the first embodiment.

[0035] In the first embodiment described above, the MS-RGW 350 was formed on the positive X-axis side and the EBG region was formed on the negative X-axis side on the top surface of the substrate. However, in the third embodiment, the MS-RGW 350 is formed on the negative X-axis side and the EBG region is formed on the positive X-axis side. In other words, the electric field propagation direction is opposite between the back surface side and the top surface side. As shown by the solid arrowed line in the figure, the electric field of the signal flowing from the MSL 310 propagates to the MS-RGW 350 via the SIW 330 and the EBG-SIW 340, and flows in the negative X-axis direction (to the left in the figure). In this way, even when the propagation direction of the electric field propagating through the MSL 310 and the electric field propagating through the MS-RGW 350 is opposite, impedance matching can be achieved when power is supplied from the SIW 330 to the MS-RGW 350.

[0036] Fourth Embodiment FIG. 12 is a cross-sectional view of an antenna device 4000 as an electronic device according to a fourth embodiment of the present disclosure.

[0037] Fig. 13(A) is a rear plan view of the antenna device 4000 of Fig. 12 as seen from the positive direction of the Z axis, and Fig. 13(B) is a top plan view of the antenna device 4000 of Fig. 12 as seen from the negative direction of the Z axis. However, the conductor substrate 220 is omitted from Fig. 13(A) and Fig. 13(B).

[0038] 8 and 9 used in the description of the second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The following description will focus on the differences from the second embodiment.

[0039] In the second embodiment described above, the MS-RGW 350 is provided on the positive X-axis side, and the EBG region blocks the propagation of the electric field in the negative X-axis direction. However, in the fourth embodiment, the MS-RGW 350 is formed on the negative X-axis side, and the EBG region blocks the propagation of the electric field in the positive X-axis direction. In other words, the electric field propagates in the opposite direction on the back surface side and the top surface side. The electric field propagated to the MS-RGW 350 via the EBG-SIW 340A, SIW 330, and EBG-SIW 340 propagates in the negative X-axis direction (to the left in the figure), as indicated by the solid line with an arrow in the figure. In this way, even when the propagation direction of the electric field propagating through MS-RGW350A is opposite to the propagation direction of the electric field propagating through MS-RGW350, impedance matching can be achieved when power is supplied from MS-RGW350A to SIW330 and from SIW330 to MS-RGW350.

[0040] Fifth Embodiment FIG. 14 is a cross-sectional view of an antenna device 5000 as an electronic device according to a fifth embodiment of the present disclosure.

[0041] Fig. 15(A) is a rear plan view of the antenna device 5000 of Fig. 14 as seen from the positive direction of the Z axis, and Fig. 15(B) is a top plan view of the antenna device 5000 of Fig. 14 as seen from the negative direction of the Z axis. However, the conductor substrate 220 is not shown in Fig. 14(A) and Fig. 14(B).

[0042] 1 and 2 used in the description of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The following description will focus on the differences from the first embodiment.

[0043] In the first embodiment described above, the MS-RGW 350 was formed only on the positive X-axis side, and the EBG region prevented the electric field from propagating toward the negative X-axis side. That is, power was fed from one side of the MS-RGW 350. In the fifth embodiment, the MS-RGW 350 is formed on both the positive X-axis side and the negative X-axis side, and power is fed to approximately the center of the MS-RGW 350 (central feeding). "Approximately the center" refers to, for example, the center of the MS-RGW 350 or a position shifted by approximately a quarter wavelength from the center. That is, the MS-RGW 350 includes a first portion 350_1, a second portion 350_2, and a connection portion 350_3 between these first and second portions, and the MS-RGW 350 is connected to the EBG-SIW 340 at the connection portion 350_3. The electric field input from the EBG-SIW 340 to the MS-RGW 350 via the connection portion 350_3 branches into a first portion 350_1 and a second portion 350_2 and propagates through each of the first portion 350_1 and the second portion 350_2. In other words, the MS-RGW 350 branches into two. Because the impedance is low in the two branches, the widths of the SIW 330 and the EBG-SIW 340 are narrowed to adjust the impedance. In regions (not shown) on the positive side of the X-axis and the negative side of the X-axis in the MS-RGW 350, one or more slots for radio wave emission are formed in the conductor substrate 220. The electric field of the signal propagating from the MSL 310 is supplied to approximately the center of the MS-RGW 350 via the SIW 330 and EBG-SIW 340, as shown by the solid line with arrows in the figure, and is then branched into two, with the electric field propagating in both the positive and negative X-axis directions (leftward in the figure). By adopting a configuration with center feeding in this way, it is possible to further improve the impedance characteristics.

[0044] Sixth Embodiment FIG. 16 is a cross-sectional view of an antenna device 6000 as an electronic device according to a sixth embodiment of the present disclosure.

[0045] Fig. 17(A) is a rear plan view of the antenna device 6000 of Fig. 16 as seen from the positive direction of the Z axis, and Fig. 17(B) is a top plan view of the antenna device 6000 of Fig. 16 as seen from the negative direction of the Z axis. However, the conductor substrates 220 and 220A are not shown in Fig. 17(A) and Fig. 17(B).

[0046] 12 and 13 used in the description of the fourth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. The following description will focus on the differences from the fourth embodiment.

[0047] In the fourth embodiment, the MS-RGW 350 was formed only on the negative X-axis side of the upper surface of the substrate, and the EBG region prevented the electric field from propagating toward the positive X-axis side. That is, power was fed from one side of the MS-RGW 350. In the sixth embodiment, the MS-RGW 350 is formed on both the positive X-axis side and the negative X-axis side, and power is fed approximately to the center of the MS-RGW 350 (central feeding). The above-mentioned "approximate center" refers, for example, to the center of the MS-RGW 350 or a position shifted approximately 1 / 4 wavelength from the center. That is, the MS-RGW 350 includes a first portion 350_1, a second portion 350_2, and a connection portion 350_3 between these first and second portions, and the MS-RGW 350 is connected to the EBG-SIW 340 at the connection portion 350_3. The electric field input from the EBG-SIW 340 to the MS-RGW 350 via the connection portion 350_3 branches into a first portion 350_1 and a second portion 350_2 and propagates through each of the first portion 350_1 and the second portion 350_2. In this embodiment, the MS-RGW 350 has two branches. Because the impedance is low in the two branches, the widths of the SIW 330 and the EBG-SIW 340 are narrowed to adjust the impedance. In regions (not shown) on the positive side of the X-axis and the negative side of the X-axis in the MS-RGW 350, one or more slots for radio wave emission are formed in the conductor substrate 220. As shown by the solid line with arrows in the figure, the electric field propagates through the MS-RGW 350A on the back side of the substrate and is supplied to approximately the center (connection part) of the MS-RGW 350 via the EBG-SIW 340A, SIW 330, and EBG-SIW 340, and is then branched into two, propagating in both the positive and negative directions of the X-axis. By adopting a configuration in which power is fed from the center in this way, it is possible to further improve the impedance characteristics.

[0048] 18 is a block diagram of a radar device 7000 including an antenna device according to an embodiment of the present disclosure. The radar device 7000 is, for example, a millimeter wave radar device.

[0049] The radar device 7000 includes a transmitting antenna device 1000_1, a receiving antenna device 1000_2, and a transceiver unit 800. The antenna devices 1000_1 and 1000_2 are the antenna device 1000 according to the first embodiment described above. However, the antenna devices according to the second to sixth embodiments may be used as the transmitting antenna device and the receiving antenna device. Although separate transmitting and receiving antenna devices are provided, a single antenna device may be used for both transmitting and receiving. As an example, the radar device 7000 may be mounted on a mobile vehicle such as an automobile or a mobile device. However, the radar device 7000 may also be provided in a fixedly installed device or system, such as a fixedly installed monitoring device.

[0050] The transceiver 800 is a circuit that performs signal transmission and reception processing. The transceiver 800 includes the power supply circuit 230 described above. The transceiver 800 generates a transmission signal and supplies it to the antenna device 1000_1. The antenna device 1000_1 propagates radio waves within the substrate based on the supplied signal and radiates the radio waves through a slot provided in the conductor substrate 220. When power is supplied from the SIW 330 to the MS-RGW 350, the ridged EBG-SIW 340 adjusts the impedance, enabling low-loss and efficient transmission. The antenna device 1000_2 receives the reflected wave of the radiated radio waves, propagates the electric field of the received signal within the substrate, and supplies it to the transceiver 800 via the MSL 310. The transceiver 800 analyzes, for example, the state of the object from which the radio waves were reflected or the distance to the object based on the received signal.

[0051] [Application Examples] Application examples of the antenna devices 1000 to 6000 will be described below. The antenna devices 1000 to 6000 can also be applied to any of the following in-vehicle control systems, devices, methods, etc. <<1. Configuration Example of Vehicle Control System>> Fig. 19 is a block diagram showing a configuration example of a vehicle control system 11, which is an example of a mobile device control system to which the present technology is applied. The antenna device according to the above-described embodiment can be used, for example, as an antenna when the communication unit 22 performs wireless communication.

[0052] The vehicle control system 11 is provided in the vehicle 1 and performs processing related to driving assistance and automatic driving of the vehicle 1.

[0053] The vehicle control system 11 includes a vehicle control ECU (Electronic Control Unit) 21, a communication unit 22, a map information storage unit 23, a location information acquisition unit 24, an external recognition sensor 25, an in-vehicle sensor 26, a vehicle sensor 27, a memory unit 28, a driving assistance / autonomous driving control unit 29, a DMS (Driver Monitoring System) 30, an HMI (Human Machine Interface) 31, and a vehicle control unit 32.

[0054] The vehicle control ECU 21, communication unit 22, map information storage unit 23, position information acquisition unit 24, external recognition sensor 25, in-vehicle sensor 26, vehicle sensor 27, memory unit 28, cruise assist / autonomous driving control unit 29, driver monitoring system (DMS) 30, human-machine interface (HMI) 31, and vehicle control unit 32 are interconnected via a communication network 41 for mutual communication. The communication network 41 is configured, for example, by an in-vehicle communication network or bus conforming to a digital bidirectional communication standard such as a Controller Area Network (CAN), a Local Interconnect Network (LIN), a Local Area Network (LAN), FlexRay (registered trademark), or Ethernet (registered trademark). Different communication networks 41 may be used depending on the type of data being transmitted. For example, a CAN may be used for data related to vehicle control, and an Ethernet may be used for large-volume data. In addition, each part of the vehicle control system 11 may be directly connected without going through the communication network 41, using wireless communication intended for communication over relatively short distances, such as near field communication (NFC) or Bluetooth (registered trademark).

[0055] In the following description, when each unit of the vehicle control system 11 communicates via the communication network 41, the description of the communication network 41 will be omitted. For example, when the vehicle control ECU 21 and the communication unit 22 communicate via the communication network 41, it will simply be described that the vehicle control ECU 21 and the communication unit 22 communicate with each other.

[0056] The vehicle control ECU 21 is configured by various processors such as a CPU (Central Processing Unit), an MPU (Micro Processing Unit), etc. The vehicle control ECU 21 controls the entire or part of the functions of the vehicle control system 11.

[0057] The communication unit 22 communicates with various devices inside and outside the vehicle, other vehicles, servers, base stations, etc., and transmits and receives various data. At this time, the communication unit 22 can communicate using a plurality of communication methods.

[0058] The following provides an overview of communication with the outside of the vehicle that can be performed by the communication unit 22. The communication unit 22 communicates with a server (hereinafter referred to as an external server) or the like on an external network via a base station or an access point using a wireless communication method such as 5G (fifth generation mobile communication system), LTE (Long Term Evolution), or DSRC (Dedicated Short Range Communications). The external network with which the communication unit 22 communicates is, for example, the Internet, a cloud network, or a network specific to a carrier. The communication method used by the communication unit 22 with the external network is not particularly limited as long as it is a wireless communication method that enables digital two-way communication at a communication speed equal to or higher than a predetermined distance.

[0059] Furthermore, for example, the communication unit 22 can communicate with a terminal located near the vehicle using P2P (Peer to Peer) technology. The terminal located near the vehicle can be, for example, a terminal worn by a mobile object moving at a relatively slow speed, such as a pedestrian or a bicycle, a terminal installed at a fixed location in a store, or an MTC (Machine Type Communication) terminal. Furthermore, the communication unit 22 can also perform V2X communication. V2X communication refers to communication between the vehicle and others, such as vehicle-to-vehicle communication with another vehicle, vehicle-to-infrastructure communication with a roadside unit, vehicle-to-home communication, and vehicle-to-pedestrian communication with a terminal carried by a pedestrian.

[0060] The communication unit 22 can receive, for example, a program for updating software that controls the operation of the vehicle control system 11 from the outside (over the air). The communication unit 22 can also receive map information, traffic information, information about the surroundings of the vehicle 1, and the like from the outside. For example, the communication unit 22 can also transmit information about the vehicle 1 and information about the surroundings of the vehicle 1 to the outside. Information about the vehicle 1 that the communication unit 22 transmits to the outside includes, for example, data indicating the state of the vehicle 1 and the recognition result by the recognition unit 73. Furthermore, for example, the communication unit 22 performs communication corresponding to a vehicle emergency notification system such as e-call.

[0061] For example, the communication unit 22 receives electromagnetic waves transmitted by a road traffic information and communication system (VICS (Vehicle Information and Communication System) (registered trademark)) such as a radio beacon, an optical beacon, or FM multiplex broadcasting.

[0062] The following provides an overview of communication with the vehicle interior that can be performed by the communication unit 22. The communication unit 22 can communicate with each device in the vehicle using, for example, wireless communication. The communication unit 22 can communicate with each device in the vehicle using a communication method that enables bidirectional digital communication at a predetermined communication speed or higher via wireless communication, such as wireless LAN, Bluetooth, NFC, or Wireless USB (WUSB). The communication unit 22 can also communicate with each device in the vehicle using wired communication. For example, the communication unit 22 can communicate with each device in the vehicle using wired communication via a cable connected to a connection terminal (not shown). The communication unit 22 can communicate with each device in the vehicle using a communication method that enables bidirectional digital communication at a predetermined communication speed or higher via wired communication, such as Universal Serial Bus (USB), High-Definition Multimedia Interface (HDMI) (registered trademark), or Mobile High-Definition Link (MHL).

[0063] Here, the in-vehicle device refers to, for example, a device in the vehicle that is not connected to the communication network 41. Possible in-vehicle devices include, for example, a mobile device or wearable device carried by a passenger such as a driver, and an information device brought into the vehicle and temporarily installed therein.

[0064] The map information storage unit 23 stores one or both of a map acquired from an external source and a map created by the vehicle 1. For example, the map information storage unit 23 stores a three-dimensional high-precision map, a global map that is less accurate than a high-precision map and covers a wide area, and the like.

[0065] Examples of high-precision maps include dynamic maps, point cloud maps, and vector maps. A dynamic map is a map consisting of four layers of dynamic information, quasi-dynamic information, quasi-static information, and static information, and is provided to the vehicle 1 from an external server or the like. A point cloud map is a map made up of a point cloud (point group data). A vector map is a map that corresponds traffic information such as the positions of lanes and traffic lights to the point cloud map, and is adapted to an advanced driver assistance system (ADAS) or autonomous driving (AD).

[0066] The point cloud map and the vector map may be provided, for example, from an external server or the like, or may be created in the vehicle 1 based on sensing results from the camera 51, radar 52, LiDAR 53, etc. as a map for matching with a local map described later, and stored in the map information storage unit 23. Furthermore, when a high-precision map is provided from an external server or the like, map data of, for example, an area of ​​several hundred square meters relating to the planned route along which the vehicle 1 will travel is acquired from the external server or the like in order to reduce communication capacity.

[0067] The position information acquisition unit 24 receives GNSS (Global Navigation Satellite System) signals from GNSS satellites and acquires position information of the vehicle 1. The acquired position information is supplied to the driving assistance / autonomous driving control unit 29. Note that the method of the position information acquisition unit 24 is not limited to using GNSS signals, and it may acquire position information using a beacon, for example.

[0068] The external recognition sensor 25 includes various sensors used to recognize the situation outside the vehicle 1, and supplies sensor data from each sensor to each part of the vehicle control system 11. The type and number of sensors included in the external recognition sensor 25 are arbitrary.

[0069] For example, the external recognition sensor 25 includes a camera 51, a radar 52, a LiDAR (Light Detection and Ranging, Laser Imaging Detection and Ranging) 53, and an ultrasonic sensor 54. Without being limited to this, the external recognition sensor 25 may be configured to include one or more types of sensors selected from the camera 51, the radar 52, the LiDAR 53, and the ultrasonic sensor 54. The number of cameras 51, radars 52, LiDARs 53, and ultrasonic sensors 54 is not particularly limited as long as the number is a number that can be realistically installed on the vehicle 1. Furthermore, the types of sensors included in the external recognition sensor 25 are not limited to this example, and the external recognition sensor 25 may include other types of sensors. Examples of sensing areas of each sensor included in the external recognition sensor 25 will be described later.

[0070] The imaging method of the camera 51 is not particularly limited. For example, cameras of various imaging methods capable of distance measurement, such as a time-of-flight (ToF) camera, a stereo camera, a monocular camera, and an infrared camera, can be applied to the camera 51 as needed. However, the camera 51 may simply acquire an image without distance measurement.

[0071] Furthermore, for example, the external recognition sensor 25 may include an environmental sensor for detecting the environment for the vehicle 1. The environmental sensor is a sensor for detecting the environment such as weather, climate, brightness, etc., and may include various sensors such as a raindrop sensor, a fog sensor, a sunlight sensor, a snow sensor, and an illuminance sensor.

[0072] Furthermore, for example, the external recognition sensor 25 includes a microphone used to detect sounds around the vehicle 1 and the location of sound sources.

[0073] The interior sensor 26 includes various sensors for detecting information inside the vehicle, and supplies sensor data from each sensor to each unit of the vehicle control system 11. The types and number of the various sensors included in the interior sensor 26 are not particularly limited as long as they are of types and numbers that can be realistically installed in the vehicle 1.

[0074] For example, the interior sensor 26 may include one or more types of sensors selected from the group consisting of a camera, radar, a seating sensor, a steering wheel sensor, a microphone, and a biometric sensor. The camera included in the interior sensor 26 may be a camera using any of various imaging methods capable of measuring distances, such as a Time of Flight (ToF) camera, a stereo camera, a monocular camera, or an infrared camera. The camera included in the interior sensor 26 may also be a camera simply for acquiring captured images, regardless of distance measurement. The biometric sensor included in the interior sensor 26 may be provided, for example, on a seat, a steering wheel, or the like, and detect various types of biometric information of a passenger, such as a driver.

[0075] The vehicle sensor 27 includes various sensors for detecting the state of the vehicle 1, and supplies sensor data from each sensor to each unit of the vehicle control system 11. The types and number of the various sensors included in the vehicle sensor 27 are not particularly limited as long as they are of types and numbers that can be realistically installed on the vehicle 1.

[0076] For example, the vehicle sensor 27 includes a speed sensor, an acceleration sensor, an angular velocity sensor (gyro sensor), and an inertial measurement unit (IMU) that integrates these sensors. For example, the vehicle sensor 27 includes a steering angle sensor that detects the steering angle of the steering wheel, a yaw rate sensor, an accelerator sensor that detects the amount of accelerator pedal operation, and a brake sensor that detects the amount of brake pedal operation. For example, the vehicle sensor 27 includes a rotation sensor that detects the number of rotations of the engine or motor, an air pressure sensor that detects tire air pressure, a slip ratio sensor that detects tire slip ratio, and a wheel speed sensor that detects the rotation speed of the wheels. For example, the vehicle sensor 27 includes a battery sensor that detects the remaining battery charge and temperature, and an impact sensor that detects external impacts.

[0077] The storage unit 28 includes at least one of a non-volatile storage medium and a volatile storage medium, and stores data and programs. The storage unit 28 is used, for example, as an electrically erasable programmable read-only memory (EEPROM) and a random access memory (RAM). Examples of storage media that can be used include a magnetic storage device such as a hard disk drive (HDD), a semiconductor storage device, an optical storage device, and a magneto-optical storage device. The storage unit 28 stores various programs and data used by each component of the vehicle control system 11. For example, the storage unit 28 includes an event data recorder (EDR) and a data storage system for automated driving (DSSAD), and stores information about the vehicle 1 before and after an event such as an accident, and information acquired by the in-vehicle sensors 26.

[0078] The driving assistance / automated driving control unit 29 controls driving assistance and automatic driving of the vehicle 1. For example, the driving assistance / automated driving control unit 29 includes an analysis unit 61, an action planning unit 62, and an operation control unit 63.

[0079] The analysis unit 61 performs an analysis process of the vehicle 1 and the surrounding situation. The analysis unit 61 includes a self-position estimation unit 71, a sensor fusion unit 72, and a recognition unit 73.

[0080] The self-position estimation unit 71 estimates the self-position of the vehicle 1 based on the sensor data from the external recognition sensor 25 and the high-precision map stored in the map information storage unit 23. For example, the self-position estimation unit 71 generates a local map based on the sensor data from the external recognition sensor 25 and matches the local map with the high-precision map to estimate the self-position of the vehicle 1. The position of the vehicle 1 is based on, for example, the center of the rear wheel pair axle.

[0081] The local map is, for example, a three-dimensional high-precision map or an occupancy grid map created using a technique such as SLAM (Simultaneous Localization and Mapping). The three-dimensional high-precision map is, for example, the point cloud map described above. The occupancy grid map is a map in which the three-dimensional or two-dimensional space around the vehicle 1 is divided into grids of a predetermined size and the occupancy status of objects is indicated on a grid-by-grid basis. The occupancy status of objects is indicated, for example, by the presence or absence of an object and its probability of existence. The local map is also used, for example, in the detection process and recognition process of the situation outside the vehicle 1 by the recognition unit 73.

[0082] The self-position estimation unit 71 may estimate the self-position of the vehicle 1 based on the position information acquired by the position information acquisition unit 24 and the sensor data from the vehicle sensor 27 .

[0083] The sensor fusion unit 72 performs sensor fusion processing to obtain new information by combining multiple different types of sensor data (for example, image data supplied from the camera 51 and sensor data supplied from the radar 52). Methods for combining different types of sensor data include integration, fusion, and association.

[0084] The recognition unit 73 executes a detection process for detecting the situation outside the vehicle 1 and a recognition process for recognizing the situation outside the vehicle 1 .

[0085] For example, the recognition unit 73 performs detection processing and recognition processing of the situation outside the vehicle 1 based on information from the external recognition sensor 25, information from the self-position estimation unit 71, information from the sensor fusion unit 72, etc.

[0086] Specifically, for example, the recognition unit 73 performs detection processing and recognition processing of objects around the vehicle 1. The object detection processing is, for example, processing to detect the presence or absence, size, shape, position, movement, etc. of an object. The object recognition processing is, for example, processing to recognize attributes such as the type of object, or to identify a specific object. However, the detection processing and the recognition processing are not necessarily clearly separated, and may overlap.

[0087] For example, the recognition unit 73 detects objects around the vehicle 1 by performing clustering to classify a point cloud based on sensor data from the radar 52, the LiDAR 53, or the like into clusters of points. This allows the presence, size, shape, and position of objects around the vehicle 1 to be detected.

[0088] For example, the recognition unit 73 performs tracking to follow the movement of clusters of point clouds classified by clustering, thereby detecting the movement of objects around the vehicle 1. As a result, the speed and traveling direction (movement vector) of the objects around the vehicle 1 are detected.

[0089] For example, the recognition unit 73 detects or recognizes vehicles, people, bicycles, obstacles, structures, roads, traffic lights, traffic signs, road markings, etc. based on image data supplied from the camera 51. The recognition unit 73 may also recognize the types of objects around the vehicle 1 by performing recognition processing such as semantic segmentation.

[0090] For example, the recognition unit 73 can perform a recognition process of traffic rules around the vehicle 1 based on the map stored in the map information storage unit 23, the result of estimation of the self-position by the self-position estimation unit 71, and the result of recognition of objects around the vehicle 1 by the recognition unit 73. Through this process, the recognition unit 73 can recognize the positions and states of traffic lights, the contents of traffic signs and road markings, the contents of traffic regulations, and lanes that can be traveled, etc.

[0091] For example, the recognition unit 73 can perform a recognition process of the environment around the vehicle 1. The surrounding environment to be recognized by the recognition unit 73 may include weather, temperature, humidity, brightness, and road surface conditions.

[0092] The behavior planning unit 62 creates a behavior plan for the vehicle 1. For example, the behavior planning unit 62 creates the behavior plan by performing route planning and route tracking processing.

[0093] Global path planning is a process for planning a rough route from the start to the goal. This route planning also includes a process for generating a trajectory (local path planning) that allows the vehicle 1 to proceed safely and smoothly in the vicinity of the vehicle 1, taking into account the motion characteristics of the vehicle 1 on the planned route.

[0094] Path following is a process of planning an operation for safely and accurately traveling along a route planned by a route plan within a planned time. The behavior planning unit 62 can, for example, calculate a target speed and a target angular velocity of the vehicle 1 based on the results of this path following process.

[0095] The operation control unit 63 controls the operation of the vehicle 1 in order to realize the action plan created by the action planning unit 62 .

[0096] For example, the operation control unit 63 controls the steering control unit 81, the brake control unit 82, and the drive control unit 83 included in the vehicle control unit 32 described later to perform acceleration / deceleration control and direction control so that the vehicle 1 travels along the trajectory calculated by the trajectory plan. For example, the operation control unit 63 performs cooperative control with the aim of realizing ADAS functions such as collision avoidance or impact mitigation, following driving, vehicle speed maintenance driving, collision warning for the host vehicle, and lane departure warning for the host vehicle. For example, the operation control unit 63 performs cooperative control with the aim of automatic driving, which travels autonomously without driver operation.

[0097] The DMS 30 performs processes such as authenticating the driver and recognizing the driver's state based on sensor data from the in-vehicle sensors 26 and input data input to the HMI 31 (described later). Examples of the driver's state to be recognized include physical condition, level of alertness, level of concentration, level of fatigue, line of sight, level of intoxication, driving operation, and posture.

[0098] The DMS 30 may be configured to perform authentication processing for passengers other than the driver and recognition processing for the conditions of the passengers. Furthermore, for example, the DMS 30 may be configured to perform recognition processing for the conditions inside the vehicle based on sensor data from the in-vehicle sensor 26. Possible conditions inside the vehicle to be recognized include, for example, temperature, humidity, brightness, and odor.

[0099] The HMI 31 inputs various data and instructions and presents various data to the driver and the like.

[0100] The following provides an overview of data input via the HMI 31. The HMI 31 includes input devices for a person to input data. The HMI 31 generates input signals based on data, instructions, and the like input via the input devices and supplies the signals to each component of the vehicle control system 11. The HMI 31 includes, as input devices, controls such as a touch panel, buttons, switches, and levers. The HMI 31 may also include input devices that allow information to be input by voice, gestures, or other means other than manual operation. Furthermore, the HMI 31 may use, as input devices, externally connected devices such as a remote control device using infrared or radio waves, or a mobile or wearable device compatible with the operation of the vehicle control system 11.

[0101] The presentation of data by the HMI 31 will be briefly described. The HMI 31 generates visual information, auditory information, and tactile information for the occupant or the outside of the vehicle. The HMI 31 also performs output control, controlling the output, output content, output timing, output method, etc. of each piece of generated information. The HMI 31 generates and outputs, as visual information, information indicated by images or lights, such as an operation screen, a status display of the vehicle 1, a warning display, and a monitor image showing the situation around the vehicle 1. The HMI 31 also generates and outputs, as auditory information, information indicated by sounds, such as voice guidance, warning sounds, and warning messages. The HMI 31 also generates and outputs, as tactile information, information imparted to the occupant's sense of touch by, for example, force, vibration, movement, etc.

[0102] Examples of the output device to which the HMI 31 outputs visual information include a display device that presents visual information by displaying an image on its own or a projector device that presents visual information by projecting an image. The display device may be a device that displays visual information within the field of view of the occupant, such as a head-up display, a transmissive display, or a wearable device with an augmented reality (AR) function, in addition to a display device having a normal display. The HMI 31 may also use display devices included in a navigation system, an instrument panel, a camera monitoring system (CMS), an electronic mirror, a lamp, or the like provided in the vehicle 1 as output devices that output visual information.

[0103] As an output device for the HMI 31 to output auditory information, for example, an audio speaker, a headphone, or an earphone can be applied.

[0104] For example, a haptic element using haptic technology can be applied as an output device for outputting tactile information from the HMI 31. The haptic element is provided on a part of the vehicle 1 that an occupant comes into contact with, such as a steering wheel or a seat.

[0105] The vehicle control unit 32 controls each part of the vehicle 1. The vehicle control unit 32 includes a steering control unit 81, a brake control unit 82, a drive control unit 83, a body system control unit 84, a light control unit 85, and a horn control unit 86.

[0106] The steering control unit 81 detects and controls the state of the steering system of the vehicle 1. The steering system includes, for example, a steering mechanism including a steering wheel, an electric power steering, etc. The steering control unit 81 includes, for example, a steering ECU that controls the steering system, an actuator that drives the steering system, etc.

[0107] The brake control unit 82 detects and controls the state of the brake system of the vehicle 1. The brake system includes, for example, a brake mechanism including a brake pedal, an antilock brake system (ABS), a regenerative brake mechanism, etc. The brake control unit 82 includes, for example, a brake ECU that controls the brake system, an actuator that drives the brake system, etc.

[0108] The drive control unit 83 detects and controls the state of the drive system of the vehicle 1. The drive system includes, for example, an accelerator pedal, a drive force generating device for generating drive force such as an internal combustion engine or a drive motor, and a drive force transmission mechanism for transmitting the drive force to the wheels. The drive control unit 83 includes, for example, a drive ECU for controlling the drive system, and an actuator for driving the drive system.

[0109] The body system control unit 84 detects and controls the states of the body system systems of the vehicle 1. The body system systems include, for example, a keyless entry system, a smart key system, a power window device, a power seat, an air conditioning system, an airbag, a seat belt, a shift lever, etc. The body system control unit 84 includes, for example, a body system ECU that controls the body system systems, an actuator that drives the body system systems, etc.

[0110] The light control unit 85 detects and controls the states of various lights of the vehicle 1. Examples of lights to be controlled include headlights, backlights, fog lights, turn signals, brake lights, projections, and bumper displays. The light control unit 85 includes a light ECU that controls the lights, an actuator that drives the lights, and the like.

[0111] The horn control unit 86 detects and controls the state of the car horn of the vehicle 1. The horn control unit 86 includes, for example, a horn ECU that controls the car horn, an actuator that drives the car horn, and the like.

[0112] Fig. 20 is a diagram showing an example of a sensing area by the camera 51, radar 52, LiDAR 53, ultrasonic sensor 54, etc. of the external recognition sensor 25 in Fig. 19. Note that Fig. 20 schematically shows the vehicle 1 as viewed from above, with the left end side being the front end (front) side of the vehicle 1 and the right end side being the rear end (rear) side of the vehicle 1.

[0113] Sensing area 101F and sensing area 101B show examples of sensing areas of the ultrasonic sensors 54. Sensing area 101F covers the periphery of the front end of the vehicle 1 with multiple ultrasonic sensors 54. Sensing area 101B covers the periphery of the rear end of the vehicle 1 with multiple ultrasonic sensors 54.

[0114] The sensing results in the sensing area 101F and the sensing area 101B are used, for example, for parking assistance for the vehicle 1.

[0115] Sensing area 102F to sensing area 102B show examples of sensing areas of a short-range or medium-range radar 52. Sensing area 102F covers a position farther in front of the vehicle 1 than sensing area 101F. Sensing area 102B covers a position farther behind the vehicle 1 than sensing area 101B. Sensing area 102L covers the periphery behind the left side of the vehicle 1. Sensing area 102R covers the periphery behind the right side of the vehicle 1.

[0116] The sensing results in sensing area 102F are used, for example, to detect vehicles, pedestrians, and the like that are present in front of the vehicle 1. The sensing results in sensing area 102B are used, for example, for a collision prevention function behind the vehicle 1. The sensing results in sensing area 102L and sensing area 102R are used, for example, to detect objects in blind spots on the sides of the vehicle 1.

[0117] Sensing areas 103F to 103B show examples of sensing areas sensed by camera 51. Sensing area 103F covers a position farther in front of vehicle 1 than sensing area 102F. Sensing area 103B covers a position farther in the rear of vehicle 1 than sensing area 102B. Sensing area 103L covers the periphery of the left side of vehicle 1. Sensing area 103R covers the periphery of the right side of vehicle 1.

[0118] The sensing results in the sensing area 103F can be used for, for example, recognition of traffic lights and traffic signs, lane departure prevention assistance systems, and automatic headlight control systems. The sensing results in the sensing area 103B can be used for, for example, parking assistance and surround view systems. The sensing results in the sensing areas 103L and 103R can be used for, for example, surround view systems.

[0119] Sensing area 104 shows an example of the sensing area of ​​LiDAR 53. Sensing area 104 covers a position farther ahead of vehicle 1 than sensing area 103F. On the other hand, sensing area 104 has a narrower range in the left-right direction than sensing area 103F.

[0120] The sensing results in the sensing area 104 are used to detect objects such as surrounding vehicles, for example.

[0121] A sensing area 105 shows an example of the sensing area of ​​the long-range radar 52. The sensing area 105 covers a position further ahead of the vehicle 1 than the sensing area 104. On the other hand, the sensing area 105 has a narrower range in the left-right direction than the sensing area 104.

[0122] The sensing results in the sensing area 105 are used for, for example, adaptive cruise control (ACC), emergency braking, collision avoidance, and the like.

[0123] The sensing areas of the cameras 51, radars 52, LiDARs 53, and ultrasonic sensors 54 included in the external recognition sensor 25 may have various configurations other than those shown in FIG. 20 . Specifically, the ultrasonic sensors 54 may also sense the sides of the vehicle 1, and the LiDAR 53 may sense the rear of the vehicle 1. The installation positions of the sensors are not limited to the above-described examples. The number of each sensor may be one or more.

[0124] The present disclosure can be applied to the radar 52. Note that the present invention is not limited to the above-described embodiment as it is, and in the implementation stage, the components can be modified and embodied without departing from the gist of the invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above-described embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, components from different embodiments may be appropriately combined.

[0125] Furthermore, the effects of the present disclosure described in this specification are merely examples, and other effects may also be present.

[0126] The present disclosure can also take the following configurations: [Item 1] An electronic device comprising: a dielectric substrate; and a first conductor substrate arranged opposite the dielectric substrate, wherein the dielectric substrate has: a first intra-dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements and electromagnetically connected to the first intra-dielectric waveguide, wherein a first microstrip ridge gap waveguide electromagnetically connected to the second intra-dielectric waveguide is formed between the dielectric substrate and the first conductor substrate. [Item 2] The electronic device according to item 1, wherein the dielectric substrate has a transmission line that propagates an electric field based on a signal generated in a power supply circuit, and the transmission line is electromagnetically connected to the first intra-dielectric waveguide on a side of the first intra-dielectric waveguide opposite to the side to which the second intra-dielectric waveguide is connected. [Item 3] The electronic device according to item 2, wherein the transmission line has a slot and is electromagnetically connected to the first intra-dielectric waveguide at the slot, and a connection portion between the first intra-dielectric waveguide and the second intra-dielectric waveguide does not overlap the slot in a direction parallel to the dielectric substrate. [Item 4] The dielectric substrate further has a third intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements on the side of the first intra-dielectric waveguide opposite to the side to which the second intra-dielectric waveguide is connected and electromagnetically connected to the first intra-dielectric waveguide, and the electronic device also includes a second conductive substrate arranged opposite to the side of the dielectric substrate on which the first conductive substrate is arranged so as to face the side, and a second microstrip ridge gap waveguide electromagnetically connected to the third intra-dielectric waveguide is formed between the dielectric substrate and the second conductive substrate.[Item 5] The electronic device according to any one of Items 1 to 4, wherein the first microstrip ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip ridge gap waveguide is connected to the second intra-dielectric waveguide at the connection portion, and an electric field input to the first microstrip ridge gap waveguide from the second intra-dielectric waveguide via the connection portion branches into the first portion and the second portion and propagates through each of the first portion and the second portion. [Item 6] The electronic device according to Item 4, wherein the first microstrip ridge gap waveguide and the second microstrip ridge gap waveguide are arranged such that the propagation direction of the electric field in the first microstrip ridge gap waveguide is opposite to the propagation direction of the electric field in the second microstrip ridge gap waveguide in a direction parallel to the dielectric substrate during transmission or reception. [Item 7] The electronic device according to Item 4, wherein the first microstrip ridge gap waveguide and the second microstrip ridge gap waveguide are arranged so that, during transmission or reception, the direction of propagation of the electric field in the first microstrip ridge gap waveguide is the same as the direction of propagation of the electric field in the second microstrip ridge gap waveguide in a direction parallel to the dielectric substrate. [Item 8] The electronic device according to Item 2 or 3, wherein the transmission line and the first microstrip ridge gap waveguide are arranged so that, during transmission or reception, the direction of propagation of the electric field in the transmission line is opposite to the direction of propagation of the electric field in the first microstrip ridge gap waveguide in a direction parallel to the dielectric substrate. [Item 9] The electronic device according to Item 2 or 3, wherein the transmission line and the first microstrip ridge gap waveguide are arranged so that, during transmission or reception, the direction of propagation of the electric field in the transmission line is the same as the direction of propagation of the electric field in the first microstrip ridge gap waveguide in a direction parallel to the dielectric substrate.[Item 10] The electronic device according to Item 2 or 3, wherein the first microstrip ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip ridge gap waveguide is connected to the second intra-dielectric waveguide at the connection portion, and an electric field input to the first microstrip ridge gap waveguide from the second intra-dielectric waveguide via the connection portion branches into the first portion and the second portion and propagates through each of the first portion and the second portion. [Item 11] The electronic device according to any one of Items 2, 3, 8, and 9, wherein the transmission line is a microstrip line. [Item 12] The electronic device according to any one of Items 1 to 11, wherein the first conductor substrate is an antenna substrate including a slot that radiates radio waves based on the electric field propagated by the first microstrip ridge gap waveguide. [Item 13] A radar device comprising: an antenna device; and a transceiver unit that transmits or receives signals using the antenna device, wherein the antenna device comprises: a dielectric substrate; and a first conductor substrate arranged opposite to the dielectric substrate, wherein the dielectric substrate has: a first intra-dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements and electromagnetically connected to the first intra-dielectric waveguide, wherein a first microstrip ridge gap waveguide that is electromagnetically connected to the second intra-dielectric waveguide is formed between the dielectric substrate and the first conductor substrate, and the first conductor substrate is an antenna substrate including a slot that radiates radio waves based on an electric field propagated by the first microstrip ridge gap waveguide.

[0127] REFERENCE SIGNS LIST 1 Vehicle 11 Vehicle system 21 Vehicle control ECU (Electronic Control Unit) 22 Communication unit 23 Map information storage unit 24 Position information acquisition unit 25 External recognition sensor 26 In-vehicle sensor 27 Vehicle sensor 28 Memory unit 29 Cruise assistance / autonomous driving control unit 30 Driver monitoring system (DMS) 31 Human-machine interface (HMI) 32 Vehicle control unit 41 Communication network 50 Ground conductor 51 Camera 52 Radar 53 LiDAR 54 Ultrasonic sensor 60 Conductor piece 61 Analysis unit 62 Action planning unit 63 Operation control unit 71 Self-position estimation unit 72 Sensor fusion unit 73 Recognition unit 81 Steering control unit 82 Brake control unit 83 Drive control unit 70 Conductor piece 90 Ground conductor 91 Conductor piece 101B Sensing area 101F Sensing area 102B Sensing area 102F Sensing area 102L Sensing area 102R Sensing area 103B Sensing area 103F Sensing area 103L Sensing area 103R Sensing area 104 Sensing area 105 Sensing area 110 Via 130 Via 140 Via 140A Via 140B Via 140C Via 190 Slot (opening) 190 Slot 191 Slot 192 Slot 210 Dielectric substrate 220 Conductive substrate 220A Conductive substrate 230 Power supply circuit 240 Air layer 240A Air layer 310 Transmission line 320 EBG element 321 Via 330 EBG-SIW 340 EBG-SIW 340A EBG-SIW 350 MS-RGW 350A MS-RGW 360 Probe 370 EBG area 800 Transmitter / receiver 900 Transmitter / receiver 1000 Antenna device 1000_1 Antenna device 1000_2 Antenna device 2000 Antenna device 3000 Antenna device 4000 Antenna device 5000 Antenna device 6000 Antenna device 7000 Radar device OP1 Opening OP2 Opening

Claims

1. An electronic device comprising: a dielectric substrate; and a first conductive substrate arranged opposite to the dielectric substrate, wherein the dielectric substrate has: a first intra-dielectric waveguide formed by first and second ground conductors and a plurality of vias; and a second intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements and electromagnetically connected to the first intra-dielectric waveguide, wherein a first microstrip ridge gap waveguide is formed between the dielectric substrate and the first conductive substrate and electromagnetically connected to the second intra-dielectric waveguide.

2. The electronic device according to claim 1, wherein the dielectric substrate has a transmission line that propagates an electric field based on a signal generated in a power supply circuit, and the transmission line is electromagnetically connected to the first intra-dielectric waveguide on a side of the first intra-dielectric waveguide opposite to the side to which the second intra-dielectric waveguide is connected.

3. The electronic device according to claim 2, wherein the transmission line has a slot, and is electromagnetically connected to the first in-dielectric waveguide at the slot, and in a direction parallel to the dielectric substrate, a connection portion between the first in-dielectric waveguide and the second in-dielectric waveguide does not overlap with the slot.

4. The electronic device according to claim 1, wherein the dielectric substrate further has a third intra-dielectric waveguide formed by a plurality of electromagnetic bandgap elements on the side of the first intra-dielectric waveguide opposite to the side to which the second intra-dielectric waveguide is connected and electromagnetically connected to the first intra-dielectric waveguide, and the electronic device further comprises a second conductor substrate arranged opposite to the side of the dielectric substrate opposite to the side to which the first conductor substrate is arranged, and a second microstrip ridge gap waveguide electromagnetically connected to the third intra-dielectric waveguide is formed between the dielectric substrate and the second conductor substrate.

5. The electronic device of claim 1, wherein the first microstrip ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip ridge gap waveguide is connected to the second intra-dielectric waveguide at the connection portion, and an electric field input to the first microstrip ridge gap waveguide from the second intra-dielectric waveguide via the connection portion branches into the first portion and the second portion and propagates within each of the first portion and the second portion.

6. The electronic device of claim 4, wherein the first microstrip ridge gap waveguide and the second microstrip ridge gap waveguide are arranged such that, during transmission or reception, the propagation direction of the electric field in the first microstrip ridge gap waveguide is opposite to the propagation direction of the electric field in the second microstrip ridge gap waveguide in a direction parallel to the dielectric substrate.

7. The electronic device of claim 4, wherein the first microstrip ridge gap waveguide and the second microstrip ridge gap waveguide are arranged such that, during transmission or reception, the propagation direction of the electric field in the first microstrip ridge gap waveguide is the same as the propagation direction of the electric field in the second microstrip ridge gap waveguide in a direction parallel to the dielectric substrate.

8. The electronic device of claim 2, wherein the transmission line and the first microstrip ridge gap waveguide are arranged such that, during transmission or reception, the propagation direction of the electric field in the transmission line is opposite to the propagation direction of the electric field in the first microstrip ridge gap waveguide in a direction parallel to the dielectric substrate.

9. The electronic device of claim 2, wherein the transmission line and the first microstrip ridge gap waveguide are arranged such that, during transmission or reception, the propagation direction of the electric field in the transmission line is the same as the propagation direction of the electric field in the first microstrip ridge gap waveguide in a direction parallel to the dielectric substrate.

10. The electronic device of claim 2, wherein the first microstrip ridge gap waveguide includes a first portion, a second portion, and a connection portion between the first portion and the second portion, the first microstrip ridge gap waveguide is connected to the second intra-dielectric waveguide at the connection portion, and an electric field input to the first microstrip ridge gap waveguide from the second intra-dielectric waveguide via the connection portion branches into the first portion and the second portion and propagates within each of the first portion and the second portion.

11. The electronic device according to claim 2, wherein the transmission line is a microstrip line.

12. The electronic device according to claim 1, wherein the first conductive substrate is an antenna substrate including a slot for emitting radio waves based on the electric field propagated by the first microstrip ridge gap waveguide.

13. A radar device comprising an antenna device and a transceiver unit that transmits or receives signals using the antenna device, wherein the antenna device comprises: a dielectric substrate; and a first conductor substrate arranged opposite the dielectric substrate, wherein the dielectric substrate has: a first intra-dielectric waveguide formed of first and second ground conductors and a plurality of vias; and a second intra-dielectric waveguide formed of a plurality of electromagnetic bandgap elements and electromagnetically connected to the first intra-dielectric waveguide, wherein a first microstrip ridge gap waveguide is formed between the dielectric substrate and the first conductor substrate and electromagnetically connected to the second intra-dielectric waveguide, and wherein the first conductor substrate is an antenna substrate including a slot that radiates radio waves based on an electric field propagated by the first microstrip ridge gap waveguide.

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