Heat dissipation structure and electronic device comprising same

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge configured to rotatably couple the first housing and the second housing; a flexible display formed to be variable in response to a relative motion of the second housing with respect to the first housing; and a heat dissipation structure at least partially disposed between the flexible display and the hinge. The heat dissipation structure may include: a heat dissipation layer stacked on the flexible display and including a first heat dissipation layer positioned in the first housing and a second heat dissipation layer positioned in the second housing; and a heat conduction layer stacked on at least a portion of the heat dissipation layer and configured to thermally connect the first heat dissipation layer and the second heat dissipation layer. Heat generated in the first housing may be sequentially transferred to the second housing through the first heat dissipation layer, the heat conductive layer, and the second heat dissipation layer.

Description

Heat dissipation structure and electronic device including the same

[0001] One embodiment disclosed in this document relates to a heat dissipation structure and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

[0003] An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with multiple functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, calendar management, or electronic wallets are being integrated into a single electronic device. These electronic devices are becoming miniaturized for convenient portability. As the carrying and use of miniaturized or thin mobile devices, such as smartphones, becomes more common, user demands for the external design of these devices may become more sophisticated and diverse.

[0004] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a hinge configured to rotatably couple the first housing and the second housing, a flexible display formed to vary in response to relative movement of the second housing with respect to the first housing, and a heat dissipation structure at least partly disposed between the flexible display and the hinge.

[0005] The heat dissipation structure may include a heat dissipation layer laminated with the flexible display, the heat dissipation layer including a first heat dissipation layer positioned within the first housing and a second heat dissipation layer positioned within the second housing, and a heat conductive layer laminated with at least a portion of the heat dissipation layer and configured to thermally connect the first heat dissipation layer and the second heat dissipation layer.

[0006] Heat generated in the first housing may be configured to be sequentially transferred to the second housing through the first heat dissipation layer, the heat conductive layer, and the second heat dissipation layer.

[0007] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a hinge configured to rotatably couple the first housing and the second housing, a flexible display formed to vary in response to relative movement of the second housing with respect to the first housing, and a heat dissipation structure at least partly disposed between the flexible display and the hinge.

[0008] The heat dissipation structure may include a heat dissipation layer laminated with the flexible display, the heat dissipation layer including a first heat dissipation layer positioned within the first housing, a second heat dissipation layer positioned within the second housing, a heat conductive layer laminated with at least a portion of the heat dissipation layer and configured to thermally connect the first heat dissipation layer and the second heat dissipation layer, and an anti-sticking layer disposed between the heat conductive layer and the heat dissipation layer.

[0009] Heat generated in the first housing may be configured to be sequentially transferred to the second housing through the first heat dissipation layer, the heat conductive layer, and the second heat dissipation layer.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0011] FIG. 2 is a front view, a side view, and a back view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 3 is a front view, a side view, and a rear view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0013] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 5 is a diagram schematically showing a flexible display and a heat dissipation structure according to one embodiment disclosed in this document, and showing a heat movement path.

[0015] FIGS. 6 and 7 are cross-sectional views taken along line A-A' of a display and a part of a heat dissipation structure of FIG. 5 according to one embodiment disclosed in this document.

[0016] FIGS. 8A and 8B are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure including the anti-stick layer of FIG. 5 according to one embodiment disclosed in the present document.

[0017] FIGS. 9A and 9B are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure including a surface protection layer of FIG. 5 according to one embodiment disclosed in the present document.

[0018] FIG. 10 is a cross-sectional view taken along line A-A' of a portion of the heat dissipation structure of FIG. 5 when the electronic device according to one embodiment disclosed in this document is in an unfolded state.

[0019] FIG. 11 is a cross-sectional view taken along line A-A' of a portion of the heat dissipation structure of FIG. 5 when the electronic device according to one embodiment disclosed in this document is in a folded state.

[0020] FIG. 12 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including an adhesive layer according to one embodiment disclosed in this document.

[0021] FIG. 13 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer according to one embodiment disclosed in this document.

[0022] FIG. 14 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer having steps formed therein according to one embodiment disclosed in the present document. FIG. 15 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer according to one embodiment disclosed in the present document.

[0023] FIGS. 16 and 17 are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure further including a protective film according to one embodiment disclosed in the present document.

[0024] FIG. 18 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure further including a second anti-stick layer according to one embodiment disclosed in the present document.

[0025] FIG. 19 is a cross-sectional view taken along line A-A' of a part of a detachable heat dissipation structure according to one embodiment disclosed in this document.

[0026] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0028] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0029] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0030] The memory (130) can store data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] An electronic device according to one embodiment disclosed in this document may be a device of one type. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0050] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0051] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] Embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0053] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0054] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0055] FIG. 2 is a front view, a side view, and a rear view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 is a front view, a side view, and a rear view of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

[0056] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a first housing (210), a second housing (220), a flexible or foldable display (230) (hereinafter, simply “display (230)”) disposed in a space provided by the first housing (210) and the second housing (220) (e.g., the display module (160) of FIG. 1), and a hinge cover (260).

[0057] According to one embodiment, a surface on which a display (230) is disposed may be defined as a front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate including coating layers) at least partially transparent. In addition, a surface opposite to the front surface may be defined as a rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a substantially opaque rear plate (hereinafter referred to as a “rear cover”). The rear cover may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (101). The side surface may be formed by a side bezel structure (or “side member”) that is coupled to the front plate and the rear cover and includes a metal and / or a polymer. In some embodiments, the rear cover and side bezel structures may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0058] The electronic device (101) may include at least one of a display (230), an audio module (241, 243, 245), a sensor module (255), a camera module (253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

[0059] According to one embodiment, the display (230) may be a display in which at least a portion of the display may be transformed into a flat or curved surface. According to one embodiment, the display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) illustrated in FIG. 2) with respect to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) illustrated in FIG. 2). However, the division of the areas of the display (230) illustrated in FIG. 2 is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (231c) or a folding axis (A), but in other embodiments, the display (230) may be divided into regions by another folding region (231c) or another folding axis (e.g., a folding axis perpendicular to the folding axis (A)).

[0060] According to one embodiment, the audio module (241, 243, 245) may include a microphone hole (241) and a speaker hole (243, 245). The microphone hole (241) may have a microphone disposed therein for acquiring external sound, and in some embodiments, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (243, 245) may include an external speaker hole (243) and a receiver hole (245) for calls. In some embodiments, the speaker hole (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without the speaker hole (243, 245) (e.g., a piezo speaker). The positions and numbers of the microphone hole (241) and the speaker holes (243, 245) may vary depending on the embodiment.

[0061] According to one embodiment, the electronic device (101) may include a first camera device (251) disposed on a first surface (210a) of the first housing (210), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

[0062] According to one embodiment, the sensor module (255) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawing, the electronic device (101) may additionally or alternatively include another sensor module (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include, as a sensor module, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, for example.

[0063] In one embodiment, the key input devices (211, 212, 213) may be disposed on a side of a foldable housing (e.g., the first housing (210) or the second housing (220)). In another embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (211, 212, 213), and the key input devices that are not included may be implemented in other forms, such as soft keys, on the display (230). In some embodiments, the key input devices may be configured such that key input is implemented by a sensor module (e.g., a gesture sensor).

[0064] According to one embodiment, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, or, additionally or alternatively, a connector for transmitting and receiving audio signals to and from an external electronic device.

[0065] According to one embodiment, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first rear cover (240), a second rear cover (250), and a hinge module (e.g., a hinge structure (340) of FIG. 4 described below). The foldable housing of the electronic device (101) is not limited to the shape and combination illustrated in FIG. 2, and may be implemented by combining and / or combining other shapes or parts. For example, in another embodiment, the first housing (210) and the first rear cover (240) may be formed integrally, and the second housing (220) and the second rear cover (250) may be formed integrally. According to one embodiment disclosed in the present document, the term 'housing' may mean a combination and / or combined configuration of other parts that are not mentioned. For example, the first area (213a) of the display (230) may be described as forming one side of the first housing (210), and in another embodiment, the first area (213a) of the display (230) may be described as being arranged or attached to one side of the first housing (210).

[0066] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (340) of FIG. 4 described below) and may include a first side (210a) facing a first direction and a second side (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge structure (e.g., the hinge structure (340) of FIG. 4 described below) and includes a third side (220a) facing a third direction and a fourth side (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot with respect to the first housing (210) about the hinge structure (or folding axis (A)).

[0067] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides (or upper / lower sides) with respect to the folding axis (A) as the center, and may have a shape that is overall symmetrical with respect to the folding axis (A). The angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device (101) is in an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state. According to one embodiment, the first housing (210), unlike the second housing (220), may additionally include one sensor, but may have a shape that is symmetrical with respect to the other areas.

[0068] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may serve as a ground plane or a radiating conductor of the electronic device (101), and when served as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., a printed circuit board (330) of FIG. 4).

[0069] According to one embodiment, the first rear cover (240) is disposed on one side (e.g., the upper side in FIG. 2) of the folding axis (A) on the rear of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210) (and / or a side bezel structure). For example, the second rear cover (250) is disposed on the other side (e.g., the lower side in FIG. 2) of the folding axis (A) on the rear of the electronic device (101) and may have its periphery wrapped by the second housing (220) (and / or a side bezel structure).

[0070] According to one embodiment, the first rear cover (240) and the second rear cover (250) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes, and in another embodiment, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of the same shape. In yet another embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

[0071] According to one embodiment, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which components of the electronic device (101) (e.g., the printed circuit board (330) of FIG. 4 or the batteries (333, 334)) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the sub-display (239) may be visually exposed through the first rear cover (240). In another embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In one embodiment, the components or sensors may include a proximity sensor, a rear camera, and / or a flash. In addition, although not separately illustrated in the drawings, one or more components or sensors may be visually exposed through the second rear cover (250).

[0072] According to one embodiment, a front camera (251) exposed on the front side of the electronic device (101) through one or more openings or a rear camera (253) exposed through the first rear cover (240) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0073] According to one embodiment, the electronic device (101) can be configured to have a folded display state or an unfolded display state. For example, the first housing (210) and the second housing (220) can rotate relative to each other between a folded state facing each other and a state unfolded at a specified angle from the folded state (e.g., the state illustrated in FIG. 2, the terminal unfolded state).

[0074] According to one embodiment, the electronic device (101) can be implemented in two ways: 'in-folding', in which the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding', in which the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in a folded state in an in-folding manner, the first region (231a) and the second region (231b) can be substantially concealed, and in a fully unfolded state, the first region (231a) and the second region (231b) can be arranged to face substantially the same direction. For another example, in a folded state in an out-folding manner, the first region (231a) and the second region (231b) may be arranged facing in opposite directions and exposed to the outside, and in a fully unfolded state, the first region (231a) and the second region (231b) may be arranged facing in substantially the same direction.

[0075] According to one embodiment, the display (230) may include a display panel (not shown) and a window member (not shown), and may be formed of a flexible material. Although not separately illustrated, it will be readily understood by those skilled in the art that the display (230) or the display panel includes a layer(s), such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or wiring layer, and / or an adhesive layer(s) bonding adjacent different layers. When the display (230) (e.g., the folding area (231c)) is deformed into a flat shape and a curved shape, a relative displacement may occur between the layers forming the display (230). The relative displacement due to the deformation of the display (203) may increase as the point is further from the folding axis (A) and / or as the thickness of the display (230) increases.

[0076] In one embodiment, the window member, for example, a thin film plate, may function as a protective film for protecting the display panel. As a protective film, the thin film plate may be made of a material that protects the display panel from external impact, is scratch-resistant, and reduces wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a transparent polyimide film (CPI) or an ultra-thin glass (UTG).

[0077] Referring to FIG. 3, the hinge cover (260) may be configured to be positioned between the first housing (210) and the second housing (220) so as to cover internal components. According to one embodiment, the hinge cover (260) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside depending on the state of the electronic device (101) (flat state, intermediate state, or folded state).

[0078] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (260) may be substantially not exposed by being covered by the first housing (210) and the second housing (220). As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (260) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (260) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than in the fully folded state. In one embodiment, the hinge cover (260) may include a curved surface.

[0079] According to one embodiment, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (219, 229)(s) disposed on at least a portion of an edge of the display (230) on the front surface (e.g., the first side (210a) or the third side (220a)). The protective member (206) or the decorative cover (219, 229) may prevent at least a portion of an edge of the display (230) from contacting a mechanical structure (e.g., the first housing (210) or the second housing (220)) and may provide a decorative effect on the exterior of the electronic device (101).

[0080] FIG. 4 is an exploded perspective view of an electronic device (101) (e.g., the electronic device (101) of FIG. 2) according to one embodiment of the present disclosure.

[0081] Referring to FIG. 4, in one embodiment, the electronic device (101) may include a display (310) (e.g., display (230) of FIG. 2), a foldable housing (e.g., first housing (321) and second housing (322), first housing (210) and second housing (220) of FIG. 2), a printed circuit board (330), a hinge structure (340), a flexible connecting member (350), a hinge cover (360) (e.g., hinge cover (260) of FIG. 3), an antenna module (370), and a rear cover (380). In one embodiment, the electronic device (101) may include at least one protective member (306) and / or at least one decorative cover (319, 329), wherein the protective member (306) and / or the decorative cover (319, 329) may be positioned adjacent to at least a portion of a periphery of the display (310) (e.g., the display (230) of FIG. 2).

[0082] In one embodiment, the display (310) may be exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the display (310) may be formed to be substantially the same as the outer shape of the front surface of the electronic device (101).

[0083] In FIG. 4, 'y' may mean the longitudinal direction of the electronic device (101) in the second state. In addition, in one embodiment of the present invention, '+y' may mean the upward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101), and '-y' may mean the downward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101).

[0084] According to one embodiment, the foldable housing of the electronic device (101) may include a first housing (321) and a second housing (322). According to one embodiment, the first housing (321) may include a first surface (321a) and a second surface (321b) facing in an opposite direction to the first surface (321a), and the second housing (322) may include a third surface (322a) and a fourth surface (322b) facing in an opposite direction to the third surface (322a). The electronic device (101) or the foldable housing (321, 322) may additionally or alternatively include a bracket assembly (325). The bracket assembly (325) may include a first bracket assembly (323) disposed in the first housing (321) and a second bracket assembly (324) disposed in the second housing (322). At least a portion of the bracket assembly (325), for example, at least a portion of the first bracket assembly (323) and at least a portion of the second bracket assembly (324), may serve as a plate to support the hinge structure (340).

[0085] According to one embodiment, a printed circuit board (330) may have an electrical component disposed thereon. For example, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be mounted on the printed circuit board (330). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0086] According to one embodiment, the printed circuit board (330) may include a first printed circuit board (331) disposed on the side of the first bracket assembly (323) and a second printed circuit board (332) disposed on the side of the second bracket assembly (324). The first printed circuit board (331) and the second printed circuit board (332) may be disposed inside a space formed by the foldable housing (321, 322), the bracket assembly (325), the first rear cover (381) and / or the second rear cover (382). Components for implementing a function of the electronic device (101) may be separately disposed on the first printed circuit board (331) and the second printed circuit board (332). For example, a processor may be disposed on the first printed circuit board (331), and an audio interface may be disposed on the second printed circuit board (332).

[0087] According to one embodiment, a battery (333, 334) for supplying power to the electronic device (101) may be disposed adjacent to the printed circuit board (330). At least a portion of the battery (333, 334) may be disposed, for example, substantially coplanar with the printed circuit board (330). According to one embodiment, a first battery (333) may be disposed adjacent to a first printed circuit board (331), and a second battery (334) may be disposed adjacent to a second printed circuit board (332). The battery (333, 334) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (333, 334) may be integrally placed inside the foldable housing (321, 322), or may be detachably placed in the foldable housing (321, 322).

[0088] According to one embodiment, the hinge structure (340) may be configured to provide a folding axis (e.g., the folding axis (A) of FIG. 2) and rotatably connect or couple the foldable housings (321, 322) and / or the bracket assembly (325). The hinge structure (340) may include a first hinge structure (341) disposed on the first housing (321) side and a second hinge structure (342) disposed on the second housing (322) side. The hinge structure (340) may be disposed between the first housing (321) and the second housing (322). According to one embodiment, the hinge structure (340) may be substantially integral with at least a portion of the first bracket assembly (323) and at least a portion of the second bracket assembly (324).

[0089] According to one embodiment, a 'housing structure' may refer to a foldable housing (321, 322) and at least one component disposed inside the foldable housing (321, 322) assembled and / or coupled. The housing structure may include a first housing structure and a second housing structure. For example, an assembled configuration including at least one of a first housing (321), a first bracket assembly (323) disposed inside the first housing (321), a first printed circuit board (331), and a first battery (333) may be referred to as a 'first housing structure'. In another example, an assembled configuration including at least one of a second housing (322), a second bracket assembly (324) disposed inside the second housing (322), a second printed circuit board (332), and a second battery (334) may be referred to as a 'second housing structure'. However, it should be noted that the 'first housing structure and second housing structure' here are not limited to the addition of the above-described components, and may additionally include or omit other components.

[0090] According to one embodiment, the flexible connecting member (350) may include a flexible printed circuit (FPCB). The flexible connecting member (350) may connect electrical components disposed on a first printed circuit board (331) and a second printed circuit board (332). To this end, the flexible connecting member (350) may be disposed to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (350) may be disposed to cross at least a portion of the hinge structure (340). According to one embodiment, the flexible connecting member (350) may be configured to connect the first printed circuit board (331) and the second printed circuit board (332) across the hinge structure (340), for example, along a direction parallel to the y-axis of FIG. 4. For another example, the flexible connecting member (350) may be extended or arranged through an opening (341h, 342h) formed in the hinge structure (340). At this time, a part of the flexible connecting member (350) may be arranged to span one side (e.g., the upper side) of the first hinge structure (341), and another part of the flexible connecting member (350) may be arranged to span one side (e.g., the upper side) of the second hinge structure (342). In addition, another part of the flexible connecting member (350) may be arranged on the other side (e.g., the lower side) of the first hinge structure (341) and the second hinge structure (342). A space (hereinafter referred to as a “wiring space”) surrounded by at least a portion of the first hinge structure (341), at least a portion of the second hinge structure (342), and at least a portion of the hinge cover (360) may be formed adjacent to the first hinge structure (341) and the second hinge structure (342). According to one embodiment, at least a portion of the flexible connecting member (350) may be disposed within the wiring space.

[0091] According to one embodiment, the hinge cover (360) may be configured to accommodate or enclose at least a portion of the hinge structure (340) or the wiring space. In some embodiments, the hinge cover (360) may form a wiring space together with the hinge structure (340) and protect a component (e.g., at least a portion (350c) of the flexible connecting member (350)) disposed within the wiring space from external impact. According to one embodiment, the hinge cover (360) may be disposed between the first housing (321) and the second housing (322). In the in-folding type electronic device (101), the hinge cover (360) may be at least partially concealed by the foldable housing (321, 322). For example, in the folded state, the hinge cover (360) may be visually exposed to the external space between the rear surface of the first housing (321) (e.g., the first rear cover (381)) and the rear surface of the second housing (322) (e.g., the second rear cover (382)), and in the unfolded state, it may be substantially accommodated within the interior of the first housing (321) or the second housing (322) and visually concealed.

[0092] According to one embodiment, the antenna module (370) (e.g., the antenna module (197) of FIG. 1) may be disposed between the rear cover (380) and the bracket assembly (323, 324). According to one embodiment, the antenna module (370) may include a first antenna module (371) disposed on the first housing (321) side and a second antenna module (372) disposed on the second housing (322) side. The antenna module (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna, thereby enabling short-range communication with an external device or wirelessly transmitting and receiving power required for charging. In another embodiment, the antenna structure may be formed by a side bezel structure of the foldable housing (321, 322) and / or a part of the bracket assembly or a combination thereof.

[0093] According to one embodiment, the rear cover (380) may include a first rear cover (381) and a second rear cover (382). The rear cover (380) may be combined with the foldable housing (321, 322) to protect the above-described components (e.g., a printed circuit board (330), a battery (333, 334), a flexible connecting member (350), or an antenna module (370)) disposed within the foldable housing (321, 322). As described above, the rear cover (380) may be formed substantially integrally with the foldable housing (321, 322).

[0094] In one embodiment, the protective member (306) and / or the decorative cover (319, 329) (e.g., the protective member (206) and / or the decorative cover (219, 229) of FIG. 2) may protect at least a portion of an edge of the display (310). In one embodiment, the protective member (306) may be positioned between the edge of the display (310) and an inner wall of the first housing (321) and / or between the edge of the display (310) and an inner wall of the second housing (322) to prevent direct contact between the edge of the display (310) and the inner wall of the foldable housing (321, 322). In another embodiment, the decorative cover (319) may be positioned in at least one of the first housing (310) and the second housing (320) and may be positioned to cover a portion of an edge of the display (310).

[0095] According to one embodiment, the electronic device may include a first housing (321), a second housing (322), and a hinge structure (340) that rotatably connects the first housing (321) and the second housing (322). The first housing (321) may include a first printed circuit board (331). The second housing (322) may include a second printed circuit board (332). The first printed circuit board (331) and the second printed circuit board (332) may be electrically connected via a flexible connecting member (350). For example, the first printed circuit board (331) may be a main printed circuit board, and the second printed circuit board (332) may be a sub-printed circuit board. For example, there may be multiple heat sources (e.g., APs (415) of FIG. 5) that generate heat on the first printed circuit board (331). The surface heating temperature of the first housing (321) may be higher than the surface heating temperature of the second housing (322) due to a heat source (e.g., AP (415) of FIG. 5) disposed on the first printed circuit board (331). In order to prevent the surface heating temperature of the first housing (321) from increasing relative to the volume thereof, a heat dissipation structure may be included to transfer heat generated within the first housing (321) to the second housing (322) through the hinge structure (340). Hereinafter, the configuration and structure of the heat dissipation structure will be described in detail.

[0096] FIG. 5 is a schematic diagram of a flexible display (410) and a heat dissipation structure according to one embodiment disclosed in this document, and is a drawing showing a heat movement path. FIGS. 6 and 7 are cross-sectional views taken along line B-B' of a portion of the display (410) and heat dissipation structure of FIG. 5 according to one embodiment disclosed in this document.

[0097] Referring to FIGS. 5 to 7, an electronic device (e.g., an electronic device (101) of FIG. 2) may include a housing (e.g., a foldable housing (321, 322) of FIG. 4), a flexible display (410), a heat dissipation layer (420), and a heat-conducting layer (430). The configuration of the flexible display (410) of FIGS. 5 to 7 may be the same as all or part of the configuration of the display (310) of FIG. 4. The structures of FIGS. 5 to 7 may be optionally combined with the structures of FIGS. 2 to 4.

[0098] According to one embodiment, the heat dissipation structure may be disposed on the flexible display (410). For example, at least a portion of the heat dissipation structure may be disposed between the flexible display (410) and a hinge (e.g., the hinge structure (340) of FIG. 4). For example, at least a portion of the heat dissipation structure may be disposed between the flexible display (410) and a bracket assembly (e.g., the bracket assembly (325) of FIG. 4). However, the position of the heat dissipation structure is not limited to the above embodiment and may be designed in various ways.

[0099] According to one embodiment, the heat dissipation structure may include a planar region (403) including a first planar region (401) disposed within a first housing (e.g., the first housing (321) of FIG. 4) and a second planar region (402) disposed within a second housing (e.g., the second housing (322) of FIG. 4), and a folding region (404) positioned between the first planar region (401) and the second planar region (402) and configured to be at least partially folded or unfolded.

[0100] According to one embodiment, the heat dissipation structure may include a heat dissipation layer (420) laminated on (e.g., in the -Z-axis direction) the flexible display (410), and a thermally conductive layer (430) laminated with at least a portion of the heat dissipation layer (420). According to one embodiment, the heat dissipation layer (420) may include a first heat dissipation layer (421) positioned within a first housing (e.g., the first housing (321) of FIG. 4) and a second heat dissipation layer (422) positioned within a second housing (e.g., the second housing (322) of FIG. 4). The first heat dissipation layer (421) and the second heat dissipation layer (422) may be spaced apart from each other. The first heat dissipation layer (421) and the second heat dissipation layer (422) may not be directly thermally connected. For example, the first heat dissipation layer (421) and the second heat dissipation layer (422) may be arranged substantially on the same plane with respect to the Z-axis when the first housing (e.g., the first housing (321) of FIG. 4) is unfolded relative to the second housing (e.g., the second housing (322) of FIG. 4). According to one embodiment, the heat dissipation layer (420) may be arranged in the planar region (403). The heat dissipation layer (420) may not be arranged in the folding region (404). According to one embodiment, at least a portion of the first heat dissipation layer (421) may be arranged in the first planar region (401). At least a portion of the second heat dissipation layer (422) may be arranged in the second planar region (402).

[0101] According to one embodiment, the first heat dissipation layer (421) and the second heat dissipation layer (422) may include a heat dissipation sheet (e.g., graphite) for transferring heat. For example, the thermal conductivity of the heat dissipation layer (420) may be approximately 1000 W / mK or more. For example, the elongation of the heat dissipation layer (420) may be approximately 1% or more and 2% or less. The elongation may be defined as the rate at which an object, such as a metal piece or a heat dissipation sheet, stretches without breaking in a tensile test, etc. Since the heat dissipation layer (420) has a low elongation, it may be placed in the flat area (403) because it may cause breakage when placed in the folding area (404).

[0102] According to one embodiment, the thermally conductive layer (430) can thermally connect the first heat dissipation layer (421) and the second heat dissipation layer (422). At least a portion of the thermally conductive layer (430) can be laminated with at least a portion of the heat dissipation layer (420) (e.g., the first heat dissipation layer (421) or the second heat dissipation layer (422)). One end of the thermally conductive layer (430) in the left direction (e.g., the -Y-axis direction in FIG. 6) can be laminated with at least a portion of the first heat dissipation layer (421), and the other end of the thermally conductive layer (430) in the right direction (e.g., the +Y-axis direction in FIG. 6) can be laminated with at least a portion of the second heat dissipation layer (422). For example, the central portion may not be laminated with the heat dissipation layer (420) based on the direction perpendicular to the folding axis of the thermally conductive layer (430) (e.g., the Y-axis direction). For example, the first heat dissipation layer (421) and the second heat dissipation layer (422) are spaced apart from each other, and the central portion of the thermal conductive layer (430) may correspond to the empty space between the first heat dissipation layer (421) and the second heat dissipation layer (422). For example, one end in contact with the first heat dissipation layer (421) and the other end in contact with the second heat dissipation layer (422) may be a portion that substantially contacts the first heat dissipation layer (421) and / or the second heat dissipation layer (422), and the central portion may be a substantially elongated section.

[0103] In one embodiment, at least a portion of the thermally conductive layer (430) may be disposed in the folding region (404). In one embodiment, the thermally conductive layer (430) may be a material having a high elongation. For example, the elongation of the thermally conductive layer (430) may be higher than the elongation of the heat dissipation layer (420). For example, the elongation of the thermally conductive layer (430) may be approximately 10% or more. By disposing the thermally conductive layer (430) having a high elongation in the folding region (404), it is possible to prevent breakage of the heat dissipation structure that occurs due to a difference in length when the electronic device (e.g., the electronic device (101) of FIG. 2) is in an unfolded state and when it is in a folded state in a foldable electronic device (e.g., the electronic device (101) of FIG. 2). In one embodiment, the thermal conductivity of the thermally conductive layer (430) may be lower than the thermal conductivity of the heat dissipation layer (420). For example, the thermal conductivity of the thermal conductive layer (430) may be approximately 50 W / mK or less. For example, the thermal conductivity of the thermal conductive layer (430) may be approximately 20 W / mK or more and 50 W / mK or less.

[0104] According to one embodiment of the present disclosure, a heat dissipation layer (420) having high thermal conductivity is disposed in a flat area (403) of a foldable electronic device (e.g., an electronic device (101) of FIG. 2), and a heat conductive layer (430) having high elongation is disposed in a folding area (404), thereby increasing the thermal conductivity of the foldable electronic device (e.g., an electronic device (101) of FIG. 2) and preventing breakage of the heat dissipation structure. According to one embodiment, the heat conductive layer (430) may include a material in which heat dissipation particles having thermal conductivity are added to a material having high elongation, such as a polymer or polyurethane. For example, the heat dissipation particles may be particles such as graphene or aluminum oxide (Al2O3).

[0105] According to one embodiment, heat generated in a first housing (e.g., the first housing (321) of FIG. 4) can be sequentially transferred to a second housing (e.g., the second housing (322) of FIG. 4) through a first heat dissipation layer (421), a heat-conducting layer (430), and a second heat dissipation layer (422). For example, heat generated in a first housing (e.g., the first housing (321) of FIG. 4) (e.g., heat generated from a heat source (AP)) is transferred to a first heat dissipation layer (421) before moving to a flexible display (410) disposed within the first housing (e.g., the first housing (321) of FIG. 4), and the heat transferred to the first heat dissipation layer (421) is transferred to a heat-conducting layer (430), and the heat transferred to the heat-conducting layer (430) is transferred to a second heat dissipation layer (422), and can move to a second housing (e.g., the second housing (322) of FIG. 4).

[0106] According to one embodiment, referring to FIG. 6, a heat dissipation layer (420) (e.g., a first heat dissipation layer (421) or a second heat dissipation layer (422)) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), and a heat conductive layer (430) may be disposed on the heat dissipation layer (420). The heat dissipation layer (420) may be disposed between the flexible display (410) and the heat conductive layer (430). According to one embodiment, referring to FIG. 7, a heat conductive layer (430) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), and a heat dissipation layer (420) (e.g., a first heat dissipation layer (421) or a second heat dissipation layer (422)) may be disposed on the heat conductive layer (430) (e.g., in the -Z-axis direction). For example, the thermal conductive layer (430) may be disposed between the flexible display (410) and the heat dissipation layer (420). According to one embodiment, the thermal conductive layer (430) may be disposed between the first heat dissipation layer (421) and the second heat dissipation layer (422). The first heat dissipation layer (421), the second heat dissipation layer (422), and the thermal conductive layer (430) may be disposed on substantially the same plane (not shown). The stacking order of the heat dissipation layer (420) and the thermal conductive layer (430) may be changed and may be designed in various ways.

[0107] According to one embodiment, a heat dissipation structure with an added thermal conductive layer (430) may have a surface temperature of approximately 0.5 degrees lower (e.g., the first housing (321) of FIG. 4)) than a heat dissipation structure without the thermal conductive layer applied. For example, the surface temperature of the first housing including the heat dissipation structure without the thermal conductive layer applied may be 47.3 degrees, and the surface temperature of the first housing including the heat dissipation structure according to the present disclosure with the thermal conductive layer (430) applied may be 46.9 degrees.

[0108] FIGS. 8A and 8B are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure including an anti-stick layer (440) of FIG. 5 according to one embodiment disclosed in the present document.

[0109] Referring to FIGS. 8A and 8B , an electronic device (e.g., the electronic device (101) of FIG. 2 ) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat-conductive layer (430), and an anti-sticking layer (440). The configurations of the flexible display (410), the heat dissipation layer (420), and the heat-conductive layer (430) of FIGS. 8A and 8B may be all or part of the configurations of the display (310), the heat dissipation layer (420), and the heat-conductive layer (430) of FIGS. 5 to 7 . The structures of FIGS. 8A and 8B may be optionally combined with the structures of FIGS. 5 to 7 .

[0110] In one embodiment, the heat dissipation structure may further include an anti-sticking layer (440) to prevent the heat conductive layer (430) and the heat dissipation layer (420) from being adhered to each other, thereby preventing the substantially stretchable region from becoming narrower than the area of ​​the heat conductive layer (430). In one embodiment, the anti-sticking layer (440) may be disposed between the heat conductive layer (430) and the heat dissipation layer (420). The anti-sticking layer (440) may be attached to the heat conductive layer (430). The anti-sticking layer (440) may correspond in size and / or position to the heat conductive layer (430). For example, the length (e.g., the length in the Y-axis direction of FIG. 8A) and / or position of the anti-sticking layer (440) may be substantially the same as those of the heat conductive layer (430). The anti-sticking layer (440) may be disposed in the folding region (404).

[0111] In one embodiment, the anti-stick layer (440) may have a high elongation. For example, the elongation of the anti-stick layer (440) may be higher than the elongation of the heat dissipation layer (420). In one embodiment, the anti-stick layer (440) may have a low adhesive strength. The anti-stick layer (440) may be tacky, adherent, and / or non-adherent to the heat dissipation layer (420). In one embodiment, the anti-stick layer (440) may be a matte material having low friction. The anti-stick layer (440) may include, for example, thermoplastic polyurethane (TPU). In one embodiment, when the foldable electronic device (e.g., the electronic device (101) of FIG. 2) changes from an unfolded state to a folded state, one surface of the anti-stick layer (440) facing the heat dissipation layer (420) may slide with respect to the heat dissipation layer (420).

[0112] According to one embodiment, when the heat dissipation layer (420) is disposed between the flexible display (410) and the heat-conducting layer (430) according to FIG. 6, the heat dissipation layer (420) (e.g., the first heat dissipation layer (421) or the second heat dissipation layer (422)) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), the anti-sticking layer (440) may be disposed on the heat dissipation layer (420) (e.g., in the -Z-axis direction), and the heat-conducting layer (430) may be disposed on the anti-sticking layer (440) (e.g., in the -Z-axis direction) (see FIG. 8a). According to one embodiment, referring to FIG. 8B, when the thermal conductive layer (430) is disposed between the flexible display (410) and the heat dissipation layer (420), the thermal conductive layer (430) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), the anti-sticking layer (440) may be disposed on the thermal conductive layer (430) (e.g., in the -Z-axis direction), and the heat dissipation layer (420) (e.g., the first heat dissipation layer (421) or the second heat dissipation layer (422)) may be disposed on the anti-sticking layer (440) (e.g., in the -Z-axis direction). The stacking order of the heat dissipation layer (420) and the thermal conductive layer (430) may be changed and may be designed in various ways.

[0113] FIGS. 9A and 9B are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure including a surface protection layer (450, 460) of FIG. 5 according to one embodiment disclosed in the present document.

[0114] Referring to FIGS. 9A and 9B , an electronic device (e.g., the electronic device (101) of FIG. 2 ) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat-conductive layer (430), an anti-sticking layer (440), or a surface protection layer (450, 460). The configurations of the flexible display (410), the heat dissipation layer (420), the heat-conductive layer (430), and the anti-sticking layer (440) of FIGS. 9A to 9B may be all or part of the configurations of the display (310), the heat dissipation layer (420), the heat-conductive layer (430), and the anti-sticking layer (440) of FIGS. 5 to 8B . The structures of FIGS. 9A and 9B may be optionally combined with the structures of FIGS. 5 to 8B .

[0115] According to one embodiment, the heat dissipation structure may further include a surface protection layer (450, 460) on the surface of the heat dissipation structure so that the heat dissipation layer (420) and / or the thermally conductive layer (430) are not exposed.

[0116] According to one embodiment, the graphite included in the heat dissipation layer (420) may be a conductive material that is easily split and flies in the form of dust when exposed to the outside. If the heat dissipation layer (420) is exposed to the outside of the heat dissipation structure and flies in the form of dust, the function of the heat dissipation layer (420) may be weakened, usability may be reduced, and an electronic device including the heat dissipation layer (420) (e.g., the electronic device (101) of FIG. 2) may be damaged if a foreign substance adheres or gets caught. To prevent this, according to one embodiment, a surface protection layer (450, 460) may be additionally disposed so that the heat dissipation layer (420) and / or the thermally conductive layer (430) are not exposed to the outside of the heat dissipation structure. For example, the surface protection layer (450, 460) may include a first protection layer (450) facing the flexible display (410) and / or a second protection layer (460) facing the hinge (e.g., the hinge structure (340) of FIG. 4). For example, either the first protection layer (450) or the second protection layer (460) may be omitted. For example, according to one embodiment, the heat dissipation structure may include the first protection layer (450) and not include the second protection layer (460). According to one embodiment, the surface protection layer (450, 460) may be disposed in the folding area (404) and / or the flat area (403). For example, they may be integrally disposed in the folding area (404) and the flat area (403).

[0117] In one embodiment, the surface protection layer (450, 460) may have a high elongation. For example, the elongation of the surface protection layer (450, 460) may be higher than the elongation of the heat dissipation layer (420). In one embodiment, the surface protection layer (450, 460) may be a material that does not generate flying products even if the surface is damaged and / or destroyed. The surface protection layer (450, 460) may include, for example, thermoplastic polyurethane (TPU).

[0118] According to one embodiment, when the heat dissipation layer (420) is disposed between the flexible display (410) and the heat-conducting layer (430) according to FIG. 8a, a first protective layer (450) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), a heat dissipation layer (420) (e.g., the first heat dissipation layer (421) or the second heat dissipation layer (422)) may be disposed on the first protective layer (450) (e.g., in the -Z-axis direction), an anti-sticking layer (440) may be disposed on the heat dissipation layer (420) (e.g., in the -Z-axis direction), a heat-conducting layer (430) may be disposed on the anti-sticking layer (440) (e.g., in the -Z-axis direction), and a second protective layer (460) may be disposed on the heat-conducting layer (430) (e.g., in the -Z-axis direction) (see FIG. 9a). For example, the second protective layer (460) may be positioned between the thermal conductive layer (430) and the hinge. According to one embodiment, when the thermal conductive layer (430) is disposed between the flexible display (410) and the heat dissipation layer (420) according to FIG. 8b, a first protective layer (450) may be disposed on the flexible display (410) (e.g., in the -Z-axis direction), a thermal conductive layer (430) may be disposed on the first protective layer (450) (e.g., in the -Z-axis direction), an anti-sticking layer (440) may be disposed on the thermal conductive layer (430) (e.g., in the -Z-axis direction), a heat dissipation layer (420) (e.g., the first heat dissipation layer (421) or the second heat dissipation layer (422)) may be disposed on the anti-sticking layer (440) (e.g., in the -Z-axis direction), and a second protective layer (460) may be disposed on the heat dissipation layer (420) (e.g., in the -Z-axis direction) (see FIG. 9b). For example, the second protective layer (460) may be positioned between the heat dissipation layer (420) and the hinge (e.g., the hinge structure (340) of FIG. 4). The stacking order of the heat dissipation layer (420) and the heat conductive layer (430) may be changed and may be designed in various ways. Hereinafter, for convenience of explanation, the description will be made with reference to FIG. 9b, in which the heat conductive layer (430) is positioned between the flexible display (410) and the heat dissipation layer (420). However, this may also be substantially applied equally when the heat dissipation layer (420) is positioned between the flexible display (410) and the heat conductive layer (430).

[0119] FIG. 10 is a cross-sectional view of a portion of a heat dissipation structure of FIG. 5 taken along line A-A' when an electronic device (e.g., the electronic device (101) of FIG. 2) according to one embodiment disclosed in the present document is in an unfolded state. FIG. 11 is a cross-sectional view of a portion of a heat dissipation structure of FIG. 5 taken along line A-A' when an electronic device (e.g., the electronic device (101) of FIG. 2) according to one embodiment disclosed in the present document is in a folded state.

[0120] Referring to FIGS. 10 and 11 , an electronic device (e.g., the electronic device (101) of FIG. 2 ) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat conductive layer (430), an anti-sticking layer (440), or a surface protection layer (450, 460). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), and the anti-sticking layer (440) of FIGS. 10 and 11 may be substantially the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), and the anti-sticking layer (440) of FIGS. 5 to 9B . The configuration of FIGS. 10 and 11 may be optionally combined with the configuration of FIGS. 5 to 9B .

[0121] According to one embodiment, when referring to FIG. 10, when the electronic device (e.g., the electronic device (101) of FIG. 2) is in an unfolded state, the heat dissipation structure may be in a state where no elongation occurs when the first housing (e.g., the first housing (321) of FIG. 4) rotates relative to the second housing (e.g., the second housing (322) of FIG. 4) such that the angle between the first housing (e.g., the first housing (321) of FIG. 4) and the second housing (e.g., the second housing (322) of FIG. 4)) is 180 degrees. According to one embodiment, when a lot of heat is generated in the first housing (e.g., the first housing (321) of FIG. 4) and the internal temperature of the first housing (e.g., the first housing (321) of FIG. 4) is higher than that of the second housing (e.g., the second housing (322) of FIG. 4), most of the heat within the first housing (e.g., the first housing (321) of FIG. 4) may be transferred to the first heat dissipation layer (421) disposed within the first housing (e.g., the first housing (321) of FIG. 4), the heat of the first heat dissipation layer (421) may be transferred to the heat conductive layer (430), and the heat of the heat conductive layer (430) may be transferred to the second heat dissipation layer (422). According to one embodiment, heat generated in a first housing (e.g., the first housing (321) of FIG. 4) can be sequentially transferred to a second housing (e.g., the second housing (322) of FIG. 4) through a first heat dissipation layer (421), a heat-conducting layer (430), and a second heat dissipation layer (422). For example, heat generated in a first housing (e.g., the first housing (321) of FIG. 4) (e.g., heat generated from a heat source (AP)) is transferred to a first heat dissipation layer (421) before moving to a flexible display (410) disposed within the first housing (e.g., the first housing (321) of FIG. 4), and the heat transferred to the first heat dissipation layer (421) is transferred to a heat-conducting layer (430), and the heat transferred to the heat-conducting layer (430) is transferred to a second heat dissipation layer (422), and can move to a second housing (e.g., the second housing (322) of FIG. 4).

[0122] According to one embodiment, a small amount of heat within a first housing (e.g., the first housing (321) of FIG. 4) may be transferred to a first heat dissipation layer (421) disposed within the first housing (e.g., the first housing (321) of FIG. 4), and heat from the first heat dissipation layer (421) may be transferred to a second heat dissipation layer (422) disposed separately.

[0123] According to one embodiment, referring to FIG. 11, when an electronic device (e.g., the electronic device (101) of FIG. 2) is in a folded state, when a first housing (e.g., the first housing (321) of FIG. 4) rotates relative to a second housing (e.g., the second housing (322) of FIG. 4) such that an angle between the first housing (e.g., the first housing (321) of FIG. 4) and the second housing (e.g., the second housing (322) of FIG. 4)) is about 0 degrees, the folding region (404) of the heat dissipation structure may be elongated. When the electronic device (e.g., the electronic device (101) of FIG. 2) is in a folded state, the length of the folding region (404) of the heat dissipation structure may increase more than the length of the folding region (404) of the heat dissipation structure when the electronic device (e.g., the electronic device (101) of FIG. 2) is in an unfolded state. For example, the heat dissipation layer (420) located in the flat region (403) may not be elongated. For example, the distance between the first heat dissipation layer (421) and the second heat dissipation layer (422) may increase. For example, the spaced apart between the first heat dissipation layer (421) and the second heat dissipation layer (422) may be an air layer (4002). For example, the air layer (4002) may mean an empty space. For example, the length of the anti-sticking layer (440), the heat conductive layer (430), and the surface protection layer (450, 460) (e.g., the first protection layer (450) or the second protection layer (460)) at least partially located in the folding region (404) may increase.

[0124] FIG. 12 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including an adhesive layer (470) according to one embodiment disclosed in this document.

[0125] Referring to FIG. 12, an electronic device (e.g., electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat conductive layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), and the surface protection layer (450, 460) of FIG. 12 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), and the surface protection layer (450, 460) of FIGS. 5 to 11. The structure of FIG. 12 can be optionally combined with the structures of FIGS. 5 to 11.

[0126] According to one embodiment, at least a portion of the thermally conductive layer (430) and / or the anti-sticking layer (440) may be positioned in the folding region (404) of the heat dissipation structure. The heat dissipation structure may further include a first adhesive layer (471, 472) disposed on a side (e.g., a side in the Y-axis direction of FIG. 12) of the thermally conductive layer (430) and / or the anti-sticking layer (440) to adhere the heat dissipation layer (420) and the first protective layer (450). The first adhesive layer (471, 472) may be laminated with at least a portion of the heat dissipation layer (420) and may be disposed parallel to the thermally conductive layer (430) and / or the anti-sticking layer (440). For example, the first adhesive layer (471, 472) may include a first-first adhesive layer (471) disposed in the first planar region (401) and positioned between the first heat dissipation layer (421) and the first protective layer (450), and / or a first-second adhesive layer (472) disposed in the second planar region (402) and positioned between the second heat dissipation layer (422) and the first protective layer (450).

[0127] According to one embodiment, the heat dissipation structure may further include a second adhesive layer (473) disposed between at least a portion of the heat dissipation layer (420) and at least a portion of the second protective layer (460) to adhere the heat dissipation layer (420) and the second protective layer (460). One side of the second adhesive layer (473) facing the flexible display (410) may face the first heat dissipation layer (421) and the second heat dissipation layer (422), and the other side facing in the opposite direction may face the second protective layer (460).

[0128] In one embodiment, the adhesive layer (470) (e.g., the first adhesive layer (471, 472), or the second adhesive layer (473)) may have a high elongation. For example, the elongation of the adhesive layer (470) may be higher than the elongation of the heat dissipation layer (420). For example, the adhesive layer may include a pressure sensitive adhesive (PSA).

[0129] According to one embodiment, the heat dissipation structure may further include a lattice structure layer (4001) between the flexible display (410) and a surface protection layer (e.g., the first protection layer (450)).

[0130] According to one embodiment, the heat dissipation structure may further include an air layer (4002) positioned between each component included in the heat dissipation structure. For example, the air layer (4002) may refer to an empty space formed between each component forming the heat dissipation structure. For example, the air layer (4002) may be formed between the first adhesive layer (471) and the thermally conductive layer (430), and between the thermally conductive layer (430) and the second adhesive layer (472). For example, the air layer (4002) may be formed between the first heat dissipation layer (421) and the second heat dissipation layer (422).

[0131] FIG. 13 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer (420) according to one embodiment disclosed in this document.

[0132] Referring to FIG. 13, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat conductive layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIG. 13 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 5 to 12. The structure of FIG. 13 can be optionally combined with the structures of FIGS. 5 to 12.

[0133] According to one embodiment, the heat dissipation structure may further include a heat dissipation layer (420) (e.g., a third heat dissipation layer (423) or a fourth heat dissipation layer (424)) disposed on a side (e.g., in the Y-axis direction) of the heat-conductive layer (430) and / or the anti-sticking layer (440) to enhance the thermal conductivity of the flat region (403). The heat dissipation layer (420) may further include a third heat dissipation layer (423) that is laminated with at least a portion of the first heat dissipation layer (421) and disposed parallel to the heat-conductive layer (430), and a fourth heat dissipation layer (424) that is laminated with at least a portion of the second heat dissipation layer (422) and disposed parallel to the heat-conductive layer (430). For example, the third heat dissipation layer (423) may be disposed between the first heat dissipation layer (421) and the first protective layer (450). For example, the fourth heat dissipation layer (424) may be disposed between the second heat dissipation layer (422) and the first protective layer (450). In one embodiment, the third heat dissipation layer (423) and / or the fourth heat dissipation layer (424) may be disposed in a planar area (403) of an electronic device (e.g., the electronic device (101) of FIG. 2). For example, the third heat dissipation layer (423) may be disposed in the first planar area (401), and the fourth heat dissipation layer (424) may be disposed in the second planar area (402).

[0134] FIG. 14 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer (421, 422) having steps formed therein according to one embodiment disclosed in the present document. FIG. 15 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure including a heat dissipation layer (420) according to one embodiment disclosed in the present document.

[0135] Referring to FIGS. 14 and 15, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a thermally conductive layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 14 and 15 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 5 to 13. The structure of FIGS. 14 and 15 may be selectively combined with the structure of FIGS. 5 to 13.

[0136] In one embodiment, the second adhesive layer (473, 474) may be disposed between at least a portion of the heat dissipation layer (420) and at least a portion of the second protective layer (460) to adhere the heat dissipation layer (420) and the second protective layer (460). In one embodiment, the second adhesive layer (473) may be formed integrally, as shown in FIG. 12. In one embodiment, as shown in FIG. 14, the second adhesive layer (473, 474) may be positioned in the planar region (403) of the heat dissipation structure. It may not be positioned in the folding region (404). For example, the second adhesive layer (473, 474) may include a second-first adhesive layer (473) disposed between a portion of the first heat dissipation layer (421) located in the first planar region (401) and the second protective layer (460), and / or a second-second adhesive layer (474) disposed between a portion of the second heat dissipation layer (422) located in the second planar region (402) and the second protective layer (460). This is because, when the adhesive layer (470) is disposed in the folding region (404), the elongation may decrease.

[0137] In one embodiment, the folding area (404) may not include the second adhesive layer (473, 474). For example, referring to FIG. 15, the space between the second-first adhesive layer (473) and the second-second adhesive layer (474) may be an empty space.

[0138] According to one embodiment, with reference to FIG. 14, the first heat dissipation layer (421) and / or the second heat dissipation layer (422) may include steps having different heights in the Z-direction. For example, the positions in the Z-direction of a portion of the first heat dissipation layer (421) positioned on the third heat dissipation layer (423) and / or the 1-1 adhesive layer (471) (e.g., in the -Z-direction) may be different from the positions of another portion of the first heat dissipation layer (421) positioned on the thermally conductive layer (430) and / or the anti-sticking layer (440). For example, the first heat dissipation layer (421) positioned on the thermally conductive layer (430) and / or the anti-sticking layer (440) may be positioned further in the +Z-direction by a specified length than the first heat dissipation layer (421) positioned on the third heat dissipation layer (423) and / or the 1-1 adhesive layer (471). This may be because the second adhesive layer (470) is not included in the folding area (404) and the Z-axis direction thickness of the thermal conductive layer (430) is formed relatively high.

[0139] FIGS. 16 and 17 are cross-sectional views taken along line A-A' of a portion of a heat dissipation structure further including a protective film (480) according to one embodiment disclosed in the present document.

[0140] Referring to FIGS. 16 and 17, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat-conducting layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 16 and 17 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 5 to 15. The structure of FIGS. 16 and 17 may be selectively combined with the structure of FIGS. 5 to 15.

[0141] In one embodiment, at least a portion of the second protective layer (460) may be formed in the folding area (404). In one embodiment, the second protective layer (460) may be formed in the folding area (404).

[0142] According to one embodiment, the heat dissipation structure may further include a protective film (480) for protecting the heat dissipation structure in a planar area (403) where the second protective layer (460) is not positioned. For example, the protective film (480) may include a first protective film (481) disposed in the first planar area (401) and connected to one end of the second protective layer (460), and a second protective film (482) disposed in the second planar area (402) and connected to the other end of the second protective layer (460). The protective film (480) may be made of, for example, a material such as a polyester film (PET), a polyethylene terephthalate film (PEN), or a polyimide film (PI).

[0143] According to one embodiment, the heat dissipation structure may further include a third adhesive layer (475, 476) for attaching the protective film (480) and the heat dissipation layer (420). For example, the third adhesive layer (475, 476) may include a 3-1 adhesive layer (475) disposed between the first protective film (480) and the first heat dissipation layer (421), and / or a 3-2 adhesive layer (476) disposed between the second protective film (480) and the second heat dissipation layer (422).

[0144] According to one embodiment, referring to FIG. 16, one end of the second protective layer (460) may be in contact with the 3-1 adhesive layer (475), and the other end of the second protective layer (460) may be in contact with the 3-2 adhesive layer (476). The second protective layer (460) may be disposed on the second adhesive layer (473, 474) (e.g., in the -Z-axis direction) and may be disposed on substantially the same plane as the third adhesive layer (475, 476).

[0145] According to one embodiment, referring to FIG. 17, the second protective layer (460) may be disposed on substantially the same plane as the second adhesive layer (473, 474). For example, the empty space between the 2-1 adhesive layer (473) and the 2-2 adhesive layer (474) may be removed, and the second protective layer (460) may be disposed between the 2-1 adhesive layer (473) and the 2-2 adhesive layer (474).

[0146] FIG. 18 is a cross-sectional view taken along line A-A' of a portion of a heat dissipation structure further including a second anti-stick layer (442) according to one embodiment disclosed in this document.

[0147] Referring to FIG. 18, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat conductive layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIG. 18 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 5 to 17. The structure of FIG. 18 can be optionally combined with the structures of FIGS. 5 to 17.

[0148] According to one embodiment, the heat dissipation structure may further include a second anti-stick layer (442) substantially on the same plane as the second adhesive layer (473, 474) to strongly protect the first heat dissipation layer (421) having a low elongation and the second heat dissipation layer (422) from breakage (for convenience of explanation, the anti-stick layer (470) illustrated in FIGS. 5 to 17 may be defined as the first anti-stick layer (471)). For example, the second anti-stick layer (442) may be disposed between the 2-1 adhesive layer (473) and the 2-2 adhesive layer (474).

[0149] According to one embodiment, a third adhesive layer (475) may be disposed on the second anti-stick layer (442) and the second adhesive layers (473, 474). For example, the third adhesive layer (475) may be formed integrally, including the folding region (404) and the flat region (403).

[0150] According to one embodiment, a second protective layer (460) and a protective film (480) may be disposed on the third adhesive layer (475) (e.g., in the -Z-axis direction). For example, the second protective layer (460) may be disposed on substantially the same plane as the protective film (480). The second protective layer (460) may be disposed in the folding area (404). The first protective film (481) may be disposed in the first plane area (401), and the second protective film (482) may be disposed in the second plane area (402).

[0151] FIG. 19 is a cross-sectional view taken along line A-A' of a part of a detachable heat dissipation structure according to one embodiment disclosed in this document.

[0152] Referring to FIG. 19, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a flexible display (410) and a heat dissipation structure. For example, the heat dissipation structure may include a heat dissipation layer (420), a heat conductive layer (430), an anti-sticking layer (440), a surface protection layer (450, 460), and an adhesive layer (470). The configuration of the flexible display (410), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIG. 18 may be the same as all or part of the configuration of the display (310), the heat dissipation layer (420), the heat conductive layer (430), the anti-sticking layer (440), the surface protection layer (450, 460), and the adhesive layer (470) of FIGS. 5 to 17. The structure of FIG. 19 can be optionally combined with the structures of FIGS. 5 to 18.

[0153] According to one embodiment, at least a portion of the heat dissipation structure may be detachable as the electronic device (e.g., electronic device (101) of FIG. 2) is folded.

[0154] According to one embodiment, a third anti-sticking layer (490) having low elongation may be disposed on the thermal conductive layer (430) and / or the anti-sticking layer (440) (e.g., in the -Z-axis direction). For example, the third anti-sticking layer (490) may be a hard material having low elongation. The third anti-sticking layer (490) may be an unstretched material. The third anti-sticking layer (490) may include a 3-1 anti-sticking layer (491) positioned within a first housing (e.g., the 1st housing (321) of FIG. 4) and a 3-2 anti-sticking layer (492) positioned within a second housing (e.g., the 2nd housing (322) of FIG. 4).

[0155] According to one embodiment, the second-first adhesive layer (473) may be further disposed between the third-first anti-sticking layer (491) and the first heat dissipation layer (421), and the second-second adhesive layer (474) may be disposed between the third-second anti-sticking layer (492) and the second heat dissipation layer (422).

[0156] According to one embodiment, the first protective film (481) may be positioned within a first housing (e.g., the first housing (321) of FIG. 4) and laminated with a first heat dissipation layer (421), and a second protective film (482) may be positioned within a second housing (e.g., the second housing (322) of FIG. 4) and laminated with a second heat dissipation layer (422).

[0157] According to one embodiment, the device may further include a third-first adhesive layer (475) disposed between the first heat dissipation layer (421) and the first protective film (481) to attach the first heat dissipation layer (421) and the first protective film (480), and a third-second adhesive layer (476) disposed between the second heat dissipation layer (422) and the second protective film (482) to attach the second heat dissipation layer (422) and the second protective film (480).

[0158] An electronic device according to one embodiment of the present disclosure may include a first housing (e.g., 321 of FIG. 4), a second housing (e.g., 321 of FIG. 4), a hinge configured to rotatably couple the first housing and the second housing (e.g., hinge structure (340) of FIG. 4), a flexible display (e.g., 410 of FIG. 5) formed to vary in response to relative movement of the second housing with respect to the first housing, and a heat dissipation structure at least partly disposed between the flexible display and the hinge. The heat dissipation structure may include a heat dissipation layer (e.g., 420 in FIG. 5) laminated with the flexible display, including a first heat dissipation layer (e.g., 421 in FIG. 5) positioned within the first housing and a second heat dissipation layer (e.g., 422 in FIG. 5) positioned within the second housing, and a heat conductive layer (e.g., 430 in FIG. 5) laminated with at least a portion of the heat dissipation layer and configured to thermally connect the first heat dissipation layer and the second heat dissipation layer. Heat generated in the first housing may be configured to be sequentially transferred to the second housing through the first heat dissipation layer, the heat conductive layer, and the second heat dissipation layer.

[0159] According to one embodiment, the heat dissipation structure may further include an anti-sticking layer (e.g., 440 in FIG. 8a) disposed between the heat-conducting layer and the heat dissipation layer.

[0160] According to one embodiment, the heat dissipation structure includes a planar region (e.g., 403 in FIG. 5) including a first planar region (e.g., 401 in FIG. 5) disposed within the first housing and a second planar region (e.g., 402 in FIG. 5) disposed within the second housing, and a folding region (e.g., 404 in FIG. 5) disposed between the first planar region and the second planar region, wherein the first heat dissipation layer is disposed in the first planar region, the second heat dissipation layer is disposed in the second planar region, and at least a portion of the heat-conductive layer may be disposed in the folding region.

[0161] According to one embodiment, the first heat dissipation layer and the second heat dissipation layer may be spaced apart from each other.

[0162] According to one embodiment, the heat dissipation layer may be disposed between the heat-conducting layer and the flexible display.

[0163] According to one embodiment, the thermally conductive layer may be disposed between the heat dissipation layer and the flexible display.

[0164] According to one embodiment, the elongation of the heat dissipation layer may be lower than the elongation of the heat conductive layer, and the thermal conductivity of the heat dissipation layer may be higher than the thermal conductivity of the heat conductive layer.

[0165] In one embodiment, the elongation of the thermally conductive layer may be 10% or greater.

[0166] According to one embodiment, the thermal conductivity of the thermally conductive layer may be 50 W / mK or less.

[0167] According to one embodiment, the heat dissipation structure may further include a surface protection layer (450, 460) including a first protection layer (e.g., 450 in FIG. 9A) facing the flexible display, and a second protection layer (e.g., 460 in FIG. 9A) facing the hinge.

[0168] According to one embodiment, the heat dissipation structure may further include a first adhesive layer (e.g., 471, 472 of FIG. 12) disposed between at least a portion of the heat dissipation layer and at least a portion of the first protective layer and disposed parallel to the heat-conductive layer.

[0169] According to one embodiment, the heat dissipation layer may further include a third heat dissipation layer (e.g., 423 in FIG. 13) laminated with at least a portion of the first heat dissipation layer and arranged parallel to the heat-conducting layer, and a fourth heat dissipation layer (e.g., 424 in FIG. 13) laminated with at least a portion of the second heat dissipation layer and arranged parallel to the heat-conducting layer.

[0170] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a hinge configured to rotatably connect the first housing and the second housing, a flexible display configured to vary in response to relative movement of the second housing with respect to the first housing, and a heat dissipation structure at least partially disposed between the flexible display and the hinge. The heat dissipation structure may include a heat dissipation layer laminated with the flexible display, the heat dissipation layer including a first heat dissipation layer positioned within the first housing and a second heat dissipation layer positioned within the second housing, a heat conductive layer laminated with at least a portion of the heat dissipation layer and configured to thermally connect the first heat dissipation layer and the second heat dissipation layer, and an anti-sticking layer disposed between the heat conductive layer and the heat dissipation layer. Heat generated in the first housing may be configured to be sequentially transferred to the second housing through the first heat dissipation layer, the heat conductive layer, and the second heat dissipation layer.

[0171] According to one embodiment, the heat dissipation structure includes a planar area including a first planar area disposed on the first housing and a second planar area disposed on the second housing, and a folding area located between the first planar area and the second planar area and configured such that at least a portion thereof can be folded or unfolded, wherein the first heat dissipation layer is disposed on the first planar area, the second heat dissipation layer is disposed on the second planar area, and at least a portion of the heat-conductive layer can be disposed on the folding area.

[0172] According to one embodiment, the first heat dissipation layer and the second heat dissipation layer may be spaced apart from each other.

[0173] According to one embodiment, the heat dissipation layer may be disposed between the heat-conducting layer and the flexible display.

[0174] According to one embodiment, the thermally conductive layer may be disposed between the heat dissipation layer and the flexible display.

[0175] According to one embodiment, the elongation of the heat dissipation layer may be lower than the elongation of the heat conductive layer, and the thermal conductivity of the heat dissipation layer may be higher than the thermal conductivity of the heat conductive layer.

[0176] In one embodiment, the elongation of the thermally conductive layer may be 10% or greater.

[0177] According to one embodiment, the thermal conductivity of the thermally conductive layer may be 50 W / mK or less.

[0178] The hinge part (e.g., folding area (404)) of a foldable electronic device (e.g., electronic device (101) of FIG. 2) is foldable, but since there is no structure for transmitting heat by penetrating the hinge part, heat cannot spread, and the surface heating temperature relative to the volume of the electronic device (e.g., electronic device (101) of FIG. 2) may increase. When a heat dissipation sheet (e.g., graphite) for transmitting heat by penetrating the hinge part of a foldable electronic device (e.g., electronic device (101) of FIG. 2) is placed, when the electronic device (e.g., electronic device (101) of FIG. 2) is unfolded, the heat dissipation sheet is folded, and when the electronic device (e.g., electronic device (101) of FIG. 2) is folded, the folded heat dissipation sheet can be unfolded. At this time, if there is no free space in the hinge part for the heat dissipation sheet to be unfolded, the heat dissipation sheet may not be unfolded or may be damaged due to interference. When attaching a heat-dissipating sheet to a printed circuit board, its size is limited by the printed circuit board, which can reduce its heat transfer performance. Using a standard heat-dissipating sheet as a single piece can lead to breakage due to its low elongation. Furthermore, placing a heat-dissipating sheet with a high elongation can significantly reduce its heat transfer performance compared to standard sheets due to its low thermal conductivity.

[0179] According to one embodiment of the present disclosure, a heat dissipation layer (420) having high thermal conductivity is placed in a flat area (403) of a foldable electronic device (e.g., an electronic device (101) of FIG. 2), and a heat conductive layer (430) having high elongation is placed in a folding area (404), thereby increasing the thermal conductivity of a foldable electronic device (e.g., an electronic device (101) of FIG. 2) and preventing breakage of a heat dissipation structure.

[0180] According to one embodiment of the present disclosure, heat generated in a first housing (e.g., the first housing (321) of FIG. 4) is sequentially transferred to a second housing (e.g., the second housing (322) of FIG. 4) through a first heat dissipation layer (421), a heat-conducting layer (430), and a second heat dissipation layer (422), so that heat diffusion between the first housing (e.g., the first housing (321) of FIG. 4) and the second housing (e.g., the second housing (322) of FIG. 4) in a foldable electronic device (e.g., the electronic device (101) of FIG. 2)) can be smoothly achieved.

[0181] A heat dissipation structure according to one embodiment of the present disclosure is simple in shape and structure by stacking a heat-conducting layer (430) on a heat dissipation layer (420), and can maintain the shape as it was when first attached, and can be easily designed and manufactured because there is nothing to consider other than that at least a part of the heat dissipation structure is extended even when an electronic device (e.g., electronic device (101) of FIG. 2) is folded or unfolded.

[0182] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

Claims

1. In an electronic device (101), First housing (321); Second housing (322); A hinge (340) configured to rotatably connect the first housing and the second housing; A flexible display (410) configured to vary in response to the rotation of the second housing relative to the first housing; and At least a portion of the heat dissipation structure is disposed between the flexible display and the hinge; The above heat dissipation structure is, A heat dissipation layer (420) laminated with the flexible display, comprising a first heat dissipation layer (421) positioned within the first housing, and a second heat dissipation layer (422) positioned within the second housing; and A heat-conducting layer (430) is laminated with at least a portion of the heat-dissipating layer and configured to thermally connect the first heat-dissipating layer and the second heat-dissipating layer; An electronic device wherein the heat dissipation structure is configured to transfer heat from the first housing to the second housing through the first heat dissipation layer, the heat-conductive layer, and the second heat dissipation layer.

2. In paragraph 1, An electronic device, wherein the heat dissipation structure further includes an anti-sticking layer (440) disposed between the heat-conducting layer and the heat dissipation layer.

3. In either of paragraphs 1 and 2, The above heat dissipation structure is, A planar area (403) including a first planar area (401) arranged within the first housing and a second planar area (402) arranged within the second housing, and Including a folding area (404) arranged between the first plane area and the second plane area, The first heat dissipation layer is disposed in the first plane area, The second heat dissipation layer is disposed in the second plane area, An electronic device wherein at least a portion of the thermally conductive layer is disposed in the folding region.

4. In any one of paragraphs 1 to 3, An electronic device in which the first heat dissipation layer and the second heat dissipation layer are spaced apart from each other.

5. In any one of paragraphs 1 to 4, An electronic device in which the heat dissipation layer is positioned between the heat conducting layer and the flexible display.

6. In any one of paragraphs 1 to 4, An electronic device wherein the heat-conducting layer is disposed between the heat dissipation layer and the flexible display.

7. In any one of paragraphs 1 to 6, The elongation of the above heat dissipation layer is lower than that of the above heat conducting layer, An electronic device wherein the thermal conductivity of the heat dissipation layer is higher than the thermal conductivity of the heat-conducting layer.

8. In any one of paragraphs 1 to 7, An electronic device wherein the elongation of the above thermally conductive layer is 10% or more.

9. In any one of paragraphs 1 to 8, An electronic device wherein the thermal conductivity of the above thermally conductive layer is 50 W / mK or less.

10. In any one of paragraphs 1 to 9, The above heat dissipation structure is, An electronic device further comprising a surface protection layer (450, 460) including a first protection layer (450) facing the flexible display and a second protection layer (460) facing the hinge.

11. In clause 10, The above heat dissipation structure is, An electronic device further comprising a first adhesive layer (471, 472) disposed between at least a portion of the heat dissipation layer and at least a portion of the first protective layer, and disposed parallel to the heat-conducting layer.

12. In any one of paragraphs 1 to 11, The above heat dissipation layer is, A third heat dissipation layer (423) laminated with at least a portion of the first heat dissipation layer and arranged parallel to the heat-conducting layer; and An electronic device further comprising a fourth heat dissipation layer (424) laminated with at least a portion of the second heat dissipation layer and arranged parallel to the heat-conducting layer.

13. In any one of paragraphs 1 or 4 to 12, A thermally conductive layer configured to be laminated with at least a portion of the heat dissipation layer and thermally connect the first heat dissipation layer and the second heat dissipation layer; and The heat dissipation structure includes a folding region arranged between a first plane region arranged within the first housing and a second plane region arranged within the second housing. An electronic device comprising an anti-stick layer (440) disposed between the heat-conducting layer and the heat-dissipating layer and disposed in the folding area.

14. In any one of paragraphs 1 to 13, An electronic device in which the heat dissipation structure is formed to transfer heat generated in the first housing from the first heat dissipation layer to the second heat dissipation layer.

15. In any one of paragraphs 1 to 14, The above heat dissipation structure is an electronic device formed so that heat generated in the first housing is sequentially transferred to the second housing through the first heat dissipation layer, the heat-conducting layer, and the second heat dissipation layer.

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