Laser engraving and cutting apparatus and laser engraving and cutting system

Abstract

Provided in the present application are a laser engraving and cutting apparatus and a laser engraving and cutting system. The laser engraving and cutting apparatus comprises a laser element, a beam splitter, a first detection apparatus, and a second detection apparatus. The laser element emits a laser, wherein a part of the laser emitted by the laser element is emitted in a first direction in order to engrave and cut a piece to be processed, and is reflected by said piece to form a first reflected light; the beam splitter is located between the laser element and the piece to be processed, and comprises a first reflecting surface, wherein the first reflecting surface faces the laser element, and another part of the laser emitted by the laser element is reflected by the first reflecting surface to form a second reflected light. The first detection apparatus detects a light reflection signal of the second reflected light; and the second detection apparatus is used for receiving the first reflected light, so as to detect and feed back a light reflection signal of the first reflected light. The present application allows for real-time monitoring of engraving and cutting power and engraving and cutting effect, as well as dynamic adjustment of engraving and cutting parameters according to monitoring results.

Description

Laser engraving and cutting device and laser engraving and cutting system

[0001] This application claims priority to a Chinese patent application filed with the Patent Office of China on July 21, 2023, with application number 202310912498.8 and application name “Laser Engraving and Cutting Device and Laser Engraving and Cutting System”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of laser engraving technology, and in particular to a laser engraving device and a laser engraving system. Background Art

[0003] Laser engraving machines require users to manually set the cutting parameters when engraving materials of different materials or thicknesses. Improperly set cutting parameters can affect the cutting effect, easily causing the material to be scrapped. Unsatisfactory cutting results require users to re-adjust the laser engraving machine parameters, causing great inconvenience. Furthermore, even with the appropriate cutting parameters set, some laser engraving machines cannot maintain stable laser output during operation, resulting in less-than-ideal cutting results.

[0004] How to solve the above problems and provide a laser engraving and cutting device and a laser engraving and cutting system that can adaptively adjust the working state and have good engraving and cutting effects are what those skilled in the art need to consider.

[0005] Summary of the Invention

[0006] The embodiment of the present application provides a laser engraving and cutting device, including a laser component, a spectroscope, a first detection device and a second detection device;

[0007] a laser component for emitting laser light, at least part of which is emitted in a first direction for carving a workpiece to be processed and forms a first reflected light after being reflected by the workpiece to be processed;

[0008] A beam splitter is located between the laser component and the workpiece to be processed, and includes a first reflective surface, the first reflective surface being configured to face the laser component and forming a first angle with the first direction; at least a portion of the laser light emitted by the laser component is reflected by the first reflective surface and forms a second reflected light along a second direction;

[0009] a first detection device, configured to receive the first reflected light, detect and feed back a reflected light signal of the first reflected light; and

[0010] The second detection device is used to receive the second reflected light to detect and feed back a reflected light signal of the second reflected light.

[0011] Furthermore, the beam splitter further includes a second reflective surface, which is configured to be disposed toward the workpiece to be processed and to form a second angle with the first direction;

[0012] The first reflected light is reflected by the second reflecting surface to form a third reflected light. The first detecting device is used to receive the third reflected light to detect and feed back a reflection signal of the third reflected light.

[0013] Furthermore, the first detection device is provided on one side of the spectroscope and includes a first focusing mirror, a first attenuation plate, and a first sensor. The third reflected light passes through the first focusing mirror and the first attenuation plate in sequence and is received by the first sensor.

[0014] Furthermore, the second detection device is arranged on the other side of the spectroscope and includes a second focusing mirror, a second attenuation plate, and a second sensor. The second reflected light passes through the second focusing mirror and the second attenuation plate in sequence and is received by the second sensor.

[0015] Furthermore, the laser engraving and cutting device further includes a third detection device, which includes an air blowing component and a detection component. The air blowing component is configured to blow air toward the workpiece to be processed, and the detection component detects and feeds back environmental information of the workpiece to be processed.

[0016] Furthermore, the air blowing assembly includes an auxiliary air pump and an air nozzle, the air nozzle is connected to the air circuit of the auxiliary air pump, and the air nozzle is arranged on a side of the workpiece to be processed close to the laser part and is arranged toward the workpiece to be processed;

[0017] and / or, the environmental information includes any one or more of sound information, air pressure information, visual information or light information;

[0018] And / or, the detection component includes any one or more of a sound sensor, an air pressure sensor, a visual sensor or a light sensor.

[0019] Furthermore, the laser engraving and cutting device also includes a reflective detection component, which is located between the laser component and the workpiece to be processed and is used to block part of the first reflected light; the reflective detection component is provided with a light-transmitting port, and the light-transmitting port allows the laser passing through the spectrometer and the first reflected light that is not blocked to pass through.

[0020] Furthermore, the laser engraving and cutting device also includes a flat window mirror and a lens detection component. The flat window mirror is arranged between the reflective detection component and the workpiece to be processed, for the laser passing through the light-transmitting port and the first reflected light to pass through. The lens detection component is arranged on the side of the flat window mirror close to the reflective detection component and is in thermal contact with the flat window mirror; and / or, a temperature sensor is provided on the lens detection component to detect temperature changes of the lens detection component.

[0021] Furthermore, the laser engraving device further includes a third focusing mirror, which is disposed between the reflective detection component and the beam splitter and allows the laser and the first reflected light to pass through.

[0022] An embodiment of the present application also provides a laser engraving system, comprising a machine, a control device, and the above-mentioned laser engraving device, wherein the laser engraving device is transmission-connected to the machine, and the control device is signal-connected to the first detection device, the second detection device, and the third detection device, respectively, for obtaining a feedback signal. The control device is also signal-connected to the machine and the laser component, for adjusting the working status of the machine and the laser component according to the feedback signal.

[0023] Compared to the prior art, the laser engraving and cutting device of the present application, by placing a beam splitter in the laser light path, has a first reflective surface of the beam splitter that reflects part of the laser light to a first detection device, and can provide feedback on the current output power of the laser component based on the light intensity received by the first detection device. Simultaneously, the second reflective surface of the beam splitter reflects the laser light reflected from the slit again to a second detection device, and can provide feedback on the current state of the slit based on the light intensity received by the second detection device. Thus, the two opposing surfaces of the beam splitter respectively implement online monitoring of the output power and the state of the slit, achieving multiple functions with a relatively simple structure, which is conducive to the miniaturization of the device.

[0024] Compared with the existing technology, the laser engraving and cutting system of the present application receives and analyzes the detection signals collected by the first detection device, the second detection device and the third detection device through the control device, and dynamically adjusts the light output power of the machine and the laser component according to the detection signal of the first detection device, thereby improving the stability of the light output power of the laser component, and dynamically adjusts the various engraving and cutting parameters of the machine and the laser component according to the detection signals of the second detection device and the third detection device, thereby improving the engraving and cutting quality of the laser engraving and cutting system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic structural diagram of a laser engraving system in one embodiment of the present application.

[0026] FIG. 2 is a schematic diagram of signal connections of a control device of a laser engraving system in one embodiment of the present application.

[0027] FIG3 is a schematic structural diagram of a laser engraving and cutting device in one embodiment of the present application.

[0028] FIG4 is a schematic diagram of signal connections in one embodiment of the present application.

[0029] FIG5 is a schematic diagram of seam detection of a laser engraving and cutting device in one embodiment of the present application, in which a sound sensor is used for detection.

[0030] FIG6 is a schematic diagram of seam detection of a laser engraving and cutting device in one embodiment of the present application, in which an air pressure sensor is used for detection.

[0031] FIG7 is a schematic diagram of seam detection of a laser engraving and cutting device in one embodiment of the present application, in which a visual sensor is used for detection.

[0032] : Description of the main component symbols: Laser engraving and cutting system 200 Machine 110 Control device 120 First module 121 Second module 122 Third module 123 Laser engraving and cutting device 100 First reflected light 1 Second reflected light 2 Third reflected light 3 Laser component 10 Spectrometer 20 First reflecting surface 21 Second reflecting surface 22 First detection device 30 First focusing mirror 31 First attenuation plate 32 First sensor 33 Second detection device 40 Second focusing mirror 41 Second attenuation plate 42 Second sensor 43 Third detection device 50 Blowing assembly 51 Air nozzle 511 Auxiliary air pump 512 Detection assembly 52 Sound sensor 521 Air pressure sensor 522 Vision sensor 523 Workpiece to be processed 60 Cutting seam 61 Third focusing mirror 70 Reflective detection component 80 Light transmission port 81 Flat window mirror 90 Lens detection component 91 Temperature sensor 92 First direction X Second direction Y First angle Q1 Second angle Q2

[0033] The following specific embodiments will further illustrate this application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0034] The following description will refer to the accompanying drawings to more fully describe the contents of this application. Illustrated in the accompanying drawings are exemplary embodiments of the present application. However, the present application can be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make this application thorough and complete and to fully convey the scope of this application to those skilled in the art. Like reference numerals represent identical or similar components.

[0035] The terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to limit the present application. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms as well. In addition, when used herein, "includes" and / or "comprising" and / or "having" integers, steps, operations, components and / or components do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, components and / or groups thereof.

[0036] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. In addition, unless explicitly defined herein, terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and the content of this application, and will not be interpreted as idealized or overly formal meanings.

[0037] The specific implementation methods of the present application will be described in further detail below with reference to the accompanying drawings.

[0038] Referring to Figures 1 and 2, the laser engraving system 200 of this embodiment is used to engrave and / or cut a workpiece to engrave and / or cut the workpiece into a desired shape. The engraving and / or cutting mentioned in the subsequent text all refer to engraving and / or cutting. The laser engraving system 200 includes a machine 110, a control device 120, and a laser engraving device 100. The laser engraving device 100 is connected to the machine 110 by a transmission and is driven by the machine 110 to move in multiple degrees of freedom in space. The movements of the laser engraving device 100 driven by the machine 110 include but are not limited to lifting, lateral movement, rotation, etc.

[0039] The laser engraving device 100 includes a laser element 10, a spectroscope 20, a first detection device 30, a second detection device 40, and a third detection device 50. The first detection device 30, the second detection device 40, and the third detection device 50 are used to monitor the operating status of the laser engraving device 100 and obtain feedback signals based on the operating status.

[0040] The control device 120 is signal-connected to the first detection device 30, the second detection device 40, and the third detection device 50, respectively. The first detection device 30, the second detection device 40, and the third detection device 50 transmit feedback signals to the control device 120. The control device 120 is also signal-connected to the machine 110 and the laser component 10, and is used to adjust the operating status of the machine 110 and the laser component 10 based on the feedback signals, thereby achieving adaptive dynamic adjustment of the operating parameters of the laser engraving system 200 based on the current operating status of the laser engraving system 200, thereby improving the engraving quality of the laser engraving system 200.

[0041] 1 to 3 , the laser engraving and cutting device 100 of this embodiment is used to engrave and cut a workpiece 60 to be processed.

[0042] The laser element 10 is positioned toward the workpiece 60 and is configured to emit laser light. The laser light is emitted in a first direction X. After passing through the beam splitter 20, it impacts the workpiece 60. The energy released by the laser light melts and evaporates the workpiece 60, gradually forming a slit 61. As the slit 61 continues to expand, the workpiece 60 is carved or processed into a specific shape. The first direction X is perpendicular to the surface of the workpiece 60 facing the laser element 10.

[0043] As an example and not a limitation, the workpiece 60 to be processed can be wood, acrylic, metal sheet, etc. In particular, the workpiece 60 to be processed can also be a highly reflective material, and its surface facing the laser element 10 will cause part of the laser light to be reflected. During the engraving process, the laser is facing the slit 61, and the laser light will be reflected by the wall surface formed by the workpiece 60 at the slit 61. This wall surface is generally irregular in shape. The projection direction of the first reflected light 1 formed after the laser light is reflected is roughly divergent. At least a portion of the roughly divergent first reflected light 1 will be projected toward the beam splitter 20 in the opposite direction of the first direction X. If the slit 61 completely penetrates the workpiece 60 to be processed, part of the laser light will pass through the slit 61, and the remaining part of the laser light will be reflected to form the first reflected light 1, resulting in a reduction in the total light intensity of the first reflected light 1.

[0044] The spectrometer 20 is located between the laser component 10 and the workpiece 60 to be processed. The laser component 10, the spectrometer 20, and the workpiece 60 to be processed are arranged in sequence along the first direction X. The spectrometer 20 includes a first reflecting surface 21 and a second reflecting surface 22. The first reflecting surface 21 and the second reflecting surface 22 are side surfaces on opposite sides of the spectrometer 20. The first reflecting surface 21 faces the laser component 10 and is set at a first angle Q1 with the first direction X. Another portion of the laser light emitted by the laser component 10 is reflected by the first reflecting surface 21 and forms a second reflected light 2 along the second direction Y. The second reflecting surface 22 faces the workpiece 60 to be processed and is set at a second angle Q2 with the first direction X. The first reflected light 1 projected toward the spectrometer 20 is reflected by the second reflecting surface 22 and forms a third reflected light 3.

[0045] For purposes of illustration and not limitation, the first angle Q1 is 45°, and in this case, the second direction Y is perpendicular to the first direction X. As mentioned above, the first reflective surface 21 and the second reflective surface 22 are parallel, and at least a portion of the first reflected light 1 is projected onto the second reflective surface 22 in a direction opposite to the first direction X. The second angle Q2 formed between this portion of the first reflected light 1 and the second reflective surface 22 is also 45°.

[0046] It is understandable that the first angle Q1 may also be other angles, which can be designed by those skilled in the art according to actual conditions. Correspondingly, the second angle Q2 may also be other angles, which can be designed by those skilled in the art according to actual conditions.

[0047] The first reflecting surface 21 and the second reflecting surface 22 are arranged in parallel. When the laser light enters the beam splitter 20 from the first reflecting surface 21, it undergoes a first refraction. When the laser light passes through the beam splitter 20 and is projected out of the second reflecting surface 22, it undergoes a second refraction. After the first and second refractions, the direction of the optical path of the laser light remains unchanged, that is, the laser light passing through the beam splitter 20 continues to be projected along the first direction X.

[0048] In particular, the side surfaces of the beam splitter 20 on opposite sides are coated to form an anti-reflection film. The material of the anti-reflection film includes but is not limited to silicon dioxide, titanium dioxide, magnesium oxide, and aluminum oxide. While increasing the transmittance of the laser, it can also increase the reflection effect of the beam splitter 20 on the laser and the first reflected light 1.

[0049] It can be understood that the anti-reflection film can be one layer or multiple layers, and each layer of the anti-reflection film is independently prepared by selecting relevant materials according to needs.

[0050] As an example and not a limitation, the anti-reflection film in the embodiment of the present application is an anti-reflection film; of course, in other embodiments, those skilled in the art can design according to actual needs.

[0051] The second detection device 40 is disposed on the optical path of the second reflected light 2 , and receives the second reflected light 2 for detecting and feeding back a reflected light signal of the second reflected light 2 .

[0052] The first detection device 30 is disposed on the optical path of the third reflected light 3 , and receives the third reflected light 3 , and is used for detecting and feeding back a reflected light signal of the third reflected light 3 .

[0053] Thus, the laser engraving device 100 of the present application, by arranging a beam splitter 20 in the optical path of the laser, allows the first reflective surface 21 of the beam splitter 20 to reflect part of the laser light to the first detection device 30, and can provide feedback on the current optical output power of the laser component 10 based on the light intensity received by the first detection device 30. At the same time, the second reflective surface 22 of the beam splitter 20 reflects the laser light reflected at the slit 61 again to the second detection device 40, and can provide feedback on the current state of the slit 61 based on the light intensity received by the second detection device 40. Thus, the two opposite surfaces of the beam splitter 20 respectively realize online monitoring of the optical output power and online monitoring of the state of the slit 61, achieving multiple functions with a relatively simple structure, which is conducive to the miniaturization design of the device.

[0054] Referring again to Figures 3 and 4 , in one embodiment, the first detection device 30 is disposed on one side of the beam splitter 20 and includes a first focusing lens 31, a first attenuation plate 32, and a first sensor 33. As described above, the second angle Q2 is 45°. Therefore, the third reflected light 3 formed by the first reflected light 1 reflecting off the second reflective surface 22 is projected along the second direction Y. The first focusing lens 31, the first attenuation plate 32, and the first sensor 33 are spaced apart along the second direction Y so that the optical axes of the first focusing lens 31 and the first attenuation plate 32 are parallel to the second direction Y.

[0055] The first focusing lens 31 and the first attenuation plate 32 sequentially allow the third reflected light 3 to pass through, so that the third reflected light 3 is focused after passing through the first focusing lens 31 and its light intensity is reduced after passing through the first attenuation plate 32 to prevent damage to the first sensor 33. The first sensor 33 is used to receive the third reflected light 3 projected from the first attenuation plate 32.

[0056] It is worth noting that the first sensor 33 in this embodiment is a light sensor, which can detect the intensity of light and thus feed back a first light intensity signal after receiving the third reflected light 3 .

[0057] It is understood that the first sensor 33 may also be another type of sensor, such as an image sensor, and the corresponding feedback signal may be image information. Those skilled in the art may reasonably select the type of sensor based on actual needs and feedback the corresponding signal / information based on the specific sensor type.

[0058] The first sensor 33 is connected to the control device 120 by signal and can transmit the first light intensity signal to the control device 120. The control device 120 has a built-in first module 121. The first module 121 is preset with multiple first light intensity standard values, and the multiple first light intensity standard values ​​are divided into at least three light intensity intervals according to the light intensity. The at least three light intensity intervals include but are not limited to a cut-through prediction interval, a non-cut-through prediction interval, and a light intensity alarm interval. All values ​​in the cut-through prediction interval are smaller than any value in the non-cut-through prediction interval. The values ​​of the non-cut-through prediction interval and the light intensity alarm interval may partially overlap, or the values ​​of the non-cut-through prediction interval and the light intensity alarm interval may not overlap at all.

[0059] It is understood that the first light intensity standard value is the result of a pre-production cutting state test of the laser engraving device 100. During the cutting state test, the laser engraving device 100 is tested under standard test conditions, which include, but are not limited to, the models of the laser component 10, the beam splitter 20, the first focusing lens 31, the first attenuation plate 32, and the first sensor 33, as well as the relative positions of these components, and the material and dimensions of the workpiece 60 to be processed. After performing a large number of cutting state tests, the laser engraving device 100 collects the first light intensity standard values ​​corresponding to the slit 61 in both the through-cut and non-through-cut states, thereby dividing the first light intensity standard values ​​corresponding to the slit 61 in both the through-cut and non-through-cut states into a through-cut prediction interval and a non-through-cut prediction interval.

[0060] At the same time, the laser engraving and cutting device 100 needs to be adjusted before starting to work to ensure that its working environment and the workpiece 60 to be processed are consistent with the above-mentioned standard test conditions, so as to ensure the accuracy of the prediction results.

[0061] In particular, the carving state test can be performed multiple times under different test conditions, thereby obtaining the first light intensity standard value under different test conditions, which is convenient for subsequent selection and comparison.

[0062] When the value of the first light intensity signal received by the control device 120 falls into the light intensity alarm range, it indicates that the intensity of the third reflected light 3 is too high, and the intensity of the first reflected light 1 formed after the laser is reflected by the workpiece 60 is too high. The control device 120 controls the laser engraving device 100 to stop working to prevent damage to various components during the reflection process due to the excessive intensity of the first reflected light 1.

[0063] When the value of the first light intensity signal received by the control device 120 falls within the cut-through prediction interval, it indicates that the slit 61 is in a cut-through state, so that part of the laser light passes through the slit 61 , resulting in a smaller intensity of the third reflected light 3 .

[0064] When the value of the first light intensity signal received by the control device 120 falls within the non-cut-through prediction range, it indicates that the slit 61 is in a non-cut-through state. The control device 120 adjusts the output power of the laser element 10 and the operating parameters of the machine 110. By adjusting the operating parameters of the machine 110, parameters such as the engraving speed, engraving focal length, and air pump pressure can be adjusted.

[0065] At the same time, based on the above-mentioned detection method of the non-through state of the slit 61, the control device 120 can be set to a supplementary cutting mode and a process adaptive adjustment mode.

[0066] When the workpiece 60 to be processed has higher requirements for engraving and cutting accuracy, the supplementary cutting mode is selected, and the control device 120 can control the machine 110 to increase the engraving and cutting speed, and judge and save the real-time position information of the machine 110 that has not been cut through during the working process based on the real-time monitoring data of the engraving and cutting quality fed back by the light intensity of the third reflected light 3, and supplement the uncut positions after completing the first round of engraving and cutting, thereby achieving higher engraving and cutting accuracy.

[0067] When the workpiece 60 needs to be formed in one step, the process adaptive adjustment mode is selected. Based on the real-time monitoring data of the engraving quality fed back by the intensity of the third reflected light 3, the control device 120 controls the laser component 10 and the machine 110 to automatically adjust various engraving process parameters, such as the air pump pressure, light output power, engraving speed, and engraving focal length, so that the workpiece 60 can be cut through in one step.

[0068] Referring again to Figures 3 to 7 , in one embodiment, the laser engraving and cutting device 100 further includes a third detection device 50. The third detection device 50 includes an air blowing assembly 51 and a detection assembly 52. ​​The air blowing assembly 51 blows air toward the slit 61 to cause environmental changes at the slit 61, including but not limited to changes in air pressure, sound, and image. The detection assembly 52 detects and provides feedback on environmental changes at the slit 61.

[0069] Since the laser engraving device 100 generates a large amount of dust and engraving debris during operation, the provision of an air blowing assembly 51 can prevent the dust and debris from contaminating the lens. At the same time, some dust and debris may remain on the surface to be processed, interfering with the engraving effect. The provision of the air blowing assembly 51 can promptly blow away the dust and debris on the surface to be processed, thereby improving the engraving quality.

[0070] Specifically, the air blowing assembly 51 includes an auxiliary air pump 512 and an air nozzle 511. The air nozzle 511 is connected to the auxiliary air pump 512, and the auxiliary air pump 512 supplies air to the air nozzle 511. The air nozzle 511 is located on the side of the workpiece 60 near the laser element 10 and is positioned toward the slit 61, so that air is blown toward the slit 61 through the air nozzle 511. The detection assembly 52 includes one or more of an acoustic sensor 521, an air pressure sensor 522, and a visual sensor 523, and can detect the status of the slit 61 using one or more of these detection methods.

[0071] When the slit 61 is not cut through, the gas blown toward the slit 61 can only dissipate to the surroundings. When the slit 61 is cut through, part of the gas passes through the slit 61 and dissipates downward. The sound sensor 521 is provided at the gas nozzle 511, and the sound signal of the gas at the gas nozzle 511 is detected by the sound sensor 521. The sound sensor 521 is connected to the control device 120 signal and transmits the sound signal to the control device 120. The control device 120 is preset with a third module 123, and the third module 123 stores a standard sound signal, and divides it into a sound predicted cutting-through interval and a sound predicted non-cutting-through interval according to the size of the standard sound signal. The collection and setting of the standard sound signal, the sound predicted cutting-through interval and the sound predicted non-cutting-through interval in the third module 123 can refer to the above-mentioned first module 121 and will not be repeated here.

[0072] When the slit 61 is not cut through, the gas blown toward the slit 61 can only dissipate in all directions, with fewer paths for gas to dissipate. At this point, the air pressure below the gas nozzle 511 is relatively high. When the slit 61 is cut through, the path for gas to dissipate downward through the slit 61 increases, and at this point, the air pressure below the gas nozzle 511 is relatively low. An air pressure sensor 522 is provided at the gas nozzle 511, and the air pressure signal at the gas nozzle 511 is detected by the air pressure sensor 522. The air pressure sensor 522 is signal-connected to the control device 120 and transmits the air pressure signal to the control device 120. The third module 123 of the control device 120 also stores a standard air pressure signal, and divides it into an air pressure predicted cut-through interval and an air pressure predicted non-cut-through interval according to the size of the standard air pressure signal. The collection and setting of the standard air pressure signal, the air pressure predicted cut-through interval, and the air pressure predicted non-cut-through interval in the third module 123 can be referred to the first module 121 described above and will not be repeated here.

[0073] When slit 61 is cut through, the workpiece 60 generates dust containing powder particles during engraving. When air nozzle 511 blows air toward slit 61, the air entrains the dust and blows it downward through the slit 61. Illuminated by the laser beam passing through slit 61, the dust forms a bright light cluster. An image sensor is positioned below the workpiece 60 at the corresponding slit 61, detecting the bright light signal from the bright light cluster. However, when slit 61 is not cut through, the image sensor cannot detect the bright light signal. The image sensor is signal-connected to control device 120, transmitting the bright light signal to it. When control device 120 receives the bright light signal, slit 61 is cut through; otherwise, slit 61 is not cut through.

[0074] It is worth noting that the first light intensity signal, the sound signal, the air pressure signal, and the bright light signal can all be used to predict whether the slit 61 is cut through. Based on this, the control device 120 is pre-configured with a correlation model that integrates the first light intensity signal, the sound signal, the air pressure signal, and the bright light signal in a specific ratio to improve the accuracy of the prediction.

[0075] For example, the judgment of the cutting-through state by the first light intensity signal, sound signal, air pressure signal, and bright light signal can be recorded as a, b, c, and d respectively through the association model (the value is 0 when it is judged to be cutting-through, otherwise it is 1), and Q is used to indicate whether it is cutting-through. The above a, b, c, and d are integrated into the association judgment formula: Q = d*(a+b+c).

[0076] Based on the above correlation judgment formula, if Q = 0, it indicates no cut-through; if Q ≥ 1, it indicates a cut-through. This correlation judgment formula is based on the complex operating environment of the laser engraving and cutting device 100. The bright light signal is less subject to interference and most intuitively reflects whether the cut-through has occurred. Therefore, the bright light signal is used as the determining factor in the calculation. However, the first light intensity signal, sound signal, and air pressure signal are subject to more interference factors, so the influence of these three parameters on the judgment is reduced.

[0077] It is worth noting that the setting of the association model can be adaptively adjusted according to the actual test conditions and design requirements of the product.

[0078] Referring again to Figures 3 and 4 , in one embodiment, the laser engraving and cutting device 100 further includes a lens barrel (not shown), a third focusing lens 70, a reflective detection component 80, a lens detection component 91, and a planar mirror 90. The third focusing lens 70, the reflective detection component 80, the lens detection component 91, and the planar mirror 90 are disposed between the beam splitter 20 and the workpiece 60, and are sequentially disposed within the lens barrel along the first direction X.

[0079] The third focusing mirror 70 can gather the laser projected from the spectrometer 20 to make the laser more concentrated. The reflective detection component 80 is made of opaque material and is provided with a light-transmitting port 81. The light-transmitting port 81 is provided at the center of the reflective detection component 80, and the direction of the axis of the light-transmitting port 81 is parallel to the first direction X. The size of the light-transmitting port 81 is related to the spot size of the laser emitted by the laser component 10 and the actual distance between the third focusing mirror 70 and the reflective detection component 80. When designing the size of the light-transmitting port 81 and the distance between the third focusing mirror 70 and the reflective detection component 80, it is necessary to ensure that all lasers passing through the third focusing mirror 70 can pass through the light-transmitting port 81 to prevent the laser from directly acting on the reflective detection component 80 to damage it and cause laser loss. When the laser is reflected on the workpiece 60 to be processed to form the first reflected light 1, the first reflected light 1 will be projected toward the reflective detection component 80. The reflective detection component 80 can block part of the divergent first reflected light 1 to prevent the first reflected light 1 from being too strong and damaging components such as the spectrometer 20. Another part of the first reflected light 1 will pass through the light-transmitting port 81 and be projected onto the spectrometer 20.

[0080] The flat window mirror 90 allows the laser light and the first reflected light 1 passing through the light transmission port 81 to pass through. The flat window mirror 90 does not affect the projection of the laser light and the first reflected light 1 passing through the light transmission port 81, and can block external dust and other impurities from entering the lens barrel. Some impurities will remain on the flat window mirror 90, and the laser acting on the impurities will produce a thermal effect, causing the temperature of the flat window mirror 90 to rise. The lens detection component 91 is attached to the side of the flat window mirror 90 close to the reflective detection component 80 and is in thermal contact with the flat window mirror 90, so that the heat generated by the flat window mirror 90 can be transferred to the lens detection component 91. A temperature sensor 92 is provided on the lens detection component 91. The temperature sensor 92 is used to detect the temperature change of the lens detection component 91, thereby obtaining a temperature signal. The temperature sensor 92 is connected to the control device 120 signal and transmits the temperature signal to the control device 120. The control device 120 is preset with a temperature threshold. When the temperature signal exceeds the temperature threshold, the control device 120 controls the alarm module (not shown) to alarm and controls the laser engraving device 100 to stop working, so that the user can clean the flat window mirror 90 in time to avoid affecting the engraving effect and damaging the flat window mirror 90 due to excessive temperature.

[0081] At the same time, the integrated arrangement of the temperature sensor 92, the lens detection component 91, and the flat window mirror 90 can reduce the required design space and lower the structural size.

[0082] Referring again to Figures 3 and 4 , in one embodiment, the second detection device 40 is disposed on the other side of the beam splitter 20 and includes a second focusing lens 41, a second attenuation plate 42, and a second sensor 43. The second focusing lens 41, the second attenuation plate 42, and the second sensor 43 are sequentially spaced apart along the second direction Y. The second sensor 43 is configured to receive the second reflected light 2 projected from the second attenuation plate 42.

[0083] The optical axis of the second focusing mirror 41 is parallel to the second direction Y, and the second focusing mirror 41 can focus the second reflected light 2 at the edge of the second focusing mirror 41 to increase the flux of the second reflected light 2 entering the second focusing mirror 41 .

[0084] The direction of the optical axis of the second attenuation plate 42 is parallel to the second direction Y, and the second attenuation plate 42 can absorb part of the second reflected light 2 projected from the second focusing mirror 41, thereby reducing the intensity of the second reflected light 2 emitted from the second attenuation plate 42, and preventing the second reflected light 2 from being too strong and causing damage to the second sensor 43.

[0085] It is worth noting that the second sensor 43 is a light sensor, which can detect the light intensity of light, and thus feed back a second light intensity signal after receiving the second reflected light 2.

[0086] The second sensor 43 is signal-connected to the control device 120 and can transmit the second light intensity signal to the control device 120. The control device 120 has a built-in second module 122, which is preset with multiple second light intensity standard values ​​and multiple output light power values. The output light power value is the output light power of the laser component 10, and the multiple output light power values ​​correspond one-to-one to the multiple second light intensity standard values. That is, when the laser component 10 emits laser light at one output light power value, the intensity of the second reflected light 2 formed after the laser is split by the spectroscope 20 is the second light intensity standard value corresponding to the current output light power value. Therefore, the current output light power of the laser component 10 can be fed back based on the second light intensity signal detected by the second sensor 43.

[0087] It is understood that the second light intensity standard value and the output light power value are the results of a power gradient test performed on the laser engraving device 100 before shipment. During the power gradient test, the laser engraving device 100 is tested under standard test conditions, which include, but are not limited to, the models of the laser component 10, beam splitter 20, second focusing lens 41, second attenuation plate 42, and second sensor 43, as well as the relative positions of these components. Furthermore, the laser engraving device 100 must be adjusted before operation to ensure that its operating environment is consistent with these standard test conditions, thereby ensuring the accuracy of the predicted results.

[0088] In some embodiments, the control device 120 may preset a standard power. The control device 120 receives the second light intensity signal and obtains the current output power of the laser component 10 by comparing the stored second light intensity standard value with the output power value. The control device 120 compares the current output power of the laser component 10 with its preset standard power and adjusts the output power of the laser component 10 based on the comparison result, thereby ensuring that the laser engraving device 100 can always operate at a constant power, improving the stability of its engraving effect, and ensuring the engraving and carving effect.

[0089] When adopting some embodiments, the control device 120 can also fit the output power-time curve according to the output power of the current laser component 10 obtained at different time points, thereby constructing a prediction model for the output power of the laser engraving device 100, which can make long-term reliability predictions for the laser engraving device 100, facilitate the analysis and screening of the laser engraving device 100 in a relatively short time during the testing and production stages, and avoid reliability problems after the subsequent products are delivered to users for use, thereby increasing after-sales costs.

[0090] The specific embodiments of the present application have been described above with reference to the accompanying drawings. However, those skilled in the art will appreciate that various modifications and substitutions may be made to the specific embodiments of the present application without departing from the scope of the present application. Such modifications and substitutions are within the scope of the present application.

Claims

1. A laser engraving and cutting device, characterized in that: include: A laser component, used for emitting laser light, at least part of which is emitted in a first direction for engraving and cutting the workpiece to be processed, and forms a first reflected light after being reflected by the workpiece to be processed; A beam splitter is located between the laser component and the workpiece to be processed, the beam splitter comprises a first reflection surface, the first reflection surface is configured to be disposed toward the laser component and to form a first angle with the first direction; another part of the laser light emitted by at least part of the laser component is reflected by the first reflection surface and forms a second reflected light along a second direction; A first detection device, used for receiving the first reflected light, detecting and feeding back a reflected light signal of the first reflected light; as well as, The second detection device is used to receive the second reflected light to detect and feed back a reflected light signal of the second reflected light.

2. The laser engraving and cutting device according to claim 1, characterized in that: The beam splitter further comprises a second reflective surface, which is configured to be disposed toward the workpiece to be processed and to form a second angle with the first direction; The first reflected light is reflected by the second reflecting surface to form a third reflected light. The first detection device is used to receive the third reflected light to detect and feed back a reflected light signal of the third reflected light.

3. The laser engraving and cutting device according to claim 2, characterized in that: The first detection device is disposed on one side of the spectroscope, and includes a first focusing mirror, a first attenuation plate, and a first sensor. The third reflected light passes through the first focusing mirror and the first attenuation plate in sequence and is received by the first sensor.

4. The laser engraving and cutting device according to claim 1, characterized in that: The second detection device is disposed at one side of the spectroscope, and includes a second focusing mirror, a second attenuation plate, and a second sensor. The second reflected light passes through the second focusing mirror and the second attenuation plate in sequence and is received by the second sensor.

5. The laser engraving and cutting device according to claim 1, characterized in that: The laser engraving and cutting device further includes a third detection device, which includes an air blowing component and a detection component. The air blowing component is configured to blow air toward the workpiece to be processed, and the detection component detects and feeds back environmental information of the workpiece to be processed.

6. The laser engraving and cutting device according to claim 5, characterized in that: The air blowing assembly comprises an auxiliary air pump and an air nozzle, wherein the air nozzle is connected to the air circuit of the auxiliary air pump, and the air nozzle is arranged on a side of the workpiece to be processed close to the laser part and is arranged toward the workpiece to be processed; and / or, the environmental information includes any one or more of sound information, air pressure information, visual information or light information; And / or, the detection component includes any one or more of a sound sensor, an air pressure sensor, a visual sensor or a light sensor.

7. The laser engraving and cutting device according to claim 1, characterized in that: The laser engraving and cutting device also includes a reflective detection component, which is located between the laser component and the workpiece to be processed and is used to block part of the first reflected light; the reflective detection component is provided with a light-transmitting port, and the light-transmitting port allows the laser passing through the beam splitter and the first reflected light that is not blocked to pass through.

8. The laser engraving and cutting device according to claim 7, characterized in that: The laser engraving and cutting device further comprises a flat window mirror and a lens detection component, wherein the flat window mirror is arranged between the reflective detection component and the workpiece to be processed, and allows the laser passing through the light-transmitting port and the first reflected light to pass through; The lens detection component is arranged on a side of the flat window mirror close to the reflective detection component and is in thermal contact with the flat window mirror; and / or, a temperature sensor is provided on the lens detection component to detect temperature changes of the lens detection component.

9. The laser engraving and cutting device according to claim 7, characterized in that: The laser engraving device further includes a third focusing mirror, which is disposed between the reflective detection element and the beam splitter and allows the laser and the first reflected light to pass through.

10. A laser engraving and cutting system, characterized in that: It includes a machine, a control device and the laser engraving and cutting device as described in any one of claims 1 to 9, wherein the laser engraving and cutting device is transmission-connected to the machine, the control device is signal-connected to the first detection device, the second detection device and the third detection device respectively for obtaining feedback signals, and the control device is also signal-connected to the machine and the laser component for adjusting the working states of the machine and the laser component according to the feedback signals.

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