Cooling circuit device and heat pump

Abstract

The invention relates to a cooling circuit device (10) for a heat pump, comprising a first cooling circuit module (11) and a second cooling circuit module (12). The cooling circuit modules (11, 12) form at least one part of a heat pump refrigerant circuit in which a refrigerant circulates. The first cooling circuit module (11) comprises a compressor for compressing the refrigerant and flow paths for the refrigerant. The second cooling circuit module (12) comprises an expansion valve (12e, 12f) for expanding the refrigerant and flow paths for the refrigerant. The first cooling circuit module (11) is fluidically connected to the second cooling circuit module (12).

Description

[0001] REFRIGERATING CYCLE AND HEAT PUMP

[0002] Field of the invention

[0003] The present invention relates to a refrigeration circuit device for a heat pump and a heat pump for heating and / or cooling a building. In particular, a high degree of integration of the individual components of a refrigerant circuit is intended to achieve a particularly compact design of the refrigeration circuit device with as few refrigerant lines as possible. This also enables particularly reliable and low-maintenance operation of the heat pump.

[0004] Background of the invention

[0005] Modern heat pumps are characterized by their high efficiency, making them particularly attractive from an ecological and economic perspective for heating and / or cooling a building, especially a residential or office building. Heating with ambient heat is, on the one hand, climate-friendly. On the other hand, many energy suppliers have been offering special heat pump tariffs for several years that are more financially attractive than a standard electricity tariff.

[0006] German patent application DE 10 2018 102 670 A1 describes a heat pump 1 with an integrated buffer storage tank 3, which is schematically illustrated in Fig. 1. The heat pump system 10 illustrated in Fig. 1 consists, in a known manner, of a heat pump 1 and a heat sink 2. As heat sink 2, a heating circuit 2.1 with a plurality of radiators 2.3 and a hot water tank 2.2 are illustrated as an example in Fig. 1. During normal operation or heating mode, ambient heat is transferred from the heat pump 1 to the heat sink 2.

[0007] The heat pump system 10 has a heat exchanger 6 operating as a condenser and through which a heating circuit medium flows. An outlet 3.2 of the buffer tank 3 is connected upstream of an inlet 6.2 of the heat exchanger 6, as seen in the flow direction of the heating circuit medium. The heating circuit medium flows via a return line RL from the heat sink 2 or from the outlet 3.2 of the buffer tank 3 towards the heat pump 1, which is indicated in Fig. 1 by an arrow pointing to the left. Correspondingly, the heating circuit medium flows via a flow line VL from the heat pump to the heat sink 2 or to the inlet 3.1 of the buffer tank 3, which is indicated in Fig. 1 by an arrow pointing to the right.

[0008] The heat pump system 10 shown in Fig. 1 consists of two interconnected system components, one of which is located inside the building and one outside the building. Such a configuration is also referred to as a split heat pump. The two system components are usually referred to as the outdoor unit (ODU) and the indoor unit (IDU). The refrigerant circulates between the outdoor unit (ODU) and the indoor unit (IDU). In this embodiment, the buffer tank 3 is also located in the indoor unit (IDU). In a known monoblock heat pump, the outdoor unit (ODU) and the indoor unit (IDU) are arranged in a common housing.

[0009] A heating circuit pump 7 for circulating the heating circuit medium is arranged between the inlet 6.2 of the heat exchanger 6 on the return line RL and the buffer tank 3. Furthermore, a temperature sensor 11 for measuring the return temperature of the heating circuit medium is arranged in the return line RL.

[0010] During normal operation, the refrigerant of the heat pump 1 absorbs ambient heat via the outdoor unit ODU (Fig. 1 shows a schematic of the evaporator with a fan 8). The refrigerant is then transported via a compressor 9.1 to the heat exchanger 6, which acts as a condenser, where it transfers the absorbed heat to the heating circuit medium. The refrigerant is then expanded in a known manner via an expansion valve 9.2 before returning to the evaporator 5. From the heat exchanger 6, the heating circuit medium initially flows via the flow line VL to a valve 4, which is designed, for example, as a 4 / 3-way valve. Depending on requirements, the heating circuit medium is then directed to the heating circuit 2.1 with the radiators 2.3 and / or to the hot water tank 2.2. The cooled heating circuit medium returns via the return line RL through the inlet 6.2 into the heat exchanger 6 to close the circuit.

[0011] Furthermore, international patent application WO 2010 / 014878 A1 discloses a refrigeration circuit device consisting of several refrigeration circuit components and several refrigeration circuit lines connecting the refrigeration circuit components. At least part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding, thereby reducing the number and length of lines in the refrigerant circuit.

[0012] As defined by Wikipedia (see https: / / de.wikipedia.org / wiki / Urformen), the term "primary forming" here and in the following description refers to a main group of manufacturing processes in which a solid body with a geometrically defined shape is produced from a formless material or blank. Primary forming can include, in particular, a milling process, a casting process, a sintering process, an additive process, and the like. As an alternative to primary forming, one-piece or monolithic components can also be manufactured by forming, e.g., by deep drawing a single sheet.

[0013] The adjective "monolithic" used above (again as in Wikipedia: https: / / de.wikipedia.org / wiki / Monolith) here and in the following description means something like "compact" or "cast in one piece" or "integral" or "continuous". A monolithic body formed by primary forming can, for example, be a workpiece that is manufactured from a single, continuous metal blank by machining such as milling. Another example of a monolithic body formed by primary forming is a workpiece that is formed from metal powder or plastic powder by additive processes (e.g. laser deposition welding, sintering, or 3D printing). Furthermore, for example, a component manufactured by an injection molding process or by a metal casting process can be a monolithic body formed by primary forming.

[0014] The refrigerant circuit of a heat pump of the type described above according to the prior art can comprise a plurality of lines, which can be made, for example, of copper and / or other metals and / or plastics. These lines can be designed, in particular, as pipes and / or hoses and can thus be rigid or movable. Individual pipe sections and / or hose sections can be permanently connected, for example, by soldering, pressing, welding, or similar methods, or they can be detachably connected to one another using a sealed coupling. There is a risk of leaks occurring, particularly at such detachable connections.

[0015] Since copper, in particular, is a raw material that can be expensive to manufacture, there is a need to keep the total length of all the lines in the refrigeration circuit as short as possible. Reducing the total length of the lines can also advantageously reduce the amount of refrigerant required. Furthermore, the number of connections between individual line sections should be reduced. This can significantly reduce the risk of leaks. This can be particularly advantageous when using a flammable and / or toxic and / or environmentally harmful refrigerant. Due to its flammability, it is particularly advantageous when using the natural refrigerant R290 (propane) to keep the total amount of refrigerant and the risk of leaks as small as possible.

[0016] Reducing the overall length of pipes and the number of connections can also enable a more compact design and thus a lower weight of the heat pump. This can be particularly advantageous for monoblock heat pumps. Small size and low weight can be advantageous, for example, in the manufacture and installation of heat pumps, and especially when retrofitting a heat pump heating system in an older building.

[0017] Furthermore, reducing the overall length of pipes can also reduce the noise emitted by the heat pump. Especially in residential buildings, it is advantageous if a heat pump can operate as quietly as possible. This can also advantageously make it possible to dispense with relief pipes, which are used in some heat pumps to prevent vibrations.

[0018] One approach to reducing the number of lines in a refrigeration circuit is described, for example, in German patent application DE 102022116 807. The refrigeration circuit device disclosed therein comprises a plurality of refrigeration circuit components and a plurality of refrigeration circuit lines connecting the refrigeration circuit components to one another. At least one part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding. An interface connected to one part of one refrigeration circuit component or to one refrigeration circuit line is arranged on this body for the external connection of one of the remaining refrigeration circuit components or one of the remaining refrigeration circuit lines.

[0019] In other words, parts of the refrigeration circuit components and parts of the refrigeration circuit lines are formed in a body that is essentially a monolithic block produced by primary molding. This makes it possible to provide a particularly compact device for connecting additional circuit components and lines. Such a block can also be manufactured particularly easily.

[0020] Problem underlying the invention Starting from the known prior art, it is an object of the present invention to increasingly integrate refrigeration circuit components and refrigerant lines in the smallest possible number of components or assemblies in order to provide an improved heat pump with the lowest possible weight, the smallest possible size and the shortest possible total length of lines in the refrigerant circuit.

[0021] Inventive solution

[0022] According to a first aspect of the present invention, a refrigeration circuit device for a heat pump is provided according to claim 1. A second aspect of the present invention relates to a heat pump for heating and / or cooling a building according to claim 20. Such a heat pump is typically also used for hot water production. A heat pump according to the invention for heating and / or cooling a building comprises a refrigeration circuit device according to the present invention. Further aspects of the present invention are the subject of the dependent claims, the drawings, and the following description of exemplary embodiments.

[0023] To switch the heat pump's operation between heating and cooling, the flow direction of the refrigerant in the refrigerant circuit can preferably be reversed, for example, using a 4 / 2-way valve or similar. In this case, the condenser and the evaporator each exchange their functions. In other words, the condenser becomes the evaporator, and the evaporator becomes the condenser.

[0024] A "module" or "refrigeration circuit module" is preferably understood here as a component or assembly of the refrigerant circuit that comprises several parts or components, which are often, but not necessarily, arranged in a module housing or on or in a support, in such a way that they are designed to be preassembled together in a single unit. Generally speaking, in such a modularized design, the parts or components are assembled into modules along predefined locations. Accordingly, the resulting assembly or component can be transported as a unit and installed into or removed from the refrigeration circuit device.

[0025] Preferred embodiments of the invention

[0026] Advantageous training and further education, which can be used individually or in combination, are the subject of the dependent claims.

[0027] The refrigeration circuit device comprises a first refrigeration circuit module and a second refrigeration circuit module. According to preferred embodiments, the refrigeration circuit device can have more than two refrigeration circuit modules. The refrigeration circuit modules form at least part of a refrigerant circuit of the heat pump. In preferred embodiments, the entire refrigerant circuit of the heat pump can be formed by the refrigeration circuit modules of the refrigeration circuit device.

[0028] A refrigeration circuit module combines components of a sub-process of a refrigerant circuit of a heat pump into a compact assembly, so that at least part of the refrigerant circuit or the entire refrigerant circuit of the heat pump can be constructed by combining several refrigeration circuit modules, whereby the individual refrigeration circuit modules can each be exchanged for a similar refrigeration circuit module in order to enable the simplest possible production and maintenance of the heat pump.

[0029] In this context, a "module" or "refrigeration circuit module" is preferably understood to mean a component or assembly of the refrigerant circuit that can be transported as a unit and installed in or removed from the refrigerant circuit device. The individual subprocesses in the refrigerant circuit of a heat pump, simplified in terms of volume, include the compression of the refrigerant, the condensation of the refrigerant, the expansion of the refrigerant, and the evaporation of the refrigerant. Compression preferably takes place in a compressor. Condensation takes place in a first heat exchanger, referred to as a condenser, where the refrigerant transfers the absorbed heat to a heating circuit medium of an external heating circuit. The expansion of the refrigerant takes place in an expansion valve.The evaporation of the refrigerant takes place, for example, in a second heat exchanger, which is called an evaporator, where the refrigerant preferably absorbs the ambient heat.

[0030] Further preferably, a further circuit carrying the heating circuit medium can be connected, which is connected to an evaporator where the heating circuit medium absorbs ambient heat. Advantageously, both heat exchangers arranged in the refrigerant circuit can be designed as compact plate heat exchangers, while the relatively large evaporator, in the case of an air-water heat pump, for example, can be arranged spatially separate from the installation space of the refrigerant circuit.

[0031] Certain subcomponents such as sensors, actuators, drives, electronics and the like can be arranged as external functional assemblies on an outer surface of a refrigeration cycle module and interact with components arranged inside the refrigeration cycle module.

[0032] Furthermore, a refrigeration cycle module is characterized in that at least some of the flow paths for the refrigerant for supplying and discharging the refrigerant to and from the respective sub-process are arranged inside the refrigeration cycle module. This eliminates the need for conventional lines such as pipes or hoses entirely or at least partially, thus achieving a multitude of advantages. A refrigeration cycle module can preferably also integrate more than one sub-process into a single assembly. By increasing the degree of integration, the refrigeration cycle device can be constructed even more compactly, saving space and weight and further reducing the overall length of refrigerant lines.

[0033] For example, the refrigeration circuit device according to the invention with refrigeration circuit modules can reduce the risk of leaks in which refrigerant escapes. Furthermore, the total amount of refrigerant required in the refrigerant circuit can be reduced. This can contribute to the safe operation of the heat pump, particularly when using a flammable, highly flammable and / or toxic refrigerant.

[0034] In addition, by integrating the refrigerant lines into the refrigeration circuit modules, low-vibration operation of the heat pump can be achieved, so that the heat pump can be operated particularly quietly and the service life of the components or the heat pump can be improved.

[0035] The first refrigeration circuit module comprises a compressor for compressing a refrigerant and flow paths for the refrigerant. Accordingly, the first refrigeration circuit module can also be referred to as a compressor module. The first refrigeration circuit module thus integrates all components required for the refrigerant compression process, as well as at least some of the flow paths to and from the compressor, i.e., a compressor supply and return.

[0036] The second refrigeration circuit module includes an expansion valve for expanding the refrigerant and flow paths for the refrigerant. The second refrigeration circuit module can therefore also be referred to as an expansion module. The expansion valve can be a thermostatic expansion valve, an electronic expansion valve, or a throttle. The expansion valve's characteristic curve can be linear or equal-percentage, for example. The expansion valve can be controlled unipolarly or bipolarly. One function of the expansion valve is to keep the refrigerant circuit balanced and ensure an even distribution of the refrigerant throughout the circuit.

[0037] The first refrigeration circuit module is fluidly connected to the second refrigeration circuit module. Preferably, the first refrigeration circuit module can be directly connected via a suitable interface on an outer surface of the first refrigeration circuit module to a corresponding interface on an outer surface of the second refrigeration circuit module. Openings for connecting the flow paths are arranged in these interfaces. The interfaces of the first refrigeration circuit module and the second refrigeration circuit module can preferably be arranged in one plane.

[0038] The first refrigeration circuit module and the second refrigeration circuit module can each have a plurality of connections to establish a flow connection between the first refrigeration circuit module and the second refrigeration circuit module. These connections can, for example, be combined into interfaces to enable simple and time-saving connection of the refrigeration circuit modules. Consequently, assembly and maintenance of the refrigeration circuit device can be carried out particularly easily and time-savingly.

[0039] The flow paths in the refrigeration circuit modules can preferably have connecting pieces and connectors. The connecting pieces are, for example, sections of the flow paths, each of which can be arranged in a plane running through the refrigeration circuit module. The connectors are preferably sections of the flow paths, each of which can be arranged perpendicular to the plane, for example. This allows for a particularly simple and space-saving design that is easy to manufacture.

[0040] At the ends of the connecting pieces, connections are preferably arranged as interfaces for connecting to corresponding connections of adjacent refrigeration circuit modules. This advantageously allows for the implementation of predefined interfaces between the refrigeration circuit modules, which allow individual refrigeration circuit modules to be replaced, in particular, with functionally identical refrigeration circuit modules that may also have different internal designs. This allows for a high degree of modularity, allowing different designs of refrigerant circuits to be implemented by exchanging individual refrigeration circuit modules.

[0041] The second refrigeration circuit module preferably comprises a first expansion valve and a second expansion valve. In preferred embodiments, the second refrigeration circuit module can also have a third expansion valve. The expansion valves can each be arranged in different flow paths in the second refrigeration circuit module. For example, by providing switching valves, the various expansion valves can be integrated into the active circuit depending on the desired configuration, thus enabling different refrigerant circuits to be implemented.

[0042] In preferred embodiments, the second refrigeration circuit module can comprise one or more reversing valves for switching between branches of the refrigerant circuit and / or for reversing the flow direction of the refrigerant. A reversing valve can be designed, for example, as a 4 / 3-way valve or a 4 / 2-way valve. The second refrigeration circuit module can thus also be referred to as a valve module in which a plurality of valves are arranged.

[0043] According to a preferred embodiment, the second refrigeration circuit module, in particular, may have a bypass line instead of a reversing valve or in addition to a reversing valve. The bypass line is a flow path provided, for example, to enable hot gas bypass defrosting.

[0044] The second refrigeration circuit module can preferably have a phase separator. The phase separator can, in particular, be a refrigerant collector for collecting the refrigerant. Liquid refrigerant and / or gaseous refrigerant can be tapped from the phase separator.

[0045] A phase separator can also be referred to as an accumulator. The refrigerant receiver preferably serves as an expansion tank to regulate pressure in the refrigerant circuit. The phase separator can alternatively be designed as a liquid separator. For example, phase separation between liquid and gaseous refrigerant can occur in the refrigerant receiver. A refrigerant receiver is typically used in a high-pressure section of the refrigerant circuit. A liquid separator is typically used in a low-pressure section of the refrigerant circuit.

[0046] The second refrigeration cycle module may comprise a front part with a flat first connecting surface, a rear part with a flat second connecting surface and a flat sealing element, wherein the first connecting surface is arranged parallel to the second connecting surface and the sealing element is arranged between the first connecting surface and the second connecting surface.

[0047] A sealing element according to the invention is preferably a seal for sealing and / or thermal insulation. Depending on requirements, it can also have a particularly high thermal conductivity. Depending on the intended use, the sealing element can be made of a suitable material.

[0048] The front and rear sections of the second refrigeration cycle module can each be a monolithic body manufactured by primary molding. The front and rear sections can each be half-shell-shaped, so that connecting the front and rear sections creates a plurality of flow paths and / or a refrigerant collector for the refrigerant.

[0049] According to an alternative embodiment, the front and rear parts of a refrigeration cycle module according to the invention can be formed by forming. For example, the front and rear parts can be manufactured using a roll-bonding process. Particularly preferably, the sealing element can also be formed between them. Further preferably, the front and rear parts can each be formed by deep-drawing a single sheet metal.

[0050] The compressor of the first refrigeration circuit module is preferably a reciprocating piston compressor comprising a crankshaft and at least one piston connected to the crankshaft. A reciprocating piston compressor can be particularly advantageous because it can be operated with little or even no oil, particularly in the working chamber or at the contact points with the refrigerant or the refrigeration circuit. This can prevent the refrigerant from becoming mixed with oil. This can increase the longevity of the refrigerant, the refrigerant circuit, and the refrigerant-carrying components, so that the heat pump according to the invention can be operated with particularly low maintenance. Furthermore, the use of an additional oil separator in the refrigerant circuit can preferably be dispensed with, thereby reducing the complexity of the refrigerant circuit, which in turn can simplify production and reduce costs.In particular, the amount of required refrigerant can be advantageously reduced because it is not bound to oil. Furthermore, particularly reliable operation of the heat pump can be ensured because sufficient lubrication is not required at operating points, which can be particularly advantageous, for example, during start-up or switching. The advantages described here can also contribute to improving the overall energy efficiency of the heat pump or the entire HVAC (heating, ventilation, air conditioning, and refrigeration) system.

[0051] The reciprocating piston compressor preferably has an even number of cylinders. For example, the reciprocating piston compressor can have two, four, six, or eight cylinders. An even number of cylinders can preferably be arranged in pairs along a common cylinder axis. When cylinders are arranged in pairs, the vibrations generated by the movement of the pistons in the cylinders can be particularly advantageously compensated in pairs. The reciprocating pistons of a cylinder pair can each have a phase shift of 180 degrees. This means that the pistons each move in opposite directions, so that the generated vibrations compensate each other. This allows for particularly low-vibration operation of the compressor.

[0052] A particularly preferred reciprocating piston compressor has three pairs of cylinders, each arranged at an angle of 60 degrees to each other. Such an arrangement is also referred to as a star arrangement. This advantageously allows first- and second-order oscillating inertial forces to be avoided or at least reduced, thus achieving particularly low-vibration operation of the compressor.

[0053] The cylinder axes of the three cylinder pairs are preferably located in a common plane. The cylinders are particularly preferably arranged in a star configuration. This allows for a particularly compact and flat compressor design, thus saving space.

[0054] The crankshaft is preferably arranged between the cylinders. With a star-shaped cylinder arrangement, the crankshaft can be arranged at a center point between the plurality of cylinders. This allows the forces acting on the crankshaft to be compensated and first- and second-order vibrations to be avoided or at least reduced.

[0055] The pistons are preferably driven by the rotating crankshaft in such a way that, during compression, they move away from the crankshaft in pairs in opposite cylinders in the same phase. In this way, a particularly favorable arrangement can be created in which the occurring oscillating first and second order inertial forces can be avoided or at least reduced particularly easily. The flow paths of the first refrigeration circuit module can, in particular, comprise a supply channel and a return channel. The return channel is located on a low-pressure side and supplies the refrigerant to the compressor, for example via inlet valves. The supply channel is located on a high-pressure side and carries the compressed refrigerant away from the compressor towards an evaporator in the refrigeration circuit.

[0056] The supply channel and the return channel can preferably each be annular. The supply channel and the return channel are preferably arranged parallel to each other, and an axis of symmetry of the supply channel and the return channel is preferably arranged perpendicular to the cylinder axes of the compressor. This allows a particularly compact design of the reciprocating piston compressor to be achieved, especially if the reciprocating piston compressor has three cylinder pairs arranged in a star configuration.

[0057] Thermal insulation is preferably arranged between the supply and return ducts. Thermal insulation can be achieved, for example, by arranging an insulating material with very low thermal conductivity or by creating an air gap or a vacuum. With an air gap, heat transfer by convection is very low. Through an air gap or a vacuum, heat can thus be transferred almost exclusively by radiation, which is negligible at the temperatures occurring in a refrigeration circuit. Heat conduction along the surrounding material can also preferably be very small. Thus, thermal insulation can reduce heat transfer between the supply and return to a negligible level.

[0058] The first refrigeration circuit module preferably comprises a drive unit for driving the crankshaft of the compressor. The drive unit may, for example, comprise an electric motor and is preferably arranged on an outer surface of the first refrigeration circuit module. Furthermore, the first refrigeration circuit module may comprise a control unit for controlling the drive unit. The drive unit preferably comprises an inverter for controlling a rotational speed of the compressor and thus a compression power of the compressor.

[0059] A preferred refrigeration circuit device comprises a third refrigeration circuit module, which includes a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit. The third refrigeration circuit module can thus also be referred to as a condenser module. The condenser can be a heat exchanger with a condenser, where the gaseous refrigerant condenses, thereby transferring heat to the heating circuit medium. Accordingly, the third refrigeration circuit module can also have connections for connecting lines of the external heating circuit.

[0060] A preferred refrigeration circuit device comprises a fourth refrigeration circuit module, which includes an evaporator for transferring heat from an ambient medium to the refrigerant. The fourth refrigeration circuit module can thus also be referred to as an evaporator module. The evaporator can be a heat exchanger at which the refrigerant absorbs heat from the ambient air, causing the refrigerant to evaporate.

[0061] According to a preferred embodiment, the evaporator in the fourth refrigeration cycle module can be a finned heat exchanger, as described, for example, in the published patent application No. DE 102010 021692 A2.

[0062] Alternatively, the fourth refrigeration circuit module can have a heat exchanger, preferably designed as a plate heat exchanger, where heat transfer takes place between the refrigerant and a heat transfer medium of a secondary circuit. This secondary circuit preferably includes an evaporator, where heat can be absorbed from an ambient medium, such as the ground in the case of a brine-water heat pump or the ambient air in the case of an air-water heat pump. Brine, for example, can be used as the heat transfer medium in the secondary circuit, pumped through a geothermal probe or a flat-plate geothermal collector.

[0063] In an air-to-water heat pump design, a large evaporator with a fan can be used, which can be arranged in the secondary circuit outside the refrigeration circuit. This allows the refrigeration circuit to be manufactured compactly and with a high degree of integration.

[0064] In a preferred embodiment of the invention, the fourth refrigeration circuit module can be arranged at a distance from the remaining refrigeration circuit modules. Pipes or hoses can be used as lines for the refrigerant. These lines include, in particular, a supply line and a return line. Each of the lines should be no longer than 100 cm, preferably no longer than 50 cm.

[0065] A preferred refrigeration circuit device comprises a fifth refrigeration circuit module, which includes an internal heat exchanger for transferring heat from a first sub-circuit of the refrigerant circuit to a second sub-circuit of the refrigerant circuit. Preferably, the internal heat exchanger can be used to cool an inverter.

[0066] A preferred refrigeration circuit device comprises a sixth refrigeration circuit module with a plurality of flow paths for the refrigerant and a plurality of connections for connecting the flow paths to other refrigeration circuit modules. The sixth refrigeration circuit module can also be referred to as a distribution module and serves as an interface between at least two of the remaining refrigeration circuit modules in order to interconnect the components in the refrigeration circuit modules according to a preferred embodiment of the refrigerant circuit and to distribute the refrigerant accordingly between the refrigeration circuit modules. For this purpose, two or more of the plurality of flow paths can branch and / or combine in the distribution module. Furthermore, the distribution module can have an expansion tank or refrigerant collector or liquid separator.

[0067] The sixth refrigeration circuit module is preferably fluidly connected to the second refrigeration circuit module. Further preferably, the sixth refrigeration circuit module is fluidly connected to the third refrigeration circuit module and / or to the fourth refrigeration circuit module and / or to the fifth refrigeration circuit module.

[0068] In a preferred embodiment, a portion of the refrigerant can be used after condensation to generate steam with the aid of an additional heat exchanger (e.g., the internal heat exchanger) and an additional expansion valve. This steam can be injected directly into the compressor. This additional steam injection can advantageously increase efficiency. Such steam injection can be used in the reciprocating compressor described in more detail below and, in alternative embodiments, particularly in a scroll compressor.

[0069] Preferably, thermal insulation can be arranged between the sixth refrigeration circuit module and the second refrigeration circuit module. The thermal insulation serves to prevent or at least minimize heat transfer between the refrigerant in the sixth refrigeration circuit module and the refrigerant in the second refrigeration circuit module. This allows, for example, a hot subcircuit to be thermally separated from a cold subcircuit of the refrigerant circuit.

[0070] According to a preferred embodiment, the sixth refrigeration circuit module comprises a front part with a flat first connecting surface, a rear part with a flat second connecting surface, and a flat sealing element. The first connecting surface is preferably arranged parallel to the second connecting surface. The sealing element is preferably arranged between the first connecting surface and the second connecting surface and prevents refrigerant from escaping at the interface between the first and second connecting surfaces.

[0071] The front part and the rear part can preferably each be a monolithic body manufactured by primary forming. Further preferably, the front part and the rear part are each half-shell-shaped, so that by connecting the front part and the rear part, a plurality of flow paths and / or a collecting tank for the refrigerant can be formed. The collecting tank can preferably assume different functions in the refrigerant circuit depending on its position in the refrigerant circuit.

[0072] At least one of the plurality of refrigeration cycle modules may comprise at least one of the following components: a refrigerant collector for collecting the refrigerant; a liquid separator; an internal heat exchanger; an economizer; a phase separator; a filter; an oil separator; a dryer; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for actuating a changeover valve and / or an expansion valve; a safety high-pressure switch; a coil for controlling a valve.

[0073] A preferred refrigeration cycle device comprises a housing surrounding the refrigeration cycle modules, wherein the housing preferably has an opening in which a fan or ventilator is arranged for drawing in ambient air. Preferably, an evaporator of the refrigeration cycle device is arranged in an air flow generated by the fan.

[0074] According to a preferred embodiment, the heat pump can be a monoblock heat pump, which can be designed in particular as an air-to-water heat pump. Such a monoblock heat pump preferably uses the energy of the ambient air for heating. Unlike split-system air-to-water heat pumps, the refrigerant circuit of a monoblock heat pump is located in a single unit. In other words, the refrigerant circuit of the monoblock heat pump is arranged in a common housing.

[0075] A monoblock heat pump is preferably installed outside the building to be heated (or cooled), for example, on the roof of the building or on a plot of land adjacent to the building. However, it is also possible to install the monoblock heat pump inside the building. Due to its compact design, a monoblock heat pump can be advantageously used as a retrofit solution for existing buildings. Compared to a split-system heat pump, the installation of a monoblock heat pump can be less labor-intensive, as no refrigerant lines need to be laid between the outdoor unit and the indoor unit. Furthermore, monoblock heat pumps can require less maintenance than split-system heat pumps.

[0076] Another exemplary embodiment of the heat pump according to the invention is a water-to-water heat pump, a brine-to-water heat pump, or a geothermal heat pump. In such an embodiment, the two heat exchangers (evaporator and condenser) can, in particular, be designed as plate heat exchangers.

[0077] According to a preferred embodiment, the heat pump has no more than two refrigerant-carrying lines arranged outside one of the refrigeration circuit modules. These two lines can, for example, be pipes or hoses connected to a heat exchanger in the refrigeration circuit. The two lines are each no longer than 100 cm, more preferably no longer than 50 cm, and most preferably no longer than 30 cm. Particularly preferred embodiments of the present invention can entirely dispense with such lines outside the refrigeration circuit modules. In other words, in such embodiments, all flow paths for the refrigerant are formed in the refrigeration circuit modules.

[0078] Particularly preferably, the refrigeration circuit device of the heat pump does not have any lines for the refrigerant arranged outside the refrigeration circuit modules. In such a design, the refrigeration circuit modules are directly connected to one another. In particular, the third refrigeration circuit module, the fourth refrigeration circuit module, and the fifth refrigeration circuit module, each of which preferably has a plate heat exchanger, can be connected directly to the sixth refrigeration circuit module. In this way, a very compact design of the refrigeration circuit device can be achieved.

[0079] A preferred heat pump further comprises an inverter thermally coupled to an internal heat exchanger of the refrigeration cycle device for cooling the inverter. The inverter can, for example, convert the frequency of an alternating current to drive the compressor. More preferably, the inverter can provide a three-phase current to operate the compressor. For example, an inverter can convert a supply voltage with a predetermined frequency into an alternating voltage with a different frequency to control a motor speed of the compressor.

[0080] Further preferably, a DC motor can be used. Such a motor can, for example, use a DC converter that generates a pulse-width modulation (PWM) signal.

[0081] Brief Description of the Drawings Further advantageous embodiments are described in more detail below with reference to an exemplary embodiment shown in the drawings, to which the invention is not limited, however. They show schematically:

[0082] Figure 1 Fig. 1 illustrates a heat pump heating system according to the state of the art.

[0083] Figure 2 Fig. 2 shows a perspective view of a refrigeration circuit device according to the invention.

[0084] Figure 3 Fig. 3 shows an exploded view of the refrigeration circuit device from Fig. 2.

[0085] Figure 4 Fig. 4 shows a second refrigeration circuit module and a sixth refrigeration circuit module of the refrigeration circuit device from Fig. 2.

[0086] Figure 5 Fig.5 illustrates a refrigeration circuit of the refrigeration circuit device of Fig.

[0087] 2.

[0088] Figure 6 Fig. 6 shows a section through the reciprocating compressor from Fig. 2 and 3.

[0089] Detailed description of implementation examples

[0090] In the following description of a preferred embodiment of the present invention, like reference numerals designate like or comparable components.

[0091] Fig. 2 shows a perspective view of a refrigeration circuit device 10 according to the invention for a heat pump. Fig. 3 shows an exploded view of the refrigeration circuit device 10 from Fig. 2. Fig. 4 shows a view of a second refrigeration circuit module 12 and a sixth refrigeration circuit module 16 of the refrigeration circuit device from Fig. 2. In Fig. 2, Fig. 3, and Fig. 4, a right-handed orthogonal coordinate system with axes X, Y, and Z is shown.

[0092] The refrigeration cycle device 10 in Fig. 2 and Fig. 3 comprises a first refrigeration cycle module 11, a second refrigeration cycle module 12, a third refrigeration cycle module 13, a fourth refrigeration cycle module 14, a fifth refrigeration cycle module 15, a sixth refrigeration cycle module 16, a motor 17, a control device 18, and coils 19.

[0093] The first refrigeration cycle module 11 comprises a reciprocating compressor comprising a crankshaft (not shown in Fig. 3) and six pistons 11f connected to the crankshaft. The reciprocating compressor comprises six cylinders 11e, each arranged in pairs along a common cylinder axis. A piston 11f is mounted in each cylinder 11e. Each cylinder 11e also has a valve flap 11g.

[0094] The three cylinder pairs are arranged in a star configuration and are each at an angle of 60 degrees to each other. The cylinder axes of the three cylinder pairs lie in a common plane, which is shown here parallel to the XY plane. This allows for a particularly compact and flat compressor design, thus saving space. The star-shaped arrangement of the reciprocating pistons allows the compressor to operate with particularly low vibration and therefore low noise. Furthermore, this minimizes another cause of leaks and improves service life or extends maintenance intervals.

[0095] The crankshaft (not shown in Fig. 3) is arranged between the cylinders and is driven by an external motor 17. The motor 17 is controlled by the control device 18. For example, an inverter can be used to control the motor 17. Furthermore, the control device 18 can also be used to control the compressor valves.

[0096] Fig. 6 shows a sectional view of the compressor through a cylinder 11e as well as through the supply line 11a and the return line 11b. The first refrigeration circuit module 11 comprises an annular supply line 11a and an annular return line 11b. The supply line 11a and the return line 11b are arranged concentrically around the crankshaft 11k, and the crankshaft 11k is arranged parallel to the Z-axis. The annular supply line 11a and the annular return line 11b are arranged parallel to one another, and an axis of symmetry of the supply line 11a and the return line 11b is arranged perpendicular to the cylinder axes of the compressor. This, together with the star-shaped arrangement of the cylinders 11e, enables a particularly compact design of the reciprocating compressor to be achieved.

[0097] A thermal insulation layer 11d is arranged between the supply channel 11a and the return channel 11b to minimize heat transfer between the return channel 11b and the supply channel 11a. A compressor housing 11c, also annular, serves as a structural support for the cylinders 11e as well as for the supply channel 11a and the return channel 11b.

[0098] The motor 17 is controlled by the control device 18, which drives the crankshaft. Furthermore, the control device 18 controls coils 19 to open or close switching valves or expansion valves in the second refrigeration circuit module 12. Furthermore, the control device 18 can control inlet and outlet valves 11g in the compressor. The control device 18 can thus control the heating or cooling output of the heat pump. The control device 18 can also receive measured values ​​from sensors, in particular temperature sensors, pressure sensors, and volume flow sensors.

[0099] The rotary motion of the crankshaft 11k is transmitted via connecting rods 11h into an upward and downward movement of the pistons 11f in the cylinders 11e, see Fig. 6. If a piston 11f moves outwards in the cylinder 11e (upwards in Fig. 6), it compresses the gaseous refrigerant contained therein, which is guided to the supply channel 11a by corresponding opening and closing of inlet and outlet valves 11g.

[0100] Refrigerant is admitted from the return line 11b into the pistons 11f via an inlet valve 11g as the piston 11f moves toward the crankshaft 11k. At bottom dead center, the inlet valve 11g is closed, and the piston 11f compresses the refrigerant in the cylinder 11e. Shortly before top dead center, the outlet valve 11g is opened toward the supply line 11a to release the compressed refrigerant via the compressor housing 11c to the supply line 11a. The thermal insulation 11d between the compressor housing 11c and the supply line 11a minimizes heat transfer between the supply line 11a and the return line 11b and can dampen pulsating movements of the refrigeration circuit module 11 that occur during operation due to the pressure difference between the return line 11b and the supply line 11a.

[0101] The second refrigeration circuit module 12 comprises a first expansion valve 12e and a second expansion valve 12f, as well as a plurality of flow channels for the refrigerant. Furthermore, the second refrigeration circuit module 12 comprises a reversing valve 12g for reversing the flow direction of the refrigerant. The reversing valve 12g can be designed, for example, as a 4 / 2-way valve. The valves 12e, 12f, and 12g can be controlled by coils 19.

[0102] The second refrigeration circuit module 12 also includes an expansion tank 12d for collecting the refrigerant and equalizing the pressure in the refrigerant circuit. The expansion tank 12d is arranged here in a medium pressure region of the refrigerant circuit and is designed as a phase separator. In alternative embodiments, the expansion tank can preferably also be designed as a liquid separator.

[0103] A return line to the expansion tank 12d (flow path F) is preferably connected to an upper region of the expansion tank 12d to supply preferably gaseous refrigerant to the expansion tank 12d. A phase separation between gaseous and liquid can occur in the expansion tank 12d. The outlet of the expansion tank 12d through the flow path with connection G (or the supply line of the expansion tank 12d) is preferably connected to a lower region of the expansion tank 12d to discharge preferably liquid refrigerant. The second refrigeration circuit module 12 comprises a front part 12a with a flat first connecting surface, a rear part 12b with a flat second connecting surface, and a flat sealing element 12c. The first connecting surface is arranged parallel to the second connecting surface, and the sealing element 12c is arranged between the first connecting surface and the second connecting surface to seal the front part 12a against the rear part 12b.

[0104] The front part 12a and the rear part 12b of the second refrigeration cycle module 12 are each monolithic bodies manufactured by primary forming or forming. The front part 12a and the rear part 12b are each half-shell-shaped, so that by assembling and connecting the front part 12a and the rear part 12b with the sealing element 12c therebetween, a plurality of flow paths and the expansion tank 12d for the refrigerant are formed.

[0105] Front part 12a, rear part 12b, and sealing element 12c can be attached to each other, for example, by bonding with an adhesive. Additionally or instead, circumferential clamps can be used, which can be attached to the peripheral edge of front part 12a, rear part 12b, and sealing element 12c. Furthermore, the parts can be connected to each other using screws or tie rods.

[0106] The refrigeration circuit device 10 in Fig. 2 and 3 comprises three heat exchangers. The first heat exchanger is arranged in the third refrigeration circuit module 13 and serves as a condenser, where heat is transferred from the refrigerant to a heating circuit medium of an external heating circuit 8. The second heat exchanger is arranged in the fourth refrigeration circuit module 14 and serves as an evaporator, where ambient heat is transferred to the refrigerant. The third heat exchanger is arranged in the fifth refrigeration circuit module 15 and serves as an internal heat exchanger to increase the efficiency of the system and to achieve suction gas superheating. In addition, the internal heat exchanger can be used, for example, to cool an inverter 9 or to cool other components of the heat pump. The heat exchangers can be designed as plate heat exchangers, for example. Other forms of heat exchanger are also possible depending on the intended use or requirements of the refrigeration circuit device 10 orThe heat pump is possible. For example, the evaporator's heat exchanger can also be a fin-tube evaporator or plate heat exchanger, which enables direct heat transfer from air to refrigerant without a liquid intermediate medium.

[0107] The third refrigeration circuit module 13, the fourth refrigeration circuit module 14, and the fifth refrigeration circuit module 15 are fluidly connected to the second refrigeration circuit module 12 via a sixth refrigeration circuit module 16. The sixth refrigeration circuit module 16 comprises a plurality of flow paths for the refrigerant and serves as a distribution module or interface between the refrigeration circuit modules to distribute the refrigerant between the refrigeration circuit modules.

[0108] Similar to the second refrigeration cycle module 12, the sixth refrigeration cycle module 16 comprises a front part 16a with a flat first connecting surface, a rear part 16b with a flat second connecting surface, and a flat sealing element 16c. The first connecting surface is arranged parallel to the second connecting surface. The sealing element 16c is arranged between the first connecting surface and the second connecting surface and prevents refrigerant from leaking out at the interface between the first and second connecting surfaces.

[0109] During the manufacture of the sixth refrigeration circuit module 16, the front part 16a, the sealing element 16c, and the rear part 16b can be bonded together, for example, using an adhesive, to create a multi-layer laminated body. The adhesive can be applied, for example, to the large areas between the flow paths or to the peripheral edge. Alternatively or additionally, the three parts of the sixth refrigeration circuit module 16 can be fastened to one another, particularly at its peripheral edge, using clamps or the like. The second refrigeration circuit module 12 can be manufactured in a similar manner. The front part 16a and the rear part 16b of the sixth refrigeration circuit module 16 are each monolithic bodies manufactured by primary forming or by forming.In addition, the front part 16a and the rear part 16b are each half-shell-shaped, so that by connecting the front part 16a and the rear part 16b, a plurality of flow paths for the refrigerant are formed. The front part 16a and the rear part 16b can be manufactured, for example, by deep drawing metal sheets or by an injection molding process.

[0110] The flow paths in the sixth refrigeration circuit module 16 and the second refrigeration circuit module 12 are described in more detail below with reference to Fig. 4 and the schematic circuit of Fig. 5. In Fig. 5, the refrigeration circuit modules 11, 13, 14, and 15 are each indicated by rectangles of dashed lines to illustrate that the refrigeration circuit modules 11, 13, 14, and 15 include flow paths and sensors in addition to a functional component of the refrigerant circuit.

[0111] In Fig. 4, the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 are shown spaced apart from one another, similar to Fig. 3, although the components of the three-part refrigeration circuit modules 12 and 16 are not shown spaced apart from one another as in Fig. 3. For a simplified illustration, the first refrigeration circuit module 11, the third refrigeration circuit module 13, the fourth refrigeration circuit module 14, and the fifth refrigeration circuit module 15 have been omitted from Fig. 4.

[0112] In the exemplary embodiment shown in Fig. 4, the flow paths in the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 are each aligned along the XY plane. Connections for connecting the refrigeration circuit modules are provided perpendicular to this, i.e., parallel to the Z axis.

[0113] As shown in Fig. 4, all flow path connections in the sixth refrigeration circuit module 16 are arranged in a plane parallel to the XY plane. This can enable a particularly compact design when connecting to other refrigeration circuit modules. The connections arranged on the opposite side of the sixth refrigeration circuit module 16 and thus not directly visible in Fig. 4 can also be arranged in a plane parallel to the XY plane. All of these connections can preferably be connected directly to another refrigeration circuit module, without the need for external lines, i.e., lines running outside the refrigeration circuit modules.

[0114] To connect the connections or second refrigeration circuit modules, for example, clamps and / or tension elements such as screws or tie rods can be used, which exert a force on the refrigeration circuit modules. To seal the connections, sealing elements can be arranged between the refrigeration circuit modules. For example, a one-piece, flat, level sealing element (not shown) can be arranged between the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16, which has corresponding cutouts for the openings of the connections. The sealing element can also serve for thermal insulation between refrigeration circuit modules.

[0115] According to a preferred embodiment, the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 can also be connected to one another by adhesive bonding. In this case, the adhesive can also advantageously serve as a sealant for sealing the connections between the terminals.

[0116] As shown in Fig. 4, the sixth refrigeration circuit module 16 has a cutout for the expansion tank 12d of the second refrigeration circuit module 12, which is curved outwardly further than the connections or parallel to the Z direction. The cutout in the sixth refrigeration circuit module 16 enables a particularly dense arrangement of the second refrigeration circuit module 12 next to or on the sixth refrigeration circuit module 16.

[0117] A reversing valve 12g and an expansion valve 12f are arranged in a group 12h of connections and flow paths. A single reversing valve or multiple reversing valves can be arranged in the group 12h. The reversing valves serve, for example, to reverse the flow direction of the refrigerant and / or to switch between sub-circuits of the refrigerant circuit.

[0118] Reference symbol A indicates the connection where the high-pressure refrigerant from the compressor supply line (i.e., from the first refrigeration circuit module 11) enters the second refrigeration circuit module 12. Reference symbol B indicates the outlet of the second refrigeration circuit module, where the return line to the compressor or the first refrigeration circuit module 11 is connected.

[0119] Depending on the setting of the changeover valve 12g, the refrigerant can then flow to the connecting line with reference symbol C in the sixth refrigeration circuit module 16 in order to reach the condenser in the third refrigeration circuit module 13.

[0120] From the condenser in the third refrigeration circuit module 13, the refrigerant flows back into the sixth refrigeration circuit module 16 and further through the flow path D to the first expansion valve 12f in the second refrigeration circuit module 12. From the first expansion valve 12f, the refrigerant flows via the inlet E in the sixth refrigeration circuit module to the internal heat exchanger in the fifth refrigeration circuit module 15. The outlet of the internal heat exchanger in the fifth refrigeration circuit module 15 is connected to the connecting line F in the sixth refrigeration circuit module 16.

[0121] The internal heat exchanger of the fifth refrigeration circuit module 15 serves, for example, to increase the overall efficiency of the system or to cool an inverter 9 for driving a compressor motor. The return line E to the internal heat exchanger and the supply line F from the internal heat exchanger are defined as the primary circuit of the internal heat exchanger. A return line K to the internal heat exchanger and a supply line J from the internal heat exchanger are defined as the secondary circuit of the internal heat exchanger. The return line K is connected to the switching valve 12g. The supply line J is connected to the return line B of the compressor 11. As shown in Fig. 5, the flow path F is connected to the expansion tank 12d in the second refrigeration circuit module 12. The outlet of the expansion tank 12d is connected to the second expansion valve 12e, from where the refrigerant flows further via the connections G to the fourth refrigeration circuit module 14 with the evaporator.The flow path with connections G can therefore also be referred to as the return of the evaporator.

[0122] The outlet of the fourth refrigeration circuit module 14 is connected to flow path H in the sixth refrigeration circuit module 16. Flow path H can be referred to as the supply line of the evaporator, which supplies the refrigerant to the switching valve 12g in the second refrigeration circuit module 12. The evaporator is thus arranged between port G and flow path H in the sixth refrigeration circuit module 16, see also Fig. 3.

[0123] As shown in the schematic refrigeration circuit of Fig. 5, the refrigeration circuit device 10 comprises a plurality of sensors for measuring the temperature of the refrigerant and for measuring the pressure of the refrigerant. Furthermore, the refrigeration circuit device 10 may include sensors (not shown in Fig. 5) for measuring a volume flow of the refrigerant. The temperature sensors in the refrigerant circuit are labeled 0 in Fig. 5, and the pressure sensors are labeled p.

[0124] In particular, a temperature sensor 0 is arranged in the return line E to the internal heat exchanger of the fifth refrigeration circuit module. Furthermore, a temperature sensor 0 is arranged in the return line G to the evaporator in the fourth refrigeration circuit module 14. Furthermore, a temperature sensor 0 is preferably arranged in the return line B to the compressor and in the flow line A from the compressor. A further temperature sensor 0 can be arranged in the flow line of the external heating circuit 8, which absorbs heat from the refrigerant at the condenser of the third refrigeration circuit module 13.

[0125] In the present embodiment of Fig. 5, two pressure sensors p are arranged in the supply line A and the return line B of the compressor, respectively. Based on the measured values ​​of the pressure sensors p, a compression performance of the compressor can be determined, for example. In particular, a control device 18 can evaluate the measured values ​​of the pressure sensors p and / or the temperature sensors 0 and control an operating state of the compressor or a drive motor 17 of the compressor and the two expansion valves 12e and 12.

[0126] As shown in Fig. 5, the refrigeration cycle device 10 or the heat pump comprises a fan 20 that generates an air flow in which the fourth refrigeration cycle module 14 with the evaporator is arranged. The fan 20 can, for example, be arranged at an opening in a housing in which the refrigeration cycle device 10 is arranged.

[0127] The described embodiment of the refrigeration circuit device 10 according to the invention completely dispenses with refrigerant lines arranged outside the refrigeration circuit modules 11 to 16. In other words, all flow paths for the refrigerant are integrated into the refrigeration circuit modules 11 to 16. This allows for the realization of a very compact refrigeration circuit device 10. The advantages of such a design include, for example, one or more of the following: a particularly low risk of leaks, a particularly small amount of required refrigerant, a particularly compact and space-saving design, particularly simple production, particularly simple installation, particularly low-maintenance operation, and particularly low noise generation.

[0128] The features disclosed in the above description, the claims and the drawings may be important both individually and in any combination for the realization of the invention in its various forms.

Claims

AMENDED CLAIMS received by the International Bureau on 03 July 2024 (03.07.2024) 1. A refrigeration circuit device (10) for a heat pump, comprising: a first refrigeration circuit module (11) and a second refrigeration circuit module (12), wherein: the refrigeration circuit modules (11, 12) form at least part of a refrigerant circuit of the heat pump, in which a refrigerant circulates; the first refrigeration circuit module (11) comprises a compressor for compressing the refrigerant and flow paths for the refrigerant; the second refrigeration circuit module (12) comprises an expansion valve (12e, 12f) for expanding the refrigerant and flow paths for the refrigerant; and the first refrigeration circuit module (11) is fluidly connected to the second refrigeration circuit module (12), wherein: the second refrigeration circuit module (12) comprises a first expansion valve (12e) and a second expansion valve (12f); and / or the second refrigeration circuit module (12) comprises a switching valve (12g) for switching between branches of the refrigerant circuit and / or for reversing a flow direction of the refrigerant;and / or the second refrigeration circuit module (12) comprises an expansion tank (12d) for collecting the refrigerant; the second refrigeration circuit module (12) comprises a front part (12a) with a flat first connecting surface, a rear part (12b) with a flat second connecting surface, and a flat sealing element (12c); the first connecting surface is arranged parallel to the second connecting surface; and the sealing element (12c) is arranged between the first connecting surface and the second connecting surface; and the front part (12a) and the rear part (12b) are each half-shell-shaped, so that by connecting the front part (12a) and the rear part (12b), a plurality of flow paths and / or an expansion tank (12c) for the refrigerant are formed.

2. Refrigeration circuit device (10) according to claim 1, wherein the first refrigeration circuit module (11) and the second refrigeration circuit module (12) each have a plurality of connections AMENDED SHEET (ARTICLE 19) in order to establish a flow connection between the first refrigeration circuit module (11) and the second refrigeration circuit module (12).

3. Refrigeration circuit device (10) for a heat pump, comprising: a first refrigeration circuit module (11) and a second refrigeration circuit module (12), wherein: the refrigeration circuit modules (11, 12) form at least part of a refrigerant circuit of the heat pump, in which a refrigerant circulates; the first refrigeration circuit module (11) comprises a compressor for compressing the refrigerant and flow paths for the refrigerant; the second refrigeration circuit module (12) comprises an expansion valve (12e, 12f) for expanding the refrigerant and flow paths for the refrigerant; the first refrigeration circuit module (11) is fluidly connected to the second refrigeration circuit module (12); a third refrigeration circuit module (13) comprising a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit; and / or a fourth refrigeration circuit module (14) comprising an evaporator for transferring heat from an ambient medium to the refrigerant;and / or a fourth refrigeration circuit module (14) having a heat exchanger connected via a secondary circuit in which a heat transfer medium circulates to an external evaporator, at which evaporator the heat transfer medium absorbs heat from an ambient medium; and / or a fifth refrigeration circuit module (15) comprising an internal heat exchanger for transferring heat from a first sub-circuit of the refrigerant circuit to a second sub-circuit of the refrigerant circuit; a sixth refrigeration circuit module (16) having a plurality of flow paths for the refrigerant and a plurality of connections for connecting the flow paths to other refrigeration circuit modules, wherein: the sixth refrigeration circuit module (16) is fluidly connected to the second refrigeration circuit module (12);and / or the sixth refrigeration circuit module (16) is fluidly connected to the third refrigeration circuit module (13) and / or the fourth refrigeration circuit module (14) and / or the fifth refrigeration circuit module (15), wherein:; AMENDED SHEET (ARTICLE 19) the sixth refrigeration circuit module (16) comprises a front part (16a) with a flat first connecting surface, a rear part (16b) with a flat second connecting surface, and a flat sealing element (16c); the first connecting surface is arranged parallel to the second connecting surface; the sealing element (16c) is arranged between the first connecting surface and the second connecting surface; the front part (16a) and the rear part (16b) are each half-shell-shaped, so that by connecting the front part (16a) and the rear part (16b), a plurality of flow paths and / or an expansion tank for the refrigerant are formed.

4. Refrigeration circuit device (10) according to claim 1 or 3, wherein the front part (16a) and the rear part (16b) are each a monolithic body manufactured by primary forming 5. Refrigeration cycle device (10) according to claim 3 or 4, further comprising: a thermal insulation arranged between the sixth refrigeration cycle module (16) and the second refrigeration cycle module (12).

6. The refrigeration cycle device (10) according to any one of claims 1 to 5, wherein at least one of the refrigeration cycle modules further comprises at least one of the following components: a phase separator; a refrigerant collector for collecting the refrigerant; a liquid separator; an internal heat exchanger; an economizer; a filter; an oil separator; a dryer; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for actuating a changeover valve and / or an expansion valve; a coil for controlling a valve; a safety high-pressure switch. AMENDED SHEET (ARTICLE 19) 7. The refrigeration cycle device (10) according to any one of claims 1 to 6, further comprising: a housing surrounding the refrigeration cycle modules (11-16), wherein: the housing has an opening in which a fan (20) is arranged for drawing in ambient air; and an evaporator of the refrigeration cycle device (10) is arranged in an air flow generated by the fan (20).

8. A heat pump for heating and / or cooling a building, comprising: a refrigeration circuit device (10) according to any one of claims 1 to 7.

9. Heat pump according to claim 8, wherein the heat pump is a monoblock heat pump.

10. Heat pump according to claim 8 or 9, wherein the heat pump has no more than two refrigerant-carrying lines arranged outside one of the refrigeration cycle modules (11-16).

11. Heat pump according to claim 10, wherein the two lines are each pipes or hoses connected to a heat exchanger in the refrigerant circuit.

12. Heat pump according to one of claims 8 to 11, further comprising an inverter (9) which is thermally coupled to an internal heat exchanger of the refrigeration cycle device (10) in order to dissipate heat from the inverter (9). AMENDED SHEET (ARTICLE 19)

Images