Probe

Abstract

In order to incorporate a resistor having a predetermined resistance value into a probe (10) while maintaining the mechanical strength of the probe (10), the probe (10) is characterized by including: a support structure (14) that supports the body of the probe (10); and an electrical path structure (15) that constitutes an electrical path from a distal section (11) to a proximal section (12) of the body of the probe (10), and is characterized in that the proximal section (12) of the body of the probe (10) is divided into a proximal section (12A) of the support structure (14) and a proximal section (12B) of the electrical path structure (15) and in that a resistor part (16) having a predetermined resistance value is provided in series with the electrical path of the electrical path structure (15).

Description

probe

[0001] The present application relates to probes.

[0002] One method for testing the characteristics of semiconductor devices is to simultaneously test multiple semiconductor devices on a wafer using a probe card. In this testing method, power is supplied to the semiconductor devices from the power probes of the probe card to operate them, and output signals from the semiconductor devices are picked up by the signal probes, and a tester determines whether the output signals are normal.

[0003] When multiple semiconductor devices are tested simultaneously, if one of the semiconductor devices being tested is damaged, an overcurrent will flow into the damaged semiconductor device, causing electrical instability. This electrical instability prevents the other normal semiconductor devices from receiving a predetermined amount of power, and so they will not output the correct signal, even though they are normal, and will be determined to be abnormal.

[0004] To prevent such errors, a protective resistor has been provided in the wiring circuit of the power probe of the probe card that supplies current to the semiconductor device. Furthermore, as the wiring has become denser, it has been proposed to provide the protective resistor inside the power probe instead of in the wiring (Patent Document 1).

[0005] In the probe proposed in Patent Document 1, during the process of stacking the conductive layers of the probe body using MEMS technology, a predetermined conductive layer is replaced with a resistive layer made of a material with a higher resistivity than the conductive layer, thereby resulting in a configuration in which one of the conductive layers of the probe body is replaced with a resistive layer.

[0006] Furthermore, as a structure for providing a protective resistor inside the probe, a probe structure has been proposed in which a resistive layer is formed on the needle tip of the probe tip so as to interrupt the electric path (Patent Document 2).

[0007] JP 2008-198956 A JP 2009-150801 A

[0008] In the probe disclosed in Patent Document 1, a part of the laminated conductive layers is replaced with a resistive layer, so that the resistive layer is included within the resistive conductive layer. However, since a high resistance value is required as a protective resistor, in order to increase the resistance value, it is necessary to reduce the cross-sectional area of ​​the electric path and to lengthen the electric path.

[0009] However, there is a problem that the thickness of the resistive layer cannot be set large because the height of the probe is limited, and there is also a problem that when a part of the laminated conductive layer is replaced with a resistive layer in the portion where the probe is fixed, the resistance value cannot be made large because the cross-sectional area of ​​the laminated resistive layer is large.

[0010] Furthermore, as shown in Patent Documents 1 and 2, if a resistive layer with high resistivity is provided near the tip of the probe, the cross-sectional area of ​​the electric path can be reduced, but there is a problem in that heat generated in the resistive layer affects the semiconductor device being inspected.

[0011] Furthermore, when a portion of the conductive layer is replaced with a resistive layer and laminated, the laminate is laminated with conductive layers of different materials interposed therebetween, which causes a problem of a decrease in mechanical strength due to a decrease in the bonding strength at the interface between the conductive layers of different materials.

[0012] The present application discloses a technique for solving the above-mentioned problems, and aims to provide a probe that has a built-in function as a protective resistor while maintaining mechanical strength.

[0013] The probe disclosed in the present application has a support structure that supports the probe body and an electrical circuit structure that forms an electrical path from the needle tip to the needle base of the probe body, and the needle base of the probe body is divided into a needle base of the support structure and a needle base of the electrical circuit structure, and is characterized in that a resistor with a predetermined resistance value is provided in series with the electrical path of the electrical circuit structure.

[0014] According to the probe disclosed in the present application, it is possible to provide a probe having a structure that includes a protective resistor function inside while maintaining mechanical strength.

[0015] 6 is a front view of a probe according to embodiment 1. FIG. 7 is a perspective view of a probe according to embodiment 1. FIG. 8 is a cross-sectional view of a part of a probe card on which a probe according to embodiment 1 is mounted. FIG. 9 is a front view of a probe according to embodiment 2. FIG. 10 is a front view of a modified example of the probe according to embodiment 2. FIG. 11 is a front view of a probe according to embodiment 3. FIG. 12 is a cross-sectional view taken along line A-A in FIG. 6. FIG. 13 is a process diagram showing a method for manufacturing a probe according to embodiment 3. FIG. 14 is a cross-sectional view of a part of a probe card on which a probe according to embodiment 3 is mounted. FIG. 15 is a front view of a probe according to embodiment 4. FIG. 16 is a front view of a probe according to embodiment 5.

[0016] The probe card is provided with a power supply probe that supplies power to the semiconductor device to be tested, a signal probe that extracts an output signal resulting from the operation of the semiconductor device, and a ground probe that grounds the electrical circuit of the semiconductor device. The subject of this application is not limited to power supply probes, but is also applicable to probes that require a predetermined value of wiring resistance. The following explanation focuses on power supply probes.

[0017] Embodiment 1. A probe according to embodiment 1 will be described with reference to the drawings. Note that, in the following drawings, the same reference numerals indicate the same or corresponding parts. FIG. 1 is a front view of the probe according to embodiment 1. As shown in the figure, the probe 10 is composed of a tip portion 11 that contacts an input terminal of a semiconductor device to be tested, a base portion 12 that is fixed to a probe card and connected to wiring, and a middle portion 13 in the center of the probe 10.

[0018] The probe base 12 of the probe 10 is divided into a support structure 14 and an electric circuit structure 15, each enclosed by a dashed line in the figure. The support structure 14 and the electric circuit structure 15 are configured on the same plane. The support structure 14 mechanically supports the probe tip 11. The electric circuit structure 15 forms an electric circuit between the probe tip 11 and the probe base 12.

[0019] That is, at the needle tip 11 of the probe 10, the support structure 14 and the electric circuit structure 15 are integrated, and at the needle base 12 of the probe 10, they are branched into a needle base 12A of the support structure 14 and a needle base 12B of the electric circuit structure 15. A resistor 16 is provided in series in the electric circuit of the electric circuit structure 15.

[0020] 2 is a perspective view of the probe 10 shown in FIG. 1. The probe 10 is manufactured by laminating metal layers by electroforming. The outer shapes of the tip 11 and base 12 (base 12A of the support structure 14 and base 12B of the electrical circuit structure 15), support structure 14, and electrical circuit structure 15 of the probe 10 are determined by a mask pattern, and are formed by laminating metal layers.

[0021] That is, the support structure 14 and the electrical path structure 15 are simultaneously formed from the same metal layer. Therefore, the support structure 14 and the electrical path structure 15 are configured on the same plane. The resistor portion 16 is formed by laminating a metal material having a higher resistivity than the metal material of the probe 10.

[0022] 3 is a partial cross-sectional view showing a structure in which the probe 10 shown in FIG. 1 is mounted on a probe card 100. The probe shown on the right side of the figure is a power supply probe 10P, and the probe shown on the left side of the figure is a signal probe 10S.

[0023] As shown in the figure, a resistor portion 16 is provided in series with the electrical path at the needle base portion 12B of the electrical path structure 15 of the power probe 10P, and this needle base portion 12B is fixed by solder 104 to a power electrode 102P provided on the space transformer 101 of the probe card 100.

[0024] The base 12A of the support structure 14 of the power supply probe 10P is fixed to the floating electrode 102F of the probe card 100 by solder 104. The floating electrode 102F is electrically floating and not connected to anything. In other words, it has an electrically insulated structure.

[0025] The probe base 12 of the signal probe 10S is fixed by solder 104 to a signal electrode 102S provided on a space transformer 101 of the probe card 100. Here, the conditions of the support structure 14 and the electrical circuit structure 15 of the power supply probe 10P are as follows:

[0026] The support structure 14 must have sufficient strength to support the probe tip 11 when the power supply probe 10P contacts the electrode of the semiconductor device with the same probe pressure as the signal probe 10S.

[0027] The electrical path structure 15 is provided with a resistance section 16 having a small cross-sectional area and a predetermined length so that the resistance value set by the cross-sectional area and length is, for example, 200 to 300 Ω, and no electrical path is formed other than this resistance section 16.

[0028] In the case of the probe 10 according to the first embodiment, in order to obtain a predetermined resistance value, it is necessary to reduce the cross-sectional area of ​​the electric path through which the current flows and to make the electric path long. For this reason, the needle base 12 is divided into a needle base 12A of the support structure 14 that provides mechanical strength and a needle base 12B of the electric path structure 15 that provides the function of supplying current, and the needle base 12B of the electric path structure 15 is provided with a resistor 16 having a predetermined resistance value.

[0029] That is, by narrowing the cross-sectional area perpendicular to the direction of current flow of the electrical path structure 15 that constitutes the electrical path and providing a resistance member in this portion, it is possible to provide a resistance portion 16 that is provided in series with the electrical path of the electrical path structure 15, thereby providing a probe 10 that has a resistance portion 16 inside.

[0030] Embodiment 2 In the probe 10 according to embodiment 1, a space is provided at the needle base 12 of the probe 10 to separate the support structure 14 and the electrical path structure 15, and the support structure 14 is fixed to the floating electrode 102F.

[0031] In the probe 10 according to the second embodiment, the functions of the support structure 14 and the electric circuit structure 15 are separated as in the first embodiment, but the probe base portion 12A of the support structure 14 and the electric circuit structure 15 are structurally integrated with each other by an insulating portion 20. Note that the insulating portion 20 is made of a resin or a metal oxide.

[0032] That is, as shown in FIG. 4, the cross-sectional area of ​​the electric path of the electric path structure 15 is limited by providing an insulating portion 20 at the needle base portion 12 of the probe 10 .

[0033] The electric path of this electric circuit structure 15 is provided with a resistor portion 16 in series, and the needle base portion 12B of the electric circuit structure 15 extends to the needle base portion 12A of the support structure 14 to form a conductive region 21. Therefore, the needle base portion 12 of the probe 10 has a structure in which the needle base portion 12A of the support structure 14 and the needle base portion 12B of the electric circuit structure 15 are integrated.

[0034] In this case, the support structure 14 is configured to support the tip 11 of the probe 10 by the middle 13, the insulating portion 20, and the base 12A of the probe 10. The electrical path structure 15 is configured by the middle 13, the resistor portion 16, and the base 12B of the probe 10.

[0035] In the case of the probe 10 according to the second embodiment, the functions of the support structure 14 and the electric circuit structure 15 are separated, and an insulating section 20 is provided in the support structure 14, so that electricity is not conducted to the needle base section 12A of the support structure 14. Since the support structure 14 and the electric circuit structure 15 are integrated at the needle base section 12, the probe 10 can be fixed to the probe card 100 by a single soldering operation.

[0036] In this second embodiment, the branching of the support structure 14 and the electrical path structure 15 is integrated by the insulating portion 20. As a modification of this second embodiment, as shown in Fig. 5, after a space 22 is provided between the support structure 14 and the electrical path structure 15 and they are branched, they can be integrated at the needle base portion 12.

[0037] In this way, when the support structure 14 and the electrical circuit structure 15 are integrated at the needle base portion 12, a mechanically strong structure can be obtained. Furthermore, when a space 22 is provided between the support structure 14 and the electrical circuit structure 15, the effect of preventing the influence of heat generated in the resistance portion 16 from being directly transmitted to the support structure 14 can be obtained by providing a space around the resistance portion 16.

[0038] Embodiment 3 A probe 10 according to embodiment 3 will be described with reference to Figures 6 and 7. Figure 6 is a front view of the probe 10, and Figure 7 is a cross-sectional view of the dashed dotted line in Figure 6 as viewed in the direction of arrow A. As shown in the figure, the probe 10 according to embodiment 3 has a support structure 14 and an electrical circuit structure 15 arranged on different planes.

[0039] As shown in Figure 6, the support structure 14 and the electrical path structure 15 are configured to overlap each other. That is, the support structure 14 and the electrical path structure 15 are configured on different planes. An insulating coating 17 is provided between the needle center portion 13 and the needle base portion 12 of the support structure 14. The insulating coating 17 is an insulating sputtered thin film made of SiN, DLC, or the like. This insulating coating 17 blocks the electrical path from the needle tip portion 11 to the needle base portion 12.

[0040] The probe base 12 is provided with a solder portion 23. The solder portion 23 is used when attaching the probe 10 to the substrate of the probe card 100.

[0041] An insulating layer 18 is provided on the surface of the support structure 14, and an electrical path structure 15 is provided on the surface of this insulating layer 18, electrically connecting between the needle center portion 13 and the needle base portion 12. The electrical path structure 15 is a resistive wiring layer made of a high-resistance sputtered film provided on the surface of the insulating layer 18 provided in a predetermined region of the support structure 14.

[0042] 7, the support structure 14 is a single flat plate. Therefore, the probe tip 11 can be firmly supported against a force applied in the vertical direction of the probe 10. The electrical path structure 15 is a resistive wiring layer made of a high-resistance sputtered film provided on the surface of an insulating layer 18 provided in a predetermined region of the support structure 14.

[0043] In the case of the probe 10 of this third embodiment, insulation is achieved by an insulating coating 17 near the needle base 12. By insulating the support structure 14 near the needle base 12, the needle tip 11 can be made to have the same characteristics (needle pressure, scrub marks, etc.) as a signal probe. In addition, since the resistor portion 16 of the electrical path structure 15 is created by the wiring shape formed by the resistive film pattern, there is an advantage that any shape can be set.

[0044] Next, an outline of the manufacturing process of the probe of this third embodiment will be described. Figure 8 shows the manufacturing process of the probe of the third embodiment. As shown in Figure 8a, the probe 10 body is manufactured using MEMS technology, and after the upper layer is polished, as shown in Figure 8b, an insulating coating 17 is formed on the needle base 12 by sputtering. Thereafter, as shown in Figure 8c, the needle base 12 is formed on the insulating coating 17.

[0045] Next, as shown in Figure 8d, an insulating layer 18 is formed to cover the needle center portion 13, the insulating coating 17, and the needle base portion 12. This insulating layer 18 may be, for example, a photosensitive insulating film. Next, as shown in Figure 8e, a conductive path pattern of a resistive sputtered film is formed on the insulating layer 18, with the start point at the needle center portion 13 and the end point at the needle base portion 12. This resistive sputtered film pattern becomes the electrical path structure 15. Next, as shown in Figure 8f, a solder portion 23 is formed at the needle base portion 12.

[0046] The power supply probe 10P prepared as described above is fixed to a power supply electrode 102P provided on a space transformer 101 of a probe card 100 by solder 104, separately from the signal probe 10S, as shown in Fig. 9. The signal probe 10S is also fixed to the signal electrode 102S.

[0047] As shown in FIG. 9, the power supply probe 10P has the same shape as the signal probe 10S, so that the mounting device used to mount the signal probe on the probe card can be used to mount the power supply probe, improving work efficiency.

[0048] Fourth Embodiment A probe 10 according to a fourth embodiment is shown in Fig. 10. The probe according to the fourth embodiment has an improved probe base portion 12 compared to the probe according to the third embodiment.

[0049] In the probe 10 of embodiment 4, an insulating layer 18 is provided from the middle needle portion 13 to the base needle portion 12 on a support structure 14 consisting of a needle tip portion 11, a middle needle portion 13, and a base needle portion 12, an insulating coating 174 is provided on the base needle portion 12, and legs 124 protruding from the outer shape of the probe 10 are provided on the surface of the insulating coating 174, and the middle needle portion 13 and the legs 124 are connected by a resistive wiring layer 154 provided on the surface of the insulating layer 18.

[0050] In the case of the probe 10 of this embodiment 4, an insulating coating 174 is used to separate the support structure 14 and the electrical circuit structure 15, and since the structure of the support structure 14 does not include the insulating coating 174, the mechanical strength of the support structure 14 can be stabilized.

[0051] The electrical path structure 15 is composed of a resistive wiring layer 154 provided on the surface of the insulating layer 18 and legs 124. The legs 124 are provided with solder portions 234. That is, the legs 124 are connected to the power supply electrodes of the probe card by the solder portions 234.

[0052] The probe 10 of this embodiment 4 differs from the probe 10 of embodiment 3 in the insulating coating 174 and the leg portion 124 provided on the probe 10. There are no changes in other parts. In the probe of this embodiment 4, the insulating coating 174 at the needle base portion 12 of the support structure 14 of the probe 10 is removed to further increase the mechanical strength of this portion, and the configuration of the probe 10 of embodiment 3 is combined with the configuration of the probe 10 of embodiment 1.

[0053] Fifth Embodiment A probe 10 according to a fifth embodiment is shown in Figure 11. The probe according to the fifth embodiment is the probe 10 according to the fourth embodiment, except that the orientation of the legs of the probe 10 is changed. There are no other changes.

[0054] That is, the probe of this fifth embodiment is a cantilever probe, and the orientation of the insulating coating 175 and leg 125 provided on the probe 10 is aligned with the beam direction of the cantilever probe. In the case of a cantilever probe, the tip 11 of the probe 10 extends from the middle 13 in a predetermined direction by the beam. By aligning the protruding direction of the leg 125 with the direction in which the tip of the probe protrudes from the middle, the area occupied by the probe on the probe card can be reduced. The leg 125 is provided with a solder portion 235.

[0055] In the above embodiment, a case where a resistor is added to a power supply probe has been described, but a signal probe that supplies a test signal from a tester to a semiconductor device also needs to have a resistor of a predetermined resistance value. In this case, the resistance value is a large value, for example, 300 Ω±20%, and the resistor can be added using the configuration described in the embodiment.

[0056] Although various exemplary embodiments and examples are described in this application, the various features, aspects, and functions described in one or more embodiments are not limited to the application of a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless modifications not illustrated are contemplated within the scope of the technology disclosed in this application. For example, this includes cases where at least one component is modified, added, or omitted, or where at least one component is extracted and combined with components of another embodiment.

[0057] 100 probe card, 10 probe, 10P power supply probe, 10S signal probe, 11 needle tip portion, 12, 12A, 12B needle base portion, 13 needle middle portion, 14 support structure, 15 electrical circuit structure, 16 resistance portion, 17, 174, 175 insulating coating, 18 insulating layer, 20 insulating portion, 21 conductive region, 22 space portion, 23, 234, 235 solder portion, 124 leg portion, 101 space transformer, 102F floating electrode, 102P power supply electrode, 104 solder, 124, 125 leg portion, 154 resistance wiring layer.

Claims

1. A probe comprising a support structure which supports a probe body, and an electrical circuit structure which forms an electrical path from the tip to the base of the probe body, the base of the probe body being divided into a base of the support structure and a base of the electrical circuit structure, and a resistor having a predetermined resistance value being connected in series with the electrical path of the electrical circuit structure.

2. The probe according to claim 1, wherein said support structure and said electrical path structure are arranged in the same plane.

3. A probe as described in claim 2, characterized in that the support structure is composed of an insulating part constituting the base of the needle of the support structure and the probe body, and the tip of the probe body and the base of the needle of the support structure are insulated by the insulating part.

4. The probe according to claim 3, wherein a space is provided between said insulating portion of said support structure and said resistive portion of said electrical path structure.

5. The probe of claim 1, wherein said support structure and said electrical trace structure are arranged in different planes.

6. The probe according to claim 5, further comprising an insulating layer provided on a surface of said support structure, and said electrical path structure provided on a surface of said insulating layer.

7. The probe according to claim 5, further comprising an insulating coating provided between the needle center portion and the needle base portion of said support structure, said insulating coating providing insulation therebetween.

8. A probe as described in claim 6, characterized in that the electrical circuit structure is a conductive path that connects the needle center portion and the needle base portion of the support structure via a resistive wiring layer provided on the surface of an insulating layer provided on the surface of the support structure.

9. The probe according to claim 6, wherein the electric circuit structure is connected to a leg portion which is insulated from the support structure and protrudes from the needle base portion.

10. The probe according to claim 9, wherein the direction in which said legs protrude is the same as the direction in which the tip of the probe protrudes from the center of the needle.

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