Socket

The socket design addresses the bulkiness and fragility of existing guide structures by using a partially overlapping guide portion with movable components, achieving reduced thickness and improved stability for semiconductor device inspections.

WO2025022913A1PCT designated stage expired Publication Date: 2025-01-30YOKOWO CO LTD
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Patent Information

Application Number
PCT/JP2024/023086
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-07-27
Filing Date
2024-06-26
Publication Date
2025-01-30

AI Technical Summary

Technical Problem

Existing sockets for semiconductor devices, such as BGA, require a structure to guide inspection targets to a predetermined position, which can be bulky and prone to distortion or damage due to the thickness of the guide portions, necessitating a reduction in the structure's size and complexity.

Method used

The socket design incorporates a guide portion that is partially located in an overlapping area with the inspection target, using a combination of movable components and separate members to reduce thickness and prevent distortion, allowing for adjustable positioning and easy replacement of guide elements.

Benefits of technology

This design reduces the thickness of the guide portion, minimizing distortion and damage while enabling stable and precise guidance of inspection targets, and allows for customization based on the type of inspection object.

✦ Generated by Eureka AI based on patent content.

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Abstract

This socket comprises: a contactor that makes contact with an object to be tested; and a guide part that positions at least a part of the object to be tested with respect to the contactor. The guide part is partially positioned with respect to a region overlapping the object to be tested.
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Description

socket

[0001] The present invention relates to a socket.

[0002] In recent years, various sockets have been developed for use in testing semiconductor devices such as BGAs (Ball Grid Arrays).

[0003] Patent Document 1 describes an example of a socket. The socket includes a probe, a housing through which the probe is inserted, and a movable base disposed on the upper surface of the housing. The movable base defines a recess for accommodating an object to be inspected.

[0004] Patent Document 2 describes an example of a socket. The socket includes a contact sheet. Contact terminals that come into contact with the contact terminals of the semiconductor chip are provided on the upper surface of the contact sheet. Guides are provided around the periphery of the contact terminals to guide the contact terminals of the semiconductor chip.

[0005] JP 2023-36137 A JP 2000-30828 A

[0006] Sockets may have a structure for guiding test objects, such as semiconductor devices, to a predetermined position. The increasing speed of semiconductor devices may require shorter probes and thinner contactors. The shortening of probes and thinner contactors may require a thinner structure for guiding test objects to a predetermined position.

[0007] One object of the present invention is to make thin the structure for guiding the test object to a predetermined position. Other objects of the present invention will become apparent from the description of this specification.

[0008] One aspect of the present invention is a socket comprising: a contactor that contacts an object to be inspected; and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, wherein the guide portion is partially positioned relative to an area that overlaps with the object to be inspected.

[0009] One aspect of the present invention is a socket comprising: a contactor that contacts an object to be inspected; and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, wherein the guide portion and a predetermined member positioned around the object to be inspected are attached to each other.

[0010] One aspect of the present invention includes a contactor that contacts an object to be tested, the contactor being a socket having a resist that guides at least a portion of the object to be tested.

[0011] According to the above aspect of the present invention, the structure for guiding the inspection object to a predetermined position can be made thinner.

[0012] 5 is an exploded perspective view of a socket according to embodiment 1. FIG. 6 is a top view of a socket according to embodiment 1. FIG. 7 is a cross-sectional view taken along line A-A in FIG. 2. FIG. 8 is an exploded perspective view of a socket according to embodiment 2. FIG. 9 is a top view of a socket according to embodiment 2. FIG. 10 is a cross-sectional view taken along line B-B in FIG. 5. FIG. 11 is a schematic cross-sectional view of a socket according to embodiment 3. FIG. 12 is a view showing a socket according to a first modified example of FIG. 7. FIG. 13 is a view showing a socket according to a second modified example of FIG. 7.

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, similar components are designated by similar reference numerals, and the description thereof will be omitted as appropriate.

[0014] In this specification, the terms "approximately," "about," "substantially," and the like, when modifying the state of an element, such as the shape, position, or numerical value, mean a range that would be understood by a person skilled in the art to enable the intended purpose to be achieved by that state.

[0015] To explain the directions, the X direction, Y direction, and Z direction are defined. The Z direction is a direction parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to the Z direction and the X direction. In each embodiment, the direction indicated by the Z-axis arrow is defined as the upward direction. In FIGS. 2 and 5, the white circle with a black dot indicating the Z direction indicates that the direction indicated by the Z-axis arrow is from the back of the page to the front. In FIGS. 3 and 6 to 9, the white circle with a black dot indicating the Y direction indicates that the direction indicated by the Y-axis arrow is from the back of the page to the front.

[0016] Hereinafter, as necessary, the side indicated by the X-axis arrow and the opposite side of the side indicated by the X-axis arrow will be referred to as the +X side and the −X side, respectively, the side indicated by the Y-axis arrow and the opposite side of the side indicated by the Y-axis arrow will be referred to as the +Y side and the −Y side, respectively, and the side indicated by the Z-axis arrow and the opposite side of the side indicated by the Z-axis arrow will be referred to as the +Z side and the −Z side, respectively.

[0017] FIG. 1 is an exploded perspective view of a socket 10A according to the first embodiment. FIG. 2 is a top view of the socket 10A according to the first embodiment. FIG. 3 is a cross-sectional view taken along the line A-A in FIG. 2. In FIG. 2, an inspection object 20 to be inspected using the socket 10A according to the first embodiment is shown by a broken line. In FIG. 3, the inspection object 20 to be inspected using the socket 10A according to the first embodiment is also shown. For the sake of explanation, the inspection object 20 shown in FIGS. 2 and 3 is not shown in FIG. 1.

[0018] The socket 10A according to the first embodiment is used to inspect an object under test 20. In the first embodiment, the object under test 20 is a ball grid array (BGA). As shown in FIG. 2 , when viewed from the Z direction, the object under test 20 has a substantially square shape with a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the object under test 20 is not limited to the shape shown in FIG. 2 . As shown in FIG. 3 , a plurality of electrodes 22 are provided on the underside of the object under test 20. Each electrode 22 is, for example, a solder ball. However, the object under test 20 may be a semiconductor device other than a BGA.

[0019] As shown in FIGS. 1 to 3, the socket 10A according to the first embodiment includes a plurality of probes 100, a support 200, a frame 300, a guide member 400A, a plurality of springs 500, and a plurality of first screws 600. FIGS. 1 and 3 show one probe 100 contacting an electrode 22 provided on the underside of a corner on the -X side and +Y side of an object under test 20. The support 200 includes a pin block 210 and a pin plate 220. The frame 300 includes a first frame portion 310, a plurality of first positioning pins 320, and a base portion 330. The guide member 400A includes a second frame portion 410A, a plurality of second positioning pins 420A, and a plurality of guide portions 430A.

[0020] FIG. 3 illustrates the appearance of only one of the multiple probes 100. The probe 100 according to the first embodiment is a pogo pin that is extendable in the Z direction. The upper and lower ends of the probe 100 are biased away from each other by a spring (not shown) provided inside the probe 100. The probe 100 serves as a contactor that comes into contact with the test object 20. Specifically, as shown in FIG. 3, when the test object 20 is tested using the socket 10A, the upper end of the probe 100 and the lower surface of the electrode 22 of the test object 20 come into contact with each other and are electrically connected to each other. When the test object 20 is tested using the socket 10A, the lower end of the probe 100 and the upper surface of the electrode of a test board such as a PCB (printed circuit board) not shown in FIGS. 1 to 3 come into contact with each other and are electrically connected to each other. Thus, the electrode 22 of the test object 20 and the electrode of the test board can be electrically connected to each other via the probe 100. However, the structure of the probe 100 is not limited to a pogo pin.

[0021] The pin block 210 and the pin plate 220 overlap each other in the Z direction, with the lower surface of the pin block 210 and the upper surface of the pin plate 220 in contact with each other. The pin block 210 and the pin plate 220 are made of, for example, an insulating resin body. As shown in Fig. 1 , when viewed from the Z direction, the pin block 210 and the pin plate 220 have a substantially rectangular plate shape with a pair of long sides parallel to the X direction and a pair of short sides substantially parallel to the Y direction. However, the shapes of the pin block 210 and the pin plate 220 are not limited to the shapes shown in Fig. 1 .

[0022] As shown in FIGS. 1 to 3 , the pin block 210 and the pin plate 220 define a plurality of through holes 202. Each through hole 202 penetrates the pin block 210 and the pin plate 220 in the Z direction. In the example shown in FIG. 2 , when viewed from the Z direction, the plurality of through holes 202 are arranged in a plurality of rows and a plurality of columns in the X direction and the Y direction, respectively. However, the arrangement of the plurality of through holes 202 is not limited to the arrangement shown in FIG. 2 . As shown in FIG. 3 , each probe 100 is inserted into each through hole 202. The support 200 supports the probe 100 parallel to the Z direction with the probe 100 inserted into the through hole 202.

[0023] 1 and 3, the first frame portion 310 is disposed on the upper surface side of the support body 200. The first frame portion 310 is, for example, a metal block. As shown in FIGS. 1 and 2, when viewed from the Z direction, the first frame portion 310 has a substantially rectangular frame shape having a pair of long sides parallel to the X direction and a pair of short sides parallel to the Y direction. However, the shape of the first frame portion 310 is not limited to the shape shown in FIGS. 1 and 2.

[0024] 1 and 3, a plurality of first positioning pins 320 protrude from the underside of the first frame portion 310. In the example shown in FIG. 1, four first positioning pins 320 protrude from the four corners of the underside of the first frame portion 310. However, the number and arrangement of the first positioning pins 320 are not limited to the number and arrangement shown in FIG. 1. The first frame portion 310 is disposed on the upper surface side of the support body 200, with the plurality of first positioning pins 320 inserted into the support body 200. By inserting the plurality of first positioning pins 320 into the support body 200, the support body 200 and the frame 300 can be positioned relative to each other.

[0025] As shown in Figures 1 and 3, the pedestal portion 330 is provided at the lower end of the inner surface of the first frame portion 310. In the example shown in Figures 1 and 3, the first frame portion 310 and the pedestal portion 330 are integrally molded. However, the first frame portion 310 and the pedestal portion 330 may be separate members. In the example shown in Figure 1, when viewed from the Z direction, the pedestal portion 330 has a substantially square frame shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the pedestal portion 330 is not limited to the shape shown in Figure 1.

[0026] 1 and 3, the second frame portion 410A is disposed on the upper surface side of the support body 200. In the example shown in Figures 1 and 2, when viewed from the Z direction, the second frame portion 410A has a substantially square frame shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the second frame portion 410A is not limited to the shape shown in Figures 1 and 2.

[0027] As shown in FIGS. 1 to 3 , the second frame portion 410A defines an opening 412A. As shown in FIGS. 1 and 2 , the opening 412A has a substantially square shape when viewed from the Z direction. However, the shape of the opening 412A is not limited to the shape shown in FIGS. 1 and 2 . As shown in FIG. 3 , when an inspection object 20 is inspected using the socket 10A, the inspection object 20 is placed inside the opening 412A. As shown in FIGS. 1 and 3 , the width of the upper part of the opening 412A in a direction perpendicular to the Z direction decreases downward. Specifically, the inner surface of the upper part of the opening 412A is tapered from the upper end to partway through the upper and lower ends of the opening 412A. Therefore, compared to when the width of the upper part of the opening 412A in a direction perpendicular to the Z direction is constant regardless of the position in the Z direction, it is easier to guide the inspection object 20 toward the inside of the opening 412A. However, the width of the opening 412A in a direction perpendicular to the Z direction may be constant regardless of the position in the Z direction.

[0028] As shown in FIGS. 1 and 3 , multiple second positioning pins 420A protrude from the underside of the second frame portion 410A. In the example shown in FIG. 1 , two second positioning pins 420A protrude from both sides of the underside of the second frame portion 410A in the X direction. The second positioning pin 420A provided on the +X side of the second frame portion 410A is located in the center of the +X side of the second frame portion 410A in the Y direction. The second positioning pin 420A provided on the −X side of the second frame portion 410A is located in the center of the −X side of the second frame portion 410A in the Y direction. However, the number and arrangement of the second positioning pins 420A are not limited to those shown in FIG. 1 . The second frame portion 410A is disposed on the upper surface side of the support body 200 with the multiple second positioning pins 420A inserted into the base portion 330. By inserting the plurality of second positioning pins 420A into the base portion 330, the frame 300 and the guide member 400A can be positioned relative to each other.

[0029] 1 to 3, the plurality of guide portions 430A are located at the bottom of the opening 412A. The second frame portion 410A and each guide portion 430A are integrally molded. In one example, the second frame portion 410A and each guide portion 430A are integrally molded from engineering plastic.

[0030] When the test object 20 is placed inside the opening 412A, the multiple guide portions 430A guide at least some of the electrodes 22 of the test object 20 to predetermined positions. Thus, the multiple guide portions 430A position the multiple electrodes 22 of the test object 20 relative to the multiple probes 100. Specifically, as shown in FIGS. 2 and 3 , each guide portion 430A defines multiple guide holes 432A. Each guide hole 432A penetrates the guide portion 430A in the Z direction. As shown in FIG. 3 , when the test object 20 is placed at a predetermined position inside the opening 412A, the electrodes 22 enter the guide holes 432A. By inserting the electrodes 22 into the guide holes 432A, the guide portions 430A can guide at least some of the electrodes 22 to predetermined positions.

[0031] In the first embodiment, as shown in FIGS. 1 and 2 , four guide portions 430A are located at the four corners of the bottom of the opening 412A when viewed from the Z direction. Therefore, the multiple guide portions 430A are partially located in the area overlapping the test object 20 in the Z direction. When the guide portions 430A are partially located in the area overlapping the test object 20 in the Z direction, the thickness of the guide portions 430A in the Z direction can be thinner than when the guide portions 430A are located over the entire area overlapping the test object 20 in the Z direction. Specifically, increasing the speed of the test object 20 may require shortening the probe 100 in the Z direction. The shortening of the probe 100 in the Z direction may require reducing the thickness of the guide portions 430A in the Z direction. However, when the second frame portion 410A and the guide portions 430A are integrally molded, the thinner the thickness of the guide portions 430A in the Z direction, the more likely defects such as distortion or breakage of the guide portions 430A will occur. In the first embodiment, the area of ​​the guide portion 430A can be made smaller than when the guide portion 430A is positioned over the entire area overlapping with the inspection object 20 in the Z direction. The smaller the area of ​​the guide portion 430A, the easier it is to suppress defects such as distortion and breakage of the guide portion 430A. Therefore, in the first embodiment, the thickness of each guide portion 430A in the Z direction can be made thinner than when the guide portion 430A is positioned over the entire area overlapping with the inspection object 20 in the Z direction.

[0032] 2 , in the first embodiment, when viewed from the Z direction, a pair of guide portions 430A located at diagonal corners of the bottom of the opening 412A are located on opposite sides of the center of the area that overlaps with the inspection object 20 in the Z direction. Therefore, compared to a case where only one guide portion 430A is located on either side of the center of the area that overlaps with the inspection object 20 in the Z direction, the inspection object 20 can be stably guided by the guide portion 430A.

[0033] As shown in Fig. 2, when viewed from the Z direction, the multiple through holes 202 in the portions of the support body 200 that overlap with each guide portion 430A in the Z direction and the multiple guide holes 432A in each guide portion 430A overlap with each other in the Z direction. Therefore, as shown in Fig. 2, the upper ends of the through holes 202 in the portions of the support body 200 that overlap with each guide portion 430A in the Z direction and the lower ends of the guide holes 432A in each guide portion 430A are connected to each other. Therefore, the lower surface of the electrode 22 inserted in the guide hole 432A and the upper end of the probe 100 inserted into the through hole 202 that communicates with the guide hole 432A can come into contact with each other.

[0034] The number and arrangement of the multiple guide portions 430A are not limited to the example according to the first embodiment. For example, when viewed from the Z direction, the guide portion 430A may be located at only one of the four corners of the bottom of the opening 412A. Alternatively, when viewed from the Z direction, the guide portion 430A may be located at at least one of the four sides of the bottom of the opening 412A instead of or in addition to the four corners of the bottom of the opening 412A. For example, when viewed from the Z direction, the guide portion 430A may be located on the opposite side of the bottom of the opening 412A.

[0035] 1, the plurality of springs 500 are disposed between the upper surface of the base 330 and the lower surface of the second frame 410A, with the second frame 410A disposed on the upper surface side of the support 200. Therefore, the lower surface of the second frame 410A can be biased upward by the plurality of springs 500. In the example shown in FIG. 1, four springs 500 are disposed between the four corners of the upper surface of the base 330 and the four corners of the lower surface of the second frame 410A. However, the number and arrangement of the springs 500 are not limited to those shown in FIG. 1.

[0036] As shown in FIG. 1 , each first screw 600 has a shank 610, a head 620, and a wide portion 630. The shank 610 extends in the Z direction. The upper end of the shank 610 and the lower surface of the head 620 are connected to each other. The dimension of the head 620 in a direction perpendicular to the Z direction is larger than the dimension of the shank 610 in a direction perpendicular to the Z direction. The wide portion 630 is located below the head 620 and around the shank 610 in the Z direction. The dimension of the wide portion 630 in a direction perpendicular to the Z direction is larger than both the dimension of the shank 610 in a direction perpendicular to the Z direction and the dimension of the head 620 in a direction perpendicular to the Z direction.

[0037] As shown in FIGS. 1 to 3 , each first screw 600 and the first frame portion 310 are fastened to each other with the shaft portion 610 inserted through the first frame portion 310 and at least a portion of the wide portion 630 pressing downward against at least a portion of the upper surface of the second frame portion 410A against the elastic force of the springs 500. The position of the wide portion 630 in the Z direction can be adjusted by adjusting the depth to which the shaft portion 610 is inserted into the first frame portion 310 in the Z direction. The position of the second frame portion 410A in the Z direction can be adjusted by pressing downward against the upper surface of the second frame portion 410A against the elastic force of each spring 500 with the wide portion 630. That is, in the example shown in FIGS. 1 to 3 , the guide member 400A is a floating plate that is movable in the Z direction. Therefore, even if the dimensions of the test object 20 vary depending on the type of test object 20, the lower end of the electrode 22 and the upper end of the probe 100 can be reliably brought into contact with each other by adjusting the position of the second frame portion 410A in the Z direction. However, the guide member 400A may be fixed immovably in the Z direction.

[0038] 1 and 2, two first screws 600 are provided on both sides of the first frame portion 310 in the X direction. The first screw 600 provided on the +X side portion of the first frame portion 310 is positioned offset toward the +Y side with respect to the center in the Y direction of the +X side portion of the first frame portion 310. The first screw 600 provided on the −X side portion of the first frame portion 310 is positioned offset toward the −Y side with respect to the center in the Y direction of the −X side portion of the first frame portion 310. However, the number and arrangement of the first screws 600 are not limited to the number and arrangement shown in FIGS. 1 and 2.

[0039] The structure of the socket 10A is not limited to the structure described using the first embodiment.

[0040] The second frame portion 410A and the plurality of guide portions 430A according to the first embodiment are integrally molded. However, similar to the second embodiment described below, the second frame portion 410A and the plurality of guide portions 430A may be separate members.

[0041] The socket 10A according to the first embodiment includes a plurality of probes 100 and a support body 200. However, the socket 10A may include a contactor such as the contactor 100C according to a third embodiment described below, instead of the plurality of probes 100 and the support body 200. Therefore, the guide portion 430A according to the first embodiment can be used not only to position at least a portion of the object under test 20 relative to a contactor such as the probes 100, but also to position at least a portion of the object under test 20 relative to a contactor such as the contactor 100C according to the third embodiment described below.

[0042] FIG. 4 is an exploded perspective view of the socket 10B according to the second embodiment. FIG. 5 is a top view of the socket 10B according to the second embodiment. FIG. 6 is a cross-sectional view taken along the line B-B of FIG. 5. In FIG. 5, the inspection object 20 to be inspected using the socket 10B according to the second embodiment is shown by a dashed line. In FIG. 6, the inspection object 20 to be inspected using the socket 10B according to the second embodiment is also shown. For the sake of explanation, the inspection object 20 shown in FIGS. 5 and 6 is not shown in FIG. 4. The socket 10B according to the second embodiment is similar to the socket 10A according to the first embodiment except for the following points.

[0043] 4 to 6, the socket 10B according to the second embodiment includes a plurality of probes 100, a support 200, a frame 300, a guide member 400B, a plurality of springs 500, a plurality of first screws 600, and a plurality of second screws 700B. The guide member 400B includes a second frame portion 410B, a plurality of second positioning pins 420B, and a guide portion 430B. The second frame portion 410B defines an opening 412B.

[0044] As shown in FIG. 4 , when viewed from the Z direction, the guide portion 430B has a substantially square plate shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the guide portion 430B is not limited to the shape shown in FIG. 4 . As shown in FIGS. 4 and 5 , the guide portion 430B is positioned over the entire bottom of the opening 412B. As shown in FIGS. 4 to 6 , the guide portion 430B defines a plurality of guide holes 432B. As shown in FIGS. 5 and 6 , the plurality of through holes 202 and the plurality of guide holes 432B overlap each other in the Z direction, with the upper ends of the through holes 202 and the lower ends of the guide holes 432B communicating with each other. The guide portion 430B according to the second embodiment positions the plurality of electrodes 22 of the test object 20 relative to the plurality of probes 100, similar to the guide portion 430A according to the first embodiment.

[0045] In the second embodiment, the second frame portion 410B and the guide portion 430B are separate components. The second frame portion 410B in the second embodiment is made of molded engineering plastic. In contrast, the guide portion 430B in the second embodiment is made of a resin sheet such as a polyimide sheet. Therefore, the second frame portion 410B is attached to a member positioned around the inspection object 20. When the second frame portion 410B is attached to a member positioned around the inspection object 20, the thickness of the guide portion 430B in the Z direction can be made thinner than when the second frame portion 410B and the guide portion 430B are integrally molded. Specifically, an increase in the speed of the inspection object 20 may require a reduction in the length of the probe 100 in the Z direction. A reduction in the length of the probe 100 in the Z direction may require a reduction in the thickness of the guide portion 430B in the Z direction. However, when the second frame portion 410B and the guide portion 430B are integrally molded, the thinner the Z-direction thickness of the guide portion 430B, the more likely defects such as distortion and breakage of the guide portion 430B will occur. In the second embodiment, the second frame portion 410B and the guide portion 430B can be formed as separate members. Therefore, in the second embodiment, defects such as distortion and breakage of the guide portion 430B can be more easily suppressed compared to when the second frame portion 410B and the guide portion 430B are integrally molded. Therefore, in the second embodiment, the Z-direction thickness of the guide portion 430B can be thinner compared to when the second frame portion 410B and the guide portion 430B are integrally molded.

[0046] The second frame portion 410B and the guide portion 430B are attached to each other by a plurality of second screws 700B. Therefore, the second frame portion 410B and the guide portion 430B can be removed from each other by removing the plurality of second screws 700B. Therefore, the guide portion 430B can be replaced depending on conditions such as the type of inspection object 20. For example, the number and arrangement of guide holes 432B provided in the guide portion 430B can be changed depending on the type of guide portion 430B.

[0047] In the example shown in Fig. 4, the four corners of the second frame portion 410B and the four corners of the guide portion 430B are attached to each other by four second screws 700B. The four second screws 700B are inserted from below to above through the guide portion 430B and the second frame portion 410B. However, the number and arrangement of the second screws 700B are not limited to those shown in Fig. 4.

[0048] The method for attaching the second frame portion 410B and the guide portion 430B to each other is not limited to screw fastening. The lower surface of the second frame portion 410B and the upper surface of the guide portion 430B may be attached to each other with, for example, double-sided tape.

[0049] The structure of the socket 10B is not limited to the structure described in the second embodiment.

[0050] The guide portion 430B according to the second embodiment is attached to the second frame portion 410B. However, the guide portion 430B may be attached to a member different from the second frame portion 410B. The member to which the guide portion 430B is attached may be a member located around the inspection object 20 when viewed from the Z direction.

[0051] The guide portion 430B according to the second embodiment is located in the entire area overlapping the inspection object 20 in the Z direction. However, similar to the guide portions 430A according to the first embodiment, the guide portion 430B may be located partially in the area overlapping the inspection object 20 in the Z direction.

[0052] The socket 10B according to the second embodiment includes a plurality of probes 100 and a support body 200. However, the socket 10B may include a contactor such as the contactor 100C according to the third embodiment described below, instead of the plurality of probes 100 and the support body 200. Therefore, the guide portion 430B according to the second embodiment can be used not only to position at least a portion of the object under test 20 relative to a contactor such as the probes 100, but also to position at least a portion of the object under test 20 relative to a contactor such as the contactor 100C according to the third embodiment described below.

[0053] 7 is a schematic cross-sectional view of a socket 10C according to embodiment 3. The socket 10C according to embodiment 3 is similar to the socket 10A according to embodiment 1 or the socket 10B according to embodiment 2, except for the following points.

[0054] The socket 10C according to the third embodiment includes a contactor 100C. The contactor 100C is disposed in the Z direction between the test object 20 and a test board such as a PCB (not shown in FIG. 7). The contactor 100C according to the third embodiment includes an elastic material 110C, a plurality of first contact portions 120C, a plurality of second contact portions 130C, a plurality of connection conductor portions 140C, and a resist 150C. Each first contact portion 120C includes a first base portion 122C and a plurality of first protrusion portions 124C. Each second contact portion 130C includes a second base portion 132C and a plurality of second protrusion portions 134C.

[0055] The elastic material 110C is an elastically deformable material, such as an elastomer such as silicone rubber or urethane, and has a sheet shape that extends in a direction perpendicular to the Z direction.

[0056] The first base portion 122C and the first protrusions 124C are made of metal and are formed by, for example, electroforming.

[0057] The first base portion 122C is disposed on the upper surface side of the elastic material 110C. In the third embodiment, the first base portion 122C has a circular shape when viewed from the Z direction. However, the shape of the first base portion 122C is not limited to the shape according to the third embodiment. The plurality of first protrusions 124C protrude from the upper surface of the first base portion 122C. When the test object 20 is tested using the socket 10C, the upper ends of the first protrusions 124C and the lower surfaces of the electrodes 22 come into contact with each other. In the third embodiment, the plurality of first protrusions 124C are arranged at equal intervals around the center of the first base portion 122C when viewed from the Z direction. Specifically, four first protrusions 124C are arranged at 90° intervals around the center of the first base portion 122C when viewed from the Z direction. Therefore, when the upper end of each first protrusion 124C and the lower surface of the electrode 22 are in contact with each other, it is possible to easily align the center of the electrode 22 and the center of the first base 122C in the Z direction as viewed from the Z direction. However, the number and arrangement of the first protrusions 124C are not limited to the number and arrangement according to the third embodiment.

[0058] The second base portion 132C and the second protrusion portion 134C are made of metal and are formed by, for example, electroforming.

[0059] The second base 132C is disposed on the lower surface side of the elastic material 110C. In this embodiment, the second base 132C has a circular shape when viewed from the Z direction. However, the shape of the second base 132C is not limited to the shape according to the third embodiment. The second protrusion 134C protrudes from the lower surface of the second base 132C. When the test object 20 is tested using the socket 10C, the lower end of the second protrusion 134C and the upper surface of the electrode of the test board (not shown in FIG. 7) come into contact with each other. When viewed from the Z direction, the second protrusion 134C is located at the center of the second base 132C. However, the number and arrangement of the second protrusions 134C are not limited to those according to the third embodiment.

[0060] Each connection conductor 140C is located between each first contact portion 120C and each second contact portion 130C in the Z direction. Each connection conductor 140C is located on the inner surface of a through hole provided in the elastic material 110C. Each connection conductor 140C is electrically connected to the lower surface of each first contact portion 120C and the upper surface of each second contact portion 130C. Therefore, each first contact portion 120C and each second contact portion 130C is electrically connected to each other via the connection conductor 140C.

[0061] The resist 150C is located on the upper surface side of the elastic material 110C. The resist 150C defines a plurality of guide holes 152C. Each guide hole 152C at least partially exposes the upper surface of each first base portion 122C. The resist 150C is formed by patterning such as photolithography. The resist 150C is formed after the first contact portions 120C are formed. Alternatively, each first contact portion 120C may be formed by electroforming using the resist 150C as a mold, or each first contact portion 120C may be formed using a 3D printer or the like.

[0062] Each electrode 22 is inserted into each guide hole 152C with the lower surface of each electrode 22 and the upper end of each first protrusion 124C in contact with each other. By inserting each electrode 22 into each guide hole 152C, the resist 150C guides each electrode 22 to a predetermined position. In the third embodiment, the resist 150C at least partially surrounds the first contact portion 120C when viewed from the Z direction. This makes it easier to guide each electrode 22 toward the first contact portion 120C by the resist 150C. The thickness of the resist 150C in the Z direction can be thinner than the thickness of a structure formed by cutting. Therefore, when the structure for guiding the electrode 22 is formed using the resist 150C, the thickness of the structure for guiding the electrode 22 in the Z direction can be thinner than when the structure for guiding the electrode 22 is formed by cutting.

[0063] The width of at least a portion of each guide hole 152C in a direction perpendicular to the Z direction decreases with increasing distance from the test object 20. In the example shown in FIG. 7 , the width of each guide hole 152C in the X direction decreases at the upper part of each guide hole 152C with increasing distance from the test object 20. Specifically, the inner surfaces on both sides of the upper part of each guide hole 152C in the X direction are tapered. Therefore, compared to a case where the width of each guide hole 152C in the X direction is constant regardless of the distance from the test object 20, it is possible to more easily guide each electrode 22 toward each first contact portion 120C.

[0064] 7 , the outer surface of each first base portion 122C around the Z direction and the peripheral portion of each first base portion 122C of the resist 150C in the Z direction are in contact with each other. In consideration of processing position accuracy, the peripheral portion of each guide hole 152C of the resist 150C in the Z direction covers the peripheral portion of each guide hole 152C in the Z direction on the top surface of each first base portion 122C. For example, the inner surface of each guide hole 152C is shifted by several tens of μm in a direction perpendicular to the Z direction toward the center of each guide hole 152C relative to the outer surface of each first base portion 122C.

[0065] FIG. 8 is a diagram showing a socket 10C1 according to a first modified example of FIG.

[0066] In the example shown in FIG. 8 , the socket 10C1 includes a contactor 100C1. The contactor 100C1 includes a resist 150C1. The resist 150C1 defines a plurality of guide holes 152C1. In the example shown in FIG. 8 , the outer surface around each first base portion 122C in the Z direction and the portion of the resist 150C1 around each first base portion 122C in the Z direction are separated from each other by a gap. Therefore, the width in the X direction of the upper portion of the guide hole 152C1 shown in FIG. 8 can be wider than the width in the X direction of the upper portion of the guide hole 152C shown in FIG. 7 . Therefore, in the example shown in FIG. 8 , the resist 150C1 can more easily guide larger electrodes 22 toward each first contact portion 120C than in the example shown in FIG. 7 .

[0067] FIG. 9 is a diagram showing a socket 10C2 according to a second modified example of FIG.

[0068] In the example shown in Figure 9, the socket 10C2 has a contactor 100C2. The contactor 100C2 includes a resist 150C2. The resist 150C2 includes a first resist 150C2a and a second resist 150C2b. The first resist 150C2a and the second resist 150C2b are layered in this order from the top surface of the elastic material 110C. The width of the second resist 150C2b in the X direction is less than the width of the first resist 150C2a in the X direction. The resist 150C2 defines a plurality of guide holes 152C2.

[0069] The width of at least a portion of each guide hole 152C2 in a direction perpendicular to the Z direction decreases with increasing distance from the test object 20. In the example shown in FIG. 9 , the width of each guide hole 152C2 in the X direction decreases from the second resist 150C2b to the first resist 150C2a with increasing distance from the test object 20. Specifically, the inner surfaces of both sides of each guide hole 152C2 in the X direction have a stepped shape from the second resist 150C2b to the first resist 150C2a. Therefore, compared to a case where the width of each guide hole 152C2 in the X direction is constant regardless of the distance from the test object 20, it is possible to more easily guide each electrode 22 toward each first contact portion 120C. In addition, in the example shown in FIG. 9 , the stepped shape of the inner surfaces of both sides of the guide hole 152C2 in the X direction can be formed by stacking the first resist 150C2a and the second resist 150C2b. Therefore, the width of each guide hole 152C2 in the X direction can be made to decrease more easily as it moves away from the inspection object 20 than when the inner surfaces on both sides in the X direction of the resist 150C2 are formed in a tapered shape.

[0070] 9, the stepped shape of the inner surfaces on both sides in the X direction of the resist 150C2 is formed by two layers of resist, a first resist 150C2a and a second resist 150C2b. However, the inner surfaces on both sides in the X direction of the resist 150C2 may be formed by three or more layers of resist.

[0071] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various other configurations can also be adopted.

[0072] According to the present specification, the following aspects of the socket are provided: (Aspect 1) In Aspect 1, the socket includes a contactor that contacts an object to be tested, and a guide portion that positions at least a portion of the object to be tested relative to the contactor, and the guide portion is partially positioned relative to a region that overlaps with the object to be tested.

[0073] The "contactor" corresponds to the "probe" in the above embodiment.

[0074] According to the above-described aspect, it is possible to more easily prevent defects such as distortion and breakage of the guide portion compared to when the guide portion is positioned over the entire area overlapping with the inspection object. Therefore, according to the above-described aspect, it is possible to make the guide portion thinner compared to when the guide portion is positioned over the entire area overlapping with the inspection object.

[0075] (Aspect 2) In aspect 2, the guide portions are located on opposite sides of the center of the region that overlaps with the inspection object.

[0076] According to the above-described aspect, the object to be inspected can be stably guided by the guide portion compared to when the guide portion is positioned on only one side of the central portion of the area overlapping with the object to be inspected.

[0077] (Aspect 3) In aspect 3, the socket comprises a contactor that contacts the object to be inspected and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, and the guide portion and a predetermined member that is positioned around the object to be inspected are attached to each other.

[0078] The "contactor" corresponds to the "probe" in the above embodiment.

[0079] According to the above-described aspect, it is possible to more easily prevent defects such as distortion and breakage of the guide portion compared to when the guide portion and the predetermined member are integrally molded. Therefore, according to the above-described aspect, it is possible to make the guide portion thinner compared to when the guide portion and the predetermined member are integrally molded.

[0080] (Aspect 4) In aspect 4, the guide portion and the predetermined member are detachable from each other.

[0081] According to the above-described aspect, the guide portion can be replaced depending on conditions such as the type of the object to be inspected.

[0082] (Aspect 5) In aspect 5, a contactor that comes into contact with the test object is provided, and the contactor has a resist that guides at least a portion of the test object.

[0083] According to the above-described aspect, the thickness of the resist can be made thinner than the thickness of the structure formed by cutting, and therefore, according to the above-described aspect, the structure for guiding at least a portion of the inspection object can be made thinner than when the structure for guiding at least a portion of the inspection object is formed by cutting.

[0084] (Aspect 6) In aspect 6, the contactor has a contact portion that comes into contact with the inspection object, and the resist at least partially surrounds the contact portion.

[0085] According to the above-described aspect, at least a portion of the object to be inspected can be easily guided toward the contact portion by the resist.

[0086] (Aspect 7) In aspect 7, the resist defines a hole that at least partially exposes the contact portion, and the width of at least a portion of the hole decreases with increasing distance from the test object.

[0087] According to the above-described aspect, it is possible to more easily guide at least a portion of the test object toward the contact portion, compared to when the width of the hole is constant regardless of the distance from the test object.

[0088] This application claims priority based on Japanese Patent Application No. 2023-122244, filed on July 27, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0089] 10A, 10B, 10C, 10C1, 10C2 Socket, 20 Test object, 22 Electrode, 100 Probe, 100C, 100C1, 100C2 Contactor, 110C Elastic material, 120C First contact portion, 122C First base portion, 124C First protrusion portion, 130C Second contact portion, 132C Second base portion, 134C Second protrusion portion, 140C Connecting conductor portion, 150C, 150C1, 150C2 Resist, 150C2a First resist, 150C2b Second resist, 152C, 152C1, 152C2 Guide hole, 200 Support, 202 Through hole, 210 Pin block, 220 Pin plate, 300 Frame, 310 First frame portion, 320 First positioning pin, 330 Base portion, 400A, 400B Guide member, 410A, 410B Second frame portion, 412A, 412B Opening, 420A, 420B Second positioning pin, 430A, 430B Guide portion, 432A, 432B Guide hole, 500 Spring, 600 First screw, 610 Shank portion, 620 Head portion, 630 Wide portion, 700B Second screw

Claims

1. A socket comprising: a contactor that contacts an object to be inspected; and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, the guide portion being partially positioned relative to an area that overlaps the object to be inspected.

2. The socket according to claim 1, wherein the guide portions are located on opposite sides of a center of the area that overlaps with the object to be inspected.

3. A socket comprising: a contactor that contacts an object to be inspected; and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, wherein the guide portion and a specified member positioned around the object to be inspected are attached to each other.

4. The socket according to claim 3, wherein said guide portion and said specified member are detachable from each other.

5. A socket comprising a contactor that contacts an object to be tested, the contactor having a resist that guides at least a portion of the object to be tested.

6. The socket according to claim 5, wherein the contactor has a contact portion that contacts the object to be inspected, and the resist at least partially surrounds the contact portion.

7. The socket of claim 6, wherein said resist defines holes at least partially exposing said contact portions, and wherein at least a portion of said holes has a decreasing width with distance from said test object.

Citation Information

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