Resin composition and electronic component device

Abstract

This resin composition comprises an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.

Description

Resin composition and electronic component device

[0001] The present disclosure relates to a resin composition and an electronic component device.

[0002] The amount of transmission loss that occurs when radio waves transmitted for communication are converted into heat in a dielectric is expressed as the product of frequency, the square root of the relative dielectric constant, and the dielectric loss tangent. In other words, since the transmission signal is more likely to be converted into heat in proportion to the frequency, the higher the frequency band, the lower the dielectric properties required for communication component materials in order to suppress transmission loss.

[0003] For example, Patent Documents 1 and 2 disclose thermosetting resin compositions containing an active ester resin as a curing agent, which are said to be capable of keeping the dielectric loss tangent of the cured product low.

[0004] In the field of information and communications, radio waves are becoming increasingly high frequency as the number of channels and the amount of information transmitted increase. Currently, studies on the fifth generation mobile communications system are underway worldwide, and several candidate frequency bands in the range of approximately 30 GHz to 70 GHz have been identified. As wireless communications will become mainstream in the future at this high frequency, materials for communications components are being required to have even lower dielectric loss tangents.

[0005] JP 2012-246367 A JP 2014-114352 A

[0006] It has become clear that when an active ester resin is used as a curing agent as in the above-mentioned Patent Documents 1 and 2, the dielectric loss tangent of the cured product decreases, but the crosslink density decreases and the strength decreases.

[0007] An object of the present disclosure is to provide a resin composition that, when cured, has a low dielectric tangent and excellent strength, and an electronic component device using the same.

[0008] Specific means for solving the above problems include the following aspects. <1> A resin composition containing an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound. <2> The resin composition according to <1>, wherein the content of the cyclic carbodiimide compound is 1 part by mass or more relative to 100 parts by mass of the epoxy resin. <3> The resin composition according to <1> or <2>, wherein the content of the cyclic carbodiimide compound is 50 parts by mass or less relative to 100 parts by mass of the epoxy resin. <4> The resin composition according to any one of <1> to <3>, wherein the ratio of the total number of functional group equivalents of the entire curing agent and the number of imide group equivalents of the cyclic carbodiimide compound to the number of epoxy group equivalents of the epoxy resin [(number of functional group equivalents of the entire curing agent + number of imide group equivalents of carbodiimide groups) / number of epoxy group equivalents of the epoxy resin] is 0.51 to 2.20. <5> The resin composition according to any one of <1> to <4>, further comprising at least one selected from the group consisting of a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, a colorant, and a stress relaxation agent. <6> An electronic component device comprising: a support member, an electronic component arranged on the support member, and a cured product of the resin composition according to any one of <1> to <5>, encapsulating the electronic component.

[0009] According to the present disclosure, there are provided a resin composition that has a low dielectric tangent and excellent strength when cured, and an electronic component device using the same.

[0010] In the present disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. Furthermore, in numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0011] Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0012] The resin composition according to an embodiment of the present disclosure includes an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound. The reason why the cured product has a low dielectric tangent and excellent strength when configured as described above is not clear, but is presumed to be as follows.

[0013] The resin composition of the present disclosure uses an active ester compound, resulting in a low dielectric loss tangent of the cured product. However, the crosslink density of a cured product of an epoxy resin and an active ester compound is low, resulting in reduced strength. Therefore, the resin composition of the present disclosure contains a cyclic carbodiimide compound. Because secondary hydroxyl groups are not generated during the curing reaction between an epoxy resin and an active ester compound, it is thought that the cyclic carbodiimide compound does not react and does not contribute to the strength of the cured product. However, in fact, the strength of the cured product is improved. This is presumably because not only the curing reaction between the epoxy resin and the active ester compound but also self-polymerization between the epoxy resins proceeds, generating secondary hydroxyl groups through this self-polymerization, which then reacts with the cyclic carbodiimide compound. In particular, the carbodiimide compound contains a cyclic structure, which increases the strength of the cured product. Furthermore, it has been revealed that the inclusion of a cyclic carbodiimide compound further reduces the dielectric loss tangent of the cured product. The reason for this is thought to be that secondary hydroxyl groups generated by self-polymerization of the epoxy resin are consumed in the reaction with the cyclic carbodiimide compound, further reducing the hydroxyl groups that contribute to an increase in the dielectric loss tangent.

[0014] (Epoxy Resin) The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule. Specific examples of epoxy resins include novolac epoxy resins (phenol novolac epoxy resins, orthocresol novolac epoxy resins, etc.) obtained by epoxidizing novolac resins obtained by condensing or co-condensing, under an acidic catalyst, at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, etc., and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc., with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc.; triphenylmethane epoxy resins obtained by epoxidizing triphenylmethane phenolic resins obtained by condensing or co-condensing, under an acidic catalyst, the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde, etc.; and copolymers obtained by epoxidizing novolac resins obtained by co-condensing, under an acidic catalyst, the above-mentioned phenolic compound and naphthol compound with an aldehyde compound. biphenyl-type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; biphenyl skeleton-type epoxy resins such as biphenylaralkyl-type epoxy resins; stilbene-type epoxy resins which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins which are diglycidyl ethers of bisphenol S; epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins which are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which active hydrogen atoms bonded to nitrogen atoms of aniline, diaminodiphenylmethane, isocyanuric acid, etc. are substituted with glycidyl groups; dicyclopentadiene-type epoxy resins obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenolic compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are produced by epoxidizing an intramolecular olefin bond; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of suitable epoxy resins include pentadiene-modified epoxy resins, cyclopentadiene-modified epoxy resins which are glycidyl ethers of cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified epoxy resins which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, naphthalene-type epoxy resins which are glycidyl ethers of naphthalene ring-containing phenolic resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid, and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Epoxidized acrylic resins are also suitable as epoxy resins. These epoxy resins may be used alone or in combination of two or more.

[0015] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin is a value measured by a method in accordance with JIS K 7236:2009.

[0016] When the epoxy resin is solid, the softening point or melting point of the epoxy resin is not particularly limited. The softening point or melting point of the epoxy resin is preferably 40°C to 180°C from the viewpoint of moldability and reflow resistance, and more preferably 50°C to 130°C from the viewpoint of handleability during preparation of the resin composition. The melting point or softening point of the epoxy resin is a value measured by differential scanning calorimetry (DSC) or a method in accordance with JIS K 7234:1986 (ring and ball method).

[0017] The mass proportion of the epoxy resin in the total amount of the resin composition is preferably 0.5 mass % to 30 mass %, more preferably 2 mass % to 20 mass %, and even more preferably 3.5 mass % to 13 mass %, from the viewpoints of strength, fluidity, heat resistance, moldability, etc.

[0018] (Curing Agent) The resin composition contains an active ester compound as a curing agent. The active ester compound may be used alone or in combination of two or more. Here, the active ester compound refers to a compound that has one or more ester groups that react with epoxy groups in one molecule and has the ability to cure epoxy resins.

[0019] When an active ester compound is used, the dielectric loss tangent of the cured product can be kept lower than when a phenolic or amine curing agent is used as the curing agent. The reason for this is presumed to be as follows: In the reaction between an epoxy resin and a phenolic or amine curing agent, secondary hydroxyl groups are generated. In contrast, in the reaction between an epoxy resin and an active ester compound, ester groups are generated instead of secondary hydroxyl groups. Since ester groups have lower polarity than secondary hydroxyl groups, a resin composition containing an active ester compound as a curing agent can keep the dielectric loss tangent of the cured product lower than a resin composition containing only a curing agent that generates secondary hydroxyl groups. Furthermore, while polar groups in a cured product increase the water absorption of the cured product, using an active ester compound as a curing agent can reduce the concentration of polar groups in the cured product, thereby suppressing the water absorption of the cured product. Furthermore, suppressing the water absorption of the cured product, in other words, reducing the polar molecule H ２By reducing the O content, the dielectric loss tangent of the cured product can be further reduced.

[0020] The type of active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with an epoxy group. Examples of the active ester compound include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds.

[0021] Examples of active ester compounds include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds using an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds using an aromatic compound as a polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring.

[0022] Specific examples of activated ester compounds include aromatic esters obtained by the condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group. Among these, aromatic esters obtained by the condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group using a mixture of raw materials: an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms on the aromatic ring, such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, or diphenylsulfonic acid, have been substituted with carboxy groups; a monohydric phenol in which one hydrogen atom on the aromatic ring has been substituted with a hydroxyl group; and a polyhydric phenol in which 2 to 4 hydrogen atoms on the aromatic ring have been substituted with hydroxyl groups. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.

[0023] Specific examples of the active ester compound include an active ester resin having a structure obtained by reacting a phenolic resin having a molecular structure in which phenolic compounds are bonded via alicyclic hydrocarbon groups with an aromatic dicarboxylic acid or a halide thereof, and an aromatic monohydroxy compound, as described in JP 2012-246367 A. As the active ester resin, a compound represented by the following structural formula (1) is preferred.

[0024]

[0025] In structural formula (1), R １ represents an alkyl group having 1 to 4 carbon atoms; X represents an unsubstituted benzene ring, an unsubstituted naphthalene ring, a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group; Y represents a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms; k is 0 or 1; and n represents the average number of repetitions and is 0.25 to 1.5.

[0026] Specific examples of the compound represented by structural formula (1) include the following exemplary compounds (1-1) to (1-10): In the structural formula, t-Bu is a tert-butyl group.

[0027]

[0028]

[0029] Other specific examples of the active ester compound include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3), which are described in JP 2014-114352 A.

[0030]

[0031] In structural formula (2), R １ and R ２are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0032] In structural formula (3), R １ and R ２ are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of an unsubstituted benzoyl group, an unsubstituted naphthoyl group, a benzoyl group or naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0033] Specific examples of the compound represented by structural formula (2) include the following exemplary compounds (2-1) to (2-6).

[0034]

[0035] Specific examples of the compound represented by structural formula (3) include the following exemplary compounds (3-1) to (3-6).

[0036]

[0037] Commercially available products of the active ester compound may be used. Examples of commercially available active ester compounds include active ester compounds containing a dicyclopentadiene-type diphenol structure such as "EXB9451," "EXB9460," "EXB9460S," and "HPC-8000-65T" (manufactured by DIC Corporation); active ester compounds containing an aromatic structure such as "EXB9416-70BK," "EXB-8," and "EXB-9425" (manufactured by DIC Corporation); active ester compounds containing an acetylated phenol novolac such as "DC808" (manufactured by Mitsubishi Chemical Corporation); and active ester compounds containing a benzoylated phenol novolac such as "YLH1026" (manufactured by Mitsubishi Chemical Corporation).

[0038] The ester equivalent (molecular weight / number of ester groups) of the active ester compound is not particularly limited. From the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and even more preferably 200 g / eq to 250 g / eq. The ester equivalent of the active ester compound is a value measured by a method in accordance with JIS K 0070:1992.

[0039] The equivalent ratio (ester group / epoxy group) between the epoxy resin and the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and even more preferably 0.97 or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. The equivalent ratio (ester group / epoxy group) between the epoxy resin and the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, and even more preferably 1.03 or less, from the viewpoint of keeping the unreacted active ester compound low.

[0040] The resin composition may contain a curing agent other than the active ester compound. The type of the other curing agent is not particularly limited and can be selected depending on the desired properties of the resin composition. Examples of the other curing agent include a phenol curing agent, an amine curing agent, an acid anhydride curing agent, a polymercaptan curing agent, a polyaminoamide curing agent, an isocyanate curing agent, and a blocked isocyanate curing agent. One type of the other curing agent may be used alone, or two or more types may be used in combination.

[0041] Specific examples of the phenolic curing agent include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolak-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde, under an acidic catalyst; and resins synthesized from the above phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, or the like. Examples of the phenolic curing agent include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins; paraxylylene-modified phenolic resins and metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above-mentioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerization of two or more of these. These phenolic curing agents may be used alone or in combination of two or more.

[0042] The functional group equivalent of the other curing agent (hydroxyl group equivalent in the case of a phenolic curing agent) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of the other curing agent is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq. The functional group equivalent of the other curing agent (hydroxyl group equivalent in the case of a phenolic curing agent) is a value measured by a method in accordance with JIS K 0070:1992.

[0043] The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and from the viewpoint of handleability during production of the resin composition, it is more preferably 50°C to 130°C. The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0044] The equivalent ratio between the epoxy resin and the curing agent (all curing agents when multiple curing agents are used), i.e., the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent / number of functional groups in the epoxy resin), is not particularly limited. From the viewpoint of minimizing unreacted components, it is preferably set in the range of 0.5 to 2.0, more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is even more preferably set in the range of 0.8 to 1.2.

[0045] The mass proportion of the active ester compound in the total amount of the active ester compound and other curing agents is preferably 80 mass % or more, more preferably 85 mass % or more, and even more preferably 90 mass % or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low.

[0046] The total mass proportion of the epoxy resin and the active ester compound in the total amount of the epoxy resin and the curing agent is preferably 80 mass % or more, more preferably 85 mass % or more, and even more preferably 90 mass % or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low.

[0047] (Cyclic Carbodiimide Compound) A cyclic carbodiimide compound is a compound having one or more carbodiimide groups (-N=C=N-) in the molecule, and having a cyclic structure in which two nitrogen atoms constituting the carbodiimide group are linked by a linking group. One type of cyclic carbodiimide compound may be used alone, or two or more types may be used in combination.

[0048] From the viewpoint of improving the strength of the resin composition when it is cured, the cyclic carbodiimide compound preferably contains two or more carbodiimide groups in the molecule.

[0049] The cyclic carbodiimide compound may have one cyclic structure or two or more cyclic structures. When the compound has two or more cyclic structures, the two rings may share two or more atoms, such as a bicyclo structure or a tricyclo structure, or the two rings may share one atom, such as a spiro structure. Furthermore, the atoms constituting the cyclic structure may have a cyclic group as a substituent, thereby resulting in a structure having two or more cyclic structures.

[0050] Examples of the cyclic carbodiimide compound include compounds represented by the following general formula (1).

[0051]

[0052] In general formula (1), X is a divalent or higher linking group. When X is a trivalent or higher linking group, it may be bonded to a polymer or to another cyclic structure. The linking group represented by X contains carbon atoms and hydrogen atoms, and may further contain heteroatoms. Examples of heteroatoms include oxygen atoms, nitrogen atoms, sulfur atoms, and phosphorus atoms.

[0053] The number of atoms (membership) of the cyclic structure comprising the carbodiimide group and X is not particularly limited, and is, for example, preferably 8 to 50, more preferably 10 to 30, and even more preferably 10 to 20. The number of members here does not include the number of atoms of substituents.

[0054] Specific examples of the linking group represented by X include an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, a combination of these, or a combination of these with a hetero atom.

[0055] Examples of the aliphatic hydrocarbon group represented by X include an alkylene group having 1 to 20 carbon atoms, an alkanetriyl group having 1 to 20 carbon atoms, and an alkanetetrayl group having 1 to 20 carbon atoms. The aliphatic hydrocarbon group may have a substituent. Examples of the substituent include an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group.

[0056] Examples of the alicyclic hydrocarbon group represented by X include a cycloalkylene group having 3 to 20 carbon atoms, a cycloalkanetriyl group having 3 to 20 carbon atoms, and a cycloalkanetetrayl group having 3 to 20 carbon atoms. The alicyclic hydrocarbon group may have a substituent. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group.

[0057] Examples of the aromatic hydrocarbon group include an arylene group having 5 to 15 carbon atoms, an arenetriyl group having 5 to 15 carbon atoms, and an arenetetrayl group having 5 to 15 carbon atoms. The aromatic hydrocarbon group may have a substituent. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group.

[0058] The molecular weight of the cyclic carbodiimide compound is preferably 100 to 3,000, more preferably 100 to 2,500, and even more preferably 250 to 2,500.

[0059] The imide equivalent of the cyclic carbodiimide compound is preferably 25 to 500, more preferably 25 to 325, and even more preferably 62 to 325.

[0060] The cyclic carbodiimide compound may be solid or liquid at room temperature (25°C). When the cyclic carbodiimide compound is solid, it may be in any shape, and may be particulate. When the cyclic carbodiimide compound is particulate, the average particle size of the particles is preferably 200 μm or less, more preferably 100 μm or less, even more preferably 20 μm or less, particularly preferably 10 μm or less, and extremely preferably 8 μm or less. Furthermore, the average particle size of the cyclic carbodiimide compound is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 0.8 μm or more.

[0061] In the present disclosure, the average particle size of a cyclic carbodiimide compound refers to the volume average particle size, specifically the particle size (D50) at which the cumulative total from the smallest particle size side reaches 50% in a volume-based particle size distribution curve obtained by a laser diffraction scattering method.

[0062] When the cyclic carbodiimide compound is in the form of particles, the maximum particle size (Dmax) of the particles is preferably 2 mm or less, more preferably 800 μm or less, even more preferably 100 μm or less, and particularly preferably 50 μm or less. The maximum particle size (Dmax) of the cyclic carbodiimide compound is preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more.

[0063] In the present disclosure, the maximum particle size (Dmax) of the cyclic carbodiimide compound refers to the maximum particle size on a volume-based particle size distribution curve determined by a laser diffraction scattering method.

[0064] When the cyclic carbodiimide compound has a spiro structure, examples of the cyclic carbodiimide compound include compounds represented by the following general formula (2).

[0065]

[0066] In the formula, X is a tetravalent group represented by the following formula (3): １ ~Ar ４are each independently an ortho-phenylene group or a 1,2-naphthalene-diyl group which may have a substituent. Examples of the substituent include an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 15 carbon atoms, a halogen atom, a nitro group, an amide group, a hydroxyl group, an ester group, an ether group, and an aldehyde group. １ ~Ar ４ may contain a heteroatom to form a heterocyclic structure. Examples of the heteroatom include an oxygen atom, a nitrogen atom, a sulfur atom, and a phosphorus atom.

[0067]

[0068] Specific examples of the compound represented by formula (2) include the following compounds.

[0069]

[0070] These cyclic carbodiimide compounds can be produced by well-known methods described in various literatures, patent publications, and the like.

[0071] Commercially available cyclic carbodiimide compounds include TCC-FP10M (Teijin Limited, trade name).

[0072] The content of the cyclic carbodiimide compound in the resin composition is not particularly limited, and is, for example, preferably 0.05% by mass to 20% by mass of the entire resin composition, more preferably 0.1% by mass to 20% by mass, even more preferably 0.2% by mass to 15% by mass, and particularly preferably 0.5% by mass to 10% by mass.

[0073] The content of the cyclic carbodiimide compound per 100 parts by mass of the epoxy resin is not particularly limited, and from the viewpoint of increasing the strength of the cured product, it is preferably 1 part by mass or more, more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, and particularly preferably 10 parts by mass or more.

[0074] Furthermore, from the viewpoint of suppressing a decrease in hardness immediately after molding, the content of the cyclic carbodiimide compound per 100 parts by mass of the epoxy resin is preferably 50 parts by mass or less, more preferably 45 parts by mass or less, even more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less.

[0075] The ratio of the total number of functional group equivalents of the entire curing agent and the number of imide group equivalents of the cyclic carbodiimide compound to the number of epoxy group equivalents of the epoxy resin [(number of functional group equivalents of the entire curing agent + number of imide group equivalents of the cyclic carbodiimide compound) / number of epoxy group equivalents of the epoxy resin] is preferably 0.51 to 2.20, more preferably 0.61 to 1.50, even more preferably 0.81 to 1.40, and particularly preferably 1.01 to 1.20.

[0076] (Inorganic Filler) The resin composition contains an inorganic filler containing silica. The type of silica is not particularly limited, and may be any of fused silica, crystalline silica, etc. One type of silica may be used alone, or two or more types may be used in combination.

[0077] The average particle size of the silica is preferably 0.2 μm to 100 μm, and more preferably 0.5 μm to 50 μm. When the average particle size of the silica is 0.2 μm or more, an increase in viscosity of the resin composition tends to be further suppressed. When the volume average particle size of the silica is 100 μm or less, the filling property of the resin composition tends to be further improved.

[0078] The average particle size of silica can be measured as follows: The resin composition is placed in a crucible and left to stand at 800°C for 4 hours to be incinerated. The particle size distribution of the resulting ash is determined using a laser diffraction / scattering particle size distribution analyzer (e.g., HORIBA, Ltd., LA920), and the average particle size of silica can be determined from the particle size distribution as the volume average particle size (D50).

[0079] From the viewpoint of fluidity, the specific surface area of ​​silica is 1.3 m ２ / g to 10.0m ２ / g, and 2.0m ２ / g to 8.0m ２ / g, more preferably 2.5m ２ / g to 7.5m ２ It is more preferable that the SiO2 content is 1 / g.

[0080] The BET method is mainly used to measure the specific surface area of ​​silica. ２ This gas adsorption method involves adsorbing inert gas molecules such as argon (Ar) or krypton (Kr) onto solid particles, and measuring the specific surface area of ​​the solid particles from the amount of adsorbed gas molecules. The specific surface area can be measured using a specific surface area and pore distribution analyzer (for example, SA3100 manufactured by Beckman Coulter).

[0081] The shape of the silica is not particularly limited, and examples thereof include spherical, elliptical, and irregular shapes. The other fillers may be crushed. From the viewpoint of improving the fluidity of the resin composition, the shape of the silica is preferably spherical.

[0082] The inorganic filler may contain an inorganic filler other than silica. The type of the other inorganic filler is not particularly limited, and examples thereof include inorganic materials such as glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, talc, clay, and mica.

[0083] The shape of the other inorganic filler is not particularly limited, and examples thereof include spherical, elliptical, and irregular shapes. The other inorganic filler may be crushed. From the viewpoint of improving the fluidity of the resin composition, the shape of the other inorganic filler is preferably spherical.

[0084] As the other inorganic filler, an inorganic filler having a flame retardant effect may be used. Examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxides of magnesium and zinc, and zinc borate. One type of the other inorganic filler may be used alone, or two or more types may be used in combination.

[0085] The content of silica in the entire inorganic filler is preferably 60% by volume or more, more preferably 65% ​​by volume or more, and even more preferably 70% by volume or more, from the viewpoint of reducing the linear expansion coefficient.

[0086] The total content of the inorganic filler contained in the resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% by volume to 90% by volume of the total resin composition, more preferably 35% by volume to 80% by volume, and even more preferably 40% by volume to 70% by volume. When the content of the inorganic filler is 30% by volume or more of the total resin composition, the properties of the cured product, such as the thermal expansion coefficient, thermal conductivity, and elastic modulus, tend to be further improved. When the content of the inorganic filler is 90% by volume or less of the total resin composition, an increase in the viscosity of the encapsulating resin composition is suppressed, and the fluidity is further improved, tending to result in better moldability.

[0087] [Various Additives] In addition to the components described above, the resin composition may contain various additives such as a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, a colorant, and a stress relaxation agent, as exemplified below. The resin composition of the present embodiment may contain various additives known in the technical field as needed, in addition to the additives exemplified below.

[0088] (Curing Accelerator) The resin composition may contain a curing accelerator as needed. The type of curing accelerator is not particularly limited and can be selected depending on the type of epoxy resin or curing agent, the desired properties of the resin composition, etc.

[0089] Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and the addition of maleic anhydride to these compounds, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone. compounds having intramolecular polarization obtained by adding a compound having a π bond, such as a quinone compound or diazophenylmethane; cyclic amidinium compounds such as the tetraphenylborate salt of DBU, the tetraphenylborate salt of DBN, the tetraphenylborate salt of 2-ethyl-4-methylimidazole, and the tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines such as ethylphosphine and phenylphosphine, secondary phosphines such as dimethylphosphine and diphenylphosphine, and tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkyl alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, and tris(benzyl)phosphine; phosphine compounds such as complexes of the organic phosphines with organic borons; and the organic phosphines or the phosphine compounds, which may be combined with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone. quinone compounds such as 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and anthraquinone, and compounds having intramolecular polarization obtained by adding a compound having a π bond such as diazophenylmethane; a compound having intramolecular polarization, which is obtained by reacting a halogenated phenol compound such as 1-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4'-hydroxybiphenyl with the halogenated phenol compound, followed by a dehydrohalogenation step;Examples of suitable curing accelerators include tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetra-substituted phosphonium with phenolic compounds; salts of tetraalkylphosphonium with partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. These curing accelerators may be used alone or in combination of two or more. Among these, particularly suitable curing accelerators include triphenylphosphine, an adduct of triphenylphosphine with a quinone compound, an adduct of tributylphosphine with a quinone compound, and an adduct of tri-p-tolylphosphine with a quinone compound.

[0090] When the resin composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). When the amount of the curing accelerator is 0.1 part by mass or more per 100 parts by mass of the resin component, the composition tends to cure well in a short time. When the amount of the curing accelerator is 30 parts by mass or less per 100 parts by mass of the resin component, the curing speed is not too fast and a good molded product tends to be obtained.

[0091] (Coupling Agent) The resin composition may contain a coupling agent. From the viewpoint of improving the adhesion between the resin component and the inorganic filler, the resin composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, and disilazane, titanium-based compounds, aluminum chelate-based compounds, and aluminum / zirconium-based compounds.

[0092] When the resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the inorganic filler. When the amount of the coupling agent is 0.05 parts by mass or more per 100 parts by mass of the inorganic filler, adhesion to the frame tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less per 100 parts by mass of the inorganic filler, moldability of the package tends to be further improved.

[0093] (Ion exchanger) The resin composition may contain an ion exchanger. The resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including an encapsulated electronic component. The ion exchanger is not particularly limited, and conventionally known ion exchangers can be used. Specific examples include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion exchangers may be used alone or in combination of two or more. Among these, hydrotalcites represented by the following general formula (A) are preferred.

[0094] Mg （１－Ｘ） Al Ｘ (OH) ２ (CO ３ ) Ｘ／２ ・mH ２ O ……(A) (0<X≦0.5, m is a positive number)

[0095] When the resin composition contains an ion exchanger, the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions. For example, the content of the ion exchanger is preferably 0.1 to 30 parts by mass, and more preferably 1 to 10 parts by mass, per 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent).

[0096] (Mold Release Agent) The resin composition may contain a mold release agent from the viewpoint of obtaining good mold releasability during molding. There are no particular limitations on the mold release agent, and conventionally known ones can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of mold release agent may be used alone, or two or more types may be used in combination.

[0097] When the resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). When the amount of the release agent is 0.01 part by mass or more per 100 parts by mass of the resin component, sufficient release properties tend to be obtained. When the amount is 10 parts by mass or less, better adhesion tends to be obtained.

[0098] (Flame retardant) The resin composition may contain a flame retardant. There are no particular limitations on the flame retardant, and conventionally known flame retardants can be used. Specific examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, and metal hydroxides. The flame retardants may be used alone or in combination of two or more.

[0099] When the resin composition contains a flame retardant, the amount thereof is not particularly limited as long as it is an amount sufficient to obtain the desired flame retardant effect. For example, the amount is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component (total amount of the epoxy resin and the curing agent).

[0100] (Colorant) The resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose, etc. The colorant may be used alone or in combination of two or more.

[0101] (Stress Relaxant) The resin composition may contain a stress relaxation agent. By including a stress relaxation agent, warpage of the package and the occurrence of package cracks can be further reduced. Examples of stress relaxation agents include commonly used known stress relaxation agents (flexibilizers). Specific examples include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based elastomers; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. One type of stress relaxation agent may be used alone, or two or more types may be used in combination. Among stress relaxation agents, silicone-based stress relaxation agents are preferred. Examples of silicone-based stress relaxation agents include those having an epoxy group, those having an amino group, and those modified with polyether, and silicone compounds such as silicone compounds having an epoxy group and polyether-based silicone compounds are more preferred.

[0102] When the resin composition contains a stress relaxation agent, the amount thereof is, for example, preferably 1 part by mass to 30 parts by mass, and more preferably 2 parts by mass to 20 parts by mass, per 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent).

[0103] The resin composition preferably has a solvent content of 5% by mass or less, more preferably 1% by mass or less, even more preferably 0.5% by mass or less, and particularly preferably contains substantially no solvent (0% by mass).

[0104] (Method for preparing resin composition) The method for preparing the resin composition is not particularly limited. A common method includes thoroughly mixing predetermined amounts of components using a mixer or the like, melt-kneading the components using a mixing roll, extruder, or the like, cooling, and pulverizing the mixture. More specifically, for example, a method includes stirring and mixing predetermined amounts of the components described above, kneading the mixture using a kneader, roll, extruder, or the like that has been preheated to 70°C to 140°C, cooling, and pulverizing the mixture.

[0105] The resin composition in this embodiment is preferably solid at room temperature and normal pressure (for example, 25°C, atmospheric pressure). When the resin composition is solid, the shape is not particularly limited, and examples include powder, granules, tablets, etc. When the resin composition is in tablet form, it is preferable that the dimensions and mass of the tablet-shaped resin composition be such that they are suitable for the molding conditions of the package, from the viewpoint of handleability.

[0106] (Characteristics of Resin Composition) - Dielectric Constant - The resin composition is compression molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds, and then post-cured at 175°C for 6 hours. The cured product has a dielectric constant at 5 GHz of, for example, 3.4 to 4.0, and preferably 3.4 to 3.7.

[0107] The relative dielectric constant of the cured product at 10 GHz is, for example, 3.3 to 4.0, preferably 3.3 to 3.7, more preferably 3.3 to 3.5, and may be 3.38 or less.

[0108] The measurement of the relative dielectric constant is carried out at a temperature of 25±3° C. using a dielectric constant measuring device (for example, Agilent Technologies, product name "Network Analyzer N5227A").

[0109] -Dielectric loss tangent- The resin composition is compression molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds, and then post-cured at 175°C for 6 hours to obtain a cured product having a dielectric loss tangent at 5 GHz of, for example, 0.01 or less, and from the viewpoint of reducing transmission loss, preferably 0.005 or less, more preferably 0.003 or less, and even more preferably 0.0021 or less. The lower limit of the dielectric loss tangent at 5 GHz of the cured product is not particularly limited, and for example, can be 0.0015 or more.

[0110] The dielectric loss tangent of the cured product at 10 GHz is, for example, 0.0020 to 0.0030, preferably 0.0020 to 0.0027, and more preferably 0.0020 to 0.0025.

[0111] The dielectric loss tangent is measured at a temperature of 25±3° C. using a dielectric constant measuring device (for example, Agilent Technologies, product name "Network Analyzer N5227A").

[0112] -Flexural Modulus- The elastic modulus of a cured product obtained by molding the resin composition using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 300 seconds is preferably 15 GPa or more, more preferably 17 GPa or more, and even more preferably 19 GPa or more. There is no particular upper limit to the elastic modulus, but it may be 25 GPa or less, or 30 GPa or less.

[0113] The cured product is subjected to a three-point support bending test in accordance with JIS-K-7171 (2016) at 25°C using a Tensilon universal testing machine (Instron Corporation, product name "Instron 5948"), and the flexural modulus E1 (GPa) of the test piece at 25°C is determined.

[0114] - Flexural Strength - A test piece having a size of 4.0 mm x 10.0 mm x 80 mm is prepared from the resin composition using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 300 seconds, and the cured product is post-cured for 6 hours at 175°C. The flexural strength of the cured product is preferably 110 MPa or more, more preferably 120 MPa or more, and even more preferably 125 MPa or more. There is no particular upper limit to the flexural strength, but it may be 140 GPa or less, 135 GPa or less, or 130 GPa or less.

[0115] The bending strength is measured by subjecting the cured product to a bending test at a temperature of 25°C using a Tensilon universal testing machine (for example, Instron Corporation, product name "Instron 5948"), creating a bending stress-displacement curve using the following formula (A), and taking the maximum stress as the bending strength (MPa).

[0116] σ=3FL / 2bh ２ Formula (A) σ: bending stress (MPa) F: bending load (N) L: distance between supports (mm) b: test piece width (mm) h: test piece thickness (mm)

[0117] - Spiral flow - When the resin composition is molded using a spiral flow measurement mold conforming to EMMI-1-66 under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 120 seconds, the flow distance (hereinafter also referred to as "spiral flow") is preferably 80 cm or more, more preferably 100 cm or more, and even more preferably 110 cm or more. The upper limit of the spiral flow is not particularly limited, and may be, for example, 200 cm or less.

[0118] The gel time of the resin composition at 175°C is preferably 30 to 90 seconds, and more preferably 40 to 60 seconds. The gel time at 175°C is measured as follows. Specifically, a 3 g sample of the resin composition is measured at 175°C using a Curelastometer (for example, manufactured by JSR Trading Co., Ltd.), and the time until the torque curve rises is measured as the gel time (sec).

[0119] (Uses of Resin Composition) The resin composition of the present embodiment can be used, for example, in the manufacture of electronic component devices, particularly high-frequency devices, as described below.

[0120] <Electronic Component Device> An electronic component device according to one embodiment of the present disclosure includes a support member, an electronic component disposed on the support member, and a cured product of the resin composition encapsulating the electronic component. Examples of electronic component devices include a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, on which electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors, passive elements such as capacitors, resistors, and coils, antennas, etc.) are mounted, and the resulting electronic component region is encapsulated with a resin composition (e.g., a high-frequency device). The type of support member is not particularly limited, and support members commonly used in the manufacture of electronic component devices can be used.

[0121] In the electronic component device of the present embodiment, if necessary, another electronic component may be disposed on the surface of the support member opposite to the surface on which the electronic component is disposed. The other electronic component may be encapsulated with the resin composition described above, with another resin composition, or may not be encapsulated.

[0122] (Method for manufacturing an electronic component device) The method for manufacturing an electronic component device according to this embodiment includes a step of placing electronic components on a support member and a step of encapsulating the electronic components with the resin composition described above. The method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Furthermore, the types of support member and electronic components used in manufacturing the electronic component device are not particularly limited, and support members and electronic components commonly used in manufacturing electronic component devices can be used.

[0123] Methods for encapsulating electronic components using the resin composition include low-pressure transfer molding, injection molding, compression molding, etc. Among these, low-pressure transfer molding is the most common.

[0124] The above-described embodiment will be specifically described below using examples, but the scope of the above-described embodiment is not limited to these examples.

[0125] <Preparation of Resin Composition> The components shown below were mixed in the blending ratios (parts by mass) shown in Table 1 to prepare resin compositions of Examples and Comparative Examples. This resin composition was solid at room temperature and normal pressure. Table 1 also shows the content of the inorganic filler relative to the entire resin composition ("Vf" (volume %) in the table). Table 1 also shows the "equivalent ratio," which is expressed as "(equivalent number of ester groups of the active ester compound + equivalent number of imide groups of the carbodiimide group) / equivalent number of epoxy groups of the epoxy resin."

[0126] Epoxy resin 1: orthocresol novolac type epoxy resin, epoxy equivalent 200 g / eq. Epoxy resin 2: biphenyl type epoxy resin, epoxy equivalent 192 g / eq.

[0127] Curing agent: Active ester compound, DIC Corporation, product name "EXB-8"

[0128] Cyclic carbodiimide compound (imide equivalent weight 256 g / eq, specific example compound listed as general formula (2) above)

[0129] Curing accelerator: adduct of tributylphosphine and 1,4-benzoquinone Coupling agent: N-phenyl-3-aminopropyltrimethoxysilane Mold release agent: Montan acid ester wax (Clariant Japan Co., Ltd.) Colorant: carbon black (Mitsubishi Chemical Corporation)

[0130] Inorganic filler 1: silica particles, average particle size: 3 μm, specific surface area: 3.0 m ２ / g Inorganic filler 2: silica particles, average particle size: 0.5 μm, specific surface area: 6.6 m ２ / g

[0131] The volume-average particle size of each inorganic filler was a value obtained by the following measurement. Specifically, the inorganic filler was first added to a dispersion medium (water) in an amount ranging from 0.01% by mass to 0.1% by mass, and the mixture was dispersed in a bath-type ultrasonic cleaner for 5 minutes. Five milliliters of the resulting dispersion was poured into a cell, and the particle size distribution was measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (HORIBA, Ltd., LA920). The particle size at an integrated value of 50% (volume basis) in the resulting particle size distribution was taken as the volume-average particle size.

[0132] <Evaluation of Resin Composition> (Dielectric Constant and Dielectric Loss Tangent) The resin composition was charged into a vacuum hand press and molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds. Post-curing was carried out at 175°C for 6 hours to obtain a cured product measuring 50 mm in length, 0.5 mm in width, and 0.5 mm in thickness. This cured product was used as a test piece and the dielectric constant (Dk) and dielectric loss tangent (Df) were measured at a temperature of 25±3°C, 5 GHz, and 10 GHz using a dielectric constant measuring device (Agilent Technologies, product name "Network Analyzer N5227A"). The results are shown in Table 1.

[0133] (Fluidity: Spiral Flow) Using a spiral flow measurement mold conforming to EMMI-1-66, the resin composition was molded under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 120 seconds, and the flow distance (cm) was determined. The results are shown in Table 1.

[0134] (Gel Time) Measurement was carried out at a temperature of 175° C. using a Curelastometer manufactured by JSR Trading Co., Ltd. for 3 g of the resin composition, and the time until the torque curve rose was taken as the gel time (seconds). The results are shown in Table 1.

[0135] (Flexural Modulus) The resin composition was subjected to a transfer molding machine under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 300 seconds to prepare test pieces measuring 4.0 mm x 10.0 mm x 80 mm. The test pieces were then post-cured at 175°C for 6 hours. A three-point support bending test in accordance with JIS-K-7171 (2016) was performed on the resulting cured product using a Tensilon universal testing machine (Instron Corporation, product name "Instron 5948") at 25°C, and the flexural modulus E1 (GPa) of the test piece at 25°C was determined. The flexural modulus was calculated using the following formula: In the formula, E is the flexural modulus (GPa), P is the load cell value (N), y is the displacement (mm), l is the span = 64 mm, w is the test piece width = 12.7 mm, and h is the test piece thickness = 4 mm.

[0136] (Bending Strength) The resin composition was charged into a transfer molding machine and molded into a 4.0 mm x 10.0 mm x 80 mm rectangular parallelepiped at a mold temperature of 175 ° C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Post-curing was performed at 175 ° C for 6 hours to prepare a test specimen for evaluating bending strength. Using this test specimen, a bending test was performed using a Tensilon universal testing machine (Instron 5948, Instron Corporation) under conditions of a support distance of 64 mm, a crosshead speed of 10 mm / min, and a temperature of 25 ° C. Using the measured results, a bending stress-displacement curve was created from the above formula (A), and the maximum stress was taken as the bending strength (MPa). The results are shown in Table 1.

[0137]

[0138] As shown in Table 1, the cured products obtained from the resin compositions of Examples 1 and 2 had lower dielectric tangents and significantly improved bending strengths compared to the cured product obtained from the resin composition of Comparative Example 1.

[0139] The disclosure of Japanese Patent Application No. 2023-119484 is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A resin composition containing an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.

2. The resin composition according to claim 1, wherein the content of the cyclic carbodiimide compound is 1 part by mass or more per 100 parts by mass of the epoxy resin.

3. A resin composition according to claim 1 or claim 2, wherein the content of the cyclic carbodiimide compound is 50 parts by mass or less per 100 parts by mass of the epoxy resin.

4. A resin composition according to claim 1 or 2, wherein the ratio of the total amount of the functional group equivalent number of the entire curing agent and the imide group equivalent number of the cyclic carbodiimide compound to the epoxy group equivalent number of the epoxy resin [(functional group equivalent number of the entire curing agent + imide group equivalent number of carbodiimide group) / epoxy group equivalent number of the epoxy resin] is 0.51 to 2.

20.

5. The resin composition according to claim 1 or 2, further comprising at least one selected from the group consisting of a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, a colorant, and a stress relaxation agent.

6. An electronic component device comprising: a support member; an electronic component arranged on the support member; and a cured product of the resin composition according to claim 1 or 2 encapsulating the electronic component.

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