Aluminum-based extrusion material, electronic device housing, and electronic device

Abstract

Disclosed are an aluminum-based extrusion material, an electronic device housing, and an electronic device. The aluminum-based extrusion material may comprise a single or multiple pattern regions including intermetallic compound particles on one or both surfaces thereof.

Description

Aluminum extrusions, electronic device housings and electronic devices

[0001] Embodiments of the present disclosure relate to aluminum-based extrusions, electronic device housings, and electronic devices.

[0002] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] Electronic devices include housings made of various materials, which protect internal components of the electronic device from external impact. Furthermore, electronic device housings can be manufactured to be easily portable and provide a pleasing aesthetic to the user during use. Electronic device housings must have high strength and hardness to protect the various internal components and modules of the electronic device, and may also have excellent gloss to ensure a high appearance. Aluminum extrusion alloys can be used as electronic device housings. Aluminum alloys offer excellent rigidity and can provide, or design with, the high-gloss and / or glossy surface characteristics of metals.

[0004] According to embodiments of the present disclosure, an aluminum-based extruded material may include a single or multiple patterned regions comprising intermetallic compound particles on one or both surfaces of the extruded material.

[0005] According to embodiments of the present disclosure, an electronic device housing may include an aluminum-based extrusion according to embodiments of the present disclosure in at least a portion of an exterior of the electronic device housing.

[0006] According to embodiments of the present disclosure, an electronic device may include an aluminum-based extrusion according to embodiments of the present disclosure or a housing of the electronic device.

[0007] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to embodiments.

[0008] FIG. 2a illustrates one side of an aluminum-based extruded material (200) according to embodiments.

[0009] FIG. 2b illustrates one side of an aluminum-based extruded material (200) according to embodiments.

[0010] FIG. 3 illustrates a partial configuration of an extruder (300) according to embodiments.

[0011] FIG. 4a shows an SEM image of an aluminum-based extruded material (200) manufactured in Example 1 according to embodiments.

[0012] Figure 4b is an enlarged view of a portion of the SEM image of Figure 4a according to embodiments.

[0013] FIG. 4c is an elemental analysis result of the pattern area (220) in the SEM image of FIG. 4a according to embodiments.

[0014] FIG. 5a shows an image and surface characteristics of an electronic device component using the aluminum-based extruded material of Example 1 according to embodiments.

[0015] FIG. 5b shows an image and surface characteristics of an electronic device component using the aluminum-based extruded material of Comparative Example 1 according to embodiments.

[0016] Figure 6a is a flow chart of a method for manufacturing an aluminum-based extruded material according to embodiments.

[0017] Figure 6b is a flow chart of a method for manufacturing an aluminum-based extruded material according to embodiments.

[0018] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to embodiments.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] According to embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] FIGS. 2A and 2B illustrate one side of an aluminum-based extruded material according to embodiments of the present disclosure. In FIGS. 2A and 2B, the aluminum-based extruded material (200) may include an aluminum-based base substrate (210); a patterned region (220) comprising intermetallic compound particles on one or both sides (e.g., the surface) of the base substrate (210); and a non-patterned region (230).

[0043] In one embodiment, the base substrate (210) may be an aluminum alloy extrusion. In one embodiment, the aluminum alloy extrusion includes a ternary or higher, quaternary or higher, or quinary or higher aluminum (Al) alloy, and the aluminum (Al) alloy may correspond to an alloy matrix of the aluminum alloy extrusion. In one embodiment, the aluminum alloy may include: aluminum (Al); and at least one of iron (Fe), zinc (Zn), magnesium (Mg), manganese (Mn), copper (Cu), titanium (Ti), chromium (Cr), zirconium (Zr), strontium (Sr), or silicon (Si), a combination thereof, or all thereof.

[0044] In one embodiment, each element other than aluminum (Al) in the aluminum alloy may be present in an amount of from about 0.01 wt % to about 15 wt %; from about 0.05 wt % to about 14 wt %; from about 0.1 wt % to about 10 wt %; from about 0.1 wt % to about 7 wt %; from about 0.1 wt % to about 6 wt %; from about 0.1 wt % to about 5 wt %; from about 0.5 wt % to about 5 wt %; from about 1 wt % to about 5 wt %; from about 1 wt % to about 4 wt %; or from 0.1 wt % to about 1 wt %, based on the total weight of the aluminum alloy (or the aluminum alloy extrusion).

[0045] According to one embodiment, the base substrate (210) may include an aluminum alloy comprising about 0.05 wt. % to about 15 wt. % of iron (Fe) based on the total weight of the aluminum alloy (or aluminum alloy extrusion), and including inevitable impurities and a balance of aluminum (Al).

[0046] According to one embodiment, the base substrate (210) may include an aluminum alloy comprising, based on the total weight of the aluminum alloy (or aluminum alloy extrusion), iron (Fe) in an amount of from about 0.05 wt % to about 15 wt %; and at least one of zinc (Zn), magnesium (Mg), manganese (Mn), copper (Cu), or chromium (Cr); or a combination thereof, each in an amount of from about 0.01 wt % to about 8 wt %, and inevitable impurities and a balance of aluminum (Al). In some embodiments, the aluminum alloy may include zinc (Zn), magnesium (Mg), copper (Cu), and chromium (Cr).

[0047] According to one embodiment, the base substrate (210) may include an aluminum alloy comprising, based on the total weight of the aluminum alloy (or aluminum alloy extrusion), iron (Fe) in an amount of from about 0.05 wt % to about 15 wt %; and at least one or more of zinc (Zn), magnesium (Mg), manganese (Mn), or copper (Cu), or a combination thereof, each in an amount of from about 0.01 wt % to about 8 wt %, and inevitable impurities and a balance of aluminum (Al). In some embodiments, the aluminum alloy may include zinc (Zn), magnesium (Mg), and manganese (Mn).

[0048] According to one embodiment, the base substrate (210) may include an aluminum alloy comprising, based on the total weight of the aluminum alloy (or aluminum alloy extrusion), iron (Fe) in an amount of from about 0.05 wt % to about 15 wt %; and at least one or more of zinc (Zn), magnesium (Mg), manganese (Mn), or silicon (Si), or a combination thereof, each in an amount of from about 0.01 wt % to about 8 wt %, and inevitable impurities and a balance of aluminum (Al). In some embodiments, the aluminum alloy may include zinc (Zn), magnesium (Mg), and silicon (Si).

[0049] According to one embodiment, the thickness of the base substrate (210) is about 1 μm (micrometer) or more; about 30 μm (micrometer) or more; about 100 μm (micrometer) or more; about 300 μm (micrometer) or more; about 600 μm (micrometer) or more; about 800 μm (micrometer) or more; about 1,000 μm (micrometer) or more; about 3,000 μm (micrometer) or more; about 5,000 μm (micrometer) or more; about 8,000 μm (micrometer) or more; about 10,000 μm (micrometer) or more; about 30,000 μm (micrometer) or more; about 50,000 μm (micrometer) or less; about 40,000 μm (micrometer) or less; About 20,000 ㎛ (micrometers) or less; About 9,000 ㎛ (micrometers) or less; About 6,000 ㎛ (micrometers) or less; About 1 ㎛ (micrometer) to about 50,000 ㎛ (micrometers); About 1 ㎛ (micrometer) to about 20,000 ㎛ (micrometers); About 1 ㎛ (micrometer) to about 10,000 ㎛ (micrometers); About 1 ㎛ (micrometer) to about 6,000 ㎛ (micrometers); About 1 ㎛ (micrometer) to about 3,000 ㎛ (micrometers); About 20 ㎛ (micrometers) to about 2,000 ㎛ (micrometers); or About 50 ㎛ (micrometers) to about 1,000 ㎛ (micrometers); may be. Here, the thickness is an average, maximum or minimum value, and may be the size of the inner or outer diameter depending on the shape of the base material (210).

[0050] According to one embodiment, the base substrate (210) is an extruded product extruded in various shapes, and may include at least one or more of a flat shape (e.g., a film or sheet), a circular shape, a polygonal shape, a rod shape, a bar shape, a hollow polygonal tube, a T shape, a hollow circular tube, or a hollow oval tube, or a combination thereof. According to one embodiment, the base substrate (210) may have a shape (or appearance) selected according to the application field, and may be a flat shape for application as a component or material of an electronic device housing.

[0051] According to one embodiment, the aluminum alloy extrusion in the base material (210) may be formed of a plurality of crystal grain structures. The crystal grains in the aluminum alloy extrusion may be formed by extruding an aluminum alloy formed by casting molten aluminum, and may be formed during a cooling process in which the aluminum alloy is slowly cooled. According to one embodiment, the crystal grains of the aluminum alloy extrusion may have a size determined by one or more of the type of process and / or process conditions after casting. In some embodiments, increasing the cooling rate of the aluminum alloy after casting may reduce the size of the crystal grains in the aluminum alloy.

[0052] In one embodiment, the aluminum alloy extruded material in the base substrate (210) may have grains formed therein, and the average grain diameter may be from about 100 μm (micrometers) to about 300 μm (micrometers); from about 150 μm (micrometers) to about 300 μm (micrometers); or from about 150 μm (micrometers) to about 250 μm (micrometers). Two or more grains may be adjacent at an edge and form grain boundaries at a boundary, and the two or more adjacent grains may have different potentials based on the grain boundaries. In one embodiment, the potential difference at the interface between two or more adjacent grains in the aluminum-based extruded material may be from about 30 mV to about 100 mV; or from about 30 mV to about 50 mV.

[0053] According to one embodiment, the pattern region (220) may be arranged singly or in plurality on the base substrate (210). According to one embodiment, each pattern region in the plurality of pattern regions (220) may be arranged at a constant or random interval within a space of about 1 μm (micrometer) to about 200 μm (micrometer); about 10 μm (micrometer) to about 100 μm (micrometer); or about 20 μm (micrometer) to about 100 μm (micrometer) to form a plurality of pattern regions. This interval can be controlled by extrusion process conditions such as the content of the intermetallic compound, the extrusion speed (e.g., the exit speed of the extrudate), and the temperature during the extrusion process. According to one embodiment, the interval can be controlled by adjusting the extrusion speed.

[0054] According to one embodiment, the plurality of pattern regions (220) may each include pattern regions in which the size, density, or both of the intermetallic compound particles are the same or different.

[0055] According to one embodiment, the size of the intermetallic compound particles in the pattern region (220) may be about 1 μm (micrometer) or more; about 3 μm (micrometer) or more; about 8 μm (micrometer) or more; about 10 μm (micrometer) or more; about 20 μm (micrometer) or more; about 50 μm (micrometer) or more; about 60 μm (micrometer) or more; about 80 μm (micrometer) or more; about 100 μm (micrometer) or less; about 1 μm (micrometer) to about 100 μm (micrometer); about 3 μm (micrometer) to about 50 μm (micrometer); or about 3 μm (micrometer) to about 20 μm (micrometer). Here, "size" is the average, maximum or minimum, and may be the particle size of the particle or, depending on the shape of the particle, the diameter, length, width or thickness.

[0056] According to one embodiment, the density of the intermetallic compound in the pattern area (220) is the number of particles per unit area (EA / 1000 ㎛). 2 ) may correspond to. According to one embodiment, the density of the intermetallic compound is about 20 EA / 1000 ㎛. 2 Ideal (or, exceeding); about 30 EA / 1000 ㎛ 2 Above; about 50 EA / 1000 ㎛ 2 Above; about 100 EA / 1000 ㎛ 2 Above; Approximately 300 EA / 1000 ㎛ 2 Above; Approximately 500 EA / 1000 ㎛ 2 Above; Approximately 600 EA / 1000 ㎛ 2 , or about 1000 EA / 1000 ㎛ 2 It may be anomalies. The figures mentioned here may be minimum, maximum, or average values.

[0057] In one embodiment, the size (e.g., width) of the pattern region (220) (e.g., width (D) of FIG. 4b) may be from about 10 μm (micrometers) to about 200 μm (micrometers); from about 20 μm (micrometers) to about 150 μm; from about 20 μm (micrometers) to about 120 μm (micrometers); from about 20 μm (micrometers) to about 110 μm (micrometers); from about 20 μm (micrometers) to about 100 μm (micrometers); from about 50 μm (micrometers) to about 100 μm (micrometers); or from about 80 μm (micrometers) to about 100 μm (micrometers). The values ​​mentioned herein may be minimum, maximum or average values.

[0058] In one embodiment, the shape of the pattern region can include at least one or more of straight lines (e.g., bands), diagonal lines, curved lines (e.g., s- or z-shaped), circular lines, and elliptical lines, or a combination thereof. In one embodiment, the intermetallic compound particles in the pattern region (220) can be arranged in a specific direction, and in some embodiments, the intermetallic compound particles can be arranged along the extrusion direction of the aluminum-based extruded material (e.g., A of FIGS. 2A and 2B ).

[0059] According to one embodiment, the non-patterned area (230) corresponds to an area other than the patterned area (220), and the patterned area (220) and the non-patterned area (230) have a density of intermetallic compound particles (EA / 1000 ㎛). 2 ) can be distinguished by. According to one embodiment, the non-patterned region (230) may have a lower density of intermetallic compound particles than the patterned region (220). According to one embodiment, the density of intermetallic compound particles in the non-patterned region (230) is about 20 EA / 1000 ㎛. 2 Less than (or less than); about 15 EA / 1000 ㎛ 2 Below; about 10 EA / 1000 ㎛ 2 Below; about 8 EA / 1000 ㎛ 2 Below; about 5 EA / 1000 ㎛ 2Below; approx. 2 EA / 1000 ㎛ 2 Below; approximately 1 EA / 1000 ㎛ 2 Below; approximately 0.1 EA / 1000 ㎛ 2 or less; or about 0 EA / 1000 ㎛ 2 This may be free of intermetallic compound particles. According to one embodiment, the pattern region (220) and the non-pattern region (230) may be alternately arranged one or more times; two or more times; five or more times; or ten or more times. That is, when the pattern region (220) and the non-pattern region (230) are arranged continuously and repeatedly, a wood grain or wood texture can be implemented.

[0060] According to one embodiment, the size (e.g., width) of the non-patterned region (230) may be about 1 μm (micrometer) or more; about 10 μm (micrometer) or more; about 30 μm (micrometer) or more; about 200 μm (micrometer) or less; about 150 μm (micrometer) or less; about 110 μm (micrometer) or less; about 100 μm (micrometer) or less; about 90 μm (micrometer) or less; from about 1 μm (micrometer) to about 200 μm (micrometer); from about 10 μm (micrometer) to about 100 μm (micrometer); or from about 20 μm (micrometer) to about 100 μm (micrometer). The values ​​mentioned herein may be minimum, maximum or average values.

[0061] According to one embodiment, the intermetallic compound particles may comprise at least one or more of the following shapes: spherical, ellipsoidal, fibrous, needle-shaped, lenticular (e.g., concave or convex), polygonal, or polyhedral, or a combination thereof. In some embodiments, the polygonal shape may be triangular, square, pentagonal, or hexagonal.

[0062] In one embodiment, the intermetallic compound particles may be elongated in a regular shape or in a specific direction (e.g., an extrusion direction) (e.g., A of FIGS. 2A and 2B). In one embodiment, the number of particles (EA) in the elongated shape in the pattern area (220) may be at least n times (e.g., n is an integer greater than or equal to about 2; an integer greater than or equal to about 5; an integer greater than or equal to about 10; an integer from about 2 to about 20; an integer from about 2 to about 15; or an integer from about 5 to about 10) greater than the number of particles (EA) in the regular shape.

[0063] In one embodiment, the intermetallic compound can include two selected from the group consisting of Fe, Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, and Ir. In one embodiment, the intermetallic compound can be an Fe-containing intermetallic compound comprising Fe; and at least one or more of Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, and Ir, or a combination thereof. In some embodiments, the Fe-containing intermetallic compound can be an intermetallic compound of Fe and Al; Fe and Mg; Fe and Zn; Fe and Mn; Fe and Ca; Fe and Cu; Fe and Cr; or Fe and Si.

[0064] In one embodiment, the intermetallic compound can be a Cu-containing intermetallic compound comprising Cu; and at least one or more of Al, Ag, Au, Ba, Co, Ca, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, and Ir, or a combination thereof. In some embodiments, the Cu-containing intermetallic compound can be an intermetallic compound of Cu and Al; Cu and Zn; Cu and Mn; Cu and Ca; or Cu and Ni.

[0065] In one embodiment, the intermetallic compound can be a Ti-containing intermetallic compound comprising Ti; and at least one or more of Al, Ag, Au, Ba, Co, Ca, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Si, Sr, Li, and Ir, or combinations thereof. In some embodiments, the Ti-based intermetallic compound can be an intermetallic compound of Ti and Al, Ti and Zn, Ti and Mn, or Ti and Ni.

[0066] In one embodiment, the intermetallic compound can be a Pt-based intermetallic compound comprising Pt; and at least one or more of Al, Ag, Au, Ba, Co, Ca, Eu, Rh, Ru, Pd, Na, Ni, Mn, Zn, Yb, Si, Sr, Li, and Ir, or combinations thereof. In some embodiments, the Pt-based intermetallic compound can be an intermetallic compound of Pt and Al, Pt and Zn, Pt and Mn, Pt and Ca, or Pt and Ni.

[0067] In one embodiment, the intermetallic compound may be formed during the casting process of the base substrate (100) (e.g., aluminum alloy). In one embodiment, the intermetallic compound may be formed by a component (e.g., Fe or Fe-containing compound) dissolved into the material from a melting furnace or infrastructure during the casting process (e.g., melting / refining) of the base substrate (100) (e.g., aluminum alloy). In one embodiment, the intermetallic compound may be added during the casting process (e.g., melting / refining) of the base substrate (210) (e.g., aluminum alloy).

[0068] According to one embodiment, the intermetallic compound may exhibit distribution and arrangement characteristics for implementing a pattern region (220) during an extrusion process. According to one embodiment, the intermetallic compound may exhibit distribution and arrangement characteristics for implementing a pattern region (220) through the configuration of the extrusion system or the setting of extrusion process conditions. According to one embodiment, an extrusion mold (e.g., an extrusion mold (320) of FIG. 3) of the extrusion system may be designed to form a pattern region (220) in which the distribution of the intermetallic compound (e.g., an Fe-containing intermetallic compound) is arranged in a specific shape (e.g., a linear arrangement) along the extrusion direction.

[0069] According to one embodiment, referring to FIG. 3, FIG. 3 illustrates a configuration of an extruder (300) according to embodiments of the present disclosure, including a billet (310), an extrusion mold (220) (e.g., a die), and an extrudate (330) (e.g., an aluminum-based extrudate (200) of FIGS. 2A and 2B) in the extruder (300). Configurations for extruder operation other than those mentioned may be generally known.

[0070] According to one embodiment, the billet (310) is a material (e.g., aluminum alloy) of the base substrate (e.g., 210 of FIGS. 2a and 2b), and the material (e.g., aluminum alloy) (e.g., billet) may be manufactured by a casting method.

[0071]

[0072] In one embodiment, the extrusion die (320) hot-extrudes the billet (310) and has a step section (S) in which the cross-sectional area narrows toward the exit. That is, the length of the step section (S) may be increased by about 2 times or more, about 3 times or more, about 4 times or more, or about 5 times or more than the diameter (or height) (L) of the mold exit. In one embodiment, the length of the step section (S) may be increased so that the height (H) of the step is at a level where the upper and lower portions of the billet (310) are in contact. By increasing the length of the step section (S), the time for which the area of ​​the billet (310) with a large cross-sectional area is converted into an extrudate (330) with a smaller cross-sectional area (e.g., 200 in FIGS. 2A and 2B) through the extrusion die (320) prior to extrusion can be increased. According to one embodiment, the time implemented by the step section (S) of the extrusion mold (320) in the extruder (300) of FIG. 3 may be increased compared to a general extrusion mold with a short step section. That is, the extrusion process is such that the direction (P) of the pressure within the extruded material (e.g., aluminum alloy) is formed by the resultant force of the extrusion direction X and the change in the cross-sectional area of ​​the extruded material Z direction, and the force in the Z direction per unit area may be reduced so that the direction of the overall force may change closer to the X direction than in a general extruder. This change in the direction of the force causes the intermetallic compound to move only in the X direction during extrusion, compared to the movement in the Z direction. As a result, an arrangement (e.g., a linear arrangement) in the X direction (e.g., the extrusion direction) (A of FIGS. 2A and 2B) can be formed during a continuous extrusion process.

[0073] According to one embodiment, during the extrusion process using the extruder (300) of FIG. 3, the distribution of undissolved intermetallic compounds (e.g., Fe-containing intermetallic compounds) can be arranged in a manner of forming a specific region or a specific pattern shape (e.g., pattern region) (e.g., linear pattern). According to one embodiment, during the extrusion process using the extruder (300) of FIG. 3, the undissolved intermetallic compounds (e.g., Fe-containing intermetallic compounds) can form a pattern region (e.g., 220 of FIGS. 2A and 2B) in which the intermetallic compounds are linearly distributed (e.g., band pattern) and a non-pattern region (e.g., 230 of FIGS. 2A and 2B) in which the number of intermetallic compounds is lower or absent (e.g., free) than the pattern region (e.g., 220 of FIGS. 2A and 2B).

[0074] In one embodiment, the width of the pattern region (220) can be adjusted by controlling the extrusion speed (e.g., exit speed) in the extrusion process. In one embodiment, the extrusion speed (e.g., exit speed) can be about 10.0 m / min or more; about 15.0 m / min or more; about 18.0 m / min or more; or about 20.0 m / min or more. The values ​​mentioned here can be minimum, maximum, or average values. When the mentioned extrusion speed or the mentioned extrusion speed and the extruder (300) of FIG. 3 are applied, a pattern region (220 of FIGS. 2A and 2B) can be formed according to the distribution of the intermetallic compound on (e.g., surface) of the base substrate (210). In one embodiment, when the extrusion speed is increased, the width of the pattern region (220 of FIGS. 2A and 2B) can be increased.

[0075] According to one embodiment, the extruder (300) in FIG. 3 may further include a cooling unit (340) at the exit area of ​​the extrusion mold to cool the extrudate passing through the extrusion mold (320). That is, when the temperature at the extrusion outlet becomes excessively high due to excessive heat generated during extrusion by increasing the step section (S), the flatness of the extrudate can be prevented or reduced by installing the cooling unit (340) at the exit of the extrusion mold.

[0076] According to one embodiment, the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) may further include an etched region (e.g., 240 of FIG. 2B) processed by an etching process on one or both sides. According to one embodiment, the etched region (240) may be etched on a surface on which the pattern region (220) is formed. According to one embodiment, the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) may be etched on a surface on which the pattern region (220) is formed after the extrusion process to control the etching depth between the pattern region (220) and the non-pattern region (230), form a three-dimensional pattern by a combination of the etching process and an intermetallic compound, or make the outline of the pattern region (220) more distinct. According to one embodiment, the three-dimensional pattern may have a shape corresponding to the shape of the pattern region (220). In one embodiment, the three-dimensional pattern may form a wood grain or a pattern or texture similar to a wood grain.

[0077] In some embodiments, the etching process may utilize a wet etching, flash etching, quick etching, or plasma etching method. In some embodiments, the wet etching may utilize an etchant comprising a base, an inorganic acid, or an organic acid. In some embodiments, the etchant may comprise from about 1 N to about 5 N, or from about 10% to about 30% of a base, an inorganic acid, or an organic acid. In some embodiments, the etchant may include, but is not limited to, hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, organic acids, perhydrol / sulfuric acid types (e.g., H2O2 and H2SO4), sodium persulfate / sulfuric acid types (e.g., Na2S2O8 and H2SO4), and the like. In some embodiments, the etchant may include, but is not limited to, a hydroxide compound such as sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, barium hydroxide, ammonium hydroxide, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, and the like. In some embodiments, the etching process may be performed for at least 1 minute; at least 10 minutes; at least 30 minutes; or at least 1 hour and at a temperature of from room temperature (rt) (e.g., from about 15° C. to about 25° C.) to about 100° C.

[0078] According to one embodiment, an anodizing layer (e.g., 250 in FIG. 2b) may be further included on one or both surfaces of an aluminum-based extruded material (e.g., 200 in FIGS. 2a and 2b). The aluminum-based extruded material (e.g., 200 in FIGS. 2a and 2b) may have a protective film (e.g., an oxide film) formed on the surface of the aluminum-based extruded material by an anodizing process. According to one embodiment, the aluminum-based extruded material (e.g., 200 in FIGS. 2a and 2b) may have an oxide film formed on the surface, and the appearance quality (e.g., color or gloss) of the aluminum-based extruded material may be determined according to the characteristics of the oxide film. According to one embodiment, the oxide film formed on the surface of the aluminum-based extruded material (e.g., 220 in FIGS. 2a and 2b) may not be easily peeled off. According to one embodiment, the anodizing layer (250) can implement an extruded material appearance that directly reflects the pattern area (220). In addition, compared to an extruded material in which an intermetallic compound is uniformly or randomly distributed, an extruded material having a pattern area (220) (e.g., 200 in FIGS. 2A and 2B) has no or improved decrease or performance degradation in physical properties such as strength and hardness, and can also implement a design, texture, or provide an aesthetic effect by the pattern area (220).

[0079] According to one embodiment, the anodizing layer (250) may be anodized using an acid bath immersion (e.g., sulfuric acid, oxalic acid, phosphoric acid, chromic acid, tartaric acid, or citric acid); an alkaline bath immersion (e.g., sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, strontium hydroxide, sodium carbonate, or sodium hydrogen carbonate); or all of these. Anodizing may be performed using a conventional and standardized method known in the art. For example, it can be performed at a temperature of about 5° C. (degrees Celsius) to about 30° C. (degrees Celsius), a voltage of about 4 V (volts) to about 10 V (volts), and a time of about 5 minutes to about 180 minutes in about 5% to about 20% NaOH.

[0080] According to one embodiment, the anodizing layer (250) may be formed on the layer on which the pattern area (220) is formed. According to one embodiment, the thickness of the anodizing layer (250) is about 0.1 μm (micrometer) or more; about 0.3 μm (micrometer) or more; about 0.5 μm (micrometer) or more; about 1 μm (micrometer) or more; about 2 μm (micrometer) or more; about 5 μm (micrometer) or more; about 10 μm (micrometer) or more; about 1 μm (micrometer) to about 200 μm (micrometer); about 10 μm (micrometer) to about 200 μm (micrometer); about 50 μm (micrometer) to about 200 μm (micrometer); Or it may be about 100 μm (micrometers) to about 200 μm (micrometers). The values ​​mentioned here may be minimum, maximum, or average values. According to one embodiment, an anodizing layer (250) may be formed on a surface on which a pattern area (220) having an etching treatment area (240) is formed.

[0081] According to one embodiment, the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) may have a yield strength of at least about 450 MPa (megapascals). According to various embodiments, the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) may be subjected to a homogenization process through heat treatment, and the yield strength of the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) may be at least about 200 MPa (megapascals); at least about 230 MPa (megapascals); at least about 250 MPa (megapascals); at least about 280 MPa (megapascals); at least about 300 MPa (megapascals); at least about 330 MPa (megapascals); at least about 350 MPa (megapascals). It can be about 380 MPa (megaPascals) or greater; about 400 MPa (megaPascals) or greater; about 420 MPa (megaPascals) or greater; about 440 MPa (megaPascals) or greater; about 460 MPa (megaPascals) or greater, about 465 MPa (megaPascals) or greater, about 470 MPa (megaPascals) or greater, about 480 MPa (megaPascals) or greater, about 490 MPa (megaPascals) or greater, about 500 MPa (megaPascals) or greater, about 510 MPa (megaPascals) or greater, about 520 MPa (megaPascals) or greater, about 530 MPa (megaPascals) or greater, or about 540 MPa (megaPascals) or greater. The yield strength mentioned in any embodiment can be a minimum, a maximum, or an average value. In one embodiment, the yield strength may be measured by a standard measurement method (e.g., KS D 8301).

[0082] According to one embodiment, the aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B) may have a surface hardness of about 90 Hv or more; about 100 Hv or more; about 120 Hv or more; about 130 Hv or more; about 150 Hv or more; about 160 Hv or more, about 170 Hv or more, about 180 Hv or more, about 190 Hv or more, about 200 Hv or more, or about 210 Hv or more. The surface hardness may be measured according to a Vickers hardness measurement method (e.g., KS D 8301), and specifically, the aluminum-based extrusion may be pressed using a pyramid-shaped diamond indenter having a square pyramidal shape with a diagonal angle of 136°, and the hardness may be measured through the diagonal length of a pyramid-shaped concave portion formed by the pressing. According to one embodiment, the surface hardness of the aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B) can be about 160 Hv or greater; about 170 Hv or greater; about 180 Hv or greater; about 190 Hv or greater; about 200 Hv or greater; or about 210 Hv or greater.

[0083] In one embodiment, the aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B ) can have a surface gloss of 300 GU or greater as measured in accordance with ISO 2813. In one embodiment, the aluminum-based extrusion can be used in a housing of an electronic device (e.g., an external frame of the electronic device) to protect internal components and modules of the electronic device. In one embodiment, the aluminum-based extrusion can have a glossiness so that the appearance of the electronic device can be attractive.

[0084] According to one embodiment, an aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B) may be formed into an electronic device housing by performing a cutting process (e.g., CNC cutting). When the cutting process is performed, it may be desirable for the aluminum-based extrusion to have high corrosion resistance and / or machinability in order to form a desired shape or form. According to one embodiment, the aluminum-based extrusion formed by extrusion (e.g., 200 of FIGS. 2A and 2B) may be processed into a shape of a housing suitable for an electronic device by performing the cutting process, and may be particularly desirable for manufacturing small parts (e.g., housings of mobile electronic devices) because the aluminum-based extrusion has excellent corrosion resistance or machinability, allowing the cut surface to be cut cleanly and quickly.

[0085] According to one embodiment, an aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B) may have excellent extrudability. For example, the extrusion process of an aluminum alloy may be performed while heating to a temperature below the solidus temperature of the aluminum alloy, and the extrusion speed may be determined by considering the temperature increase due to frictional heat during extrusion. According to one embodiment, the aluminum-based extruded material may have a solidus temperature of about 600°C (degrees Celsius) or higher, and may be heated at a preheating temperature of about 400°C (degrees Celsius) or higher; about 450°C (degrees Celsius) or higher; about 480°C (degrees Celsius) or higher; about 500°C (degrees Celsius) or higher; about 530°C (degrees Celsius) or higher; or about 550°C (degrees Celsius) or higher (or lower), thereby reducing an extrusion load during extrusion and reducing flow stress.

[0086] According to one embodiment, the surface gloss of an aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B) can be measured according to the International Organization for Standardization's standard ISO 2813. According to ISO 2813, the surface gloss of an uncolored specimen having a thickness of about 10 ㎛ (micrometers) can be measured by measuring the amount of light reflected by incident light at an incident angle of 60° (degrees), thereby measuring the surface gloss of the surface of the aluminum-based extrusion.

[0087] In one embodiment, the aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) may have a surface gloss of at least about 300 GU as measured according to ISO 2813.

[0088] Example

[0089] As shown in Fig. 3, a 70 series aluminum alloy ballet was preheated and extruded at about 450°C (degree Celsius) to about 550°C (degree Celsius) using an extrusion die (the length of the step section: more than 4 times the exit diameter). The size of the pattern area of ​​the extrudate and the density of the intermetallic compound were measured and shown in Table 1. Next, the extrudate was flattened and etched with NaOH. Next, anodizing treatment was performed. Figs. 4a, 4b, and 4c show an SEM image of the manufactured extrudate (Fig. 4a), an enlarged image of the pattern area (220) and the non-pattern area (230) (Fig. 4b), and the results of EDS elemental analysis (Fig. 4c) of the pattern area (220) during the measurement process of the SEM image (Fig. 4a).

[0090] Comparative Example 1

[0091] An extruded product was manufactured in the same manner as Example 1, except that an aluminum-based extruded product was manufactured using a generally known extruder.

[0092] The extrudates of Example 1 and Comparative Example 1 can be heat-treated at about 210° C. (degrees Celsius) to homogenize each 70 series aluminum alloy. The extrudates formed in this manner according to Example 1 and Comparative Example 1 were subjected to a flattening process, a CNC cutting process, an etching process, and an anodizing process to manufacture a metal frame for a tablet electronic device having an oxide film formed on the surface. The image of the rear appearance of the electronic device equipped with the metal frame and the surface of a specific area were enlarged to confirm the distribution of the intermetallic compound. The results are shown in FIG. 5a (Example 1) and FIG. 5b (Comparative Example 1).

[0093] Density of pattern area (220) (EA / 1000 ㎛) 2 ) Density of non-patterned area (230) (EA / 1000 ㎛) 2 ) Width of pattern area (㎛) Example 1601090 to 100

[0094] In Table 1, Example 1 is characterized in that intermetallic compounds (e.g., Fe-containing intermetallic compounds) having a size of 10 ㎛ (micrometers) or less are densely and intensively arranged, and thus an extrudate having a band-shaped pattern linearly arranged along the extrusion direction (arrow) can be produced. In Comparative Example 1, since the intermetallic compounds are randomly distributed, a pattern area according to the distribution and arrangement of the intermetallic compounds is not formed.

[0095] In addition, in FIG. 4b, the width (D) of the pattern area (220) is about 90 μm (micrometer) to about 100 μm (micrometer), and there is a difference in the density of the intermetallic compound between the pattern area (220) and the non-pattern area (230), and in the EDS analysis results, a high Fe component is detected in the pattern area, indicating that an Fe-containing intermetallic compound exists.

[0096] That is, when a general extrusion process or extruder is used, the Fe-containing intermetallic compound has a very high melting point, so it is not dissolved in the aluminum alloy matrix during the extrusion process, but is destroyed by the high pressure and heat during the extrusion process and dispersed within the extruded material. That is, the Fe-containing intermetallic compound can be uniformly distributed on the surface of the extruded alloy. In contrast, according to one embodiment, Example 1 can implement a pattern area (220) by controlling the distribution (e.g., surface distribution) of the intermetallic compound during the extrusion process by applying an extruder with an increased step length.

[0097] Referring to FIGS. 4A, 4B, 4C, and 5A, FIG. 5A is a metal frame using an extruded material according to Example 1, in which intermetallic compound particles are linearly arranged in a pattern region (i.e., band shape) and a non-pattern region having a lower density of intermetallic compound particles than the pattern region are repeatedly arranged in an anodized extruded product, which can implement a wood pattern or texture on the back of the product. FIG. 5B is a metal frame using an extruded material of Comparative Example 1, in which intermetallic compounds are randomly arranged, but the extruded material of Example 1 of FIG. 5A has a pattern region by the intermetallic compound and can provide appearance characteristics utilizing the same.

[0098] In one embodiment, the intermetallic compounds (e.g., Fe-containing intermetallic compounds) in the extruded material (e.g., aluminum alloy) have a high melting point, so that they are not dissolved or precipitated during the heat treatment process, but are crystallized from the time of solidification of the initial billet, and the distribution of the intermetallic compounds (e.g., Fe-containing intermetallic compounds) can be arranged in a specific pattern shape (e.g., linear) during the extrusion process. This can provide an extruded material in which a region where the intermetallic compounds (e.g., Fe-containing intermetallic compounds) are concentrated (i.e., above a specific density) and a region where the intermetallic compounds do not exist or are distributed densely can be distinguished. The extruded material can be designed to have an outer shape or surface properties suitable for an application through a processing process (e.g., etching, planarizing, anodizing, etc.). In one embodiment, the extruded material can be processed to produce a product having a wood grain and texture appearance.

[0099] According to one embodiment, one or both sides of an aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B) can have intermetallic compounds linearly distributed and arranged along the extrusion direction, thereby implementing a wood grain or wood grain-like pattern (e.g., 220 in FIGS. 2A and 2B).

[0100] According to one embodiment, the aluminum alloy applied to the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) can be manufactured into a product by casting and processing through any manufacturing process performed according to the standard. That is, a series of manufacturing processes known to those skilled in the art of the aluminum industry may include, for example, a process of adding other metal elements after melting aluminum, a process of casting a billet for extrusion, a process of homogenizing heat treatment of the billet for extrusion, a process of extruding while heating at a high temperature, an artificial aging heat treatment process of the extruded aluminum alloy through heat treatment, a cutting process, a flattening process, an etching process, a surface oxidation treatment process (e.g., an anodizing process), etc., but the manufacturing process is not limited thereto. According to one embodiment, the artificial aging heat treatment process can improve the rigidity of the extruded aluminum alloy.

[0101] According to one embodiment, the size (or width) of the pattern region (220) (e.g., width (D) of FIG. 4B) and the size (or width) of the non-pattern region (230) in an aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) can be determined based on a point where the density of intermetallic compound particles mentioned in the present document is satisfied or the density of the intermetallic compound is satisfied simultaneously, and the average content of the constituent elements of the intermetallic compound within a specific area differs by about 1 time or more, about 1.5 times or more, about 2 times or more, about 2.5 times or more, about 3 times or more, about 3.5 times or more, about 4 times or more, about 5 times or more, about 8 times or more, or about 10 times or more. In some embodiments, the elements can be analyzed in a plurality of specific regions in a direction corresponding to the extrusion direction (A) and a direction perpendicular to the extrusion direction (A), and the average contents in these two directions can be comprehensively considered to determine the point. In addition, the size (or width) of the pattern region (220) (width (D) in FIG. 4b) and the size (or width) of the non-pattern region (230) can be determined through SEM image analysis while simultaneously satisfying the density of the intermetallic compound. In addition, the size (or width) of the pattern region (220) (width (D) in FIG. 4b) can be determined first, and then the size (or width) of the non-pattern region (230) can be determined by the gap between the pattern region (220) and the adjacent pattern region (220), or the opposite method can be used.

[0102] According to one embodiment, the density, elemental analysis, image measurement, etc. of the intermetallic compound in the pattern area (220) and the non-pattern area (230) of the aluminum-based extruded material (e.g., 200 of FIGS. 2A and 2B) can be analyzed using conventional methods (equipment, programs, etc.) known in the technical field of the present disclosure. For example, SEM measurement, EDS, commercially available or known image analysis programs and equipment, etc. can be used, and are not specifically mentioned in this document.

[0103] According to one embodiment, FIG. 6A is a flow chart of a method for manufacturing an aluminum-based extruded material according to one embodiment. Referring to FIG. 6A, the method may include an extrusion process (410) and a planar processing process (420) of an extruded aluminum alloy. According to one embodiment, the extrusion process (410) may be a process of preparing a base material (e.g., an aluminum alloy) for the extrusion process, and controlling the distribution (e.g., surface distribution) of intermetallic compounds within the extrudate by modifying a system or extrusion process conditions for the extrusion process of the base material to obtain an extrudate having a pattern region. In some embodiments, the shape of the pattern region, the size of the pattern region, or the spacing between the pattern regions may be set by controlling the particle distribution in the extrusion process (410).

[0104] According to one embodiment, the extrusion process (410) may be performed by preparing a base material including an intermetallic compound and extruding the base material by changing the length of a step section (e.g., S in FIG. 3) and the height of the step (e.g., H in FIG. 3) of an extrusion die. According to one embodiment, the base material including an intermetallic compound may be prepared and the extrusion speed of the base material passing through the extrusion die may be controlled. According to one embodiment, the base material including an intermetallic compound may be prepared and the length of a step section (e.g., S in FIG. 3) and the height of the step (e.g., H in FIG. 3) of an extrusion die may be changed and the extrusion speed of the base material (e.g., aluminum alloy) passing through the extrusion die (e.g., 320 in FIG. 3) may be controlled. According to one embodiment, the extrusion process (410) may be performed at a temperature of about 350° C. (Celsius) or higher.

[0105] In one embodiment, the planar processing process (420) may perform a planarization process on one or all surfaces of an extruded aluminum alloy. In one embodiment, a surface applicable to an exterior surface (e.g., a metal frame or the back surface of an electronic device housing) may be planarized.

[0106] According to one embodiment, FIG. 6B is a flowchart of a method for manufacturing an aluminum-based extruded material according to one embodiment. Referring to FIG. 6B, the method may include an extrusion process (510), a planar processing process (520), an etching process (530), and a surface treatment process (540).

[0107] In one embodiment, the extrusion process (510) may be a process of preparing a base material for the extrusion process, and controlling the distribution (e.g., surface distribution) of intermetallic compounds within the extrudate by modifying a system or extrusion process conditions for the extrusion process of the base material to obtain an extrudate having a pattern region (e.g., 410 of FIG. 6A). In some embodiments, the particle distribution may be controlled in the extrusion process (510) to set the shape of the pattern region, the dimension of the pattern region, or the spacing between the pattern regions. In one embodiment, the extrusion process (510) may be performed at a temperature of about 350° C. (Celsius) or higher.

[0108] According to one embodiment, the extrusion process (510) may prepare a base material including an intermetallic compound, and extrude the base material by changing the length of a step section (e.g., S in FIG. 3) and the height of the step (e.g., H in FIG. 3) of an extrusion die. According to one embodiment, the base material including an intermetallic compound may be prepared, and the extrusion speed of the base material passing through the extrusion die may be controlled. According to one embodiment, the base material including an intermetallic compound may be prepared, and the length of a step section (e.g., S in FIG. 3) and the height of the step (e.g., H in FIG. 3) of an extrusion die may be changed, and the extrusion speed of the base material passing through the extrusion die may be controlled.

[0109] In one embodiment, the planar processing process (520) of the extruded aluminum alloy may perform a planarization process on one or all surfaces of the extruded aluminum alloy. In one embodiment, one surface applicable as an exterior surface (e.g., the back surface of a metal frame or housing) may be planarized.

[0110] In one embodiment, the etching process (530) can implement a three-dimensional pattern by surface etching one or both sides of the extrudate having a pattern area. In one embodiment, a three-dimensional pattern corresponding to the pattern area can be formed using wet, dry, or both. This can be implemented by implementing a three-dimensional pattern through different etching rates in the pattern area and non-pattern area of ​​the extrudate. In one embodiment, a linear pattern can be formed, which can enable the implementation of a wood grain or similar texture.

[0111] In one embodiment, the etching process (530) may utilize a wet etching, flash etching, quick etching, or plasma etching method. In some embodiments, the wet etching may utilize an etching solution containing a base, an inorganic acid, or an organic acid. In some embodiments, the etching solution may include about 1 N to about 5 N, or about 10% to about 30% of a base, an inorganic acid, or an organic acid. In some embodiments, the etching solution may include, but is not limited to, hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, organic acids, perhydrol / sulfuric acid types (e.g., H2O2 and H2SO4), sodium persulfate / sulfuric acid types (e.g., Na2S2O8 and H2SO4), and the like. In some embodiments, the etchant may include, but is not limited to, a hydroxide compound such as sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, barium hydroxide, ammonium hydroxide, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, and the like. In some embodiments, the etching process may be performed for at least about 1 minute; at least about 10 minutes; at least about 30 minutes; or at least about 1 hour and at room temperature (rt) (e.g., from about 15° C. to about 25° C. to about 100° C.).

[0112] According to one embodiment, the surface treatment process (540) may modify surface characteristics (e.g., color, gloss, etc.) by forming an oxide film by performing an anodizing process on the surface on which the etching process (530) was performed.

[0113] According to one embodiment, the surface treatment process (540) may be anodized using an acid bath immersion (e.g., sulfuric acid, oxalic acid, phosphoric acid, chromic acid, tartaric acid, or citric acid); an alkaline bath immersion (e.g., sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, strontium hydroxide, sodium carbonate, or sodium hydrogen carbonate); or all of these. Anodizing may be performed using a conventional and standardized method known in the art. For example, it can be performed at a temperature of about 5° C. (degrees Celsius) to about 30° C. (degrees Celsius), a voltage of about 4 V to about 10 V, and a time of about 5 minutes to about 180 minutes in about 5% to about 20% NaOH.

[0114] According to embodiments, an aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B ) may be utilized as a component of an electronic device. In one embodiment, the extruded material may be applied as a component or material constituting a large-area exterior surface of the electronic device. In one embodiment, the extruded material may be a metal front component (e.g., a metal frame) in the electronic device.

[0115] In one embodiment, when a metal frame is exposed to a large surface area of ​​an electronic device, a pattern can be implemented on the exterior of the metal frame by controlling the distribution of an intermetallic compound (e.g., an iron-containing intermetallic compound) on the surface. In one embodiment, a pattern or surface characteristic having a wood pattern or similar texture can be provided.

[0116] According to embodiments, an electronic device housing may include an aluminum-based extrusion. According to one embodiment, the electronic device housing may include a pattern area (e.g., 220 of FIGS. 2A and 2B) on a back surface. According to one embodiment, the electronic device housing may include an aluminum-based extrusion according to embodiments of the present disclosure on at least a portion of an exterior surface of the electronic device housing. For example, the aluminum-based extrusion may be used as a housing for an electronic device including at least one of a mobile phone and / or a tablet computer. According to one embodiment, the aluminum-based extrusion may be used to manufacture a housing for an outer casing of a mobile phone (e.g., a smart phone), a tablet front component (e.g., a component with a large-area back surface exposed) (e.g., a metal frame), and a tablet bottom chassis.

[0117] According to embodiments of the present disclosure, an aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B) may include a single or multiple pattern regions (e.g., 220 of FIGS. 2A and 2B) comprising intermetallic compound particles on one or both surfaces of the aluminum-based extrusion.

[0118] Typically, metal frames are shaped by CNC machining high-strength extruded materials, and surface anodizing is used to achieve high surface scratch resistance and colorability. While anodizing offers a variety of colors by coloring with various dyes, it has limitations in achieving additional aesthetics, such as patterns, because the reaction occurs uniformly across the entire surface. To achieve this patterning, a hairline process, such as scratching the metal surface, is used to create irregularities through changes in roughness. Then, anodizing is applied to the irregularities to form a pattern. This method of surface treatment using hairlines to change surface roughness can damage the hairlines from external impact, reducing pattern continuity. Furthermore, foreign substances and moisture remaining in the gaps between the hairlines can cause contamination and design damage. Furthermore, if scratches or other handling defects occur during the hairline formation process, the entire hairline must be removed, along with the handling defects, before the hairline is re-formed, a complex, repetitive process (rework process) is required.

[0119] Accordingly, according to embodiments, the present disclosure can provide an aluminum-based extruded material capable of implementing a pattern area and imparting an aesthetic effect by controlling the distribution and arrangement of an intermetallic compound (e.g., an Fe-containing intermetallic compound) in the aluminum-based extruded material, and an electronic device housing and electronic device including the same.

[0120] In one embodiment, the width of a single or multiple pattern areas (e.g., 220 in FIGS. 2A and 2B ) in the aluminum-based extrusion may each be from about 10 μm (micrometers) to about 200 μm (micrometers).

[0121] According to one embodiment, in an aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B), a plurality of pattern regions (e.g., 220 of FIGS. 2A and 2B) are arranged at regular or random intervals, and the plurality of pattern regions may each have the same or different sizes, densities, or both of intermetallic compound particles.

[0122] In one embodiment, the size of the intermetallic compound particles in a single or multiple pattern regions (e.g., 220 in FIGS. 2A and 2B) of an aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B) may be about 1 μm (micrometer) or greater.

[0123] According to one embodiment, the density of intermetallic compound particles in a single or multiple pattern areas (220 in FIGS. 2A and 2B) in an aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B) is the number of particles per unit area (EA / 1000 μm). 2 ) and the density of intermetallic compound particles in a single or multiple pattern areas is 20 EA / 1000 ㎛. 2 It may be excessive.

[0124] In one embodiment, a region (e.g., 230 in FIGS. 2A and 2B) other than a pattern region (e.g., 220 in FIGS. 2A and 2B) on one surface of an aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B) may have a lower density than the density of the intermetallic compound in the pattern region (e.g., 220 in FIGS. 2A and 2B).

[0125] According to one embodiment, the density of the intermetallic compound in an area outside the pattern area (e.g., 230 in FIGS. 2A and 2B) of an aluminum-based extruded material (e.g., 200 in FIGS. 2A and 2B) is 20 EA / 1000 ㎛. 2 It could be as follows:

[0126] According to one embodiment, the shape of a single or multiple pattern areas (220 of FIGS. 2A and 2B) in an aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B) may include at least one or more of straight lines, diagonal lines, curved lines, circular lines, and elliptical lines, or a combination thereof.

[0127] According to one embodiment, the intermetallic compound in the aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B) may include at least two or more of Fe, Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, or Ir.

[0128] According to one embodiment, the intermetallic compound in the aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B) may include an Fe-containing intermetallic compound comprising at least one or more of Fe; and Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, and Ir, or a combination thereof.

[0129] According to one embodiment, the pattern region (220 of FIGS. 2A and 2B) of the aluminum-based extruded material may include intermetallic compound particles having a regular shape or an elongated shape, and the number (EA) of intermetallic compound particles having an elongated shape may be at least 10 times greater than that of the region outside the pattern region.

[0130] According to one embodiment, the aluminum-based extrusion (200 of FIGS. 2a and 2b) may be an aluminum alloy extrusion containing Fe of 0.05 wt% or more.

[0131] According to one embodiment, the aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) may further include an anodizing layer (250 in FIG. 2b) on one or both sides.

[0132] According to one embodiment, an anodizing layer (e.g., 250 in FIG. 2b) in an aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) may be disposed on a surface of the aluminum-based extrusion that includes a single or multiple pattern areas (e.g., 220 in FIGS. 2a and 2b).

[0133] According to one embodiment, the thickness of the anodizing layer (250 in FIG. 2b) in the aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) may be about 0.1 μm (micrometer) or greater.

[0134] According to one embodiment, the aluminum-based extrusion (e.g., 200 in FIGS. 2A and 2B) may further include an etched area (240 in FIG. 2B) on one or both sides of the aluminum-based extrusion.

[0135] In one embodiment, the etching treatment area (240 in FIG. 2b) in an aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) may be disposed on a surface of the aluminum-based extrusion that includes a single or multiple patterned areas. In one embodiment, the etching treatment area (240 in FIG. 2b) may be formed by an etching process on a surface of the aluminum-based extrusion that includes a single or multiple patterned areas.

[0136] According to one embodiment, an anodizing layer (250 in FIG. 2b) may be further disposed on a surface of an aluminum-based extrusion (e.g., 200 in FIGS. 2a and 2b) that includes an etching treatment area (240 in FIG. 2b).

[0137] According to embodiments of the present disclosure, an electronic device housing may include an aluminum-based extrusion according to embodiments of the present disclosure (e.g., 200 of FIGS. 2A and 2B) in at least a portion of an exterior of the electronic device housing.

[0138] According to embodiments of the present disclosure, an electronic device may include an aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B ); according to embodiments of the present disclosure. In one embodiment, the electronic device housing may implement a pattern on a large-area appearance surface by controlling the distribution and arrangement of an intermetallic compound within the aluminum-based extrusion (e.g., 200 of FIGS. 2A and 2B ). That is, a pattern or surface property having a wood pattern or similar texture may be provided.

[0139] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0140] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0141] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0142] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0143] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0144] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. As an aluminum extrusion material, A single or multiple pattern regions comprising intermetallic compound particles on one or both surfaces of the aluminum-based extruded material; Aluminum extrusion material including:

2. In paragraph 1, The width of each of the single or multiple pattern regions is 10 ㎛ (micrometers) to 200 ㎛ (micrometers), An aluminum-based extruded material, wherein the size of intermetallic compound particles in the single or multiple pattern areas is 1 ㎛ (micrometer) or more.

3. In any one of paragraphs 1 and 2, The above multiple pattern areas are arranged at regular or random intervals, An aluminum-based extruded material, wherein each of the plurality of pattern regions has the same or different intermetallic compound particle size, density, or both.

4. In any one of paragraphs 1 to 3, The density of intermetallic compound particles in the above single or multiple pattern areas is the number of particles per unit area (EA / 1000 ㎛). 2 ) and, The density of intermetallic compound particles in the above single or multiple pattern areas is 20 EA / 1000 ㎛. 2 Excessive aluminum extrusion.

5. In any one of paragraphs 1 to 4, In one surface of the above aluminum-based extruded material, an area outside the pattern area has a lower density than the density of the intermetallic compound in the pattern area, The density of intermetallic compounds in areas other than the above pattern area is 20 EA / 1000 ㎛. 2 Aluminum extrusion material, which is as follows.

6. In any one of paragraphs 1 to 5, The shape of the above single or multiple pattern areas is, An aluminum extrusion comprising at least one or more of straight lines, diagonal lines, curved lines, circular lines and elliptical lines, or a combination thereof.

7. In any one of paragraphs 1 to 6, The above intermetallic compound is, An aluminum-based extruded material comprising at least two or more of Fe, Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Zn, Zr, Yb, Ti, Si, Sr, Li, or Ir.

8. In any one of paragraphs 1 to 7, The above intermetallic compound is, An Fe-containing intermetallic compound comprising Fe; and at least one or more of Al, Ag, Au, Ba, Co, Ca, Cu, Eu, Rh, Ru, Pt, Pd, Na, Ni, Mn, Zn, Zr, Yb, Ti, Si, Sr, Li, or Ir; An aluminum extrusion comprising:

9. In any one of paragraphs 1 to 8, The above aluminum extrusion material is, An aluminum-based extruded material, which is an aluminum alloy extruded material containing Fe 0.05 wt% or more.

10. In any one of paragraphs 1 to 9, An anodizing layer on one or both sides of the above aluminum extrusion material; Including more, An aluminum extruded material, wherein the thickness of the anodizing layer is approximately 0.1 ㎛ (micrometer) or more.

11. In any one of paragraphs 1 to 10, The above anodizing layer is, An aluminum-based extrusion, wherein the aluminum-based extrusion is disposed on a surface of the aluminum-based extrusion, the surface including a single or multiple pattern areas.

12. In any one of paragraphs 1 to 11, An etching treatment area on one or both sides of the above aluminum extrusion material; An aluminum extrusion material further comprising:

13. In any one of paragraphs 1 to 12, An aluminum-based extruded material, wherein the etching treatment area is disposed on a surface of the aluminum-based extruded material including a single or multiple pattern areas.

14. As an electronic device housing, An aluminum-based extruded material according to any one of claims 1 to 13, at least in a portion of the exterior of the electronic device housing; An electronic device housing, comprising:

15. An aluminum extruded material according to any one of claims 1 to 13; An electronic device comprising:

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