Data center cooling equipment

Abstract

The present disclosure is directed to various embodiments of a data center cooling system. For example, an embodiment of the data center cooling system may employ a double-lift absorption chiller having a first segment with an evaporator and a low temperature absorber, a second segment with a low temperature generator and a high temperature absorber, and a third segment with a high temperature generator and a condenser, where various fluid flows (e.g., water flows) are directed through the above-described componentry to generate chilled water for cooling a conditioned space of the data center and for cooling servers of the data center (e.g., via immersion cooling). Additionally or alternatively, other componentry (e.g., a dry-cooler, a back-up chiller, pumps, an electrical chiller, an air-cooled chiller, a single-effect chiller, etc.) may be employed.

Description

DATA CENTER COOLING EQUIPMENTCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Patent Application Serial No. 63 / 529,081, entitled “DATA CENTER COOLING EQUIPMENT,'’ filed July 26, 2023, which is incorporated herein by reference in its entirety for all purposes.BACKGROUND

[0002] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described and / or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.

[0003] Demand for data centers to process and store information has dramatically increased. Data centers may include a relatively large number of computer servers having delicate instruments that require certain thermal conditions to operate appropriately. For example, temperature control of the computer servers may enable the computer servers to operate safely and efficiently.

[0004] While data centers are often air cooled, immersion cooling systems may be used to cool the computer servers via a liquid coolant in which the computer servers are submerged. For example, conventional immersion cooling systems may employ a tank including liquid coolant therein, where the liquid coolant is utilized to cool the computer servers in the tank. Unfortunately, cooling computer servers through the use of conventional immersion cooling systems may be unpredictable and difficult to control, which may increase powder consumption, reduce efficiency, and reduce temperature control of the computer servers. Further, conventional immersion cooling systems may employ an extraneous number of components and complex control schemes, thereby increasing a cost of such conventional immersion cooling systems. Further still,conventional data center cooling systems may use an exorbitant amount of external energy (e.g., electricity, heat from a cogeneration unit, etc.) that contributes to a cost of operating and maintaining the data center. Accordingly, it is now recognized that improved systems and methods are desired.SUMMARY

[0005] A summary of certain embodiments disclosed herein is set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of these certain embodiments and that these aspects are not intended to limit the scope of this disclosure. Indeed, this disclosure may encompass a variety of aspects that may not be set forth below.

[0006] In an embodiment, a data center cooling system for a data center includes an absorption chiller configured to cool a first fluid and a second fluid separate from the first fluid. The absorption chiller includes a first outlet configured to convey the first fluid toward server equipment of the data center. The data center cooling system also includes an air handler configured to receive the second fluid via a second outlet of the absorption chiller, cool an air flow via the second fluid, and output the air flow into a room of the data center.

[0007] In another embodiment, a data center cooling system for a data center includes a dry-cooler configured to cool a first fluid. A dr -cool er outlet of the dry-cooler is configured to convey the first fluid toward server equipment of the data center. The data center cooling system also includes an electrical chiller configured to cool a second fluid, and an air handler. The air handler is configured to receive the second fluid via an electrical chiller outlet of the electrical chiller, cool an air flow via the second fluid, and output the air flow into a room of the data center.

[0008] In still another embodiment, a data center cooling system for a data center includes a single-effect absorption chiller configured to receive a first fluid, a second fluid separate from the first fluid, and a third fluid separate from the first fluid and the second fluid. The data center cooling system also includes a dry-cooler configured to be positioned on a first flow path corresponding to the first fluid and extending to and from the single-effect absorption chiller, where the dry -cooler is configured to cool the first fluid for delivery to the single-effect absorption chiller. The data center cooling system alsoincludes an additional dry-cooler configured to be positioned on a second flow path corresponding to the second fluid and extending between the single-effect absorption chiller and server equipment of the data center, where the additional dry-cooler is configured to cool the second fluid for delivery to the server equipment. The data center cooling system also includes an air handler configured to receive the third fluid from the single-effect absorption chiller via a third flow path extending between the single-effect absorption chiller and the air handler, cool an air flow via the third fluid, and output the air flow into a room in which the server equipment is disposed.BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Various aspects of this disclosure may be better understood upon reading the following detailed description and upon reference to the drawings in which:

[0010] FIG. 1 is a perspective view of a building utilizing an embodiment of a heating, ventilation, air conditioning, and / or refrigeration (HVAC&R) system in a commercial setting, in accordance with an aspect of the present disclosure;

[0011] FIG. 2 is a perspective view of an embodiment of a vapor compression system, in accordance with an aspect of the present disclosure;

[0012] FIG. 3 is a schematic of an embodiment of the vapor compression system of FIG. 2. in accordance with an aspect of the present disclosure;

[0013] FIG. 4 is a schematic of an embodiment of the vapor compression system of FIG. 2, in accordance with an aspect of the present disclosure;

[0014] FIG. 5 is a data center cooling system employing a double-lift absorption chiller and dry-cooler, in accordance with an aspect of the present disclosure;

[0015] FIG. 6 is a data center cooling system employing an air-cooled double-lift absorption chiller, in accordance with an aspect of the present disclosure;

[0016] FIG. 7 is a comparison of solution temperature between a single-effect cycle and a double-lift cycle, in accordance with an aspect of the present disclosure;

[0017] FIG. 8 is another comparison of solution temperature between a singleeffect cycle and a double-lift cycle, in accordance with an aspect of the present disclosure;

[0018] FIG. 9 is a double-lift absorption chiller (e.g., of the data center cooling system of FIG. 5), in accordance with an aspect of the present disclosure;

[0019] FIG. 10 is a table of experimental results corresponding to the double-lift absorption chiller of FIG. 9, in accordance with an aspect of the present disclosure;

[0020] FIG. 11 is a data center cooling system employing an electrical chiller and a dry-cooler, in accordance with an aspect of the present disclosure; and

[0021] FIG. 12 is a data center cooling system employing a single-effect absorption chiller, a dry-cooler, an additional dry-cooler, and an additional chiller (e.g., air-cooled chiller), in accordance with an aspect of the present disclosure.DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

[0022] One or more specific embodiments will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.

[0023] When introducing elements of various embodiments of the present disclosure, the articles “a,” “an,” and “the” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be noted that references to “one embodiment” or “anembodiment'’ of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

[0024] As used herein, the terms “approximately,” “generally,” “substantially,” and so forth, are intended to convey that the property value being described may be within a relatively small range of the property value, as those of ordinary skill would understand. For example, when a property value is described as being “approximately” equal to (or, for example, “substantially similar” to) a given value, this is intended to convey that the property7value may be within + / - 5%, within + / - 4%, within + / - 3%, within + / - 2%, within + / - 1%. or even closer, of the given value. Similarly, when a given feature is described as being “substantially parallel” to another feature, “generally perpendicular” to another feature, and so forth, this is intended to convey that the given feature is within + / - 5%, within + / - 4%, within + / - 3%, within + / - 2%, within + / - 1%, or even closer, to having the described nature, such as being parallel to another feature, being perpendicular to another feature, and so forth. Mathematical terms, such as “parallel” and “perpendicular,” should not be rigidly interpreted in a strict mathematical sense, but should instead be interpreted as one of ordinary skill in the art w ould interpret such terms. For example, one of ordinary7skill in the art would understand that two lines that are substantially parallel to each other are parallel to a substantial degree, but may have minor deviation from exactly parallel.

[0025] Embodiments of the present disclosure relate to data center cooling sy stems configured to provide cooling to server equipment and a room in which the server equipment is disposed. That is, presently disclosed systems may be employed to directly cool the server equipment (e.g., via immersion cooling) and cool a room (e.g., via temperature-controlled air) corresponding to the server equipment. Various embodiments of the present disclosure may include a double-lift absorption chiller (e.g., an air-cooled double-lift absorption chiller, among other ty pes of double-lift absorption chillers), a dry-cooler, an electrical chiller, a single-effect absorption chiller, an additional chiller (e.g., a back-up chiller), an additional dry -cooler, or any combination thereof. In general, presently disclosed systems may reduce a solution temperature and / or refrigerant pressure, enabling more efficient cooling techniques, relative to traditional configurations. V arious embodiments of the present disclosure are described in detail below.

[0026] Turning now to the drawings, FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and / or refrigeration (HVAC&R) system 10 in a building 12 for a typical commercial setting. The HVAC&R system 10 may include a vapor compression system 14 (e.g., a chiller) that supplies a chilled liquid, which may be used to cool the building 12. The HVAC&R system 10 may also include a boiler 16 to supply warm liquid to heat the building 12 and an air distribution system which circulates air through the building 12. The air distribution system can also include an air return duct 18, an air supply duct 20, and / or an air handler 22. In some embodiments, the air handler 22 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by conduits 24. The heat exchanger in the air handler 22 may receive either heated liquid from the boiler 16 or chilled liquid from the vapor compression system 14, depending on the mode of operation of the HVAC&R system 10. The HVAC&R system 10 is shown with a separate air handler on each floor of building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 22 and / or other components that may be shared between or among floors.

[0027] FIGS. 2 and 3 are embodiments of the vapor compression system 14 that can be used in the HVAC&R system 10. The vapor compression system 14 may circulate a refrigerant through a circuit starting with a compressor 32. The circuit may also include a condenser 34, an expansion valve(s) or device(s) 36, and a liquid chiller or an evaporator 38. The vapor compression system 14 may further include a control panel 40 that has an analog to digital (A / D) converter 42, a microprocessor 44, a nonvolatile memory 46, and / or an interface board 48.

[0028] Some examples of fluids that may be used as refrigerants in the vapor compression system 14 are hydrofluorocarbon (HFC) based refrigerants, for example, R-410A, R-407, R-134a, R-1234ze, R1233zd, R513A. hydrofluoro olefin (HFO), "natural" refrigerants like ammonia (NH3), R-717, carbon dioxide (CO2), R-744, or hydrocarbon based refrigerants, water vapor, or any other suitable refrigerant. In some embodiments, the vapor compression system 14 may be configured to efficiently utilize refrigerants having a normal boiling point of about 19 degrees Celsius (66 degrees Fahrenheit) at one atmosphere of pressure, also referred to as low pressure refrigerants.versus a medium pressure refrigerant, such as R-134a. As used herein, "normal boiling point" may refer to a boiling point temperature measured at one atmosphere of pressure.

[0029] In some embodiments, the vapor compression system 14 may use one or more of a variable speed drive (V SDs) 52, a motor 50, the compressor 32, the condenser 34, the expansion valve or device 36. and / or the evaporator 38. The motor 50 may drive the compressor 32 and may be powered by a variable speed drive (VSD) 52. The VSD 52 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source, and provides power having a variable voltage and frequency to the motor 50. In other embodiments, the motor 50 may be powered directly from an AC or direct current (DC) power source. The motor 50 may include any type of motor that can be powered by a VSD or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.

[0030] The compressor 32 compresses a refrigerant vapor and delivers the vapor to the condenser 34 through a discharge passage. In some embodiments, the compressor 32 may be a centrifugal compressor. The refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34. The refrigerant vapor may condense to a refrigerant liquid in the condenser 34 due to thermal heat transfer with the cooling fluid. The liquid refrigerant from the condenser 34 may flow through the expansion device 36 to the evaporator 38. In the illustrated embodiment of FIG. 3, the condenser 34 is water cooled and includes a tube bundle 54 connected to a cooling tower 56, which supplies the cooling fluid to the condenser 34.

[0031] The liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34. The liquid refrigerant in the evaporator 38 may undergo a phase change from the liquid refrigerant to a refrigerant vapor. As shown in the illustrated embodiment of FIG. 3, the evaporator 38 may include a tube bundle 58 having a supply line 60S and a return line 60R connected to a cooling load 62. The cooling fluid of the evaporator 38 (e.g., water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable fluid) enters the evaporator 38 via return line 60R and exits the evaporator 38 via supply line 60S. The evaporator 38 may reduce the temperatureof the cooling fluid in the tube bundle 58 via thermal heat transfer with the refrigerant. The tube bundle 58 in the evaporator 38 can include a plurality of tubes and / or a plurality of tube bundles. In any case, the vapor refrigerant exits the evaporator 38 and returns to the compressor 32 by a suction line to complete the cycle.

[0032] FIG. 4 is a schematic of the vapor compression system 14 with an intermediate circuit 64 incorporated between condenser 34 and the expansion device 36. The intermediate circuit 64 may have an inlet line 68 that is directly fluidly connected to the condenser 34. In other embodiments, the inlet line 68 may be indirectly fluidly coupled to the condenser 34. As shown in the illustrated embodiment of FIG. 4, the inlet line 68 includes a first expansion device 66 positioned upstream of an intermediate vessel 70. In some embodiments, the intermediate vessel 70 may be a flash tank (e.g., a flash intercooler, an economizer, etc.). In other embodiments, the intermediate vessel 70 may be configured as a heat exchanger or a "surface economizer.” In the illustrated embodiment of FIG. 4, the intermediate vessel 70 is used as a flash tank, and the first expansion device 66 is configured to lower the pressure of (e.g., expand) the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus, the intermediate vessel 70 may be used to separate the vapor from the liquid received from the first expansion device 66.

[0033] Additionally, the intermediate vessel 70 may provide for further expansion of the liquid refrigerant because of a pressure drop experienced by the liquid refrigerant when entering the intermediate vessel 70 (e.g., due to a rapid increase in volume experienced when entering the intermediate vessel 70). The vapor in the intermediate vessel 70 may be drawn by the compressor 32 through a suction line 74 of the compressor 32. In other embodiments, the vapor in the intermediate vessel may be drawn to an intermediate stage of the compressor 32 (e.g., not the suction stage). The liquid that collects in the intermediate vessel 70 may be at a lower enthalpy than the liquid refrigerant exiting the condenser 34 because of the expansion in the expansion device 66 and / or the intermediate vessel 70. The liquid from intermediate vessel 70 may then flow in line 72 through a second expansion device 36 to the evaporator 38.

[0034] It should be appreciated that any of the features described herein may be incorporated with the vapor compression system 14 or any other suitable HVAC&Rsystems. For example, the present techniques may be incorporated with any HVAC&R system having an economizer, such as the intermediate vessel 70, and a compressor, such as the compressor 32. The discussion below describes the present techniques incorporated with embodiments of the compressor 32 configured as a single stage compressor. However, it should be noted that the systems and methods described herein may be incorporated with other embodiments of the compressor 32 and HVAC&R system 10.

[0035] It should be noted that any of FIGS. 1-4 may include various features associated with presently disclosed data center cooling systems, such as an absorption chiller (e.g., single-effect absorption chiller, double-lift absorption chiller, air-cooled double-left absorption chiller, etc.), a dry-cooler, an electrical chiller, etc. These and other features employed or employable in FIGS. 1-4 are described in detail below with respect to FIGS. 5-12.

[0036] With the foregoing in mind, FIG. 5 is an embodiment of a data center cooling system 100 employing a double-lift absorption chiller 102 (e.g., water-cooled double-lift absorption chiller) and a dry-cooler 104 (e.g., corresponding to the doublelift absorption chiller 102). In the illustrated embodiment, a cooling load of a data center 106 may include (1) direct server cooling (e.g., immersion cooling) of server equipment, such as one or more servers 108, within the data center 106, and (2) server room space cooling of a conditioned space 110 (e.g., via an air handler 112, such as a terminal unit) within the data center 106. The double-lift absorption chiller 102 is the primary cooling device, employs the load as its driving heat source, and supplies chilled water to meet the load. Further, the double-lift absorption chiller 102 radiates the heat from direct server cooling and server room space cooling via the dry -cool er 104. In general, an absorption chiller uses a heat source to provide the energy needed to drive the data center cooling system 100. For example, a first coolant may perform evaporative cooling which is then absorbed into a second coolant, where the heat source is employed to effectively reset the first and second coolants to their initial states. These and other aspects of the data center cooling system 100 are described in detail below.

[0037] As shown, the dry-cooler 104 cools a cooling water 114 distributed to a first segment 116 (e.g., including a low temperature absorber and evaporator) of the doublelift absorption chiller 102 to generate a space chilled water 118. In some embodiments,a pump 120 may be employed to generate a flow of the cooling water 114 between the double-lift absorption chiller 102 and the dry-cooler 104, as shown. The space chilled water 118 is output from an outlet 121 of the first segment 1 16 of the double-lift absorption chiller 102, and routed to the air handler 112 (e.g., terminal unit) that receives the space chilled water 118 and generates a cooled air flow via the space chilled water 118. For example, the space chilled water 118 is output from the outlet 121, through a space chilled water flow path 123 (e.g.. a loop or circuit), and to the air handler 112. The cooled air flow generated by the air handler 112 is employed to condition the conditioned space 110 in the data center 106. In some embodiments, a pump 122 is employed to enable a flow of the space chilled water 118 between the first segment 116 of the double-lift absorption chiller 102 and the air handler 112. Further, in some embodiments, a back-up chiller 124 may be employed in a fluid loop of the space chilled water 118 to further reduce a temperature of the space chilled water 118, if necessary. In some embodiments, operation of the back-up chiller 124 is initiated in response to a determination that the double-lift absorption chiller 102 alone cannot adequately cool the space chilled water 118 for conditioning of the conditioned space 110 (e g., via the air handler 112).

[0038] The cooling water 114 is then routed from the first segment 116 of the double-lift absorption chiller 102 to a second segment 126 of the double-lift absorption chiller 102 and / or a third segment 128 of the double-lift absorption chiller 102, as shown. As described in greater detail with respect to FIG. 9, the second segment 126 may include, for example, a low temperature generator and a high temperature absorber, and the third segment 128 may include a high temperature generator and a condenser. The cooling water 114 in the second segment 126 and / or the third segment 128 may interface with a server water 130 (e.g., referred to in certain instances of the present disclosure as the “heat source hot water"’), as shown, to cool the sever water 130. The server water 130 may be output from the double-lift absorption chiller 102 via an outlet 131, as shown, toward an immersion cooling assembly 111, referred to in certain instances of the present disclosure as a liquid immersion cooling assembly, and / or the servers 108 in the data center 106. For example, the server water 130 is output from the outlet 131, through a server water flow path 133 (e.g.. a loop or circuit), and to the immersion cooling assembly 111 and / or the servers 108 in the data center 106. In some embodiments, the servers 108 are considered a part of and / or considered to be integratedwith the immersion cooling assembly 111 (e.g., the servers 108 are disposed in a tank of the immersion cooling assembly 111). A pump 132 may be employed to route the server water 130 between the double-lift absorption chiller 102 and the servers 108 in the data center 106. In some embodiments, the server water 130 may be employed to cool a separate thermally conductive, dielectric fluid (e g., oil) employed for liquid immersion cooling of the servers 108, while in other embodiments, the server water 130 is configured to cool the servers 108 without the use of a separate thermally conductive, dielectric fluid (e g., oil).

[0039] The server water 130, which is heated directly or indirectly by the servers 108, such as by liquid immersion cooling techniques by way of the energy released from the servers 108, is routed back to the double-lift absorption chiller 102. Depending on the embodiment, the server water 130 may be routed first to the second segment 126 of the double-lift absorption chiller 102 and then the third segment 128 of the doublelift absorption chiller 102, or alternatively first to the third segment 128 of the doublelift absorption chiller 102 and then the second segment 126 of the double-lift absorption chiller 102. As described above, the first segment 116 of the double-lift absorption chiller 102 may include an evaporator and a low temperature absorber, the second segment 126 of the double-lift absorption chiller 102 may include a low temperature generator and a high temperature absorber, and the third segment 128 of the double-lift absorption chiller 102 may include a high temperature generator and a condenser. This componentry' of the first segment 116, the second segment 126, and the third segment 128 are illustrated in, and will be described in greater detail with respect to, FIG. 9 of the present disclosure.

[0040] Other embodiments employing double-lift absorption chiller techniques in are also possible in accordance with the present disclosure. For example, FIG. 6 is an embodiment of the data center cooling system 100 employing an air-cooled double-lift absorption chiller 150. The embodiment in FIG. 6 is substantially similar to the embodiment in FIG. 5, except that the air-cooled double-lift absorption chiller 150 illustrated in FIG. 6 replaces a combination of the double-lift absorption chiller 102 and the dry-cooler 104 illustrated in FIG. 5. For example, in FIG. 6. a fan 152 integrated with the air-cooled double-lift absorption chiller 150 is employed in lieu of the cooling water 114 described with respect to FIG. 5. However, the air-cooled double-liftabsorption chiller 150 in FIG. 6, like the double-lift absorption chiller 102 (e.g., water- cooled double-lift absorption chiller) in FIG. 5. includes the first segment 116, the outlet 121 positioned at the first segment 116, the second segment 126, the third segment 128, and the outlet 131 positioned at the third segment 128. In the illustrated embodiment, operation of the back-up chiller 124 may be employed to further cool the space chilled water 118, for example, at least when the air-cooled double-lift absorption chiller 150 cannot adequately cool the space chilled water 118 for conditioning the conditioned space 110 (e.g., via the air handler 112)

[0041] FIG. 7 is a graphical comparison of solution temperatures between a singleeffect cycle and a double-lift cycle, and corresponds to instances where the double-lift cycle is operated by lower heat source (driving) temperatures. For example, FIG. 7 includes a first graph 170 corresponding to a single-effect cycle and a second graph 172 corresponding to a double-lift cycle. Each of these graphs 170, 172 includes an X-axis 174 corresponding to solution temperature and a Y-axis 176 corresponding to refrigerant pressure. FIG. 8 is another graphical comparison of solution temperatures between a single-effect cycle and a double-lift cycle, and corresponds to instances where the double-lift cycle is operated with higher cooling water temperatures. For example, FIG. 8 includes another first graph 180 corresponding to a single-effect cycle and another second graph 182 corresponding to a double-lift cycle. Each of these graphs 180, 182 in FIG. 8, like the graphs 170, 172 in FIG. 7, includes the X-axis 174 corresponding to solution temperature and the Y-axis 176 corresponding to refrigerant pressure. The following legend provides details regarding the abbreviated componentry referenced in the graphs 170, 172, 180, 182 of FIGS. 7 and 8, which will be described in greater detail with reference to FIG. 9: E -evaporator, A - Absorber, C - condenser, G - Generator, HG - High Temperature Generator, HA - High Temperature Absorber, LG - Low Temperature Generator, LA - Low Temperature Absorber. The technical benefits of the double-lift cycle are illustrated in FIGS. 7 and 8.

[0042] FIG. 9 is an embodiment of a double-lift absorption chiller, such as the double-lift absorption chiller 102 illustrated in the embodiment of the data center cooling system 100 of FIG. 5. In the illustrated embodiment the double-lift absorption chiller 102 includes an evaporator 200, a low temperature absorber 202. a low temperature generator 204, a high temperature absorber 206, a high temperaturegenerator 208, and a condenser 210. The evaporator 200 and the low temperature absorber 202 may correspond to the first segment 116 of the double-lift absorption chiller 102 illustrated in FIG. 5, the low temperature generator 204 and the high temperature absorber 206 may correspond to the second segment 126 of the double-lift absorption chiller 102 illustrated in FIG. 5, and the high temperature generator 208 and the condenser 210 may correspond to the third segment 128 of the double-lift absorption chiller 102 illustrated in FIG. 5. FIG. 9 also illustrates interactions (e.g.. flow arrangements) of the space chilled water 118, the cooling water 114, and the server water 130 with the various componentry of the double-lift absorption chiller 102.

[0043] FIG. 10 is a table 240 of experimental results corresponding to the embodiment of the double-lift absorption chiller 102 illustrated in FIG. 9 at 7.1 kilowatts (kW). For example, the table 240 includes data indicative of inlet temperature 250 and outlet temperature 252 of the space chilled water 118, inlet temperature 254 and outlet temperature 256 of the cooling water 114, and inlet temperature 258 and outlet temperature 260 of the server water 130 (referred to in certain instances of the present disclosure as “heat source hot water”). As shown, a heat balance 262 of the double-lift absorption chiller 102 may be -0.7%.

[0044] Still other embodiments of the data center cooling system 100 are possible in accordance with the present disclosure. For example, FIG. 11 is an embodiment of the data center cooling system 100 employing an electrical chiller 300 and an instance of the dry-cooler 104. In the illustrated embodiment, the dry-cooler 104 directly cools the server water 130 employed for cooling the servers 108 of the data center 106 via the immersion cooling assembly 111. The server water 130 is output from a dry-cooler outlet 302 of the dry-cooler 104 toward the immersion cooling assembly 111 and / or the servers 108 in the data center 106, as shown. Further, the electrical chiller 300 generates the space chilled water 118 employed for cooling the conditioned space 110 of the data center 106 via the air handler 112. The space chilled water 118 is output from an electrical chiller outlet 304 of the electrical chiller 300 toward the air handler 112, as shown.

[0045] Further, FIG. 12 is an embodiment of the data center cooling system 100 employing a single-effect absorption chiller 350 having a first segment 352 (e.g., similar to the first segment 116 in FIG. 5) and a second segment 354 (e.g., similar tothe third segment 128 in FIG. 5), the dry -cooler 104 corresponding to the cooling water 114, an additional dry-cooler 356, and an additional chiller 358 (e.g.. air-cooled chiller). As shown, the additional dry-cooler 356 may be employed to further reduce a temperature of the server water 130 (e.g., upstream of the immersion cooling assembly 111 and / or the servers 108 of the data center 106 relative to a flow of the server water 130), and the additional chiller 358 may be employed to further reduce a temperature of the space chilled water 118 (e.g.. upstream of the air handler 112 relative to a flow of the space chilled water 118).

[0046] While only certain features and embodiments of the disclosure have been illustrated and described, many modifications and changes may occur to those skilled in the art, such as variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, including temperatures and pressures, mounting arrangements, use of materials, colors, orientations, and so forth without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the disclosure. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described, such as those unrelated to the presently contemplated best mode of carrying out the disclosure, or those unrelated to enabling the claimed disclosure. It should be noted that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.

[0047] The techniques presented and claimed herein are referenced and applied to material obj ects and concrete examples of a practical nature that demonstrably improve the present technical field and, as such, are not abstract, intangible or purely theoretical. Further, if any claims appended to the end of this specification contain one or more elements designated as '‘means for [perform]ing [a function] ... ” or “step for[perform] ing [a function]... '’, it is intended that such elements are to be interpreted under 35 U.S.C. 112(f). However, for any claims containing elements designated in any other manner, it is intended that such elements are not to be interpreted under 35 U.S.C. 112(f).

Claims

CLAIMSWhat is claimed is:

1. A data center cooling system for a data center, wherein the data center cooling system comprises: an absorption chiller configured to cool a first fluid and a second fluid separate from the first fluid; a first outlet of the absorption chiller, wherein the first outlet is configured to convey the first fluid toward server equipment of the data center; and an air handler configured to: receive the second fluid via a second outlet of the absorption chiller; cool an air flow via the second fluid; and output the air flow into a room of the data center.

2. The data center cooling system of claim 1, comprising: a first flow path coupling the first outlet of the absorption chiller with an immersion cooling assembly configured to cool the server equipment; and a second flow path coupling the second outlet of the absorption chiller with the air handler.

3. The data center cooling system of claim 1, wherein the absorption chiller comprises a double-lift absorption chiller.

4. The data center cooling system of claim 3, comprising: a dry-cooler configured to cool a third fluid; and a pump configured to bias the third fluid to: a first segment of the double-lift absorption chiller, wherein the first segment also receives the second fluid; and then a second segment of the double-lift absorption chiller, wherein the second segment also receives the first fluid; and then a third segment of the double-lift absorption chiller, wherein the third segment also receives the first fluid.

5. The data center cooling system of claim 4, comprising: an evaporator of the first segment, wherein the evaporator is configured to receive the second fluid; a low temperature absorber of the first segment, wherein the low temperature absorber is configured to receive the third fluid; a low temperature generator of the second segment, wherein the low temperature generator is configured to receive the first fluid; a high temperature absorber of the second segment, wherein the high temperature absorber is configured to receive the third fluid; a high temperature generator of the third segment, wherein the high temperature generator is configured to receive the first fluid; and a condenser of the third segment, wherein the condenser is configured to receive the third fluid.

6. The data center cooling system of claim 4, wherein the first fluid, the second fluid, and the third fluid each comprise water.

7. The data center cooling system of claim 1, wherein the absorption chiller comprises an air-cooled double-lift absorption chiller.

8. The data center cooling system of claim 1 , comprising: a first pump configured to generate a first flow of the first fluid through the absorption chiller; and a second pump configured to generate a second flow of the second fluid through the absorption chiller.

9. The data center cooling system of claim 1, comprising a back-up chiller configured to cool the second fluid between the absorption chiller and the air handler in at least one operating mode of the data center cooling system.

10. A data center cooling system for a data center, wherein the data center cooling system comprises: a dry-cooler configured to cool a first fluid;a dry-cooler outlet of the dry-cooler, wherein the dry -cooler outlet is configured to convey the first fluid toward server equipment of the data center; an electrical chiller configured to cool a second fluid; and an air handler configured to: receive the second fluid via an electrical chiller outlet of the electrical chiller; cool an air flow via the second fluid; and output the air flow into a room of the data center.

11. The data center cooling system of claim 10, comprising: a first flow path coupling the dry-cooler outlet with an immersion cooling assembly configured to cool the server equipment; and a second flow path coupling the electrical chiller outlet with the air handler.

12. The data center cooling system of claim 10, comprising: a first pump configured to generate a first flow of the first fluid through drycooler; and a second pump configured to generate a second flow of the second fluid through the electrical chiller.

13. The data center cooling system of claim 10, wherein the server equipment is disposed in the room.

14. A data center cooling system for a data center, wherein the data center cooling system comprises: a single-effect absorption chiller configured to receive a first fluid, a second fluid separate from the first fluid, and a third fluid separate from the first fluid and the second fluid; a dry-cooler configured to be positioned on a first flow path corresponding to the first fluid and extending to and from the single-effect absorption chiller, wherein the dry -cooler is configured to cool the first fluid for delivery' to the single-effect absorption chiller; an additional dry-cooler configured to be positioned on a second flow path corresponding to the second fluid and extending between the single-effect absorptionchiller and server equipment of the data center, wherein the additional dry-cooler is configured to cool the second fluid for delivery to the server equipment; and an air handler configured to: receive the third fluid from the single-effect absorption chiller via a third flow path extending between the single-effect absorption chiller and the air handler; cool an air flow via the third fluid; and output the air flow into a room in which the server equipment is disposed.

15. The data center cooling system of claim 14, comprising an additional chiller configured to be disposed on the third flow path and to cool the third fluid for delivery to the air handler.

16. The data center cooling system of claim 15, wherein the additional chiller comprises an air-cooled chiller.

17. The data center cooling system of claim 14, wherein the single-effect absorption chiller comprises: a first segment configured to receive the first fluid and the third fluid; and a second segment configured to receive the first fluid and the second fluid.

18. The data center cooling system of claim 17, wherein: the first segment is configured to receive the first fluid from the dry-cooler; the second segment is configured to receive the first fluid from the first segment; and the dry-cooler is configured to receive the first fluid from the second segment.

19. The data center cooling system of claim 14. comprising: a first pump configured to bias the first fluid along the first flow path; a second pump configured to bias the second fluid along the second flow path; and a third pump configured to bias the third fluid along the third flow path.

20. The data center cooling system of claim 14. wherein the server equipment is disposed in the room.

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