Epoxy resin composition and preparation method therefor, display module and display device

Abstract

The present invention relates to an epoxy resin composition and a preparation method therefor, a display module and a display device. The epoxy resin composition comprises the following components in parts by mass: 3-10 parts of an epoxy resin, 0.8-3 parts of an organic silicon resin, 2-10 parts of a methacrylic resin, 2-10 parts of a melamine urea-formaldehyde resin, 1.5-6 parts of an amine curing agent, 1-3 parts of a filler, 0.5-2 parts of a coupling agent, and 46-80 parts of alcohol. The methacrylic resin and the melamine urea-formaldehyde resin interact with each other, are further matched with the epoxy resin and the organic silicon resin, and act together with other components at a specific ratio; therefore, the moisture resistance of a packaging film layer formed by using the epoxy resin composition can be effectively improved.

Description

Epoxy resin composition and preparation method thereof, display module and display device

[0001] Cross-references

[0002] This application claims priority to Chinese patent application No. 202310948723.3, filed on July 28, 2023, entitled “Epoxy resin composition, preparation method thereof, display module and display device,” and all disclosed contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to the field of display technology, and in particular to an epoxy resin composition and a preparation method thereof, a display module and a display device. Background Art

[0004] LED display is a kind of display composed of LED display modules. Compared with LCD display, LED display has better image fineness, higher contrast and true color reproduction, longer service life, lower power consumption, and can be infinitely assembled in size.

[0005] In recent years, as the pixel pitch of LED display modules has become increasingly smaller, image detail and grayscale have also become increasingly refined. Modules have evolved from SMD and mask processing to fine pitches below P2 and Mini LED and Micro LED modules below P1.0, using packaging formats such as COB (chip-on-board) and COG (chip-on-board). As COB processing becomes increasingly sophisticated, large and small pitch outdoor fixed installations and rental markets have become a trend. However, whether used outdoors or indoors in environments with high humidity, humidity differences between morning and evening, seasonal temperature differences, or temperature differences between morning and evening, traditional COB display modules can experience moisture delamination issues.

[0006] Summary of the Invention

[0007] Based on this, the present application provides an epoxy resin composition with good moisture-proof performance, a preparation method thereof, a display module and a display device.

[0008] The technical solution of this application to solve the above technical problems is as follows.

[0009] In a first aspect, the present application provides an epoxy resin composition comprising the following components in parts by mass:

[0010] In some embodiments, the epoxy resin composition comprises the following components in parts by mass:

[0011] In some embodiments, in the epoxy resin composition, the ratio of the sum of the mass of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the mass of the silicone resin and the epoxy resin is (1-4):1.

[0012] In some embodiments, in the epoxy resin composition, the mass ratio of the melamine urea-formaldehyde resin to the methacrylic acid resin is (0.5-3):1.

[0013] In some embodiments, in the epoxy resin composition, the mass ratio of the epoxy resin to the silicone resin is (1.5-6):1.

[0014] In some embodiments, in the epoxy resin composition, the amine curing agent includes at least one of polyphthalamide, fatty amine and polyamide.

[0015] In some embodiments, in the epoxy resin composition, the alcohol includes at least one of propylene glycol, n-propanol, and isopropanol.

[0016] In some embodiments, in the epoxy resin composition, the filler includes at least one of mica powder and silica powder.

[0017] In some embodiments, in the epoxy resin composition, the coupling agent is at least one of a silane coupling agent and a titanate coupling agent.

[0018] In some embodiments, the epoxy resin composition further comprises 5 to 10 parts by mass of nano-silicon dioxide.

[0019] In some embodiments, the epoxy resin composition further comprises, by weight, 3.75 to 15 parts of propylene glycol methyl ether acetate, 0.25 to 1 part of a dispersant, 0.65 to 2.6 parts of butyl acetate, and 0.35 to 1.4 parts of melanin.

[0020] In some embodiments, in the epoxy resin composition, the dispersant includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC and sodium citrate.

[0021] In some embodiments, in the epoxy resin composition, the viscosity of the epoxy resin composition is 50 mPa.s to 200 mPa.s.

[0022] A second aspect of the present application provides a method for preparing an epoxy resin composition, comprising the following steps:

[0023] Provide raw materials according to the components of the epoxy resin composition provided in the first aspect of the present application, and mix the raw materials.

[0024] The third aspect of the present application provides an epoxy resin film layer obtained by curing the epoxy resin composition provided by the first aspect of the present application.

[0025] A fourth aspect of the present application provides a display module, comprising a display module body and a packaging film layer, wherein the packaging film layer is provided on the display module body, and the packaging film layer comprises the above-mentioned epoxy resin film layer.

[0026] The fifth aspect of the present application provides a display device, including the display module provided in the fifth aspect of the present application.

[0027] Compared with the prior art, the epoxy resin composition of the present application has the following beneficial effects:

[0028] The above-mentioned epoxy resin composition includes epoxy resin, silicone resin, methacrylic resin, melamine urea-formaldehyde resin, amine curing agent, filler, coupling agent and alcohol. The methacrylic resin and melamine urea-formaldehyde resin interact with each other, and are further combined with epoxy resin and silicone resin, as well as other components in a specific proportion to work together, which can effectively improve the moisture-proof performance of the encapsulation film layer formed using the epoxy resin composition. DETAILED DESCRIPTION

[0029] Reference will now be made in detail to embodiments of the present invention, one or more examples of which are described below. Each example is provided to illustrate, not to limit, the present invention. Indeed, it will be apparent to those skilled in the art that various modifications and variations may be made to the present invention without departing from the scope or spirit of the invention. For example, features illustrated or described as part of one embodiment may be used in another embodiment to produce further embodiments.

[0030] Therefore, it is intended that the present invention covers such modifications and variations as come within the scope of the appended claims and their equivalents. Other objects, features, and aspects of the present invention are disclosed in or are obvious from the following detailed description. Those skilled in the art will appreciate that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the present invention.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0032] The term "comprises", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements limited by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. The indefinite articles "a" and "an" before the elements or components of the present invention have no restriction on the quantity requirements (i.e., the number of occurrences) of the elements or components. Therefore, "a" or "a" should be interpreted as including one or at least one, and elements or components in the singular also include plural forms, unless the quantity obviously refers only to the singular form. The meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] The weights of the relevant components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also represent the weight ratio between the components. Therefore, as long as the content of the relevant components is proportionally increased or decreased according to the description of the embodiments of the present invention, it is within the scope disclosed in the description of the embodiments of the present invention. Specifically, the weights mentioned in the description of the embodiments of the present invention may be mass units known in the chemical industry, such as μg, mg, g, and kg.

[0034] Except as shown in the operating examples or otherwise indicated, all numbers used in the specification and claims to express the amount of ingredients, physicochemical properties, etc. are understood to be adjusted by the term "about" in all cases. For example, therefore, unless otherwise indicated, the numerical parameters listed in the above specification and the appended claims are approximate values, and those skilled in the art will be able to appropriately change these approximate values ​​using the teachings disclosed herein to seek to obtain the desired properties. The use of numerical ranges expressed as endpoints includes all numbers within the range and any range within the range, for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4 and 5, etc.

[0035] One embodiment of the present application provides an epoxy resin composition, which comprises the following components in parts by mass:

[0036] The above-mentioned epoxy resin composition includes epoxy resin, silicone resin, methacrylic resin, melamine urea-formaldehyde resin, amine curing agent, filler, coupling agent and alcohol. The methacrylic resin and melamine urea-formaldehyde resin interact with each other, and are further combined with epoxy resin and silicone resin, as well as other components in a specific proportion to work together, which can effectively improve the moisture-proof performance of the encapsulation film layer formed using the epoxy resin composition.

[0037] At the same time, the epoxy resin composition has good fluidity and is easy to apply evenly; and the encapsulation film layer formed by the epoxy resin composition has high hardness, with a pencil hardness greater than 4.5H, which effectively avoids the moisture-proof effect affected by factors such as operational friction.

[0038] It can be understood that in the epoxy resin composition, the mass fraction of epoxy resin includes but is not limited to 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, and 10 parts; the mass fraction of silicone resin includes but is not limited to 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, and 3 parts; the mass fraction of methacrylic resin includes but is not limited to 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, and 10 parts; the mass fraction of melamine urea-formaldehyde resin includes but is not limited to 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, and 10 parts; the mass fraction of amine curing agent includes but is not limited to The mass fractions of include but are not limited to 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.2 parts, 5.5 parts, 5.8 parts, and 6 parts; the mass fractions of fillers include but are not limited to 1 part, 1.2 parts, 1.5 parts, 1.8 parts, 2 parts, 2.2 parts, 2.5 parts, 2.8 parts, and 3 parts; the mass fractions of coupling agents include but are not limited to 0.5 parts, 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 1.8 parts, and 2 parts; the mass fractions of alcohol include but are not limited to 56 parts, 60 parts, 65 parts, 70 parts, 75 parts, 78 parts, and 80 parts. In some examples, any two of these values ​​may be used as end values ​​within a range, the same below.

[0039] It is understood that the mass fraction relationship between the components in the above epoxy resin composition can also be a mass percentage relationship, such as:

[0040] In some examples, the epoxy resin composition includes the following components by mass percentage:

[0041] In some examples, the epoxy resin composition includes the following components in parts by mass:

[0042] In some examples, the epoxy resin composition includes the following components in parts by mass:

[0043] In some of the examples, in the epoxy resin composition, the ratio of the sum of the mass of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the mass of the silicone resin and the epoxy resin is (1-4):1.

[0044] It is understood that the sum of the masses of the methacrylic resin and the melamine urea-formaldehyde resin is m1, the sum of the masses of the silicone resin and the epoxy resin is m2, and m1 / m2 = (1-4):1. It is further understood that m1 / m2 includes but is not limited to 1:1, 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, and 4:1.

[0045] Optionally, the ratio of the sum of the mass of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the mass of the silicone resin and the epoxy resin is (1-3):1.

[0046] Furthermore, the ratio of the sum of the mass of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the mass of the silicone resin and the epoxy resin is (1.6-2):1.

[0047] In some of the examples, in the epoxy resin composition, the mass ratio of melamine urea-formaldehyde resin to methacrylic acid resin is (0.5-3):1.

[0048] It is understood that the mass ratio of melamine urea-formaldehyde resin to methacrylic resin includes but is not limited to 0.5:1, 1:1, 1.5:1, 2:1, 2.5:1, and 3:1.

[0049] Optionally, the mass ratio of melamine urea-formaldehyde resin to methacrylic acid resin is (1-3):1.

[0050] Furthermore, the mass ratio of melamine urea-formaldehyde resin to methacrylic acid resin is (1.1-2):1.

[0051] In some of the examples, in the epoxy resin composition, the mass ratio of the epoxy resin to the silicone resin is (1.5-6):1.

[0052] It will be appreciated that the mass ratio of epoxy resin to silicone resin includes, but is not limited to, 1.5:1, 1.6:1, 1.7:1, 1.8:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, and 6:1.

[0053] Optionally, the mass ratio of epoxy resin to silicone resin is (4-6):1.

[0054] In some examples, in the epoxy resin composition, the amine curing agent includes at least one of polyphthalamide, aliphatic amine, and polyamide.

[0055] In some examples, in the epoxy resin composition, the alcohol includes at least one of propylene glycol, n-propanol, and isopropanol.

[0056] In some examples, in the epoxy resin composition, the filler includes at least one of mica powder and silica powder.

[0057] Furthermore, the particle size of the filler is less than 48 μm.

[0058] In some examples, in the epoxy resin composition, the coupling agent is at least one of a silane coupling agent and a titanate coupling agent.

[0059] It is understood that silane coupling agents include but are not limited to A151 (vinyl triethoxysilane), A171 (vinyl trimethoxysilane) and A172 (vinyl tri(β-methoxyethoxy) silane); titanate coupling agents include but are not limited to isopropyl tri(isostearoyl) titanate (KR-TTS), isopropyl tri(dioctyl pyrophosphoryl) titanate (KR-38S) and bis(dioctyl pyrophosphoryl) titanium oxyacetate (KR-138S).

[0060] In some of the examples, the epoxy resin composition further includes 5 to 10 parts by mass of nano-silicon dioxide.

[0061] It can be understood that the mass fractions of nano-silicon dioxide include but are not limited to 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, and 10 parts.

[0062] In some of the examples, the epoxy resin composition further includes, by mass, 3.75 to 15 parts of propylene glycol methyl ether acetate, 0.25 to 1 part of a dispersant, 0.65 to 2.6 parts of butyl acetate, and 0.35 to 1.4 parts of melanin.

[0063] It can be understood that in the epoxy resin composition, propylene glycol methyl ether acetate is 4 parts, 4.5 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, and 15 parts; dispersant is 0.25 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, and 1 part; butyl acetate is 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 2 parts, 2.2 parts, 2.4 parts, and 2.5 parts; and melanin is 0.4 parts, 0.5 parts, 0.7 parts, 0.8 parts, 1 part, 1.2 parts, and 1.4 parts.

[0064] Optionally, the epoxy resin composition further comprises, by mass, 5 to 10 parts of propylene glycol methyl ether acetate, 0.5 to 1 part of a dispersant, 1 to 2 parts of butyl acetate, and 0.5 to 1 part of melanin.

[0065] Furthermore, the dispersant includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC and sodium citrate.

[0066] In some examples, the epoxy resin composition has a viscosity of 50 mPa·s to 200 mPa·s.

[0067] It can be understood that the viscosity of the epoxy resin composition includes but is not limited to 50 mPa.s, 100 mPa.s, 150 mPa.s, and 200 mPa.s.

[0068] By controlling the viscosity of the epoxy composition, uniform coating and controllable thickness can be effectively achieved. Otherwise, the thickness may be too thick, affecting the splicing of the display screen and generating dark splicing lines.

[0069] One embodiment of the present application provides a method for preparing an epoxy resin composition, comprising the following steps:

[0070] Raw materials are provided according to the components of the above-mentioned epoxy resin composition, and the raw materials are mixed.

[0071] Furthermore, in some examples, in the method for preparing the epoxy resin composition, the mixing step includes:

[0072] (1) mixing epoxy resin, silicone resin, melamine urea-formaldehyde resin, methacrylic resin, amine curing agent, filler and coupling agent to obtain an epoxy resin mixed solution;

[0073] (2) mixing nano-silicon dioxide and alcohol to obtain a nano-silicon dioxide dispersion;

[0074] (3) Mixing the epoxy resin mixture and the nano-silica dispersion.

[0075] It can be understood that there is no order in which steps (1) to (2) are performed.

[0076] Furthermore, in some examples, the mixing step further includes:

[0077] (4) mixing propylene glycol methyl ether acetate, a dispersant, butyl acetate, and melanin to obtain a melanin slurry;

[0078] (5) Mixing the black slurry with the mixed solution obtained in step (3).

[0079] One embodiment of the present application provides an epoxy resin film layer obtained by curing the above-mentioned epoxy resin composition.

[0080] The epoxy resin film layer obtained by curing the epoxy resin composition has good moisture resistance.

[0081] One embodiment of the present application provides a display module, including a display module body and a packaging film layer, wherein the packaging film layer is disposed on the display module body, and the packaging film layer includes the above-mentioned epoxy resin film layer.

[0082] It can be understood that the display module provided above is provided with a packaging film layer including the above epoxy resin film layer on the display module body, which effectively improves the moisture-proof performance of the display module, thereby preventing the display module from peeling due to moisture.

[0083] In some examples, in the display module, the epoxy resin film layer is disposed around the display module body. It can be understood that the four sides of the display module body are the thickness direction of the display module body.

[0084] In some of the examples, in the display module, the epoxy resin film layer has a thickness of 30 μm to 100 μm.

[0085] It can be understood that the thickness of the epoxy resin film layer includes but is not limited to 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, and 100 μm.

[0086] In some examples, in the display module, the display module body includes a display structure and a surface encapsulation layer, and the surface encapsulation layer is provided on the surface of the display structure for encapsulating the display structure.

[0087] It can be understood that the present application is not limited to the encapsulation layer on the surface of the display structure, such as an epoxy resin encapsulation layer.

[0088] In some examples, in the display module, the display structure is disposed on a substrate.

[0089] An embodiment of the present application provides a method for preparing a display module, comprising step S10:

[0090] The epoxy resin composition is coated around the display module body and cured.

[0091] In some examples, in step S10 , the curing step includes: baking at 80° C. to 100° C. for 3 to 5 minutes, and then taking out for natural curing.

[0092] In some examples, in step S10 , before the coating step, a tearable tape layer is provided on the surface of the display module body, and then the coating step is performed. The tearable tape layer is then removed and cured.

[0093] It is understood that the size of the easy-to-tear tape layer is determined according to the size of the display module body, so as to prevent the epoxy resin composition from overflowing and contaminating the surface of the display module body.

[0094] In some examples, in step S10 , coating is performed using a coating machine such as a glue dispensing machine or a glue filling machine.

[0095] In some examples, step S10 includes steps S11 to S15:

[0096] Step S11: Use a mold robot arm to suck the easy-to-tear single-sided tape.

[0097] Furthermore, in step S11, the mold robot arm is equipped with a vacuum air pressure tube and a vacuum suction hole.

[0098] Furthermore, in step S11, the thickness of the easily tearable single-sided tape is greater than 1 mm, the width is greater than 5 mm, and the shape is customized according to the specific product size.

[0099] Step S12: After step S11 is completed, the display module body is sucked by a mold robot arm so that the easy-to-tear single-sided tape layer is attached to the surface encapsulation layer in the display module body.

[0100] It can be understood that the display module body includes a die-bonded substrate and a surface encapsulation layer.

[0101] Step S13: placing the epoxy resin composition into the syringe of a coating machine, coating the four sides of the display module body, and curing.

[0102] In some examples, in step S13 , the injection needle is provided with a brush.

[0103] Furthermore, the coating can be done with a brush or a sponge.

[0104] Furthermore, the brush may be cylindrical or the like.

[0105] It will be appreciated that the injection needle is provided with an air pressure tube.

[0106] It can be understood that the coated area is the four sides of the easy-to-tear single-sided tape and the display module body after they are attached, that is, the cross-section of the easy-to-tear single-sided tape and the display module body after they are attached.

[0107] It is understandable that steps S11, S12, and S13 may be performed sequentially, or the epoxy resin composition may be placed in the injection needle of the coating machine for standby use before performing step S11.

[0108] In some embodiments, the air pressure of the coating machine is 0.45Mpa~0.6Mpa, the X\Y\X three-axis accuracy is ±0.02mm, the glue output is adjustable from 0.1g to 1000g, the glue output error is less than 0.5%, and the maximum moving speed is 500mm / s.

[0109] In some of these examples, the coating machine uses Changlin Automation Equipment CL-655G, and the needle syringe glue outlet is modified into a cylindrical brush head.

[0110] Modify traditional coating machines such as dispensing machines and needle-type glue filling machines, change their glue heads, that is, add customized brushes, improve the accuracy of hand brushes or other machine brushes, ensure uniform brushing and no missed brushing, and at the same time control the viscosity of epoxy resin to ensure that after uniform brushing, before solidification, liquid flow is reduced or non-existent, and eliminate uneven forming of the film, which affects module installation.

[0111] One embodiment of the present application provides a display device, including the above-mentioned display module.

[0112] In some examples, the display device includes one or more spliced ​​display modules. That is, in one example, the display device may include a single display module. Alternatively, in another example, the display device may be a large-scale display device composed of multiple spliced ​​display modules.

[0113] The present application will be described in further detail below in conjunction with specific implementation methods, but the implementation methods of the present application are not limited thereto.

[0114] Example 1

[0115] The components of the epoxy composition are as follows:

[0116] 6 parts of epoxy resin (Shanghai Shunxinda New Materials Technology 3801A), 1 part of silicone resin (Kangmet 7772), 5 parts of methacrylic resin (Guangzhou Jingyi New Materials Co., Ltd. SM 2703 / 80BACX), 6 parts of melamine urea-formaldehyde resin (Jining Tangyi Chemical Co., Ltd. 563), 6 parts of nano-silica, 3 parts of polyphthalamide, 2 parts of mica powder, 1 part of coupling agent vinyltriethoxysilane (A151), 25 parts of propylene glycol, 20 parts of n-propanol, 20 parts of isopropanol, 5 parts of propylene glycol methyl ether acetate, 2 parts of butyl acetate, 1 part of carbon black and 1 part of water glass. Among them, the ratio of the sum of the masses m1 of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the masses m2 of the silicone resin and the epoxy resin is approximately 1.6:1; the ratio of the mass m3 of the melamine urea-formaldehyde resin to the mass m4 of the methacrylic resin is 1.2:1; and the ratio of the mass m5 of the epoxy resin to the mass m6 of the silicone resin is 6:1.

[0117] The addition of epoxy resin, silicone resin, methacrylic resin and melamine urea-formaldehyde resin in Examples 2 to 7 and Comparative Examples 1 to 6 are shown in Table 1, wherein the number of parts of each component in Example 2 is the same as that in Example 1, except that the filler in Example 2 is silicon powder, the coupling agent is isopropyl tri(isostearyl) titanate (KR-TTS), the amine curing agent is polyamide, and the dispersant is sodium citrate; the other components in Examples 3 to 7 and Comparative Examples 1 to 6 are the same as those in Example 1.

[0118] Table 1

[0119] Add the components into a blender in proportion and mix them evenly to prepare a sub-black transparent epoxy resin coating.

[0120] Changlin automation equipment CL-655G was used, and the glue outlet of the needle syringe was transformed into a cylindrical brush head; 30g of the epoxy resin sub-black transparent coating prepared in each embodiment and comparative example was poured into the syringe, the air pressure of the CL-655G equipment was adjusted to 0.5 MPa, the discharge amount was adjusted to 0.1 gram, the brushing rotation speed was 50 rpm, the brushing movement speed was 200 mm / s, and a control program was compiled; an outdoor P1.875 COB module was fixed on the platform of a needle-type glue filling machine, and the epoxy resin sub-black transparent coating prepared in each embodiment and comparative example was brushed on all four sides of the COB module, and the modules were sequentially placed into a tunnel curing furnace and baked at 100°C for 3-5 minutes. The coating film thickness was about 50 μm, and display modules A to M were obtained respectively.

[0121] Perform pencil hardness test and moisture resistance test on display modules A to M;

[0122] The pencil hardness test is as follows:

[0123] 1. Place the test piece upright and secure it. Hold a pencil at a 45° angle to the test piece and scratch firmly, without breaking the lead, for about 1 cm in front of the tester at a constant speed. The scratching speed should be 1 mm / s. After each scratch, regrind the lead tip. Repeat the test five times using a pencil with the same hardness rating.

[0124] 2. When evaluating by observing the damage of the coating, if the substrate or primer coating is visible in only 2 or less tests out of 5, a pencil with a larger hardness mark should be used to conduct the same test. When the coating is damaged more than 2 times (for every 5 tests), the hardness mark of the pencil at this time can be read, and the hardness mark next to this pencil hardness mark can be recorded.

[0125] The moisture-proof test steps are as follows:

[0126] 1. After the display module is placed in a 5% salt spray environment for 5 days, the dead light rate α (light-emitting chip failure) is tested. The lower the dead light rate, the better the moisture-proof effect, and the dead light rate within 10% is qualified;

[0127] 2. Place the lamp at high temperature and high humidity of 80℃ and humidity greater than 85% for 7 days to test the dead light rate β (light-emitting chip failure). The lower the dead light rate, the better the moisture-proof effect, and the dead light rate must be within 10% to pass the test.

[0128] The test results are shown in Table 2:

[0129] Table 2

[0130] As can be seen from Table 2, compared with the comparative examples, the epoxy resin compositions of the examples have higher pencil hardness and better moisture resistance. Comparative Examples 1 to 6 differ from Example 1 mainly in that no acrylic resin is added in Comparative Example 1, no melamine urea-formaldehyde resin is added in Comparative Example 2, no silicone resin is added in Comparative Example 3, the amount of silicone resin added in Comparative Example 4 is too large, the methacrylic acid resin is replaced with an equal mass of vinyl ester resin in Comparative Example 5, and the melamine urea-formaldehyde resin is replaced with an equal mass of melamine urea-formaldehyde resin in Comparative Example 6. The resulting epoxy resin compositions have lower pencil hardness, higher dead lamp rate, and poor moisture resistance.

[0131] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0132] The embodiments described above only express several implementation methods of the present application, which are convenient for understanding the technical solutions of the present application in a specific and detailed manner, but they cannot be understood as limiting the scope of protection of the invention patent. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided in the present application are all within the scope of protection of the claims attached to the present application. Therefore, the scope of protection of the patent of this application shall be based on the content of the attached claims, and the description can be used to interpret the content of the claims. Industrial Applicability

[0133] The present invention provides an epoxy resin composition, a preparation method thereof, a display module, and a display device. The epoxy resin composition comprises the following components, measured by mass: 3-10 parts epoxy resin, 0.8-3 parts silicone resin, 2-10 parts methacrylic resin, 2-10 parts melamine urea-formaldehyde resin, 1.5-6 parts amine curing agent, 1-3 parts filler, 0.5-2 parts coupling agent, and 46-80 parts alcohol. The methacrylic resin and melamine urea-formaldehyde resin interact with each other, and further work in combination with the epoxy resin and silicone resin, as well as other components in specific proportions, to effectively improve the moisture-proof properties of encapsulation films formed using the epoxy resin composition. The epoxy resin composition has good economic value and application prospects.

Claims

1. An epoxy resin composition, characterized in that By mass, it includes the following components:

2. The epoxy resin composition according to claim 1, wherein By mass, it includes the following components:

3. The epoxy resin composition according to claim 1, characterized in that The ratio of the sum of the masses of the methacrylic resin and the melamine urea-formaldehyde resin to the sum of the masses of the silicone resin and the epoxy resin is (1-4):

1.

4. The epoxy resin composition according to claim 3, characterized in that The mass ratio of the melamine urea-formaldehyde resin to the methacrylic resin is (0.5-3):

1.

5. The epoxy resin composition according to claim 1, wherein The mass ratio of the epoxy resin to the silicone resin is (1.5-6):

1.

6. The epoxy resin composition according to any one of claims 1 to 5, wherein The amine curing agent includes at least one of polyphthalamide, fatty amine and polyamide.

7. The epoxy resin composition according to any one of claims 1 to 5, wherein The alcohol includes at least one of propylene glycol, n-propanol and isopropanol.

8. The epoxy resin composition according to any one of claims 1 to 5, wherein The filler includes at least one of mica powder and silica powder.

9. The epoxy resin composition according to any one of claims 1 to 5, wherein The coupling agent is at least one of a silane coupling agent and a titanate coupling agent.

10. The epoxy resin composition according to any one of claims 1 to 5, wherein The epoxy resin composition further comprises, by weight, 5 to 10 parts of nano silicon dioxide.

11. The epoxy resin composition according to claim 1, wherein The epoxy resin composition further comprises, by weight, 3.75 to 15 parts of propylene glycol methyl ether acetate, 0.25 to 1 part of a dispersant, 0.65 to 2.6 parts of butyl acetate and 0.35 to 1.4 parts of melanin.

12. The epoxy resin composition according to claim 11, wherein The dispersant includes at least one of STA-1110A, RD-9107, LS3050, water glass, sodium humate, sodium hexametaphosphate, sodium tripolyphosphate, CMC and sodium citrate.

13. The epoxy resin composition according to any one of claims 1 to 12, wherein The epoxy resin composition has a viscosity of 50 mPa.s to 200 mPa.s.

14. A method for preparing an epoxy resin composition, characterized in that: The following steps are involved: The components of the epoxy resin composition according to any one of claims 1 to 13 are provided with raw materials, and the raw materials are mixed.

15. An epoxy resin film layer, characterized in that: Obtained by curing the epoxy resin composition according to any one of claims 1 to 13.

16. A display module, characterized in that: It comprises a display module body and a packaging film layer, wherein the packaging film layer is arranged on the display module body, and the packaging film layer comprises the epoxy resin film layer as claimed in claim 15.

17. A display device, characterized in that: Comprising the display module as claimed in claim 16.

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