Electronic control component and air conditioner having same

Abstract

An electronic control component (100) and an air conditioner (1000) having same. The electronic control component (100) comprises an electronic control box (1), a circuit board (2) and a heating device (3), wherein the electronic control box (1) is a closed box body; the circuit board (2) is accommodated in the electronic control box (1); and the heating device (3) comprises an inductive device (31) arranged on the circuit board (2), the inductive device (31) being accommodated in the electronic control box (1).

Description

Electronic control component and air conditioner having the same

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on the Chinese patent application with application number 202310958493.9 and application date of July 31, 2023, and the Chinese patent application with application number 202322047509.9 and application date of July 31, 2023, and claims the priority of the above-mentioned Chinese patent applications. The entire contents of the above-mentioned Chinese patent applications are hereby introduced into this application as a reference. Technical Field

[0003] The present application relates to the technical field of electronic control components, and in particular to an electronic control component and an air conditioner having the same. Background Art

[0004] In the air conditioner in the related art, the inductive device of the electronic control component is usually set outside the electronic control box. When the air conditioner is used in an environment such as a kitchen or factory, the working environment of the air conditioner is complex and there are many pollutants in the air. The pollutants in the air will contact the inductive device, causing an adverse effect on the inductive device and reducing the working reliability of the electronic control component.

[0005] Application Contents

[0006] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an electronic control component, which is a sealed component with an inductive device disposed within the sealed electronic control box, to reduce the impact of air pollutants on the inductive device, improve the operating stability of the electronic control component, and extend the service life of the electronic control component.

[0007] The present application also proposes an air conditioner having the above-mentioned electronic control component.

[0008] According to the first aspect of the present application, the electronic control component includes: an electronic control box, which is a closed box body; a circuit board, which is housed in the electronic control box; and a heating device, which includes an inductive device provided on the circuit board, and the inductive device is housed in the electronic control box.

[0009] According to the electronic control component of the embodiment of the present application, by setting the electronic control box as a closed box body, pollutants such as oil, dust, etc. can be prevented from entering the electronic control box, and the circuit board and the inductive device are stored inside the electronic control box, which can avoid the adverse effects caused by oil contacting the circuit board and the inductive device, thereby improving the working stability of the electronic control component and extending the service life of the electronic control component.

[0010] The inductive device includes a first inductive device, an end of the first inductive device away from the circuit board is a distal end of the first inductive device, and a distance between the distal end of the first inductive device and the electric control box is 5 mm-10 mm.

[0011] The inductive device includes a first inductive device, and the end of the first inductive device away from the circuit board is the distal end of the first inductive device. The electrical control box includes an inner shell and an outer shell covering the inner shell. The inner shell is an insulating shell and is formed with a first opening. The first opening is opposite to the distal end of the first inductive device. The outer shell is a metal shell and blocks and closes the first opening.

[0012] The inductive device includes a first inductive device, and the electrical control box includes a first box wall. The first box wall is located on a side of the first inductive device away from the circuit board. A portion of the first box wall protrudes in a direction away from the circuit board to form a protrusion. The inner side of the protrusion forms an avoidance cavity, and at least a portion of the first inductive device is accommodated in the avoidance cavity.

[0013] In a cross section of the circuit board, a cross-sectional width of the protrusion gradually decreases in a direction away from the circuit board.

[0014] The cross-sectional profile of the protrusion is trapezoidal or arc-shaped.

[0015] The electronic control component also includes an air duct cover arranged outside the electronic control box, and a heat dissipation air duct is formed between the air duct cover and the first box wall. The air flow direction of the heat dissipation air duct is from one side of the cross-sectional width of the protrusion to the other side of the cross-sectional width.

[0016] There are multiple first inductive components, and the first box wall has multiple protrusions, each of which corresponds to one first inductive component.

[0017] The heating device further includes a capacitive device provided on the circuit board, and the capacitive device is accommodated in the electric control box.

[0018] The capacitive component includes a first capacitive component, an end of the first capacitive component away from the circuit board is a distal end of the first capacitive component, and a distance between the distal end of the first capacitive component and the electric control box is 5 mm-10 mm.

[0019] The capacitive device includes a first capacitive device, the end of the first capacitive device away from the circuit board is the distal end of the first capacitive device, the electrical control box includes an inner shell and an outer shell covering the inner shell, the inner shell is an insulating shell and is formed with a second opening, the second opening is opposite to the distal end of the first capacitive device, and the outer shell is a metal shell and blocks and closes the second opening.

[0020] The inductive device includes a first inductive device, and the capacitive device includes a first capacitive device. The first inductive device and the first capacitive device are located on the same side of the circuit board in the thickness direction, and the height of the first inductive device in the thickness direction of the circuit board is higher than the height of the first capacitive device. The electrical control box includes a first box wall, and the first box wall is located on a side of the first inductive device away from the circuit board. The distance between the first part of the first box wall corresponding to the first inductive device and the circuit board is greater than the distance between the second part of the first box wall corresponding to the first capacitive device and the circuit board.

[0021] The electrical control box includes an inner shell and an outer shell covering the inner shell, the inner shell having a through discharge hole, the inner end of the discharge hole being connected to the interior of the electrical control box, the outer shell covering the outer end of the discharge hole, and a gap connected to the outer end of the discharge hole and a slit connecting the gap to the outside of the electrical control box being formed between the outer shell and the inner shell, the gap and the flow width of the gap being smaller than the equivalent diameter of the inner end of the discharge hole.

[0022] There are multiple discharge holes; and / or the flow area of ​​the discharge holes gradually decreases from the inner end to the outer end.

[0023] The electric control component further includes an air duct cover provided outside the electric control box, a heat dissipation air duct is formed between the air duct cover and the electric control box, and the exhaust hole is located downstream of the capacitive device in the air flow direction of the heat dissipation air duct.

[0024] The electronic control component also includes: an air duct cover, which is arranged outside the electronic control box and is located on the side of the inductive device away from the circuit board. A heat dissipation air duct is formed between the air duct cover and the electronic control box. The air duct cover itself or together with the electronic control box defines an air inlet of the heat dissipation air duct, and the air duct cover itself or together with the electronic control box defines an air outlet of the heat dissipation air duct.

[0025] The distance between the air duct cover and the electric control box is the height of the heat dissipation air duct, and the height of the heat dissipation air duct at least at a position corresponding to the inductive component is 10 mm to 15 mm.

[0026] The electrical control box includes a first box wall, which is located on the side of the inductive device away from the circuit board. The heat dissipation duct is formed between the first box wall and the duct cover. The first box wall has a concave-convex shape, and the duct cover is also constructed with a matching concave-convex shape corresponding to the concave-convex position of the first box wall, so that the height of the heat dissipation duct at the concave-convex position corresponding to the first box wall is fixed.

[0027] The circuit board is also provided with a capacitive device, which is also housed in the electrical control box and is located on the same side of the circuit board as the inductive device. In the airflow direction of the heat dissipation duct, at least one capacitive device and at least one inductive device are arranged in parallel.

[0028] The inductive device includes a first inductive device, and the capacitive device includes a first capacitive device. The height of the first inductive device in the thickness direction of the circuit board is higher than the height of the first capacitive device. The air inlet includes a first inlet part located upstream of the first inductive device and a second inlet part located upstream of the first capacitive device. The distance between the first inlet part and the circuit board is greater than the distance between the second inlet part and the circuit board.

[0029] The first inductive device and the first capacitive device are arranged at intervals along the first direction, the air outlet and the air inlet are located on both sides of the first inductive device in the second direction, and the air inlet is constructed as a long strip opening whose length direction extends along the first direction and whose width direction extends along the second direction. The length of the air inlet is more than 10 times the width of the air inlet.

[0030] The circuit board is also provided with a power device, and the electronic control component also includes a radiator, which cooperates with at least one of the power devices for heat transfer, and at least part of the radiator is located outside the electronic control box. In the airflow direction of the heat dissipation duct, the radiator is located downstream of the inductive device.

[0031] The air conditioner according to the second aspect of the present application includes a casing, a compressor, a first heat exchanger, a second heat exchanger, a supply air fan, an exhaust air fan and an electronic control component according to the first aspect of the present application, the casing having a supply air duct and an exhaust air duct isolated from each other, the first heat exchanger is arranged in the supply air duct, the second heat exchanger is arranged in the exhaust air duct, the first heat exchanger and the second heat exchanger are both connected to the compressor and serve as an evaporator and a condenser respectively, the inlet of the supply air fan is connected to the supply air duct and the outlet of the supply air fan is connected to the indoor side, the inlet of the exhaust fan is connected to the exhaust duct and the outlet of the exhaust fan is connected to the outdoor side, and the electronic control component is arranged on the air inlet path of the exhaust fan.

[0032] According to the air conditioner of the embodiment of the present application, the installation of the electronic control component of the first aspect can improve the operating reliability of the air conditioner. Furthermore, by arranging the electronic control component in the air inlet path of the exhaust fan, the supply fan can simultaneously provide airflow to the second heat exchanger while dissipating heat from the electronic control component. This eliminates the need for an additional exhaust fan, simplifies the air conditioner structure, reduces the size and manufacturing cost of the air conditioner, and facilitates installation.

[0033] The electric control component is arranged in the exhaust air duct and along the air inlet path of the exhaust fan. The electric control component is located upstream of the second heat exchanger, or the electric control component and the second heat exchanger are arranged in parallel.

[0034] The exhaust fan and the air supply fan are both arranged in the shell.

[0035] The refrigerant in the compressor includes carbon dioxide.

[0036] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic structural diagram of an electric control component according to a first embodiment of the present application;

[0038] FIG2 is a schematic structural diagram of an electric control component according to a second embodiment of the present application;

[0039] FIG3 is a schematic structural diagram of an electric control component according to a third embodiment of the present application;

[0040] FIG4 is a partial enlarged view of area A according to the example shown in FIG1 ;

[0041] FIG5 is a perspective view of the electronic control component according to the present application;

[0042] FIG6 is a perspective view of an air conditioner according to an embodiment of the present application;

[0043] FIG7 is a schematic diagram of the coordination between the electronic control component and the second heat exchanger in the air conditioner according to an embodiment of the present application.

[0044] Figures 1 and 2 show: air conditioner 1000; electronic control component 100; electronic control box 1; inner shell 11; first opening 111; second opening 112; exhaust hole 113; outer shell 12; gap 121; gap 122; first box wall 1a; protrusion b; circuit board 2; heating device 3; inductive device 31; first inductive device 310; capacitive device 32; first capacitive device 320; air duct cover 4; heat dissipation duct 50; air inlet 51; first inlet part 511; second inlet part 512; air outlet 52; power device 6; radiator 7; outer shell 200; supply air duct 210; exhaust air duct 220; partition 230; compressor 300; first heat exchanger 400; second heat exchanger 500; supply air fan 600; exhaust air fan 700. DETAILED DESCRIPTION

[0045] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0046] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the applicability of other processes and / or the use of other materials.

[0047] The following describes an electronic control component 100 according to an embodiment of the first aspect of the present application with reference to FIG1 .

[0048] According to the embodiment of the present application, the electric control component 100 includes: an electric control box 1, a circuit board 2 and a heating device 3. The electric control box 1 is a closed box body, the circuit board 2 is housed in the electric control box 1, and the heating device 3 includes an inductive device 31 arranged on the circuit board 2, and the inductive device 31 is housed in the electric control box 1.

[0049] It is worth noting that the application scenarios of the electronic control component 100 of the present application are not limited. For example, the electronic control component 100 can be used to control the actions of components such as compressors, solenoid valves, and fans.

[0050] For example, when the working environment of the electronic control component 100 is relatively complex, such as when the air in the working environment contains pollutants such as oil and dust, in the embodiment of the present application, by configuring the electronic control box 1 as a closed box body, pollutants such as oil and dust can be prevented from entering the electronic control box 1. Furthermore, by storing the circuit board 2 and the inductive device 31 inside the electronic control box 1, oil and dust can be prevented from contacting the inductive device 31 and causing adverse effects on the inductive device 31. This can improve the working reliability of the inductive device 31 and the working stability of the electronic control component 100, thereby extending the service life of the electronic control component 100.

[0051] It is also worth noting that the “closed” mentioned in this application should be understood in a broad sense. If there are no air flow channels (such as heat dissipation holes) for heat dissipation on the electric control box 1, it can be understood as a closed state.

[0052] According to the electronic control component 100 of the embodiment of the present application, by setting the electronic control box 1 as a closed box body, pollutants such as oil, dust, etc. can be prevented from entering the electronic control box 1, and the circuit board 2 and the inductive device 31 are stored inside the electronic control box 1, which can prevent oil from contacting the inductive device 31 and causing adverse effects on the inductive device 31, thereby improving the working reliability of the inductive device 31 and improving the working stability of the electronic control component 100, thereby extending the service life of the electronic control component 100.

[0053] It is worth noting that the electronic control component 100 of the present application configures the electronic control box 1 as a closed box, with the circuit board 2 and the inductive device 31 both disposed within the electronic control box 1. When the electronic control component 100 is operating, the inductive device 31 generates heat. Since the electronic control box 1 of the present embodiment is not provided with through holes for heat dissipation, some embodiments of the present application also incorporate a heat dissipation design into the electronic control component 100 to enhance its heat dissipation capability and further improve its operational reliability.

[0054] In some embodiments of the present application, as shown in FIG1 , the inductive device 31 includes a first inductive device 310 . The end of the first inductive device 310 that is away from the circuit board 2 is the distal end of the first inductive device 310 . The distance L1 between the distal end of the first inductive device 310 and the electrical control box 1 is 5 mm to 10 mm, for example, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc. Typically, the distal end of the first inductive device 310 is the position closest to the electrical control box 1 . If the distance between the distal end of the first inductive device 310 and the electrical control box 1 is too large, the efficiency of heat radiation dissipation from the first inductive device 310 to the electrical control box 1 is low, and the heat dissipation capacity of the first inductive device 310 is insufficient. If the distance between the distal end of the first inductive device 310 and the electrical control box 1 is too small, the electrical safety distance is not met.

[0055] By setting the distance between the distal end of the first inductor 310 and the electrical control box 1 to the above-mentioned distance value, the distance between the distal end of the first inductor 310 and the electrical control box 1 is reduced, which is beneficial for the first inductor 310 to radiate heat to the electrical control box 1, thereby improving the heat dissipation effect of the first inductor 310; and by setting the distance between the distal end of the first inductor and the electrical control box 1 to the above-mentioned distance value, the safety distance requirement can also be met.

[0056] There can be one or more inductive devices 31, at least one of which is a first inductive device 310. The first inductive device 310 satisfies the aforementioned spacing between the distal end of the first inductive device 310 and the electrical control box 1. The spacing between the other inductive devices 31 and the electrical control box 1 can meet the aforementioned spacing value, or the spacing between the other inductive devices 31 and the electrical control box 1 may not meet the aforementioned spacing value. For example, in some examples, the first inductive device 310 may be connected to a high-voltage circuit, such as a PFC inductor (where PFC stands for Power Factor Correction) or a common-mode inductor. The first inductive device 310 generates relatively high heat, while the other inductive devices 31 generate relatively low heat. Therefore, embodiments of the present application prioritize the design of heat dissipation for the first inductive device 310. By setting the spacing between the distal end of the first inductive device and the electrical control box 1 to the aforementioned spacing value, the spacing between the first inductive device 310 and the electrical control box 1 is reduced, which facilitates heat dissipation from the inductive device 31 to the electrical control box 1 through radiation. The inductive device 31 , which generates relatively less heat, may or may not be within this spacing.

[0057] In some embodiments of the present application, as shown in Figures 2 and 3 , the inductive element 31 includes a first inductive element 310. The end of the first inductive element 310 that is distal to the circuit board 2 is the distal end of the first inductive element 310. The electrical control box 1 includes an inner shell 11 and an outer shell 12 covering the inner shell 11. The inner shell 11 is an insulating shell and has a first opening 111 formed therein. The first opening 111 is opposite the distal end of the first inductive element 310. The outer shell 12 is a metal shell that blocks and closes the first opening 111. Therefore, in this embodiment, the electrical control box 1 is configured as at least a two-layer structure. The metal shell ensures the structural reliability and fire resistance of the electrical control box 1, while the insulating shell provides insulation and other functions, thereby improving the safety of the electrical control component 100. Optionally, the inner shell 11 can be made of plastic. In addition to providing insulation, it also has flame retardant properties, which helps improve the flame retardancy and fire resistance of the electrical control box 1. By setting the electric control box 1 as a double-layer structure, with the inner shell 11 being a plastic shell and the outer shell 12 being a metal shell, the manufacturing cost of the inner shell 11 is low. On the basis of improving the working reliability of the electric control box 1, the manufacturing cost of the electric control box 1 can also be reduced.

[0058] Typically, the distal end of the first inductive element 310 is the point closest to the electrical control box 1. However, it is understood that the outer shell 12 of the present application is a metal shell with strong thermal conductivity, while the inner shell 11 is an insulating shell with relatively weaker thermal conductivity than the outer shell 12. Furthermore, the outer shell 12 is located outside the inner shell 11 and is directly exposed to the outside world. Therefore, by providing a first opening 111 at a position opposite the distal end of the first inductive element 310, the first inductive element 310 radiates heat directly to the outer shell 12 through the first opening 111. This facilitates heat dissipation from the first inductive element 310 to the electrical control box 1, thereby improving the efficiency of heat dissipation from the first inductive element 310.

[0059] There can be one or more inductive devices 31, at least one of which is a first inductive device 310. A first opening 111 is provided on the inner shell 11 opposite the distal end of the first inductive device 310. The inner shell 11 opposite the distal end of the other inductive devices 31 may or may not have openings. For example, in some examples, the first inductive device 310 may be connected to a high-voltage circuit, such as a PFC inductor (where PFC stands for Power Factor Correction) or a common-mode inductor. The first inductive device 310 generates relatively high heat, while the other inductive devices 31 generate relatively low heat. Therefore, embodiments of the present application prioritize the design of heat dissipation for the first inductive device 310. By providing the first opening 111 on the inner shell 11 opposite the distal end of the first inductive device 310, the first inductive device 310 and the metal shell are efficiently dissipated by heat radiation, which facilitates heat radiation from the first inductive device 310 to the electrical control box 1.

[0060] When there are multiple first inductive devices 310, optionally, at least two first inductive devices 310 correspond to the same first opening 111, that is, a first opening 111 is provided on the inner shell 11, and the range of the first opening 111 is relatively large, which can be opposite to the distal ends of the at least two first inductive devices 310; or, also optionally, each first inductive device 310 corresponds to a different first opening 111, and the first inductive devices 310 correspond to the first openings 111 one-to-one.

[0061] In some specific embodiments of the present application, the outer shell 12 is a metal shell, and the inner shell 11 is a plastic shell. The metal shell ensures the structural reliability and fire resistance of the electrical control box 1, and the insulating shell provides insulation and other functions. The plastic shell not only provides insulation but also has flame retardant properties, which helps improve the flame retardancy and fire resistance of the electrical control box 1. Furthermore, it can reduce the manufacturing cost of the electrical control box 1.

[0062] In some embodiments of the present application, as shown in Figures 1 and 2, the inductive device 31 includes a first inductive device 310, and the electrical control box 1 includes a first box wall 1a, which is located on the side of the first inductive device 310 away from the circuit board 2. A portion of the first box wall 1a protrudes in a direction away from the circuit board 2 to form a protrusion b, and an avoidance cavity is formed on the inner side of the protrusion b, that is, a avoidance cavity is formed on the side facing the inside of the electrical control box 1, and at least a portion of the first inductive device 310 is accommodated in the avoidance cavity.

[0063] By providing the protrusion b to form a relief cavity to accommodate the inductive device 31, the first aspect of the present invention is to increase the heat radiation area of ​​the first inductive device 310 and improve the heat dissipation efficiency. It is understood that the first inductive device 310 is at least partially accommodated in the relief cavity. In addition to radiating heat with the side wall of the electrical control box 1 away from the circuit board 2, the first inductive device 310 also radiates heat with the wall located lateral to the first inductive device 310. Compared to radiating heat only with the side wall away from the circuit board 2, the provision of the protrusion b on the first box wall 1a of the electrical control box 1 in the embodiment of the present application can increase the heat radiation area of ​​the first inductive device 310, thereby facilitating the heat dissipation of the first inductive device 310 to the electrical control box 1 and improving the heat dissipation efficiency of the first inductive device 310.

[0064] The protrusion b is provided to form an avoidance cavity to accommodate the inductive device 31 . Secondly, the protrusion b can cover the heat dissipation of the first inductive device 310 , thereby reducing the adverse thermal impact of the heat flowing to other locations on other components on the circuit board 2 .

[0065] The protrusion b forms a relief cavity to accommodate the inductive device 31. Thirdly, the relief cavity avoids the first inductive device 310, reducing interference between the first inductive device 310 and the electrical control box 1 and improving the operational stability of the first inductive device 310. Furthermore, only a portion of the relief cavity needs to protrude away from the circuit board 2, without requiring the entire electrical control box 1 to be raised to distance it from the circuit board 2. This non-protruding portion saves material and reduces manufacturing costs. Furthermore, the non-protruding portion of the electrical control box 1 is closer to other components on the circuit board 2, facilitating heat dissipation from these components.

[0066] There can be one or more inductive devices 31 , at least one of which is a first inductive device 310 . The first inductive device 310 is housed in the avoidance cavity, and the remaining inductive devices 31 can be arranged corresponding to the flat portion of the electric control box 1 .

[0067] For example, in some examples, the first inductive component 310 may be connected to a high-voltage circuit, such as a PFC inductor or a common-mode inductor. The first inductive component 310 generates high heat and is relatively tall, while the other inductive components 31 are relatively short and generate relatively little heat. Therefore, a protrusion b is provided on the first box wall 1a opposite the first inductive component 310. The protrusion b forms a relief cavity to shield the first inductive component 310, facilitating heat radiation from the first inductive component 310 to the electrical control box 1. It also shields the heat dissipated by the first inductive component 310, preventing adverse thermal effects on the other inductive components 31, improving interference between the first inductive component 310 and the electrical control box 1, and enhancing the operational stability of the first inductive component 310. The remaining relatively short inductive components 31 are positioned corresponding to the non-protruding portions of the electrical control box 1, saving material and facilitating heat radiation from the shorter inductive components 31.

[0068] When there are multiple first inductive devices 310, optionally, at least two first inductive devices 310 are housed in the same avoidance cavity; or, further optionally, each first inductive device 310 is housed in a different avoidance cavity, and the first inductive devices 310 are arranged in a one-to-one correspondence with the protrusions b.

[0069] In some embodiments of the present application, in the cross-section of the circuit board 2, the cross-sectional width of the protrusion b remains unchanged in the direction away from the circuit board 2, the protrusion b is constructed as a rectangle, and the protrusion b is formed by mutually perpendicular edges, which is convenient for design and processing.

[0070] Alternatively, in other embodiments of the present application, as shown in Figures 1 and 2, in a cross-section of the circuit board 2, the cross-sectional width of the protrusion b gradually decreases in a direction away from the circuit board 2. Compared to setting the cross-sectional width of the protrusion b to remain constant in a direction away from the circuit board 2, or to increasing in a direction away from the circuit board 2, the shape of the protrusion b in the embodiments of the present application can reduce the space occupied by the external part of the electric control box 1 and save manufacturing materials.

[0071] In addition, the cross-sectional width of the protrusion b gradually decreases in the direction away from the circuit board 2, and the avoidance cavity formed by the protrusion b is funnel-shaped, which shrinks in the direction away from the circuit board 2, which is beneficial to concentrate the heat dissipation of the first inductive device 310, and further reduce the adverse thermal impact of the heat flowing to other locations on other components on the circuit board 2.

[0072] For some annular first inductive devices 310, as shown in Figures 1 and 2, the placement orientation of the first inductive device 310 can be set to roughly match the shape of the protrusion b, so as to maximize the use of the space in the avoidance cavity and reduce the distance between each position of the protrusion b and the first inductive device 310, thereby improving the thermal radiation and heat dissipation efficiency of the first inductive device 310.

[0073] Moreover, when used in the embodiment with the "heat dissipation duct 50" described later, the airflow of the heat dissipation duct 50 can be set to flow in a direction from one side of the width of the protrusion b to the other side of the width. In this way, since the width gradually decreases, it is conducive to smooth flow of airflow, reduced wind resistance, improved ventilation efficiency, and conducive to heat dissipation.

[0074] Optionally, as shown in FIG1 , the cross-sectional profile of the protrusion b is a trapezoid, wherein the spacing between the legs of the trapezoid gradually decreases as it moves away from the circuit board 2, and the edge away from the circuit board 2 connects the two legs and is parallel to the bottom of the trapezoid. The sides of the trapezoid are all straight, which facilitates the manufacturing and processing of the protrusion b and improves the production efficiency of the electric control box 1.

[0075] Alternatively, as shown in FIG2 , the cross-sectional profile of the protrusion b is arc-shaped. When the cross-sectional shape of the first inductive element 310 is annular, the first inductive element 310 is disposed within the avoidance cavity formed by the protrusion b having an arc-shaped cross-sectional profile. This improves the shape matching between the first inductive element 310 and the protrusion b, and the spacing between the protrusion b and the first inductive element 310 is small and uniform, thereby improving the heat radiation and heat dissipation efficiency of the first inductive element 310.

[0076] Alternatively, the cross-sectional profile of the protrusion b may be a trapezoidal shape with curved waists. The waists are curved, and the spacing between the waists gradually decreases away from the circuit board 2. The edge away from the circuit board 2 is connected to the two waists and parallel to the bottom of the protrusion b. This not only improves the shape matching between the first inductive device 310 and the protrusion b, but also facilitates the manufacturing and processing of the protrusion b.

[0077] Alternatively, the cross-sectional profile of the protrusion b may be in a pyramidal, stepped, or other shape, which will not be elaborated here.

[0078] In some embodiments of the present application, as shown in Figure 1, the cross-sectional profile of the protrusion b is a trapezoid, and the two sides of the trapezoid gradually approach each other in the direction away from the circuit board 2 to form the upper base of the trapezoid, and the angles between the upper base and the two sides of the trapezoid are both 135°±5°, that is, the size range of the angles between the upper base and the two sides of the trapezoid is both 130°-140°.

[0079] Optionally, the angle between the upper base and the waist of the trapezoid may be 130°, 132°, 135°, 136°, 139°, 140°, etc.

[0080] Optionally, the angles between the upper base of the trapezoid and the two sides are equal, and the cross-sectional profile of the protrusion b is an isosceles trapezoid; or, also optionally, the angles between the upper base of the trapezoid and the two sides are not equal, which all fall within the scope of protection of this application.

[0081] Optionally, the angles between the upper base and the two sides of the trapezoid are both 135°.

[0082] By designing the cross-sectional profile of the protrusion b to be a trapezoid, and the angles between the upper base and the two waists of the trapezoid are both 135°±5°, on the one hand, it is convenient for the manufacturing and processing of the protrusion b, and the upper base and waist of the trapezoid can be formed by stamping the profile, which is convenient for the stamping and forming of the protrusion b during production, further improving production efficiency and saving manufacturing costs; on the other hand, it is beneficial to concentrate the heat dissipation of the first inductive device 310; on the third hand, when used in the embodiment with the "heat dissipation duct 50" described later, it is beneficial to reduce wind resistance and ensure smooth airflow.

[0083] It is worth noting that the electric control box 1 of the embodiment of the present application may include one or more features of the above-mentioned embodiment. For example, the electric control box 1 includes an inner shell 11 and an outer shell 12 covering the inner shell 11. The side of the electric control box 1 away from the circuit board 2 is a first box wall 1a, and the first box wall 1a also has a double-layer structure of the inner shell 11 and the outer shell 12. The first box wall 1a protrudes in the direction away from the circuit board 2 to form a protrusion b. The inner side of the protrusion b forms an avoidance cavity, and the first inductive device 310 is accommodated in the avoidance cavity. The distance between the distal end of the first inductive device 310 and the outer shell 12 of the protrusion b is 5 mm, and the inner shell 11 of the protrusion b is provided with a first opening 111, and the outer shell 12 blocks and closes the first opening 111. The distance between the distal end of the first inductive device 310 and the electrical control box 1 is relatively small, which is conducive to heat radiation dissipation from the first inductive device 310 to the electrical control box 1. The first inductive device 310 can also directly dissipate heat through heat radiation from the outer shell 12 with good thermal conductivity. The first inductive device 310 is also located in the avoidance cavity, which comprehensively improves the heat radiation dissipation efficiency of the first inductive device 310.

[0084] In some embodiments of the present application, as shown in Figures 1 and 2, the electronic control component 100 also includes an air duct cover 4 arranged outside the electronic control box 1, and a heat dissipation duct 50 is formed between the air duct cover 4 and the first box wall 1a. The airflow direction of the heat dissipation duct 50 is from one side of the cross-sectional width of the protrusion b to the other side of the cross-sectional width. As shown in Figure 1, the direction of the arrow is the airflow direction.

[0085] By providing the air duct cover 4, a heat dissipation duct 50 is formed between the air duct cover 4 and the first box wall 1a. The heat dissipation airflow flows through the heat dissipation duct 50 to exchange heat with the first box wall 1a. The heat dissipation airflow removes the heat radiated from the inductive element to the electrical control box 1, thereby dissipating heat from the heat-generating device 3. Furthermore, by providing the air duct cover 4 to dissipate heat from the electrical control box 1, it is unnecessary to provide a heat dissipation airflow channel in the electrical control box 1. This prevents contaminants such as oil and dust from entering the electrical control box 1, thereby improving the operational stability of the electrical control component 100.

[0086] Air flows within the heat dissipation duct 50 from one side of the cross-sectional width of the protrusion b to the other side of the cross-sectional width, as shown in Figures 1 and 2 . The direction of the arrow is the airflow direction. Since the cross-sectional width gradually decreases in the direction away from the circuit board 2, the airflow rises along one side of the cross-sectional width of the protrusion b in the direction away from the circuit board 2. As it flows to the other side of the cross-sectional width of the protrusion b, the airflow rises gently along the protrusion b. Compared to setting the cross-sectional width of the protrusion b to remain unchanged in the direction away from the circuit board 2, or setting the cross-sectional width of the protrusion b to expand in the direction away from the circuit board 2, the cross-sectional width shape of the protrusion b in the embodiment of the present application can reduce wind resistance, improve airflow, thereby improving ventilation efficiency and improving the heat dissipation efficiency of the electronic control component 100.

[0087] In some specific embodiments of the present application, the air duct cover 4 is a plastic member. The air duct cover 4 not only forms the heat dissipation duct 50, but also serves as insulation and flame retardant, improving the safety of the electronic control component 100 and reducing costs. However, the present application is not limited thereto. For example, in other embodiments of the present application, the air duct cover 4 can also be set as a metal cover.

[0088] In some embodiments of the present application, there are multiple first inductive components 310. The first box wall 1a has multiple protrusions b, each corresponding to a first inductive component 310. Each first inductive component 310 is housed within a corresponding avoidance cavity. Each first inductive component 310 has a large radiable area, improving the heat dissipation efficiency of each first inductive component 310. Furthermore, each protrusion b encloses the heat dissipation of each first inductive component 310, reducing thermal crosstalk between the multiple first inductive components 310 and minimizing any adverse thermal effects.

[0089] In some embodiments of the present application, as shown in FIG2 , the heating device 3 further includes a capacitive device 32 provided on the circuit board 2, and the capacitive device 32 is housed in the electric control box 1. The electric control box 1 of the present application is configured as a closed box body, which can prevent pollutants such as oil, dust, etc. from entering the electric control box 1, and can prevent oil from contacting the capacitive device 32 and causing adverse effects on the capacitive device 32, thereby improving the working reliability of the capacitive device 32. Similarly, the capacitive device 32 generates heat during operation, and since the electric control box 1 is configured as a closed shell, the electric control box 1 is not provided with through holes for heat dissipation. Therefore, some embodiments of the present application also perform a heat dissipation design on the electric control component 100 to improve the heat dissipation capacity of the capacitive device 32 in the electric control component 100, thereby further improving the working reliability of the electric control component 100.

[0090] In some embodiments of the present application, as shown in FIG2 , the capacitive device 32 includes a first capacitive device 320. The end of the first capacitive device 320 that is away from the circuit board 2 is the distal end of the first capacitive device 320. The distance L2 between the distal end of the first capacitive device 320 and the electrical control box 1 is 5 mm to 10 mm, for example, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc. Typically, the distal end of the first capacitive device 320 is the position closest to the electrical control box 1. If the distance between the distal end of the first capacitive device 320 and the electrical control box 1 is too large, the efficiency of heat radiation dissipation from the first capacitive device 320 to the electrical control box 1 is low, and the heat dissipation capacity of the first capacitive device 320 is insufficient. If the distance between the distal end of the first capacitive device 320 and the electrical control box 1 is too small, the electrical safety distance is not met.

[0091] By setting the distance between the distal end of the first capacitive device 320 and the electrical control box 1 to the aforementioned distance value, the distance between the distal end of the first capacitive device 320 and the electrical control box 1 is shortened, which is beneficial for heat radiation from the first capacitive device 320 to the electrical control box 1, thereby improving the heat dissipation effect of the first capacitive device 320. Furthermore, by setting the distance between the distal end of the first capacitive device 320 and the electrical control box 1 to the aforementioned distance value, the requirement for electrical safety distance can also be met.

[0092] There may be one or more capacitive components 32, at least one of which is a first capacitive component 320. The distance between the distal end of the first capacitive component 320 and the electrical control box 1 is the aforementioned spacing value. The distances between the other capacitive components 32 and the electrical control box 1 may also meet the aforementioned spacing value, or the distances between the other capacitive components 32 and the electrical control box 1 may not meet the aforementioned spacing value. For example, in some examples, the first capacitive component 320 is a high-voltage electrolytic capacitor that generates relatively high heat. The first capacitive component 320 generates high heat, while the other capacitive components 32 generate relatively low heat. By setting the distance between the distal end of the first capacitive component 320 and the electrical control box 1 to the aforementioned spacing value, the distance between the first capacitive component 320 and the electrical control box 1 is shortened, facilitating heat dissipation from the first capacitive component 320 to the electrical control box 1 through radiation. Capacitive components 32 that generate relatively low heat may or may not meet this spacing value.

[0093] In some embodiments of the present application, as shown in Figures 2 and 3 , the capacitive element 32 includes a first capacitive element 320, with the end of the first capacitive element 320 distal from the circuit board 2 being the distal end of the first capacitive element 320. The electrical control box 1 includes an inner shell 11 and an outer shell 12 covering the inner shell 11. The inner shell 11 is an insulating shell and has a second opening 112 formed therein, which is opposite the distal end of the first capacitive element 320. The outer shell 12 is a metal shell and blocks and closes the second opening 112. Therefore, in this embodiment, the electrical control box 1 is configured as at least a two-layer structure. The metal shell ensures the structural reliability and fire resistance of the electrical control box 1, while the insulating shell provides insulation and other functions, thereby improving the safety of the electrical control component 100. Optionally, the inner shell 11 can be made of plastic, which, in addition to providing insulation, also has flame retardant properties, thereby improving the flame retardancy and fire resistance of the electrical control box 1. By setting the electric control box 1 as a double-layer structure, with the inner shell 11 being a plastic shell and the outer shell 12 being a metal shell, the manufacturing cost of the inner shell 11 is low. On the basis of improving the working reliability of the electric control box 1, the manufacturing cost of the electric control box 1 can also be reduced.

[0094] Typically, the distal end of the first capacitive element 320 is the position closest to the electrical control box 1. However, it is understood that the outer shell 12 of the present application is a metal shell with strong thermal conductivity, while the inner shell 11 is an insulating shell with weaker thermal conductivity than the outer shell 12. Furthermore, the outer shell 12 is located outside the inner shell 11 and can directly contact the external space. Therefore, by providing a second opening 112 at a position opposite the distal end of the inner shell 11 and the first capacitive element 320, the first capacitive element 320 can radiate heat directly to the outer shell 12 through the second opening 112. This facilitates heat dissipation from the first capacitive element 320 to the electrical control box 1, thereby improving the efficiency of heat dissipation from the first capacitive element 320.

[0095] There may be one or more capacitive components 32, at least one of which is a first capacitive component 320. A second opening 112 is provided on the inner shell 11 opposite the distal end of the first capacitive component 320. The inner shell 11 opposite the distal end of the other capacitive components 32 may or may not have openings. For example, in some examples, the first capacitive component 320 is a high-voltage electrolytic capacitor that generates relatively high heat. The first capacitive component 320 generates relatively high heat, while the other capacitive components 32 generate relatively low heat. By providing the second opening 112 on the inner shell 11 opposite the distal end of the first capacitive component 320, the first capacitive component 320 and the metal shell are efficiently radiated and dissipated, which facilitates the first capacitive component 320 to dissipate heat to the electrical control box 1.

[0096] When there are multiple first capacitive devices 320, optionally, at least two first capacitive devices 320 correspond to the same second opening 112, that is, the second opening 112 has a larger range and can be opposite to the distal ends of at least two first capacitive devices 320; or, also optionally, each first capacitive device 320 corresponds to a different second opening 112, and the first capacitive devices 320 correspond to the second openings 112 one-to-one.

[0097] In some embodiments of the present application, as shown in Figures 2 and 3 , the inductive device 31 includes a first inductive device 310. The end of the first inductive device 310 that is away from the circuit board 2 is the distal end of the first inductive device 310. The inner shell 11 further defines a first opening 111, which is opposite to the distal end of the first inductive device 310. The outer shell 12 further blocks and seals the first opening 111. The provision of the first opening 111 improves the heat radiation dissipation efficiency of the first inductive device 310. Alternatively, the first opening 111 and the second opening 112 of the inner shell 11 may be spaced apart, with the first inductive device 310 independently corresponding to the first opening 111 and the first capacitive device 320 independently corresponding to the second opening 112. Alternatively, the first opening 111 and the second opening 112 of the inner shell 11 may be interconnected, with the distal ends of the first inductive device 310 and the distal ends of the first capacitive device 320 both opposite to the first opening 111 and the second opening 112.

[0098] In some embodiments of the present application, as shown in FIG2 , the inductive element 31 includes a first inductive element 310, and the capacitive element 32 includes a first capacitive element 320. The first inductive element 310 and the first capacitive element 320 are located on the same side of the circuit board 2 in the thickness direction, and the height H1 of the first inductive element 310 is higher than the height H2 of the first capacitive element 320 in the thickness direction of the circuit board 2, i.e., H1>H2. The electrical control box 1 includes a first box wall 1a, which is located on a side of the first inductive element 310 away from the circuit board 2. The portion of the first box wall 1a corresponding to the first inductive element 310 is a first portion of the first box wall 1a, and the portion of the first box wall 1a corresponding to the first capacitive element 320 is a second portion of the first box wall 1a. The distance H3 between the first portion of the first box wall 1a and the circuit board 2 is greater than the distance H4 between the second portion of the first box wall 1a and the circuit board 2, i.e., H3>H4.

[0099] The first inductive element 310 is relatively tall, and the distance between its first portion and the circuit board 2 is large. The first capacitive element 320 is relatively short, and the distance between its first portion and the circuit board 2 is small. This ensures that both the first inductive element 310 and the first capacitive element 320 are properly installed, while the distance between their sides facing away from the circuit board 2 and the electrical control box 1 is small, thereby facilitating heat radiation dissipation from both. If the first box wall 1a is designed as a flat structure, the distance between the first box wall 1a and the first inductive element 310 is small, while the distance between the first box wall 1a and the first capacitive element 320 is large. This not only hinders heat radiation dissipation from the first capacitive element 320 to the electrical control box 1, but also easily transfers heat from the first inductive element 310 to the electrical control box 1, further hindering heat dissipation from the first capacitive element 320.

[0100] In some embodiments of the present application, as shown in FIG2 , a first portion of the first box wall 1a corresponding to the first inductive element 310 protrudes in a direction away from the circuit board 2 to form a protrusion b. The protrusion b forms a relief cavity on one side of the electrical control box 1, and at least a portion of the first inductive element 310 is accommodated within the relief cavity. Heat dissipated by the first inductive element 310 can be dissipated to the protrusion b. The large area of ​​the protrusion b helps improve the heat radiation efficiency of the first inductive element 310. Furthermore, the heat dissipated by the first inductive element 310 can be largely concentrated within the relief cavity, thereby reducing the flow of heat from the first inductive element 310 to other locations within the electrical control box 1 and reducing the temperature rise caused by this heat on other components on the circuit board 2. In addition, it is only necessary to set the first part to protrude in the direction away from the circuit board 2, and the second part of the first box wall 1a is a normal plate shape. The non-protruding second part can be closer to the first capacitive device 320, which is beneficial for the first capacitive device 320 to radiate heat to the electrical control box 1. Moreover, since there is no need to raise the first box wall 1a as a whole to move away from the circuit board 2, materials can be saved and manufacturing costs can be reduced.

[0101] It is understood that the capacitive device 32 generates heat during operation and also volatilizes electrolyte. When the electrolyte accumulates to a certain concentration in a high-temperature, enclosed environment, it can pose a safety issue. Therefore, the embodiments of the present application further design the electrical control box 1 to dissipate the electrolyte volatilized by the capacitive device 32 during operation out of the electrical control box 1, thereby reducing the concentration of electrolyte emitted by the capacitive device 32 within the electrical control box 1 and further improving the operational reliability of the electrical control component 100.

[0102] In some embodiments of the present application, as shown in FIG4 , the electric control box 1 includes an inner shell 11 and an outer shell 12 covering the inner shell 11. The inner shell 11 has a through-hole 113, the inner end of the hole 113 communicating with the interior of the electric control box 1, and the outer shell 12 covers the outer end of the hole 113. The hole 113 does not directly connect the interior and exterior of the electric control box 1, and the electrolyte does not simply flow out of the electric control box 1 through the hole 113. A gap 121 is formed between the outer shell 12 and the inner shell 11, the gap 121 communicating with the outer end of the hole 113. A slit 122 is also formed between the outer shell 12 and the inner shell 11, the gap 122 communicating with the gap 121 and communicating with the exterior of the electric control box 1, and the gap 122 connects the gap 121 to the exterior of the electric control box 1. Thus, the electrolyte volatilized from the capacitive device 32 can be discharged out of the electric control box 1 through the discharge hole 113 , the gap 121 and the slit 122 in sequence.

[0103] Exemplarily, gap 121 and slit 122 are interconnected and are both formed between inner shell 11 and outer shell 12. An angle is provided between the outflow direction of gap 121 and the outflow direction of slit 122, thereby increasing the airflow resistance in the discharge path formed by discharge hole 113, gap 121, and slit 122, and reducing the occurrence of airflow from outside the electrical control box 1 flowing into the interior of the electrical control box 1 through the discharge path. In some specific embodiments, as shown in FIG4 , gap 121 is formed between outer shell 12 and inner shell 11, covering the outer end of discharge hole 113. In the cross-sectional direction, the extension direction of gap 121 is perpendicular to the extension direction of slit 122.

[0104] For example, as shown in FIG4 , the flow width T1 of the gap 121 and the flow width T2 of the slit 122 are both smaller than the equivalent diameter D of the inner end of the discharge hole 113 (i.e., the end connected to the interior of the electrical control box 1). When the electrolyte flows along the path of the discharge hole 113, the gap 121, and the slit 122, the flow area of ​​the electrolyte gradually decreases and the flow rate of the electrolyte gradually increases. This ensures that the discharge path formed by the discharge hole 113, the gap 121, and the slit 122 is unidirectional. Only the electrolyte volatilized by the capacitor can be discharged through the discharge path, and no external airflow enters the electrical control box 1 to dissipate heat and cool the electrical components inside the electrical control box 1. Therefore, this path does not belong to the air flow channel for heat dissipation. In addition, when there is a heat dissipation duct 50 outside, the heat inside the electrical control box 1 and the negative pressure of the duct can be used to further improve the efficiency of the unidirectional discharge of the volatilized electrolyte.

[0105] In some embodiments of the present application, as shown in FIG. 4 , there are multiple discharge holes 113 , which increases the flow width of the electrolyte volatilized from the capacitor out of the electric control box 1 and improves the outflow efficiency of the electrolyte.

[0106] In some embodiments of the present application, the flow area of ​​the discharge hole 113 gradually decreases along the direction from the inner end (i.e., the end connected to the interior of the electric control box 1) to the outer end (i.e., the end connected to the gap 121), and the electrolyte volatilized from the capacitor flows from the electric control box 1 to the gap 121 through the discharge hole 113 in a unidirectional path, thereby further ensuring the unidirectionality of the discharge path formed by the discharge hole 113, the gap 121 and the gap 122, and allowing the volatilized electrolyte to be discharged more effectively.

[0107] In some specific embodiments of the present application, as shown in FIG4 , there are multiple discharge holes 113 , and the multiple discharge holes 113 are spaced apart along the extension direction of the gap 121 . This increases the communication area between the discharge holes 113 and the gap 121 , thereby improving the outflow efficiency of the volatilized electrolyte from the capacitor. The flow area of ​​each discharge hole 113 gradually decreases from the inner end to the outer end. As the electrolyte flows from the discharge hole 113 to the gap 121 , the flow area gradually decreases, and the flow rate of the electrolyte gradually increases. This ensures that the electrolyte remains unidirectional during its outflow from the discharge hole 113 . The increased flow rate of the electrolyte allows for more efficient discharge of the volatilized electrolyte.

[0108] In some embodiments of the present application, the electronic control component 100 further includes an air duct cover 4 disposed outside the electronic control box 1. A heat dissipation duct 50 is formed between the air duct cover 4 and the electronic control box 1. The heat dissipation airflow flows through the heat dissipation duct 50 to exchange heat with the electronic control box 1. The heat dissipation airflow removes the heat radiated from the capacitive device 32 to the electronic control box 1, thereby dissipating heat from the heat-generating device 3. Furthermore, by providing the air duct cover 4 to dissipate heat from the electronic control box 1, it is unnecessary to provide an airflow channel for heat dissipation in the electronic control box 1. This prevents contaminants such as oil and dust from entering the electronic control box 1, thereby improving the operational stability of the electronic control component 100.

[0109] In the direction of airflow through the heat dissipation duct 50, the discharge hole 113 is located downstream of the capacitive device 32. As shown in Figure 1, the direction of the arrow indicates the airflow direction. The airflow first passes through the position opposite the capacitive device 32, and then passes through the position opposite the discharge hole 113. As a result, the electrolyte volatilized from the capacitive device 32 can be discharged more directly and quickly through the heat dissipation duct 50, improving the efficiency of electrolyte discharge and enhancing safety.

[0110] It can be understood that, as shown in FIG1 , the direction of the arrow is the direction of airflow. Combined with FIG4 , when the heat dissipation airflow flows through the gap 122 , the pressure at the connection point between the gap 122 and the outside of the electrical control box 1 is relatively small. By utilizing the negative pressure of the heat dissipation duct 50 , the electrolyte can be more effectively discharged from the electrical control box 1 through the gap 122 , thereby improving the discharge efficiency of the volatilized electrolyte.

[0111] In some embodiments of the present application, as shown in Figures 1 to 3, the electronic control component 100 also includes an air duct cover 4, which is arranged outside the electronic control box 1 and is located on the side of the inductive device 31 away from the circuit board 2. A heat dissipation duct 50 is formed between the air duct cover 4 and the electronic control box 1. The air duct cover 4 itself or together with the electronic control box 1 defines an air inlet 51 of the heat dissipation duct 50, and the air duct cover 4 itself or together with the electronic control box 1 defines an air outlet 52 of the heat dissipation duct 50.

[0112] When the electronic control component 100 is operating, the heat generating element 3 generates heat. However, the electronic control box 1 of the present application does not have a through hole for heat dissipation. Therefore, the inductive element 31 dissipates heat by radiating heat to the electronic control box 1. However, by providing the air duct cover 4, a heat dissipation duct 50 is formed between the air duct cover 4 and the electronic control box 1. The heat dissipation airflow flows through the heat dissipation duct 50 to exchange heat with the electronic control box 1, removing the heat radiated from the inductive element to the electronic control box 1, thereby accelerating the heat dissipation efficiency of the inductive element 31.

[0113] Optionally, the air duct cover 4 may form an air inlet 51 for the heat dissipation airflow, or the air duct cover 4 and the electrical control box 1 may jointly form the air inlet 51 for the heat dissipation airflow. Similarly, the air duct cover 4 may form an air outlet 52 for the heat dissipation airflow, or the air duct cover 4 and the electrical control box 1 may jointly form the air outlet 52 for the heat dissipation airflow.

[0114] The end of the inductive device 31 that is distal to the circuit board 2 is the distal end of the inductive device 31. This distal end is closest to the electrical control box 1, and the inductive device 31 primarily dissipates heat from the electrical control box 1 through radiation from the distal end. In some embodiments of the present application, the air duct cover 4 is disposed outside the electrical control box 1 near the distal end of the inductive device 31, placing the heat dissipation duct 50 closer to the distal end of the inductive device 31, thereby facilitating efficient heat dissipation from the inductive device 31.

[0115] In some specific embodiments of the present application, the air duct cover 4 is a plastic component. The air duct cover 4 not only forms the heat dissipation duct 50, but also serves as an insulator, thereby improving the safety of the electronic control component 100. However, the invention is not limited thereto. The air duct cover 4 can also be a metal cover, so that the air duct cover 4 can also dissipate heat through heat radiation.

[0116] In some embodiments of the present application, as shown in Figure 1, the distance between the air duct cover 4 and the electrical control box 1 is the height H0 of the heat dissipation duct 50, and the height of the heat dissipation duct 50 at least at the position corresponding to the inductive device 31 is 10mm to 15mm, for example, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, etc.

[0117] Whether the height of the heat dissipation duct 50 is too high or too low, it is not conducive to the heat dissipation of the inductive device 31. When the height of the heat dissipation duct 50 is too high, the heat dissipation airflow through the heat dissipation duct 50 is slow, and the heat exchange efficiency between the heat dissipation airflow and the electrical control box 1 is low. When the height of the heat dissipation duct 50 is too low, the heat dissipation flow rate is small, and the heat dissipation capacity is insufficient. By setting the height of the heat dissipation duct 50 at the position corresponding to the inductive device 31 within the above range, the heat exchange efficiency of the heat dissipation airflow can be improved, thereby improving the heat dissipation speed of the inductive device 31.

[0118] In some embodiments of the present application, the height of the heat dissipation duct 50 at least at the location corresponding to the inductive device 31 is maintained consistent, so that the heat dissipation airflow has a uniform flow rate when flowing through the heat dissipation duct 50 corresponding to the inductive device 31, thereby improving the heat exchange efficiency between the heat dissipation airflow and the electronic control box 1. Alternatively, the height of the heat dissipation duct 50 at least at the location corresponding to the inductive device 31 can also be set to a stepped or gradual change, etc., which will not be detailed here.

[0119] In some embodiments of the present application, as shown in Figures 1 and 2, the electric control box 1 includes a first box wall 1a, which is located on a side of the inductive device 31 away from the circuit board 2. The heat dissipation duct 50 is formed between the first box wall 1a and the duct cover 4. The first box wall 1a has a concave-convex shape, and the duct cover 4 is also configured with a matching concave-convex shape at the concave-convex positions corresponding to the first box wall 1a, so that the height of the heat dissipation duct 50 at the concave-convex positions corresponding to the first box wall 1a is fixed.

[0120] The concave-convex shape of the first box wall 1a increases the contact area between the first box wall 1a and the heat exchange airflow, improving the heat exchange rate and facilitating heat dissipation of the inductive device 31. Furthermore, by configuring the corresponding concave-convex positions of the air duct cover 4 with a matching concave-convex shape, the heat dissipating airflow can flow smoothly through the concave-convex positions of the first box wall 1a, improving the heat exchange efficiency between the heat dissipating airflow and the electronic control box 1, and facilitating heat dissipation of the inductive device 31.

[0121] In some specific embodiments of the present application, as shown in Figures 1 and 2, the height of the inductive device 31 is relatively high, and the first box wall 1a protrudes relative to the inductive device 31 in a direction away from the circuit board 2 to form a protrusion b, and the inner side of the protrusion b forms an avoidance cavity, and the inductive device 31 is arranged in the avoidance cavity. By providing the protrusion b, interference with the inductive device 31 can be avoided, and the distance between the first box wall 1a and the inductive device 31 and other components can be maintained at a preset distance, which is conducive to the heat radiation and heat dissipation of the inductive device and other components and meeting the safety distance requirements. In addition, by providing the protrusion b, the heat radiation area of ​​the inductive device 31 can be increased, and the heat dissipation efficiency can be improved; the protrusion b also covers the heat dissipation of the inductive device 31, reducing the heat flow to other locations and causing adverse thermal effects on other components on the circuit board 2.

[0122] The duct cover 4, located on the side of the protrusion b facing away from the circuit board 2, is also constructed in a shape that matches the protrusion b. The duct cover 4 protrudes away from the circuit board 2, ensuring that the height of the heat dissipation duct 50 formed between the duct cover 4 and the protrusion b is constant. The inductive element 31 is disposed within the avoidance cavity formed by the protrusion b. The inductive element 31 primarily dissipates heat through radiation from the protrusion b. As the heat dissipation airflow flows within the heat dissipation channel, it encounters a larger heat dissipation area, thereby increasing the heat exchange rate. Furthermore, as the heat dissipation airflow flows within the heat dissipation duct 50 formed by the protrusion b and the duct cover 4, the fixed height of the heat dissipation duct 50 facilitates smooth airflow, improving heat exchange efficiency and facilitating heat dissipation from the inductive element 31.

[0123] In one embodiment of the present application, as shown in FIG1 , in the cross-section of the circuit board 2, the cross-sectional width of the protrusion b gradually decreases in the direction away from the circuit board 2. The cross-sectional profile of the protrusion b is a trapezoid, with the two sides of the trapezoid gradually approaching each other in the direction away from the circuit board 2 to form the upper base of the trapezoid. Correspondingly, the cross-sectional width of the air duct cover 4 at the position corresponding to the protrusion b also gradually decreases in the direction of the circuit board 2, and the cross-sectional profile of the air duct cover 4 at the corresponding position is also a trapezoid. The two sides of the trapezoid formed by the cross-sectional profile of the air duct cover 4 are respectively arranged parallel to the two sides of the trapezoid formed by the cross-sectional profile of the protrusion b, so that the heat dissipation duct 50 is highly fixed at the position of the protrusion b.

[0124] In other embodiments of the present application, as shown in FIG2 , in a cross-section of the circuit board 2, the cross-sectional width of the protrusion b gradually decreases as it moves away from the circuit board 2. The cross-sectional profile of the protrusion b is an arc, expanding outward in the direction away from the inductive device 31. Correspondingly, the cross-sectional width of the air duct cover 4 at the location corresponding to the protrusion b also gradually decreases along the direction of the circuit board 2, and the cross-sectional profile of the air duct cover 4 at the corresponding location is an arc. The spacing between the two arcs remains constant, so that the height of the heat dissipation duct 50 is fixed at the location of the protrusion b.

[0125] In some embodiments of the present application, a capacitive device 32 is further provided on the circuit board 2. The capacitive device 32 is also housed in the electrical control box 1 and is located on the same side of the circuit board 2 as the inductive device 31. In the airflow direction of the heat dissipation duct 50, at least one capacitive device 32 and at least one inductive device 31 are arranged in parallel, that is, at least one capacitive device 32 and at least one inductive device 31 have no upstream and downstream arrangement relationship, and the airflow does not flow through the two in sequence, thereby preventing heat crosstalk between the capacitive device 32 and the inductive device 31 and reducing the occurrence of adverse thermal effects on each other.

[0126] Optionally, there may be one or more capacitive devices 32; there may be one or more inductive devices 31. In the airflow direction of the heat dissipation duct 50, one capacitive device 32 may be arranged in parallel with one inductive device 31; one capacitive device 32 may be arranged in parallel with multiple inductive devices 31; multiple capacitive devices 32 may be arranged in parallel with one inductive device 31; or multiple capacitive devices 32 may be arranged in parallel with multiple inductive devices 31.

[0127] In some embodiments of the present application, there are multiple capacitive devices 32 and multiple inductive devices 31, and in the airflow direction of the heat dissipation duct 50, the multiple inductive devices 31 are arranged in parallel, that is, the multiple inductive devices 31 have no upstream and downstream arrangement relationship, and the airflow does not flow through the multiple inductive devices 31 one after another; and / or, in the airflow direction of the heat dissipation duct 50, the multiple capacitive devices 32 are arranged in parallel, that is, the multiple capacitive devices 32 have no upstream and downstream arrangement relationship, and the airflow does not flow through the multiple capacitive devices 32 one after another.

[0128] In some specific embodiments of the present application, the inductive device 31 includes a PFC inductor, and the capacitive device 32 includes a high-voltage electrolytic capacitor. The PFC inductor and the high-voltage electrolytic capacitor are located on the same side of the circuit board 2 and are arranged side by side in the airflow direction of the heat dissipation duct 50 to prevent thermal crosstalk between the PFC inductor and the high-voltage electrolytic capacitor.

[0129] In some embodiments of the present application, as shown in FIG1 and FIG5 , the inductive element 31 includes a first inductive element 310, and the capacitive element 32 includes a first capacitive element 320. The height of the first inductive element 310 is higher than the height of the first capacitive element 320 in the thickness direction of the circuit board 2. The air inlet 51 includes a first inlet portion 511 located upstream of the first inductive element 310 and a second inlet portion 512 located upstream of the first capacitive element 320. The distance between the first inlet portion 511 and the circuit board 2 (e.g., the distance in the third direction Z in FIG5 ) is greater than the distance between the second inlet portion 512 and the circuit board 2 (e.g., the distance in the third direction Z in FIG5 ). That is, in the thickness direction of the circuit board 2 (e.g., the third direction Z in FIG5 ), the height of the first inlet portion 511 is greater than the height of the second inlet portion 512. The air inlet 51 has two portions of different heights, forming a stepped configuration in the thickness direction of the circuit board 2.

[0130] It is understandable that if the air inlet 51 is set as an opening with a fixed height in the thickness direction of the circuit board 2, since the height of the first inductive device 310 is higher than the height of the first capacitive device 320, the distance of the heat dissipation airflow to the heat dissipation duct 50 relative to the first inductive device 310 is shorter. After the heat dissipation airflow exchanges heat with the electrical control box 1 corresponding to the first inductive device 310, part of the heat dissipation airflow will flow to the electrical control box 1 corresponding to the first capacitive device 320 arranged in parallel with the first inductive device 310, and will produce cross-flow with the heat dissipation airflow that exchanges heat with the electrical control box 1 corresponding to the first capacitive device 320, which not only reduces the fluidity of the heat dissipation airflow, but also reduces the heat exchange efficiency of the heat dissipation airflow.

[0131] By configuring the air inlet 51 with two sections of different heights, the distance between the first inlet section 511 and the first inductor 310 and the distance between the second inlet section 512 and the first capacitive element 320 are similar in the thickness direction of the circuit board 2. In the airflow direction, the first inductor 310 and the first capacitive element 320 are arranged side by side. Therefore, the distance from the first inlet section 511 to the point of the heat dissipation duct 50 opposite the first inductor 310 is similar to the distance from the second inlet section 512 to the point of the heat dissipation duct 50 opposite the first capacitive element 320. The heat dissipating airflow for the first inductor 310 and the heat dissipating airflow for the first capacitive element 320 flow side by side within the heat dissipation duct 50, reducing cross-flow and improving the heat exchange efficiency of the heat dissipation airflow.

[0132] In some embodiments of the present application, as shown in Figure 1, the electric control box 1 includes a first box wall 1a, which is located on the side of the inductive device 31 away from the circuit board 2, and the heat dissipation duct 50 is formed between the first box wall 1a and the duct cover 4.

[0133] The inductive element 31 includes a first inductive element 310, and the capacitive element 322 includes a first capacitive element 320. The first inductive element 310 and the first capacitive element 320 are arranged side by side in the direction of airflow. The first inductive element 310 is taller than the first capacitive element 320 in the thickness direction of the circuit board 2. The first inductive element 310 and the first capacitive element 320 are spaced uniformly from the first box wall 1a. Therefore, the first box wall 1a protrudes away from the circuit board 2 relative to the first inductive element 310, forming a protrusion b. The first box wall 1a is flat relative to the first capacitive element 320. The cross-sectional profile of the protrusion b is trapezoidal, with its two sides gradually approaching each other as they move away from the circuit board 2. A relief cavity is formed within the protrusion b, and the inductive element 31 is disposed within the relief cavity.

[0134] Correspondingly, the air duct cover 4 located on the side of the protrusion b away from the circuit board 2 is also constructed in a trapezoidal shape, matching the protrusion b. This ensures that the height of the heat dissipation duct 50 formed between the air duct cover 4 and the protrusion b is constant. The air duct cover 4 corresponding to the first capacitive component 320 is also constructed in a straight plate shape. The heat dissipation duct 50 is at the same height at the location corresponding to the first inductive component 310 and the location corresponding to the first capacitive component 320. This constant height of the heat dissipation duct 50 facilitates smooth airflow, reduces heat cross-contamination, improves heat exchange efficiency, and facilitates heat dissipation from the first inductive component 310 and the first capacitive component 320.

[0135] As shown in FIG5 , the air duct cover 4 defines an air inlet 51, which includes a first inlet portion 511 and a second inlet portion 512. The first inlet portion 511 is located upstream of the first inductive element 310, and the second inlet portion 512 is located upstream of the first capacitive element 320. The height of the first inlet portion 511 is greater than the height of the second inlet portion 512 in the thickness direction of the circuit board 2. The air inlet 51 is constructed in a stepped shape in the thickness direction of the circuit board 2. This ensures that the distance from the first inlet portion 511 to the heat dissipation duct 50 opposite the first inductive element 310 is equal to the distance from the second inlet portion 512 to the heat dissipation duct 50 opposite the first capacitive element 320. This further reduces heat cross-contamination and improves the heat exchange efficiency of the heat dissipation airflow.

[0136] In some embodiments of the present application, as shown in FIG3 , the inductive element 31 includes a first inductive element 310, and the capacitive element 32 includes a first capacitive element 320. The first inductive element 310 and the first capacitive element 320 are arranged side by side in the airflow direction. The height of the first inductive element 310 and the first capacitive element 320 are aligned in the thickness direction of the circuit board 2. The first inductive element 310 and the first capacitive element 320 are spaced apart from the electrical control box 1. The electrical control box 1 includes an inner shell 11 and an outer shell 12 covering the inner shell 11. The inner shell 11 defines a first opening 111, which is opposite to the first inductive element 310. The inner shell 11 also defines a second opening 112, which is opposite to the first capacitive element 320. The first opening 111 and the second opening 112 are spaced apart from each other, and the outer shell 12 blocks and seals the first opening 111 and the second opening 112.

[0137] In some embodiments of the present application, as shown in FIG5 , the first inductive element 310 and the first capacitive element 320 are spaced apart along a first direction X, and the air outlet 52 and the air inlet 51 are located on either side of the first inductive element 310 in a second direction Y. The air inlet 51 is configured as an elongated opening whose length direction extends along the first direction X and whose width direction extends along the second direction Y. The length of the air inlet 51 is at least 10 times its width.

[0138] The first inlet portion 511 and the second inlet portion 512 are sequentially arranged in the first direction X. By setting the air inlet 51 as a long strip-shaped opening extending along the first direction X, the airflow for dissipating heat to the first inductive device 310 and the first capacitive device 320 can flow into the air inlet 51 side by side, so that the heat dissipation airflow for dissipating heat to the first inductive device 310 and the heat dissipation airflow for dissipating heat to the first capacitive device 320 flow side by side in the heat dissipation duct 50, further reducing heat crosstalk and improving the heat exchange efficiency of the heat dissipation airflow.

[0139] The air inlet 51 is set to a long strip opening with a very small width, which can save space while ensuring the inflow rate, and reduce the entry of insects, large particles, etc. into the heat dissipation duct 50, thereby preventing the heat dissipation duct 50 from being blocked, and improving the working stability and cleanliness of the electronic control component 100.

[0140] In some embodiments of the present application, the length of the air inlet 51 is about 20 cm, and the width of the air inlet 51 is about 15 mm. Of course, the present application is not limited thereto, and the length and width of the air inlet 51 can be flexibly adjusted according to the specifications of the electronic control component 100.

[0141] In some embodiments of the present application, as shown in Figures 1 to 3, a power device 6 is further provided on the circuit board 2. The power device 6 generates heat when working, and the power device 6 is arranged on the circuit board 2 and enclosed in the electric control box 1. Therefore, the electric control component 100 also includes a radiator 7. The radiator 7 cooperates with at least one power device 6 for heat transfer, and at least part of the radiator 7 is located outside the electric control box 1. The radiator 7 conducts the heat of the power device 6 to the outside of the electric control box 1, thereby improving the heat dissipation capacity of the power device 6.

[0142] In the airflow direction of the heat dissipation duct 50, the radiator 7 is located downstream of the inductive device 31. The heat dissipation airflow first passes through the electrical control box 1 corresponding to the inductive device 31, and then passes through the radiator 7, thereby avoiding the heat of the radiator 7 from adversely affecting the heat dissipation of the inductive device 31. In addition, the heat dissipation airflow flowing in the heat dissipation duct 50 undergoes multiple heat exchanges, thereby improving the heat exchange efficiency of the heat dissipation airflow.

[0143] In some embodiments of the present application, the power device 6 includes but is not limited to: a compressor IPM (IPM is the abbreviation of Intelligent Power Module), a fan IPM (IPM is the abbreviation of Intelligent Power Module), an IGBT (Insulated Gate Bipolar Transistor), a bridge stack and other relatively small and short components.

[0144] In some embodiments of the present application, the heat sink 7 includes fins. The power device 6 transfers heat to the fins. The heat dissipation airflow flows through the fins to exchange heat with the fins, removing the heat and improving the heat dissipation effect of the power device 6. It is worth noting that the method of "heat transfer coordination" is not limited. For example, it can be direct or indirect contact heat transfer, or heat radiation heat transfer through a small gap.

[0145] The air conditioner 1000 according to the second embodiment of the present application will be described below with reference to FIG. 6 and FIG. 7 .

[0146] According to an embodiment of the present application, an air conditioner 1000, as shown in FIG6 , includes a housing 200, a compressor 300, a first heat exchanger 400, a second heat exchanger 500, a supply fan 600, an exhaust fan 700, and an electronic control component 100 for any of the above. For example, the electronic control component 100 can be used to control the operation of the compressor 300, the supply fan 600, and the exhaust fan 700. The first heat exchanger 400 and the second heat exchanger 500 exchange heat with the airflow passing through, and the supply fan 600 and the exhaust fan 700 provide a flowing airflow.

[0147] The housing 200 includes a supply air duct 210 and an exhaust air duct 220, which are isolated from each other. A first heat exchanger 400 is located in the supply air duct 210, and a second heat exchanger 500 is located in the exhaust air duct 220. Both the first heat exchanger 400 and the second heat exchanger 500 are connected to the compressor 300 and serve as the evaporator and condenser, respectively. The inlet of the supply air fan 600 is connected to the supply air duct 210, and the outlet of the supply air fan 600 is connected to the indoor side. The inlet of the exhaust air fan 700 is connected to the exhaust air duct 220, and the outlet of the exhaust air fan 700 is connected to the outdoor side. The electronic control component 100 is located in the air inlet path of the exhaust air fan 700.

[0148] It is worth noting that the air conditioner 1000 can both cool and heat the indoor space. When the air conditioner 1000 is cooling the indoor space, the first heat exchanger 400 functions as an evaporator, and the second heat exchanger 500 functions as a condenser. The airflow provided by the supply fan 600 passes through the evaporator to release heat, and the cool air flows into the indoor space along the supply air duct 210, thereby cooling the indoor space. The airflow provided by the exhaust fan 700 passes through the condenser to remove heat from the condenser, and the hot air flows to the outdoor space along the exhaust air duct 220. When the air conditioner 1000 is heating the indoor space, the first heat exchanger 400 functions as a condenser, and the second heat exchanger 500 functions as an evaporator. The airflow provided by the supply fan 600 passes through the condenser to absorb heat, and the hot air flows into the indoor space along the supply air duct 210, thereby heating the indoor space. The airflow provided by the exhaust fan 700 passes through the evaporator to release heat, and the cool air flows to the outdoor space along the exhaust air duct 220. Alternatively, the air conditioner may have only one of the two functions described above.

[0149] The electronic control unit 100 is positioned in the air inlet path of the exhaust fan 700. While the supply fan 600 provides airflow to the second heat exchanger 500, it also induces airflow through the electronic control unit 100, dissipating heat from the unit. The airflow provided by the supply fan 600 flows through the heat dissipation duct 50, exchanging heat with the electronic control box 1. This improves the heat dissipation capacity of the heat-generating components 3 in the electronic control unit 100 and further enhances the operational reliability of the electronic control unit 100. Furthermore, since the electronic control unit 100 is positioned in the air inlet path of the exhaust fan 700, it does not interfere with the indoor air supply and does not affect the indoor cooling or heating efficiency of the air conditioner 1000.

[0150] The air conditioner 1000 of the present embodiment utilizes the exhaust fan 700 to dissipate heat from the electronic control component 100, eliminating the need for an additional exhaust fan. This simplifies the structure of the air conditioner 1000, reduces the size and manufacturing cost of the air conditioner 1000, and facilitates installation of the air conditioner 1000. Furthermore, the exhaust fan is prevented from occupying space within the housing 200, thereby facilitating airflow within the exhaust duct 220 and the supply duct 210 and preventing a reduction in the air volume supplied by the air conditioner 1000.

[0151] In some embodiments, a first opening or multiple first air inlet holes can be set at the position of the housing 200 corresponding to the first heat exchanger 400; a second opening or multiple second air inlet holes can be set at the position of the housing 200 corresponding to the second heat exchanger 500; the housing 200 can have a third opening, and the air inlet 51 of the heat dissipation duct 50 of the electronic control component 100 can extend out or be exposed at the third opening.

[0152] According to the air conditioner 1000 of the embodiment of the present application, the installation of the electronic control component 100 improves the operating reliability of the air conditioner 1000. Furthermore, by placing the electronic control component 100 in the air inlet path of the exhaust fan 700, the supply fan 600 can simultaneously dissipate heat from the electronic control component 100 while providing airflow to the second heat exchanger 500. This eliminates the need for an additional exhaust fan, simplifies the structure of the air conditioner 1000, reduces the size and manufacturing cost of the air conditioner 1000, and facilitates installation of the air conditioner 1000. Furthermore, the installation of the exhaust fan avoids occupying space within the housing 200, thereby facilitating air flow within the exhaust duct 220 and the supply duct 210 and preventing a reduction in the air volume of the air conditioner 1000.

[0153] In some embodiments, as shown in FIG7 , the electronic control component 100 is disposed within the exhaust duct 220 and is located upstream of the second heat exchanger 500 along the air intake path of the exhaust fan 700. In the exhaust duct 220, airflow preferentially passes through the electronic control component 100. The heat dissipation airflow first exchanges heat with the electronic control box 1 through the heat dissipation duct 50 before passing through the second heat exchanger 500, thereby improving the heat exchange efficiency between the ventilation airflow and the electronic control component 100.

[0154] When the air conditioner 1000 cools the indoor side, the airflow provided by the exhaust fan 700 passes through the second heat exchanger 500 to take away the heat of the second heat exchanger 500, and the hot air flows to the outdoor side along the exhaust duct 220. Therefore, the electronic control component 100 is set upstream of the second heat exchanger 500, so that the heat exchange airflow with a lower temperature can pass through the electronic control component 100 first, thereby improving the heat dissipation efficiency of the electronic control component 100.

[0155] In other embodiments, the electronic control component 100 is disposed within the exhaust duct 220 and is arranged in parallel with the second heat exchanger 500 along the air intake path of the exhaust fan 700. The air supply fan 600 provides airflow to the second heat exchanger 500 while also providing airflow to the electronic control component 100 to dissipate heat from the electronic control component 100. This prevents crosstalk between the two heat exchanged airflows and improves the heat dissipation efficiency of both the second heat exchanger 500 and the electronic control component 100.

[0156] In some embodiments, the exhaust fan 700 and the supply fan 600 are both located within the housing 200, and the air conditioner 1000 is an integrated air conditioner for ease of installation and layout. The supply fan 600 is located in the supply duct 210, and the exhaust fan 700 is located in the exhaust duct 220. The supply duct 210 and the exhaust duct 220 are separated from each other by a partition 230. The compressor 300 connected to the first heat exchanger 400 and the second heat exchanger 500 can be located in either the supply duct 210 or the exhaust duct 220.

[0157] Of course, the present application is not limited to this. For example, in other embodiments of the present application, at least one of the exhaust fan 700 and the supply fan 600 can also be arranged outside the housing 200, while ensuring that the inlet of the supply fan 600 is connected to the supply air duct 210 and the outlet of the supply fan 600 is connected to the indoor side, and the inlet of the exhaust fan 700 is connected to the exhaust air duct 220 and the outlet of the exhaust fan 700 is connected to the outdoor side. The electronic control component 100 can be arranged on the air inlet path of the exhaust fan 700.

[0158] According to the air conditioner 1000 of the embodiment of the present application, the electronic control component 100 is disposed within the exhaust duct 220 and is located upstream of the second heat exchanger 500 along the air intake path of the exhaust fan 700. When the exhaust fan 700 is in operation, it creates a negative pressure region within the exhaust duct 220. Low-temperature air from the external environment (i.e., air at a lower temperature than the electronic control component 100) is drawn into the negative pressure region, dissipating heat from the electronic control component 100. This in turn provides airflow for heat dissipation in the second heat exchanger 500, simplifying the structure and improving heat dissipation efficiency.

[0159] In some specific embodiments of the present application, the air conditioner 1000 is an integrated air conditioner embedded in the kitchen ceiling. The kitchen environment is subject to fumes, dust, and the like, and the ceiling installation environment is relatively closed, making heat difficult to dissipate. Configuring the electrical control box 1 as a closed box can effectively improve the operating reliability of the electrical control component 100. Furthermore, the embodiments of the present application also propose various heat dissipation solutions, which are beneficial in resolving the heat dissipation problem of the electrical control component 100 and improving its operating reliability.

[0160] In some embodiments, the refrigerant in compressor 300 includes carbon dioxide. Carbon dioxide has low flow losses, good heat transfer, and is safe and non-toxic. However, carbon dioxide has a low critical temperature and low cooling efficiency. Therefore, the operating pressure of air conditioner 1000 is high, and the electronic control component 100 has higher heat dissipation requirements. The air conditioner 1000 of the present application is equipped with the electronic control component 100 of the above-described embodiment, which can improve the heat dissipation efficiency of the electronic control component 100 and enhance the operating stability of the air conditioner 1000.

[0161] It is worth noting that the electronic control component 100 according to the embodiment of the present application is not only used in the air conditioner 100, for example, it can also be used in other equipment that requires electronic control, which will not be described in detail here.

[0162] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0163] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0164] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0165] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0166] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0167] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic control component, wherein: include: An electric control box, which is a closed box body; A circuit board, the circuit board is housed in the electric control box; as well as A heating device includes an inductive device disposed on the circuit board, and the inductive device is accommodated in the electric control box.

2. The electronic control component according to claim 1, wherein: The inductive device comprises a first inductive device, an end of the first inductive device away from the circuit board is a distal end of the first inductive device, and a distance between the distal end of the first inductive device and the electric control box is 5 mm-10 mm.

3. The electronic control component according to any one of claims 1 to 2, wherein: The inductive device includes a first inductive device, an end of the first inductive device away from the circuit board is a distal end of the first inductive device, the electric control box includes an inner shell and an outer shell covering the inner shell, the inner shell is an insulating shell and is formed with a first opening, the first opening is opposite to the distal end of the first inductive device, and the outer shell is a metal shell and blocks and closes the first opening.

4. The electronic control component according to any one of claims 1 to 3, wherein: The inductive device includes a first inductive device, and the electrical control box includes a first box wall. The first box wall is located on a side of the first inductive device away from the circuit board. A portion of the first box wall protrudes in a direction away from the circuit board to form a protrusion, and an avoidance cavity is formed on the inner side of the protrusion. At least a portion of the first inductive device is accommodated in the avoidance cavity.

5. The electronic control component according to claim 4, wherein: In the cross section of the circuit board, the cross-sectional width of the protrusion gradually decreases along a direction away from the circuit board.

6. The electronic control component according to claim 5, wherein: The cross-sectional profile of the protrusion is trapezoidal or arc-shaped.

7. The electronic control component according to claim 6, wherein: The two sides of the trapezoid gradually approach each other in a direction away from the circuit board to form an upper base of the trapezoid, and the included angles between the upper base of the trapezoid and the two sides are both 135°±5°.

8. The electronic control component according to claim 5, wherein: The electric control component also includes an air duct cover arranged outside the electric control box, a heat dissipation air duct is formed between the air duct cover and the first box wall, and the air flow direction of the heat dissipation air duct is from one side of the cross-sectional width of the protrusion to the other side of the cross-sectional width.

9. The electronic control component according to claim 4, wherein: There are multiple first inductive components, and the first box wall has multiple protrusions, and each protrusion corresponds to one first inductive component.

10. The electronic control component according to any one of claims 1 to 9, wherein: The heating device also includes a capacitive device arranged on the circuit board, and the capacitive device is accommodated in the electric control box.

11. The electric control component according to claim 10, wherein: The capacitive device comprises a first capacitive device, an end of the first capacitive device away from the circuit board is a distal end of the first capacitive device, and a distance between the distal end of the first capacitive device and the electric control box is 5 mm-10 mm.

12. The electronic control component according to claim 10, wherein: The capacitive device includes a first capacitive device, an end of the first capacitive device away from the circuit board is the distal end of the first capacitive device, the electric control box includes an inner shell and an outer shell covering the inner shell, the inner shell is an insulating shell and is formed with a second opening, the second opening is opposite to the distal end of the first capacitive device, and the outer shell is a metal shell and blocks and closes the second opening.

13. The electric control component according to claim 10, wherein: The inductive device includes a first inductive device, and the capacitive device includes a first capacitive device. The first inductive device and the first capacitive device are located on the same side of the circuit board in the thickness direction, and the height of the first inductive device in the thickness direction of the circuit board is higher than the height of the first capacitive device. The electric control box includes a first box wall, and the first box wall is located on a side of the first inductive device away from the circuit board. The distance between a first part of the first box wall corresponding to the first inductive device and the circuit board is greater than the distance between a second part of the first box wall corresponding to the first capacitive device and the circuit board.

14. The electronic control component according to claim 10, wherein: The electric control box includes an inner shell and an outer shell covering the inner shell, the inner shell having a through discharge hole, the inner end of the discharge hole being connected to the interior of the electric control box, the outer shell covering the outer end of the discharge hole, and a gap connected to the outer end of the discharge hole and a slit connecting the gap to the outside of the electric control box being formed between the outer shell and the inner shell, the flow width of the gap and the flow width of the slit being both smaller than the equivalent diameter of the inner end of the discharge hole.

15. The electric control component according to claim 14, wherein: There are multiple discharge holes; and / or, the flow area of ​​the discharge holes gradually decreases along the direction from the inner end to the outer end.

16. The electronic control component according to claim 14, wherein: The electric control component also includes an air duct cover arranged outside the electric control box, a heat dissipation air duct is formed between the air duct cover and the electric control box, and in the air flow direction of the heat dissipation air duct, the exhaust hole is located downstream of the capacitive device.

17. The electronic control component according to any one of claims 1 to 16, wherein: Also includes: An air duct cover is arranged outside the electric control box and is located on a side of the inductive device away from the circuit board. A heat dissipation air duct is formed between the air duct cover and the electric control box. The air duct cover itself or together with the electric control box defines an air inlet of the heat dissipation air duct. The air duct cover itself or together with the electric control box defines an air outlet of the heat dissipation air duct.

18. The electric control component according to claim 17, wherein: The distance between the air duct cover and the electric control box is the height of the heat dissipation air duct, and the height of the heat dissipation air duct at least at the position corresponding to the inductive device is 10 mm to 15 mm.

19. The electric control component according to claim 18, wherein: The electric control box includes a first box wall, which is located on a side of the inductive device away from the circuit board. The heat dissipation duct is formed between the first box wall and the duct cover. The first box wall is a concave-convex shape, and the duct cover is also constructed with a matching concave-convex shape corresponding to the concave-convex position of the first box wall, so that the height of the heat dissipation duct at the concave-convex position corresponding to the first box wall is fixed.

20. The electronic control component according to claim 17, wherein: The circuit board is also provided with a capacitive device, which is also housed in the electric control box and is located on the same side of the circuit board as the inductive device. In the airflow direction of the heat dissipation duct, at least one capacitive device and at least one inductive device are arranged in parallel.

21. The electronic control component according to claim 20, wherein: The inductive device includes a first inductive device, and the capacitive device includes a first capacitive device. In the thickness direction of the circuit board, the height of the first inductive device is higher than the height of the first capacitive device. The air inlet includes a first inlet portion located upstream of the first inductive device and a second inlet portion located upstream of the first capacitive device. The distance between the first inlet portion and the circuit board is greater than the distance between the second inlet portion and the circuit board.

22. The electronic control component according to claim 21, wherein: The first inductive device and the first capacitive device are arranged at intervals along a first direction, the air outlet and the air inlet are located on both sides of the first inductive device in a second direction, the air inlet is constructed as a long strip opening whose length direction extends along the first direction and whose width direction extends along the second direction, and the length of the air inlet is more than 10 times the width of the air inlet.

23. The electronic control component according to claim 17, wherein: The circuit board is also provided with a power device, and the electronic control component also includes a heat sink, which cooperates with at least one of the power devices for heat transfer, and at least part of the heat sink is located outside the electronic control box. In the airflow direction of the heat dissipation duct, the heat sink is located downstream of the inductive device.

24. An air conditioner, wherein: It includes a shell, a compressor, a first heat exchanger, a second heat exchanger, an air supply fan, an exhaust fan and an electronic control component according to any one of claims 1-23, the shell having an air supply duct and an exhaust duct isolated from each other, the first heat exchanger is arranged in the air supply duct, the second heat exchanger is arranged in the exhaust duct, the first heat exchanger and the second heat exchanger are both connected to the compressor and serve as an evaporator and a condenser respectively, the inlet of the air supply fan is connected to the air supply duct and the outlet of the air supply fan is connected to the indoor side, the inlet of the exhaust fan is connected to the exhaust duct and the outlet of the exhaust fan is connected to the outdoor side, and the electronic control component is arranged on the air inlet path of the exhaust fan.

25. The air conditioner according to claim 24, wherein: The electric control component is arranged in the exhaust air duct and along the air inlet path of the exhaust fan. The electric control component is located upstream of the second heat exchanger, or the electric control component and the second heat exchanger are arranged in parallel.

26. The air conditioner according to any one of claims 24-25, wherein: The exhaust fan and the air supply fan are both arranged in the shell.

27. The air conditioner according to any one of claims 24 to 26, wherein: The refrigerant in the compressor includes carbon dioxide.

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