Communication device

Abstract

The present application relates to the technical field of communications, and relates to a communication device, used for solving the technical problem of poor heat dissipation effect of a communication device. The communication device provided by the present application can comprise a housing, a first heating assembly, a second heating assembly, and an air guide pipe; the housing has a heat dissipation air duct, and an air inlet and an air outlet that are communicated with the heat dissipation air duct; the first heating assembly and the second heating assembly are both located in the heat dissipation air duct; the air guide pipe is located in the heat dissipation air duct; the air guide pipe has an air inlet end and an air outlet end, the air inlet end is communicated with the air inlet, and the first heating assembly is located at the air outlet end of the air guide pipe. Part of air entering from the air inlet can dissipate heat of the second heating assembly, and the other part of air can cool the first heating assembly by means of the air guide pipe, thereby ensuring the heat dissipation efficiency of the first heating assembly.

Description

A communication device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on July 28, 2023, with application number 202310952110.7 and application name “A Communication Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of communication technology, and in particular to a communication device. Background Art

[0004] With the rapid development of electronic technology, electronic devices are becoming increasingly integrated, leading to increasing heat density. To ensure the performance and reliability of electronic components, heat dissipation is often required. Current electronic devices typically use air cooling to dissipate heat from electronic components. Air flowing over the surfaces of the components reduces heat dissipation, keeping them operating within a reasonable temperature range. Existing communication equipment, such as indoor baseband units (BBUs) and radio hubs (RHUBs), is primarily used in office buildings, shopping malls, and subways to implement functions such as signal encryption and blind spot filtering. These devices have high requirements for heat dissipation and noise reduction, and different electronic components within these devices have varying heat dissipation requirements. However, existing technologies typically address the needs of electronic components with high heat dissipation requirements by increasing the heat dissipation capacity of the entire communication device. For example, this approach often directly increases the fan airflow and the number of fans used. This approach lacks research and optimization for practical applications. Increasing the number of fans increases the size and weight of the communication equipment, while increasing fan airflow can lead to significant noise issues. Therefore, how to improve the heat dissipation performance of some electronic components in communication equipment has become a technical problem that needs to be solved urgently.

[0005] Summary of the Invention

[0006] The present application provides a communication device with good heat dissipation performance.

[0007] A communications device may include a housing, a first heat-generating component, a second heat-generating component, and an air duct. The housing has a heat dissipation duct and an air inlet and an air outlet connected to the heat dissipation duct. The first heat-generating component and the second heat-generating component are both located within the heat dissipation duct. The air duct is located within the heat dissipation duct and has an air inlet and an air outlet, with the air inlet connected to the air inlet. The first heat-generating component is located at the air outlet of the air duct. In actual use, outside air can enter the heat dissipation duct through the air inlet and be discharged through the air outlet. A portion of the air entering through the air inlet flows through the second heat-generating component to dissipate heat from the second heat-generating component before being discharged through the air outlet. In addition, the air inlet of the air duct is connected to the air inlet, so that another portion of the air entering through the air inlet enters the air duct through the air inlet and is discharged through the air outlet. The first heat-generating component is located at the air outlet of the air duct. Therefore, the air discharged from the air outlet can cool the first heat-generating component when flowing through the first heat-generating component, thereby ensuring the heat dissipation efficiency of the first heat-generating component.

[0008] In a specific configuration, the air duct may have an insulating sidewall, and the insulating sidewall is disposed toward the second heating component. The insulating sidewall can effectively block the heat generated by the second heating component, thereby preventing the heat generated by the second heating component from being transferred into the air duct and causing the temperature of the air in the air duct to rise, thereby effectively ensuring the heat dissipation efficiency of the first heating component.

[0009] Alternatively, in a specific configuration, the entire air duct may be made of a heat-insulating material, thereby improving the convenience during production and helping to reduce the volume of the heat-conducting pipe.

[0010] In one example, the air duct may have an air inlet and multiple air outlets. The air duct may also include a deflector plate for directing air flow within the air duct to each air outlet. The deflector plate effectively distributes and directs air flow within the air duct, ensuring sufficient air flow at each air outlet, thereby ensuring efficient heat dissipation for the communication equipment.

[0011] In a specific configuration, the air duct can be long and narrow, with multiple air outlets arranged in sequence along the length of the air duct, thereby efficiently utilizing the length of the air duct and enabling the air duct to have a greater number of air outlets. In a specific configuration of the guide plates, multiple guide plates can be arranged in sequence along the length of the air duct, thereby effectively distributing and guiding the airflow in the air duct.

[0012] In a specific configuration, the air duct may be in a straight line or a curved line in the connection path between the air inlet end and the air outlet end of the air duct.

[0013] In one example, the diameter of the air inlet is larger than the diameter of the air inlet end, so that part of the air entering through the air inlet can dissipate heat to the second heating component, and the other part can dissipate heat to the first heating component through the air duct, thereby effectively taking into account the heat dissipation efficiency of the first heating component and the second heating component.

[0014] In a specific configuration, the communication device may further include a first fan, which is located at an air inlet or an air outlet of the housing; or the first fan may be disposed at both the air inlet and the air outlet. The first fan is configured to draw outside air into the air inlet, thereby effectively dissipating heat from the first and second heat-generating components.

[0015] In one example, the communication device further includes a second fan. The second fan is located at the air inlet or outlet, or the second fan is located within the air duct. The second fan can accelerate the flow of air within the air duct, thereby improving the heat dissipation efficiency of the first heat-generating component.

[0016] In one example, the outer surface of the air duct may have an avoidance groove, and at least a portion of the second heating component is located in the avoidance groove to prevent position interference between the second heating component and the air duct.

[0017] In one example, the communication device may further include a radiator located in the heat dissipation duct and in thermal contact with the second heat generating component. The radiator can effectively increase the heat dissipation area of ​​the second heat generating component, thereby improving the heat dissipation efficiency of the second heat generating component.

[0018] In a specific configuration, the heat sink may have heat dissipation teeth, and an air duct may be formed between two adjacent heat dissipation teeth for air circulation. In addition, the air duct may be located at the top of the heat dissipation teeth, so that the air duct and the heat dissipation teeth can together form a relatively closed air duct, thereby improving the air circulation efficiency and thus improving the heat dissipation efficiency of the second heating component.

[0019] In one example, the air duct may include a tube body and a heat dissipation portion disposed outside the tube body, the heat dissipation portion being in thermal contact with the second heating component. Heat generated by the second heating component can be transferred to the heat dissipation portion and effectively dissipated through the heat dissipation portion, thereby effectively improving the heat dissipation efficiency of the second heating component.

[0020] In one example, the air duct may include a heat insulating portion located between the tube body and the heat dissipation portion. The heat insulating portion can effectively isolate heat transfer between the tube body and the heat dissipation portion to prevent heat from the heat dissipation portion from being transferred into the tube body, thereby ensuring heat dissipation efficiency of the first heating component.

[0021] In a specific configuration, the first heat-generating component may include multiple optical modules, which may be arranged sequentially along the length of the air duct, thereby achieving efficient use of space. Furthermore, a greater number of air outlets may be provided along the length of the air duct, thereby enabling effective heat dissipation of the multiple optical film blocks.

[0022] In one example, the second heat generating component includes a circuit board and a plurality of electronic components located on the circuit board. The electronic components may specifically be chips, power conversion devices, etc. In specific applications, the number and type of electronic components may be reasonably set according to actual needs.

[0023] In specific applications, the communication equipment may be an indoor baseband processing unit or a radio frequency convergence unit. The air duct can be used to dissipate heat in a targeted manner for different electronic components within the communication equipment, thereby improving the overall heat dissipation performance of the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a schematic diagram of an application architecture of a communication device provided in an embodiment of the present application;

[0025] FIG2 is a schematic diagram of a planar structure of a conventional communication device provided in an embodiment of the present application;

[0026] FIG3 is a schematic diagram of a planar structure of a communication device provided in an embodiment of the present application;

[0027] FIG4 is a schematic diagram of a planar structure of a communication device provided in an embodiment of the present application;

[0028] FIG5 is a schematic diagram of the three-dimensional structure of an air guide duct provided in an embodiment of the present application;

[0029] FIG6 is a schematic cross-sectional view of an air duct provided in an embodiment of the present application;

[0030] FIG7 is a schematic diagram of a planar structure of another communication device provided in an embodiment of the present application;

[0031] FIG8 is a schematic diagram of a partial cross-sectional structure of another communication device provided in an embodiment of the present application;

[0032] FIG9 is a schematic diagram of the three-dimensional structure of another air duct provided in an embodiment of the present application.

[0033] Explanation of Reference Numerals: 01-RF Convergence Unit; 10-Communication Device; 11-Casing; 12-First Heat Generating Component; 13-Second Heat Generating Component; 14-Air Duct; 15-Power Supply; 16-Fan; 17-Radiator; 011-Casing; 012-Fan; 013-Circuit Board Assembly; 014-Optical Module; 015-Power Supply; 111-Cooling Air Duct; 112-Air Inlet; 113-Air Outlet; 120-Optical Module; 131-Circuit Board; 132-Electronic Component; 13a-Second Heat Generating Component; 13b-Second Heat Generating Component; 140-Tube; 141-Air Inlet; 142-Air Outlet; 144-Avoidance Groove; 145-Heat Dissipation Portion; 146-Heat Insulation Portion; 171-Heat Dissipation Gear; 172-Air Duct; 17a-Radiator; 17b-Radiator; 131a - circuit board; 131b - circuit board; 132a - electronic components; 132b - electronic components; 142a - air outlet; 142b - air outlet; 142c - air outlet; 143a - guide plate; 143b - guide plate; 171a - tooth plate; 171b - tooth plate; 172a - air duct; 172b - air duct. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0035] To facilitate understanding of the communication device provided in the embodiments of the present application, the following first introduces its application scenarios.

[0036] The communication device provided in the embodiments of the present application can be applied in a digital indoor system (DIS) to achieve effective coverage of indoor communication signals.

[0037] For example, as shown in Figure 1, a digital indoor system (DIS) may include a pico remote radio unit (pRRU), a radio hub (RHUB), and a building base band unit (BBU). The RF hub can be connected to the pico remote radio unit and the building base band unit via an optoelectronic hybrid cable or a network cable. A pico remote radio unit, also known as a pico base station, is a miniaturized, low-power, low-consumption micro-cellular base station. It is primarily designed to address indoor wireless signal coverage issues in specific areas. As a network element in an indoor coverage solution, the RF hub needs to be used in conjunction with the pico remote radio unit and the building base band unit. The RF hub is used to receive downlink baseband data sent by the building base band unit, transmit it to the pico remote radio unit after branching, and transmit the uplink baseband data from the pico remote radio unit to the building base band unit after combining.

[0038] In actual applications, the communication equipment proposed in this application can specifically be the above-mentioned indoor baseband processing unit (building base band unit, BBU), radio frequency convergence unit (radio HUB, RHUB) and other box-type communication equipment. The communication equipment can be used in scenarios such as office buildings, shopping malls, subways, etc. to achieve encryption and blind spot filling of communication signals. In actual applications, the communication equipment can be installed in relatively closed environments such as indoor weak current wells and stairwells to facilitate good integration with the external environment. Therefore, there are high requirements for the heat dissipation performance and operating noise of the communication equipment.

[0039] Box-type communication devices typically house multiple different types of electronic components within a single housing, each with varying heat dissipation requirements. However, existing technologies typically address the needs of these high-heat-demanding electronic components by increasing the overall heat dissipation capacity of the communication device. For example, this can be achieved by simply increasing the fan's air volume and the number of fans used. However, this approach lacks research and optimization for practical applications. Increasing the number of fans increases the size and weight of the communication device and can also lead to significant fan noise.

[0040] For example, as shown in Figure 2, consider the RF convergence unit 01. RF convergence unit 01 may include a housing 011, a fan 012 housed within it, a circuit board assembly 013, an optical module 014, and a power supply unit (PSU) 015. The solid arrows in Figure 2 indicate the airflow path. As can be clearly seen in Figure 2, the majority of the air flows through the circuit board assembly 013 and the power supply 015. Only a small amount of air can flow through the optical module 014. While electronic components like the circuit board assembly 013 and the power supply 015 have lower temperature requirements, the optical module 014 has higher temperature requirements. Industry standards generally specify that the temperature specification for the optical module 014 housing should be below 85°C. Some optical modules 014 have higher heat dissipation requirements to achieve higher performance. Therefore, within the RF convergence unit 01, the optical module 014 becomes the heat dissipation bottleneck for the entire unit. It is understandable that, in actual application, the radio frequency convergence unit 01 may also include multiple other types of electronic components, which are not described here in detail.

[0041] In current solutions, multiple fans 012 are typically provided, and by increasing the air volume of the fans 012, the air circulation between the interior of the housing 011 and the external environment is increased, thereby improving the heat dissipation performance of the entire RF convergence unit 01. However, a large number of fans 012 will increase the manufacturing and operating costs of the RF convergence unit 01, and will not be conducive to reducing the volume and weight of the RF convergence unit 01. In addition, when the air volume generated by the fans 012 is large, the noise and energy consumption of the RF convergence unit 01 during operation will be significantly increased, which is not conducive to the widespread application of the RF convergence unit 01. In addition, in actual applications, the circuit board assembly 013 and the power supply 015 will also generate a lot of heat. Since the distance between the optical module 014 and the circuit board assembly 013 and the power supply 015 is relatively close, the heat generated by the circuit board assembly 013 and the power supply 015 will also be transferred to the optical module 014, which is not conducive to ensuring the heat dissipation efficiency of the optical module 014.

[0042] It is understandable that other types of communication devices also have the same problems as those of the above-mentioned radio frequency convergence unit 01, which will not be described in detail here.

[0043] Based on this, the embodiments of the present application provide a communication device with good heat dissipation performance, so as to avoid the problem that too many fans increase the size and weight of the communication device and generate high noise when multiple fans are running simultaneously.

[0044] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] As shown in FIG3 , in an example provided in the present application, a communication device 10 may include a housing 11, a first heat-generating component 12, a second heat-generating component 13, and an air duct 14. The housing 11 has a heat dissipation duct 111 and an air inlet 112 and an air outlet 113 connected to the heat dissipation duct 111. The first heat-generating component 12 and the second heat-generating component 13 are both located in the heat dissipation duct 111. The air duct 14 is located in the heat dissipation duct 111 and has an air inlet end 141 and an air outlet end 142. The air inlet end 141 is connected to the air inlet 112. The first heat-generating component 12 is located at the air outlet end 142 of the air duct 14. In actual use, outside air can enter the heat dissipation duct 111 from the air inlet 112 and be discharged from the air outlet 113. Part of the air entering from the air inlet 112 flows through the second heat-generating component 13 to dissipate heat from the second heat-generating component 13, and is finally discharged from the air outlet 113. In addition, the air inlet end 141 of the air duct 14 is connected to the air inlet 112. Therefore, another portion of the air entering from the air inlet 112 enters the air duct 14 through the air inlet end 141 and is then discharged from the air outlet end 142. The first heating element 12 is located at the air outlet end 142 of the air duct 14. Therefore, the air discharged from the air outlet end 142 can cool the first heating element 12 when flowing through it, thereby ensuring the heat dissipation efficiency of the first heating element 12.

[0046] In the communication device 10 provided in this application, the air duct 14 is provided to separate and guide the air flowing in from the air inlet 112. This allows a portion of the air to cool the second heating component 13, thereby ensuring the heat dissipation performance of the second heating component 13. Another portion of the air can be precisely guided to the first heating component 12 through the air duct 14, thereby ensuring the heat dissipation performance of the first heating component 12. This prevents the hot air flowing through the second heating component 13 from affecting the first heating component 12.

[0047] Or it can be understood that, when the air duct 14 is not provided, the heat generated by the first heating component 12 and the second heating component 13 will be accumulated in the heat dissipation duct 111, and the heat generated by the second heating component 13 will be transferred to the vicinity of the first heating component 12, thereby making the temperature near the first heating component 12 higher. After the external cold air enters the heat dissipation duct 111 from the air inlet 112 of the outer shell 11, it is easy to generate turbulence in the heat dissipation duct 111, which is not conducive to the effective dissipation of heat. In addition, in actual application, there are also high requirements for the layout of the first heating component 12 and the second heating component 13. For example, in order to ensure that the first heating component 12 is at a lower temperature, in the heat dissipation duct 111, the first heating component 12 needs to be located at the upwind port of the second heating component 13. However, under the conditions of the miniaturized and compact layout of the communication equipment 10, it is difficult to achieve the above layout requirements, and therefore, there are great limitations.

[0048] In the example provided in this application, by equipping the air duct 14, the cold air entering from the air inlet 112 can be effectively transferred to the first heating component 12, which can avoid adverse effects between the first heating component 12 and the second heating component 13. Therefore, in the entire heat dissipation duct 111, the position layout between the first heating component 12 and the second heating component 13 has good flexibility. It helps to achieve the miniaturization and compact setting of the communication equipment 10. For example, under the same working conditions, before and after the air duct 14 is equipped, the temperature of the first heating component 12 can drop by about 5°C, which can significantly improve the heat dissipation efficiency of the first heating component 12.

[0049] It should be noted that the first heating component 12 and the second heating component 13 described above refer to two different heating components in the communication device 10. The first heating component 12 may include one electronic component or multiple electronic components. Correspondingly, the second heating component 13 may include one electronic component or multiple electronic components. Of course, in actual applications, the communication device 10 may include more heating components, and the number and type of electronic components included in each heating component may be diverse.

[0050] For example, as shown in FIG4 , in the example provided in this application, the first heating component 12 specifically includes a plurality of optical modules 120 arranged in sequence. The second heating component 13 specifically includes a circuit board 131 and a plurality of electronic components 132 located on the circuit board 131. In actual application, the electronic components in the second heating component 13 can specifically be chips, power conversion devices, etc., and this application does not limit the specific type and quantity of the electronic components. In addition, the heating component in the communication device 10 may also include a power supply 15.

[0051] Of course, in actual applications, the communication device 10 may further include more heating components, which will not be described in detail here.

[0052] In order to facilitate understanding of the technical solution of the present application, a detailed description will be given below by taking the first heating component 12 as an optical module 120 and the second heating component 13 as a circuit board assembly light as an example.

[0053] As shown in FIG4 , in the example provided herein, the housing 11 is generally rectangular, with the air inlet 112 and air outlet 113 of the housing 11 positioned opposite each other, thereby providing for efficient air circulation. A row (five in FIG4 ) of fans 16 are located at the air inlet 112 . These fans 16 accelerate the flow of air, allowing outside air to enter the heat dissipation duct 111 at a relatively high rate through the air inlet 112 and be discharged through the air outlet 113 .

[0054] In specific configurations, the number of fans 16 may be one, two, or more. In practical applications, the number of fans 16 may be flexibly adjusted based on actual needs. Furthermore, in some examples, the fans 16 may be located at the air outlet 113, or at both the air inlet 112 and the air outlet 113.

[0055] Furthermore, as shown in FIG4 , the second heating element 13 is located within the heat dissipation duct 111 and has a relatively large area. The power supply 15 has lower heat dissipation requirements and can be located downwind of the second heating element 13. Air flows from the air inlet 112 through the second heating element 13 and then through the power supply 15, thereby cooling both the second heating element 13 and the power supply 15, before being exhausted from the air outlet 113.

[0056] Multiple optical modules 120 are arranged in sequence from the air inlet 112 to the air outlet 113, and one end of each optical module 120 (such as the upper end in FIG4 ) is connected to the conductive circuit in the circuit board 131. The other end of each optical module 120 can be connected to an external cable through a port in the housing 11.

[0057] In practical applications, the shape and structure of the air duct 14 can be varied.

[0058] For example, as shown in Figures 4 to 6, in an example provided in the present application. The air duct 14 is a roughly rectangular tube structure, having an air inlet end 141 and three air outlet ends. Among them, the three air outlet ends are respectively an air outlet end 142a, an air outlet end 142b and an air outlet end 142c. The air inlet end 141 is located at one end in the length direction of the air duct 14, and the three air outlet ends are arranged in sequence along the length direction of the air duct 14, thereby achieving a side outlet effect of the air flow. In addition, by providing multiple air outlet ends, the air duct 14 can effectively dissipate heat at different positions of the first heating component 12, which can effectively improve the heat dissipation effect of the first heating component 12.

[0059] In addition, as shown in Figure 6, in the example provided in this application, the air duct 14 also has two guide plates, namely guide plate 143a and guide plate 143b. The guide plates are used to guide the flow in the air duct 14 to each air outlet. Specifically, after the air enters the air duct 14 from the air inlet end 141, when it flows through the guide plate 143a, a portion of the air flow can be effectively guided to the air outlet end 142a. When it flows through the guide plate 143b, a portion of the air flow can be effectively guided to the air outlet end 142b. The remaining air flow can be discharged from the air outlet end 142c.

[0060] In specific settings, the structure type of the guide plate can be various.

[0061] For example, as shown in Figure 6, in the example provided in this application, each guide plate is a straight plate. Among them, the guide plate 143a and the guide plate 143b are both inclined toward the air inlet end 141, so that the airflow can be effectively guided to the corresponding air outlet end. In addition, the length of the guide plate 143a is slightly smaller than the length of the guide plate 143b, so as to achieve an even distribution of the airflow. Specifically, of the airflow entering the air guide duct 14 from the air inlet end 141, about 1 / 3 is blocked by the guide plate 143a and guided to the air outlet end 142a. In addition, about 1 / 3 is blocked by the guide plate 143b and guided to the air outlet end 142b. The remaining approximately 1 / 3 of the airflow flows to the air outlet end 142c.

[0062] It is understood that the deflectors 143a and 143b described above are merely exemplary. In actual applications, the number, shape, and location of the deflectors can be flexibly adjusted based on actual needs. Furthermore, the air flow rate discharged from each air outlet can be the same or different, which is not discussed further here.

[0063] Furthermore, in a specific implementation, the air duct 14 may be linear or curved in the connection path between the air inlet end 141 and the air outlet end. Alternatively, it is understood that the overall shape of the air duct 14 may be linear or curved, etc. In actual applications, the shape of the air duct 14 may be appropriately configured based on actual needs, and this will not be elaborated upon here.

[0064] When the air outlet end 142 is provided, the air duct 14 may include one, two or more air outlet ends.

[0065] When the air duct 14 includes multiple air outlets, the multiple air outlets can be arranged sequentially along the length of the air duct 14. In addition, when the first heating component 12 includes multiple optical modules 120, the multiple optical modules 120 can be arranged sequentially along the length of the air duct 14 to achieve better heat dissipation effect.

[0066] For example, as shown in FIG4 , in the example provided in this application, the first heat generating component 12 includes a plurality of optical modules 120. The plurality of optical modules 120 can be sequentially arranged along the length of the air duct 14, so that each optical module 120 can be effectively cooled.

[0067] Some optical modules 120 may be cooled by air discharged from the air outlet 142a, others by air discharged from the air outlet 142b, and still others by air discharged from the air outlet 142c, which will not be described in detail here.

[0068] In addition, during specific configuration, the shape of the air inlet end 141 of the air guide duct 14 can be varied.

[0069] For example, as shown in FIG. 4 , in an example provided in the present application, the air inlet end 141 may be a trumpet-shaped structure so that more air can enter the air duct 14 from the air inlet end 141 .

[0070] In addition, the diameter of the air inlet 112 can be larger than the diameter of the air inlet end 141 to ensure that there is enough air to dissipate the heat of the second heating component 13.

[0071] In specific settings, the size and shape of the air inlet 112 and the air inlet end 141 can be reasonably set according to actual needs, and will not be described in detail here.

[0072] 4 , in order to ensure efficient air circulation, in the example provided in this application, a row of fans 16 are provided at the air inlet 112. The fans 16 can effectively draw outside air into the heat dissipation duct 111, thereby improving the heat dissipation performance of the entire communication device 10.

[0073] As shown in FIG. 4 , among the multiple fans 16 , there is a fan 16 provided corresponding to the air inlet end 141 , through which a sufficient amount of air can be sucked into the air duct 14 , thereby ensuring the heat dissipation performance of the first heating component 12 .

[0074] In the specific configuration, an additional fan may be provided in the air duct 14. Alternatively, a fan may be provided at each air outlet 142 to increase the air circulation speed, thereby ensuring the heat dissipation performance of the first heating component 12.

[0075] In addition, as shown in Figure 5, in the example provided in this application, the outer surface of the air duct 14 also has an avoidance groove 144, and some electronic devices in the second heating component 13 can be located in the avoidance groove 144 to prevent position interference between the second heating component 13 and the air duct 14.

[0076] In specific settings, the number, position and shape of the avoidance grooves 144 can be reasonably set according to actual needs, and this application does not impose any restrictions on this.

[0077] In addition, please refer to Figures 4 and 7 in combination. In an example provided in the present application, in order to improve the heat dissipation performance of the second heating component 13. The second heating component 13 also includes one or more radiators 17. One side of the radiator 17 is in thermal contact with some or all of the electronic components 132 on the circuit board 131, so that the heat of the corresponding electronic components 132 can be transferred to the radiator 17 for dissipation. In addition, the radiator 17 is also provided with heat dissipation teeth 171, and an air duct 172 for air circulation is formed between two adjacent heat dissipation teeth 171. When the air flows through the air duct 172 between the heat dissipation teeth 171, it can quickly take away the heat in the heat dissipation teeth 171, thereby effectively improving the heat dissipation performance of the second heating component 13.

[0078] As shown in Figure 7, the air duct 14 can be arranged between the radiator 17 and the first heating component 12, which can effectively isolate the heat of the radiator 17 to prevent the heat of the radiator 17 from being transferred to the first heating component 12, thereby preventing the radiator 17 from reducing the heat dissipation performance of the first heating component 12.

[0079] In a specific configuration, the air duct 14 may have a heat-insulating side wall (not shown in the figure), and the heat-insulating side wall may be arranged toward the radiator 17 of the second heating component 13. The heat-insulating side wall can prevent the heat of the radiator 17 from being transferred into the air duct 14, thereby preventing the air temperature in the air duct 14 from increasing, thereby facilitating the heat dissipation performance of the first heating component 12.

[0080] Among them, a heat insulation layer can be set on the side wall of the air duct 14 facing the radiator 17. Alternatively, the entire air duct 14 can also be made of a heat insulation material. In actual application, the specific material of the air duct 14 can be reasonably set according to actual needs.

[0081] Alternatively, as shown in Figure 8, the communication device 10 may include two second heating components and two radiators. The two second heating components are respectively a second heating component 13a and a second heating component 13b. The two radiators are respectively a radiator 17a and a radiator 17b. The second heating component 13a includes a circuit board 131a and an electronic component 132a arranged on the circuit board 131a. The electronic component 132a is in thermal contact with the radiator 17a, so that the heat of the electronic component 132a can be transferred to the radiator 17a for dissipation. The second heating component 13b includes a circuit board 131b and an electronic component 132b arranged on the circuit board 131b. The electronic component 132b is in thermal contact with the radiator 17b, so that the heat of the electronic component 132b can be transferred to the radiator 17b for dissipation. The air duct 14 can be located at the top of the tooth plate 171a of the radiator 17a and the top of the tooth plate 171b of the radiator 17b. The outer wall of the air duct 14 and the top of the tooth plate 171a can together form a relatively closed air duct 172a, thereby improving the circulation efficiency of the airflow and facilitating the heat dissipation efficiency of the second heating element 13a. The outer wall of the air duct 14 and the top of the tooth plate 171b can together form a relatively closed air duct 172b, thereby improving the circulation efficiency of the airflow and facilitating the heat dissipation efficiency of the second heating element 13b.

[0082] In addition, the air duct 14 is located between the radiator 17a and the radiator 17b, which can effectively isolate the radiator 17a and the radiator 17b and prevent the heat transfer between the radiator 17a and the radiator 17b. Therefore, the heat dissipation efficiency of the second heating component 13a and the second heating component 13b can be effectively guaranteed.

[0083] In addition, as shown in FIG9 , in some examples, a heat dissipation portion 145 may be provided on a side of the air duct 14 close to the second heating component 13 , and the heat dissipation performance of the second heating component 13 may be improved by the heat dissipation portion 145 .

[0084] Specifically, please refer to Figures 7 and 9. In the example provided in this application, the air duct 14 may specifically include a tube body 140, a heat dissipation portion 145 and a heat insulation portion 146. The heat dissipation portion 145 may be made of a material with good thermal conductivity such as copper and aluminum. The heat insulation portion 146 may be made of a material with good thermal insulation such as plastic and foam board. In specific applications, the heat dissipation portion 145 may be in thermal contact with the electronic components in the second heating component 13, so that the heat of the second heating component 13 can be transferred to the heat dissipation portion 145 for dissipation, which can effectively improve the heat dissipation efficiency of the second heating component 13.

[0085] The heat insulating portion 146 can effectively insulate the heat dissipating portion 145 and the tube body 140 , and can effectively prevent the heat of the heat dissipating portion 145 from being transferred to the tube body 140 , thereby ensuring the heat dissipation efficiency of the first heating component 12 .

[0086] Alternatively, it is understood that the heat dissipation portion 145 can replace the above-mentioned heat sink 17, which can effectively improve the integrated design of the communication device 10.

[0087] Alternatively, in some examples, the heat dissipation portion 145 and the heat sink 17 may also exist at the same time. The heat dissipation portion 145 and the heat sink 17 may both be in thermal contact with the second heating component 13. The heat dissipation portion 145 can effectively increase the heat dissipation area of ​​the second heating component 13. Alternatively, the heat dissipation portion 145 can also be in thermal contact with the heat sink 17, thereby increasing the heat dissipation area of ​​the heat sink 17.

[0088] During the specific configuration, the specific shape and location of the air duct 14 can be flexibly adjusted according to actual needs, which will not be elaborated here.

[0089] In addition, in actual application, the communication device 10 can specifically be a radio frequency convergence unit or an indoor baseband processing unit. This application does not limit the specific type of the communication device 10.

[0090] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0091] In this application, "plurality" refers to two or more. "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural.

[0092] It is understood that the various numbers used in the embodiments of this application are merely for ease of description and are not intended to limit the scope of the embodiments of this application. The order of the sequence numbers of the above-mentioned processes does not necessarily imply a specific order of execution; the order of execution of the processes should be determined by their functions and inherent logic.

Claims

1. A communication device, characterized in that: It includes a housing, a first heating component, a second heating component and an air duct; The housing has a heat dissipation duct and an air inlet and an air outlet communicated with the heat dissipation duct, and the first heat generating component and the second heat generating component are both located in the heat dissipation duct; The air guide pipe is located in the heat dissipation air duct, and the air guide pipe has an air inlet end and an air outlet end, and the air inlet end is connected to the air inlet; Wherein, the first heating component is located at the air outlet end of the air duct.

2. The communication device according to claim 1, characterized in that The air duct has a heat-insulating side wall, and the heat-insulating side wall is arranged toward the second heating component.

3. The communication device according to claim 1 or 2, characterized in that: The air guide duct is made of heat insulating material.

4. The communication device according to any one of claims 1 to 3, characterized in that: The air guide duct has one air inlet end and a plurality of air outlet ends; The air guide duct is further provided with a guide plate, and the guide plate is used to guide the flow in the air guide duct to each of the air outlet ends.

5. The communication device according to claim 4, characterized in that The air guide pipe is in the shape of an elongated strip, and the plurality of air outlet ends are arranged in sequence along the length direction of the air guide pipe; The air guide duct is provided with a plurality of guide plates, and the plurality of guide plates are sequentially arranged along the length direction of the air guide duct.

6. The communication device according to any one of claims 1 to 5, characterized in that: In the connection path between the air inlet end and the air outlet end of the air guide duct, the air guide duct is in a straight line or a curve shape.

7. The communication device according to any one of claims 1 to 6, characterized in that: The diameter of the air inlet is larger than the diameter of the air inlet end; The communication device further includes a first fan, which is located at the air inlet and / or the air outlet of the housing.

8. The communication device according to any one of claims 1 to 7, characterized in that: The communication device further includes a second fan; The second fan is located at the air inlet end or the air outlet end, or the second fan is located in the air duct.

9. The communication device according to any one of claims 1 to 8, characterized in that: The outer surface of the air guide duct has an avoidance groove, and at least a part of the electronic components included in the second heating component is located in the avoidance groove.

10. The communication device according to any one of claims 1 to 9, characterized in that: The communication device further comprises a heat sink, which is located in the heat dissipation air duct and is in thermal contact with the second heat generating component.

11. The communication device according to claim 10, characterized in that The radiator has heat dissipation teeth, and the air guide pipe is located at the top of the heat dissipation teeth.

12. The communication device according to any one of claims 1 to 11, characterized in that: The air duct comprises a tube body and a heat dissipation portion arranged on the outer side of the tube body, and the heat dissipation portion is in thermal contact with the second heating component.

13. The communication device according to claim 12, characterized in that The air guide pipe has a heat insulation portion, and the heat insulation portion is located between the pipe body and the heat dissipation portion.

14. The communication device according to any one of claims 1 to 13, characterized in that: The first heat generating component includes a plurality of optical modules, and the plurality of optical modules are sequentially arranged along the length direction of the air duct.

15. The communication device according to any one of claims 1 to 14, characterized in that: The second heat generating assembly includes a circuit board and a plurality of electronic components located on the circuit board.

16. The communication device according to any one of claims 1 to 15, characterized in that: The communication device is an indoor baseband processing unit or a radio frequency convergence unit.

Images