Method for manufacturing optical filter, photosensitive composition, and compound

Abstract

Provided is a method for manufacturing an optical filter comprising: a step for forming a photosensitive composition layer by applying a photosensitive composition including a compound represented by formula (1), a photopolymerization initiator, and a solvent on a support; a step for exposing a part of the photosensitive composition layer; a step for removing an unexposed part of the photosensitive composition layer by using a first alkali developer to form a resist film; a step for heating and modifying the resist film and solubilizing the resist film in a second alkali developer; a step for forming a pixel formation composition layer by applying a composition for pixel formation including a coloring material and a curable compound on the support and the resist film; a step for curing the pixel formation composition layer; and a step for removing the resist film from the support using the second alkali developer. Also provided are a photosensitive composition and a compound.

Description

Optical filter manufacturing method, photosensitive composition and compound

[0001] The present invention relates to a method for producing an optical filter. The present invention also relates to a photosensitive composition and compound.

[0002] In recent years, the widespread use of digital cameras and camera-equipped mobile phones has led to a significant increase in demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors. Color filters are used as key devices in displays and optical elements. Color filters typically have pixels of the three primary colors, red, green, and blue, and serve to separate transmitted light into the three primary colors.

[0003] The pixels of the color filter are produced by forming a pattern using a pixel-forming composition containing a coloring material by a method such as photolithography.

[0004] Patent Document 1 describes the production of a color filter by forming a pattern by photolithography using a photosensitive coloring composition containing a colorant, an alkali-soluble resin, a polymerizable compound, and an oxime-based photopolymerization initiator.

[0005] Japanese Patent Application Laid-Open No. 2022-063556

[0006] In recent years, there has been a strong demand for smaller and thinner solid-state imaging devices. Therefore, it is also desired that films containing color materials, such as color filters, used in solid-state imaging devices be made thinner. To achieve a thinner film while maintaining the desired spectral performance, it is necessary to increase the concentration of the color material in the pixel-forming composition used for film formation.

[0007] However, when the colorant concentration of the pixel-forming composition is increased, the proportion of components other than the colorant becomes relatively smaller, and therefore, when a pixel is manufactured by forming a pattern using the pixel-forming composition by a photolithography method, development residues tend to be easily generated.

[0008] Therefore, an object of the present invention is to provide a method for producing an optical filter that can suppress the generation of development residues. Another object of the present invention is to provide a photosensitive composition that can be used in the method for producing an optical filter. Another object of the present invention is to provide a compound.

[0009] The present invention provides the following:

[0010] <1> A method for producing an optical filter, comprising: a step of applying a photosensitive composition containing a compound represented by formula (1), a photopolymerization initiator, and a solvent onto a support to form a photosensitive composition layer; a step of exposing a part of the photosensitive composition layer; a step of removing an unexposed part of the photosensitive composition layer using a first alkaline developer to form a resist film; a step of heating the resist film to modify it and solubilize it in a second alkaline developer; a step of applying a pixel-forming composition containing a colorant and a curable compound onto the support and the resist film to form a pixel-forming composition layer; a step of curing the pixel-forming composition layer; and a step of removing the resist film from the support using the second alkaline developer; In formula (1), R １ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; L １ represents a single bond or a divalent linking group; X １ represents a group represented by formula (X1) or formula (X2); １ represents an n-valent linking group, n represents an integer of 2 to 6, and X １ is a group represented by formula (X2), L １ is a divalent linking group; In formula (X1), R １１ and R １２ each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). ２１represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). <2> The method for producing an optical filter according to <1>, wherein the support is provided with partition walls. <3> The method for producing an optical filter according to <1> or <2>, wherein the support is provided with first pixels containing a colorant, and the step of exposing a part of the photosensitive composition layer comprises exposing the photosensitive composition layer formed on the first pixels, and the step of forming a resist film comprises removing an unexposed portion of the photosensitive composition layer using the first alkaline developer to form the resist film at least on the first pixels. <4> The method for producing an optical filter according to <1> or <2>, wherein X in formula (1) １ <5> The method for producing an optical filter according to any one of <1> to <3>, wherein L in the formula (1) is a group represented by the formula (X1). １ <6> The method for producing an optical filter according to any one of <1> to <5>, wherein the compound represented by formula (1) is a compound represented by formula (1a): In formula (1a), R １ａ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ａ and R １２ａ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ａ represents a divalent linking group; １ａ represents an n-valent linking group, and n represents an integer of 2 to 6. <7> The method for producing an optical filter according to any one of <1> to <6>, wherein the photosensitive composition further contains a resin having an acid value of 10 to 200 mgKOH / g. <8> The method for producing an optical filter according to any one of <1> to <7>, wherein the photopolymerization initiator contains an oxime compound. <9> The method for producing an optical filter according to any one of <1> to <8>, wherein a content of the colorant in the total solid content of the pixel-forming composition is 60 mass % or more. <10> A photosensitive composition used in the method for producing an optical filter according to any one of <1> to <9>, comprising: a compound represented by formula (1), a photopolymerization initiator, and a solvent; In formula (1), R １represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; L １ represents a single bond or a divalent linking group; X １ represents a group represented by formula (X1) or formula (X2); １ represents an n-valent linking group, n represents an integer of 2 to 6, and X １ is a group represented by formula (X2), L １ is a divalent linking group; In formula (X1), R １１ and R １２ each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). ２１ represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). <11> A compound represented by formula (1a); In formula (1a), R １ａ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ａ and R １２ａ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ａ represents a divalent linking group; １ａ represents an n-valent linking group, and n represents an integer of 2 to 6.

[0011] According to the present invention, it is possible to provide a method for producing an optical filter that can suppress the generation of development residues. Also, according to the present invention, it is possible to provide a photosensitive composition that can be used in the method for producing an optical filter. Also, according to the present invention, it is possible to provide a compound.

[0012] Fig. 1 is an explanatory diagram showing an embodiment of a method for manufacturing an optical filter;Fig. 2 is an explanatory diagram showing an embodiment of a method for manufacturing an optical filter;Fig. 3 is an explanatory diagram showing an embodiment of a method for manufacturing an optical filter;Fig. 4 is an explanatory diagram showing an embodiment of a method for manufacturing an optical filter;Fig. 5 is an explanatory diagram showing an embodiment of a method for manufacturing an optical filter.

[0013] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the structural formulae herein, Me refers to a methyl group, Et refers to an ethyl group, Bu refers to a butyl group, and Ph refers to a phenyl group. As used herein, the weight-average molecular weight and number-average molecular weight are polystyrene-equivalent values ​​measured by GPC (gel permeation chromatography). As used herein, the term "total solids" refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "pigment" refers to a coloring material that is difficult to dissolve in a solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0014] <Method for manufacturing optical filter> The method for manufacturing an optical filter of the present invention is characterized by comprising the steps of: applying a photosensitive composition containing a compound represented by formula (1), a photopolymerization initiator, and a solvent onto a support to form a photosensitive composition layer (hereinafter also referred to as step 1); exposing a part of the photosensitive composition layer to light (hereinafter also referred to as step 2); removing an unexposed part of the photosensitive composition layer using a first alkaline developer to form a resist film (hereinafter also referred to as step 3); heating the resist film to modify it and solubilize it in a second alkaline developer (hereinafter also referred to as step 4); applying a pixel-forming composition containing a colorant and a curable compound onto the support and the resist film to form a pixel-forming composition layer (hereinafter also referred to as step 5); curing the pixel-forming composition layer (hereinafter also referred to as step 6); and removing the resist film from the support using the second alkaline developer (hereinafter also referred to as step 7).

[0015] Because the compound represented by formula (1) has an ethylenically unsaturated bond-containing group, exposing a photosensitive composition layer formed using the photosensitive composition causes a polymerization reaction of the compound represented by formula (1) contained in the exposed portion of the photosensitive composition layer, thereby reducing the solubility in an alkaline developer. Therefore, by developing the exposed photosensitive composition layer with an alkaline developer (first alkaline developer), the unexposed portion of the photosensitive composition layer can be removed from the support. This allows a patterned resist film to be formed on the support. Because the compound represented by formula (1) has a group represented by formula (X1) or formula (X2), heating (preferably to 120 to 300°C) thermally decomposes these groups, denaturing the resist film to make it soluble in an alkaline developer. That is, the resist film before heating is difficult to dissolve in an alkaline developer due to the polymerization reaction of the compound represented by formula (1), but heating denatures the resist film to make it soluble in an alkaline developer. In the method for producing an optical filter of the present invention, after modifying the resist film as described above, a pixel-forming composition containing a colorant and a curable compound is applied to a support and the resist film to form a pixel-forming composition layer. After curing the pixel-forming composition, the resist film is removed from the support using a second alkaline developer. The pixel-forming composition layer formed on the resist film is removed together with the resist film, and only the pixel-forming composition layer (pixels) formed in the areas where the resist film is not formed remain on the support, thereby forming pixels in a pattern. Furthermore, since the resist film can be easily removed using the alkaline developer, the generation of residue between pixels can be suppressed. Furthermore, according to the method for producing an optical filter of the present invention, the generation of residue between pixels can be suppressed even when the colorant concentration of the pixel-forming composition is increased. Therefore, the effects of the present invention are more pronounced when pixels are formed using a pixel-forming composition with a high colorant concentration.

[0016] Each step of the method for producing an optical filter of the present invention will be described in more detail below.

[0017] <<Step 1>> In step 1, a photosensitive composition containing a compound represented by formula (1), a photopolymerization initiator, and a solvent is applied to a support to form a photosensitive composition layer. Details of the photosensitive composition will be described later.

[0018] The support on which the photosensitive composition layer is formed is not particularly limited and can be appropriately selected depending on the application. Examples include glass substrates and silicon substrates, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like. The silicon substrate may also be provided with an underlayer to improve adhesion to an upper layer, prevent diffusion of substances, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water.

[0019] The support may have partition walls formed thereon to provide a plurality of regions partitioned by the partition walls. In such a support, a photosensitive composition layer is formed in the regions partitioned by the partition walls (openings of the partition walls) on the support.

[0020] The material of the partition walls is not particularly limited. Examples include organic materials such as siloxane resins and fluororesins, and inorganic particles such as silica particles. The silica particles preferably include a plurality of spherical silica particles connected in a beaded pattern. In this specification, the term "spherical" refers to any substantially spherical shape, and may be deformed as long as the effects of the present invention are achieved. For example, the term "spherical" includes shapes with surface irregularities and flat shapes with a major axis in a specific direction. Furthermore, "a plurality of spherical silica particles connected in a beaded pattern" refers to a structure in which a plurality of spherical silica particles are connected in a linear and / or branched chain. For example, a structure in which a plurality of spherical silica particles are connected in a beaded chain is exemplified. In the present invention, the structure "a plurality of spherical silica particles connected in a beaded pattern" includes not only a ring-shaped structure but also a chain-like structure with terminals. The partition walls can also be formed using a composition containing colloidal silica particles described in WO 2019 / 017280.

[0021] The partition walls may be made of a metal such as tungsten or aluminum. Alternatively, the partition walls may be a laminate of a metal and a black matrix. In the case of a laminate, the order in which the metal and the black matrix are laminated is not particularly limited.

[0022] The height of the partition walls is preferably 0.3 to 1.2 μm. The lower limit is preferably 0.35 μm or more, and more preferably 0.4 μm or more. The upper limit is preferably 1.1 μm or less, more preferably 1.0 μm or less, and even more preferably 0.8 μm or less.

[0023] The width of the partition wall is preferably 0.05 to 0.2 μm. The lower limit is preferably 0.06 μm or more, more preferably 0.08 μm or more, and even more preferably 0.10 μm or more. The upper limit is preferably 0.18 μm or less, and more preferably 0.15 μm or less.

[0024] The ratio of the height to the width of the partition wall (height / width) is preferably 1.5 to 20.0. The lower limit is preferably 1.8 or more, more preferably 2.0 or more, and even more preferably 4.0 or more. The upper limit is preferably 15.0 or less, more preferably 10.0 or less, and even more preferably 8.0 or less.

[0025] The pitch width of the partition walls is preferably 0.5 to 2.0 μm. The lower limit is preferably 0.6 μm or more, more preferably 0.7 μm or more, and even more preferably 0.8 μm or more. The upper limit is preferably 1.8 μm or less, more preferably 1.4 μm or less, and even more preferably 1.2 μm or less. The pitch width of the partition walls refers to the arrangement pitch of adjacent partition walls. The shorter the pitch width, the smaller the pixel size.

[0026] An organic layer may be provided on the surface of the partition wall. The organic layer can be formed by applying an organic layer-forming composition to the partition wall and drying it. The organic layer is preferably formed using an organic layer-forming composition containing a compound having an ethylenically unsaturated bond group.

[0027] The partition walls can be formed using a conventionally known method. For example, the partition walls can be formed as follows. First, a partition wall material layer is formed on a support. The partition wall material layer can be formed by, for example, applying a composition containing inorganic particles such as silica particles to a support, followed by curing or other processes to form a film. Examples of such compositions include the optical functional layer-forming compositions described in paragraphs 0012 to 0133 of WO 2015 / 190374, the contents of which are incorporated herein by reference. Alternatively, the partition wall material layer can be formed by forming a film of an inorganic material such as silicon dioxide on a support using a vapor deposition method such as chemical vapor deposition (CVD) or vacuum deposition, or a method such as sputtering. Next, a resist pattern is formed on the partition wall material layer using a mask having a pattern corresponding to the shape of the partition walls. Next, the partition wall material layer is etched using this resist pattern as a mask to form a pattern. Etching methods include dry etching and wet etching. Dry etching can be performed under the conditions described in paragraphs 0114 to 0120, 0129, and 0130 of JP 2016-014856 A. Then, the resist pattern is peeled off and removed from the partition wall material layer. In this manner, the partition wall can be formed.

[0028] The photosensitive composition can be applied by any known application method. Examples of such methods include the dropping method (drop casting); the slit coating method; the spray method; the roll coating method; the spin coating method; the casting method; the slit and spin method; the pre-wetting method (for example, the method described in JP 2009-145395 A); various printing methods such as inkjet (for example, on-demand method, piezo method, thermal method), nozzle jet printing, and the like, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing; transfer methods using a mold, etc.; and nanoimprinting. For methods of applying the photosensitive composition, the descriptions in WO 2017 / 030174 and WO 2017 / 018419 can be referred to, and the contents of these documents are incorporated herein by reference.

[0029] The support on which the photosensitive composition layer is formed may be provided with first pixels containing a coloring material. The first pixels can be formed using a pixel-forming composition described below.

[0030] The first pixel may be provided in a part of a plurality of regions partitioned by partition walls. That is, partition walls may be formed on a support on which a photosensitive composition layer is formed, and a plurality of regions partitioned by the partition walls may be provided, and the first pixel containing a coloring material may be provided in a part of the plurality of regions partitioned by the partition walls.

[0031] The photosensitive composition layer formed on the support may be dried (prebaked). The prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 80°C or higher, or can be 90°C or higher. The prebaking time is preferably 30 to 900 seconds, more preferably 50 to 600 seconds, and even more preferably 70 to 400 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0032] <<Step 2>> In step 2, a portion of the photosensitive composition layer is exposed. For example, the photosensitive composition layer can be exposed in a pattern by exposing it through a mask having a predetermined mask pattern using a stepper exposure machine or a scanner exposure machine. This allows the photosensitive composition layer in the exposed portions to be cured. When first pixels are provided on the support, in step 2, the photosensitive composition layer formed on the first pixels is exposed. In this embodiment, a portion of the photosensitive composition layer between the first pixels may also be exposed. This allows the photosensitive composition layer in the exposed portions, i.e., the photosensitive composition layer formed on the first pixels, to be cured. When a portion of the photosensitive composition layer between the first pixels is also exposed, the exposed portion of the photosensitive composition layer between the first pixels can also be cured.

[0033] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0034] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light irradiation and pauses are repeated in short cycles (for example, milliseconds or less).

[0035] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m ２ etc.

[0036] <<Step 3>> In step 3, the unexposed portions of the photosensitive composition layer after step 2 are removed using a first alkaline developer to form a resist film. As a result, the photosensitive composition layer in the unexposed portions is eluted into the developer, and only the photocured portions remain as a resist film. When first pixels are provided on the support, the photosensitive composition layer formed on the first pixels is exposed in step 2, and therefore, in step 3, the unexposed portions of the photosensitive composition layer are removed using the first alkaline developer, thereby removing the photosensitive composition layer in the unexposed portions of the photosensitive composition layer between the first pixels, and forming a resist film at least on the first pixels.

[0037] The temperature of the first alkaline developer is preferably, for example, 20 to 30° C. The development time is preferably 20 to 180 seconds. To improve residue removability, the developer may be shaken off every 60 seconds and new developer may be supplied, which may be repeated several times.

[0038] The first alkaline developer is preferably an alkaline aqueous solution obtained by diluting an alkaline agent with pure water. Examples of alkaline agents include organic alkaline compounds such as ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxyamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, pyrrole, piperidine, and 1,8-diazabicyclo-[5.4.0]-7-undecene, and inorganic alkaline compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, and sodium metasilicate. From the standpoint of environmental and safety considerations, alkaline agents with a high molecular weight are preferred. The concentration of the alkaline agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, more preferably 0.01 to 1% by mass. The first alkaline developer may further contain a surfactant.

[0039] After development with the first alkaline developer, a rinse treatment may be performed. The rinse treatment is preferably performed by supplying a rinse liquid to the developed photosensitive composition layer while rotating the support on which the developed photosensitive composition layer is formed. It is also preferable to perform the rinse treatment by moving the nozzle that ejects the rinse liquid from the center of the support to the peripheral edge of the support. In this case, the nozzle may be moved while gradually decreasing the moving speed when moving the nozzle from the center of the support to the peripheral edge. By performing the rinse in this manner, in-plane variation in the rinse can be suppressed. It is also preferable to gradually decrease the rotation speed of the support while moving the nozzle from the center of the support to the peripheral edge.

[0040] <<Step 4>> In step 4, the resist film obtained in step 3 is heated to be denatured and solubilized in a second alkaline developer. The second alkaline developer may be the same as or different from the first alkaline developer.

[0041] The heating temperature of the resist film in step 4 is preferably 120 to 300°C. The upper limit is preferably 250°C or less, more preferably 220°C or less. The lower limit is preferably 140°C or more, more preferably 160°C or more. The heating time of the resist film is preferably 3 to 60 minutes. The upper limit is preferably 45 minutes or less, more preferably 30 minutes or less. The lower limit is preferably 5 minutes or more, more preferably 10 minutes or more.

[0042] <<Step 5>> In step 5, a pixel-forming composition layer is formed by applying a pixel-forming composition containing a colorant and a curable compound onto the support and the resist film after step 5. The pixel-forming composition will be described later.

[0043] Known application methods can be used as the method for applying the pixel-forming composition. Examples include the dropping method (drop casting); the slit coating method; the spray method; the roll coating method; the spin coating method; the casting coating method; the slit and spin method; the pre-wetting method (for example, the method described in JP 2009-145395 A); various printing methods such as inkjet (for example, on-demand method, piezo method, thermal method), nozzle jet printing, etc., ejection printing, flexographic printing, screen printing, gravure printing, reverse offset printing, and metal mask printing; transfer methods using molds, etc.; and nanoimprinting. Furthermore, for the method of applying the pixel-forming composition, the descriptions in WO 2017 / 030174 and WO 2017 / 018419 can be referred to, and the contents thereof are incorporated herein by reference.

[0044] The formed pixel-forming composition layer may be dried (prebaked). When a film is produced by a low-temperature process, prebaking may not be performed. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can also be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0045] <<Step 6>> In step 6, the pixel-forming composition layer is cured. The pixel-forming composition layer may be cured by heat curing or photocuring.

[0046] In the case of heat curing, the heating temperature is preferably 120 to 300°C. The upper limit is preferably 250°C or less, more preferably 220°C or less. The lower limit is preferably 130°C or more, more preferably 140°C or more. The heating time of the resist film is preferably 1 to 60 minutes. The upper limit is preferably 30 minutes or less, more preferably 10 minutes or less. The lower limit is preferably 2 minutes or more, more preferably 3 minutes or more.

[0047] In the case of photocuring, it is preferable to carry out the photocuring by exposing the pixel-forming composition layer to light, which can be carried out using a stepper exposure machine, a scanner exposure machine, or the like.

[0048] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0049] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light irradiation and pauses are repeated in short cycles (for example, milliseconds or less).

[0050] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m ２ etc.

[0051] <<Step 7>> In step 7, the resist film is removed from the support using a second alkaline developer. As a result, the pixel-forming composition layer formed on the resist film is removed together with the resist film, and only the pixel-forming composition layer (pixels) formed in areas where the resist film is not formed remains on the support, allowing pixels to be formed in a pattern.

[0052] The second alkaline developer may be the same as or different from the first alkaline developer.

[0053] The temperature of the second alkaline developer is preferably, for example, 20 to 30° C. The development time is preferably 20 to 180 seconds. To improve residue removability, the developer may be shaken off every 60 seconds and new developer may be supplied, which may be repeated several times.

[0054] After development with the second alkaline developer, a rinsing treatment may be carried out by the methods described above.

[0055] When forming an optical filter having a plurality of pixels, the above series of steps can be repeated to manufacture an optical filter having a plurality of pixels.

[0056] The method for producing an optical filter of the present invention will be described in more detail with reference to the drawings, taking as an example a case where a support on which partition walls are formed is used. In the drawings, reference numeral 10 denotes a support, and reference numeral 20 denotes partition walls.

[0057] As shown in FIG. 1 , a photosensitive composition is applied to a support 10 to form a photosensitive composition layer 30 (Step 1). Next, a portion of the photosensitive composition layer 30 is exposed to light (Step 2). Next, as shown in FIG. 2 , the unexposed portions of the photosensitive composition layer 30 are removed using a first alkaline developer to form a resist film 31 (Step 3). Next, the resist film 31 is heated to be denatured and solubilized in a second alkaline developer (Step 4). Next, as shown in FIG. 3 , a pixel-forming composition is applied to the support 10 and the resist film 31 to form a pixel-forming composition layer 40 (Step 5). Next, the pixel-forming composition layer 40 is hardened (Step 6). Next, the resist film 31 is removed from the support 10 using a second alkaline developer (Step 7). As a result, as shown in FIG. 4 , the pixel-forming composition layer formed on the resist film is removed together with the resist film, and only the pixel-forming composition layer (pixels) formed in the areas where the resist film is not formed remain on the support 10, forming pixels 40 in a pattern.

[0058] The types of optical filters manufactured by the method for manufacturing an optical filter of the present invention include color filters and infrared transmission filters, and color filters are preferred.

[0059] A solid-state imaging device or an image display device can be manufactured using the method for manufacturing an optical filter of the present invention.

[0060] <Photosensitive composition> Next, the photosensitive composition of the present invention used in the method for producing an optical filter of the present invention will be described. The photosensitive composition of the present invention contains a compound represented by formula (1), a photopolymerization initiator, and a solvent. This photosensitive composition is preferably used as a composition for forming a resist film in the method for producing an optical filter of the present invention. Hereinafter, each component used in the photosensitive composition of the present invention will be described.

[0061] <<Compound Represented by Formula (1) (Specific Compound)>> The photosensitive composition of the present invention contains a compound represented by formula (1). In formula (1), R １ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; L １represents a single bond or a divalent linking group; X １ represents a group represented by formula (X1) or formula (X2); １ represents an n-valent linking group, n represents an integer of 2 to 6, and X １ is a group represented by formula (X2), L １ is a divalent linking group; In formula (X1), R １１ and R １２ each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). ２１ represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1).

[0062] R in formula (1) １ The hydrocarbon group represented by R in formula (1) is preferably an aliphatic hydrocarbon group, and more preferably an alkyl group. １ is preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and even more preferably a hydrogen atom or a methyl group.

[0063] L in formula (1) １ represents a single bond or a divalent linking group, and is preferably a divalent linking group because this can further suppress the generation of development residues.

[0064] L １ The divalent linking group represented by is a hydrocarbon group, a heterocyclic group, —O—, —S—, —NR Ｌ１ -, -CO-, -COO-, -OCO-, -SO ２ - and groups formed by combining two or more of these groups. Ｌ１represents a hydrogen atom, an alkyl group, or an aryl group, with a hydrogen atom being preferred. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The aliphatic hydrocarbon group may be cyclic or acyclic. The acyclic aliphatic hydrocarbon group may be a straight-chain aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group. The aliphatic hydrocarbon group may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. The hydrocarbon group may have a substituent or may not have a substituent. The cyclic aliphatic hydrocarbon group and the aromatic hydrocarbon group may be a monocyclic or fused ring. The heterocyclic group may be a monocyclic or fused ring. The heterocyclic group is preferably a 5- or 6-membered ring. The heterocyclic group may be an aliphatic heterocyclic group or an aromatic heterocyclic group. Examples of heteroatoms constituting the heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. L １ The divalent linking group represented by is preferably a group containing a hydrocarbon group, more preferably a group containing an aliphatic hydrocarbon group, still more preferably a group containing a straight-chain aliphatic hydrocarbon group, and particularly preferably a group containing a straight-chain saturated aliphatic hydrocarbon group.

[0065] A in formula (1) １ represents an n-valent linking group. １ The n-valent linking group represented by is a hydrocarbon group, a heterocyclic group, —O—, —S—, —NR Ａ１ -, -CO-, -COO-, -OCO-, -SO ２ - and groups formed by combining two or more of these groups. Ａ１represents a hydrogen atom, an alkyl group, or an aryl group, with a hydrogen atom being preferred. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. The aliphatic hydrocarbon group may be cyclic or acyclic. The acyclic aliphatic hydrocarbon group may be a straight-chain aliphatic hydrocarbon group or a branched aliphatic hydrocarbon group. The aliphatic hydrocarbon group may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group. The hydrocarbon group may have a substituent or may not have a substituent. The cyclic aliphatic hydrocarbon group and the aromatic hydrocarbon group may be a monocyclic ring or a fused ring. The heterocyclic group may be a monocyclic ring or a fused ring. The heterocyclic group is preferably a 5- or 6-membered ring. The heterocyclic group may be an aliphatic heterocyclic group or an aromatic heterocyclic group. Examples of heteroatoms constituting the heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. A １ The n-valent linking group represented by is preferably a group containing a hydrocarbon group, and more preferably a group containing an aromatic hydrocarbon group, a group containing a linear saturated aliphatic hydrocarbon group, or a group containing a cyclic aliphatic hydrocarbon group.

[0066] In formula (1), n ​​represents an integer of 2 to 6, preferably an integer of 2 to 4, more preferably 2 or 3, and even more preferably 2.

[0067] X in formula (1) １ represents a group represented by formula (X1) or formula (X2), and is preferably a group represented by formula (X1) because this increases the affinity with an alkaline developer after modification and can further suppress the generation of development residues.

[0068] R in formula (X1) １１ and R １２ and R in formula (X2). ２１ The hydrocarbon group represented by R in formula (X1) is preferably an aliphatic hydrocarbon group, and more preferably an alkyl group. １１ and R １２ and R in formula (X2). ２１The number of carbon atoms in the hydrocarbon group represented by is preferably 1 to 5, and more preferably 1 to 3. １１ and R １２ and R in formula (X2). ２１ The hydrocarbon group represented by is particularly preferably a methyl group.

[0069] The specific compound is preferably a compound represented by formula (1a). The compound represented by formula (1a) is also a compound of the present invention. In formula (1a), R １ａ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ａ and R １２ａ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ａ represents a divalent linking group; １ａ represents an n-valent linking group, and n represents an integer of 2 to 6.

[0070] R in formula (1a) １ａ is R in formula (1). １ The preferred ranges are also the same as those of the above. １ａ is A in formula (1). １ n in formula (1a) has the same meaning as n in formula (1), and the preferred range is also the same.

[0071] L in formula (1a) １ａ The divalent linking group represented by is L in formula (1). １ The preferred ranges are also the same.

[0072] R in formula (1a) １１ａ and R １２ａ The hydrocarbon group represented by R is preferably an aliphatic hydrocarbon group, and more preferably an alkyl group. １１ａ and R １２ａ The hydrocarbon group represented by R preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms. １１ａ and R １２ａ is particularly preferably a methyl group.

[0073] The specific compound is preferably a compound represented by formula (1b). In formula (1b), R １ｂ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ｂ and R １２ｂ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ｂ represents —O— or —NH—; １ｂ represents a divalent linking group; １ｂ represents an n-valent linking group, and n represents an integer of 2 to 6.

[0074] R in formula (1b) １ｂ is R in formula (1). １ The preferred ranges are also the same as those of the formula (1b). １ｂ is A in formula (1). １ The n in formula (1b) has the same meaning as the n in formula (1), and the preferred range is also the same. R in formula (1b) １１ｂ and R １２ｂ is R in formula (1a) １１ａ and R １２ａ The same applies to the preferred range.

[0075] L in formula (1b) １ｂ The divalent linking group represented by is L in formula (1). １ The preferred ranges are also the same.

[0076] Y in formula (1b) １ｂ represents —O— or —NH—, and is preferably —O—.

[0077] Specific examples of the specific compound include compounds (M-1) to (M-16) described in the examples below.

[0078] The content of the specific compound in the total solid content of the photosensitive composition is preferably 20 to 85% by mass. The lower limit is preferably 25% by mass or more, and more preferably 30% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 75% by mass or less. The photosensitive composition may contain only one type of specific compound, or may contain two or more types. When two or more types are contained, the total amount thereof preferably falls within the above range.

[0079] <<Photopolymerization initiator>> The photosensitive composition of the present invention contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound having photosensitivity to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0080] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound.Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A No. 2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37-60pp, vol. 19, No. peroxide-based photopolymerization initiators described in JP-A-2019-3, 2019, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP-A-2019-043864, photopolymerization initiators described in JP-A-2019-044030, peroxide-based initiators described in JP-A-2019-167313, aminoacetophenone-based initiators having an oxazolidine group described in JP-A-2020-055992, Oxime-based photopolymerization initiators described in JP-A-0459, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in WO 2020 / 152120, compounds described in JP-A-2021-181406, photopolymerization initiators described in JP-A-2022-013379, compounds represented by formula (1) described in JP-A-2022-015747, fluorine-containing fluorene oxime ester-based photoinitiators described in JP-T-2021-507058, Chinese Patent Application Publication No. 1107643 Initiators described in Patent Publication No. 67, initiators described in JP-T-2022-518535, initiators described in WO 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP-A-2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in WO 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Patent Publication No. 10-2017-0087330, Examples of the photopolymerization initiator include compounds described in WO 2019 / 013112, compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in WO 2019 / 013112, and photopolymerization initiators described in JP 2023-033731 A.

[0081] Specific examples of hexaarylbiimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0082] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (all manufactured by BASF), etc. Commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (all manufactured by IGM Resins B.V.), Irgacure 819, Irgacure TPO (all manufactured by BASF), etc.

[0083] Examples of the oxime compound include the compounds described in paragraph 0142 of WO 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by the general formula (1) of JP-A-2021-173858, and the compounds described in paragraphs 0022 to 0024, and the compounds represented by the general formula (1) of JP-A-2021-170089 and the compounds described in paragraphs 0117 to 0120. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), and the like. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, and Irgacure OXE04 (manufactured by BASF), TR-PBG-301, TR-PBG-304, and TR-PBG-327 (manufactured by TRONLY), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation, photopolymerization initiator 2 described in JP-A-2012-014052). Furthermore, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, and NCI-930 (manufactured by ADEKA Corporation).

[0084] As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound in which a substituent having a hydroxy group is bonded to a carbazole skeleton, or a compound described in paragraphs 0143 to 0149 of WO 2022 / 085485 can also be used.

[0085] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0086] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0087] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0088] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6). In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0089] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0090] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0091] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0092] R Ｘ１ ~R Ｘ９The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0093] R Ｘ１ ~R Ｘ９ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0094] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group. １ａ The acyl group represented by is —C(O)—R １０１ It is preferable that R １０１ represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0095] R １０１ The number of carbon atoms in the aryl group represented by R is preferably 6 to 20, and more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. １０１ The aryl group represented by is preferably a phenyl group, a methylphenyl group or a naphthyl group, more preferably a methylphenyl group or a naphthyl group.

[0096] R １０１ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0097] R in formula (OX-1)２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0098] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0099] Alk of formula (OX-1) １ and Alk ２each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0100] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0101] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0102] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0103] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent; n represents 0 or 1;

[0104] R １ｂ and R ２ｂExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0105] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. Examples of the alkyl group and the aryl group include those described above. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0106] Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar １ｂ is preferably an aromatic ring group which may have a substituent. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0107] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0108] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃeach independently represents a substituent; １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ represents -O- or -S-; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0109] R １ｃ and R ２ｃ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0110] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0111] Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0112] Ar ２ｃrepresents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0113] k represents 0 or 1, and is preferably 0.

[0114] m represents an integer of 0 to 4, preferably 0 or 1, and more preferably 1.

[0115] Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[0116]

[0117]

[0118]

[0119]

[0120] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferable to measure using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate as a solvent.

[0121] As the photopolymerization initiator, it is also preferable to use a combination of Irgacure OXE01 (manufactured by BASF) and / or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins B.V.).

[0122] As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, thereby obtaining good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced and solubility in solvents is improved, making it less likely to precipitate over time, thereby improving the storage stability of the photosensitive composition. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0123] The content of the photopolymerization initiator in the total solid content of the photosensitive composition is preferably 1 to 40% by mass. The lower limit is preferably 3% by mass or more, more preferably 8% by mass or more. The upper limit is preferably 35% by mass or less, more preferably 30% by mass or less. The content of the photopolymerization initiator is preferably 3 to 70 parts by mass per 100 parts by mass of the specific compound. The lower limit is preferably 5 parts by mass or more, more preferably 10 parts by mass or more. The upper limit is preferably 50 parts by mass or less, more preferably 40 parts by mass or less. The photosensitive composition may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types are contained, the total amount thereof preferably falls within the above range.

[0124] <<Solvent>> The photosensitive composition of the present invention contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as the solubility of each component and the coatability of the photosensitive composition are satisfied. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph 0223 of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0125] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent with a mass ppt (parts per trillion) level may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0126] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0127] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The organic solvent may contain only one type of isomer or multiple types of isomers.

[0128] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0129] The content of the solvent in the photosensitive composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and even more preferably from 30 to 90% by mass.

[0130] <<Resin>> The photosensitive composition of the present invention preferably contains a resin.

[0131] Examples of resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Further, examples of the resin include the resins described in paragraphs 0091 to 0099 of WO 2022 / 065215, the blocked polyisocyanate resins described in JP 2016-222891 A, the resins described in JP 2020-122052 A, the resins described in JP 2020-111656 A, the resins described in JP 2020-139021 A, the resins described in JP 2017-138503 A containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain, and the resins described in paragraphs 0199 to 0199 of JP 2020-186373 A. 0233, the alkali-soluble resin described in JP 2020-186325 A, the resin represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339, the copolymer containing an epoxy group and an acid group described in WO 2022 / 030445, the resin described in JP 2018-135514 A, the copolymer described in JP 2020-041046 A, the resin described in JP 2023-033156 A, the resin described in JP 2023-030386 A, and the resin described in JP 2023-027753 A can also be used.

[0132] The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

[0133] The resin to be used is preferably a resin having an acid group, such as a carboxy group, a phosphate group, a sulfo group, or a phenolic hydroxy group.

[0134] The acid value of the resin having an acid group is preferably 5 to 250 mgKOH / g, more preferably 10 to 200 mgKOH / g, and even more preferably 20 to 180 mgKOH / g, because this can further suppress the generation of residues.

[0135] The resin having an acid group preferably contains a repeating unit having an acid group on a side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on a side chain based on all repeating units of the resin. The upper limit of the content of repeating units having an acid group on a side chain is preferably 50 mol% or less, more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on a side chain is preferably 10 mol% or more, more preferably 20 mol% or more.

[0136] For resins having acid groups, please refer to the descriptions in paragraphs

[0558] to

[0571] of JP 2012-208494 A (corresponding to paragraphs

[0685] to

[0700] of U.S. Patent Application Publication No. 2012 / 0235099 A) and paragraphs

[0076] to

[0099] of JP 2012-198408 A, the contents of which are incorporated herein by reference. Alternatively, commercially available resins having acid groups can be used. There are no particular limitations on the method for introducing acid groups into the resin, and examples include the method described in Japanese Patent No. 6,349,629 A. Furthermore, examples of methods for introducing acid groups into the resin include a method in which an acid anhydride is reacted with a hydroxy group generated by a ring-opening reaction of an epoxy group to introduce the acid group.

[0137] A resin having a basic group can also be used as the resin. The resin having a basic group is preferably a resin containing a repeating unit having a basic group in the side chain, more preferably a copolymer having a repeating unit having a basic group in the side chain and a repeating unit not containing a basic group, and even more preferably a block copolymer having a repeating unit having a basic group in the side chain and a repeating unit not containing a basic group. The resin having a basic group can also be used as a dispersant. The amine value of the resin having a basic group is preferably 5 to 300 mgKOH / g. The lower limit is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more. The upper limit is preferably 200 mgKOH / g or less, more preferably 100 mgKOH / g or less.

[0138] Commercially available resins having basic groups include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, and BYK-LPN6919 (all manufactured by BYK-Chemie), and Solsperse 112. 00, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 37500, 38500, 39000, 53095, 56000, 7100 (all manufactured by The Lubrizol Group, Japan), Efka PX 4300, 4330, 4046, 4060, 4080 (all manufactured by BASF), and the like. In addition, the resin having a basic group may be the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665, the block copolymer A1 described in paragraphs 0046 to 0076 of JP-A-2018-156021, or the vinyl resin having a basic group described in paragraphs 0150 to 0153 of JP-A-2019-184763, the contents of which are incorporated herein by reference.

[0139] It is also preferable to use a resin having an acid group and a resin having a basic group. When a resin having an acid group and a resin having a basic group are used in combination, the content of the resin having a basic group is preferably 20 to 500 parts by mass, more preferably 30 to 300 parts by mass, and even more preferably 50 to 200 parts by mass, per 100 parts by mass of the resin having an acid group.

[0140] It is also preferable to use a resin having an aromatic carboxy group as the resin. In a resin having an aromatic carboxy group, the aromatic carboxy group may be contained in the main chain of the repeating unit or may be contained in a side chain of the repeating unit. It is preferable that the aromatic carboxy group is contained in the main chain of the repeating unit. In this specification, an aromatic carboxy group refers to a group having a structure in which one or more carboxy groups are bonded to an aromatic ring. In the aromatic carboxy group, the number of carboxy groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having an aromatic carboxy group include the resins described in paragraphs 0082 to 0107 of WO 2021 / 166858.

[0141] As the resin, it is preferable to use a resin having a graft chain (hereinafter also referred to as a graft resin). When a graft resin is used, the generation of residues can be further suppressed. In this specification, the term "graft chain" refers to a polymer chain that branches off from the main chain of a repeating unit. The number of atoms of the graft chain excluding hydrogen atoms is preferably 40 to 10,000, more preferably 50 to 2,000, and even more preferably 60 to 500.

[0142] The graft chain preferably contains a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, a polystyrene structure, a polyurethane structure, a polyurea structure, and a polyamide structure, more preferably contains a repeating unit of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure, and further preferably contains a repeating unit of a polyether structure or a polyester structure because this provides excellent pigment dispersibility, and particularly preferably contains a repeating unit of a polyester structure.

[0143] Examples of repeating units of polyester structures include repeating units of structures represented by formula (G-1), formula (G-4), or formula (G-5). Examples of repeating units of polyether structures include repeating units of structures represented by formula (G-2). Examples of repeating units of poly(meth)acrylic structures include repeating units of structures represented by formula (G-3). Examples of repeating units of polystyrene structures include repeating units of structures represented by formula (G-6).

[0144] In the above formula, R Ｇ１ and R Ｇ２ R each independently represents an alkylene group. Ｇ１ and R Ｇ２ The alkylene group represented by is not particularly limited, but is preferably a linear or branched alkylene group having 1 to 20 carbon atoms, more preferably a linear or branched alkylene group having 2 to 16 carbon atoms, and even more preferably a linear or branched alkylene group having 3 to 12 carbon atoms.

[0145] In the above formula, R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１ represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent. Ｇ１Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an alkyleneoxy group (preferably an alkyleneoxy group having 1 to 12 carbon atoms), an oxyalkylenecarbonyl group (preferably an oxyalkylenecarbonyl group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, -OCO-, -S-, and groups formed by combining two or more of these. Ｇ４ Examples of the substituent represented by include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, a heteroarylthioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

[0146] R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group. Ｇ６ The number of carbon atoms in the aryl group represented by R is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. Ｇ６ The aryl group represented by may have a substituent, such as a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, a heteroarylthioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

[0147] The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include a group represented by formula (W-1). -L ｗ１ -R ｗ１ ...(W-1) In the formula, L ｗ１ represents a single bond or a divalent linking group, R ｗ１represents an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, or a heteroarylthioether group.

[0148] L ｗ１ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, -OCO-, -CONR Ｌ１ -, -S-, and groups combining two or more of these groups. Ｌ１ represents a hydrogen atom, an alkyl group, or an aryl group.

[0149] R ｗ１ is preferably an alkyl group or an alkoxy group.

[0150] The graft chain preferably has a structure represented by the following formula (G-1a), (G-2a), (G-3a), (G-4a), (G-5a) or (G-6a), and more preferably has a structure represented by formula (G-1a), (G-4a) or (G-5a).

[0151] In the above formula, R Ｇ１ and R Ｇ２ each represents an alkylene group, and R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１ represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent, R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group; W １００ represents a hydrogen atom or a substituent, and n1 to n6 each independently represent an integer of 2 or more. Ｇ１ ~R Ｇ６ , Q Ｇ１ , L Ｇ１ Regarding the formula (G-1) to (G-6), Ｇ１ ~RＧ６ , Q Ｇ１ , L Ｇ１ The same applies to the preferred range.

[0152] In formulae (G-1a) to (G-6a), W １００ is preferably a substituent. Examples of the substituent include the group represented by the above formula (W-1).

[0153] In formulae (G-1a) to (G-6a), n1 to n6 are each preferably an integer of 2 to 100, more preferably an integer of 2 to 80, and even more preferably an integer of 8 to 60.

[0154] In formula (G-1a), when n1 is 2 or more, R Ｇ１ may be the same or different. Ｇ１ In the case where the repeating unit has two or more different repeating units, the arrangement of the repeating units is not particularly limited and may be random, alternating, or block. The same applies to formulas (G-2a) to (G-6a). The graft chain has a structure represented by formula (G-1a), formula (G-4a), or formula (G-5a), and R Ｇ１ It is also preferable that the repeating unit has a structure containing two or more different repeating units.

[0155] The graft resin is preferably a resin having a repeating unit having a graft chain. Examples of the repeating unit having a graft chain include a repeating unit represented by formula (e3).

[0156] In the formula, A ｅ３０ represents a trivalent linking group, L ｅ３０ represents a single bond or a divalent linking group; W ｅ３０ represents a graft chain.

[0157] A ｅ３０Examples of the trivalent linking group represented by are a poly(meth)acrylic linking group, a polyalkyleneimine linking group, a polyester linking group, a polyurethane linking group, a polyurea linking group, a polyamide linking group, a polyether linking group, and a polystyrene linking group. A poly(meth)acrylic linking group or a polyalkyleneimine linking group is preferred, and a poly(meth)acrylic linking group is more preferred.

[0158] L ｅ３０ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, -OCO-, -CONR ｘ３ -, -S-, and groups combining two or more of these groups. ｘ３ represents a hydrogen atom, an alkyl group, or an aryl group. The alkylene group and arylene group may have a substituent.

[0159] W ｅ３０ Examples of the graft chain represented by include the graft chains described above.

[0160] The content of the repeating unit having a graft chain is preferably 1 mol% or more, more preferably 2 mol% or more, and even more preferably 3 mol% or more, of all repeating units of the graft resin, and the upper limit can be set to 90 mol% or less, 80 mol% or less, or 70 mol% or less.

[0161] The graft resin may further have a repeating unit having an acid group, such as a carboxy group, a sulfo group, or a phosphate group, with a carboxy group being preferred.

[0162] The content of the repeating units having an acid group in all repeating units of the graft resin is preferably 1 mol% or more, more preferably 2 mol% or more, and even more preferably 3 mol% or more, with the upper limit being 90 mol% or less, 80 mol% or less, or 70 mol% or less.

[0163] The weight average molecular weight of the graft resin is preferably 5,000 to 100,000. The upper limit is preferably 80,000 or less, and more preferably 60,000 or less. The lower limit is preferably 6,000 or more, and more preferably 8,000 or more. The acid value of the graft resin is preferably 5 to 250 mgKOH / g, and from the viewpoint of further suppressing the generation of residues, is more preferably 10 to 200 mgKOH / g, and even more preferably 20 to 180 mgKOH / g.

[0164] The content of the resin in the total solid content of the photosensitive composition is preferably 4 to 60% by mass. The lower limit is preferably 9% by mass or more, more preferably 19% by mass or more. The upper limit is preferably 51% by mass or less, more preferably 46% by mass or less. The content of the resin is preferably 5 to 250 parts by mass per 100 parts by mass of the specific compound. The lower limit is preferably 10 parts by mass or more, more preferably 20 parts by mass or more. The upper limit is preferably 150 parts by mass or less, more preferably 200 parts by mass or less. The photosensitive composition may contain only one type of resin, or may contain two or more types. When two or more types are contained, the total amount thereof preferably falls within the above range.

[0165] <<Surfactant>> The photosensitive composition of the present invention may contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant may be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant, and more preferably a silicone-based surfactant. For details of the surfactant, reference may be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0166] As the fluorine-based surfactant, the compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0167] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0168] Silicone surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). As the silicone surfactant, compounds having the following structure can also be used.

[0169] The content of the surfactant in the total solid content of the photosensitive composition is preferably 0.001 to 1% by mass. The lower limit is preferably 0.005% by mass or more, and more preferably 0.01% by mass or more. The upper limit is preferably 0.5% by mass or less, and more preferably 0.1% by mass or less. The photosensitive composition may contain only one type of surfactant, or may contain two or more types. When two or more types of surfactants are contained, the total amount thereof preferably falls within the above range.

[0170] <<Polymerization Inhibitor>> The photosensitive composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Of these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solids content of the photosensitive composition is preferably 0.0001 to 5 mass%. One type of polymerization inhibitor may be used alone, or two or more types may be used. When two or more types are used, the total amount preferably falls within the above range.

[0171] <<Other Components>> The photosensitive composition of the present invention may contain an ultraviolet absorber and the like, if necessary.

[0172] <Pixel-forming composition> Next, the pixel-forming composition used in the method for producing an optical filter of the present invention will be described. The pixel-forming composition contains a colorant and a curable compound. Each component used in the pixel-forming composition will be described below.

[0173] <<Colorant>> The pixel-forming composition contains a colorant. Examples of the colorant include a white colorant, a black colorant, a chromatic colorant, and an infrared-absorbing colorant. Pigment derivatives can also be used as the colorant. In the present invention, the white colorant includes not only pure white colorants but also light gray colorants close to white (e.g., off-white, light gray, etc.).

[0174] The colorant may be a pigment or a dye. A pigment and a dye may be used in combination. The pigment may be either an inorganic pigment or an organic pigment, but is preferably an organic pigment from the viewpoints of a wide range of color variations, ease of dispersion, safety, and the like. The colorant preferably contains a pigment. Furthermore, the pigment preferably contains at least one selected from a chromatic pigment and an infrared absorbing pigment, and more preferably contains a chromatic pigment.

[0175] The average primary particle diameter of the pigment and pigment derivative is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. In this specification, the primary particle diameter of the pigment and pigment derivative can be determined from a photograph obtained by observing the primary particles of the pigment and pigment derivative using a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles without aggregation. The same applies to the average primary particle diameter of pigment derivatives.

[0176] The crystallite size of the pigment and pigment derivative is preferably 0.1 to 50 nm, more preferably 0.5 to 30 nm, and even more preferably 1 to 15 nm. The crystallite size can be determined from the half-width of the diffraction angle peak using an X-ray diffractometer and calculated using the Scherrer equation. The crystallite size of the organic pigment and pigment derivative can be adjusted by known methods such as adjusting the production conditions or pulverizing the product after production.

[0177] The specific surface area of ​​pigments and pigment derivatives is 1 to 300 m ２ / g. The lower limit is 10 m ２ / g or more, and ２ / g or more is more preferable. ２ / g or less, and ２ The value of the specific surface area can be determined according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: Determination of the specific surface area of ​​solids by gas adsorption.

[0178] The colorant contained in the pixel-forming composition preferably contains a pigment and a pigment derivative. Examples of the pigment derivative include compounds having a structure in which an acid group or a basic group is bonded to a dye skeleton. Details of the pigment derivative will be described later. The content of the pigment derivative is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, per 100 parts by mass of the pigment. Only one type of pigment derivative may be used, or two or more types may be used in combination.

[0179] The colorant contained in the pixel-forming composition may contain a pigment and a dye. When the composition contains a pigment and a dye, the content of the dye is preferably 10 to 100 parts by mass per 100 parts by mass of the pigment. The upper limit is preferably 80 parts by mass or less, more preferably 70 parts by mass or less. The lower limit is preferably 20 parts by mass or more, more preferably 30 parts by mass or more, and even more preferably 40 parts by mass or more. Only one type of dye may be used, or two or more types may be used in combination. It is also preferable that the colorant contained in the pixel-forming composition is substantially free of dye. According to this embodiment, a film with excellent light resistance and heat resistance can be formed. "Substantially free of dye" means that the content of dye in the colorant is 0.1% by mass or less, preferably 0.01% by mass or less, and more preferably zero.

[0180] (Chromatic Colorant) Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm. Examples include yellow colorants, orange colorants, red colorants, green colorants, purple colorants, and blue colorants. The chromatic colorant is preferably a pigment (chromatic pigment), more preferably a red pigment, yellow pigment, or blue pigment, and even more preferably a red pigment or blue pigment. Specific examples of chromatic color pigments include those shown below.

[0181] Examples of red colorants include diketopyrrolopyrrole compounds, anthraquinone compounds, azo compounds, naphthol compounds, azomethine compounds, xanthene compounds, quinacridone compounds, perylene compounds, and thioindigo compounds, and diketopyrrolopyrrole compounds, anthraquinone compounds, and azo compounds are preferred, and diketopyrrolopyrrole compounds are more preferred. Furthermore, the red colorant is preferably a red pigment. Furthermore, the red pigment is preferably a diketopyrrolopyrrole pigment.

[0182] Specific examples of red colorants include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, Examples of red pigments include 150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291,294,295,296,297. In addition, as a red colorant, a compound described in paragraph number 0034 of WO 2022 / 085485, or a brominated diketopyrrolopyrrole compound described in JP-A-2020-085947 can also be used.

[0183] As the red colorant, C.I. Pigment Red 122, 177, 224, 254, 255, 264, 269, and 272 are preferred, and C.I. Pigment Red 254, 264, and 272 are more preferred.

[0184] Examples of green coloring materials include phthalocyanine compounds and squarylium compounds, and phthalocyanine compounds are preferred. The green coloring material is preferably a green pigment. The green pigment is preferably a phthalocyanine pigment.

[0185] Specific examples of green colorants include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Furthermore, halogenated zinc phthalocyanine pigments having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used as green colorants. Specific examples include the compounds described in WO 2015 / 118720. Furthermore, compounds described in paragraph 0029 of WO 2022 / 085485, aluminum phthalocyanine compounds described in JP-A 2020-070426, and diarylmethane compounds described in JP-A 2020-504758 can also be used as green colorants.

[0186] As the green colorant, C.I. Pigment Green 7, 36, 58, 62, and 63 are preferred, and C.I. Pigment Green 36 and 58 are more preferred.

[0187] Examples of orange colorants include diketopyrrolopyrrole compounds and azo compounds, and diketopyrrolopyrrole compounds are preferred. The orange colorant is preferably an orange pigment. The orange pigment is preferably a diketopyrrolopyrrole pigment. Specific examples of orange colorants include orange pigments such as C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, and 73.

[0188] Examples of yellow colorants include azo compounds, azomethine compounds, isoindoline compounds, pteridine compounds, quinophthalone compounds, and perylene compounds. The yellow colorant is preferably a yellow pigment. The yellow pigment is preferably at least one selected from isoindoline pigments, quinophthalone pigments, and azo pigments. Specific examples of yellow colorants include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125 , 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236 and the like.

[0189] Furthermore, as the yellow coloring material, an azobarbituric acid nickel complex having the following structure can also be used.

[0190] In addition, as a yellow colorant, the compounds described in paragraphs 0031 to 0033 of WO 2022 / 085485, the methine dyes described in JP-A 2019-073695, and the methine dyes described in JP-A 2019-073696 can be used.

[0191] Examples of the purple colorant include an oxazine compound, a quinacridone compound, a perylene compound, and an indigo compound, and the oxazine compound is preferred. The purple colorant is preferably a purple pigment. Specific examples of the purple colorant include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

[0192] Examples of blue colorants include phthalocyanine compounds and squarylium compounds, with phthalocyanine compounds being preferred. The blue colorant is preferably a blue pigment. The blue pigment is preferably a phthalocyanine pigment. Specific examples of blue colorants include blue pigments such as C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, and 88. Furthermore, aluminum phthalocyanine compounds having phosphorus atoms can also be used as blue colorants. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

[0193] Dyes can also be used as chromatic colorants. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes.

[0194] A dye polymer can also be used as a chromatic colorant. The dye polymer is preferably a dye dissolved in a solvent when used. The dye polymer may also form particles. When the dye polymer is particulate, it is typically used in a dispersed state in a solvent. A particulate dye polymer can be obtained, for example, by emulsion polymerization, and specific examples of the compounds and production methods described in JP-A 2015-214682 include those described in JP-A 2015-214682. The dye polymer has two or more dye structures in one molecule, preferably three or more dye structures. The upper limit is not particularly limited, but can be 100 or less. The multiple dye structures in one molecule may be the same dye structure or different dye structures. The weight-average molecular weight (Mw) of the dye polymer is preferably 2,000 to 50,000. The lower limit is more preferably 3,000 or more, and even more preferably 6,000 or more. The upper limit is more preferably 30,000 or less, and even more preferably 20,000 or less. As the dye multimer, compounds described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, WO 2016 / 031442, etc. can also be used.

[0195] As chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in JP 2020-117638 A, phthalocyanine compounds described in WO 2020 / 174991 A, isoindoline compounds described in JP 2020-160279 A or salts thereof, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069442 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069070 A Compounds represented by the formula (I) described in Korean Patent Publication No. 10-2020-0069067, compounds represented by the formula (I) described in Korean Patent Publication No. 10-2020-0069062, halogenated zinc phthalocyanine pigments described in Japanese Patent No. 6809649, isoindoline compounds described in Japanese Patent Publication No. 2020-180176, phenothiazine compounds described in Japanese Patent Publication No. 2021-187913, halogenated zinc phthalocyanines described in International Publication No. 2022 / 004261, and halogenated zinc phthalocyanines described in International Publication No. 2021 / 250883 can be used. The other colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, in the rod-shaped structure, or in both structures. Other colorants include quinophthalone compounds represented by formula 1 in Korean Patent Publication No. 10-2020-0030759, polymer dyes described in Korean Patent Publication No. 10-2020-0061793, colorants described in JP-A-2022-029701, isoindoline compounds described in WO 2022 / 014635, aluminum phthalocyanine compounds described in WO 2022 / 024926, and JP-A-2022-0458 Compounds described in Patent Publication No. 95, compounds described in WO 2022 / 050051, compounds described in JP 2020-090676, compounds described in JP 2020-055956, compounds described in JP 2021-031681, compounds described in JP 2022-056354, compounds described in US Patent Application Publication No. 2021 / 0355327, compounds described in WO 2022 / 065357,Compounds described in JP 2020-045436 A, compounds described in Korean Patent Publication No. 10-2021-0146726 A, compounds described in JP 2018-178039 A, compounds described in Chinese Patent Publication No. 113881244 A, compounds described in Chinese Patent Publication No. 113881245 A, compounds described in Chinese Patent Publication No. 113881246 A, compounds described in JP 2022-1048 A compounds described in JP-A-2022-096701, compounds described in JP-A-2020-023652, green pigments described on pages 80 to 84 of the Journal of the Color Materials Association (published in 2022), compounds described in JP-A-2022-143135, compounds described in JP-A-2022-140287, compounds described in WO 2022 / 136308, Chinese Patent Application Publication No. 11306134 Perylene compounds described in Korean Patent Publication No. 10-2017-0018993, cyan pigments described in Korean Patent Publication No. 10-2017-0018993, isoindoline compounds described in Japanese Patent Application Laid-Open No. 2020-180176, compounds described in Japanese Patent Application Laid-Open No. 2023-013209, compounds described in Japanese Patent Application Laid-Open No. 2023-013166, xanthene compounds described in International Publication No. 2023 / 286526, compounds described in Japanese Patent Application Laid-Open No. 2021-155746 Compounds described in JP-A-2021-155747, compounds described in JP-A-2021-155748, compounds described in JP-A-2021-155749, compounds described in WO 2018 / 051876, compounds described in JP-A-2020-083981, compounds described in JP-A-2023-056463, compounds described in JP-T-2023-515473, and the like can also be used.

[0196] Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of the two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When a pixel-forming composition contains two or more chromatic colorants and exhibits black color through the combination of the two or more chromatic colorants, such a pixel-forming composition can be preferably used as a pixel-forming composition for an infrared transmission filter. (1) An embodiment containing a red colorant and a blue colorant. (2) An embodiment containing a red colorant, a blue colorant, and a yellow colorant. (3) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a purple colorant. (4) An embodiment containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant. (5) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a green colorant. (6) An embodiment containing a red color material, a blue color material, and a green color material. (7) An embodiment containing a yellow color material and a purple color material.

[0197] (White coloring material) Examples of the white coloring material include inorganic pigments such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. As the white coloring material, the white pigments described in paragraphs 0040 to 0043 of WO 2022 / 085485 can be used.

[0198] (Black Colorant) The black colorant is not particularly limited, and known materials can be used. The black colorant may be an inorganic black colorant or an organic black colorant. The black colorant is preferably a pigment. In this specification, the black colorant refers to a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.

[0199] Examples of inorganic black colorants include carbon black, titanium black, graphite, etc., with carbon black and titanium black being preferred, and titanium black being more preferred. Titanium black is a black particle containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. As the titanium black, the titanium black described in paragraph 0044 of WO 2022 / 085485 can be used. As the inorganic black colorant, zirconium nitride powder described in JP 2023-048173 A can also be used.

[0200] Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. The organic black colorant may be a compound described in paragraph 0166 of International Publication No. 2022 / 065215. Furthermore, examples of organic black colorants include perylene black (such as Lumogen Black FK4280) described in paragraphs 0016 to 0020 of JP-A-2017-226821 and black azo pigments described in JP-A-2022-121935.

[0201] (Infrared absorbing colorant) The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength longer than 700 nm. The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1800 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm, even more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1200 nm, and particularly preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1000 nm. In addition, the absorbance A of the infrared absorbing colorant at a wavelength of 500 nm is １ and absorbance A at the maximum absorption wavelength ２ Ratio A １ / A ２ is preferably 0.08 or less, and more preferably 0.04 or less. The infrared absorbing colorant is preferably a pigment, and more preferably an organic pigment.

[0202] Examples of infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, and metal borides. Specific examples of these include the compounds described in paragraph 0114 of WO 2022 / 065215. Examples of infrared absorbing colorants include the compounds described in paragraph 0121 of WO 2022 / 065215, squarylium compounds described in JP 2020-075959 A, Copper complexes described in Korean Patent Publication No. 10-2019-0135217, croconic acid compounds described in JP 2021-195515, near-infrared absorbing dyes described in JP 2022-022070, croconium compounds described in WO 2019 / 021767, compounds described in JP 2019-127549, compounds described in WO 2022 / 059619, and JP 2022-151682 Compounds described in JP-A-2022-188858, squarylium compounds described in JP-A-2022-184710, compounds described in JP-A-2022-189736, squarylium compounds described in JP-A-2023-004570, squarylium compounds described in WO 2019 / 230660, and compounds described in WO 2020 / 218615 can also be used.

[0203] (Pigment Derivative) A pigment derivative can also be used as the colorant. In the present invention, it is preferable to use a pigment and a pigment derivative in combination. Examples of the pigment derivative include compounds having a structure in which an acid group or a basic group is bonded to a colorant skeleton.

[0204] Examples of dye skeletons that constitute the pigment derivative include a quinoline dye skeleton, a benzimidazolone dye skeleton, a benzisoindole dye skeleton, a benzothiazole dye skeleton, an iminium dye skeleton, a squarylium dye skeleton, a croconium dye skeleton, an oxonol dye skeleton, a pyrrolopyrrole dye skeleton, a diketopyrrolopyrrole dye skeleton, an azo dye skeleton, an azomethine dye skeleton, a phthalocyanine dye skeleton, a naphthalocyanine dye skeleton, an anthraquinone dye skeleton, a quinacridone dye skeleton, a dioxazine dye skeleton, a perinone dye skeleton, a perylene dye skeleton, a thioindigo dye skeleton, an isoindoline dye skeleton, an isoindolinone dye skeleton, a quinophthalone dye skeleton, a dithiol dye skeleton, a triarylmethane dye skeleton, and a pyrromethene dye skeleton.

[0205] Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonic acid amide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ Examples of the carboxylic acid amide group include -NHCOR, ... Ｘ１ As the sulfonic acid amide group, a group represented by -NHSO is preferred. ２ R Ｘ２ As the imide acid group, a group represented by -SO ２ NHSO ２ R Ｘ３ , -CONHSO ２ R Ｘ４ , -CONHCOR Ｘ５ or -SO ２ NHCOR Ｘ６ A group represented by the formula: ２ NHSO ２ R Ｘ３ is more preferred. Ｘ１ ~R Ｘ６ R each independently represents an alkyl group or an aryl group. Ｘ１ ~RＸ６ The alkyl group and aryl group represented by may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

[0206] Examples of basic groups include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0207] Specific examples of pigment derivatives include the compounds described in paragraph 0124 of WO 2022 / 085485, the benzimidazolone compounds or salts thereof described in JP 2018-168244 A, the compounds having an isoindoline skeleton described in general formula (1) of Japanese Patent No. 6996282, the compounds described in JP 2019-172968 A, and the compounds described in Chinese Patent Publication No. 115124889.

[0208] The content of the colorant in the total solid content of the pixel-forming composition is preferably 40% by mass or more, more preferably 50% by mass or more, even more preferably 55% by mass or more, and even more preferably 60% by mass or more, and the upper limit is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less.

[0209] The content of the pigment in the total solid content of the pixel-forming composition is preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 45% by mass or more, and the upper limit is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less.

[0210] The content of the pigment in the colorant is preferably 20 to 100% by mass, more preferably 50 to 100% by mass, and even more preferably 70 to 100% by mass. The total content of the pigment and pigment derivative in the colorant is preferably 25 to 100% by mass, more preferably 55 to 100% by mass, and even more preferably 75 to 100% by mass.

[0211] <<Curable Compound>> The pixel-forming composition contains a curable compound. The curable compound may be a known compound capable of crosslinking by radicals, acid, or heat. Examples of the curable compound include a compound having an ethylenically unsaturated bond-containing group and a compound having a cyclic ether group, with a compound having a cyclic ether group being preferred. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be an alicyclic epoxy group. An alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. The curable compound is preferably a thermosetting compound.

[0212] (Compound Having an Ethylenically Unsaturated Bond-Containing Group) The compound having an ethylenically unsaturated bond-containing group may be in any chemical form such as a monomer, prepolymer, or oligomer, but is preferably a monomer. The molecular weight of the compound having an ethylenically unsaturated bond-containing group is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0213] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C═C value) of the compound having an ethylenically unsaturated bond-containing group is preferably 2 to 14 mmol / g. The lower limit is preferably 3 mmol / g or more, more preferably 4 mmol / g or more, and even more preferably 5 mmol / g or more. The upper limit is preferably 12 mmol / g or less, more preferably 10 mmol / g or less, and even more preferably 8 mmol / g or less. The C═C value of the compound having an ethylenically unsaturated bond-containing group is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the compound having an ethylenically unsaturated bond-containing group by the molecular weight of the compound having an ethylenically unsaturated bond-containing group.

[0214] The compound having an ethylenically unsaturated bond-containing group is preferably a compound containing three or more ethylenically unsaturated bond-containing groups, more preferably a compound containing 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound containing 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the compound having an ethylenically unsaturated bond-containing group is preferably a trifunctional to 15-functional (meth)acrylate compound, and more preferably a trifunctional to hexafunctional (meth)acrylate compound. Specific examples of compounds having an ethylenically unsaturated bond-containing group include the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215 and the compounds described in Taiwan Patent Publication No. 201832008.

[0215] Preferred examples of the compound having an ethylenically unsaturated bond-containing group include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454 and SR499, commercially available from Sartomer). Examples of compounds having an ethylenically unsaturated bond-containing group include diglycerin EO (ethylene oxide)-modified (meth)acrylate (commercially available product: M-460, manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (KAYARAD, manufactured by Nippon Kayaku Co., Ltd.). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1006, 8UH-1012 (manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), dendrimer structure or hyperbranched structure described in JP-A-2023-043479, and the like can also be used.

[0216] (Compound Having a Cyclic Ether Group) With regard to the compound having a cyclic ether group used as a curable compound, examples of the cyclic ether group include an epoxy group and an oxetanyl group. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of the epoxy compound include compounds having one or more epoxy groups in one molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups in one molecule. The upper limit of the epoxy groups contained in the epoxy compound can be, for example, 10 or less, or can be 5 or less. The lower limit of the epoxy groups contained in the epoxy compound is preferably 2 or more. As the compound having a cyclic ether group, the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, paragraphs 0147 to 0156 of JP-A-2014-043556, and paragraphs 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172 can also be used.

[0217] The compound having a cyclic ether group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (macromolecule) (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10,000 or less, particularly preferably 5,000 or less, and even more preferably 3,000 or less.

[0218] Commercially available examples of compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0219] The content of the curable compound in the total solid content of the pixel-forming composition is preferably 1 to 30% by mass. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. The lower limit is preferably 3% by mass or more, and more preferably 5% by mass or more. The pixel-forming composition may contain only one type of curable compound, or may contain two or more types. When two or more types of polymerizable compounds are contained, the total amount thereof is preferably within the above range.

[0220] <<Resin>> The pixel-forming composition can contain a resin. The resin is blended, for example, for the purpose of dispersing coloring materials and the like in the pixel-forming composition or for the purpose of using as a binder. Note that a resin that is mainly used to disperse coloring materials and the like in the pixel-forming composition is also called a dispersant. However, such a use of the resin is just one example, and the resin can also be used for purposes other than such a use. Examples of the resin include the resins described above as materials that can be used in the photosensitive composition.

[0221] The pixel-forming composition may also contain a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. As the acidic dispersant (acidic resin), a resin in which the amount of acid groups is 70 mol% or more is preferred, assuming that the total amount of acid groups and basic groups is 100 mol%. The acid groups contained in the acidic dispersant (acidic resin) are preferably carboxy groups. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mgKOH / g. Furthermore, the term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. As the basic dispersant (basic resin), a resin in which the amount of basic groups is greater than 50 mol% is preferred, assuming that the total amount of acid groups and basic groups is 100 mol%. The basic groups contained in the basic dispersant are preferably amino groups.

[0222] The resin used as the dispersant is preferably a graft resin. For details of the graft resin, please refer to paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated herein by reference. Furthermore, the graft resin may be any of the graft resins described above as materials that can be used in the photosensitive composition.

[0223] The resin used as the dispersant is preferably a polyimine-based dispersant containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant is preferably a resin having a main chain with a partial structure containing a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and having a basic nitrogen atom in at least one of the main chain and the side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. For details about polyimine-based dispersants, please refer to the description in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0224] The resin used as a dispersant is preferably a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.

[0225] The resin used as a dispersant is also preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group in a side chain is preferably 10 mol % or more, more preferably 10 to 80 mol %, and even more preferably 20 to 70 mol %, of all repeating units of the resin.

[0226] As the dispersant, the resin described in JP 2018-087939 A, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077 A, polyethyleneimine having a polyester side chain described in WO 2016 / 104803, block copolymers described in WO 2019 / 125940 A, block polymers having an acrylamide structural unit described in JP 2020-066687 A, block polymers having an acrylamide structural unit described in JP 2020-066688 A, dispersants described in WO 2016 / 104803, and the like can also be used.

[0227] Dispersants are also available as commercially available products, and specific examples thereof include the DISPERBYK series manufactured by BYK Chemie, the SOLSPERSE series manufactured by Lubrizol Japan, the Efka series manufactured by BASF, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd. In addition, the products described in paragraph 0129 of JP 2012-137564 A and the products described in paragraph 0235 of JP 2017-194662 A can also be used as dispersants.

[0228] The content of the resin in the total solid content of the pixel-forming composition is preferably 1 to 60% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less. The content of the dispersant is preferably 10 to 100 parts by mass per 100 parts by mass of the pigment. The lower limit is preferably 15 parts by mass or more, more preferably 20 parts by mass or more. The upper limit is preferably 80 parts by mass or less, more preferably 60 parts by mass or less. The pixel-forming composition may contain only one type of resin, or may contain two or more types. When two or more types of resins are contained, the total amount thereof preferably falls within the above range.

[0229] <<Photopolymerization initiator>> The pixel-forming composition may contain a photopolymerization initiator. Examples of the photopolymerization initiator include the photopolymerization initiators described above as materials that can be used in the photosensitive composition.

[0230] The content of the photopolymerization initiator in the total solid content of the pixel-forming composition is preferably 45% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less. The pixel-forming composition may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types of photopolymerization initiators are contained, the total amount thereof is preferably within the above range.

[0231] It is also preferable that the pixel-forming composition is substantially free of a photopolymerization initiator. When the pixel-forming composition is substantially free of a photopolymerization initiator, the content of the photopolymerization initiator in the total solid content of the pixel-forming composition is 0.05% by mass or less, preferably 0.01% by mass or less, and more preferably no photopolymerization initiator is contained.

[0232] <<Surfactant>> The pixel-forming composition can contain a surfactant. Examples of the surfactant include the surfactants described above as materials that can be used in the photosensitive composition. The content of the surfactant in the total solid content of the pixel-forming composition is preferably 0.001% by mass to 5.0% by mass, and more preferably 0.005% by mass to 3.0% by mass. The pixel-forming composition may contain only one type of surfactant, or may contain two or more types. When two or more types of surfactants are contained, the total amount thereof is preferably in the above range.

[0233] <<Polymerization Inhibitor>> The pixel-forming composition can contain a polymerization inhibitor. Examples of the polymerization inhibitor include the polymerization inhibitors described above as materials that can be used in the photosensitive composition. The content of the polymerization inhibitor in the total solid content of the pixel-forming composition is preferably 0.0001 to 5 mass %. The pixel-forming composition may contain only one type of polymerization inhibitor, or may contain two or more types. When two or more types of polymerization inhibitors are contained, the total amount thereof is preferably in the above range.

[0234] <<Polyalkyleneimine>> The pixel-forming composition may also contain a polyalkyleneimine. The polyalkyleneimine is used, for example, as a dispersing aid for pigments. A dispersing aid is a material for improving the dispersibility of coloring materials such as pigments in a pixel-forming composition. The polyalkyleneimine is a polymer obtained by ring-opening polymerization of an alkyleneimine. The polyalkyleneimine is preferably a polymer having a branched structure containing a primary amino group, a secondary amino group, and a tertiary amino group. The alkyleneimine preferably has 2 to 6 carbon atoms, more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2 carbon atoms.

[0235] The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less. Regarding the molecular weight value of the polyalkyleneimine, if the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, if the molecular weight of the specific amine compound cannot be calculated from the structural formula or calculation is difficult, the number average molecular weight value measured by the boiling point elevation method is used. If the number average molecular weight cannot be measured by the boiling point elevation method or is difficult to measure, the number average molecular weight value measured by the viscosity method is used. If the number average molecular weight cannot be measured by the viscosity method or is difficult to measure, the number average molecular weight value measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

[0236] The amine value of the polyalkyleneimine is preferably 5 mmol / g or more, more preferably 10 mmol / g or more, and even more preferably 15 mmol / g or more.

[0237] Specific examples of alkyleneimines include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. It is particularly preferred that the polyalkyleneimine be polyethyleneimine. Furthermore, the polyethyleneimine preferably contains primary amino groups in an amount of 10 mol% or more, more preferably 20 mol% or more, and even more preferably 30 mol% or more, based on the total of primary amino groups, secondary amino groups, and tertiary amino groups. Commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by Nippon Shokubai Co., Ltd.).

[0238] The content of the polyalkyleneimine in the total solid content of the pixel-forming composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass per 100 parts by mass of the pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and even more preferably 8 parts by mass or less. Only one type of polyalkyleneimine may be used, or two or more types may be used. When two or more types are used, the total amount thereof is preferably within the above range.

[0239] <<UV Absorber>> The pixel-forming composition may contain a UV absorber. Examples of UV absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of International Publication No. 2022 / 085485, the reactive triazine UV absorber described in JP-A-2021-178918, the UV absorber described in JP-A-2022-007884, the compound described in Korean Patent Publication No. 10-2022-0014454, and the compound described in JP-A-2023-013321. The content of the UV absorber in the total solids content of the pixel-forming composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. In the present invention, the ultraviolet absorber may be used alone or in combination of two or more kinds. When two or more kinds are used, it is preferable that the total amount is in the above range.

[0240] <<Silane Coupling Agent>> The pixel-forming composition may contain a silane coupling agent. Examples of the silane coupling agent include silane compounds having a hydrolyzable group, and preferably silane compounds having both a hydrolyzable group and another functional group. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond through at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with an amino group, a (meth)acryloyl group, and an epoxy group being preferred. Specific examples of the silane coupling agent include the compound described in paragraph 0177 of WO 2022 / 085485 and the compound described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the pixel-forming composition is preferably 0.01 to 15.0 mass%, more preferably 0.05 to 10.0 mass%. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be in the above range.

[0241] <<Antioxidant>> The pixel-forming composition may contain an antioxidant. Examples of antioxidants include phenolic compounds, phosphite ester compounds, and thioether compounds. As the phenolic compound, any phenolic compound known as a phenolic antioxidant can be used. Preferred phenolic compounds include hindered phenolic compounds. Compounds having a substituent at the position adjacent to the phenolic hydroxy group (ortho position) are preferred. As the substituent, a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms is preferred. Furthermore, as the antioxidant, compounds having a phenol group and a phosphite ester group in the same molecule are also preferred. Furthermore, as the antioxidant, phosphorus-based antioxidants can also be suitably used. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, and ethylbis(2,4-di-tert-butyl-6-methylphenyl)phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, and ADK STAB AO-330 (manufactured by ADEKA Corporation). Examples of the antioxidant include the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in WO 2017 / 006600, the compounds described in WO 2017 / 164024, and the compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the pixel-forming composition is preferably 0.01 to 20 mass %, and more preferably 0.3 to 15 mass %. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is in the above range.

[0242] <<Other Components>> The pixel-forming composition may contain, as necessary, a sensitizer, a plasticizer, and other auxiliary agents (e.g., conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling promoters, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. As these components, compounds described in paragraph 0182 of WO 2022 / 085485 can be used. In addition, as the chain transfer agent, a thiol compound described in JP 2020-109068 A can be used.

[0243] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, treatment details, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In addition, in the structural formulas shown below, Me is a methyl group.

[0244] (Synthesis Example 9) Synthesis of Compound (M-9) 250 parts by mass of ω-carboxy-polycaprolactone (n≒2) monoacrylate (Toagosei Co., Ltd., Aronix M-5300), 0.08 parts by mass of 2,6-di-t-butyl-4-methylphenol (Fujifilm Wako Pure Chemical Industries, Ltd.), and 3,300 parts by mass of dichloromethane (Fujifilm Wako Pure Chemical Industries, Ltd.) were added to a three-neck flask and stirred at 20 ° C. under an inert gas atmosphere. 2.5 parts by mass of N,N-dimethylformamide (Fujifilm Wako Pure Chemical Industries, Ltd.) were then added, and the mixture was cooled to an internal temperature of 5 ° C. 127 parts by mass of oxalyl chloride (Tokyo Chemical Industry Co., Ltd.) was added dropwise to maintain an internal temperature of less than 10 ° C., and the mixture was then heated to an internal temperature of 20 ° C. and stirred for 3 hours. Distillation under reduced pressure at 40° C. and 80 Torr yielded 255 parts by mass (yield 96%) of Compound A (n≈2) having the following structure. １ H NMR (CDCl ３ ) Chemical shift values: 1.36-1.50, 1.60-1.80, 2.28-2.34, 2.89-2.94, 4.04-4.09, 4.14-4.18, 5.80-5.85, 6.08-6.15, 6.37-6.43 ppm

[0245] A three-neck flask was charged with 50 parts by mass of α,α,α',α'-tetramethyl-1,3-benzenedimethanol (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) and 580 parts by mass of tetrahydrofuran (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd., ultra-dehydrated, stabilizer-containing), and the mixture was stirred at 20°C for 10 minutes under an inert gas atmosphere, followed by cooling to an internal temperature of -10°C. 242 parts by mass of a 1.6 mol / L n-butyllithium-hexane solution (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) was added, and the mixture was stirred for 5 minutes to prepare Solution B. A separate three-neck flask was charged with 185 parts by mass of Compound A synthesized above and 220 parts by mass of tetrahydrofuran (ultra-dehydrated, stabilizer-containing), and the mixture was cooled to an internal temperature of -10°C under an inert gas atmosphere. Solution B was then added dropwise to maintain the internal temperature below 0°C. After completion of the dropwise addition, the internal temperature was raised to 20°C and the mixture was stirred for 5 hours. The internal temperature was cooled to 0°C, and 1,000 parts by mass of 1 mol / L hydrochloric acid and 880 parts by mass of ethyl acetate were added and stirred for 10 minutes. After removing the aqueous layer by separation, the organic layer was returned to the flask, and 1,000 parts by mass of saturated aqueous sodium bicarbonate solution was added and stirred for 10 minutes. Next, after removing the aqueous layer by separation, the organic layer was returned to the flask, and 1,000 parts by mass of saturated saline solution was added and stirred for 10 minutes. Further, after removing the aqueous layer by separation, 50 parts by mass of magnesium sulfate was added to the organic layer. After removing insoluble matter by filtration, 0.06 parts by mass of 2,6-di-t-butyl-4-methylphenol (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added to the organic layer, and the mixture was distilled under reduced pressure at 40°C and 100 Torr. Impurities were removed by silica gel column chromatography using ethyl acetate and hexane as eluents, and 65 parts by mass of M-9 (yield 33%) was obtained. １ H NMR (CDCl ３ ) Chemical shift values: 1.35-1.45, 1.58-1.70, 1.76, 2.05, 2.29-2.23, 4.03-4.17, 5.80-5.83, 6.07-6.15, 6.37-6.42, 7.21-7.32 ppm

[0246] (Synthesis Examples 1 to 8, 10 to 16) Synthesis of Compounds (M-1) to (M-8) and (M-10) to (M-16) Compounds (M-1) to (M-8) and (M-10) to (M-16) were each synthesized in the same manner as for compound (M-9).

[0247] Compounds (M-1) to (M-16) are compounds having the structures shown below.

[0248] <Preparation of Pigment Dispersion> (Preparation of Red Pigment Dispersion) A mixture of 5.25 parts by mass of C.I. Pigment Red 254, 5.25 parts by mass of C.I. Pigment Red 272, 4.5 parts by mass of C.I. Pigment Yellow 139, 17 parts by mass of Resin B-7 as a dispersant, 1.3 parts by mass of Derivative Y-1 as a pigment derivative, and 66.7 parts by mass of propylene glycol monomethyl ether acetate (PGMEA) was mixed and dispersed for 3 hours using a bead mill (zirconia beads 0.3 mm diameter). Thereafter, the mixture was further mixed and dispersed at 2000 kg / cm using a high-pressure disperser NANO-3000-10 (manufactured by Japan BEE Co., Ltd.) equipped with a pressure reducing mechanism. ２ The dispersion treatment was carried out under a pressure of 1000 kJ / min at a flow rate of 500 g / min. This dispersion treatment was repeated 10 times to obtain a red pigment dispersion liquid.

[0249] (Production of Green Pigment Dispersion) A mixture of 9 parts by mass of C.I. Pigment Green 36, 6 parts by mass of C.I. Pigment Yellow 150, 16.7 parts by mass of Resin B-7 as a dispersant, 2.5 parts by mass of Derivative Y-2 as a pigment derivative, and 65.8 parts by mass of PGMEA was mixed and dispersed for 3 hours using a bead mill (zirconia beads 0.3 mm diameter). Thereafter, the mixture was further mixed and dispersed at 2000 kg / cm using a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) equipped with a pressure reducing mechanism. ２ The dispersion treatment was carried out under a pressure of 1000 kJ / min at a flow rate of 500 g / min. This dispersion treatment was repeated 10 times to obtain a green pigment dispersion.

[0250] (Production of Blue Pigment Dispersion) A mixture of 12 parts by mass of C.I. Pigment Blue 15:4, 3 parts by mass of C.I. Pigment Violet 23, 16 parts by mass of Resin B-2 as a dispersant, 2.7 parts by mass of Derivative Y-2 as a pigment derivative, and 66.3 parts by mass of PGMEA as a solvent was mixed and dispersed for 3 hours using a bead mill (zirconia beads 0.3 mm diameter). Thereafter, the mixture was further mixed and dispersed at 2000 kg / cm using a high-pressure disperser NANO-3000-10 (manufactured by Japan BEE Co., Ltd.) equipped with a pressure reducing mechanism. ２ The dispersion treatment was carried out under a pressure of 1000 psi and a flow rate of 500 g / min. This dispersion treatment was repeated 10 times to obtain a blue pigment dispersion.

[0251] Details of the raw materials listed above with their abbreviations are as follows:

[0252] (Dispersant) Resin B-2: 30 mass % PGMEA solution of a resin having the following structure (the number attached to the main chain is the molar ratio, and the number attached to the side chain is the number of repeating units; weight average molecular weight 21,000, acid value 129 mg KOH / g). Resin B-7: 30 mass % PGMEA solution of a resin having the following structure (the number attached to the main chain is the molar ratio, and the number attached to the side chain is the number of repeating units; weight average molecular weight 24,000, acid value 52 mg KOH / g).

[0253] (Pigment derivatives) Derivatives Y-1 and Y-2: Compounds having the following structures

[0254] <Preparation of Compositions for Forming Resist Films> The raw materials shown in the table below were mixed in the ratios (parts by mass) shown in the table, and then filtered through a nylon filter with a pore size of 0.45 μm (manufactured by Nippon Pall Corporation, DFA4201NXEY) to prepare compositions for forming resist films (photosensitive compositions 1 to 35, c1).

[0255]

[0256] <Production of pixel-forming compositions> The raw materials shown in the table below were mixed in the ratios (parts by mass) shown in the table, and then filtered through a nylon filter with a pore size of 0.45 μm (DFA4201NXEY, manufactured by Nihon Pall Co., Ltd.) to produce each of the pixel-forming compositions (pixel-forming compositions R1 to R3, G1 to G3, B1 to B3). The value of the content of the colorant (total content of pigment and derivative) in the total solids content of each pixel-forming composition is recorded in the colorant concentration column.

[0257]

[0258] <Production of partition wall forming composition> The components were mixed to obtain the composition shown in the table below, and filtered using a nylon filter with a pore size of 0.45 μm (manufactured by Nippon Pall Corporation, DFA4201NXEY) to obtain a partition wall forming composition. The blending amounts shown in the table below are in parts by mass. The blending amount of the silica particle liquid was determined by the amount of SiO in the silica particle liquid. ２ The value of the amount of solvent is the total amount of solvent contained in the silica particle liquid.

[0259]

[0260] Details of the materials indicated by the abbreviations in the table above are as follows:

[0261] (Curable Compounds) M-1 to M-16: Compounds (M-1) to (M-16) synthesized above E-1: EHPE3150 (manufactured by Daicel Corporation) T-1: KAYARAD DPHA (mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate, manufactured by Nippon Kayaku Co., Ltd.)

[0262] (Pigment dispersions) Red pigment dispersion: the red pigment dispersion prepared above. Green pigment dispersion: the green pigment dispersion prepared above. Blue pigment dispersion: the blue pigment dispersion prepared above.

[0263] (Resins) B-1: A 30 mass % PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y=41 / 59 (mol %), weight average molecular weight 21000, acid value 55 mgKOH / g). B-2: A 30 mass % PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y=21 / 79 (mol %), weight average molecular weight 21000, acid value 129 mgKOH / g). B-3: A 30 mass % PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y=72 / 28 (mol %), weight average molecular weight 21000, acid value 16 mgKOH / g). B-4: 30% by mass PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y = 13.5 / 86.5 (mol%), weight average molecular weight 21000, acid value 192 mgKOH / g). B-5: 30% by mass PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y = 84 / 16 (mol%), weight average molecular weight 21000, acid value 8 mgKOH / g). B-6: 30% by mass PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y = 11.5 / 88.5 (mol%), weight average molecular weight 21000, acid value 218 mgKOH / g). B-7: 30% by mass PGMEA solution of a resin having the following structure (the numbers attached to the main chain are molar ratios, and the numbers attached to the side chains are the numbers of repeating units. x / y=39 / 61 (mol %), weight average molecular weight 24,000, acid value 52 mgKOH / g)

[0264] (Photopolymerization initiators) I-1 to I-4: Compounds having the following structures

[0265] (Surfactants) W-1: A solution prepared by diluting KF-6001 (carbinol-modified polydimethylsiloxane, manufactured by Shin-Etsu Chemical Co., Ltd.) with PGMEA to a solids concentration of 1% by mass. W-2: A solution prepared by diluting KF-6001 (carbinol-modified polydimethylsiloxane, manufactured by Shin-Etsu Chemical Co., Ltd.) with PGMEA to a solids concentration of 0.1% by mass.

[0266] (Polymerization inhibitor) H-1: p-methoxyphenol

[0267] (Solvent) S-1: Propylene glycol monomethyl ether acetate S-2: Cyclopentanone S-3: 1,4-butanediol diacetate S-4: Propylene glycol monomethyl ether S-5: Ethanol, methanol or a mixture thereof S-6: Water

[0268] (Silica particle liquid) P-1: A solution of silica particles (beaded silica) in which a plurality of spherical silica particles having an average particle diameter of 15 nm are connected in a beaded shape by metal oxide-containing silica (connecting material). Note that in the silica particle liquid P-1, the average particle diameter of the spherical silica particles was determined by calculating the number average of the circle-equivalent diameters of the projected images of the spherical portions of 50 spherical silica particles measured by a transmission electron microscope (TEM). Furthermore, in the silica particle liquid P-1, it was examined by TEM observation whether the silica particles were in a beaded shape.

[0269] <Production of Silicon Wafer with Partition Wall> A silicon wafer with a diameter of 8 inches (20.32 cm) and a silicon photodiode formed thereon was used as a support. The partition wall-forming composition prepared above was spin-coated on the surface of the silicon wafer on which the silicon photodiode was formed, and the resulting layer was heated using a hot plate at 100°C for 2 minutes, and then at 230°C for 2 minutes to form a partition wall material layer with a thickness of 0.5 μm. An antireflective coating composition (DUV42P, manufactured by Brewer Science) was then spin-coated on the partition wall material layer to a thickness of 64 nm after baking, and the layer was heated at 200°C for 1 minute and cooled to 23°C to form an antireflective coating. Next, a positive photoresist (FFPS-0283, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was spin-coated and heated at 90°C for 1 minute to form a photoresist layer with a thickness of 0.8 μm. Next, a KrF scanner exposure machine (FPA6300ES6a, manufactured by Canon Inc.) was used to expose the sample to 16 J / cm 2 through a mask. ２ After exposure at an exposure dose of 100°C, a heat treatment was carried out for 1 minute at 100°C. Thereafter, development treatment was carried out for 1 minute with a developer (FHD-5, manufactured by FUJIFILM Electronic Materials Co., Ltd.), followed by a heat treatment for 1 minute at 100°C to form a mesh-like pattern with a line width of 0.12 μm and a pitch width of 1 μm. This pattern was used as a photomask and patterned by a dry etching method under the conditions described in paragraphs 0129 to 0130 of JP 2016-014856 A, to form partition walls with a width of 0.12 μm and a height of 0.5 μm in a grid pattern at 1 μm intervals to form partition walls. The dimensions of the opening of the partition wall on the silicon wafer (the area equivalent to one pixel separated by the partition wall on the silicon wafer) are 0.88 μm long x 0.88 μm wide, and together with the width of the partition wall of 0.12 μm, this is defined as a 1.0 μm pixel size in this example.

[0270] Examples 1 to 40, Comparative Example 1 A photosensitive composition shown in the table below was applied by spin coating onto the support having the partition walls formed above, and then heated at 100°C for 2 minutes using a hot plate to form a photosensitive composition layer with a thickness of 0.6 μm. Next, using an i-line stepper exposure device (FPA-3000i5+, manufactured by Canon Corporation), 1000 mJ / cm was applied to the area other than the area where the first pixel was to be formed through a mask having 1.0 μm square openings (1.0 μm pixel, partition wall width between pixels: 0.12 μm, partition wall inner diameter: 0.88 μm) in a Bayer array. ２ The photosensitive composition layer was exposed to an exposure dose of 100 ppm. Next, the photosensitive composition layer was subjected to puddle development at 23°C for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), and the unexposed portions of the photosensitive composition layer were developed and removed. The layer was then rinsed with a spin shower and washed with pure water, and further heated on a hot plate at 180°C for 15 minutes to form a 0.5 μm thick and 1.0 μm square resist film (1.0 μm pixel, partition width between resist films: 0.12 μm, partition inner diameter: 0.88 μm) within the area surrounded by the partition walls on the support, except for the area where the first pixel was to be formed. Next, a pixel-forming composition listed in the table below was applied by spin coating to form a pixel-forming composition layer. The layer was then heated on a hot plate at 100°C for 2 minutes, and then at 160°C for 5 minutes to harden the pixel-forming composition layer. Next, puddle development was performed using a 0.3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH) at 23°C for 60 seconds to develop and remove the resist film from the support, and the pixel-forming composition layer formed on the resist film was removed from the support. Thereafter, rinsing with a spin shower and washing with pure water were performed, and the wafer was dried by rotating at 2000 rpm for 30 seconds, thereby forming first pixels (1.0 µm pixels, partition wall width between pixels: 0.12 µm, partition wall inner diameter: 0.88 µm) having a thickness of 0.5 µm and an area of ​​1.0 µm square on the support within the region surrounded by the partition walls.

[0271] For the support on which the first pixels were formed, residue in the non-image areas was observed using a high-resolution FEB (Field Emission Beam) length measuring device (HITACHI CD-SEM) S9380II (manufactured by Hitachi High-Technologies Corporation), and the residue was evaluated according to the following evaluation criteria. -Evaluation criteria- A: No residue was observed. B: Residue was observed in an area of ​​more than 0% but less than 10% of the non-image area. C: Residue was observed in an area of ​​10% or more but less than 20% of the non-image area. D: Residue was observed in an area of ​​20% or more but less than 30% of the non-image area. E: Residue was observed in an area of ​​30% or more of the non-image area.

[0272] Examples 41 to 43 Using the photosensitive compositions shown in the table below, resist films with thicknesses of 0.5 μm and 1.0 μm square (1.0 μm pixel, partition wall width between resist films: 0.12 μm, partition wall inner diameter: 0.88 μm) were formed on the support having the partition walls formed above in the same manner as in the Examples, within the regions on the support surrounded by the partition walls, except for the regions where first pixels were to be formed. Next, a pixel-forming composition shown in the table below was applied by spin coating to form a pixel-forming composition layer. The layer was then heated at 100°C for 2 minutes using a hot plate. Next, using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Inc.), a 1.0 μm square opening (1.0 μm pixel, partition wall width between pixels: 0.12 μm, partition wall inner diameter: 0.88 μm) was exposed to 1000 mJ / cm . ２ The resist film was exposed to light at a wavelength of 365 nm at an exposure dose of 0.3 wt %. Next, puddle development was performed using a 0.3 wt % aqueous solution of tetramethylammonium hydroxide (TMAH) at 23° C. for 60 seconds to develop and remove the resist film from the support, and the pixel-forming composition layer formed on the resist film was removed from the support. The resist film was then rinsed with a spin shower and washed with pure water, and heated on a hot plate at 200° C. for 5 minutes to form first pixels (1.0 μm pixels, partition wall width between pixels: 0.12 μm, partition wall inner diameter: 0.88 μm) with a thickness of 0.5 μm and 1.0 μm square in the region surrounded by the partition walls on the support.

[0273] For the support on which the first pixels were formed, residues in non-image areas were observed using a high-resolution FEB (Field Emission Beam) length measuring device (HITACHI CD-SEM) S9380II (manufactured by Hitachi High-Technologies Corporation), and the residues were evaluated according to the above-mentioned evaluation criteria.

[0274]

[0275] As shown in the table above, the Examples were superior to the Comparative Examples in the residue evaluation.

[0276] Example 44 Photosensitive Composition 9 was applied by spin coating onto the support on which the first pixels prepared in Example 9 had been formed, and then heated at 100°C for 2 minutes using a hot plate to form a photosensitive composition layer with a thickness of 0.6 μm. Next, using an i-line stepper exposure device (FPA-3000i5+, manufactured by Canon Corporation), 1000 mJ / cm was applied to the area other than the area where the second pixels were to be formed, through a mask having 1.0 μm square openings (1.0 μm pixels, partition wall width between pixels: 0.12 μm, partition wall inner diameter: 0.88 μm) in a Bayer array. ２The pattern-forming composition layer was exposed to an exposure dose of 1000 ppm. Next, the pattern-forming composition layer was subjected to puddle development at 23°C for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), and the unexposed portions of the photosensitive composition layer were developed and removed. The layer was then rinsed with a spin shower and washed with pure water, and further heated on a hot plate at 180°C for 15 minutes to form a 0.5 μm thick and 1.0 μm square resist film (1.0 μm pixel, partition width between resist films: 0.12 μm, partition inner diameter: 0.88 μm) within the area surrounded by the partitions on the support, except for the area where the second pixel was to be formed. Next, pixel-forming composition R1 was applied by spin coating to form a pixel-forming composition layer. The layer was then heated on a hot plate at 100°C for 2 minutes, and then at 160°C for 5 minutes to harden the pixel-forming composition layer. Next, puddle development was performed using a 0.3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH) at 23°C for 60 seconds to develop and remove the resist film from the support, and the pixel-forming composition layer formed on the resist film was removed from the support. Thereafter, rinsing with a spin shower and washing with pure water were performed, and the wafer was dried by rotating it at 2000 rpm for 30 seconds, thereby forming second pixels (1.0 µm pixels, partition wall width between pixels: 0.12 µm, partition wall inner diameter: 0.88 µm) having a thickness of 0.5 µm and an area of ​​1.0 µm square on the support within the region surrounded by the partition walls. The support on which the second pixels had been formed was observed for residues on the first pixels and residues in non-image areas using a high-resolution FEB (Field Emission Beam) length measuring device (HITACHI CD-SEM) S9380II (manufactured by Hitachi High-Technologies Corporation), and no residues were found.

[0277] Example 45 Photosensitive composition 9 was applied by spin coating onto the support on which the first and second pixels prepared in Example 44 had been formed, and then heated at 100°C for 2 minutes using a hot plate to form a photosensitive composition layer with a thickness of 0.6 μm. Next, using an i-line stepper exposure device (FPA-3000i5+, manufactured by Canon Corporation), 1000 mJ / cm was applied to the area other than the area where the third pixel was to be formed through a mask having 1.0 μm square openings (1.0 μm pixel, partition wall width between pixels: 0.12 μm, partition wall inner diameter: 0.88 μm) in a Bayer array. ２The pattern-forming composition layer was exposed to an exposure dose of 1000 ppm. Next, the pattern-forming composition layer was subjected to puddle development at 23°C for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH), and the unexposed portions of the photosensitive composition layer were developed and removed. The layer was then rinsed with a spin shower and washed with pure water, and further heated on a hot plate at 180°C for 15 minutes to form a 0.5 μm thick and 1.0 μm square resist film (1.0 μm pixel, partition width between resist films: 0.12 μm, partition inner diameter: 0.88 μm) within the area surrounded by the partitions on the support, except for the area where the third pixel was to be formed. Next, pixel-forming composition B1 was applied by spin coating to form a pixel-forming composition layer. The layer was then heated on a hot plate at 100°C for 2 minutes, and then at 160°C for 5 minutes to harden the pixel-forming composition layer. Next, puddle development was performed using a 0.3 mass% aqueous solution of tetramethylammonium hydroxide (TMAH) at 23°C for 60 seconds to develop and remove the resist film from the support, and the pixel-forming composition layer formed on the resist film was removed from the support. Thereafter, rinsing with a spin shower and washing with pure water were performed, and the wafer was dried by rotating it at 2000 rpm for 30 seconds, thereby forming third pixels (1.0 µm pixels, partition wall width between pixels: 0.12 µm, partition wall inner diameter: 0.88 µm) having a thickness of 0.5 µm and a size of 1.0 µm square on the support within the region surrounded by the partition walls. The support on which the third pixels had been formed was observed for residues on the first pixels and residues on the second pixels using a high-resolution FEB (Field Emission Beam) length measurement device (HITACHI CD-SEM) S9380II (manufactured by Hitachi High-Technologies Corporation), and no residues were found.

[0278] 10: Support 20: Partition wall 30: Photosensitive composition layer 31: Resist film 40: Pixel-forming composition layer 41: Pixel

Claims

1. A method for producing an optical filter, comprising the steps of: applying a photosensitive composition containing a compound represented by formula (1), a photopolymerization initiator, and a solvent onto a support to form a photosensitive composition layer; exposing a part of the photosensitive composition layer; removing an unexposed part of the photosensitive composition layer using a first alkaline developer to form a resist film; heating the resist film to denature it and solubilize it in a second alkaline developer; applying a pixel-forming composition containing a colorant and a curable compound onto the support and the resist film to form a pixel-forming composition layer; curing the pixel-forming composition layer; and removing the resist film from the support using the second alkaline developer; In formula (1), R １ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; L １ represents a single bond or a divalent linking group; X １ represents a group represented by formula (X1) or formula (X2); １ represents an n-valent linking group, n represents an integer of 2 to 6, １ When is a group represented by formula (X2), L １ is a divalent linking group; In formula (X1), R １１ and R １２ Each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). ２１ represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1).

2. The method for manufacturing an optical filter according to claim 1, wherein the support is provided with a partition wall.

3. A method for producing an optical filter as described in claim 1 or 2, wherein the support is provided with first pixels containing a colorant, and in the step of exposing a portion of the photosensitive composition layer, the photosensitive composition layer formed on the first pixels is exposed, and in the step of forming a resist film, the unexposed portions of the photosensitive composition layer are removed using the first alkaline developer to form the resist film at least on the first pixels.

4. X in the formula (1) １ The method for producing an optical filter according to claim 1 or 2, wherein:

5. L in the formula (1) １ The method for producing an optical filter according to claim 1 or 2, wherein is a divalent linking group.

6. The method for producing an optical filter according to claim 1 or 2, wherein the compound represented by formula (1) is a compound represented by formula (1a); In formula (1a), R １ａ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ａ and R １２ａ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ａ represents a divalent linking group; １ａ represents an n-valent linking group, and n represents an integer of 2 to 6.

7. The method for producing an optical filter according to claim 1 or 2, wherein the photosensitive composition further contains a resin having an acid value of 10 to 200 mgKOH / g.

8. The method for producing an optical filter according to claim 1 or 2, wherein the photopolymerization initiator includes an oxime compound.

9. The method for producing an optical filter according to claim 1 or 2, wherein the content of the coloring material in the total solid content of the pixel-forming composition is 60 mass % or more.

10. A photosensitive composition for use in the method for producing an optical filter according to claim 1, comprising a compound represented by formula (1), a photopolymerization initiator, and a solvent; In formula (1), R １ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; L １ represents a single bond or a divalent linking group; X １ represents a group represented by formula (X1) or formula (X2); １ represents an n-valent linking group, n represents an integer of 2 to 6, １ When is a group represented by formula (X2), L １ is a divalent linking group; In formula (X1), R １１ and R １２ Each independently represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1). ２１ represents a hydrocarbon group having 1 to 10 carbon atoms, and * represents a linking site in formula (1).

11. A compound represented by formula (1a); In formula (1a), R １ａ represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms; R １１ａ and R １２ａ each independently represents a hydrocarbon group having 1 to 10 carbon atoms; １ａ represents a divalent linking group; １ａ represents an n-valent linking group, and n represents an integer of 2 to 6.

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