Wire-aligning apparatus

Abstract

A wire-aligning apparatus is provided. The wire-aligning apparatus according to an aspect of the present invention may comprise: an aligning unit, which can align a first portion of a first wire electrically connected to a first cell, with a second portion of a second wire electrically connected to a second cell, so as to be parallel on one surface of the second cell; a moving unit, which can move the aligning unit to the one surface of the second cell; and a controller for controlling the aligning unit and the moving unit.

Description

Wire alignment device

[0001] The present invention relates to a wire alignment device, and more particularly, to a wire alignment device for aligning wires coupled to one cell and wires coupled to another cell in parallel in order to solder the wires coupled to one cell to another adjacent cell.

[0002] A solar panel is a flat-panel device integrated with elements that convert light energy into electrical energy. These panels are typically manufactured in modular form and installed in a designated location, where they generate electrical energy using sunlight shining on the ground.

[0003] Typically, solar panels are manufactured by joining together at least one cell assembly. A cell assembly comprises a plurality of unit cells (hereinafter referred to as "cells") arranged in a predetermined manner and a plurality of wires for electrically connecting adjacent cells. Typically, the cells are provided as flat-plate components, and the wires are joined to one surface of the cells.

[0004] At this time, a soldering process is primarily used to connect the cells and wires of the cell assembly. This process allows for the formation of a soldering area surrounding a portion of the wire on one side of the cell. If necessary, multiple soldering areas may be provided along the wire on one side of the cell.

[0005] Meanwhile, after a cell assembly is manufactured, defects may be discovered in the cells that make up the cell assembly. It is desirable to repair such cell assemblies. To repair a cell assembly, the defective cell is typically replaced with a good cell.

[0006] The repair process for a cell assembly as described above can be broadly divided into four steps. First, the wire that electrically connects the defective cell to its neighboring cell is detached from the defective cell. Then, the wire is cut, thereby separating the defective cell from the cell assembly. Next, the defective cell is removed, and a good cell is supplied in its place. Finally, the replaced cell and its neighboring cell are electrically connected using the wire.

[0007] At this time, a resoldering process is typically performed to form a new solder joint surrounding the wire on one side of the cell to bond the wire to the cell. Furthermore, prior to performing the resoldering process, a process is performed to align the wire of the replaced cell with the wire of the neighboring cell so that they are parallel to each other. This is to ensure that the two wires are closely aligned and parallel to each other to form a proper solder joint, thereby ensuring proper electrical connection between the two cells.

[0008] However, traditionally, this wire alignment process required workers to manually align the wires using a special gripping tool, such as tweezers. This traditional wire alignment process was labor-intensive, made it difficult to achieve consistent quality during the repair process, and further increased the manufacturing cost of solar panels.

[0009] Accordingly, there has been an urgent need for the development of a wire alignment device that can minimize the labor required for the repair process of cell assemblies, achieve uniformity in repair quality, and reduce the manufacturing cost of solar cells by automatically performing the process of aligning wires to cells.

[0010] The present invention has been devised in consideration of the above points, and an object of the present invention is to provide a wire alignment device capable of automatically aligning wires for electrically connecting neighboring cells.

[0011] Another object of the present invention is to provide a wire alignment device capable of quickly aligning multiple wires provided on one side of a cell.

[0012] Another object of the present invention is to provide a wire alignment device capable of accurately aligning wires with uniform quality.

[0013] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0014] According to one aspect of the present invention, a wire alignment device is provided, comprising: an alignment unit capable of aligning a first portion of a first wire electrically connected to a first cell and a second portion of a second wire electrically connected to a second cell in parallel on one surface of the second cell; a movement unit capable of moving the alignment unit on the one surface of the second cell; and a controller for controlling the alignment unit and the movement unit.

[0015] A wire alignment device according to one aspect of the present invention is configured such that a pair of grippers of an alignment unit move relatively toward each other and bring a first part of a first wire and a second part of a second wire placed therebetween into close contact with each other in parallel, so that wires can be automatically aligned without separate human labor input.

[0016] A wire alignment device according to one aspect of the present invention comprises an alignment unit including a plurality of pairs of grippers, each of the plurality of pairs of grippers being configured to align a pair of first wires and second wires in parallel with each other, so that a plurality of first and second wires placed on a cell can be aligned in parallel at one time, thereby enabling a plurality of wires to be aligned quickly.

[0017] A wire alignment device according to one aspect of the present invention is configured such that an alignment unit and a moving unit for moving the same are systematically and uniformly controlled by a controller to align wires, so that cell assemblies can be repaired consistently with uniform quality.

[0018] A wire alignment device according to one aspect of the present invention comprises a first alignment frame and a second alignment frame, the alignment unit being operated by an actuator, a plurality of first grippers protruding from the first alignment frame, and a second gripper protruding from the second alignment frame, so that multiple pairs of grippers can be operated with a small number of actuators, and thus the structure is simple, maintenance is easy, and operation can be performed at a low cost.

[0019] In a wire alignment device according to one aspect of the present invention, an alignment frame of an alignment unit extends outward, and a plurality of grippers are provided along a peripheral portion of the alignment frame in the extension direction, so that when the peripheral portion of the alignment frame or the gripper touches a cell, the alignment frame can bend, thereby minimizing damage to the cell caused by the gripper or the alignment frame.

[0020] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings.

[0021] FIG. 1 and FIG. 2 are perspective views from different angles showing a wire alignment-soldering system according to one embodiment of the present invention installed next to a workbench on which a cell assembly is placed.

[0022] FIG. 3 is a schematic diagram of a wire alignment-soldering system according to one embodiment of the present invention.

[0023] Figure 4 is an enlarged view of part A of Figure 1.

[0024] FIG. 5 is a side view of a portion of a cell assembly that may be a workpiece of a wire alignment-soldering system according to one embodiment of the present invention.

[0025] FIGS. 6 and 7 are perspective views of the alignment unit of the wire alignment-soldering system according to one embodiment of the present invention viewed from different angles.

[0026] Figure 8 is an exploded perspective view of the alignment unit illustrated in Figure 7.

[0027] Fig. 9 is a cross-sectional view according to II of Fig. 6. At this time, cross-sections of the first part of the first wire and the second part of the second wire are shown together for the purpose of explaining the invention.

[0028] FIG. 10 is a drawing for explaining the process of aligning the first wire and the second wire as the pair of grippers illustrated in FIG. 9 are operated.

[0029] FIG. 11 is a drawing for explaining a modified example of a pair of grippers of a wire alignment-soldering system according to one embodiment of the present invention.

[0030] FIGS. 12 and 13 are perspective views of a soldering unit of a wire alignment-soldering system according to one embodiment of the present invention viewed from different angles.

[0031] FIG. 14 is a rear view of a soldering unit of a wire alignment-soldering system according to one embodiment of the present invention.

[0032] Figure 15 is a flowchart of a wire alignment-soldering method according to one embodiment of the present invention.

[0033] Figure 16 is a flowchart detailing step S200 of Figure 15.

[0034] FIG. 17 and FIG. 18 are drawings for explaining a process in which an alignment unit of a wire alignment-soldering device according to one embodiment of the present invention is placed on one side of a cell.

[0035] FIG. 19 is a drawing for explaining a process in which a first wire and a second wire are aligned by an alignment unit of a wire alignment-soldering device according to one embodiment of the present invention.

[0036] Figure 20 is a flowchart detailing step S300 of Figure 15.

[0037] FIG. 21 and FIG. 22 are drawings for explaining a process in which a soldering unit of a wire alignment-soldering device according to one embodiment of the present invention is arranged on one side of a cell so as to be able to solder either one of two unit groups.

[0038] FIG. 23 and FIG. 24 are drawings for explaining the process in which the first wire and the second wire are brought into close contact with the cell as the pressurizing frame of the soldering unit illustrated in FIG. 22 is operated.

[0039] FIG. 25 is a drawing for explaining a process in which a first wire and a second wire, which are in close contact with a cell, are soldered to the cell by a soldering device of the soldering unit illustrated in FIG. 22.

[0040] FIG. 26 is a drawing for explaining a process in which the soldering unit illustrated in FIG. 22 is placed on one side of a cell so that it can solder either of the remaining two unit groups.

[0041] FIG. 27 is a drawing for explaining a process in which the alignment unit illustrated in FIG. 17 and the soldering unit illustrated in FIG. 22 are placed on one side of another cell to solder other wires.

[0042] According to one aspect of the present invention, a wire alignment device is provided, comprising: an alignment unit capable of aligning a first portion of a first wire electrically connected to a first cell and a second portion of a second wire electrically connected to a second cell in parallel on one surface of the second cell; a movement unit capable of moving the alignment unit on the one surface of the second cell; and a controller for controlling the alignment unit and the movement unit.

[0043] At this time, the alignment unit may include a support frame that can be moved by the movement unit; and a first gripper provided on one side of the support frame to be movable in a direction parallel to one side of the second cell, and a second gripper spaced apart from one side of the first gripper, so as to be relatively movable in a direction approaching each other.

[0044] At this time, the second gripper may be configured to be movable relative to the first gripper.

[0045] At this time, the alignment unit may include an actuator supported by the support frame to move the first gripper.

[0046] At this time, the first wire and the second wire are each provided in multiple numbers, and the pair of grippers are provided in multiple numbers, so that they can be configured to align a pair of the first and second wires that are adjacent to each other among the plurality of first and second wires.

[0047] At this time, the alignment unit includes a first alignment frame coupled to one side of the support frame so as to be movable in a direction parallel to one side of the second cell, and the plurality of first grippers can protrude from one side of the first alignment frame.

[0048] At this time, the plurality of first grippers may be spaced apart from each other along the direction in which the plurality of first wires are arranged.

[0049] At this time, the first alignment frame includes a first alignment coupling portion coupled to the support frame; and a first alignment extension portion connected to the first alignment coupling portion and extending in a direction away from the support frame, and the plurality of first grippers may be positioned on one surface of the outer surface of the first alignment extension portion facing the second cell.

[0050] At this time, the first alignment extension is provided in a flat shape parallel to the second cell, and the plurality of first grippers can be spaced apart along the periphery of the first alignment extension.

[0051] At this time, the plurality of first grippers may be provided on a side of the first alignment extension portion facing the first alignment coupling portion.

[0052] At this time, the alignment unit includes a second alignment frame coupled to the other side of the support frame, and the plurality of second grippers can protrude from one side of the second alignment frame.

[0053] At this time, the second alignment frame includes a second alignment coupling portion coupled to the other side of the support frame; and a second alignment extension portion having a flat plate shape extended from the second alignment coupling portion so as to be parallel to the second cell and disposed on one surface of the first alignment extension portion, and the plurality of second grippers may be provided along the periphery of the second alignment extension portion.

[0054] At this time, the pair of grippers may have a thickness in a direction perpendicular to the second cell that is smaller than a diameter of at least one of the first portion and the second portion.

[0055] At this time, the first gripper may include a first alignment surface that can come into contact with at least one of the first portion and the second portion in order to align the first wire and the second wire, and the first alignment surface may be configured to be inclined in a direction away from the second gripper as it goes toward the second cell side.

[0056] At this time, the first alignment surface can extend in a direction parallel to the second wire.

[0057] At this time, the second gripper may include a second alignment surface that can come into contact with at least one of the first portion and the second portion in order to align the first wire and the second wire, and the second alignment surface may be configured to be inclined in a direction away from the first gripper as it goes toward the second cell.

[0058] At this time, the moving unit may be configured to move the alignment unit in a direction in which the first cell and the second cell are arranged and in a direction perpendicular to the second cell.

[0059] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0060] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0061] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0062] FIG. 1 and FIG. 2 are perspective views of a wire alignment-soldering system according to an embodiment of the present invention, viewed from different angles, with the system installed next to a workbench on which a cell assembly is placed. FIG. 3 is a schematic diagram of a wire alignment-soldering system according to an embodiment of the present invention. FIG. 4 is an enlarged view of A in FIG. 1. FIG. 5 is a side view of a portion of a cell assembly that can be a target of a wire alignment-soldering system according to an embodiment of the present invention.

[0063] A wire alignment-soldering system according to one embodiment of the present invention is a system for electrically and physically connecting one cell of a cell assembly to other neighboring cells by aligning and soldering wires on the cells.

[0064] Before describing a wire alignment-soldering system according to one embodiment of the present invention, a cell assembly and its components that can be a work target of the wire alignment-soldering system according to one embodiment of the present invention will be briefly described with reference to FIGS. 1 to 5.

[0065] In the present disclosure, a cell (P) refers to a flat-shaped member that performs a predetermined electrical function. As an example, the cell (P) may be a PV cell that produces electrical energy using solar light energy incident on one side, but is not limited thereto.

[0066] In the present disclosure, a wire (W) refers to a conductive member that is thin and long in one direction. As an example, the wire (W) may be a single metal wire having a predetermined conductivity, but is not limited thereto.

[0067] At this time, the wire (W) can electrically connect two neighboring cells (P) to each other. To this end, one side and the other side of the wire (W) can be electrically coupled to two neighboring cells (P), respectively.

[0068] Here, the wire (W) can be electrically connected to the cell (P) by a soldering portion (S) provided on one surface of the cell (P). The soldering portion (S) is a lump formed by solidifying molten metal and can surround at least a portion of the wire (W). As an example, the soldering portion (S) can be made of lead (Pb) or silver (Ag), but is not limited thereto.

[0069] In the present disclosure, a cell assembly (3) means an assembly composed of a plurality of cells (P) arranged in a predetermined manner and a plurality of wires (W) electrically connecting the plurality of cells (P) to each other.

[0070] At this time, the manner in which the plurality of cells (P) are arranged and connected in the cell assembly (3) is not particularly limited. As an example, as shown in FIGS. 1 to 5, the plurality of cells (P) may be arranged in parallel along the X-axis direction and connected in series by wires (W), but is not limited thereto, and the plurality of cells (P) may be arranged in a grid shape or connected in parallel by wires (W).

[0071] At this time, there may be at least one wire connecting two neighboring cells. For example, as illustrated in FIGS. 1 to 4, there may be twelve wires (W) connecting neighboring cells (P). Furthermore, the twelve wires (W) connecting neighboring cells (P) may be spaced apart from each other along the Y-axis.

[0072] Meanwhile, during the manufacturing process of the cell assembly (3), there are cases where a process must be performed to electrically and physically connect one cell (P) to other cells (P). An example of such a process may be a repair process of the cell assembly (3).

[0073] When a defective cell is detected among the cells (P) of the cell assembly (3), the cell assembly (3) needs to be repaired. Generally, to repair the cell assembly (3), the defective cell is first removed and a good replacement cell is placed in its place.

[0074] When the three cells (P) illustrated in FIGS. 4 and 5 are named as the first cell (P1), the second cell (P2), and the third cell (P3) along the negative direction of the X-axis, respectively, the second cell (P) may be a replacement cell of a good product. This replacement cell may still be electrically and physically separated from the other cells.

[0075] Referring to the enlarged portion of FIG. 4 and FIG. 5, it can be confirmed that the first wire (W1) coupled to the first cell (P1) and the second wire (W2) coupled to the second cell (P2) are separated from each other, and the first wire (W1) coupled to the second cell (P2) and the second wire (W2) coupled to the third cell (P3) are separated from each other, so that the first to third cells (P1 to P3) are not physically and electrically connected to each other.

[0076] Next, when a defective cell is removed from the cell assembly (3) and a good replacement cell is placed in its place, the replacement cell can be physically and electrically connected to other neighboring cells (P).

[0077] Accordingly, the cell assembly (3) can be repaired, and the wire alignment-soldering system (1) according to one embodiment of the present invention can perform a process of physically and electrically connecting the second cell (P2), which is a replacement cell, with the neighboring first cell (P1) and third cell (P3).

[0078] Of course, the repair process of the cell assembly (3) described above is only one example of a process to which the wire alignment-soldering system (1) according to one embodiment of the present invention can be applied, and the process to which the wire alignment-soldering system (1) according to one embodiment of the present invention can be applied is not limited to the above-described process.

[0079] Hereinafter, each component of a wire alignment-soldering system according to an embodiment of the present invention will be specifically described. Referring to FIGS. 1 to 3, a wire alignment-soldering system (1) according to an embodiment of the present invention may include a wire alignment device (100), a soldering device (200), and a controller (300).

[0080] In this embodiment, the wire alignment device (100) is a device for aligning a first part (WP1) of a first wire (W1) and a second part (WP2) of a second wire (W2), which are arranged misaligned from each other, adjacent and parallel to each other, as illustrated in FIG. 4. The first part (WP1) and the second part (WP2) will be described in detail later.

[0081] In this embodiment, the soldering device (200) is a device for soldering a first portion (WP1) of a first wire (W1) and a second portion (WP2) of a second wire (W2) to a cell (P), as illustrated in FIG. 4. Accordingly, a first cell (P1) to which the first wire (W1) is connected can be electrically and physically connected to a second cell (P2).

[0082] And, in this embodiment, the controller (300) is configured to control the wire alignment device (100) and the soldering device (200). This controller (300) may be implemented using an electrical circuit processed by hardware, or may be implemented by a processor, a central processing unit (CPU), a controller, an arithmetic logic unit, an operational logic circuit, a digital signal processing device, a microcomputer, an FPGA, a system on a chip (SoC), a programmable logic unit, a microprocessor, or any device capable of performing the functions described below.

[0083] In this way, the wire alignment-soldering system (1) according to one embodiment of the present invention can electrically and physically connect neighboring cells without inputting separate human labor, since the wire alignment device (100) and the soldering device (200) automatically align and solder wires on the cells (P).

[0084] Furthermore, in a wire alignment-soldering system (1) according to one embodiment of the present invention, since the wire alignment device (100) and the soldering device (200) are controlled systematically and consistently by the controller (300), the wire alignment and soldering process can be performed uniformly and accurately with high quality.

[0085] (1) Wire alignment device

[0086] Hereinafter, a wire alignment device according to an embodiment of the present invention will be described in detail. FIGS. 6 and 7 are perspective views of an alignment unit of a wire alignment-soldering system according to an embodiment of the present invention viewed from different angles. FIG. 8 is an exploded perspective view of the alignment unit illustrated in FIG. 7. FIG. 9 is a cross-sectional view according to II of FIG. 6. At this time, cross-sections of a first portion of a first wire and a second portion of a second wire are illustrated together for the purpose of explaining the invention. FIG. 10 is a drawing for explaining a process in which a first wire and a second wire are aligned as a pair of grippers illustrated in FIG. 9 are operated. FIG. 11 is a drawing for explaining a modified example of a pair of grippers of a wire alignment-soldering system according to an embodiment of the present invention.

[0087] Referring to FIGS. 1 to 4, a wire alignment device (100) according to one embodiment of the present invention may include a moving unit (110) for an alignment unit (hereinafter, referred to as a moving unit (110)). In this embodiment, the moving unit (110) may be configured to move an alignment unit (130) described below in the X-axis direction in which a plurality of cells (P) are arranged and in the Z-axis direction, which is a direction perpendicular to the cells (P).

[0088] In this way, in the present embodiment, the moving unit (110) can align all of the plurality of wires (W) placed on the cell (P) by moving only in the two directions described above, without the need to move the separation unit (50) in the three spatial coordinate axes (XYZ axes). Since this is an effect also related to the configuration of the alignment unit (130) according to the present embodiment, this will be described in detail later together with the alignment unit (130).

[0089] Referring to FIGS. 1 and 2, the moving unit (110) of the wire alignment device (100) according to the present embodiment may include a first base frame (111), a first motor (112), a first guide frame (113), and a first cable bearer (114) to move the alignment unit (130) in the X-axis direction.

[0090] First, the first base frame (111) may be arranged in a predetermined space where the wire alignment device (100) is installed and configured to support the first motor (112) to the first cable bearer (114) and the alignment unit (130) described below. In addition, the first motor (112) may be provided on the side of the first base frame (111). The first motor (112) may generate a driving force for moving the alignment unit (130) in the X-axis direction. The first motor (112) may be, for example, an electric motor.

[0091] A first guide frame (113) may be placed on the upper side of the first base frame (111). The first guide frame (113) may extend along the X-axis direction. In addition, a first cable bearer (114) may be installed on the side of the first guide frame (113).

[0092] This first cable bear (114) can be bent or stretched in the X-axis direction at one portion by the power generated from the first motor (112). Accordingly, the second base frame (115) coupled to one side of the first cable bear (114) and the alignment unit (130) supported thereby can be moved in the X-axis direction.

[0093] And, referring to FIGS. 1 and 2, the moving unit (110) of the wire alignment device (100) according to the present embodiment may include a second base frame (115), a second motor (116), a second guide frame (117), and a second cable bearer (118) to move the alignment unit (130) in the Z-axis direction.

[0094] First, the second base frame (115) may be configured to be coupled to one side of the first cable bearer (114) as described above and thereby moved in the X-axis direction. Then, the second base frame (115) may be configured to support the second motor (116) to the second guide frame (117) and the alignment unit (130) described below. At this time, the second base frame (115) may be slidably coupled to the first guide frame (113) so as to be smoothly guided in the X-axis direction.

[0095] According to the present embodiment, a second motor (116) may be coupled to one side of the second base frame (115). The second motor (116) may generate a driving force to move the alignment unit (130) along the Z-axis. As an example, the second motor (116) may be an electric motor.

[0096] In addition, a second guide frame (117) extending in the Z-axis direction can be coupled to the second base frame (115), and a second cable bearer (118) can be installed on the side of the second guide frame (117).

[0097] According to the present embodiment, the second cable bear (118) can be partially stretched or bent in the Z-axis direction by the driving force of the second motor (116), and by this operation, the alignment unit (130) supported on one side of the second cable bear (118) can be moved in the Z-axis direction.

[0098] In this way, the moving unit (110) of the wire alignment device (100) according to one embodiment of the present invention can move the alignment unit (130) in two different directions (X-axis direction and Z-axis direction). However, the configuration of the moving unit (110) is not limited to the configuration using the cable bearer and motor described above, and the configuration of the moving unit (110) is not particularly limited as long as it can move the alignment unit (130).

[0099] Referring again to FIGS. 1 and 2, a wire alignment device (100) according to one embodiment of the present invention may further include a connecting frame (120) for an alignment unit (hereinafter, referred to as a connecting frame (120)). The connecting frame (120) may connect the alignment unit (130) to the moving unit (110) so that the alignment unit (130) can be moved by the moving unit (110).

[0100] As illustrated, the connecting frame (120) may be provided as a plurality of separately provided frames. Accordingly, the relative position between the moving unit (110) and the alignment unit (130) may be adjusted, and furthermore, a stable support structure of the alignment unit (130) may be implemented. Furthermore, the connecting frame (120) may be slidably coupled to the second guide frame (117) of the moving unit (110). Accordingly, the Z-axis movement of the alignment unit (130) may be stably guided.

[0101] Meanwhile, in the present embodiment, the connecting frame (120) is provided separately, but in some cases, the connecting frame (120) may not be provided separately. For example, if the alignment unit (130) is configured to be directly coupled to the moving unit (110), there will be no need for the connecting frame (120) to be provided separately.

[0102] Referring to FIGS. 1, 2, and 6, a wire alignment device (100) according to one embodiment of the present invention may include an alignment unit (130). The alignment unit (130) may be configured to align wires twisted or inclined on a cell in parallel with each other.

[0103] Specifically, referring to FIGS. 4 and 5, a portion of the first wire (W1) coupled to the lower surface of the first cell (P1) may be extended and placed on the upper surface of the second cell (P2). This portion is referred to as the first portion (WP1). In addition, a portion of the second wire (W2) coupled to the second cell (P2) may be extended freely toward the first cell (P1) on the upper surface of the second cell (P2). This portion is referred to as the second portion (WP2).

[0104] By soldering these first part (WP1) and second part (WP2) to the upper surface of the second cell (P2), the first cell (P1) and the second cell (P2) can be electrically and physically connected to each other.

[0105] However, as illustrated, if soldering is performed in a state where the first part (WP1) and the second part (WP2) are not adjacent to each other in parallel, physical and electrical coupling between the first cell (P1) and the second cell (P2) may not be achieved to a sufficient degree. To prevent this, the alignment unit (130) of the wire alignment device (100) according to the present embodiment can align the first part (WP1) and the second part (WP2).

[0106] Referring again to FIGS. 1, 2 and 6, the alignment unit (130) of the wire alignment device (100) according to one embodiment of the present invention may include a support frame (140) for the alignment unit (hereinafter, referred to as a support frame (140)). The support frame (140) may be provided as a frame extending in the vertical direction.

[0107] At this time, the upper part of the support frame (140) can be fixedly connected to the aforementioned connecting frame (120), and the lower part of the support frame (140) can face the cell assembly (3). A gripper (180) described later can be provided at the lower part of the support frame (140), and by adjusting the vertical length (length in the Z-axis direction) of the support frame (140), the distance between the gripper (180) and the cell can be adjusted.

[0108] Referring to FIGS. 6 to 8, the alignment unit (130) of the wire alignment device (100) according to one embodiment of the present invention may include an actuator (150). In this embodiment, the actuator (150) is configured to provide a driving force for operating a gripper (180) described below.

[0109] According to one embodiment of the present invention, the actuator (150) may be installed at the lower front of the support frame (140). In addition, the actuator (150) is configured as a linear actuator and can implement linear movement of the gripper (180) described below. However, the position where the actuator (150) is installed is not particularly limited, and the type of the actuator (150) may be appropriately selected depending on the operating method of the gripper (180).

[0110] The alignment unit (130) of the wire alignment device (100) according to one embodiment of the present invention may include a first alignment frame (160) and a second alignment frame (170). In this embodiment, the first alignment frame (160) and the second alignment frame (170) are configured to provide a base on which a gripper (180) described below is installed, while transmitting the driving force of the actuator (150) to the gripper (180).

[0111] To this end, in the present embodiment, the first alignment frame (160) and the second alignment frame (170) can be movably coupled to the actuator (150) in the Y-axis direction. That is, the first alignment frame (160) and the second alignment frame (170) can be relatively moved along the Y-axis direction by the actuator (150) to move away from or closer to each other.

[0112] In the present embodiment, the first alignment frame (160) may include a first coupling portion (161) and a first extension portion (162). First, the first coupling portion (161) may refer to a portion of the first alignment frame (160) that is coupled to the actuator (150). According to the present embodiment, the first coupling portion (161) may be coupled to the right portion of the actuator (150).

[0113] At this time, as illustrated, the first coupling portion (161) may be composed of multiple members. That is, the first coupling portion (161) may be composed of a first member directly coupled to the actuator (150) and a second member coupled to the first member, to which a first extension portion (162) described later is connected.

[0114] In this way, if the first coupling portion (161) is composed of multiple parts, there is an advantage in that each part of the first coupling portion (161) can be composed of different materials. For example, the first part directly coupled to the actuator (150) can be composed of a material having strong rigidity, such as a metal, so as to achieve a stable coupling structure while fully transmitting the driving force. On the other hand, the second part can be composed of a material different from the first part, such as rubber or plastic, in order to achieve a predetermined purpose. Of course, the first coupling portion (161) can also be provided as a single part.

[0115] Meanwhile, referring to FIGS. 7 and 8, a first extension portion (162) may be provided on one side of the first coupling portion (161). The first extension portion (162) may function as a base on which a first gripper (181) described later is installed. In the present embodiment, the first extension portion (162) may extend from the first coupling portion (161) along the positive direction of the X-axis. However, the direction in which the first extension portion (162) extends is not particularly limited as long as it is in a direction away from the support frame (140).

[0116] In this embodiment, the first gripper (181) described later may be provided on the extension direction end side of the first extension portion (162). When the first gripper (181) is provided on the end side of the first extension portion (162), the alignment unit (130) moves toward the cell side, and when the first gripper (181) or a part of the first extension portion (162) comes into contact with the upper surface of the cell, the first extension portion (162) may be bent.

[0117] By the bending action of the first extension portion (162), the shock that may occur when the separation unit (130) and the cell collide can be alleviated, so that damage to the cell due to the operation of the alignment unit (130) can be prevented. At this time, in order for the cushioning action due to the above-described bending to be performed more smoothly, the first extension portion (162) can be made of a material having great flexibility, such as rubber or plastic.

[0118] Meanwhile, referring again to FIG. 8, in the present embodiment, the first extension portion (162) may be provided as a plate-shaped member parallel to the upper surface of the cell. At this time, the first extension portion (162) may have a rectangular shape extending in the negative direction of the Y-axis.

[0119] And, in the present embodiment, the Y-axis length of the first extension (162) may correspond to the Y-axis width of the cell. Accordingly, the first extension (162) may provide a base on which a plurality of first grippers (181) may be installed to align a plurality of wires, respectively.

[0120] Referring again to FIGS. 6 to 8, the second alignment frame (170) of the wire alignment device (100) according to one embodiment of the present invention may include a second coupling portion (171) and a second extension portion (172). At this time, the second coupling portion (171) and the second extension portion (172) may be formed symmetrically with the first coupling portion (161) and the first extension portion (162) described above.

[0121] More specifically, the second coupling portion (171) has an overall similar shape to the first coupling portion (161), but can be coupled to the left portion of the actuator (150). In addition, the second extension portion (172) has an overall similar shape to the first extension portion (162), but can have a rectangular flat plate shape extending in the positive direction of the Y-axis.

[0122] At this time, the second extension (172) can be arranged parallel to the lower side of the first extension (162). In this way, the first extension (162) of the first alignment frame (160) and the second extension (172) of the second alignment frame (170) are provided as plates that are arranged to overlap each other, so that the alignment unit (130) can be provided compactly with a simpler structure.

[0123] Meanwhile, referring to FIGS. 8 to 10, the alignment unit (130) of the wire alignment device (100) according to one embodiment of the present invention may include a pair of grippers (180) consisting of a first gripper (181) and a second gripper (182).

[0124] In this embodiment, a pair of grippers (180) may be configured to align a first portion (WP1) of a pair of adjacent first wires (W1) and a second portion (WP2) of a pair of adjacent second wires (W2) adjacent to each other and in parallel, as illustrated in FIG. 4.

[0125] Referring to FIGS. 7 and 8, in the present embodiment, the first gripper (181) may be provided as a member in the shape of a section protruding from the lower surface of the first extension portion (162) by a predetermined thickness. In this case, the lower surface of the first extension portion (162) means a surface facing the upper surface of the cell.

[0126] Accordingly, as illustrated in FIG. 9, the first gripper (181) protruding toward the cell (P) can be placed on the side of the wires (W1, W2) placed on the cell (P). Then, when the first alignment frame (160) is moved in the Y-axis direction by the actuator (150), the first gripper (181) provided on the first alignment frame (160) moves in the Y-axis direction and can align the wires (W1, W2) placed on the side.

[0127] At this time, in the present embodiment, the first gripper (181) may be provided on the side facing the support frame (140) of the first extension (162). More specifically, the first gripper (181) may be provided on the edge portion that is positioned on the positive direction end side of the X-axis of the first extension (162) and extends along the Y-axis direction. This configuration is to maximize the bending action of the first extension (162).

[0128] And, according to the present embodiment, the first gripper (181) may be provided in multiple units so as to align multiple wires at once. In the present embodiment, the first gripper (181) may be provided in 12 units.

[0129] This is to align 12 pairs of first and second parts (WP1, WP2) provided on the upper surface of the second cell (P2) at once, as illustrated in Fig. 4. The number of these first grippers (181) can be appropriately adjusted depending on the number of wires, the shape of the first extension (162), etc.

[0130] In addition, in the present embodiment, a plurality of first grippers (181) are all connected (or coupled) to a single first alignment frame (160). Therefore, all of the first grippers (181) can be operated using only an actuator (150) for operating a single first alignment frame (160). By this configuration, the alignment unit (130) according to the present embodiment can be configured more simply and compactly.

[0131] Meanwhile, in the present embodiment, the first gripper (181) is configured to be provided integrally with the first extension (162), but if necessary, the first gripper (181) may be provided as a separate member from the first extension (162) and then combined.

[0132] Referring again to FIGS. 7 and 8, in the present embodiment, the second gripper (182) may be provided on the second extension (172) of the second alignment frame (170). In addition, the second gripper (182) may be provided in multiple numbers corresponding to the plurality of first grippers (181).

[0133] At this time, in the present embodiment, the second gripper (182) can protrude in the positive direction of the X-axis from the periphery of the second extension (172). And, a plurality of second grippers (182) can be respectively arranged between a plurality of first grippers (181). Accordingly, adjacent first grippers (181) and second grippers (182) can form a pair of grippers (180).

[0134] Accordingly, when the first and second alignment frames (160, 170) are moved closer to each other in the Y-axis direction by the actuator (150), the first and second grippers (181, 182) also become closer to each other as shown in FIGS. 9 and 10, and the wires (W1, W2) placed therebetween can be aligned.

[0135] Meanwhile, in the present embodiment, the second gripper (182) may be provided as a member in the shape of a section having a predetermined thickness in the vertical direction. That is, the second gripper (182) may have an overall shape similar to that of the first gripper (181). Of course, the first gripper (181) and the second gripper (182) may be provided in different shapes so that they can each perform their own unique additional functions.

[0136] And, in this embodiment, a plurality of second grippers (182) are all connected (or coupled) to a single second alignment frame (170). Therefore, in this embodiment, all of the second grippers (182) can be operated with only an actuator (150) for operating a single second alignment frame (170). By this configuration, the alignment unit (130) according to this embodiment can be configured more simply and compactly.

[0137] Meanwhile, as described above, the above-described configuration of the alignment unit (130) according to the present embodiment can contribute to simplifying the structure of the moving unit (110). This is because the alignment unit (130) according to the present embodiment can simultaneously align all of the plurality of wires (W) provided on one side of the cell (P), and therefore, the alignment unit (130) does not need to move in the Y-axis direction, which is the direction in which the plurality of wires (W) are arranged.

[0138] Hereinafter, a process of aligning wires by the gripper (180) of the wire alignment device (100) according to one embodiment of the present invention will be briefly described. Referring to FIGS. 3 and 9, the controller (300) can control the moving unit (110) so that the alignment unit (130) is placed on the upper side of the cell (P). Accordingly, a pair of first parts (WP1) and second parts (WP2) can be placed between a pair of first grippers (181) and second grippers (182), respectively.

[0139] Referring again to FIGS. 3 and 10, the controller (300) can control the alignment unit (130) to bring a pair of grippers (181, 182) closer to each other. Accordingly, the first gripper (181) and the second gripper (182) can come closer to each other, and the first part (WP1) and the second part (WP2) can be aligned adjacent to each other and in parallel.

[0140] At this time, referring to FIGS. 9 and 10, the thickness (t) of the first gripper (181) protruding from the lower surface of the first extension (162) (i.e., the thickness in the direction perpendicular to the cell (P) of the first gripper (181)) may be smaller than the diameter (d1) of the wire (W1, W2). Alternatively, the thickness (t) in the direction perpendicular to the cell (P) of the second gripper (182) may be smaller than the diameter (d1) of the wire (W1, W2).

[0141] This configuration can allow the first and second parts (WP1, WP2) of the wires (W1, W2) to contact the upper surface of the cell (P) before the grippers (181, 182) when the alignment unit (130) moves toward the cell (P) to align the wires (W1, W2).

[0142] Due to this, the force applied by the alignment unit (130) toward the cell (P) can act as a force that pushes the wires (W1, W2) toward the cell (P), and the first and second parts (WP1, WP2) of the wires (W1, W2) can be aligned in the Y-axis direction while being in close contact with the upper surface of the cell (P).

[0143] Hereinafter, a modified example of a gripper that can similarly achieve the aforementioned adhesion effect will be described with reference to FIG. 11. Referring to FIG. 11, in this modified example, the first gripper (181') may have a first alignment surface (181a) on a side parallel to the cell (P). In addition, the second gripper (182') may have a second alignment surface (182a) facing the first alignment surface (181a) on a side parallel to the cell (P).

[0144] At this time, the first alignment surface (181a) may be inclined in a direction (positive direction of the Y-axis) away from the second gripper (182) as it goes toward the cell (P) side (negative direction of the Z-axis). And, the second alignment surface (182a) may be inclined in a direction (negative direction of the Y-axis) away from the first gripper (181) as it goes toward the cell (P) side (negative direction of the Z-axis).

[0145] In this way, when the first alignment surface (181a) of the first gripper (181') and the second alignment surface (182a) of the second gripper (182') are configured to be inclined, the first and second portions located between the first alignment surface (181a) and the second alignment surface (182a) can receive a force in an inclined direction with respect to the cell (P). As a result, the first and second portions can be aligned adjacent to each other and parallel by the grippers (181', 182') while being in close contact with the upper surface of the cell (P).

[0146] At this time, in this modified example, the first alignment surface (181a) and the second alignment surface (182a) can extend along the X-axis direction, which is the extension direction of the wire. Accordingly, the first gripper (181') and the second gripper (182') can align the sides of the first and second parts by applying pressure to the entirety.

[0147] Meanwhile, a wire alignment device (100) according to one embodiment of the present invention may be provided to include a controller (300) for controlling a moving unit (110) and an alignment unit (130) as a single configuration.

[0148] (2) Soldering device

[0149] Hereinafter, a soldering device according to an embodiment of the present invention will be described. FIGS. 12 and 13 are perspective views of a soldering unit of a wire alignment-soldering system according to an embodiment of the present invention viewed from different angles. FIG. 14 is a rear view of a soldering unit of a wire alignment-soldering system according to an embodiment of the present invention.

[0150] Referring to FIGS. 1 to 4, a soldering device (200) according to one embodiment of the present invention may include a moving unit (210) for a soldering unit (hereinafter, referred to as a moving unit (210)). In this embodiment, the moving unit (210) may be configured to move a soldering unit (240) described below in an X-axis direction in which a plurality of cells (P) are arranged, a Y-axis direction in which a plurality of wires (W) provided in the cells (P) are arranged, and a Z-axis direction that is a direction perpendicular to the cells (P).

[0151] Referring to FIGS. 1 and 2, the moving unit (210) of the soldering device (200) according to the present embodiment may include a first base frame (211), a first motor (212), a first guide frame (213), and a first cable bearer (214) to move the soldering unit (240) in the X-axis direction.

[0152] First, the first base frame (211) may be arranged in a predetermined space where the soldering device (200) is installed and configured to support the first motor (212) to the first cable bearer (214) and the soldering unit (240) described below. In addition, the first motor (212) may be provided on the side of the first base frame (211). The first motor (212) may generate a driving force for moving the soldering unit (240) in the X-axis direction. The first motor (212) may be, for example, an electric motor.

[0153] A first guide frame (213) may be placed on the upper side of the first base frame (211). The first guide frame (213) may extend along the X-axis direction. In addition, a first cable bearer (214) may be installed on the side of the first guide frame (213).

[0154] This first cable bear (214) can be bent or stretched in the X-axis direction at one portion by the power generated from the first motor (212). Accordingly, the second base frame (215) coupled to one side of the first cable bear (214) and the soldering unit (240) supported thereby can be moved in the X-axis direction.

[0155] And, referring to FIGS. 1 and 2, the moving unit (210) of the soldering device (200) according to the present embodiment may include a second base frame (215), a second motor (216), a second guide frame (217), and a second cable bearer (218) to move the soldering unit (240) in the Z-axis direction.

[0156] First, the second base frame (215) may be configured to be coupled to one side of the first cable bear (214) as described above and thereby moved in the X-axis direction. Then, the second base frame (215) may be configured to support the second motor (216) to the second cable bear (218) and the soldering unit (240) described below. At this time, the second base frame (215) may be slidably coupled to the first guide frame (213) so as to be smoothly guided in the X-axis direction.

[0157] According to the present embodiment, a second motor (216) may be coupled to one side of the second base frame (215). The second motor (216) may generate a driving force to move the soldering unit (240) along the Z-axis. As an example, the second motor (216) may be an electric motor.

[0158] In addition, a second guide frame (217) extending in the Z-axis direction can be coupled to the second base frame (215), and a second cable bearer (218) can be installed on the side of the second guide frame (217).

[0159] According to the present embodiment, the second cable bear (218) can be partially stretched or bent in the Z-axis direction by the driving force of the second motor (216), and by this operation, the soldering unit (240) supported on one side of the second cable bear (218) can be moved in the Z-axis direction.

[0160] And, referring to FIGS. 1 and 2, the moving unit (210) of the soldering device (200) according to the present embodiment may include a third base frame (219), a third motor (220), a third guide frame (221), and a third cable bearer (222) to move the soldering unit (240) in the Y-axis direction.

[0161] First, the third base frame (219) may be configured to be coupled to one side of the second cable bear (218) described above and thereby moved in the Z-axis direction. Then, the third base frame (219) may be configured to support the third motor (220) to the third cable bear (222) and the soldering unit (240) described below. At this time, the third base frame (219) may be slidably coupled to the second guide frame (217) so as to be smoothly guided in the Z-axis direction.

[0162] According to the present embodiment, a third motor (220) may be coupled to one side of the third base frame (219). The third motor (220) may generate a driving force to move the soldering unit (240) along the Y-axis. As an example, the third motor (220) may be an electric motor.

[0163] In addition, a third guide frame (221) extending in the Y-axis direction can be coupled to the third base frame (219), and a third cable bearer (222) can be installed on the side of the third guide frame (221).

[0164] According to this embodiment, the third cable bear (222) can be partially stretched or bent in the Y-axis direction by the driving force of the third motor (220), and by this operation, the soldering unit (240) supported on one side of the third cable bear (222) can be moved in the Y-axis direction.

[0165] In this way, the moving unit (210) of the soldering device (200) according to one embodiment of the present invention can move the soldering unit (240) in three axes (XYZ axes). However, the configuration of the moving unit (210) is not limited to the configuration using the cable bearer and motor described above, and the configuration of the moving unit (210) is not particularly limited as long as it can move the soldering unit (240).

[0166] Referring again to FIGS. 1 and 2, a soldering device (200) according to one embodiment of the present invention may further include a connecting frame (230) for a soldering unit (hereinafter, referred to as a connecting frame (230)). The connecting frame (230) may connect the soldering unit (240) to the moving unit (210) so that the soldering unit (240) may be moved by the moving unit (210).

[0167] As illustrated, the connecting frame (230) may be provided as a plurality of separately provided frames. Accordingly, the relative position between the moving unit (210) and the soldering unit (240) may be adjusted, and further, a stable support structure of the soldering unit (240) may be implemented. Furthermore, the connecting frame (230) may be slidably coupled to the third guide frame (221). Accordingly, the Z-axis movement of the soldering unit (240) may be stably guided.

[0168] Meanwhile, in the present embodiment, the connecting frame (230) is provided separately, but in some cases, the connecting frame (230) may not be provided separately. For example, if the soldering unit (240) is configured to be directly coupled to the moving unit (210), there will be no need to provide the connecting frame (230) separately.

[0169] Referring to FIGS. 1, 2, and 12, a soldering device (200) according to one embodiment of the present invention may include a soldering unit (240). The soldering unit (240) may be configured to solder a wire on a cell to a cell.

[0170] In this embodiment, the soldering unit (240) may include a support frame (250) for the soldering unit (hereinafter, referred to as a support frame (250)). The support frame (250) may be provided as a frame extending in the vertical direction.

[0171] At this time, the upper part of the support frame (250) can be fixedly connected to the above-described connecting frame (230), and the lower part of the support frame (250) can face the cell assembly (3). A soldering device (260) described later can be provided at the lower part of the support frame (250), and by adjusting the vertical length (length in the Z-axis direction) of the support frame (250), the distance between the soldering device (260) and the cell can be adjusted.

[0172] Referring to FIGS. 12 to 14, a flat-plate-shaped fixed frame (251) protruding in the X-axis direction may be provided at the bottom of the support frame (250). The fixed frame (251) is configured to support a soldering device (260) and a moving frame (270) described later.

[0173] In addition, the soldering unit (240) of the soldering apparatus according to the present embodiment may include a soldering device (260). As described above, the soldering device (260) may be installed in the fixed frame (251).

[0174] At this time, in the present embodiment, the soldering device (260) may include a device body (261) and a soldering operation unit (262) that performs soldering of a wire to a cell. The device body (261) may be provided as a box-shaped device to assist the operation of the soldering operation unit (262). For example, a PCB or a power supply for controlling the soldering operation unit (262) may be built into the device body (261).

[0175] In this embodiment, the soldering operation unit (262) may be installed on the lower side of the device body (261). In addition, the end of the soldering operation unit (262) may face the cell side. The soldering operation unit (262) may be formed of, but is not limited to, a high-frequency welder, a laser welder, or the like.

[0176] At this time, in the present embodiment, the soldering operation unit (262) may be configured in multiple units so as to be able to solder multiple wires to the cell. In addition, the multiple soldering operation units (262) may be spaced apart from each other along the Y-axis direction, which is the direction in which the multiple wires provided on one side of the cell are arranged. Accordingly, the multiple soldering operation units (262) can quickly solder multiple wires placed on one side of the cell at once.

[0177] Meanwhile, when referring to FIG. 4 together, the number of soldering operation parts (262) may be less than the number of adjacent pairs of first and second wires (W1, W2) placed on one side of the second cell (P2). This may be because a sufficient number of soldering operation parts (262) cannot be installed in the soldering unit (240) due to limitations such as the weight of the soldering device (260) and the shape or structure of the soldering unit (240).

[0178] At this time, the number of the first wire (W1) (or the number of the pair of first and second wires (W1, W2) adjacent to each other) may be an integer multiple of the number of soldering operation parts (262). For example, as in the embodiments illustrated in FIGS. 4 and 13, the number of the first wire (W1) (or the number of the pair of first and second wires (W1, W2) adjacent to each other) may be 12, and the number of soldering operation parts (262) may be 6.

[0179] In this way, when the number of positive components is configured to have an integer ratio, the soldering unit (240) can perform movement and soldering a number of times corresponding to the integer ratio, thereby soldering all wires without the soldering operating part (262) being wasted without being used in the process, thereby achieving structural and operational optimization of the soldering unit (240).

[0180] Meanwhile, referring again to FIGS. 12 to 14, in the present embodiment, a movable frame (270) may be provided on the lower side of the fixed frame (251). The movable frame (270) may be configured to move in an up-and-down direction perpendicular to the cell with respect to the fixed frame (251). At this time, a separate actuator (not shown) for operating the movable frame (270) may be installed in the support frame (250).

[0181] In this embodiment, the soldering operating part (262) of the aforementioned soldering device (260) is arranged to penetrate the moving frame (270) in the vertical direction, and the lower part of the soldering operating part (262) can be exposed to the lower side of the moving frame (270). Accordingly, the soldering operating part (262) can perform soldering on the cell without interference from the moving frame (270).

[0182] At this time, a pressure frame (271) can be combined with the lower surface of the moving frame (270). The pressure frame (271) is configured to improve soldering quality by pressing the wire on the cell toward the cell side.

[0183] This pressure frame (271) can be configured to move together with the moving frame (270). Accordingly, when the moving frame (270) moves up and down, the pressure frame (271) also moves together and can press the wire against the cell.

[0184] At this time, the pressurizing frame (271) according to the present embodiment can extend in the Y-axis direction, which is the direction in which a plurality of soldering operating parts (262) are arranged. In addition, the side of the pressurizing frame (271) can be bent toward the lower side of the soldering operating part (262). At this time, the end of the bent portion can be positioned as close as possible to the soldering operating part (262).

[0185] Accordingly, all of the multiple wires soldered by the soldering operation unit (262) can be brought into close contact with the cell. In addition, a specific portion of the wires soldered by the soldering operation unit (262) can be brought into close contact with the cell as closely as possible.

[0186] Meanwhile, according to the present embodiment, a guide bar (272) may be provided between the fixed frame (251) and the movable frame (270) to guide the up and down movement of the movable frame (270). The guide bar (272) may have a rod shape extending in the up and down direction, and one end may be coupled to the fixed frame (251) and the other end may be coupled to the movable frame (270). At this time, the guide bars (272) may be provided in multiple numbers and spaced apart from each other along the Y-axis direction so as to level the movable frame (270).

[0187] In addition, a buffer member (273) may be provided on each of the plurality of guide bars (272). The buffer member (273) is configured to buffer the impact generated when the pressurizing frame (271) presses the wire, and may have a predetermined elasticity for this purpose. In the present embodiment, the buffer member (273) is provided as a coil spring installed on the guide bar (272), but is not limited thereto. Accordingly, the impact that may occur on the upper surface of the cell due to the operation of the pressurizing frame (271) can be minimized.

[0188] Meanwhile, a soldering device (200) according to one embodiment of the present invention may be provided to include a controller (300) for controlling a moving unit (210) and a soldering unit (240) as a single component.

[0189] (3) Wire alignment and soldering method

[0190] Hereinafter, a wire alignment and soldering method according to an embodiment of the present invention will be described. Fig. 15 is a flowchart of a wire alignment-soldering method according to an embodiment of the present invention. Fig. 16 is a flowchart detailing step S200 of Fig. 15. Figs. 17 and 18 are diagrams for explaining a process in which an alignment unit of a wire alignment-soldering device according to an embodiment of the present invention is placed on one side of a cell. Fig. 19 is a diagram for explaining a process in which a first wire and a second wire are aligned by an alignment unit of a wire alignment-soldering device according to an embodiment of the present invention. Fig. 20 is a flowchart detailing step S300 of Fig. 15. Figs. 21 and 22 are diagrams for explaining a process in which a soldering unit of a wire alignment-soldering device according to an embodiment of the present invention is placed on one side of a cell so as to be able to solder either one of two unit groups. FIG. 23 and FIG. 24 are drawings for explaining a process in which a first wire and a second wire are brought into close contact with a cell as a pressurizing frame of the soldering unit illustrated in FIG. 22 is operated. FIG. 25 is a drawing for explaining a process in which a first wire and a second wire brought into close contact with a cell are soldered to the cell by a soldering device of the soldering unit illustrated in FIG. 22. FIG. 26 is a drawing for explaining a process in which the soldering unit illustrated in FIG. 22 is arranged on one side of a cell so as to be able to solder any one of the remaining two unit groups. FIG. 27 is a drawing for explaining a process in which the alignment unit illustrated in FIG. 17 and the soldering unit illustrated in FIG. 22 are arranged on one side of another cell so as to solder other wires.

[0191] A wire alignment and soldering method according to one embodiment of the present invention can be implemented by the wire alignment-soldering system (1) according to one embodiment of the present invention described above. Hereinafter, for the convenience of understanding, each step of the method will be specifically described through a process in which the second cell (P2) illustrated in FIG. 4 is connected to the first and third cells (P1, P3) by the wire alignment-soldering method according to one embodiment of the present invention.

[0192] Referring to FIGS. 1 to 5 and 15, in a wire alignment-soldering method according to one embodiment of the present invention, first to third cells (P1 to P3) are arranged in parallel along the X-axis direction on a worktable (2) (S100), and a first part (WP1) of a first wire (W1) connected to a first cell (P1) and a second part (WP2) of a second wire (W2) connected to a second cell (P2) are aligned (S200).

[0193] Referring to FIG. 3, FIG. 16 to FIG. 18, in step S200 according to one embodiment of the present invention, the controller (300) controls the moving unit (110) for the alignment unit to place the alignment unit (130) on the upper side of the second cell (P2) (S210).

[0194] At this time, in step S210, a pair of adjacent first parts (WP1) and second parts (WP2) can be placed between a pair of grippers (180). If there are a plurality of pairs of first and second parts (WP1, WP2) and a plurality of pairs of grippers (180), as illustrated in FIG. 18, a pair of first and second parts (WP1, WP2) are placed between a pair of grippers (180).

[0195] And, referring to FIGS. 3, 4, 16 and 19, in step S200 according to one embodiment of the present invention, the controller (300) controls the alignment unit (130) to align the first part (WP1) and the second part (WP2) so that they are adjacent to each other and parallel (S220).

[0196] In step S220 according to the present embodiment, the first gripper (181) and the second gripper (182) are moved closer to each other, and the sides of the first and second parts (WP1, WP2) placed therebetween are pressed. Accordingly, the first part (WP1) and the second part (WP2) placed on the upper surface of the second cell (P2) can be aligned adjacent to each other and in parallel.

[0197] At this time, if the alignment unit (130) has a plurality of pairs of grippers (180), multiple pairs of the first and second parts (WP1, WP2) are aligned uniformly at once, so that multiple wires (W1, W2) can be aligned quickly at once.

[0198] Referring to FIGS. 1 to 5 and 15, in a wire alignment-soldering method according to one embodiment of the present invention, a first wire (W1) and a second wire (W2) are aligned (S200), and a first portion (WP1) of the aligned first wire (W1) and a second portion (WP2) of the second wire (W2) are soldered to an upper surface of a second cell (P2) (S300).

[0199] Referring to FIGS. 4 and 20, in step S300 according to one embodiment of the present invention, first, m*n (m and n are natural numbers) first wires (W1) placed on the upper surface of the second cell (P2) are set (or classified) into m unit groups, each consisting of n first wires (W1) adjacent to each other in the Y-axis direction (S310). At this time, n may be the number of soldering operating parts (262) of the soldering unit (240).

[0200] In the illustrated embodiment, the first part (WP1) of twelve first wires (W1) is placed on the upper surface of the second cell (P2), and since there are six soldering operating parts (262) of the soldering device (240), the twelve first wires (W1) can be set as two unit groups of six each.

[0201] Hereinafter, with reference to Fig. 22, the unit group located in the relatively positive direction of the Y-axis among the two unit groups is referred to as the first unit group, and the unit group located on the opposite side is referred to as the second unit group.

[0202] Next, referring to FIGS. 3, 4, and 20 to 22, in step S300 according to one embodiment of the present invention, the controller (300) controls the moving unit (210) for the soldering unit to place the soldering unit (240) on the upper side of the second cell (P2) (S320).

[0203] At this time, in step S320 according to the present embodiment, the soldering unit (240) may be first placed on the upper side of the first unit group among the two unit groups, as illustrated in FIG. 22. However, the order of the two unit groups is not particularly limited.

[0204] At this time, in step S320 according to the present embodiment, the first portions (WP1) of the first wires (W1) belonging to the first unit group are arranged to face each other in the vertical direction with respect to the plurality of soldering operating parts (262).

[0205] Meanwhile, as illustrated in Fig. 23, even if the first part (WP1) and the second part (WP2) are aligned adjacently and parallel in the Y-axis direction by the alignment unit (130), they may be spaced apart by a predetermined distance (d2) in the Z-axis direction. This may deteriorate the soldering quality of the soldering device (260).

[0206] To prevent this, in step S300 according to one embodiment of the present invention, as illustrated in FIG. 24, the pressurizing frame (271) is moved in the negative direction of the Z-axis to bring the first portion (WP1) of the first wire (W1) and the second portion (WP2) of the second wire (W2) into close contact with the upper surface of the second cell (P2) (S330). Accordingly, higher quality soldering can be achieved.

[0207] Next, referring to FIG. 3, FIG. 20 and FIG. 25, in step S300 according to one embodiment of the present invention, the first and second parts (WP1, WP2) are brought into close contact with the upper surface of the second cell (P2) (S330), and the controller (300) controls the soldering unit (240) to cause the soldering operation unit (262) to form a soldering part (S1) surrounding the first and second parts (WP1, WP2) on the upper surface of the second cell (P2) (S340).

[0208] At this time, in step S340, one soldering operation unit (262) operates on each of a pair of adjacent first and second parts (WP1, WP2), so that a soldering part (Sl) can be formed on each of a pair of first and second parts (WP1, WP2).

[0209] Through the above-described process, soldering of the first wires (W1) belonging to the first unit group can be completed.

[0210] Referring to FIG. 20 and FIG. 26, next, in step S300 according to one embodiment of the present invention, it is determined whether the first wires (W1) of all unit groups placed on the upper surface of the second cell (P2) are soldered (S350).

[0211] If the first wires (W1) of all unit groups are not soldered to the second cell (P2), steps S320 to S340 described above are performed for the unsoldered unit groups. In the present embodiment, since soldering has not yet been performed for the second unit group, steps S320 to S340 will be performed for the second unit group.

[0212] If the first wires (W1) of all unit groups are soldered to the second cell (P2), the controller (300) controls the moving unit (210) for the soldering unit to move the soldering unit (240) away from the second cell (P2) (S360).

[0213] In this way, according to step S300 according to the present embodiment, multiple first wires (W1) can be quickly and automatically soldered to the second cell (P2) at once, thereby minimizing human labor required for the repair process of the cell assembly and reducing manufacturing costs.

[0214] Furthermore, according to step S300 according to the present embodiment, since the soldering unit (240) is controlled and soldered in a planned and consistent manner by the controller (300), high-quality soldering can be implemented uniformly and consistently.

[0215] Through the above-described process, physical and electrical connection between the first cell (P1) and the second cell (P2) can be established.

[0216] And, by repeatedly performing the above-described steps S200 to S300 for the first wire (W1) connected to the second cell (P2) and the second wire (W2) connected to the third cell (P3), a physical and electrical connection between the second cell (P2) and the third cell (P3) can be achieved.

[0217] Accordingly, the second cell (P2), which is a replacement cell, can be fully electrically and physically connected to the other cells (P) of the cell assembly (3).

[0218] Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in this specification, and a person skilled in the art who understands the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

Claims

1. An alignment unit capable of aligning a first portion of a first wire electrically connected to a first cell and a second portion of a second wire electrically connected to a second cell in parallel on one surface of the second cell; a moving unit capable of moving the above-mentioned alignment unit onto the one side of the second cell; and A wire alignment device comprising a controller for controlling the alignment unit and the moving unit.

2. In paragraph 1, The above sorting unit is a support frame that can be moved by the above moving unit; and A wire alignment device comprising a pair of grippers configured to be relatively movable in a direction approaching each other, including a first gripper provided on one side of the support frame to be movable in a direction parallel to the one side of the second cell, and a second gripper spaced apart from one side of the first gripper.

3. In paragraph 2, The above second gripper A wire alignment device configured to be relatively movable with respect to the first gripper.

4. In paragraph 2, The above sorting unit is A wire alignment device comprising an actuator supported by the support frame for moving the first gripper.

5. In paragraph 2, The first wire and the second wire are each provided in multiple numbers, The above pair of grippers A wire alignment device, which is provided in a plurality of units and configured to align a pair of first and second wires that are adjacent to each other among a plurality of first and second wires.

6. In paragraph 5, The above sorting unit is A first alignment frame is included that is coupled to one side of the support frame so as to be movable in a direction parallel to the one side of the second cell, The above plurality of first grippers A wire alignment device protruding from one side of the first alignment frame.

7. In paragraph 6, The above plurality of first grippers A wire alignment device in which the plurality of first wires are spaced apart along the direction in which they are arranged.

8. In paragraph 6, The above first alignment frame a first alignment joint coupled to the above support frame; and A first alignment extension portion connected to the first alignment joint and extending away from the support frame, The above plurality of first grippers A wire alignment device positioned on one surface of the outer surface of the first alignment extension facing the second cell.

9. In paragraph 8, The above first alignment extension It is provided in a flat shape parallel to the second cell above, The above plurality of first grippers A wire alignment device spaced apart along the periphery of the first alignment extension.

10. In paragraph 9, The above plurality of first grippers A wire alignment device provided on a side opposite to the first alignment joint of the first alignment extension.

11. In paragraph 9, The above sorting unit is A second alignment frame is included that is coupled to the other side of the support frame, The above plurality of second grippers A wire alignment device protruding from one side of the second alignment frame.

12. In paragraph 11, The above second alignment frame a second alignment joint coupled to the other side of the support frame; and A second alignment extension portion having a flat shape extending from the second alignment joint portion so as to be parallel to the second cell and disposed on one side of the first alignment extension portion, The above plurality of second grippers A wire alignment device provided along the perimeter of the second alignment extension.

13. In paragraph 2, The above pair of grippers A wire alignment device, wherein the thickness in the direction perpendicular to the second cell is smaller than the diameter of at least one of the first portion and the second portion.

14. In paragraph 2, The above first gripper In order to align the first wire and the second wire, a first alignment surface that can come into contact with at least one of the first part and the second part is included. The above first alignment surface is A wire alignment device configured to be inclined in a direction away from the second gripper as it moves toward the second cell side.

15. In paragraph 14, The above first alignment surface is A wire alignment device extending in a direction parallel to the second wire.

16. In paragraph 14, The above second gripper In order to align the first wire and the second wire, a second alignment surface is included that can come into contact with at least one of the first part and the second part, The above second alignment surface is A wire alignment device configured to be inclined in a direction away from the first gripper as it moves toward the second cell side.

17. In paragraph 1, The above moving unit is A wire alignment device configured to move the alignment unit in a direction in which the first cell and the second cell are arranged and in a direction perpendicular to the second cell.

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