Implantation assistance apparatus

Abstract

An implantation assistance apparatus. The implantation assistance apparatus comprises: a base (100); and at least two implantation assistance members (200), wherein the implantation assistance members (200) each have a first end (210) and a second end (220) opposite to each other, the first ends (210) are arranged on the base (100), and the second ends (220) are used for being connected to flexible neural electrodes (10) in a one-to-one correspondence manner, so as to drive the flexible neural electrodes (10) to be inserted into a preset position. According to the implantation assistance apparatus, the implantation assistance members (200) drive the flexible neural electrodes (10) to be inserted into the preset position, so that the implantation of the flexible neural electrodes (10) is achieved; in addition, the number of the implantation assistance members (200) is two or more, and the multiple implantation assistance members (200) can be preassembled with the flexible neural electrodes (10), thereby reducing the time required for implanting multiple flexible neural electrodes.

Description

Implant assist devices Technical Field

[0001] The present application relates to brain-computer interface technology, and in particular to an implant assist device. Background Art

[0002] Currently, the acquisition of neuroelectrophysiological signals mainly relies on brain-computer interfaces. Based on the method of information collection, they are generally divided into two types: implantable and non-implantable. Non-implantable electrodes generally refer to electroencephalograms (EEGs), which can non-invasively observe and record brain activity. Implantable electrodes mostly refer to cortical EEGs and puncturing intracortical electrodes, which require puncturing brain tissue to obtain stronger and higher-quality EEG signals. Therefore, implantable electrodes have broad application prospects in EEG signal detection and brain science research.

[0003] Because the bending stiffness of flexible neural electrodes is much lower than that of rigid neural electrodes, existing invasive brain-computer interfaces typically use flexible neural electrodes for neural signal acquisition, thereby preventing the electrodes from damaging the surrounding nervous system, reducing neural signal attenuation caused by immune responses, and thereby increasing the stable operating time of the invasive brain-computer interface in the human body. However, because the Young's modulus and bending stiffness of flexible neural electrodes are much lower than those of rigid neural electrodes, flexible neural electrodes cannot be implanted based solely on their own stiffness. Therefore, in existing technologies, flexible neural electrodes are usually bonded to hard needles made of alloys for implantation.

[0004] However, for large-scale arrays of flexible neural electrodes, the flexible neural electrodes need to be implanted one by one during the implantation process, which consumes a lot of time.

[0005] Summary of the Invention

[0006] The present application provides an implant assisting device to solve the problem of taking too long during the implantation process.

[0007] The present application provides an implantation assisting device for implanting a flexible neural electrode, the implantation assisting device comprising:

[0008] base;

[0009] At least two implantation auxiliary parts, each of which has a first end and a second section relative to each other, each of the first ends is arranged on the base, and the second end is used to be connected to the flexible neural electrode one by one to drive the flexible neural electrode to be inserted into a preset position.

[0010] In an optional embodiment of an implant assist device provided in the present application, at least two mounting portions are provided on the base, and the implant assist components are connected to the mounting portions one by one to fix the implant assist components to the base.

[0011] In an optional embodiment of an implant assist device provided in the present application, a through hole is provided on the mounting portion, the implant assist component is inserted into the base through the through hole, the first end and the second end are respectively located on both sides of the base, and the first end is connected to the base.

[0012] In an optional embodiment of an implant assisting device provided in the present application, the implant assisting device further comprises a fixing member, wherein the first end is bent toward the base and abuts against a surface of the base;

[0013] The fixing member is covered on the base to press the first end tightly onto the base.

[0014] In an optional embodiment of an implant assist device provided in the present application, the fixing member is bonded and fixed to the base.

[0015] In an optional embodiment of an implantation assist device provided in the present application, the implantation assist component is arranged on the end surface of the base, each implantation assist component is arranged side by side, and the implantation assist component is flush with one of the two opposite surfaces of the base.

[0016] In an optional embodiment of an implantation assist device provided in the present application, there are multiple implantation assist components, and the multiple implantation assist components are arranged in an array on the surface of the base.

[0017] In an optional embodiment of an implant assist device provided in the present application, the implant assist component and the base are integrally formed or cut and integrally formed through a micro-electromechanical system processing process.

[0018] In an optional embodiment of an implantation assist device provided in the present application, a cross-section of the implantation assist component gradually decreases from the first end to the second end.

[0019] In an optional embodiment of an implant assist device provided in the present application, the implant assist component has a first surface and a second surface relative to each other, and the first surface and the second surface are electroplated surfaces, polished surfaces or chemically corroded surfaces.

[0020] In an optional embodiment of an implant assist device provided in the present application, the implant assist device further includes a gripping member, and the gripping member is disposed on the base.

[0021] In an optional embodiment of an implant assist device provided in the present application, the gripping member and the base are integrally formed;

[0022] Alternatively, the gripping member is detachably connected to the base.

[0023] The implant assist device provided by the present application includes an implant assist component disposed on a base, wherein the implant assist component has a first end and a second end opposite to each other, the first end being disposed on the base, and the second end being connected to a flexible neural electrode. The implant assist component drives the flexible neural electrode to be inserted into a preset position, thereby achieving implantation of the flexible neural electrode. Furthermore, there may be multiple implant assist components, with the second end of each implant assist component being connected to a plurality of flexible neural electrodes in a one-to-one correspondence. By pre-assembling the implant assist component and the flexible neural electrodes, at least two flexible neural electrodes can be simultaneously implanted into the preset positions using the implant assist component during implantation, thereby greatly reducing the time required to implant multiple flexible neural electrodes, improving implantation efficiency, and thereby ensuring the safety of flexible neural electrode implantation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG1 is a structural schematic diagram of an implant assisting device provided in an embodiment of the present application;

[0025] FIG2 is a second structural diagram of the implant assisting device provided in an embodiment of the present application;

[0026] FIG3 is a third structural diagram of the implant assisting device provided in an embodiment of the present application;

[0027] FIG4 is a schematic structural diagram of a single flexible neural electrode assembled with an implant assisting device provided in an embodiment of the present application;

[0028] FIG5 is a partial enlarged view of point I in FIG4;

[0029] FIG6 is a fourth structural diagram of the implant assisting device provided in an embodiment of the present application;

[0030] FIG7 is a fifth structural diagram of the implant assisting device provided in an embodiment of the present application;

[0031] FIG8 is a schematic diagram of a base provided in an embodiment of the present application;

[0032] FIG9 is a sixth structural diagram of the implant assisting device provided in an embodiment of the present application;

[0033] FIG10 is a seventh structural diagram of the implant assisting device provided in an embodiment of the present application;

[0034] FIG11 is a first processing diagram of the implant assisting device provided in an embodiment of the present application;

[0035] FIG12 is a second processing diagram of the implant assisting device provided in an embodiment of the present application.

[0036] Explanation of the reference numerals: 100 - base; 110 - mounting portion; 200 - implantation auxiliary component; 210 - first end; 220 - second end; 230 - first surface; 240 - second surface; 300 - fixing component; 400 - holding component; 500 - first surface; 600 - second surface; 10 - flexible neural electrode. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0039] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0040] The terms "first," "second," and "third" (if any) in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can, for example, be implemented in orders other than those illustrated or described herein.

[0041] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or display that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, product or display.

[0042] As described in the background art, existing invasive brain-computer interfaces usually use flexible neural electrodes for neural signal acquisition to prevent the electrodes from causing damage to the surrounding nervous system, reduce the attenuation of neural signals caused by immune responses, and thus increase the stable working time of the invasive brain-computer interface in the human body. However, since the Young's modulus and bending stiffness of flexible neural electrodes are much smaller than those of rigid neural electrodes, the flexible neural electrodes cannot be implanted solely based on their own stiffness. Therefore, in the prior art, flexible neural electrodes are usually bonded to hard needles made of alloys to complete the implantation. However, for arrays composed of large-scale flexible neural electrodes, the flexible neural electrodes need to be implanted one by one during the implantation process, which consumes a lot of time and exposes the brain tissue for a long time, greatly increasing the surgical risk and infection risk.

[0043] In response to the above technical problems, the present application proposes an implantation assist device, which includes a base and at least two implantation assist components disposed on the base, wherein the implantation assist components have a first end and a second end, each first end being disposed on the base, and the second end being used to connect to a flexible neural electrode in a one-to-one correspondence, thereby driving the flexible neural electrode to be inserted into a preset position through the implantation assist component. When the flexible neural electrode is large in scale, the implantation assist component and the flexible neural electrode can be preassembled together, so that multiple flexible neural electrodes can be implanted simultaneously using the implantation assist device, thereby greatly reducing the time required to implant multiple flexible neural electrodes, improving the implantation efficiency, and thus ensuring the safety of the flexible neural electrode implantation.

[0044] The following describes in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems using specific embodiments. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0045] Figure 1 is a schematic diagram of the structure of the implant assisting device provided in an embodiment of the present application, Figure 2 is a schematic diagram of the structure of the implant assisting device provided in an embodiment of the present application, and Figure 6 is a schematic diagram of the structure of the implant assisting device provided in an embodiment of the present application. Please refer to Figures 1, 2, and 6.

[0046] This embodiment provides an implant assist device, comprising a base 100 and at least two implant assist components 200. When the implant assist device is implanted, the base 100 can be manually or mechanically grasped, thereby improving the convenience of implantation. Each implant assist component 200 has a first end 210 and a second end 220 disposed opposite each other. Each first end 210 is disposed on the base 100, and the second end 220 is configured to connect to a flexible neural electrode 10 in a one-to-one manner, thereby driving the flexible neural electrode 10 to be inserted into a predetermined position.

[0047] Since the implantation auxiliary parts 200 provided in this embodiment can be two or more, the corresponding number of flexible neural electrodes 10 is less than or equal to the number of implantation auxiliary parts 200. When the number of flexible neural electrodes 10 to be implanted is too large, it will take a lot of time to implant the flexible neural electrodes 10 one by one. The implantation auxiliary device provided in this embodiment can connect each flexible neural electrode 10 to the second end 220 of the implantation auxiliary part 200 one by one before implantation, thereby pre-assembling the flexible neural electrode 10 and the implantation auxiliary part 200 together, so that multiple flexible neural electrodes 10 can be directly implanted simultaneously using the implantation auxiliary device during implantation, which greatly reduces the time consumed in implanting multiple flexible neural electrodes 10, improves the implantation efficiency, and further ensures the safety of the flexible neural electrode 10 implantation.

[0048] Specifically, the flexible nerve electrode 10 and the implantation auxiliary component 200 are fixed by a soluble biocompatible adhesive. After the implantation auxiliary device drives the flexible nerve electrode 10 to be inserted into the preset position, the soluble biocompatible adhesive is allowed to dissolve, and the flexible nerve electrode 10 is separated from the implantation auxiliary component 200. The implantation auxiliary device can then be pulled out, thereby completing the implantation of the flexible nerve electrode 10.

[0049] For example, the soluble biocompatible adhesive is fibrin. It is understood that the specific composition of the soluble biocompatible adhesive is not limited here, and other suitable adhesives can be selected for bonding and fixing according to needs.

[0050] Furthermore, in this embodiment, a plurality of implantation aids 200 are arranged side by side on the end face of the base 100, and one of the two opposite surfaces of the implantation aid 200 and the base 100 is flush, thereby ensuring that the flexible neural electrode 10 is in the same plane during implantation, thereby achieving smooth implantation of the flexible neural electrode 10.

[0051] It should be noted that the multiple implantation aids 200 can be disposed on the same surface or different surfaces of the base 100, and according to requirements, the multiple implantation aids 200 can be arranged in any number and manner to accommodate different implantation requirements. For example, the multiple implantation aids 200 are disposed in an array on the surface of the base 100.

[0052] Furthermore, the implant assist component 200 can be made of a rigid material to enhance its bending stiffness, thereby preventing the implant assist component 200 from bending during implantation, which could result in the flexible neural electrode 10 being unable to be accurately implanted at the preset location, or deviating from the preset path during implantation, thereby damaging brain blood vessels. For example, the implant assist component 200 is made of tungsten alloy. Using an implant assist component 200 made of this material can effectively insert the flexible neural electrode 10 into the preset location.

[0053] It should be noted that the specific material of the implantation auxiliary component 200 is not limited here. In other embodiments, the implantation auxiliary component 200 can be made of other suitable materials according to needs.

[0054] Figure 11 is a schematic diagram of the first processing method of the implant assisting device provided in an embodiment of the present application, and Figure 12 is a schematic diagram of the second processing method of the implant assisting device provided in an embodiment of the present application. Please refer to Figures 1, 11, and 12. Specifically, in this embodiment, the base 100 and the implant assisting member 200 are integrally formed using a micro-electromechanical system (MEMS) process (hereinafter referred to as the MEMS process).

[0055] The MEMS process includes bulk silicon MEMS processing. The following briefly describes the steps of processing the implant assist device provided by this embodiment using bulk silicon MEMS processing:

[0056] S1: Cleaning the workpiece to be processed (in this embodiment, the workpiece to be processed is a silicon wafer) (for example, wet cleaning, RCA cleaning, or diluted chemical cleaning) to remove impurities on its surface.

[0057] S2: coating a layer of photoresist on the first surface 500 of the workpiece to be processed, and performing a pre-baking operation to volatilize the organic solvent in the photoresist.

[0058] S3: Use a photolithography machine and a corresponding first mask to sequentially expose, post-bake, develop, and rinse the workpiece coated with photoresist.

[0059] S4: etching (dry etching) the rinsed workpiece to be processed, and then removing the remaining photoresist to form a groove on the workpiece to be processed, thereby obtaining the structure shown in FIG12 .

[0060] S5: Turn over the workpiece, place the notch of the groove downward, and apply a layer of photoresist on the second surface 600 of the workpiece opposite to the first surface 500, and then perform pre-baking to volatilize the organic solvent in the photoresist.

[0061] S6: Use a photolithography machine and a corresponding second mask to sequentially expose, post-bake, develop, and rinse the workpiece coated with photoresist.

[0062] S7: dry-etching the rinsed workpiece to be processed to form an implantation auxiliary member 200 on the workpiece to be processed corresponding to the groove, and then removing the remaining photoresist to obtain the structure shown in FIG1 .

[0063] S8: Cut the workpiece processed in the previous step (if the workpiece is of a suitable shape and size, cutting is not required) to obtain an implant assisting device.

[0064] It should be noted that when the implant assist device is manufactured using the MEMS processing technology, it is not limited to the bulk silicon MEMS processing technology. For example, the implant assist device can also be integrally formed using the surface silicon MEMS processing technology.

[0065] It is understandable that the processing technology of the base 100 and the implant auxiliary component 200 is not limited to the above-mentioned MEMS process, and other suitable processes can be adopted according to needs. For example, the base 100 and the implant auxiliary component 200 can be integrally formed by cutting.

[0066] For example, the base 100 and the implant assisting member 200 can be manufactured using an electrospark process. When using the electrospark process to manufacture an implant assisting device, a workpiece to be processed can be placed on a workbench. A cutting device is then used to machine a groove into the workpiece, resulting in the structure shown in FIG12 . The workpiece is then flipped over, with the groove facing downward, and the cutting device is used to cut the workpiece corresponding to the groove into the implant assisting member 200 .

[0067] It should be noted that when using the electric spark process to manufacture the implant assist device, the implant assist part 200 and the base 100 can also be directly cut on the workpiece using cutting equipment. The specific method is not limited to the above steps, and this embodiment does not impose any restrictions on this.

[0068] Figure 3 is a third structural diagram of the implant assisting device provided in an embodiment of the present application, Figure 4 is a structural diagram of a single flexible neural electrode assembled with the implant assisting device provided in an embodiment of the present application, and Figure 5 is a partial enlarged view of point I in Figure 4. Please refer to Figures 3 to 5.

[0069] In an optional exemplary embodiment, the implant assisting member further includes a gripping member 400, which is disposed on the base 100 for easy holding, so that the implant assisting device and the flexible neural electrode 10 can be implanted into a preset position manually or mechanically.

[0070] Specifically, in an optional exemplary embodiment, the grip 400 and base 100 are integrally formed. This integral molding process ensures the connection strength between the grip 400 and base 100, preventing the grip 400 or base 100 from falling off during implantation. The entire structure is manufactured using a bulk silicon MEMS process. It should be understood that the processing technology for the grip 400 and base 100 is not limited to the aforementioned bulk silicon MEMS process; other suitable processes may be used as needed.

[0071] In an optional exemplary embodiment, the gripping member 400 and the base 100 may also be detachably connected. When the space available for the implantation path is limited during implantation, the gripping member 400 may be removed to ensure smooth implantation of the implant assist device. It should be noted that this embodiment does not limit the connection method and processing technology of the gripping member 400 and the base 100.

[0072] Specifically, in an optional exemplary embodiment, a receiving hole is provided at one end of the flexible neural electrode 10, and the second end 220 of the implant auxiliary component 200 can be inserted into the receiving hole. At this time, the second end 220 can be selectively connected to the flexible neural electrode 10 through a soluble biocompatible adhesive, which will greatly improve the reliability of the connection between the implant auxiliary component 200 and the flexible neural electrode 10, thereby avoiding the problem of the flexible neural electrode 10 falling off during implantation, affecting the implantation effect.

[0073] Figure 6 is a fourth structural diagram of an implant assisting device provided in an embodiment of the present application, Figure 7 is a fifth structural diagram of an implant assisting device provided in an embodiment of the present application, Figure 8 is a schematic diagram of a base provided in an embodiment of the present application, Figure 9 is a sixth structural diagram of an implant assisting device provided in an embodiment of the present application, and Figure 10 is a seventh structural diagram of an implant assisting device provided in an embodiment of the present application. Please refer to Figures 6 to 10.

[0074] In an optional exemplary embodiment, the base 100 is detachably connected to the implantation auxiliary component 200, and at least two mounting portions 110 are provided on the base 100. The implantation auxiliary component 200 is connected to the mounting portions 100 one by one, thereby fixing the implantation auxiliary component 200 to the base 100.

[0075] By providing the mounting portion 110, the implantation auxiliary component 200 and the base 100 can be detachably connected, so that the number and installation position of the implantation auxiliary components 200 can be freely adjusted according to needs, thereby improving the adaptability of the implantation auxiliary device provided in this embodiment, and eliminating the need to process implantation auxiliary components 200 of different numbers and positions, thereby reducing production costs.

[0076] It should be noted that the structure of the mounting portion 110 can be selected according to needs, and there is no limitation on the mounting portion 110. For example, the mounting portion 110 can be a mounting hole or a mounting seat.

[0077] It should be noted that the mounting portion 100 can be integrally formed with the base 100 or detachably connected. For example, when the mounting portion 110 is a mounting hole, the hole can be directly drilled on the base 100; when the mounting portion 110 is a mounting seat, the mounting portion 110 can be detachably connected to the base 100 or fixedly connected by bonding or other means. This embodiment does not impose any restrictions on the connection method between the mounting portion 110 and the base 100.

[0078] Specifically, in an optional exemplary embodiment, a through hole is provided on the mounting portion 110, and the through hole passes through the mounting portion 110 and the base 100. The implant auxiliary component 200 can be inserted into the base 100 through the through hole, and the first end 210 and the second end 220 are respectively located on both sides of the base 100, the first end 210 is connected to the base 100, and the second end is connected to the flexible neural electrode 10.

[0079] Specifically, in an optional exemplary embodiment, the implant assist device further includes a fixing member 300. The first end 210 of the implant assist member 200 is bent toward the base 100 and abuts against the surface of the base 100. The fixing member 300 is covered on the base 100, thereby pressing the first end 210 against the base 100. By providing the fixing member 300 to press the first end 210, the connection strength between the implant assist member 200 and the base 100 is further enhanced.

[0080] It should be noted that, in an optional exemplary embodiment, the fixing member 300 can be used to press the implantation aid 200 against the base 100 in other ways as needed, and no limitation is imposed on the fixing method of the implantation aid 200 and the base 100. For example, the cross-sectional area of ​​the first end 210 is greater than the cross-sectional area of ​​the second end 220, and the size of the first end 210 is greater than the size of the through hole, so that the first end 210 can be snapped into the through hole to fix the implantation aid 200 to the base 100.

[0081] Specifically, in this embodiment, the shape and size of the fixing member 300 are the same as those of the base 100, thereby compressing the first end 210 of the implant aid 200 while reducing processing costs. It should be noted that in alternative exemplary embodiments, the shape and size of the fixing member 300 can also be adaptively adjusted according to individual needs, and this embodiment does not impose any restrictions on the shape and size of the fixing member 300.

[0082] Specifically, in this embodiment, the fixing member 300 is bonded to the base 100. By bonding the fixing member 300 to the base 100, the connection strength between the fixing member 300 and the base 100 is ensured, thereby preventing the fixing member 300 or the base 100 from falling off during the implantation process. It should be noted that in optional exemplary embodiments, the fixing method between the fixing member 300 and the base 100 can also be adaptively adjusted according to one's own needs. This embodiment does not impose any restrictions on the fixing method between the fixing member 300 and the base 100.

[0083] In an optional exemplary embodiment, the fixing member 300 is detachably connected to the base 100, so that when the number or installation position of the implant auxiliary members 200 needs to be adjusted, the fixing member 300 can be removed, and the number or installation position of the implant auxiliary members 200 can be further adjusted, thereby improving the adaptability of the implant auxiliary device provided by this embodiment, and eliminating the need to process implant auxiliary members 200 of different numbers and positions, thereby reducing production costs.

[0084] By opening a through hole on the mounting portion 110, the implantation auxiliary component 200 can be set through the base 100. Compared with directly connecting the implantation auxiliary component 200 to the base 100 through the mounting portion 110, the connection strength between the implantation auxiliary component 200 and the base 100 is higher, further avoiding the implantation auxiliary component 200 from falling off due to force during the implantation process.

[0085] Specifically, in an optional exemplary embodiment, the implantation aid 200 is a tungsten wire. Meanwhile, it is understood that the material of the implantation aid 200 is not limited to the above-mentioned tungsten wire, and can be made of other suitable materials according to needs.

[0086] Specifically, in an optional exemplary embodiment, the cross-sectional area of ​​the implant aid 200 gradually decreases from the first end 210 to the second end 220, thereby facilitating the fixation of the flexible neural electrode 10 to the second end 220. Furthermore, gradually decreasing the cross-sectional area of ​​the implant aid 200 can improve the smoothness of the surface of the implant aid 200, thereby enhancing implant safety, reducing resistance during implantation, and further enhancing the implantation effect of the flexible neural electrode 10.

[0087] Specifically, in an optional exemplary embodiment, the implant auxiliary component 200 has a first surface 230 and a second surface 240 relative to each other, and the first surface 230 and the second surface 240 can be electroplated surfaces, polished surfaces or chemically corroded surfaces, that is, by electroplating, polishing or chemically corroding the first surface 230 and the second surface 240, the cross-sectional area of ​​the implant auxiliary component 200 gradually decreases from the first end 210 to the second end 220.

[0088] It is understandable that this embodiment does not impose any restrictions on the processing methods of the first surface 230 and the second surface 240 , and an appropriate processing method can be adaptively selected according to one's own needs.

[0089] The following briefly describes the process of manufacturing the implant assist device using the assembly method provided in this embodiment:

[0090] S1: Take a workpiece of suitable size and drill two or more through holes in the workpiece to obtain the structure shown in FIG. 8 , thereby forming a base 100 .

[0091] S2: Select a tungsten wire (other materials may also be used) that matches the size of the through hole and cut it into a suitable length, and pass it through the through hole. The two ends of the tungsten wire form a first end 210 and a second end 220 respectively.

[0092] S3: applying pressure to the first end 210 so that the first end 210 abuts against the base 100 to obtain the structure shown in FIG. 7 .

[0093] S4: Apply adhesive to the surface where the first end 210 abuts against the base 100 in the previous step, take another piece of original material of appropriate size and press it on the adhesive to complete the assembly of the implant assisting device and obtain the structure shown in FIG9 .

[0094] Furthermore, in an optional exemplary embodiment, multiple implant assisting devices can be combined in any manner to form an implant assisting module, each implant assisting module containing multiple implant assisting devices of the same or different specifications, thereby jointly completing the implantation of the flexible neural electrode 10.

[0095] It should be noted that different implant assist devices can also be selectively packaged for easy transportation.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An implantation assisting device for implanting a flexible neural electrode, characterized in that: The implantation assisting device comprises: Pedestal; At least two implantation auxiliary parts, each of which has a first end and a second end relative to each other, each of the first ends is arranged on the base, and the second ends are used to be connected to the flexible neural electrodes one by one to drive the flexible neural electrodes to be inserted into a preset position.

2. The implantation assisting device according to claim 1, characterized in that: At least two mounting parts are arranged on the base, and the implantation auxiliary parts are connected to the mounting parts in a one-to-one correspondence to fix the implantation auxiliary parts to the base.

3. The implantation assisting device according to claim 2, characterized in that: The mounting portion is provided with a through hole, and the implantation auxiliary component is inserted into the base through the through hole. The first end and the second end are respectively located on two sides of the base, and the first end is connected to the base.

4. The implantation assisting device according to claim 2, characterized in that: The implantation assisting device further comprises a fixing member, wherein the first end is bent toward the base and abuts against a surface of the base; The fixing member is covered on the base to press the first end tightly onto the base.

5. The implantation assisting device according to claim 4, characterized in that: The fixing member is bonded and fixed to the base.

6. The implantation assisting device according to claim 1, characterized in that: The implantation auxiliary parts are arranged on the end surface of the base, and the implantation auxiliary parts are arranged side by side, and the implantation auxiliary parts are flush with one of the two surfaces opposite to the base.

7. The implantation assisting device according to any one of claims 1 to 5, characterized in that: There are multiple implantation auxiliary components, and the multiple implantation auxiliary components are arranged in an array on the surface of the base.

8. The implantation assisting device according to claim 7, characterized in that: The implantation auxiliary component and the base are integrally formed or cut through a micro-electromechanical system processing technology.

9. The implantation assisting device according to any one of claims 1 to 5, characterized in that: The cross section of the implantation auxiliary component gradually decreases from the first end to the second end.

10. The implantation assisting device according to claim 9, characterized in that: The implantation auxiliary component has a first surface and a second surface opposite to each other, and the first surface and the second surface are electroplated surfaces, polished surfaces or chemically corroded surfaces.

11. The implantation assisting device according to any one of claims 1 to 5, characterized in that: The implantation assisting device further comprises a holding piece, and the holding piece is arranged on the base.

12. The implantation assisting device according to claim 11, characterized in that: The gripping member is integrally formed with the base; Alternatively, the gripping member is detachably connected to the base.

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