Electronic component and method for producing electronic component

Abstract

This electronic component comprises a substrate which is provided with: a circuit component; a conductor that is conductively connected to a conductive component of a shield that shields the circuit component from the outside; and a conductive member that is in contact with both the conductive component and the conductor. The conductive member and the conductive component are alloyed.

Description

Electronic component and method for manufacturing electronic component

[0001] The present invention relates to an electronic component and a method for manufacturing an electronic component.

[0002] Electronic components have been known in the past in which a circuit board on which various circuit components are mounted is sealed with resin and the resin surface is covered with an electromagnetic wave shielding material. The purpose of this is to prevent electromagnetic waves from penetrating into the sealed interior, and the electromagnetic wave shielding material often uses a thin metal film formed by vapor deposition or plating, or a conductive resin containing a metal filler.

[0003] For example, Patent Documents 1 and 2 disclose the configuration of a circuit module, which is an example of an electronic component. In these circuit modules, a conductor portion located at a side edge of a printed circuit board (PCB) is conductively connected to a conductive component contained in a shield.

[0004] In the circuit module described in Patent Document 2, a conductor portion located at a side edge of the PCB and a conductive component contained in the shield are electrically connected via solder.

[0005] JP 2004-172176 A International Publication No. 2015 / 194435

[0006] In the above-described conventional electronic components, the conductive connection between the conductor portion of the substrate and the conductive component of the shield is formed by their mutual contact. Here, the side end surface of the conductor portion that contacts the shield is a cut surface formed by groove machining on the substrate, and this cut surface may not necessarily be flat at a microscopic level. Meanwhile, the conductive component of the shield is embedded in the resin of the base material that constitutes the shield, and the conductive component exposed at the inner wall surface of the shield that contacts the conductor portion of the substrate is distributed in a patchy pattern at a microscopic level.

[0007] When a conductive connection is formed by contact between the non-flat conductor portion of the substrate and the patchy conductive component of the shield, there is a problem that individual differences in the conductive connection are likely to occur. Furthermore, if the electronic component is for high-frequency signals, individual differences in the high-frequency characteristics of the electronic component are likely to occur. Furthermore, there is a problem that the connection resistance between the conductor portion of the substrate and the conductive component of the shield can change due to factors such as thermal history after the electronic component is completed.

[0008] These problems exist as long as the side end surface of the solder that contacts the shield is a cut surface, even when the conductive connection is formed via solder as in Patent Document 2. In other words, in the above-mentioned conventional electronic components, there is a certain limit to how much improvement can be made in the connection reliability between the substrate and the shield.

[0009] An object of the present invention is to provide an electronic component and a method for manufacturing an electronic component that can reliably improve the connection reliability between a substrate and a shield.

[0010] One aspect of the electronic component according to the present invention has a substrate provided with a circuit component, a conductor conductively connected to a conductive component of a shield that shields the circuit component from the outside, and a conductive member in contact with both the conductive component and the conductor, wherein the conductive member and the conductive component are alloyed.

[0011] One aspect of the method for manufacturing an electronic component according to the present invention includes preparing a substrate having a circuit component, a conductor conductively connected to a conductive component of a shield that shields the circuit component from the outside, and a conductive member in contact with both the conductive component and the conductor, and heat-treating the substrate at a temperature exceeding the melting point of the conductive member to alloy the conductive member and the conductive component.

[0012] According to the present invention, the reliability of the connection between the substrate and the shield can be reliably improved.

[0013] FIG. 1A is a diagram schematically illustrating the appearance of an electronic component according to a first embodiment, and FIGS. 1B and 1C are diagrams schematically illustrating the configuration of the front and back sides of a circuit board in the electronic component. FIG. 2 is a longitudinal cross-sectional view and an enlarged view of a main portion illustrating the internal configuration of the electronic component according to the first embodiment. FIG. 3 is a diagram for explaining the configuration of a ground electrode in the electronic component according to the first embodiment. FIGS. 4A to 4F are diagrams illustrating the order of steps in a manufacturing method for the electronic component according to the first embodiment. FIGS. 5A and 5B are SEM images of the contact state between the ground electrode and the conductive component of the shield in a conventional electronic component and an electronic component according to the first embodiment. FIG. 6 is a graph comparing the change in connection resistance due to thermal history between the conventional electronic component and the electronic component according to the first embodiment. FIG. 7 is a diagram for explaining the general configuration of an electronic component according to a second embodiment. FIG. 8 is a diagram schematically illustrating the configuration of the front side of a circuit board in the electronic component according to the second embodiment.

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0015] (Embodiment 1) (Configuration of Electronic Component) Fig. 1A is a diagram schematically showing the appearance of an electronic component according to embodiment 1, and Figs. 1B and 1C are diagrams schematically showing the configuration of the front and back sides of a circuit board in the electronic component. Fig. 2 is a vertical cross-sectional view and an enlarged view of a main part showing the internal configuration of the electronic component according to the present embodiment. Fig. 3 is a diagram for explaining the configuration of a ground electrode in the electronic component according to the present embodiment.

[0016] In this embodiment, the electronic component 100 is described as a wireless module with a slot antenna, but the application of the electronic component 100 is not limited to a wireless module with a slot antenna.

[0017] The electronic component 100 includes a shield 110 and a circuit board 120 .

[0018] The shield 110 is a box-shaped lid having an elongated rectangular shape in plan view that matches the elongated rectangular shape of the circuit board 120, and functions to shield the circuit components 140a, 140b, and 140c arranged on the circuit board 120 from the outside. The shield 110 is made of a conductive resin material. The conductive resin material is a material obtained by mixing a metal filler into an insulating resin material as a base material. The metal material that serves as the conductive component of the shield 110 is, for example, Cu or Ag.

[0019] A pattern of slots 112 is formed on the outer surface of the shield 110 (in this embodiment, the top surface 110a and the front wall 110c). The slots 112 are grooves that form gaps without conductive components on the outer surface of the shield 110. These grooves may be used for marking letters or the like, but in this embodiment, they are used as slots 112 to realize a slot antenna.

[0020] In this embodiment, the circuit board 120 is a flat, elongated rectangular plate, and is a multilayer printed circuit board on which a multilayer wiring pattern (not shown) is formed. Since a conventionally known configuration can be adopted as the configuration of the multilayer printed circuit board, detailed description thereof will be omitted here.

[0021] On a layer on the surface 122 side of the circuit board 120 (hereinafter referred to as the "surface layer"; the surface layer is an example of the first layer), circuit components 140a, 140b, and 140c are arranged by reflow mounting with solders 154a, 154b, and 154c. The circuit components 140a, 140b, and 140c are, for example, semiconductor devices or chip components. In this embodiment, the circuit component 140b is a semiconductor device that handles high-frequency signals, the circuit component 140a is a chip capacitor, and the circuit component 140c is a chip inductor.

[0022] A large number of electrodes are disposed on the surface layer. The electrodes disposed on the surface layer include a ground electrode 1222 and terminal connection electrodes 1224a, 1224b, and 1224c. In Fig. 2 and other figures, the ground electrode 1222 and the terminal connection electrodes 1224a, 1224b, and 1224c disposed on the surface layer are disposed so as to protrude upward from the surface layer of the circuit board 120, but they may also be disposed so as to be embedded in the surface layer of the circuit board 120 with their top surfaces facing upward.

[0023] The terminal connection electrodes 1224a, 1224b, and 1224c are electrodes connected to the terminals of the circuit components 140a, 140b, and 140c, respectively. The terminal connection electrodes 1224a, 1224b, and 1224c are connected to a terminal connection back surface electrode 1324 provided on the back surface layer via a wiring pattern (not shown) arranged on an inner layer of the circuit board 120.

[0024] The ground electrode 1222 is an electrode that is conductively connected to a conductive component of the shield 110 and grounds the shield 110. Because the shield 110 is grounded by the ground electrode 1222, forming a slot 112 in the shield 110 makes it possible to realize the electronic component 100 that functions as a slot antenna. The ground electrode 1222 is connected to a ground back surface electrode 1322 provided on a layer on the back surface 132 side (hereinafter referred to as the "back surface layer." The back surface layer is an example of a second layer) via a wiring pattern (not shown) arranged on an inner layer of the circuit board 120. The ground electrode 1222 is an example of a conductor that is conductively connected to a conductive component of the shield 110.

[0025] In the present embodiment, the ground electrode 1222 is a comb-like electrode arranged in a rectangular ring shape along the outer periphery of the circuit board 120. Because the ground electrode 1222 is provided along the outer periphery of the circuit board 120, when the shield 110 is provided in the half-cut groove 170 formed in the outer periphery of the circuit board 120, the side of the ground electrode 1222 and the inner wall surface 110e of the shield 110 are adjacent to each other. This forms a conductive connection between the ground electrode 1222 and the conductive component of the shield 110.

[0026] A conductive member 152 is applied to the upper surface of the ground electrode 1222. The conductive member 152 is made of a material containing one or more of Sn, Ag, Cu, Bi, In, Sb, Ni, Ge, Co, P, and Pb. An example of the conductive member 152 is solder containing Sn as a main component. Hereinafter, for ease of explanation, the conductive member 152 will be referred to as "solder 152."

[0027] Because the solder 152 is applied to the upper surface of the ground electrode 1222, whose side is in contact with the shield 110, the side of the solder 152 also contacts the shield 110. Therefore, the solder 152 is also conductively connected to the conductive component of the shield 110. The side of the solder 152, together with the side of the ground electrode 1222, forms a conductive connection surface with the conductive component of the shield 110. This makes it possible to increase the area of ​​the conductive connection surface. Note that, provided that the conductive connection between the solder 152 and the shield 110 is ensured, a direct conductive connection between the ground electrode 1222 and the shield 110 is not necessarily required.

[0028] The side of the solder 152 that contacts the inner wall surface 110e of the shield 110 is alloyed with the conductive components distributed on the inner wall surface 110e, forming an alloy joint 156. The solder 152 applied to the ground electrode 1222 that should be conductively connected to the conductive component of the shield 110 is alloyed with the conductive component of the shield 110, thereby stably reducing the connection resistance between the ground electrode 1222 and the shield 110 and suppressing an increase in the connection resistance between the ground electrode 1222 and the shield 110 regardless of thermal history, etc. In other words, the connection reliability between the circuit board 120 and the shield 110 can be reliably improved.

[0029] The solder 152, together with the circuit components 140a, 140b, 140c, etc., is covered with the sealing resin 160. That is, the lower portion of the solder 152 contacts the ground electrode 1222, the side portion facing the inner wall surface 110e of the shield 110 is alloyed with the conductive component distributed on the inner wall surface 110e, and the remaining portion is covered with the sealing resin 160.

[0030] Here, the sealing resin 160 may undergo thermal expansion due to thermal history or the like. Furthermore, thermal expansion of the sealing resin 160 may cause the sealing resin 160 to penetrate into the conductive connection surface between the ground electrode 1222 and the shield 110. In this case, if the bond between the ground electrode 1222 and the shield 110 at the conductive connection surface is weak, the bond may separate, increasing the connection resistance. However, in this embodiment, the solder 152 and the conductive component of the shield 110 form an alloy bond 156 at the conductive connection surface, which allows the bond between the ground electrode 1222 and the shield 110 at the conductive connection surface to be firmly maintained. Therefore, even if the sealing resin 160 thermally expands due to thermal history or the like after the manufacture of the electronic component 100, the connection between the circuit board 120 and the shield 110 can be stably maintained.

[0031] In addition to the rear surface electrode 1322 for grounding and the rear surface electrode 1324 for terminal connection, monitor electrodes 1328a and 1328b are provided on the rear surface layer of the circuit board 120. In this embodiment, four monitor electrodes 1328a and 1328b are provided, including two monitor electrodes 1328a and two monitor electrodes 1328b. The monitor electrodes 1328a and 1328b are connected to corresponding rear surface wiring 1326a and 1326b, respectively, and are further connected to corresponding surface surface wiring 1226a and 1226b via inner layer wiring patterns (not shown). The surface surface wiring 1226a and 1226b are each electrically connected to the shield 110 and / or the ground electrode 1222.

[0032] As a result, monitor electrodes 1328a and 1328b form a circuit for monitoring the connection resistance between shield 110 and ground electrode 1222. Therefore, even after manufacturing electronic component 100, it is possible to measure the connection resistance between shield 110 and ground electrode 1222 at any time to check whether the connection resistance is maintained at an appropriate level. Therefore, the reliability of the connection between circuit board 120 and shield 110 via solder 152 can be ensured over the long term.

[0033] In this embodiment, the circuit for monitoring the connection resistance between the shield 110 and the ground electrode 1222 is composed of four monitor electrodes 1328a, 1328b. That is, this circuit is configured to perform accurate electrical resistance measurements using the four-terminal method. However, this circuit may also be configured to perform electrical resistance measurements using another method, such as the two-terminal method.

[0034] As described above, the ground electrode 1222 is a comb-shaped electrode. The ground electrode 1222 is subject to cutting in the half dicing process. If the ground electrode 1222 were configured to be continuous in a rectangular ring shape along the outer periphery of the circuit board 120, there is a risk that stress would be concentrated locally on the ground electrode 1222 when the ground electrode 1222 is cut in the half dicing process, resulting in dicing defects. In this regard, if the ground electrode 1222 is a comb-shaped electrode, the occurrence of stress concentration and therefore dicing defects in the half dicing process can be suppressed, and the yield of the electronic component 100 can be improved.

[0035] In this embodiment, the comb-tooth-shaped ground electrodes 1222 have a line width W of 200 μm, which is the width of each individual ground electrode 1222, and a line spacing G of 50 μm, which is the distance between adjacent ground electrodes 1222. By making the line width W larger than the line spacing G in this way, the area to which the solder 152 is applied, particularly the width, can be increased, and therefore the contact area between the solder 152 and the conductive component of the shield 110 can be increased.

[0036] The line width W of the ground electrode 1222 is preferably 100 μm or greater. Setting the line width W of the ground electrode 1222 is effectively equivalent to setting the maximum width of the solder 152 to be applied to the ground electrode 1222. If the solder 152 is applied in a size that exceeds the line width W of the ground electrode 1222, the solder 152 may flow to undesired areas on the surface 122 of the circuit board 120, causing problems. In light of this, the line width W of the ground electrode 1222 is preferably greater than a certain size. Furthermore, when applying the solder 152 by screen printing, for example, it is essential that the solder 152 be easily removed from the metal mask. In light of this, the line width W of the ground electrode 1222 is preferably greater than a certain size. The width of the solder 152 that is easily removed from the metal mask is, for example, 100 μm. Therefore, as described above, it is preferable that the line width W of the ground electrode 1222, which determines the width of the solder 152, is 100 μm or more.

[0037] On the other hand, if the line width W of the ground electrode 1222 is excessively wide, the solder 152 may spread too much in the width direction before solidification. In such a case, the thickness of the solder 152 becomes thin, and as a result, the contact area between the solder 152 and the shield 110 becomes a linear shape with no height. In order to ensure a certain area or more for alloying the solder 152 and the conductive components of the shield 110, it is preferable that the contact area between the solder 152 and the shield 110 has some height. Therefore, in order to restrict the spread of the solder 152 in the width direction and ensure the height of the contact area, it is preferable to set the line width W of the ground electrode 1222 to a certain value or less, for example, 500 μm or less.

[0038] (Method of Manufacturing Electronic Component) Next, a description will be given of a method of manufacturing electronic component 100. Figures 4A to 4F are diagrams showing the steps of the method of manufacturing electronic component 100 in the order of execution.

[0039] The first step shown in FIG. 4A is a reflow mounting step. In the reflow mounting step, circuit components 140a to 140c (hereinafter referred to as "circuit components 140" for ease of explanation) are reflow mounted on terminal connection electrodes 1224a to 1224c (hereinafter referred to as "terminal connection electrodes 1224" for ease of explanation) on the surface 122 of the circuit board 120. More specifically, first, cream-like solder 152 and solder 154a to 154c (hereinafter referred to as "solder 154" for ease of explanation) are applied by screen printing to the ground electrode 1222 and the terminal connection electrode 1224. Then, the circuit component 140 is placed on the cream-like solder 154, and the circuit board 120 is heated in a reflow furnace or the like. The cream-like solder 154 melts and then solidifies, fixing the circuit component 140. At this time, the solder 152 on the ground electrode 1222 also solidifies.

[0040] The circuit board 120 is in the form of a multiple-panel board in which a plurality of module boards are connected in a front-to-back and left-to-right direction until it is separated into individual pieces in a later process.

[0041] 4B is a resin sealing layer forming step in which a layer of sealing resin 160 is formed so as to bury all of the ground electrodes 1222 and terminal connection electrodes 1224, the solders 152 and 154a, and the circuit components 140 on the front surface 122.

[0042] The third step shown in FIG. 4C is a half-dicing step (or "grooving step"). In the half-dicing step, half-cut grooves 170 are formed at the boundaries of the module substrate. The half-cut grooves 170 penetrate the layer of sealing resin 160 and have a depth that reaches the middle position in the thickness direction of the circuit board 120. The ground electrodes 1222 and solder 152 located at the edges of the module substrate are partially scraped off to form flush sides (conductive connection surfaces).

[0043] 4D is a shield layer formation step in which a layer of the shield 110 made of a conductive resin material is formed so as to cover the upper surface of the sealing resin 160 and completely fill the half-cut groove 170.

[0044] 4E is a full dicing process (or "singulation process"). In the full dicing process, the module substrate is completely cut at the center position in the width direction of the half-cut groove 170, and the circuit boards 120 are diced into individual pieces.

[0045] 4F is a heat treatment process. In the heat treatment process, the individual circuit boards 120 are placed in a temperature environment exceeding the melting point of the solder 152. This causes the solder 152 to melt and alloy with the conductive component of the shield 110, forming an alloy joint 156 (see FIG. 2) that is an intermetallic compound between the solder 152 and the conductive component of the shield 110.

[0046] Incidentally, since the heating target in the heat treatment process is the solder 152 on the ground electrodes 1222 located in the edge regions of the individual circuit boards 120, the edge regions of the individual circuit boards 120 may be locally heated. However, if the heating of the circuit board 120 is uneven across the surface 122, warping of the circuit board 120 may occur. Therefore, to prevent warping of the circuit board 120, it is preferable to heat the entire circuit board 120 uniformly. In this case, solder having a melting point higher than the high-temperature environment in which the heat treatment process is performed may be used as the solder 154 on the terminal connection electrodes 1224, which is not the heating target.

[0047] The above-described method for manufacturing the electronic component 100 is merely an example. At the time of performing the sixth step shown in FIG. 4F , the circuit board 120 must be provided with the circuit component 140, a conductor (ground electrode 1222) that is conductively connected to the conductive component of the shield 110, and solder 154 that contacts both the conductive component and the conductor. However, the process for preparing such a circuit board 120 is not limited to the above-described example and can be implemented with various modifications. For example, it is possible to perform the full dicing process after the heat treatment process, as long as it can prevent warping of the circuit board 120.

[0048] 5A and 5B are SEM images of the contact state between the ground electrode and the conductive component of the shield in an electronic component according to a conventional example and electronic component 100 according to embodiment 1. The captured range of these SEM images corresponds to the range shown as the enlarged view of the main part in FIG. 2. The conventional example here refers to a configuration in which solder is not used for the conductive connection between the ground electrode and the shield, such as the electronic component described in Patent Document 1, for example.

[0049] In the conventional example (FIG. 5A), the ground electrode and the conductive component distributed in granular form on the inner wall surface of the shield are not in close contact with each other, and a good conductive connection is not necessarily formed. In contrast, in this embodiment (FIG. 5B), the ground electrode and the conductive component distributed in granular form on the inner wall surface of the shield are in close contact with each other (corresponding to alloy joint 156 shown in FIG. 2), and a good conductive connection is formed.

[0050] FIG. 6 is a graph for comparing the change in connection resistance due to thermal history between the electronic component according to the conventional example and the electronic component according to the first embodiment.

[0051] As shown in Fig. 6, in the conventional example ("without solder" in Fig. 6), the connection resistance between the ground electrode and the shield is high from the early stage of the thermal history, and this resistance value increases further as the number of temperature cycles increases. In contrast, in the present embodiment ("with solder" in Fig. 6), the connection resistance between the ground electrode 1222 and the shield 110 remains low from the early stage of the thermal history until the number of temperature cycles reaches 1000.

[0052] Second Embodiment An electronic component according to a second embodiment of the present invention will now be described. The configuration of electronic component 200 according to the present embodiment described below is basically similar to the configuration of electronic component 100 described in the first embodiment. Therefore, the same reference numerals are used to designate components of electronic component 200 that are common to electronic component 100 described in the first embodiment, and detailed description thereof will be omitted. The following description will focus on the differences from the first embodiment.

[0053] Fig. 7 is a diagram for explaining the general configuration of electronic component 200 according to this embodiment. Fig. 8 is a diagram schematically showing the configuration of front surface 122 of circuit board 120 in electronic component 200.

[0054] Electronic component 200 differs from electronic component 100 of embodiment 1 in that slot 282 (second slot) that functions as a slot antenna is provided at a position different from slot 112 provided on top surface 110a of shield 110, specifically, on surface 122 of circuit board 120.

[0055] Although slot 282 may be provided on rear surface 132 of circuit board 120 (see FIG. 1C), the present embodiment will be described taking as an example a case where slot 282 is provided on front surface 122 of circuit board 120.

[0056] In this embodiment, a portion of the surface 122 of the circuit board 120 is covered with a metal plate 280, and a pattern of slots 282 is formed in the metal plate 280.

[0057] One end of the pattern of the slot 282 is connected to one end of the slot 112 formed in the front wall 110c of the shield 110. This allows the slot 282 provided in the circuit board 120 to form an integrated slot antenna together with the slot 112 provided in the shield 110.

[0058] The connection positions of the slots 112 and 282 are part of the outer periphery of the circuit board 120. Therefore, the ground electrode 1222 arranged on the outer periphery of the circuit board 120 is partially removed to avoid the connection positions of the slots 112 and 282. In this embodiment, the line width W of the ground electrode 2222 adjacent to the connection positions of the slots 112 and 282 is narrowed. By doing so, the ground electrodes 1222 and 2222 and the solder 152 arranged thereon (see FIG. 2 , etc.) are arranged in positions different from the connection positions of the slots 112 and 282. In this arrangement, the ground electrodes 1222 and 2222 and the solder 152 arranged thereon do not come into contact with the slots 112 and 282, so the function of the slot antenna is not impaired by the ground electrodes 1222 and 2222.

[0059] Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the specific embodiments described above. Various modifications and changes to the specific examples described in the above embodiments are possible within the scope of the gist of the present invention as defined in the claims.

[0060] The disclosures of the specification, drawings and abstract contained in Japanese Patent Application No. 2023-132282, filed on August 15, 2023, are incorporated herein by reference in their entirety.

[0061] The present invention can be suitably used, for example, in electronic components that employ a configuration in which a shield is provided to shield circuit components mounted on a substrate from the outside.

[0062] 100, 200 Electronic component 110, 210 Shield 110a Top surface 110b Side wall 110c Front wall 110d Rear wall 110e Inner wall 112, 282 Slot 120 Circuit board 122 Surface 1222, 2222 Ground electrode 1224a, 1224b, 1224c Terminal connection electrode 1226a, 1226b Surface side wiring 132 Back surface 1322 Back surface electrode for ground 1324 Terminal connection back surface electrode 1326a, 1326b Back surface side wiring 1328a, 1328b Monitor electrode 140a, 140b, 140c Circuit component 152 Conductive member (e.g., solder) 154a, 154b, 154c Solder 156 Alloy joint 160 Sealing resin 170 Half-cut groove 280 Metal plate 290 Lead-out portion G Line spacing W Line width

Claims

1. An electronic component having a substrate provided with a circuit component, a conductor conductively connected to a conductive component of a shield that shields the circuit component from the outside, and a conductive member in contact with both the conductive component and the conductor, the conductive member and the conductive component being alloyed.

2. The electronic component according to claim 1, wherein the conductive member has a lower portion in contact with the conductor, a side portion facing the inner wall surface of the shield that is alloyed with the conductive component distributed on the inner wall surface, and the remaining portion is covered with a sealing resin.

3. The electronic component according to claim 1, wherein the conductive member is disposed on each electrode, and a side portion of the conductive member, together with a side portion of the conductor, forms a conductive connection surface with the conductive component.

4. The electronic component according to claim 3, wherein the conductor is a comb-shaped electrode arranged on a first layer of the substrate, and the line width of the electrode is greater than the line spacing of the electrode.

5. The electronic component according to claim 4, wherein the line width of the electrode is 100 μm or more.

6. The electronic component according to claim 5, wherein the line width of the electrode is 500 μm or less.

7. The electronic component according to claim 1, wherein the conductor is a ground electrode, and a monitor electrode is provided on a second layer of the substrate, the monitor electrode being electrically connected to the shield and / or the ground electrode via wiring, thereby forming a circuit for monitoring the connection resistance between the shield and the ground electrode.

8. The electronic component according to claim 1, wherein the shield is provided with a groove that forms a gap free of the conductive component.

9. The electronic component according to claim 8, wherein the groove functions as a slot for a slot antenna.

10. An electronic component as described in claim 9, wherein the conductor is disposed on a first layer of the substrate, the conductive member is disposed on the conductor, a second slot that functions as the slot antenna together with the slot is provided in the first layer of the substrate so as to connect with the slot, and the conductor and the conductive member are disposed at positions different from the connection positions of the slot and the second slot.

11. A method for manufacturing an electronic component, comprising: preparing a substrate having a circuit component, a conductor conductively connected to a conductive component of a shield that shields the circuit component from the outside, and a conductive member in contact with both the conductive component and the conductor; and heat-treating the substrate at a temperature exceeding the melting point of the conductive member to alloy the conductive member and the conductive component.

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