Hybrid metallo-dielectric waveguide crossover modules and methods

Abstract

A waveguide crossover module has a first waveguide for a first signal to propagate therethrough and a second waveguide for a second signal to propagate therethrough. The first waveguide and the second waveguide intersect at a perpendicular angle with a first pair of metal plates coupled to opposing sides of the waveguides about the intersection. The waveguides may be made of a dielectric material, and may have apertures therein. The waveguides may be surrounded by air overlays, low refractive index regions, or metal strips adjacent the metal plates. The metal plates may be arranged either symmetrically or asymmetrically about the intersection, may be of any suitable shape. The first signal and the second signal may have overlapping or non-overlapping frequency ranges.

Description

[0001] HYBRID METALLO-DIELECTRIC WAVEGUIDE CROSSOVER

[0002] MODULES AND METHODS

[0003] FIELD OF THE DISCLOSURE

[0004] The present disclosure relates generally to waveguides, and in particular to methods and modules for intersecting dielectric waveguide crossovers comprising metal plates about their intersection.

[0005] BACKGROUND

[0006] Waveguides are structures, such as tubes or dielectric rods, that may be used for directing signals or waves. Waveguides are used in communications systems for propagating electromagnetic signals or waves.

[0007] In modules, systems, and apparatus for signal or wave transmission, waveguides may be used for providing guided signal or wave transmission. Crosstalk between signals in waveguides may occur where a signal or wave in one waveguide leaks or interferes with a signal or wave in a nearby waveguide. To reduce the impact of crosstalk, frequency filters may be used. Alternatively, waveguides may be arranged, with proper detouring of routes of waveguides, to minimize crosstalk. However, in applications where space constraints in modules, systems, and apparatus are limited, crossing or intersecting of two or more waveguide routes may be required. In some instances one or more waveguides may physically intersect.

[0008] In high frequency applications, such as communications in the terahertz frequency range, route detours may be physically inefficient or bulky, which increases overall power consumption and losses. The use of vias to bypass or coupling windows to feed through signals to alternative circuit layer results in many issues. First, the associated manufacture process of vias may be complex and expensive. Second, additional radiation loss due to related discontinuities during signal or wave propagation and guidance may result. Third, the use of multi-layer topologies increases fabrication complexity and circuit volume. There remains a need for methods, modules, systems, and apparatus for increased space and energy efficiency high-isolation waveguide crossovers.

[0009] SUMMARY

[0010] Embodiments disclosed herein relate to methods and modules wherein a hybrid metallo-dielectric waveguide comprising a first dielectric waveguide and a second dielectric waveguide intersecting at a right angle at an intersection. A non-radiative dielectric waveguide crossover is formed about the intersection by coupling a pair of metal plates thereabout. Mode conversion resulting from the intersection of the non-radiative dielectric waveguide crossover and mode selection resulting from the interfaces between the dielectric waveguides and the non-radiative dielectric waveguides provide a hybrid metallo-dielectric waveguide crossover with suitably low-levels of crosstalk between the intersecting waveguides within the desired operating frequency ranges.

[0011] According to one aspect of this disclosure, a module comprises a first waveguide for a first signal to propagate therethrough; a second waveguide for a second signal to propagate therethrough, the second waveguide intersecting the first waveguide at a perpendicular angle at a first intersection; and a first pair of metal plates coupled to opposing sides of the first waveguide and the second waveguide about the first intersection.

[0012] In some implementations, each of the first waveguide and the second waveguide comprises a dielectric material.

[0013] In some implementations, the dielectric material comprises silicon. In some implementations, each of the first waveguide and the second waveguide is bilaterally surrounded by air overlays.

[0014] In some implementations, each of the first waveguide and the second waveguide is bilaterally surrounded by low refractive index regions.

[0015] In some implementations, one of the first pair of metal plates comprises gold or copper.

[0016] In some implementations, the first pair of metal plates are arranged symmetrically about the first intersection.

[0017] In some implementations, the first pair of metal plates are arranged asymmetrically about the first intersection.

[0018] In some implementations, each of the plates of the first pair of metal plates has a square shape.

[0019] In some implementations, each of the dielectric waveguides comprise one or more apertures.

[0020] In some implementations, the module comprises one or more metallic strips on one of the first waveguide and the second waveguide adjacent one of the first pair of metal plates.

[0021] In some implementations, the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are non-overlapping.

[0022] In some implementations, the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are overlapping. In some implementations, the first range of frequencies and the second range of frequencies are within the terahertz band.

[0023] In some implementations, the module further comprises a third waveguide for a third signal to propagate therethrough, the third waveguide intersecting the first waveguide at a perpendicular angle at a second intersection and the third waveguide parallel to the second waveguide; and a second pair of metal plates coupled to opposing sides of the first waveguide and the third waveguide about the second intersection.

[0024] In some implementations, the third waveguide comprises a dielectric material.

[0025] In some implementations, the dielectric material comprises silicon.

[0026] In some implementations, the third waveguide is bilaterally surrounded by air overlays.

[0027] In some implementations, the third waveguide is bilaterally surrounded by low refractive index regions.

[0028] In some implementations, one of the second pair of metal plates comprises gold or copper.

[0029] In some implementations, the second pair of metal plates are arranged symmetrically about the second intersection.

[0030] In some implementations, the second pair of metal plates are arranged asymmetrically about the second intersection.

[0031] In some implementations, each of the plates of the second pair of metal plates has a square shape.

[0032] In some implementations, each of the dielectric waveguides comprise one or more apertures. In some implementations, the module further comprising one or more metallic strips on the third waveguide adjacent one of the second pair of metal plates.

[0033] In some implementations, the third signal is within a third range of frequencies.

[0034] In some implementations, the third range of frequencies is within the terahertz band.

[0035] According to one aspect of this disclosure, a method comprises the step of transmitting a first signal through a first waveguide, wherein the first waveguide intersects a second waveguide perpendicularly at an intersection and comprises a pair of metal plates coupled to opposing sides of the first waveguide and the second waveguide.

[0036] In some implementations, the method further comprises the step of transmitting a signal through the second waveguide.

[0037] In some implementations, the pair of metal plates are arranged symmetrically about the intersection.

[0038] In some implementations, the pair of metal plates are arranged asymmetrically about the intersection.

[0039] In some implementations, the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are non-overlapping.

[0040] In some implementations, the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range In some implementations, the first range of frequencies and the second range of frequencies are within the terahertz band.

[0041] BRIEF DESCRIPTION OF THE DRAWINGS

[0042] For a more complete understanding of the disclosure, reference is made to the following description and accompanying drawings, in which:

[0043] FIG. 1A is a schematic diagram illustrating a multi-layer waveguide system connection scheme according to some examples of the present disclosure;

[0044] FIG. IB is a schematic diagram illustrating a single layer waveguide system connection scheme according to some examples of the present disclosure;

[0045] FIG. 2 is a schematic diagram of a multi-layer dielectric waveguide crossover comprising an air bridge about an intersection of a pair of dielectric waveguides according to some examples of the present disclosure;

[0046] FIG. 3 is a schematic diagram a co-planar dielectric waveguide crossover according to some examples of the present disclosure;

[0047] FIG. 4A and FIG. 4B are schematic diagrams illustrating field distribution of the dielectric waveguide crossover of FIG. 3;

[0048] FIG. 5 is a graph illustrating performance characteristics of the dielectric waveguide crossover of FIG. 3;

[0049] FIG. 6A is a schematic diagram of a dielectric waveguide crossover and a pair of metal plates according to some examples of the present disclosure; FIG. 6B is a schematic diagram of a hybrid metallo-dielectric waveguide crossover according to some examples of the present disclosure;

[0050] FIG. 7A to 7H are schematic diagrams of alternative examples of a hybrid metallo-dielectric waveguide crossover according to some examples of the present disclosure;

[0051] FIG. 8A is a schematic diagram illustrating mode compatibility field distribution for a LSM01 mode wave or signal in a portion of the hybrid metallo-dielectric waveguide crossover of FIG. 6B about an interconnection between a non-radiative dielectric waveguide and a dielectric waveguide;

[0052] FIG. 8B is a graph illustration performance characteristics of the hybrid metallo-dielectric waveguide of FIG. 8A;

[0053] FIG. 8C are illustrations of modes of a signal about the non-radiative dielectric waveguide and dielectric waveguide of the portion of the hybrid metallo-dielectric waveguide of FIG. 8A, wherein the LSM01 mode is within the non-radiative dielectric waveguide and the El lx and El ly modes are within the dielectric waveguide;

[0054] FIG. 9A is a schematic diagram of a non-radiative dielectric waveguide crossover according to some examples of the present disclosure;

[0055] FIG. 9B is a graph illustrating performance characteristics of the non-radiative dielectric waveguide crossover of FIG. 9A;

[0056] FIG. 9C is a schematic diagram illustrating field distribution of the non-radiative dielectric FIG. 10A is a schematic diagram illustrating mode incompatibility for a wave or signal in a portion of the hybrid metallo-dielectric waveguide crossover of FIG. 6B about an interconnection between a non-radiative dielectric waveguide and a dielectric waveguide;

[0057] FIG. 1 OB is a graph illustrating performance characteristics of the hybrid metallo-dielectric waveguide of FIG. 1 OA;

[0058] FIG. 1 OC are illustrations of modes of a signal about the non-radiative dielectric waveguide and dielectric waveguide of the hybrid metallo-dielectric waveguide of FIG. 10A, wherein the LSEn mode is within the non-radiative waveguide and the Enx and Euy modes are within the dielectric waveguide; FIG. 11 A is a schematic diagram illustrating a wave or signal injected at a first port of the hybrid metallo-dielectric waveguide crossover of FIG. 6B;

[0059] FIG. 1 IB is a graph illustrating performance characteristics of the hybrid metallo-dielectric waveguide crossover of FIG. 11A;

[0060] FIG. 12A and FIG. 12B are schematic diagrams illustrating field distribution of the hybrid metallo-dielectric waveguide crossover of FIG. 6B;

[0061] FIG. 13 is a schematic diagram of a hybrid metallo-dielectric waveguide according to some examples of the present disclosure; and

[0062] FIG. 14 is block diagram of a method for a transmitting signals according to some examples of this disclosure. DETAILED DESCRIPTION

[0063] Unless otherwise defined, all technical and scientific terms used herein generally have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Exemplary terms are defined below for ease in understanding the subject matter of the present disclosure.

[0064] The term “a” or “an” refers to one or more of that entity; for example, “a waveguide” refers to one or more waveguides or at least one waveguide. As such, the terms “a” (or “an”), “one or more” and “at least one” are used interchangeably herein. In addition, reference to an element or feature by the indefinite article “a” or “an” does not exclude the possibility that more than one of the elements or features are present, unless the context clearly requires that there is one and only one of the elements. Furthermore, reference to a feature in the plurality (e.g., waveguides), unless clearly intended, does not mean that the modules or methods disclosed herein must comprise a plurality.

[0065] The expression “and / or” refers to and encompasses any and all possible combinations of one or more of the associated listed items (e.g. one or the other, or both), as well as the lack of combinations when interrupted in the alternative (or).

[0066] Waveguides are structures, such as tubes or dielectric rods, that may be used for directing signals or waves. Waveguides are used in communications systems for propagating electromagnetic signals or waves.

[0067] Crosstalk between signals in waveguides may occur where a signal or wave in one waveguide leaks or interferes with a signal or wave in a nearby waveguide. To reduce the impact of crosstalk, frequency filters may be used. Alternatively, waveguides may be arranged, with proper detouring of routes of waveguides, to minimize crosstalk.

[0068] However, in applications where space constraints in modules, systems, and apparatus are limited, crossing or intersecting of two or more waveguide routes may be unavoidable, and in high frequency applications, such as communications in the terahertz frequency range, route detours may be physically inefficient or bulky, which increases overall power consumption and losses.

[0069] Referring to FIG. 1A, a portion of a multi-layer waveguide network 100 comprises a first waveguide path 102, a second waveguide path 104, and a third waveguide path 106. The first waveguide path 102 between a first port 120 and a second pot 122, the second waveguide path 104 between a third port 124 and a fourth port 126, and the third waveguide path between a fifth port 128 and a sixth port 130. The second waveguide path 104 comprises a first via 112 and a second via 114 to provide a first crossover path 108 to avoid physically crossing the first waveguide path 102. The third waveguide path 106 comprises a third via 116 and a fourth via 118 to provide a second crossover path 110 to avoid physically crossing the first waveguide path 102 and the second waveguide path 104. The vias 112, 114, 116, and 118 may also be coupling windows or apertures for transferring or coupling electromagnetic waves from one layer or location to another layer or location. For example, vias 112. 114, 116, and 118 may provide vertical connections between microstrip lines on different layers. Alternatively, coupling windows or apertures may be used to re-route electromagnetic waves from one waveguide to another waveguide on different layers. As previously indicated, fabrication of vias and windows / apertures may be complex and multi-layer topologies generally increase design complexity, structural volume, and power consumption / loss.

[0070] Referring to FIG. 2, a dielectric waveguide 200 comprises a first waveguide 202 between a first port 208 to a second port 210 and a second waveguide 204 between a third port 212 to a fourth port 214. The waveguide 200 comprises an air bridge 206 to provide an alternate path between the first port 208 and the second port 210.

[0071] For applications in the microwave band, between about 300 megahertz (MHz) and 30 gigahertz (GHz), or the millimeter-wave band, between about 30 GHz and 300GHz, modules, systems, and apparatus comprising multi-layer topologies may be used to provide a balance of compact physical circuit dimensions and power consumption or loss. The use of multi-layer crossovers in systems in highly integrated THz applications to detour signals or waves from crossing may significantly increase the length of signal or wave transmission paths along with associated power consumption or loss. The use of vias to bypass or coupling windows to feed through signals to alternative circuit layer results in many issues. First, the associated manufacture process of vias may be complex and expensive. Second, additional radiation loss due to related discontinuities during signal or wave propagation and guidance may result. Third, the use of multi-layer topologies increases fabrication complexity and circuit volume.

[0072] Alternatively, referring to FIG. IB, a single layer waveguide network 150 may reduce circuit and associated fabrication complexity where high isolation of waveguides is provided to ensure suitable system performance. The single layer waveguide network 150 comprises a first waveguide path 152 between a first port 170 and a second port 172, a second waveguide path 154 between a third port 174 and a fourth port 176, and a third waveguide path 156 between a fifth port 178 and a sixth port 180. The first waveguide path 152 comprises a first 90-degree bend 158, a first crossover 160 intersecting with the second waveguide path 154, and a second crossover 162 intersecting with the third waveguide path 156. The second waveguide path 154 comprises the first crossover 160 intersecting with the first waveguide path 152, a second 90-degree bend 164, and a third crossover 166 intersecting with the third waveguide path 156. The third waveguide path 156 comprises the second crossover 162 intersecting with the first waveguide path 152 , the third crossover 166 intersecting with the second waveguide path 154, and a third 90-degree bend 168.

[0073] The performance impact of single-layer crossover components in such modules, systems, and apparatus may be improved by designing the crossover to suppress radiation leakage, reduce crosstalk, decrease reflection loss, and / or the like. For example, for metallic waveguide crossovers, inserting a pair of metallized vias may reduce crosstalk, filtering crossovers may be used to improve performance, and multi-mode interference structures may be used to improve performance of dielectric waveguide crossovers. In addition, photonic band-gap structures may be used in applications for optical signals or waves to guide energy in specific directions based on Bragg’s reflection.

[0074] Referring to FIG. 3, a dielectric waveguide 300 comprises a first waveguide 302 between a first port 308 to a second port 310 and a second waveguide 304 between a third port 312 to a fourth port 314. The waveguide 300 may be referred to as a crossing guide as the first waveguide 302 and the second waveguide 304 intersect at an intersection 306.

[0075] FIG. 4A and FIG. 4B illustrate the field distribution of a transmission of a signal or wave in the first waveguide 302 between a first port 308 and a second port 310. FIG. 5 is a graph illustrating the transmission or reflection levels in decibels (dB) of signals over a frequency range of between about 270 GHz and 300 GHz. Referring to FIG. 5, S21, S31, and S11 are illustrated, wherein S21 represents the insertion loss between the second port 310 and the first port 308, S31 represents isolation between the third / fourth port 312 / 314 and the first port 308, and Si 1 represents the reflection at the first port 308.

[0076] In some implementations of the present disclosure, modules comprise a hybrid metallo-dielectric waveguide comprising dielectric waveguide components and non-radiative dielectric components. A hybrid metallo-dielectric waveguide may be suitable for use in low-loss highly-integrated THz-range circuits and systems to address issues related to structural complexity, integration density, potential radiation leakage, and high-levels of crosstalk. While implementations of hybrid metallo-dielectric waveguides disclosed herein may refer to operation in the THz band, they are generally operable within any suitable range of frequencies including in the millimeter wave to THz bands.

[0077] The use of non-radiative dielectric waveguide components, comprising substrate integrated non-radiative dielectric waveguide substrate guides, may be used to improve performance of waveguide crossovers. In some implementations of the present disclosure, a dielectric rod, or an equivalent thereof, may be placed or sandwiched between two metal plates and may be bilaterally surround by air overlays, or equivalent low refractive index regions. A signal or wave may be contained within a dielectric core of a dielectric waveguide due to a significant difference in relative permittivity between the dielectric core and its surrounding environment. As described herein, non-radiative dielectric waveguide components may be suitable for comprising significant or sharp discontinuities such as crossovers.

[0078] As metal plates comprised in non-radiative dielectric waveguide components may introduce higher signal or wave conductive losses than in dielectric waveguides, such conductive losses may be mitigated by using non-radiative dielectric waveguide components specifically proximate discontinuities, such as crossovers. Dielectric waveguide components would the comprise the remaining parts of the circuit, providing a hybrid metallo-dielectric waveguide crossover having characteristics of low signal or wave loss and being radiation-free. Further, as discussed in detail herein, mode conversion about the intersection of non-radiative dielectric waveguide crossover and mode selection in hybrid metallo-dielectric waveguides permits significant reduction in crosstalk between waveguides comprising a signal and waveguides intersecting therewith.

[0079] As described above, the use of co-planar waveguide crossovers in highly integrated systems may be significant as it reduces the need detours and / or multi-layer topologies which may require increased circuit size and / or higher complexity and associated costs. Dielectric waveguides provide signal or wave conductors having low-loss properties, especially in the THz frequency band. However, dielectric crossovers generally have properties of radiation leakage and high crosstalk between intersecting waveguides. As non-radiative dielectric waveguides are suitable for sharp discontinuities, the combination of dielectric waveguides and non-radiative waveguides formed through the addition of a pair of metal plates proximate the crossover intersection, may provide a crossover with low radiation leakage.

[0080] Referring to FIG. 6A, a dielectric waveguide 600 comprises a first waveguide 602 between a first port 620 to a second port 622 and a second waveguide 604 between a third port 624 to a fourth port 626. The dielectric waveguide 600 may also be referred to as a crossing guide as the first waveguide path 602 and the second waveguide path 604 intersect at an intersection 606 at approximately perpendicularly at a 90-degree or right angle. Referring to FIG. 6B, a non-radiative dielectric waveguide crossover 612 may be formed by coupling a pair of metal plates 614A and 614B on opposing sides of the first waveguide 602 and the second waveguide 604. The first waveguide 602 interfaces the non-radiative dielectric waveguide crossover 612 at a first interface 628 and a second interface 630 while the second waveguide 604 interfaces the non-radiative dielectric waveguide 612 at a third interface 632 and a fourth interface 634. The metal plates 614A and 614B may comprise any suitable material having good conductive properties, such as gold, copper, silver, and / or the like. As discussed, the metal plates 614A and 614B may have any suitable shape or pattern and may comprise one or more apertures. The dielectric material of the waveguides 602 and 604 may comprise any suitable material that may be dependent on the application, including but not limited to aluminum, silicon, and / or the like. The choice of dielectric material may depend on the substrates used and / or the fabrication process and may vary specific performance characteristics depending on the particular dielectric material use.

[0081] The embodiment of the present disclosure illustrated in FIG. 6B represents the most basic embodiment of the hybrid metallo-dielectic waveguide 610, wherein the non-radiative waveguide crossover 612 comprises a pair of square metal plates 614A and 614B arranged symmetrically about the intersection 606. The shapes and configurations of the metal plates may be varied as illustrated in FIG. 7A to 7H, wherein the metal plates of each pair are of approximately identical dimensions and arranged in parallel about the plane defined by the direction of the length of the first waveguide 602 and the second waveguide 604. Each of the variations of the hybrid metallo-dielectric waveguide 610A, 610B, 610C, 610D, 610E, 610F, 610G, and 61 OH comprise different characteristics of the non-radiative dielectric waveguide components and the dielectric waveguides. Referring to FIG. 7A, the hybrid metallo-dielectric waveguide 610 comprises a pair of square -shaped metal plates 614A and 614B arranged approximately symmetrically about the intersection 606 with a plurality of holes or apertures 618 on the waveguides 602 and 604 for adjusting crossover performance. Referring to FIG. 7B, a hybrid metallo-dielectric waveguide 610B further comprises metal strips 616, for adjusting crossover performance, on exterior surfaces of the first waveguide 602 and the second waveguide 604 and running perpendicular to the length of the first waveguide 602 and the second waveguide 604. Referring to FIG. 7C, a hybrid metallo- -dielectric waveguide 610C comprises metal strips 616, for adjusting crossover performance, on exterior surfaces of the second waveguide 604 and running perpendicular to the length of the second waveguide 604. Referring to FIG. 7D. a hybrid metallo-dielectric waveguide 610D comprises a alternative second waveguide 604A having different cross-sectional dimensions than the first waveguide 602, wherein the cross-sectional dimension of the second waveguide 604A is for operating in a different frequency than the first waveguide 602. The frequency ranges of the first waveguide 602 and the second waveguide 604 may be overlapping or non-overlapping depending on the particular application. Referring to FIG. 7E, FIG. 7F, FIG. 7G, and FIG. 7H, the dimensions and asymmetrical arrangement of the metal plates may be adjusted to provide different frequency responses. Referring to FIG. 7E, a hybrid metallo-dielectric waveguide 610E comprises rectangular metal plates 614C and 614D, wherein the longer side of the rectangular metal plates 614C and 614D are arranged to run along the second waveguide 604. Referring to FIG. 7F, a hybrid metallo-dielectric waveguide 610F comprises the rectangular metal plates 614C and 614D, wherein the longer side of the rectangular metal plates 614C and 614D are arranged to run along the first waveguide 602. Referring to FIG. 7G, a hybrid metallo-dielectric waveguide 610G comprises rectangular metal plates 614E and 614F, wherein the longer side of the rectangular metal plates 614E and 614F are arranged to run along the first waveguide 602 and is arranged asymmetrically about the intersection 606. Referring to FIG. 7H, a hybrid metallo-dielectric waveguide 610H comprises rectangular metal plates 614G and 614H, wherein the longer side of the rectangular metal plates 614G and 614H are equal to the length of the first waveguide 602 and are arranged to run along the first waveguide 602.

[0082] Mode compatibility between the LSMoi mode of the non-radiative dielectric waveguide and the Enx mode of the dielectric waveguide is an important characteristic for operation of the hybrid metallo-dielectric waveguide comprising the non-radiative dielectric waveguide and dielectric waveguide components. FIG. 8A illustrates a portion of the hybrid metallo-dielectric waveguide 610 comprising a portion of the non-radiative dielectric crossover 612 and aportion of the first waveguide 602. Referring to FIG. 8A, FIG. 8B, and FIG. 8C, the LSMoi mode of a signal or wave in a portion of the non-radiative dielectric crossover 612 is conducted through the first interface 628 to the first waveguide 602 in the Enx mode with a negligible insertion loss of about 0.15 dB without any additional transition components over a frequency range of 270 GHz to 300 GHz with some implementations of the hybrid metallo-dielectric waveguide 610 disclosed herein.

[0083] Even though its non-radiative performance, crosstalk exists for the non-radiative dielectric waveguide crossover. Referring to FIG. 9A, a non-radiative dielectric waveguide crossover 612 may experience crosstalk between the first waveguide 602 and the second waveguide 604. FIG. 9B is a graph illustrating the transmission or reflection or isolation levels in decibels (dB) of signals over a frequency range of between about 270 GHz and 300 GHz and for longitudinal-section magnetic (LSM) and longitudinal-section electric (LSE) modes. Referring to FIG. 9B, S21 (LSM01-LSM01), S31 (LSMoi-LSEn), S31 (LSM01-LSM01) and Sn are illustrated, wherein S21 (LSM01-LSM01) represents the insertion loss of about 1.5 dB between the second interface 630 and the first interface 628 for LSMoi (which is comparable to a dielectric waveguide crossover), S31 (LSM01-LSE11) represents crosstalk between the third / fourth interface 632 / 634 and the first interface 628 for LSM01 to LSE11 of about -10dB„ S31 (LSM01-LSM01) represents crosstalk between the third / fourth interface 632 / 634 and the first interface 628 for LSM01 to LSM01 varying from -40dB to -lOdB and Sn represents reflection at the first interface 628. The - lOdB crosstalk for LSMoi-LSEn from about 270 GHz and 300 GHz may result in significant signal contamination or interference and high transmission loss. FIG. 9C illustrates electric field distribution about the non-radiative waveguide crossover 612.

[0084] Mode conversion at the non-radiative dielectric waveguide crossover may be used to address crosstalk. In some implementations disclosed herein, the desired mode of the non-radiative dielectric waveguide may be the LSM01 mode as it comprises a property of low signal or wave conductor loss. However, the LSM01 mode may result in mode conversion loss as it does not comprise a required single-mode operating frequency band. In some implementations of the present disclosure, the fiindamental non-radiative mode of the non-radiative dielectric waveguide is the LSEn mode, followed by the LSM01 mode. Mode conversion between these two degenerate modes, namely LSEn and LSM01 modes, may occur at discontinuities, such as crossovers or bends, resulting in significant mode conversion loss. This mode conversion loss may be difficult to eliminate without the use of mode suppressors.

[0085] However, in some implementations of the hybrid metallo-dielectric waveguide crossover disclosed herein, high isolation properties may exist within a certain bandwidth due to the mode conversion between the LSM01 and LSEn modes over the intersection and the mode selectivity of the hybrid metallo-dielectric waveguide. Referring to FIG. 10A, FIG. 10B, and FIG. 10C, the LSE11 mode of a signal or wave in a portion of the non-radiative dielectric waveguide crossover 612 does not find any compatible modes in the second waveguide 604. As a result, the LSE11 mode in a portion of the non-radiative dielectric waveguide crossover 612 is reflected back into the non-radiative dielectric waveguide crossover 612 as it encounters the interface 632 / 634 with the second waveguide 604, as both the El lx and the El ly modes are incompatible. This characteristic of mode selectivity contributes to the isolation properties of hybrid metallo- dielectric waveguide crossover as between the first waveguide and the second waveguide.

[0086] Referring to FIG. 11 A, a hybrid metallo-dielectric waveguide 610 comprises a first waveguide 602 between a first port 620 and a second port 622, a second waveguide 604 between a third port 624 and a fourth port 626, and a non-radiative dielectric waveguide crossover 612. In an exemplary embodiment of the present disclosure, a signal or wave injected at the first port 620 in the Enx mode enters the first interface 628 between first waveguide 602 and the non-radiative dielectric waveguide crossover 612, the mode of the signal or wave is converted from Enx to LSMoi. When the LSMoi signal enters an intersection 606, the LSMoi signal continues through towards the second port 622. Meanwhile, the signal is directed towards the undesired third port 624 and the fourth port 626 and is converted to LSEn mode due to mode conversion as described herein. As the LSEn mode signals directed towards the third port 624 and fourth port 626 encounter the third interface 632 and the fourth interface 634, respectively, between the non-radiative dielectric waveguide crossover 612 and the second waveguide 604, mode incompatibility of the LSEn mode of the signal or wave results in the LSEn mode being reflected back, representing high isolation between the first waveguide 602 and the second waveguide 604 within the frequency range of 270 GHz to 300 GHz using some implementations of the present disclosure. FIG. 11B is a graph illustrating the transmission or reflection or isolation levels in dB of signal over a frequency range of between about 270 GHz and 300GHz, where S21 represents insertion loss between the second port 622 and the first port 620, S31 represents isolation between the third / fourth port 624 / 626 and the first port 620, and S11 represents reflection at the first port 620. FIG. 12A and FIG. 12B illustrates electric field distribution through the hybrid metallo- dielectric waveguide 610. The foregoing describes a hybrid metallo-dielectric waveguide 610 comprising a first waveguide 602 and a second waveguide 604 but it is understood that additional waveguides running parallel either the first waveguide 602 or the second waveguide 604 may be added. For example, referring to FIG. 13, a hybrid metallo-dielectric waveguide 650 further comprises a third waveguide 652 that may run parallel with the second waveguide 604 and intersect with the first waveguide 602 at a second intersection 656. A second non-radiative dielectric waveguide 654 may be formed at the hybrid metallo-electric waveguide 650 about the second intersection 656 but coupling a pair of metal plates 658A and 658B thereto. It is further understood that all features described above for the hybrid metallo-dielectric waveguide 610 would similarly apply to the hybrid metallo-dielectric waveguide 650. While not illustrated, it is understood that any further additional waveguides could be added in a similar manner.

[0087] FIG. 14 is a flowchart showing the steps of a method 1400, according to some examples of the present disclosure. The method 1400 begins with transmitting a first signal through a first waveguide (step 1402). Optionally, at step 1404, a second signal is transmitted through a second waveguide.

[0088] Embodiments of present disclosure provide a hybrid metallo-dielectric waveguide suitable for signal or wave transmission including re-routing that may be used in highly-integrated systems, as for fifth generation communication systems This invention provides a signal transmission and rerouting topology which can be applied to highly- integrated systems, such as 5G / 6G communication systems, radio frequency identification systems, radar systems, sensor networks, and / or the like.

[0089] Embodiments of the present disclosure may provide a fundamental building block in many systems and may be incorporated therein with both passive and active components, including but not limited to for antennas, power combining, dividing, routing structures, and / or the like. The specific structures, hosting substrates, manufacturing facilities used, operating bands, patterns of metal layers, and / or the like may vary and may be adapted to suit particular applications.

[0090] The present disclosure encompasses various embodiments, including not only method embodiments, but also other embodiments such as apparatus embodiments and embodiments related to non-transitory computer readable storage media. Embodiments may incorporate, individually or in combinations, the features disclosed herein.

[0091] Although this disclosure refers to illustrative embodiments, this is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the disclosure, will be apparent to persons skilled in the art upon reference to the description.

[0092] Features disclosed herein in the context of any particular embodiments may also or instead be implemented in other embodiments. Method embodiments, for example, may also or instead be implemented in apparatus, system, and / or computer program product embodiments. In addition, although embodiments are described primarily in the context of methods and apparatus, other implementations are also contemplated, as instructions stored on one or more non-transitory computer-readable media, for example. Such media could store programming or instructions to perform any of various methods consistent with the present disclosure.

[0093] Although embodiments have been described above with reference to the accompanying drawings, those of skill in the art will appreciate that variations and modifications may be made without departing from the scope thereof as defined by the appended claims.

Claims

WHAT IS CLAIMED IS:

1. A module comprising: a first waveguide for a first signal to propagate therethrough; a second waveguide for a second signal to propagate therethrough, the second waveguide intersecting the first waveguide at a perpendicular angle at a first intersection; and a first pair of metal plates coupled to opposing sides of the first waveguide and the second waveguide about the first intersection.

2. The module of claim 1, wherein each of the first waveguide and the second waveguide comprises a dielectric material.

3. The module of claim 2, wherein the dielectric material comprises silicon.

4. The module of claim 2 or 3, wherein each of the first waveguide and the second waveguide is bilaterally surrounded by air overlays.

5. The module of any one of claims 2 to 4, wherein each of the first waveguide and the second waveguide is bilaterally surrounded by low refractive index regions.

6. The module of any one of claims 1 to 5, wherein one of the first pair of metal plates comprises gold or copper.

7. The module of any one of claims 1 to 6, wherein the first pair of metal plates are arranged symmetrically about the first intersection.

8. The module of any one of claims 1 to 6, wherein the first pair of metal plates are arranged asymmetrically about the first intersection.

9. The module of any one of claims 1 to 8, wherein each of the plates of the first pair of metal plates has a square shape.

10. The module of any one of claims 1 to 9, wherein each of the dielectric waveguides comprises one or more apertures.

11. The module of any one of claims 1 to 10 further comprising one or more metallic strips on one of the first waveguide and the second waveguide adjacent one of the first pair of metal plates.

12. The module of any one of claims 1 to 11, wherein the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are non-overlapping.

13. The module of any one of claims 1 to 11, wherein the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are overlapping.

14. The module of claim 12 or 13, wherein the first range of frequencies and the second range of frequencies are within the terahertz band.

15. The module of any one of claims 1 to 14 further comprising: a third waveguide for a third signal to propagate therethrough, the third waveguide intersecting the first waveguide at a perpendicular angle at a second intersection and the third waveguide parallel to the second waveguide; and a second pair of metal plates coupled to opposing sides of the first waveguide and the third waveguide about the second intersection.

16. The module of claim 15, wherein the third waveguide comprises a dielectric material.

17. The module of claim 16, wherein the dielectric material comprises silicon.

18. The module of claim 16 or 17, wherein the third waveguide is bilaterally surrounded by air overlays.

19. The module of any one of claims 16 to 18, wherein the third waveguide is bilaterally surrounded by low refractive index regions.

20. The module of any one of claims 15 to 19, wherein one of the second pair of metal plates comprises gold or copper.

21. The module of any one of claims 15 to 20, wherein the second pair of metal plates are arranged symmetrically about the second intersection.

22. The module of any one of claims 15 to 20, wherein the second pair of metal plates are arranged asymmetrically about the second intersection.

23. The module of any one of claims 15 to 22, wherein each of the plates of the second pair of metal plates has a square shape.

24. The module of any one of claims 15 to 23, wherein each of the dielectric waveguides comprises one or more apertures.

25. The module of any one of claims 15 to 24, further comprising one or more metallic strips on the third waveguide adjacent one of the second pair of metal plates.

26. The module of any one of claims 15 to 25, wherein the third signal is within a third range of frequencies.

27. The module of claim 26, wherein the third range of frequencies is within the terahertz band.

28. A method comprising the step of: transmitting a first signal through a first waveguide, wherein the first waveguide intersects a second waveguide perpendicularly at an intersection and comprises a pair of metal plates coupled to opposing sides of the first waveguide and the second waveguide.

29. The method of claim 28 further comprising the step of: transmitting a signal through the second waveguide.

30. The method of claim 28 or 29, wherein the pair of metal plates are arranged symmetrically about the intersection.

31. The method of any one of claims 28 to 30, wherein the pair of metal plates are arranged asymmetrically about the intersection.

32. The method of any one of claims 28 to 31, wherein the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are non-overlapping.

33. The method of any one of claims 28 to 31, wherein the first signal is within a first range of frequencies and the second signal is within a second range of frequencies, wherein the first range and the second range are overlapping.

34. The module of claim 32 or 33, wherein the first range of frequencies and the second range of frequencies are within the terahertz band.

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