Heat dissipation device and method for manufacturing same

Abstract

The present application discloses a heat dissipation device and a method for manufacturing same. The heat dissipation device comprises a cover, a flow homogenization assembly, and a bottom plate assembly; the bottom plate assembly comprises a heat dissipation chamber; in a first area of the heat dissipation chamber, a plurality of heat conduction pieces are arranged at a first interval, and in a second area of the heat dissipation cavity, a plurality of heat conduction pieces are arranged at a second interval; a third area of the flow homogenization assembly comprises a plurality of first flow homogenization channels and a plurality of first liquid discharge channels; in the first flow homogenization channels, a plurality of first liquid outlet holes are arranged at a third interval; the first liquid outlet holes are communicated with the first flow homogenization channels and the first area; a fourth area of the flow homogenization assembly comprises a plurality of second flow homogenization channels and a plurality of second liquid discharge channels; in the second flow homogenization channels, a plurality of second liquid outlet holes are arranged at a fourth interval; the second liquid outlet holes are communicated with the second flow homogenization channels and the second area; the first liquid discharge channels are communicated with the first area and the second flow homogenization channels; the cover is provided with a liquid inlet and a liquid outlet; the liquid inlet is communicated with the first flow homogenization channels; and the second liquid discharge channels are communicated with the second area and the liquid outlet.

Description

Heat dissipation device and method for manufacturing heat dissipation device

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on August 25, 2023, with application number 202311085306.7 and application name “Heat dissipation device and manufacturing method of heat dissipation device”. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of heat dissipation equipment, and in particular to a heat dissipation device and a method for manufacturing the heat dissipation device. Background Art

[0004] With the rapid development of social informatization, more requirements have been put forward for the performance of electronic equipment, which has led to the continuous increase of single-chip functional modules. The chip shows a trend of increasing integration and area at the same time, making the uneven distribution of chip power more and more obvious, resulting in multiple local "hot spots" with high heat flux density on the chip. The temperature unevenness caused by local "hot spots" can cause thermal stress in large-area chips, causing chip warping or even breakage, seriously affecting the reliability and life of the chip.

[0005] However, most of the heat dissipation devices in the related art dissipate heat from a uniform heat source, and have a poor heat dissipation effect on non-uniform heat-generating chips.

[0006] Summary of the Invention

[0007] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device, which can improve the heat dissipation effect of a chip with non-uniform heat generation.

[0008] In order to solve the above problems, this application adopts the following technical solutions:

[0009] 18. The heat dissipation device of claim 17, wherein the heat dissipation device is configured to: dissipate heat from a first portion of the heat dissipation cavity, and wherein the heat dissipation device is configured to dissipate heat from a second portion of the heat dissipation cavity. The heat dissipation device is configured to: dissipate heat from a first portion of the heat dissipation cavity, wherein the heat dissipation device is configured to dissipate heat from a second portion of the heat dissipation cavity. The heat dissipation device is configured to: dissipate heat from a second portion of the heat dissipation cavity, wherein the heat dissipation device is configured to dissipate heat from a second portion of the heat dissipation cavity. The two liquid outlet holes connect the second uniform flow channel and the second area, and the first liquid discharge channel connects the first area and the second uniform flow channel; the cover body covers the uniform flow component, and the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet connects the first uniform flow channel, and the second liquid discharge channel connects the second area and the liquid outlet; when the chip is in an installed state, the surface of the base plate component away from the uniform flow component contacts the chip, the fifth area of ​​the chip corresponds to the first area, and the sixth area of ​​the chip corresponds to the second area, wherein the temperature of the fifth area is higher than the temperature of the sixth area.

[0010] In a second aspect, an embodiment of the present application discloses a method for manufacturing a heat dissipation device, comprising: bonding a liquid separator plate, a jet plate, a frame plate, and a bottom plate in sequence to form a first main body; and connecting a cover body to the first main body.

[0011] The embodiment of the present application provides a heat dissipation device, by arranging relatively dense heat-conducting parts in the first area of ​​the heat dissipation cavity of the base plate component and arranging relatively sparse heat-conducting parts in the second area of ​​the heat dissipation cavity of the bottom component, when the chip is in the installed state, the high heat flux density area of ​​the chip corresponds to the first area, and the low heat flux density area of ​​the chip corresponds to the second area, and the heat dissipation cavity is covered with a uniform flow component, the third area of ​​the uniform flow component corresponds to the first area of ​​the heat dissipation cavity, the fourth area of ​​the uniform flow component corresponds to the second area of ​​the heat dissipation cavity, and the multiple first uniform flow channels on the third area of ​​the uniform flow component are connected to the liquid inlet on the cover body, and the first uniform flow channels are connected to the liquid inlet on the cover body. A plurality of first liquid outlet holes are arranged at a third interval on the cover, the first liquid outlet holes connect the first uniform flow channel and the first area, the plurality of first drainage channels on the third area of ​​the uniform flow component connect the first area and the plurality of second uniform flow channels on the fourth area of ​​the uniform flow component, a plurality of second liquid outlet holes are arranged at a fourth interval on the second uniform flow channel, the second liquid outlet holes connect the second uniform flow channel and the second area, the plurality of second drainage channels on the fourth area of ​​the uniform flow component connect the second area and the liquid outlet on the cover, which can achieve heat dissipation of the high heat flux density area of ​​the chip first, and then heat dissipation of the low heat flux density area of ​​the chip, thereby improving the heat dissipation effect of the non-uniform heat generation chip. In addition, by dissipating heat from the chip through the heat dissipation device provided in the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, thereby ensuring the service life and reliability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG1 is a schematic structural diagram of a heat dissipation device disclosed in an embodiment of the present application;

[0013] FIG2 is a schematic structural diagram of a base plate assembly disclosed in an embodiment of the present application;

[0014] FIG3 is a schematic diagram showing the arrangement of a flow uniformity channel and a drainage channel on a flow uniformity component disclosed in an embodiment of the present application;

[0015] FIG4 is a schematic diagram of a chip disclosed in an embodiment of the present application;

[0016] FIG5 is a schematic structural diagram of a heat conducting member disclosed in an embodiment of the present application;

[0017] FIG6 is a cross-sectional view of a heat dissipation device disclosed in an embodiment of the present application;

[0018] FIG7 is a schematic structural diagram of a jet plate disclosed in an embodiment of the present application;

[0019] FIG8 is a flow chart of a method for manufacturing a heat dissipation device disclosed in an embodiment of the present application;

[0020] FIG9 is a processing flow chart of a base plate disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0022] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0023] The present application discloses a heat dissipation device and a method for manufacturing the heat dissipation device. Figure 1 is a structural schematic diagram of a heat dissipation device disclosed in an embodiment of the present application. Figure 2 is a structural schematic diagram of a base plate assembly disclosed in an embodiment of the present application. Figure 3 is a schematic diagram of the arrangement of a uniform flow channel and a drainage channel on a uniform flow assembly disclosed in an embodiment of the present application. Figure 4 is a schematic diagram of a chip disclosed in an embodiment of the present application.

[0024] As shown in Figures 1 to 4, the heat dissipation device disclosed in the present application includes: a cover body 100, a flow uniforming component 200 and a base plate component 300, wherein: the base plate component 300 includes a heat dissipation chamber, a first area 321 of the heat dissipation chamber is arranged with a plurality of heat conductive members 322 at a first interval, and a second area 323 of the heat dissipation chamber is arranged with a plurality of heat conductive members 322 at a second interval, wherein the first interval is smaller than the second interval; the flow uniforming component 200 covers at least the heat dissipation chamber, the third area 201 of the flow uniforming component 200 includes a plurality of first flow uniforming channels 211 and a plurality of first drainage channels 212, the first flow uniforming channels 211 and the first drainage channels 212 are arranged alternately, the first flow uniforming channel 211 is provided with a plurality of first liquid outlet holes 221 at a third interval, the first liquid outlet holes 221 connect the first flow uniforming channel 211 and the first area 321, the fourth area 202 of the flow uniforming component 200 includes a plurality of second flow uniforming channels 213 and a plurality of second drainage channels 214, the second The uniform flow channel 213 and the second drainage channel 214 are arranged alternately, and the second uniform flow channel 213 is provided with a plurality of second liquid outlet holes 223 at a fourth interval, the second liquid outlet holes 223 connect the second uniform flow channel 213 and the second area 323, and the first drainage channel 212 connects the first area 321 and the second uniform flow channel 213; the cover body 100 covers the uniform flow assembly 200, and the cover body 100 is provided with a liquid inlet 110 and a liquid outlet 120, the liquid inlet 110 connects the first uniform flow channel 211, and the second drainage channel 214 connects the second area 323 and the liquid outlet 120; when the chip is in the installed state, the surface of the base plate assembly 300 away from the uniform flow assembly 200 contacts the chip, the fifth area 401 of the chip corresponds to the first area 321, and the sixth area 402 of the chip corresponds to the second area 323, wherein the temperature of the fifth area 401 is higher than the temperature of the sixth area 402.

[0025] It should be noted that the height of the heat conducting member 322 is smaller than the height of the heat dissipation chamber. For example, as shown in FIG5 , the height h of the heat conducting member 322 is pin It can be 0.7 to 0.8 times the height of the heat dissipation chamber. In addition, the thickness of the cover 100 can be 300-500 μm, and the diameters of the liquid inlet 110 and the liquid outlet 120 can be 5-8 mm.

[0026] The multiple first uniform flow channels 211 and the multiple first drainage channels 212 on the third area 201 of the uniform flow component 200 can be arranged alternately along the preset direction of the uniform flow component 200. For example, along the preset direction of the uniform flow component 200, they are arranged in the order of 1, 3, and 5 first drainage channels 212 and 2, 4, and 6 first uniform flow channels 211. The liquid outlet holes can be arranged in one row or in multiple rows along the uniform flow channel. Exemplarily, the preset direction can be a direction perpendicular to the line connecting the liquid inlet 110 and the liquid outlet 120 on the cover body 100. The arrangement of the multiple second uniform flow channels 213 and the multiple second drainage channels 214 on the fourth area 202 of the uniform flow component 200 is similar to the arrangement of the multiple first uniform flow channels 211 and the multiple first drainage channels 212 on the third area 201 of the uniform flow component 200, and will not be repeated here.

[0027] In the present application, the cover 100, the flow uniforming assembly 200 and the base plate assembly 300 are stacked in sequence, and the first area 321 of the base plate assembly 300 corresponding to the high heat flux density area of ​​the chip is arranged with denser heat conductive parts 322, so that the surface area of ​​the heat conductive parts 322 in contact with the liquid in the first area 321 is larger, and the second area 323 of the base plate assembly 300 corresponding to the low heat flux density area of ​​the chip is arranged with sparser heat conductive parts 322, so that the surface area of ​​the heat conductive parts 322 in contact with the liquid in the second area 323 is relatively small, which can achieve local high heat control of the chip while maintaining better temperature uniformity and improving the heat dissipation effect of the non-uniform heat generating chip.

[0028] Furthermore, the third area 201 of the flow equalizer assembly 200 corresponds to the first area 321 of the bottom plate assembly 300, the fourth area 202 of the flow equalizer assembly 200 corresponds to the second area 323 of the bottom plate assembly 300, the plurality of first flow equalizer channels 211 on the third area 201 of the flow equalizer assembly 200 are connected to the liquid inlet 110 on the cover body 100, a plurality of first liquid outlet holes 221 connecting the first flow equalizer channel 211 and the first area 321 are arranged at a third interval on the first flow equalizer channel 211, and the plurality of first drainage channels 212 on the third area 201 of the flow equalizer assembly 200 are connected to the first area 3 21 and multiple second uniform flow channels 213 on the fourth area 202 of the uniform flow component 200, multiple second liquid outlet holes 223 connecting the second uniform flow channel 213 and the second area 323 are arranged at fourth intervals on the second uniform flow channel 213, and multiple second drainage channels 214 on the fourth area 202 of the uniform flow component 200 connect the second area 323 and the liquid outlet 120 on the cover body 100, which can achieve heat dissipation of the high heat flux density area of ​​the chip first, and then heat dissipation of the low heat flux density area of ​​the chip, thereby achieving more uniform heat dissipation and further improving the heat dissipation effect of the non-uniform heat generation chip.

[0029] When the heat dissipation device disclosed in the present application is used to dissipate heat for the chip disposed below the base plate assembly 300, as shown in FIG6 , the liquid flows through the liquid inlet 110 on the cover body 100 into the plurality of first uniform flow channels 211 disposed in the third region 201 of the uniform flow assembly 200 for uniform flow, and then vertically impacts the first region 321 of the heat dissipation chamber with the heat conducting member 322 through the first liquid outlet 221 disposed on the first uniform flow channel 211, thereby realizing distributed jet flow, and utilizing the heat conducting member 322 to contact the liquid for heat conduction, thereby realizing heat dissipation of the high heat flux density region (i.e., the fifth region 401) of the chip, and then the liquid in the first region 321 of the heat dissipation chamber passes through the third region 201 disposed in the uniform flow assembly 200. 01's multiple first drainage channels 212 flow into multiple second uniform flow channels 213 provided in the fourth area 202 of the uniform flow component 200 for uniform flow, and after uniform flow, vertically impact the second area 323 of the heat dissipation chamber with the heat conductive member 322 through the second liquid outlet 223 provided on the second uniform flow channel 213 to realize distributed jet, and utilize the heat conductive member 322 to contact with the liquid for heat conduction to realize heat dissipation of the low heat flux density area of ​​the chip (i.e., the sixth area 402). After completing the heat dissipation of the chip, the liquid in the second area 323 of the heat dissipation chamber flows out from the liquid outlet 120 on the cover body 100 through the multiple second drainage channels 214 provided in the fourth area 202 of the uniform flow component 200.

[0030] The present application adopts a liquid outlet design that can increase the flow rate of the liquid flowing downward, thereby increasing disturbance and enhancing heat exchange. The heat dissipation chamber can provide a mixed flow space, extend the jet path, and enhance the heat dissipation effect. In addition, the liquid enters the heat dissipation chamber through the uniform flow channel and liquid outlet of the uniform flow component 200, and after hitting the heat conductive member 322, it is quickly reflected and discharged through the drainage channel. This liquid flow method can maintain a lower overall pressure drop at a higher flow rate.

[0031] An embodiment of the present application provides a heat dissipation device, which arranges denser heat-conducting members 322 in the first area 321 of the heat dissipation chamber of the base plate assembly 300, and sparser heat-conducting members 322 in the second area 323 of the heat dissipation chamber of the bottom assembly. When the chip is in an installed state, the high heat flux density area of ​​the chip corresponds to the first area 321, and the low heat flux density area of ​​the chip corresponds to the second area 323. In addition, a uniform flow assembly 200 is covered on the heat dissipation chamber, and the third area 201 of the uniform flow assembly 200 corresponds to the first area 321 of the heat dissipation chamber, and the fourth area 202 of the uniform flow assembly 200 corresponds to the second area 323 of the heat dissipation chamber. The multiple first uniform flow channels 211 on the third area 201 of the uniform flow assembly 200 are connected to the liquid inlet 110 on the cover body 100, and the first uniform flow channels 211 are connected to the liquid inlet 110 on the cover body 100. A plurality of first liquid outlet holes 221 are arranged at three intervals, the first liquid outlet holes 221 connect the first uniform flow channel 211 and the first area 321, the plurality of first drainage channels 212 on the third area 201 of the uniform flow component 200 connect the first area 321 and the plurality of second uniform flow channels 213 on the fourth area 202 of the uniform flow component 200, a plurality of second liquid outlet holes 223 are arranged at a fourth interval on the second uniform flow channel 213, the second liquid outlet holes 223 connect the second uniform flow channel 213 and the second area 323, the plurality of second drainage channels 214 on the fourth area 202 of the uniform flow component 200 connect the second area 323 and the liquid outlet 120 on the cover 100, which can achieve heat dissipation of the high heat flux density area of ​​the chip first, and then heat dissipation of the low heat flux density area of ​​the chip, thereby improving the heat dissipation effect of the non-uniform heat generation chip. In addition, by dissipating the heat of the chip through the heat dissipation device provided in the present application, the thermal stress caused by the local temperature difference of the chip can be eliminated, thereby ensuring the service life and reliability of the chip.

[0032] In this application, the heat conductor can be microneedle teeth. Using microneedle teeth as heat conductor 322 can effectively enhance the overall heat exchange effect, avoid the occurrence of local hot spots, and achieve better temperature control in high heat flux density areas. It should be noted that the microneedle teeth can be a rectangular columnar structure, which is not specifically limited in this application.

[0033] In one implementation, when the heat conductive member 322 is a rectangular columnar structure, the spacing length between the heat conductive members 322 can be equal to the width of the bottom surface of the rectangular columnar structure. That is, the bottom surface width of the heat conductive member 322 disposed in the first region 321 is smaller than the bottom surface width of the heat conductive member 322 disposed in the second region 323. When the heat conductive member 322 is a square columnar structure, the spacing length between the heat conductive members 322 can be equal to the side length of the square bottom surface of the square columnar structure. That is, the square bottom surface of the heat conductive member 322 disposed in the first region 321 is smaller than the square bottom surface of the heat conductive member 322 disposed in the second region 323. For example, as shown in FIG. 5 , the side length d of the bottom surface square of the heat conductive member 322 disposed in the first region 321 is pin It can be 10-100um, the first interval w pin The side length d of the bottom square of the heat conducting member 322 disposed in the second area 323 may be 10-100 μm. pin It can be 100-200um, the second interval w pin In addition, the height of the heat conducting member 322 arranged in the first area 321 and the height of the heat conducting member 322 arranged in the second area 323 can be set according to actual heat dissipation requirements. For example, the height of the heat conducting member 322 arranged in the first area 321 can be set greater than the height of the heat conducting member 322 arranged in the second area 323.

[0034] In the embodiment of the present application, since the first area 321 of the heat dissipation chamber is densely arranged with heat conductive parts 322, and the second area 323 of the heat dissipation chamber is sparsely arranged with heat conductive parts 322, the third area 201 of the flow equalizer component 200 corresponds to the first area 321 of the heat dissipation chamber, and the fourth area 202 of the flow equalizer component 200 corresponds to the second area 323 of the heat dissipation chamber. By setting the size of the first liquid outlet 221 of the third area 201 of the flow equalizer component 200 to be smaller than the size of the second liquid outlet 223 of the fourth area 202 of the flow equalizer component 200, and the third interval between the first liquid outlet holes 221 is smaller than the fourth interval between the second liquid outlet holes 223, that is, the first liquid outlet holes 221 of the third area 201 are densely distributed, and the second liquid outlet holes 223 of the fourth area 202 are sparsely distributed, the liquid outlet holes on the flow equalizer component 200 can cooperate with the heat conductive parts 322 arranged in the heat dissipation chamber, thereby further improving the heat dissipation effect of the chip.

[0035] In one implementation, the flow-uniform component 200 may include a liquid separator 210 and a jet plate 220, wherein the third region 201 of the liquid separator 210 includes the plurality of first flow-uniform channels 211 and the plurality of first drainage channels 212, the fourth region 202 of the liquid separator 210 includes the plurality of second flow-uniform channels 213 and the plurality of second drainage channels 214, the third region 201 of the jet plate 220 includes the plurality of first liquid outlet holes 221 and the plurality of first drainage frames 222, and the fourth region 202 of the jet plate 220 includes the plurality of first liquid outlet holes 221 and the plurality of first drainage frames 222. It includes the multiple second liquid outlet holes 223 and the multiple second liquid drainage frames 224, the first liquid outlet hole 221 corresponds to the first uniform flow channel 211, the second liquid outlet hole 223 corresponds to the second uniform flow channel 213, the first liquid drainage frame 222 corresponds to the first liquid drainage channel 212, the first liquid drainage frame 222 connects the first liquid drainage channel 212 and the first area 321, the second liquid drainage frame 224 corresponds to the second liquid drainage channel 214, the second liquid drainage frame 224 connects the second liquid drainage channel 214 and the second area 323.

[0036] In the present application, the uniform flow component 200 can be composed of a separator plate 210 and a jet plate 220. The flow direction of the liquid in the separator plate 210 is shown in Figure 3. The third area 201 of the separator plate 210 includes multiple first uniform flow channels 211 and multiple first drainage channels 212. The fourth area 202 of the separator plate 210 includes multiple second uniform flow channels 213 and multiple second drainage channels 214. The arrangement of the multiple first uniform flow channels 211, the multiple first drainage channels 212, the multiple second uniform flow channels 213 and the multiple second drainage channels 214 here is consistent with the above description, and this application will not repeat them here.

[0037] Exemplarily, the thickness of the liquid separation plate 210 can be 1-1.5 mm, the multiple first uniform flow channels 211 can be a rake-shaped structure, the multiple first drainage channels 212 can be a rake-shaped structure, the multiple second uniform flow channels 213 can be a rake-shaped structure, and the multiple second drainage channels 214 can also be a rake-shaped structure. The width of the uniform flow channel can be 1-1.5 mm, and the width of the drainage channel can be 1-1.5 mm.

[0038] The structure of the jet plate 220 is shown in FIG7 . The third region 201 of the jet plate 220 includes a plurality of first liquid outlet holes 221 and a plurality of first liquid drainage frames 222. The fourth region 202 of the jet plate 220 includes a plurality of second liquid outlet holes 223 and a plurality of second liquid drainage frames 224. The first liquid outlet holes 221 are arranged to correspond to the first uniform flow channel 211 of the separator plate 210. The first liquid drainage frames 222 are arranged to correspond to the first liquid drainage channel 212 of the separator plate 210. The second liquid outlet holes 223 are arranged to correspond to the second uniform flow channel 213 of the separator plate 210. The second liquid drainage frames 224 are arranged to correspond to the second liquid drainage channel 214 of the separator plate 210. By way of example, the thickness of the jet plate 220 may be 200-300 μm.

[0039] In an embodiment of the present application, the base plate assembly 300 may include a frame plate 310 and a base plate 320, the frame plate 310 is provided with the heat dissipation chamber, the first area 321 of the base plate 320 is arranged with a plurality of heat conductive parts 322 at the first interval, and the second area 323 of the base plate 320 is arranged with a plurality of heat conductive parts 322 at the second interval.

[0040] For example, the thickness of the bottom plate 320 may be 600-800 um, the thickness of the frame plate 310 may be 200-300 um, and the corresponding height of the heat dissipation chamber may be 200-300 um.

[0041] In one implementation, the base plate 320 can be made of silicon. Since the chip mounted below the base plate 320 is a silicon-based chip, the base plate 320 being made of silicon can avoid interface reliability risks caused by inconsistent thermal expansion coefficients when soldering the chip to the heat sink.

[0042] Optionally, the base plate 320 may be formed by etching the chip.

[0043] In the embodiment of the present application, the area of ​​the arrangement region of the heat conducting member 322 on the base plate assembly 300 may be larger than the area of ​​the chip, thereby better achieving heat dissipation for the chip.

[0044] In one implementation, the first drainage channel 212 and the second drainage channel 214 may be strip-shaped drainage frames, which can increase the outflow speed of liquid from the first area 321 or the second area 323 of the heat dissipation chamber.

[0045] In an embodiment of the present application, the heat sink may further include a metal layer disposed between the base plate assembly 300 and the chip. The metal layer may be formed by sequentially plating titanium, platinum, and gold on the surface of the base plate assembly 300 close to the chip or on the surface of the chip using vapor deposition or magnetron sputtering technology. After the metallization process is completed, gold-tin solder is attached to the soldering surface of the base plate assembly 300 or the chip using evaporation technology, and then the heat sink and the chip are placed in an atmosphere furnace using a fixture for heating and bonding to achieve assembly of the heat sink and the chip.

[0046] If the base plate assembly 300 is made of silicon, the titanium in the metal layer can enhance adhesion, the platinum in the metal layer can act as a barrier to prevent titanium from leaking downward, and the gold can improve solderability. If the base plate assembly 300 is made of a non-silicon material, the metal layer can separate the base plate assembly 300 from the chip, avoiding interface reliability risks caused by inconsistent thermal expansion coefficients of the materials.

[0047] In addition, the heat dissipation device disclosed in the present application can be packaged as a whole after being assembled with the chip, that is, the heat dissipation device can be directly welded on the chip silicon wafer through the patch process, and then the heat dissipation device and the chip can be packaged as a whole to reduce the interface thermal resistance between the heat dissipation device and the chip and improve the heat dissipation effect on the chip.

[0048] The heat dissipation device disclosed in this application can be used to dissipate heat for high-density heterogeneous chips, SSP (Supervisor Stack Pointer) chips, etc.

[0049] It should be noted that the liquid mentioned above can be water, dielectric working fluid or refrigerant, etc., that is, the heat dissipation device disclosed in this application can use water, dielectric working fluid or refrigerant as the working medium.

[0050] The present application also discloses a method for manufacturing a heat dissipation device, as shown in FIG8 . The method includes:

[0051] S820 , bonding the liquid separation plate 210 , the jet plate 220 , the frame plate 310 and the bottom plate 320 in sequence to form a first body.

[0052] S840: Connect the cover 100 to the first body.

[0053] For example, epoxy resin or UV adhesive may be used to bond the cover 100 and the first body.

[0054] It should be noted that the separator plate 210 , jet plate 220 , frame plate 310 , bottom plate 320 and cover 100 here are the separator plate 210 , jet plate 220 , frame plate 310 , bottom plate 320 and cover 100 described in the heat dissipation device above.

[0055] Through the manufacturing method disclosed in the present application, taking into account the bonding size requirements, the liquid separator plate 210, the jet plate 220, the frame plate 310 and the bottom plate 320 are first bonded in sequence to form a first main body, and then the cover body 100 is connected to the first main body. This can solve the processing difficulties of heat dissipation devices with extremely small space dimensions and improve the manufacturing efficiency of the heat dissipation devices.

[0056] In the embodiment of the present application, to facilitate bonding of the separator plate 210, the fluidic plate 220, the frame plate 310, and the base plate 320, the base plate 320 and the fluidic plate 220 can be made of silicon, and the frame plate 310 and the separator plate 210 can be made of glass, i.e., a structure of one layer of silicon, one layer of glass, one layer of silicon, and one layer of glass. Furthermore, the frame plate 310 can be made of polydimethylsiloxane (PDMS), and the cover 100 can be made of glass.

[0057] In this application, the base plate 320, the frame plate 310, the jet plate 220, the separator plate 210 and the cover body 100 are processed separately, the base plate 320 is processed by a deep silicon etching process, the frame plate 310, the separator plate 210 and the cover body 100 are processed by a laser cutting process, and the jet plate 220 is processed by an etching process.

[0058] The process flow chart of deep silicon etching of the base plate 320 is shown in FIG9 , which includes the following steps: a) designing a photolithography mask according to the desired thermal conductive part morphology; b) spin coating photoresist; c) exposing, changing the exposure time according to the desired thermal conductive part height; d) clearing the photoresist to complete the etching process.

[0059] The above embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0060] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A heat dissipation device, comprising: Cover body, flow distribution assembly and bottom plate assembly, wherein: The base plate assembly includes a heat dissipation chamber, a first area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a first interval, and a second area of ​​the heat dissipation chamber is arranged with a plurality of heat conductive members at a second interval, wherein the first interval is smaller than the second interval; The flow-uniform component at least covers the heat dissipation chamber, the third region of the flow-uniform component includes a plurality of first flow-uniform channels and a plurality of first drainage channels, the first flow-uniform channels and the first drainage channels are arranged alternately, the first flow-uniform channel is provided with a plurality of first liquid outlet holes at a third interval, the first liquid outlet holes connect the first flow-uniform channel and the first region, the fourth region of the flow-uniform component includes a plurality of second flow-uniform channels and a plurality of second drainage channels, the second flow-uniform channels and the second drainage channels are arranged alternately, the second flow-uniform channel is provided with a plurality of second liquid outlet holes at a fourth interval, the second liquid outlet holes connect the second flow-uniform channel and the second region, and the first drainage channel connects the first region and the second flow-uniform channel; The cover body covers the flow-uniform component, and the cover body is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected to the first flow-uniform channel, and the second liquid discharge channel is connected to the second area and the liquid outlet; When the chip is in an installed state, the surface of the base plate component away from the uniform flow component is in contact with the chip, the fifth area of ​​the chip corresponds to the first area, and the sixth area of ​​the chip corresponds to the second area, wherein the temperature of the fifth area is higher than the temperature of the sixth area.

2. The heat dissipation device according to claim 1, wherein: The size of the first liquid outlet hole is smaller than that of the second liquid outlet hole, and the third interval is smaller than the fourth interval.

3. The heat dissipation device according to claim 1 or 2, wherein: The uniform flow component includes a separator plate and a jet plate, the third area of ​​the separator plate includes the multiple first uniform flow channels and the multiple first drainage channels, the fourth area of ​​the separator plate includes the multiple second uniform flow channels and the multiple second drainage channels, the third area of ​​the jet plate includes the multiple first liquid outlet holes and the multiple first drainage frames, the fourth area of ​​the jet plate includes the multiple second liquid outlet holes and the multiple second drainage frames, the first liquid outlet hole corresponds to the first uniform flow channel, the second liquid outlet hole corresponds to the second uniform flow channel, the first drainage frame corresponds to the first drainage channel, the first drainage frame connects the first drainage channel and the first area, the second drainage frame corresponds to the second drainage channel, and the second drainage frame connects the second drainage channel and the second area.

4. The heat dissipation device according to claim 1, wherein: The base plate assembly includes a frame plate and a base plate, the frame plate is provided with the heat dissipation chamber, a plurality of heat conducting members are arranged at the first interval in the first area of ​​the base plate, and a plurality of heat conducting members are arranged at the second interval in the second area of ​​the base plate.

5. The heat dissipation device according to claim 4, wherein: The bottom plate is made of silicon material.

6. The heat dissipation device according to claim 5, wherein: The bottom plate is formed by etching the chip.

7. The heat dissipation device according to claim 1, wherein: The area of ​​the arrangement region of the heat conducting member on the base plate assembly is larger than the area of ​​the chip.

8. The heat dissipation device according to claim 1, wherein: The first liquid discharge channel and the second liquid discharge channel are strip-shaped liquid discharge frames.

9. The heat dissipation device according to claim 1, wherein: The invention also comprises a metal layer, wherein the metal layer is arranged between the base plate component and the chip.

10. A method for manufacturing a heat dissipation device, comprising: Bonding the liquid separation plate, the jet plate, the frame plate and the bottom plate in sequence to form a first body; The cover body is connected to the first body.

11. The manufacturing method according to claim 10, wherein: The bottom plate and the jet plate are made of silicon material, and the frame plate and the liquid separation plate are made of glass.

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