Electroplating device

Abstract

An electroplating device, comprising a central flow tube. The central flow tube passes through an anode; one end of the central flow tube is an anode electroplating solution inlet, and the other end of the central flow tube extends out of the surface of the anode; the central flow tube is connected to a plurality of branch flow tubes extending to the edge of the anode; and each branch flow tube is provided with a plurality of injection holes. An anode electroplating solution is supplied to the surface of the anode through the injection holes in the branch flow tubes. In the device, the anode electroplating solution can be guided to the surface of the anode, and the oxide generated on the surface of the anode is washed away in time by utilizing the impact force of the liquid, thereby ensuring that the impedance of a loop remains unchanged, and avoiding a rise in the voltage of the loop; additionally, the fluidity and the flow uniformity of the anode electroplating solution are improved.

Description

electroplating equipment Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating device. Background Art

[0002] In the electroplating process, a metal block acts as an anode and a substrate, immersed in the plating solution. An electric field is generated on the anode surface, and under the action of the electric field, the metal is gradually deposited on the substrate surface. As shown in Figure 1, in the electroplating equipment, the anode chamber includes a low-positioned liquid inlet 100 and a high-positioned liquid outlet 200. During the electroplating process, the plating solution flows in from the liquid inlet 100 and diffuses in the gap between the anode plate and the bottom surface of the chamber; then, part of the plating solution flows upward through the center hole 300 of the anode plate, and the rest flows upward along the surrounding walls, finally converging and flowing to the high-positioned liquid outlet 200.

[0003] However, this structure suffers from a slow flow rate within the cavity and an uneven flow field, particularly at the anode surface, where the plating solution has a very low flow rate. Because constant current is used in electroplating, excessive plating volume over a given period can lead to oxide accumulation on the anode surface, which can't be flushed away in time. This increases the circuit impedance, raising the voltage across the entire circuit and triggering an alarm. This can cause the equipment to shut down and even require manual cavity disassembly for cleaning, impacting the plating rate.

[0004] Summary of the Invention

[0005] The object of the present invention is to provide an electroplating device for solving the problem in the prior art that oxides accumulate on the anode surface, resulting in increased loop impedance.

[0006] To achieve the above and other related purposes, the present invention provides an electroplating device, comprising:

[0007] The central flow tube is arranged in the anode, one end of which is the anode plating liquid inlet, and the other end extends out of the anode surface and is connected to a plurality of branch flow tubes extending toward the edge of the anode, each branch flow tube is provided with a plurality of injection holes;

[0008] The anode plating solution is supplied to the anode surface through the injection holes of the branch flow pipe.

[0009] Furthermore, the multiple injection holes on each branch flow pipe face the anode surface.

[0010] Furthermore, the opening directions of the multiple injection holes on each branch flow pipe are inclined relative to the vertical direction.

[0011] Furthermore, the multiple injection holes on each branch flow pipe are divided into two groups, and the opening directions of the two groups of injection holes are different.

[0012] Furthermore, the opening directions of the two groups of injection holes are symmetrical with respect to the vertical direction.

[0013] Furthermore, the opening directions of every two adjacent injection holes on each branch flow pipe are different.

[0014] Furthermore, the opening directions of every two adjacent injection holes are symmetrical with respect to the vertical direction.

[0015] Furthermore, the diameters or densities of the multiple injection holes on each branch flow pipe are the same.

[0016] Furthermore, the diameters or densities of the multiple injection holes on each branch flow pipe are different.

[0017] Furthermore, the diameters or densities of the multiple injection holes on each branch flow pipe gradually increase from the center to the edge along the radial direction of the anode.

[0018] Furthermore, one end of each branch flow tube away from the central flow tube is of closed design.

[0019] Furthermore, it also includes:

[0020] An anode plating solution inlet is provided at the bottom of the anode chamber;

[0021] The anode plate covers the anode plating solution inlet and is used to support the anode; the anode plate is provided with a central hole, which is connected to the anode plating solution inlet.

[0022] Furthermore, a sealing ring is provided between the anode plate and the bottom surface of the anode chamber.

[0023] As described above, the present invention provides an electroplating device having the following beneficial effects: a central flow tube and a branch flow tube are added in the anode cavity to drain the anode plating liquid to the anode surface, and the impact force of the liquid is used to promptly flush away the oxides generated on the anode surface, thereby ensuring that the loop impedance remains unchanged and avoiding an increase in the loop voltage; and through the design of multiple branch flow tubes, the fluidity of the anode plating liquid and the uniformity of the flow rate are increased.

[0024] Summary of the Figures

[0025] The features and properties of the present invention are further described by the following examples and accompanying drawings.

[0026] FIG1 is a schematic diagram of an electroplating device;

[0027] FIG2 is a cross-sectional view of an electroplating apparatus according to the present invention;

[0028] FIG3 shows another cross-sectional view of the electroplating apparatus of the present invention;

[0029] FIG4 is a partial enlarged view of the circled portion of the electroplating apparatus in FIG3 ;

[0030] FIG. 5 is a schematic diagram showing some components of the electroplating apparatus of the present invention.

[0031] Preferred embodiments of the present invention

[0032] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0033] It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Although the illustrations only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation, the form, quantity, and proportion of each component in actual implementation may be varied arbitrarily, and the component layout may be more complex. Furthermore, parts with the same reference numerals in multiple figures represent identical or equivalent parts or components.

[0034] As shown in Figures 2 and 3, this embodiment proposes an electroplating device, including a plating chamber for accommodating a plating solution. The interior of the plating chamber is divided into an anode chamber 11 and a cathode chamber 12. The anode chamber 11 and the cathode chamber 12 are separated by a membrane 13 fixed on a membrane frame 14.

[0035] Membrane 13 is a cationic membrane used for copper, nickel, and tin electroplating. Alternatively, membrane 13 may be a proton exchange membrane or a conventional membrane covered with a fabric structure suitable for alloy electroplating. Membrane 13 is secured to a membrane frame 14. Membrane frame 14 is a rigid perforated or mesh frame.

[0036] The anode chamber 11 accommodates an anode 111 and an anode plate 112, and the anode 111 is connected to an independently controlled power channel (not shown) by the anode plate 112. Electroplating current or voltage is independently applied to the anode 111 by the power channel. The power channel is connected to a power supply, which can be a DC power supply or a pulse power supply. The anode 111 is made of a soluble material, such as copper, nickel, tin. The anode 111 can be a column. As shown in Figure 4, a liquid inlet 113 is provided at the bottom of the anode chamber 11 to provide anodizing solution to the anode 111. Simultaneously, as shown in Figure 3, a liquid outlet 114 is also provided at the top of the anode chamber 11 sidewalls for discharging the electroplating solution, decomposition products and particles in the anode chamber 11.

[0037] As shown in Figure 3, the membrane frame 14 is tilted between the anode chamber 11 and the cathode chamber 12, that is, the membrane frame 14 is not parallel to the bottom surface of the anode chamber 11, but at a certain angle. A liquid outlet 114 is set at the highest point of the side wall of the anode chamber 11 to discharge bubbles.

[0038] The anode plate 112 is arranged at the bottom of the anode cavity 11, and the anode 111 is arranged on the anode plate 112. Specifically, the anode 111 is fixed to the anode plate 112 by a fixing member 119. The anode plate 112 can be circular, with a center hole 116 provided at the center of the circle, and the anode plating solution flows through the center hole 116. The anode plate 112 is made of an insoluble material, such as titanium or its metal oxide. As shown in Figure 4, a sealing ring 115 is provided between the anode plate 112 and the bottom surface of the anode cavity 11 to ensure sealed contact between the anode plate 112 and the bottom surface of the cavity, thereby preventing the anode plating solution from flowing upward through the gap between the anode plate 112 and the cavity, thereby draining the anode plating solution to the center hole 116 of the anode plate 112. In some embodiments, a sealing gasket can also be added between the anode plate 112 and the sealing ring 115, and combined with the sealing ring to achieve a better sealing effect.

[0039] As shown in Figures 3 and 5, a central flow tube 117 is also provided within the anode chamber 11, having a first end 1171 and a second end 1172. First end 1171 serves as the inlet for the anode plating solution and is connected to the central hole 116 of the anode plate 112. Second end 1172 is connected to a plurality of branch flow tubes 118 extending toward the edge. Central flow tube 117 is disposed within the anode 111, with second ends 1172 extending beyond the anode surface 1111. The length of branch flow tubes 118 is less than the radius of the anode 111, and the ends away from central flow tube 117 are closed.

[0040] As shown in Figure 5, the branch flow tubes 118 are circular tubes. Each branch flow tube 118 is provided with a plurality of spray holes 1181 on the side facing the anode surface 1111, for supplying the anode plating solution to the anode surface 1111. In other embodiments, the branch flow tubes 118 may be square tubes or other shapes. The diameters of the multiple spray holes 1181 on each branch flow tube 118 may be the same or different. As the anode radius increases, the area of ​​the anode surface 1111 increases, requiring more flow to flush it. Therefore, in some embodiments, the diameter of the spray holes 1181 gradually increases from the center to the edge of the anode 111. Alternatively, the density of the spray holes 1181 on each branch flow tube 118 may be the same or different. In some embodiments, the density of the spray holes 1181 gradually increases from the center to the edge of the anode 111. According to one embodiment, the opening direction of each spray hole 1181 is inclined relative to the vertical to prevent the anode plating solution from being sprayed onto the same location and causing impact. The multiple spray holes 1181 on each branch flow tube 118 can be divided into two groups. The opening directions of the two groups of injection holes 1181 are different. In some embodiments, the opening directions of the two groups of injection holes 1181 are symmetrical in the vertical direction. Alternatively, the opening directions of every two adjacent injection holes 1181 on each branch flow tube 118 are different. In some embodiments, the opening directions of every two adjacent injection holes 1181 are symmetrical in the vertical direction. In some embodiments, as shown in FIG5 , the second end 1172 of the central flow tube 117 is connected to four branch flow tubes 118 for evenly distributing the flow, and the angles between adjacent branch flow tubes 118 are all 90 degrees. During the electroplating process, the anode 111 is continuously consumed, so that the distance from the anode surface 1111 to the branch flow tube 118 gradually increases, so that the impact force of the anode plating solution sprayed onto the anode surface 1111 increases, thereby washing away the oxides accumulated on the anode surface 1111.

[0041] Through the design of the central flow tube 117 and the branch flow tube 118, the anode plating liquid is drained to the anode surface 1111, and the impact force of the liquid is used to promptly flush away the oxides produced on the anode surface 1111, thereby ensuring that the loop impedance remains basically unchanged, avoiding equipment standby caused by voltage increase alarm, and improving the electroplating rate; moreover, multiple branch flow tubes 118 are provided to increase the fluidity of the anode plating liquid and the uniformity of the flow rate.

[0042] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. An electroplating device, comprising an electroplating chamber, wherein the electroplating chamber comprises an anode, characterized in that: include: A central flow tube is arranged in the anode, one end of which is the anode plating liquid inlet, and the other end extends out of the anode surface and is connected to a plurality of branch flow tubes extending toward the edge of the anode, each branch flow tube being provided with a plurality of injection holes; The anode plating solution is supplied to the anode surface through the injection holes of the branch flow pipe.

2. The electroplating device according to claim 1, characterized in that: The plurality of injection holes on each branch flow pipe faces the anode surface.

3. The electroplating device according to claim 2, characterized in that: The opening directions of the plurality of injection holes on each branch flow pipe are inclined relative to the vertical direction.

4. The electroplating device according to claim 3, characterized in that: The plurality of injection holes on each branch flow pipe are divided into two groups, and the opening directions of the two groups of injection holes are different.

5. The electroplating device according to claim 4, characterized in that: The opening directions of the two groups of injection holes are symmetrical with respect to the vertical direction.

6. The electroplating device according to claim 3, characterized in that: The opening directions of every two adjacent injection holes on each branch flow pipe are different.

7. The electroplating device according to claim 6, characterized in that: The opening directions of every two adjacent injection holes are symmetrical with respect to the vertical direction.

8. The electroplating device according to claim 1, characterized in that: The diameters or densities of the multiple injection holes on each branch flow pipe are the same.

9. The electroplating device according to claim 1, characterized in that: The diameters or densities of the multiple injection holes on each branch flow pipe are different.

10. The electroplating device according to claim 9, characterized in that: The diameters or densities of the multiple injection holes on each branch flow pipe gradually increase from the center to the edge along the radial direction of the anode.

11. The electroplating device according to claim 1, characterized in that: One end of each branch flow tube away from the central flow tube is of closed design.

12. The electroplating device according to claim 1, characterized in that: Also includes: An anode plating solution inlet is arranged at the bottom of the anode chamber; The anode plate is covered on the anode plating liquid inlet and is used to support the anode; the anode plate is provided with A central hole is provided, which is connected to the inlet of the anode plating solution.

13. The electroplating device according to claim 12, characterized in that: A sealing ring is arranged between the anode plate and the bottom surface of the anode chamber.

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