Electric control module assembly, potting method, outdoor unit, and heating, ventilation and air conditioning equipment

Abstract

An electric control module assembly (10), a potting method, an outdoor unit (100), and heating, ventilation and air conditioning equipment. The electric control module assembly (10) comprises an electric control module (20) and a heat dissipation component (30). The electric control module (20) comprises an electric control box (24) and an electric control assembly (21) arranged in the electric control box (24). The electric control assembly (21) comprises an electric control board (22) and a plurality of components (23) arranged on the electric control board (22). The heat dissipation component (30) is used for performing heat dissipation on the electric control module (20). An isolation structure is provided in the electric control box (24). The isolation structure covers the outer surfaces of the plurality of components (23), so that the components (23) are isolated from air.

Description

Electronic control module components, glue filling method, outdoor unit and HVAC equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on Chinese patent applications with application numbers 202311128861.3 and 202311128895.2, both with application date of September 1, 2023, and claims the priority of the Chinese patent applications. The entire contents of the Chinese patent applications are hereby incorporated into this application by reference. Technical Field

[0003] The present application relates to the technical field of electronically controlled heat dissipation, and in particular to an electronically controlled module assembly, a glue filling method, an outdoor unit, and HVAC equipment. Background Art

[0004] In related technologies, electronic control modules generate a significant amount of heat during operation. To ensure stable operation, they are typically cooled and dissipated. For example, some employ heat dissipation components that are thermally connected to the components of the electronic control module. The components transfer heat to the heat dissipation component, which then dissipates the heat, thereby dissipating heat from the electronic control module.

[0005] However, when the heat dissipation component is cooling the electronic control module, condensation may form on the components of the electronic control module, affecting the reliability, stability and safety of the electronic control module. Therefore, there is room for improvement.

[0006] Summary of the Invention

[0007] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present application is to propose an electric control module assembly, which can dissipate heat from the electric control module by providing a heat dissipation component, and can isolate the components from the air by providing an isolation structure and making the isolation structure cover the outer surface of the components, thereby avoiding condensation on the components of the electric control module, thereby improving the reliability, stability and safety of the electric control module; in addition, when there are flammable and explosive gases in the environment where the electric control module is located, by providing an isolation structure and making the isolation structure cover the outer surface of the components, the safety hazard of ignition and explosion caused by contact between the flammable and explosive gases and the components can be eliminated, and at the same time, it can also enhance the vibration resistance of the electric control module, prevent the components from detaching, buffer and protect the components, and prevent dust.

[0008] This application proposes a method for glue filling of the above-mentioned electronic control module assembly.

[0009] The present application proposes an outdoor unit having the above-mentioned electronic control module assembly.

[0010] The present application also proposes a HVAC device having the above-mentioned outdoor unit.

[0011] According to the first aspect of the present application, the electric control module assembly includes: an electric control module, including an electric control box body and an electric control assembly arranged in the electric control box body, the electric control assembly including an electric control board and multiple components arranged on the electric control board; a heat dissipation component for dissipating heat from the electric control module; wherein an insulating structure is provided in the electric control box body, and the insulating structure covers the outer surfaces of multiple components.

[0012] According to the electronic control module assembly of the embodiment of the present application, the electronic control module can be cooled by providing a heat dissipation component, and the components can be isolated from the air by providing an isolation structure and making the isolation structure cover the outer surface of the components, thereby avoiding condensation on the components of the electronic control module, thereby improving the reliability, stability and safety of the electronic control module; in addition, when there are flammable and explosive gases in the environment where the electronic control module is located, by providing an isolation structure and making the isolation structure cover the outer surface of the components, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module, prevent the components from detaching, cushion and protect the components, and prevent dust.

[0013] According to some embodiments of the present application, the isolation structure is a colloidal structure.

[0014] According to some embodiments of the present application, part of the heat dissipation component is located inside the electric control box body and is thermally connected to the electric control component. The space defined by the electric control box body, the electric control component and the heat dissipation component is filled with the insulation structure, and the insulation structure integrally connects the electric control component and part of the heat dissipation component.

[0015] According to some embodiments of the present application, the inner wall of the electric control box body or the electric control board is provided with a first limiting structure for partially limiting the heat dissipation component.

[0016] According to some embodiments of the present application, the electric control board has a first side and a second side arranged opposite to each other along the thickness direction of the electric control board, a filling space is defined between the first side of the electric control board and the electric control box body, at least part of the components are arranged on the first side of the electric control board and located in the filling space, and the filling space is filled with the insulating structure.

[0017] According to some embodiments of the present application, part of the heat dissipation component is located in the filling space and is thermally connected to the component.

[0018] According to some embodiments of the present application, the insulating structure is filled between the outer edge of the electric control board and the inner wall of the electric control box body.

[0019] According to some embodiments of the present application, multiple components are installed on the first side of the electronic control board, the surface of the second side of the electronic control board is the back side of the board, the back side of the board reveals the welding feet of multiple components, the isolation structure is flush with the back side of the board or the isolation structure protrudes from the back side of the board and covers the welding feet of multiple components.

[0020] According to some embodiments of the present application, at least a portion of the inner wall of the electric control box body facing the first side of the electric control board is formed as a contoured structure, the configuration of the first side of at least a portion of the components installed on the first side of the electric control board is defined as the first side configuration of the electric control component, and the contoured structure is similar to the first side configuration of the electric control component.

[0021] According to some embodiments of the present application, the electronic control box body includes a first box body and a second box body that are independently formed. The box wall of the first box body encloses a cavity with an opening. The box wall of the first box body has a bottom wall opposite to the opening and a ring wall surrounding the bottom wall to form the opening. The bottom wall of the first box body constitutes the contour structure. The electronic control component is fixed in the cavity of the first box body. The space between the bottom wall of the first box body and the first side of the electronic control board constitutes the filling space.

[0022] According to some embodiments of the present application, the isolation structure is a colloid structure formed by glue pouring, the opening side of the first box body is configured as a glue pouring side, and the colloid material enters the filling space from the opening of the first box body.

[0023] According to some embodiments of the present application, there is a gap between the outer edge of the board surface of the electric control board and the annular wall of the first box body, and at least a part of the gap constitutes a glue filling port, and the glue filling port is connected to the filling space.

[0024] According to some embodiments of the present application, a first glue filling hole communicating with the filling space is formed on the electric control board.

[0025] According to some embodiments of the present application, the equivalent diameter of the first glue filling hole is greater than 10 mm; and / or the first glue filling hole is located in the middle of the electronic control board.

[0026] According to some embodiments of the present application, a first fixing column and a second fixing column are provided in the first box body, the electric control board is installed on the first fixing column, the second fixing column is connected to the second box body, the first fixing column is supported on the first side of the electric control board, the surface of the second side of the electric control board is the back side of the board, and the second fixing column is located on the outer peripheral side of the electric control board and protrudes from the back side of the board.

[0027] According to some embodiments of the present application, the isolation structure is a colloid structure, the glue filling side of the filling space is located on the first side of the electronic control board, and a second glue filling hole is formed on the portion of the electronic control box body located on the first side of the electronic control board. When the first side of the electronic control board is facing upward, the second glue filling hole is located at the highest position of the electronic control box body.

[0028] According to some embodiments of the present application, the isolation structure is a colloid structure, and the heat dissipation component is led out from the glue-filled side of the electronic control box body; and / or, the isolation structure is a colloid structure, and the wiring harness connected to the electronic control component is led out from the glue-filled side of the electronic control box body.

[0029] According to some embodiments of the present application, the heat dissipation component includes a heat dissipation element, which includes a heat dissipation body located in the electric control box body, and a heat dissipation channel for the flow of heat dissipation medium is formed in the heat dissipation element.

[0030] According to some embodiments of the present application, the heat dissipation component includes a medium inlet pipe and a medium outlet pipe, and the heat dissipation channel connects the medium inlet pipe and the medium outlet pipe.

[0031] According to some embodiments of the present application, the heat sink is multiple and arranged in parallel.

[0032] According to some embodiments of the present application, the medium inlet pipe and the medium outlet pipe are located on both sides of the length direction of the electric control board, the heat sink extends along the length direction of the electric control board, and multiple heat sinks are arranged along the width direction of the electric control board.

[0033] According to some embodiments of the present application, a third limiting structure is provided on the inner wall of the electric control box body, and the medium inlet pipe and the medium outlet pipe cooperate with the third limiting structure to limit the medium inlet pipe and the medium outlet pipe.

[0034] According to some embodiments of the present application, a portion of the medium inlet pipe and a portion of the medium outlet pipe are located between an outer edge of the electric control board and an inner wall of the electric control box body.

[0035] According to some embodiments of the present application, the heat sink is a phase change heat sink and includes a heat absorption section and a heat dissipation section. The heat dissipation medium in the heat sink is suitable for circulating between the heat absorption section and the heat dissipation section. The heat absorption section includes the heat dissipation body.

[0036] According to some embodiments of the present application, the heat dissipation component includes at least one heat dissipation element, and the heat dissipation element includes a heat dissipation body located in the electric control box body, and the heat dissipation body of at least one heat dissipation element is coated on the outer peripheral side of the component.

[0037] According to some embodiments of the present application, the heat sink whose heat dissipation body is located on the outer peripheral side of the component is a first heat sink, and the heat dissipation body of at least a portion of the first heat sink extends non-linearly.

[0038] According to some embodiments of the present application, at least a portion of the heat dissipation body of the first heat dissipation element extends circumferentially along the component.

[0039] According to some embodiments of the present application, the heat dissipation body of the first heat dissipation element includes a bending portion or multiple bending portions arranged at intervals along the extension direction of the first heat dissipation element, and the bending portion includes multiple bending segments connected in sequence along the extension direction of the first heat dissipation element, and there is an angle between two adjacent bending segments.

[0040] According to some embodiments of the present application, the angle between two adjacent bending segments ranges from 90° to 170°.

[0041] According to some embodiments of the present application, the first heat dissipation member further includes a non-bending portion extending along a straight line, the bending section of the bending section connected to the non-bending portion is a first bending section, and the angle between the non-bending portion and the first bending section ranges from 90° to 170°.

[0042] According to some embodiments of the present application, the heat sink whose heat dissipation body is located on the peripheral side of the component is a first heat sink, and the heat dissipation body of the first heat sink is located on the peripheral side of multiple components.

[0043] According to some embodiments of the present application, the heat sink whose heat dissipation body is located on the outer periphery of the component is a first heat sink, and at least part of the plurality of components are arranged along the length direction of the electronic control board to form a component group;

[0044] The heat dissipation body of the first heat dissipation element extends along the circumference of the components of the component group; and / or the first heat dissipation element is provided on both sides of the component group along the width direction of the electronic control board.

[0045] According to some embodiments of the present application, the heat dissipation body located on the outer peripheral side of the component is a first heat dissipation body, the peripheral side surface of the component is the side surface of the component, and the heat dissipation body of the first heat dissipation body is thermally connected to the side surface of the component.

[0046] According to some embodiments of the present application, the heat sink whose heat dissipation body is located on the outer peripheral side of the component is a first heat sink, there are multiple heat sinks, and the multiple heat sinks include the first heat sink and the second heat sink. The end face of the component in the height direction is the end face of the device, and the heat dissipation body of the second heat sink is thermally connected to the end face of the device.

[0047] According to some embodiments of the present application, the heat dissipation body of the second heat dissipation element includes a fixing portion and a heat dissipation portion, the heat dissipation portion forms a heat dissipation channel for the flow of heat dissipation medium, and the fixing portion is connected to the electric control board via a fastener.

[0048] According to some embodiments of the present application, a heat-conducting layer is provided between the heat dissipation body and the components; the heat-conducting layer includes one or more of thermally conductive glue, thermally conductive silicone grease, thermally conductive pads and thermally conductive metals.

[0049] According to some embodiments of the present application, the heat dissipation body is formed in a flat shape, and at least one side of the heat dissipation body along the thickness direction is opposite to or thermally connected to the component.

[0050] According to some embodiments of the present application, the heat dissipation component includes at least one heat dissipation element, the heat dissipation element includes a heat dissipation body located inside the electrical control box body, the inner wall of the electrical control box body is provided with a first limiting structure, and at least part of the heat dissipation element cooperates with the first limiting structure to limit the heat dissipation element.

[0051] According to some embodiments of the present application, the first limiting structure includes a first limiting groove, and at least a portion of the heat sink is accommodated in the first limiting groove.

[0052] According to the glue pouring method of the electronic control module assembly of the second aspect embodiment of the present application, the electronic control module assembly is the electronic control module assembly according to the above-mentioned first aspect embodiment of the present application, and the glue pouring method includes: assembling the electronic control assembly and the heat dissipation component on the electronic control box body to form a pre-assembly; adjusting the pre-assembly so that the glue pouring side of the electronic control box body faces upward; and pouring glue from the glue pouring side of the electronic control box body into the electronic control box body to form the insulating structure.

[0053] According to the glue filling method of the embodiment of the present application, an isolation structure can be formed in the electronic control box body, which can isolate the components from the air, thereby avoiding condensation on the components of the electronic control module, thereby improving the reliability, stability and safety of the electronic control module; in addition, when there are flammable and explosive gases in the environment where the electronic control module is located, by providing an isolation structure and the isolation structure covering the outer surface of the components, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module, prevent the components from detaching, cushion and protect the components, and prevent dust.

[0054] According to some embodiments of the present application, the electronic control assembly and the heat dissipation component are assembled in the electronic control box body to form a pre-assembled body, including: assembling part of the heat dissipation component in the electronic control assembly, assembling the electronic control assembly equipped with the heat dissipation component in the first box body of the electronic control box body, and making the first side of the electronic control board face the first box body, and the first side of the electronic control board is provided with the components; adjusting the pre-assembled body so that the glue-filled side of the electronic control box body faces upward, including: adjusting the pre-assembled body so that the second side of the electronic control board faces upward; glue is poured from the glue-filled side of the electronic control box body into the electronic control box body to form the isolation structure, including: glue is poured from the second side of the electronic control board toward the first box body to form the isolation structure, and the second box body of the electronic control box body is assembled to the first box body.

[0055] According to the outdoor unit of the third embodiment of the present application, it includes: an outdoor casing; an outdoor heat exchanger and an outdoor fan, which are arranged in the outdoor casing; a compressor assembly, which is arranged in the outdoor casing; and an electronic control module assembly, which is arranged in the outdoor casing and is the electronic control module assembly according to the above-mentioned first embodiment of the present application.

[0056] According to the outdoor unit of the embodiment of the present application, by providing the above-mentioned electronic control module assembly, the heat dissipation effect of the electronic control module can be improved, and by providing an isolation structure, the components can be isolated from the air, thereby avoiding condensation on the components of the electronic control module, thereby improving the reliability, stability and safety of the electronic control module; in addition, when there are flammable and explosive gases in the environment where the electronic control module is located, by providing an isolation structure and the isolation structure covering the outer surface of the components, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module, prevent the components from detaching, cushion and protect the components, and prevent dust.

[0057] According to some embodiments of the present application, the refrigerant circulation system of the outdoor unit includes a cooling part for dissipating heat from the electronic control module. The cooling part is thermally connected to the heat dissipation component or at least a part of the cooling part constitutes the heat dissipation component.

[0058] According to some embodiments of the present application, a water heat exchange component is further included, wherein the water heat exchange component includes a water heat exchanger, the water heat exchanger has a water flow channel and a refrigerant channel for mutual heat exchange, and the cooling part is connected between the refrigerant channel of the water heat exchanger and the outdoor heat exchanger.

[0059] The HVAC equipment according to the fourth embodiment of the present application includes: an outdoor unit according to the above-mentioned third embodiment of the present application.

[0060] According to the HVAC equipment of the embodiment of the present application, by setting the above-mentioned outdoor unit, the electronic control module assembly of the outdoor unit is provided with a heat dissipation component, which can improve the heat dissipation effect of the electronic control module. The electronic control module assembly is also provided with an isolation structure, which can isolate the components from the air, thereby avoiding condensation on the components of the electronic control module, thereby improving the reliability, stability and safety of the electronic control module; in addition, when there are flammable and explosive gases in the environment where the electronic control module is located, by setting an isolation structure and the isolation structure covering the outer surface of the component, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module, prevent the components from detaching, buffer and protect the components, and prevent dust.

[0061] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0063] FIG1 is a simplified diagram of an outdoor unit according to some embodiments of the present application;

[0064] FIG2 is a partial enlarged view of point A in FIG1 ;

[0065] FIG3 is a schematic diagram of an electric control module assembly according to some embodiments of the present application;

[0066] FIG4 is a schematic diagram of the electronic control module assembly in FIG3 from another perspective;

[0067] FIG5 is a schematic diagram showing the positions of the heat dissipation component and the electronic control component of the electronic control module assembly in FIG3 ;

[0068] FIG6 is a schematic diagram of the electric control box of the electric control module assembly in FIG3 ;

[0069] FIG7 is a schematic diagram of a heat dissipation component of the electronic control module assembly in FIG3 ;

[0070] FIG8 is a schematic diagram of an electric control module assembly according to other embodiments of the present application;

[0071] FIG9 is a schematic diagram of the electronic control module assembly in FIG8 from another perspective;

[0072] FIG10 is a schematic diagram showing the positions of the heat dissipation components and the electronic control components of the electronic control module assembly in FIG8;

[0073] FIG11 is a schematic diagram of the electric control box of the electric control module assembly in FIG8 ;

[0074] FIG12 is a schematic diagram of a heat dissipation component of the electronic control module assembly in FIG8;

[0075] FIG13 is a schematic diagram of a partial structure of an electric control module assembly according to some embodiments of the present application;

[0076] FIG14 is a schematic diagram of the electronic control module assembly in FIG13 from another perspective;

[0077] FIG15 is a schematic diagram showing the positions of the heat dissipation components and the electronic control components of the electronic control module assembly in FIG13;

[0078] FIG16 is a schematic diagram showing the positions of the electric control box and the heat dissipation component of the electric control module assembly in FIG13;

[0079] FIG17 is a schematic diagram of a heat dissipation component of the electronic control module assembly in FIG13;

[0080] FIG18 is a schematic cross-sectional view of the second heat dissipation member of the heat dissipation component in FIG17 ;

[0081] FIG19 is a schematic diagram of a partial structure of an electric control module assembly according to other embodiments of the present application;

[0082] FIG20 is a schematic diagram of the electronic control module assembly in FIG19 from another perspective;

[0083] FIG21 is a schematic diagram showing the positions of the heat dissipation components and the electronic control components of the electronic control module assembly in FIG19;

[0084] FIG22 is a schematic diagram showing the positions of the electric control box and the heat dissipation components of the electric control module assembly in FIG19;

[0085] FIG23 is a schematic diagram of a heat dissipation component of the electronic control module assembly in FIG19;

[0086] FIG24 is a simplified diagram of an outdoor unit according to some other embodiments of the present application.

[0087] Reference numerals:

[0088] 100. Outdoor unit;

[0089] 10. Electronic control module assembly; 11. Outdoor housing; 12. Outdoor fan; 13. Compressor assembly; 14. Water heat exchanger; 141. First refrigerant inlet and outlet; 142. Second refrigerant inlet and outlet; 15. Cooling unit;

[0090] 20. Electronic control module; 21. Electronic control assembly; 22. Electronic control board; 221. First side; 222. Second side; 23. Component; 231. Component end face; 232. Component side face; 24. Electronic control box; 241. First box; 2411. Opening; 2412. Cavity; 2413. Circular wall; 2414. Bottom wall; 242. Second box; 25. First limiting structure; 251. First limiting groove; 26. Second limiting structure; 27. Third limiting structure; 28. First fixing post; 29. ​​Second fixing post.

[0091] 30. Heat dissipation component; 31. Heat dissipation element; 31a. First heat dissipation element; 31b. Second heat dissipation element; 311. Fixing portion; 312. Heat dissipation portion; 31c. Third heat dissipation element; 31d. Fourth heat dissipation element; 32. Heat dissipation body; 33. Bending portion; 34. Bending section; 341. First bending section; 35. Non-bending portion; 36. Heat dissipation channel; 37. Medium inlet pipe; 38. Medium outlet pipe;

[0092] 40. Straight section; 41. Connecting section; 42. Heat absorption section; 43. Heat dissipation section; 44. Glue filling port; 45. First glue filling hole; 46. Component group; 46a. First component group; 46b. Second component group;

[0093] 50. Water inlet; 51. Water outlet; 52. Throttling component; 53. Heat-conducting substrate; 54. Connecting pipe; 55. Cooling bypass. DETAILED DESCRIPTION

[0094] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0095] The electric control module assembly 10 according to an embodiment of the present application is described below with reference to the accompanying drawings.

[0096] 1-12 , an electronic control module assembly 10 according to an embodiment of the first aspect of the present application includes an electronic control module 20 and a heat dissipation component 30. The electronic control module 20 includes an electronic control box 24 and an electronic control assembly 21 disposed within the electronic control box 24. The electronic control assembly 21 includes an electronic control board 22 and a plurality of components 23 disposed on the electronic control board 22. The heat dissipation component 30 is used to dissipate heat from the electronic control module 20.

[0097] An insulating structure is provided in the electric control box body 24 , and the insulating structure covers the outer surfaces of the plurality of components 23 to isolate the components 23 from the air.

[0098] For example, referring to Figures 5 and 10, the electronic control module 20 includes an electronic control box body 24 and an electronic control component 21 arranged in the electronic control box body 24. The electronic control component 21 includes an electronic control board 22 and a plurality of components 23 arranged in the electronic control board 22. An isolation structure is provided in the electronic control box body 24, and the isolation structure covers the outer surfaces of the plurality of components 23 to isolate the plurality of components 23 from the air.

[0099] During the operation of the electronic control module 20, the components 23 in the electronic control assembly 21 will generate heat, causing the temperature of the electronic control module 20 to gradually increase. By providing a heat dissipation component 30, the heat dissipation component 30 can exchange heat with the electronic control module 20, thereby cooling the electronic control module 20, thereby controlling the temperature of the electronic control module 20 within a normal temperature to ensure the stability of the operation of the electronic control module 20.

[0100] Furthermore, by providing an isolation structure, the isolation structure covers the outer surfaces of the multiple components 23 of the electronic control assembly 21, so that the components 23 can be isolated from the air. Therefore, during the process of heat dissipation and cooling of the electronic control module 20 by the heat dissipation component 30, the components 23 will not come into contact with the outside air to cause condensation, which can avoid condensation on the components 23, thereby improving the reliability, stability and safety of the electronic control module 20, thereby improving the reliability, stability and safety of the entire machine.

[0101] It should be noted that the outer surface of component 23 includes the outer surface of the main body of component 23 and / or the outer surfaces of the pins. That is, the outer surface of component 23 may include the outer surface of the main body of component 23, the outer surfaces of the pins of component 23, or both the outer surface of the main body of component 23 and the outer surfaces of the pins of component 23.

[0102] According to the electronic control module assembly 10 of the embodiment of the present application, by providing a heat dissipation component 30, heat can be dissipated from the electronic control module 20. Moreover, by providing an isolation structure and having the isolation structure cover the outer surface of the component 23, the component 23 can be isolated from the air, thereby preventing condensation on the component 23 of the electronic control module 20, thereby improving the reliability, stability, and safety of the electronic control module 20. In addition, when the electronic control module 20 is located in an environment where flammable and explosive gases exist, by providing an isolation structure and having the isolation structure cover the outer surface of the component 23, the safety hazard of ignition and explosion caused by contact between the flammable and explosive gases and the component 23 can be eliminated. At the same time, it can also enhance the vibration resistance of the electronic control module 20, prevent the component 23 from detaching, cushion and protect the component 23, and prevent dust.

[0103] For example, in order to eliminate the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components 23 in the electronic control module 20, it is generally necessary to seal the electronic control box body 24 by setting a sealing structure or sealing member to ensure the sealing of the electronic control box body 24. By setting an isolation structure in the electronic control box body 24 and the isolation structure covering the outer surface of the component 23, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and components 23 can be eliminated. At the same time, the requirements for the sealing of the electronic control box body 24 can be reduced, and the setting of parts such as seals can be reduced, thereby reducing the difficulty of production and processing to a certain extent and reducing costs.

[0104] For example, the electronic control module 20 may be the electronic control module 20 of the outdoor unit 100. If the refrigerant circulation system of the outdoor unit 100 uses a flammable refrigerant, when the refrigerant circulation system leaks due to a malfunction, the environment in which the electronic control module 20 is located will contain flammable and explosive gases. The components 23 in the electronic control module 20 may ignite and explode due to contact with flammable and explosive gases. By providing an isolation structure in the electronic control box body 24 and the isolation structure covering the outer surface of the component 23, the outer surface of the component 23 can be isolated from the air, thereby eliminating the safety hazard of ignition and explosion. At the same time, it can also enhance the vibration resistance of the electronic control module 20, prevent the component 23 from detaching, cushion and protect the component 23, and prevent dust.

[0105] It should be noted that the “plurality” in this application refers to two or more.

[0106] 3-12 , according to some embodiments of the present application, the isolation structure is a colloidal structure. The potting glue used in the colloidal structure is fluid before solidification, so it can fully contact the outer surface of the component 23, so that the isolation structure formed after the potting is better covered on the outside of the component 23, which can ensure the isolation effect of the component 23 from the air, so that the component 23 is better isolated from the air, and condensation is avoided due to cooling of the component 23. In addition, the colloidal structure can improve the overall structural strength of the electronic control module assembly 10, enhance vibration resistance, and play a role in buffering and protecting the component 23.

[0107] Referring to Figures 3-12, according to some embodiments of the present application, a portion of the heat dissipation component 30 is located within the electronic control box 24 and is thermally connected to the electronic control assembly 21. The space defined by the electronic control box 24, the electronic control assembly 21, and the heat dissipation component 30 is filled with an insulating structure. The insulating structure integrally connects the electronic control assembly 21 and the heat dissipation component 30, thereby integrally connecting the electronic control assembly 21 and the heat dissipation component 30. Furthermore, an insulating structure may also be provided outside the space defined by the electronic control box 24, the electronic control assembly 21, and the heat dissipation component 30 to ensure that the insulating structure effectively covers the outer surface of the component 23. A portion of the heat dissipation component 30 is thermally connected to the electronic control assembly 21, and heat generated by the electronic control assembly 21 during operation can be transferred to the heat dissipation component 30, thereby enabling the heat dissipation function of the heat dissipation component 30 to the electronic control assembly 21, thereby reducing the temperature of the electronic control assembly 21 and ensuring the operational stability of the electronic control module 20. The isolation structure connects the electronic control component 21 and the heat dissipation component 30 as a whole. This setting can realize the fixing effect of the isolation structure on the electronic control component 21 and the heat dissipation component 30, thereby improving the overall structural strength of the electronic control module assembly 10. At the same time, the heat dissipation component 30 connected as a whole with the electronic control component 21 has a better heat dissipation effect.

[0108] 4-6 and 9-11 , according to some embodiments of the present application, the inner wall of the electric control box body 24 or the electric control board 22 is provided with a first limiting structure 25 for partially limiting the position of the heat dissipation component 30. This arrangement enables the electric control box body 24 to limit the heat dissipation component 30, ensuring the stability of the position of the heat dissipation component 30, thereby ensuring the heat dissipation effect of the heat dissipation component 30 on the electric control assembly 21.

[0109] For example, referring to FIG6 , the inner wall of the electric control box body 24 is formed with three limiting protrusions at three different positions. These three limiting protrusions are all first limiting structures 25. The heat dissipation component 30 can be provided with limiting notches that respectively cooperate with the three limiting protrusions on the inner wall. The cooperation between the limiting protrusions on the inner wall and the limiting notches enables the first limiting structure 25 to limit the heat dissipation component 30. In addition, this arrangement can facilitate the assembly of the heat dissipation component 30 and the electric control box body 24.

[0110] 4-7 and 10-12 , according to some embodiments of the present application, the electric control board 22 has a first side 221 and a second side 222 disposed opposite each other along the thickness direction of the electric control board 22 . A filling space is defined between the first side 221 of the electric control board 22 and the electric control box body 24 . At least some of the components 23 are disposed on the first side 221 of the electric control board 22 and within the filling space, and the filling space is filled with an insulating structure. At least some of the components 23 are disposed on the first side 221 of the electric control board 22 and within the filling space. This means that some of the components 23 may be disposed on the first side 221 of the electric control board 22 and within the filling space, or all of the components 23 may be disposed on the first side 221 of the electric control board 22 and within the filling space.

[0111] By providing an insulating structure in the filling space, the insulating effect of the insulating structure on the components 23 can be ensured, thereby preventing the components 23 from coming into contact with the external air and generating condensation. In addition, the components 23 are all located on the first side 221 of the electronic control board 22, which can facilitate the glue filling operation in the filling space and reduce the material used in the insulating structure.

[0112] 3 to 12 , according to some embodiments of the present application, a portion of the heat dissipation component 30 is located within the filling space and is thermally connected to the component 23. The heat dissipation component 30 and the component 23 can be thermally connected in a variety of ways. For example, the heat dissipation component 30 located within the filling space can be directly thermally connected to the component 23. A thermal conductive layer can also be provided between the heat dissipation component 30 and the outer surface of the component 23, and the heat dissipation component 30 and the component 23 are thermally connected through the thermal conductive layer. The heat dissipation component 30 and the component 23 are thermally connected through the thermal conductive layer. The heat dissipation component 30 and the component 23 are thermally connected through the thermal conductive layer, which can ensure the heat dissipation effect of the heat dissipation component 30 located within the filling space on the component 23 also located within the filling space. At the same time, the insulating structure within the filling space can isolate the heat dissipation component 30 and the component 23 located within the filling space from the outside air, thereby avoiding condensation during the heat dissipation process.

[0113] 3-12 , according to some embodiments of the present application, an insulating structure is provided between the outer edge of the electric control board 22 and the inner wall of the electric control box 24. This insulating structure prevents external air from entering the electric control assembly 21 through the gap between the outer edge of the electric control board 22 and the inner wall of the electric control box 24, ensuring the insulating structure's ability to isolate the components 23 and thereby preventing condensation on the components 23 during heat dissipation.

[0114] Referring to Figures 3-12 , according to some embodiments of the present application, multiple components 23 can be mounted on a first side 221 of an electronic control board 22. A second side 222 of the electronic control board 22 serves as the backside of the board. The backside of the board 22 exposes the solder pins of the multiple components 23. An insulating structure is flush with the backside of the board or protrudes from the backside and covers the solder pins of the multiple components 23 located on the backside. Flushness with the backside of the board ensures that the insulating structure effectively insulates the components 23 on the electronic control board 22, thereby preventing condensation from the components 23 during heat dissipation. Protruding from the backside of the board and covering the backside of the board ensures that the insulating structure effectively insulates the components 23. Furthermore, the insulating structure can isolate the backside of the electronic control board 22 from the air, thereby preventing condensation from forming on the backside of the board. For example, with this arrangement, the solder pins of the multiple components 23 located on the backside of the board can also be covered by the insulating structure, thereby preventing condensation from the pins during heat dissipation from contact with the air. At the same time, if the back panel is also provided with components, the isolation structure is protruded from the back of the panel and covers the back of the panel, which can ensure the isolation effect of the isolation structure on the components 23 provided on the electronic control panel 22, improve the overall structural strength, and provide better buffering and protection for the components 23.

[0115] Referring to Figures 6 and 11 , according to some embodiments of the present application, at least a portion of the inner wall of the first side 221 of the electrical control box body 24, facing the electrical control board 22, is formed as a contoured structure. The configuration of the first side of at least a portion of the components 23 mounted on the first side 221 of the electrical control board 22 is defined as the first side configuration of the electrical control assembly 21, and the contoured structure is similar in shape to the first side configuration of the electrical control assembly 21. The provision of the contoured structure significantly reduces the space occupied by the filler space, thereby improving the space utilization within the electrical control module assembly 10. Furthermore, this configuration reduces the material used for the insulating structure, thereby reducing production costs to a certain extent.

[0116] At least a portion of the inner wall of the first side 221 of the electric control box body 24 facing the electric control board 22 is formed as a contoured structure. That is, a portion of the inner wall of the first side 221 of the electric control box body 24 facing the electric control board 22 may be formed as a contoured structure, or the entire inner wall of the first side 221 of the electric control box body 24 facing the electric control board 22 may be formed as a contoured structure. This reduces the material used for the insulating structure and reduces production costs.

[0117] 3-12 , according to some embodiments of the present invention, the isolation structure is a glue-potting structure, and the glue-potting side of the filling space is located on the second side 222 of the electronic control board 22. By setting the second side 222 of the electronic control board 22 as the glue-potting side, during the glue-potting process of the filling space, the direction of the electronic control box body 24 is adjusted so that the second side 222 of the electronic control board 22 faces upward, and the potting glue is poured from the second side 222 of the electronic control board 22 into the filling space. Under the action of gravity, the potting glue flows from the second side 222 of the electronic control board 22 to the lowest point of the filling space until the entire filling space is filled, thereby covering the outer surfaces of the multiple components 23 located within the filling space, isolating the components 23 from the air, and preventing condensation caused by cooling of the components 23.

[0118] 3-12 , according to some embodiments of the present application, the electric control box 24 includes a first box body 241 and a second box body 242, each formed independently. The walls of the first box body 241 enclose a cavity 2412 having an opening 2411. The walls of the first box body 241 include a bottom wall 2414 opposite the opening 2411 and an annular wall 2413 surrounding the bottom wall 2414 of the first box body 241 to form the opening 2411. The bottom wall 2414 of the first box body 241 constitutes the contoured structure. The electric control assembly 21 is fixed within the cavity of the first box body 241. The space between the bottom wall 2414 of the first box body 241 and the first side 221 of the electric control board 22 is filled with space. With this arrangement, after the glue is injected into the filling space through the second side 222 of the electric control board 22, the second box body 242 is connected to the first box body 241 to form the electric control box 24, resulting in a reasonable structure and simple operation.

[0119] In addition, after the first box body 241 and the second box body 242 are connected, the direction of the second box body 242 can be adjusted so that the second side 222 of the electronic control board 22 faces upward, and glue is poured into the filling space through the second box body 242. Under the action of gravity, the potting glue flows from top to bottom from one side of the second box body 242 to the lowest point of the filling space until the entire filling space is filled. The operation is simple and the sealing effect is good. For example, a glue hole connected to the filling space can be set in the second box body 242 to facilitate the glue pouring operation.

[0120] 3-12 , according to some embodiments of the present application, the isolation structure is a colloid structure formed by glue pouring. The open side of the first box body 241 is configured as a glue pouring side. The opening 2411 of the first box body 241 is located on the second side 222 of the electronic control board 22. The colloid material enters the filling space from the opening 2411 of the first box body 241. During the process of pouring glue into the first box body 241 to form the colloid structure, glue can be poured from the open side of the first box body 241 so that the colloid material enters the filling space. For example, the colloid material can enter the filling space through the gap between the outer edge of the electronic control board 22 and the annular wall 2413 of the first box body 241. The colloid material can also enter the filling space through the glue pouring hole on the electronic control board 22. After the glue pouring is completed and the colloid material solidifies into the colloid structure, the second box body is connected and fixed to the first box body.

[0121] 3-12 , according to some embodiments of the present application, a gap is provided between the outer edge of the surface of the electric control board 22 and the annular wall 2413 of the first box body 241, and at least a portion of the gap constitutes a glue filling port 44, which is connected to the filling space. A gap is provided between the outer edge of the surface of the electric control board 22 and the annular wall 2413 of the first box body 241, and at least a portion of the gap constitutes a glue filling port 44, that is, a portion of the gap may constitute the glue filling port 44, or the entire gap may constitute the glue filling port 44. By providing the glue filling port 44, glue filling can be performed through the glue filling port 44 in the gap between the outer edge of the surface of the electric control board 22 and the annular wall 2413 of the first box body 241. This configuration simplifies the structure of the glue filling port 44 and facilitates the glue filling operation.

[0122] After the electronic control board 22 and the heat dissipation component 30 are assembled, they are flipped upside down into the first box body 241 and assembled with the first box body 241. The direction of the first box body 241 is then adjusted so that the second side 222 of the electronic control board 22 faces upward, and glue is poured into the filling space through the glue pouring port 44 on the second side 222 of the electronic control board 22. Under the action of gravity, the potting glue flows from top to bottom from the second side 222 of the electronic control board 22 to the lowest point of the filling space until the entire filling space is filled, thereby covering the outer surfaces of the multiple components 23 located inside the filling space, isolating the components 23 from the air. Pouring glue into the filling space through the glue pouring port 44 is simple to operate and can improve the glue pouring efficiency to a certain extent. In addition, the glue pouring condition can be observed through the glue pouring port 44 to avoid overflow caused by excessive potting glue.

[0123] Referring to Figures 4 and 9 , according to some embodiments of the present application, a first glue injection hole 45 is formed on the electronic control board 22, communicating with the filling space. By providing this first glue injection hole 45, glue can be injected into the filling space through the first glue injection hole 45 on the second side 222 of the electronic control board 22 during the glue injection operation, resulting in a simple structure and convenient operation. Furthermore, the first glue injection hole 45 also serves as an observation point, allowing the glue injection status within the filling space to be observed during the glue injection operation.

[0124] After the electronic control board 22 and the heat sink 30 are assembled, they are flipped upside down into the first housing 241 and assembled with the first housing 241. The orientation of the first housing 241 is adjusted so that the second side 222 of the electronic control board 22 faces upward, and glue is poured into the filling space through the first glue injection holes 45 on the second side 222 of the electronic control board 22. Under the action of gravity, the potting glue flows from the second side 222 of the electronic control board 22 to the lowest point of the filling space until the entire filling space is filled, thereby covering the outer surfaces of the multiple components 23 located within the filling space and isolating the components 23 from the air. Filling the filling space with glue through the first glue injection holes 45 is simple to operate and allows the glue injection status to be monitored through the first glue injection holes 45 to prevent overflow caused by excessive potting glue.

[0125] For example, referring to Figures 4 and 9, in the process of pouring glue into the filling space from the second side 222 of the electronic control board 22, you can choose to pour glue into the filling space through the glue pouring port 44 formed by the gap around the inner wall of the electronic control board 22 and the first box body 241; you can choose to pour glue into the filling space through the first glue pouring hole 45 on the electronic control board 22; you can also choose to pour glue into the filling space through the glue pouring port 44 and the first glue pouring hole 45 at the same time.

[0126] 4 and 9 , according to some embodiments of the present application, the equivalent diameter of the first glue filling hole 45 is greater than 10 mm. This setting ensures that the glue filling operation is performed through the first glue filling hole 45. When the glue filling glue flows into the filling space through the first glue filling hole 45, the glue filling glue can flow smoothly, providing sufficient operating space for the glue filling operation. At the same time, the equivalent diameter of the first glue filling hole 45 is greater than 10 mm, so that the first glue filling hole 45 can play an observation role. When the glue filling operation is performed, the glue filling situation in the filling space can be observed through the first glue filling hole 45. In addition, this setting can improve the glue filling efficiency to a certain extent.

[0127] 4 and 9 , the first potting hole 45 is located in the middle of the electronic control board 22. This arrangement allows the potting compound to flow from the middle of the electronic control board 22 into the filling space, which in turn allows the potting compound to flow more evenly throughout the filling space, effectively covering the components 23 in the filling space with the insulating structure formed after potting.

[0128] 6 and 11 , according to some embodiments of the present application, a second limiting structure 26 for limiting the position of the electric control board 22 and a first fixing column 28 for fixing the electric control board 22 are formed on the inner wall of the first box body 241. During the assembly process of the electric control board 22 with the first box body 241, the second limiting structure 26 can facilitate the positioning of the electric control board 22 and the first box body 241. After the positioning is completed, the electric control board 22 and the first box body 241 can be connected and fixed by the first fixing column 28. The assembly process is simple and, at the same time, the stability of the position of the electric control board 22 can be ensured, thereby facilitating the glue filling operation.

[0129] For example, referring to Figures 6 and 11 , two limiting protrusions are formed on the inner wall edge of the first box body 241. Both limiting protrusions are second limiting structures 26. Limiting notches that match the two limiting protrusions can be respectively provided at corresponding positions on the edge of the electric control board 22. The cooperation between the limiting protrusions and the limiting notches enables the second limiting structures 26 to limit the electric control board 22. Furthermore, this arrangement facilitates the assembly of the electric control board 22 and the electric control box body 24.

[0130] For example, referring to Figures 6 and 11, five first fixing columns 28 are formed on the edge of the electric control box body 24. After the electric control board 22 and the electric control box body 24 are positioned, the five first fixing columns 28 are used to complete the connection and fixation with the electric control box body 24. The first fixing columns 28 can connect the electric control board 22 and the electric control box body 24 at five different positions, thereby ensuring the connection effect between the electric control board 22 and the electric control box body 24, and also making the connection process simpler. Optionally, the connection and fixation of the electric control box body 24 and the electric control board 22 can be completed by the cooperation of fasteners and the first fixing columns 28.

[0131] Referring to Figures 4-6 and 9-11, according to some embodiments of the present application, first fixing posts 28 and second fixing posts 29 are provided within first housing 241. The electrical control board 22 is mounted on the first fixing posts 28, and the second fixing posts 29 are connected to the second housing 242. The first fixing posts 28 are supported on the first side 221 of the electrical control board 22, and the surface of the second side 222 of the electrical control board 22 serves as the back surface of the board. The second fixing posts 29 are located on the outer periphery of the electrical control board 22 and protrude from the back surface of the board. With this arrangement, the first housing 241 and the second housing 242 can be connected and fixed via the second fixing posts 29 to form the electrical control box 24, simplifying the connection process and achieving a good connection effect.

[0132] After the electronic control board 22 and the heat dissipation component 30 are assembled, they are flipped upside down into the first box body 241 and assembled with the first box body 241. Then, the direction of the first box body 241 is adjusted so that the second side 222 of the electronic control board 22 faces upward, and glue is poured into the filling space through the second side 222 of the electronic control board 22. By arranging the second fixing column 29 on the outer peripheral side of the electronic control board 22 and protruding from the back side of the board, it is possible to avoid the situation where the potting glue blocks the second fixing column 29 during the potting process, thereby ensuring the connection effect of the second fixing column 29.

[0133] For example, referring to Figures 6 and 11, four second fixing posts 29 are provided at different positions on the inner wall of the first box body 241. These four fixing posts enable the first box body 241 and the second box body 242 to be connected and fixed at four different positions, thereby ensuring a good connection. Alternatively, the connection and fixation between the first box body 241 and the second box body 242 can be completed by the cooperation of fasteners and the second fixing posts 29.

[0134] 3 and 8 , according to some embodiments of the present application, the insulating structure is a colloid structure, and the glue pouring side of the filling space is located on the first side 221 of the electronic control board 22. A second glue pouring hole is formed in the portion of the electronic control box body 24 located on the first side 221 of the electronic control board 22. When the first side 221 of the electronic control board 22 faces upward, the second glue pouring hole is located at the highest position of the electronic control box body 24. With this arrangement, after the electronic control board 22 and the heat sink 30 are assembled, they are flipped upside down into the first box body 241 to complete the assembly with the first box body 241. The position of the electronic control box body 24 is then adjusted so that the first side 221 of the electronic control board 22 faces upward, and glue is poured into the filling space through the second glue pouring hole located in the electronic control box body 24. The potting glue can flow from the highest point of the electronic control box body 24 to the filling space until the entire filling space is filled. When pouring glue in this manner, the first side 221 of the electronic control board 22 serves as the glue pouring side. This setting can ensure that the flow path of the potting compound is more reasonable, and at the same time, can ensure that the potting compound can fill the entire filling space, thereby ensuring that all components 23 in the filling space are covered by the isolation structure formed after potting, thereby ensuring the isolation effect of the isolation structure.

[0135] 3-12 , according to some embodiments of the present application, the insulating structure is a colloid structure, and the heat dissipation component 30 is drawn out from the glue-filling side of the electronic control box body 24. If the heat dissipation component 30 is drawn out from other locations on the glue-filling side of the non-electronic control box body 24, corresponding perforations need to be provided at the location where the heat dissipation component 30 is drawn out of the box body. During the glue-filling process, the perforations can cause glue leakage. For example, if the heat dissipation component 30 is drawn out from the side wall of the electronic control box body 24, perforations need to be provided at corresponding locations on the side wall. During the glue-filling process, glue leakage is likely to occur at the perforation locations. Drawing the heat dissipation component 30 out of the electronic control box body 24 allows the drawn portion of the heat dissipation component 30 to be higher than the glue-filling side of the electronic control box body 24. Regardless of whether perforations are provided for drawing out the heat dissipation component 30, glue leakage during the glue-filling process can be avoided or reduced. The structure is reasonable and can facilitate glue-filling operations on the glue-filling side.

[0136] 3 to 12 , according to some embodiments of the present application, the isolation structure is a colloid structure, and the wiring harness connected to the electronic control component 21 is led out from the glue-filling side of the electronic control box body 24. If the wiring harness is led out from other positions on the glue-filling side of the non-electronic control box body 24, corresponding perforations need to be set at the position where the wiring harness is led out from the box body. During the glue-filling process, the perforations will cause glue leakage. For example, if the wiring harness is led out from the side wall of the electronic control box body 24, perforations need to be set at the corresponding positions of the side wall. During the glue-filling process, glue leakage is likely to occur at the perforation positions. The wiring harness is led out from the electronic control box body 24, which can make the wiring harness lead-out portion higher than the glue-filling side of the electronic control box body 24, and regardless of whether perforations are set for leading out the heat dissipation component 30, glue leakage during the glue-filling process can be avoided or reduced. The structure is reasonable and can facilitate glue-filling operations on the glue-filling side.

[0137] According to some embodiments of the present application, referring to Figures 3-7 and 13-23, the heat dissipation component 30 includes at least one heat sink 31, which includes a heat dissipation body 32. The heat dissipation body 32 of the at least one heat sink 31 covers the outer periphery of the component 23. Since the outer periphery of the component 23 has a relatively large area, the heat transfer area between the component 23 and the heat dissipation component 30 can be increased, thereby improving the heat dissipation effect on the component 23 and thus improving the heat dissipation effect of the entire electronic control module 20. In addition, the heat dissipation body 32 of the at least one heat sink 31 is disposed on the outer periphery of the component 23, which can fully utilize the space on the outer periphery of the component 23, making the arrangement of the heat dissipation component 30 and the component 23 more compact, thereby making the structure of the electronic control module assembly 10 more compact and facilitating a reduction in the volume of the electronic control module assembly 10.

[0138] The heat dissipation component 30 is used to dissipate heat for the electronic control module 20 and includes at least one heat dissipation element 31 , that is, the heat dissipation component 30 may include one heat dissipation element 31 or multiple heat dissipation elements 31 to ensure the heat dissipation effect of the heat dissipation component 30 on the electronic control module 20 .

[0139] The heat dissipation body 32 of at least one heat sink 31 is located on the outer side of the component 23, that is, the heat dissipation body 32 of one heat sink 31 can be located on the outer side of the component 23, or the heat dissipation bodies 32 of multiple heat sinks 31 can be located on the outer side of the component 23 to ensure the heat dissipation effect of the heat dissipation component 30 on the electronic control module 20.

[0140] Optionally, the heat sink 31 located on the peripheral side of the component 23 can have a certain gap between it and the component 23 to maintain a safe distance. The component 23 can exchange heat with the heat dissipation body 32 of the heat sink 31 arranged on the peripheral side through heat radiation, thereby controlling the temperature of the component 23 within the normal operating temperature.

[0141] Optionally, the heat sink 31 located on the outer peripheral side of the component 23 can be in direct contact with the component 23, and the component 23 is directly thermally connected to the heat dissipation body 32 of the heat sink 31 arranged on the outer peripheral side and heat exchange is performed, thereby controlling the temperature of the component 23 within the normal operating temperature.

[0142] Optionally, a heat sink 31 (i.e., heat sink body 32) located on the outer peripheral side of the component 23 can be provided with a heat-conducting layer between the component 23, and a heat-conducting connection can be made through the heat-conducting layer. The heat-conducting layer can also play a role of insulation protection. For example, the heat-conducting layer can be made of any one of the materials that can conduct heat and insulate, such as thermal adhesive, thermal grease, thermal pad, etc., to ensure the heat transfer effect between the component 23 and the heat sink 31 while also playing a role of insulation protection. Furthermore, both sides of the heat-conducting layer are sticky, and the component 23 and the heat sink body 32 are bonded together, which is conducive to the stability of the thermal connection.

[0143] According to some embodiments of the present application, referring to Figures 15-17 and 21-23, a heat sink 31 having a heat dissipation body 32 located on the outer periphery of a component 23 is a first heat sink 31a. The heat dissipation body 32 of at least a portion of the first heat sink 31a extends non-linearly. For example, the heat dissipation body 32 of a portion of the first heat sink 31a may extend non-linearly, or the heat dissipation body 32 of each first heat sink 31a may extend non-linearly. By providing the first heat sink 31a extending circumferentially along the component 23, the heat transfer area between the heat dissipation body 32 of the first heat sink 31a and the component 23 can be increased, thereby improving the heat dissipation efficiency of the first heat sink 31a to a certain extent, thereby ensuring the heat dissipation effect of the first heat sink 31a on the component 23. Furthermore, when the number of components 23 in the electronic control module 20 is large, the non-linearly extending heat sink 31 can better match the arrangement of the components 23 in the electronic control module 20, thereby fully utilizing the internal space of the electronic control module assembly 10 and making the arrangement of the heat sink 30 and the components 23 more compact.

[0144] According to some embodiments of the present application, referring to Figures 15-17 and Figures 21-23, at least a portion of the heat dissipation body 32 of the first heat dissipation element 31a extends circumferentially along the component 23. At least a portion of the heat dissipation body 32 of the first heat dissipation element 31a extends circumferentially along the component 23. That is, a portion of the heat dissipation body 32 of the first heat dissipation element 31a may extend circumferentially along the component 23, or the entire heat dissipation body 32 of the first heat dissipation element 31a may extend circumferentially along the component 23. With this arrangement, the first heat dissipation element 31a extending circumferentially along the component 23 can increase the heat transfer area between the heat dissipation body 32 of the first heat dissipation element 31a and the component 23, thereby improving the heat dissipation efficiency of the first heat dissipation element 31a to a certain extent, thereby ensuring the heat dissipation effect of the first heat dissipation element 31a on the component 23.

[0145] It should be explained that the height of the component 23 refers to the protruding height of the component 23 relative to the electronic control board 22 , and the circumferential direction of the component 23 refers to the direction perpendicular to the height direction of the component 23 .

[0146] According to some embodiments of the present application, referring to Figures 15-17 and Figures 21-23, the heat dissipation body 32 of the first heat sink 31a includes a single bent portion 33 or multiple bent portions 33 spaced apart along the extension direction of the first heat sink 31a. The bent portion 33 includes multiple bent segments 34 sequentially connected along the extension direction of the first heat sink 31a, with an angle between adjacent bent segments 34. By providing the bent portions 33, the first heat sink 31a can increase the heat transfer area between the heat dissipation body 32 and the component 23, thereby ensuring the heat dissipation effect of the heat dissipation body 32 on the component 23. The bent segments 34 are connected along the extension direction of the first heat sink 31a to form the bent portion 33, which has a relatively simple structure and can facilitate the processing and manufacturing of the bent portion 33 to a certain extent.

[0147] It should be explained that if two adjacent bending segments 34 are both straight structures, the angle between the two adjacent bending segments 34 refers to the angle between the straight lines where the two straight structures are located; if at least part of the two bending segments 34 include arc structures, the angle between the two adjacent bending segments refers to the angle between the tangent of any point at the arc structure of one of the bending segments 34 and the tangent of any point at the arc structure of the other bending segment 34; if one of the two bending segments 34 is a straight structure and at least part of the other bending segment 34 includes an arc structure, the angle between the two adjacent bending segments 34 refers to the angle between the straight line where the straight structure is located and the tangent of any point at the arc structure of the other bending segment 34.

[0148] For example, the first heat sink 31 a includes three bending portions 33 spaced apart along the extending direction of the first heat sink 31 a . This arrangement can improve the heat dissipation effect of the heat sink body 32 on the component 23 .

[0149] For example, the bending portion 33 includes three bending sections 34 sequentially connected along the extension direction of the first heat sink 31a, and an angle is formed between two adjacent bending sections 34. This arrangement can make the structure of the bending portion 33 simpler and facilitate production and processing.

[0150] According to some embodiments of the present application, referring to Figures 15 to 17 and Figures 21 to 23, the angle between two adjacent bending segments 34 ranges from 90 to 170 degrees. The angle between two adjacent bending segments 34 ranges from 90 to 170 degrees. For example, the angle between the two bending segments 34 can be 90 degrees, 100 degrees, 110 degrees, 120 degrees, 130 degrees, 140 degrees, 150 degrees, 160 degrees, 170 degrees, etc. By setting the angle between the two bending segments to 90 to 170 degrees, a larger angle can be formed between the two bending segments, so that the bending degree of the bending portion 33 is smaller, which is convenient for processing and manufacturing. In addition, when a heat dissipation channel 36 for the flow of heat dissipation medium is formed in the heat dissipation element 31, When the heat dissipation medium flows through the part between the two bending sections 34, if the angle between the two bending sections 34 is too small, it will cause greater resistance to the flow of the heat dissipation medium. By setting the angle between the two bending sections 34 to 90°~170°, the resistance of the heat dissipation medium when flowing through the part between the two bending sections 34 can be reduced, and the guiding effect of the bending section 34 can be ensured, thereby ensuring that the heat dissipation medium in the heat dissipation element 31 can flow smoothly, ensuring the heat dissipation effect of the heat dissipation element 31 on the components 23, and avoiding the occurrence of poor flow of the heat dissipation medium.

[0151] According to some embodiments of the present application, referring to Figures 15 to 17 and Figures 21 to 23, the first heat dissipation member 31a also includes a non-bending portion 35 extending in a straight line, and the bending section 34 of the bending portion 33 connected to the non-bending portion 35 is a first bending section 341. The angle between the non-bending portion 35 and the first bending section 341 ranges from 90 to 170°. For example, the angle between the non-bending portion 35 and the first bending section 341 can be 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170°, etc. The provision of the non-bending portion 35 can reduce the processing difficulty and production cost of the first heat sink 31a to a certain extent. Furthermore, when a heat dissipation channel 36 for the flow of heat dissipation medium is formed within the heat sink 31, if the angle between the non-bending portion 35 and the first bending section 341 is too small, significant resistance to the flow of the heat dissipation medium will be created. By setting the angle between the non-bending portion 35 and the first bending section 341 to 90° to 170°, the resistance to the flow of the heat dissipation medium through the portion between the non-bending portion 35 and the first bending section 341 can be reduced, thereby ensuring the flow guidance effect of the first heat sink 31a, thereby ensuring smooth flow of the heat dissipation medium in the heat sink 31, ensuring the heat dissipation effect of the heat sink 31 on the component 23, and avoiding the occurrence of poor heat dissipation flow. Furthermore, the provision of the non-bending portion 35 can further facilitate the flow of the heat dissipation medium in the heat dissipation channel 36. In addition, the non-bending portion 35 can also be used to dissipate heat from components that generate less heat, or dissipate heat from a region where components are densely arranged.

[0152] It should be explained that if the first bending section 341 is a straight structure, the angle between the non-bending portion 35 and the first bending section 341 refers to the angle between the non-bending section 34 and the straight line where the first bending section 341 is located; if at least part of the first bending section 341 includes an arc structure, the angle between the non-bending portion 35 and the first bending section 341 refers to the angle between the straight line where the non-bending section 34 is located and the tangent of any point of the arc structure of the first bending section 341.

[0153] According to some embodiments of the present application, referring to Figures 15-17 and 21-23, a heat sink 31 having a heat dissipation body 32 located on the periphery of a component 23 is a first heat sink 31a. The heat dissipation body 32 of the first heat sink 31a is located on the periphery of multiple components 23. With this arrangement, a single first heat sink 31a can improve the heat dissipation effect of multiple components 23, thereby reducing the number of first heat sinks 31a, reducing production costs to a certain extent, and simultaneously reducing the space occupied by the heat sink 30 in the electronic control module assembly 10, thereby improving the space utilization of the electronic control module assembly 10.

[0154] According to some embodiments of the present application, referring to Figures 15-17 and 21-23, a heat sink 31 having a heat dissipation body 32 located on the outer periphery of a component 23 is a first heat sink 31a. At least a portion of the plurality of components 23 are arranged along the length of the electronic control board 22 and constitute a component group 11. The heat dissipation body 32 of the first heat sink 31a extends circumferentially along the components 23 of the component group 11. The provision of the component group 11 can regionalize and rationalize the spatial layout within the electronic control module assembly 10, while also facilitating the arrangement of the first heat sink 31a and fully utilizing the internal space of the electronic control module assembly 10. The heat dissipation body 32 of the first heat sink 31a extends circumferentially along the components 23 of the component group 11, ensuring effective heat dissipation for the plurality of components 23 in the component group 11, thereby enhancing the heat dissipation of the entire electronic control module 20.

[0155] At least part of the multiple components 23 are arranged along the length direction of the electronic control board 22 and constitute the component group 11. That is, some of the multiple components 23 can be arranged along the length direction of the electronic control board 22 and constitute the component group 11, or all of the multiple components 23 can be arranged along the length direction of the electronic control board 22 and constitute the component group 11.

[0156] For example, seven components 23 are arranged along the length direction of the electronic control board 22 and constitute the component group 11. The heat dissipation body 32 of the first heat dissipation member 31a extends circumferentially along the seven components 23 in the component group 11 to ensure the heat dissipation effect of each component 23 in the component group 11.

[0157] According to some embodiments of the present application, referring to Figures 15-17 and 21-23, the heat sink 31 of the heat sink body 32 located on the outer periphery of the component 23 is a first heat sink 31a. At least a portion of the multiple components 23 are arranged along the length of the electronic control board 22 and form a component group 11. The component group 11 is provided with a first heat sink 31a on both sides of the component group 11 along the width of the electronic control board 22. By providing the component group 11, the spatial layout within the electronic control module assembly 10 can be regionalized and rationalized, while also facilitating the placement of the first heat sink 31a and fully utilizing the internal space of the electronic control module assembly 10. By providing the first heat sink 31a on both sides of the component group 11 along the width of the electronic control board 22, the area of ​​heat transfer between the heat sink body 32 and the outer periphery of the component 23 can be increased, thereby improving the heat dissipation effect of the component 23 and, therefore, the heat dissipation effect of the entire electronic control module 20.

[0158] At least part of the multiple components 23 are arranged along the length direction of the electronic control board 22 and constitute the component group 11. That is, some of the multiple components 23 can be arranged along the length direction of the electronic control board 22 and constitute the component group 11, or all of the multiple components 23 can be arranged along the length direction of the electronic control board 22 and constitute the component group 11.

[0159] For example, seven components 23 are arranged along the length direction of the electronic control board 22 and constitute a component group 11. A first heat sink 31a is provided on both sides of the component group 11 along the width direction of the electronic control board 22. The two first heat sinks 31a can ensure the heat dissipation effect of each component 23 in the component group 11.

[0160] According to some embodiments of the present application, referring to Figures 15-17 and Figures 21-23, the heat sink 31 having a heat dissipation body 32 located on the outer periphery of the component 23 is a first heat sink 31a. The peripheral surface of the component 23 is a device side surface 232. The heat dissipation body 32 of the first heat sink 31a is thermally connected to the device side surface 232. Through this arrangement, heat generated by the component 23 thermally connected to the heat dissipation body 32 of the first heat sink 31a during operation can be exchanged with the heat dissipation body 32 of the first heat sink 31a at the device side surface 232, thereby controlling the temperature of the component 23 within the normal operating temperature and ensuring the stability of the operation of the component 23. The device side surface 232 of the component 23 has a relatively large area, thereby increasing the heat transfer area between the heat dissipation body 32 and the component 23, thereby improving the heat dissipation effect of the first heat sink 31a on the component 23.

[0161] Optionally, the heat dissipation body 32 of the first heat dissipation member 31a is thermally connected to the device side 232. The heat dissipation body 32 of the first heat dissipation member 31a can be thermally connected to the device side 232 directly, or the heat dissipation body 32 of the first heat dissipation member 31a can be thermally connected to the device side 232 through a thermal conductive layer.

[0162] According to some embodiments of the present application, the heat sink 31 whose heat dissipation body 32 is located on the outer peripheral side of the component 23 is a first heat sink 31a. There are multiple heat sinks 31, including a first heat sink 31a and a second heat sink 31b. The end surface of the component 23 in the height direction is the device end surface 231, and the heat dissipation body 32 of the second heat sink 31b is thermally connected to the device end surface 231. The heat generated by the component 23 thermally connected to the heat dissipation body 32 of the second heat sink 31b during operation can be exchanged with the heat dissipation body 32 of the first heat sink 31a at the device end surface 231, thereby controlling the temperature of the component 23 within the normal operating temperature to ensure the stability of the operation of the component 23.

[0163] Among them, a second heat sink 31b can be thermally connected to the device end surface 231 of one or more components 23, a second heat sink 31b can dissipate heat for one component 23, and a second heat sink 31b can dissipate heat for multiple components 23.

[0164] Optionally, the second heat sink 31b can be a straight structure, so that the structure of the second heat sink 31b is simple and easy to process and shape. When the heat sink medium flows in the second heat sink 31b, it is conducive to the smooth flow of the heat sink medium and ensures the heat dissipation effect.

[0165] Optionally, the second heat sink 31b can be a bent setting. For example, when the second heat sink 31b is thermally connected or in thermal contact with multiple components 23, the second heat sink 31b can be bent in the height direction of the component 23, so that the second heat sink 31b can be directly or indirectly thermally connected to the device end faces 231 of multiple components with different heights. This setting can reduce the number of second heat sinks 31b and enable a single second heat sink 31b to dissipate heat for multiple components 23 at the same time.

[0166] For example, the heat dissipation member 31 whose heat dissipation body 32 is located on the peripheral side of the component 23 is the first heat dissipation member 31a. The number of components 23 that generate heat transfer with the first heat dissipation member 31a is large, the arrangement is complex, and the area of ​​the peripheral side of the component 23 is relatively large. By setting the first heat dissipation member 31a, the area of ​​heat transfer between the component 23 and the heat dissipation component 30 can be increased, thereby improving the heat dissipation effect of multiple components 23 in the electronic control component 21; the heat dissipation member 31 whose heat dissipation body 32 is located on the end surface 231 of the device is the second heat dissipation member 31b, and the heat dissipation member 31a is connected to the second heat dissipation member 31b. The number of components 23 thermally connected to the heat sink 31b is one. The device end face 231 of this component 23 is a straight structure and the area of ​​the device end face 231 is larger than the area of ​​the peripheral side. By providing a second heat sink 31b thermally connected to the device end face 231, the heat conduction area between the component 23 and the heat dissipation component 30 can be increased, thereby improving the heat dissipation effect of this component 23. In addition, the second heat sink 31b thermally connected to the device end face 231 has a relatively simple structure, which can facilitate the processing and production of the second heat sink 31b.

[0167] According to some embodiments of the present application, referring to FIG17 , the heat dissipation body 32 of the second heat sink 31b includes a fixing portion 311 and a heat dissipation portion 312. The heat dissipation portion 312 is formed with a heat dissipation channel 36 for the flow of a heat dissipation medium. The fixing portion 311 is connected to the electronic control board 22 via fasteners. By providing the fixing portion 311, the fixing portion 311 and the electronic control board 22 can be connected via fasteners, which can position the second heat sink 31b, ensure the stability of the position of the second heat sink 31b, and prevent the second heat sink 31b from affecting the heat dissipation effect on the component 23 due to unstable position. The heat dissipation portion 312 is formed with a heat dissipation channel 36 for the flow of a heat dissipation medium. The heat dissipation channel 36 serves as a guide for the heat dissipation medium. The heat dissipation medium flows through the heat dissipation channel 36 through the component 23, exchanging heat with the component 23, thereby achieving heat dissipation for the component 23.

[0168] According to some embodiments of the present application, referring to FIG2 and FIG8-12, a heat dissipation component 30 includes at least one heat sink 31. The heat sink 31 includes a heat sink body 32. The heat sink body 32 is thermally connected to the electronic control assembly 21. The heat sink body 32 of at least one heat sink 31 is bent to thermally connect to at least two components 23 of different heights. The end surface of the component 23 in the height direction is the component end surface 231, and the heat sink body 32 is thermally connected to the component end surface 231. The bent heat sink body 32 enables the same heat sink body 32 to be thermally connected to components 23 of different heights. This bent heat sink body 32 can adapt to components 23 of different heights, allowing the heat sink body 32 to better fit the components 23 of different heights, thereby improving the heat dissipation effect of the components 23 of different heights, and thus improving the heat dissipation effect of the entire electronic control module 20.

[0169] Optionally, the heat dissipation component 30 includes a third heat dissipation element 31c and a fourth heat dissipation element 31d. The heat dissipation body 32 of the third heat dissipation element 31c includes at least one straight section 40 and a connecting section 41 connecting adjacent straight sections 40. The straight sections 40 and the connecting sections 41 are angled with each other and are thermally connected to the device end face 231. The multiple straight sections 40 of the same heat dissipation element 32 correspond to components 23 at different heights. The fourth heat dissipation element 31d is a straight structure that can be thermally connected to the device end face 231. The thermally conductive connection between the straight sections 40 of the heat dissipation element 32 and the device end face 231 allows the straight sections 40 of the heat dissipation element 32 to fit snugly with the device end face 231 of the component 23, ensuring a better fit between the straight sections 40 of the heat dissipation element 32 and the device end face 231 of the component 23. This increases the thermal conductivity area between the heat dissipation element 32 and the device end face 231, thereby improving the heat dissipation efficiency of the component 23.

[0170] Optionally, the connecting section 41 of the heat sink 32 is used to connect two adjacent straight sections 40. These two adjacent straight sections 40 can be thermally connected to components 23 at different heights, thereby simplifying the bending structure of the heat sink 32 and facilitating its fabrication. Different straight sections 40 of the same heat sink 32 correspond to components 23 at different heights, so the connecting section 41 connecting two adjacent straight sections 40 forms an angle with each other. This arrangement allows the heat sink 32 to thermally connect to components 23 at different heights, while maintaining a simple structure and facilitating fabrication.

[0171] For example, the angle between the straight section 40 and the connecting section 41 is 90° to 170°. For example, the angle between the straight section 321 and the connecting section 322 can be 90°, 100°, 110°, 120°, 130°, 140°, 150°, 160°, 170°, etc. By setting the angle between the straight section 321 and the connecting section 322 to 90°~170°, there is a larger angle between the straight section 40 and the connecting section 41, so that the bending degree of the heat dissipation body 32 is small, which is convenient for processing and manufacturing; in addition, when a heat dissipation channel 36 for the flow of heat dissipation medium is formed in the heat dissipation element 31, when the heat dissipation medium flows through the part between the straight section 40 and the connecting section 41, if the angle between the straight section 40 and the connecting section 41 is too small, it will cause greater resistance to the flow of the heat dissipation medium. By setting the angle between the straight section 40 and the connecting section 41 to 90°~170°, the resistance of the heat dissipation medium when flowing through the part between the straight section 40 and the connecting section 41 can be reduced, and the guiding effect of the connecting section 41 can be ensured, thereby ensuring that the heat dissipation medium in the heat dissipation element 31 can flow smoothly, ensuring the heat dissipation effect of the heat dissipation element 31 on the components 23, and avoiding the occurrence of poor heat dissipation medium flow due to the large bending degree of the heat dissipation body 32.

[0172] Optionally, the electronic control assembly 21 includes a component group 46 corresponding to each heat sink 31. The component group 46 includes a first component group 46a and a second component group 46b. In the first component group 46a, there is a large height difference between at least some adjacent components 23. The bent third heat sink 31c is thermally connected to the first component group 46a. The components 23 in the second component group 46b are of the same height or have a smaller height difference. The straight fourth heat sink 31d is thermally connected to the second component group 46b. By providing the component group 46, the spatial layout within the electronic control module assembly 10 can be regionalized and rationalized. In addition, by providing the component group 46, components 23 of different heights can be rationally classified to facilitate the arrangement of the heat sink 31.

[0173] According to some embodiments of the present application, the heat dissipation component 30 is used to dissipate heat from the electronic control module 20 and includes at least one heat sink 31. The heat sink 31 includes a heat dissipation body 32. The heat dissipation body 32 is thermally connected to the electronic control component 21. A heat conductive layer is provided between the heat dissipation body 32 and the component 23 to ensure the connection and heat conduction between the heat dissipation body 32 and the component 23. The heat conductive layer can be one or more of thermal conductive adhesive, thermal conductive silicone grease, thermal conductive pad, or thermal conductive metal. For example, the heat conductive layer can be thermal conductive adhesive, thermal conductive silicone grease, thermal conductive pad, or thermal conductive metal; the heat conductive layer can also include at least two of thermal conductive adhesive, thermal conductive silicone grease, thermal conductive pad, and thermal conductive metal. When the heat conductive layer includes at least two of thermal conductive adhesive, thermal conductive silicone grease, thermal conductive pad, and thermal conductive metal, the two heat conductive structures can be stacked along the thickness direction of the heat conductive layer, or the two heat conductive structures can be mixed to form the heat conductive layer.

[0174] According to some embodiments of the present application, the heat sink body 32 is formed in a flat shape, with at least one side of the heat sink body 32 along the thickness direction facing or thermally connected to the component 23. The flat heat sink body 32 has a larger contact surface with the component 23, which can greatly increase the area of ​​heat transfer between the component 23 and the heat sink body 32, thereby improving the heat dissipation effect of the component 23. At the same time, the flat heat sink body 32 can greatly reduce the space occupied by the heat sink 31.

[0175] At least one side of the heat dissipation body 32 in the thickness direction is thermally connected to the component 23 , that is, one side of the heat dissipation body 32 in the thickness direction can be thermally connected to the component 23 , or both sides of the heat dissipation body 32 in the thickness direction can be thermally connected to the component 23 .

[0176] According to some embodiments of the present application, the electronic control module 20 includes an electronic control box body 24, in which the electronic control assembly 21 is disposed. The inner wall of the electronic control box body 24 is provided with a first limiting structure 25, and at least a portion of the heat sink 31 cooperates with the first limiting structure 25 to limit the position of the heat sink 31. The electronic control box body 24 can isolate or protect the electronic control module 20 and the heat sink 30 therein, preventing dust from outside the electronic control box body 24 from entering the interior of the electronic control box body 24, thereby to a certain extent improving the service life of the components within the electronic control box body 24. The inner wall of the electronic control box body 24 is provided with a first limiting structure 25, and at least a portion of the heat sink 31 cooperates with the first limiting structure 25. This arrangement can achieve a limiting effect on the heat sink 31, ensure the stability of the position of the heat sink 31, and thus ensure the stability of the heat dissipation effect of the heat sink 31 on the components 23.

[0177] At least some of the heat dissipating elements 31 cooperate with the first limiting structure 25 , that is, some of the heat dissipating elements 31 cooperate with the first limiting structure 25 , or all of the heat dissipating elements 31 cooperate with the first limiting structure 25 .

[0178] According to some embodiments of the present application, the first limiting structure 25 includes a first limiting groove 251, and at least a portion of the heat sink 31 is accommodated in the first limiting groove 251. For example, the heat sink 31 may be partially accommodated in the first limiting groove 251, or the entire heat sink 31 may be accommodated in the first limiting groove 251. The first limiting structure 25 limits the heat sink 31 through the first limiting groove 251. The partial accommodation of the heat sink 31 in the first limiting groove 251 simplifies the assembly process of the heat sink 31 and improves the limiting effect.

[0179] Part of the heat sink 31 is accommodated in the first limiting groove 251 , that is, part of the heat sink 31 is accommodated in the first limiting groove 251 , or the entire heat sink 31 is accommodated in the first limiting groove 251 to achieve the limiting effect of the first limiting groove 251 .

[0180] Referring to FIG3 , according to some embodiments of the present application, a heat dissipation component 30 includes a heat sink 31 . The heat sink 31 includes a heat dissipation body 32 located within the electrical control box body 24 . A heat dissipation channel 36 is formed within the heat sink 31 , through which a heat dissipation medium flows. The heat dissipation channel 36 is formed within the heat sink 31 , and serves to guide the heat dissipation medium within the heat dissipation channel 36 . The heat dissipation body 32 of the heat sink 31 located within the electrical control box body 24 can exchange heat with the components 23 within the electrical control box through the flow of the heat dissipation medium therein, thereby achieving the heat dissipation function of the heat sink 30 .

[0181] Referring to Figures 3-12 , according to some embodiments of the present application, heat dissipation component 30 includes a medium inlet pipe 37 and a medium outlet pipe 38, with heat dissipation channel 36 connecting the medium inlet pipe 37 and the medium outlet pipe 38. Heat dissipation medium enters heat dissipation channel 36 from medium inlet pipe 37, absorbs heat generated by components 23 during operation, and then flows out from medium outlet pipe 38. This arrangement achieves a simple structure while achieving high heat dissipation efficiency.

[0182] Referring to Figures 5 and 10 , according to some embodiments of the present application, multiple heat sinks 31 are arranged in parallel. By being arranged in parallel, these heat sinks 31 can share the same medium inlet pipe 37 and the same medium outlet pipe 38 . This reduces the number of medium inlet pipes 37 and outlet pipes 38 in the electronic control module assembly 10 , reducing production costs. Furthermore, the structure is simple and space utilization is improved. Furthermore, the multiple heat sinks 31 arranged in parallel can more evenly distribute heat to the components 23, further enhancing the heat dissipation effect.

[0183] For example, referring to Figures 5 and 10 , the heat dissipation component 30 includes two heat dissipating elements 31, which are arranged in parallel and share a medium inlet pipe 37 and a medium outlet pipe 38. This can reduce the number of medium inlet pipes 37 and medium outlet pipes 38, thereby reducing production costs. Furthermore, the structure is simple and can improve space utilization. The heat dissipating medium enters the heat dissipation channels 36 of the two heat dissipating elements 31 from the medium inlet pipe 37. During the flow process, the heat from the two heat dissipating elements 31 absorbs heat from the components 23, then flows out of the medium outlet pipe 38 after being combined. This makes the heat dissipation of the components 23 more uniform, further improving the heat dissipation effect of the heat dissipating element 30.

[0184] 5 and 10 , according to some embodiments of the present application, the medium inlet pipe 37 and the medium outlet pipe 38 are located on both sides of the length direction of the electric control board 22 , the heat sink 31 extends along the length direction of the electric control board 22 , and multiple heat sinks 31 are arranged along the width direction of the electric control board 22 .

[0185] This arrangement simplifies the structure of the medium inlet pipe 37, medium outlet pipe 38, and heat dissipation channel 36, while fully utilizing the internal space of the battery module assembly and achieving a more rational layout. Furthermore, the heat sink 31 extends along the length of the electronic control board 22, allowing it to contact more components 23 on the board 22, thereby improving the heat dissipation effect of the heat sink 30. Furthermore, the number of heat sinks 31 can be reduced, shortening the length of the medium inlet pipe 37 and medium outlet pipe 38.

[0186] For example, referring to FIG. 5 and FIG. 10 , the heat sink 31 extends along the length direction of the electric control board 22 , and two heat sinks 31 are arranged along the width direction of the electric control board 22 .

[0187] 4 and 9 , according to some embodiments of the present application, a third limiting structure 27 is provided on the inner wall of the electrical control box body 24. The medium inlet pipe 37 and the medium outlet pipe 38 cooperate with the third limiting structure 27 to limit the position of the medium inlet pipe 37 and the medium outlet pipe 38. The third limiting structure 27 provided on the inner wall of the electrical control box body 24 enables the electrical control box body 24 to limit the position of the medium inlet pipe 37 and the medium outlet pipe 38, thereby ensuring the stability of the position of the medium inlet pipe 37 and the medium outlet pipe 38, thereby ensuring the stability of the heat dissipation effect of the heat sink 31 on the component 23.

[0188] For example, referring to Figure 6 , two limiting protrusions are formed on the inner wall edges of both sides in the longitudinal direction of the first box body 241. These four limiting protrusions constitute the third limiting structure 27. Limiting notches that match the two limiting protrusions can be provided at the corresponding positions of the medium inlet pipe 37 and the medium outlet pipe 38. The cooperation between the limiting protrusions and the limiting notches enables the third limiting structure 27 to limit the medium inlet pipe 37 and the medium outlet pipe 38. Furthermore, this arrangement facilitates the assembly of the medium inlet pipe 37 and the medium outlet pipe 38 with the electrical control box body 24.

[0189] For another example, referring to Figure 11 , two detachable latch holes are formed on either side of the lengthwise direction of the first box body 241. Both latch holes serve as the third limiting structure 27. The medium inlet pipe 37 and the medium outlet pipe 38 can engage with the latch holes, respectively. Once engaged, they are latched into corresponding positions on the electrical control box body 24, thereby enabling the third limiting structure 27 to limit the medium outlet pipe 38 and the medium inlet pipe 37. Furthermore, this arrangement facilitates assembly of the medium inlet pipe 37 and the medium outlet pipe 38 with the electrical control box body 24.

[0190] 4 and 9 , according to some embodiments of the present application, portions of the medium inlet pipe 37 and the medium outlet pipe 38 are located between the outer edge of the electrical control board 22 and the inner wall of the electrical control box 24. This arrangement allows for a more rational arrangement of the heat dissipation component 30 within the electrical control box 24, fully utilizing the internal space of the electrical control box 24 and improving space utilization. Furthermore, when the insulating structure is a colloid structure, this arrangement prevents potting glue from entering the medium inlet pipe 37 and the medium outlet pipe 38 during the potting process, thereby facilitating potting operations within the electrical control box 24 while ensuring the heat dissipation effectiveness of the heat dissipation component 30.

[0191] 1-2 , according to some embodiments of the present application, the heat sink 31 is a phase-change heat sink element and includes a heat-absorbing section 42 and a heat-dissipating section 43. The heat-dissipating medium within the heat sink 31 is adapted to circulate between the heat-absorbing section 42 and the heat-dissipating section 43. The heat-absorbing section 42 includes a heat-dissipating body 32. The heat-absorbing section 42 of the heat sink 31 is configured to absorb heat generated by the components 23 during operation, thereby dissipating heat from the components 23. The heat-dissipating section 43 of the heat sink 31 is configured to dissipate heat from the heat-dissipating medium. After dissipation, the heat-dissipating medium can flow back to the heat-dissipating section 43 to absorb heat, thereby achieving circulation of the heat-dissipating medium between the heat-absorbing section 42 and the heat-dissipating section 43.

[0192] During operation of heat sink 31, the heat dissipation medium located in heat absorption section 42 is in a liquid state. After absorbing the heat generated by component 23 during operation, the liquid heat dissipation medium converts from liquid to gaseous state and flows through heat dissipation channel 36 to heat dissipation section 43. The gaseous heat dissipation medium condenses in heat dissipation section 43, converting from a high-temperature gaseous state to a low-temperature liquid state. Finally, it flows through heat dissipation channel 36 to heat absorption section 42, where it again absorbs the heat generated by component 23 during operation, thus starting the next heat dissipation cycle. The heat dissipation medium circulates between heat absorption section 42 and heat dissipation section 43, absorbing and dissipating heat through the phase change of the heat dissipation medium within heat dissipation channel 36, thereby achieving the cyclic heat dissipation function of heat sink 31 for component 23.

[0193] The following describes an electric control module assembly 10 according to some embodiments of the present application with reference to FIG. 13 to FIG. 18 .

[0194] 13-18 , the electric control module assembly 10 includes an electric control module 20 and a heat dissipation component 30. The electric control module 20 includes an electric control component 21 and an electric control box body 24. The electric control component 21 includes an electric control board 22 and a plurality of components 23 arranged on the electric control board 22. The heat dissipation component 30 is used to dissipate heat from the electric control module 20 and includes two heat dissipation members 31, namely a first heat dissipation member 31a and a second heat dissipation member 31b. The heat dissipation member 31 includes a heat dissipation body 32, wherein the heat dissipation body 32 of one of the heat dissipation members 31 is located on the outer peripheral side of the component 23.

[0195] The heat sink 31, whose heat dissipation body 32 is located on the outer periphery of the component 23, is the first heat sink 31a. The heat dissipation body 32 of the first heat sink 31a extends non-linearly. The heat dissipation body 32 of the first heat sink 31a extends along the circumference of the component 23. The heat dissipation body 32 of the first heat sink 31a includes three bending portions 33. The bending portion 33 includes three bending sections 34 connected in sequence along the extension direction of the first heat sink 31a. An angle is formed between two adjacent bending sections 34, and the angle between two adjacent bending sections 34 ranges from 90 to 170 degrees. The first heat sink 31a also includes a non-bending portion 35 extending in a straight line. The bending section 34 of the bending portion 33 connected to the non-bending portion 35 is the first bending section 341. The angle between the non-bending portion 35 and the first bending section 341 ranges from 90 to 170 degrees. At least some of the components 23 are arranged along the length of the electronic control board 22 to form a component group. The heat dissipation body 32 of the first heat sink 31 a is disposed around the outer periphery of the components 23 of the component group.

[0196] The peripheral surface of the component 23 is the component side surface 232. The heat dissipation body 32 of the first heat sink 31a is thermally connected to the component side surface 232. The end surface of the component 23 in the height direction is the component end surface 231. The heat dissipation body 32 of the second heat sink 31b is thermally connected to the component end surface 231. The heat dissipation body 32 of the second heat sink 31b includes a fixing portion 311 and a heat dissipation portion 312. The heat dissipation portion 312 forms a heat dissipation channel 36 for the flow of heat dissipation medium. The fixing portion 311 is connected to the electronic control board 22 via fasteners. A thermal conductive layer is provided between the heat dissipation body 32 and the component 23. The thermal conductive layer is thermally conductive silicone grease. The heat dissipation body 32 is formed in a flat shape, and at least one side of the heat dissipation body 32 along the thickness direction is opposite to or thermally connected to the component 23.

[0197] The electronic control assembly 21 is disposed within the electronic control box 24. A first retaining structure 25 is provided on the inner wall of the electronic control box 24. The first heat sink 31a cooperates with the first retaining structure 25 to retain the first heat sink 31a. The first retaining structure 25 includes a first retaining groove 251, which partially accommodates the first heat sink 31a.

[0198] A heat dissipation channel 36 is formed within the heat sink 31 for the flow of heat dissipation medium. The heat dissipation component 30 includes a medium inlet pipe 37 and a medium outlet pipe 38. The heat dissipation channel 36 connects the medium inlet pipe 37 and the medium outlet pipe 38. The first heat sink 31a and the second heat sink 31b are arranged in parallel. The medium inlet pipe 37 and the medium outlet pipe 38 are located on either side of the length of the electronic control board 22. The heat sink 31 extends along the length of the electronic control board 22, and the first heat sink 31a and the second heat sink 31b are arranged along the width of the electronic control board 22. The inner wall of the electronic control box 24 is also provided with a third limiting structure 27. The medium inlet pipe 37 and the medium outlet pipe 38 cooperate with the third limiting structure 27 to limit the position of the medium inlet pipe 37 and the medium outlet pipe 38. The following describes the electronic control module assembly 10 according to other embodiments of the present application with reference to Figures 19-23.

[0199] 19-23 , in this embodiment, the difference from the electronic control module assembly 10 in FIG1-6 is that the heat dissipation component 30 includes three heat dissipation members 31 , namely, two first heat dissipation members 31 a and one second heat dissipation member 31 b , and the two first heat dissipation members 31 a are provided with a bending portion 33 , and the bending portion 33 includes three bending sections 34 .

[0200] In addition, two first heat sinks 31a are provided on either side of the component group 11 along the width of the electronic control board 22. The two first heat sinks 31a and the second heat sink 31b are connected in parallel. The two first heat sinks 31a are located on the outer periphery of the component 23 and are provided on either side of the electronic control board 22 in the width direction. This increases the heat transfer area between the component 23 and the heat sink 30, improving the heat dissipation of the component 23 and, consequently, the heat dissipation of the entire electronic control module 20.

[0201] According to the second embodiment of the present application, the glue pouring method of the electronic control module assembly 10 is the electronic control module assembly 10 according to the first embodiment of the present application. The glue pouring method includes:

[0202] Assemble the electronic control assembly 21 and the heat dissipation component 30 to the electronic control box body 24 to form a pre-assembled body;

[0203] Adjust the pre-assembly so that the glue-filled side of the electric control box body 24 faces upward; the electric control board 22 has a first side 221 and a second side 222 arranged opposite to each other along the thickness direction of the electric control board 22, and the glue-filled side of the electric control box body 24 can be the first side 221 or the second side 222.

[0204] For example, when glue is poured using the glue pouring port 44 in the gap between the outer edge of the electronic control board 22 and the inner wall of the first box body 241, the second side 222 of the electronic control board 22 is the glue pouring side, and the pre-assembly is adjusted so that the second side 222 of the electronic control board 22 faces upward; when glue is poured using the first glue pouring hole 45 on the electronic control board 22, the second side 222 of the electronic control board 22 is the glue pouring side, and the pre-assembly is adjusted so that the second side 222 of the electronic control board 22 faces upward; when glue is poured using the second glue pouring hole located in the electronic control box body 24, the first side 221 of the electronic control board 22 is the glue pouring side, and the pre-assembly is adjusted so that the first side 221 of the electronic control board 22 faces upward.

[0205] The insulating structure is formed by pouring glue into the electric control box body 24 from the glue pouring side of the electric control box body 24 .

[0206] According to the glue filling method of the embodiment of the present application, an isolation structure can be formed in the electronic control box body 24, which can isolate the components 23 from the air, thereby avoiding condensation on the components 23 of the electronic control module 20, thereby improving the reliability, stability and safety of the electronic control module 20; in addition, when there are flammable and explosive gases in the environment where the electronic control module 20 is located, by providing an isolation structure and the isolation structure covering the outer surface of the components, the safety hazard of ignition and explosion caused by contact between flammable and explosive gases and the components 23 can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module 20, prevent the components 23 from detaching, cushion and protect the components 23, and prevent dust.

[0207] According to some embodiments of the present application, the electronic control assembly 21 and the heat dissipation component 30 are assembled in the electronic control box body 24 to form a pre-assembly, including: assembling a portion of the heat dissipation component 30 in the electronic control assembly 21, assembling the electronic control assembly 21 with the heat dissipation component 30 in the first box body 241 of the electronic control box body 24, and making the first side 221 of the electronic control board 22 face the first box body 241, and the first side 221 of the electronic control board 22 is provided with a component 23;

[0208] Adjusting the pre-assembly so that the glue-filled side of the electric control box body 24 faces upward, including: adjusting the pre-assembly so that the second side 222 of the electric control board 22 faces upward;

[0209] The insulating structure is formed by pouring glue from the glue-filling side of the electrical control box 24 into the electrical control box 24, including: pouring glue from the second side 222 of the electrical control board 22 into the first box 241 to form the insulating structure, and then assembling the second box 242 of the electrical control box 24 to the first box 241. During the pouring process, the potting glue is poured from the second side 222 of the electrical control board 22 into the filling space. Under the action of gravity, the potting glue flows from the second side 222 of the electrical control board 22 to the lowest point of the filling space until the entire filling space is filled. This allows the potting glue to cover the outer surfaces of the multiple components 23 located within the filling space, isolating the components 23 from air and preventing condensation caused by cooling. After the potting is completed, the second box 242 of the electrical control box 24 is assembled to the first box 241. This operation is simple.

[0210] 1 and 24 , the outdoor unit 100 according to the third embodiment of the present application includes an outdoor housing 11, an outdoor heat exchanger, an outdoor fan 12, a compressor assembly 13, and an electronic control module assembly 10. The outdoor heat exchanger, the outdoor fan 12, the compressor assembly 13, and the electronic control module assembly 10 are all arranged in the outdoor housing 11, and the electronic control module assembly 10 is the electronic control module assembly 10 according to the first embodiment of the present application. During the operation of the outdoor unit 100, the temperature of the electronic control module 20 rises. By providing a heat dissipation component 30 in the electronic control module assembly 10, the heat generated by the electronic control module 20 during operation can be dissipated through the heat dissipation component 30, thereby controlling the temperature of the electronic control assembly 21 within the normal operating temperature to ensure the stability of the operation of the electronic control module 20.

[0211] According to the outdoor unit 100 of the embodiment of the present application, by providing the above-mentioned electric control module assembly 10, the heat dissipation effect of the electric control module 20 can be improved, and by providing an isolation structure, the components 23 can be isolated from the air, thereby avoiding condensation on the components 23 of the electric control module 20, thereby improving the reliability, stability and safety of the electric control module 20; in addition, when there are flammable and explosive gases in the environment where the electric control module 20 is located, by providing an isolation structure and the isolation structure covering the outer surface of the component 23, the safety hazard of ignition and explosion caused by contact between the flammable and explosive gas and the component 23 can be eliminated, and at the same time, it can also enhance the vibration resistance of the electric control module 20, prevent the components 23 from detaching, cushion and protect the components 23, and prevent dust.

[0212] 1 and 24 , according to some embodiments of the present application, the refrigerant circulation system of the outdoor unit 100 includes a cooling portion 15 for dissipating heat from the electronic control module 20 . The cooling portion 15 is thermally connected to a heat dissipation component 30 or at least a portion of the cooling portion 15 constitutes the heat dissipation component 30 .

[0213] The refrigerant circulation system of the outdoor unit 100 includes a cooling unit 15 for dissipating heat from the electronic control module 20 . Through this arrangement, the refrigerant in the refrigerant circulation system can be used to remove the heat generated by the electronic control module 20 .

[0214] Among them, the cooling part 15 is thermally connected to the heat dissipation component 30. The heat generated by the electronic control module 20 is transferred to the cooling part 15 through the heat dissipation component 30, and then the heat is taken away by the refrigerant flowing through the cooling part 15, thereby realizing indirect heat dissipation and cooling of the electronic control module 20 by the refrigerant.

[0215] For example, referring to Figures 1-2, the heat dissipation component 30 includes two heat sinks 31. Each heat sink 31 is a phase-change heat dissipation element and includes a heat absorbing section 42 and a heat dissipating section 43. The heat dissipating medium within the heat sink 31 is adapted to circulate between the heat absorbing section 42 and the heat dissipating section 43. The heat absorbing section 42 includes a heat dissipating body 32. The heat dissipating sections 43 are thermally connected to the cooling unit 15 via a thermally conductive substrate 53. The cooling unit 15 can exchange heat with the heat dissipating medium within the heat dissipating sections 43, thereby dissipating heat from the heat dissipating sections 43.

[0216] At least a portion of the cooling unit 15 constitutes the heat sink 30. This means that either a portion of the cooling unit 15 constitutes the heat sink 30, or the entire cooling unit 15 constitutes the heat sink 30. Heat generated by the electronic control module 20 can be directly transferred to the cooling unit 15, where it is removed by the refrigerant flowing through the cooling unit 15. This allows for indirect cooling of the electronic control module 20 by the refrigerant. This configuration simplifies the structure, eliminates the need for a heat conductor connecting the cooling unit 15 and the electronic control module 20, and allows the cooling unit 15 to better absorb the heat generated by the electronic control module 20.

[0217] For example, referring to Figures 3 and 8, at least part of the cooling part 15 constitutes a heat dissipation component 30, and the heat generated by the electronic control module 20 can be directly transferred to the cooling part 15, and the heat is taken away by the refrigerant flowing through the cooling part 15, thereby achieving indirect heat dissipation and cooling of the electronic control module 20 by the refrigerant.

[0218] 1 and 24 , according to some embodiments of the present application, a water heat exchange assembly is further included, the water heat exchange assembly including a water heat exchanger 14, the water heat exchanger 14 having a water flow channel and a refrigerant channel for mutual heat exchange, and a water cooling unit 15 connected between the refrigerant channel and the inlet of the outdoor heat exchanger. The water flow channel and the refrigerant channel in the water heat exchanger 14 can realize the heat exchange function of the water heat exchanger 14 by exchanging heat with each other. After the refrigerant in the refrigerant circulation system enters the refrigerant channel of the water heat exchanger 14, the water in the water flow channel exchanges heat with the refrigerant in the refrigerant channel. After the water in the water flow channel flows out of the water heat exchanger 14 after heat exchange, the temperature of the water can be changed. The water adjusted to a preset temperature can be introduced into the room to provide domestic water or introduced into the indoor heat exchanger of the indoor unit to adjust the indoor air temperature.

[0219] Optionally, the water heat exchanger 14 may be a plate heat exchanger.

[0220] The water heat exchanger 14 has a first refrigerant inlet and outlet 141 and a second refrigerant inlet and outlet 142, both of which are connected to the refrigerant channel. Refrigerant flows into the refrigerant channel through one of the first and second refrigerant inlets and outlets 141 and 142 and flows out of the refrigerant channel through the other of the first and second refrigerant inlets and outlets 141 and 142. The outdoor heat exchanger has a first heat exchange inlet and outlet 141 and a second heat exchange inlet and outlet 142. Refrigerant flows into the outdoor heat exchanger through one of the first and second heat exchange inlets and outlets and flows out of the outdoor heat exchanger through the other of the first and second heat exchange inlets and outlets. The cooling unit 15 is connected between the second refrigerant inlet and outlet 142 and the first heat exchange inlet and outlet.

[0221] For example, when the outdoor heat exchanger acts as an evaporator and the water heat exchanger 14 acts as a condenser, the refrigerant discharged from the compressor assembly 13 flows into the refrigerant channel of the water heat exchanger 14 through the first refrigerant inlet 141 and flows out from the second refrigerant inlet 142. The refrigerant flowing out of the water heat exchanger 14 can flow through the cooling unit 15 and take away the heat generated by the electronic control module 20. The refrigerant flowing out of the cooling unit 15 flows into the outdoor heat exchanger through the first heat exchange inlet and flows out of the outdoor heat exchanger through the second heat exchange inlet and returns to the compressor to continue the compression cycle. After the refrigerant in the refrigerant circulation system enters the refrigerant channel of the water heat exchanger 14, the water in the water flow channel and the refrigerant in the refrigerant channel exchange heat with each other. After the heat exchange is completed, the refrigerant flows through the cooling unit 15. At this time, the refrigerant flowing into the cooling unit 15 has a lower temperature after heat exchange in the water heat exchanger 14. The refrigerant flowing through the cooling unit 15 can realize the heat dissipation function of the electronic control module 20. Furthermore, compared to the refrigerant temperature in the return air pipe section of the refrigerant circulation system, the refrigerant flowing through the water heat exchanger 14 and before flowing into the outdoor heat exchanger, while meeting the heat dissipation requirements for the electronic control module 20, has a higher temperature than the refrigerant in the return air pipe section. This can reduce the risk of condensation caused by the refrigerant cooling the electronic control module 20. Furthermore, by using the refrigerant after flowing through the water heat exchanger 14 to cool the electronic control module 20, the heat exchange performance of the water heat exchanger 14 can be prioritized, ensuring that indoor heat exchange requirements are met.

[0222] When the outdoor heat exchanger acts as a condenser and the water heat exchanger 14 acts as an evaporator, the refrigerant discharged from the compressor assembly 13 flows into the outdoor heat exchanger through the second heat exchange inlet and outlet, and flows out from the first heat exchange inlet and outlet. The refrigerant flowing out of the outdoor heat exchanger can flow through the cooling unit 15 and take away the heat generated by the electronic control module 20. The refrigerant flowing out of the cooling unit 15 flows into the water heat exchanger 14 through the second refrigerant inlet and outlet 142, and flows out of the water heat exchanger 14 through the first refrigerant inlet and outlet 141, and returns to the compressor to continue the compression cycle. The refrigerant in the refrigerant circulation system enters the outdoor heat exchanger for heat exchange. After the heat exchange is completed, the refrigerant flows through the cooling unit 15. At this time, the temperature of the refrigerant flowing into the cooling unit 15 is lower after heat exchange through the outdoor heat exchanger. The refrigerant flowing through the cooling unit 15 can realize the heat dissipation function of the electronic control module 20. Moreover, relative to the refrigerant temperature of the return air pipe portion in the refrigerant circulation system, the refrigerant that flows through the outdoor heat exchanger and before flowing into the water heat exchanger 14 can satisfy the heat dissipation of the electronic control module 20 while the temperature of this part of the refrigerant is higher than the refrigerant temperature of the return air pipe portion, thereby reducing the risk of condensation caused by the use of the refrigerant to dissipate heat for the electronic control module 20.

[0223] Optionally, the water path heat exchanger 14 further includes a water path inlet 50 and a water path outlet 51. The water entering the water flow channel through the water path inlet 50 exchanges heat with the refrigerant in the refrigerant channel. After the water in the water flow channel flows out of the water path heat exchanger 14 after heat exchange, the temperature of the water can be changed and the water flows out from the water path outlet 51. The water with the temperature adjusted to the preset temperature can be introduced into the room to provide domestic water or introduced into the indoor heat exchanger of the indoor unit to adjust the indoor air temperature.

[0224] Optionally, the refrigerant circulation system may be provided with a throttling component 52 to control parameters such as the flow rate of the refrigerant in the refrigerant circulation system.

[0225] Optionally, referring to Figure 24 , the refrigerant circulation system includes a connecting pipe 54 and a cooling bypass 55, connected between the refrigerant channel of the water heat exchanger 14 and the heat exchanger. The cooling bypass 55 and a portion of the connecting pipe 54 are connected in parallel, and a portion of the cooling bypass 55 constitutes the cooling unit 15. The refrigerant in the connecting pipe 54 of the refrigerant system is used to ensure indoor heat exchange performance, thereby achieving temperature regulation. The refrigerant in the cooling unit 15 of the cooling bypass 55 is used to meet the cooling requirements of the electronic control module 20, thereby dissipating heat from the electronic control module 20. By connecting at least a portion of the outlet section of the main pipe in parallel with the cooling bypass 55, the performance of the outdoor unit 100 can be maintained while dissipating heat from the electronic control module 20.

[0226] 1 to 12 , a heating and ventilation device according to a fourth embodiment of the present application includes an outdoor unit 100 according to the third embodiment of the present application. The heating and ventilation device may be an air conditioning system, a heat pump system, or the like.

[0227] According to the HVAC equipment of the embodiment of the present application, by setting the above-mentioned outdoor unit 100, the electronic control module assembly 10 of the outdoor unit 100 is provided with a heat dissipation component 30, which can improve the heat dissipation effect of the electronic control module 20, and the electronic control module assembly 10 is also provided with an isolation structure, which can isolate the components 23 from the air, thereby avoiding condensation on the components 23 of the electronic control module 20, thereby improving the reliability, stability and safety of the electronic control module 20; in addition, when there are flammable and explosive gases in the environment where the electronic control module 20 is located, by setting an isolation structure and the isolation structure covering the outer surface of the component 23, the safety hazard of ignition and explosion caused by contact between the flammable and explosive gas and the component 23 can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module 20, prevent the component 23 from detaching, cushion and protect the component 23, and prevent dust.

[0228] The following describes an electric control module assembly 10 according to some embodiments of the present application with reference to FIG. 3 to FIG. 12 .

[0229] Referring to Figures 3-12 , in this embodiment, the electronic control module assembly 10 includes an electronic control module 20 and a heat sink 30. The electronic control module 20 includes an electronic control box 24 and an electronic control assembly 21 disposed within the electronic control box 24. The electronic control assembly 21 includes an electronic control board 22 and multiple components 23 disposed thereon. The heat sink 30 is used to dissipate heat from the electronic control module 20. An insulating structure is provided within the electronic control box 24, covering the outer surfaces of the multiple components 23 to isolate them from the air. The insulating structure is a colloid structure.

[0230] The heat sink 30 is partially located within the electronic control box 24 and is thermally connected to the electronic control assembly 21. The insulating structure fills the space defined by the electronic control box 24, the electronic control assembly 21, and the heat sink 30, connecting the electronic control assembly 21 and the heat sink 30 as a whole. The heat sink 30 includes multiple heat sinks 31, each of which includes a heat sink body 32, which is thermally connected to the electronic control assembly 21. The end face of the component 23 in the height direction is the component end face 231, and the peripheral side surface of the component 23 is the component side face 232. The heat sink body 32 can be thermally connected to the component end face 231 or the component side face 232.

[0231] For example, referring to Figures 3 to 7, in this embodiment, the heat dissipation component 30 includes a first heat dissipation member 31a and a second heat dissipation member 31b. The first heat dissipation member 31a is provided with a bending portion 33, and the bending portion 33 is formed by three bending segments 34 connected together. The heat dissipation body 32 of the first heat dissipation member 31a is thermally connected to the side surface 232 of the device; the second heat dissipation member 31b is a straight structure and is thermally connected to the end surface 231 of the device.

[0232] For example, referring to Figures 8 to 12, in this embodiment, the heat dissipation component 30 includes a third heat dissipation component 31c and a fourth heat dissipation component 31d, and the electronic control component 21 includes a first component group 46a and a second component group 46b which are thermally connected to the third heat dissipation component 30 and the fourth heat dissipation component 30 respectively. The first component group 46a includes multiple components 23 of three different heights. The heat dissipation body 32 of the third heat dissipation component 31c is bent to be thermally connected to the device end faces 231 of the components 23 of three different heights; the second component group 46b includes one component 23, and the fourth heat dissipation component 31d is a flat structure, which is thermally connected to the device end face 231 of the component 23 in the second component group 46b.

[0233] The inner wall of the electrical control box body 24 or the electrical control board 22 is provided with a first limiting structure 25 for limiting the position of the heat sink 30. The electrical control board 22 has a first side 221 and a second side 222 disposed opposite each other along the thickness direction of the electrical control board 22. A filling space is defined between the first side 221 of the electrical control board 22 and the electrical control box body 24. The component 23 is disposed on the first side 221 of the electrical control board 22 and is located within the filling space. The filling space is filled with an insulating structure.

[0234] A portion of the heat sink 30 is located within the filler space and is thermally connected to the components 23. An insulating structure is placed between the outer edge of the electronic control board 22 and the inner wall of the electronic control box 24. The surface of the second side 222 of the electronic control board 22 serves as the back surface of the board, and the insulating structure is flush with the back surface or protrudes from and covers the back surface. At least a portion of the inner wall of the first side 221 of the electronic control box 24, facing the electronic control board 22, is formed as a contoured structure that mimics the shape of the first side 221 of the corresponding electronic control component 21.

[0235] The electrical control box 24 includes a first box body 241 and a second box body 242, each formed independently. The electrical control assembly 21 is disposed within the first box body 241. The first side 221 of the electrical control board 22 faces the first box body 241 and defines a filler space between the first side 221 and the first box body 241. The inner wall of the first box body 241 is formed with a second retaining structure 26 for limiting the position of the electrical control board 22 and a first fixing post 28 for securing the electrical control board 22. During assembly of the electrical control board 22 with the first box body 241, the second retaining structure 26 facilitates positioning of the electrical control board 22 within the first box body 241. Once positioned, the first fixing post 28 secures the electrical control board 22 to the first box body 241.

[0236] There is a gap between the outer edge of the electronic control board 22 and the inner wall of the first box body 241. At least part of the gap can constitute a glue filling port 44, which is connected to the filling space; a first glue filling hole 45 connected to the filling space is also formed on the electronic control board 22. The equivalent diameter of the first glue filling hole 45 is greater than 10 mm and is located in the middle of the electronic control board 22.

[0237] A second fixing post 29 connected to the second box body 242 is provided in the first box body 241 . The surface of the second side 222 of the electric control board 22 is the back of the board. The second fixing post 29 is located on the outer peripheral side of the electric control board 22 and protrudes from the back of the board.

[0238] The heat sink 30 extends from the glue-filled side of the electronic control box 24, and the wiring harness connected to the electronic control assembly 21 extends from the glue-filled side of the electronic control box 24. The heat sink 30 includes a heat sink 31, which includes a heat sink body 32 located within the electronic control box 24. The heat sink 31 has a heat dissipation channel 36 formed therein for the flow of heat dissipation medium.

[0239] The heat sink 30 includes a medium inlet pipe 37 and a medium outlet pipe 38. A heat dissipation channel 36 connects the medium inlet pipe 37 and the medium outlet pipe 38. Two heat sinks 31 are arranged in parallel, with the medium inlet pipe 37 and the medium outlet pipe 38 located on either side of the electronic control board 22 in the longitudinal direction. The heat sinks 31 extend along the length of the electronic control board 22 and are arranged along its width.

[0240] The inner wall of the electrical control box 24 is further provided with a third limiting structure 27. The medium inlet pipe 37 and the medium outlet pipe 38 cooperate with the third limiting structure 27 to limit the position of the medium inlet pipe 37 and the medium outlet pipe 38. Portions of the medium inlet pipe 37 and the medium outlet pipe 38 are located between the outer edge of the electrical control board 22 and the inner wall of the electrical control box 24.

[0241] The heat dissipation component 30 can dissipate heat for the electronic control module 20, and by providing an isolation structure and making the isolation structure cover the outer surface of the component 23, the component 23 can be isolated from the air, thereby avoiding condensation on the component 23 of the electronic control module 20, and improving the reliability, stability and safety of the electronic control module 20.

[0242] 3 to 12 , the glue filling method of the electric control module assembly 10 of this embodiment is described below. The method includes:

[0243] The electronic control assembly 21 and the heat sink 30 are assembled into the electronic control box 24 to form a pre-assembled assembly. During the pre-assembly process, the electronic control board 22 and the heat sink 30 are first assembled based on the correspondence between the components 23 on the electronic control board 22 and the heat sink 31, so that the heat sink 30 is fixed to the electronic control board 22. For example, the electronic control board 22 and the heat sink 30 can be positioned by bonding. After the fixing is completed, the electronic control board 22 is flipped upside down into the first box 241, so that the first side 221 of the electronic control board 22 faces the first box 241. The heat sink 30, the electronic control board 22, and the first box 241 are positioned using the first retaining structure 25, the second retaining structure 26, and the third retaining structure 27. Finally, the electronic control board 22 and the first box 241 are connected and fixed using the first fixing post 28 to form the pre-assembled assembly. For example, the connection and fixation of the electronic control board 22 and the first box 241 can be completed by the cooperation of a fastener and the first fixing post 28. At this time, a filling space is defined between the first side 221 of the electric control board 22 and the electric control box body 24 , and the components 23 and the heat dissipation member 30 are both located in the filling space.

[0244] Adjust the pre-assembled body so that the glue-filling side of the electronic control box body 24 faces upward. When pouring glue into the filling space from the glue-filling side of the electronic control board 22, you can choose to pour glue into the filling space through the glue-filling port 44 formed by the gap around the electronic control board 22 and the inner wall of the first box body 241; you can choose to pour glue into the filling space through the first glue-filling hole 45 on the electronic control board 22; or you can choose to pour glue into the filling space through both the glue-filling port 44 and the first glue-filling hole 45 simultaneously.

[0245] The insulating structure is formed by pouring glue into the electric control box body 24 from the glue pouring side. During the pouring process, the potting glue is poured from the glue pouring side of the electric control board 22 into the filling space. Under the action of gravity, the potting glue flows from the top to the bottom, from the second side 222 of the electric control board 22 to the lowest point of the filling space, until the entire filling space is filled, thereby covering the outer surfaces of the multiple components 23 located inside the filling space, so that the components 23 are isolated from the air.

[0246] After the potting operation is completed and the potting glue is solidified, the first box body 241 and the second box body 242 are connected by the second fixing column 29 to form a final assembly. For example, the first box body 241 and the second box body 242 can be connected and fixed by the cooperation of the fastener and the first fixing column 28.

[0247] The glue filling method of this embodiment is simple. At the same time, the isolation effect of the colloid structure is good, which can isolate the components 23 from the air, thereby avoiding condensation on the components 23 of the electronic control module 20, thereby improving the reliability, stability and safety of the electronic control module 20; in addition, when there are flammable and explosive gases in the environment where the electronic control module 20 is located, by providing an isolation structure and the isolation structure covering the outer surface of the component 23, the safety hazard of ignition and explosion caused by the contact between the flammable and explosive gas and the component 23 can be eliminated, and at the same time, it can also enhance the vibration resistance of the electronic control module 20, prevent the components 23 from detaching, cushion and protect the components 23, and prevent dust.

[0248] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0249] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electric control module assembly, characterized in that: include: An electric control module, comprising an electric control box body and an electric control component arranged in the electric control box body, wherein the electric control component comprises an electric control board and a plurality of components arranged on the electric control board; A heat dissipation component, used for dissipating heat from the electronic control module; Wherein, an insulating structure is provided in the electric control box body, and the insulating structure covers the outer surfaces of the plurality of components.

2. The electric control module assembly according to claim 1, characterized in that: The isolation structure is a colloid structure.

3. The electric control module assembly according to claim 1 or 2, characterized in that: Part of the heat dissipation component is located in the electric control box body and is thermally connected to the electric control component. The space defined by the electric control box body, the electric control component and the heat dissipation component is filled with the insulating structure, and the insulating structure integrally connects the electric control component and part of the heat dissipation component.

4. The electric control module assembly according to claim 3, characterized in that: The inner wall of the electric control box body or the electric control board is provided with a first limiting structure for partially limiting the heat dissipation component.

5. The electric control module assembly according to any one of claims 1 to 4, characterized in that: The electric control board has a first side and a second side arranged opposite to each other along the thickness direction of the electric control board, a filling space is defined between the first side of the electric control board and the electric control box body, at least part of the components are arranged on the first side of the electric control board and located in the filling space, and the filling space is filled with the insulating structure.

6. The electric control module assembly according to claim 5, characterized in that: Part of the heat dissipation component is located in the filling space and is thermally connected to the component.

7. The electric control module assembly according to claim 5, characterized in that: The insulating structure is filled between the outer edge of the electric control board and the inner wall of the electric control box body.

8. The electric control module assembly according to claim 7, characterized in that: A plurality of the components are mounted on the first side of the electric control board, the surface of the second side of the electric control board is the back side of the board, the back side of the board reveals the welding feet of a plurality of the components, the isolation structure is flush with the back side of the board or the isolation structure protrudes from the back side of the board and covers the welding feet of a plurality of the components.

9. The electric control module assembly according to claim 5, characterized in that: At least a portion of the inner wall of the electric control box body facing the first side of the electric control board is formed as a contoured structure, and the configuration of the first side of at least a portion of the components installed on the first side of the electric control board is defined as the first side configuration of the electric control component, and the contoured structure is similar to the first side configuration of the electric control component.

10. The electric control module assembly according to claim 9, characterized in that: The electric control box body comprises a first box body and a second box body which are independently formed. The box wall of the first box body encloses a cavity with an opening, the box wall of the first box body has a bottom wall opposite to the opening and an annular wall surrounding the bottom wall to form the opening, the bottom wall of the first box body constitutes the contoured structure, the electronic control component is fixed in the cavity of the first box body, and the space between the bottom wall of the first box body and the first side of the electronic control board constitutes the filling space.

11. The electric control module assembly according to claim 10, characterized in that: The isolation structure is a colloid structure formed by glue pouring, the opening side of the first box body is configured as a glue pouring side, and the colloid material enters the filling space from the opening of the first box body.

12. The electric control module assembly according to claim 11, characterized in that: There is a gap between the outer edge of the board surface of the electric control board and the annular wall of the first box body, and at least a part of the gap constitutes a glue injection port, and the glue injection port is connected to the filling space.

13. The electric control module assembly according to claim 11, characterized in that: The electric control board is formed with a first glue injection hole communicating with the filling space.

14. The electric control module assembly according to claim 13, characterized in that: The equivalent diameter of the first glue filling hole is greater than 10 mm; and / or the first glue filling hole is located in the middle of the electric control board.

15. The electric control module assembly according to claim 11, characterized in that: A first fixing column and a second fixing column are provided in the first box body, the electric control board is installed on the first fixing column, the second fixing column is connected to the second box body, the first fixing column is supported on a first side of the electric control board, the surface of the second side of the electric control board is the back side of the board, and the second fixing column is located on the outer peripheral side of the electric control board and protrudes from the back side of the board.

16. The electric control module assembly according to claim 5, characterized in that: The isolation structure is a colloid structure, the glue filling side of the filling space is located on the first side of the electric control board, and a second glue filling hole is formed on the portion of the electric control box body located on the first side of the electric control board. When the first side of the electric control board faces upward, the second glue filling hole is located at the highest position of the electric control box body.

17. The electric control module assembly according to claim 5, characterized in that: The insulating structure is a colloid structure, and the heat dissipation component is led out from the glue-filled side of the electric control box body; and / or the insulating structure is a colloid structure, and the wiring harness connected to the electric control component is led out from the glue-filled side of the electric control box body.

18. The electric control module assembly according to any one of claims 1 to 17, characterized in that: The heat dissipation component comprises a heat dissipation element, and the heat dissipation element comprises a heat dissipation body located in the electric control box body. A heat dissipation channel for the flow of heat dissipation medium is formed in the heat dissipation element.

19. The electric control module assembly according to claim 18, characterized in that: The heat dissipation component comprises a medium inlet pipe and a medium outlet pipe, and the heat dissipation channel is connected with the medium inlet pipe and the medium outlet pipe.

20. The electric control module assembly according to claim 19, characterized in that: The heat sink is a plurality of heat sinks arranged in parallel.

21. The electric control module assembly according to claim 20, characterized in that: The medium inlet pipe and the medium outlet pipe are located on both sides of the length direction of the electric control board, the heat sink extends along the length direction of the electric control board, and a plurality of heat sinks are arranged along the width direction of the electric control board.

22. The electric control module assembly according to claim 19, characterized in that: The inner wall of the electric control box body is provided with a third limiting structure, and the medium inlet pipe and the medium outlet pipe cooperate with the third limiting structure to limit the medium inlet pipe and the medium outlet pipe.

23. The electric control module assembly according to claim 19, characterized in that: The portion of the medium inlet pipe and the portion of the medium outlet pipe are located between the outer edge of the electric control board and the inner wall of the electric control box body.

24. The electric control module assembly according to claim 18, characterized in that: The heat sink is a phase-change heat sink and includes a heat absorption section and a heat dissipation section. The heat dissipation medium in the heat sink is suitable for circulating between the heat absorption section and the heat dissipation section. The heat absorption section includes the heat dissipation body.

25. The electric control module assembly according to any one of claims 1 to 17, characterized in that: The heat dissipation component includes at least one heat dissipation element, and the heat dissipation element includes a heat dissipation body located in the electric control box body. The heat dissipation body of at least one heat dissipation element is coated on the outer peripheral side of the component.

26. The electric control module assembly according to claim 25, characterized in that: The heat sink whose heat dissipation body is located on the outer peripheral side of the component is a first heat sink, and the heat dissipation body of at least a portion of the first heat sink extends in a non-linear manner.

27. The electric control module assembly according to claim 26, characterized in that: At least a portion of the heat dissipation body of the first heat dissipation element extends along the circumference of the component.

28. The electric control module assembly according to claim 26, characterized in that: The heat dissipation body of the first heat dissipation element includes a bending portion or a plurality of bending portions arranged at intervals along the extension direction of the first heat dissipation element, and the bending portion includes a plurality of bending sections connected in sequence along the extension direction of the first heat dissipation element, and an angle is formed between two adjacent bending sections.

29. The electric control module assembly according to claim 28, characterized in that: The angle between two adjacent bending sections ranges from 90° to 170°.

30. The electric control module assembly according to claim 28, characterized in that: The first heat sink also includes a non-bending portion extending in a straight line, the bending section of the bending section connected to the non-bending portion is a first bending section, and the angle between the non-bending portion and the first bending section ranges from 90 to 170°.

31. The electric control module assembly according to claim 25, characterized in that: The heat sink whose heat dissipation body is located on the outer periphery of the components is a first heat sink, and the heat dissipation body of the first heat sink is located on the outer periphery of the plurality of components.

32. The electric control module assembly according to claim 25, characterized in that: The heat sink of the heat dissipation body located on the outer periphery of the component is a first heat sink, and at least part of the plurality of components are arranged along the length direction of the electric control board to form a component group; The heat dissipation body of the first heat dissipation element extends along the circumferential direction of the components of the component group; and / or the first heat dissipation element is provided on both sides of the component group along the width direction of the electric control board.

33. The electric control module assembly according to claim 25, characterized in that: The heat sink whose heat dissipation body is located on the outer peripheral side of the component is a first heat sink, the peripheral side surface of the component is a device side surface, and the heat dissipation body of the first heat sink is thermally connected to the device side surface.

34. The electric control module assembly according to claim 25, characterized in that: The heat sink whose heat dissipation body is located on the outer peripheral side of the component is a first heat sink. There are multiple heat sinks, including the first heat sink and the second heat sink. The end face of the component in the height direction is the device end face, and the heat dissipation body of the second heat sink is thermally connected to the device end face.

35. The electric control module assembly according to claim 34, characterized in that: The heat dissipation body of the second heat dissipation element includes a fixing portion and a heat dissipation portion, the heat dissipation portion is formed with a heat dissipation channel for the flow of heat dissipation medium, and the fixing portion is connected to the electric control board through a fastener.

36. The electric control module assembly according to claim 25, characterized in that: A heat-conducting layer is provided between the heat dissipation body and the components; the heat-conducting layer includes one or more of heat-conducting glue, heat-conducting silicone grease, heat-conducting pads and heat-conducting metals.

37. The electric control module assembly according to claim 25, characterized in that: The heat dissipation body is formed in a flat shape, and at least one side of the heat dissipation body along the thickness direction is opposite to or thermally connected to the component.

38. The electric control module assembly according to claim 1, characterized in that: The heat dissipation component includes at least one heat dissipation element, which includes a heat dissipation body located in the electric control box body. The inner wall of the electric control box body is provided with a first limiting structure, and at least part of the heat dissipation element cooperates with the first limiting structure to limit the heat dissipation element.

39. The electric control module assembly according to claim 38, characterized in that: The first limiting structure includes a first limiting groove, and at least a portion of the heat sink is accommodated in the first limiting groove.

40. A method for filling glue for an electric control module assembly, characterized in that: The electric control module assembly is an electric control module assembly according to any one of claims 1 to 39, and the glue pouring method comprises: Assembling the electric control assembly and the heat dissipation component on the electric control box body to form a pre-assembled body; Adjusting the pre-assembled body so that the glue-filled side of the electric control box body faces upward; The insulating structure is formed by pouring glue into the electric control box body from the glue pouring side of the electric control box body.

41. The method for filling glue of an electric control module assembly according to claim 40, characterized in that: Assembling the electric control assembly and the heat dissipation component on the electric control box body to form a pre-assembled body, including: Assemble part of the heat dissipation component on the electric control assembly, and assemble the electric control assembly equipped with the heat dissipation component into the first box body of the electric control box body, and make the first side of the electric control board face the first box body, and the first side of the electric control board is provided with the components; Adjusting the pre-assembly so that the glue-filled side of the electric control box body faces upward, including: adjusting the pre-assembly so that the second side of the electric control board faces upward; pouring glue from the glue-filled side of the electric control box body into the electric control box body to form the isolation structure, including: pouring glue from the second side of the electric control board into the first box body to form the isolation structure, and assembling the second box body of the electric control box body to the first box body.

42. An outdoor unit, characterized in that: include: Outdoor housing; An outdoor heat exchanger and an outdoor fan are arranged in the outdoor casing; A compressor assembly is disposed in the outdoor casing; An electric control module assembly is arranged in the outdoor casing and is an electric control module assembly according to any one of claims 1-39.

43. The outdoor unit according to claim 42, characterized in that: The refrigerant circulation system of the outdoor unit includes a cooling part for dissipating heat from the electric control module. The cooling part is thermally connected to the heat dissipation component or at least a part of the cooling part constitutes the heat dissipation component.

44. The outdoor unit according to claim 43, characterized in that: It also includes a water heat exchange component, which includes a water heat exchanger. The water heat exchanger has a water flow channel and a refrigerant channel for mutual heat exchange. The cooling unit is connected between the refrigerant channel of the water heat exchanger and the outdoor heat exchanger.

45. A HVAC equipment, characterized in that: include: An outdoor unit according to any one of claims 42-44.

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