Semiconductor manufacturing device and film-cutting mechanism

Abstract

A film-sticking device (1) comprises: a table (2) on which a semiconductor wafer W is placed; and a cutting unit (19) that cuts a photoresist film (6) attached to the semiconductor wafer (W) placed on the table (2) using a laser (LS). The cutting unit (19) is configured to include a laser light source (61) and a beam expander (63) that enlarges or reduces the beam diameter of a laser (LS) emitted by the laser light source (61).

Description

Semiconductor manufacturing equipment and film cutting mechanism

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a film cutting mechanism.

[0002] Conventionally, there has been known an apparatus that includes a table on which a silicon wafer (semiconductor wafer) is placed, and a means for cutting a film attached to the semiconductor wafer placed on the table along the outer periphery of the semiconductor wafer (see Patent Document 1).

[0003] Patent No. 4728534

[0004] The above-mentioned device is configured to cut the film by irradiating the film with a laser. Therefore, the quality of the cut edge of the film is affected by the size of the laser spot diameter. If the spot diameter is not appropriate, the quality of the cut edge of the film may be reduced.

[0005] Therefore, it is desirable to provide a semiconductor manufacturing apparatus that can improve the quality of the cut edge surface of the film.

[0006] A semiconductor manufacturing apparatus according to an embodiment of the present invention comprises a table on which a semiconductor wafer is placed, and a film cutting mechanism that uses a laser to cut a film attached to the semiconductor wafer placed on the table, the film cutting mechanism including a laser light source and a beam expander that expands or reduces the beam diameter of the laser emitted by the laser light source.

[0007] The above-described semiconductor manufacturing apparatus can improve the quality of the cut end surface of the film.

[0008] FIG. 1 is a side view of a film bonding device according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating the function of a control unit mounted on the film bonding device. FIG. 3 is a diagram illustrating a pressing pattern. FIG. 4 is a side view of the film bonding device when the moving unit has moved to the left end side. FIG. 5 is a side view of the film bonding device when the moving unit has moved to the right end side. FIG. 6 is a diagram illustrating an example of a film trimmed by a cutting unit. FIG. 7 is a diagram illustrating a configuration example of a hollow structure. FIG. 8 is a diagram illustrating a configuration example of a hollow structure. FIG. 9 is a diagram illustrating a configuration example of a lifting support mechanism. FIG. 10 is a right side view of an outer periphery support member and a lifting support mechanism. FIG. 11 is a bottom view of an outer periphery support member and a lifting support mechanism. FIG. 12 is a top view of a semiconductor wafer and an outer periphery support member placed on a table. FIG. 13 is a perspective view of a cutting unit. FIG. 14 is a top view, a rear view, and a right side view of the cutting unit. FIG. 15 is a diagram illustrating a configuration example of a laser unit. FIG. 16 is a cross-sectional view of the laser unit. FIG. 17 is a diagram illustrating a configuration example of an upper discharge system. FIG. 18 is a diagram illustrating a configuration example of a lower discharge system. FIG. 19 is a cross-sectional view of the discharge system.

[0009] First, a film bonding apparatus 1, which is an example of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure, will be described with reference to Fig. 1. Fig. 1 is a schematic diagram of the film bonding apparatus 1.

[0010] The film bonding device 1 is an apparatus used when bonding a film such as a photoresist film 6 to a semiconductor wafer W. It includes a table 2 that is circular in plan view and on which the semiconductor wafer W, which is circular in plan view, is placed. A film supply unit 3 and a winding unit 4 are arranged diagonally above the table 2 at a predetermined distance. A three-layer film F3 is supplied from the film supply unit 3. In the illustrated example, the three-layer film F3 is formed by laminating a carrier film 7 on one surface of a heat-sensitive photoresist film 6 and a reinforcing film 8 on the other surface. The carrier film 7 is peeled off from the three-layer film F3 by a pinch roller 9, resulting in a two-layer film F2. The two-layer film F2 is then pressed and bonded to the surface of the semiconductor wafer W, and the reinforcing film 8 is then peeled off from the two-layer film F2 by horizontal movement of a moving unit (described below).

[0011] The table 2 is configured to be raised and lowered by a table lifting mechanism TLM including slide rods 10, a substrate 11, and supports 12. Specifically, the table 2 is fixed to the upper ends of four slide rods 10, which are supported on a frame (not shown) so as to be freely raised and lowered, via the substrates 11 and supports 12. The table 2 is raised and lowered by raising and lowering the slide rods 10 with the driving force of a driving source (not shown), such as an air cylinder. The table 2 also has a portion of an intake passage formed therein, one end of which opens to the mounting surface and the other end of which is connected to a suction source (not shown), such as a pump. In the illustrated example, the intake passage includes a groove 2G (see FIG. 9 ) formed in the mounting surface (top surface) of the table 2 and a plurality of through-holes (holes vertically penetrating the table 2) formed within the groove 2G. Therefore, the semiconductor wafer W is attracted to the table 2 by the suction action of the suction source.

[0012] As shown in FIG. 1 , a single slide shaft 15 extending horizontally (perpendicular to the rotation axis of the pinch roller 9) is disposed on one side of the table 2 in a direction parallel to the rotation axis of the pinch roller 9. A moving unit including a first moving unit 16, a second moving unit 17, and a third moving unit 18 is slidably supported on this slide shaft 15. The moving units are configured to move horizontally by the driving force of a driving source (not shown), such as an air cylinder. Also, above the table 2, a cutting unit 19 is provided so as to be horizontally movable, serving as a film cutting mechanism that uses a laser to trim the photoresist film 6 attached to the semiconductor wafer W. The cutting unit 19 may include a blade for cutting the film instead of a device that emits a laser to cut the film.

[0013] The third moving unit 18 has a pressure roller 20 that presses the photoresist film 6 to be applied to the front surface of the semiconductor wafer W on the table 2. The pressure roller 20 is an example of a pressing member, and at least the roller surface of the pressure roller 20 is formed of an elastic material such as rubber. The film bonding device 1 can apply the two-layer film F2 to the front surface of the semiconductor wafer W on the table 2 by moving the moving unit (see FIG. 1) located at one end (right end) of the slide shaft 15 to the other end (left end) of the slide shaft 15 as shown in FIG. 4. The film bonding device 1 can also bond the two-layer film F2 to the front surface of the semiconductor wafer W by pressing it with the pressure roller 20.

[0014] The pressure roller 20 may be configured so that its pressure is adjusted by a pressure adjustment mechanism 21 in accordance with the pressing area of ​​the semiconductor wafer W (the contact area between the pressure roller 20 and the semiconductor wafer W). In the illustrated example, the pressure adjustment mechanism 21 includes a pressing cylinder 22 having a piston rod 22a. The tip of the piston rod 22a is connected to a support member (not shown) that rotatably supports the pressure roller 20. The pressing cylinder 22 is an example of a pressing drive source, and a fluid supply source such as a pump supplies a fluid in an amount corresponding to the pressing area of ​​the semiconductor wafer W, thereby finely adjusting the extension and retraction movement of the piston rod 22a.

[0015] A rectangular, annular outer support member 5 is provided on the outer periphery of the table 2. The outer support member 5, also called a bumper member, has an upper surface 5a that functions as a contact surface against which the pressure roller 20 contacts when pressing the photoresist film 6. The outer support member 5 is supported so as to be movable up and down by a lifting support mechanism 25 including a rotation motor 35, and the heights of the four corners of the outer support member 5 can be adjusted separately. In the illustrated example, the outer support member 5 is also called a digital bumper because its height level is adjusted by computer control. A portion of an exhaust passage 13 is formed between the table 2 and the outer support member 5. One end of the exhaust passage 13 is open to the mounting surface, and the other end of the exhaust passage 13 is connected to an exhaust device 14, such as an exhaust fan or an exhaust pump. In the illustrated example, the exhaust passage 13 is a passage for exhausting smoke and other substances generated when the film is cut by the laser-based cutting unit 19. It includes an annular gap 13G (see FIG. 9 ) between the table 2 and the outer support member 5 and a pipe 13D (see FIG. 9 ) connected to the side of the outer support member 5. That is, in the illustrated example, the exhaust device 14 and the exhaust passage 13 (pipe 13D and gap 13G) constitute a lower discharge system EXD (air knife), which is part of the discharge system EX for removing unwanted matter, such as foreign matter, generated when the film is cut by the cutting unit 19. Foreign matter generated when the film is cut by the cutting unit 19 includes smoke generated by heating the film with the laser. This configuration allows the air flowing through the exhaust passage 13 to instantly cool the cut surface of the film cut by the cutting unit 19, thereby achieving a clean cut surface free of burrs and other impurities.

[0016] Next, the functions of the film bonding device 1 will be described with reference to FIG. 2 . FIG. 2 is a block diagram illustrating the functions of a control unit 40 installed in the film bonding device 1. Specifically, the film bonding device 1 has the control unit 40 that controls functions related to the bonding of the film. In the illustrated example, the control unit 40 is a microcomputer including a CPU, a memory, and the like. The control unit 40 is connected to a rotation motor 35, a pressing cylinder 22, and an input unit 41. The input unit 41 is, for example, a keyboard, a mouse, or a fingertip operation unit. The control unit 40 also has a height level memory unit 42 that stores multiple height levels of the outer periphery support member 5 that are predetermined depending on the shape or size of the semiconductor wafer W, and a pressing pattern memory unit 43 that stores multiple pressing patterns that are predetermined depending on the shape or size of the semiconductor wafer W.

[0017] In the illustrated example, the control unit 40 first determines whether or not a height level switching command has been input from the input unit 41. Then, when a height level switching command is input from the input unit 41, the control unit 40 determines a predetermined height level corresponding to the switching command from among a plurality of height levels stored in the height level storage unit 42. Thereafter, the control unit 40 drives the rotation motor 35 to achieve the determined predetermined height level.

[0018] The control unit 40 also determines whether or not a pressing pattern switching command has been input from the input unit 41. When a pressing pattern switching command is input from the input unit 41, the control unit 40 determines a predetermined pressing pattern corresponding to the switching command from among a plurality of pressing patterns stored in the pressing pattern storage unit 43. Thereafter, the control unit 40 drives the pressing cylinder 22 so as to achieve the determined predetermined pressing pattern.

[0019] In this way, in the film bonding device 1, when a height level switching command corresponding to the shape of the semiconductor wafer W to be used is input to the control unit 40, a predetermined height level corresponding to the switching command is determined, and the rotation motor 35, which is the drive source of the lifting support mechanism 25, is driven. As a result, the outer peripheral support member 5 is lifted and lowered, and the outer peripheral support member 5 is positioned at the predetermined height level.

[0020] In the film bonding device 1, when a pressure pattern switching command corresponding to the shape of the semiconductor wafer W to be used is input to the control unit 40, a predetermined pressure pattern corresponding to the switching command is determined. In the illustrated example, as shown in Figure 3, a pressure pattern P1 corresponding to a semiconductor wafer W that is circular in plan view is determined.

[0021] Next, the film laminating process will be described. First, as shown in FIG. 4 , the film laminating device 1 causes the moving units (first moving unit 16, second moving unit 17, and third moving unit 18) located at one end (right end) of the slide shaft 15 to simultaneously travel toward the other end (left end) of the slide shaft 15. Then, the two-layer film F2 supplied from the film supply unit 3 is applied to the front surface of the semiconductor wafer W on the table 2, and the pressure roller 20 of the third moving unit 18 presses the two-layer film F2 against the front surface of the semiconductor wafer W in the pressure pattern P1 (see FIG. 3 ) to be laminated. During the pressing of the two-layer film F2, the pressure roller 20 rolls over the upper surface 5a of the outer peripheral support member 5, the height of which has been adjusted, while being in contact with the upper surface 5a. The upper surface 5a of the outer peripheral support member 5 may be coated with Teflon (registered trademark) or Tosical (registered trademark) to make it easier to peel off the attached film.

[0022] Next, as shown in FIG. 5 , the film bonding apparatus 1 retracts the second moving unit 17 and the third moving unit 18 to their original positions, thereby peeling off the reinforcement film 8 from the two-layer film F2 on the semiconductor wafer W. As a result, only the photoresist film 6 remains on the surface of the semiconductor wafer W. The film bonding apparatus 1 then moves the cutting unit 19 horizontally along the outer periphery of the semiconductor wafer W and irradiates it with a laser to trim the photoresist film 6 (see FIG. 6 ). The remaining film, i.e., the portion of the photoresist film 6 other than the portion that is bonded to the surface of the semiconductor wafer W, is peeled off by the first moving unit 16, which functions as a removal head, and taken up by the take-up unit 4. As a result, the film bonding apparatus 1 can obtain the semiconductor wafer W to which the photoresist film 6 is bonded.

[0023] In the illustrated example, the photoresist film 6 attached to the surface of the semiconductor wafer W is then subjected to exposure, removal, and other processes, and a pre-cured wall portion 81 is formed on the semiconductor wafer W as shown in FIG. 7 . Next, a height level switching command corresponding to the semiconductor wafer W having the wall portion 81 is input to the control unit 40, and the outer peripheral support member 5 is adjusted to a predetermined height level. In addition, a pressing pattern switching command corresponding to the semiconductor wafer W having the wall portion 81 is input to the control unit 40, and a predetermined pressing pattern is determined. Next, the semiconductor wafer W having the wall portion 81 is again subjected to the film attachment process as described above, and a semiconductor wafer W with another photoresist film 6 attached on the wall portion 81 is obtained. Thereafter, the photoresist film 6 attached on the wall portion 81 is subjected to exposure, removal, and other processes, and a hollow structure 80 consisting of the wall portion 81 and a roof portion 82 is formed on the semiconductor wafer W as shown in FIG. 8 .

[0024] In the illustrated example, the height level and pressure pattern are different between the first film application process and the second film application process, but they may be the same, or only one may be different.

[0025] Furthermore, the film laminating device 1 is configured to abut the pressure roller 20 against the upper surface 5a of the outer peripheral support member 5, the height of which is adjusted, when pressing the photoresist film 6. Therefore, the film laminating device 1 can prevent the pressure roller 20 from excessively pressing the photoresist film 6, and can laminate the thin, soft photoresist film 6 in multiple layers while minimizing mechanical stress on the underlying layers. In particular, when laminating the photoresist film 6 that will become the wall portion 81 of the hollow structure 80, the film laminating device 1 can effectively absorb the unevenness (surface pattern) on the front surface of the semiconductor wafer W, thereby minimizing mechanical stress on the semiconductor wafer W. Furthermore, when laminating the photoresist film 6 that will become the roof portion 82 of the hollow structure 80, the film laminating device 1 can effectively absorb the unevenness (surface pattern) of the pre-cured wall portion 81, thereby minimizing mechanical stress on the semiconductor wafer W and the wall portion 81.

[0026] Furthermore, the film bonding device 1 is configured so that the outer peripheral support member 5 can be raised and lowered by the lifting support mechanism 25 including the rotation motor 35 to position the outer peripheral support member 5 at a predetermined height level. Therefore, the film bonding device 1 can stably bond a film to semiconductor wafers W of various shapes. As a result, the film bonding device 1 can form a hollow structure 80 with an extremely thin film thickness (e.g., approximately 50 μm) and excellent thickness accuracy on the semiconductor wafer W with a high yield. In particular, the film bonding device 1 can form a good hollow structure 80 over substantially the entire surface of the semiconductor wafer W. Furthermore, the film bonding device 1 can form a hollow structure 80 with an even thicker film thickness (e.g., approximately 100 μm) by bonding three or more layers of photoresist film 6.

[0027] Furthermore, the film bonding device 1 is configured so that the pressing force of the pressure roller 20 can be adjusted in accordance with the pressing area of ​​the semiconductor wafer W by a pressing force adjustment mechanism 21 including a pressing cylinder 22. Therefore, the film bonding device 1 can stably bond films to semiconductor wafers W of a wider variety of shapes.

[0028] Furthermore, the film bonding device 1 is configured such that the control unit 40 is provided with a height level memory unit 42 and a pressure pattern memory unit 43, and the height level and pressure pattern can be selected according to the shape of the semiconductor wafer W to be used, based on input information input to the control unit 40. Therefore, the film bonding device 1 can stably bond films to semiconductor wafers W of a wider variety of shapes.

[0029] Next, with reference to FIGS. 9 to 11 , an example configuration of the lifting support mechanism 25 that lifts and lowers the outer periphery support member 5 will be described. FIG. 9 is a diagram illustrating an example configuration of the lifting support mechanism 25. Specifically, the upper view of FIG. 9 is a perspective view of the table 2, the outer periphery support member 5, the tube 13D, the lifting support mechanism 25, and the table lifting mechanism TLM. The lower view of FIG. 9 is a perspective view of the outer periphery support member 5 and the lifting support mechanism 25, and corresponds to the upper view of FIG. 9 with the table 2, the tube 13D, and the table lifting mechanism TLM removed. Furthermore, for clarity, the side cover 5C, which is one of the components of the outer periphery support member 5, is not illustrated in the lower view of FIG. 9 .

[0030] In FIG. 9 , X1 represents one direction of the X axis constituting a three-dimensional Cartesian coordinate system, and X2 represents the other direction of the X axis. Furthermore, Y1 represents one direction of the Y axis constituting the three-dimensional Cartesian coordinate system, and Y2 represents the other direction of the Y axis. Similarly, Z1 represents one direction of the Z axis constituting the three-dimensional Cartesian coordinate system, and Z2 represents the other direction of the Z axis. In FIG. 9 , the X1 side of the outer peripheral support member 5 corresponds to the front side (front surface side) of the outer peripheral support member 5, and the X2 side of the outer peripheral support member 5 corresponds to the rear side (rear surface side) of the outer peripheral support member 5. Furthermore, the Y1 side of the outer peripheral support member 5 corresponds to the left side of the outer peripheral support member 5, and the Y2 side of the outer peripheral support member 5 corresponds to the right side of the outer peripheral support member 5. Furthermore, the Z1 side of the outer peripheral support member 5 corresponds to the upper side of the outer peripheral support member 5, and the Z2 side of the outer peripheral support member 5 corresponds to the lower side of the outer peripheral support member 5. The same applies to other members in other figures.

[0031] Fig. 10 is a right side view of the outer peripheral support member 5 and the lifting support mechanism 25. For clarity, Fig. 10 omits the side cover 5C, as in the lower view of Fig. 9 . Fig. 11 is a bottom view of the outer peripheral support member 5 and the lifting support mechanism 25. For clarity, Fig. 11 omits the side cover 5C and some of the components of the lifting support mechanism 25 (the mounting piece 34 and the rotation motor 35).

[0032] In the illustrated example, the outer periphery support member 5 includes a base plate 5B, a side cover 5C, a pedestal portion 5D, a top plate portion 5T, and an outer periphery wall portion 5W, as shown in Fig. 9. Note that, for clarity, in Figs. 10 and 11, a cross pattern is applied to the base plate 5B, a fine dot pattern is applied to the pedestal portion 5D, and a coarse dot pattern is applied to the top plate portion 5T and the outer periphery wall portion 5W. As shown in the lower diagram of Fig. 9, the lifting support mechanism 25 includes a lifting mechanism LM that lifts and lowers the outer periphery support member 5, and a support mechanism 50 that supports the outer periphery support member 5.

[0033] Specifically, as shown in the lower diagram of Fig. 9, the lifting mechanism LM includes an attachment piece 34, a rotation motor 35, a transmission belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB (not visible in the lower diagram of Fig. 9), and a right rear driven pulley 39RB. The tension pulley 38 includes a left tension pulley 38L arranged between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R arranged between the drive pulley 37 and the right front driven pulley 39RF.

[0034] The support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB (not visible in the lower view of FIG. 9 ), and a right rear support mechanism 50RB. In the illustrated example, the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have the same structure (the same shape and the same size). Specifically, as shown in FIG. 10 , the support mechanism 50 includes a nut 51, a screw 52, ​​a bearing 53, and a spacer 54.

[0035] The base plate 5B of the outer peripheral support member 5 is a member that supports the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W via the support mechanism 50. In the illustrated example, the base plate 5B is fixed to a support portion 12 (see FIG. 1) of the table lifting mechanism TLM and can be raised and lowered together with the support portion 12 by the table lifting mechanism TLM. Specifically, as shown in FIG. 11 , the base plate 5B is a metal plate having a substantially rectangular outer shape in a plan view, including four corners CN (first corner CN1 to fourth corner CN4) and a center portion CF in which a rectangular opening 5K is formed.

[0036] The side cover 5C of the outer periphery support member 5 is a part that forms the side surface of the outer periphery support member 5. In the illustrated example, the side cover 5C is attached to the base plate 5B so as to cover the base plate 5B and the support mechanism 50, as shown in the upper diagram of FIG.

[0037] The pedestal portion 5D of the outer periphery side support member 5 functions as a pedestal for the top plate portion 5T of the outer periphery side support member 5, and is supported by a support mechanism 50 fixed to the base plate 5B. In the illustrated example, the pedestal portion 5D is a metal plate that has a substantially rectangular ring shape in a plan view and has a circular opening for receiving the table 2.

[0038] The top plate portion 5T of the outer periphery support member 5 is a portion fixed to the upper side of the base portion 5D. In the illustrated example, the top plate portion 5T is a metal plate that has a substantially rectangular ring shape in a plan view and has a circular opening for receiving the table 2, similar to the base portion 5D.

[0039] The outer peripheral wall 5W of the outer peripheral support member 5 constitutes a part of the exhaust passage 13. In the illustrated example, the outer peripheral wall 5W is a metal member shaped like an open box having an octagonal bottom wall and an octagonal cylindrical side wall in a plan view. The octagonal cylindrical side wall is configured to connect four tubes 13D (first tube 13D1 to fourth tube 13D4). The upper end of the octagonal cylindrical side wall is configured to be fixed to the base 5D.

[0040] In this way, the outer periphery support member 5 is configured so that the pedestal portion 5D, the top plate portion 5T, and the outer periphery wall portion 5W can be raised and lowered relative to the base plate 5B by the support mechanism 50. Specifically, as shown in Fig. 10, a bearing 53 of the support mechanism 50 is fixed to the base plate 5B. In the illustrated example, the bearing 53 is a ball bearing, and the inner ring is fixed to the screw 52 and the outer ring is fixed to the base plate 5B.

[0041] 10 , a nut 51 of the support mechanism 50 is fixed to the base portion 5D by a bolt BT. In the illustrated example, the nut 51 is a trapezoidal screw nut, and constitutes a height adjustment mechanism HAM in cooperation with a trapezoidal screw 52. The height adjustment mechanism HAM is configured such that the nut 51 moves upward (toward Z1) when the screw 52 rotates in one direction around the rotation axis AX, and moves downward (toward Z2) when the screw 52 rotates in the other direction around the rotation axis AX.

[0042] In the illustrated example, as shown in the lower diagram of Figure 9, the support mechanism 50 includes a left front support mechanism 50LF fixed to a first corner CN1 of the base plate 5B, a right front support mechanism 50RF fixed to a second corner CN2 of the base plate 5B, a right rear support mechanism 50RB fixed to a third corner CN3 of the base plate 5B, and a left rear support mechanism 50LB (not visible in Figure 9) fixed to a fourth corner CN4 of the base plate 5B (not visible in the lower diagram of Figure 9, so see Figure 11).

[0043] Specifically, as shown in FIG. 11 , the left front support mechanism 50LF is configured to be able to rotate the screw 52 around a first rotation axis AX1, the right front support mechanism 50RF is configured to be able to rotate the screw 52 around a second rotation axis AX2, the right rear support mechanism 50RB is configured to be able to rotate the screw 52 around a third rotation axis AX3, and the left rear support mechanism 50LB is configured to be able to rotate the screw 52 around a fourth rotation axis AX4.

[0044] 11, the first to fourth rotation axes AX1 to AX4 are arranged so that the distances DS from the central axis CA that passes through the center of the table 2 are equal to each other. The first to fourth rotation axes AX1 to AX4 are also arranged so that the angles (central angles) between the central axis CA and each of the line segments that connects the central axis CA to each of the first to fourth rotation axes AX1 to AX4 are equal to each other, θ (90 degrees).

[0045] An operator adjusting the height of the outer peripheral support member 5 can separately adjust the height of each of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5 as shown in the upper diagram of Figure 9 by, for example, manually rotating the screws 52 of the height adjustment mechanisms HAM in each of the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB.

[0046] The lifting mechanism LM is configured to be able to lift and lower the outer periphery support member 5 by utilizing the height adjustment mechanism HAM of the support mechanism 50. Specifically, as described above, the lifting mechanism LM includes the attachment piece 34, the rotation motor 35, the transmission belt 36, the drive pulley 37, the tension pulley 38, and the driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB, and a right rear driven pulley 39RB. The left front driven pulley 39LF, the right front driven pulley 39RF, the left rear driven pulley 39LB, and the right rear driven pulley 39RB have the same structure (the same shape and the same size). The tension pulleys 38 include a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF. The left tension pulley 38L and the right tension pulley 38R have the same structure (the same shape and the same size).

[0047] In the illustrated example, the mounting piece 34 of the lifting mechanism LM is a metal plate to which a rotation motor 35, a drive pulley 37, and a tension pulley 38 are attached, and is fixed to the base plate 5B of the outer periphery support member 5 via a bracket 34a (see FIG. 10 ). The rotation motor 35 is a drive unit for rotating the drive pulley 37 and is attached to the underside of the mounting piece 34. The transmission belt 36 is a belt for transmitting the rotational force of the drive pulley 37 to the driven pulley 39. The drive pulley 37 is a member for rotating the driven pulley 39 via the transmission belt 36. The tension pulleys 38 (left tension pulley 38L and right tension pulley 38R) are members for adjusting the tension of the transmission belt 36. The drive pulley 37, left tension pulley 38L, and right tension pulley 38R are attached to the upper surface of the mounting piece 34. The driven pulley 39 is a member for transmitting the rotational force to the screw 52 of the support mechanism 50.

[0048] In the illustrated example, the driven pulleys 39 include a left front driven pulley 39LF fixed to the screw 52 of the left front support mechanism 50LF, a right front driven pulley 39RF fixed to the screw 52 of the right front support mechanism 50RF, a left rear driven pulley 39LB fixed to the screw 52 of the left rear support mechanism 50LB, and a right rear driven pulley 39RB fixed to the screw 52 of the right rear support mechanism 50RB. Specifically, the left rear driven pulley 39LB includes a fixed portion and a rotating portion that rotates relative to the fixed portion. The fixed portion is fixed to the lower surface of the base plate 5B of the outer periphery support member 5 via a spacer 54. The rotating portion is fixed to the lower end of the screw 52 so as to rotate integrally with the screw 52. The same applies to the left front driven pulley 39LF, the right front driven pulley 39RF, and the right rear driven pulley 39RB.

[0049] With this configuration, the lifting mechanism LM can rotate the four driven pulleys 39 simultaneously at the same rotational speed and in the same direction by rotating the drive pulley 37 using the rotation motor 35. That is, the lifting mechanism LM can simultaneously rotate the screws 52 of the four support mechanisms simultaneously at the same rotational speed and in the same direction. Therefore, the lifting mechanism LM can raise and lower the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer periphery support member 5 at the same lifting speed.

[0050] Note that height adjustment of the first corner 5N1 using the left front support mechanism 50LF is typically performed while the screws 52 of the three support mechanisms 50 other than the left front support mechanism 50LF are not rotating. This is to prevent the height of the other corners 5N from changing due to height adjustment of the first corner 5N1. The same applies to height adjustments using the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB. Therefore, in the illustrated example, the lifting mechanism LM is configured to be able to disengage the transmission belt 36 from the driven pulley 39. Specifically, the lifting mechanism LM is configured to adjust the position of the tension pulley 38 using the position adjustment bolt BT2 (see the lower diagram in Figure 9 ), specifically, to loosen the tension of the transmission belt 36, thereby allowing the transmission belt 36 to be removed from the driven pulley 39.

[0051] With this configuration, for example, when adjusting the height of the first corner portion 5N1 using the left front support mechanism 50LF, the worker can release the engagement between the left front driven pulley 39LF, which is fixed to the screw 52 of the left front support mechanism 50LF, and the transmission belt 36. Therefore, the worker can rotate only the screw 52 of the left front support mechanism 50LF alone, without rotating the screws 52 of the other support mechanisms 50, and can adjust the height of only the first corner portion 5N1 without changing the heights of the other corners 5N.

[0052] However, the driven pulley 39 may be configured to be switchable between a state in which the screw 52 and the driven pulley 39 can rotate integrally (a state in which they cannot rotate relative to each other) and a state in which the screw 52 and the driven pulley 39 can rotate relative to each other. In this case, the operator can rotate only the screw 52 of the remaining support mechanism 50 without rotating the screws 52 of the three support mechanisms 50, without disengaging the transmission belt 36 from the driven pulley 39.

[0053] With the above-described configuration, the support mechanism 50 including the four height adjustment mechanisms HAM provides the advantage that, for example, an operator can flexibly adjust the levelness of the upper surface 5 a of the outer periphery support member 5. Furthermore, because the rotation axis AX of the height adjustment mechanism HAM (screw 52) also functions as a support axis, the support mechanism 50 provides the advantage of being simpler in structure than a configuration in which a support axis is provided separately from the rotation axis of the height adjustment mechanism.

[0054] Furthermore, the nuts 51 and screws 52 that constitute the height adjustment mechanism HAM have a relatively small diameter (e.g., 12 mm), and therefore may be standardized products (commercially available nuts and screws). This configuration therefore has the effect of improving the accuracy of height adjustment by the height adjustment mechanism HAM while suppressing an increase in the manufacturing cost of the support mechanism 50.

[0055] In the above embodiment, a combination of a trapezoidal screw nut and a trapezoidal screw is used as the height adjustment mechanism HAM, but other mechanisms such as a ball screw may also be used.

[0056] Furthermore, with the above-described configuration, the lifting mechanism LM has the effect of enabling an operator to raise and lower the outer peripheral support member 5, for example, by using the support mechanism 50 including four height adjustment mechanisms HAM.

[0057] In the above embodiment, the lifting mechanism LM is configured to simultaneously operate the four height adjustment mechanisms HAM using one rotation motor 35. However, it may be configured to separately operate the four height adjustment mechanisms HAM using four rotation motors. In this case, the transmission belt 36, the drive pulley 37, the tension pulley 38, and the driven pulley 39 may be omitted.

[0058] Furthermore, in the above-described embodiment, the lifting mechanism LM is configured to be able to lift and lower the outer periphery side support member 5 by operating the height adjustment mechanism HAM using the driven pulley 39. Therefore, this configuration has the effect of enabling an operator to easily change the lifting resolution of the outer periphery side support member 5. This is because the lifting resolution can be changed by changing the number of teeth of the driven pulley 39.

[0059] Next, an example of the shape and size of the top plate 5T of the outer peripheral support member 5 in a plan view will be described with reference to FIG. 12 . FIG. 12 is a top view of the semiconductor wafer W placed on the table 2 and the top plate 5T of the outer peripheral support member 5. Note that in FIG. 12 , for clarity, a dot pattern is applied to the top surface of the semiconductor wafer W. Also, in FIG. 12 , the size of the pressure roller 20 in a plan view is represented by a dashed line, and a cross pattern is applied to the range CZ (contact area) where the pressure roller 20 contacts the semiconductor wafer W and the top plate 5T. Note that in the illustrated example, the pressure roller 20 is configured to be movable in the X-axis direction while rolling.

[0060] In the illustrated example, the top plate portion 5T has a substantially rectangular outer shape in a plan view, and is configured so that the width W1 in the direction along the rotation axis of the pressure roller 20 (Y-axis direction) is smaller than the width W2 of the pressure roller 20. However, the width W1 of the top plate portion 5T may be configured so that it is larger than the width W2 of the pressure roller 20, or may be configured so that it is the same as the width W2 of the pressure roller 20.

[0061] This configuration has the effect of keeping the total contact area, which is the sum of the contact area between the semiconductor wafer W and the pressure roller 20 (first contact area) and the contact area between the top plate portion 5T and the pressure roller 20 (second contact area), constant regardless of the position of the pressure roller 20 in the X-axis direction. This means that if the pressing force of the pressure roller 20 is constant, the pressing force per unit contact area within the first contact area can be kept constant regardless of the position of the pressure roller 20 in the X-axis direction. Therefore, this configuration makes it possible to uniformly apply a film such as the photoresist film 6 to the semiconductor wafer W placed on the table 2.

[0062] In the illustrated example, the top plate 5T is configured to have a shape that is line-symmetrical with respect to a dashed line L2 that passes through the central axis CA and is parallel to the X axis. This configuration has the advantage that the size of a portion of the first contact area (first left contact area) on one side of the second contact area (Y1 side, left side) and the size of the remaining portion of the first contact area (first right contact area) on the other side of the second contact area (Y2 side, right side) can be made the same, regardless of the position of the pressure roller 20 in the X axis direction. This means that variation in the pressure force of the pressure roller 20 in the Y axis direction can be suppressed. Therefore, this configuration allows a film such as the photoresist film 6 to be uniformly applied to the semiconductor wafer W placed on the table 2.

[0063] Furthermore, in the film sticking device 1, since the top panel 5T has a substantially rectangular outer shape in a plan view, compared to a case in which the top panel has a circular outer shape in a plan view, the size of the upper surface 5a of the top panel 5T can be reduced while still achieving four-point support by the support mechanism 50. However, the top panel 5T may be configured to have an outer shape other than a substantially rectangular shape in a plan view (for example, an outer shape such as a circle, a hexagon, or an octagon).

[0064] Next, the cutting unit 19 will be described in detail with reference to FIGS. 13 and 14 . FIG. 13 is a perspective view showing an example of the configuration of the cutting unit 19 disposed above the table 2 and the outer periphery support member 5. Specifically, the left view of FIG. 13 is a perspective view of the table 2, outer periphery support member 5, cutting unit 19, lifting support mechanism 25, and table lifting mechanism TLM as viewed diagonally from above right, and the right view of FIG. 13 is a perspective view of the table 2, outer periphery support member 5, cutting unit 19, lifting support mechanism 25, and table lifting mechanism TLM as viewed diagonally from above left. FIG. 14 is a three-view diagram (top view, rear view, and right side view) of the cutting unit 19 in FIG. 13 . Note that, for clarity, dot patterns are applied to flat plate-like members supporting each member, such as the support plate 19B, in FIGS. 13 and 14 .

[0065] Specifically, the cutting unit 19 includes a support plate 19B, a first linear motion device 19X, a second linear motion device 19Y, and a laser unit 19L.

[0066] The support plate 19B is a member that supports each component constituting the cutting unit 19. In the illustrated example, the support plate 19B is a flat metal member that includes a first support plate 19B1, a second support plate 19B2, and a third support plate 19B3. The first support plate 19B1 is a member that supports the entire cutting unit 19 and is disposed so as to extend parallel to the XZ plane. The second support plate 19B2 is a member to which the first linear motion device 19X is attached. The second support plate 19B2 extends parallel to the XY plane and is attached to the left side surface (the side surface on the Y1 side) of the first support plate 19B1 via a first bracket BR1, as shown in the rear view of FIG. 14. The third support plate 19B3 is a member to which the second linear motion device 19Y is attached. The third support plate 19B3 extends parallel to the XY plane and is attached to a first guide block 19XG, which is a movable part of the first linear motion device 19X, as shown in the rear view of FIG. 14.

[0067] The first linear motion device 19X is a device for moving the movable part along the X-axis direction. In the illustrated example, the first linear motion device 19X is an electric linear actuator and includes a first guide block 19XG as a movable part and a first guide rail 19XR as a fixed part. The second linear motion device 19Y is a device for moving the movable part along the Y-axis direction. In the illustrated example, the second linear motion device 19Y is an electric linear actuator and includes a second guide block 19YG as a movable part and a second guide rail 19YR as a fixed part. As shown in the right side view of FIG. 14 , the second guide rail 19YR is fixed to the third support plate 19B3 via a second bracket BR2. The first linear motion device 19X and the second linear motion device 19Y are configured to operate in response to commands from the control unit 40.

[0068] Laser unit 19L is a device for emitting a laser beam toward the film. In the illustrated example, laser unit 19L is configured so that it can be translated in the X-axis direction by first linear motion device 19X and so that it can be translated in the Y-axis direction by second linear motion device 19Y. In other words, laser unit 19L is configured so that it can be translated along the XY plane above table 2 and outer periphery support member 5.

[0069] Here, the laser unit 19L will be described in detail with reference to Fig. 15 and Fig. 16. Fig. 15 is a perspective view showing an example of the configuration of the laser unit 19L. Fig. 16 is a diagram showing a cross section of the laser unit 19L in a virtual plane parallel to the YZ plane including the optical axis OA in Fig. 15, as viewed from the X1 side.

[0070] As shown in Figures 15 and 16, the laser unit 19L is composed of a support plate 60, a laser light source 61, a cooling fan 62, a beam expander 63, a cover 64, a linear motion device 65, a focusing lens 66, a lens holder 67, a lens cover 68, and an upper exhaust system EXU.

[0071] The support plate 60 is a member that supports each component that constitutes the laser unit 19L. In the illustrated example, the support plate 60 is a flat metal member that includes a first support plate 60A, a second support plate 60B, a third support plate 60C, and a fourth support plate 60D. The first support plate 60A is a member that supports the laser light source 61 and is disposed so as to extend parallel to the YZ plane. The second support plate 60B is a member to which the cooling fan 62 is attached and extends parallel to the XZ plane and is attached to the first support plate 60A so as to be perpendicular to the first support plate 60A. The third support plate 60C is a member to which the linear motion device 65 is attached and extends parallel to the XZ plane so as to face the cooling fan 62 attached to the second support plate 60B across the laser light source 61 and is attached to the first support plate 60A so as to be perpendicular to the first support plate 60A. The fourth support plate 60D is a member to which the upper discharge system EXU is attached, and is fixed to the movable part 65M of the linear motion device 65 by fastening parts such as bolts, and is arranged to extend parallel to the XY plane.

[0072] The laser light source 61 is a device that emits a laser LS. In the illustrated example, the laser light source 61 is configured to emit a laser LS (carbon dioxide laser) downward along an optical axis OA extending in the Z-axis direction. The laser light source 61 is also configured to operate in response to commands from the control unit 40. The laser LS may be a laser other than a carbon dioxide laser, such as a fiber laser, a YAG laser, or an ultraviolet laser. The laser light source 61 may also be configured to change the direction of the laser LS. In other words, the laser light source 61 may be configured to scan the photoresist film 6 with the laser LS. The laser light source 61 may also be configured to adjust the intensity of the laser LS in response to commands from the control unit 40.

[0073] The cooling fan 62 is a device that cools the laser light source 61. In the illustrated example, the cooling fan 62 is an electric fan that is configured to operate in response to a command from the control unit 40.

[0074] The beam expander 63 is an optical device that expands or reduces the beam diameter of the laser LS emitted by the laser light source 61. In the illustrated example, the beam expander 63 is configured to expand the beam diameter of the laser LS emitted by the laser light source 61 and allow the laser LS with the expanded beam diameter to be incident on a condenser lens 66.

[0075] The cover 64 is a member that covers the beam expander 63. In the illustrated example, the cover 64 is an L-shaped metal plate, and is fastened to the third support plate 60C by fastening parts such as bolts.

[0076] The linear motion device 65 is a device for moving the movable part along the Z-axis direction. In the illustrated example, the linear motion device 65 is an electric linear actuator, and is configured to operate in response to commands from the control unit 40. Specifically, the linear motion device 65 includes a fixed part 65F and a movable part 65M, and is configured to be able to move the movable part 65M up and down relative to the fixed part 65F.

[0077] The condenser lens 66 is an optical element that condenses the laser beam LS. In the illustrated example, the condenser lens 66 is configured to condense the laser beam LS emitted by the laser light source 61 and having a beam diameter expanded by the beam expander 63, so as to form a laser spot on the upper surface of the photoresist film 6.

[0078] The lens holder 67 is a member that holds the condenser lens 66 in cooperation with the lens cover 68. In the illustrated example, the lens holder 67 is fixed to a top plate member 70 of the upper exhaust system EXU by adhesive. However, the lens holder 67 may be fixed to the upper exhaust system EXU by any other method, such as by fastening with a fastening part.

[0079] The lens cover 68 is a member that cooperates with the lens holder 67 to hold the condenser lens 66. In the illustrated example, the lens cover 68 has an opening for passing the laser LS, and is fixed to the upper surface side of the lens holder 67 by fastening parts (not shown).

[0080] The upper discharge system EXU is part of the discharge system EX, which removes unwanted materials such as foreign matter generated when the film is cut by the cutting unit 19. In the illustrated example, the upper discharge system EXU is fixed to the fourth support plate 60D by fastening parts (not shown). Therefore, the control unit 40 can move the upper discharge system EXU up and down by driving the linear motion device 65. Furthermore, because a lens holder 67 is fixed to the upper discharge system EXU, the control unit 40 can move the condenser lens 66 held by the lens holder 67 along the optical axis OA. Therefore, the control unit 40 can drive the linear motion device 65 to adjust the distance between the photoresist film 6 and the condenser lens 66, and can match that distance to the focal length of the condenser lens 66.

[0081] The upper discharge system EXU will now be described in detail with further reference to Fig. 17. Fig. 17 is a perspective view showing an example of the configuration of the upper discharge system EXU.

[0082] As shown in FIG. 17, the upper discharge system EXU includes a top plate member 70, a first side plate member 71, a bottom plate member 72 (see FIG. 16), a second side plate member 73, a curved pipe 74, and a straight pipe 75.

[0083] The top plate member 70 is a member that forms the ceiling of the compartment CM (see FIG. 16 ). The compartment CM is a chamber that confines foreign matter generated when the film is cut by the cutting unit 19 to prevent it from diffusing outside the compartment CM. In the illustrated example, the top plate member 70 is formed from a metal plate and has a shape that is a combination of a semicircle and a rectangle in a plan view.

[0084] The first side plate member 71 is a member that constitutes part of the side wall of the compartment CM. In the illustrated example, the first side plate member 71 is formed of a metal plate and is bent so as to surround the curved portion of the semicircular portion of the top plate member 70 and the short side portion of the rectangular portion.

[0085] The bottom plate member 72 (see FIG. 16) is a member that forms the inner bottom surface of the compartment CM. In the illustrated example, the bottom plate member 72 is formed of a metal plate and is formed to have the same shape and size as the top plate member 70 in a plan view.

[0086] The second side plate member 73 is a member that separates the remaining portion of the side wall of the compartment CM. In the illustrated example, the second side plate member 73 is formed of a metal plate and is disposed so as to contact one of the long sides of the rectangular portion of the top plate member 70.

[0087] Furthermore, a through-hole 70H for passing the laser LS is formed in the top plate member 70. Similarly, a through-hole 72H (see FIG. 16) for passing the laser LS is formed in the bottom plate member 72. Furthermore, a through-hole 73H (see FIG. 16) for discharging foreign matter is formed in the second side plate member 73. In the illustrated example, the diameter of the through-hole 70H is smaller than the diameter of the through-hole 72H and smaller than the diameter of the through-hole 73H. This is to prevent foreign matter from escaping through the through-hole 70H.

[0088] The curved pipe 74 is part of an exhaust passage for discharging foreign matter. In the illustrated example, one end of the curved pipe 74 is connected to the second side plate member 73, and the other end is connected to one end of the straight pipe 75. Specifically, the curved pipe 74 is a 90-degree bent pipe arranged so that the opening on one end (inlet side) faces leftward (Y1 side) and the opening on the other end (outlet side) faces upward (Z1 side). Note that the curved pipe 74 may be a bent pipe having a bend angle other than a 90-degree bend, such as an 80-degree bent pipe or a 100-degree bent pipe.

[0089] The straight pipe 75 is another part of the exhaust passage for discharging foreign matter. In the illustrated example, one end of the straight pipe 75 is connected to the other end of the curved pipe 74, and the other end is connected to one end of a flexible tube (not shown). The other end of the tube is directly or indirectly connected to an exhaust device such as an exhaust fan. The straight pipe 75 may be replaced with a curved pipe or may be omitted.

[0090] In the illustrated example, the upper exhaust system EXU constitutes part of the laser unit 19L and is configured to be movable in the X-axis direction and the Y-axis direction together with the laser light source 61, and is configured to be movable in the Z-axis direction relative to the laser light source 61 by the linear motion device 65. However, the upper exhaust system EXU may be provided separately from the laser unit 19L. That is, the upper exhaust system EXU may be provided independently from the other components constituting the laser unit 19L (the support plate 60, the laser light source 61, the cooling fan 62, the beam expander 63, the cover 64, the linear motion device 65, the condenser lens 66, the lens holder 67, and the lens cover 68) and configured to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. In this case, the upper exhaust system EXU may be configured to be movable in the X-axis direction and the Y-axis direction. That is, the upper exhaust system EXU may be configured not to move in the Z-axis direction.

[0091] Next, details of the lower discharge system EXD will be described with reference to FIG. 18 . FIG. 18 is a diagram showing an example of the configuration of the lower discharge system EXD. Specifically, the upper view of FIG. 18 is a top view of the semiconductor wafer W placed on the upper surface of the table 2 and the photoresist film 6 attached to the upper surface 5a of the outer periphery support member 5. Note that a dot pattern is applied to the photoresist film 6 in the upper view of FIG. 18 for clarity. The center view and lower view of FIG. 18 are cross-sectional views of the table 2, outer periphery support member 5, photoresist film 6, and semiconductor wafer W. Specifically, the center view of FIG. 18 is a view showing the cross section of the table 2, outer periphery support member 5, photoresist film 6, and semiconductor wafer W on an imaginary plane parallel to the XZ plane including the dashed-dotted line L3 in the upper view of FIG. 18 , as viewed from the Y2 side. 18 is a cross-sectional view of the table 2, outer peripheral support member 5, photoresist film 6, and semiconductor wafer W as viewed from the Y2 side on an imaginary plane parallel to the XZ plane including the dashed dotted line L4 in the upper diagram of Fig. 18. Fig. 18 shows the state before the photoresist film 6 is cut by the cutting unit 19.

[0092] Specifically, the lower discharge system EXD is configured to include an exhaust passage 13 and an exhaust device 14. Before the photoresist film 6 is cut by the cutting unit 19, the exhaust passage 13 (pipe 13D and gap 13G) located below the portion CP of the photoresist film 6 to be cut is in a negative pressure state because air is exhausted by the exhaust device 14. This is because the entrance (the upper surface of the gap 13G) is blocked by the photoresist film 6. The portion CP of the photoresist film 6 to be cut is the portion to be cut by the cutting unit 19, i.e., the portion where the spot of the laser LS emitted by the laser unit 19L is positioned.

[0093] Next, referring to FIG. 19 , the flow of smoke FM discharged outside the film bonding device 1 by the discharge system EX will be described. FIG. 19 is a cross-sectional view of the photoresist film 6, the semiconductor wafer W, and the discharge system EX. Specifically, the upper view of FIG. 19 is a cross-sectional view immediately after the laser LS is irradiated onto the photoresist film 6, i.e., before the photoresist film 6 is cut, and includes a cross-section of the upper discharge system EXU on an imaginary plane parallel to the YZ plane including the dashed-dotted line L5 in FIG. 17 . The lower view of FIG. 19 corresponds to the upper view of FIG. 19 and is a cross-sectional view after a portion of the cut target portion CP of the photoresist film 6 is cut to form a through-hole 6C. The through-hole 6C connects the space above the photoresist film 6 with the space below the photoresist film 6, and is formed by cutting the photoresist film 6 with the laser LS. Note that in FIG. 19 , the air flow within the discharge system EX is indicated by black arrows.

[0094] The smoke FM is part of the foreign matter generated when the photoresist film 6 is heated by the laser LS emitted by the laser unit 19L, and in the illustrated example includes upper smoke FM1 discharged to the outside by the upper exhaust system EXU, and lower smoke FM2 discharged to the outside by the lower exhaust system EXD.

[0095] Before the penetration 6C is formed, the smoke FM does not include lower smoke FM2, as shown in the upper diagram of Figure 19. This is because there is no air flow from the space above the photoresist film 6 into the exhaust passage 13. Therefore, most of the smoke FM (upper smoke FM1) is exhausted to the outside by the upper exhaust system EXU.

[0096] On the other hand, after the penetration 6C is formed, the smoke FM includes lower smoke FM2, as shown in the lower diagram of Fig. 19. This is because there is an air flow flowing from the space above the photoresist film 6 into the exhaust passage 13. As a result, part of the smoke FM (upper smoke FM1) is exhausted to the outside by the upper exhaust system EXU, and another part of the smoke FM (lower smoke FM2) is exhausted to the outside by the lower exhaust system EXD.

[0097] In the illustrated example, the exhaust system EX is configured such that the flow rate of air exhausted by the lower exhaust system EXD is greater than the flow rate of air exhausted by the upper exhaust system EXU, so that the amount of lower smoke FM2 exhausted by the lower exhaust system EXD is greater than the amount of upper smoke FM1 exhausted by the upper exhaust system EXU.

[0098] 1 , the semiconductor manufacturing apparatus (film bonding apparatus 1) according to the embodiment of the present disclosure includes: a table 2 on which a semiconductor wafer W is placed; a pressing member (pressing roller 20) that presses a film (photoresist film 6) to be bonded to the semiconductor wafer W placed on the table 2; an outer periphery support member 5 that is provided on the outer periphery of the table 2 and is disposed so as to receive the pressing force of the pressing member (pressing roller 20) when the pressing member (pressing roller 20) presses the film (photoresist film 6); and a support mechanism 50 that supports the outer periphery support member 5 at least three positions that are spaced apart from one another in a plan view and that can separately adjust the heights of the at least three positions. In the example shown in FIG. 1 , the support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB, and a right rear support mechanism 50RB. The left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have a height adjustment mechanism HAM. In the illustrated example, the semiconductor manufacturing apparatus is a film application device 1, which is an example of a laminator, but it may also be a mounter that applies a film to a ring. That is, the outer peripheral support member 5 supported by the support mechanism 50 may be mounted on the mounter as a member on which the ring is placed. The same applies to the following features. That is, the following features may also be mounted on the mounter. The film may also be a resin film or polyimide film having heat-sensitive adhesive or photosensitive properties.

[0099] With this configuration, the semiconductor manufacturing apparatus has the effect of eliminating the inclination of the upper surface of the outer peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of enabling the operator to adjust the horizontality of the upper surface 5 a of the outer peripheral support member 5.

[0100] The semiconductor manufacturing apparatus (film bonding apparatus 1) may also include a lifting mechanism LM that raises and lowers the outer peripheral support member 5. In the illustrated example, the lifting mechanism LM includes a rotation motor 35, a transmission belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39, as shown in FIGS. 10 and 11 . However, the lifting mechanism LM may also include other mechanical elements such as gears, chains, or wires. The lifting mechanism LM may also be omitted. Even in this case, the operator can adjust the levelness of the upper surface 5 a of the outer peripheral support member 5 by using the height adjustment mechanisms HAM in the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB. Furthermore, by raising and lowering the table 2, the operator can make the semiconductor wafer W placed on the upper surface of the table 2 flush with the upper surface 5 a of the outer peripheral support member 5.

[0101] 9, the outer periphery support member 5 may have a substantially rectangular shape in plan view and may be disposed so as to surround the table 2. In this case, the height adjustment mechanism HAM may be configured so as to be able to adjust the height of each of the four corners of the outer periphery support member 5 separately.

[0102] With this configuration, the semiconductor manufacturing apparatus has the advantage of being able to eliminate tilt of the upper surface of the outer peripheral support member 5, even when the outer peripheral support member 5 is supported at four points by the support mechanism 50, for example.

[0103] Furthermore, the lifting mechanism LM may be configured to simultaneously lift and lower each of the four corners of the outer periphery support member 5. In the illustrated example, the lifting mechanism LM is configured to simultaneously operate the height adjustment mechanisms HAM in the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB to lift and lower the outer periphery support member 5.

[0104] With this configuration, the semiconductor manufacturing equipment can raise and lower the outer peripheral support member 5 while eliminating any tilt of the upper surface of the outer peripheral support member 5. Specifically, the semiconductor manufacturing equipment has the effect of enabling an operator to raise and lower the outer peripheral support member 5 while maintaining the horizontality of the upper surface 5 a of the outer peripheral support member 5.

[0105] As shown in FIG. 1 , a film bonding apparatus 1, which is an example of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure, includes a table 2 on which a semiconductor wafer W is placed and a cutting unit 19 that uses a laser to cut a film (photoresist film 6) that is bonded to the semiconductor wafer W placed on the table 2. As shown in FIG. 15 , the cutting unit 19 may include a laser light source 61 and a beam expander 63 that expands or reduces the beam diameter of a laser LS emitted by the laser light source 61. The laser LS may be, for example, a carbon dioxide laser, a fiber laser, a YAG laser, or an ultraviolet laser. The beam expander 63 may be a Galilean beam expander or a Keplerian beam expander. The beam expander 63 may be a fixed magnification beam expander or a variable magnification zoom expander.

[0106] This configuration allows the film application device 1 to reduce the size (spot diameter) of the laser LS spot formed on the top surface of the film when cutting the film. Therefore, this configuration has the effect of improving the quality of the cut edge of the film. Note that improving the quality of the cut edge of the film includes suppressing deterioration of the quality of the cut edge of the film, such as suppressing the occurrence of burrs. This configuration also has the effect of allowing the film to be cut with a smaller laser output than when the spot diameter is large.

[0107] 1 and 15, the film bonding device 1 may also include a discharge system EX that sucks in and discharges foreign matter generated when the film (photoresist film 6) is cut by the cutting unit 19. In this case, the cutting unit 19 may be configured to move parallel to the upper surface of the table 2, as shown in FIG. 13. That is, the cutting unit 19 may be configured to move parallel to both the X-axis and Y-axis directions. Furthermore, the laser light source 61 may be configured to emit a laser LS having an optical axis OA perpendicular to the upper surface of the table 2, as shown in FIG. 15. Furthermore, the discharge system EX may include an upper discharge system EXU provided above the film (photoresist film 6). The upper discharge system EXU may be configured to move integrally with the cutting unit 19.

[0108] With this configuration, the film application device 1 can maintain the same positional relationship between the film, the laser LS, and the upper discharge system EXU when cutting the film while moving the cutting unit 19. Therefore, compared to a configuration in which the positional relationship between the film, the laser, and the discharge system changes when cutting the film, this configuration has the advantage of being able to stably remove the smoke FM that is generated when cutting the film, suppressing the diffusion of the laser LS due to the smoke FM, and ultimately suppressing deterioration in the quality of the cut edge surface of the film.

[0109] 18, the cutting unit 19 may be configured to cut a portion CP to be cut, which is a portion of the film (photoresist film 6) attached to the semiconductor wafer W along the outer edge of the semiconductor wafer W. In this case, the discharge system EX may include a lower discharge system EXD provided below the film (photoresist film 6). The lower discharge system EXD may include an exhaust device 14 (see FIG. 1) connected to an exhaust passage 13 (pipe 13D and gap 13G) located below the portion CP to be cut of the film (photoresist film 6).

[0110] Specifically, an annular gap 13G may be formed between the table 2 and the outer periphery support member 5. The gap 13G may constitute the exhaust passage 13 of the lower exhaust system EXD.

[0111] With this configuration, the film application device 1 can create an air flow from the space above the film to the space below the film when the through hole 6C is formed in the film. This configuration allows air to be applied to the cut edge of the film heated by the laser LS to cool it, thereby improving the quality of the cut edge of the film. Furthermore, this configuration can draw smoke FM, which is generated when the film is cut, into the space below the film, thereby reducing the diffusion of the laser LS due to smoke FM compared to a configuration without a lower exhaust system, thereby reducing the deterioration of the quality of the cut edge of the film.

[0112] Furthermore, the width of gap 13G may be configured to increase in a stepwise manner in the direction away from the film (downward), as shown in the upper diagram of Fig. 19. Specifically, gap 13G may be configured so that width W3 of the portion closer to the film is smaller than width W4 of the portion farther from the film.

[0113] With this configuration, the lower discharge system EXD can increase the flow rate of air flowing through the portion of gap 13G closer to the film than the flow rate of air flowing through the portion farther from the film. Therefore, compared to a configuration in which the width of gap 13G does not change in the vertical direction or a configuration in which the width decreases in the direction away from the film (downward), this configuration can more efficiently cool the cut edge of the film, thereby further improving the quality of the cut edge of the film. In the illustrated example, gap 13G is configured to increase in a stepped manner in the direction away from the film, but it may also be configured to increase in a reverse tapered manner in the direction away from the film.

[0114] The exhaust system EX may also be configured so that the flow rate of gas exhausted to the outside by the lower exhaust system EXD is greater than the flow rate of gas exhausted to the outside by the upper exhaust system EXU.

[0115] With this configuration, the film application device 1 can increase the amount of lower smoke FM2 discharged to the outside by the lower exhaust system EXD compared to the amount of upper smoke FM1 discharged to the outside by the upper exhaust system EXU, as shown in the lower diagram of Figure 19 . This configuration therefore reduces the amount of upper smoke FM1 in the space above the film, suppressing the diffusion of the laser LS due to the upper smoke FM1 and ultimately preventing the quality of the cut edge of the film from deteriorating. This configuration also prevents the cut edge of the film from facing upward, preventing the upward-facing cut edge from interfering with the cutting of the subsequent cut target portion CP by the laser LS. This is because the cut edge of the film is pulled downward by the air flowing downward. This configuration therefore further improves the quality of the cut edge of the film.

[0116] The preferred embodiments of the present invention have been described above in detail. However, the present invention is not limited to the above-described embodiments. Various modifications and substitutions may be applied to the above-described embodiments without departing from the scope of the present invention. Furthermore, the features described with reference to the above-described embodiments may be combined as appropriate unless technically inconsistent.

[0117] This application claims priority based on Japanese Patent Application No. 2023-141613, filed on August 31, 2023, the entire contents of which are incorporated herein by reference.

[0118]

Claims

1. A semiconductor manufacturing device comprising: a table on which a semiconductor wafer is placed; and a film cutting mechanism that uses a laser to cut a film attached to the semiconductor wafer placed on the table, the film cutting mechanism including a laser light source and a beam expander that expands or reduces the beam diameter of a laser emitted by the laser light source.

2. The semiconductor manufacturing apparatus of claim 1, further comprising an exhaust system for sucking in and discharging foreign matter generated when the film is cut by the film cutting mechanism, the film cutting mechanism being configured to be able to move parallel to an upper surface of the table, the exhaust system including an upper exhaust system provided above the film, and the upper exhaust system being configured to be able to move integrally with the film cutting mechanism.

3. The semiconductor manufacturing apparatus according to claim 2, wherein the film cutting mechanism is configured to cut a portion of the film affixed to the semiconductor wafer that is to be cut, the portion being along the outer edge of the semiconductor wafer, and the discharge system includes a lower discharge system provided below the film, and the lower discharge system includes an exhaust device connected to an exhaust passage located below the portion of the film to be cut.

4. The semiconductor manufacturing apparatus according to claim 3, comprising: a pressing member that presses the film affixed to the semiconductor wafer placed on the table; and an outer periphery support member that is provided on the outer periphery of the table and positioned so as to receive the pressing force of the pressing member when the pressing member presses the film, wherein an annular gap is formed between the table and the outer periphery support member, and the gap constitutes the exhaust passage of the lower exhaust system.

5. The semiconductor manufacturing apparatus according to claim 3, wherein a flow rate of the gas discharged to the outside by the lower exhaust system is greater than a flow rate of the gas discharged to the outside by the upper exhaust system.

6. A film cutting mechanism that uses a laser to cut a film attached to a semiconductor wafer placed on a table, the film cutting mechanism comprising a laser light source and a beam expander that expands or reduces the beam diameter of the laser emitted by the laser light source.

Images